TW202200378A - Cover tape for packing electronic component and package - Google Patents

Abstract

The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1 × 10¹⁰ Ω/□ or less; the heat sealing layer includes an antistatic agent; and a transmittance of a light with an incident angle of 40° through the cover tape for packing an electronic component is 80% or more.

Description

Cover tape and packaging body for electronic parts packaging

The present invention relates to a cover tape for packaging electronic parts and a packaging body using the same.

In recent years, electronic components such as IC (Integrated Circuit), resistors, transistors, diodes, capacitors, piezoelectric element registers, etc., are packaged with tape for surface mounting. In the tape packaging, electronic components are accommodated in a carrier tape having a plurality of accommodating portions for accommodating electronic components, and then the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting electronic components. When mounting electronic components, the cover tape is peeled off from the carrier tape, and the electronic components are automatically taken out and surface mounted on the board. Furthermore, the cover tape is also referred to as an upper tape.

In tape packaging, static electricity may be generated due to friction or contact of electronic components with carrier tape or cover tape, and electronic components may be deteriorated or destroyed by static electricity. In addition, at the time of mounting, static electricity may be generated by peeling the cover tape from the carrier tape, and there may be cases where electronic components cannot be taken out normally due to adhesion of electronic components to the cover tape. Therefore, the carrier tape and the cover tape are required to have high antistatic properties.

In addition, in the unopened state of the tape package, visual inspection or camera inspection is performed from the cover tape to detect the defects of the electronic parts as the contents, or to identify the codes printed on the electronic parts, etc. Therefore, the cover tape is also required to have high transparency, and various cover tapes focusing on transmittance have been proposed (for example, Patent Documents 1 and 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-140200 [Patent Document 2] Japanese Patent Laid-Open No. 2019-171577

[Problems to be Solved by Invention]

With the miniaturization of electronic components, it has become increasingly difficult to confirm through the cover tape. Furthermore, in the step of mounting electronic components such as ICs, a method is implemented: a CCD (Charge Coupled Device) camera or the like is used from the cover tape to take pictures and analyze the images, thereby confirming the electronic components in the storage portion. The position, orientation or angle of the parts, and the installation steps are carried out at the same time. As described above, in accordance with the requirements of miniaturization of electronic components or confirmation by a CCD camera, it is necessary to further improve the visibility of the cover tape.

In the actual camera inspection, sometimes the electronic parts in the storage part of the package are photographed from the oblique direction with an angle to the vertical direction through the cover tape, not from the vertical direction of the surface of the cover tape. to shoot. The inventors of the present invention have found that, in the case of a package using the above-described conventional cover tape, when the inside of the storage portion is checked in an oblique direction through the cover tape, the visibility of the electronic components may be deteriorated. .

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a cover tape for packaging electronic components, in which electronic components are photographed through the cover tape (especially when photographing from an oblique direction, etc.). Excellent visibility and high anti-static properties. [Technical means to solve problems]

One embodiment of the present invention provides a cover tape for packaging electronic parts, comprising: a base material layer; a heat seal layer disposed on one surface side of the base material layer; and an antistatic layer disposed on the base material The surface side of the layer opposite to the surface on the side of the above-mentioned heat-sealing layer; and the surface resistivity of the surface on the side where the above-mentioned antistatic layer is arranged is 1×10 ¹⁰ Ω/□ or less, the above-mentioned heat-sealing layer contains an antistatic agent, and the above-mentioned The transmittance of light with an incident angle of 40 degrees of the cover tape for electronic parts packaging is more than 80%.

One embodiment of the present invention provides a cover tape for packaging electronic parts, comprising: a base material layer; a heat seal layer disposed on one surface side of the base material layer; and an antistatic layer disposed on the side of the base material layer The surface opposite to the surface on the side of the above-mentioned heat-sealing layer; and the surface resistivity of the surface on the side where the above-mentioned antistatic layer is arranged is 1×10 ¹⁰ Ω/□ or less, the above-mentioned heat-sealing layer contains an antistatic agent, and the above-mentioned electronic component The absorption rate of light with an incident angle of 40 degrees of the cover tape for packaging is less than 10%.

One embodiment of the present invention provides a package including: a carrier tape having a plurality of accommodating parts for accommodating electronic components; electronic components accommodated in the accommodating parts; and the above-mentioned cover tape for packaging electronic components, which It is arrange|positioned so that the said accommodating part may be covered. [Effect of invention]

The cover tape for packaging electronic parts of the present invention has high antistatic performance and is excellent in visibility of the electronic parts when the electronic parts are observed or photographed through the cover tape.

Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in many different aspects, and should not be construed as being limited to the contents described in the embodiments illustrated below. In addition, in the drawings, the width, thickness, shape, etc. of each part may be schematically shown in comparison with the actual form to clarify the description, but this is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same code|symbol is attached|subjected to the same element as the element described in the figure already shown, and a detailed description is abbreviate|omitted suitably.

In this specification, when a state of disposing other components on a certain component is shown, it is simply described as "on" or "under", unless otherwise specified, it includes the following two situations, namely, , other components are arranged directly above or just below a certain component in a way that it is connected with a certain component, and other components are arranged above or below a certain component and further separated from another component. Also, in this specification, when the state of disposing other members on the surface of a certain member is simply described as "on the surface side" or "on the surface", unless otherwise specified, the following two are included. In one case, other members are arranged directly above or directly below a certain member in a manner of being in contact with a certain member, and other members are arranged above or below a certain member and further interposed between another member.

As described above, various cover tapes focusing on transmittance have been proposed. However, the inventors of the present invention have found that there is a situation in the previous cover tapes, that is, in the camera inspection of photographing electronic parts through the cover tape in the package body, although there is no problem when photographing from a direction perpendicular to the surface of the cover tape, However, when shooting from an oblique direction, the visibility deteriorates. Moreover, the reason for this phenomenon is that although the transmittance of light with an incident angle of 0 degrees is relatively high in the previous cover tape, the transmittance of light with an incident angle of more than 0 degrees (eg, 40 degrees) may not be high enough.

Regarding the conventional cover tape, the film thickness of the antistatic layer may be increased so that the antistatic layer has sufficient antistatic performance, and as a result, the transmittance may be lowered. In addition, there is a case where the absorptivity becomes high. Furthermore, an antistatic agent (such as conductive particles) is sometimes added to the heat sealing layer to make the cover tape have sufficient antistatic performance, but the film thickness of the heat sealing layer is usually set to be relatively thick at 1 μm or more to ensure As a result, the content of the antistatic agent increases, resulting in coloring or internal diffusion in the heat sealing layer, resulting in a decrease in transmittance. In addition, there is a case where the absorptivity becomes high. The inventors of the present invention found that such a tendency to decrease in transmittance and increase in absorptivity becomes more pronounced as the optical path length in the cover band becomes longer when the incident angle is greater than 0 degrees. Therefore, the conventional cover tapes do not have both transmittance or absorptivity to such an extent that the visibility from the oblique direction is not deteriorated, and excellent antistatic performance.

Therefore, the inventors of the present invention found that if the cover tape is provided with an antistatic layer such that the surface resistivity becomes a specific value or less, and an antistatic agent is added to the heat sealing layer, the antistatic performance of the entire cover tape can be improved, and the incident When the transmittance of light at an angle of 40 degrees is 80% or more, the anti-static performance is excellent, and the visibility of electronic parts can be suppressed from deteriorating in the case of camera inspection from an oblique direction.

Furthermore, the inventors of the present invention found that if the cover tape is provided with an antistatic layer such that its surface resistivity becomes a specific value or less, and an antistatic agent is added to the heat sealing layer, the antistatic performance of the entire cover tape can be improved, and the incident When the absorption rate of light at an angle of 40 degrees is 10% or less, the anti-static performance is excellent, and the visibility of electronic parts can be suppressed from deteriorating in the case of camera inspection from an oblique direction.

Here, when light is incident from an angular direction larger than the incident angle of 40 degrees, the reflection component of the layer interface between the surface and the inside of the cover tape tends to increase. Similarly, when the camera inspection is performed from an angular direction larger than the incident angle of 40 degrees, the detection amount of the reflected light increases, and therefore, the configuration of the camera for inspection is generally not good. For this reason, the camera etc. for inspection are arrange|positioned so that it may form an angle of 40 degrees or less normally with respect to the perpendicular direction of a film surface, and it is hard to generate|occur|produce visibility deterioration by reflected light within such an angle range.

In recent years, the structure of electronic parts has become more complex, and it is not possible to accurately detect defects in parts only by photographing from 0 degrees (directly above). Moreover, since the inspection is performed at a high speed, there is a possibility that the imaging setting is shifted from 0 degrees even if it is performed at 0 degrees. Hereinafter, the cover tape for packaging electronic components and the package body of the present invention will be described in detail.

A. Cover tape for packaging electronic parts (first embodiment and second embodiment) The cover tape for packaging electronic parts according to the first embodiment of the present invention is characterized by having: a base material layer; One surface side of the above-mentioned base material layer; and an antistatic layer, which is disposed on the surface side of the above-mentioned base material layer opposite to the surface of the above-mentioned heat-sealing layer side; and the surface resistivity of the surface on which the above-mentioned antistatic layer is disposed 1×10 ¹⁰ Ω/□ or less, the heat-sealing layer contains an antistatic agent, and the light transmittance at an incident angle of 40 degrees of the cover tape for packaging electronic parts is 80% or more.

A cover tape for packaging electronic parts according to a second embodiment of the present invention is characterized by having: a base material layer; a heat seal layer disposed on one surface side of the base material layer; and an antistatic layer disposed on the base material The surface side of the layer opposite to the surface on the side of the above-mentioned heat-sealing layer; and the surface resistivity of the surface on the side where the above-mentioned antistatic layer is arranged is 1×10 ¹⁰ Ω/□ or less, the above-mentioned heat-sealing layer contains an antistatic agent, and the above-mentioned The absorption rate of light with an incident angle of 40 degrees of the cover tape for electronic parts packaging is less than 10%.

In addition, in this specification, "cover tape for electronic component packaging" may be abbreviated as "cover tape".

The cover tapes according to the first embodiment and the second embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of a cover tape according to a first embodiment and a second embodiment of the present invention. As shown in FIG. 1 , the cover tape 1 of the present invention includes: a base material layer 2; a heat seal layer 3 disposed on one surface side of the base material layer 2; and an antistatic layer 4 disposed between the base material layer 2 and the The side opposite to the side of the heat seal layer 3 side.

FIGS. 2( a ) and ( b ) are schematic plan views and cross-sectional views showing an example of a packaging body using the cover tapes for packaging electronic parts according to the first and second embodiments of the present invention, and FIG. 2( b ) is FIG. 2 (a) sectional view of line AA. As shown in FIGS. 2( a ) and ( b ), the package body 10 includes: a carrier tape 11 having a plurality of accommodating parts 12 for accommodating electronic components 13 ; the electronic components 13 , which are accommodated in the accommodating parts 12 ; and a cover The belt 1 is arranged so as to cover the accommodating portion 12 . The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealed portions 3h are provided in a line with a predetermined width at both ends of the heat-sealed layer 3 of the cover tape 1. Also, in the package body 10 , the carrier tape 11 may have a feed hole 14 .

The structure of the cover tapes of the first embodiment and the second embodiment can be obtained, for example, by the following way, that is, a thin antistatic layer with high antistatic performance is arranged on one surface of the base material, and the antistatic layer is arranged on one surface of the base material. The side opposite to the electrostatic layer side is provided with a heat-sealing layer that contains an antistatic agent and is not easily colored. Hereinafter, each configuration of the cover tapes according to the first embodiment and the second embodiment of the present invention will be described.

I. Antistatic layer The antistatic layer in this invention is arrange|positioned at the surface side opposite to the surface of the heat-sealing layer side of a base material layer, and is used to prevent the layer which covers electrification. By having an antistatic layer, it can prevent static electricity from being in contact with other surfaces, or prevent dirt or dust from adhering to the surface of the cover tape due to static electricity.

The surface resistivity of the surface on the side where the antistatic layer is disposed of the cover tape in the present invention is 1×10 ¹⁰ Ω/□ or less, preferably 1×10 ⁹ Ω/□ or less.

In the present invention, "the surface of the cover tape on which the antistatic layer is disposed" is not particularly limited, but is usually the surface of the antistatic layer. The surface resistivity is a value measured under the following test conditions using Hiresta UP MCP-HT450 manufactured by Mitsubishi Chemical Analytical Technologies.

(Test conditions) ・Probe: UA probe ・Applied voltage: less than 10 ¹⁰ Ω/□ 10 V 10 ¹⁰ to 10 ¹² Ω/□ 500 V 10 ¹³ Ω/□ or more 1000 V ・Measurement point: sample center ・Measured value: Measure 5 points so that the measurement points do not overlap, and use the average value ・Measurement time for one time: Display after 10 seconds ・Sample storage before measurement: at 25°C, 40%RH (Relative Humidity, relative humidity) Storage environment for more than 24 hours ・Measurement environment: 25±2℃, 40±5%RH environment

The surface resistivity of the surface on the side where the antistatic layer is provided on the cover tape is preferably lower than the surface resistivity on the surface on the side where the heat sealing layer is provided. If the surface resistivity of the surface on which the heat sealing layer is arranged is to be lowered, the visibility may be lowered or the heat sealing property may be lowered. In order to suppress static electricity when the cover tape is peeled off in the mounting step, it is important to impart antistatic properties to the entire front and back surfaces of the cover tape. Therefore, by lowering the surface resistivity of the surface on the side where the antistatic layer of the cover tape is arranged, it is possible to suppress a decrease in visibility or a decrease in heat sealability.

The antistatic layer in the present invention is not particularly limited, and examples thereof include a layer containing a conductive polymer and a layer containing a polymer type surfactant. Among them, the following two aspects of the first antistatic layer and the second antistatic layer are preferred. In particular, if it is the following first antistatic layer (layer containing a conductive polymer), the above-mentioned surface resistivity can be obtained even if the thickness is thin, which is preferable. By making the thickness of the antistatic layer thinner, the transmittance of light with an incident angle of 40 degrees of the cover tape can be improved. In addition, by making the thickness of the antistatic layer thinner, the absorptivity of light at an incident angle of 40 degrees of the cover tape can be reduced.

The thickness of the antistatic layer is preferably thinner than that of the heat sealing layer described below. Specifically, it is preferable that the thickness of the heat sealing layer: the thickness of the antistatic layer=1:0.001 to 1:0.5.

(1) First Antistatic Layer The first antistatic layer in the present invention contains a conductive polymer. By having the conductive polymer in the first antistatic layer, the surface resistance of the antistatic layer is reduced. The following second antistatic layer has a strong affinity with water due to the strong affinity of quaternary ammonium salt, so that water molecules are drawn closer to form a film of moisture on the surface of the antistatic layer, thereby reducing the surface resistance. The conductive polymer in the electrostatic layer itself exhibits conductivity. Therefore, even if the thickness of the antistatic layer is thin, it is easy to reduce the surface resistance to 1×10 ¹⁰ Ω/□ or less.

(a) Conductive polymer As a conductive polymer, polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinyl carbazole, etc. are mentioned, for example. Among them, the conductive polymer is preferably polythiophene. As the polythiophene, for example, PEDOT/PSS (poly(3,4-ethylenedioxythiophene/polystyrenesulfonic acid) is preferably used.

(b) Cross-linked resin The first antistatic layer in the present invention has, in addition to the above-mentioned conductive polymer, a cross-linked resin including an acryl amide main chain and a cross-linked structure, and the cross-linked structure preferably has -C ( =O) _OC2H4NH- or _-C (OH) _CH2OC (=O)-. Such a first antistatic layer is formed of an antistatic material containing a conductive polymer, a first crosslinkable acrylic polymer having a carboxylate anion group, and a first polyfunctional curing agent.

The crosslinked structure in the crosslinked resin contained in the first antistatic layer is the crosslinkable functional group (carboxylate anion (-COO-) or other crosslinkable functional group of the following first crosslinkable acrylic polymer) A structure formed by bonding with the first polyfunctional hardener, has -C(=O)OC ₂ H ₄ NH- or -C(OH)CH ₂ OC(=O)-.

(c) Thickness The thickness of the first antistatic layer is a value required for the surface resistivity of the first antistatic layer to satisfy the above-mentioned value, and is, for example, 0.02 μm or more, preferably 0.05 μm or more. On the other hand, from the viewpoint of permeability, it is preferably thin, for example, 0.50 μm or less, preferably 0.25 μm or less.

(2) Second anti-static layer The second anti-static layer has a cross-linked resin comprising an acrylamide main chain, a side chain containing a quaternary ammonium salt, and a cross-linked structure, and the cross-linked structure has -NHC(=O)O-, -NHC(=O) _- or -C(=O) _OC2H4NH- . The second antistatic layer is formed of an antistatic material containing a second crosslinkable acrylic polymer containing a crosslinkable functional group and having a quaternary level and a second polyfunctional hardener. The base of ammonium salt.

(a) Cross-linked resin The second antistatic layer in the present invention has a cross-linked resin as a cross-linked resin, and the cross-linked resin includes an acrylamide main chain, a side chain containing a quaternary ammonium salt, and a cross-linked structure. The quaternary ammonium salt has the function of acting as the hydrophilic part of the surfactant. The quaternary ammonium salt, which is aligned on the surface of the antistatic layer, has a strong affinity with water, so that the water molecules are drawn closer to form moisture on the surface of the antistatic layer. film, thereby reducing the surface resistance.

The quaternary ammonium salt contained in the crosslinked resin may, for example, be represented by the following formula (1). -N ⁺ R ₃ A ^- (1) (in the formula, R are each independently the same or different organic groups) R is preferably an alkyl group with 1 to 6 carbon atoms, considering the surface orientation of the quaternary ammonium salt, more Preferred is an alkyl group having 1 to 2 carbon atoms. The quaternary ammonium salt represented by the above formula (1) is bonded to the acrylyl chain as the main chain via a divalent hydrocarbon group which may contain oxygen and nitrogen. A ^- is any anion. In order to improve the surface hydrophilicity, it is preferably a halogen anion (F ^- , Cl ^- , Br ^- , I ^- ) or a substituted or unsubstituted alkyl sulfate anion with 1 to 6 carbon atoms, In particular, ^Cl- or a substituted or unsubstituted alkyl sulfate anion having 1 to 3 carbon atoms is more preferable.

The above-mentioned divalent hydrocarbon group is preferably -X(CH ₂ ) _n - (in the formula, n is an integer of 1 to 6, and X is an amide group (-C(=O)NH-) or an ester group (-C (=O)O-), the carbon atom of the amide group or the ester group is bonded to the acrylamide chain as the main chain). The content of the quaternary ammonium salt contained in the antistatic layer can be set to a value required to make the surface resistivity of the antistatic layer in the present invention fall within the following numerical ranges.

The cross-linked structure is a structure in which the cross-linkable functional group of the second cross-linkable acrylic polymer and the second polyfunctional hardener are bonded together, and it has -NHC(=O)O-, -NHC(= O) _- or -C(=O) _OC2H4NH- . The second antistatic layer has an acryl chain as a main chain. In this specification, the meaning of an acryl chain is a generalized meaning of an acryl chain and a methacryl chain.

(b) Thickness The thickness of the second antistatic layer is a value required for the surface resistivity of the second antistatic layer to satisfy the above-mentioned value, and is, for example, 0.05 μm or more, preferably 0.1 μm or more. On the other hand, from the viewpoint of permeability, it is preferably thin, for example, 0.5 μm or less, or preferably 0.25 μm or less.

II. Substrate layer The base material layer in the present invention is a layer supporting the above-mentioned antistatic layer or heat sealing layer. As the base material layer, various materials can be applied as long as it has mechanical strength that can withstand external forces during storage and transportation, or heat resistance that can withstand manufacturing and tape packaging. For example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalate Polyesters such as formic acid-cyclohexanedimethanol-ethylene glycol copolymers, polyamides such as nylon 6, nylon 66, and nylon 610, polyolefins such as polyethylene, polypropylene, and polymethylpentene, etc. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are suitable for use in terms of cost and mechanical strength.

The thickness of the base material layer may be, for example, 2.5 μm or more and 300 μm or less, 6 μm or more and 100 μm or less, or 12 μm or more and 50 μm or less. If the thickness of the base material layer is too thick, the rigidity at the time of tape wrapping becomes strong, which is disadvantageous in terms of workability and cost. Moreover, when the thickness of a base material layer is too thin, mechanical strength may become insufficient.

III. Heat sealing layer The heat sealing layer in this invention is arrange|positioned on the surface side of the opposite side to the said antistatic layer of a base material layer. In the heat-sealing layer, when the cover tape of the present invention is used to manufacture a package, the cover tape is bonded to the carrier tape by heat-sealing the carrier tape. Moreover, the heat sealing layer in this invention contains an antistatic agent. By not only disposing an antistatic layer on the side of the base material layer opposite to the heat sealing layer, but also adding an antistatic agent to the heat sealing layer, the antistatic property of the entire cover tape can be further improved.

Although it does not specifically limit as an antistatic agent contained in a heat-sealing layer, It is preferable that it is low in visible light absorption and not only produces coloring. For example, glycerol fatty acid ester, polyglycerol fatty acid ester, sorbitan fatty acid ester, polyoxyethylene alkyl phenyl ether, polyoxyethylene alkylene alkyl ether (for example, polyoxyethylene alkyl ether), polyoxyethylene alkyl Nonionic surfactants such as ethylene glycol fatty acid ester, polyoxyethylene sorbitan fatty acid ester, fatty acid alkanolamide, etc. These can be used individually or in combination of 2 or more types.

In the present invention, the surface resistivity of the surface on the side where the heat sealing layer is disposed of the cover tape is, for example, 1×10 ¹⁰ Ω/□ or more, and preferably 1×10 ¹¹ Ω/□ or more. The reason is that the added amount of the antistatic agent can be reduced, so that the transmittance of light with an incident angle of 40 degrees of the cover tape can be improved. In addition, the reason is that the absorption rate of light having an incident angle of 40 degrees of the cover tape can be lowered. On the other hand, in order to obtain a higher antistatic property of the entire cover tape, the surface resistivity of the surface on the side where the heat seal layer is disposed of the cover tape is 1×10 ¹⁴ Ω/□ or less, preferably 5× 10 ¹³ Ω/□ or less. Furthermore, "the surface on the side of the cover tape on which the heat seal layer is disposed" is usually the surface of the heat seal layer.

The surface resistivity of the heat seal layer is a value measured under the same test conditions as the surface resistivity of the surface on the side where the antistatic layer is disposed as described in the above-mentioned "I. Antistatic layer".

The heat-sealing layer has a thermoplastic resin, and the thermoplastic resin is preferably any one of ethylene-vinyl acetate copolymer, acrylic resin, polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer, or Resins with these main components. Among these, it is preferable to contain an ethylene-vinyl acetate type copolymer. Since the heat-sealing layer contains the ethylene-vinyl acetate-based copolymer, the heat-sealability to the carrier tape becomes favorable. Therefore, accidental peeling during transportation and storage can be suppressed.

In the present invention, the ethylene-vinyl acetate-based copolymer is a copolymer containing at least an ethylene-based monomer unit and a vinyl acetate monomer unit. The vinyl monomer unit refers to the structural unit derived from the vinyl monomer, and the vinyl acetate monomer unit refers to the structural unit derived from the vinyl acetate monomer.

When the heat-sealing layer in the present invention contains an ethylene-vinyl acetate-based copolymer, it is preferable to further contain a polyethylene resin. By blending polyethylene resin, it can maintain good heat-sealing properties, reduce surface tackiness, and suppress deterioration after being placed in a high-humidity-heat environment.

As the polyethylene resin, various polyethylenes such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene can be exemplified. ) and linear low-density polyethylene (LLDPE, density 0.910 to 0.925) are suitable for use due to their superiority in dispersibility.

In addition, in the present invention, the classification of various polyethylenes refers to those defined in old JIS K6748:1995 or JIS K6899-1:2000. The content of the polyethylene resin in the heat seal layer is preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less.

In the heat sealing layer, additives such as adhesion imparting agents, anti-blocking agents, dispersing agents, fillers, plasticizers, colorants, etc. may also be included if necessary.

The thickness of the heat seal layer can be, for example, 0.5 μm or more and 30 μm or less, preferably 1 μm or more and 20 μm or less. When the thickness of the heat-sealing layer is too thin, the sealing property may be poor, and a uniform film may not be obtained. If the thickness of the heat seal layer is too thick, the transparency of the cover tape may be lowered.

Regarding the surface roughness of the heat sealing layer, according to JIS B 0601, the arithmetic mean roughness Ra is, for example, 0.2 μm≦Ra≦1.2 μm, preferably 0.2 μm≦Ra≦0.8 μm, and more preferably 0.2 μm≦Ra≦0.6 μm. Moreover, the maximum height Rz is, for example, 2.0 μm≦Rz≦10 μm, or preferably 2.0 μm≦Rz≦8.0 μm. When the surface roughness of the heat-sealing layer is too large, the transmittance may decrease due to the influence of interface reflection when the incident light is transmitted through the band at an incident angle of 40 degrees.

The arithmetic mean roughness Ra and the maximum height Rz are values measured under the following test conditions using a small surface roughness measuring machine Surftest SJ-210 (manufactured by Mitutoyo Co., Ltd.). (Test conditions) ・Specification JIS B 0602-2001 ・Curve: R ・Filter: Gaussian (GAUSS) ・λc/λs: 0.8/2.5 ・Number of sections: ×5 ・Measurement speed 0.5 mm/s ・A total of 5 points were measured, and the average value was calculated

IV. Cover Tape (1) First Embodiment The transmittance of light with an incident angle of 40 degrees of the cover tape in the first embodiment of the present invention is 80% or more. Among them, 82% or more is preferable. The above transmittance is measured under the following test conditions using UV-Vis-NIR spectrophotometers V-670 and V-670 with variable angle large integrating sphere unit and polarizing element GPH-506 (Japan Optical Co., Ltd.) The value obtained from the transmittance of light incident in a direction inclined by 40 degrees (ie, at an incident angle of 40 degrees) with respect to the vertical direction (incidence angle of 0 degrees) of the surface on the antistatic layer side of the cover tape.

(Test conditions) ・Measurement wavelength range: 380 to 780 nm ・Bandwidth of measurement spectrum: 5.0 nm ・Scanning speed: 400 nm/min ・Measurement wavelength interval: 1.0 nm ・Inner diameter of integrating sphere: 150 mm in diameter ・Light incident angle: transmittance (40°) ・Transmittance (%): Calculate the average value of the measurement wavelength range

Further, in the cover tape in the first embodiment of the present invention, it is preferable that the transmittance of light incident from the vertical direction (incidence angle of 0 degrees) of the surface of the cover tape is 80% or more.

The transmittance of the cover tape is preferably 10% or less, preferably 5% or less, as a deviation (maximum value-minimum value) of transmittance in the measurement wavelength range of 380 to 780 nm. If the deviation is within the above range, the inspection light source (color or wavelength) that matches the type of electronic parts or carrier tape can be selected without being affected by the coloration of the cover tape.

The absorptivity of the light incident at an incident angle of 40° of the cover tape in the first embodiment of the present invention is preferably 10% or less, particularly preferably 5% or less. In addition, the absorption rate of light incident at an incident angle of 0° is preferably 10% or less. The absorptivity at an incident angle of 0° and the absorptivity at an incident angle of 40° are values calculated in the same manner as in the following "(2) Second Embodiment".

(2) Second Embodiment In the second embodiment of the present invention, the cover tape has an absorptivity of 10% or less of light at an incident angle of 40 degrees. Among them, 5% or less is preferable. In addition, the absorption rate of light incident at an incident angle of 0° is preferably 10% or less.

The absorptivity at an incident angle of 0° is a value calculated by the following formula. The reflectance (10°) was measured using the above-mentioned UV-Vis-NIR spectrophotometer V-670, a large-scale integrating sphere unit with variable angle for V-670, and a polarizing element GPH-506 (Nihon Shoko Co., Ltd.) The test conditions) were set as the average value of the reflectance in the above-mentioned measurement wavelength range measured at a light incident angle of 10°. ・Calculated as absorptivity (0°) (%) = 100 - [transmittance (0°)] - [reflectance (10°)]

The absorptivity at an incident angle of 40° is a value calculated by the following formula. The reflectance (40°) is the average value of the reflectance in the above-mentioned measurement wavelength range measured under the above-mentioned (test conditions) with a light incident angle of 40°. ・Calculated as absorptivity (40°) (%) = 100 - [transmittance (40°)] - [reflectance (40°)]

Furthermore, the above-mentioned large-scale integrating sphere unit for V-670 used in the measurement of transmittance and reflectance has a large-scale integrating sphere and a detector (ultraviolet-visible region: photomultiplier tube, near the top of the integrating sphere) Infrared region: PbS (lead sulfide)). As shown in FIG. 4 , the inner surface of the large integrating sphere 40 of the variable-angle large integrating sphere unit for V-670 is spherical, and is provided with a plurality of openings, and a standard white plate 41 (BaSO ₄ ) can be installed in the openings. An entrance opening is provided at the position where the measurement light is irradiated.

When measuring the transmittance at an incident angle of 0°, as shown in the left figure of FIG. 4( a ), a cover tape 1 is set at the position of the entrance opening O of the integrating sphere 40 , and the measurement is performed at an incident angle of 0°. At this time, a standard white plate 41 is provided in openings other than the inlet opening O. As shown in FIG. In the case of measuring the transmittance at an incident angle of 40°, the integrating sphere 40 is rotated around the setting position of the sample (covering tape) from the integrating sphere position at an incident angle of 0° (the left image of Fig. 4(a) ) to measure The transmittance at an incident angle of 40° (the right image of Fig. 4(a)).

In addition, when measuring the reflectance at an incident angle of 10°, as shown in the left figure of FIG. 4(b), the incident light is incident from the entrance opening O ₁₀ with the incident angle of 10°, and is reflected on the cover tape. Determination. At this time, a standard white plate 41 is provided at the inlet opening O ₄₀ . In addition, in the case of measuring the reflectance at the incident angle of 40°, the integrating sphere 40 is rotated from the position of the integrating sphere at the incident angle of 10° (the left image of Fig. 4(b)) with the cover tape set position as the center, and the The measurement was performed by incident light at the entrance opening O ₄₀ with an incident angle of 40°. _At this time, a standard white plate 41 is provided at the inlet opening O10.

(3) Others In the present invention, the cover tape is preferably such that the transmittance of light with an incident angle of 40 degrees is more than 80%, and preferably more than 82%, and the absorptivity of light with an incidence angle of 40 degrees is less than 10%. Preferably it is 5% or less.

V. Other Components (1) Intermediate layer In the present invention, for example, as shown in FIG. 3 , an intermediate layer 5 may be disposed between the base material layer 2 and the heat seal layer 3 as needed. Through the intermediate layer, the adhesion between the base material layer and the heat sealing layer can be improved. In addition, when the cover tape of the present invention is heat-sealed on the carrier tape by the intermediate layer, the cushioning properties can be improved, so that heat can be imparted to the heat-sealing layer more uniformly.

The material of the intermediate layer is appropriately selected according to the material of the base material layer and the heat-sealing layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethanes, polyesters, and the like. The thickness of the intermediate layer can be, for example, 5 μm or more and 50 μm or less.

As the intermediate layer, a film can be used. In this case, it does not specifically limit as a lamination method of a base material layer and an intermediate layer, A well-known method can be used. For example, a method of bonding a pre-manufactured film to the base material layer with an adhesive, or extruding the raw material of the heat-melted film to the base material layer through a T-die or the like can be exemplified to obtain a laminate. method etc. In addition, the adhesive agent is the same as that described in the item of the said heat-sealing layer.

(2) Tackifier layer It is also possible to further have an adhesion promoting layer between the base material layer and the intermediate layer, or between the intermediate layer and the heat sealing layer. By forming the adhesion promoting layer, the adhesion between the substrate layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer can be improved even when the base layer, the intermediate layer or the heat-sealing layer lacks the adhesive force . The tackifier layer is not particularly limited as long as it is appropriately selected according to the materials used for the base material layer, the intermediate layer, and the heat-sealing layer. The tackifying layer can be formed of, for example, a resin having good adhesion such as olefin-based, acrylic-based, isocyanate-based, urethane-based, and ester-based adhesives.

B. Packaging body The package of the present invention includes: a carrier tape having a plurality of accommodating parts for accommodating electronic components; electronic components accommodated in the accommodating parts; and the cover tape arranged to cover the accommodating parts.

In the package of the present invention, the carrier tape may be transparent or opaque, preferably an opaque carrier tape. The reason for this is that the effect of the cover tape with higher transmittance of the present invention can be exerted more remarkably.

In addition, this invention is not limited to the said embodiment. The above-described embodiment is an example, and those having substantially the same structure as the technical idea described in the scope of claims of the present invention and exhibiting the same functions and effects are included in the technical scope of the present invention. [Example]

Hereinafter, an Example and a comparative example are shown, and this invention is demonstrated in detail. (Example 1) As the base material layer, a biaxially stretched polyethylene terephthalate film (FE2002 manufactured by FUTAMURA CHEMICAL, hereinafter referred to as PET film) having a thickness of 25 μm and corona-treated on both sides was prepared. By coating the antistatic composition 1 on one side of the PET film, an antistatic layer with a thickness of less than 1 μm (about 53 nm) was formed. The urethane-based tackifying coating agent (Takenate A-3075/Takelac A-3210 (mass ratio) = 3/1, using 5% dilution with ethyl acetate) to form a tackifying layer.

Next, a polyethylene resin (NOVATEC LC600A, manufactured by Nippon Polyethylene Co., Ltd.) was used to form an intermediate layer with a thickness of 15 μm on the surface side of the PET film on which the tackifying layer was formed by a melt extrusion lamination method. Next, using the heat-sealing composition 1, and by the melt extrusion lamination method, a thickness of 15 μm, an arithmetic mean roughness Ra of the surface of 0.68 μm, and a maximum of A heat-sealing layer with a height of 5.9 μm was formed to make the cover tape 1 . Cover tape 1 contains antistatic layer (53 nm)/substrate layer (25 μm)/adhesion promoting layer/intermediate layer (15 μm)/heat sealing layer (15 μm).

(Example 2) Using the heat-sealing composition 1, and by melt extrusion lamination, a heat-sealing layer with a thickness of 15 μm, an arithmetic mean roughness Ra of the surface of 0.46 μm, and a maximum height of 3.5 μm was formed. In the same manner as in Example 1, the cover tape 2 was produced.

(Example 3) A cover tape 3 was produced by the same method as in Example 1, except that the antistatic composition 2 was coated on one surface side of the PET film to form an antistatic layer with a thickness of less than 1 μm (about 140 nm).

(Comparative Example 1) A cover tape 4 was produced by the same method as in Example 1, except that an antistatic layer was not formed on one surface side of the PET film. The cover tape 4 comprises a substrate layer (25 μm)/an adhesion promoting layer/intermediate layer (15 μm)/a heat sealing layer (15 μm).

(Comparative Example 2) As the base material layer, a biaxially stretched polyethylene terephthalate film (E7415 manufactured by Toyobo Co., Ltd., hereinafter referred to as PET film) having a thickness of 25 μm and an antistatic treatment on one side was prepared. Apply a urethane based tackifying coating agent (Takenate A-3075/Takelac A-3210 (mass ratio) = 3/1, with acetic acid on the opposite side of the PET film to the side that has been antistatically treated ethyl ester for 5% dilution) to form a tackifying layer.

Next, a polyethylene resin (NOVATEC LC600A, manufactured by Nippon Polyethylene Co., Ltd.) was used to form an intermediate layer with a thickness of 30 μm on the surface side of the PET film on which the tackifying layer was formed by a melt extrusion lamination method. Next, by applying the heat-sealing composition 2 to the surface side of the intermediate layer opposite to the tackifying layer side, a heat having a thickness of 2 μm, an arithmetic mean roughness Ra of the surface of 0.64 μm, and a maximum height of 3.5 μm was formed. The sealing layer is formed, thereby making the cover tape 5 . The cover tape 5 comprises an antistatic layer (less than 1 μm)/substrate layer (25 μm)/adhesion promoting layer/intermediate layer (30 μm)/heat sealing layer (2 μm).

(Comparative Example 3) A cover tape 6 was produced by the same method as in Example 1, except that the antistatic composition 1 was applied to one surface side of the PET film to form an antistatic layer with a thickness of 1 μm. The cover tape consists of antistatic layer (1 μm)/substrate layer (25 μm)/adhesion promoting layer/intermediate layer (15 μm)/heat sealing layer (15 μm).

(Antistatic composition 1) The following main ingredients and hardeners were mixed at a dry solid content ratio of 10:3, and ethylene glycol was added as a conductive aid in the same weight as the dry solid content of the above mixture. Then, the antistatic composition 1 whose total solid content concentration was 1.2 mass % was adjusted by diluting solvent 2-propanol and distilled water. ・Main ingredients: Acrylic polymer compound with carboxylate anion in the side chain, and polythiophene-based conductive polymer compound PEDOT/PSS (product name ARACOAT AS-601D, manufactured by Arakawa Chemical Co., Ltd.) ・A hardener: Polyfunctional aziridine-based hardener (product name ARACOAT CL-910, manufactured by Arakawa Chemical Co., Ltd.)

(Antistatic composition 2) The following main ingredient and hardener were mixed at a dry solid content ratio of 10:1, and the antistatic composition 2 having a total solid content concentration of 3.0 mass % was adjusted with methanol as a dilution solvent. ・Main ingredient: An acrylic polymer compound (AKURIT 1SX-1123 (manufactured by Taisei Fine Chemical Co., Ltd.)) containing a quaternary ammonium salt group in the side chain, a carboxyl group, and a (meth)acrylate group. ・Hardener: Polyfunctional aziridine-based hardener, trimethylolpropane-tris(1-aziridine) 1,1,1-propionate (product name: KUMITITE PZ-33 (manufactured by Nippon Shokubai Corporation) ))

(Heat Sealing Composition 1) ・65 parts by mass of ethylene-vinyl acetate copolymer (EVAFLEX EV550, manufactured by Mitsui-Dow Polymer Chemical Co., Ltd.) ・20 parts by mass of low-density polyethylene resin (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.) ・11 parts by mass of hydrogenated petroleum resin (ARKON P-125, manufactured by Arakawa Chemical Co., Ltd.) ・A mixture of 4 parts by mass of a nonionic surfactant (RIKEMASTER ELB-347, manufactured by Riken Vitamin Co., Ltd.).

(Heat Sealing Composition 2) A composition obtained by mixing acrylic adhesive resin (A450A, manufactured by DIC GRAPHICS) and tin oxide (T-1, manufactured by Mitsubishi Materials) as a transparent conductive powder at a dry solid content ratio of 1:3.

(Measurement of Surface Resistivity) The surface of the cover tapes 1 to 6 produced in the above, on which the antistatic layer is arranged (and the surface on which the heat seal is arranged, was measured by the method described in the above "A. Cover tape for electronic parts packaging I. Antistatic layer"). The surface resistivity (surface resistivity of the antistatic layer) and the surface resistivity of the surface on which the heat seal layer is disposed. In addition, the sample size was set to 50 cm x 40 cm. The results are shown in Table 1.

(Measurement of transmittance and absorption rate) The above was measured by the methods described in "A. Cover tape for packaging electronic parts IV. Cover tape (1) transmittance" and "A. Cover tape for electronic parts packaging IV. Cover tape (2) Absorption rate" The transmittance and absorptivity of the cover tapes 1-6 manufactured in China with an incident angle of 0° and an incident angle of 40°. The results are shown in Table 1.

(Production of packaging samples) Package samples were produced under the following tape conditions. While 100 electronic parts (0603 size_container) were continuously arranged in the cavity of the paper carrier tape, the paper carrier tape and the cover tape were heat-sealed using a tape machine NST-35 (Nitto Industries) under the following conditions and coiling, thereby obtaining a roll-shaped package sample.

(tape condition) ・Paper carrier tape: 0.31 mm thick, 8 mm wide virgin paper manufactured by Hokuetsu Corporation ・Paper carrier tape feed hole pitch: 2 mm ・Taping temperature 180℃ ・Taping speed 3500 takt ・Tip size 0.6 mm x 2 wires ・Length of taping pliers (sealing length at 1 production distance) 8±1 mm

(visibility evaluation) About the produced package sample, the visibility of the electronic component via the cover tape was evaluated by the following evaluation method. Evaluation method: For the filled electronic parts, the electronic parts were observed with an optical microscope through the cover tape from the direction at an angle of 0° and 40° with respect to the vertical direction of the surface of the cover tape (lens, HOZAN L-816) , to determine whether the electronic parts can be identified. All 100 wafers are inspected and the yield is calculated.

[Table 1] Surface resistivity [Ω/□] Incidence angle of light is 0 degrees The incident angle of light is 40 degrees visual evaluation Antistatic layer heat seal layer Transmittance [%] Absorption rate[%] Transmittance [%] Absorption rate[%] Transmittance deviation [%] Check angle 0 degrees Check angle 40 degrees Example 1 7.23E+08 3.23E+12 85.5 2.5 81.4 5.4 4.1 100% pass rate Pass rate 87% Example 2 6.45E+08 4.19E+12 85.6 2.6 82.6 4.5 3.9 100% pass rate The pass rate is 96% Example 3 7.52E+09 3.01E+12 84.6 3.1 80.3 7.1 5.3 100% pass rate Pass rate 80% Comparative Example 1 9.87E+13 3.73E+12 86.6 2.0 84.0 3.5 4.7 100% pass rate Pass rate 98% Comparative Example 2 8.79E+11 9.87E+07 83.6 4.6 76.2 10.9 13.9 100% pass rate The pass rate is 41% Comparative Example 3 2.34E+07 3.79E+12 83.7 4.4 76.4 11.3 11.7 100% pass rate The pass rate is 44%

According to Table 1, the cover tape of the present invention is excellent in antistatic performance, and not only has a transmittance of 80% or more for light with an incident angle of 0 degrees, but also has a transmittance of 80% or more for light with an incident angle of 40 degrees. Therefore, it was shown that the deterioration of visibility can be suppressed in the case where observation or camera inspection is performed from an oblique direction with an angle with respect to the surface of the cover tape, not from a vertical direction.

On the other hand, the antistatic performance of the cover tape 2 of the comparative example 1 was poor, and the transmittance of the light with an incident angle of 40 degrees of the cover tape 3 of the comparative example 2 was poor. In Comparative Example 2, since a large number of conductive fine particles were prepared in the heat sealing layer, reflection and scattering of the fine particles and light in the heat sealing layer were promoted, and as a result, the absorptivity became high. In addition, in Comparative Example 3, since the thickness of the antistatic layer was thick, the transmittance decreased, and the visibility was good at an incident angle of 0 degrees, but the visibility was deteriorated at an incident angle of 40 degrees.

1: Cover tape 2: Base material layer 3: Heat sealing layer 3h: Heat sealing part 4: Antistatic layer 5: Intermediate layer 10: Package 11: Carrier tape 12: Storage part 13: Electronic parts 14: Feed hole 40 : Large integrating sphere 41: Standard white board O: Inlet opening O ₁₀ : Inlet opening O ₄₀ : Inlet opening

FIG. 1 is a schematic cross-sectional view illustrating a cover tape for packaging electronic parts according to the present invention. Fig.2 (a), (b) is a schematic plan view and a cross-sectional view which illustrate the package of this invention. FIG. 3 is a schematic cross-sectional view illustrating a cover tape for packaging electronic parts according to the present invention. Figures 4(a) and (b) are schematic cross-sectional views of the inside of the device for explaining the large-scale integrating sphere unit with variable angle for V-670.

1: Cover tape

2: substrate layer

3: Heat sealing layer

4: Anti-static layer

Claims (5)

A cover tape for packaging electronic parts, comprising: a base material layer; a heat seal layer disposed on one surface side of the base material layer; and an antistatic layer disposed between the base material layer and the heat seal layer side and the surface resistivity of the surface on the side where the antistatic layer is arranged is 1×10 ¹⁰ Ω/□ or less, the heat sealing layer contains an antistatic agent, the incident angle of the cover tape for packaging electronic parts The transmittance of light at 40 degrees is more than 80%. A cover tape for packaging electronic parts, comprising: a base material layer; a heat seal layer disposed on one surface side of the base material layer; and an antistatic layer disposed between the base material layer and the heat seal layer side and the surface resistivity of the surface on the side where the antistatic layer is arranged is 1×10 ¹⁰ Ω/□ or less, the heat sealing layer contains an antistatic agent, the incident angle of the cover tape for packaging electronic parts The absorption rate of light at 40 degrees is less than 10%. The cover tape for packaging electronic parts according to claim 1 or 2, wherein the surface resistivity of the surface on the side where the heat sealing layer is disposed is 1×10 ¹⁴ Ω/□ or less. The cover tape for packaging electronic parts according to claim 1 or 2, wherein the thickness of the antistatic layer is thinner than the thickness of the heat sealing layer. A packaging body, which has: A carrier tape, which has a plurality of storage portions for storing electronic components; An electronic component, which is accommodated in the above-mentioned accommodating portion; and The cover tape for electronic component packaging according to claim 1 or 2, which is arranged so as to cover the above-mentioned storage portion.

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