TW202207343A - Substrate processing apparatus and substrate conveyance method - Google Patents

Abstract

The present invention provides a substrate processing apparatus and a substrate conveyance method. A second conveyance mechanism (23) of a substrate processing apparatus (100) includes a fist non-sharing hand (H_F), a second non-sharing hand (H_S), and M sharing hands (H_1 to H_M). In a first conveyance cycle, the M sharing hands (H_1 to H_M) support a substrate (W) yet to be processed and a processed substrate (W) at different timings. In the first conveyance cycle, the first non-sharing hand (H_F) supports only a substrate (W) yet to be processed. In the first conveyance cycle, the second non-sharing hand (H_S) supports only a processed substrate (W). In a state in which the second conveyance mechanism (23) receives N substrates (W) from a substrate placement section (29), the second sharing hand (H_S) does not support the substrates (W) while the M sharing hands (H_1 to H_M) and the first non-sharing hand (H_F) support the substrates (W).

Description

Substrate processing apparatus and substrate transfer method

The present invention relates to a substrate processing apparatus and a substrate conveying method.

The substrate processing system described in Patent Document 1 includes a first processing unit, a second processing unit, a main transfer device, a first transfer device, and a second transfer device.

The main transfer device includes a plurality of (five) wafer holding sections that hold the wafers. The main transfer device can move in the horizontal direction and the vertical direction, and can rotate around the vertical axis, so that the wafer holder can be used to transfer a plurality of wafers simultaneously between the cassette and the transfer module.

The first transfer device includes one wafer holding unit. Further, the first transfer device uses the wafer holding unit to perform processing of taking out the wafer from the transfer module and transferring the wafer to the first processing unit, and taking out the wafer processed by the first processing unit from the first processing unit And transfer to the transfer module. Therefore, the wafer holding portion is shared between the wafer before processing and the wafer after processing.

The second transfer device includes one wafer holding unit. Furthermore, the second transfer device uses the wafer holding unit to perform processing of taking out the wafer from the transfer module and transferring the wafer to the second processing unit, and taking out the wafer processed by the second processing unit from the second processing unit. And transfer to the transfer module. Therefore, the wafer holding portion is shared between the wafer before processing and the wafer after processing.

Hereinafter, for the sake of convenience, the description will focus on the first conveying device and the first processing unit. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-201526

[Problems to be Solved by Invention]

The inventors of the present application have paid attention to the possibility that the first transfer device includes a plurality of wafer holding parts (for example, three or more wafer holding parts), and that a plurality of wafers are shared between the wafer before processing and the wafer after processing The possibility of maintaining the department was explored. Furthermore, the inventors of the present application have made active studies focusing on the operation of transferring a plurality of wafers to a plurality of first processing units by the plurality of wafer holding units, in order to improve the operation of the first transfer device (transfer mechanism) for transferring wafers (substrates). production capacity.

An object of the present invention is to provide a substrate processing apparatus and a substrate conveying method which can improve the productivity of the operation of conveying substrates by a conveying mechanism. [Technical means to solve problems]

According to one aspect of the present invention, a substrate processing apparatus includes a substrate placing portion, a plurality of processing units, and a conveying mechanism. The substrate mounting portion is used to mount a plurality of substrates. The plurality of processing units each process the above-mentioned substrates. A conveyance mechanism conveys the said board|substrate between the said board|substrate mounting part and the said processing unit. In one transfer cycle, the transfer mechanism receives N (N is an integer of 2 or more) of the substrates before being processed by the processing unit from the substrate placement portion, and transfers the N substrates to one of the plurality of processing units. N number of processing units are carried in, and N pieces of the above-mentioned substrates processed by the above-mentioned N processing units are carried out from the above-mentioned N number of processing units, and the above-mentioned N pieces of substrates are delivered to the above-mentioned substrate placement portion. The above-mentioned conveyance mechanism includes a plurality of hands. Each of the plurality of hands supports the above-mentioned substrate. The plurality of hands includes a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands disposed between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are continuously arranged in the vertical direction from the first non-shared hand to the second non-shared hand. In the above-mentioned one transfer cycle, the above-mentioned M common hands support the above-mentioned substrate before being processed by the above-mentioned processing unit and the above-mentioned substrate after processing at different timings. In the above-mentioned one conveyance cycle, the above-mentioned first non-shared hand supports only the above-mentioned substrate before being processed by the above-mentioned processing unit. In the above-mentioned one conveyance cycle, the above-mentioned second non-shared hand supports only the above-mentioned substrate processed by the above-mentioned processing unit. When the conveying mechanism receives the N substrates from the substrate placement portion, the second non-shared hand does not support the substrate, and the M shared hands and the first non-shared hand support the substrate.

In one aspect of the present invention, in the substrate processing apparatus, it is preferable that the M shared hands and the first non-shared hand receive the substrate from the substrate placement portion within the one transfer cycle. It is preferable that in the said 1 conveyance cycle, the said 2nd non-shared hand carries out the said board|substrate after processing from the said processing unit. Preferably, in the above-mentioned 1 transfer cycle, the common hands adjacent to the second non-shared hands of the M common hands are loaded into the processing units from which the substrates have been carried out by the second non-shared hands into the above-mentioned processing units before processing. substrate. Preferably, within the one transfer cycle, the common hand adjacent to the second non-shared hand is removed from the processing unit that is different from the processing unit of the substrate before the processing by the common hand. the above-mentioned substrate.

In one aspect of the present invention, in the substrate processing apparatus, it is preferable that the total number of the M shared hands, the first non-shared hands, and the second non-shared hands is N+1. Preferably: M=N-1.

In one aspect of the present invention, in the substrate processing apparatus, it is preferable that the total number of the plurality of hands is 2N.

In one aspect of the present invention, in the substrate processing apparatus, it is preferable that N=2.

In one aspect of the present invention, the substrate processing apparatus preferably further includes a control unit that controls the conveyance mechanism. It is preferable that the said conveyance mechanism is controlled by the said control part, and it operates in any one mode of a 1st board|substrate conveyance mode and a 2nd board|substrate conveyance mode. Preferably, the first substrate transfer mode is a mode in which the N+1 hands out of the 2N hands are used as the M shared hands, the first non-shared hands, and the second non-shared hands. Preferably, in the second substrate transfer mode, N hands of the 2N hands are used for supporting only the substrate before being processed by the processing unit, and the other N hands are used for supporting only the substrate after being processed by the processing unit. The pattern of the above-mentioned substrate.

In one aspect of the present invention, in the substrate processing apparatus, it is preferable that the total number of the plurality of hands is N+1.

According to another aspect of the present invention, the substrate conveying method is performed by a conveying mechanism that conveys the substrates between a substrate placement portion on which a plurality of substrates are placed and a plurality of processing units that process the substrates. The substrate transfer method includes the steps of: receiving N (N is an integer of 2 or more) of the substrates before being processed by the processing unit from the substrate placement unit in one transfer cycle, and transferring the N substrates to the plurality of substrates N processing units among the processing units are carried in, and N pieces of the substrates processed by the N processing units are carried out from the N processing units, and the N pieces of the substrates are delivered to the substrate placement portion. The said conveyance mechanism is equipped with the some hand which supports the said board|substrate, respectively. The plurality of hands includes a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands disposed between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are continuously arranged in the vertical direction from the first non-shared hand to the second non-shared hand. In the step of delivering the N substrates to the substrate placement section, the M shared hands support the substrates before processing by the processing unit and the substrates after processing at different timings within the one transfer cycle. For the substrate, in the above-mentioned one transfer cycle, the first non-shared hand supports only the substrate before being processed by the processing unit, and in the above-mentioned one transfer cycle, the second non-shared hand supports only the substrate processed by the processing unit. the above-mentioned substrate; when the above-mentioned conveying mechanism receives the above-mentioned N pieces of substrates from the above-mentioned substrate placing part, the above-mentioned second non-shared hand does not support the above-mentioned substrate, but the above-mentioned M common hands and the above-mentioned first non-shared hand support it the above-mentioned substrate.

In one aspect of the present invention, in the substrate transfer method, preferably, in the step of delivering the N pieces of substrates to the substrate placement portion, in the one transfer cycle, the M shares share the hand and the The first non-shared hand receives the substrate from the substrate placement portion, and the second non-shared hand carries out the processed substrate from the processing unit in the one transport cycle, and the M The shared hand adjacent to the second non-shared hand in the shared hand is transported into the processing unit that has been transported out of the substrate by the second non-shared hand, and the substrate before processing is transported, within the one transfer cycle, adjacent to the second non-shared hand. 2. The shared hand of the non-shared hand carries out the processed substrate from the aforementioned processing unit different from the aforementioned processing unit of the aforementioned substrate before processing by the aforementioned shared hand.

In one aspect of the present invention, in the substrate transfer method, it is preferable that the total number of the M shared hands, the first non-shared hands, and the second non-shared hands is N+1. Preferably: M=N-1.

In one aspect of the present invention, in the substrate transfer method, it is preferable that the total number of the plurality of hands is 2N.

In one aspect of this invention, in a board|substrate conveyance method, it is preferable that N=2.

In one aspect of the present invention, in the substrate conveyance method, preferably, the conveyance mechanism operates in either a first substrate conveyance mode or a second substrate conveyance mode. Preferably, the first substrate transfer mode is a mode in which the N+1 hands out of the 2N hands are used as the M shared hands, the first non-shared hands, and the second non-shared hands. Preferably, in the second substrate transfer mode, N hands of the 2N hands are used for supporting only the substrate before being processed by the processing unit, and the other N hands are used for supporting only the substrate after being processed by the processing unit. The pattern of the above-mentioned substrate.

In one aspect of the present invention, in the substrate transfer method, it is preferable that the total number of the plurality of hands is N+1. [Effect of invention]

According to the substrate processing apparatus and the substrate conveying method of the present invention, the productivity of the operation of conveying the substrate by the conveying mechanism can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same reference signs are attached to the same or corresponding parts in the drawings, and thus the description will not be repeated. In addition, for convenience of description, a three-dimensional orthogonal coordinate system (X, Y, Z) is indicated in the drawings as appropriate. In addition, in the figure, the X axis and the Y axis are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction. In addition, in the description of the embodiment, the first direction DX, the second direction DY, and the third direction DZ are used as appropriate. The first direction DX, the second direction DY, and the third direction DZ are orthogonal to each other. As an example, the first direction DX and the second direction DY are substantially parallel to the horizontal direction, and the third direction DZ is substantially parallel to the vertical direction. For convenience of explanation, the third direction DZ may be referred to as "up-down direction DZ".

First, the substrate processing apparatus 100 of the present embodiment will be described with reference to FIG. 1 . FIG. 1 is a plan view showing the inside of a substrate processing apparatus 100 according to the present embodiment. In addition, in this embodiment, in order to simplify drawing and description, an intake system and an exhaust system are abbreviate|omitted.

The substrate processing apparatus 100 shown in FIG. 1 processes the substrate W. The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a Field Emission Display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, an optical disk Cover substrate, ceramic substrate or solar cell substrate.

The substrate processing apparatus 100 includes a transfer unit 1 and a processing unit 20 . The processing unit 20 is arranged adjacent to the transfer unit 1 . The transfer unit 1 supplies the substrate W to the processing unit 20 . The processing unit 20 processes the substrate W. The transfer conveyance unit 1 collects the substrate W from the processing unit 20 .

The transfer transfer unit 1 includes a plurality of carrier placement units 3 (for example, four carrier placement units 3 ). The plurality of carrier placement portions 3 are arranged along the first direction DX. The plurality of carrier mounting portions 3 are respectively used to mount a plurality of carriers C. As shown in FIG. The plurality of carriers C accommodate the plurality of substrates W, respectively. In the present embodiment, as an example, each of the plurality of carriers C accommodates 25 substrates W. As shown in FIG. The carrier C is, for example, a FOUP (front opening unified pod).

The transfer conveyance unit 1 includes a first transfer chamber 5 . The first transfer chamber 5 is located between the plurality of carrier placement units 3 and the processing unit 20 .

The transfer conveyance unit 1 includes at least one first conveyance mechanism 7 . In the present embodiment, as an example, the transfer conveyance unit 1 includes one first conveyance mechanism 7 . The first transfer mechanism 7 is arranged in the first transfer chamber 5 . The first conveyance mechanism 7 conveys the substrate W. Specifically, the first conveyance mechanism 7 conveys the substrate W between each carrier C and the processing unit 20 .

The first conveyance mechanism 7 includes a plurality of first hands 9 and a first hand drive unit 11 . Furthermore, only one first hand 9 is shown in FIG. 1 , and the markings of the other first hands 9 are omitted for simplicity. Each of the first hands 9 supports one substrate W. In the present embodiment, each first hand 9 supports one substrate W in a horizontal posture. The first hand drive unit 11 is connected to each of the first hands 9 . The first hand drive unit 11 moves each of the first hands 9 . The first hand drive unit 11 includes a plurality of electric motors.

Next, each of the first hand 9 and the first hand drive unit 11 will be described with reference to FIGS. 1 and 2 . FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1 .

As shown in FIG. 2 , the plurality of first hands 9 are arranged along the vertical direction DZ. In the present embodiment, as an example, the first conveyance mechanism 7 includes five first hands 9 . Actually, as described below, the plurality of first hands 9 are arranged at intervals in the vertical direction DZ. When the first hand drive unit 11 moves the plurality of first hands 9 , the interval between the plurality of first hands 9 in the up-down direction DZ is kept constant. Each 1st hand 9 receives the unprocessed board|substrate W from the carrier C, and conveys the unprocessed board|substrate W to the processing part 20. Moreover, each 1st hand 9 receives the processed board|substrate W processed by the processing part 20 from the processing part 20, and conveys it to the carrier C. FIG.

As shown in FIGS. 1 and 2 , the first hand drive unit 11 includes a rail 11a, a horizontal moving unit 11b, a vertical moving unit 11c, a turning unit 11d, a turning shaft 11e, and an advancing/retreating unit 11f.

The rails 11 a are arranged at the bottom of the first transfer chamber 5 . The rail 11a extends along the first direction DX. The horizontal moving part 11b is supported by the rail 11a. The horizontal moving part 11b moves in the 1st direction DX along the rail 11a. The vertical moving part 11c is supported by the horizontal moving part 11b. The vertical movement part 11c moves in the up-down direction DZ with respect to the horizontal movement part 11b.

The turning portion 11d is supported by the vertical moving portion 11c. The turning portion 11d turns with respect to the vertical moving portion 11c. The turning portion 11d is driven by the turning shaft 11e to turn around the turning axis A1. The revolution axis A1 is an imaginary line extending along the vertical direction DZ.

The advancing and retreating portion 11f reciprocates in one direction of the level determined by the direction of the turning portion 11d. The advancing and retracting portion 11f is connected to each of the first hands 9 . And 11 f of advancing and retracting parts make each 1st hand 9 reciprocate in one direction of the level determined by the direction of the turning part 11d, respectively. The advancing and retracting portion 11f is connected to each of the first hands 9 .

As described above with reference to FIGS. 1 and 2 , the first conveyance mechanism 7 includes the first hand drive unit 11 . Therefore, each of the first hands 9 can move in parallel along the vertical direction DZ. In this case, the first hand drive unit 11 moves the entire plurality of first hands 9 along the vertical direction DZ. Moreover, each 1st hand 9 can turn around the turning axis line A1. In this case, the 1st hand drive part 11 turns the whole of the some 1st hand 9, for example. Furthermore, each of the first hands 9 can be moved in parallel in any horizontal direction.

Next, the processing unit 20 will be described with reference to FIGS. 1 to 4 . FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1 . FIG. 4 is a side view showing the substrate processing apparatus 100 .

As shown in FIGS. 1 , 3 and 4 , the processing unit 20 includes a plurality of processing units 21 . Each of the plurality of processing units 21 processes the substrates W one by one. For example, each processing unit 21 processes the substrate W with a processing liquid (eg, chemical liquid). In the present embodiment, as an example, the processing unit 20 includes 24 processing units 21 .

Specifically, the processing unit 20 has a plurality of processing towers TW. As an example, each processing tower TW is composed of K processing units 21 arranged along the vertical direction DZ. In this embodiment, K is an integer of 2 or more. In each processing tower TW, K/2 processing units 21 are arranged in the lower stage LW, and K/2 processing units 21 are arranged in the upper stage UP.

In the present embodiment, as an example, K=6, and one processing tower TW is constituted by six processing units 21 . Moreover, the processing part 20 has four processing towers TW. The four treatment towers TW are sometimes referred to as treatment towers TW1, TW2, TW3, and TW4, respectively.

The treatment towers TW1 and TW2 are arranged along the second direction DY. The treatment towers TW3 and TW4 are arranged along the second direction DY. The processing towers TW1 and TW2 and the processing towers TW3 and TW4 face each other in the first direction DX with the second transfer chamber 31 interposed therebetween.

Moreover, as shown in FIGS. 1 and 2 , the processing unit 20 further includes a plurality of substrate placement units 29 . In the present embodiment, as an example, the processing unit 20 includes two substrate placement units 29 . Each substrate placing portion 29 can place a plurality of substrates W thereon. In the present embodiment, as an example, each of the substrate placement portions 29 can accommodate 20 substrates W to be placed thereon. Each of the substrate placement portions 29 is adjacent to the first transfer chamber 5 .

Hereinafter, regarding the two substrate placement portions 29, the substrate placement portion 29 located in the lower stage LW may be referred to as "substrate placement portion 29L", and the substrate placement portion 29 located in the upper stage UP may be referred to as "substrate placement portion". 29U".

The substrate placement portion 29L is arranged in the second transfer chamber 31 of the lower stage LW. The substrate placement portion 29U is arranged in the second transfer chamber 31 of the upper stage UP. The substrate placement portion 29L and the substrate placement portion 29U are arranged on a straight line along the vertical direction DZ.

Furthermore, as shown in FIG. 2 , the processing unit 20 further includes a plurality of second transfer mechanisms 23 and a plurality of second transfer chambers 31 . In the present embodiment, as an example, the processing unit 20 includes two second transfer mechanisms 23 and two second transfer chambers 31 . The second conveyance mechanism 23 corresponds to an example of the "conveyance mechanism".

The two second transfer chambers 31 are arranged along the vertical direction DZ. Each second transfer chamber 31 extends along the second direction DY. Each of the second transfer chambers 31 is connected to the first transfer chamber 5 .

Each second conveyance mechanism 23 conveys the substrate W. Specifically, the second conveyance mechanism 23 conveys the substrate W between the substrate placement portion 29 and the processing unit 21 . Hereinafter, regarding the two second conveyance mechanisms 23, the second conveyance mechanism 23 located in the lower stage LW may be referred to as "second conveyance mechanism 23L", and the second conveyance mechanism 23 located in the upper stage UP may be referred to as "second conveyance mechanism". 23U".

The second transfer mechanism 23L is arranged in the second transfer chamber 31 of the lower stage LW. The second transfer mechanism 23U is arranged in the second transfer chamber 31 of the upper stage UP.

As shown in FIGS. 1 to 3 , each second conveyance mechanism 23 includes a plurality of second hands 25 and a second hand drive unit 17 . In the present embodiment, as an example, each of the second conveyance mechanisms 23 includes four second hands 25 . The second hand 25 corresponds to an example of "hand".

Each second hand 25 supports one substrate W. In the present embodiment, each second hand 25 supports one substrate W in a horizontal posture. The second hand drive unit 17 is connected to each of the second hands 25 . The second hand drive unit 17 moves each of the second hands 25 . The second hand drive unit 17 includes a plurality of electric motors.

Specifically, in each of the second conveyance mechanisms 23, the plurality of second hands 25 are arranged along the vertical direction DZ. Actually, as described below, in each second conveyance mechanism 23, a plurality of second hands 25 are arranged at intervals in the vertical direction DZ. Furthermore, when the second hand drive unit 17 moves the plurality of second hands 25, the interval between the plurality of second hands 25 in the vertical direction DZ is maintained constant. For example, the second hand 25 receives the unprocessed board|substrate W from the board|substrate mounting part 29, and conveys the unprocessed board|substrate W to the processing unit 21. For example, the second hand 25 receives the processed substrate W processed by the processing unit 21 from the processing unit 21 and delivers it to the substrate placement portion 29 .

The 2nd hand drive part 17 is provided with two support|pillars 27a, the vertical movement part 27b, the horizontal movement part 27c, the turning part 27d, the turning shaft 27e, and the advance-retraction part 27f.

The two pillars 27 a are arranged in the second transfer chamber 31 . Specifically, the two pillars 27 a are arranged on the inner side surface of the second transfer chamber 31 . The two struts 27a are arranged at intervals in the second direction DY. Each support|pillar 27a extends along the up-down direction DZ. The vertical movement part 27b is supported by two support|pillars 27a. The vertical moving portion 27b extends in the second direction DY across the two struts 27a. The vertical moving part 27b moves in the up-down direction DZ along the two pillars 27a. The horizontal moving part 27c is supported by the vertical moving part 27b. The horizontal moving part 27c moves in the second direction DY between the two support columns 27a along the vertical moving part 27b.

The turning portion 27d is supported by the horizontal moving portion 27c. The turning portion 27d turns with respect to the horizontal moving portion 27c. The revolving portion 27d is driven by the revolving shaft 27e to revolve around the revolving axis A2. The revolving axis A2 is an imaginary line extending along the vertical direction DZ.

The advancing and retreating portion 27f moves relative to the turning portion 27d. The advancing and retreating portion 27f reciprocates in one direction of the level determined by the direction of the turning portion 27d. The advancing and retracting portions 27f are connected to the respective second hands 25 .

As described above with reference to FIGS. 1 to 3 , each of the second conveyance mechanisms 23 includes the second hand drive unit 17 . Therefore, each second hand 25 can move in parallel along the vertical direction DZ. In this case, the second hand drive unit 17 moves the entire plurality of second hands 25 in the vertical direction DZ. Moreover, each 2nd hand 25 can turn around the turning axis line A2. In this case, the second hand drive unit 17 rotates the entire plurality of second hands 25, for example. Furthermore, each second hand 25 can be moved in parallel in any horizontal direction.

Here, as shown in FIG. 1 , the substrate processing apparatus 100 further includes a control unit 200 . The control unit 200 controls each configuration of the substrate processing apparatus 100 . Specifically, the control unit 200 controls the first conveyance mechanism 7 , the second conveyance mechanism 23 , and the processing unit 21 .

The control unit 200 is, for example, a computer. Specifically, the control unit 200 includes a processor and a memory device. The processor includes, for example, a CPU (Central Processing Unit, central processing unit). The memory device stores data and computer programs. Memory devices include, for example, primary memory devices, such as semiconductor memories, and auxiliary memory devices, such as semiconductor memories, solid-state drives, and/or hard disk drives. The memory device may also include removable media. The memory device corresponds to an example of a non-transitory computer-readable memory medium.

Specifically, the processor of the control unit 200 controls the first conveyance mechanism 7 , the second conveyance mechanism 23 and the processing unit 21 by executing the computer program stored in the memory device.

1 and 2, the entire flow of the first conveyance mechanism 7 and the second conveyance mechanism 23 when the substrate W is conveyed will be described.

The first hand 9 of the first conveyance mechanism 7 receives the unprocessed plural substrates W from the carrier C, and delivers the unprocessed plural substrates W to the substrate placement portion 29L or the substrate placement portion 29U. As a result, a plurality of unprocessed substrates W are placed on the substrate placement portion 29L or the substrate placement portion 29U. In this embodiment, the “unprocessed substrate” refers to the substrate W that has not yet been processed by the processing unit 21 , that is, the substrate W that has not been processed by the processing unit 21 .

The second hand 25 of the second conveyance mechanism 23L receives a plurality of unprocessed substrates W from the substrate placement portion 29L, and carries the unprocessed substrates W one by one into each processing unit 21 of the lower stage LW. Then, each processing unit 21 of the lower stage LW processes the unprocessed substrate W. FIG.

Further, the second hand 25 of the second conveyance mechanism 23L unloads the processed substrates W from each processing unit 21 of the lower stage LW, and delivers the processed substrates W to the substrate placement portion 29L. As a result, the plurality of substrates W after the processing are placed on the substrate placement portion 29L.

On the other hand, the second hand 25 of the second conveyance mechanism 23U receives a plurality of unprocessed substrates W from the substrate placement portion 29U, and carries the unprocessed substrates W into each processing unit 21 of the upper stage UP one by one. Then, each processing unit 21 of the upper stage UP processes the unprocessed substrate W.

Further, the second hand 25 of the second conveyance mechanism 23U unloads the processed substrates W from the respective processing units 21 of the upper stage UP, and delivers the processed substrates W to the substrate placement portion 29U. As a result, the plurality of substrates W after the processing are placed on the substrate placement portion 29U.

The first hand 9 of the first conveyance mechanism 7 receives the processed substrates W from the substrate placement portion 29L or the substrate placement portion 29U, and delivers the processed substrates W to the carrier C. As a result, the plurality of substrates W after the processing are accommodated in the carrier C. As shown in FIG.

Next, the processing unit 21 will be described with reference to FIG. 5 . FIG. 5 is a side view showing the interior of the processing unit 21 . As shown in FIG. 5 , the processing unit 21 includes a processing housing 41 , a substrate holding unit 43 , a rotation driving unit 45 , a first nozzle 47 , a first nozzle moving unit 47 a , a second nozzle 49 , a second nozzle moving unit 49 a , a 3 nozzle 51, 3rd nozzle moving part 51a, 4th nozzle 53, 4th nozzle moving part 53a, and cup 55. The substrate processing apparatus 100 further includes a first processing liquid supply pipe 473 , a second processing liquid supply pipe 493 , a third processing liquid supply pipe 513 , and a rinse liquid supply pipe 533 .

The process housing 41 has a box shape. The process casing 41 accommodates the substrate holding unit 43 , the rotational drive unit 45 , the first nozzle 47 , the first nozzle moving unit 47 a , the second nozzle 49 , the second nozzle moving unit 49 a , the third nozzle 51 , and the third nozzle moving unit 51 a , the fourth nozzle 53 , the fourth nozzle moving part 53 a and the cup 55 . Further, the process casing 41 accommodates a part of the first process liquid supply pipe 473 , a part of the second process liquid supply pipe 493 , a part of the third process liquid supply pipe 513 , and a part of the rinse liquid supply pipe 533 . The substrate W that has been carried into the processing unit 21 by the second transfer mechanism 23 is accommodated in the processing casing 41 .

The substrate holding portion 43 holds the substrate W horizontally. The substrate holding portion 43 is, for example, a vacuum type spin chuck. In addition, the method of holding the board|substrate W by the board|substrate holding part 43 is not limited to a vacuum type. The method of holding the substrate W by the substrate holding portion 43 may be, for example, a clamp type or a Bernoulli type.

The rotation drive part 45 rotates the board|substrate holding part 43 centering on the rotation axis A3. As a result, the substrate W and the substrate holding portion 43 integrally rotate around the rotation axis A3. The rotation axis A3 is an imaginary line extending along the vertical direction DZ. The rotary drive unit 45 includes, for example, an electric motor.

The first nozzle 47 supplies the first processing liquid to the substrate W from above the substrate W. Specifically, the first nozzle 47 ejects the first processing liquid toward the rotating substrate W. The first nozzle moving portion 47a moves the first nozzle 47 between the processing position and the retracted position. When the first nozzle 47 is moved to the processing position, it faces the substrate W in plan view. When the first nozzle 47 moves to the retracted position, it does not face the substrate W in plan view. Specifically, when the first nozzle 47 moves to the retracted position, it retracts around the substrate W in plan view.

Specifically, the first nozzle moving portion 47 a includes a first nozzle arm 471 and a first nozzle driving portion 472 . The first nozzle arm 471 extends in a substantially horizontal direction. The first nozzle 47 is arranged at the front end of the first nozzle arm 471 . The 1st nozzle drive part 472 turns the 1st nozzle arm 471 along a substantially horizontal plane centering on the rotation axis line extending along the vertical direction DZ. As a result, the first nozzle 47 moves in the circumferential direction along the circumferential direction with the rotation axis extending in the up-down direction DZ as the center. The first nozzle drive unit 472 includes an electric motor capable of forward and reverse rotation.

The first processing liquid supply pipe 473 supplies the first processing liquid to the first nozzle 47 . The first processing liquid supply pipe 473 is a tubular member through which the first processing liquid flows. In the present embodiment, the first treatment liquid is an acidic liquid. For example, the first treatment solution is hydrofluoric acid (hydrofluoric acid), a mixed solution of sulfuric acid and hydrogen peroxide water (SPM), sulfuric acid, sulfuric acid-hydrogen peroxide water, hydrofluoric acid-nitric acid (a mixture of hydrofluoric acid and nitric acid) solution), or hydrochloric acid.

The second nozzle 49 supplies the second processing liquid to the substrate W from above the substrate W. Specifically, the second nozzle 49 ejects the second processing liquid toward the rotating substrate W. Like the first nozzle moving portion 47a, the second nozzle moving portion 49a moves the second nozzle 49 between the processing position and the retracted position. Specifically, the second nozzle moving portion 49a includes a second nozzle arm 491 and a second nozzle driving portion 492, similarly to the first nozzle moving portion 47a. The configurations of the second nozzle arm 491 and the second nozzle drive unit 492 are the same as those of the first nozzle arm 471 and the first nozzle drive unit 472, and therefore their descriptions are omitted.

The second processing liquid supply pipe 493 supplies the second processing liquid to the second nozzle 49 . The second processing liquid supply pipe 493 is a tubular member through which the second processing liquid flows. In the present embodiment, the second treatment liquid is an alkaline liquid. For example, the second treatment liquid is ammonia water-hydrogen peroxide water (SC1), ammonia water, ammonium fluoride solution, or tetramethylammonium hydroxide (TMAH).

The third nozzle 51 supplies the third processing liquid to the substrate W from above the substrate W. Specifically, the third nozzle 51 ejects the third processing liquid to the substrate W in rotation. The 3rd nozzle moving part 51a moves the 3rd nozzle 51 between a processing position and a retracted position similarly to the 1st nozzle moving part 47a. Specifically, the third nozzle moving portion 51a has a third nozzle arm 511 and a third nozzle driving portion 512, similarly to the first nozzle moving portion 47a. The configurations of the third nozzle arm 511 and the third nozzle drive unit 512 are the same as those of the first nozzle arm 471 and the first nozzle drive unit 472, and therefore their descriptions are omitted.

The third processing liquid supply pipe 513 supplies the third processing liquid to the third nozzle 51 . The third processing liquid supply pipe 513 is a tubular member through which the third processing liquid flows. In the present embodiment, the third treatment liquid is an organic solvent. For example, the third treatment liquid is isopropanol (IPA), methanol, ethanol, hydrofluoroether (HFE), or acetone.

The fourth nozzle 53 supplies the rinsing liquid to the substrate W from above the substrate W. As shown in FIG. Specifically, the fourth nozzle 53 ejects the rinse liquid to the substrate W that is rotating. The 4th nozzle moving part 53a moves the 4th nozzle 53 between a processing position and a retracted position similarly to the 1st nozzle moving part 47a. Specifically, the fourth nozzle moving part 53a has the fourth nozzle arm 531 and the fourth nozzle driving part 532, similarly to the first nozzle moving part 47a. The configurations of the fourth nozzle arm 531 and the fourth nozzle drive unit 532 are the same as those of the first nozzle arm 471 and the first nozzle drive unit 472, and therefore their descriptions are omitted.

The rinse liquid supply pipe 533 supplies the rinse liquid to the fourth nozzle 53 . The flushing liquid supply pipe 533 is a tubular member through which the flushing liquid flows. For example, the rinsing liquid is pure water, carbonated water, electrolytic ionized water, hydrogen water, ozone water, or diluted hydrochloric acid water.

The cup 55 is arranged around the substrate holding portion 43 . The cup 55 surrounds the side of the substrate W held by the substrate holding portion 43 . The sump 55 receives the first to third processing liquids and the rinsing liquid scattered from the rotating substrate W.

Next, the first conveyance mechanism 7 , the second conveyance mechanisms 23L and 23U, and the substrate placement portions 29L and 29U will be described with reference to FIG. 6 .

FIG. 6 is a side view showing the first conveyance mechanism 7, the second conveyance mechanisms 23L, 23U, and the substrate placement portions 29L, 29U.

As shown in FIG. 6 , the first conveyance mechanism 7 includes P first hands 9 . In this specification, unless otherwise specified, P is an integer of 2 or more, and represents the total number of 9 in the first hand. As a preferable example, the P first hands 9 are arranged at equal intervals d along the vertical direction DZ.

Each of the first hands 9 supports the substrate W before processing or the substrate W after processing. Each of the first hands 9 supports one substrate W at a time.

In the present embodiment, as an example, P=5, and the first conveyance mechanism 7 includes five first hands 9 .

The second conveyance mechanism 23L and the second conveyance mechanism 23U each include Q second hands 25 . In this specification, unless otherwise specified, Q is an integer of 3 or more, and represents the total number of the second hand 25 of each of the second conveyance mechanism 23L and the second conveyance mechanism 23U. As a preferable example, the Q second hands 25 are arranged at equal intervals d along the vertical direction DZ. That is, the spacer interval d between the two second hands 25 in the vertical direction DZ adjacent to each other in the vertical direction DZ. Each second hand 25 supports one substrate W at a time.

For example, a part of the second hands 25 of the Q second hands 25 can be used not only in the case of supporting the substrate W before processing, but also in the case of supporting the substrate W after the processing.

For example, some of the second hands 25 of the Q second hands 25 may only support the substrates W before processing, and the other part of the second hands 25 may only support the substrates W after processing.

In the present embodiment, as an example, Q=4, and each of the second conveyance mechanism 23L and the second conveyance mechanism 23U includes four second hands 25 .

Hereinafter, the four second hands 25 of each of the second conveyance mechanism 23L and the second conveyance mechanism 23U will be referred to as the second hand HA, the second hand HB, the second hand HC and the second hand in order from bottom to top, respectively. HD.

Each of the substrate placement portion 29L and the substrate placement portion 29U includes R support portions 291 . In this specification, unless otherwise specified, R is an integer equal to or greater than 2, and represents the total number of the support portions 291 of each of the substrate placement portion 29L and the substrate placement portion 29U. R is, for example, an even number of 2 or more. The R support portions 291 are arranged at intervals along the vertical direction DZ. As a preferred example, the R support portions 291 are arranged at equal intervals d along the vertical direction DZ. That is, the interval d between the two supporting parts 291 in the up-down direction DZ adjacent to each other in the up-down direction DZ is d. Each support portion 291 supports one substrate W. Specifically, each support portion 291 supports one substrate W in a horizontal posture.

As a preferred example, the interval d between the support parts 291 , the interval d between the first hand 9 and the interval d between the second hand 25 are approximately equal.

In the present embodiment, as an example, R/2 support portions 291 of the lower stage 291A of the substrate placement portion 29L and the substrate placement portion 29U support the substrate W before processing, and R/2 support portions 291 of the upper stage 291B support the processing. Substrate W after that.

In addition, in the present embodiment, as an example, R=20, and each of the substrate placement portion 29L and the substrate placement portion 29U includes 20 support portions 291 .

In addition, the interval between the first hands 9 is not particularly limited, and for example, the interval may not be equal, and only a part of the interval may be equal. In addition, the interval between the second hands 25 is not particularly limited, and for example, the interval may not be equal, and only a part of the interval may be equal. Furthermore, the interval between the support portions 291 is not particularly limited, and for example, the interval may not be equal, and only a part of the interval may be equal. Furthermore, the interval between the mutually adjacent support parts 291, the interval between the mutually adjacent first hands 9, and the mutually adjacent second hand 25 may not be equal.

Next, an example of the first substrate conveyance method of the present embodiment will be described with reference to FIG. 7 . In the description of FIG. 7 , when there is no need to specify the situation of a specific substrate W, it is abbreviated as “substrate”.

The first substrate transfer method is performed by the second transfer mechanism 23 that transfers the substrate between the substrate placement unit 29 and the processing unit 21 . In the first substrate transfer method, M second hands 25 are shared between the substrate before processing and the substrate after processing, whereby a plurality of substrates are transferred. In this specification, M is an integer of 1 or more unless otherwise specified. The first substrate transfer method corresponds to an example of the "substrate transfer method".

FIG. 7 is a diagram showing an example of the entire flow of the first substrate transfer method. In FIG. 7 , for simplicity, attention is paid to the substrate placement portion 29L arranged in the lower stage LW, the second conveyance mechanism 23L arranged in the lower stage LW, and the processing unit 21A among the plurality of processing units 21 arranged in the lower stage LW, 21B to explain. The processing unit 21A and the processing unit 21B are arranged in different positions. In addition, the lower stage 291A of the substrate placement portion 29L is used to place the substrate before processing, and the upper stage 291B of the substrate placement portion 29L is used to place the processed substrate.

Also, in the description of the first substrate transfer method, the second hand HA may be referred to as "1st non-shared hand HA", the second hand HB may be referred to as "shared hand HB", and the second hand HC may be referred to as "shared hand HB". "Second non-shared hand HC". In the exemplary 1st board|substrate conveyance method shown in FIG. 7, the 2nd hand HD is not used.

Furthermore, in the following description, the conveyance cycle CY represents one round of operations in the following sequence: the second conveyance mechanism 23 receives unprocessed substrates from the substrate placement portion 29 , and then the second conveyance mechanism 23 loads the unprocessed substrates into the processing unit 21 . , and the second transport mechanism 23 transports the processed substrate from the processing unit 21 , and then the second transport mechanism 23 mounts the processed substrate on the substrate mounting portion 29 .

As shown in FIG. 7 , as an example, at a certain timing, 10 unprocessed substrates W1 to W10 are placed on the lower stage 291A of the substrate placement portion 29L along the vertical direction DZ, and the substrate placement portion 29L is placed on the lower stage 291A. The upper stage 291B has no substrate placed thereon.

In the first substrate transfer method, in one transfer cycle CY, the second transfer mechanism 23L transfers two unprocessed substrates W1 and W2 into the two processing units 21A and 21B, and carries out two unprocessed substrates W1 and W2 from the two processing units 21A and 21B. Substrates WX1 and WX2 after wafer processing. The conveyance cycle CY is repeatedly executed.

Specifically, in the first substrate transfer method, within one transfer cycle CY, the second transfer mechanism 23L receives the two substrates W1 and W2 before being processed by the processing units 21A and 21B from the substrate mounting portion 29L, and transfers the two The wafers W1 and W2 are loaded into two processing units 21A and 21B among the plurality of processing units 21 , and the two wafers WX1 and WX2 are carried out from the two processing units 21A and 21B and processed by the two processing units 21A and 21B. The two substrates WX1 and WX2 are delivered to the substrate placement portion 29L.

More specifically, the four second hands HA to HD include a first unshared hand HA, a shared hand HB, and a second unshared hand HC. The shared hand HB is arranged between the first unshared hand HA and the second unshared hand HC. The shared hand HB is adjacent to the second non-shared hand HC in the first specific direction SD1. The first non-shared hand HA is adjacent to the shared hand HB in the first specific direction SD1.

The first specific direction SD1 represents the direction from the second non-shared hand HC to the first non-shared hand HA. On the other hand, the second specific direction SD2 is the opposite direction to the first specific direction SD1, and represents the direction from the first non-shared hand HA toward the second non-shared hand HC. The first specific direction SD1 and the second specific direction SD2 are substantially parallel to the vertical direction DZ. For example, the first specific direction SD1 represents the downward direction, and the second specific direction SD2 represents the upward direction.

The first non-shared hand HA, the shared hand HB, and the second non-shared hand HC are continuously arranged along the vertical direction DZ from the first non-shared hand HA to the second non-shared hand HC.

In addition, within one conveyance cycle CY, the first non-shared hand HA supports only the substrate W1 before being processed by the processing unit 21B. In addition, in one conveyance cycle CY, the common hand HB supports the substrate W2 before being processed by the processing unit 21A and the substrate WX1 after being processed by the processing unit 21B at different timings. Furthermore, in one conveyance cycle CY, the second non-shared hand HC supports only the substrate WX2 processed by the processing unit 21A.

With continued reference to FIG. 7 , the states ST1 to ST4 of the second conveyance mechanism 23L within one conveyance cycle CY will be described.

In the state ST1 in which the second conveyance mechanism 23L has received the two substrates W1 and W2 from the substrate placement portion 29L, the second non-shared hand HC does not support the substrate W, and the shared hand HB and the first non-shared hand HA support the substrate W1 , W2. In the 1st board|substrate conveyance method, a 2nd hand HD is not used.

The state ST2 after the state ST1 represents the second conveyance when the processed substrate WX2 is unloaded from the processing unit 21A by the second non-shared hand HC that does not support the substrate, and the unprocessed substrate W2 is loaded into the same processing unit 21A by the common hand HB. Status of mechanism 23L.

The state ST3 after the state ST2 indicates that the substrate WX1 after processing is carried out from the processing unit 21B by the common hand HB that does not support the substrate in the state ST2, and the substrate W1 before processing is carried into the same processing unit 21B by the first non-shared hand HA. The state of the second conveyance mechanism 23L at this time.

The state ST4 after the state ST3 represents the state of the second conveyance mechanism 23L when the substrate WX1 after processing is supported by the common hand HB, the substrate WX2 after processing is supported by the second non-shared hand HC, and the substrate is not supported by the first non-shared hand HA. .

As described above with reference to FIG. 7 , according to the present embodiment, the second conveyance mechanism 23L of the substrate processing apparatus 100 includes the first non-shared hand HA, the shared hand HB, and the second non-shared hand that are continuously arranged in the vertical direction DZ hc. Therefore, when carrying out the unloading and loading of the substrates W1, W2, WX1, and WX2 to the processing units 21A and 21B, compared with the case where the substrate before processing and the substrate after processing do not share hands, it is possible to shorten the first non-return. The moving distance of the shared hand HA to the second non-shared hand HC (specifically, the second hand HA to HD) in the up-down direction DZ. As a result, the throughput of the operation of the second conveyance mechanism 23L to convey the substrates W1, W2, WX1, and WX2 can be improved. 8 , 9 , 11 and 12 , this point will be described in detail with reference to specific examples.

Next, an example of the first substrate transfer method will be described in detail with reference to FIGS. 8 and 9 . In the following description, when the first non-shared hand HA, the shared hand HB, the second non-shared hand HC, and the second hand HD are expressed as a whole, in order to avoid redundancy, they are sometimes referred to as the second hand HA to HD. In addition, when there is no need to specify a specific substrate W, it is abbreviated as "substrate".

8 and 9 are flowcharts showing an example of the first substrate transfer method. As shown in FIGS. 8 and 9 , the first substrate conveyance method includes steps S1 to S12 in one conveyance cycle CY. In the 1st board|substrate conveyance method, a 2nd hand HD is not used. In steps S1 to S12, the second hands HA to HD are moved by the second hand drive unit 17 controlled by the control unit 200.

As shown in FIG. 8 , in step S1 , the first non-shared hand HA supports the substrate W1 before processing, and the shared hand HB supports the substrate W2 before processing. On the other hand, the second non-shared hand HC does not support the substrate. The second non-shared hand HC faces the transfer port 41a of the processing unit 21A. Then, the second non-shared hand HC starts to move to the processed substrate WX2 inside the processing unit 21A.

In addition, the state of the second hand HA to HD in step S1 indicates a state in which the second hand HA to HD of the state ST1 shown in FIG. 7 has moved to the position of the processing unit 21A. In addition, in the process of the board|substrate WX2, the conveyance port 41a is blocked by the shielding member (not shown).

Next, in step S2, the second non-shared hand HC carries out the processed substrate WX2 from the processing unit 21A through the transfer port 41a.

Next, in step S3, the second non-shared hand HC returns to the position before the movement. Then, the second hands HA to HD start to move in the second specific direction SD2.

Next, in step S4, the second hands HA to HD move in the second specific direction SD2 by the distance d, and then stop. The distance d is approximately equal to the interval d in the vertical direction DZ between the second non-shared hand HC and the shared hand HB ( FIG. 6 ). As a result, the common hand HB faces the transfer port 41a of the processing unit 21A. Then, the shared hand HB starts to move into the processing unit 21A.

Next, in step S5, the common hand HB carries the substrate W2 before processing into the processing unit 21A through the transfer port 41a.

Next, in step S6, the shared hand HB returns to the position before the movement. Then, the second hands HA to HD start to move to the next processing unit 21B ( FIG. 9 ).

Next, as shown in FIG. 9 , in step S7 , the first non-shared hand HA supports the substrate W1 before processing, and the second non-shared hand HC supports the substrate WX2 after processing. On the other hand, the shared hand HB does not support the substrate. The common hand HB faces the transfer port 41a of the processing unit 21B. Then, the common hand HB starts to move toward the processed substrate WX1 located inside the processing unit 21B.

Furthermore, the state of the second hands HA to HD in step S7 indicates a state in which the second hands HA to HD in the state of step S6 shown in FIG. 8 have moved to the position of the processing unit 21B. In addition, during processing of the substrate WX1, the transfer port 41a is blocked by a shielding member (not shown).

Next, in step S8, the common hand HB carries out the processed substrate WX1 from the processing unit 21B through the transfer port 41a.

Next, in step S9, the shared hand HB returns to the position before the movement. Then, the second hands HA to HD start to move in the second specific direction SD2.

Next, in step S10 , the second hands HA to HD move the distance d in the second specific direction SD2 and then stop. The distance d is approximately equal to the interval d in the vertical direction DZ between the shared hand HB and the first non-shared hand HA ( FIG. 6 ). As a result, the first non-shared hand HA faces the transfer port 41a of the processing unit 21B. Then, the first non-shared hand HA starts to move into the processing unit 21B.

Next, in step S11, the first non-shared hand HA carries the substrate W1 before processing into the processing unit 21B through the transfer port 41a.

Next, in step S12, the first non-shared hand HA returns to the position before the movement. Then, the second hands HA to HD start to move to the board placement portion 29L ( FIG. 7 ). Then, the shared hand HB and the second non-shared hand HC deliver the boards WX1 and WX2 to the board placement portion 29L, respectively.

In summary, as shown in FIGS. 8 and 9 , steps S1 to S12 are executed within one conveyance cycle CY. As a result, in one transfer cycle CY, two unprocessed substrates W1 and W2 can be loaded into the two processing units 21A and 21B, and two processed substrates WX1 and WX2 can be taken out from the two processing units 21A and 21B. .

It is worth mentioning that, in this embodiment, the common hand HB is shared between the operation of loading the pre-processed substrate W2 into the processing unit 21A and the operation of unloading the processed substrate WX1 from the processing unit 21B. Therefore, toward the first specific direction SD1, from the second non-shared hand HC to the first non-shared hand HA, they can be sequentially used for carrying out the substrates WX2, WX1 and carrying in the substrates W1, W2.

As a result, if the unprocessed substrate W2 is to be loaded into the same processing unit 21A after the operation of unloading the processed substrate WX2 from the processing unit 21A is completed, the shared hand HB only needs to move the distance d in the second specific direction SD2 (th 2. The interval d) between the non-shared hand HC and the shared hand HB is sufficient. Similarly, if the unprocessed substrate W1 is to be loaded into the same processing unit 21B after the unloading of the processed substrate WX1 from the processing unit 21B is completed, the first non-shared hand HA only needs to move the distance in the second specific direction SD2 d (the interval d between the shared hand HB and the first non-shared hand HA) is sufficient. Therefore, compared with the case where the substrate before processing and the substrate after processing do not share hands, the throughput of the operation of the second transport mechanism 23L for transporting the substrates W1, W2, WX1, and WX2 can be improved. This point will be described in detail below in comparison with the second substrate transfer method shown in FIGS. 11 and 12 .

In addition, in the present embodiment, in the first substrate transfer method, the transfer cycle CY (step S1 to step S12 ) is repeatedly executed while changing the processing unit 21 .

In addition, the 2nd conveyance mechanism 23U (FIG. 6) performs the 1st board|substrate conveyance method similarly to the 2nd conveyance mechanism 23L.

Next, an example of the second substrate transfer method of the present embodiment will be described with reference to FIG. 10 . The second substrate conveyance method is performed by the second conveyance mechanism 23 that conveys the substrate W between the substrate placement portion 29 and the processing unit 21 . In the second substrate transfer method, among the Q second hands 25, a part of the second hands 25 continuous in the vertical direction DZ supports only the substrate W before processing, and the other part of the second hands 25 continuous in the vertical direction DZ supports only the processing After that, the substrates W are conveyed by a plurality of substrates W. As shown in FIG. Therefore, in the second substrate transfer method, the second hand 25 is not shared between the substrate W after processing and the substrate W before processing.

FIG. 10 is a diagram showing an example of the entire flow of the second substrate transfer method. In FIG. 10 , as in the case shown in FIG. 7 , it is illustrated focusing on the substrate placement portion 29L, the second conveyance mechanism 23L, and the processing units 21A and 21B. In addition, the lower stage 291A of the substrate placement portion 29L is used to place the substrate before processing, and the upper stage 291B of the substrate placement portion 29L is used to place the processed substrate. Furthermore, the definition of the conveyance cycle CY in the second substrate conveyance method is the same as the definition of the conveyance cycle CY in the first substrate conveyance method.

As shown in FIG. 10 , as an example, at a certain timing, 10 unprocessed substrates W1 to W10 are placed on the lower stage 291A of the substrate placement portion 29L along the vertical direction DZ, and the substrate placement portion 29L The upper stage 291B has no substrate placed thereon.

In the second substrate transfer method, in the same manner as in the first substrate transfer method, within one transfer cycle CY, the second transfer mechanism 23L receives the two substrates W1, W2, the two substrates W1, W2 are loaded into the two processing units 21A, 21B among the plurality of processing units 21, and the two processing units 21A, 21B are carried out from the two processing units 21A, 21B. The substrates WX1 and WX2, and the two substrates WX1 and WX2 are delivered to the substrate placement portion 29L. The conveyance cycle CY is repeatedly executed.

Specifically, in the second substrate transfer method, in one transfer cycle CY, among the four second hands HA to HD, the second hands HA and HB consecutive in the upper and lower direction DZ of the lower stage support only the unprocessed substrate W1 , W2. In addition, the second hand HC and HD, which are continuous in the top-bottom direction DZ of the upper stage, support only the processed substrates WX1 and WX2 .

With continued reference to FIG. 10 , the states ST11 to ST14 of the second conveyance mechanism 23L within one conveyance cycle CY will be described.

In the state ST11 in which the second conveyance mechanism 23L has received the two substrates W1 and W2 from the substrate placement portion 29L, the second hands HA and HB support the substrates W1 and W2, respectively, while the second hands HC and HD do not support the substrates.

The state ST12 after the state ST11 shows the state of the second conveyance mechanism 23L when the processed substrate WX2 is unloaded from the processing unit 21A by the second hand HD, and the unprocessed substrate W2 is loaded into the same processing unit 21A by the second hand HB.

The state ST13 following the state ST12 shows the state of the second conveyance mechanism 23L when the processed substrate WX1 is unloaded from the processing unit 21B by the second hand HC, and the unprocessed substrate W1 is loaded into the same processing unit 21B by the second hand HA.

The state ST14 after the state ST13 shows the state of the second conveyance mechanism 23L when the substrates WX1 and WX2 after the processing are supported by the second hands HC and HD, but the substrates are not supported by the second hands HA and HB.

As described above with reference to FIG. 10 , according to the present embodiment, the second conveyance mechanism 23L of the substrate processing apparatus 100 includes: dedicated second hands HA and HB for supporting the substrates W1 and W2 before processing; and The dedicated second-hand HC and HD for the processed substrates WX1 and WX2. Therefore, the processing liquid in the processing unit 21 can be prevented from adhering to the second hands HA and HB through the processed substrates WX1 and WX2. Furthermore, it is possible to suppress adhesion of the treatment liquid to the substrate before the treatment newly supported by the second-hand HA and HB.

Next, an example of the second substrate conveyance method will be described in detail with reference to FIGS. 11 and 12 . In the following description, when there is no need to specify the situation of a specific substrate W, it is abbreviated as "substrate".

11 and 12 are flowcharts showing an example of a second substrate transfer method. As shown in FIGS. 11 and 12 , the second substrate conveyance method includes steps S21 to S32 in one conveyance cycle CY. In steps S21 to S32 , the second hands HA to HD are moved by the second hand drive unit 17 controlled by the control unit 200 .

As shown in FIG. 11 , in step S21 , the second hands HA and HB support the substrates W1 and W2 before processing, respectively. On the other hand, the second-hand HC and HD do not support substrates. The second hand HD faces the transfer port 41a of the processing unit 21A. Then, the second hand HD starts to move toward the processed substrate WX2 located inside the processing unit 21A.

In addition, the state of the 2nd hand HA-HD of step S21 shows the state that the 2nd hand HA-HD of the state ST11 shown in FIG. 10 has moved to the position of the processing unit 21A.

Next, in step S22, the second hand HD carries out the processed substrate WX2 from the processing unit 21A through the transfer port 41a.

Next, in step S23, the second hand HD returns to the position before the movement. Then, the second hands HA to HD start to move in the second specific direction SD2.

Next, in step S24 , the second hands HA to HD move in the second specific direction SD2 by a distance of 2d (=2×d), and then stop. The distance 2d is approximately equal to the interval 2d in the up-down direction DZ between the second hand HD and the second hand HB ( FIG. 6 ). As a result, the second hand HB faces the transfer port 41a of the processing unit 21A. Then, the second hand HB starts to move into the processing unit 21A.

Next, in step S25, the second hand HB carries the substrate W2 before processing into the processing unit 21A through the transfer port 41a.

Next, in step S26, the second hand HB returns to the position before the movement. Then, the second hands HA to HD start to move to the next processing unit 21B ( FIG. 12 ).

Next, as shown in FIG. 12 , in step S27 , the second hand HA supports the substrate W1 before processing, while the second hand HB does not support the substrate. On the other hand, the second hand HC does not support the substrate, while the second hand HD supports the processed substrate WX2. The second hand HC faces the transfer port 41a of the processing unit 21B. Then, the second hand HC starts to move toward the processed substrate WX1 located inside the processing unit 21B.

In addition, the state of the second hand HA to HD in step S27 indicates a state in which the second hand HA to HD in the state of step S26 shown in FIG. 11 has moved to the position of the processing unit 21B.

Next, in step S28, the second hand HC carries out the processed substrate WX1 from the processing unit 21B through the transfer port 41a.

Next, in step S29, the second hand HC returns to the position before the movement. Then, the second hands HA to HD start to move in the second specific direction SD2.

Next, in step S30 , the second hands HA to HD move in the second specific direction SD2 by a distance of 2d (=2×d), and then stop. The distance 2d is approximately equal to the interval 2d in the vertical direction DZ between the second hand HC and the second hand HA ( FIG. 6 ). As a result, the second hand HA faces the transfer port 41a of the processing unit 21B. Then, the second hand HA starts to move into the processing unit 21B.

Next, in step S31, the second hand HA carries the substrate W1 before processing into the processing unit 21B through the transfer port 41a.

Next, in step S32, the second hand HA returns to the position before the movement. Then, the second hands HA to HD start to move to the board placement portion 29L ( FIG. 10 ). Next, the second hands HC and HD deliver the substrates WX1 and WX2 to the substrate placement portion 29L, respectively.

In summary, as shown in FIGS. 11 and 12 , steps S21 to S32 are executed in one conveyance cycle CY. As a result, within one conveyance cycle CY, two unprocessed substrates W1 and W2 can be conveyed into the two processing units 21A and 21B by the second hands HA and HB, and two unprocessed substrates W1 and W2 can be carried by the second hands HC and HD from the two processing units. 21A and 21B carry out two processed substrates WX1 and WX2.

In addition, in this embodiment, the 2nd board|substrate conveyance method repeatedly performs conveyance cycle CY (step S21 - step S32), changing the process unit 21. FIG.

In addition, the 2nd conveyance mechanism 23U (FIG. 6) performs the 2nd board|substrate conveyance method similarly to the 2nd conveyance mechanism 23L.

Here, with reference to FIGS. 8 and 11 , the first substrate conveyance method and the second substrate conveyance method are compared. As shown in steps S3 and S4 in FIG. 8 , the moving distance of the shared hand HB in the up-down direction DZ is "d". On the other hand, as shown in steps S23 and S24 of FIG. 11 , the moving distance of the second hand HB is "2d". Therefore, the moving distance d of the common hand HB in the first substrate transfer method is smaller than the moving distance 2d of the second hand HB in the second substrate transfer method. Similarly, as shown in steps S9 and S10 of FIG. 9 and steps S29 and S30 of FIG. 12 , the moving distance d of the first non-shared hand HA in the first substrate transfer method is smaller than that of the second hand in the second substrate transfer method The moving distance of HA is 2d.

As a result, in the first substrate conveyance method, the throughput of the conveyance operation of the substrates W1, W2, WX1, and WX2 by the second conveyance mechanism 23 can be improved as compared with the second substrate conveyance method. That is, in the first substrate transfer method, compared to the case where the substrate before processing and the substrate after processing do not share hands, the second transfer mechanism 23 can improve the transfer operation of the substrates W1, W2, WX1, and WX2. capacity.

For example, in the first substrate transfer method, compared with the second substrate transfer method, the moving distance in the vertical direction DZ of the second hands HA to HD is shorter by "d" with respect to one processing unit 21 . In addition, since the transfer cycle CY is repeatedly executed, shortening "d" relative to the moving distance of one processing unit 21 is useful to improve the throughput of the operation of the second transfer mechanism 23 to transfer the substrate.

As mentioned above, the 1st board|substrate conveyance method and the 2nd board|substrate conveyance method were demonstrated with reference to FIGS. 7-12. For example, when the second conveyance mechanism 23 is set to execute either the first substrate conveyance method or the second substrate conveyance method, the substrate processing apparatus 100 is delivered to the user by the manufacturer. That is, any one of the 1st board|substrate conveyance method and the 2nd board|substrate conveyance method is attached to the board|substrate processing apparatus 100.

However, both the first substrate conveyance method and the second substrate conveyance method may be attached to the substrate processing apparatus 100 to selectively execute the first substrate conveyance method and the second substrate conveyance method. In this case, the user can select an ideal substrate transfer method according to the situation. As a result, user convenience can be improved.

In the first substrate transfer method exemplarily described above with reference to FIGS. 7 to 9 , three second hands 25 are used. However, the first substrate transfer method is not limited to the case where three second hands 25 are used, but can be generalized as shown in FIG. 13 . In addition, in the following description, the number of the processing units 21 to which the carrying in and carrying out of the board|substrate W are performed in one conveyance cycle CY is described as "N". In this specification, unless otherwise specified, N is an integer of 2 or more. The description will be made focusing on the N processing units 21 . In addition, in order to make it easy for the reader to understand, the description will be made focusing on N+1 second hands 25 used in the first substrate transfer method among the plurality (Q) of second hands 25 .

FIG. 13 is a diagram for explaining the generalization of the first substrate transfer method. FIG. 13 shows one second conveyance mechanism 23 among the plurality of second conveyance mechanisms 23 . As shown in FIG. 13 , in the first substrate conveyance method, within one conveyance cycle CY, the second conveyance mechanism 23 receives from the substrate placement portion 29 N pieces of the substrates W before being processed by the processing unit 21 , and transfers the N pieces of substrates. W is loaded into N processing units 21_1 to 21_N among the plurality of processing units 21, and N pieces of substrates W processed by the N processing units 21_1 to 21_N are carried out from the N processing units 21_1 to 21_N, and the N pieces of substrates are processed. The board|substrate W is delivered to the board|substrate mounting part 29.

Furthermore, the N processing units 21_1 to 21_N may be a part of the processing units 21 (the total number of the processing units 21>N) among the plurality of processing units 21 provided in the substrate processing apparatus 100, or may be all the processing units 21 (the processing units 21). Total of 21 = N).

The plurality of second hands 25 include a first unshared hand H_F, M shared hands H_1 to H_M, and a second unshared hand H_S. M is an integer of 1 or more. The M shared hands H_1 to H_M are arranged between the first unshared hand H_F and the second unshared hand H_S.

The total number of the first non-shared hands H_F, the M shared hands H_1 to H_M, and the second non-shared hands H_S is N+1. Also, M=N-1. That is, the second conveyance mechanism 23 includes N-1 common hands H_1 to H_M.

Furthermore, the N+1 second hands 25 (the first non-shared hand H_F, the shared hands H_1 to H_M, and the second non-shared hand H_S) may be a plurality of (Q) second hands included in the second conveyance mechanism 23 . Part of the 25 in the second hand 25, can also be all the second hand 25.

The first unshared hand H_F, the M shared hands H_1 to H_M, and the second unshared hand H_S are continuously arranged in the vertical direction DZ from the first unshared hand H_F to the second unshared hand H_S.

In addition, in a state where the second conveyance mechanism 23 has received the N pieces of substrates W before processing from the substrate placement portion 29, the second non-shared hand H_S does not support the substrate W, and the M shared hands H_1 to H_M, and the first The non-shared hand H_F supports the substrate W. That is, the M shared hands H_1 to H_M and the first non-shared hand H_F support N substrates W.

In one transport cycle CY, the M shared hands H_1 to H_M support the processing unit 21 to process the substrate W before processing and the substrate W after processing at different timings.

In one transfer cycle CY, the first non-shared hand H_F supports only the substrate W before being processed by the processing unit 21 .

In one transfer cycle CY, the second non-shared hand H_S supports only the substrate W processed by the processing unit 21 .

13, the operation of the second conveyance mechanism 23 in the first substrate conveyance method will be described in detail.

In one conveyance cycle CY, each of the M shared hands H_1 to H_M and the first non-shared hand H_F receives the substrate W before processing from the substrate placement unit 29 .

In one transfer cycle CY, the second non-shared hand H_S moves to a position facing the transfer port 41a of the processing unit 21_1, and carries out the processed substrate W from the processing unit 21_1.

In one conveyance cycle CY, by moving the N+1 second hands 25 in the second specific direction SD2 by the distance d, the shared hand H_M adjacent to the second non-shared hand H_S among the M shared hands H_1 to H_M moves to the same position as the second non-shared hand H_S. The opposite position of the transfer port 41a of the processing unit 21_1. The distance d represents the interval between the adjacent second hands 25 in the vertical direction DZ. Then, the shared hand H_M carries the substrate W before the processing into the processing unit 21_1 from which the substrate W has been carried out by the second non-shared hand H_S. The processing unit 21_1 processes the substrate W.

In one transfer cycle CY, by moving N+1 second hands 25, the shared hand H_M adjacent to the second non-shared hand H_S is moved to a position opposite to the transfer port 41a of the processing unit 21_2, and the processing unit 21_2 is A processing unit different from the processing unit 21_1 of the substrate W before processing that has been carried by the shared hand H_M. Then, the shared hand H_M unloads the processed substrate W from the processing unit 21_2.

In one conveyance cycle CY, by moving the N+1 second hands 25 in the second specific direction SD2 by the distance d, among the M shared hands H_1 to H_M, the shared hand H_M-1 adjacent to the shared hand H_M is moved to and processed. The position where the transfer port 41a of the unit 21_2 faces. The shared hand H_M-1 is adjacent to the shared hand H_M in the first specific direction SD1. Then, the common hand H_M-1 carries the substrate W before the processing into the processing unit 21_2 from which the substrate W has been carried out by the common hand H_M. The processing unit 21_2 processes the substrate W.

In one transfer cycle CY, by moving N+1 second hands 25, the common hand H_M-1 adjacent to the common hand H_M is moved to a position opposite to the transfer port 41a of the processing unit 21_3, and the processing unit 21_3 is connected to A processing unit different from the processing unit 21_2 of the substrate W before the processing has been carried by the shared hand H_M-1. Then, the shared hand H_M-1 unloads the processed substrate W from the processing unit 21_3.

In one transfer cycle CY, by moving the N+1 second hands 25 in the second specific direction SD2 by the distance d, the common hand H_M-2 adjacent to the common hand H_M-1 is moved to the transfer port 41a with the processing unit 21_3 opposite position. The shared hand H_M-2 is adjacent to the shared hand H_M-1 in the first specific direction SD1. Then, the shared hand H_M-2 carries the substrate W before the processing into the processing unit 21_3 from which the substrate W has been carried out by the shared hand H_M-1. The processing unit 21_3 processes the substrate W.

In one transfer cycle CY, by moving N+1 second hands 25, the common hand H_M-2 adjacent to the common hand H_M-1 is moved to a position opposite to the transfer port 41a of the processing unit 21_4, and the processing unit 21_4 It is a processing unit different from the processing unit 21_3 of the substrate W before the processing by the shared hand H_M-2. Then, the shared hand H_M-2 unloads the processed substrate W from the processing unit 21_4.

From then on, the substrates W are carried in and out of the processing units 21_4 to 21_N-1 by the shared hands H_M-3 to H_2 in the same manner in one conveyance cycle CY. The processing units 21_4 to 21_N-1 process the substrate W.

Then, within one conveyance cycle CY, by moving N+1 second hands 25, the shared hand H_1 adjacent to the shared hand H_2, that is, the shared hand H_1 adjacent to the first non-shared hand H_F, is moved to the processing unit 21_N The processing unit 21_N is a processing unit that is different from the processing unit 21_N-1 that has been transported out of the substrate W by the shared hand H_2 at the opposite position of the transfer port 41a. The shared hand H_1 is adjacent to the shared hand H_2 in the first specific direction SD1. Then, the shared hand H_1 carries out the processed substrate W from the processing unit 21_N.

That is, in one conveyance cycle CY, the common hand H_1 carries out the processed substrate W from the Nth processing unit 21_N.

Then, within one transfer cycle CY, by moving N+1 second hands 25 in the second specific direction SD2 by the distance d, the first non-shared hand H_F moves to a position facing the transfer port 41a of the processing unit 21_N. Then, the first non-shared hand H_F carries the substrate W before processing into the processing unit 21_N from which the substrate W has been carried out by the shared hand H_1 adjacent to the first non-shared hand H_F. The processing unit 21_N processes the substrate W.

That is, within one transfer cycle CY, the first non-shared hand H_F transfers the substrate W before processing to the Nth processing unit 21_N.

Then, the M shared hands H_1 to H_M and the second non-shared hand H_S deliver the processed N substrates W to the substrate placement unit 29 .

As described above with reference to FIG. 13 , in this embodiment, the operations of the shared hands H_1 to H_M in carrying the substrate W before processing to the processing unit 21_1 - the processing unit 21_N-1 and after the processing from the processing unit 21_2 - the processing unit 21_N are carried out. The actions of the substrate W are shared among them. Therefore, toward the first specific direction SD1, from the second non-shared hand H_S to the first non-shared hand H_F, the second non-shared hand H_S to the first non-shared hand H_F can be used for carrying out the substrate W and carrying in the substrate W in sequence.

As a result, if the unprocessed substrate W is to be loaded into the same processing unit 21 after the operation of unloading the processed substrate W from the processing unit 21 is completed, the shared hands H_1 to H_M and the first non-shared hand H_F only need to be transferred to the same processing unit 21. The movement distance d (interval d between the second hand 25 ) in the second specific direction SD2 may be sufficient. Therefore, compared to the case where hands are not shared between the substrate W before processing and the substrate W after processing (eg, the second substrate transport method), the throughput of the operation of the second transport mechanism 23L for transporting the substrate W can be improved.

Next, when the first substrate transfer method has been generalized, referring to FIGS. 14 to 16 , the total number Q of the second hand 25 , the number of the second hand 25 used in the first substrate transfer method, and the second hand 25 are compared. The relationship between the number of the second hand 25 used in the substrate transfer method will be described. 14 to 16 show one second conveyance mechanism 23 among the plurality of second conveyance mechanisms 23 . In addition, the number of the processing units 21 to which the carrying-in and carrying-out of the substrates W are carried out in one conveyance cycle CY is described as "N".

14 shows the total number Q of the second hands 25, the number of the second hands 25 used in the first substrate transfer method, and the second substrate transfer method when the second transfer mechanism 23 includes 2N second hands 25 Graph of the relationship between the number of second hand 25 used.

As shown in FIG. 14 , Q=2×N=2N. Therefore, the total number Q of the plurality of second hands 25 included in the second conveyance mechanism 23 is 2N. That is, the second conveyance mechanism 23 includes 2N second hands 25 . In this example, N is an integer of 2 or more.

Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the 2N second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer of 1 or more.

The total number of the first non-shared hands H_F, the M shared hands H_1 to H_M, and the second non-shared hands H_S is N+1. Also, M=N-1. That is, the second conveyance mechanism 23 includes N-1 common hands H_1 to H_M. In addition, in the 1st board|substrate conveyance method, N-1 second hand 25 among Q (= 2N pieces) 2nd hands 25 is not used.

On the other hand, when the second substrate transfer method is installed in the substrate processing apparatus 100, for example, among the 2N second hands 25, the N second hands 25 that are continuous in the vertical direction DZ (for example, the second hand 25 in the lower row The hands 25) support the substrate W before processing, and another N second hands 25 (eg, the second hands 25 in the upper stage) that are continuous in the vertical direction DZ support the substrate W after processing.

As described above with reference to FIG. 14 , according to the present embodiment, by setting the total number Q of the second hands 25 to 2N, all the second hands 25 can be used when the second substrate transfer method is installed in the substrate processing apparatus 100 . As a result, in the second substrate transfer method, the throughput at the time of transferring the substrate W can be improved. In addition, by providing the second conveyance mechanism 23 with 2N number of second hands 25 in advance, when the first substrate conveyance method is installed in the substrate processing apparatus 100, the existing N+1 second hands 25 can be used without adding new second hands 25. Hand 25.

For example, in the case of N=2, the first substrate transfer method can be performed using the first non-shared hand H_F, the one shared hand H_1, and the second non-shared hand H_S. That is, the 1st board|substrate conveyance method can be performed with the 2nd hand 25 of the minimum structure. Therefore, the cost of the second conveyance mechanism 23 can be reduced.

Here, for example, any one of the first substrate transfer method and the second substrate transfer method described with reference to FIG. 14 is mounted on the substrate processing apparatus 100 .

However, both the 1st board|substrate conveyance method and the 2nd board|substrate conveyance method may be attached to the board|substrate processing apparatus 100.

Specifically, the second conveyance mechanism 23 may be controlled by the control unit 200 to operate in any one of the first substrate conveyance mode MD1 and the second substrate conveyance mode MD2.

The first substrate conveyance mode MD1 is a mode in which the second conveyance mechanism 23 executes the first substrate conveyance method. Specifically, in the first substrate transfer mode MD1, N+1 second hands 25 among the 2N second hands 25 are used as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S mode.

The second substrate conveyance mode MD2 is a mode in which the second conveyance mechanism 23 executes the second substrate conveyance method. Specifically, in the second substrate transfer mode MD2, the N second hands 25 among the 2N second hands 25 are used to support only the substrates W before being processed by the processing unit 21, and the other N second hands 25 are used for In the mode of supporting only the substrate W processed by the processing unit 21 .

By operating the control unit 200, the user can operate the second conveyance mechanism 23 in the first substrate conveyance mode MD1, and also in the second substrate conveyance mode MD2. Therefore, the convenience of the user can be improved. The same is true for the manufacturer of the substrate processing apparatus 100 , which can be set to either the first substrate transfer mode MD1 or the second substrate transfer mode MD2 by operating the control unit 200 and then shipped. Therefore, the convenience of the manufacturer can be improved.

15 shows the total number Q of the second hands 25, the number of the second hands 25 used in the first substrate transfer method, and the number of the second hands 25 when N is an odd number in the second transfer mechanism 23. 2. A diagram showing the relationship between the number of second-hand 25 used in the substrate transfer method.

As shown in FIG. 15, Q=N+1. Therefore, in the second conveyance mechanism 23, the total number Q of the plurality of second hands 25 is N+1. That is, the second conveyance mechanism 23 includes N+1 second hands 25 . In this example, N is an odd number greater than or equal to 3.

Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the N+1 second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer of 1 or more.

The total number of the first non-shared hands H_F, the M shared hands H_1 to H_M, and the second non-shared hands H_S is N+1. Also, M=N-1. That is, the second conveyance mechanism 23 includes N-1 common hands H_1 to H_M. In particular, in the first substrate transfer method, all the second hands 25 of the Q pieces (=N+1 pieces) of the second hands 25 are used. That is, according to the present embodiment, the number of the second hands 25 is optimized when the first substrate transfer method is executed, and there are no redundant second hands 25 . Therefore, the cost of the second conveyance mechanism 23 can be reduced.

On the other hand, when the second substrate conveyance method is installed in the substrate processing apparatus 100, for example, among N+1 second hands 25, (N+1)/2 second hands 25 (for example, N+1)/2 second hands 25 are consecutive in the vertical direction DZ. , the second hand 25 in the lower stage supports the substrate W before processing, and another (N+1)/2 second hands 25 (for example, the second hand 25 in the upper stage) continuous along the vertical direction DZ supports the substrate W after processing.

Here, for example, any one of the first substrate transfer method and the second substrate transfer method described with reference to FIG. 15 is attached to the substrate processing apparatus 100 .

14 , the second conveyance mechanism 23 may be controlled by the control unit 200 to operate in either the first substrate conveyance mode MD10 or the second substrate conveyance mode MD20.

The first substrate conveyance mode MD10 is a mode in which the second conveyance mechanism 23 executes the first substrate conveyance method. Specifically, the first board transfer mode MD10 is a mode in which all Q (=N+1) second hands 25 are used as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S .

The second substrate conveyance mode MD20 is a mode in which the second conveyance mechanism 23 executes the second substrate conveyance method. Specifically, in the second substrate transfer mode MD20, (N+1)/2 second hands 25 in the vertical direction DZ of Q (=N+1) second hands 25 are used to support only the processing unit 21 before processing In addition, the other (N+1)/2 second hands 25 that are continuous in the up-down direction DZ are used to support only the substrate W processed by the processing unit 21 .

In the case of mounting both the first board conveyance mode MD10 and the second board conveyance mode MD20, as in the case of mounting both the first board conveyance mode MD1 and the second board conveyance mode MD2, it is possible to improve the user and manufacturer's convenience. Convenience.

16 shows the total number Q of the second hands 25, the number of the second hands 25 used in the first substrate transfer method, and the number of the second hands 25 used in the first substrate transfer method when N is an even number in the case where the second transfer mechanism 23 includes N+1 second hands 25, and N is an even number. 2. A diagram showing the relationship between the number of second-hand 25 used in the substrate transfer method.

As shown in FIG. 16, Q=N+1. Therefore, in the second conveyance mechanism 23, the total number Q of the plurality of second hands 25 is N+1. That is, the second conveyance mechanism 23 includes N+1 second hands 25 . In this example, N is an even number of 2 or more.

Furthermore, when the first substrate transfer method is installed in the substrate processing apparatus 100, the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is an even number are the same as referring to FIG. 15 . The first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S are the same when N described is an odd number.

On the other hand, when the second substrate conveyance method is installed in the substrate processing apparatus 100, for example, among N+1 second hands 25, N/2 consecutive second hands 25 in the vertical direction DZ (for example, the second hand 25 in the lower row The second hand 25) supports the substrate W before processing, and the other N/2 second hands 25 that are continuous in the vertical direction DZ support the substrate W after processing. Also, the second hand 25 at the top or the second hand 25 at the bottom is not used.

Here, for example, any one of the first substrate transfer method and the second substrate transfer method described with reference to FIG. 16 is mounted on the substrate processing apparatus 100 .

14, the second conveyance mechanism 23 may be controlled by the control unit 200 to operate in either the first substrate conveyance mode MD100 or the second substrate conveyance mode MD200.

The first substrate conveyance mode MD100 is the same as the first substrate conveyance mode MD10 described with reference to FIG. 15 .

In the second substrate transfer mode MD200, N/2 consecutive second hands 25 in the vertical direction DZ among the Q (=N+1) second hands 25 are used to support only the substrates W before being processed by the processing unit 21, and The other N/2 second hands 25 that are continuous in the up-down direction DZ are used to support only the mode of the substrate W processed by the processing unit 21 .

In the case of mounting both the first board transport mode MD100 and the second board transport mode MD200, as in the case of mounting both the first board transport mode MD1 and the second board transport mode MD2, it is possible to improve the user and manufacturer's convenience. Convenience.

The embodiments of the present invention have been described above with reference to the drawings ( FIGS. 1 to 16 ). However, the present invention is not limited to the above-described embodiments, and can be implemented in various forms within a range that does not deviate from the gist (for example, the following (1) to (4)). In addition, a plurality of constituent elements disclosed in the above-described embodiments can be appropriately changed. For example, some of the constituent elements shown in a certain embodiment may be added to the constituent elements of other embodiments, or some of the constituent elements of all the constituent elements shown in a certain embodiment may be deleted from the embodiment. .

In order to make the invention easy to understand, the drawings schematically show each constituent element, and for the convenience of drawing, the thickness, length, number, interval, etc. of each constituent element shown in the drawings may be different from actual ones. In addition, the structure of each component shown in the above-mentioned embodiment is only an example, and is not specifically limited, Of course, various changes can be added in the range which does not deviate substantially from the effect of this invention.

(1) In the first substrate transfer method described with reference to FIG. 13 , the second transfer mechanism 23 may include one or a plurality of second hands 25 that are continuous with the first non-shared hand H_F in the first specific direction SD1 , or There may be one or a plurality of second hands 25 consecutive to the second non-shared hand H_S in the second specific direction SD2. The same applies to the second conveyance mechanism 23 described with reference to FIGS. 7 to 9 .

(2) In FIG. 13 , in terms of the first substrate transfer method, the second hand 25 in the lowermost stage of the N+1 second hands 25 is set as the first non-shared hand H_F, and the second hand 25 in the uppermost stage is set as the first non-shared hand H_F. It is the second non-shared hand H_S (first form). However, the second hand 25 at the bottom of the N+1 second hands 25 may be set as the second non-shared hand H_S, and the second hand 25 at the uppermost stage may be set as the first non-shared hand H_F (the second form).

In this case, the first specific direction SD1 and the second specific direction SD2 are opposite to the case of FIG. 13 . That is, the first specific direction SD1 represents the upward direction, and the second specific direction SD2 represents the downward direction. In this case, in FIG. 13 , the reference symbols of the shared hand 25 are “H_1 to H_M” from top to bottom, and the reference symbols of the processing unit 21 are “21_1 to 21_N” from top to bottom.

Moreover, when performing the conveyance cycle CY repeatedly, the 1st form and the 2nd form may be mixed, and the 1st board|substrate conveyance method may be performed.

In addition, the same applies to the 2nd conveyance mechanism 23 demonstrated with reference to FIGS. 7-9, and the 2nd aspect can also be employ|adopted for a 1st board|substrate conveyance method. For example, the second hand HC may be set as the first non-shared hand, and the second hand HA may be set as the second non-shared hand. Moreover, in the 2nd conveyance mechanism 23 demonstrated with reference to FIGS. 7-9, the 1st board|substrate conveyance method may be performed using the 2nd hand HB - the 2nd hand HC instead of the 2nd hand HA.

(3) The control unit 200 shown in FIG. 1 can determine the processing unit 21 in which the substrate W is carried out and loaded in one transfer cycle CY according to a preset schedule, or can be determined by an event-driven method. The event-driven method refers to a method of determining an optimal processing unit 21 from a plurality of processing units 21 at the time point when the processing unit 21 to be carried out and loaded in the substrate W is determined.

(4) The configuration of the first hand driving portion 11 shown in FIGS. 1 to 3 is not particularly limited, as long as the first hand 9 can be driven. For example, it is also possible that all the 5 first-hand 9 revolving axes are common. For example, as long as the revolving axes are the same, the revolving axes of four consecutive first hands 9 in the vertical direction DZ among the five first hands 9 may be common, and the revolving axes of the other first hand 9 may be different. Similarly, the configuration of the second hand driving unit 17 is not particularly limited, as long as the second hand 25 can be driven. [Industrial Availability]

The present invention relates to a substrate processing apparatus and a substrate transfer method, which have industrial applicability.

1: Transfer and transfer part 3: Vehicle mounting part 5: 1st transfer room 7: 1st conveying mechanism 9: 1st hand 11: 1st hand drive part 11a: Orbits 11b: Horizontal moving part 11c: Vertical moving part 11d: Swirl 11e: Rotary axis 11f: Advance and retreat department 17: Second hand drive 20: Processing Department 21: Processing unit 21A: Processing unit 21B: Processing unit 21_1～21_N: Processing unit 23: Second conveying mechanism (conveying mechanism) 23L: Second conveying mechanism (conveying mechanism) 23U: Second conveying mechanism (conveying mechanism) 25: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand) 27a: Pillar 27b: Vertical moving part 27c: Horizontal moving part 27d: Circumference 27e: Rotary axis 27f: Advance and retreat department 29: Substrate mounting part 29L: Substrate mounting part 29U: Substrate mounting part 31: 2nd transfer room 41: Handling the shell 41a: transfer port 43: Substrate holding part 45: Rotary drive part 47: 1st Nozzle 47a: 1st nozzle moving part 49: No. 2 Nozzle 49a: Second nozzle moving part 51: 3rd Nozzle 51a: 3rd nozzle moving part 53: 4th Nozzle 53a: Fourth nozzle moving part 55: Cheng Cup 100: Substrate processing device 200: Control Department 291: Support Department 291A: Lower section of substrate placement section 291B: Upper section of substrate placement portion 471: 1st Nozzle Arm 472: 1st Nozzle Drive 473: 1st treatment liquid supply piping 491: 2nd Nozzle Arm 492: Second Nozzle Drive 493: Second treatment liquid supply piping 511: 3rd Nozzle Arm 512: 3rd Nozzle Drive 513: The third processing liquid supply piping 531: 4th Nozzle Arm 532: Fourth Nozzle Drive 533: Rinse fluid supply piping C: vehicle TW: processing tower TW1～TW4: Processing tower W: substrate W1～W10: Substrate WX1: Substrate WX2: Substrate HA~HD: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand) H_1～H_M: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand) H_F: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand) H_S: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand)

FIG. 1 is a plan view showing the inside of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1 . FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1 . FIG. 4 is a side view showing the substrate processing apparatus of the present embodiment. FIG. 5 is a side view showing the inside of the processing unit of the present embodiment. FIG. 6 is a side view showing a first conveyance mechanism, a substrate placement portion, and a second conveyance mechanism of the substrate processing apparatus according to the present embodiment. FIG. 7 is a diagram showing an example of the entire flow of the first substrate conveying method executed by the substrate processing apparatus of the present embodiment. FIG. 8 is a flowchart showing the first stage of the first substrate conveying method executed by the substrate processing apparatus of the present embodiment. FIG. 9 is a flowchart showing the second stage of the first substrate conveyance method executed by the substrate processing apparatus of the present embodiment. FIG. 10 is a diagram showing an example of the entire flow of the second substrate transfer method executed by the substrate processing apparatus of the present embodiment. FIG. 11 is a flowchart showing the first stage of the second substrate conveyance method executed by the substrate processing apparatus of the present embodiment. FIG. 12 is a flowchart showing the second stage of the second substrate transfer method executed by the substrate processing apparatus of the present embodiment. FIG. 13 is a diagram for generalizing and explaining the first substrate conveying method executed by the substrate processing apparatus of the present embodiment. 14 shows the total number of second hands, the number of second hands used in the first substrate transfer method, and the number of second hands used in the second substrate transfer method when the second transfer mechanism of the present embodiment has 2N second hands The graph of the relationship between the quantity of the second hand. 15 shows the total number of second hands, the number of second hands used in the first substrate transfer method, and the number of second hands when N is an odd number of the second transfer mechanism of the present embodiment A diagram showing the relationship between the quantity of the second hand used in the substrate transfer method. 16 shows the total number of second hands, the number of second hands used in the first substrate transfer method, and the second A diagram showing the relationship between the quantity of the second hand used in the substrate transfer method.

21: Processing unit

21_1~21_N: Processing unit

23: Second conveying mechanism (conveying mechanism)

25: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand)

29: Substrate mounting part

41a: transfer port

H_F: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand)

H_S: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand)

H_1~H_M: 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand)

W: substrate

Claims (14)

A substrate processing apparatus comprising: a substrate placing part for placing a plurality of substrates; a plurality of processing units, each of which processes the substrate; and a transport mechanism that transports the substrate between the substrate placement portion and the processing unit; and within one transport cycle, the transport mechanism from the substrate placement portion Receiving N (N is an integer of 2 or more) of the substrates before being processed by the processing units, carrying the N substrates into N processing units among the plurality of processing units, and unloading from the N processing units by the above-mentioned N processing units. The N pieces of the above-mentioned substrates processed by the N processing units are handed over to the above-mentioned substrate placing portion; The above-mentioned conveying mechanism is provided with a plurality of hands each supporting the above-mentioned substrates, and The above-mentioned plurality of hands include a first non-shared hand, a second non-shared hand, and a second hand. 2 non-shared hands, and M (M is an integer greater than or equal to 1) shared hands disposed between the above-mentioned first non-shared hand and the above-mentioned second non-shared hand, the above-mentioned first non-shared hand, the above-mentioned M shared hands, and The second non-shared hand is continuously arranged along the vertical direction from the first non-shared hand to the second non-shared hand; In the above-mentioned one conveying cycle, the above-mentioned M shared hands are supported by the above-mentioned processing at different timings The above-mentioned substrate before unit processing and the above-mentioned substrate after processing, in the above-mentioned 1 transport cycle, the above-mentioned first non-shared hand only supports the above-mentioned substrate before being processed by the above-mentioned processing unit, In the above-mentioned 1 transport cycle, the above-mentioned second The non-shared hand only supports the above-mentioned substrates processed by the above-mentioned processing unit, and the above-mentioned second non-shared hand does not support the above-mentioned substrates, and the above-mentioned M pieces of the above-mentioned substrates are not supported by the above-mentioned second non-shared hand when the above-mentioned conveying mechanism receives the above-mentioned N pieces of the substrates from the above-mentioned substrate placing portion. The common hand and the first non-shared hand support the substrate. The substrate processing apparatus of claim 1, wherein in the one transport cycle, the M shared hands and the first non-shared hand receive the substrate from the substrate placement portion, and in the one transport cycle, the first 2 The non-shared hands carry out the processed substrates from the processing unit, within the above-mentioned 1 transfer cycle, the shared hands of the M shared hands adjacent to the second non-shared hands have been carried out by the second non-shared hands. The above-mentioned processing unit of the substrate, the above-mentioned substrate before the processing is carried in, within the above-mentioned 1 transfer cycle, the above-mentioned common hand adjacent to the above-mentioned second non-shared hand and the above-mentioned processing unit of the above-mentioned substrate before the processing has been carried by the common hand. Different from the above-mentioned processing unit, the above-mentioned substrate after processing is carried out. The substrate processing apparatus of claim 1 or 2, wherein the total number of the M shared hands, the first non-shared hands, and the second non-shared hands is N+1, and M=N-1. The substrate processing apparatus of claim 3, wherein the total number of the plurality of hands is 2N. The substrate processing apparatus of claim 4, wherein N=2. The substrate processing apparatus according to claim 4, further comprising a control unit that controls the conveyance mechanism, and the conveyance mechanism is controlled by the control unit to operate in either a first substrate conveyance mode or a second substrate conveyance mode, and the above The first substrate transfer mode is a mode in which the N+1 hands out of the 2N hands are used as the M common hands, the first non-shared hand, and the second non-shared hand, and the second substrate transfer mode is the mode in which the 2N hands are used N hands of the hands are used in a mode that supports only the substrates before being processed by the processing unit, and the other N hands are used in a mode that only supports the substrates after being processed by the processing unit. The substrate processing apparatus of claim 3, wherein the total number of the plurality of hands is N+1. A substrate conveying method, which is performed by a conveying mechanism, and the conveying mechanism conveys the substrate between a substrate placing portion for placing a plurality of substrates and a plurality of processing units for processing the substrate; and the substrate conveying method comprises: The following steps: within one conveyance cycle, receive N (N is an integer of 2 or more) of the substrates before being processed by the processing unit from the substrate placement portion, and transfer the N substrates to one of the plurality of processing units. N processing units are loaded in, and N pieces of the substrates processed by the N processing units are carried out from the N processing units, and the N pieces of the substrates are delivered to the substrate placement portion; A plurality of hands, the plurality of hands includes a first unshared hand, a second unshared hand, and M (M is an integer greater than 1) disposed between the first unshared hand and the second unshared hand The shared hand, the above-mentioned first non-shared hand, the above-mentioned M shared hands, and the above-mentioned second non-shared hand are arranged continuously along the up-down direction from the above-mentioned first non-shared hand to the above-mentioned second non-shared hand; In the above-mentioned step of delivering the substrate to the above-mentioned substrate placement portion, in the above-mentioned one conveying cycle, the above-mentioned M shared hands support the above-mentioned substrate before being processed by the above-mentioned processing unit and the above-mentioned substrate after processing at different timings, in the above-mentioned 1 Within each transport cycle, the first non-shared hand supports only the substrate before being processed by the processing unit, and within the transport cycle, the second non-shared hand supports only the substrate processed by the processing unit, at When the conveying mechanism receives the N substrates from the substrate placement portion, the second non-shared hand does not support the substrate, and the M shared hands and the first non-shared hand support the substrate. The substrate transfer method according to claim 8, wherein in the step of delivering the N pieces of substrates to the substrate placement portion, within the one transfer cycle, the M shared hands and the first non-shared hand are selected from the The substrate placement part receives the substrate, and within the one transport cycle, the second non-shared hand transports the processed substrate from the processing unit, and within the one transport cycle, the M shared hands are adjacent to the second non-shared hand. The shared hand of the 2 non-shared hands is to the processing unit that has been transported out of the substrate by the second non-shared hand, and the substrate before processing is loaded into the above-mentioned shared hand adjacent to the second non-shared hand within the above-mentioned 1 transfer cycle. The hand carries out the substrate after processing from the processing unit different from the processing unit that has been carried into the substrate before processing by the shared hand. The substrate transfer method according to claim 8 or 9, wherein the total number of the M shared hands, the first non-shared hand, and the second non-shared hand is N+1, and M=N-1. The substrate conveying method according to claim 10, wherein the total number of the plurality of hands is 2N. The substrate conveying method according to claim 11, wherein N=2. The substrate transfer method of claim 11, wherein the transfer mechanism operates in either a first substrate transfer mode or a second substrate transfer mode, and the first substrate transfer mode uses the N+1 hands out of the 2N hands as The above-mentioned M shared hands, the above-mentioned first non-shared hand and the above-mentioned second non-shared hand mode, the above-mentioned second substrate transfer mode uses N of the above-mentioned 2N hands to only support the above-mentioned before being processed by the above-mentioned processing unit. substrates, and use the other N hands in a mode that supports only the substrates processed by the processing unit. The substrate conveying method according to claim 10, wherein the total number of the plurality of hands is N+1.

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