TW202142101A - Substrate processing device, jig, calibration method for substrate processing device, and method for manufacturing semiconductor device - Google Patents

Abstract

Provided is an invention that has: a processing container in which a substrate is processed; a port that, inside the processing container, forms an opening through which a temperature-measuring instrument having a protective tube is inserted facing upward; and a non-metal jig that covers the inner surface of the opening of the port, and is formed in a cylindrical shape that can be mounted in the port from inside the processing container. The jig inserted in the port is configured to be able to move up and down together with the temperature-measuring instrument when the temperature-measuring instrument is mounted in the port.

Description

Substrate processing device, jig, calibration method of substrate processing device, and manufacturing method of semiconductor device

The present invention relates to a substrate processing device, a jig, a calibration method of the substrate processing device, and a manufacturing method of a semiconductor device.

In the manufacture of semiconductor devices (IC, etc.), in order to heat-treat substrates, batch-type vertical heat-treating devices are widely used. In the conventional processing furnace of this type of heat treatment device, a wafer boat loaded with a plurality of wafers is inserted from below into a substantially cylindrical vertical reaction tube whose upper end is closed and the lower end is open, and it is installed as A heater that surrounds the outer side of the reaction tube to heat the wafers on the wafer boat. On the wafer boat, a plurality of wafers are held in multiple layers in a horizontal posture with the centers of the wafers aligned with each other.

Furthermore, in the above-mentioned heat treatment device, a thermocouple formed in the protective tube is arranged inside the reaction tube to measure the temperature inside the reaction tube, and feedback control of the heater is performed based on the measured temperature. The thermocouple arranged inside the reaction tube is inserted from below the port of the sealing cover provided to close the opening of the reaction tube, and is fixed so as to protrude from the reaction tube. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-67766

(The problem to be solved by the invention)

When the thermocouple is inserted from the port provided in the sealing cover, the front or side surface of the protective tube with the thermocouple will rub against the metal surface of the port, causing the metal to adhere to the protective tube, and it will be affected by the attached metal. The possibility of metal contamination.

The subject of the present invention is to provide a technology to reduce the metal contamination of the protective tube. (Technical means to solve the problem)

According to the present invention, it is possible to provide a technology, which is provided with: a processing container for processing a substrate; a metal port in which an opening is formed in the processing container through which a temperature measuring device with a protective tube is inserted upward; and a non-metal The jig that covers the inner peripheral surface of the opening of the port and is formed into a cylindrical shape that can be attached to the port from the inside of the processing container; and the jig inserted into the port is When the temperature measuring device is attached to the port, it can be moved up and down together with the temperature measuring device. (Compared with the effect of previous technology)

According to the present invention, the metal pollution of the protective tube can be reduced.

As an embodiment of the present invention, a configuration example of a substrate processing apparatus that implements a substrate processing step by heat treatment as one step of a semiconductor device manufacturing process will be described with reference to FIG. 1.

The substrate processing apparatus 1 houses a substrate 100 such as a silicon wafer in a reaction tube 11 as a processing container provided inside the processing furnace 10, and heats the substrate 100 to a predetermined temperature under a predetermined atmosphere to form a thin film. The processing furnace 10 includes a reaction tube 11 and a heater unit 12 that is provided on the outer circumference of the reaction tube 11 and is divided into a plurality of pieces along the furnace axis direction as a heater unit 12. The reaction tube 11 is an open hollow at one end, and the furnace port 18 as the second opening is closed by a sealing cover (base) 13 as a cover. The substrate 100 to be processed in the reaction tube 11 is supported by the wafer boat 14 and contained, and is heated by the heater unit 12 under reduced pressure to form a thin film on the substrate 100. The heater unit 12 is connected to the controller 17 and is controlled by the controller 17 to heat the inside of the reaction tube 11.

The heater unit 12 and the sealing cover 13 divided into a plurality of heating zones are respectively provided with a heater thermocouple 15 as a temperature detector and a distributed thermocouple 20 as a temperature detector, and the heater thermocouple 15 The distributed thermocouple 20 is connected to the controller 17. In addition, although not shown in FIG. 1, the three heater thermocouples 15 on the upper surface are connected to the controller 17.

According to the measured temperature and the set temperature near the heater unit 12 measured by the heater thermocouple 15, the power supply of the heater unit 12 to each heating zone is controlled by the thyristor 16 controlled by the controller 17 , And the temperature distribution inside the reaction tube 11 becomes constant. In addition, although not shown in FIG. 1, the three heater units 12 on the upper surface are connected to the thyristor controlled by the controller 17 in the same way as the heater unit 12 on the lowermost surface.

The distributed thermocouple 20 is installed through the opening of the sealing cover 13 and protrudes into the reaction tube 11 to measure the internal temperature of the reaction tube 11. The distributed thermocouple 20 is formed by wiring four pairs of thermocouple wires 22a, 22b protected by a plurality of insulating tubes in a protective tube 21, for example. The protection tube 21 is made of, for example, a highly heat-resistant material such as quartz, SiC (silicon carbide), alumina, or ceramics.

The protection tube 21 is formed by a large diameter portion 21a, a small diameter portion 21b, and a tapered portion 21c. The large diameter portion 21a has a closed tip and an open base end, and the outer diameter is enlarged on the base end side. The small diameter portion 21b is provided Between the front end and the large-diameter portion 21a, the tapered portion 21c gradually increases in diameter from the small-diameter portion 21b to the large-diameter portion 21a. The base end opening is closed by a Teflon cover 28. Furthermore, when the temperature in the reaction tube 11 is used under very high temperature conditions of 1000° C. or higher, it is preferable to form the protection tube 21 from SiC or alumina with high heat resistance. The thermocouple wires 22a and 22b drawn from the protective tube 21 are protected by a flexible insulating coating 28, and are relayed by a terminal block (connector) 27 to be connected to the compensation wire 29. The compensation wire 29 is connected to the controller 17 through the terminal connector 26.

In the distributed thermocouple 20 constructed in this way, the protection tube 21 is inserted into the reaction tube 11 from the metal port 19 provided in the sealing cover 13 toward the furnace axis, so as to follow the crystal in the reaction tube 11 The boat 14 is installed, and the lower part of the protective tube 21 is fixed by the port 19. The plurality of thermocouple wires 22a, 22b passed through the inside of the protective tube 21 are for each of the plurality of regions, and the reaction heated by the heater unit 12 provided outside the reaction tube 11 is measured respectively The temperature near the wafer boat 14 of the tube 11.

The wafer boat 14 made of quartz supporting the substrate 100 is carried into such a reaction tube 11. The sealing cover 13 provided at the lower part of the wafer boat 14 to support the wafer boat 14 closes the furnace port 18 of the reaction tube 11 and makes the inside of the reaction tube 11 airtight. The heater unit 12 provided on the outer side of the reaction tube 11 heats the substrate 100 inserted in the reaction tube 11 for each area, and supplies and circulates the process gas from a gas supply port (not shown). Then, exhaust is performed from an exhaust port (not shown), thereby forming a film on the substrate 100.

However, the distributed thermocouple 20 is used to calibrate the temperature of each zone in the reaction tube 11 divided by zones, in order to set the temperature near the wafer boat 14 in the reaction tube 11 as a target during the manufacturing operation such as film formation. The set temperature to be compared with the measured temperature of each heater thermocouple 15 embedded in the heater unit 12 is adjusted.

As an example, before the production operation of the film formation, the controller 17 can use the heater unit 12 to heat the reaction tube 11, and use the heater thermocouple 15 to measure the temperature outside the reaction tube 11, and by distributed The thermocouple 20 measures the temperature distribution in the upper and lower directions in the reaction tube 11, and the calibration data is prepared in advance based on the measurement data of the heater thermocouple 15 and the distributed thermocouple 20. In order to uniformly heat the inside of the reaction tube 11, the controller 17 sets the target value (in-tube set temperature) corresponding to the measured temperature of the distributed thermocouple 20 to be all the same, and controls the heater unit 12 for each zone. Then, when the control converges and becomes a stable state, the temperature of the heater thermocouple 15 is acquired and stored as a target value (heater set temperature) corresponding to the heater thermocouple 15. If the above actions are performed on a plurality of set temperatures, a table that converts the set temperature in the tube to the set temperature of the heater can be obtained. If this table is used, by controlling the temperature of the heater thermocouple 15 close to the heater setting temperature, the inside of the reaction tube 11 can be uniformly heated without the need for the distributed thermocouple 20.

In order to perform more advanced multivariable model predictive control, the controller 17 can use the distributed thermocouple 20 to obtain the thermal characteristics of the processing furnace 10 such as step response. Hereinafter, such a measurement including the acquisition of the conversion table is called calibration, and the data that can be obtained by calibration is called calibration data. In this case, when the substrate processing apparatus 1 is used, the distributed thermocouple 20 is removed and the opening of the port 19 is blocked, and only the heater thermocouple 15 is used to measure the temperature. Then, the measured temperature of the heater thermocouple 15 is corrected to the temperature data inside the reaction tube 11 based on the correction data, and the corrected data is used to control the heater unit 12. Although calibration is often performed comprehensively during installation or maintenance of the device, partial calibration can also be performed during operation.

Hereinafter, the installation of the distributed thermocouple 20 will be described using FIGS. 3 to 6. As shown in FIG. 3(b), the sealing lid has a quartz disc-shaped lid (base) 13a, and a metal lid holder 13b that is in contact with and held on the bottom surface of the lid 13a. A circular hole 13c as an opening is provided in the cover 13a, and a metal port 19 is provided in the cover socket 13b. The port 19 is composed of a pipe portion 19a extending in the vertical direction and one end connected to the lower surface of the cover holder 13b, and a joint 19b as a fastening portion provided on one end side of the pipe portion 19a. The space inside the pipe portion 19a communicates with the upper surface side of the lid holder 13b. The hole 13c is formed in the cover body 13a so as to be concentric with the tube portion 19a, and the distributed thermocouple 20 is inserted upward to the opening 19c in the reaction tube 11. The pipe portion 19a is a round pipe having a fixed diameter in the insertion direction. The inner diameter of the pipe portion 19a is smaller than the diameter of the hole 13c. In order to fasten the distributed thermocouple 20 on the outer periphery of the joint 19b, a male screw or flange for fastening a cap nut (joint nut) can be provided. On the inner circumference of the joint 19b, a tapered surface or a step difference can be provided corresponding to an O-ring 32 described later in order to airtightly seal the distributed thermocouple 20.

As shown in Fig. 3(a), the jig 31 is formed into a cylindrical shape by non-metal such as quartz, and as shown in Fig. 3(b), the inner surface of the opening 19c of the port 19 can be covered from The side of the reaction tube 11 above the cover 13 is attached to the port 19. The jig 31 has a cylindrical portion 31a fitted into the inner side of the pipe portion 19a by a gap, and a locking portion 31b formed at one end of the cylindrical portion 31a larger than the shape of the inner side of the pipe portion 19a. For example, the cylindrical portion 31a is a round pipe having a fixed diameter in the insertion direction, and the outer diameter of the cylindrical portion 31a is configured to be smaller than the inner diameter of the pipe portion 19a. The locking portion 31b is a circular tube having a fixed diameter in the insertion direction, and the outer diameter of the locking portion 31b is configured to be larger than the inner diameter of the pipe portion 19a.

The lower surface of the locking portion 31b is configured to abut against the upper surface of the cover socket 13b or the port 19. Thereby, the jig 31 will not fall off downward. The length of the cylindrical portion 31a of the jig 31 is the same as that of the tube portion 19a of the port 19. The inner diameters of the cylindrical portion 31a and the locking portion 31b of the jig 31 are configured to be larger than the protective tube 21 of the distributed thermocouple 20 and smaller than the outer diameter of the large-diameter portion 21a of the protective tube 21. The length of the insertion direction of the locking portion 31b is configured to be longer than the length of the insertion direction of the cover 13a. Furthermore, when the locking portion 31b may be in contact with the reaction tube 11, a part of the locking portion 31b can also be cut out.

First, as shown in FIG. 4, the jig 31 is inserted into the port 19 from above the hole 13c of the cover 13a. Thereby, the inner surface of the opening 19c (pipe portion 19a) is covered by the jig 31. When the cylindrical portion 31a of the jig 31 is inserted into the port 19 and is locked to the port 19 by the locking portion 31b, the front end (lower end) of the cylindrical portion 31a is inserted into the port 19 in the vertical direction The upper position is the same as the lower end of the tube 19a of the port 19 or is located below the lower end.

Next, as shown in FIG. 5, the protective tube 21 is inserted into the cylindrical portion 31a of the jig 31 from below the port 19, and pushed upward so as to protrude into the reaction tube 11. At this time, since the inner surfaces of the tube portion 19a of the port 19 and the hole 13c of the sealing cover 13 are covered by the jig 31, the protection tube 21 will not rub against the port 19 and the sealing cover 13.

Then, as shown in FIG. 6, the jig 31 inserted into the port 19 is continuously enlarged by the thickness of the protective tube 21 when the distributed thermocouple 20 is to be attached to the port 19 The tapered portion 21c is lifted together with the distributed thermocouple 20, the locking portion 31b of the jig 31 is separated from the hole 13c, and a part of the cylindrical portion 31a is separated from the inner surface of the tube portion 19a of the port 19. The distributed thermocouple 20 inserted into a fixed position is fastened to the port 19 by a connector 19b. At this time, the distributed thermocouple 20 is maintained at a fixed position by a cap nut, etc., and the inner periphery of the large diameter portion 21a and the joint 19b is inserted into a gap, by the O-shaped provided on the cap taper portion 21c The ring 32 abuts on the tapered surface provided on the joint 19b, and can maintain the airtightness between the distributed thermocouple 20 and the joint 19b. Furthermore, when the correction is performed under conditions close to atmospheric pressure, the O-ring 32 and the tapered surface provided on the joint 19b are not required. In addition, the push-up of the jig 31 includes a method of making the O-ring 32 abut in addition to the method in which the jig 31 directly abuts the taper portion 21c. In this way, when the distributed thermocouple 20 is to be attached to the port 19, one part of the cylindrical portion 31a of the jig 31 is separated from the inner surface of the tube portion 19a of the port 19 as the opening on the one hand, and the other part is It stays on the inner surface of the pipe part 19a.

When using the device, the cover 13a shown in FIGS. 3 to 6 can be replaced, and a cover without holes 13c can be used, so that the metal will not be exposed from the furnace mouth at all. Alternatively, a non-metallic plug that closes the hole 13c may be attached. Furthermore, the sealing cover 13 is not limited to being separated into a cover for maintaining airtightness and a cover holder for ensuring mechanical strength, and it may be formed integrally with metal. In this case, the port 19 connected to the sealing cover 13 by welding can be completely closed by the airtight cover attached to the joint 19b.

In addition, the present invention is not limited to the above-mentioned embodiments, and of course various changes can be made without departing from the scope of the gist. For example, the large-diameter portion 21a and the tapered portion 21c are not limited to those formed integrally with the small-diameter portion 21b (distributed thermocouple 20), but also include those separately prepared as ferrules or the like. When it is to be attached to the port 19, it can function as the large-diameter portion 21a, and the ferrule that is fixed as an integral part with the distributed thermocouple 20 can be regarded as constituting the large-diameter portion 21a. In addition, the distributed thermocouple 20 is not limited to those that are removed during operation. It can also be left in the reaction tube 11 together with the jig 31 during operation, so that the internal temperature measured thereby can be used for High-precision temperature control.

In addition, in the above-mentioned embodiment, although the case where the processing is performed on the wafer has been described, the processing object may be a substrate other than the wafer, a photomask, a printed circuit board, or a liquid crystal panel. , CD or floppy disk, etc. In addition, the present invention can be applied not only to semiconductor manufacturing devices, but also to devices that process glass substrates such as LCD manufacturing devices, and other substrate processing devices. Substrate processing includes not only CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), oxide film, nitride film, metal-containing film, etc., but also exposure processing and photolithography. , Coating treatment, etc.

1: Substrate processing equipment 10: Treatment furnace 11: Reaction tube (processing container) 12: heater unit 13: Sealing cover (base) 13a: Lid 13b: Lid holder 13c: round hole 14: Crystal Boat 15: Heater thermocouple 16: thyristor 17: Controller 18: Furnace mouth 19: Port 19a: Pipe Department 19b: Connector 20: Distributed thermocouple (temperature detector) 21: Protection tube 21c: Cap cone 22a, 22b: thermocouple wire 26: Terminal connector 27: Terminal block (connector) 28: Teflon cover 29: Compensation wire 31: Fixture 31a: cylindrical part 31b: Locking part 32: O-ring 100: substrate

Fig. 1 is a vertical cross-sectional view of a substrate processing apparatus in an embodiment of the present invention. Fig. 2 is a longitudinal cross-sectional view showing a profile thermocouple according to an embodiment of the present invention. FIG. 3(a) is a perspective view showing the jig of the embodiment of the present invention, and FIG. 3(b) is a diagram illustrating the installation part of the distributed thermocouple shown in FIG. 2. Fig. 4 is a diagram showing a state where the jig shown in Fig. 3(a) is attached to the mounting part shown in Fig. 3(b). Fig. 5 is a diagram showing a state where the distributed thermocouple shown in Fig. 2 is started to be inserted into the mounting part shown in Fig. 4. Fig. 6 is a diagram showing a state in which the distributed thermocouple shown in Fig. 2 is attached to the mounting part shown in Fig. 4.

11: Reaction tube (processing container)

13a: Lid

13b: Lid holder

19: Port

19a: Pipe Department

19b: Connector

20: Distributed thermocouple (temperature detector)

21: Protection tube

31: Fixture

31a: cylindrical part

31b: Locking part

32: O-ring

Claims (13)

A substrate processing device is provided with: Processing container, which processes the substrate; A port, which is formed in the above-mentioned processing container with an opening through which a temperature measuring device with a protective tube can be inserted upward; and A non-metallic jig that covers the inner peripheral surface of the opening of the port and is formed into a cylindrical shape that can be attached to the port from the inside of the processing container; The jig inserted into the port is configured to be movable up and down together with the temperature measurement device when the temperature measurement device is attached to the port. The substrate processing apparatus of claim 1, wherein when the jig inserted into the port is lifted by the temperature measuring device attached to the port, on the one hand, a part of the jig is separated from the opening On the other side, another part is left on the inner surface of the above-mentioned opening. The substrate processing apparatus of claim 1 or 2, wherein the jig inserted into the port is abutted against the enlarged part of the protective tube attached to the port, and the temperature is The measuring device is lifted together. The substrate processing apparatus according to claim 3, which is further provided with a cover for closing a furnace port provided below the processing container for carrying in and out of the substrate; and the port is provided in the cover. Such as the substrate processing apparatus of claim 4, wherein the above-mentioned port has: A tube portion, which extends in the up-down direction, one end is connected to the above-mentioned cover, and the above-mentioned opening is formed on the inner side thereof; and A fastening portion is connected to the other end of the pipe portion, and the attached temperature measuring device is fixed to the enlarged portion or the large diameter portion of the temperature measuring device. The substrate processing apparatus of claim 5, wherein the tube portion is a circular tube having a fixed diameter in the insertion direction, The jig has a cylindrical portion that is fitted into the gap toward the inner side of the pipe portion, and a locking portion formed at one end of the cylindrical portion to be larger than the inner side of the opening, and is inserted into the port. When the locking portion is locked to the opening, the front end inserted into the port side corresponds to the connection position of the pipe portion and the fastening portion of the port, or is located further than the connection position of the fastening portion side. The substrate processing apparatus of claim 4, wherein at least one of the port and the cover is made of metal. The substrate processing apparatus of claim 6, wherein the cover has a disc-shaped cover made of quartz, and a cover holder made of metal contacting and holding the bottom surface of the cover 13a, and the port is provided On the cover body holder, and the cover body has a hole larger than the locking portion at a position corresponding to the port. The substrate processing apparatus according to claim 3, wherein the enlarged portion of the protective tube has a tapered shape. The substrate processing apparatus of claim 3, wherein the airtightness is maintained by the O-ring between the fastening portion and the enlarged portion of the protection tube. A fixture that is inserted into a processing container for processing substrates to form a non-metallic fixture for an opening through which a temperature measuring device with a protective tube is inserted upward; Have: A cylindrical portion that covers the inner surface of the opening of the port and is formed into a cylindrical shape that can be attached to the port from the inside of the processing container, and the gap is embedded in the inside of the port; and The locking portion is formed at one end of the cylindrical portion to be larger than the shape of the inner side of the opening; When the temperature measuring device is attached to the port, it is lifted together with the temperature measuring device by abutting on the enlarged part of the protective tube, and a part of the cylindrical portion is separated from the inside of the opening. surface. A method for calibrating a substrate processing device, which includes: The step of preparing a substrate processing device for attaching a non-metallic fixture to a port, wherein the port is formed inside a processing container for processing substrates for upwardly inserting a profile temperature measuring device with a protective tube An opening, and the jig covers the inner peripheral surface of the opening of the port and is formed into a cylindrical shape that can be attached to the port from the inside of the processing container; The step of attaching the distributed temperature measuring device to the port and setting the jig and the temperature measuring device to be pushed up together; and The controller heats the processing container with a heater, measures the temperature outside the processing container with a heater temperature measuring device, and measures the temperature distribution in the upper and lower directions of the processing container with a distributed thermocouple 20, and A step of preparing calibration data from the measurement data of the heater temperature measuring device and the distributed temperature measuring device. A method of manufacturing a semiconductor device, which includes: The step of carrying a substrate into a processing container of a substrate processing apparatus, and the substrate processing apparatus has a processing container for processing the substrate, and a port through which a temperature measuring device with a protective tube is inserted upwardly in the processing container; The step of controlling the heater of the processing container according to the temperature, and the temperature is formed to cover the inner surface of the opening of the port when the temperature is attached to the port from the inside of the processing container The non-metallic fixture is measured by the above-mentioned temperature measuring device attached to the above-mentioned port; and The step of processing the substrate heated by the above heater; The temperature measuring device is attached to the port, and a part of the jig is lifted out of the opening when the enlarged part of the protective tube of the temperature measuring device abuts on the jig.的内面。 The inner surface.

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