TW202139279A - Setting method of alignment mark and machining apparatus automatically adjusting the range of the designated mark to set the alignment mark - Google Patents

Abstract

The present invention automatically adjusts the range of the designated mark to set the alignment mark. The alignment mark setting method provided herein includes the following steps: a photographing step, photographing one or more marks formed on the front side of the wafer; an information acquiring step, acquiring the information of each circumscribed rectangle that constitutes one or more marks for one or more captured marks; a frame line adjustment step, in response to the situation where one mark or multiple marks have been designated, the center of the entire circumscribed rectangle of one mark or multiple marks being moved to the center of the quadrilateral frame line, and automatically adjusting the position and size of the frame line relative to the circumscribed rectangle so that the circumscribed rectangle is located in the frame line and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and a registration step, using the region containing one mark or multiple marks inside the frame line whose size has been adjusted as an alignment mark to be registered in the machining device.

Description

Setting method and processing device of calibration mark

The present invention relates to a method for setting an area containing one or more marks designated by an operator as a calibration mark in a processing device for processing a wafer with a plurality of marks formed on the front side, And the processing device that can set this area as calibration mark.

A wafer in which devices such as IC (Integrated Circuit) are formed in each area divided by a plurality of planned dividing lines set in a grid on the front side, and the back side is ground to a predetermined thickness , The processed device is processed along the planned dividing line to be divided into a plurality of device wafers.

As a processing device for processing the wafer along the planned dividing line, for example, a cutting device can be used. The cutting device includes a work chuck table for sucking and holding wafers. The work clamp table can rotate around a predetermined rotation axis. A camera and a cutting unit including cutting blades are arranged above the work clamping table.

Before cutting the wafer with the cutting device, a calibration step for positioning the cutting insert on the extension line of the planned dividing line is performed (see, for example, Patent Document 1). In the calibration step, a mark of a predetermined shape formed on the front side of the wafer is photographed while the back side of the wafer is sucked and held by the work chuck, and the mark is set as a calibration mark in the cutting device ( Teaching steps).

After that, the pattern matching in the image is used to identify the calibration marks of the same shape that exist in the two separate places. And, using the coordinates of the two calibration marks to rotate the work chuck by a predetermined angle, the direction of the wafer is adjusted so that the planned dividing line becomes parallel to the X axis of the cutting device.

In this way, in the calibration step, the teaching step is performed first. In the teaching step, the operator searches for the calibration mark in a state where the image of the front side of the wafer captured by the camera is displayed on the display device, and decides which mark to use as the calibration mark.

In the teaching step, a frame line composed of a crosshair and a square frame surrounding the crosshair is displayed in the center of the image, and the operator uses the operation keys to set the position of the frame line on the X axis Adjust, or enlarge/reduce the size of the frame line in the direction and Y-axis direction.

And, in a state where the mark used as the calibration mark falls inside the frame line, the mark and the area surrounding the mark surrounded by the frame line are registered as the calibration mark. However, since the adjustment of the position and size of the frame line is usually carried out by the operator's manual operation and feel, there will be a frame every time the calibration mark is set, or every time a different operator sets the calibration mark. Possibility of different sizes of lines. Prior art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 7-106405

The problem to be solved by the invention

If the size of the frame line is different each time it is set, there may be the following situations: although the mark of the same shape is set as the calibration mark, the range of the mark set as the calibration mark is different, or the area of the area around the mark is different. In other words, although marks of the same shape are used as targets, calibration marks of different shapes and sizes may be set.

The present invention was made in view of the above-mentioned problems, and its object is to automatically adjust the range of the designated mark to set the calibration mark. Means to solve the problem

According to one aspect of the present invention, a method for setting calibration marks can be provided. In a processing device for processing a wafer on which a plurality of marks are formed on the front side, one or more marks designated by an operator are included. The area is set as the calibration mark, and the setting method of the aforementioned calibration mark has the following steps: In the photographing step, the one or more marks that have been formed on the wafer are photographed by the photographing unit; The information obtaining step is to obtain the information of the circumscribed rectangle of each of the one or more marks photographed in the one or more marks; In the frame adjustment step, after the information acquisition step, in response to a situation where one or more of the more than one mark is designated, the circumscribed rectangle of the one mark or the entirety of the plurality of marks Move to the center of the square frame line used when setting the processing device as a calibration mark, and automatically adjust the position and size of the frame line relative to the circumscribed rectangle to: the circumscribed rectangle falls on Within the frame line, and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and The registration step is to register the region containing the one mark or the plurality of marks in the inner side of the frame line that has been resized as a calibration mark in the processing device.

According to another aspect of the present invention, a processing device can be provided, which can set an area containing more than one mark designated by an operator as a calibration mark when processing a wafer with a plurality of marks formed on the front side , The aforementioned processing device has: Work clamp table to attract and hold the wafer; A photographing unit having a photographing element, which is arranged above the work chuck table and photographs the wafer attracted and held by the work chuck table; A display device, which displays the image obtained by the photographing unit; The control unit has a processor and controls the actions of the work clamp table, the photographing unit and the display device; and Input device to input the instructions of the operator to the control unit, The control unit contains: The information obtaining unit obtains information of the circumscribed rectangle of each of the one or more marks photographed by the photographing unit; The frame adjustment unit, in response to the situation where one or more of the one or more marks is designated through the input device, the center of the circumscribed rectangle of the one mark or the entirety of the plurality of marks, Move to the center of the square frame line used in the processing device to be set as a calibration mark, and automatically adjust the position and size of the frame line relative to the circumscribed rectangle to: the circumscribed rectangle falls on the frame line , And the distance between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and The calibration mark registration unit registers an area including the one mark or the plurality of marks on the inner side of the frame line that has been resized as a calibration mark. Invention effect

In one aspect of the calibration mark setting method of the present invention, first, information of the circumscribed rectangle constituting one or more marks is acquired for one or more photographed marks (information acquisition step). And, after the information acquisition step, the operator designates one or more marks among the more than one marks.

In response to the operator’s designation, the center of the entire circumscribed rectangle of a mark or a plurality of marks is moved to the center of the square frame, and the position and size of the frame relative to the circumscribed rectangle are automatically adjusted to: circumscribed The rectangle falls within the frame line, and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance (frame line adjustment step).

After that, an area containing one mark or a plurality of marks on the inner side of the resized frame line is registered as a calibration mark in the processing device (registration step). Therefore, the calibration mark can be automatically set in a predetermined range according to the shape and size of the mark, rather than a setting that depends on the operator's feeling.

The form used to implement the invention

With reference to the attached drawings, one aspect of the implementation of the present invention will be described. FIG. 1 is a perspective view of a cutting device (processing device) 2. The X-axis direction (processing feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (vertical direction, height direction) shown in Fig. 1 are orthogonal to each other.

Furthermore, in FIG. 1, a part of the constituent elements is shown as a functional block diagram. The cutting device 2 includes a base 4 supporting each structure. A cover 6 covering the base 4 can be provided above the base 4. A predetermined space is formed inside the cover 6.

A cutting unit (processing unit) 8 for cutting (processing) the wafer 11 is arranged in this predetermined space. The cutting unit 8 can be moved in the Y-axis direction and the Z-axis direction by a Y-axis and Z-axis direction moving mechanism not shown.

The Y-axis and Z-axis direction moving mechanism includes, for example, a ball screw type Y-axis direction mechanism (not shown) that moves the Y-axis moving plate (not shown) along the Y-axis direction, and is provided on the Y-axis moving plate and makes cutting A ball screw type Z-axis direction moving mechanism (not shown) in which the unit 8 moves along the Z-axis direction.

The cutting unit 8 has a spindle housing in which the longitudinal direction is arranged in an angular column shape substantially parallel to the Y-axis direction. A part of a cylindrical spindle (not shown) is rotatably accommodated in the spindle housing.

A rotary drive source (not shown) such as a motor is provided at one end of the main shaft, and a cutting blade having an annular cutting edge is installed at the other end of the main shaft. A part of the camera unit (photographing unit) 10 is fixed to the side surface on one side in the X-axis direction in the spindle housing.

The camera unit 10 has a light source such as LED (not shown), an optical system including a condenser lens (not shown), etc., and a CCD (Charge Coupled Device) image sensor or CMOS (complementary metal oxide) Complementary Metal Oxide Semiconductor (Complementary Metal Oxide Semiconductor) image sensor and other imaging components.

A work chuck table 12 for sucking and holding the wafer 11 is provided under the cutting unit 8. The work clamp table 12 has a substantially disc-shaped frame body formed of metal. A recess formed by a disk-shaped space is formed in the frame.

One end of a suction path (not shown) is exposed on the bottom surface of the recess, and a suction source (not shown) such as a vacuum pump or an ejector is connected to the other end of the suction path. A disc-shaped perforated plate is fixed to the recess.

If the suction source is operated, a negative pressure is generated on the upper surface (holding surface 12a) of the perforated plate through the suction path. A rotation drive source (not shown) such as a motor is connected below the work chuck table 12.

The rotation drive source rotates the work chuck table 12 around a predetermined rotation axis substantially parallel to the Z-axis direction. A ball screw type X-axis direction moving mechanism (not shown) for moving the work chuck table 12 and the rotating drive source in the X-axis direction is provided below the rotation drive source.

A disc-shaped wafer 11 and the like can be placed on the holding surface 12 a of the work chuck table 12. FIG. 2 is a plan view of the wafer 11 and the like. The wafer 11 is formed of a semiconductor such as silicon. However, the material, shape, structure, size, etc. of the wafer 11 are not limited.

The front surface 11a of the wafer 11 is divided into a plurality of regions by planned dividing lines (dicing lanes) 13 arranged in a grid pattern. Devices 15 such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed in each area. Furthermore, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the devices 15.

In the vicinity of the planned dividing line 13, a plurality of marks 17 having a predetermined shape are formed (refer to FIG. 3). The mark 17 is used as a calibration mark 29 (refer to FIG. 8(B)) used as a reference when the wafer 11 is calibrated.

The mark 17 is formed by, for example, removing a part of the outermost surface of the circuit layer formed on the active region of the semiconductor element by etching or the like. As long as the camera unit 10 photographs the front side 11a, an image of the mark 17 can be obtained. FIG. 3 is a partially enlarged view of the front side 11a of the wafer 11.

In FIG. 3, two devices 15 arranged with one planned dividing line 13 interposed therebetween are shown. In the vicinity of the planned dividing line 13 of one device 15 shown in FIG. 3, a substantially L-shaped mark 17a, a substantially circular mark 17b, a substantially square mark 17c, and a substantially cross-shaped mark 17d are formed.

As shown in Figure 2, an adhesive tape (dicing tape) 19 is attached to the back side 11b of the wafer 11 before cutting. It is composed of an adhesive layer (paste layer) made of resin on one side of the layer.

The wafer 11 is attached to the central part of the adhesive tape 19, and a metal ring-shaped frame 21 is attached to the outer peripheral part of the adhesive tape 19. Thereby, a wafer unit 23 in which the frame 21 supports the wafer 11 through the adhesive tape 19 can be formed.

As shown in FIG. 1, a touch panel 14 is provided on the front surface 6 a of the cover 6 of the cutting device 2. The touch panel 14 is, for example, a touch-panel type liquid crystal display, and also serves as an input device and a display device. The input device is used to allow the operator to input instructions to the control unit 16 (described later), and the display device is used to display 10Acquired images, or various processing conditions, etc.

Furthermore, it is also possible to replace the touch panel 14 with a monitor, display, etc. having only the function of a display device. However, in this case, a user interface such as a keyboard, mouse, trackball, joystick, etc. is used as an input device and is additionally provided.

The cutting device 2 is provided with a control unit 16 for controlling the operation of each component. The control unit 16 controls, for example, the operations of the cutting unit 8, the camera unit 10, the work clamp table 12, the touch panel 14, the X-axis direction movement mechanism, and the Y-axis and Z-axis direction movement mechanism.

The control unit 16 is constituted by a computer. The aforementioned computer includes processing devices such as a processor represented by a CPU (Central Processing Unit), and a DRAM (Dynamic Random Access Memory). ) And other auxiliary memory devices such as primary memory devices, flash memory, hard disk drives, solid state drives, etc.

The auxiliary memory device stores software containing predetermined programs. The function of the control unit 16 can be realized by operating the processing device and the like in accordance with this software. FIG. 4 is a diagram illustrating the configuration of the control unit 16.

As shown in FIG. 4, the control unit 16 has functional blocks, and the aforementioned functional blocks can perform various processing on the images captured by the camera unit 10. One of the function blocks is the information acquisition unit 16a, and the information acquisition unit 16a performs a known labeling process on the binarized image including one or more markers 17.

For example, the information acquisition unit 16a assigns a label number 1 to each pixel located on the boundary line of the mark 17a and inside the boundary line, and assigns a label number 0 to each pixel located outside the boundary line of the mark 17a. In this way, the information obtaining unit 16a obtains information corresponding to the coordinates and label numbers of each pixel.

Fig. 5 is a diagram showing an example of labeling processing for one mark 17a. In FIG. 5, for convenience, one pixel is represented by a circle. In FIG. 5, although an example in which the mark 17a is constituted by 29×29 pixels in the vertical and horizontal directions is shown, the number of pixels constituting the mark 17a is not limited to this example.

The information acquisition unit 16a specifies the positions of the end portions in the vertical direction and the horizontal direction in each pixel having the label number 1. Specifically, the information acquisition unit 16a specifies the upper end position Y _U and the lower end position Y _D , and the left end position X _L and the right end position X _R.

In Fig. 5, for the convenience of description, the coordinates are shown with a label number (X‚Y‚ label number). In addition, in FIG. 5, two of the plural coordinates (X _U ‚Y _U ) located at the upper end are representatively displayed. Similarly, the two coordinates at the lower end (X _D ‚Y _D ), the two coordinates at the left end (X _L ‚Y _L ), and the two coordinates at the right end (X _R ‚Y _R ) are representatively displayed respectively. .

_{The information acquisition unit 16a specifies the center coordinates (X C} ‚Y _C ) located at the center of one or more marks 17 in the vertical direction and the horizontal direction. For example, the information acquisition unit 16a _{calculates the center position Y C in the} vertical direction from the average of the _{upper end position Y U} and the lower end position Y _{D , and calculates the center position X C in the} horizontal direction from the average of the left end position X _L and the right end position X _R .

The upper end position Y _U , the lower end position Y _D , the left end position X _L , the right end position X _R and the center coordinate (X _C ‚Y _C ) become the information of the circumscribed rectangle 25 (refer to FIG. 6) constituting the mark 17. However, in this embodiment, for ease of understanding, an example in which the circumscribed rectangle 25 is displayed on the screen of the touch panel 14 is described, but the circumscribed rectangle 25 may not necessarily be displayed on the screen.

As shown in FIG. 6, in the center of the imaging area of the camera unit 10, a quadrangular frame line 27 formed by a cross line and a square frame surrounding the cross line is displayed. The frame line adjustment part 16b (refer to FIG. 4) automatically adjusts the position and size of the frame line 27 relative to the circumscribed rectangle 25 so that the circumscribed rectangle 25 falls within the frame line 27.

Specifically, the frame line adjustment unit 16b first operates the X-axis direction moving mechanism and the Y-axis Z-axis direction moving mechanism to move the imaging area of the camera unit 10 to: the center coordinates (X _C ‚Y _C ) is moved to the center of the frame line 27 (that is, the intersection of the cross lines).

Next, the frame line adjustment unit 16b adjusts the size of the frame line 27 facing the circumscribed rectangle 25 so that the frame line 27 and the interval between the frame line 27 and the rectangle 25 located inside and outside the frame line 27 become a predetermined distance.

Although the interval between the frame line 27 and the circumscribed rectangle 25 can be adjusted to, for example, a distance corresponding to 10 pixels, the interval is not limited to a distance corresponding to 10 pixels, and may be set to an arbitrary distance. The adjusted frame line 27 is displayed on the touch panel 14 for confirmation.

The control unit 16 has a calibration mark registration unit 16c (refer to FIG. 4). The calibration mark registration unit 16c registers the resized frame line 27 and the area containing one or more marks 17 existing inside the frame line 27 as the calibration mark 29 (see FIG. 8(B)). A predetermined memory area of the control unit 16. In this way, the calibration mark 29 can be set on the cutting device 2.

The control unit 16 of this embodiment automatically adjusts the position and size of the frame line 27 in response to the mark 17. In this way, the calibration mark 29 can be automatically set in a predetermined range in accordance with the shape and size of the mark 17 without depending on the feeling of the operator.

Next, referring to FIGS. 4 to 9, the method of setting the calibration mark 29 of the first embodiment (that is, the method of performing the teaching step) will be described. In the first embodiment, one mark 17 is registered as the calibration mark 29. FIG. 9 is a flowchart of a method of setting the calibration mark 29.

First, the back surface 11b side of the wafer 11 is held by the holding surface 12a with the adhesive tape 19 interposed therebetween. Then, the operator observes the front side 11a through the camera unit 10, and photographs one or more marks 17 that may be used as the calibration marks 29 (photographing step S10) (refer to FIG. 4).

Next, the information obtaining unit 16a obtains the information of the circumscribed rectangle 25 constituting each of the more than one mark 17 captured in the imaging step S10 (that is, the upper end position Y _U , the lower end position Y _D , and the left end in FIG. 5 Position X _L , right end position X _R and center coordinates (X _C ‚Y _C )) (information acquisition step S20).

FIG. 6 is a diagram showing an example of a screen displayed by the circumscribed rectangle 25 of each mark 17. 6 shows: the circumscribed rectangle 25a of the mark 17a, the circumscribed rectangle 25b of the mark 17b, the circumscribed rectangle 25c of the mark 17c, and the circumscribed rectangle 25d of the mark 17d.

In the first embodiment, after the information acquisition step S20, the operator touches the display area of one of the marks 17 with a finger, thereby designating one mark 17 through the touch panel 14. Fig. 7 is a diagram showing a situation where the operator designates one mark 17a. In addition, in FIG. 7, the fingers and hands of the operator are represented by pictograms for convenience.

The frame line adjustment unit 16b moves the imaging area in response to the situation where one mark 17a is designated, so that the center of the circumscribed rectangle 25a moves to the center of the frame line 27 (the dotted arrow in FIG. 7). In addition, the frame line adjustment unit 16b adjusts the size of the frame line 27 so that the distance between the circumscribed rectangle 25a and the frame line 27 becomes a predetermined distance (frame line adjustment step S30).

FIG. 8(A) is a diagram showing the frame line 27 adjusted in position and size. In FIG. 8(A), although a design is added to the mark 17a in order to clarify the range of the mark 17a and for the convenience of description, the design is not displayed on the actual screen.

After the frame line adjustment step S30, the calibration mark registration unit 16c sets the resized frame line 27 and the area containing the mark 17a existing inside the frame line 27 as the calibration mark 29, and registers it in the predetermined control unit 16 Memory area (registration step S40).

FIG. 8(B) is a diagram showing the calibration mark 29 set in the cutting device 2 through S10 to S40. In addition, in FIG. 8(B), although the aim is to clearly form the outer peripheral end of the calibration mark 29, the dotted line represents the square part corresponding to the frame line 27, but the actual calibration mark 29 is not This dashed line is not shown.

In this embodiment, the position and size of the frame line 27 are automatically adjusted in accordance with the mark 17a. Thereby, it is possible to automatically set the calibration mark 29 in a predetermined range in accordance with the shape and size of the mark 17a, etc., regardless of the feeling of the operator.

Next, the second embodiment will be described. In the second embodiment, the cutting device 2 is used to set an area including a plurality of marks 17 as the calibration mark 29. First, the marks 17a, 17b, 17c, and 17d that have the possibility of being used as the calibration marks 29 are photographed (photographing step S10).

Next, the information acquiring unit 16a acquires the upper end position Y _U , the lower end position Y _D , the left end position X _L , the right end position X _R and the center coordinates (X _C ‚Y _C ) of each of the marks 17a, 17b, 17c, and 17d (information Obtain step S20). That is, the information of the circumscribed rectangle 25 constituting each of the four marks 17 is obtained.

In the second embodiment, after the information acquisition step S20, the operator touches the display area corresponding to any area surrounded by the marks 17a, 17b, 17c, and 17d with a finger. FIG. 10(A) is a diagram showing how the operator designates an arbitrary area 31 surrounded by a plurality of marks 17.

In response to the operator’s designation, the information acquisition unit 16a of the second embodiment identifies all the markers 17 at least partly located within the range of a predetermined size rectangle 33 centered on the area 31, and determines that they are designated by the operator Marked 17 of these all.

In the example shown in FIG. 10(A), since parts of the four marks 17a, 17b, 17c, and 17d are located within the rectangle 33, the information acquisition unit 16a will determine that the operator has designated the four marks 17a, 17b, 17c and 17d.

When a plurality of marks 17 are designated, the information acquisition unit 16a obtains information that constitutes a circumscribed rectangle 35 circumscribing the entire plurality of marks 17. For example, the information obtaining unit 16a obtains information of the circumscribed rectangle 25 that constitutes each of the four marks 17 and obtains the information of the circumscribed rectangle 35 that circumscribes the entirety of the four marks 17.

In the example of FIG. 10(A), the information acquisition unit 16a starts from the upper end position Y _{U of the} mark 17a or 17b, the lower end position Y _{D of the} mark 17d, the left end position X _{L of the} mark 17b, and the right end position X of the mark 17a or 17d. _R obtains the information of the upper end position Y _U , the lower end position Y _D , the left end position X _L and the right end position X _R of the circumscribed rectangle 35.

Furthermore, the information acquisition unit 16a _{calculates the longitudinal center position Y C of the circumscribed rectangle 35 from the average of the upper end position Y U} and the lower end position Y _D of the circumscribed rectangle 35, and calculates the center position Y C of the circumscribed rectangle 35 from the left end position X _L and the right end position X _{The average of R is used to calculate the center position X C} of the horizontal direction of the circumscribed rectangle 35. In this way, the center coordinates (X _C ‚Y _C ) of the circumscribed rectangle 35 are obtained.

After that, the frame line adjustment unit 16b will move the imaging area in response to the situation where the four marks 17 are designated, so that the center of the circumscribed rectangle 35 moves to the center of the frame line 27. Furthermore, the size of the frame line 27 is adjusted such that the circumscribed rectangle 35 falls within the frame line 27, and the interval between the circumscribed rectangle 35 and the frame line 27 becomes a predetermined distance (frame line adjustment step S30).

FIG. 10(B) is a diagram showing the frame line 27 after the frame line adjustment step S30. After the frame line adjustment step S30, the calibration mark registration unit 16c registers the resized frame line 27 and the area containing the marks 17a, 17b, 17c, and 17d existing inside the frame line 27 as the calibration mark 29 ( Login step S40).

In this embodiment, the size of the frame line 27 is automatically adjusted in accordance with the shape, size, and arrangement of the four marks 17. Therefore, it is possible to automatically set the calibration mark 29 in a predetermined range in accordance with the shape, size, and arrangement of the plurality of marks 17 without depending on the feeling of the operator.

Next, the third embodiment will be described. In the third embodiment, the imaging step S10 and the information obtaining step S20 are performed in the same manner as in the second embodiment. However, in the third embodiment, the operator touches the display area in the vicinity of the corner corresponding to one mark 17 with a finger, so that there is only one mark 17 located in the rectangle 33.

FIG. 11(A) is a diagram showing a state where the operator touches the display area corresponding to the vicinity of the lower right corner of the mark 17d with a finger. In this way, only a part of the mark 17d located in the rectangle 33 centered on the area 31 at the lower right of the mark 17d is designated by the operator.

In response to the operator’s designation, move the shooting area so that the center of the circumscribed rectangle 25d moves to the center of the frame line 27, and adjust the size of the frame line 27 so that the interval between the circumscribed rectangle 25d and the frame line 27 is determined in advance Distance (frame line adjustment step S30).

FIG. 11(B) is a diagram showing the frame line 27 after the frame line adjustment step S30. In this embodiment, the mark 17d can be selected by specifying the vicinity of the display area of the mark 17d so that the rectangle 33 includes a part of one mark 17d. In addition, the calibration mark 29 can be automatically set in a predetermined range in accordance with the shape and size of the selected mark 17d.

In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the purpose of the present invention. The mark 17 may be formed on the device 15 as in the above-mentioned embodiment, or may be formed on the planned dividing line 13. In addition, the mark 17 is not limited to a geometric shape, and may be a letter, a number, or the like.

However, in the above-mentioned embodiment, although the example of the cutting device 2 is described as the processing device, the processing device may be a laser processing device (not shown) that processes the wafer 11 with a laser beam. A laser processing unit can be configured in the laser processing device to replace the cutting unit 8. The laser processing unit includes a laser oscillator for generating a pulsed laser beam, or a condenser lens for condensing the laser beam.

The laser beam may also have a wavelength that penetrates the wafer 11. In this case, the focus point of the pulsed laser beam is positioned inside the wafer 11, and the wafer 11 is processed by multiphoton absorption (so-called stealth dicing). The laser beam may also have a wavelength that can be absorbed by the wafer 11. In this case, the wafer 11 can be ablated by a pulsed laser beam.

2: Cutting device 4: Base 6: Cover 6a: Front surface 8: Cutting unit 10: Camera unit 11: Wafer 11a: Front side 11b: Back side 12: Working chuck table 12a: Holding surface 13: Partition plan line 14: Touch panel 15: Device 16: Control unit 16a: Information acquisition unit 16b: Frame adjustment unit 16c: Calibration mark registration unit 17, 17a, 17b, 17c, 17d: Mark 19: Adhesive tape 21: Frame 23: Wafer unit 25, 25a, 25b, 25c, 25d, 35: circumscribed rectangle 27: frame line 29: calibration mark 31: area 33: rectangle X _C , Y _C : center position X _L : left end position X _R : right end position Y _U : upper end Position Y _D : Lower end position X, Y, Z: Direction S10: Shooting step S20: Information acquisition step S30: Frame adjustment step S40: Registration step

Fig. 1 is a perspective view of a cutting device. Fig. 2 is a plan view of a wafer and the like. Fig. 3 is a partial enlarged view of the front side of the wafer. Fig. 4 is a diagram illustrating the structure of a control unit. Fig. 5 is a diagram showing an example of labeling processing. Fig. 6 is a diagram showing an example of a screen on which each mark is displayed outside the rectangle. Fig. 7 is a diagram showing how the operator designates a mark. FIG. 8(A) is a diagram showing the frame line of the adjusted position and size, and FIG. 8(B) is a diagram showing the calibration mark. Fig. 9 is a flowchart of a method for setting calibration flags. Fig. 10(A) is a diagram showing a situation where the operator designates an arbitrary position surrounded by a plurality of marks, and Fig. 10(B) is a diagram showing the frame line after the frame line adjustment step. Fig. 11(A) is a diagram showing a situation where the operator touches the display area corresponding to the vicinity of the lower right corner of the mark with a finger, and Fig. 11(B) is a diagram showing the frame line after the frame line adjustment step .

13: Divide the planned line

15: Device

17a, 17b, 17c, 17d: mark

25, 25a, 25b, 25c, 25d: circumscribed rectangle

27: frame line

Claims (2)

A method for setting calibration marks is to set an area containing more than one mark designated by an operator as a calibration mark in a processing device for processing a wafer with a plurality of marks formed on the front side. The setting method is characterized by the following steps: In the photographing step, the one or more marks that have been formed on the wafer are photographed by the photographing unit; The information obtaining step is to obtain the information of the circumscribed rectangle of each of the one or more marks photographed in the one or more marks; In the frame adjustment step, after the information acquisition step, in response to a situation where one or more of the more than one mark is designated, the circumscribed rectangle of the one mark or the entirety of the plurality of marks Move to the center of the square frame line used when setting the processing device as a calibration mark, and automatically adjust the position and size of the frame line relative to the circumscribed rectangle to: the circumscribed rectangle falls on Within the frame line, and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and The registration step is to register the region containing the one mark or the plurality of marks in the inner side of the frame line that has been resized as a calibration mark in the processing device. A processing device that can set an area containing more than one mark designated by an operator as a calibration mark when processing a wafer with a plurality of marks formed on the front side. The aforementioned processing device is characterized by: Work clamp table to attract and hold the wafer; A photographing unit having a photographing element, which is arranged above the work chuck table and photographs the wafer attracted and held by the work chuck table; A display device, which displays the image obtained by the photographing unit; The control unit has a processor and controls the actions of the work clamp table, the photographing unit and the display device; and Input device to input the instructions of the operator to the control unit, The control unit contains: The information obtaining unit obtains information of the circumscribed rectangle of each of the one or more marks photographed by the photographing unit; The frame adjustment unit, in response to the situation where one or more of the one or more marks is designated through the input device, the center of the circumscribed rectangle of the one mark or the entirety of the plurality of marks, Move to the center of the square frame line used in the processing device to be set as a calibration mark, and automatically adjust the position and size of the frame line relative to the circumscribed rectangle to: the circumscribed rectangle falls on the frame line , And the distance between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and The calibration mark registration unit registers an area including the one mark or the plurality of marks on the inner side of the frame line that has been resized as a calibration mark.

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