JP7002605B2 - Board processing equipment and board processing method - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate using a first chemical fluid and a second chemical fluid. Examples of the substrate include a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, and a substrate for a photomask. Includes ceramic substrates, solar cell substrates, etc.

In the manufacturing process of semiconductor devices and liquid crystal display devices, a single-wafer type substrate processing device that processes the substrates one by one in order to treat the surface of the substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel with a chemical solution is used. May be used. The single-wafer type substrate processing apparatus has a spin chuck that holds and rotates the substrate almost horizontally inside a processing chamber partitioned by a partition wall, and a first chemical solution on the upper surface of the substrate held by the spin chuck. A first chemical solution nozzle for supplying the second chemical solution and a second chemical solution nozzle for supplying the second chemical solution to the upper surface of the substrate held by the spin chuck are provided. The first chemical solution nozzle has a discharge port, and the chemical solution pipe for supplying the chemical solution from the chemical solution supply source to the first chemical solution nozzle is connected to the first chemical solution nozzle.

In such a substrate processing apparatus, the first chemical solution and the second chemical solution may be a combination that poses a risk of contact (that is, a combination that is not suitable for contact). When processing with a combination of chemicals that is not suitable for such contact is performed in one treatment chamber, a valve for the other chemical is newly opened when one of the chemicals is supplied so as not to make contact inside the treatment chamber. It has been proposed to execute an interlock process such as prohibiting the opening of a valve for a chemical solution when the detection value of the rotation speed of the substrate is out of the rotation speed range (see, for example, Patent Documents 1 and 2).

Japanese Patent No. 4917469 Japanese Patent No. 4917470

However, if the first nozzle is arranged around the spin chuck during the treatment using the second chemical fluid (second chemical liquid), the atmosphere containing the second chemical fluid is transmitted through the discharge port. There is a risk of entering the chemical fluid piping (chemical liquid piping). The entry of the atmosphere containing the second drug fluid into the inside of the drug fluid pipe can cause contact between the first drug fluid and the second drug fluid.

Therefore, an object of the present invention is to prevent the occurrence of contact between the chemical fluids inside the chemical fluid piping even if the combination of the plurality of chemical fluids used for the substrate treatment is not suitable for contact. However, it is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of completing a process using the plurality of types of chemical fluids in one processing chamber.

The present invention is a processing chamber, a substrate holding unit arranged in the processing chamber to hold a substrate, and a discharge for discharging a fluid toward the main surface of the substrate held by the substrate holding unit. It has a first nozzle having an outlet and a drug fluid pipe connected to the first nozzle and having an inside communicating with the discharge port, and the first drug is connected to the first nozzle via the drug fluid pipe. A first drug fluid supply unit for supplying a fluid and a water pipe branched and connected to the drug fluid pipe, and a first for supplying water to the drug fluid pipe via the water pipe. A second nozzle for supplying a second drug fluid, which is a fluid different from the first drug fluid, is provided on the main surface of the water supply unit and the substrate held by the board holding unit. A second drug fluid supply unit and a control unit for controlling the first drug fluid supply unit, the second drug fluid supply unit, and the first water supply unit are included, and the control unit is the first. By supplying the drug fluid of 1 to the drug fluid pipe, the first drug fluid is discharged from the first nozzle toward the main surface of the substrate held by the substrate holding unit, and the first drug fluid is discharged. The first processing step of applying the treatment using the chemical fluid to the substrate held in the substrate holding unit, and the state in which the first nozzle is arranged above the substrate held in the substrate holding unit. Then, the second chemical fluid is supplied from the second nozzle to the main surface of the substrate held by the substrate holding unit, and the process using the second chemical fluid is performed by the substrate holding unit. After the execution of the second treatment step and the execution of the first treatment step applied to the substrate held in the above, and before the execution of the second treatment step, the water from the first water supply unit is used as the drug. Provided is a substrate processing apparatus for supplying to a fluid pipe and performing a first water replacement step of replacing the first drug fluid inside the drug fluid pipe with water.

According to this configuration, the first treatment step using the first drug fluid and the second treatment step using the second drug fluid are performed in a common treatment chamber. In the first processing step, by supplying the first drug fluid to the drug fluid pipe, the first drug fluid is discharged from the first nozzle toward the main surface of the substrate.

Further, the first water replacement step is executed after the execution of the first treatment step and before the execution of the second treatment step. Before the start of the second treatment step, the first chemical fluid used in the first treatment step may remain inside the chemical fluid pipe. However, by substituting the inside of the drug fluid pipe with water prior to the second treatment step, the first drug fluid does not remain inside the drug fluid pipe at the start of the second treatment step. Therefore, even if the second drug fluid enters the drug fluid pipe in the second processing step, it does not come into contact with the first drug fluid inside the drug fluid pipe. This makes it possible to prevent the contact between the first drug fluid and the second drug fluid inside the drug fluid pipe in the second processing step.

As described above, even if the combination of a plurality of types of drug fluids (first drug fluid and second drug fluid) used for substrate treatment is not suitable for contact, those drugs inside the drug fluid pipe are used. It is possible to provide a substrate processing apparatus capable of completing processing using the plurality of types of chemical fluids in one processing chamber while preventing the occurrence of fluid contact.
Further, in this specification, the term "combination that is not suitable for contact" includes not only "combination that causes danger in contact" but also "combination that produces a product by contact". Is. The "combination that produces a product by contact" also includes a combination of an acid and an alkali.

The substrate processing device is a chemical fluid valve interposed in the chemical fluid pipe, and further includes a chemical fluid valve arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe. May be good. The control unit may control the drug fluid valve. In the first processing step, the drug fluid valve may be opened while supplying the first drug fluid to the drug fluid pipe. The second processing step may be performed with the chemical fluid valve closed. In the first water replacement step, water may be supplied to the chemical fluid pipe with the chemical fluid valve open.
In one embodiment of the present invention, the substrate processing apparatus further includes a suction unit for sucking the inside of the drug fluid pipe. Then , the control unit further controls the suction unit . Then , after the completion of the first water replacement step, the control unit further executes the first suction step of sucking the inside of the drug fluid pipe .
According to this configuration, after the completion of the first water replacement step, the inside of the chemical fluid pipe is sucked. By this suction, water is removed from the inside of the chemical fluid pipe, and after suction, no water remains inside the chemical fluid pipe, or the amount of water remaining inside the chemical fluid pipe is small. Thereby, it is possible to suppress or prevent the water from falling from the first nozzle after the completion of the first water replacement step, and therefore, it is possible to suppress or prevent particle contamination on the main surface of the substrate.

In one embodiment of the present invention, the fluid is discharged toward the processing chamber, the substrate holding unit arranged in the processing chamber and holding the substrate, and the main surface of the substrate held by the substrate holding unit. It has a first nozzle having a discharge port for the operation, and a drug fluid pipe which is connected to the first nozzle and whose inside communicates with the discharge port, and is connected to the first nozzle via the drug fluid pipe. To supply water to the drug fluid pipe via the water pipe, having a first drug fluid supply unit for supplying the first drug fluid and a water pipe branched and connected to the drug fluid pipe. A second for supplying a second chemical fluid, which is a fluid different from the first chemical fluid, to the first water supply unit and the main surface of the substrate held by the substrate holding unit. The control unit includes a second drug fluid supply unit having a nozzle of the above, a control unit for controlling the first drug fluid supply unit, the second drug fluid supply unit, and the first water supply unit. Is a substrate in which the second chemical fluid is held in the substrate holding unit from the second nozzle in a state where the first nozzle is arranged above the substrate held in the substrate holding unit. The first treatment step of supplying to the main surface of the above and applying the treatment using the second chemical fluid to the substrate, and the first treatment by supplying the first chemical fluid to the chemical fluid pipe. The first processing step of discharging the first chemical fluid from the nozzle toward the main surface of the substrate held by the substrate holding unit and performing the treatment using the first chemical fluid on the substrate. After the execution of the second treatment step and before the execution of the first treatment step, the water from the first water supply unit is supplied to the drug fluid pipe to the inside of the drug fluid pipe. Provided is a substrate processing apparatus for performing a second water replacement step of replacing with water.

According to this configuration, a second treatment step using the second drug fluid and a first treatment step using the first drug fluid are performed in a common treatment chamber. In the first processing step, by supplying the first drug fluid to the drug fluid pipe, the first drug fluid is discharged from the first nozzle toward the main surface of the substrate.
Further, after the second treatment step, the second water replacement step is executed prior to the first treatment step. After the end of the second treatment step and before the start of the first treatment step, the second chemical fluid used in the second treatment step enters the chemical fluid pipe and is inside the chemical fluid pipe. There is a possibility that it remains in. However, by substituting the inside of the chemical fluid pipe with water prior to the first treatment step, the second chemical fluid does not remain inside the chemical fluid pipe at the start of the first treatment step. Therefore, even if the first drug fluid is supplied to the drug fluid pipe in the first treatment step, it does not come into contact with the second drug fluid. This makes it possible to prevent the contact between the first chemical fluid and the second chemical fluid inside the chemical fluid pipe in the first treatment step.

As described above, even if the combination of a plurality of types of drug fluids (first drug fluid and second drug fluid) used for substrate treatment is not suitable for contact, those drugs inside the drug fluid pipe are used. It is possible to provide a substrate processing apparatus capable of completing processing using the plurality of types of chemical fluids in one processing chamber while preventing the occurrence of fluid contact.
The substrate processing device is a chemical fluid valve interposed in the chemical fluid pipe, and further includes a chemical fluid valve arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe. May be good. The control unit may control the drug fluid valve. The second processing step may be performed with the chemical fluid valve closed. In the first processing step, the drug fluid valve may be opened while supplying the first drug fluid to the drug fluid pipe. In the second water replacement step, water may be supplied to the chemical fluid pipe with the chemical fluid valve open.
In one embodiment of the present invention, the substrate processing apparatus further includes a suction unit for sucking the inside of the drug fluid pipe. Then , the control unit further controls the suction unit . Then , after the completion of the second water replacement step, the control unit further executes the first suction step of sucking the inside of the drug fluid pipe .
According to this configuration, after the completion of the second water replacement step, the inside of the chemical fluid pipe is sucked. By this suction, water is removed from the inside of the chemical fluid pipe, and after suction, no water remains inside the chemical fluid pipe, or the amount of water remaining inside the chemical fluid pipe is small. Thereby, it is possible to suppress or prevent the water from falling from the first nozzle after the completion of the second water replacement step, and therefore, it is possible to suppress or prevent particle contamination on the main surface of the substrate.

In one embodiment of the invention, the control unit is designed to flush the second chemical fluid from the main surface of the substrate held by the substrate holding unit with water after the second processing step. Prior to the first treatment step, a first water supply step of supplying water to the main surface of the substrate held by the substrate holding unit is further executed . Then , the control unit executes the second water replacement step as the first water supply step .

According to this configuration, after the second treatment step, the inside of the chemical fluid pipe is replaced with water in parallel with the first water supply step of flushing the second chemical fluid from the main surface of the substrate with water. Perform the water replacement step of 2. As a result, the total treatment time can be shortened as compared with the case where the first water supply step is performed at the same timing as the second water replacement step.

In one embodiment of the present invention, the substrate processing apparatus discharges fluid toward the main surface of the substrate held by the substrate holding unit, which is a nozzle different from the first nozzle. A third nozzle for supplying water to the third nozzle and a second water supply unit for supplying water to the third nozzle are further included. Then , the control unit further controls the second water supply unit . Then , the control unit starts the first processing step after the end of the second processing step, and after the second processing step, prior to the start of the first processing step, said. A second water supply step is executed in which water is supplied to the third nozzle to start discharging water from the third nozzle toward the main surface of the substrate held by the substrate holding unit. Then, the control unit starts supplying the first drug fluid to the drug fluid pipe in the first processing step prior to the end of the second water supply step .

According to this configuration, the first chemical fluid can be discharged from the discharge port immediately after the end of the second water supply. That is, the first treatment step can be started immediately after the end of the second water supply step. As a result, the entire processing time can be shortened.
In one embodiment of the invention, the control unit initiates the first treatment step prior to the end of the second water supply step .

According to this configuration, the first chemical fluid can be discharged from the discharge port even before the end of the second water supply. As a result, the total processing time can be further shortened.
In one embodiment of the present invention, the control unit sucks the inside of the drug fluid pipe after the discharge of the first drug fluid from the first nozzle in the first processing step is completed. The suction step of 2 is further executed .

In one embodiment of the present invention, the substrate processing apparatus further includes an opposed member having a substrate facing surface facing the main surface of the substrate held by the substrate holding unit. The discharge port of the first nozzle is provided on the surface facing the substrate .
According to this configuration, the facing member facing the main surface of the substrate is provided, and the ejection port of the first nozzle is provided on the facing surface of the facing member. Therefore, in the second processing step, the second chemical fluid may enter the inside of the chemical fluid pipe from the discharge port as the second chemical fluid is supplied to the main surface of the substrate. The entry of the atmosphere containing the second drug fluid into the inside of the drug fluid pipe can cause contact between the first drug fluid and the second drug fluid.
However, the inside of the drug fluid pipe is replaced with water. Therefore, even when the facing member facing the main surface of the substrate is provided and the discharge port of the first nozzle is provided on the facing surface of the facing member, the first inside the chemical fluid piping is provided. Contact between the drug fluid and the second drug fluid can be prevented.

The water may contain carbonated water.
The first drug fluid may contain an organic solvent, and the second drug fluid may contain a sulfuric acid-containing liquid.
One embodiment of the present invention comprises a substrate holding step of holding a substrate by a substrate holding unit in a processing chamber and the first drug fluid via a drug fluid pipe connected to a first nozzle. The first chemical fluid was discharged from the first nozzle toward the main surface of the substrate held by the substrate holding unit by supplying the fluid to the nozzle, and the first chemical fluid was used. The first processing step of performing the processing on the substrate held in the substrate holding unit, and the first processing in a state where the first nozzle is arranged above the substrate held in the substrate holding unit. A second chemical fluid, which is a fluid different from the chemical fluid, is supplied from the second nozzle to the main surface of the substrate held by the substrate holding unit, and the treatment using the second chemical fluid is used. Is branched and connected to the chemical fluid piping after the execution of the second processing step and the execution of the first processing step and before the execution of the second processing step. Substrate treatment comprising a first water replacement step of supplying water to the drug fluid pipe through the water pipe and replacing the first drug fluid inside the drug fluid pipe with water. Provide a method.
A drug fluid valve may be interposed in the drug fluid pipe. The chemical fluid valve may be arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe. In the first processing step, the drug fluid valve may be opened while supplying the first drug fluid to the drug fluid pipe. The second processing step may be performed with the chemical fluid valve closed. In the first water replacement step, water may be supplied to the chemical fluid pipe with the chemical fluid valve open.

In one embodiment of the invention, the substrate treatment method further comprises a first suction step of sucking the inside of the drug fluid pipe after the completion of the first water replacement step.

One embodiment of the present invention is for a substrate holding step of holding a substrate by a substrate holding unit in a processing chamber and for discharging a first chemical fluid above the substrate held by the substrate holding unit. With the first nozzle arranged, a second drug fluid, which is a fluid different from the first drug fluid, is supplied from the second nozzle to the main surface of the substrate, and the second drug is supplied. A second processing step of applying a treatment using a fluid to the substrate, and a main substrate of the substrate held by the substrate holding unit from the first nozzle by supplying the first drug fluid to the drug fluid pipe. After executing the first treatment step of discharging the first chemical fluid toward the surface and performing the treatment using the first chemical fluid on the substrate and the second treatment step, the first treatment step is performed. A second water replacement step of supplying water to the chemical fluid pipe via a water pipe branched and connected to the chemical fluid pipe and replacing the inside of the chemical fluid pipe with water before the execution of the treatment step of To provide a substrate processing method including and.
A drug fluid valve may be interposed in the drug fluid pipe. The chemical fluid valve may be arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe. The second processing step may be performed with the chemical fluid valve closed. In the first processing step, the drug fluid valve may be opened while supplying the first drug fluid to the drug fluid pipe. In the second water replacement step, water may be supplied to the chemical fluid pipe with the chemical fluid valve open.

In one embodiment of the invention, the substrate treatment method further comprises a first suction step of sucking the inside of the drug fluid pipe after completion of the second water replacement step.
In one embodiment of the present invention, the substrate processing method is intended to flush the second chemical fluid from the main surface of the substrate held by the substrate holding unit with water after the second processing step. The first water supply step of supplying water to the main surface of the substrate held by the substrate holding unit is further included prior to the first treatment step. The first water supply step includes the second water replacement step .

In one embodiment of the present invention, the substrate processing method starts the first processing step after the end of the second processing step, and after the second processing step, the first processing. Prior to the step, the third nozzle, which is a nozzle different from the first nozzle, is supplied with water from the third nozzle toward the main surface of the substrate held by the substrate holding unit. A second water supply step of discharging water is further included. Then , the first treatment step starts the supply of the first chemical fluid to the chemical fluid pipe prior to the end of the second water supply step .

In one embodiment of the invention, the first treatment step is performed in parallel with the second water supply step .

In one embodiment of the present invention, the substrate processing method sucks the inside of the chemical fluid pipe after the discharge of the first chemical fluid from the first nozzle in the first processing step is completed. A second suction step is further included.

The water may contain carbonated water.
The first drug fluid may contain an organic solvent, and the second drug fluid may contain a sulfuric acid-containing liquid.

FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus according to the embodiment of the present invention. FIG. 2A is a schematic cross-sectional view for explaining a configuration example of a processing unit provided in the substrate processing apparatus. FIG. 2B is a diagram for specifically explaining the configuration around the facing member included in the processing unit. FIG. 2C is a schematic cross-sectional view showing an enlarged configuration example of the lower part of the processing unit. FIG. 3 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus. FIG. 4 is a flow chart for explaining a first substrate processing example by the processing unit. 5A-5B is a schematic diagram for explaining the first substrate processing example. 5C-5D is a schematic diagram for explaining the process following FIG. 5B. 5E-5F is a schematic diagram for explaining the process following FIG. 5D. 5G-5H is a schematic diagram for explaining the process following FIG. 5F. FIG. 6 is a schematic diagram for explaining a monitoring situation by the first liquid detection sensor and the second liquid detection sensor in the main process of the first substrate processing example. FIG. 7 is a diagram for explaining the hard interlock in the first substrate processing example. FIG. 8 is a schematic diagram for explaining a second substrate processing example by the processing unit. FIG. 9 is a schematic diagram for explaining a third substrate processing example by the processing unit.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus 1 according to the first embodiment of the present invention. The substrate processing device 1 is a single-wafer processing device that processes substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disk-shaped substrate. The substrate processing apparatus 1 includes a plurality of processing units 2 for processing the substrate W with the processing liquid, a load port LP on which a carrier C accommodating a plurality of substrates W processed by the processing unit 2 is mounted, and a load port. It includes transfer robots IR and CR that transfer the substrate W between the LP and the processing unit 2, and a control unit 3 that controls the substrate processing device 1. The transfer robot IR transfers the substrate W between the carrier C and the substrate transfer robot CR. The substrate transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plurality of processing units 2 have, for example, a similar configuration.

FIG. 2A is a schematic cross-sectional view for explaining a configuration example of the processing unit 2.
The processing unit 2 holds the box-shaped processing chamber 4 and one substrate W in a horizontal posture in the processing chamber 4, and rotates the substrate W around the vertical rotation axis A1 passing through the center of the substrate W. It includes a spin chuck (board holding unit) 5 and a facing member 7 having a board facing surface 6 facing the upper surface (main surface) of the board W held by the spin chuck 5. The facing member 7 has a first nozzle 9 having a first discharge port (discharge port) 8 for discharging a fluid toward the center of the upper surface of the substrate W held by the spin chuck 5, and a spin chuck. A second nozzle (third nozzle) 11 having a second discharge port 10 for discharging the fluid toward the central portion of the upper surface of the substrate W held in 5, and the first drug fluid. An organic solvent supply unit (first chemical fluid supply unit) 12 for supplying isopropyl alcohol (IPA), which is an example of a liquid organic solvent (organic solvent having a low surface tension), to the first nozzle 9. , A rinse water supply unit (second water supply unit) 13 for supplying water as a rinse liquid (for example, carbonated water) to the second nozzle 11, and the upper surface of the substrate W held by the spin chuck 5. A sulfuric acid-containing liquid supply unit (second chemical fluid supply unit) for supplying an example of a sulfate-containing liquid mixture (sulfuric acid / hydrogen peroxide mixture (SPM)) as a second chemical fluid. ) 14, a cleaning chemical supply unit 15 for supplying SC1 (a liquid containing NH ₄ OH and H ₂ O ₂ ), which is an example of a cleaning chemical solution, and a spin on the upper surface of the substrate W held by the spin chuck 5. Includes a tubular processing cup 16 that surrounds the chuck 5.

The processing chamber 4 includes a box-shaped partition wall 18 accommodating a spin chuck 5 and a nozzle, and an FFU (fan filter) as a blowing unit that sends clean air (air filtered by a filter) from the upper portion of the partition wall 18 into the partition wall 18. -Including unit) 19.
The FFU 19 is arranged above the partition wall 18 and is attached to the ceiling of the partition wall 18. The FFU 19 sends clean air downward from the ceiling of the partition wall 18 into the processing chamber 4. Further, an exhaust gas pipe 81 is connected to the bottom of the processing cup 16, and the exhaust liquid pipe 81 is located in the processing chamber 4 toward the exhaust gas processing equipment provided in the factory where the substrate processing device 1 is installed. Derivation of gas. Therefore, a downflow (downflow) flowing downward in the processing chamber 4 is formed by the FFU 19 and the exhaust liquid pipe 81. The processing of the substrate W is performed in a state where a downflow is formed in the processing chamber 4.

As the spin chuck 5, a holding type chuck that sandwiches the substrate W in the horizontal direction and holds the substrate W horizontally is adopted. Specifically, the spin chuck 5 has a spin motor 22, a lower spin shaft 23 integrated with the drive shaft of the spin motor 22, and a disc-shaped disc-shaped body attached substantially horizontally to the upper end of the lower spin shaft 23. Includes spin base 24 and.
On the upper surface of the spin base 24, a plurality of (three or more, for example, six) holding members 25 are arranged on the peripheral edge thereof. The plurality of sandwiching members 25 are arranged at an appropriate interval on the circumference corresponding to the outer peripheral shape of the substrate W at the upper peripheral peripheral portion of the spin base 24.

Further, the spin chuck 5 is not limited to the pinch type, for example, the substrate W is held in a horizontal posture by vacuum suctioning the back surface of the substrate W, and further rotates around a vertical rotation axis in that state. By doing so, a vacuum suction type (vacuum chuck) that rotates the substrate W held by the spin chuck 5 may be adopted.
FIG. 2B is a diagram for specifically explaining the configuration around the facing member 7 included in the processing unit 2.

As shown in FIGS. 2A and 2B, the facing member 7 includes a blocking plate 26 and an upper spin shaft 27 coaxially provided on the blocking plate 26. The blocking plate 26 has a disk shape having a diameter substantially the same as or larger than that of the substrate W. The substrate facing surface 6 forms the lower surface of the blocking plate 26, and is circular so as to face the entire upper surface of the substrate W.
A cylindrical through hole 28 that vertically penetrates the blocking plate 26 and the upper spin shaft 27 is formed in the central portion of the substrate facing surface 6. The inner peripheral wall of the through hole 28 is partitioned by a cylindrical surface. A first nozzle 9 and a second nozzle 11 are inserted inside the through hole 28. The first and second nozzles 9 and 11 extend in the vertical direction along the rotation axis A2 (coaxial with the rotation axis A1) of the upper spin shaft 27, respectively.

Specifically, a central shaft nozzle 29 extending vertically along the rotation axis A2 of the blocking plate 26 is inserted inside the through hole 28. As shown in FIG. 2B, the central axis nozzle 29 includes first and second nozzles 9, 11 and a cylindrical casing 30 surrounding the first and second nozzles 9, 11. In this embodiment, the first and second nozzles 9 and 11 are inner tubes, respectively. The first discharge port 8 is formed at the lower end of the first nozzle 9. The second discharge port 10 is formed at the lower end of the second nozzle 11. The casing 30 extends in the vertical direction along the rotation axis A2. The casing 30 is inserted into the through hole 28 in a non-contact manner. Therefore, the inner circumference of the blocking plate 26 surrounds the outer circumference of the casing 30 at intervals in the radial direction.

As shown in FIG. 2A, a cutoff plate rotating unit 31 is coupled to the upper spin shaft 27. The cutoff plate rotation unit 31 rotates the upper spin shaft 27 together with the cutoff plate 26 around the rotation axis A2. A cutoff plate elevating unit 32 including an electric motor, a ball screw, and the like is coupled to the cutoff plate 26. The cutoff plate elevating unit 32 raises and lowers the cutoff plate 26 together with the central axis nozzle 29 in the vertical direction. The cutoff plate elevating unit 32 has a proximity position (see FIG. 5A and the like) in which the substrate facing surface 6 of the cutoff plate 26 is close to the upper surface of the substrate W held by the spin chuck 5, and a retracted position provided above the close position. The blocking plate 26 and the central axis nozzle 29 are moved up and down between the positions (see FIGS. 2A, 5G, etc.). The cutoff plate elevating unit 32 can hold the cutoff plate 26 at each position between the proximity position and the retracted position.

Further, in connection with the cutoff plate 26, a cutoff plate proximity position sensor 33 (not shown in FIGS. 2A to 2C) for detecting the arrangement of the cutoff plate 26 at a close position is provided.
As shown in FIG. 2B, the organic solvent supply unit 12 is connected to the organic solvent pipe (drug fluid pipe) 34, which is connected to the first nozzle 9 and whose inside communicates with the first discharge port 8, and the organic solvent pipe 34. A second organic solvent valve 35 that is interposed to open and close the organic solvent pipe 34 and a second organic solvent pipe 34 that is interposed in the organic solvent pipe 34 downstream of the first organic solvent valve 35 to open and close the organic solvent pipe 34 . 36 includes an organic solvent valve (drug fluid valve) 36 and a valve closing sensor 37 for detecting that the first organic solvent valve 35 is in a closed state.

As shown in FIG. 2B, the first water pipe 39 is located at the first branch position 38 set between the first organic solvent valve 35 and the second organic solvent valve 36 in the organic solvent pipe 34. It is branched and connected. In the following description, the downstream portion 40 on the downstream side of the first branch position 38 in the organic solvent pipe 34 is referred to as "organic solvent downstream portion 40". The upstream portion 41 on the upstream side of the first branch position 38 in the organic solvent pipe 34 is referred to as an “organic solvent upstream portion 41”. In this embodiment, the first branch position 38 is set to a position close to the upper end of the organic solvent pipe 34. Therefore, in a state where the organic solvent does not exist in the portion 40 on the downstream side of the organic solvent, the time until the organic solvent reaches the second nozzle 11 (second discharge port 10) after the opening of the first organic solvent valve 35 is It gets longer (for example, about 3 seconds).

When the first organic solvent valve 35 is opened, the organic solvent from the organic solvent supply source is supplied to the second organic solvent valve 36. When the second organic solvent valve 36 is opened in this state, the organic solvent supplied to the second organic solvent valve 36 is discharged from the first discharge port 8 toward the center of the upper surface of the substrate W.
As shown in FIG. 2B, in the organic solvent downstream side portion 40, the inside of the organic solvent downstream side portion 40 is located at a predetermined first detection position 42 on the upstream side of the interposition position of the second organic solvent valve 36. A first liquid detection sensor 43 for detecting the presence or absence of the liquid in the above is arranged. The first liquid detection sensor 43 detects the presence or absence of the liquid inside the organic solvent pipe 34 at the first detection position 42, and sends a signal according to the detection result to the control unit 3. When the tip of the liquid inside the organic solvent pipe 34 is advanced from the first detection position 42 (located on the side of the first nozzle 9), the liquid is detected by the first liquid detection sensor 43. Will be done. When the tip of the liquid inside the organic solvent pipe 34 is retracted from the first detection position 42 (located on the organic solvent supply source side), the liquid may be released by the first liquid detection sensor 43. Not detected.

As shown in FIG. 2B, in the organic solvent downstream side portion 40, the inside of the organic solvent downstream side portion 40 is located at a predetermined second detection position 44 on the downstream side of the interposition position of the second organic solvent valve 36. A second liquid detection sensor 45 for detecting the presence or absence of the liquid in the above is arranged. The second liquid detection sensor 45 detects the presence or absence of the liquid inside the organic solvent pipe 34 at the second detection position 44, and sends a signal according to the detection result to the control unit 3. When the tip of the liquid inside the organic solvent pipe 34 is advanced from the second detection position 44 (located on the side of the first nozzle 9), the liquid is detected by the second liquid detection sensor 45. Will be done. When the tip of the liquid inside the organic solvent pipe 34 is retracted from the second detection position 44 (located on the organic solvent supply source side), the liquid may be released by the second liquid detection sensor 45. Not detected.

The first liquid detection sensor 43 and the second liquid detection sensor 45 are, for example, fiber sensors for liquid detection (for example, FU95S manufactured by KEYENCE CORPORATION), respectively, and are directly attached to the outer peripheral wall of the organic solvent pipe 34. Or they are placed in close proximity. The first liquid detection sensor 43 and / or the second liquid detection sensor 45 may be composed of, for example, a capacitance type sensor.

As shown in FIG. 2B, water from a water supply source (for example, carbonated water) is supplied to the first water pipe 39. A first water valve 46 for opening and closing the first water pipe 39 is interposed in the middle of the first water pipe 39. When the first water valve 46 is opened, the water is supplied from the first water pipe 39 to the organic solvent downstream portion 40. Further, when the first water valve 46 is closed, the supply of water from the first water pipe 39 to the organic solvent downstream side portion 40 is stopped. The water supplied from the first water pipe 39 to the organic solvent pipe 34 is, for example, carbonated water. The first water pipe 39 and the first water valve 46 are included in the replacement water supply unit (first water supply unit) 47.

As shown in FIG. 2B, suction is performed at the second branch position 48 set in the middle of the first water pipe 39 (that is, between the first branch position 38 and the first water valve 46). The pipe 49 is branched and connected. In the following description, the downstream portion 50 on the downstream side of the second branch position 48 in the first water pipe 39 is referred to as a “water downstream portion 50”.
As shown in FIG. 2B, a suction valve 51 for opening and closing the suction pipe 49 is interposed in the middle of the suction pipe 49. A suction device 52 is connected to the tip of the suction pipe 49. The suction device 52 includes, for example, a vacuum generator 53 and a drive valve 54 for operating the vacuum generator 53, as shown in FIG. 2A. The suction device 52 is not limited to a device that generates a suction force by generating a vacuum, and may be, for example, an aspirator or the like.

As shown in FIG. 2B, in the operating state of the suction device 52 (vacuum generator 53), the first organic solvent valve 35 and the first water valve 46 are closed and the second organic solvent valve 36 is opened. When the suction valve 51 is opened in this state, the function of the suction device 52 is activated, the inside of the organic solvent downstream side portion 40 and the water downstream side portion 50 is exhausted, and the organic solvent downstream side portion 40 and the water downstream side portion 50 are exhausted. The liquid (water or organic solvent) contained in is drawn into the suction pipe 49. The suction device 52 and the suction valve 51 are included in the suction unit 55.

As shown in FIG. 2B, the rinse water supply unit 13 opens and closes a second water pipe 56, which is connected to the second nozzle 11 and whose inside communicates with the second discharge port 10, and a second water pipe 56. A second water valve 57 that switches between supplying and stopping the supply of water from the second water pipe 56 to the second nozzle 11 is included. When the second water valve 57 is opened, water from the water supply source is supplied to the second water pipe 56, and is discharged from the second discharge port 10 toward the center of the upper surface of the substrate W.

As shown in FIG. 2A, the processing unit 2 further includes an inert gas pipe 58 that supplies the inert gas to the cylindrical space between the outer periphery of the casing 30 and the inner circumference of the blocking plate 26, and the inert gas. It includes an inert gas valve 59 interposed in the pipe 58. When the Inactive gas valve 59 is opened, the inert gas from the Inactive gas supply source passes between the outer periphery of the casing 30 and the inner circumference of the blocking plate 26, and is discharged downward from the center of the lower surface of the blocking plate 26. Will be done. Therefore, when the inert gas valve 59 is opened with the blocking plate 26 arranged at a close position, the inert gas discharged from the central portion of the lower surface of the blocking plate 26 is applied to the upper surface of the substrate W and the substrate of the blocking plate 26. It spreads outward (in the direction away from the rotation axis A1) between the facing surface 6 and the air between the substrate W and the blocking plate 26 is replaced with the inert gas. The inert gas flowing in the inert gas pipe 58 is, for example, nitrogen gas. The inert gas is not limited to nitrogen gas, and may be another inert gas such as helium gas or argon gas.

As shown in FIG. 2A, the sulfuric acid-containing liquid supply unit 14 is provided in the sulfuric acid-containing liquid nozzle (second nozzle) 60, the sulfuric acid-containing liquid pipe 61 connected to the sulfuric acid-containing liquid nozzle 60, and the sulfuric acid-containing liquid pipe 61. It includes an intervening sulfuric acid-containing liquid valve 62 and a first nozzle moving unit 63 for moving the sulfuric acid-containing liquid nozzle 60. The first nozzle moving unit 63 includes a motor and the like. A nozzle retracting sensor 64 for detecting that the sulfuric acid-containing liquid nozzle 60 is in the retracted position is coupled to the first nozzle moving unit 63.

When the first nozzle moving unit 63 is composed of, for example, a stepping motor, the amount of movement of the sulfuric acid-containing liquid nozzle 60 (swing angle of the arm) output from the motor control unit for controlling the stepping motor. ), The nozzle withdrawal sensor 64 can detect whether or not the sulfuric acid-containing liquid nozzle 60 is in the retracted position.
The sulfuric acid-containing liquid nozzle 60 is, for example, a straight nozzle that discharges a liquid in a continuous flow state. A sulfuric acid-containing liquid from a sulfuric acid-containing liquid supply source is supplied to the sulfuric acid-containing liquid pipe 61. In this embodiment, the sulfuric acid-containing liquid pipe 61 is supplied with a high-temperature (for example, about 170 ° C. to about 200 ° C.) sulfuric acid-hydrogen peroxide mixture (SPM) as the sulfuric acid-containing liquid. To. The SPM heated to the high temperature is supplied to the sulfuric acid-containing liquid pipe 61 by the heat of reaction between the sulfuric acid and the hydrogen peroxide solution.

When the sulfuric acid-containing liquid valve 62 is opened, the high-temperature SPM supplied from the sulfuric acid-containing liquid pipe 61 to the sulfuric acid-containing liquid nozzle 60 is discharged downward from the sulfuric acid-containing liquid nozzle 60. When the sulfuric acid-containing liquid valve 62 is closed, the discharge of high-temperature SPM from the sulfuric acid-containing liquid nozzle 60 is stopped. The first nozzle moving unit 63 has a processing position where the high-temperature SPM discharged from the sulfuric acid-containing liquid nozzle 60 is supplied to the upper surface of the substrate W, and the sulfuric acid-containing liquid nozzle 60 is located sideways to the spin chuck 5 in a plan view. The sulfuric acid-containing liquid nozzle 60 is moved to and from the retracted retracted position.

As shown in FIG. 2A, the cleaning chemical liquid supply unit 15 includes a cleaning chemical liquid nozzle 65, a cleaning chemical liquid pipe 66 connected to the cleaning chemical liquid nozzle 65, a cleaning chemical liquid valve 67 interposed in the cleaning chemical liquid pipe 66, and cleaning. It includes a second nozzle moving unit 68 for moving the chemical solution nozzle 65. The cleaning chemical solution nozzle 65 is, for example, a straight nozzle that discharges a solution in a continuous flow state. A cleaning chemical solution (for example, SC1) from a cleaning chemical solution supply source is supplied to the cleaning chemical solution pipe 66.

When the cleaning chemical liquid valve 67 is opened, the SC1 supplied from the cleaning chemical liquid pipe 66 to the cleaning chemical liquid nozzle 65 is discharged downward from the cleaning chemical liquid nozzle 65. When the cleaning chemical solution valve 67 is closed, the discharge of the cleaning chemical solution from the cleaning chemical solution nozzle 65 is stopped. The second nozzle moving unit 68 has a processing position where the SC1 discharged from the cleaning chemical solution nozzle 65 is supplied to the upper surface of the substrate W and a retracting position where the cleaning chemical solution nozzle 65 retracts to the side of the spin chuck 5 in a plan view. The cleaning chemical solution nozzle 65 is moved between and. Further, in the second nozzle moving unit 68, the cleaning chemical liquid discharged from the cleaning chemical liquid nozzle 65 is located at the center of the upper surface of the substrate W, and the cleaning chemical liquid discharged from the cleaning chemical liquid nozzle 65 is located on the substrate W. The cleaning chemical solution nozzle 65 is horizontally moved to and from the peripheral edge position where the liquid is landed on the upper peripheral edge portion. Both the central position and the peripheral position are processing positions.

FIG. 2C is a schematic cross-sectional view showing an enlarged configuration example of the lower part of the processing unit 2.
As shown in FIGS. 2A and 2C, the processing cup 16 surrounds the spin chuck 5 and has first and second guards 71 and 72 for receiving the processing liquids (cleaning chemicals and rinsing liquids) scattered around the substrate W. And a guard elevating unit 73 that raises and lowers the individual guards 71 and 72 independently. The guard elevating unit 73 independently elevates and elevates the individual guards 71 and 72. The guard elevating unit 73 is configured to include, for example, a ball screw mechanism.

The processing cup 16 can be accommodated so as to overlap in the vertical direction, and the guard elevating unit 73 raises and lowers at least one of the two guards 71 and 72 to deploy and accommodate the processing cup 16.
The inner first guard 71 surrounds the spin chuck 5 and has a shape substantially rotationally symmetric with respect to the rotation axis A1 of the substrate W by the spin chuck 5. As shown in FIG. 2C, the first guard 71 has an annular bottom portion 74 in a plan view, a cylindrical inner wall portion 75 rising upward from the inner peripheral edge of the bottom portion 74, and an upper portion from the outer peripheral edge of the bottom portion 74. A cylindrical outer wall portion 76 that rises above the inner peripheral edge and a cylindrical guide portion 77 that rises upward from a part of the corresponding bottom portion 74 between the inner peripheral edge and the outer peripheral edge are integrally provided.

The guide portion 77 has a cylindrical main body portion 78 that rises from the bottom portion 74, and a cylindrical upper end portion 79 that extends diagonally upward toward the center side (direction approaching the rotation axis A1) while drawing a smooth arc from the upper end portion of the main body portion 78. And include.
A first drainage groove 80 for collecting and draining the treatment liquid (sulfuric acid-containing liquid, cleaning chemical liquid, and water) used for treating the substrate W is partitioned between the inner wall portion 75 and the guide portion 77. ing. An exhaust liquid pipe 81 extending from a negative pressure source (not shown) is connected to the lowest portion of the bottom of the first drainage groove 80. As a result, the inside of the first drainage groove 80 is forcibly exhausted, and the treatment liquid collected in the first drainage groove 80 and the atmosphere in the first drainage groove 80 are combined with the exhaust liquid pipe 81. Is discharged through. The treatment liquid discharged together with the atmosphere is separated from the atmosphere by the gas-liquid separator 97 interposed in the middle of the exhaust liquid pipe 81. In the exhaust liquid pipe 81, a plurality of drainage branch pipes (branch pipe 82 for sulfuric acid-containing liquid, branch pipe 83 for cleaning chemical liquid, and branch pipe 84 for water) are respectively connected to the drainage branch pipe 81 via the gas-liquid separator 97. The valve 85 is connected via. Each drainage branch valve 85 includes a second valve closing sensor 95 that detects that the drainage branch valve 85 is in the closed state.

In the sulfuric acid-containing liquid step (step S3 in FIG. 4), which will be described later, only the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 is opened among the drainage branch valves 85, and the drainage liquid pipe 81 is circulated. The treatment liquid to be treated is supplied to the sulfuric acid-containing liquid branch pipe 82, and then sent to a treatment device (not shown) for draining the sulfuric acid-containing liquid.
Further, in the first and second rinsing steps (steps S4 and S6 in FIG. 4) described later, only the drainage branch valve 85 for the water branch pipe 84 is opened among the drainage branch valves 85. The treatment liquid flowing through the exhaust liquid pipe 81 is supplied to the water branch pipe 84, and then sent to a treatment device (not shown) for drainage treatment of water.

Further, in the cleaning chemical liquid step (step S5 in FIG. 4) described later, of the drainage branch valves 85, only the drainage branch valve 85 for the cleaning chemical liquid branch pipe 83 is opened, and the drainage liquid pipe 81 is circulated. The processing liquid to be treated is supplied to the branch pipe 83 for cleaning chemicals, and then sent to a processing apparatus (not shown) for draining the cleaning chemicals.
Further, between the guide portion 77 and the outer wall portion 76, there is a second drainage groove 86 for collecting and recovering the organic solvent used for treating the substrate W. In the second drainage groove 86, for example, one end of the exhaust pipe 87 is connected to the bottom. As a result, the inside of the second drainage groove 86 is forcibly exhausted, and the atmosphere in the second drainage groove 86 is discharged through the exhaust pipe 87.

The other end of the exhaust pipe 87 is connected to a negative pressure source (not shown). An exhaust valve 101 for opening and closing the exhaust pipe 87 is interposed in the exhaust pipe 87. The exhaust valve 101 is provided with a valve open sensor 21 for detecting that the exhaust valve 101 is in the open state.
The outer second guard 72 has a shape substantially rotationally symmetric with respect to the rotation axis A1. The second guard 72 surrounds the spin chuck 5 outside the guide portion 77 of the first guard 71. An opening 89 having a diameter larger than that of the substrate W held by the spin chuck 5 is formed in the upper end portion 88 of the second guard 72, and the upper end 90 of the second guard 72 is an opening for partitioning the opening 89. It is the end.

The second guard 72 has a lower end portion 91 that forms a coaxial cylindrical shape with the guide portion 77, and a tubular shape that extends diagonally upward toward the center side (direction approaching the rotation axis A1) while drawing a smooth arc from the upper end of the lower end portion 91. It has an upper end portion 88 and a folded portion 92 formed by folding the tip end portion of the upper end portion 88 downward.
The lower end portion 91 is located on the second drainage groove 86, and is formed to have a length accommodated in the second drainage groove 86 with the first guard 71 and the second guard 72 closest to each other. Has been done. Further, the upper end portion 88 is provided so as to overlap the upper end portion 79 of the guide portion 77 of the first guard 71 in the vertical direction, and the guide is provided in a state where the first guard 71 and the second guard 72 are closest to each other. It is formed so as to be close to the upper end portion 79 of the portion 77 while maintaining a very small gap. The folded-back portion 92 is formed so that the first guard 71 and the second guard 72 are closest to each other and horizontally overlap with the upper end portion 79 of the guide portion 77.

As shown in FIG. 2A, the guard elevating unit 73 has a guard between an upper position where the upper end of the guard is located above the board W and a lower position where the upper end of the guard is located below the board W. Move 71 and 72 up and down. The guard elevating unit 73 can hold the guards 71 and 72 at any position between the upper position and the lower position. The supply of the processing liquid to the substrate W and the drying of the substrate W are performed in a state where any of the guards 71 and 72 faces the peripheral end surface of the substrate W.

When the inner first guard 71 faces the peripheral end surface of the substrate W, both the first and second guards 71 and 72 are arranged at the upper positions as shown in FIG. 5A and the like. In this state, the folded-back portion 92 overlaps the upper end portion 79 of the guide portion 77 in the horizontal direction.
In relation to the first guard 71, a guard upper position sensor 93 for detecting the upper position of the first guard 71 and a guard for detecting the upper position of the first guard 71. A lower position sensor 94 is provided.

On the other hand, when the outer second guard 72 faces the peripheral end surface of the substrate W, the second guard 72 is arranged at an upper position and the first guard is arranged as shown in FIGS. 2A and 5G. 71 is placed in the lower position.
FIG. 3 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1.
The control unit 3 is configured by using, for example, a microcomputer. The control unit 3 has an arithmetic unit such as a CPU, a fixed memory device, a storage unit such as a hard disk drive, and an input / output unit. The storage unit stores the program executed by the arithmetic unit.

It controls the operations of the second nozzle moving units 63 and 68, the blocking plate rotating unit 31, the blocking plate elevating unit 32, the guard elevating unit 73, and the like. Further, the control unit 3 includes a first organic solvent valve 35, a second organic solvent valve 36, a first water valve 46, a suction valve 51, a drive valve 54, a second water valve 57, and an inert gas valve 59. The sulfuric acid-containing liquid valve 62, the cleaning chemical liquid valve 67, the drainage branch valve 85, and the like are opened and closed. Further, the control unit 3 has a detection output of the first valve open sensor 21, a detection output of the cutoff plate proximity position sensor 33, a detection output of the valve close sensor 37, a detection output of the first liquid detection sensor 43, and a second. The detection output of the liquid detection sensor 45, the detection output of the nozzle retract sensor 64, the detection output of the guard upper position sensor 93, the detection output of the guard lower position sensor 94, the detection output of the second valve closing sensor 95, etc. are input. It has become like.

FIG. 4 is a flow chart for explaining a first substrate processing example by the processing unit 2. 5A to 5H are schematic diagrams for explaining a first substrate processing example.
Hereinafter, the first substrate processing example will be described with reference to FIGS. 2A to 4. Refer to FIGS. 5A to 5H as appropriate. The first substrate processing example is a resist removing process for removing a resist formed on the upper surface of the substrate W. As described below, in the first substrate processing example, the substrate W is treated with a sulfuric acid-containing liquid step S3 in which the substrate W is treated with a sulfuric acid-containing liquid such as SPM, and the substrate W is treated with a liquid organic solvent such as IPA. It includes an organic solvent step (first treatment step) S7. The sulfuric acid-containing liquid and the organic solvent are a combination of a drug fluid (a drug solution or a gas containing a drug component) such that contact is dangerous (in this case, a rapid reaction).

When the resist removing process is applied to the substrate W by the processing unit 2, the substrate W after the ion implantation process at a high dose is carried into the inside of the processing chamber 4 (step S1 in FIG. 4). It is assumed that the substrate W to be carried in has not been processed for ashing the resist. Further, a fine pattern having a high aspect ratio is formed on the surface of the substrate W.
Specifically, in the control unit 3, the facing member 7 (that is, the blocking plate 26 and the central shaft nozzle 29) is retracted to the retracted position, and all the moving nozzles (that is, the sulfuric acid-containing liquid nozzle 60 and the cleaning chemical liquid nozzle 65) are retracted. Is retracted from above the spin chuck 5, and the first and second guards 71 and 72 are lowered to the lower position. As a result, the upper ends of the first and second guards 71 and 72 are both arranged below the holding position of the substrate W. In this state, by allowing the hand H (see FIG. 1) of the substrate transfer robot CR (see FIG. 1) holding the substrate W to enter the inside of the processing chamber 4, the substrate W becomes its surface (resist forming surface). Is handed over to the spin chuck 5 with the head facing upward. After that, the substrate W is held by the spin chuck 5 (substrate holding step).

After that, the control unit 3 starts the rotation of the substrate W by the spin motor 22. The substrate W is increased to a predetermined liquid treatment rate (within the range of 1 to 500 rpm, for example, about 100 rpm) and maintained at that liquid treatment rate. Further, the control unit 3 controls the guard elevating unit 73 to raise the first and second guards 71 and 72 to the upper positions, respectively, so that the first guard 71 faces the peripheral end surface of the substrate W.

When the rotation speed of the substrate W reaches the liquid treatment speed, a static elimination step (step S2 in FIG. 4) is performed in which carbonated water is supplied to the upper surface of the substrate W to eliminate static electricity from the substrate W. Specifically, the control unit 3 opens the second water valve 57. As a result, as shown in FIG. 5A, carbonated water is discharged from the second discharge port 10 of the second nozzle 11 toward the center of the upper surface of the substrate W. The carbonated water discharged from the second nozzle 11 lands on the central portion of the upper surface of the substrate W, receives centrifugal force due to the rotation of the substrate W, and flows on the upper surface of the substrate W toward the peripheral edge portion of the substrate W.

Further, in this embodiment, the static elimination step S2 not only discharges the carbonated water from the second nozzle 11, but also discharges the carbonated water from the first discharge port 8 of the first nozzle 9. It will be realized. That is, the static elimination step S2 includes a first water replacement step T1 for replacing the inside of the organic solvent pipe 34 with carbonated water. Specifically, the control unit 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the suction valve 51 in synchronization with the start of the static elimination step S2, while closing the first water valve. Open 46. As a result, the carbonated water from the first water pipe 39 is supplied to the organic solvent downstream portion 40. When the IPA droplets used in the previous resist removing treatment are attached to the inner wall of the organic solvent downstream portion 40, the IPA droplets are replaced by carbonated water. The carbonated water supplied to the portion 40 on the downstream side of the organic solvent is discharged from the first nozzle 9 and landed on the central portion of the upper surface of the substrate W, and receives centrifugal force due to the rotation of the substrate W to move on the upper surface of the substrate W. It flows toward the peripheral edge of the substrate W. Further, when the IPA atmosphere used in the previous resist removing treatment is mixed in the pipe of the organic solvent downstream side portion 40, it is also removed by carbonated water.

The carbonated water supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W and is received by the inner wall of the first guard 71. Then, the carbonated water flowing down along the inner wall of the first guard 71 is guided to the exhaust liquid pipe 81 after being collected in the first drainage groove 80. In the static elimination step S2, the drainage branch valve 85 for the water branch pipe 84 is opened, and the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 and the drainage branch valve 85 for the cleaning chemical liquid branch pipe 83 are opened. By closing, the flow destination of the liquid passing through the exhaust liquid pipe 81 is set to the water branch pipe 84. Therefore, in the static elimination step S2, the carbonated water guided to the exhaust liquid pipe 81 is guided to a treatment device (not shown) for draining the carbonated water through the water branch pipe 84. If the IPA droplets used in the previous resist removal process adhere to the inner wall of the first guard 71, the first drainage groove 80, and the pipe wall of the exhaust liquid pipe 81, the IPA droplets are attached. Is washed away with carbonated water.

By supplying carbonated water to the upper surface of the substrate W, a liquid film of carbonated water is formed on the upper surface of the substrate W. When the liquid film of carbonated water comes into contact with the upper surface of the substrate W, the substrate W held by the spin chuck 5 is statically eliminated. In this embodiment, since the static elimination step S2 includes the first water replacement step T1, the entire resist removing process is processed as compared with the case where the first water replacement step T1 is performed at a timing different from that of the static elimination step S2. You can save time.

Then, when a predetermined time has elapsed from the start of discharging the carbonated water, the control unit 3 closes the first water valve 46 while keeping the second water valve 57 open, as shown in FIG. 5B. While maintaining the discharge of the carbonated water from the second nozzle 11, the discharge of the carbonated water from the first nozzle 9 is stopped.
After stopping the discharge of the carbonated water from the first nozzle 9, the first water suction step T2 (first suction step) of sucking the carbonated water in the organic solvent pipe 34 is executed. In the first water suction step T2, the carbonated water existing inside the organic solvent pipe 34 after the first water replacement step T1 is sucked by the suction unit 55.

Specifically, after the completion of the first water replacement step T1, the control unit 3 sucks while opening the second organic solvent valve 36 and closing the first organic solvent valve 35 and the first water valve 46. Open the valve 51. As a result, the inside of the organic solvent downstream side portion 40 and the water downstream side portion 50 is exhausted, and as shown in FIG. 5B, the carbonated water existing in the organic solvent downstream side portion 40 and the water downstream side portion 50 is sucked. It is drawn into the pipe 49 (suction). The suction of the carbonated water is performed until the tip surface of the carbonated water recedes to a predetermined standby position in the pipe (for example, set in the suction pipe 49 or the water downstream side portion 50). When the tip surface of the carbonated water recedes to the standby position, the control unit 3 closes the suction valve 51. As a result, the first water replacement step T1 is completed.

Since the first water suction step T2 is executed after the completion of the first water replacement step T1, carbonated water does not exist inside the organic solvent pipe 34 after the execution of the first water suction step T2. This makes it possible to suppress or prevent the drop of carbonated water from the first nozzle 9 after the completion of the first water replacement step T1.
When a predetermined time has elapsed from the start of discharging the carbonated water, the control unit 3 closes the first water valve 46 and stops the discharge of the carbonated water from the second nozzle 11. As a result, the static elimination step S2 is completed.

Further, in this embodiment, since the first water suction step T2 and a part of the static elimination step S2 (discharge of carbonated water from the second nozzle 11) are performed in parallel, the first water suction step T2 Compared with the case where the static elimination step S2 is performed separately after the completion of the static elimination step S2, the processing time of the entire resist removing processing can be shortened.
Next, the control unit 3 performs a sulfuric acid-containing liquid step (second processing step; step S3 in FIG. 4) of supplying high-temperature SPM to the upper surface of the substrate W. In the sulfuric acid-containing liquid step S3, the control unit 3 supplies high-temperature SPM from the sulfuric acid-containing liquid nozzle 60 to the central portion of the upper surface of the substrate W in order to peel the resist from the surface of the substrate W.

Specifically, in the sulfuric acid-containing liquid step S3, the control unit 3 moves the sulfuric acid-containing liquid nozzle 60 from the retracted position to the central position by controlling the first nozzle moving unit 63. As a result, the sulfuric acid-containing liquid nozzle 60 is arranged above the central portion of the substrate W. After that, the control unit 3 opens the sulfuric acid-containing liquid valve 62. As a result, high-temperature (for example, about 170 ° C. to about 200 ° C.) SPM is supplied to the sulfuric acid-containing liquid nozzle 60 from the sulfuric acid-containing liquid pipe 61, and high-temperature SPM is discharged from the discharge port of the sulfuric acid-containing liquid nozzle 60. The high-temperature SPM discharged from the sulfuric acid-containing liquid nozzle 60 lands on the central portion of the upper surface of the substrate W, receives centrifugal force due to the rotation of the substrate W, and flows outward along the upper surface of the substrate W. As a result, as shown in FIG. 5C, the entire upper surface of the substrate W is covered with the liquid film of SPM. The high temperature SPM strips the resist from the surface of the substrate W and removes it from the surface of the substrate W.

The SPM supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W and is received by the inner wall of the first guard 71. Then, the SPM flowing down along the inner wall of the first guard 71 is guided to the after-exhaust liquid pipe 81 collected in the first drainage groove 80. In the sulfuric acid-containing liquid step S3, the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 is opened, and the drainage branch valve 85 for the cleaning chemical branch pipe 83 and the drainage branch valve for the water branch pipe 84 are opened. By closing the 85, the flow destination of the liquid passing through the exhaust liquid pipe 81 is set to the sulfuric acid-containing liquid branch pipe 82. Therefore, in the static elimination step S2, the SPM guided to the exhaust liquid pipe 81 is guided to a processing device (not shown) for draining the sulfuric acid-containing liquid through the sulfuric acid-containing liquid branch pipe 82. Therefore, after the sulfuric acid-containing liquid step S3, droplets of SPM adhere to the inner wall of the first guard 71, the first drainage groove 80, and the pipe wall of the exhaust liquid pipe 81.

In the sulfuric acid-containing liquid step S3, a large amount of SPM mist is generated around the upper surface of the substrate W due to the supply of the high temperature SPM to the substrate W. In the sulfuric acid-containing liquid step S3, the cutoff plate 26 and the central shaft nozzle 29 are separated from each other at a retracted position (for example, the substrate facing surface 6 of the cutoff plate 26 is sufficiently spaced upward from the upper surface of the spin base 24 (for example, about 150 mm). However, since the SPM used in the sulfuric acid-containing liquid step S3 is extremely high temperature (for example, about 170 ° C. to about 200 ° C.), a large amount of SPM mist is generated in the sulfuric acid-containing liquid step S3, and as a result, a large amount of SPM mist is generated. The mist of this SPM enters the inside of the organic solvent pipe 34 from the first discharge port 8 and enters the inside of the organic solvent pipe 34 (deeply).

In this case, if the IPA used in the previous resist removal treatment remains inside the organic solvent pipe 34 (including adhesion of IPA droplets to the inside of the organic solvent pipe 34), the sulfuric acid-containing liquid step S3 In, the mist of SPM that has entered the organic solvent pipe 34 may come into contact with the IPA inside the organic solvent pipe 34. When the SPM mist comes into contact with the IPA inside the organic solvent pipe 34, particles are generated, and the inside of the organic solvent pipe 34 may become a particle generation source.

However, in this embodiment, since the first water replacement step T1 is executed prior to the sulfuric acid-containing liquid step S3, the IPA remains inside the organic solvent pipe 34 at the start of the sulfuric acid-containing liquid step S3. do not have. Therefore, even if the SPM mist enters the organic solvent pipe 34 in the sulfuric acid-containing liquid step S3, it does not come into contact with the IPA inside the organic solvent pipe 34. Therefore, it is possible to prevent the IPA from coming into contact with the SPM in the sulfuric acid-containing liquid step S3, thereby suppressing or preventing the inside of the organic solvent pipe 34 from becoming a particle generation source.

In the sulfuric acid-containing liquid step S3, when a predetermined period elapses from the start of discharging the high-temperature SPM, the sulfuric acid-containing liquid step S3 ends. Specifically, the control unit 3 closes the sulfuric acid-containing liquid valve 62 to stop the discharge of high-temperature SPM from the sulfuric acid-containing liquid nozzle 60, and then controls the first nozzle moving unit 63 to control sulfuric acid. The liquid-containing nozzle 60 is retracted to the retracted position.

Next, a first rinsing step (step S4 in FIG. 4) of supplying carbonated water as a rinsing liquid to the upper surface of the substrate W is performed. Specifically, the control unit 3 opens the second water valve 57. As a result, as shown in FIG. 5D, carbonated water is discharged from the second discharge port 10 of the second nozzle 11 toward the center of the upper surface of the substrate W. The carbonated water discharged from the second nozzle 11 lands on the central portion of the upper surface of the substrate W, receives centrifugal force due to the rotation of the substrate W, and flows on the upper surface of the substrate W toward the peripheral edge portion of the substrate W.

Further, in this embodiment, in the first rinsing step S4, not only the carbonated water is discharged from the second nozzle 11, but also the carbonated water is discharged from the first discharge port 8 of the first nozzle 9. It is realized by doing. That is, the first rinsing step S4 includes a second water replacement step T3 in which the inside of the organic solvent pipe 34 is replaced with carbonated water in parallel with the discharge of the carbonated water from the second nozzle 11. Specifically, the control unit 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the suction valve 51 in synchronization with the start of the first rinsing step S4. Open the water valve 46 of. As a result, the carbonated water from the first water pipe 39 is supplied to the organic solvent downstream side portion 40, and the droplets of SPM adhering to the inner wall of the organic solvent downstream side portion 40 are replaced by the carbonated water. The carbonated water supplied to the portion 40 on the downstream side of the organic solvent is discharged from the first nozzle 9 and landed on the central portion of the upper surface of the substrate W, and receives centrifugal force due to the rotation of the substrate W to move on the upper surface of the substrate W. It flows toward the peripheral edge of the substrate W.

The carbonated water supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W and is received by the inner wall of the first guard 71. Then, the carbonated water flowing down along the inner wall of the first guard 71 is guided to the exhaust liquid pipe 81 after being collected in the first drainage groove 80. In the first rinsing step S4, the drainage branch valve 85 for the water branch pipe 84 is opened, and the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 and the drainage branch for the cleaning chemical liquid branch pipe 83 are opened. By closing the valve 85, the flow destination of the liquid passing through the exhaust liquid pipe 81 is set to the water branch pipe 84. Therefore, the carbonated water guided to the exhaust liquid pipe 81 is guided to a treatment device (not shown) for draining the water through the water branch pipe 84. When the droplets of SPM used in the sulfuric acid-containing liquid step S3 adhere to the inner wall of the first guard 71, the first drainage groove 80, and the pipe wall of the exhaust liquid pipe 81, the droplets of SPM are attached. Is washed away with carbonated water.

The carbonated water supplied to the upper surface of the substrate W pushes the SPM on the substrate W outward and is discharged around the substrate W, and the liquid film of the SPM on the substrate W covers the entire upper surface of the substrate W. It is replaced by a liquid film of water. That is, the SPM is washed away from the upper surface of the substrate W by the carbonated water as the rinsing liquid. Then, when a predetermined time has elapsed from the start of discharging the carbonated water, the control unit 3 closes the first water valve 46 and the second water valve 57, respectively, from the first nozzle 9 and the second nozzle 11. Stop the discharge of carbonated water. This completes the first rinsing step.

Further, in this embodiment, since the first rinsing step S4 includes the second water replacement step T3, the first water replacement step T1 is compared with the case where the first rinsing step T1 is performed at a different timing from the first rinsing step S4. Therefore, the processing time of the entire resist removing processing can be shortened.
Further, in the first rinsing step S4, it is not necessary to synchronize the stop of the discharge of the carbonated water from the first nozzle 9 with the stop of the discharge of the carbonated water from the second nozzle 11, and it is not necessary to synchronize the stop of the discharge of the carbonated water from the first nozzle 9. The discharge of the carbonated water may be stopped prior to the stop of the discharge of the carbonated water from the second nozzle 11.

After the discharge of carbonated water from the first nozzle 9 and the second nozzle 11 is stopped, the control unit 3 supplies the SC1 to the upper surface of the substrate W in a cleaning chemical solution step (first processing step; step S5 in FIG. 4). I do. In the cleaning chemical solution step S5, in order to remove the resist residue existing on the surface of the substrate W after the sulfuric acid-containing liquid step S3 from the surface of the substrate W, the control unit 3 puts SC1 from the cleaning chemical solution nozzle 65 on the upper surface of the substrate W. Supply.

Specifically, in the cleaning chemical solution step S5, the control unit 3 moves the cleaning chemical solution nozzle 65 from the retracted position to the processing position by controlling the second nozzle moving unit 68. After that, the control unit 3 opens the cleaning chemical solution valve 67. As a result, as shown in FIG. 5E, SC1 is supplied from the cleaning chemical liquid pipe 66 to the cleaning chemical liquid nozzle 65, and SC1 is discharged from the discharge port of the cleaning chemical liquid nozzle 65. Further, the control unit 3 controls the second nozzle moving unit 68 in parallel with the ejection of the SC1 from the cleaning chemical solution nozzle 65 to reciprocate the cleaning chemical solution nozzle 65 between the central position and the peripheral position. (Half scan). As a result, the liquid landing position of SC1 from the cleaning chemical solution nozzle 65 can be reciprocated between the center of the upper surface of the substrate W and the peripheral edge of the upper surface of the substrate W, whereby the liquid landing position of SC1 can be moved back and forth. The entire upper surface of the substrate W can be scanned. By supplying SC1 to the upper surface of the substrate W, the resist residue can be removed from the surface of the substrate W.

The SC1 supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W and is received by the inner wall of the first guard 71. Then, the SC1 flowing down along the inner wall of the first guard 71 is guided to the after-exhaust liquid pipe 81 collected in the first drainage groove 80. In the cleaning chemical liquid step S5, the drainage branch valve 85 for the cleaning chemical liquid branch pipe 83 is opened, and the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 and the drainage branch valve 85 for the water branch pipe 84 are opened. By closing, the flow destination of the liquid passing through the exhaust liquid pipe 81 is set to the cleaning chemical liquid branch pipe 83. Therefore, the SC1 guided to the exhaust liquid pipe 81 is guided to a processing device (not shown) for draining the cleaning chemical liquid through the cleaning chemical liquid branch pipe 83.

Further, in parallel with the cleaning chemical solution step S5, a second water suction step T4 (first suction step) for sucking carbonated water in the organic solvent pipe 34 is executed. In the second water suction step T4, the carbonated water existing inside the organic solvent pipe 34 after the organic melting step S7 is sucked by the suction unit 55.
Specifically, after the completion of the second water replacement step T3, the control unit 3 sucks while opening the second organic solvent valve 36 and closing the first organic solvent valve 35 and the first water valve 46. Open the valve 51. As a result, the insides of the organic solvent downstream side portion 40 and the water downstream side portion 50 are exhausted, and as shown in FIG. 5E, the carbonated water existing in the organic solvent downstream side portion 40 and the water downstream side portion 50 is sucked. It is drawn into the pipe 49 (suction). The suction of the carbonated water is performed until the tip surface of the carbonated water recedes to a predetermined standby position in the pipe (for example, set in the suction pipe 49 or the water downstream side portion 50). When the tip surface of the carbonated water recedes to the standby position, the control unit 3 closes the suction valve 51. As a result, the second water suction step T4 is completed.

Since the second water suction step T4 is executed after the completion of the second water replacement step T3, carbonated water does not exist inside the organic solvent pipe 34 after the execution of the second water suction step T4. This makes it possible to suppress or prevent the drop of carbonated water from the first nozzle 9 after the completion of the second water replacement step T3.
Further, in this embodiment, since the second water suction step T4 is executed in parallel with the cleaning chemical solution step S5, the second water suction step T4 is compared with the case where the second water suction step T4 is performed at a different timing from the cleaning chemical solution step S5. Therefore, the processing time of the entire resist removing process can be shortened.

When a predetermined period elapses from the start of discharging SC1, the cleaning chemical solution step S5 ends. Specifically, the control unit 3 closes the cleaning chemical solution valve 67 to stop the discharge of SC1 from the cleaning chemical solution nozzle 65, and then controls the second nozzle moving unit 68 to control the cleaning chemical solution nozzle 65. Evacuate to the evacuation position.
Next, a second rinsing step (step S6 in FIG. 4) of supplying carbonated water as a rinsing liquid to the upper surface of the substrate W is performed. Specifically, the control unit 3 opens the second water valve 57. As a result, as shown in FIG. 5F, carbonated water is discharged from the second discharge port 10 of the second nozzle 11 toward the center of the upper surface of the substrate W. The carbonated water discharged from the second nozzle 11 lands on the central portion of the upper surface of the substrate W, receives centrifugal force due to the rotation of the substrate W, and flows on the upper surface of the substrate W toward the peripheral edge portion of the substrate W.

The carbonated water supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W toward the side of the substrate W and is received by the inner wall of the first guard 71. Then, the carbonated water flowing down along the inner wall of the first guard 71 is guided to the exhaust liquid pipe 81 after being collected in the first drainage groove 80. In the second rinsing step S6, the drainage branch valve 85 for the water branch pipe 84 is opened, and the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 and the drainage branch for the cleaning chemical liquid branch pipe 83 are opened. By closing the valve 85, the flow destination of the liquid passing through the exhaust liquid pipe 81 is set to the water branch pipe 84. Therefore, in the second rinsing step S6, the carbonated water guided to the exhaust liquid pipe 81 is guided to a treatment device (not shown) for draining water through the water branch pipe 84.

The carbonated water supplied to the upper surface of the substrate W causes the SC1 on the substrate W to be swept outward and discharged around the substrate W, and the liquid film of the SC1 on the substrate W covers the entire upper surface of the substrate W. It is replaced by a liquid film of water. That is, SC1 is washed away from the upper surface of the substrate W by carbonated water as a rinsing liquid. Then, when a predetermined time elapses after the second water valve 57 is opened, the control unit 3 closes the second water valve 57 and stops the discharge of carbonated water from the second nozzle 11. As a result, the second rinsing step S6 is completed.

Next, an organic solvent step (step S7 in FIG. 4) of supplying IPA as an organic solvent to the upper surface of the substrate W is performed. Specifically, the control unit 3 controls the cutoff plate elevating unit 32 to arrange the cutoff plate 26 at a close position. When the blocking plate 26 is in a close position, the blocking plate 26 shields the upper surface of the substrate W from the space around it.
Further, the control unit 3 controls the guard elevating unit 73, arranges the second guard 72 in the upper position while keeping the first guard 71 in the lower position, and arranges the second guard 72 in the peripheral position of the substrate W. Face the end face. Further, the control unit 3 slows down the rotation of the substrate W to a predetermined paddle speed. This paddle speed means whether the centrifugal force acting on the liquid on the upper surface of the substrate W is smaller than the surface tension acting between the rinse liquid and the upper surface of the substrate W when the substrate W is rotated at the paddle speed. Alternatively, it refers to a speed at which the centrifugal force and the surface tension are almost equal to each other.

Then, the control unit 3 opens the first organic solvent valve 35 while opening the second organic solvent valve 36 and closing the first water valve 46 and the suction valve 51. As a result, as shown in FIG. 5G, the IPA from the organic solvent supply source is supplied to the second nozzle 11, and the IPA is discharged from the second nozzle 11 to land on the upper surface of the substrate W.
In the sulfuric acid-containing liquid step S3, the SPM mist that has entered the organic solvent pipe 34 is liquefied by condensation to form SPM droplets. If droplets of SPM are present inside the organic solvent pipe 34 before the start of the organic solvent step S7, the IPA supplied to the organic solvent pipe 34 in the organic solvent step S7 will be SPM inside the organic solvent pipe 34. May come into contact with. When the IPA comes into contact with the droplets of SPM inside the organic solvent pipe 34, particles are generated, and the inside of the organic solvent pipe 34 may become a particle generation source.

However, in this embodiment, since the second water replacement step T3 is executed prior to the organic solvent step S7, the droplets of SPM remain inside the organic solvent pipe 34 at the start of the organic solvent step S7. Not. Therefore, even if the IPA is supplied to the organic solvent pipe 34 in the organic solvent step S7, it does not come into contact with the SPM inside the organic solvent pipe 34. Therefore, it is possible to effectively suppress or prevent the generation of particles due to the contact between the IPA and the SPM, and thereby suppress or prevent the inside of the organic solvent pipe 34 from becoming a particle generation source.

In the organic solvent step S7, the carbonated water contained in the liquid film on the upper surface of the substrate W is sequentially replaced with IPA by discharging the IPA from the first nozzle 9. As a result, the liquid film of IPA covering the entire upper surface of the substrate W is held in a paddle shape on the upper surface of the substrate W. Even after the liquid film over the entire upper surface of the substrate W is replaced with the liquid film of IPA, the supply of IPA to the upper surface of the substrate W continues. Therefore, IPA is discharged from the peripheral edge of the substrate W.

The IPA discharged from the peripheral edge of the substrate W is received by the inner wall of the second guard 72. Then, the IPA flowing down along the inner wall of the first guard 72 is guided to the rear exhaust pipe 87 collected in the second drainage groove 86. Therefore, after the organic solvent step S7, IPA droplets are attached to the inner wall of the second guard 72, the second drainage groove 86, and the pipe wall of the exhaust pipe 87.
When a predetermined period elapses from the start of discharging the IPA, the control unit 3 closes the first organic solvent valve 35 and stops the discharging of the IPA from the first nozzle 9. As a result, the organic solvent step S7 is completed.

Next, a spin-drying step (step S8 in FIG. 4) of drying the substrate W is performed. Specifically, the control unit 3 controls the cutoff plate elevating unit 32 to arrange the cutoff plate 26 at a close position. Further, in this state, by controlling the spin motor 22, the control unit 3 controls the drying rotation speed (as shown in FIG. 5H), which is larger than the rotation speed in each step from the sulfuric acid-containing liquid step S3 to the organic solvent step S7. For example, the substrate W is accelerated to several thousand rpm), and the substrate W is rotated at the drying rotation speed. As a result, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is shaken off around the substrate W. In this way, the liquid is removed from the substrate W and the substrate W dries. Further, the control unit 3 controls the cutoff plate rotation unit 31 to rotate the cutoff plate 26 at high speed in the rotation direction of the substrate W.

Further, in parallel with the spin dry step S8, the organic solvent suction step T5 (second suction step) for sucking the organic solvent in the organic solvent pipe 34 is executed. In this organic solvent suction step T5, the organic solvent existing inside the organic solvent pipe 34 after the organic solvent step S7 is sucked by the suction unit 55.
Specifically, after the organic solvent step S7 is completed, the control unit 3 opens the second organic solvent valve 36 and closes the first organic solvent valve 35 and the first water valve 46 while closing the suction valve 51. open. As a result, the insides of the organic solvent downstream side portion 40 and the water downstream side portion 50 are exhausted, and as shown in FIG. 5H, the IPA existing in the organic solvent downstream side portion 40 and the water downstream side portion 50 is sucked into the suction pipe. Pulled into 49 (suction). The suction of the IPA is performed until the tip surface of the IPA retracts to a predetermined standby position in the pipe (for example, set to the suction pipe 49 or the water downstream side portion 50). When the tip surface of the IPA retracts to the standby position, the control unit 3 closes the suction valve 51.

When a predetermined time elapses from the acceleration of the substrate W, the control unit 3 controls the spin motor 22 to stop the rotation of the substrate W by the spin chuck 5, and controls the cutoff plate rotation unit 31 to rotate the cutoff plate 26. To stop.
After that, the substrate W is carried out from the processing chamber 4 (step S9 in FIG. 4). Specifically, in the control unit 3, the cutoff plate 26 is arranged in the retracted position, the second guard 72 is lowered to the lower position, and the first and second guards 71 and 72 are held in the holding position of the substrate W. Place below. After that, the control unit 3 causes the hand H of the substrate transfer robot CR to enter the inside of the processing chamber 4. Then, the control unit 3 causes the hand of the substrate transfer robot CR to hold the substrate W on the spin chuck 5, and retracts the hand H of the substrate transfer robot CR from the processing chamber 4. As a result, the substrate W from which the resist has been removed from the surface is carried out from the processing chamber 4.

Further, as shown by the alternate long and short dash line in FIG. 4, an organic solvent predispens (step S10 in FIG. 4) for replacing the organic solvent pipe 34 with a new IPA is executed prior to the start of the organic solvent suction step T5. There is. Before the start of the organic solvent suction step T5, the tip surface of the IPA of the organic solvent pipe 34 is located in the organic solvent upstream side portion 41. At this time, the IPA in the organic solvent pipe 34 (inside the organic solvent upstream portion 41) may change with time (temperature change or component change).

When performing organic solvent pre-dispensing, the control unit 3 opens the first organic solvent valve 35 and the suction valve 51 while closing the second organic solvent valve 36 and the first water valve 46, and from the organic solvent supply source. IPA is drawn into the suction pipe 49 (suction) through the organic solvent upstream side portion 41 and the water downstream side portion 50. As a result, the IPA that has changed over time, which is present in the portion 41 on the upstream side of the organic solvent, is replaced with a fresh IPA. After a predetermined period has elapsed from the opening of the first organic solvent valve 35, the control unit 3 closes the first organic solvent valve 35 and the suction valve 51.

FIG. 6 is a schematic diagram for explaining a monitoring situation by the first liquid detection sensor 43 and the second liquid detection sensor 45 in the main process of the first substrate processing example.
As shown in FIG. 6, in the organic solvent step S7 (during organic solvent discharge), the control unit 3 has a detection output of the first liquid detection sensor 43 arranged on the upstream side of the second organic solvent valve 36. It does not refer to both the detection output of the second liquid detection sensor 45 located downstream of the second organic solvent valve 36 and the detection output of the second liquid detection sensor 45. In other words, in the organic solvent step S7, the control unit 3 ignores the presence or absence of the liquid at both the first detection position 42 and the second detection position 44.

As shown in FIG. 6, in the organic solvent suction step T5, the control unit 3 has the detection output of the first liquid detection sensor 43 arranged on the upstream side of the second organic solvent valve 36, and the second organic. Both of the detection outputs of the second liquid detection sensor 45 arranged on the downstream side of the solvent valve 36 are referred to. In other words, the control unit 3 monitors the presence or absence of the liquid at both the first detection position 42 and the second detection position 44. In the organic solvent suction step T5, the liquid (that is, the liquid) at both the first detection position 42 and the second detection position 44 based on the detection outputs from both the first liquid detection sensor 43 and the second liquid detection sensor 45. When it is detected that the IPA) does not exist, the control unit 3 detects that the suction of the IPA is completed.

Further, in the first substrate processing example, the control unit 3 is not only in the organic solvent suction step T5 but also in other suction steps (for example, the first water suction step T2 and the second water suction step T4). The presence or absence of the liquid is monitored at both the detection position 42 and the second detection position 44.
Further, in the organic solvent pre-dispensing step S10, the control unit 3 refers only to the detection output of the second liquid detection sensor 45 arranged on the upstream side of the second organic solvent valve 36, and refers to the second organic solvent. The detection output of the first liquid detection sensor 43 arranged on the downstream side of the valve 36 is not referred to. In other words, the control unit 3 monitors the presence or absence of the liquid at the second detection position 44, but ignores the presence or absence of the liquid at the first detection position 42. When the presence of liquid (that is, IPA) at the second detection position 44 is detected by the second liquid detection sensor 45 even though the second organic solvent valve 36 is controlled to be in the closed state, As shown in FIG. 6, the control unit 3 can detect an outflow error assuming that the organic solvent (that is, IPA) is leaking from the second organic solvent valve 36.

Further, in the first substrate processing example, except for each step particularly mentioned, the control unit 3 only outputs the detection output of the second liquid detection sensor 45 arranged on the downstream side of the second organic solvent valve 36. Refer to it, and do not refer to the detection output of the first liquid detection sensor 43 arranged on the upstream side of the second organic solvent valve 36. In other words, the control unit 3 monitors the presence or absence of the liquid at the second detection position 44, but ignores the presence or absence of the liquid at the first detection position 42. When the presence of liquid (that is, IPA) at the second detection position 44 is detected by the second liquid detection sensor 45 even though the second organic solvent valve 36 is controlled to be in the closed state, As shown in FIG. 6, the control unit 3 can detect an outflow error assuming that the organic solvent (that is, IPA) is leaking from the second organic solvent valve 36.

FIG. 7 is a diagram for explaining a hard interlock in the first substrate processing example.
This interlock process is executed at the start of each process in the process of performing a series of substrate processes according to the recipe held in the memory of the control unit 3.
At the start of the sulfuric acid-containing liquid step S3, (3) the detection output of the guard lower position sensor 94 is on, that is, whether the first guard 71 is arranged in the lower position, and (5) the first and second guards. Whether the detection outputs of the liquid detection sensors 43 and 45 are off, that is, the tip surface of the IPA is retracted to the suction pipe 49 or the water downstream side portion 50, and (6) the detection output of the valve closing sensor 37 is on. That is, whether or not the first organic solvent valve 35 is in the closed state is checked. When all the conditions (3), (5) and (6) are satisfied, the control unit 3 allows the sulfuric acid-containing liquid valve 62 to open. That is, if any one of the conditions (3), (5) and (6) is not satisfied, the control unit 3 prohibits the opening operation of the sulfuric acid-containing liquid valve 62. By such a hard interlock, it is possible to reliably prevent the contact between the IPA and the SPM in the processing chamber 4 at the start of ejection of the IPA from the first nozzle 9.

Further, at the start of the organic solvent step S7, (1) whether the detection output of the cutoff plate proximity position sensor 33 is on, that is, whether the cutoff plate 26 is arranged at the close position, and (2) detection of the nozzle retract sensor 64. Whether the output is on, that is, the sulfuric acid-containing liquid nozzle 60 is in the retracted position, (4) the detection output of the guard upper position sensor 93 is on, that is, the first guard 71 is placed in the upper position. It is checked whether (8) the detection output of the first valve open sensor 21 is on, that is, whether the exhaust valve 101 that opens and closes the exhaust pipe 100 is in the open state. When all the conditions (1), (2), (4) and (8) are satisfied, the control unit 3 allows the opening operation of the first organic solvent valve 35. That is, if any one of the conditions (1), (2), (4) and (8) is not satisfied, the control unit 3 prohibits the opening operation of the first organic solvent valve 35. .. By such a hard interlock, it is possible to reliably prevent the contact between the SPM and the IPA in the processing chamber 4 at the start of discharging the SPM from the sulfuric acid-containing liquid nozzle 60.

Further, at the start of the static elimination step S2, at the start of the sulfuric acid-containing liquid step S3, at the start of the first rinsing step S4, at the start of the cleaning chemical solution step S5, or at the start of the second rinsing step S6, (7) The detection output of the second valve closing sensor 95 corresponding to the processing other than the processing liquid to be discharged is all on, that is, the drainage branch valve 85 corresponding to the processing other than the processing liquid to be discharged is closed. Is checked.

Specifically, in the static elimination step S2, the first rinsing step S4, and the second rinsing step S6, the second valve closing sensor 95 corresponding to the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82, and The detection output of the second valve closing sensor 95 corresponding to the drainage branch valve 85 for the cleaning chemical branch pipe 83 is examined. In the sulfuric acid-containing liquid step S3, the second valve closing sensor 95 corresponding to the drainage branch valve 85 for the branch pipe 83 for cleaning chemicals and the second valve closing valve 85 corresponding to the drainage branch valve 85 for the branch pipe 84 for water are used. The detection output of the valve closing sensor 95 is examined respectively. In the cleaning chemical liquid step S5, the second valve closing sensor 95 corresponding to the drainage branch valve 85 for the sulfuric acid-containing liquid branch pipe 82 and the second valve closing valve 85 corresponding to the water branch pipe 84 are the second. The detection output of the valve closing sensor 95 is examined respectively.

When this condition (7) is satisfied, the control unit 3 starts the discharge opening / closing valve (that is, the first water valve 46, sulfuric acid) corresponding to the processing liquid to be discharged at the start of each process S2 to S6. One of the liquid-containing valve 62 and the cleaning chemical liquid valve 67) is opened. That is, if the condition (7) is not satisfied, the control unit 3 prohibits the opening operation of the valves 46, 62, 67.

As described above, according to this embodiment, the first water replacement step T1 is executed prior to the sulfuric acid-containing liquid step S3. If the IPA used in the previous resist removal treatment remains inside the organic solvent pipe 34 before the start of the sulfuric acid-containing liquid step S3, the SPM that has entered the organic solvent pipe 34 in the sulfuric acid-containing liquid step S3. Mist may come into contact with the IPA inside the organic solvent pipe 34. However, by substituting the inside of the organic solvent pipe 34 with carbonated water prior to the sulfuric acid-containing liquid step S3, no IPA remains inside the organic solvent pipe 34 at the start of the sulfuric acid-containing liquid step S3. Therefore, even if the SPM mist enters the organic solvent pipe 34 in the sulfuric acid-containing liquid step S3, it does not come into contact with the IPA inside the organic solvent pipe 34. Therefore, it is possible to prevent the IPA from coming into contact with the SPM in the sulfuric acid-containing liquid step S3, thereby suppressing or preventing the inside of the organic solvent pipe 34 from becoming a particle generation source.

Further, after the sulfuric acid-containing liquid step S3, the second water replacement step T3 is executed prior to the organic solvent step S7. If the droplets of SPM that have entered the organic solvent pipe 34 in the sulfuric acid-containing liquid step S3 and have been liquefied by condensation are present inside the organic solvent pipe 34 before the start of the organic solvent step S7, the organic solvent step S7 In, the IPA supplied to the organic solvent pipe 34 may come into contact with the SPM inside the organic solvent pipe 34. However, by substituting the inside of the organic solvent pipe 34 with carbonated water prior to the organic solvent step S7, no droplets of SPM remain inside the organic solvent pipe 34 at the start of the organic solvent step S7. Therefore, even if the IPA is supplied to the organic solvent pipe 34 in the organic solvent step S7, it does not come into contact with the SPM inside the organic solvent pipe 34. Therefore, it is possible to effectively suppress or prevent the generation of particles due to the contact between the IPA and the SPM, and thereby suppress or prevent the inside of the organic solvent pipe 34 from becoming a particle generation source.

FIG. 8 is a schematic diagram for explaining a second substrate processing example by the processing unit 2. FIG. 9 is a schematic diagram for explaining a third substrate processing example by the processing unit 2. The second and third substrate processing examples differ from the first substrate processing example shown in FIG. 4 and the like in that IPA is supplied to the first nozzle 9 prior to the end of the second rinsing step S6. ing. Other than that, the second and third substrate processing examples are not different from the first substrate processing example.

In the second substrate processing example shown in FIG. 8, the control unit 3 opens the second organic solvent valve 36 during the execution of the second rinsing step S6 (in parallel with the second rinsing step S6). The first organic solvent valve 35 is opened. As a result, IPA from the organic solvent supply source is supplied toward the first nozzle 9. However, the control unit 3 closes the second water valve 57 at the timing immediately before the IPA is discharged from the first discharge port 8. As a result, IPA is not discharged from the first discharge port 8. That is, during the execution of the second rinsing step S6, IPA is not discharged from the first discharge port 8, and the inside of the organic solvent downstream side portion 40 and the inside of the nozzle pipe of the first nozzle 9 are formed by the IPA. It is filled.

After that, when the second rinsing step S6 is completed and the organic solvent step S7 is started, the control unit 3 opens the first organic solvent valve 35, whereby the first nozzle 9 from the organic solvent supply is opened. The supply of IPA to the first discharge port 8 is resumed, and the IPA is discharged from the first discharge port 8.
According to this second substrate processing example, IPA can be discharged from the first discharge port 8 immediately after the completion of the second rinsing step S6. That is, the organic solvent step S7 can be started immediately after the completion of the second rinsing step S6. As a result, the processing time of the entire resist removing processing can be shortened as compared with the first substrate processing example.

In the third substrate processing example shown in FIG. 9, unlike the second substrate processing example shown in FIG. 8, the control unit 3 is in parallel with the second rinsing step S6 during the execution of the second rinsing step S6. ), IPA is discharged from the first discharge port 8.
Specifically, the control unit 3 opens the first organic solvent valve 35 while opening the second organic solvent valve 36 during the execution of the second rinsing step S6. As a result, the IPA from the organic solvent supply source is supplied toward the first nozzle 9, and is discharged from the first discharge port 8. That is, the control unit 3 starts the organic solvent step S7 before the end of the second rinsing step S6.

In the third substrate processing example, the discharge flow rate of IPA from the first discharge port 8 is a small flow rate (for example, about 1/10) as compared with the discharge flow rate of carbonated water from the second discharge port 10. .. Therefore, there is almost no adverse effect on the rinsing process on the substrate W. In the third substrate processing example, as in the second substrate processing example, since there is no interval from the end of the second rinsing step S6 to the start of the organic solvent step S7, it is compared with the first substrate processing example. Therefore, the processing time of the entire resist removing process can be shortened.

Although one embodiment of the present invention has been described above, the present invention can also be implemented in other embodiments.
For example, in the first and second water suction steps T2 and T4 of the first to third substrate processing examples, the carbonated water is sucked until the tip surface of the carbonated water recedes to the suction pipe 49 or the water downstream side portion 50. Although it has been described as performing, the tip surface of the carbonated water after suction may be located inside the organic solvent pipe 34.

In the first to third substrate processing examples, the first water replacement step T1 may be performed at a timing different from that of the static elimination step S2. Further, the second water replacement step T3 may be performed at a timing different from that of the first rinsing step S4. The first water suction step T2 may be performed after the completion of the static elimination step S2. The second water suction step T4 may be performed at a timing different from that of the cleaning chemical solution step S5.
Further, in the first to third substrate treatment examples, as the water replacement step, the first water replacement step T1 executed prior to the sulfuric acid-containing liquid step S3 and the organic solvent step S7 after the sulfuric acid-containing liquid step S3. The second water replacement step T3, which is executed prior to the above, is executed. However, the water replacement step may be performed at least once before and / or after the execution of the organic solvent step S7 and / or before and / or after the execution of the sulfuric acid-containing step S3.

Further, in the first to third substrate processing examples, hydrogen peroxide solution (H ₂ O ₂ ) is applied to the upper surface (surface) of the substrate W prior to the execution of the cleaning chemical solution step S5 or after the execution of the cleaning chemical solution step S5. The hydrogen peroxide solution supply step may be performed.
Further, in the above-described embodiment, SPM is exemplified as the sulfuric acid-containing liquid used as an example of the first drug fluid, but sulfuric acid or SOM (sulfuric acid ozone) can also be used as the sulfuric acid-containing liquid.

In the above-described embodiment, the air / liquid between the atmosphere and the treatment liquid is used as the treatment cup by using an external gas / liquid separator (gas / liquid separator 97) without performing the gas / liquid separation between the atmosphere and the treatment liquid inside. The case where the processing cup 16 of the type for performing separation is used has been described. However, as the treatment cup, a treatment cup of a type capable of internally separating the atmosphere and the treatment liquid may be used.

This type of processing cup includes one or more cups arranged to surround the spin chuck 5 and a drainage pipe connected to each cup. Further, in the processing chamber 4 having this type of processing cup, an exhaust port is opened at the lower part of the side wall of the partition wall 18 or the bottom of the partition wall 18, and the inside of the exhaust port is provided with an exhaust duct connected to the exhaust port. By being sucked, the atmosphere of the lower space of the processing chamber 4 is exhausted.

Further, in the above-described embodiment, a common drainage groove (drainage groove 80) for draining a plurality of types of treatment liquids (sulfate-containing liquid, cleaning chemical liquid and water) is provided, and the drainage groove 80 is provided. The distribution destination of the drainage liquid (treatment liquid) is switched between a plurality of drainage branch pipes 82 to 84 according to the type of the drainage liquid (treatment liquid).
However, in the processing cup 16, each type of processing liquid may be provided with a drainage groove in a one-to-one correspondence. That is, a drainage groove for the sulfuric acid-containing liquid, a drainage groove for the cleaning chemical solution, and a drainage groove for water may be individually provided. In this case, it is not necessary to switch the distribution destination of the drainage (treatment liquid) between the plurality of drainage branch pipes.

Further, in the above-described embodiment, IPA is exemplified as an example of the organic solvent used as an example of the second drug fluid, but methanol, ethanol, HFE (hydrofluoroether), acetone and the like are exemplified as the organic solvent. can. Further, the organic solvent is not limited to a case where it is composed of only a single component, but may be a liquid mixed with other components. For example, it may be a mixed solution of IPA and acetone, or it may be a mixed solution of IPA and methanol.

In the above-described embodiment, the combination of a sulfuric acid-containing solution such as SPM and an organic solvent such as IPA is exemplified as a combination of a chemical solution that poses a risk of contact, but in addition, a combination of aqua regia and sulfuric acid is used for contact. It can be exemplified as a combination that involves danger.
The present invention is also widely applied to combinations that produce products (eg, salts) by contact, such as the combination of acid and alkali described above, i.e., combinations of drug fluids that are not suitable for contact. To.

In the above description, the first drug fluid (fluid containing the drug component) has been described as a liquid (that is, a liquid containing the drug component), but the first drug fluid is a gas (that is, a gas containing the drug component). ) May be adopted.
Further, although it has been described that the second drug fluid is a liquid, a gas may be adopted as the second drug fluid.

Further, carbonated water was exemplified as water for replacing the inside of the chemical fluid pipe (organic solvent pipe 34), but this water is not limited to carbonated water, but deionized water (DIW), electrolytic ionized water, hydrogen water, and ozone. It may be either water or aqueous hydrochloric acid having a diluted concentration (for example, about 10 ppm to 100 ppm).
In addition, various design changes can be made within the scope of the matters described in the claims.

1: Substrate processing device 4: Processing chamber 5: Spin chuck (board holding unit)
6: Substrate facing surface 7: Facing member 8: First discharge port 9: First nozzle 11: Second nozzle 12: Organic solvent supply unit (first chemical fluid supply unit)
13: Rinse water supply unit (second water supply unit)
14: Sulfuric acid-containing liquid supply unit (second chemical fluid supply unit)
15: Cleaning chemical solution supply unit 16: Processing cup 34: Organic solvent piping (chemical fluid piping)
35: First organic solvent valve 36: Second organic solvent valve 37: Valve closing sensor 39: First water pipe 40: Organic solvent downstream part 43: First liquid detection sensor 45: Second liquid detection Sensor 46: First water valve 47: Replacement water supply unit (first water supply unit)
49: Suction pipe 51: Suction valve 52: Suction device 53: Vacuum generator 54: Drive valve 55: Suction unit 56: Second water pipe 57: Second water valve A1: Rotating axis A2: Rotating axis W: Substrate

Claims (21)

With the processing chamber,
A substrate holding unit arranged in the processing chamber to hold the substrate,
A first nozzle having a discharge port for discharging a fluid toward the main surface of the board held by the board holding unit, and a first nozzle.
A first for supplying a first drug fluid to the first nozzle via the drug fluid pipe, which has a drug fluid pipe connected to the first nozzle and internally communicates with the discharge port. With the drug fluid supply unit,
A first water supply unit having a water pipe branched and connected to the chemical fluid pipe and supplying water to the chemical fluid pipe via the water pipe, and a first water supply unit.
A chemical fluid valve interposed in the chemical fluid pipe, which is arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe.
A second drug fluid having a second nozzle for supplying a second drug fluid, which is a fluid different from the first drug fluid, on the main surface of the board held by the board holding unit. With the supply unit
The first drug fluid supply unit, the drug fluid valve, the second drug fluid supply unit, and a control unit for controlling the first water supply unit are included.
The control unit is
By opening the drug fluid valve while supplying the first drug fluid to the drug fluid pipe , the first nozzle is directed toward the main surface of the substrate held by the substrate holding unit. The first treatment step of discharging the chemical fluid and performing the treatment using the first chemical fluid on the substrate held by the substrate holding unit, and
With the first nozzle arranged above the substrate held by the substrate holding unit and with the drug fluid valve closed, the second drug fluid is held by the substrate from the second nozzle. A second processing step of supplying to the main surface of the substrate held by the unit and performing the treatment using the second chemical fluid on the substrate held by the substrate holding unit.
After the execution of the first treatment step and before the execution of the second treatment step, the water from the first water supply unit is supplied to the chemical fluid pipe with the chemical fluid valve open. A substrate processing apparatus for performing a first water replacement step of replacing the first chemical fluid inside the chemical fluid pipe with water. Further includes a suction unit for sucking the inside of the drug fluid pipe.
The control unit further controls the suction unit.
The substrate processing apparatus according to claim 1, wherein the control unit further executes a first suction step of sucking the inside of the chemical fluid pipe after the completion of the first water replacement step. With the processing chamber,
A substrate holding unit arranged in the processing chamber to hold the substrate,
A first nozzle having a discharge port for discharging a fluid toward the main surface of the board held by the board holding unit, and a first nozzle.
A first for supplying a first drug fluid to the first nozzle via the drug fluid pipe, which has a drug fluid pipe connected to the first nozzle and internally communicates with the discharge port. With the drug fluid supply unit,
A first water supply unit having a water pipe branched and connected to the chemical fluid pipe and supplying water to the chemical fluid pipe via the water pipe, and a first water supply unit.
A chemical fluid valve interposed in the chemical fluid pipe, which is arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe.
A second drug fluid having a second nozzle for supplying a second drug fluid, which is a fluid different from the first drug fluid, on the main surface of the board held by the board holding unit. With the supply unit
The first drug fluid supply unit, the drug fluid valve, the second drug fluid supply unit, and a control unit for controlling the first water supply unit are included.
The control unit is
With the first nozzle arranged above the substrate held by the substrate holding unit and with the drug fluid valve closed, the second drug fluid is held by the substrate from the second nozzle. A second treatment step of supplying to the main surface of the substrate held in the unit and performing the treatment using the second chemical fluid on the substrate, and
By opening the drug fluid valve while supplying the first drug fluid to the drug fluid pipe , the first nozzle is directed toward the main surface of the substrate held by the substrate holding unit. The first treatment step of discharging the chemical fluid and applying the treatment using the first chemical fluid to the substrate, and
After the execution of the second treatment step and before the execution of the first treatment step, the water from the first water supply unit is supplied to the chemical fluid pipe with the chemical fluid valve open. A substrate processing apparatus for performing a second water replacement step of replacing the inside of the chemical fluid pipe with water. Further includes a suction unit for sucking the inside of the drug fluid pipe.
The control unit further controls the suction unit.
The substrate processing apparatus according to claim 3, wherein the control unit further executes a first suction step of sucking the inside of the chemical fluid pipe after the completion of the second water replacement step. Prior to the first treatment step, the control unit is used to wash away the second chemical fluid from the main surface of the substrate held by the substrate holding unit with water after the second treatment step. The first water supply step of supplying water to the main surface of the substrate held by the substrate holding unit is further executed.
The substrate processing apparatus according to claim 3 or 4, wherein the control unit executes the second water replacement step as the first water supply step. A third nozzle that is different from the first nozzle and discharges the fluid toward the main surface of the substrate held by the substrate holding unit.
Further includes a second water supply unit for supplying water to the third nozzle.
The control unit further controls the second water supply unit.
The control unit is
The first treatment step is started after the end of the second treatment step, and after the second treatment step and prior to the start of the first treatment step, water is applied to the third nozzle. A second water supply step of starting water discharge from the third nozzle toward the main surface of the substrate held by the substrate holding unit by supplying the water is executed.
Any of claims 3 to 5, wherein the control unit starts supplying the first drug fluid to the drug fluid pipe in the first treatment step prior to the end of the second water supply step. The substrate processing apparatus according to item 1. The substrate processing apparatus according to claim 6, wherein the control unit starts the first processing step before the end of the second water supply step. The control unit further executes a second suction step of sucking the inside of the drug fluid pipe after the discharge of the first drug fluid from the first nozzle in the first processing step is completed. Item 6. The substrate processing apparatus according to any one of Items 1 to 7. Further including a facing member having a board facing surface facing the main surface of the board held by the board holding unit.
The substrate processing apparatus according to any one of claims 1 to 8, wherein the ejection port of the first nozzle is provided on the surface facing the substrate. The substrate processing apparatus according to any one of claims 1 to 9, wherein the water contains carbonated water. The first drug fluid contains an organic solvent and contains
The substrate processing apparatus according to any one of claims 1 to 10, wherein the second chemical fluid contains a sulfuric acid-containing liquid. The substrate holding process in which the substrate is held by the substrate holding unit in the processing chamber,
By supplying the first chemical fluid to the first nozzle via the chemical fluid pipe connected to the first nozzle, the main substrate of the substrate held by the substrate holding unit from the first nozzle. A first treatment step of discharging the first chemical fluid toward a surface and performing a treatment using the first chemical fluid on a substrate held by the substrate holding unit.
In a state where the first nozzle is arranged above the substrate held by the substrate holding unit, a second chemical fluid, which is a fluid different from the first chemical fluid, is introduced from the second nozzle. A second processing step of supplying to the main surface of the substrate held by the substrate holding unit and performing the treatment using the second chemical fluid on the substrate held by the substrate holding unit.
After the execution of the first treatment step and before the execution of the second treatment step, water is supplied to the chemical fluid pipe through the water pipe branched and connected to the chemical fluid pipe, and the chemical fluid is supplied. It includes a first water replacement step of replacing the first chemical fluid inside the pipe with water.
A chemical fluid valve is interposed in the chemical fluid pipe, and the chemical fluid valve is arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe.
In the first processing step, the drug fluid valve is opened while supplying the first drug fluid to the drug fluid pipe.
The second processing step is executed with the chemical fluid valve closed, and
A substrate treatment method for supplying water to a chemical fluid pipe in a state where the chemical fluid valve is opened in the first water replacement step . The substrate processing method according to claim 12, further comprising a first suction step of sucking the inside of the drug fluid pipe after the completion of the first water replacement step. The substrate holding process in which the substrate is held by the substrate holding unit in the processing chamber,
A second, which is a different type of fluid from the first chemical fluid, in a state where the first nozzle for discharging the first chemical fluid is arranged above the substrate held by the substrate holding unit. A second treatment step in which the chemical fluid of No. 1 is supplied from the second nozzle to the main surface of the substrate, and the treatment using the second chemical fluid is applied to the substrate.
By supplying the first chemical fluid to the chemical fluid pipe, the first chemical fluid is discharged from the first nozzle toward the main surface of the substrate held by the substrate holding unit, and the first chemical fluid is discharged. The first treatment step of applying the treatment using the chemical fluid of 1 to the substrate, and
After the execution of the second treatment step and before the execution of the first treatment step, water is supplied to the chemical fluid pipe via the water pipe branched and connected to the chemical fluid pipe, and the chemical fluid pipe is supplied. Including a second water replacement step of replacing the inside of the pipe with water,
A chemical fluid valve is interposed in the chemical fluid pipe, and the chemical fluid valve is arranged on the downstream side of the branch connection position of the water pipe in the chemical fluid pipe.
The second processing step is executed with the chemical fluid valve closed.
In the first processing step, the drug fluid valve is opened and the drug fluid valve is opened while supplying the first drug fluid to the drug fluid pipe.
A substrate treatment method for supplying water to a chemical fluid pipe in a state where the chemical fluid valve is opened in the second water replacement step . The substrate processing method according to claim 14, further comprising a first suction step of sucking the inside of the drug fluid pipe after the completion of the second water replacement step. Prior to the first treatment step, the substrate holding unit is subjected to the second treatment step in order to wash away the second chemical fluid from the main surface of the substrate held by the substrate holding unit with water after the first treatment step. It further comprises a first water supply step of supplying water to the main surface of the retained substrate.
The substrate processing method according to claim 15, wherein the first water supply step includes the second water replacement step. The first processing step is started after the completion of the second processing step.
After the second treatment step, prior to the first treatment step, water is supplied to a third nozzle, which is a nozzle different from the first nozzle, to be held by the substrate holding unit. A second water supply step of discharging water from the third nozzle toward the main surface of the substrate is further included.
The substrate treatment according to claim 15 or 16, wherein the first treatment step starts execution of the supply of the first chemical fluid to the chemical fluid pipe prior to the end of the second water supply step. Method. The substrate treatment method according to claim 17, wherein the first treatment step is executed in parallel with the second water supply step. 13. The substrate processing method according to item 1. The substrate treatment method according to any one of claims 12 to 19, wherein the water contains carbonated water. The first drug fluid contains an organic solvent and contains
The substrate treatment method according to any one of claims 12 to 20, wherein the second drug fluid contains a sulfuric acid-containing liquid.

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