TW202145322A - Sheet peeling method and sheet peeling device including the sheet-abutting step, the adhered object supporting step, and the sheet pulling step - Google Patents

Sheet peeling method and sheet peeling device including the sheet-abutting step, the adhered object supporting step, and the sheet pulling step Download PDF

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TW202145322A
TW202145322A TW110104349A TW110104349A TW202145322A TW 202145322 A TW202145322 A TW 202145322A TW 110104349 A TW110104349 A TW 110104349A TW 110104349 A TW110104349 A TW 110104349A TW 202145322 A TW202145322 A TW 202145322A
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Taiwan
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sheet
adhesive sheet
abutting
adherend
adhesive
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TW110104349A
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山田忠知
毛受利彰
高野健
丸山政徳
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日商琳得科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A sheet peeling method is a method to peel off the adhesive sheet (AS) from the integrated object (UP) of the adhered object (CP) attached to the adhesive sheet (AS), and implement the following steps: a sheet-abutting step to abut the vertices (12C) of the plural convex parts (12A) which are formed on the convex part forming surface (12B) against the adhesive sheet (AS) of the integrated object (UP); a adhered object supporting step to support the adhered object (CP) of the integrated object (UP) with the adhered object supporting means (20), and use the adhered object supporting means (20) and the sheet-abutting means (10) for abutting the vertices (12C) of the plural convex parts (12A) against the adhesive sheet (AS) to sandwich the integrated object (UP); and a sheet pulling step to pull the adhesive sheet (AS) of the sandwiched integrated object (UP) to the convex part forming surface (12B).

Description

薄片剝離方法以及薄片剝離裝置Sheet peeling method and sheet peeling device

本發明有關於薄片剝離方法以及薄片剝離裝置。The present invention relates to a sheet peeling method and a sheet peeling device.

現存已知將使複數凸部的頂點抵接的黏著薄片牽引到凸部形成面，從被黏體貼附於黏著薄片之一體物將該黏著薄片剝離的薄片剝離方法(例如，參照文獻1：日本特開平4-192348號公報)。 在文獻1所記載的膠帶晶片的剝離方法(薄片剝離方法)中，有著將覆蓋於具有複數凸部(凸部)的吸台1之上側面(凸部形成面)的晶圓片5(黏著薄片)牽引到凸部形成面，從晶片6(被黏體)貼附於黏著薄片的一體物將該黏著薄片剝離時，引發被黏體位置偏移這類問題。There is known a sheet peeling method in which an adhesive sheet that abuts the vertices of a plurality of convex portions is pulled to the convex portion forming surface, and the adhesive sheet is peeled off from an object that is adhered to the adhesive sheet (for example, refer to Document 1: Japan Japanese Patent Laid-Open No. 4-192348). In the tape wafer peeling method (sheet peeling method) described in Document 1, there is a wafer 5 (adhesion) to be covered on the upper side surface (convex portion forming surface) of the suction table 1 having a plurality of convex portions (convex portions). When the wafer 6 (adhesive body) is pulled to the convex portion forming surface, and the adhesive sheet is peeled off from the integrated body in which the wafer 6 (adhesive body) is attached to the adhesive sheet, the problem of positional displacement of the adhesive body occurs.

本發明的目地在於：提供可以防止從被黏體貼附於黏著薄片的一體物將黏著薄片剝離時，引發被黏體位置偏移之情形的薄片剝離方法以及薄片剝離裝置。 本發明採用請求項所記載的構造。 依據本發明，由於以被黏體支撐手段來支撐被黏體，並藉由該被黏體支撐手段與使複數凸部的頂點抵接的薄片抵接手段來將一體物夾入，因而可以防止從被黏體貼附於黏著薄片的一體物將黏著薄片剝離時，引發被黏體位置偏移的情形。 另外，若實施氣體供給步驟的話，藉著將黏著薄片牽引到凸部形成面時，在黏著薄片和被黏體支撐手段之間產生負壓，可以抑制黏著薄片被拉往被黏體支撐手段側的情形，從一體物確實地剝離黏著薄片。An object of the present invention is to provide a sheet peeling method and a sheet peeling device that can prevent the position of the adherend from being displaced when the adhesive sheet is peeled off from the integrated object in which the adherend adheres to the adhesive sheet. The present invention adopts the structure described in the claim. According to the present invention, since the adherend is supported by the adherend supporting means, and the integrated body is sandwiched by the adherend supporting means and the sheet abutting means for abutting the apexes of the plurality of convex portions, it is possible to prevent the When the adhesive sheet is peeled off from the integrated object in which the adherend is attached to the adhesive sheet, the position of the adherend is displaced. In addition, when the gas supply step is performed, when the adhesive sheet is pulled to the convex portion forming surface, a negative pressure is generated between the adhesive sheet and the adherend supporting means, so that the adhesive sheet can be suppressed from being pulled toward the adherend supporting means. In the case of , the adhesive sheet is surely peeled off from the one-piece body.

以下，將本發明的一個實施方式根據圖1A至圖2C進行說明。 此外，本實施方式之X軸、Y軸、Z軸，分別位於正交的關係，X軸及Y軸，作為既定平面內的軸，Z軸，作為正交於前述既定平面的軸。並且，在本實施方式中，在將從與Y軸平行之圖1A的近側方向觀看之情況下為基準，且表示方向的情況下，「上」為Z軸的箭頭方向且「下」為其相反方向，「左」為X軸的箭頭方向且「右」為其相反方向，「前」為與Y軸平行的圖1A中近側方向且「後」為其相反方向。 本發明的薄片剝離裝置EA是將黏著薄片AS從作為被黏體的晶片CP貼附於黏著薄片AS之一體物UP剝離的裝置，具備：薄片抵接手段10，具有形成複數凸部12A的凸部形成面12B；被黏體支撐手段20，支撐一體物UP之晶片CP，並與藉由使複數凸部12A的頂點12C抵接於黏著薄片AS的薄片抵接手段10來將一體物UP夾入；薄片牽引手段30，將夾入的一體物UP之黏著薄片AS牽引到凸部形成面12B；以及氣體供給手段40，以薄片抵接手段10和被黏體支撐手段20來將一體物UP夾入時，在黏著薄片AS和被黏體支撐手段20之間供給空氣及氣體等的氣體，配置於將張力施加於黏著薄片AS，將複數晶片CP的相互間隔加大之分離手段50的附近。 薄片抵接手段10，具備：線性馬達11，作為驅動機器；以及保持構件12，受到線性馬達11的未圖示之滑動件支撐。 保持構件12，具備：凸部形成面12B；環狀的槽部12D，將凸部形成面12B區隔於內側；以及環狀的密封部12E，被區隔於槽部12D的外側，以密封材、海棉、橡膠、樹脂等的密封構件所形成。凸部形成面12B之凸部12A，配置成格子圖案，並且其前端為平面。 被黏體支撐手段20具備支撐盤21，該支撐盤21受到線性馬達11的未圖示之滑動件支撐，且具有可藉由真空泵及真空抽氣器等的未圖示之減壓手段吸持的支撐面21A。 支撐盤21的大小，在俯視比凸部形成面12B的內徑更小。 薄片牽引手段30，具備：減壓手段31，是真空泵及真空抽氣器等；以及吸引孔32，設置於保持構件12，經由配管31A將減壓手段31和槽部12D連通。 氣體供給手段40，具備連接於增壓泵及渦輪等未圖示之加壓手段的噴嘴41。 分離手段50，具備：複數直線型馬達51，作為驅動機器；以及把持手段52，是受到各直線型馬達51的輸出軸51A支撐，且將黏著薄片AS的端部予以把持的機械式夾盤及吸盤圓筒等。 說明以上的薄片剝離裝置EA的動作。 首先，當該薄片剝離裝置EA的使用者(以下，簡稱為「使用者」)，或多關節機械人及帶式輸送機等的未圖示之搬運手段，對於各構件配置於在圖1A表示的初期位置的薄片剝離裝置EA，將貼附半導體晶圓(以下，也簡稱為「晶圓」)WF的黏著薄片AS搬運至保持構件12和支撐盤21之間的既定位置時，分離手段50驅動直線型馬達51及把持手段52，以把持手段52將黏著薄片AS予以把持。此外，晶圓WF，以雷射照射裝置及藥液施加裝置等的脆弱化手段在晶圓WF物理性或化學性形成脆弱層，或以切割刀等的切斷手段將晶圓WF半切斷來形成凹槽及缺口，成為可分割成複數晶片CP的狀態。接下來，分離手段50驅動直線型馬達51，如圖1A中以雙虛鏈線表示般，藉著將張力施加於黏著薄片AS而將晶圓WF分割成複數晶片CP，形成晶片CP貼附於黏著薄片AS的一體物UP，並且將該複數晶片CP的相互間隔加大(分離步驟)。 其後，薄片抵接手段10及被黏體支撐手段20驅動線性馬達11，如圖2A所示般，使保持構件12和支撐盤21接近，使複數凸部12A的頂點12C抵接於一體物UP的黏著薄片AS(薄片抵接步驟)，並且以保持構件12和支撐盤21將一體物UP夾入，以支撐面21A支撐晶片CP(被黏體支撐步驟)。此時，晶片CP，如圖1B中以雙虛鏈線表示般，藉由凸部12A的頂點12C以複數點(在本實施方式中為3點)來支撐。 接著，薄片牽引手段30驅動減壓手段31，將在黏著薄片AS和凸部形成面12B之間形成的空間予以減壓且開始以凸部形成面12B來吸持黏著薄片AS，如圖2B所示般，將黏著薄片AS牽引到凸部形成面12B(薄片牽引步驟)。藉此，黏著薄片AS跟隨凸部形成面12B的凹凸而變形，從晶片CP被部分剝離。 而且，被黏體支撐手段20驅動未圖示的減壓手段，開始以支撐面21A之晶片CP的吸持後，氣體供給手段40驅動未圖示的加壓手段，如圖2B以箭頭表示般，在跟隨凸部形成面12B的凹凸的黏著薄片AS和支撐面21A之間供給氣體(氣體供給步驟)。藉此，在薄片牽引步驟將黏著薄片AS牽引到凸部形成面12B時，藉著在黏著薄片AS和支撐面21A之間產生負壓，抑制黏著薄片AS被拉往支撐面21A側的情形，維持黏著薄片AS從晶片CP剝離的狀態。 接下來，被黏體支撐手段20驅動線性馬達11，如圖2C所示般，使支撐盤21復歸於初期位置後，將未圖示之減壓手段的驅動停止，解除以支撐面21A之晶片CP的吸持。其後，黏著薄片AS被剝離的晶片CP，為了製造具備該晶片CP的半導體裝置，所以藉由使用者或未圖示的搬運手段而從支撐面21A搬運，且積層於未圖示的引線框架及基板等(積層步驟)。 接著，薄片牽引手段30將減壓手段31的驅動停止，解除以凸部形成面12B吸持黏著薄片AS後，薄片抵接手段10驅動線性馬達11，使保持構件12復歸於初期位置。而且，當分離手段50驅動把持手段52，解除以把持手段52的黏著薄片AS的把持時，使用者或未圖示的搬運手段，將已剝離晶片CP的黏著薄片AS回收於箱及袋等的未圖示之回收手段(回收步驟)，以後重覆上述同樣的步驟。 依據如上述般的實施方式，由於以被黏體支撐手段20來支撐晶片CP，並藉由該被黏體支撐手段20與使複數凸部12A的頂點12C抵接的薄片抵接手段10來將一體物UP夾入，因而可以防止將黏著薄片AS從晶片CP貼附於黏著薄片AS的一體物UP剝離時，引發晶片CP位置偏移的情形。 如上述般，用於實施本發明的最佳構成、方法等，雖於前述記載中揭示，但本發明未限定於此。換言之，本發明，雖有關於主要特定的實施方式特別加以圖示，且進行說明，但對於不偏離本發明的技術思想及目地範圍，且以上所述的實施方式，在形狀、材質、數量、其他詳細的構成中，本領域技術人員可以施加各種變形。另外，上述所揭示之限定形狀、材質等的記載，是為了容易理解本發明所例示性記載之敘述，由於並非用來限定本發明，因而以那些形狀、材質等之限定的一部分或移除全部限定之構件的名稱的記載，被包含在本發明。 例如，薄片抵接手段10，也可以藉獨立於被黏體支撐手段20的驅動機器來使保持構件12移動，也可以一邊不使保持構件12移動地或使其移動，一邊使分離手段50移動來使複數凸部12A的頂點12C抵接於黏著薄片AS。 被黏體支撐手段20，可以藉獨立於薄片抵接手段10的驅動機器來使支撐盤21移動，也可以一邊不使保持構件12移動地或使其移動，一邊使支撐盤21及分離手段50移動，以與薄片抵接手段10將一體物UP夾入來支撐晶片CP，或者不使支撐盤21移動地且使保持構件12及分離手段50移動，以與薄片抵接手段10將一體物UP夾入來支撐晶片CP。 薄片牽引手段30，可以藉庫倫力、磁力、伯努利吸附等將黏著薄片AS牽引到凸部形成面12B，取代或併用將黏著薄片AS和凸部形成面12B之間的空間予以減壓而將黏著薄片AS牽引到凸部形成面12B的方式，也可以藉著從支撐面21A往黏著薄片AS噴附氣體，將黏著薄片AS牽引到凸部形成面12B，或以線圈加熱器及熱導管等之加熱側等的加熱手段來將黏著薄片AS加熱，或以帕耳帖元件及熱導管的冷卻側等的冷卻手段來將黏著薄片AS冷卻。 也可以在本發明的薄片剝離裝置EA設置氣體供給手段40，或不設置。 分離手段50，可以預先將分割的複數晶片CP的相互間隔加大，於黏著薄片AS，例如，可以朝上下方向施加張力；或者朝右方、左方、前方及後方的4方向，右方及左方的2方向，左前方、左後方及右方的3方向，或包含前後左右方向的成分之5方向以上施加張力，以加大晶片CP的相互間隔，可以藉由多關節機械人等的驅動機器，使分離手段50和支撐盤21相對移動來將張力施加於黏著薄片AS，藉此加大晶片CP的相互間隔，也可以在使用經由黏著薄片AS來與晶圓WF或晶片CP成為一體化的環狀框架等之框架構件的情況下，以分離手段50來支撐框架構件，使分離手段50和支撐盤21相對移動來將張力施加於黏著薄片AS，藉此加大晶片CP的相互間隔。 分離手段50，也可以設置在本發明的薄片剝離裝置EA，或不設置，在不設置的情況下，使用預先複數晶片CP在互相加大間隔的狀態貼附於黏著薄片AS的一體物UP即可。 薄片剝離裝置EA，可以設有將黏著薄片AS以壓輥等的押壓手段貼附於晶圓WF或晶片CP的貼附手段，或設有將晶圓WF研削來減少該晶圓WF的厚度的研削手段，也可以設有將晶圓WF或晶片CP與框架構件經由黏著薄片AS成為一體化的一體化手段。 框架構件，除了環狀框架以外，也可以是非環狀(外周未相連接)構件，或圓形、橢圓形、多角形、其他的形狀。 積層步驟及回收步驟，也可以實施或不實施。 本發明之手段及步驟，只要可以完成針對那些手段及步驟進行說明的動作、功能或步驟則無任何限定，更何況，完全不限定於在前述實施方式揭示的單純一個實施方式的構成物及步驟。例如，薄片抵接步驟，只要是使具有形成複數凸部之凸部形成面的薄片抵接手段之該複數凸部的頂點，抵接於一體物之黏著薄片的步驟的話，對照申請當初的技術常識，只要是其技術範圍內的話無任何限定(其他的手段及步驟也相同)。 黏著薄片AS及被黏體的材質、種別、形狀等，未特別限定。例如，黏著薄片AS及被黏體，也可以是圓形、橢圓形、三角形及四角形等的多角形、其他的形狀，黏著薄片AS也可以是壓敏接著性、熱敏接著性等的接著形態。另外，如此般的黏著薄片AS，例如，也可以是僅接著劑層的單層的薄片、在基材和接著劑層之間具有中間層的薄片、在基材的上側面具有覆蓋層等3層以上的薄片、甚至是可以將基材從接著劑層剝離的所謂雙面黏著薄片般的薄片，雙面黏著薄片也可以是具有單層或複層的中間層的薄片，及無中間層的單層或複層的薄片。另外，就被黏體而言，例如，可以是食品、樹脂容器、矽半導體晶圓及化合物半導體晶圓等的半導體晶圓、回路基板、光碟等的資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等的單質物，也可以是以那些兩個以上形成的複合物，任意形態的構件及物品等也可以作為對象。此外，黏著薄片AS，也可以換成功能性、用途性的讀法，例如，資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、固晶膜、固晶膠帶、記錄層形成樹脂薄片等的任意薄片、薄膜、膠帶等。 前述實施方式之驅動機器，不但可以採用轉動馬達、直線型馬達、線性馬達、單軸機械人、具備2軸或3軸以上關節的多關節機械人等的電動機器、氣缸、油壓缸、無桿氣缸及旋轉氣缸等的致動器等，還可以採用將這些直接地或間接地組合的機器。 在前述實施方式中，採用壓輥及壓頭等的押壓手段及押壓構件這類將被押壓物進行押壓之構件的情況下，也可以採用輥、圓棒、片材、橡膠、樹脂、海棉等的構件，以取代或併用在上述所例示的構件，或採用藉由空氣及氣體等的氣體之噴附進行押壓的構造，也可以將押壓的構件以橡膠及樹脂等可變形的構件來構成，也可以由不變形的構件來構成，採用支撐(保持)手段及支撐(保持)構件等的支撐(保持)被支撐構件(被保持構件)之構件的情況下，也可採用以機械式夾盤及吸盤圓筒等的把持手段、庫倫力、接著劑(接著薄片、接著膠帶)、黏著劑(黏著薄片、黏著膠帶)、磁力、伯努利吸附、吸引吸附、驅動機器等來支撐(保持)被支撐構件的構成，採用切斷手段及切斷構件等將被切斷構件切斷，或在被切斷構件形成切痕及切斷線的情況下，也可以採用藉切割刀、雷射切割器、離子束、火力、熱、水壓、電熱線、氣體及液體等的噴附等來進行切斷的構件，以取代或併用在上述所例示的構件，或以將適當的驅動機器組合而成的構件來使進行切斷的構件移動且進行切斷。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1A to 2C . In addition, the X-axis, Y-axis, and Z-axis of this embodiment are in an orthogonal relationship, respectively. The X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis that is orthogonal to the predetermined plane. In addition, in the present embodiment, when viewed from the proximal direction of FIG. 1A parallel to the Y-axis as a reference, and when indicating directions, "up" is the arrow direction of the Z-axis and "down" is The opposite directions, "left" is the arrow direction of the X-axis and "right" is the opposite direction, "front" is the proximal direction in Fig. 1A parallel to the Y-axis and "rear" is the opposite direction. The sheet peeling apparatus EA of the present invention is an apparatus for peeling off the adhesive sheet AS from the wafer CP, which is an adherend, to an object UP, which is one of the adhesive sheets AS, and includes sheet contact means 10 having protrusions forming a plurality of protrusions 12A. The part forming surface 12B; the adherend supporting means 20 supports the wafer CP of the unitary body UP, and clamps the unitary body UP with the sheet abutting means 10 that abuts the vertices 12C of the plurality of convex portions 12A against the adhesive sheet AS The sheet pulling means 30 pulls the adhesive sheet AS of the sandwiched integrated body UP to the convex portion forming surface 12B; During sandwiching, a gas such as air or gas is supplied between the adhesive sheet AS and the adherend supporting means 20, and it is arranged in the vicinity of the separation means 50 that applies tension to the adhesive sheet AS and increases the mutual interval of the plurality of wafers CP. . The sheet contacting means 10 includes a linear motor 11 as a driving device, and a holding member 12 supported by a slider (not shown) of the linear motor 11 . The holding member 12 includes a convex portion forming surface 12B, an annular groove portion 12D partitioning the convex portion forming surface 12B inside, and an annular sealing portion 12E partitioned outside the groove portion 12D to seal It is formed of sealing members such as materials, sponges, rubbers, resins, etc. The convex part 12A of the convex part formation surface 12B is arrange|positioned in a lattice pattern, and the front end is a flat surface. The adherend support means 20 includes a support plate 21, which is supported by a sliding member (not shown in the figure) of the linear motor 11, and has a decompression means (not shown in the figure) that can be sucked by a vacuum pump and a vacuum evacuation device. The support surface 21A. The size of the support plate 21 is smaller than the inner diameter of the convex portion forming surface 12B in plan view. The sheet pulling means 30 includes a decompression means 31 such as a vacuum pump, a vacuum evacuation device, and the like, and a suction hole 32 provided in the holding member 12 to communicate the decompression means 31 and the groove portion 12D via a pipe 31A. The gas supply means 40 includes a nozzle 41 connected to a pressurizing means not shown, such as a booster pump and a turbine. The separating means 50 is provided with a plurality of linear motors 51 as a driving device, and a holding means 52 is supported by the output shaft 51A of each linear motor 51 and is a mechanical chuck for holding the end of the adhesive sheet AS and Suction cup cylinder, etc. The operation of the above-described sheet peeling device EA will be described. First, when a user of the sheet peeling device EA (hereinafter, simply referred to as a "user"), or a conveying means such as a multi-joint robot and a belt conveyor, which is not shown in the figure, arranges each member as shown in FIG. 1A . When the sheet peeling device EA at the initial position of the device conveys the adhesive sheet AS to which the semiconductor wafer (hereinafter, also simply referred to as "wafer") WF is attached to a predetermined position between the holding member 12 and the support plate 21, the separation means 50 The linear motor 51 and the holding means 52 are driven, and the adhesive sheet AS is held by the holding means 52 . In addition, in the wafer WF, a fragile layer is physically or chemically formed on the wafer WF by a weakening means such as a laser irradiation device and a chemical solution application device, or the wafer WF is half-cut by a cutting means such as a dicing blade. Grooves and notches are formed, and it is in a state capable of being divided into a plurality of wafers CP. Next, the separation means 50 drives the linear motor 51, as indicated by the double-dashed chain line in FIG. 1A, by applying tension to the adhesive sheet AS to divide the wafer WF into a plurality of wafers CP, so that the wafer CP is attached to the The integrated body UP of the sheets AS is adhered, and the mutual interval of the plurality of wafers CP is increased (separation step). After that, the sheet contacting means 10 and the adherend supporting means 20 drive the linear motor 11 to bring the holding member 12 and the support plate 21 close to each other, as shown in FIG. 2A , so that the vertices 12C of the plurality of convex portions 12A are brought into contact with the integrated object. The sheet AS of the UP is adhered (sheet abutting step), and the integrated body UP is sandwiched by the holding member 12 and the support plate 21, and the wafer CP is supported by the support surface 21A (the adhered body supporting step). At this time, the wafer CP is supported by a plurality of points (three points in the present embodiment) by the vertexes 12C of the convex portions 12A, as indicated by the double-dashed line in FIG. 1B . Next, the sheet pulling means 30 drives the decompression means 31 to decompress the space formed between the adhesive sheet AS and the convex portion forming surface 12B and starts to suck the adhesive sheet AS with the convex portion forming surface 12B, as shown in FIG. 2B . As shown, the adhesive sheet AS is pulled to the convex portion forming surface 12B (sheet pulling step). Thereby, the adhesive sheet AS deforms following the unevenness of the convex portion forming surface 12B, and is partially peeled off from the wafer CP. Then, the pressure reducing means not shown is driven by the adherend support means 20 to start holding the wafer CP on the support surface 21A, and the gas supply means 40 drives the pressure means not shown, as indicated by arrows in FIG. 2B . , gas is supplied between the adhesive sheet AS following the unevenness of the convex portion forming surface 12B and the support surface 21A (gas supply step). Thereby, when the adhesive sheet AS is pulled to the convex portion forming surface 12B in the sheet pulling step, negative pressure is generated between the adhesive sheet AS and the support surface 21A, so that the adhesive sheet AS is prevented from being pulled toward the support surface 21A side. The state in which the adhesive sheet AS is peeled off from the wafer CP is maintained. Next, the adherend support means 20 drives the linear motor 11 to return the support plate 21 to the initial position as shown in FIG. 2C , then stops the driving of the decompression means (not shown), and releases the wafer on the support surface 21A. Suspension of CP. Thereafter, the wafer CP from which the adhesive sheet AS has been peeled off is transported from the support surface 21A by a user or a transport means not shown in order to manufacture a semiconductor device including the wafer CP, and is laminated on a lead frame not shown. and substrates, etc. (lamination step). Next, the sheet pulling means 30 stops the driving of the decompression means 31 and releases the holding of the adhesive sheet AS by the convex portion forming surface 12B, and then the sheet contact means 10 drives the linear motor 11 to return the holding member 12 to the initial position. Then, when the separation means 50 drives the holding means 52 to release the holding of the adhesive sheet AS by the holding means 52, the user or the conveying means not shown collects the adhesive sheet AS from which the wafer CP has been peeled off in a box, a bag, or the like. For the recovery means (recovery step) not shown, the same steps as described above are repeated thereafter. According to the above-described embodiment, since the wafer CP is supported by the adherend supporting means 20, and the wafer CP is supported by the adherend supporting means 20 and the sheet abutting means 10 that abut the vertices 12C of the plurality of convex portions 12A Since the integrated object UP is sandwiched, it is possible to prevent the wafer CP from being displaced when the adhesive sheet AS is peeled off from the integrated object UP in which the adhesive sheet AS is attached to the wafer CP. As described above, the best configuration, method, etc. for carrying out the present invention are disclosed in the foregoing description, but the present invention is not limited thereto. In other words, in the present invention, the main specific embodiments are particularly illustrated and described, but the above-described embodiments do not deviate from the technical idea and purpose of the present invention in terms of shapes, materials, numbers, In other detailed configurations, various modifications can be made by those skilled in the art. In addition, the descriptions of the limited shapes, materials, etc. disclosed above are for easy understanding of the illustrative descriptions of the present invention. Since they are not intended to limit the present invention, a part or all of the limitations of those shapes, materials, etc. are removed. The description of the name of the limited member is included in the present invention. For example, in the sheet contacting means 10, the holding member 12 may be moved by a drive device independent of the adherend supporting means 20, or the separating means 50 may be moved without moving the holding member 12 or by moving the holding member 12. The vertexes 12C of the plurality of convex portions 12A are brought into contact with the adhesive sheet AS. In the adherend support means 20, the support plate 21 may be moved by a drive device independent of the sheet contact means 10, or the support plate 21 and the separation means 50 may be moved without moving the holding member 12 or by moving the support plate 21. The wafer CP is supported by sandwiching the integrated body UP with the sheet abutting means 10 , or the holding member 12 and the separating means 50 are moved without moving the support tray 21 to move the integrated body UP with the sheet contacting means 10 . It is sandwiched to support the wafer CP. The sheet pulling means 30 can pull the adhesive sheet AS to the convex portion forming surface 12B by Coulomb force, magnetic force, Bernoulli adsorption, etc., instead of or in combination with decompressing the space between the adhesive sheet AS and the convex portion forming surface 12B. The method of pulling the adhesive sheet AS to the convex portion forming surface 12B can also be performed by spraying gas from the support surface 21A to the adhesive sheet AS to draw the adhesive sheet AS to the convex portion forming surface 12B, or using a coil heater and a heat pipe. The adhesive sheet AS is heated by heating means such as the heating side or the like, or the adhesive sheet AS is cooled by cooling means such as the cooling side of the Peltier element and the heat pipe. The gas supply means 40 may be provided in the sheet peeling apparatus EA of the present invention, or may not be provided. The separation means 50 may increase the distance between the plurality of divided wafers CP in advance, and may apply tension to the adhesive sheet AS, for example, in the up-down direction; 2 directions on the left, 3 directions on the left front, rear left, and right, or more than 5 directions including the components in the front, back, left, and right directions. To increase the distance between the wafers CP, it is possible to use a multi-joint robot or the like. The machine is driven to relatively move the separating means 50 and the support plate 21 to apply tension to the adhesive sheet AS, thereby increasing the mutual spacing of the wafers CP, and it is also possible to integrate the wafer WF or the wafer CP through the adhesive sheet AS. In the case of a frame member such as a ring-shaped frame, the separation means 50 is used to support the frame member, and the separation means 50 and the support plate 21 are relatively moved to apply tension to the adhesive sheet AS, thereby increasing the distance between the wafers CP. . The separation means 50 may be provided in the sheet peeling device EA of the present invention, or it may not be provided. In the case of not being provided, a plurality of wafers CP are used in advance and are adhered to the integrated body UP of the adhesive sheet AS in a state of increasing the distance from each other. Can. The sheet peeling device EA may be provided with a sticking means for sticking the adhesive sheet AS on the wafer WF or the wafer CP by pressing means such as a press roll, or may be provided with grinding the wafer WF to reduce the thickness of the wafer WF The grinding means may also be provided with an integrated means for integrating the wafer WF or the wafer CP and the frame member via the adhesive sheet AS. In addition to the annular frame, the frame member may be a non-annular (outer periphery not connected) member, or a circular, elliptical, polygonal, or other shape. The lamination step and the recovery step may or may not be performed. The means and steps of the present invention are not limited at all as long as the actions, functions, or steps described with respect to those means and steps can be accomplished, and moreover, they are not limited to the components and steps of a single embodiment disclosed in the foregoing embodiment at all. . For example, as long as the sheet abutting step is a step of abutting the apexes of the plurality of convex portions of the sheet contact means having the convex portion forming surface forming the plurality of convex portions with the adhesive sheet of the integrated body, the technique of the original application can be compared Common sense is not limited at all as long as it is within the technical scope (other means and steps are also the same). The material, type, shape, etc. of the adhesive sheet AS and the adherend are not particularly limited. For example, the adhesive sheet AS and the to-be-adhered body may have polygonal shapes such as circles, ellipses, triangles, and squares, and other shapes, and the adhesive sheet AS may have adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. . In addition, such an adhesive sheet AS may be, for example, a single-layer sheet having only an adhesive layer, a sheet having an intermediate layer between the substrate and the adhesive layer, or a cover layer on the upper side of the substrate. A sheet with more than one layer, or even a sheet like a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. Single-layer or multi-layer flakes. In addition, the adherend may be, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, etc. A simple substance such as a wood board or a resin may be a composite of two or more of those, and members and articles of any form may also be targeted. In addition, the adhesive sheet AS can also be replaced with functional and useful readings, such as labels for information recording, labels for decoration, protective sheets, dicing tapes, die-bonding films, die-bonding tapes, recording layer forming resin sheets, etc. Any sheet, film, tape, etc. The driving machine of the above-mentioned embodiment can be used not only electric machines such as rotary motors, linear motors, linear motors, single-axis robots, and multi-joint robots with joints of two or more axes, air cylinders, hydraulic cylinders, etc. Actuators such as rod air cylinders and rotary air cylinders, etc. can also be used in combination with these directly or indirectly. In the above-mentioned embodiment, when pressing means such as pressing rollers and pressing heads, and pressing members such as pressing members are used to press the object to be pressed, rollers, round bars, sheets, rubber, etc. may also be used. Resin, sponge, etc., can be used in place of or in combination with the members exemplified above, or a structure in which pressing is performed by spraying gas such as air or gas, or rubber, resin, etc. It may be composed of a deformable member or a non-deformable member. In the case of a member that supports (holds) the supported member (the member to be held), such as a supporting (holding) means and a supporting (holding) member, the Holding means such as mechanical chucks and suction cup cylinders, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive A structure in which a machine or the like supports (holds) the supported member, and the member to be cut is cut by means of cutting means, cutting members, etc., or when the member to be cut forms a notch and a cutting line, it is also possible to use A member that is cut by means of a dicing knife, a laser cutter, an ion beam, thermal power, heat, water pressure, electric heating wire, gas and liquid spray, etc., in place of or in combination with the members exemplified above, or with A member formed by combining an appropriate drive machine moves and cuts the member to be cut.

5:晶圓片 6:晶片(被黏體) 10:薄片抵接手段 11:線性馬達 12:保持構件 12A:凸部 12B:凸部形成面 12C:凸部的頂點 12D:槽部 12E:密封部 20:被黏體支撐手段 21:支撐盤 21A:支撐面 30:薄片牽引手段 31:減壓手段 31A:配管 32:吸引孔 40:氣體供給手段 41:噴嘴 50:分離手段 51:直線型馬達 51A:輸出軸 52:把持手段 AS:黏著薄片 CP:晶片 EA:薄片剝離裝置 WF:晶圓 UP:一體物5: Wafer 6: Wafer (bonded body) 10: Sheet abutting means 11: Linear motor 12: Hold Components 12A: convex part 12B: convex part forming surface 12C: Vertex of the convex part 12D: Groove 12E: Sealing part 20: Supported by the sticky body 21: Support plate 21A: Support surface 30: Sheet pulling means 31: Decompression means 31A: Piping 32: Attraction holes 40: Gas supply means 41: Nozzle 50: Separation Means 51: Linear motor 51A: output shaft 52: Holding Means AS: Adhesive Sheet CP: Wafer EA: Flake peeling device WF: Wafer UP: One thing

[圖1A]是實施本發明之一個實施方式所涉及的薄片剝離方法之薄片剝離裝置的說明圖。 [圖1B]是實施本發明之一個實施方式所涉及的薄片剝離方法之薄片剝離裝置的說明圖。 [圖2A]是薄片剝離方法的說明圖。 [圖2B]是薄片剝離方法的說明圖。 [圖2C]是薄片剝離方法的說明圖。It is explanatory drawing of the sheet peeling apparatus which implements the sheet peeling method which concerns on one Embodiment of this invention. 1B is an explanatory diagram of a sheet peeling apparatus that implements the sheet peeling method according to one embodiment of the present invention. [ Fig. 2A ] An explanatory diagram of a sheet peeling method. [ Fig. 2B ] An explanatory diagram of a sheet peeling method. [ Fig. 2C ] An explanatory diagram of a sheet peeling method.

10:薄片抵接手段 10: Sheet abutting means

11:線性馬達 11: Linear motor

12:保持構件 12: Hold Components

12A:凸部 12A: convex part

12B:凸部形成面 12B: convex part forming surface

12C:凸部的頂點 12C: Vertex of the convex part

12D:槽部 12D: Groove

12E:密封部 12E: Sealing part

20:被黏體支撐手段 20: Supported by the sticky body

21:支撐盤 21: Support plate

21A:支撐面 21A: Support surface

30:薄片牽引手段 30: Sheet pulling means

31:減壓手段 31: Decompression means

31A:配管 31A: Piping

32:吸引孔 32: Attraction holes

40:氣體供給手段 40: Gas supply means

41:噴嘴 41: Nozzle

50:分離手段 50: Separation Means

51:直線型馬達 51: Linear motor

51A:輸出軸 51A: output shaft

52:把持手段 52: Holding Means

AS:黏著薄片 AS: Adhesive Sheet

CP:晶片 CP: Wafer

EA:薄片剝離裝置 EA: Flake peeling device

WF:晶圓 WF: Wafer

UP:一體物 UP: One thing

Claims (3)

一種薄片剝離方法，是從被黏體貼附於黏著薄片之一體物將該黏著薄片剝離的薄片剝離方法，其特徵為： 實施以下步驟： 使具有形成複數凸部之凸部形成面的薄片抵接手段之該複數凸部的頂點，抵接於前述一體物之前述黏著薄片的薄片抵接步驟； 以被黏體支撐手段來支撐前述一體物之前述被黏體，並藉由該被黏體支撐手段與使前述複數凸部的頂點抵接於前述黏著薄片的前述薄片抵接手段來將前述一體物夾入的被黏體支撐步驟；以及 將夾入的前述一體物之前述黏著薄片牽引到前述凸部形成面的薄片牽引步驟。A sheet peeling method, which is a sheet peeling method for peeling off the adhesive sheet from a body that is adhered to the adhesive sheet, characterized in that: Implement the following steps: A sheet abutting step of making the apexes of the plurality of convex portions of the sheet abutting means having the convex portion forming surface forming the plurality of convex portions abut against the aforementioned adhesive sheet of the aforementioned integrated body; The adherend of the integrated body is supported by the adherend supporting means, and the integrated body is held by the adherend supporting means and the sheet abutting means for making the apexes of the plurality of convex portions abut against the adhesive sheet. an adherent support step for sandwiching; and The sheet pulling step of pulling the above-mentioned adhesive sheet of the sandwiched integral body to the above-mentioned convex portion forming surface. 如請求項1的薄片剝離方法，其中， 實施以前述薄片抵接手段和前述被黏體支撐手段來將前述一體物夾入時，在前述黏著薄片和前述被黏體支撐手段之間供給氣體的氣體供給步驟。The sheet peeling method of claim 1, wherein, A gas supply step of supplying a gas between the adhesive sheet and the adherend supporting means when the integrated body is sandwiched by the sheet contacting means and the adherend supporting means is performed. 一種薄片剝離裝置，是從被黏體貼附於黏著薄片之一體物將該黏著薄片剝離的薄片剝離裝置，其特徵為： 具備： 薄片抵接手段，具有形成複數凸部的凸部形成面； 被黏體支撐手段，支撐前述一體物之前述被黏體，並與藉由使前述複數凸部的頂點抵接於前述黏著薄片的前述薄片抵接手段來將前述一體物夾入；以及 薄片牽引手段，將夾入的前述一體物之前述黏著薄片牽引到前述凸部形成面。A sheet peeling device is a sheet peeling device for peeling off the adhesive sheet from an object that is adhered to an adhesive sheet, characterized by: have: a sheet contacting means having a convex portion forming surface on which a plurality of convex portions are formed; an adherend supporting means for supporting the adherend of the one-piece body and sandwiching the one-piece body with the sheet abutting means for abutting the apexes of the plurality of convex portions against the adhesive sheet; and The sheet pulling means pulls the sandwiched adhesive sheet of the integrated body to the convex portion forming surface.
TW110104349A 2020-02-25 2021-02-05 Sheet peeling method and sheet peeling device including the sheet-abutting step, the adhered object supporting step, and the sheet pulling step TW202145322A (en)

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