TW202205705A - 壓電元件 - Google Patents

壓電元件 Download PDF

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Publication number
TW202205705A
TW202205705A TW110120803A TW110120803A TW202205705A TW 202205705 A TW202205705 A TW 202205705A TW 110120803 A TW110120803 A TW 110120803A TW 110120803 A TW110120803 A TW 110120803A TW 202205705 A TW202205705 A TW 202205705A
Authority
TW
Taiwan
Prior art keywords
piezoelectric
layer
protective layer
hole
lead
Prior art date
Application number
TW110120803A
Other languages
English (en)
Chinese (zh)
Inventor
香川裕介
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202205705A publication Critical patent/TW202205705A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
TW110120803A 2020-06-25 2021-06-08 壓電元件 TW202205705A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020109721 2020-06-25
JP2020-109721 2020-06-25

Publications (1)

Publication Number Publication Date
TW202205705A true TW202205705A (zh) 2022-02-01

Family

ID=79282437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110120803A TW202205705A (zh) 2020-06-25 2021-06-08 壓電元件

Country Status (7)

Country Link
US (1) US20230127642A1 (https=)
EP (1) EP4175322A4 (https=)
JP (1) JP7457807B2 (https=)
KR (1) KR20230010710A (https=)
CN (1) CN115700063A (https=)
TW (1) TW202205705A (https=)
WO (1) WO2021261154A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021095511A1 (ja) 2019-11-12 2021-05-20 富士フイルム株式会社 圧電素子
US20230160762A1 (en) * 2021-11-25 2023-05-25 National Taiwan University Of Science And Technology Pressure Sensing Element with Porous Structure Based Flexible Base
EP4507480A4 (en) * 2022-05-18 2025-07-09 Kureha Corp LAMINATED PIEZOELECTRIC FILM

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
WO2007148728A1 (ja) * 2006-06-22 2007-12-27 Dai Nippon Printing Co., Ltd. サスペンション用基板およびその製造方法
KR101628584B1 (ko) 2011-09-30 2016-06-08 후지필름 가부시키가이샤 전기 음향 변환 필름, 플렉시블 디스플레이, 성대 마이크로폰 및 악기용 센서
JP6005093B2 (ja) 2013-03-28 2016-10-12 富士フイルム株式会社 電気音響変換フィルム、電気音響変換器、フレキシブルディスプレイおよびプロジェクター用スクリーン
JP6005089B2 (ja) 2013-03-29 2016-10-12 富士フイルム株式会社 電気音響変換フィルム
JP6071932B2 (ja) 2013-04-01 2017-02-01 富士フイルム株式会社 電気音響変換フィルム
JP6304593B2 (ja) 2014-05-21 2018-04-04 株式会社リコー 電気機械変換部材、液滴吐出ヘッド、画像形成装置、及び、電気機械変換素子の分極処理方法
JP6199245B2 (ja) 2014-06-30 2017-09-20 富士フイルム株式会社 電気音響変換フィルムおよび電気音響変換フィルムの導通方法
JP6870925B2 (ja) * 2015-08-24 2021-05-12 ローム株式会社 圧電素子利用装置およびその製造方法
US10870009B2 (en) * 2017-01-04 2020-12-22 Cardiac Pacemakers, Inc. Buzzer apparatus
EP3879590A4 (en) * 2018-11-08 2021-12-29 FUJIFILM Corporation Laminated piezoelectric element and electro-acoustic transducer
WO2021095511A1 (ja) * 2019-11-12 2021-05-20 富士フイルム株式会社 圧電素子

Also Published As

Publication number Publication date
CN115700063A (zh) 2023-02-03
EP4175322A4 (en) 2023-12-06
EP4175322A1 (en) 2023-05-03
KR20230010710A (ko) 2023-01-19
JP7457807B2 (ja) 2024-03-28
JPWO2021261154A1 (https=) 2021-12-30
WO2021261154A1 (ja) 2021-12-30
US20230127642A1 (en) 2023-04-27

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