CN114252664B - Probe station - Google Patents
Probe station Download PDFInfo
- Publication number
- CN114252664B CN114252664B CN202111092707.6A CN202111092707A CN114252664B CN 114252664 B CN114252664 B CN 114252664B CN 202111092707 A CN202111092707 A CN 202111092707A CN 114252664 B CN114252664 B CN 114252664B
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- unit
- magnetic field
- camera
- horizontal direction
- substrate
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- 239000000523 sample Substances 0.000 title claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000012546 transfer Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 8
- 230000035939 shock Effects 0.000 claims description 7
- 239000006096 absorbing agent Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0273—Magnetic circuits with PM for magnetic field generation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/695—Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A probe station includes a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a camera unit disposed above the chuck and configured to image the substrate; and a camera driving part configured to move the camera unit in a horizontal direction. The camera driving part includes a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
Description
Technical Field
The present invention relates to a probe station. More particularly, the present invention relates to a probe station for electrically testing semiconductor devices formed on a substrate using a probe card.
Background
Semiconductor devices may be formed on a substrate, such as a silicon wafer, by repeatedly performing a series of manufacturing processes. For example, in order to manufacture a semiconductor device, various manufacturing processes such as a deposition process for forming a thin layer on a wafer, an etching process for patterning the thin layer to form a circuit, a planarization process for planarizing the thin layer, and the like may be performed on the wafer.
After the semiconductor device is formed, an electrical test process for checking electrical characteristics of the semiconductor device may be performed. The test process may be performed by a probe station including a probe card having a plurality of probes, and a test head that provides electrical signals to the semiconductor device and analyzes output signals derived from the semiconductor device to check electrical characteristics of the semiconductor device may be connected to the probe card.
The probe station may include a chuck for supporting the substrate, and the probe card may be disposed above the chuck. The chuck may be configured to be movable in a horizontal direction to achieve alignment between the substrate and the probe card, and may be configured to be movable in a vertical direction to achieve electrical connection between the substrate and the probe card.
A lower camera unit for imaging probes of the probe card may be disposed on one side of the chuck, and an upper camera unit for imaging the substrate may be disposed above the chuck. The camera unit may be used for alignment between the substrate and the probe card. The upper camera unit may be horizontally moved by a driving unit which is constructed in a bridge shape. For example, the upper camera unit may be moved to a predetermined position to image the substrate, and the chuck may be moved by the chuck driving unit such that a plurality of points of the substrate are imaged by the upper camera unit.
The driving unit may include a stopper member such that the upper camera unit is stopped at a predetermined position. However, when the movement of the upper camera unit is stopped by the stopper member, vibration and vibration due to collision may occur, and a test process for the substrate may be greatly delayed due to a considerable time required to remove the vibration. Further, the internal structure of the probe station may be slightly deformed by the collision and vibration, and thus contact accuracy between the substrate and the probe card may be lowered.
Disclosure of Invention
Embodiments of the present invention provide a probe station capable of reducing vibration and shock generated when a camera unit for imaging a substrate is stopped.
According to one aspect of the invention, a probe station may include a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a camera unit disposed above the chuck and configured to image the substrate; and a camera driving part configured to move the camera unit in a horizontal direction. In particular, the camera driving part may include a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
According to some embodiments of the invention, the camera driving part may further include a driving unit for moving the camera unit in a horizontal direction; and a movable member configured to be movable in a horizontal direction by the driving unit, and the camera unit is mounted on the movable member.
According to some embodiments of the invention, the probe station may further comprise a column on which both sides of the driving unit are mounted.
According to some embodiments of the invention, the brake unit may include a brake plate mounted on the movable member and made of an electrically conductive material; and a magnetic field generating unit mounted on one of the columns and configured to generate a magnetic field. In this case, the brake plate and the magnetic field generating unit may be arranged such that an eddy current braking force is generated by the magnetic field when the movable member moves to a position close to one of the posts.
According to some embodiments of the invention, the magnetic field generating unit may comprise a plurality of permanent magnets mounted on a side surface of one of the posts.
According to another aspect of the invention, a probe station may include a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a top plate on which the probe card is mounted; a plurality of support columns configured to support a top plate; a camera unit disposed between the chuck and the top plate and configured to image the substrate; a camera driving part configured to move the camera unit in a horizontal direction; and a middle column disposed between the support columns. In particular, the camera driving part may be mounted on one of the support columns and the intermediate column and may include a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
According to some embodiments of the invention, the camera driving part may further include a driving unit for moving the camera unit in a horizontal direction; and a movable member configured to be movable in a horizontal direction by the driving unit, and the camera unit is mounted on the movable member. In this case, both sides of the driving unit may be mounted on one of the support columns and the middle column, respectively.
According to some embodiments of the invention, the brake unit may include a brake plate mounted on the movable member and made of an electrically conductive material; and a magnetic field generating unit mounted on the intermediate column and configured to generate a magnetic field. In this case, the brake plate and the magnetic field generating unit may be arranged such that an eddy current braking force is generated by the magnetic field when the movable member moves to a position close to the intermediate column.
According to some embodiments of the invention, the magnetic field generating unit may comprise a plurality of permanent magnets mounted on a side surface of the intermediate column.
According to some embodiments of the invention, the permanent magnets may be arranged such that the polarity alternates in the horizontal direction.
According to some embodiments of the present invention, the magnetic field generating unit may include a plurality of first permanent magnets mounted on a side surface of the intermediate column, and a plurality of second permanent magnets disposed to face the first permanent magnets. In this case, the brake plate may be mounted on the movable member so as to be movable between the first permanent magnet and the second permanent magnet by the driving unit.
According to some embodiments of the present invention, the magnetic field generating unit may further include a first mounting bracket mounted on a side surface of the middle column, extending in a horizontal direction and having a channel shape with an opened lower portion, and the first permanent magnet and the second permanent magnet may be mounted to face each other on an inner side surface of the first mounting bracket.
According to some embodiments of the invention, the first permanent magnets may be arranged such that the polarity alternates in the horizontal direction, and the second permanent magnets may be arranged with a polarity opposite to the polarity of the first permanent magnets.
According to some embodiments of the invention, the drive unit may comprise a pneumatic cylinder mounted on one of the support columns and the intermediate column and configured to move the movable member; and a guide mechanism mounted on one of the support columns and the intermediate column and configured to guide the movable member in a horizontal direction.
According to some embodiments of the invention, the camera driving part may further include a stopper member for stopping the camera unit at a predetermined position.
According to some embodiments of the invention, the camera driving part may further include a damper for absorbing shock caused by the stopper member.
According to yet another aspect of the invention, a probe station may include a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a top plate on which the probe card is mounted; first and second support columns spaced apart from each other in a first horizontal direction and configured to support a top plate; third and fourth support columns spaced apart from the first and second support columns in a second horizontal direction perpendicular to the first horizontal direction and configured to support the top plate; a camera unit disposed between the chuck and the top plate and configured to image the substrate; a camera driving part configured to move the camera unit in a second horizontal direction; and a middle column disposed between the first and third support columns. In particular, the camera driving part may include a driving unit mounted on the third support column and the intermediate column and for moving the camera unit in the second horizontal direction, and a braking unit mounted on the intermediate column and for stopping the camera unit at a predetermined position using an eddy current braking force.
According to some embodiments of the invention, the probe station may further comprise a card changing unit provided on one side of the intermediate column to change the probe card. In this case, the intermediate column may have a lower height than the third support column, and the card exchange unit may transfer the probe card in the first horizontal direction in an upper space of the intermediate column.
According to some embodiments of the invention, the probe station may further comprise a second intermediate post disposed between the second and fourth support posts; and a second camera driving part configured to move the camera unit in a second horizontal direction. In this case, the second camera driving part may include a second driving unit mounted on the fourth support column and the second intermediate column and for moving the camera unit in the second horizontal direction, and a second braking unit mounted on the second intermediate column and for stopping the camera unit at a predetermined position using an eddy current braking force.
According to some embodiments of the invention, the probe station may further comprise a substrate transfer robot disposed on one side of the second middle post to load the substrate onto the chuck. In this case, the second middle column may have a lower height than the fourth support column, and the substrate transfer robot may transfer the substrate in the first horizontal direction in an upper space of the second middle column.
According to the embodiments of the present invention described above, when the movable member on which the camera unit is mounted moves to a predetermined position above the chuck, the moving speed of the movable member can be reduced by the eddy current braking force. Further, the moving speed of the movable member may be secondarily decelerated by the damper, and then the movable member may be stopped at a predetermined position by the stopper member. Accordingly, the shock and vibration generated when the movable member is stopped can be greatly reduced as compared with the related art, and thus the test delay time can be greatly reduced. In addition, the stability of the probe station can be greatly improved by reducing vibration and shock, and thus the contact accuracy between the substrate and the probe card can be significantly improved.
The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The following detailed description and claims more particularly exemplify these embodiments.
Drawings
Embodiments of the invention will be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic front view showing a probe station according to an embodiment of the present invention;
fig. 2 is a schematic side view showing the camera driving part shown in fig. 1;
fig. 3 is a schematic plan view showing a camera driving part as shown in fig. 1;
fig. 4 is a schematic enlarged front view showing an example of the brake unit shown in fig. 2;
fig. 5 is a schematic enlarged plan view showing the brake unit shown in fig. 4;
FIG. 6 is a schematic enlarged bottom view illustrating another example of the brake unit shown in FIG. 2; and
fig. 7 is a schematic enlarged side view showing the brake unit shown in fig. 6.
While the various embodiments are amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention as claimed to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter as defined by the claims.
Detailed Description
Hereinafter, embodiments of the present invention are described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below and is implemented in various other forms. The following examples are not intended to fully complete the present invention, but are intended to fully convey the scope of the invention to those skilled in the art.
In the specification, when an element is referred to as being "on" or "connected to" another element or layer, it can be directly on, connected to, or intervening elements or layers may also be present. In contrast, it will be understood that when an element is referred to as being directly on or connected to another element or layer, it means that there are no intervening elements present. In addition, although terms like first, second and third are used to describe various regions and layers in various embodiments of the present invention, the regions and layers are not limited to these terms.
The terminology used in the following description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Additionally, unless otherwise defined herein, all terms including technical or scientific terms may have the same meaning as commonly understood by one of ordinary skill in the art.
Embodiments of the present invention are described with reference to schematic illustrations of idealized embodiments. Accordingly, variations in the manufacturing methods and/or tolerances may be expected from the form of the drawings. Accordingly, embodiments of the invention are not described as being limited to the specific forms or regions of the drawings and include deviations in forms thereof. This region may be entirely schematic and its form may not describe or delineate the exact form or structure in any given region and is not intended to limit the scope of the invention.
Fig. 1 is a schematic front view showing a probe station according to an embodiment of the present invention. Fig. 2 is a schematic side view showing the camera driving part shown in fig. 1, and fig. 3 is a schematic plan view showing the camera driving part shown in fig. 1.
Referring to fig. 1 to 3, a probe station 100 according to an embodiment of the present invention may be used to electrically test semiconductor devices formed on a substrate 10, such as a semiconductor wafer. The probe station 100 may include a chuck 110 configured to support the substrate 10; a probe card 120 disposed above the chuck 110 and configured to electrically test a semiconductor device formed on the substrate 10; a camera unit 130 disposed above the chuck 110 and configured to image the substrate 10; and a camera driving part 140 configured to move the camera unit 130 in a horizontal direction.
Although not shown in the drawings, the chuck 110 may have a plurality of vacuum holes for vacuum sucking the substrate 10 and a heater for heating the substrate 10 to a predetermined test temperature, and a cooling unit for cooling the substrate 10 may be disposed under the chuck 110. The probe station 100 may include chuck driving means 112 for aligning and connecting the substrate 10 and the probe card 120. In particular, the chuck driving unit may horizontally move and rotate the chuck 110 to achieve alignment between the substrate 10 and the probe card 120, and may vertically move the chuck 110 to connect the substrate 10 to the probe card 120. Further, although not shown in the drawings, a lower camera unit (not shown) for imaging the probes of the probe card 120 may be mounted on the side of the chuck 110.
The probe station 100 may include a test chamber 102 providing a space in which an electrical test process is performed on the substrate 10, and the chuck 110 and the probe card 120 may be disposed in the test chamber 102. Further, the loader 180 for loading the substrate 10 onto the chuck 110 and unloading the substrate 10 from the chuck 110 may be disposed on one side of the test chamber 102 in a first horizontal direction, for example, in an X-axis direction, and the tester 20 for electrically testing the substrate 10 through the probe card 120 may be disposed on the test chamber 102.
The test chamber 102 may include a top plate 104 on which the probe card 120 is mounted, and support columns 106A, 106B, 106C, and 106D for supporting the top plate 104. The loader 180 may include a substrate transfer robot 182 for transferring the substrate 10 and a substrate transfer chamber 184 in which the substrate transfer robot 182 is disposed. Further, although not shown, the loader 180 may include a load port (not shown) on which a container for accommodating a plurality of substrates is placed.
The camera driving part 140 may include a driving unit 142 for moving the camera unit 130 in a second horizontal direction, for example, in a Y-axis direction, above the chuck 110, i.e., between the chuck 110 and the probe card 120; and a movable member 144 configured to be movable in a second horizontal direction by the driving unit 142, the camera unit 130 being mounted on the movable member 144. For example, a pneumatic cylinder may be used as the driving unit 142. In particular, in order to overcome the space, a rodless cylinder may be used as the driving unit 142, and the movable member 144 may be guided in the second horizontal direction by a guide mechanism 150 provided in parallel to the rodless cylinder, for example, by a linear motion guide.
According to one embodiment of the invention, the top plate 104 may be supported by first and second support columns 106A and 106B spaced apart from each other in a first horizontal direction and third and fourth support columns 106C and 106D spaced apart from the first and second support columns 106A and 106B in a second horizontal direction and spaced apart from each other in the first horizontal direction, as shown in fig. 3. Further, a first intermediate post 108A may be disposed between the first and third support posts 106A and 106C, and a second intermediate post 108B may be disposed between the second and fourth support posts 106B and 106D.
The drive unit 142 and the guide mechanism 150 may be mounted on the first intermediate post 108A and the third support post 106C. Specifically, both sides of the rodless cylinder may be mounted on the first intermediate post 108A and the third support post 106C, respectively, and both sides of the linear motion guide may be mounted on the first intermediate post 108A and the third support post 106C, respectively.
According to an embodiment of the present invention, the probe station 100 may further include a second camera driving part 190 configured to move the camera unit 130 in a second horizontal direction. The second camera driving part 190 may have the same configuration as the camera driving part 140. For example, the second camera drive component 190 may include a second drive unit mounted on the second intermediate post 108B and the fourth support post 106D, and a second guide mechanism mounted on the second intermediate post 108B and the fourth support post 106D.
The movable member 144 may have a bridge shape, and may include a first movable post 146A coupled to the first camera driving part 140, a second movable post 146B coupled to the second camera driving part 190, and a movable plate 148 disposed on the first and second movable posts 146A and 146B. In this case, the camera unit 130 may be mounted on the movable plate 148.
According to an embodiment of the present invention, the camera driving part 140 may include a braking unit 160 for stopping the camera unit 130 at a predetermined position using an eddy current braking force. The braking unit 160 may include a braking plate 162 mounted on the movable member 144, in particular, on the first movable column 146A and made of an electrically conductive material, and a magnetic field generating unit 164 mounted on a side surface of the first intermediate column 108A and configured to generate a magnetic field. The brake plate 162 and the magnetic field generating unit 164 may be arranged such that when the movable member 144 moves to a position close to the first intermediate column 108A, an eddy current braking force is generated by the magnetic field. Specifically, when the brake plate 162 moves close to the magnetic field generating unit 164, eddy currents may be induced by the magnetic field in the brake plate 162, and thus eddy current braking forces may be generated in a direction opposite to the moving direction of the brake plate 162, i.e., the movable member 144.
Fig. 4 is a schematic enlarged front view showing an example of the brake unit shown in fig. 2, and fig. 5 is a schematic enlarged plan view showing the brake unit shown in fig. 4.
Referring to fig. 4 and 5, the magnetic field generating unit 164 may include a plurality of permanent magnets 166 mounted on a side surface of the first intermediate post 108A. The permanent magnets 166 may be arranged such that the polarity alternates along the direction of movement of the movable member 144. In particular, when the brake plate 162 moves, the magnetic field that may be generated by the permanent magnet 166 generates an eddy current braking force in a direction opposite to the direction of movement of the movable member 144.
Further, the second camera driving part 190 may include a second braking unit 200 for stopping the camera unit 130 at a predetermined position using an eddy current braking force, as shown in fig. 1 and 3. The second brake unit 200 may have the same configuration as the brake unit 160. For example, the second brake unit 200 may include a plurality of permanent magnets mounted on the second intermediate post 108B and a brake plate mounted on the second movable post 146B.
Referring again to fig. 2, the camera driving part 140 may include a stopping member 152 for stopping the camera unit 130 at a predetermined position above the chuck 110. The movable member 144 may be stopped by being brought into close contact with the stopper member 152. Further, the camera driving part 140 may further include a damper 154 for absorbing shock caused by the stopper member 152. For example, a cylindrical damper 154 may be used, and the damper 154 and the stopper member 152 may be disposed such that a rod portion of the damper 154 protrudes from the stopper member 152 toward the movable member 144.
In particular, when the driving unit 142 includes the rodless cylinder as described above, a constant air pressure may be applied into the rodless cylinder until the movable member 144 stops, and thus a constant force may be applied from the rodless cylinder to the movable member 144 until the movable member 144 stops. Further, the braking unit 160 may primarily use the eddy current braking force to reduce the moving speed of the movable member 144, and the moving speed of the movable member 144 may be secondarily reduced by the damper 154 when the movable member 144 approaches the stopper member 152. As a result, by the primary deceleration of the brake unit 160 and the secondary deceleration of the damper 154, the movable member 144 can be brought into close contact with the stopper member 152 without vibration or vibration.
Meanwhile, the stopper member 152 and the damper 154 may be mounted on the first intermediate post 108A, and although not shown, the second stopper member and the second damper may be mounted on the second intermediate post 108B. Further, although not shown, a third stop member and a third damper may be mounted on the third support column 106C, and a fourth stop member and a fourth damper may be mounted on the fourth support column 106D.
Fig. 6 is a schematic enlarged bottom view showing another example of the brake unit shown in fig. 2, and fig. 7 is a schematic enlarged side view showing the brake unit shown in fig. 6.
Referring to fig. 6 and 7, the magnetic field generating unit 164 may include a first permanent magnet 168 mounted on a side surface of the first intermediate post 108A, a second permanent magnet 170 disposed to face the first permanent magnet 168, and a brake plate 162 mounted on the movable member 144, particularly the first movable post 146A, and made of an electrically conductive material. In this case, the brake plate 162 may be mounted on the first movable column 146A so as to be movable by the driving unit 142 between the first permanent magnet 168 and the second permanent magnet 170.
For example, the magnetic field generating unit 164 may include a first mounting bracket 172 mounted on a side surface of the first intermediate column 108A, extending in the second horizontal direction and having a channel shape with an opened lower portion, and the first permanent magnet 168 and the second permanent magnet 170 may be mounted to face each other on an inner side surface of the first mounting bracket 172. Further, the brake unit 160 may include a second mounting bracket 174 for mounting the brake plate 162 to the first movable column 146A.
In particular, the first permanent magnets 168 may be arranged such that the polarity alternates along the second horizontal direction, i.e., the direction of movement of the movable member 144, and the polarity of the second permanent magnets 170 may be arranged opposite to the polarity of the first permanent magnets 168, as shown in fig. 6.
The brake plate 162 is movable by the drive unit 142 between first and second permanent magnets 168 and 170. That is, when the brake plate 162 enters between the first and second permanent magnets 168 and 170, an eddy current braking force can be applied to the brake plate 162 by the magnetic field formed by the first and second permanent magnets 168 and 170, and thus, the movable member 144 can be sufficiently decelerated in a short time.
Referring to fig. 1 to 3, a card changing unit 210 for changing the probe card 120 may be provided on one side of the first middle column 108A. The card changing unit 210 may include a card transfer robot 212 that moves the probe card 120 in a first horizontal direction to change the probe card 120. In particular, the first middle column 108A may have a lower height than the first and third support columns 106A and 106C, and the card transfer robot 212 may transfer the probe card 120 in the first horizontal direction in the upper space of the first middle column 108A to replace the probe card 120.
Further, the substrate transfer robot 182 may be disposed on one side of the second middle column 108B. The second middle column 108B may have a lower height than the second and fourth support columns 106B and 106D, and the substrate transfer robot 182 may transfer the substrate 10 in the upper space of the second middle column 108B in the first horizontal direction to load and unload the substrate 10.
Although the exemplary embodiments of the present invention have been described with reference to specific embodiments, they are not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes can be made thereto without departing from the spirit and scope of the appended claims.
Claims (20)
1. A probe station, comprising:
a chuck configured to support a substrate;
a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate;
a camera unit disposed above the chuck and configured to image the substrate; and
a camera driving part configured to move the camera unit in a horizontal direction,
wherein the camera driving part includes a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force,
the brake unit includes a brake plate made of an electrically conductive material and a magnetic field generating unit configured to generate a magnetic field, and
when the brake plate moves to a position close to the magnetic field generating unit, the eddy current braking force is generated by the magnetic field.
2. The probe station of claim 1, wherein the camera drive component further comprises:
a driving unit for moving the camera unit in the horizontal direction; and
a movable member configured to be movable in the horizontal direction by the driving unit, and the camera unit is mounted on the movable member.
3. The probe station of claim 2, further comprising:
and a column on which both sides of the driving unit are mounted.
4. The probe station of claim 3, wherein,
the brake plate is mounted on the movable member;
the magnetic field generating unit is mounted on one of the columns; and is also provided with
The brake plate and the magnetic field generating unit are arranged such that the eddy current braking force is generated by the magnetic field when the movable member moves to a position close to one of the posts.
5. The probe station of claim 4, wherein the magnetic field generating unit comprises a plurality of permanent magnets mounted on a side surface of one of the posts.
6. A probe station, comprising:
a chuck configured to support a substrate;
a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate;
a top plate on which the probe card is mounted;
a plurality of support columns configured to support the top plate;
a camera unit disposed between the chuck and the top plate and configured to image the substrate;
a camera driving part configured to move the camera unit in a horizontal direction; and
the middle column is arranged between the support columns,
wherein the camera driving part is mounted on one of the support columns and the intermediate column and includes a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force,
the brake unit includes a brake plate made of an electrically conductive material and a magnetic field generating unit configured to generate a magnetic field, and
when the brake plate moves to a position close to the magnetic field generating unit, the eddy current braking force is generated by the magnetic field.
7. The probe station of claim 6, wherein the camera drive component further comprises:
a driving unit for moving the camera unit in the horizontal direction; and
a movable member configured to be movable in the horizontal direction by the driving unit, and on which the camera unit is mounted,
wherein both sides of the driving unit are mounted on one of the support columns and the intermediate column, respectively.
8. The probe station of claim 7, wherein,
the brake plate is mounted on the movable member;
the magnetic field generating unit is mounted on the intermediate column; and
the brake plate and the magnetic field generating unit are arranged such that the eddy current braking force is generated by the magnetic field when the movable member moves to a position close to the intermediate post.
9. The probe station of claim 8, wherein the magnetic field generating unit comprises a plurality of permanent magnets mounted on a side surface of the intermediate post.
10. The probe station of claim 9, wherein the permanent magnets are arranged such that polarities alternate in the horizontal direction.
11. The probe station of claim 8, wherein the magnetic field generating unit comprises:
a plurality of first permanent magnets mounted on a side surface of the intermediate column; and
a plurality of second permanent magnets disposed to face the first permanent magnets,
wherein the brake plate is mounted on the movable member so as to be movable between the first permanent magnet and the second permanent magnet by the drive unit.
12. The probe station according to claim 11, wherein the magnetic field generating unit further comprises a first mounting bracket mounted on the side surface of the intermediate column, extending in the horizontal direction and having a channel shape with an opened lower portion, and
the first permanent magnet and the second permanent magnet are mounted to face each other on an inner side surface of the first mounting bracket.
13. The probe station of claim 11, wherein the first permanent magnets are arranged such that polarities alternate in the horizontal direction, and
the polarity of the second permanent magnet is arranged opposite to the polarity of the first permanent magnet.
14. The probe station of claim 7, wherein the drive unit comprises:
a pneumatic cylinder mounted on one of the support columns and the intermediate column and configured to move the movable member; and
a guide mechanism mounted on one of the support columns and the intermediate column and configured to guide the movable member in the horizontal direction.
15. The probe station of claim 6, wherein the camera drive component further comprises a stop member for stopping the camera unit at the predetermined position.
16. The probe station of claim 15, wherein the camera drive component further comprises a shock absorber for absorbing shock caused by the stop member.
17. A probe station, comprising:
a chuck configured to support a substrate;
a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate;
a top plate on which the probe card is mounted;
first and second support columns spaced apart from each other in a first horizontal direction and configured to support the top plate;
third and fourth support columns spaced apart from the first and second support columns in a second horizontal direction perpendicular to the first horizontal direction and configured to support the top plate;
a camera unit disposed between the chuck and the top plate and configured to image the substrate;
a first camera driving part configured to move the camera unit in the second horizontal direction; and
a first intermediate column disposed between the first support column and the third support column,
wherein the first camera driving part includes:
a first driving unit mounted on the third support column and the first intermediate column and for moving the camera unit in the second horizontal direction; and
a first braking unit for stopping the camera unit at a predetermined position using a first eddy current braking force,
wherein the first brake unit includes a first brake plate made of an electrically conductive material and a first magnetic field generating unit mounted on the first intermediate post and configured to generate a first magnetic field, and
when the first brake plate moves to a position close to the first magnetic field generating unit, the first eddy current braking force is generated by the first magnetic field.
18. The probe station of claim 17, further comprising:
a card replacement unit provided on one side of the first intermediate column to replace the probe card,
wherein the first intermediate column has a lower height than the third support column, and the card changing unit transfers the probe card in the first horizontal direction in an upper space of the first intermediate column.
19. The probe station of claim 17, further comprising:
the second middle column is arranged between the second support column and the fourth support column; and
a second camera driving part configured to move the camera unit in the second horizontal direction,
wherein the second camera driving part includes:
a second driving unit mounted on the fourth support column and the second intermediate column and for moving the camera unit in the second horizontal direction; and
a second braking unit for stopping the camera unit at the predetermined position using a second eddy current braking force,
wherein the second brake unit includes a second brake plate made of an electrically conductive material and a second magnetic field generating unit mounted on the second intermediate post and configured to generate a second magnetic field, and
when the second brake plate moves to a position close to the second magnetic field generating unit, the second eddy current braking force is generated by the second magnetic field.
20. The probe station of claim 19, further comprising:
a substrate transfer robot disposed on one side of the second intermediate column to load the substrate onto the chuck,
wherein the second middle column has a lower height than the fourth support column, and the substrate transfer robot transfers the substrate in the first horizontal direction in an upper space of the second middle column.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2020-0122497 | 2020-09-22 | ||
| KR1020200122497A KR20220039420A (en) | 2020-09-22 | 2020-09-22 | Probe station |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114252664A CN114252664A (en) | 2022-03-29 |
| CN114252664B true CN114252664B (en) | 2024-02-20 |
Family
ID=80789893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111092707.6A Active CN114252664B (en) | 2020-09-22 | 2021-09-17 | Probe station |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20220039420A (en) |
| CN (1) | CN114252664B (en) |
| TW (1) | TWI799987B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20220039420A (en) | 2022-03-29 |
| TWI799987B (en) | 2023-04-21 |
| TW202212832A (en) | 2022-04-01 |
| CN114252664A (en) | 2022-03-29 |
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