TW202211996A - Substrate processing method and substrate processing apparatus - Google Patents

Abstract

The invention provides a technique for suppressing the occurrence of defects caused by air bubbles in a mixed liquid. A substrate processing method includes a holding step (S1), a mixed liquid supply step (S5), and a replacement step (S8). In the holding step (S1), a substrate is held. In the mixed liquid supply step (S5), a processing liquid containing water and isopropanol are supplied to a mixing tube via a first supply tube and a second supply tube, respectively, and the mixed liquid in which the processing liquid and isopropanol are mixed is discharged from a nozzle toward the substrate via the mixing tube. In the replacement step (S8), after the mixed liquid supply step (S5), a replacement liquid, which is used as either a processing liquid or isopropanol, is supplied, and the mixed liquid in the mixing tube is pushed out by the replacement liquid and ejected from a nozzle, thereby replacing the mixed liquid with the replacement liquid.

Description

Substrate processing method and substrate processing apparatus

The present invention relates to a substrate processing method and a substrate processing apparatus.

Conventionally, a blade-type substrate processing apparatus for processing substrates one by one has been used. The substrate processing apparatus performs various processes such as, for example, a process by a chemical solution, a cleaning process for cleaning the substrate, and a drying process for drying the substrate, on the loaded unprocessed substrate. Then, the processed substrate is carried out from the substrate processing apparatus, and the next unprocessed substrate is carried into the substrate processing apparatus. In this way, the substrate processing apparatus sequentially performs a series of processing on the substrates one by one.

Patent Document 1 discloses an example of such a substrate processing apparatus. In Patent Document 1, as a cleaning process, a substrate processing apparatus discharges droplets of a mixed solution of isopropyl alcohol (IPA; isopropyl alcohol) and pure water on the main surface of the substrate to clean the main surface of the substrate. Specifically, the substrate processing apparatus includes: a holding part for holding the substrate; a supply pipe for supplying isopropyl alcohol; a supply pipe for supplying pure water; a mixing pipe for joining the two supply pipes; and a nozzle, It is arranged at the front end of the mixing tube. Moreover, a valve is provided in each supply pipe. The two valves were opened, whereby isopropyl alcohol and pure water were supplied to the mixing pipe through the supply pipe, respectively. Then, the mixed liquid system of isopropyl alcohol and pure water is ejected from the nozzle toward the substrate through the mixing tube. In addition, the nozzle is a two-fluid nozzle, and not only the mixed liquid but also the gas is supplied. The nozzle system ejects the mixed liquid in the form of fine droplets. The liquid mixture system in the form of droplets is ejected onto the substrate, whereby the substrate is cleaned. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-133441.

[The problem to be solved by the invention]

When the substrate processing apparatus finishes the cleaning process, the supply of isopropyl alcohol, pure water, and gas is stopped. Thereby, the ejection of the mixed liquid from the nozzle is stopped. At this time, the mixed liquid system is stationary in the mixing tube. In addition, when isopropyl alcohol is mixed with pure water, air bubbles are generated in the mixed liquid. Since the air bubbles increase over time, the amount of air bubbles inside the mixing tube also increases over time while the discharge of the mixed liquid from the nozzle is stopped.

In this way, when the air bubbles increase, various problems occur due to the air bubbles when the substrate processing apparatus discharges the mixed liquid from the nozzle next time. For example, there is a possibility that the particles may adhere to the substrate due to various factors such as the accumulation of particles around the bubbles. In addition, the flow rate of the mixed solution decreases due to air bubbles. Also, in the case of using the two-fluid nozzle as the nozzle, the ratio of the mixed liquid to the gas supplied to the two-fluid nozzle is reduced because the flow rate of the mixed liquid is reduced. As a result, the drop potential of the droplets of the mixed solution increases, thereby causing damage to the substrate.

Therefore, the present invention has been developed in view of the above-mentioned problems, and an object of the present invention is to provide a technique capable of suppressing the occurrence of problems due to air bubbles in the liquid mixture. [means to solve the problem]

The substrate processing method according to the first aspect includes: a holding step of holding the substrate; and a mixed solution supply step of supplying a treatment solution containing water and isopropyl alcohol to the mixing tube through a first supply pipe and a second supply pipe, respectively a mixed liquid mixed with the treatment liquid and the isopropyl alcohol is ejected from the nozzle to the substrate through the mixing pipe; and a replacement step is performed after the mixed liquid supply step, and is supplied to the treatment liquid and the isopropyl alcohol. In any one of the replacement liquids, the mixed liquid in the mixing tube is pushed out by the replacement liquid and the mixed liquid is ejected from the nozzle, thereby replacing the mixed liquid with the replacement liquid.

The substrate processing method according to the second aspect is the substrate processing method according to the first aspect, further comprising after the mixed solution supplying step: a drying step for drying the substrate; and the replacement step when the mixed solution is supplied It starts after the process until the above-mentioned drying process is completed.

The substrate processing method of the third aspect is the substrate processing method according to the first aspect or the second aspect, wherein in the replacement step, the mixed solution is not supplied within the reference time after the mixed solution supply step When the above-mentioned substitution liquid is supplied, the above-mentioned mixed liquid in the above-mentioned mixing tube is replaced with the above-mentioned substitution liquid.

The substrate processing method of the fourth aspect is the substrate processing method described in the third aspect, wherein the reference time is set to be shorter as the concentration of the isopropyl alcohol in the mixed solution is higher.

The substrate processing method of the fifth aspect is the substrate processing method described in the first aspect, further comprising: a detection step of detecting air bubbles in the mixing tube by a bubble detection unit; When the amount of air bubbles detected by the air bubble detection unit is larger than the allowable amount, the replacement liquid is supplied to replace the mixed liquid in the mixing tube with the replacement liquid.

The substrate processing method of a sixth aspect is the substrate processing method as described in any one of the first aspect to the fifth aspect, wherein the mixed liquid comprises a mixture produced by mixing the processing liquid and the isopropyl alcohol of air bubbles.

The substrate processing method of a seventh aspect is the substrate processing method described in any one of the first to sixth aspects, wherein in the replacement step, the nozzle is moved to a plan view compared to the substrate processing method. In the state of the standby retreat position outside the substrate, the replacement liquid is supplied and the mixed liquid is replaced with the replacement liquid.

The substrate processing method of an eighth aspect is the substrate processing method according to any one of the first aspect to the seventh aspect, wherein in the replacement step, the supply of the replacement liquid and the supply of the replacement liquid are repeated, The aforementioned mixed liquid is replaced with the aforementioned replacement liquid.

The substrate processing method of a ninth aspect is the substrate processing method according to any one of the first to eighth aspects, wherein in the replacement step, the mixed liquid in the mixed liquid supply step is The flow rate is also large to supply the aforementioned replacement fluid.

The substrate processing method of the tenth aspect is the substrate processing method described in any one of the first aspect to the ninth aspect, wherein the replacement liquid is the processing liquid.

The substrate processing apparatus according to the first aspect includes: a substrate holding part for holding the substrate; a mixed liquid supply part including a nozzle; a first supply pipe to which a processing liquid containing water is supplied; and a second supply pipe being supplied with isopropyl alcohol; and a mixing pipe for supplying a mixed liquid of the treatment liquid supplied from the first supply pipe and the isopropyl alcohol supplied from the second supply pipe to the nozzle; and a control unit is controlled by the mixed solution supply unit in such a manner that after the discharge of the mixed solution from the nozzle is completed, a replacement solution belonging to either the treatment solution or the isopropyl alcohol is supplied to the mixing tube, and the replacement solution is supplied with the replacement solution. The mixed liquid in the mixing tube is pushed out and the mixed liquid is ejected from the nozzle to replace the mixed liquid with the replacement liquid. [Inventive effect]

According to the substrate processing method of the first aspect and the substrate processing apparatus of the first aspect, the mixed liquid of the processing liquid and the isopropyl alcohol is contained in the mixing tube through the mixed liquid supply step. In the mixed liquid, bubbles will be generated due to the difference in the solubility of the gas to the treatment liquid and isopropanol. Since the amount of air bubbles increases with time, the amount of air bubbles increases with time after the mixed solution supply step.

In the replacement step, after the mixed liquid supply step, the mixed liquid system inside the mixing tube is replaced with the replacement liquid. Therefore, the generation of air bubbles in the inside of the mixing tube can be suppressed. Therefore, it is possible to suppress the occurrence of problems due to air bubbles in the subsequent mixed solution supply step.

According to the substrate processing method of the second aspect, the replacement step is performed at an earlier timing after the mixed solution supply step. Therefore, in a state where the amount of air bubbles is small, the replacement liquid pushes out the mixed liquid and air bubbles, and ejects the mixed liquid and air bubbles from the nozzle. Since the amount of air bubbles is small, it is easy to discharge air bubbles from the nozzle.

According to the substrate processing method of the third aspect, when the mixed liquid is not supplied within the reference time after the mixed liquid supply step, the mixed liquid system inside the mixing tube is replaced with the replacement liquid. Therefore, when the amount of air bubbles increases due to the elapse of the reference time, the mixed liquid system inside the mixing tube is replaced with the replacement liquid.

According to the substrate processing method of the fourth aspect, execution of an unnecessary replacement step can be suppressed.

According to the substrate processing method of the fifth aspect, in the replacement step, when the amount of air bubbles is larger than the allowable amount, the mixed liquid system inside the mixing tube is replaced with the replacement liquid. Therefore, the generation of air bubbles in the mixing tube afterward can be suppressed. Therefore, it is possible to suppress the occurrence of problems due to air bubbles in the subsequent mixed solution supply step. In addition, since air bubbles are detected, execution of unnecessary push-out processing can be suppressed more reliably.

According to the substrate processing method of the sixth aspect, unnecessary supply of the mixed liquid and the replacement liquid to the substrate can be avoided.

According to the substrate processing method of the seventh aspect, air bubbles in the mixing tube can be more appropriately discharged.

According to the substrate processing method of the eighth aspect, air bubbles in the mixing tube can be more appropriately discharged.

According to the substrate processing method of the ninth aspect, the processing liquid containing water having a solubility lower than that of isopropyl alcohol is used as the replacement liquid. Thereby, when the mixed liquid pushes out and discharges the processing liquid inside the mixing tube, bubbles are less likely to be generated at the boundary between the mixed liquid and the processing liquid.

Embodiments are described below with reference to the accompanying drawings. In addition, the drawings are schematically shown, and for convenience of description, the configuration is appropriately omitted or simplified in the drawings. In addition, the mutual relationship of the magnitude|size and position of the structure shown in a figure is not described correctly, and it will change suitably.

In addition, in the description shown below, the same components are attached with the same reference numerals and shown in the drawings, and the names and functions of these components are regarded as the same. Therefore, the detailed description of these constituent elements may be omitted in order to avoid repetition.

In addition, in the description described below, even when a sequence number such as "first" or "second" is used, these terms are terms that are appropriately used in order to facilitate the understanding of the content of the embodiment, and are not Limited to the order generated by these sorted numbers, etc.

Unless otherwise specified, it is used to express the expression of relative or absolute positional relationship (for example, "towards one direction", "along one direction", "parallel", "orthogonal", "center", "concentric" and "coaxial", etc.) not only strictly express the indicated positional relationship, but also express a state in which the angle or distance has been relatively displaced within a tolerance or a range in which the same degree of function can be obtained. Unless otherwise specified, expressions used to indicate the state of equality (such as "same", "equal", "homogeneous", etc.) not only indicate the state of quantitative and exact equality, but also indicate that there is a tolerance or that the same can be obtained The state of the functional error of the degree. Unless otherwise specified, expressions used to express shapes (such as "square shape" or "cylindrical shape") not only geometrically and strictly express the indicated shape, but also express the same degree of There are shapes such as unevenness or chamfering within the range of efficacy. The expression "having", "having", "having", "containing" or "containing" one element is not an exclusive expression that excludes the existence of other elements. This expression of "at least one of A, B, and C" includes only A, only B, only C, a combination of any two of A to C, and all of A to C.

[First Embodiment] [Schematic Configuration of Substrate Processing Apparatus] FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus 100 . As shown in FIG. 1 , the substrate processing apparatus 100 is, for example, a blade-type apparatus, and can be used for processing for removing organic residues adhering to the surface of a semiconductor substrate (wafer) W, which is an example of a substrate. The organic residues include, for example, resists that remain on the surface of the substrate W after an ion implantation treatment for implanting impurities into the surface of the substrate W and become unnecessary, or are derived from adhesion to Organic-based unnecessary substances such as resists in the vicinity of the outer peripheral portion on the surface of the substrate W, and the like. In addition, the substrate processing apparatus 100 can also be used for inorganic residue removal and etching of the substrate W.

The substrate processing apparatus 100 includes: a load port LP serving as a container holding mechanism for holding a plurality of carriers C serving as a container; and a plurality of (twelve in this embodiment) A) processing unit 10, which processes the substrate W. Specifically, for example, three sets of processing units 10 are arranged so as to be stacked in the vertical direction, and each of the three sets of processing units 10 is constituted by four processing units 10 arranged in a plane.

The substrate processing apparatus 100 further includes, for example, an indexer robot (IR), a center robot (CR), and a control unit 90 . The index robot IR can transfer the substrate W between the load port LP and the center robot CR, for example. The center robot CR system can transport the substrate W between the index robot IR and each processing unit 10, for example. The control unit 90 can control the operation of each unit included in the substrate processing apparatus 100 , the opening and closing of valves, and the like.

Here, as shown in FIG. 1 , the load port LP and each processing unit 10 are arranged in the horizontal direction with an interval therebetween. In the loading port LP, the plurality of carriers C for accommodating the plurality of substrates W are arranged along the horizontal arrangement direction D when viewed from above. The load port LP functions as a carry-in portion for carrying the substrate W in. Here, the indexing robot IR system can, for example, transfer a plurality of substrates W from the carrier C to the substrate placing portion 110 one by one, and can transfer a plurality of substrates W from the substrate placing portion 110 to the carrier C one by one. . The substrate placement portion 110 includes a placement stage on which the substrate W is placed.

The center robot CR system can, for example, transfer a plurality of substrates W from the substrate placement unit 110 to each processing unit 10 one by one, and can convey a plurality of substrates W from each processing unit 10 to the substrate placement unit 110 one by one. In addition, for example, the central robot CR system can transfer the substrate W between the plurality of processing units 10 as required. The index robot IR, the substrate placing unit 110 , and the center robot CR function as a substrate receiving and transferring unit for receiving and transferring the substrates W from the loading unit (load port LP) to the processing unit 10 .

In the example of FIG. 1, the index robot IR system has a U-shaped hand H in a plan view. Here, the index robot IR system has two hands H. The two hands H are arranged at different heights from each other. Each of the hands H can support the substrate W in a horizontal posture. The index robot IR system can move the hand H in the horizontal direction and the vertical direction. Here, the index robot IR system can change the orientation of the hand H by rotating (autorotating) the axis along the vertical direction as the center. The indexing robot IR moves along the arrangement direction D in the path through the pick-up transfer position (where the indexing robot IR is depicted in FIG. 1 ). The pick-up and transfer position is a position at which the index robot IR and the substrate placement portion 110 face each other in a direction orthogonal to the arrangement direction D in a plan view. The index robot IR system can make the hand H face the arbitrary carrier C and the board|substrate mounting part 110, respectively. Here, for example, the index robot IR moves the hand H to perform a carry-in operation for carrying the substrate W into the carrier C and a carry-out operation for carrying out the board W from the carrier C. In addition, for example, the index robot IR moves the hand H in the pick-and-transfer position, whereby the carrying-in operation for carrying the substrate W to the board placing part 110 and the carrying-in operation for unloading the board W from the board placing part 110 can be performed. The move out action.

In the example of FIG. 1 , like the index robot IR, the center robot CR system has a U-shaped hand H in a plan view. Here, the center robot CR system has two hands H. The two hands H are arranged at different heights from each other. Each of the hands H can support the substrate W in a horizontal posture. The center robot CR system can move each hand H in the horizontal direction and the vertical direction. Here, the center robot CR system can change the orientation of the hand H by rotating (autorotating) the axis along the vertical direction as the center. The central robot CR is surrounded by a plurality of processing units 10 when viewed from above. The center robot CR system can make the hand H face any of the processing units 10 and the substrate placement portion 110 . Here, for example, the center robot CR moves the hand H to perform a carry-in operation for carrying the substrate W into each processing unit 10 and a carry-out operation for carrying out the substrate W from each processing unit 10 . In addition, for example, the center robot CR moves the hand H to perform the carrying operation for carrying the substrate W into the substrate placing portion 110 and the unloading operation for unloading the substrate W from the substrate placing portion 110 .

The unprocessed substrate W is taken out from the carrier C by the index robot IR, and is transferred to the center robot CR via the substrate placement unit 110 . The center robot CR carries this unprocessed substrate W into the processing unit 10 . The processing unit 10 processes the substrate W. The processed substrate W is taken out from the processing unit 10 by the central robot CR, and is transferred to the indexing robot IR via the other processing units 10 and the substrate placement unit 110 as required. The index robot IR carries the processed substrate W into the carrier C. As shown in FIG. Through the above-described operations, the substrate W is processed.

[processing unit] FIG. 2 is a side view schematically showing an example of the configuration of the processing unit 10 . The processing unit 10 includes a spin chuck 20 , which is an example of a substrate holding portion, a mixed solution supply portion 30 , a chemical solution supply portion 70 , a rinse solution supply portion 80 , and a processing cup 40 .

[Rotation fixture] The rotation jig 20 holds the substrate W in a horizontal posture. The horizontal posture refers to a posture in which the thickness direction of the substrate W is along the vertical direction. The rotation jig 20 includes a disc-shaped spin base 21 fixed to the upper end of a rotating shaft 24 extending in the vertical direction in a horizontal posture. A spin motor 22 for rotating the rotating shaft 24 is provided below the spin base 21 . The rotation motor 22 rotates the rotation base 21 in the horizontal plane via the rotating shaft 24 . Further, a cylindrical cover member 23 is provided so as to surround the rotation motor 22 and the rotation shaft 24 .

The outer diameter of the disk-shaped rotation base 21 is slightly larger than the diameter of the circular substrate W held by the rotation jig 20 . Therefore, the rotation base 21 has an upper surface 21a facing the entire lower surface of the substrate W to be held.

A plurality of (four in the present embodiment) chuck pins 26 are erected on the peripheral edge portion of the upper surface 21 a of the rotation base 21 . The plurality of clip pins 26 are arranged along the circumference corresponding to the peripheral edge of the circular substrate W at equal intervals (as in the present embodiment, four clip pins 26 are at 90° intervals). Each of the clamp pins 26 is drivably provided between a holding position, which is a position in contact with the peripheral edge of the substrate W, and an open position, which is a position separated from the peripheral edge of the substrate W. As shown in FIG. The plurality of clamp pins 26 are interlocked and driven by a link mechanism (not shown) housed in the rotation base 21 . The rotation jig 20 stops the plurality of jig pins 26 at their respective contact positions, whereby the substrate W can be held above the rotation base 21 in a horizontal posture close to the upper surface 21 a (refer to FIG. 2 ); the rotation jig 20 The holding of the substrate W can be released by stopping the plurality of clamp pins 26 at their respective open positions.

The rotation motor 22 is surrounded by a cover member 23 . The upper end of the cover member 23 is positioned directly below the rotation base 21 . The collar-shaped member 25 is provided in the upper end part of the cover member 23, and the collar-shaped member 25 protrudes substantially horizontally from the cover member 23 toward the outer direction, and further extends downwardly curvedly. In a state in which the rotation jig 20 holds the substrate W by the plurality of jig pins 26 , the rotation motor 22 rotates the rotation shaft 24 , thereby enabling the substrate W to revolve in the vertical direction passing through the center of the substrate W The axis of rotation CX rotates. In addition, the drive train of the autorotation motor 22 is controlled by the control unit 90 .

[Mixed solution supply part] The mixed solution supply unit 30 supplies a mixed solution (described later) toward the substrate W held by the rotation jig 20 . Here, the mixed liquid supply unit 30 is provided with a nozzle 31 that causes a gas to collide with the mixed liquid to generate droplets of the mixed liquid and eject the liquid droplets of the mixed liquid.

FIG. 3 is a longitudinal cross-sectional view schematically showing an example of the configuration of the nozzle 31 . The nozzle 31 is a so-called external mixing type two-fluid nozzle, and is used to make gas collide with the mixed liquid outside the casing of the nozzle 31 to generate liquid droplets of the mixed liquid; the nozzle 31 is provided with an outer cylinder 301 and is composed of The casing; and the inner cylinder 302 , which is embedded in the outer cylinder 301 .

Both the outer cylinder 301 and the inner cylinder 302 have a cylindrical outer shape and are arranged coaxially, and the coaxial shapes have a central axis L in common. In addition, the lower end surface 301a of the outer cylinder 301 is an annular surface orthogonal to the central axis L. As shown in FIG.

A linear inner space 303 along the central axis L is formed in the inner cylinder 302 . The inner space 303 has a circular opening at the lower end of the inner cylinder 302 . A mixing tube 323 (also refer to FIG. 4 ) to be described later is connected to the upper end of the inner space 303 . The mixed liquid system supplied from the mixing pipe 323 flows into the inner space 303 and is ejected from the opening 304 at the lower end (downward along the central axis L). That is, the inner space 303 is the flow path of the mixed liquid, and the opening 304 is the discharge port of the mixed liquid. Hereinafter, the inner space 303 is also referred to as a "mixed liquid flow path 303". In addition, the opening 304 at the lower end of the inner space 303 is also referred to as a "mixed liquid ejection port 304".

The inner tube 302 includes a large-diameter portion 302a and a small-diameter portion 302b, and the small-diameter portion 302b is continuously provided below the large-diameter portion 302a and has an outer diameter smaller than the large-diameter portion 302a. The inner diameter of the outer tube 301 embedded in the outer side of the inner tube 302 is equal to the outer diameter of the large diameter portion 302a, and the outer tube 301 has a substantially constant inner diameter excluding the lower end portion of the outer tube 301. Therefore, a gap 305 is formed between the outer wall of the small diameter portion 302b and the inner wall of the outer cylinder 301 . The gap 305 is an annular space in cross-section with the central axis L as the center, and is annularly opened at the lower end of the outer cylinder 301 (that is, the annular space surrounding the mixed liquid ejection port 304 ).

One end of an L-shaped introduction pipe 306 is connected to the vicinity of the upper end of the gap 305 , and the introduction pipe 306 is provided so as to penetrate the inner surface and the outer surface of the outer cylinder 301 . A gas supply pipe 331 is connected to the other end of the introduction pipe 306 , and the gas supply pipe 331 is connected to a gas supply source 335 (also refer to FIG. 4 ) which will be described later. The gas system supplied from the gas supply source 335 via the gas supply pipe 331 and the introduction pipe 306 flows into the gap 305 and is ejected from the opening 307 at the lower end. That is, the gap 305 is the flow path of the gas, and the opening 307 is the discharge port of the gas. Hereinafter, the gap 305 is also referred to as a "gas flow path 305". In addition, the opening 307 at the lower end of the gap 305 is also referred to as a "gas ejection port 307".

A flange 308 is formed near the lower end of the small diameter portion 302b, and the flange 308 protrudes radially outward from the outer peripheral surface of the small diameter portion 302b. The flange 308 is formed with a through hole 309 penetrating the flange 308; the gas system flowing into the gas flow path 305 changes the direction of flow when passing through the through hole 309, and becomes a swirling flow that flows in a swirling manner around the central axis L .

A cylindrical short cylindrical portion 310 is formed on a portion lower than the portion where the flange 308 is formed in the small diameter portion 302b, and the short cylindrical portion 310 protrudes along the central axis L from the lower surface of the flange 308. The short cylindrical part 310 is arrange|positioned so that the central axis of the short cylindrical part 310 may correspond to the central axis L. The outer diameter of the short tube portion 310 is smaller than the inner diameter of the lower end surface 301a of the outer tube 301, and a ring shape surrounding the central axis L is formed between the lower end surface of the short tube portion 310 and the lower end surface 301a of the outer tube 301. opening 307. The opening 307 is formed so that the gap (ie, the gas flow path) 305 communicates with the opening (ie, the gas ejection port) 307 of the external space.

The gas system that has flowed into the gas flow path 305 becomes a swirling flow when passing through the through hole 309 formed in the flange 308 and flows into the space 311 around the short cylindrical portion 310 . Here, a portion of the inner wall surface of the outer cylinder 301 surrounding the periphery of the short cylinder portion 310 is formed in a diameter-reduced shape, and the inner diameter becomes smaller as the diameter-reduced shape goes downward. Therefore, the swirling flow of the gas flowing into the space 311 around the short cylindrical portion 310 becomes a swirling airflow that approaches the central axis L in the space 311 and is ejected from the gas ejection port 307 . The swirling gas flow ejected from the gas ejection port 307 flows so as to surround the mixed liquid ejected from the mixed liquid ejection port 304 along the central axis L, and travels so as to converge on a certain point F of the central axis L. Hereinafter, the point F is also referred to as a "convergence point F".

When the mixed liquid is ejected from the mixed liquid ejection port 304 and the gas is ejected from the gas ejection port 307, the mixed liquid collides and mixes with the gas in the outer space of the nozzle 31 (specifically, the converging point F and the vicinity of the converging point F). Thereby, the mixed liquid becomes fine droplets. That is, droplets of the mixed liquid are generated. The liquid droplet system of the produced liquid mixture is accelerated by the gas flow to become a jet flow. That is, below the convergence point F, the gas system becomes a swirling airflow that goes downward while moving away from the central axis L as it swirls, and the droplet system is accelerated by the airflow and ejected toward the substrate W.

FIG. 4 is a diagram schematically showing an example of the configuration of the mixed solution supply unit 30 . A mixed liquid piping system 32 belonging to the piping system is connected to the nozzle 31 , and the mixed liquid piping system 32 is for supplying the mixed liquid to the nozzle 31 . The mixed solution piping system 32 includes a first supply pipe 321 , a second supply pipe 322 , a mixing pipe 323 , and a mixing unit 324 .

The upstream end of the first supply pipe 321 is connected to the first treatment liquid supply source 3214 , and the downstream end of the first supply pipe 321 is connected to the mixing part 324 . The first treatment liquid supply source 3214 is a supply source of the first treatment liquid. The first treatment liquid is a treatment liquid containing water, for example, pure water (DIW (deionized water; deionized water)) or carbon dioxide water (CO ₂ water). In the following description, pure water is used as the first treatment liquid.

A supply valve 3211 is provided in the first supply pipe 321 . The supply valve 3211 switches the opening and closing of the flow path of the first supply pipe 321 . As illustrated in FIG. 4 , the first supply pipe 321 may be provided with a flow rate adjustment valve 3212 and a flow meter 3213 . The flow rate adjustment valve 3212 adjusts the flow rate of pure water flowing through the first supply pipe 321 . The flow meter 3213 detects the flow rate of pure water flowing through the first supply pipe 321 .

The upstream end of the second supply pipe 322 is connected to the second treatment liquid supply source 3224 , and the downstream end of the second supply pipe 322 is connected to the mixing part 324 . The second processing liquid supply source 3224 is a supply source of the second processing liquid. The second treatment liquid is a treatment liquid of a different type from the first treatment liquid, and is, for example, isopropyl alcohol (IPA). The following description uses isopropyl alcohol as the second treatment liquid.

A supply valve 3221 is provided in the second supply pipe 322 . The supply valve 3221 switches the opening and closing of the flow path of the second supply pipe 322 . As illustrated in FIG. 4 , the second supply pipe 322 may be provided with a flow rate adjustment valve 3222 and a flow meter 3223 . The flow rate adjustment valve 3222 adjusts the flow rate of isopropyl alcohol flowing through the second supply pipe 322 . The flow meter 3223 detects the flow rate of the second treatment liquid flowing through the second supply pipe 322 .

The mixing unit 324 mixes the pure water supplied from the first supply pipe 321 and the isopropyl alcohol supplied from the second supply pipe 322 . The mixing unit 324 is, for example, a mixing valve.

The upstream end of the mixing pipe 323 is connected to the mixing part 324, and the downstream end of the mixing pipe 323 is connected to the nozzle 31 (specifically, the upper end of the inner space 303). The mixed liquid from the mixing part 324 flows through the mixing pipe 323 and is supplied to the nozzle 31 . In the example of FIG. 4 , a supply valve 3231 is provided in the mixing pipe 323 . The supply valve 3231 switches the opening and closing of the flow path of the mixing tube 323 .

A gas piping system 33 belonging to the piping system is also connected to the nozzle 31 , and the gas piping system 33 is for supplying gas to the nozzle 31 . The gas piping system 33 includes a gas supply pipe 331 . The downstream end of the gas supply pipe 331 is connected to the nozzle 31 (specifically, the introduction pipe 306 of the nozzle 31 ), and the upstream end of the gas supply pipe 331 is connected to the gas supply source 335 . The gas supply source 335 is a supply source for supplying gas (here, nitrogen (N ₂ ) gas, for example). The gas supply source 335 may supply gases other than nitrogen gas (for example, various inert gases other than nitrogen gas, dry air, etc.).

A supply valve 332 is provided in the gas supply pipe 331 . The supply valve 332 switches the opening and closing of the flow path of the gas supply pipe 331 . As shown in the example of FIG. 4 , the gas supply pipe 331 may be provided with a flow rate adjustment part 333 and a filter 334 . The flow rate adjustment unit 333 adjusts the flow rate of the gas flowing through the gas supply pipe 331 . The flow rate adjustment unit 333 is, for example, a mass flow controller (Mass Flow Controller). The filter 334 removes impurities in the gas flowing through the gas supply pipe 331 .

In the above configuration, when the supply valve 3211 , the supply valve 3221 , the supply valve 3231 and the supply valve 332 are opened, the pure water supplied from the first processing liquid supply source 3214 and the isopropyl alcohol supplied from the second processing liquid supply source 3224 The mixed liquid and the nitrogen gas system supplied from the gas supply source 335 are supplied to the nozzle 31 . Then, the mixed liquid and the nitrogen gas are mixed at the nozzle 31 , and the mixed liquid becomes fine droplets, and the droplets are ejected from the nozzle 31 as a jet flow.

The mixed solution supply unit 30 can appropriately control the opening and closing states of the supply valve 3211 , the supply valve 3221 , the supply valve 3231 , and the supply valve 332 , whereby pure water or isopropyl alcohol can be supplied to the substrate W independently. For example, when the supply valve 3211 and the supply valve 3231 are opened while the supply valve 3221 and the supply valve 332 are closed, the pure water in the form of a liquid column is ejected from the nozzle 31 . In addition, when the supply valve 332 is opened in this state, pure water in the form of droplets is ejected from the nozzle 31 . Similarly, when the supply valve 3221 and the supply valve 3231 are opened while the supply valve 3211 and the supply valve 332 are closed, the columnar isopropyl alcohol is ejected from the nozzle 31 . In addition, when the supply valve 332 is opened in this state, droplet-like isopropyl alcohol is ejected from the nozzle 31 .

The supply valve 3211 , the supply valve 3221 , the supply valve 3231 , and the supply valve 332 are each electrically connected to the control unit 90 , and are opened and closed under the control of the control unit 90 . Each of the flowmeter 3213 and the flowmeter 3223 is also electrically connected to the control unit 90 , and their detection results are output to the control unit 90 . Each of the flow rate adjustment valve 3212 and the flow rate adjustment valve 3222 is also electrically connected to the control unit 90 . The control unit 90 controls the opening degree of the flow rate adjustment valve 3212 based on the detection result of the flow meter 3213 , and controls the opening degree of the flow rate adjustment valve 3222 based on the detection result of the flow meter 3223 . Thereby, the flow rates of pure water and isopropyl alcohol are adjusted. The flow rate adjustment unit 333 is electrically connected to the control unit 90 , and adjusts the flow rate of the gas under the control of the control unit 90 . Thereby, the discharge state of the processing liquid from the nozzles 31 (specifically, the discharge start timing, the discharge end timing, the type of the discharged processing liquid, the discharge flow rate, the discharge force of the discharged droplets, etc.) is controlled by the control unit 90 control.

Referring again to FIG. 2 , the ejection direction (central axis L) of the nozzle 31 is arranged along the vertical direction. Moreover, the nozzle 31 may be arrange|positioned so that the discharge direction of the nozzle 31 may be inclined with respect to the vertical direction. For example, the nozzles 31 may be arranged obliquely so that the mixed liquid can be ejected toward the center of the substrate W from a position farther from the center of the substrate W in a plan view.

Moreover, the nozzle 31 is attached to the front-end|tip part of the arm 34 extended horizontally. The base end portion of the arm 34 is connected to the upper end of the lift shaft 35, and the lift shaft 35 is arranged in a posture such that the axis line is in the vertical direction. The elevating shaft 35 is arranged on the nozzle base 36 .

The nozzle base 36 is provided with a nozzle drive unit 37 for moving the nozzle 31 . For example, the nozzle drive unit 37 is configured to include: a rotation drive unit (eg, a servo motor) that rotates the lift shaft 35 around the axis of the lift shaft 35 ; a lift drive unit (eg, a stepping motor) ) to make the lift shaft 35 rise and fall along the axis of the lift shaft 35 . When the nozzle driving part 37 rotates the lifting shaft 35, the nozzle 31 moves along the arc track in the horizontal plane; when the nozzle driving part 37 lifts the lifting shaft 35, the nozzle 31 is close to the upper surface of the substrate W and away from the substrate Move in the direction of the upper surface of W.

The nozzle drive unit 37 moves the nozzle 31 between the processing position and the standby retreat position by driving the rotation drive unit and the lift drive unit. The processing position is the position where the nozzle 31 ejects the processing liquid toward the upper surface of the substrate W. As shown in FIG. The standby retreat position is a position where the nozzle 31 does not eject the processing liquid toward the upper surface of the substrate W, and is a position where it does not interfere with the conveyance path of the substrate W. As shown in FIG. More specifically, the standby retreat position is, for example, a position outside the substrate W in a plan view. In the example of FIG. 2, the nozzle 31 stopped at the standby|standby retraction position is shown by the two-dot chain line.

The nozzle drive unit 37 is electrically connected to the control unit 90 and operates under the control of the control unit 90 . That is, the position of the nozzle 31 is controlled by the control unit 90 .

[standby pod] As shown in FIG. 2 , the processing unit 10 includes a standby bay 39 . The standby chamber 39 is provided vertically below the standby retreat position of the nozzle 31 . The standby chamber 39 has, for example, a box-like shape opened vertically above, and receives the processing liquid ejected from the nozzle 31 .

[Medical Solution Supply Department] In the example of FIG. 2 , the processing unit 10 includes a chemical solution supply unit 70 . The chemical solution supply unit 70 includes a nozzle 71 . The nozzle 71 is, for example, a single-fluid nozzle, and is used to eject the chemical liquid toward the substrate W held by the rotation jig 20 . FIG. 5 is a diagram schematically showing an example of the configuration of the chemical solution supply unit 70 . A chemical liquid piping system 72 belonging to the piping system is connected to the nozzle 71 , and the chemical liquid piping system 72 is for supplying the chemical liquid to the nozzle 71 . The chemical liquid piping system 72 includes a chemical liquid supply pipe 721 . The upstream end of the chemical liquid supply pipe 721 is connected to the chemical liquid supply source 725 , and the downstream end of the chemical liquid supply pipe 721 is connected to the nozzle 71 . The chemical solution supply source 725 is a supply source of the chemical solution. The chemical solution may be, for example, dilute hydrofluoric acid or a chemical solution for removing organic substances.

A supply valve 722 is provided in the chemical solution supply pipe 721 . The supply valve 722 switches the opening and closing of the flow path of the chemical solution supply pipe 721 . As illustrated in FIG. 5 , a flow control valve 723 and a flow meter 724 may be provided in the chemical solution supply pipe 721 . The flow rate adjustment valve 723 adjusts the flow rate of the chemical solution flowing through the chemical solution supply pipe 721 . The flow meter 724 detects the flow rate of the chemical solution flowing through the chemical solution supply pipe 721 .

When the supply valve 722 is opened, the chemical solution (here, dilute hydrofluoric acid) flows from the chemical solution supply source 725 through the chemical solution supply pipe 721 and is supplied to the nozzle 71 to be ejected from the nozzle 71 .

The supply valve 722 is electrically connected to the control unit 90 , and is opened and closed under the control of the control unit 90 . The flowmeter 724 is electrically connected to the control unit 90 , and the detection result of the flowmeter 724 is output to the control unit 90 . The flow rate adjustment valve 723 is electrically connected to the control unit 90 , and the control unit 90 controls the opening degree of the flow rate adjustment valve 723 based on the detection result of the flow meter 724 . Thereby, the flow rate of the chemical solution is adjusted. As described above, the discharge state of the chemical solution from the nozzle 71 (specifically, the discharge start timing, the discharge end timing, the discharge flow rate, etc.) is controlled by the control unit 90 .

Referring again to FIG. 2 , the nozzle 71 is attached to the front end portion of the horizontally extending arm 74 . The base end portion of the arm 74 is coupled to the upper end of the lift shaft 75, and the lift shaft 75 is arranged in a posture such that the axis line is in the vertical direction. The elevating shaft 75 is arranged on the nozzle base 76 .

The nozzle base 76 is provided with a nozzle drive unit 77 for moving the nozzle 71 . For example, the nozzle drive unit 77 is configured to include a rotation drive unit (eg, a servo motor) that rotates the lift shaft 75 around the axis of the lift shaft 75 , and a lift drive unit (eg, a stepping motor) that rotates the lift shaft 75 along the axis of the lift shaft 75 . It moves up and down along the axis of the lift shaft 75 . When the nozzle driving part 77 rotates the lifting shaft 75, the nozzle 71 moves along the arc track in the horizontal plane; when the nozzle driving part 77 lifts the lifting shaft 75, the nozzle 71 is close to the upper surface of the substrate W and away from the substrate Move in the direction of the upper surface of W.

The nozzle drive unit 77 moves the nozzle 71 between the processing position and the standby retreat position by driving the rotation drive unit and the lift drive unit. The processing position is the position where the nozzles 71 eject the chemical solution toward the upper surface of the substrate W;

The nozzle drive unit 77 is electrically connected to the control unit 90 and operates under the control of the control unit 90 . That is, the position of the nozzle 71 is controlled by the control unit 90 .

In addition, in the example of FIG. 2, although the nozzle 71 is attached to the arm 74, the nozzle 71 may be attached to the front end of the arm 34. That is, the nozzle 71 may move integrally with the nozzle 31 . In this case, the arm 74, the lift shaft 75, the nozzle base 76, and the nozzle drive part 77 are not required.

[Cleaning fluid supply part] In the example of FIG. 2 , the processing unit 10 includes a cleaning liquid supply unit 80 . The cleaning liquid supply unit 80 includes a nozzle 81 . The nozzle 81 is, for example, a single-fluid nozzle, and is used to spray the cleaning liquid on the upper surface of the substrate W. As shown in FIG. The nozzle 81 is provided at a position facing the substrate W in the vertical direction in a space above the substrate W held by the rotation jig 20 . The nozzle 81 has a lower surface with a large area, and the lower surface and the upper surface of the substrate W are arranged to face each other. The nozzle 81 has, for example, a circular shape in plan view, and the diameter of the nozzle 81 is, for example, half or more of the diameter of the substrate W.

A cleaning liquid piping system 82 belonging to the piping system is connected to the nozzle 81 , and the cleaning liquid piping system 82 supplies the cleaning liquid to the nozzle 81 . The cleaning liquid piping system 82 includes a cleaning liquid supply pipe 821 . The upstream end of the cleaning liquid supply pipe 821 is connected to the cleaning liquid supply source 825 , and the downstream end of the cleaning liquid supply pipe 821 is connected to the nozzle 81 . The cleaning liquid supply source 825 is a supply source of the cleaning liquid. The cleaning liquid is, for example, a treatment liquid having a higher volatility than the first treatment liquid (pure water here), and is, for example, isopropyl alcohol. Hereinafter, isopropyl alcohol is used as the cleaning solution for description.

A supply valve 822 is provided in the cleaning liquid supply pipe 821 . The supply valve 822 switches the opening and closing of the flow path of the cleaning liquid supply pipe 821 . As illustrated in FIG. 2 , a flow rate adjustment valve 823 and a flow meter 824 may be provided in the cleaning liquid supply pipe 821 . The flow rate adjustment valve 823 adjusts the flow rate of isopropyl alcohol flowing through the cleaning liquid supply pipe 821 . The flow meter 824 detects the flow rate of isopropyl alcohol flowing through the cleaning liquid supply pipe 821 .

When the supply valve 822 is opened, the isopropyl alcohol flows from the cleaning solution supply source 825 through the cleaning solution supply pipe 821 , is supplied to the nozzle 81 , and is ejected from the nozzle 81 .

The supply valve 822 is electrically connected to the control unit 90 , and is opened and closed under the control of the control unit 90 . The flowmeter 824 is also electrically connected to the control unit 90 , and the detection result of the flowmeter 824 is output to the control unit 90 . The flow rate adjustment valve 823 is electrically connected to the control unit 90 , and the control unit 90 controls the opening degree of the flow rate adjustment valve 823 based on the detection result of the flow meter 824 . Thereby, the flow rate of isopropyl alcohol is adjusted. As described above, the discharge state of the cleaning liquid from the nozzles 81 (specifically, the discharge start timing, the discharge end timing, the discharge flow rate, etc.) is controlled by the control unit 90 .

The nozzle 81 is moved by the nozzle drive part 83 . The nozzle drive unit 83 includes a lift drive unit (eg, a stepping motor) for moving the nozzle 81 . The nozzle driving unit 83 is electrically connected to the control unit 90 to move the nozzle 81 in the direction of approaching the upper surface of the substrate W and moving away from the upper surface of the substrate W. As shown in FIG. That is, the position of the nozzle 81 is controlled by the control unit 90 . The nozzle drive unit 83 moves the nozzle 81 between a processing position, which is a position close to the upper surface of the substrate W, and a standby retreat position, which is a position away from the upper surface of the substrate W. The processing position is the position where the nozzle 81 sprays isopropyl alcohol on the upper surface of the substrate W. As shown in FIG. The standby retreat position is a position where the nozzle 81 does not eject isopropyl alcohol from the upper surface of the substrate W, and is a position where it does not interfere with the conveyance path of the substrate W. As shown in FIG. The nozzle 81 can also be moved horizontally by the nozzle drive part 83 .

[processing cover] The processing cap 40 catches the processing liquid scattered from the substrate W held by the rotation jig 20 and rotated.

The processing cover 40 includes an inner cover 41 , a middle cover 42 and an outer cover 43 which are independent from each other and can be raised and lowered. The inner cover 41 surrounds the rotation jig 20 and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the center of the substrate W held by the rotation jig 20 . The inner cover 41 integrally includes: a bottom portion 44 that is annular in plan view; a cylindrical inner wall portion 45 that rises upward from the inner peripheral edge of the bottom portion 44; and a cylindrical outer wall portion 46 that extends from the The outer peripheral edge of the bottom portion 44 rises upward; the first guide portion 47 rises from between the inner wall portion 45 and the outer wall portion 46, and the upper end portion draws a smooth arc while facing the center side (close to the self-rotating clamp). 20 extends obliquely upward in the direction of the rotation axis CX of the substrate W held by the substrate 20 ;

The inner wall portion 45 is formed to have a length such that it is accommodated between the lid member 23 and the flange member 25 while maintaining an appropriate gap in the state where the inner cover 41 is raised to the uppermost position. The middle wall portion 48 is formed to have a length such that the second guide portion 52 and the processing liquid separation wall 53, which will be described later, are accommodated in the middle cover 42 with an appropriate gap in the state where the inner cover 41 and the middle cover 42 are closest to each other. between.

The first guide portion 47 has an upper end portion 47b that extends obliquely upward toward the center side (direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. In addition, the space between the inner wall portion 45 and the first guide portion 47 is used as a waste groove 49, and the waste groove 49 is used for collecting and discarding the used processing liquid. An annular inner recovery groove 50 is formed between the first guide portion 47 and the middle wall portion 48 , and the inner recovery groove 50 is used to collect and recover the used processing liquid. Furthermore, between the middle wall portion 48 and the outer wall portion 46 is an annular outer recovery groove 51 , and the outer recovery groove 51 is used to collect and recover a different type of treatment liquid from the inner recovery groove 50 .

An exhausting and draining mechanism (not shown) is connected to the waste trench 49 , and the exhausting and draining mechanism is used to discharge the processing liquid collected in the waste trench 49 and forcibly exhaust the inside of the waste trench 49 . For example, four exhaust and drain mechanisms are provided along the circumferential direction of the waste groove 49 at equal intervals. In addition, a recovery mechanism (both not shown) is connected to the inner recovery groove 50 and the outer recovery trench 51, and the recovery mechanism collects the treatment liquid collected in the inner recovery trench 50 and the outer recovery trench 51 respectively to the installation. A recovery tank outside the processing unit 10. In addition, the bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined at a slight angle with respect to the horizontal direction, and a recovery mechanism is connected to the lowest position. Thereby, the treatment liquid flowing into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

The middle cover 42 surrounds the rotation jig 20 and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the center of the substrate W held by the rotation jig 20 . The middle cover 42 integrally includes a second guide portion 52 and a cylindrical treatment liquid separation wall 53 , and the treatment liquid separation wall 53 is connected to the second guide portion 52 .

The second guide portion 52 has, on the outer side of the first guide portion 47 of the inner cover 41, a lower end portion 52a formed in a cylindrical shape coaxial with the lower end portion of the first guide portion 47, and an upper end portion 52b formed in a cylindrical shape. The lower end portion 52a extends obliquely upward toward the center side (in the direction close to the rotation axis CX of the substrate W) while drawing a smooth arc from the upper end of the lower end portion 52a, and the folded portion 52c is formed by turning the front end portion of the upper end portion 52b downward. The lower end portion 52a is accommodated in the inner recovery groove 50 while maintaining an appropriate gap between the first guide portion 47 and the middle wall portion 48 when the inner cover 41 and the middle cover 42 are closest to each other. In addition, the upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cover 41 in the up-down direction, and the inner cover 41 and the middle cover 42 are kept close to each other with a very small interval The upper end portion 47b of the first guide portion 47 . Further, the folded portion 52c formed by folding the front end of the upper end portion 52b downward is formed to have a length such that the folded portion 52c is horizontally aligned with the first guide portion in a state where the inner cover 41 and the middle cover 42 are closest to each other. The front end of the upper end portion 47b of 47 overlaps.

In addition, the upper end portion 52b of the second guide portion 52 is formed so that the thickness becomes thicker as it goes downward, and the processing liquid separation wall 53 has a lower end outer peripheral edge portion extending downward from the upper end portion 52b. cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer recovery groove 51 while maintaining an appropriate gap between the middle wall portion 48 and the outer cover 43 when the inner cover 41 and the middle cover 42 are closest to each other.

The outer cover 43 is tied around the circumference of the rotation jig 20 in the outer side of the second guide portion 52 of the middle cover 42, and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the substrate W held by the rotation jig 20. center of. The cover 43 functions as a third guide. The cover 43 has a lower end portion 43a formed in a cylindrical shape coaxial with the lower end portion 52a of the second guide portion 52, and an upper end portion 43b extending from the upper end of the lower end portion 43a toward the center side ( The direction close to the rotation axis CX of the substrate W) extends obliquely upward; and the turn-back portion 43c is formed by turning the front end portion of the upper end portion 43b downward.

The lower end portion 43a is accommodated in the outer recovery groove 51 while maintaining an appropriate gap between the treatment liquid separation wall 53 of the middle cover 42 and the outer wall portion 46 of the inner cover 41 when the inner cover 41 and the outer cover 43 are closest to each other. In addition, the upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cover 42 in the up-down direction, and is close to the second guide portion 52 with a very small interval when the middle cover 42 and the outer cover 43 are closest to each other. the upper end 52b. In addition, the folded portion 43c formed by folding the front end portion of the upper end portion 43b downward is the folded portion 43c in the horizontal direction and the folded portion 52c of the second guide portion 52 in the state where the middle cover 42 and the outer cover 43 are closest to each other. formed by overlapping.

In addition, the inner cover 41, the middle cover 42, and the outer cover 43 are independent from each other and can be raised and lowered. That is, each of the inner cover 41, the middle cover 42, and the outer cover 43 is provided with a hood elevating mechanism (not shown) individually, and is independently raised and lowered by the hood elevating mechanism. As such a cover raising/lowering mechanism, various well-known mechanisms, such as a ball screw mechanism and an air cylinder, can be used, for example.

In addition, the process cover 40 may be provided with an exhaust structure for exhausting the gas in the process cover 40 to the outside.

[control unit 90] The control unit 90 controls the operation of each unit in the substrate processing apparatus 100 . FIG. 6 is a functional block diagram schematically showing an example of the configuration of the control unit 90 . The hardware configuration of the control unit 90 is the same as that of a general computer. That is, the control unit 90 is configured to include a processing unit 91 such as a CPU (Central Processing Unit), which performs various arithmetic processes, and a temporary storage medium 92 that is a RAM that is a readable and writable memory. (Random Access Memory), etc., used to store various information; and the non-transitory memory medium 93, which is a ROM (Read Only Memory; only memory) that belongs to the read-only memory used to store the basic program. read memory) and a disk for storing control software or data in advance. When the processing unit 91 of the control unit 90 executes a predetermined processing program, each operating mechanism of the substrate processing apparatus 100 is controlled by the control unit 90 to perform processing in the substrate processing apparatus 100 . In addition, a part or all of the functional parts implemented in the control part 90 may be implemented by hardware, such as a dedicated logic circuit. In addition, the storage medium 92 of the control part 90 memorize|stores the processing recipe (processing recipe) which defines the processing content of the board|substrate processing apparatus 100.

In the example of FIG. 6, the connection between the control part 90 and each part in the processing unit 10 is shown. The control unit 90 controls the rotation jig 20 , the mixed solution supply unit 30 , the chemical solution supply unit 70 , the cleaning solution supply unit 80 , and the process cover 40 . The control unit 90 performs a series of processes on the substrate W by operating each unit based on program information (including a processing recipe) that defines a program for processing the substrate W. The program information that defines the procedure for processing the substrate W may be notified to the control unit 90 by, for example, a device on the upstream side of the substrate processing apparatus 100 , or may be notified to the operator via a user interface (not shown), for example. ) is input to the control unit 90 .

[Flow of substrate processing] FIG. 7 is a flowchart showing an example of the flow of substrate processing. Initially, the nozzles 31 , the nozzles 71 , the nozzles 81 , and the processing cover 40 in the processing unit 10 are stopped at their respective standby and retreat positions.

The center robot CR carries the unprocessed substrate W into the processing unit 10 and places it on the autorotation jig 20 , and the autorotation jig 20 holds the substrate W (step S1 , corresponding to the holding step). Specifically, the rotation jig 20 holds the substrate W by a group of jig pins 26 . Thereby, the board|substrate W is hold|maintained in a horizontal attitude|position.

When the substrate W is held by the autorotation jig 20, the autorotation jig 20 starts to rotate, whereby the substrate W held by the autorotation jig 20 starts to rotate in a horizontal posture (step S2). The rotation of the board|substrate W is continued until the step S6 mentioned later is complete|finished.

In addition, in order to catch the processing liquid scattered from the peripheral edge of the substrate W during the substrate processing, the processing cover 40 is raised as necessary. In the substrate processing, the cover that is appropriately raised is switched according to the type of the processing liquid supplied to the substrate W. However, this part is essentially different from the present embodiment, so the description of this part is omitted below.

Next, chemical solution processing is performed (step S3). For example, the nozzle 71 is moved to a processing position higher than the substrate W by the nozzle drive unit 77 . Next, the supply valve 722 is opened, and the chemical solution (for example, diluted hydrofluoric acid) is ejected from the nozzle 71 toward the upper surface of the substrate W that is rotating. The chemical liquid impinging on the upper surface of the substrate W moves toward the peripheral edge side of the substrate W due to centrifugal force, and is scattered from the peripheral edge side of the substrate W to the outside. The chemical liquid acts on the upper surface of the substrate W, whereby the chemical liquid processing is performed on the substrate W. As shown in FIG.

For example, the supply valve 722 is closed when the first predetermined time elapses from the start of supply of the chemical solution. Thereby, the discharge of the chemical liquid from the nozzle 71 is stopped. Next, the nozzle 71 is moved to the standby retreat position by the nozzle drive unit 77 .

Next, a cleaning process is performed (step S4). As a specific example, first, the nozzle 31 is lowered to the processing position by the nozzle drive unit 37 . Next, the supply valve 3211 and the supply valve 3231 are opened. Thereby, the first treatment liquid (here, pure water) containing water is ejected from the nozzles 31 to the upper surface of the rotating substrate W. Thereby, the chemical liquid system on the upper surface of the substrate W is replaced with pure water. In addition, the cleaning process (step S4) can also be abbreviate|omitted.

For example, when the second predetermined time elapses from the start of supply of pure water, droplet processing is performed (step S5, which corresponds to the mixed solution supply step). During droplet processing, supply valve 3211, supply valve 3221, supply valve 3231, and supply valve 332 are opened. Thereby, pure water and isopropyl alcohol are supplied to the mixing part 324 through the first supply pipe 321 and the second supply pipe 322 , respectively, and the mixed liquid system from the mixing part 324 is supplied to the nozzle 31 through the mixing pipe 323 . In addition, a nitrogen gas system is supplied to the nozzle 31 . Thereby, in the nozzle 31 , the mixed liquid and the nitrogen gas system are mixed to form droplets of the mixed liquid, and the droplets of the mixed liquid are ejected from the nozzle 31 to the upper surface of the rotating substrate W.

The flow rate of the mixed solution is set to, for example, about several hundred mL/min (for example, 100 mL/min). In addition, the concentration of isopropyl alcohol in the mixed solution is set to, for example, 10 vol % or more and 40 vol % or less. Thereby, the particles on the upper surface of the substrate W can be appropriately removed by the droplet treatment.

In the droplet processing, in parallel with the discharge of the droplets of the mixed solution, the nozzle drive unit 37 causes the nozzles 31 to move along a horizontal plane close to the upper surface of the substrate W on the rotation base 21 in a non-contact state along the The rotation direction of the substrate W is moved in a direction intersecting. Specifically, the nozzle drive unit 37 reciprocates the nozzle 31 along an arc trajectory connecting a first position and a second position where the jet of droplets ejected from the nozzle 31 collides with the center of the upper surface of the substrate W The second position is the position where the jet flow of the droplets ejected from the nozzle 31 collides with the peripheral edge portion of the upper surface of the substrate W. When the nozzle 31 reciprocates between the first position and the second position while the substrate W is rotating, the liquid droplets of the mixed solution ejected from the nozzle 31 are impinged on the entire upper surface of the substrate W. Moving (scanning (sweeping)), the droplets of the mixed solution collide with all positions on the upper surface of the substrate W. FIG. That is, the droplet system of the mixed liquid is supplied to the whole area of the upper surface of the substrate W. As shown in FIG.

For example, when the third predetermined time elapses from the start of supplying the droplets of the mixed solution, the supply valve 3211, the supply valve 3221, the supply valve 3231, and the supply valve 332 are closed. Thereby, the ejection of droplets of the mixed liquid is stopped. Next, the nozzle 31 is moved to the standby retreat position by the nozzle drive unit 37 .

Next, a drying process is performed (step S6, which corresponds to a drying process). The so-called drying process is a process for drying the substrate W. For example, first, the nozzle 81 is moved to the processing position by the nozzle drive unit 83 . Next, the supply valve 822 is opened. Thereby, the cleaning liquid (here, isopropyl alcohol) having high volatility is ejected from the nozzle 81 to the upper surface of the substrate W in rotation. The isopropyl alcohol impregnated on the upper surface of the substrate W receives centrifugal force, moves toward the peripheral edge of the substrate W, and scatters from the peripheral edge of the substrate W to the outside. Thereby, the mixed liquid system on the upper surface of the substrate W is replaced with isopropyl alcohol.

For example, when the fourth predetermined time elapses from the start of supplying isopropyl alcohol, the supply valve 822 is closed. Thereby, the ejection of isopropyl alcohol is stopped. Next, by the nozzle drive part 83, the nozzle 81 is raised to a standby|standby retreat position.

Next, the rotational speed of the rotation jig 20 is increased to a high rotational speed (for example, a rotational speed higher than the rotational speed at the time of droplet processing). Thereby, the isopropyl alcohol system remaining on the substrate W is spun off and removed from the substrate W, whereby the substrate W is dried (so-called spin drying). As described above, isopropyl alcohol with high volatility exists on the upper surface of the substrate W, and the isopropyl alcohol is easily evaporated by spin drying. Thereby, generation|occurrence|production of a watermark can be suppressed. In addition, it is not always necessary to supply isopropyl alcohol in the drying process. That is, the supply of isopropyl alcohol may be omitted, and the substrate W may be dried by the high-speed rotation of the substrate W.

When the fifth predetermined time elapses after the rotation of the autorotation jig 20 at the high rotation speed is started, the rotation of the autorotation jig 20 is stopped. In addition, the process cover 40 is lowered.

Next, the center robot CR carries out the substrate W from the processing unit 10 (step S7). As described above, the series of processing on the substrate W is completed.

A series of processes from steps S1 to S7 described above are sequentially performed on the substrates W, whereby a plurality of substrates W are processed one by one in the processing unit 10 .

[Generation of bubbles] In addition, bubbles are generated in the mixed liquid. It is believed that this is due to the difference in solubility of the gas (eg air) for the different two liquids. The following is a concrete description.

Here, the solubility of the gas in the mixed liquid containing the first liquid and the second liquid is described. The first liquid system has a first solubility, and the second liquid system has a second solubility smaller than the first solubility. The solubility of the gas in the mixed liquid is determined according to the first solubility, the second solubility and the concentrations of the first liquid and the second liquid in the mixed liquid. Here, the fictitious solubility is introduced to describe the solubility of the gas in the mixed liquid. The fictitious solubility refers to the solubility calculated in a linear ratio using the first solubility, the second solubility, and the concentration. For example, when the concentration of the first liquid in the mixed solution is referred to as the first concentration and the concentration of the second liquid in the mixed solution is referred to as the second concentration, the virtual solubility is represented by (first solubility) × (first concentration ) + (second solubility) × (second concentration). It can be seen that the solubility of the gas in the liquid mixture becomes smaller than the assumed solubility.

Therefore, for example, when gas is dissolved in the first liquid and the second liquid in a saturated state, when the first liquid and the second liquid are mixed, a part of the dissolved gas system appears as bubbles. Specifically, the gas system appears in an amount corresponding to the difference between the solubility in the mixed liquid and the fictive solubility.

That is, when mixed pure water and isopropyl alcohol are mixed, bubbles are generated in the mixed liquid due to the difference in solubility. In addition, there may be a case where a tank for storing isopropanol is provided in the second treatment liquid supply source 3224 and an inert gas (eg, nitrogen gas) is supplied to the upper space in the tank. In this case, the isopropyl alcohol stored in the storage tank is pressed by nitrogen gas, and the isopropyl alcohol is supplied from the storage tank to the second supply pipe 322 in response to this pressing force. In this case, since nitrogen gas is dissolved in isopropanol, nitrogen gas appears in the mixed liquid as bubbles due to mixing of pure water and isopropanol.

When the applicant checked the inside of the mixing tube 323 after the droplet treatment (step S5 ), it was confirmed that the higher the concentration of isopropyl alcohol in the mixed solution, the more the amount of generated air bubbles increased. That is, since the solubility of gas to isopropyl alcohol is high, it is considered that a gas system dissolved in this isopropyl alcohol appears in the mixed liquid. In addition, it was confirmed that the higher the concentration of isopropyl alcohol, the more the amount of air bubbles in the liquid mixture increased with the passage of time. That is, while the nozzle 31 is stopped at the standby retreat position, the amount of air bubbles increases as time elapses.

Therefore, when the time from when the processing unit 10 finishes the droplet processing until the next start of the droplet processing is long, the amount of air bubbles in the mixing section 324 and the mixing tube 323 may increase.

When the amount of air bubbles increases, there is a possibility that a problem may occur due to the air bubbles in the next droplet processing. For example, the particles may adhere to the upper surface of the substrate W due to various factors such as aggregation of the particles around the bubbles. There may also be cases where the flow rate of the mixture is reduced due to air bubbles. When the flow rate of the mixed liquid decreases, the flow rate of the nitrogen gas becomes relatively large relative to the flow rate of the mixed liquid, and as a result, the flow velocity of the liquid droplets of the mixed liquid increases, and the substrate W is damaged.

Therefore, in order to suppress the generation of such bubbles, it is considered that the concentration of isopropyl alcohol in the mixed solution should be small. However, as the concentration of isopropanol was lowered, the particle removal performance by droplet treatment was lowered. Therefore, the concentration of isopropanol is required to some extent. For example, when the concentration of isopropyl alcohol in the mixed solution is set to 10 vol % or more and 40 vol % or less, the particulate removal performance can be improved. On the other hand, as described above, when the concentration of isopropyl alcohol becomes high, while the nozzle 31 is stopped at the stand-by retreat position, many air bubbles are generated in the mixed liquid as time elapses, and the air bubbles lower down the A problem arises in one droplet handling.

[Extrusion process (replacement process)] Therefore, in the present embodiment, in order to suppress the generation of air bubbles in the liquid mixture, the ejection process is performed from the end of the droplet process until the next start of the droplet process. The push-out treatment is a treatment of supplying a treatment liquid (hereinafter referred to as a replacement liquid) of pure water and isopropyl alcohol, pushing out the mixed liquid inside the mixing section 324 and the mixing tube 323 with the replacement liquid, and removing the liquid from the mixing section 324 and the mixing tube 323. The nozzle 31 ejects. This push-out process is performed, for example, in a state where the nozzle 31 is stopped at the standby retreat position. Thereby, the mixed liquid system ejected from the nozzle 31 is caught by the waiting room 39 and collected or discarded.

By this extrusion process, the mixed liquid inside the mixing section 324 and the mixing tube 323 is replaced with the replacement liquid. Since the replacement liquid is a single liquid, generation of air bubbles in the mixing section 324 and the mixing tube 323 can be suppressed.

FIG. 9 is a flowchart showing an example of the flow of substrate processing. In the example of FIG. 9 , the control unit 90 executes the ejection process (step S8 , which corresponds to the replacement process) immediately after the droplet process (step S5 ). In the example of FIG. 9, the push-out process (step S8) is performed in parallel with the drying process (step S6).

In this push-out process, the mixed liquid supply unit 30 supplies, for example, pure water as a replacement liquid. Specifically, when the supply valve 3221 and the supply valve 332 are closed, the supply valve 3211 and the supply valve 3231 are opened. Thereby, pure water is supplied from the first supply pipe 321 to the mixing unit 324 . By the supply of pure water, the mixed liquid system in the mixing unit 234 and the mixing tube 323 is pushed out by the pure water, and is ejected from the nozzle 31 to the standby chamber 39 . Therefore, the mixed liquid system inside the mixing section 324 and the mixing tube 323 is replaced with pure water in order from the upstream side. When all the mixed liquid is ejected, pure water is ejected from the nozzle 31 next.

For example, when the fifth predetermined time elapses from the start of supply of pure water, the supply valve 3211 and the supply valve 3231 are closed. Thereby, the supply of pure water is stopped. The fifth predetermined time is set to be sufficient time for the mixed liquid in the mixing section 324 and the mixing tube 323 to be replaced with pure water.

Thereby, since the liquid mixture is replaced with pure water, the generation of subsequent bubbles can be suppressed. Therefore, in the case where the droplet processing is performed next time, the occurrence of problems due to air bubbles can be suppressed.

In addition, in the above-mentioned example, conditions other than the completion of the droplet processing are not adopted as a trigger for starting the ejection processing. That is, every time the droplet processing is terminated, the ejection processing is normally performed. Thereby, the occurrence of a problem due to air bubbles in the next droplet processing can be reliably suppressed. However, push-out processing is not necessarily routinely required. The reason is that in the case where the time from the end of the droplet processing until the next start of the droplet processing is short, the amount of air bubbles is less likely to increase.

Therefore, the control unit 90 performs the ejection process when the liquid mixture is not supplied to the substrate W within the reference time Tref after the droplet process is completed, that is, when the next droplet process is not performed. On the other hand, when the next droplet processing is performed within the reference time Tref, the ejection processing is not performed.

FIG. 8 is a flowchart schematically showing an example of the judgment as to whether or not the push-out process is necessary. First, the control unit 90 acquires the time from the end of the droplet processing until the next start of the droplet processing (hereinafter referred to as the droplet standby time T1 ) (step S11 ). The droplet standby time T1 is included in, for example, program information that defines a program for processing the substrate W. This program information is notified to the control unit 90 by, for example, an apparatus on the upstream side of the substrate processing apparatus 100 , or may be notified to the control unit 90 by an operator's input.

Next, the control unit 90 determines whether or not the droplet standby time T1 is equal to or longer than the reference time Tref (step S12). The reference time Tref is preset, for example, and is specifically set to several minutes (for example, about 5 minutes).

When the droplet standby time T1 is equal to or longer than the reference time Tref, the control unit 90 determines that the ejection process is necessary (step S13). On the other hand, when the droplet standby time T1 is less than the reference time Tref, the control unit 90 determines that the ejection process is unnecessary (step S14).

FIG. 10 is a diagram showing various steps of substrate processing in time series. In the example of FIG. 10, the sequence of executing the respective steps S1 to S8 is shown. In the example of FIG. 10, the substrate processing of the substrate W1, the substrate W2, and the substrate W3 of the three substrates W is shown.

In the example of FIG. 10 , the substrate processing of steps S1 to S7 is performed on the substrate W1, and then the same substrate processing is performed on the next substrate W2. That is, in the example of FIG. 10 , the substrate processing on the substrate W2 is performed continuously with the substrate processing on the substrate W1 . Therefore, the time from the end of the substrate processing on the substrate W1 to the start of the substrate processing on the next substrate W2 is very short.

In this case, the droplet standby time T1 from the end of the droplet processing on the substrate W1 (step S5 ) until the start of the droplet processing on the next substrate W2 (step S5 ) becomes shorter than the reference time Tref. Therefore, the ejection process is not performed during the droplet standby time T1 (step S8). That is, since the droplet standby time T1 is shorter than the reference time Tref, the amount of air bubbles at the start time of the droplet process (step S5 ) on the next substrate W2 is small even if the ejection process is not performed. Therefore, the droplet processing can be appropriately performed even if the ejection processing is not performed. In addition, the consumption of the replacement liquid (pure water in this case) can be reduced by not performing the push-out treatment.

On the other hand, in the example of FIG. 10 , after a predetermined time interval elapses after the substrate processing of the substrate W2 , the substrate processing is performed on the substrate W3 . That is, in the example of FIG. 10 , the time from the end of the substrate processing on the substrate W2 to the start of the substrate processing on the next substrate W3 is long.

For example, there may be cases where the substrate processing apparatus 100 performs the substrate processing using a predetermined number of substrates W as a unit. This predetermined number of sheets can be set, for example, to the number of sheets of the substrates W contained in the carrier C carried into the load port LP. There may be a case where the substrate processing for the substrates W in one unit is continuously performed, and when the substrate processing for the last substrate W (for example, substrate W2) in the one unit is completed, a predetermined time interval has elapsed to start the next substrate processing. One unit of substrate processing of the first substrate W (eg, substrate W3 ).

In this case, the droplet standby time T1 from the end of the droplet processing on the substrate W2 (step S5 ) to the start of the droplet processing on the next substrate W3 (step S5 ) becomes longer than The reference time Tref is still long. In this case, the ejection process is performed in the droplet standby time T1 (step S8). In the example of FIG. 10, the push-out process (step S8) is performed in parallel with the drying process (step S6) with respect to the board|substrate W2. Thereby, the mixed liquid inside the mixing part 324 and the mixing tube 323 can be replaced with pure water. Therefore, the generation of air bubbles due to the mixed liquid can be suppressed.

Therefore, it is possible to suppress the occurrence of problems due to air bubbles in the droplet processing (step S5 ) on the substrate W3 . More specifically, the number of particles remaining on the upper surface of the substrate W can be reduced by about half compared to the case where the push-out process is not performed. In addition, damage to the substrate W due to a decrease in the flow rate of the mixed solution can also be reduced.

As described above, when the mixed solution is not supplied within the reference time Tref after the mixed solution supply unit 30 ends the supply of the mixed solution, the push-out process is performed. Thereby, the generation of air bubbles in the mixing section 324 and the mixing tube 323 can be suppressed. Furthermore, it is possible to suppress the occurrence of problems due to air bubbles in the subsequent droplet processing.

In addition, in the above-mentioned example, in the push-out process (step S8 ), the mixed liquid supply unit 30 supplies the replacement liquid (here, pure water) to the mixing unit 324 in a state where the nozzle 31 is stopped at the standby retreat position. . Thereby, the mixed liquid and the pure water system are ejected to the standby chamber 39 without being ejected to the substrate W. Therefore, unnecessary supply of the processing liquid (here, pure water) to the substrate W can be avoided. In addition, the next process (herein, drying process) on the substrate W can be started immediately after the droplet process.

In addition, in the above-mentioned example, in the extrusion process (step S8 ), the mixed liquid supply unit 30 does not supply the gas to the nozzle 31 . Thereby, the consumption amount of gas can be reduced.

[replacement fluid] Oxygen is more soluble in water than oxygen is in isopropanol, and nitrogen is more soluble in water than nitrogen is in isopropanol. Therefore, the air system can dissolve more in isopropyl alcohol than in water.

In the above-described example, the first treatment liquid (here, pure water) containing water is used as the replacement liquid in the push-out treatment (step S8 ). That is, instead of using isopropyl alcohol having a high solubility, pure water having a low solubility was used. According to this push-out process, the interiors of the mixing section 324 and the mixing tube 323 are filled with pure water with low solubility.

In this state, when the mixed solution supply unit 30 supplies pure water and isopropyl alcohol to the mixing unit 324 , the mixed solution system pushes out the pure water inside the mixing unit 324 and the mixing tube 323 and ejects the pure water from the nozzle 31 . At this time, although bubbles are also generated at the interface between the mixed solution and pure water, since the solubility of pure water is low, it is difficult to generate bubbles.

On the other hand, isopropyl alcohol can also be used as a replacement liquid in the push-out process (step S8). In this case, since the mixed liquid inside the mixing section 324 and the mixing tube 323 can be replaced with the replacement liquid (isopropyl alcohol), the generation of air bubbles can also be suppressed.

However, in this state, when the mixed liquid supply unit 30 supplies pure water and isopropyl alcohol to the mixing unit 324, the mixed liquid system pushes out the isopropyl alcohol inside the mixing unit 324 and the mixing pipe 323 and causes the isopropyl alcohol to escape from the mixing unit 324. The nozzle 31 ejects. At this time, since the mixed liquid pushes out isopropyl alcohol with high solubility, there is a possibility that air bubbles may be generated at the interface between the mixed liquid and isopropyl alcohol.

Therefore, from the viewpoint of reducing the generation of air bubbles, it is desirable to use the first treatment liquid (here, pure water) as the replacement liquid in the push-out treatment (step S8). Thereby, the generation of the above-mentioned bubbles can be suppressed.

[flow] In addition, since the mixed liquid exists in the mixing section 324 and the mixing tube 323 after the droplet processing, air bubbles are generated. Furthermore, in the push-out process, the replacement liquid (here, pure water) pushes out the mixed liquid and ejects the mixed liquid from the nozzle 31 . At this time, the air bubbles in the mixed liquid also move along with the flow of the mixed liquid and pure water, and are ejected from the nozzle 31 . However, there is a possibility that some air bubbles remain.

Therefore, the flow rate of the replacement liquid in the push-out treatment may be set high. FIG. 11 is a graph showing an example of the discharge flow rate from the nozzle 31 . As illustrated in FIG. 11 , the flow rate of the replacement liquid in the extrusion process (step S8 ) may be set higher than the flow rate of the mixed liquid in the droplet process (step S5 ). The flow rate of the replacement liquid is, for example, set to be, for example, twice or more the flow rate of the mixed liquid, for example, about 250 mL/min.

In this way, by increasing the flow rate of the replacement liquid in the extrusion process, the force acting on the bubbles in the extrusion process increases, and the bubbles are easily moved toward the nozzle 31 side. Therefore, the air bubbles can be discharged more appropriately.

[Opening and closing of supply valve] The opening and closing of the supply valve 3231 provided in the mixing tube 323 may be repeatedly switched during the push-out process. FIG. 12 is a timing chart showing an example of opening and closing of the supply valve 3231 . In the example of FIG. 12 , the supply valve 3231 is kept open for a long period in the droplet processing (step S5 ), whereas the supply valve 3231 is repeatedly switched on and off in the ejection processing (step S8 ).

By such switching of opening and closing, the supply valve 3231 vibrates. The vibration is also transmitted from the mixing pipe 323 to the mixing part 324 and the nozzle 31 . Therefore, in the case where air bubbles are generated in these interiors, the vibration also acts on the air bubbles, and the air bubbles move due to the vibration in each interior. Therefore, even if the air bubbles are stationary at each internal level difference (eg, a level difference such as a joint), the air bubbles move from the level difference by vibration and are discharged from the nozzle 31 by the flow of the replacement liquid. Therefore, the air bubbles can be discharged from the nozzle 31 more appropriately.

In addition, in the push-out process, the supply valve 3211 provided in the first supply pipe 321 may maintain the open state without repeatedly switching the opening and closing. Alternatively, the opening and closing of the supply valve 3211 may be repeatedly switched.

[Timing of push out processing] Referring to FIG. 10 , the ejection process (step S8 ) may be executed from the end of the droplet process (step S5 ) until the start of the next droplet process (step S5 ). That is, the ejection process (step S8 ) may be executed until the droplet standby time T1 elapses.

For example, the push-out process (step S8 ) may be performed while the substrate processing for the next substrate W (eg, the substrate W3 ) is in progress. For example, as shown by the two-dotted chain line in FIG. 10 , the push-out process (step S8 ) may be performed in parallel with the chemical solution process (step S3 ) for the next substrate W3 . Even in this case, since the air bubbles can be discharged by the ejection process (step S8 ), the droplet process on the substrate W3 can be appropriately performed (step S5 ).

However, in the droplet standby time T1, since the amount of air bubbles increases over time, when the ejection process is performed at a slow timing, it becomes slightly difficult to discharge air bubbles. Therefore, it is desirable to perform push-out processing at a faster timing. For example, it is desirable to start the push-out process until the next board W3 is carried in (step S1 ).

For example, the push-out process (step S8 ) may be performed during an idling period after the substrate W2 is unloaded from the processing unit 10 until the next substrate W3 is carried into the processing unit 10 . In the example of FIG. 10, the push-out process (step S8) is shown by the two-dot chain line between the carrying out of the board|substrate W2 (step S7) and the carrying-in of the next board|substrate W3 (step S1). Thereby, since the push-out process (step S8) is performed at an early sequence, the push-out process (step S8) can be performed in a state with fewer air bubbles. Therefore, air bubbles can be more appropriately discharged in the push-out process.

More preferably, the push-out process is started (step S8 ) until the drying process for the substrate W2 is completed (step S6 ). Thereby, since the push-out process (step S8) can be performed at an earlier time sequence, air bubbles can be discharged more appropriately.

In addition, in the description of the execution sequence of the extraction process described above, reference is made to FIG. 10 showing the reference time Tref, but the configuration using the reference time Tref as the start trigger of the extraction process is not essential. Even in the case where the ejection treatment is normally performed after the droplet treatment is completed, the ejection treatment may be performed until the next droplet treatment is started. Of course, as described above, it is desirable to perform the push-out processing at an earlier timing from the viewpoint of easily discharging air bubbles.

[Capacity of mixing tube] As the capacity of the mixing tube 323 increases, the amount of the replacement liquid required to replace the mixed liquid inside the mixing tube 323 with the replacement liquid increases. As a result, the consumption of the replacement fluid increases. Therefore, the volume of the mixing tube 323 is set to, for example, 20 mL or less, or preferably 10 mL or less. Thereby, the consumption amount of the replacement fluid can be reduced.

[Setting the reference time] When the concentration of isopropyl alcohol with high solubility becomes higher, the amount of bubbles becomes larger. Therefore, when the reference time Tref is set according to the high concentration of isopropyl alcohol, the reference time Tref is set to a smaller value. In this case, it does not matter if the isopropanol concentration of the liquid mixture ejected during the droplet processing is low, the amount of bubbles at the start of the next droplet processing will not matter even if the droplet standby time T1 is equal to or longer than the reference time Tref. There is a possibility that the tolerance is not met. In this case, unnecessary push-out processing is performed.

On the other hand, when the reference time Tref is set according to the low isopropyl alcohol concentration, the reference time Tref is set to a larger value. In this case, if the concentration of isopropyl alcohol in the mixed liquid discharged during the droplet processing increases, even if the droplet standby time T1 is less than the reference time Tref, there will be bubbles at the start of the next droplet processing. the possibility that the amount exceeds the allowable amount. In this case, a problem arises in the next droplet processing.

Therefore, the control unit 90 may set the reference time Tref to be shorter as the isopropyl alcohol concentration of the liquid mixture in the droplet processing is higher. For example, the reference time Tref may be shortened stepwise with respect to an increase in the concentration of isopropanol, or may be shortened monotonically (for example, proportionally) with respect to an increase in the concentration of isopropanol. The relationship between the reference time Tref and the concentration of isopropyl alcohol can also be set, for example, by a table, a mathematical formula, or the like.

The information on the concentration of isopropyl alcohol is included in program information and the like for specifying the treatment of the substrate. The control unit 90 reads the information on the concentration of isopropanol in the liquid mixture used for droplet processing from the program information, and sets the reference time Tref based on the concentration of the isopropanol and the above-described relationship.

Thereby, execution of unnecessary ejection processing can be suppressed, and problems in the next droplet processing can be suppressed.

[Piping system] The mixing part 324 and the mixing pipe 323 may be designed so that the steps or the bending angles in the interior are reduced. Thereby, the air bubbles can be suppressed from being caught in the step or the bending angle, and the air bubbles can be easily discharged.

[Second Embodiment] In the first embodiment, whether or not the ejection process is necessary is determined based on the droplet standby time T1. Specifically, when the droplet standby time T1 is equal to or longer than the preset reference time Tref, it is determined that the ejection process is necessary. In addition, since the amount of generation of air bubbles varies, it is desirable to set the reference time Tref to be slightly shorter in order to more reliably avoid problems in the next droplet processing. However, in this case, if the reference time Tref is made short, even if the generation amount of air bubbles becomes small, the push-out process may be performed. Such unnecessary push-out processing is undesirable.

Therefore, in the second embodiment, whether or not air bubbles are generated in the mixing tube 323 is monitored, and based on the result, it is determined whether or not the ejection process is necessary. Hereinafter, the second embodiment will be described.

The substrate processing apparatus 100 of the second embodiment is the same as that of the first embodiment. However, in the second embodiment, the internal configuration of the processing unit 10 is different. FIG. 13 is a diagram schematically showing an example of the configuration of the processing unit 10 according to the second embodiment. The processing unit 10 of the second embodiment differs from the processing unit 10 of the first embodiment in the point of the presence or absence of the bubble detection unit 60 .

The air bubble detection unit 60 detects air bubbles generated in the mixed liquid inside the mixing tube 323 . For example, the air bubble detection unit 60 optically detects the air bubbles. As a more specific example, the bubble detection unit 60 includes a camera 61 . The camera 61 is, for example, an optical system including a CCD (Charge Coupled Device), which is a type of solid-state imaging element, and a lens.

The camera 61 is arranged so that at least the mixing tube 323 in the state where the nozzle 31 is stopped at the standby retreat position is included in the imaging area. It is only necessary to include a part of the mixing tube 323 in the longitudinal direction in the imaging area, and it is not necessary to include the entire mixing tube 323 . The camera 61 shoots the shooting area to obtain shooting image data. The camera 61 outputs the captured image data to the control unit 90 .

The mixing tube 323 is formed of a transparent member. Therefore, the state of the mixed liquid inside the mixing tube 323 can be visually checked from the outside. Therefore, the mixed liquid inside the mixing tube 323 is reflected on the captured image data obtained by the camera 61 .

The control unit 90 analyzes the captured image data, and detects air bubbles inside the mixing tube 323 . Although the algorithm of video processing is not particularly limited, a simple example will be briefly described. For example, the captured image data obtained by the camera 61 in a state where no air bubbles are generated are stored in the storage medium 93 in advance as reference image data. In addition, an area including only the mixing tube 323 in the captured image data may be cut out and stored in the storage medium 93 in advance as the reference image data. Hereinafter, it is assumed that this area is memorized as reference image data.

The control unit 90 detects air bubbles based on the comparison of the captured image data acquired by the camera 61 during the droplet standby time T1 and the reference image data. For example, the control unit 90 cuts out an area including the mixing tube 323 in the captured image data, and calculates an index (for example, the sum of the absolute values of the differences of each pixel) for showing the difference between the area and the reference image data ). The control unit 90 determines that an unacceptable level of air bubbles is generated when the index is larger than the reference value.

In addition, in this example, it can be said that the image analysis function of the control unit 90 and the camera 61 constitute the air bubble detection unit 60 . Of course, another control unit different from the control unit 90 may have the image analysis function, and the other control unit and the camera 61 may constitute the air bubble detection unit 60 .

In addition, the bubble detector 60 does not necessarily need to include the camera 61 . For example, the air bubble detection unit 60 may include a light emitter and a light receiver not shown. The light emitter irradiates light to a part of the mixing tube 323 in the longitudinal direction. The light receiver is disposed on the opposite side of the light emitter with respect to the part of the mixing tube 323 , and receives the light passing through the mixing tube 323 . Since the light amount of the light received by the light receiver varies according to the amount of air bubbles in the mixing tube 323, the generation of air bubbles can be detected based on the light amount of the light.

[Substrate processing] An example of the operation of the substrate processing by the processing unit 10 is the same as that of the first embodiment, for example, the same as the flowchart of FIG. 7 . However, in the second embodiment, when the air bubble detection unit 60 detects air bubbles of an unacceptable level, the pushing process is performed inside the mixing tube 323 .

[Push out processing] FIG. 14 is a flowchart showing an example of the operation of the processing unit 10 . This series of processing is repeatedly performed. For example, the control unit 90 determines whether or not the droplet processing (step S5 ) has ended (step S21 ). When the droplet processing has not yet ended, the control unit 90 executes step S21 again.

When the droplet processing is completed, the bubble detection unit 60 starts a bubble detection operation (step S22 : detection process). As a specific example, the camera 61 captures images of the capture area at each predetermined time, sequentially acquires captured image data, and outputs the captured image data to the control unit 90 . The control unit 90 analyzes the captured image data, and determines whether or not the amount of air bubbles is equal to or greater than the allowable amount (step S23). This allowable amount is a value that will not cause a problem in the next droplet processing, and is set in advance.

When the amount of air bubbles is less than the allowable amount, the control unit 90 determines whether or not droplet processing has been started on the next substrate W (step S25 ). In the case where droplet processing has been started, a series of processing ends. That is, in the example of FIG. 14 , the detection operation of air bubbles is not performed while the droplet processing is being performed. Conversely, the detection operation of air bubbles is performed during the droplet standby time T1. Thereby, execution of unnecessary processing can be suppressed.

In the case where the droplet processing has not started, the control unit 90 performs the determination of step S23 again with respect to the captured image data acquired next. That is, the control unit 90 analyzes the next captured image data, and determines whether or not the amount of air bubbles is equal to or greater than the allowable amount for the captured image data.

When the amount of air bubbles is equal to or greater than the allowable amount, the mixed solution supply unit 30 executes the push-out process (step S24). This ejection process is performed before starting the next droplet process. That is, the ejection process is performed during the droplet standby time T1. By the execution of the push-out process, the mixed liquid and the bubble system in the mixing unit 324 and the mixing tube 323 are pushed out by the replacement liquid (here, pure water) and ejected from the nozzle 31 . Thereby, the mixed liquid system inside the mixing part 324 and the mixing tube 323 is replaced with pure water. Therefore, the generation of subsequent bubbles can be suppressed. Next, the control unit 90 executes step S25.

As described above, in the second embodiment, the mixed solution supply unit 30 executes the ejection process in accordance with the detection result of the air bubble detection unit 60 . Thereby, the push-out process is performed when air bubbles exceeding the allowable amount are actually detected. By performing this ejection processing, it is possible to suppress the occurrence of problems in the next droplet processing. In addition, when the air bubbles exceeding the allowable amount are not detected, the push-out process is not performed. Therefore, execution of unnecessary push-out processing can also be suppressed.

As described above, although the substrate processing method and the substrate processing apparatus 100 have been described in detail, the above description is merely an example in all aspects, and the substrate processing apparatus is not limited to these aspects. It can be construed that countless variations not illustrated can be conceived without departing from the scope of the present invention. The respective configurations described in the above-described respective embodiments and respective modified examples can be appropriately combined or omitted as long as they do not contradict each other.

For example, in the above example, although the nozzle 31 is a two-fluid nozzle, it may also be a single-fluid nozzle. In this case, the nozzle 31 ejects the liquid mixture of the first treatment liquid containing water and isopropyl alcohol in a columnar shape. Even in this case, when the nozzle 31 stops ejecting the mixed liquid, the amount of air bubbles in the mixing portion 324 and the inside of the mixing tube 323 increases with time. In this state, when the nozzle 31 ejects the mixed liquid again, the bubbles will cause the following situations: the mixed liquid from the nozzle 31 will be scattered; the flow rate of the mixed liquid will decrease at the moment when the bubbles are ejected; A portion of the surface creates an area that is not covered by the mixture. Such a problem is unfavorable, and therefore it is desired to suppress the generation of air bubbles.

Therefore, even if the nozzle 31 is a single-fluid nozzle, the processing unit 10 can perform the ejection process during the droplet standby time T1 as in the first embodiment or the second embodiment. Thereby, the occurrence of problems due to air bubbles can be suppressed.

In addition, in the above-mentioned example, although the nozzle 31 ejects the mixed liquid in the ejection direction (central axis L) along the vertical direction, it is not limited to this. The nozzle 31 may discharge the mixed liquid in the discharge direction (central axis L) inclined with respect to the vertical direction.

In addition, in the specific example of the first embodiment, the control unit 90 reads the droplet waiting time T1 from the program information, and determines that the ejection process is necessary when the droplet waiting time T1 is equal to or longer than the reference time Tref. However, the judgment as to whether or not the push-out process is necessary is not limited to this. For example, the control unit 90 may measure the elapsed time after the droplet processing (step S5 ) is completed, and determine that the ejection step is necessary when the elapsed time becomes equal to or longer than the reference time Tref. The elapsed time can be measured, for example, by a timer circuit not shown.

10: Processing unit 20: Rotation fixture 21: Rotation base 21a: upper surface 22: Autorotation motor 23: Cover member 24: Rotary axis 25: Flange member 26: Clamp Pin 30: Mixed solution supply part 31,71,81: Nozzle 32: Mixed liquid piping system 33: Gas piping system 34,74: Arm 35,75: Lifting shaft 36,76: Nozzle base 37, 77, 83: Nozzle Drive 39: Standby cabin 40: Handling hood 41: inner cover 42: Middle cover 43: Cover 43a, 52a301a: lower end 43b, 47b, 52b: upper end 43c, 52c: Turn-back part 44: Bottom 45: inner wall 46: Outer wall 47: The first guide 48: Middle wall 49: Abandoned Trench 50: Inside recovery groove 51: Outer recovery groove 52: Second guide part 53: Treatment liquid separation wall 60: Bubble detection section 61: Camera 70: Liquid medicine supply department 72: Chemical liquid piping system 80: Cleaning fluid supply part 82: Cleaning fluid piping system 90: Control Department 91: Processing Department 92, 93: Memory Media 100: Substrate processing device 110: Substrate mounting part 301: outer cylinder 302: inner cylinder 302a: Large diameter section 302b: Trail Section 303: Internal space (mixed liquid flow path) 304: Opening (mixed liquid ejection port) 305: Clearance (gas flow path) 306: Import Tube 307: Opening (gas outlet) 308: Flange 309: Through hole 310: Short barrel 311: Space 321: First supply pipe 322: Second supply pipe 323: Mixing Tube 324: Mixed Ministry 331: Gas supply pipe 332,722,822,3211,3221,3231: Supply valve 333: Flow Adjustment Department 334: Filter 335: Gas supply source 721: Liquid medicine supply pipe 723, 823, 3212, 3222: Flow adjustment valve 724, 824, 3213, 3223: Flowmeters 725: Liquid supply source 821: Cleaning fluid supply pipe 825: Cleaning fluid supply source 3214: The first treatment liquid supply source 3224: The second treatment liquid supply source C: Carrier CR: Center Robot CX: axis of rotation D: Arrangement direction F: point (convergence point) H: hand IR: Index Robot L: center axis LP: Load port S1: Holding process (carrying in and holding) S2: Rotate S3: Liquid treatment S4: Cleaning treatment S5: Mixed solution supply process (droplet treatment) S6: drying process (drying treatment) S7: Move out S8: Replacement process (extrusion process) T1: Droplet standby time Tref: base time W, W1, W2, W3: Substrate (semiconductor substrate)

1 is a diagram schematically showing an example of the overall configuration of a substrate processing apparatus. 2 is a side view schematically showing an example of the configuration of the processing unit according to the first embodiment. 3 is a longitudinal cross-sectional view schematically showing an example of the configuration of the nozzle. [ Fig. 4] Fig. 4 is a diagram schematically showing an example of the configuration of the mixed solution supply unit. [ Fig. 5] Fig. 5 is a diagram schematically showing an example of the configuration of the chemical solution supply unit. FIG. 6 is a functional block diagram schematically showing an example of the configuration of the control unit. FIG. 7 is a flowchart showing an example of the flow of substrate processing. FIG. 8 is a flowchart schematically showing an example of the judgment of whether or not the push-out process is necessary. 9 is a flowchart showing an example of the flow of substrate processing. [FIG. 10] It is a figure which shows each step of a board|substrate process in time series. 11 is a graph showing an example of the discharge flow rate of the nozzle. 12 is a timing chart showing an example of opening and closing of the supply valve provided in the mixing tube. 13 is a side view schematically showing an example of the configuration of the processing unit according to the second embodiment. 14 is a flowchart showing an example of the operation of the processing unit.

S1: Holding process (carrying in and holding)

S2: Rotate

S3: Liquid treatment

S4: Cleaning treatment

S5: Mixed solution supply process (droplet treatment)

S6: drying process (drying treatment)

S7: Move out

S8: Replacement process (extrusion process)

Claims (11)

A substrate processing method, comprising: The holding process is to hold the substrate; In the mixed solution supply step, a treatment solution containing water and isopropanol are supplied to the mixing pipe through a first supply pipe and a second supply pipe, respectively, and a mixed solution in which the treatment liquid and the isopropyl alcohol are mixed is passed through the mixing pipe ejected from the nozzle to the aforementioned substrate; and The substitution step is to supply a substitution liquid belonging to any one of the treatment liquid and the isopropyl alcohol after the mixed liquid supply step, and push out the mixed liquid in the mixing tube with the substitution liquid, so that the mixed liquid is removed from the mixing tube. The nozzle is ejected to replace the mixed liquid with the replacement liquid. The substrate processing method according to claim 1, further comprising after the mixed solution supply step: a drying step for drying the substrate; The replacement step is started after the mixed solution supply step and is continued until the drying step is completed. The substrate processing method according to claim 1 or 2, wherein, in the replacement step, when the mixed solution is not supplied within a reference time after the mixed solution supply step, the replacement solution is supplied and the liquid in the mixing tube is removed. The aforementioned mixed liquid is replaced with the aforementioned replacement liquid. The substrate processing method according to claim 3, wherein the reference time is set to be shorter as the concentration of the isopropyl alcohol in the mixed solution is higher. The substrate processing method according to claim 1, further comprising: a detection step of detecting air bubbles in the mixing tube by the air bubble detection unit; In the replacement step, when the amount of air bubbles detected by the air bubble detector is larger than the allowable amount, the replacement liquid is supplied and the mixed liquid in the mixing tube is replaced with the replacement liquid. The substrate processing method according to claim 1 or 2, wherein the mixed liquid contains bubbles generated by mixing the processing liquid and the isopropyl alcohol. The substrate processing method according to claim 1 or 2, wherein in the replacement step, the replacement liquid is supplied and the replacement liquid is supplied in a state in which the nozzle has been moved to a stand-by evacuation position outside the substrate in plan view. The mixed liquid is replaced with the aforementioned replacement liquid. The substrate processing method according to claim 1 or 2, wherein, in the replacement step, supply of the replacement liquid and stoppage of the supply of the replacement liquid are repeated, and the mixed liquid is replaced with the replacement liquid. The substrate processing method according to claim 1 or 2, wherein in the replacement step, the replacement liquid is supplied at a flow rate larger than the flow rate of the mixed liquid in the mixed liquid supply step. The substrate processing method according to claim 1 or 2, wherein the replacement liquid is the treatment liquid. A substrate processing device is provided with: The substrate holding part is used to hold the substrate; The mixed solution supply part includes: nozzle; the first supply pipe is supplied with a treatment liquid containing water; a second supply pipe that is supplied with isopropanol; and a mixing pipe for supplying a mixed liquid of the treatment liquid supplied from the first supply pipe and the isopropyl alcohol supplied from the second supply pipe to the nozzle; and The control unit controls the mixed liquid supply unit so as to supply the replacement liquid belonging to either the processing liquid or the isopropyl alcohol to the mixing tube after the discharge of the mixed liquid from the nozzles is completed, The replacement liquid pushes out the mixed liquid in the mixing tube and ejects the mixed liquid from the nozzle, thereby replacing the mixed liquid with the replacement liquid.

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