TW202140984A - Vapor chamber having carbon fiber composite - Google Patents
Vapor chamber having carbon fiber composite Download PDFInfo
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- TW202140984A TW202140984A TW109113337A TW109113337A TW202140984A TW 202140984 A TW202140984 A TW 202140984A TW 109113337 A TW109113337 A TW 109113337A TW 109113337 A TW109113337 A TW 109113337A TW 202140984 A TW202140984 A TW 202140984A
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本係有關發明於一種具碳纖維複材之均溫板,尤其是指一種除具有良好導熱性外,還具有抗腐蝕性,而能運用在5G通訊設備以及強酸、海邊等惡劣環境之均溫板者。This series of inventions are related to an even temperature plate with a carbon fiber composite material, especially a temperature plate that has good thermal conductivity and corrosion resistance, and can be used in 5G communication equipment, strong acids, seaside and other harsh environments By.
隨著科技不斷的進步,一般電腦系統或電子產品的處理器、電子元件的處理、運算速度也相對不斷提昇,以因應各項運作需求;然而,處理、運算速度的提升,相對也使處理器、電子元件產生更多熱能,當熱能未快速的加以排除時,便會使處理器、電子元件因為過熱而導致效能降低、停止運作,甚至因此損壞。因此,對處理器、電子元件的散熱處理,是涉及電腦系統或電子產品性能發揮及使用壽命相當重要的一個環節。With the continuous advancement of science and technology, the processing and computing speeds of processors and electronic components in general computer systems or electronic products have been relatively continuously improved to meet various operational requirements. However, the increase in processing and computing speeds relatively makes the processor , Electronic components produce more heat energy. When the heat energy is not quickly removed, the processor and electronic components will be overheated and cause performance degradation, stop operation, or even damage. Therefore, the heat dissipation treatment of processors and electronic components is a very important link involving the performance and service life of computer systems or electronic products.
既有散熱器主要由一基板及數片散熱鰭片構成,其中該基板用於接觸發熱源,各散熱鰭片則平行並列設立於該基板頂面,當基板吸收發熱源的熱能後,便將熱能向各該散熱鰭片傳遞,藉由散熱鰭片與空氣的接觸,使得散熱鰭片上的熱能得以向外界空氣傳遞,達到降溫效果。然而,該基板及散熱鰭片雖是以熱傳率良好的金屬材料製成,惟其散熱能力受到材料性質與結構的限制,難以進一步提升。The existing heat sink is mainly composed of a substrate and several heat dissipation fins. The substrate is used to contact the heat source, and the heat dissipation fins are set up in parallel on the top surface of the substrate. When the substrate absorbs the heat energy of the heat source, it will The heat energy is transferred to each of the heat dissipation fins, and the heat energy on the heat dissipation fins can be transferred to the outside air by the contact between the heat dissipation fins and the air, so as to achieve a cooling effect. However, although the substrate and the heat dissipation fins are made of metal materials with good heat transfer rate, their heat dissipation capacity is limited by the material properties and structure, and it is difficult to further improve.
又,市面上如上所述的散熱氣或散熱板通常是由銅、鋁等金屬製作而成的,其導熱效率雖然十分良好,但化學穩定性不佳,容易產生氧化、腐蝕等問題,進而影響散熱率。In addition, the above-mentioned heat sinks or heat sinks on the market are usually made of metals such as copper and aluminum. Although their thermal conductivity is very good, their chemical stability is not good, and they are prone to oxidation, corrosion and other problems, which will affect Heat dissipation rate.
本發明之主要目的,係提供一種具碳纖維複材之均溫板,係透過底板與頂板採用具有良好導熱性與化學穩定性的碳纖維材料,使均溫板除與現有的金屬均溫板的散熱效率接近外,,並得以改善金屬均溫板抗腐蝕性不足的問題。The main purpose of the present invention is to provide a temperature equalizing plate with carbon fiber composite material, which uses carbon fiber materials with good thermal conductivity and chemical stability through the bottom plate and top plate, so that the equalizing plate can dissipate heat from the existing metal equalizing plate. The efficiency is close to the outside, and the problem of insufficient corrosion resistance of the metal uniform temperature plate can be improved.
本發明之目的及功效,係由以下技術實現:The purpose and effects of the present invention are achieved by the following technologies:
一種具碳纖維複材之均溫板,係包括一底板、一頂板、至少一毛細網板與複數支支撐柱;其中:A uniform temperature plate with carbon fiber composite material, which includes a bottom plate, a top plate, at least one capillary mesh plate and a plurality of support columns; wherein:
所述底板、所述頂板係採用碳纖維材質之板體,所述底板、所述頂板彼此上下對應蓋設密合,使所述底板、所述頂板之間形成密閉的腔室,所述腔室內注入工作流體;The bottom plate and the top plate are made of carbon fiber material, and the bottom plate and the top plate are covered with each other up and down correspondingly, so that a closed cavity is formed between the bottom plate and the top plate. Inject working fluid;
所述毛細網板係採用金屬導熱材質的網狀體,係設置所述腔室內,所述毛細網板設有複數個穿孔;The capillary mesh plate is a mesh body made of a metal heat-conducting material, which is arranged in the chamber, and the capillary mesh plate is provided with a plurality of perforations;
所述支撐柱穿設所述毛細網板之穿孔,其二端分別抵接所述底板、所述頂板;The support column penetrates the perforation of the capillary mesh plate, and its two ends abut the bottom plate and the top plate respectively;
俾透過所述底板與所述頂板採用碳纖維材料,使均溫板具有良好導熱性與化學穩定性,達到散熱效率高、抗腐蝕性之效果。Through the use of carbon fiber materials for the bottom plate and the top plate, the uniform temperature plate has good thermal conductivity and chemical stability, and achieves the effects of high heat dissipation efficiency and corrosion resistance.
如上所述之具碳纖維複材之均溫板,其中,所述工作流體係為純水、甲醇、丙酮或鈉溶液其中之一。The above-mentioned uniform temperature plate with carbon fiber composite material, wherein the working flow system is one of pure water, methanol, acetone or sodium solution.
如上所述之具碳纖維複材之均溫板,其中,所述毛細網板採用之金屬導熱材質為銅。As mentioned above, the thermally conductive metal plate with carbon fiber composite material is copper.
為令本發明所運用之技術內容、發明目的及其達成之功效有更完整且清楚的揭露,茲於下詳細說明之,並請一併參閱所揭之圖式及圖號:In order to make the technical content, the purpose of the invention and the effect achieved by the present invention more complete and clear, the following detailed descriptions are provided, and please refer to the disclosed drawings and figure numbers together:
請參見第一~四圖。本發明之具碳纖維複材之均溫板,係包括一底板1、一頂板2、至少一毛細網板3與複數個支撐柱4;其中:Please refer to the first to fourth pictures. The temperature equalizing plate with carbon fiber composite material of the present invention includes a
底板1,係為一採用碳纖維材質之板體;The
頂板2,亦係為一採用碳纖維材質之板體,頂板2與底板1彼此上下對應密合蓋設,使底板1與頂板2之間形成密閉的腔室A(參見第四圖),腔室A內注入有工作流體B(參見第五圖),其中,該工作流體B係為純水、甲醇、丙酮或鈉溶液其中之一;The
毛細網板3,係採用金屬導熱材質的網狀體,設置腔室A內,該毛細網板3設有複數個貫穿的穿孔31,其中,所述毛細網板3採用之金屬導熱材質為銅;The
支撐柱4,係穿設於毛細網板3之穿孔31中,並以其二端分別抵接底板1、頂板2,使毛細網板3成懸空架設在腔室A中,並且藉毛細網板3將腔室A分為上、下層。The
實施時(請參見第五圖),係將均溫板安裝貼觸於發熱元件5(如處理器/CPU),此時發熱元件5產生的熱由外部高溫區經由熱傳導進入腔室A內,接近熱源周遭的工作流體B會迅速地吸收熱量氣化成蒸氣,帶走大量的熱能,接著利用蒸氣的潛熱性,由高壓區擴散到低壓區(亦即低溫區),並接觸到溫度較低的內壁時,蒸氣會迅速地凝結成液體並放出熱能,凝結的水靠毛細網板3的毛細作用流回熱源點形成熱傳迴圈,如此透過工作流體B之蒸發、冷凝及通過該毛細網板3之循環運作,即能達到對該發熱元件進行持續性散熱之目的。During the implementation (please refer to the fifth figure), the uniform temperature plate is installed and attached to the heating element 5 (such as processor/CPU). At this time, the heat generated by the
由於本發明之底板1與頂板2皆是採用碳纖維材料,其除了具有良好的導熱性之外,還具備有化學穩定性,因此能抗腐蝕性,進而達到延長均溫板壽命、減少汰換率之效果,而得以運用在5G通訊設備以及適用於強酸(實驗室)、海邊等惡劣環境。Since the
以上所舉者僅係本發明之部份實施例,並非用以限制本發明,致依本發明之創意精神及特徵,稍加變化修飾而成者,亦應包括在本專利範圍之內。The above-mentioned examples are only part of the embodiments of the present invention, and are not intended to limit the present invention. Any modification based on the creative spirit and characteristics of the present invention should also be included in the scope of this patent.
綜上所述,本發明實施例確能達到所預期之使用功效,又其所揭露之具體技術手段,不僅未曾見諸於同類產品中,亦未曾公開於申請前,誠已完全符合專利法之規定與要求,爰依法提出發明專利之申請,懇請惠予審查,並賜准專利,則實感德便。To sum up, the embodiments of the present invention can indeed achieve the expected use effect, and the specific technical means disclosed by it have not been seen in similar products, nor have they been disclosed before the application. It is in full compliance with the patent law. Regulations and requirements, Yan submits an application for a patent for invention in accordance with the law, and asks for favors for examination, and grants a patent for approval, it is really convenient.
1:底板1: bottom plate
2:頂板2: top plate
3:毛細網板3: Capillary mesh plate
31:穿孔31: Piercing
4:支撐柱4: Support column
5:發熱元件5: Heating element
A:腔室A: Chamber
B:工作流體B: working fluid
第一圖:本發明之具碳纖維複材之均溫板的立體分解圖Figure 1: A three-dimensional exploded view of the temperature equalizing plate with carbon fiber composite material of the present invention
第二圖:本發明之具碳纖維複材之均溫板將支撐柱與毛細網板結合的立體示意圖Figure 2: The three-dimensional schematic diagram of the combination of the support column and the capillary mesh plate of the temperature equalizing plate with carbon fiber composite material of the present invention
第三圖:本發明之具碳纖維複材之均溫板將支撐柱、毛細網板安置於底板內的立體示意圖The third figure: the three-dimensional schematic diagram of the temperature equalizing plate with carbon fiber composite material of the present invention, the supporting column and the capillary mesh plate are arranged in the bottom plate
第四圖:本發明之具碳纖維複材之均溫板的組合剖視圖Figure 4: Combined cross-sectional view of the temperature equalizing plate with carbon fiber composite material of the present invention
第五圖:本發明之具碳纖維複材之均溫板實施降溫散熱狀態的示意圖Figure 5: A schematic diagram of the cooling and heat dissipation state of the uniform temperature plate with carbon fiber composite material of the present invention
1:底板1: bottom plate
2:頂板2: top plate
3:毛細網板3: Capillary mesh plate
31:穿孔31: Piercing
4:支撐柱4: Support column
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TW109113337A TW202140984A (en) | 2020-04-21 | 2020-04-21 | Vapor chamber having carbon fiber composite |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114935272A (en) * | 2022-05-24 | 2022-08-23 | 中国电子科技集团公司第十研究所 | Integrated forming temperature-uniforming plate based on additive manufacturing |
WO2024093695A1 (en) * | 2022-10-31 | 2024-05-10 | 广州力及热管理科技有限公司 | Liquid-cooling heat dissipation module embedded with three-dimensional vapor chamber element |
-
2020
- 2020-04-21 TW TW109113337A patent/TW202140984A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114935272A (en) * | 2022-05-24 | 2022-08-23 | 中国电子科技集团公司第十研究所 | Integrated forming temperature-uniforming plate based on additive manufacturing |
CN114935272B (en) * | 2022-05-24 | 2023-08-04 | 中国电子科技集团公司第十研究所 | Integrated molding samming board based on additive manufacturing |
WO2024093695A1 (en) * | 2022-10-31 | 2024-05-10 | 广州力及热管理科技有限公司 | Liquid-cooling heat dissipation module embedded with three-dimensional vapor chamber element |
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