TW202201572A - Sensing component packaging structure and method thereof - Google Patents

Abstract

A sensing component packaging structure includes a lead frame, a chip, an isolating shield, a sensor and a protecting layer. The lead frame includes a first surface and a second surface. A first chip installation region and bonding areas of the lead frame are disposed at the first surface, and a second chip installation region is disposed at the second surface. The chip is disposed on the first chip installation region and electrically connected to the bonding areas of the lead frame. The isolating shield covers the chip and a portion of the lead frame. The sensor is disposed in the second chip installation region. The protecting layer is located above the sensor.

Description

Sensing element packaging structure and packaging method thereof

The present invention relates to a sensing element packaging structure and a packaging method thereof, in particular to a sensing element packaging structure and a packaging method for a miniaturized device.

In the era of increasing technological advancement, smart hearing aids are becoming more and more popular, and the functionality of smart hearing aids is increasing day by day, not only as hearing aids, but with more and more functions and available Time is also getting longer. For example, in a smart hearing aid device, a sensing element (such as an infrared temperature sensing element, etc.) can be installed to sense the user's body temperature, thereby detecting the user's health status, or to control the hearing aid device's Turn it on and off, and even control noise or have sleep monitoring effects.

However, when the hearing aid device or smart device becomes smaller and smaller, and many components need to be installed in the hearing aid device or miniaturization, but the volume of the sensing element is too large, how to reduce the sense of It has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is that the volume of the sensing element applied in the hearing aid device is too large, and the purpose of reducing the volume of the sensing element needs to be achieved by improving the packaging structure.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a sensing element package structure, which includes a lead frame, a chip, an insulating casing, a sensor and a protective layer. The lead frame has a first surface and a second surface opposite to the first surface, the first die bonding area and a plurality of wire bonding areas of the lead frame are arranged on the first surface, and the second die bonding area is arranged on the second surface superior. The chip is arranged in the first die bonding area of the lead frame, and the chip is electrically connected to a plurality of wire bonding areas of the lead frame. The insulating shell covers the chip and part of the lead frame, the sensor is arranged on the second die bonding area of the lead frame, and the protective layer is arranged above the sensor.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a packaging method for a sensing element, which includes: providing a lead frame; arranging a chip in a first die bonding area of the lead frame; The chip is electrically connected to a plurality of wire bonding areas of the lead frame; the encapsulation material is filled on the lead frame to form an insulating shell covering the chip and part of the lead frame; a sensor is arranged on a second die bonding of the lead frame The first die bonding region and the second die bonding region are respectively located on different planes of the lead frame; and a protective layer is arranged on the sensor.

One of the beneficial effects of the present invention is that the sensing element package structure provided by the present invention can reduce the size of the sensing element package by arranging the chip and the sensor on the opposite first surface and the second surface respectively. The purpose of the volume of the structure.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific embodiments to illustrate the embodiments of the "sensor element packaging structure and packaging method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

1 is a bottom view of a sensing element packaging structure according to an embodiment of the present invention, FIG. 2 is a top perspective view of a sensing element packaging structure according to an embodiment of the present invention, and FIG. 3A is a sensing element packaging structure according to a first embodiment of the present invention. FIG. 3B is a cross-sectional view of a package structure of a sensing element according to a second embodiment of the present invention, FIG. 4 is an exploded view of the package structure of a sensing element according to an embodiment of the present invention, and FIG. 5 is a schematic diagram of a lead frame of the present invention. 1 to 5 , the sensing element package structure 10 according to the embodiment of the present invention mainly includes a lead frame 11 , a chip 12 , an insulating housing 13 , a sensor 14 and a protective layer 15 .

As shown in FIG. 4 and FIG. 5 , the lead frame 11 includes a first surface 111 and a second surface 112 , the second surface 112 is opposite to the first surface 111 , a first die bonding area 113 and a plurality of wire bonding areas on the lead frame 11 . 114 is located on the first surface 111 of the lead frame 11, and a second die bonding area 115 and a plurality of pad areas 117 are located on the second surface 112 of the lead frame, and the first die bonding area 113 corresponds to the second die bonding area In the area 115 , the plurality of wire bonding areas 114 correspond to the plurality of pad areas 117 . A plurality of wire bonding regions 114 are arranged around the first die bonding region 113 . In addition, it can be seen from FIG. 5 that the plurality of wire-bonding regions 114 extend outwards along the first direction (-X-axis direction or +X-axis direction) or the second direction (-Y-axis direction or +Y-axis direction), respectively. A plurality of pins 116 are provided. When the lead frame 11 is installed in an electronic device (not shown), the sensing element package structure 10 can be electrically connected to other electronic components (not shown) through the pins 116 . Also, the number of pins 116 may vary from chip 12 to chip.

In addition, the shape of the pins 116 can also be different. In a preferred embodiment of the present invention, as shown in FIG. 4 or FIG. 5 , on the first surface 111 , the plurality of wire bonding areas 114 are bent in one direction. Afterwards, a plurality of pins 116 extend outward, and the direction may be toward the bottom surface. More specifically, the plurality of wire-bonding areas 114 extend outward and go toward the first direction or the second direction (X-axis direction or Y-axis direction, respectively). ) is bent at a predetermined angle to form a plurality of structures corresponding to surrounding the first die bonding region 113 , further, the pin 116 includes an external portion 1161 and a bending portion 1163 , and one end of the pin 116 is formed There are a plurality of contact surfaces 1165 parallel to the surface of the wire bonding area 114, and there is a difference L between the surface of the wire bonding area 114 and the contact surface 1165 of the pin 116, as shown in FIG. 3A . In addition, the drawings of the present invention are only examples, and are not intended to limit the present invention. The lead frame 11 of the present invention can only be presented in the appearance of the drawings. In different embodiments, the shapes of the pins 116 may be different.

The chip 12 of the present invention is preferably an Application Specific Integrated Circuit (ASIC) chip. The chip 12 is disposed in the first die bonding region 113 on the first surface 111 of the lead frame 11 and passes through a plurality of wires 16 The wafer 12 is electrically connected to the plurality of wire bonding areas 114 on the first surface 111 of the lead frame 11 by wire bonding. In addition, since the pins 116 are formed to surround the first die bonding region 113, the chip 12 and the wires 16 can be protected from damage by external forces. Further, the height of the step L between the surface of the wire bonding area 114 and the contact surface 1165 of the pin 116 is determined according to the overall packaging height required by the chip 12 , and the overall packaging height required by the chip 12 is determined according to the height of the chip 12 . It depends on the addition of the wire height required for the subsequent wire 16 .

In addition, it should be noted here that, as shown in FIG. 3A , on the first surface 111 of the lead frame 11 , the level difference L of the pins 116 is higher than the vertical height of the leads 16 , so in the subsequent encapsulation process, the The encapsulant material covers the contact surface 1165 flush with the pins 116 of the lead frame 11 , so that part of the insulating housing 13 can completely cover the chip 12 and the wires 16 , so as to protect the chips 12 and the wires 16 . In addition, in the preferred embodiment of the present invention, a heat dissipation film 17 can be further arranged between the lead frame 11 and the chip 12, so that the heat energy generated by the chip 12 during operation can be transferred to the wires more quickly through the heat dissipation film 17 The frame 11 can achieve a good heat dissipation effect. However, in different embodiments, different thermally conductive materials can also be used. For example, a thermal paste can be applied between the lead frame 11 and the chip 12, which can also achieve the purpose of dissipating heat from the chip 12. Alternatively, in yet another implementation In the example, no thin film or heat dissipation material is disposed or coated between the lead frame 11 and the wafer 12, which is not limited herein.

In the embodiment of the present invention, the insulating casing 13 covers the wafer 12 and part of the lead frame 11 , the insulating casing 13 can be divided into a first part 131 and a second part 132 , and the first part 131 is located on the side of the lead frame 11 . The first surface 111 and the second portion 132 are located on the second surface 112 . Specifically, the first portion 131 is located between the plurality of pins 116 and covers the chip 12 and the wires 16 , and a top surface 133 of the first portion 131 is flush with the contact surface 1165 of the pins 116 to protect the chip 12 and the effect of wire 16. The first portion 131 is also filled in the gaps between the first die bonding region 113 and the plurality of wire bonding regions 114 , and is flush with the second surface 112 of the lead frame 11 to provide a flat surface for subsequent die bonding of the sensor 14 , and to provide a first The die bonding region 113 is electrically separated from the plurality of wire bonding regions 114 . The second portion 132 is disposed around the pins 116 of the lead frame 11 and on the second surface 112 , and can be used to protect the pins 116 and be connected to the protective layer 15 . In addition, as shown in FIG. 3A and FIG. 3B , the first part 131 and the second part 132 of the insulating housing 13 completely cover the bent portion 1163 of the lead frame 11 , thereby enhancing the structural strength. The pin 116 is preferably a stepped structure S in the region adjacent to the second part 132 of the insulating shell 13 , that is to say, the exposed thickness of the pin 116 on the side surface of the insulating shell 13 is smaller than the thickness of the wire bonding area 114 , preferably not more than half of the thickness of the wire bonding area 114, in addition, the side surface of the pin 116 may be exposed by the insulating housing 13 or be flush with the surface of the insulating housing 13, which is not limited here, the pin 116 has a The stepped structure S not only improves the bonding between the lead frame 11 and the insulating case 13 , but also helps to reduce the cutting stress when placing the single sensing element package structure 10 , and avoid burrs generated during the cutting process.

As shown in FIG. 3A , the second part 132 has a casing wall 134 , and the casing wall 134 surrounds the second die-bonding region 115 of the lead frame 11 to form an accommodating groove 18 , so that the sensor 14 provided later can be It is placed in the accommodating groove 18 , and the sensor 14 is exposed in the accommodating groove 18 . In addition, at least one groove 136 can be formed on the surface of the second portion 132 of the insulating case 13, so that the user can separate the protective layer 15 from the insulating case 13 through the at least one groove 136, as shown in FIG. 2 and FIG. As shown in FIG. 4 , two corresponding grooves 136 are formed on two corresponding side top surfaces of the second portion 132 of the insulating housing 13 . The material of the insulating shell 13 may preferably be silicone or epoxy, and the color of the material of the insulating shell 13 is preferably black, so as to prevent ambient light from interfering with the sensing of the sensor 14 . However, in different embodiments, the insulating shell 13 can also be of other colors, and any color that can block ambient light and only transmit infrared light can be the color of the encapsulant material of the present invention, but is not limited herein.

Still referring to FIG. 3A , the sensor 14 is disposed on the second die bonding region 115 of the second surface 112 , that is, the sensor 14 is placed in the accommodating groove 18 formed by the second portion 132 of the insulating housing 13 . The sensor 14 of the present invention is preferably an infrared sensor, and the bottom of the sensor 14 is electrically connected to the pins 116 of the lead frame 11 except for the second die bonding area 115 that directly contacts the second surface 112 of the lead frame 11 . , the sensor 14 directly contacts the plurality of pad areas 117 surrounding the second die bonding area 115 , so that the heat generated by the sensor 14 during operation can be quickly transferred to the second die bonding area of the lead frame 11 115 and a plurality of pad areas 117, so that the temperature of the sensor 14 can be kept as the same as the temperature of the external environment as much as possible.

Then, the protective layer 15 is disposed above the sensor 14 , as shown in FIG. The second portion 132 of the housing 13 supports the protective layer 15 , and a gap C may be formed between the protective layer 15 and the sensor 14 to ensure that the protective layer 15 and the sensor 14 do not collide. The protective layer 15 is preferably composed of glass that only allows infrared rays to pass through. However, in different embodiments, the protective layer 15 can also be composed of other materials, such as plastic, which is not limited herein. In the present invention, the chip 12 and the sensor 14 are respectively disposed on the different first surfaces 111 and the second surface 112 of the lead frame 11 . Compared with the conventional arrangement of the chip 12 and the sensor 14 on the same plane, it is possible to achieve The purpose of reducing the size of the sensing element packaging and testing structure 10 is because if the chip 12 and the sensor 14 are placed on the same plane, a larger area is required to place the chip 12 and the sensor 14 on the same plane, so that the overall As the size increases, the wafer 12 and the sensor 14 are placed on different planes to achieve the purpose of reducing the required area for use, thereby reducing the overall size.

[Second Embodiment]

However, as shown in FIG. 3B , in the second embodiment, the protective layer 15 may have a U-shaped structure, and the surface of the second portion 132 is flush with the surface of the second die bonding region 115 , and the left and right sides of the protective layer 15 are flush. The ends will protrude and abut against the surface of the first portion 131 of the insulating housing 13 . In the second embodiment of FIG. 3B , the insulating housing 13 also includes a first part 131 and a second part 132 , and the arrangement positions of the first part 131 and the second part 132 are similar to those of the first embodiment, and are not repeated here. The difference is that in the second embodiment, the surface of the second portion 132 is flush with the pad area 117 . The surface of the pad area 117 is coplanar, and the protective layer 15 is presented in a U-shaped structure. Similarly, an accommodating groove 18 can be formed between the left and right ends of the protective layer 15, so that the sensor 14 set later can be placed in the accommodating groove 18. slot 18. In addition, since other elements of the sensing element package structure 10 of the second embodiment are the same as those of the sensing element package structure 10 of the first embodiment, the description of other elements of the second embodiment is omitted here.

FIG. 6 is a flowchart of a manufacturing method of a sensing element package structure according to an embodiment of the present invention. Please refer to FIG. 6 , and with reference to FIGS. 1 to 5 and their component numbers, in step S601 , a lead frame 11 is provided. The lead frame 11 can be a metal lead frame. The lead frame 11 can be integrally formed by die casting. How to form the lead frame The rack 11 is well known to those skilled in the art, and will not be repeated here. The lead frame 11 includes a first surface 111 and a second surface 112 opposite to the first surface 111 . The lead frame 11 includes a first die bonding area 113 , a plurality of wire bonding areas 114 , a second die bonding area 115 and a plurality of Pad area 117 . In step S602 , a wafer 12 is disposed in the first die bonding area 113 of the lead frame 11 , and in step S603 , the wafer 12 is electrically connected to the plurality of wire bonding areas 114 of the lead frame 11 through wires 16 in a wire bonding manner. Further, the chip 12 can be directly disposed on the first die bonding area 113 of the lead frame 11 , or in different embodiments, a heat dissipation film 17 can be disposed on the first die bonding area 113 first, but the heat dissipation film 17 The arrangement of the wafer 12 is not limited herein. The chip 12 has a plurality of contact points 121 , and two ends of each wire 16 can be connected to the contact point 121 of the chip 12 and each wire bonding area 114 respectively, so as to achieve the purpose of electrically connecting the chip 12 and the lead frame 11 .

In addition, the wires 16 can electrically connect the wafer 12 to the plurality of wire bonding areas 114 of the lead frame 11 in a forward wire bonding or reverse wire bonding manner, which is not limited herein. In order to allow the heat generated by the wafer 12 to be conducted to the lead frame 11, the wafer 12 may directly contact the first die bonding area 113, or the wafer 12 may contact the first die bonding area 113 through the heat dissipation film 17. Not limited, in addition, how to dispose the wafer 12 on the first die bonding region 113 of the first surface 111 of the lead frame 11 is well known to those skilled in the art, and will not be repeated here.

In step S604, the lead frame 11 is filled with encapsulant material. In detail, the encapsulant material can be filled on the first surface 111 or the second surface 112 of the lead frame 11 at one time, and then the encapsulant material will automatically flow to the second surface 112 or the first surface 111 to form the first embodiment The first part 131 and the second part 132 of the insulating housing 13 in the second embodiment, or the lead frame 11 is filled twice, firstly filling the second part 132 of the insulating housing 13, and then filling it again to form The first portion 131 of the insulating housing 13 . For example, after the lead frame 11 completes the steps of mounting the chip 12 and wire bonding of the wires 16, a mold with a height difference (not shown) is used to put the lead frame 11 into the mold, and the mold is filled to form an insulating shell The material of the body 13 reaches the first surface 111 or the second surface 112 of the lead frame 11, wherein the first part 131 of the insulating shell 13 is located between the plurality of pins 116 and covers the chip 12 and the wires 16, and the insulating shell 13 The second portion 132 of the body 13 is disposed around the pins 116 and extends in one direction and surrounds the second surface 112 of the lead frame 11 , thereby forming an accommodating groove 18 or a plurality of pads on the second surface 112 The surface of the region 117 forms a flush plane. In the embodiment of the present invention, the color of the encapsulant material is preferably black, because the black encapsulant material can block most of the ambient light from being transmitted to the sensor 14, so as to prevent the sensor 14 from being disturbed by the ambient light. The measurement accuracy decreases. In addition, the insulating casing 13 of the present invention can only allow infrared light to be transmitted to the sensor 14, and can block light other than infrared light.

In step S605 , the sensor 14 is disposed on the second die bonding region 115 of the second surface 112 of the lead frame 11 . In detail, the sensor 14 is disposed on the lead frame 11 and is located in the accommodating groove 18 formed by the insulating housing 13 of the first embodiment or the accommodating groove 18 formed by the protective layer 15 of the second embodiment. The detector 14 is in contact with the second die bonding region 115 of the lead frame 11 , so that the heat generated by the sensor 14 during operation can be transferred to the lead frame 11 to achieve the effect of heat dissipation of the sensor 14 . In step S606 , the protective layer 15 is disposed on the sensor 14 , and the protective layer 15 is located on the insulating casing 13 . The surrounding second portion 132 supports the protective layer 15 , thereby protecting the sensor 14 , preventing ambient light from irradiating the sensor 14 , and completing the step of disposing the protective layer 15 . The protective layer 15 is preferably made of glass, which not only prevents the sensor 14 from directly contacting the external environment, but also prevents light other than infrared rays from being transmitted to the sensor 14 . In the present invention, the protective layer 15 is preferably made of a glass material that only allows infrared light to pass through, or a special material can be coated on the protective layer 15 to block ambient light and only allow infrared light to transmit. How to coat the protective layer 15 so that only infrared light can be transmitted to the sensor 14 is well known to those skilled in the art, and will not be repeated here.

After completing the setting of the protective layer, the process steps of the sensing element package structure of the present invention are completed. In addition, in the present invention, an additional step may be included to manufacture the plurality of sensing element package structures 10 in the mold. The sensing element packaging structures 10 are cut one by one, or in different embodiments, a testing step may be further included to test the sensing effect of each sensing element packaging structure 10 to complete the sensing element packaging structure of the present invention. 10 complete process steps.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the sensing element package structure provided by the present invention can reduce the size of the sensing element package by arranging the chip and the sensor on the opposite first surface and the second surface respectively. The purpose of the volume of the structure.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Sensing element package structure 11: Lead frame 111: First surface 112: Second Surface 113: The first solid crystal region 114: Line area 115: The second solid crystal area 116: pin 1161: External part 1163: Bending part 1165: Contact surface 117: Pad area 12: Wafer 121: Contact 13: Insulating shell 131: Part One 132: Part Two 133: Top surface 134: Shell Wall 136: Groove 14: Sensor 15: Protective layer 16: Wire 17: heat dissipation film 18: accommodating slot L: level difference C: gap S: stepped structure S601-S606: Steps

FIG. 1 is a bottom view of a sensing element package structure according to an embodiment of the present invention.

FIG. 2 is a top perspective view of a sensing element package structure according to an embodiment of the present invention.

3A is a cross-sectional view of a package structure of a sensing element according to an embodiment of the present invention.

FIG. 3B is a cross-sectional view of a sensing device package structure according to another embodiment of the present invention.

FIG. 4 is an exploded view of a packaging structure of a sensing element according to an embodiment of the present invention.

FIG. 5 is a schematic diagram of the lead frame of the present invention.

FIG. 6 is a flowchart of a manufacturing method of a sensing element package structure according to an embodiment of the present invention.

10: Sensing element package structure

111: First surface

112: Second Surface

114: Line area

1161: External part

1163: Bending part

1165: Contact surface

117: Pad area

13: Insulating shell

131: Part One

132: Part Two

133: Top surface

134: Shell Wall

14: Sensor

15: Protective layer

16: Wire

17: heat dissipation film

18: accommodating slot

L: level difference

C: gap

S: stepped structure

Claims (10)

A sensing element package structure, comprising: a lead frame having a first surface and a second surface opposite to the first surface, a first die bonding area and a plurality of wire bonding areas of the lead frame are disposed on the first surface, and a second die-bonding region is disposed on the second surface; a chip, which is disposed in the first die bonding area of the lead frame, and the chip is electrically connected to a plurality of the wire bonding areas of the lead frame; an insulating shell covering the wafer and part of the lead frame; a sensor disposed on the second die bonding area of the lead frame; and A protective layer is disposed above the sensor. The sensing element package structure according to claim 1, wherein the plurality of wire bonding areas of the lead frame are bent outward along a direction to extend a plurality of pins, and the plurality of pins surround the surrounding area. The first die-bonding region is used to protect the wafer and the wires. The sensing element package structure according to claim 2, wherein a difference is formed between the surface of the wire bonding area and a contact surface of the pin, and the contact surface of the pin is insulated from the insulation A top surface of the housing is flush. The sensing element package structure according to claim 1, wherein the protective layer can be a U-shaped glass or flat glass, and defines an accommodating space together with the insulating casing, and the sensor is located in the accommodating space. in the setting space. The sensing element package structure according to claim 1, wherein the insulating housing comprises a first part and a second part, the first part covers the chip located on the first surface and part of the wires, The second part surrounds the periphery of the second surface and is in contact with the protective layer to define an accommodating space for accommodating the sensor. The sensing element package structure according to any one of claims 1 to 5, further comprising: a heat dissipation film disposed between the chip and the first die bonding area of the lead frame. The sensing element package structure according to any one of claims 1 to 5, wherein a gap is formed between the sensor and the protective layer, and the insulating housing is made of black material silicone ( Silicone) or epoxy resin (Epoxy). A packaging method for a sensing element, comprising: providing a lead frame; disposing a chip in a first die bonding area of the lead frame; electrically connecting the wafer to a plurality of wire bonding areas of the lead frame; Filling encapsulation material on the lead frame to form an insulating shell covering the chip and part of the lead frame; disposing a sensor in a second die bonding area of the lead frame, and the first die bonding area and the second die bonding area are respectively located on different planes of the lead frame; and A protective layer is placed on the sensor. The method for packaging a sensing element according to claim 8, wherein, in the step of filling the encapsulant material, the plurality of wire bonding areas of the lead frame further include a plurality of bonding wires exposed to the insulating housing. foot. The packaging method for a sensing element according to any one of claims 8 or 9, wherein, in the step of disposing the protective layer, the protective layer can be a U-shaped glass or flat glass, which is insulated from the The casings together define an accommodating space, and the sensor is located in the accommodating space.

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