CN113496933A - Method for setting alignment mark and processing device - Google Patents

Method for setting alignment mark and processing device Download PDF

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Publication number
CN113496933A
CN113496933A CN202110347211.2A CN202110347211A CN113496933A CN 113496933 A CN113496933 A CN 113496933A CN 202110347211 A CN202110347211 A CN 202110347211A CN 113496933 A CN113496933 A CN 113496933A
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Prior art keywords
marks
alignment mark
mark
circumscribed rectangle
frame line
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CN202110347211.2A
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Chinese (zh)
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大森崇史
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a method and a device for setting an alignment mark, which automatically adjust the range of a designated mark to set the alignment mark. The setting method of the alignment mark comprises the following steps: an imaging step of imaging 1 or more marks formed on the front surface side of the wafer; an information acquisition step of acquiring information of respective circumscribed rectangles constituting 1 or more marks with respect to the 1 or more marks photographed; a frame line adjusting step of moving the center of the circumscribed rectangle of the whole of the 1 mark or the plurality of marks to the center of the quadrangular frame line according to the condition that the 1 mark or the plurality of marks are designated, and automatically adjusting the position and the size of the frame line relative to the circumscribed rectangle in a mode of accommodating the circumscribed rectangle in the frame line and adjusting the interval between the circumscribed rectangle and the frame line to a predetermined distance; and a registration step of registering, as an alignment mark, a region including 1 mark or a plurality of marks on the inner side of the frame wire whose size has been adjusted in the processing device.

Description

Method for setting alignment mark and processing device
Technical Field
The present invention relates to a method for setting an alignment mark in which a region including 1 or more marks designated by an operator is set as an alignment mark in a processing apparatus for processing a wafer having a plurality of marks formed on a front surface side, and a processing apparatus capable of setting the region as an alignment mark.
Background
A wafer having devices such as ICs (Integrated circuits) formed in respective regions defined by a plurality of planned dividing lines set in a lattice shape on the front surface side is ground to a predetermined thickness on the back surface side of the wafer, and then processed along the planned dividing lines by a processing apparatus to be divided into a plurality of device chips.
As a processing apparatus for processing a wafer along a planned dividing line, for example, a cutting apparatus is used. The cutting device has a chuck table for suction holding the wafer. The chuck table is rotatable about a predetermined rotation axis. A camera and a cutting unit including a cutting tool are disposed above the chuck table.
Before the wafer is cut by the cutting apparatus, an alignment step for positioning the cutting tool on the extension line of the planned dividing line is performed (for example, see patent document 1). In the alignment step, a mark having a predetermined shape formed on the front surface side of the wafer is imaged in a state where the back surface side of the wafer is sucked and held by the chuck table, and the mark is set as an alignment mark in the cutting device (teaching step).
Then, pattern matching in the image is used to determine the alignment marks of the same shape that are present at the two separate locations. Then, the orientation of the wafer is adjusted so that the line to divide is parallel to the X axis of the cutting device by rotating the chuck table by a predetermined angle using the coordinates of the alignment marks at the two positions.
In this way, in the alignment step, the teaching step is first performed. In the teaching process, an operator searches for an alignment mark and determines which mark is to be used as the alignment mark in a state where an image of the front surface side of the wafer captured by the camera is displayed on the display device.
In the teaching step, a frame line composed of a cross line and a square frame surrounding the cross line is displayed in the center of the image, and the operator adjusts the position of the frame line in the X-axis direction and the Y-axis direction using the operation keys to enlarge/reduce the size of the frame line.
Then, in a state where a mark serving as an alignment mark is accommodated inside the wire, the mark and a region around the mark surrounded by the wire are registered as the alignment mark. However, since the position and size of the wire are usually adjusted by manual work of an operator, the size of the wire may be different every time the alignment mark is set or every time a different operator sets the alignment mark.
Patent document 1: japanese laid-open patent publication No. 7-106405
If the size of the frame line differs from setting to setting, the range of the mark set as the alignment mark may differ, and the area of the region around the mark may differ, although the mark of the same shape is set as the alignment mark. That is, although marks of the same shape are targeted, it is possible to set alignment marks of different shapes and sizes.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to automatically adjust the range of a designated mark and set an alignment mark.
According to one aspect of the present invention, there is provided an alignment mark setting method for setting, as an alignment mark, a region including 1 or more marks designated by an operator in a processing apparatus for processing a wafer having a plurality of marks formed on a front surface side, the method comprising: an imaging step of imaging the 1 or more marks formed on the wafer by an imaging unit; an information acquisition step of acquiring information of respective circumscribed rectangles constituting the 1 or more marks with respect to the 1 or more marks photographed by the photographing step; a frame line adjusting step of, after the information acquiring step, moving the center of the circumscribed rectangle of the 1 or more marks to the center of a quadrangular frame line used when the alignment mark is to be set in the processing apparatus, based on the fact that 1 or more marks among the 1 or more marks have been designated, and automatically adjusting the position and size of the frame line with respect to the circumscribed rectangle so as to accommodate the circumscribed rectangle in the frame line and adjust the interval between the circumscribed rectangle and the frame line to a predetermined distance; and a registration step of registering, as an alignment mark, a region including the 1 mark or the plurality of marks on the inner side of the frame wire whose size has been adjusted in the processing apparatus.
According to another aspect of the present invention, there is provided a processing apparatus capable of setting, as an alignment mark, a region including 1 or more marks designated by an operator when processing a wafer having a plurality of marks formed on a front surface side, the processing apparatus including: a chuck table for sucking and holding the wafer; an imaging unit having an imaging element, the imaging unit being disposed above the chuck table and imaging the wafer sucked and held on the chuck table; a display device that displays the image acquired by the photographing unit; a control unit having a processor, the control unit controlling the operations of the chuck table, the photographing unit, and the display device; and an input device that inputs an instruction of an operator to the control unit, the control unit including: an information acquisition unit that acquires information of each circumscribed rectangle constituting the 1 or more marks, for the 1 or more marks imaged by the imaging unit; a frame line adjusting unit that moves the center of the circumscribed rectangle of the 1 or more marks to the center of a frame line of a quadrangle used when the alignment mark is set in the processing device, based on the designation of 1 or more marks among the 1 or more marks by the input device, and automatically adjusts the position and size of the frame line with respect to the circumscribed rectangle so that the circumscribed rectangle is accommodated in the frame line and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and an alignment mark registration unit that registers, as an alignment mark, a region including the 1 mark or the plurality of marks on the inner side of the frame line whose size has been adjusted.
In a method of setting an alignment mark according to an aspect of the present invention, information of a circumscribed rectangle constituting 1 or more marks is acquired for 1 or more marks that have been captured (information acquisition step). Then, after the information acquisition step, the operator designates 1 or more marks among the 1 or more marks.
According to the designation by the operator, the center of the circumscribed rectangle of 1 mark or the entire plurality of marks is moved to the center of the rectangular outline, and the position and size of the outline with respect to the circumscribed rectangle are automatically adjusted so that the circumscribed rectangle is accommodated in the outline and the interval between the circumscribed rectangle and the outline is adjusted to a predetermined distance (outline adjusting step).
Then, the region including 1 mark or a plurality of marks inside the adjusted size wire is registered as an alignment mark in the processing device (registration step). Therefore, the alignment mark can be automatically set within a predetermined range according to the shape and size of the mark, without depending on the setting of the operator's feeling.
Drawings
Fig. 1 is a perspective view of a cutting device.
Fig. 2 is a plan view of a wafer or the like.
Fig. 3 is a partial enlarged view of the front side of the wafer.
Fig. 4 is a diagram illustrating the configuration of the control unit.
Fig. 5 is a diagram showing an example of the labeling process.
Fig. 6 is a diagram showing an example of a screen on which a circumscribed rectangle of each mark is displayed.
Fig. 7 is a diagram showing a case where the operator designates the mark.
Fig. 8 (a) is a diagram showing the outline after the position and size are adjusted, and fig. 8 (B) is a diagram showing the alignment mark.
Fig. 9 is a flowchart of a setting method of an alignment mark.
Fig. 10 (a) is a diagram showing a case where the operator designates an arbitrary position surrounded by a plurality of marks, and fig. 10 (B) is a diagram showing the outline after the outline adjusting step.
Fig. 11 (a) is a diagram showing a state in which the operator touches the display region corresponding to the vicinity of the lower right corner of the mark with a finger, and fig. 11 (B) is a diagram showing the frame line after the frame line adjusting step.
Description of the reference symbols
2: a cutting device; 4: a base station; 6: a cover; 6 a: a front surface; 8: a cutting unit; 10: a camera unit; 12: a chuck table; 12 a: a holding surface; 14: a touch panel; 16: a control unit; 16 a: an information acquisition unit; 16 b: a frame line adjusting part; 16 c: an alignment mark registration unit; 11: a wafer; 11 a: a front side; 11 b: a back side; 13: dividing the predetermined line; 15: a device; 17. 17a, 17b, 17c, 17 d: marking; 19: an adhesive tape; 21: a frame; 23: a wafer unit; 25. 25a, 25b, 25c, 25d, 35: a circumscribed rectangle; 27: a frame line; 29: aligning the mark; 31: an area; 33: rectangular.
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view of a cutting device (machining device) 2. The X-axis direction (machining feed direction), the Y-axis direction (indexing feed direction), and the Z-axis direction (vertical direction and height direction) shown in fig. 1 are perpendicular to each other.
In fig. 1, a part of the components is represented by functional blocks. The cutting device 2 includes a base 4 for supporting each structure. A cover 6 for covering the base 4 is provided above the base 4. A predetermined space is formed inside the cover 6.
In the predetermined space, a cutting means (machining means) 8 for cutting (machining) the wafer 11 is disposed. The cutting unit 8 can be moved in the Y-axis direction and the Z-axis direction by a Y-axis Z-axis direction moving mechanism, not shown.
The Y-axis Z-axis direction moving mechanism includes, for example: a ball screw type Y-axis direction moving mechanism (not shown) that moves a Y-axis moving plate (not shown) in the Y-axis direction; and a ball screw type Z-axis direction moving mechanism (not shown) provided in the Y-axis moving plate and moving the cutting unit 8 in the Z-axis direction.
The cutting unit 8 has a prismatic spindle housing whose longitudinal direction is arranged substantially parallel to the Y-axis direction. A part of a cylindrical main shaft (not shown) is rotatably housed in the main shaft housing.
A rotation drive source (not shown) such as a motor is provided at one end of the spindle, and a cutting tool having an annular cutting edge is attached to the other end of the spindle. A part of a camera unit (imaging unit) 10 is fixed to one side surface of the main shaft housing in the X-axis direction.
The camera unit has: light sources (not shown) such as LEDs; an optical system including a condenser lens (not shown) and the like; and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.
A chuck table 12 for suction-holding the wafer 11 is provided below the cutting unit 8. The chuck table 12 has a substantially disk-shaped frame body formed of metal. The frame body is formed with a recess constituted by a disk-shaped space.
One end of a suction passage (not shown) is exposed at the bottom surface of the recess, and a suction source (not shown) such as a vacuum pump or an ejector is connected to the other end of the suction passage. A disk-shaped porous plate is fixed to the concave portion.
When the suction source is operated, a negative pressure is generated on the upper surface (holding surface 12a) of the porous plate via the suction path. A rotation drive source (not shown) such as a motor is connected to a lower side of the chuck table 12.
The rotation drive source rotates the chuck table 12 about a predetermined rotation axis substantially parallel to the Z-axis direction. A ball screw type X-axis direction moving mechanism (not shown) for moving the chuck table 12 and the rotation drive source in the X-axis direction is provided below the rotation drive source.
A disk-shaped wafer 11 and the like are placed on the holding surface 12a of the chuck table 12. Fig. 2 is a plan view of the wafer 11 and the like. The wafer 11 is made of a semiconductor such as silicon. However, the material, shape, structure, size, and the like of the wafer 11 are not limited.
The front surface 11a of the wafer 11 is divided into a plurality of regions by planned dividing lines (streets) 13 arranged in a grid pattern. In each region, a device 15 such as an IC (Integrated Circuit) or an LSI (Large-Scale Integration) is formed. In addition, the kind, number, shape, structure, size, arrangement, and the like of the devices 15 are also not limited.
A plurality of marks 17 (see fig. 3) having a predetermined shape are formed in the vicinity of the line to divide 13. The mark 17 is used as an alignment mark 29 (see fig. 8B), and the alignment mark 29 serves as a reference when the wafer 11 is aligned.
The mark 17 is formed by removing a part of the outermost surface of the circuit layer formed on the active region constituting the semiconductor element by etching or the like, for example. If the front face 11a side is photographed by the camera unit 10, an image of the mark 17 is acquired. Fig. 3 is a partially enlarged view of the front surface 11a side of the wafer 11.
Fig. 3 shows 2 devices 15 arranged with 1 line to divide 13 therebetween. In the vicinity of the line to divide 13 of 1 device 15 shown in fig. 3, a substantially L-shaped mark 17a, a substantially circular mark 17b, a substantially square mark 17c, and a substantially cross-shaped mark 17d are formed.
As shown in fig. 2, an adhesive tape (dicing tape) 19 including a circular base material layer made of a resin and a resin adhesive layer (paste layer) provided on one surface of the base material layer is attached to the back surface 11b side of the wafer 11 before cutting.
The wafer 11 is attached to the center of the adhesive tape 19, and a metal ring-shaped frame 21 is attached to the outer periphery of the adhesive tape 19. Thereby, the wafer unit 23 in which the wafer 11 is supported by the frame 21 via the adhesive tape 19 is formed.
As shown in fig. 1, a touch panel 14 is provided on the front surface 6a of the cover 6 of the cutting apparatus 2. The touch panel 14 is, for example, a touch panel type liquid crystal display, and serves as both an input device for an operator to input an instruction to the control unit 16 (described later) and a display device for displaying an image acquired by the camera unit 10, various processing conditions, and the like.
Instead of the touch panel 14, a monitor, a display, or the like having only the function of the display device may be provided. However, in this case, a user interface such as a keyboard, a mouse, a trackball, or a joystick is separately provided as the input device.
The cutting apparatus 2 is provided with a control unit 16 for controlling the operation of each component. The control unit 16 controls, for example, the operations of the cutting unit 8, the camera unit 10, the chuck table 12, the touch panel 14, the X-axis direction moving mechanism, and the Y-axis Z-axis direction moving mechanism.
The control unit 16 is constituted by, for example, a computer including: a Processing device such as a processor represented by a Central Processing Unit (CPU); a main Memory device such as a DRAM (Dynamic Random Access Memory); and secondary storage devices such as flash memory, hard drives, solid state drives, and the like.
The auxiliary storage device stores software including a predetermined program. The function of the control unit 16 is realized by operating a processing device or the like in accordance with the software. Fig. 4 is a diagram illustrating the configuration of the control unit 16.
As shown in fig. 4, the control unit 16 has functional blocks that perform various processes on the image captured by the camera unit 10. One of the functional blocks is an information acquisition section 16a, and the information acquisition section 16a performs a known labeling (labeling) process on the binarized image including 1 or more markers 17.
For example, the information acquiring unit 16a assigns a label number 1 to each pixel located on the boundary line of the mark 17a and on the inner side of the boundary line, and assigns a label number 0 to each pixel located on the outer side of the boundary line of the mark 17 a. In this way, the information acquiring unit 16a acquires the information of the coordinates and the tag number corresponding to each pixel.
Fig. 5 is a diagram illustrating an example of labeling processing for 1 marker 17 a. In fig. 5, 1 pixel is represented by a circle for convenience. In fig. 5, the mark 17a is formed of 29 × 29 pixels in the vertical and horizontal directions, but the number of pixels forming the mark 17a is not limited to this example.
The information acquiring section 16a determines the positions of the longitudinal and lateral ends in each pixel having the label number 1. Specifically, the information acquiring unit 16a specifies the upper end position YUAnd lower end position YDAnd a left endPosition XLAnd a right end position XR。
Fig. 5 shows (X, Y, label number) of coordinates added with a label number for convenience of explanation. In addition, in fig. 5, a plurality of coordinates (X) at the upper end are representatively shownU，YU)2 of the above. Likewise, 2 coordinates (X) at the lower end are respectively representatively shownD，YD)2 coordinates (X) at the left endL，YL) And 2 coordinates (X) at the right endR，YR)。
The information acquiring section 16a determines the center coordinates (X) at the center of the 1 or more marks 17 in the longitudinal and transverse directionsC，YC). For example, the information acquiring section 16a acquires the upper end position YUAnd lower end position YDTo calculate the longitudinal center position YCAccording to the left end position XLAnd a right end position XRTo calculate the lateral center position XC。
Upper end position YULower end position YDLeft end position XLRight end position XRAnd center coordinate (X)C，YC) Information of the circumscribed rectangle 25 (see fig. 6) constituting the mark 17. In the present embodiment, an example in which the circumscribed rectangle 25 is displayed on the screen of the touch panel 14 is described for easy understanding, but the circumscribed rectangle 25 may not necessarily be displayed on the screen.
As shown in fig. 6, a rectangular outline 27 including a cross line and a square outline surrounding the cross line is displayed in the center of the imaging area of the camera unit 10. The wire adjusting portion 16b (see fig. 4) automatically adjusts the position and size of the wire 27 with respect to the circumscribed rectangle 25 so as to accommodate the circumscribed rectangle 25 in the wire 27.
Specifically, the frame line adjusting unit 16b first operates the X-axis direction moving mechanism and the Y-axis Z-axis direction moving mechanism to adjust the center coordinates (X) of the circumscribed rectangle 25 of the 1 mark 17C，YC) The camera unit 10 is moved toward the center of the frame wire 27 (i.e., the intersection of the cross-hairs)The photographing area moves.
Next, the wire adjusting portion 16b adjusts the relative size of the wire 27 with respect to the circumscribed rectangle 25 so that the distance between the wire 27 and the circumscribed rectangle 25 positioned inside the wire 27 becomes a predetermined distance.
For example, the interval between the frame line 27 and the circumscribed rectangle 25 is adjusted so as to be a distance corresponding to 10 pixels, but the interval is not limited to a distance corresponding to 10 pixels, and may be set to any distance. The frame line 27 whose size has been adjusted is displayed on the touch panel 14 for confirmation.
The control unit 16 has an alignment mark registration section 16c (see fig. 4). The alignment mark registration unit 16c registers the frame wire 27 whose size has been adjusted and a region including 1 or more marks 17 inside the frame wire 27 as an alignment mark 29 (see fig. 8B) in a predetermined storage region of the control unit 16. Thus, the alignment mark 29 is set in the cutting device 2.
The control unit 16 of the present embodiment automatically adjusts the position and size of the wire 27 according to the mark 17. Thus, the alignment mark 29 can be automatically set within a predetermined range according to the shape, size, and the like of the mark 17 without depending on the feeling of the operator.
Next, a method of setting the alignment mark 29 (i.e., a method of performing a teaching process) according to embodiment 1 will be described with reference to fig. 4 to 9. In embodiment 1, 1 mark 17 is registered as the alignment mark 29. Fig. 9 is a flowchart of a setting method of the alignment mark 29.
First, the back surface 11b side of the wafer 11 is held by the holding surface 12a via the adhesive tape 19. Then, the operator observes the front surface 11a side with the camera unit 10, and images 1 or more marks 17 that can be used as the alignment marks 29 (imaging step S10) (see fig. 4).
Next, the information acquiring unit 16a acquires information of the circumscribed rectangle 25 constituting each of the 1 or more markers 17 imaged in the imaging step S10 (i.e., the upper end position Y in fig. 5)ULower end position YDLeft end position XLRight end position XRAnd center coordinate (X)C，YC) (information acquisition step S20).
Fig. 6 is a diagram showing an example of a screen on which the circumscribed rectangle 25 of each marker 17 is displayed. In fig. 6, a circumscribed rectangle 25a of the mark 17a, a circumscribed rectangle 25b of the mark 17b, a circumscribed rectangle 25c of the mark 17c, and a circumscribed rectangle 25d of the mark 17d are shown.
In embodiment 1, after the information acquisition step S20, the operator touches the display area of 1 mark 17 with a finger, thereby specifying 1 mark 17 via the touch panel 14. Fig. 7 is a diagram showing a case where the operator designates 1 marker 17 a. In fig. 7, for convenience, the fingers and the hand of the operator are pictorially shown.
When the 1 marker 17a is designated, the frame wire adjusting unit 16b moves the imaging area so as to move the center of the circumscribed rectangle 25a toward the center of the frame wire 27 (dotted arrow in fig. 7). Then, the wire adjusting portion 16b adjusts the size of the wire 27 so that the distance between the circumscribed rectangle 25a and the wire 27 becomes a predetermined distance (wire adjusting step S30).
Fig. 8 (a) is a diagram showing the wire 27 whose position and size have been adjusted. In fig. 8 (a), for convenience of explanation, the mark 17a is marked with a pattern to clearly show the range of the mark 17a, but the pattern is not displayed on the actual screen.
After the wire adjusting step S30, the alignment mark registration unit 16c registers the wire 27 whose size has been adjusted and the area including the mark 17a inside the wire 27 as the alignment mark 29 in a predetermined storage area of the control unit 16 (registration step S40).
Fig. 8 (B) is a diagram showing the alignment mark 29 set in the cutting apparatus 2 through steps S10 to S40. In fig. 8 (B), a portion corresponding to the square of the frame wire 27 is indicated by a broken line for the purpose of clarifying the outer peripheral end portion of the alignment mark 29, but the broken line is not shown in the actual alignment mark 29.
In the present embodiment, the position and size of the wire 27 are automatically adjusted according to the mark 17 a. This allows the alignment mark 29 to be automatically set within a predetermined range according to the shape, size, and the like of the mark 17a without depending on the feeling of the operator.
Next, embodiment 2 will be explained. In embodiment 2, a region including a plurality of marks 17 is set as an alignment mark 29 using the cutting device 2. First, the marks 17a, 17b, 17c, and 17d that are likely to be used as the alignment marks 29 are photographed (photographing step S10).
Next, the information acquiring unit 16a acquires the upper end position Y of each of the marks 17a, 17b, 17c, and 17dULower end position YDLeft end position XLRight end position XRAnd center coordinate (X)C，YC) (information acquisition step S20). That is, information of the circumscribed rectangles 25 constituting the 4 marks 17 is acquired.
In embodiment 2, after the information acquisition step S20, the operator touches the display area corresponding to an arbitrary area surrounded by the markers 17a, 17b, 17c, and 17d with a finger. Fig. 10 (a) is a diagram showing a case where the operator designates an arbitrary area 31 surrounded by a plurality of markers 17.
The information acquiring unit 16a according to embodiment 2 specifies all the marks 17 at least a part of which is located within the range of the rectangle 33 having a predetermined size centered on the area 31 in accordance with the specification by the operator, and determines that the operator has specified all the marks 17.
In the example shown in fig. 10 (a), a part of each of the 4 markers 17a, 17b, 17c, and 17d is located within the rectangle 33, and therefore the information acquisition section 16a determines that the operator has designated the 4 markers 17a, 17b, 17c, and 17 d.
When the plurality of markers 17 are specified, the information acquiring unit 16a acquires information constituting a circumscribed rectangle 35 circumscribing the entirety of the plurality of markers 17. For example, the information acquiring unit 16a acquires information constituting a circumscribed rectangle 35 circumscribed to the whole of the 4 markers 17 from information constituting the circumscribed rectangles 25 of the 4 markers 17.
In the example of fig. 10 (a), the information acquiring unit 16a acquires the upper end position Y of the mark 17a or 17bUAnd the lower end position Y of the mark 17dDLeft end position X of mark 17bLAnd the right end position X of the mark 17a or 17dRObtain the upper end position Y of the circumscribed rectangle 35ULower end position YDLeft end position XLAnd a right end position XRThe information of (1).
In addition, the information acquiring section 16a acquires the upper end position Y of the circumscribed rectangle 35UAnd lower end position YDTo calculate the longitudinal center position Y of the circumscribed rectangle 35CAccording to the left end position X of the circumscribed rectangle 35LAnd a right end position XRTo calculate the lateral center position X of the circumscribed rectangle 35C. Thereby, the center coordinates (X) of the circumscribed rectangle 35 are acquiredC，YC)。
Then, in the case where 4 markers 17 have been designated, the frame wire adjusting unit 16b moves the imaging area so that the center of the circumscribed rectangle 35 moves toward the center of the frame wire 27. Then, the size of the wire 27 is adjusted so that the circumscribed rectangle 35 is accommodated in the wire 27 and the distance between the circumscribed rectangle 35 and the wire 27 is a predetermined distance (wire adjusting step S30).
Fig. 10 (B) is a diagram showing the wire 27 after the wire adjusting step S30. After the wire adjusting step S30, the alignment mark registration unit 16c registers the wire 27 whose size has been adjusted and the area including the marks 17a, 17b, 17c, and 17d inside the wire 27 as the alignment mark 29 (registration step S40).
In the present embodiment, the size of the wire 27 is automatically adjusted according to the shape, size, and arrangement of the 4 marks 17. Therefore, the alignment mark 29 can be automatically set within a predetermined range according to the shape, size, and arrangement of the plurality of marks 17 without depending on the feeling of the operator.
Next, embodiment 3 will be explained. In embodiment 3, the photographing step S10 and the information acquisition step S20 are performed in the same manner as in embodiment 2. However, in embodiment 3, the operator touches the display area corresponding to the vicinity of the corner of 1 marker 17 with a finger so that the number of markers 17 located within the rectangle 33 is only 1.
Fig. 11 (a) is a diagram showing a case where the operator touches the display area corresponding to the vicinity of the lower right corner of the marker 17d with a finger. In this way, only a part of the mark 17d located within the rectangle 33 centered on the area 31 right below the mark 17d is specified by the operator.
The imaging area is moved so that the center of the circumscribed rectangle 25d moves toward the center of the wire 27 in accordance with the designation by the operator, and the size of the wire 27 is adjusted so that the distance between the circumscribed rectangle 25d and the wire 27 becomes a predetermined distance (wire adjusting step S30).
Fig. 11 (B) is a diagram showing the wire 27 after the wire adjusting step S30. In the present embodiment, the marker 17d can be selected by designating the vicinity of the display region of the marker 17d so that the rectangle 33 includes a part of 1 marker 17 d. In addition, the alignment mark 29 can be automatically set within a predetermined range according to the shape and size of the selected mark 17 d.
The structure, method, and the like of the above embodiments can be modified as appropriate without departing from the scope of the object of the present invention. The mark 17 may be formed in the device 15 as in the above-described embodiment, or may be formed in the line to divide 13. The mark 17 is not limited to a geometric shape, and may be a character, a number, or the like.
In the above-described embodiment, the example of the cutting device 2 has been described as the processing device, but the processing device may be a laser processing device (not shown) that processes the wafer 11 with a laser beam. In the laser processing apparatus, a laser processing unit is disposed instead of the cutting unit 8. The laser processing unit includes a laser oscillator for generating a pulsed laser beam, a condenser lens for condensing the laser beam, and the like.
The laser beam may also have a wavelength that is transmitted through the wafer 11. In this case, the pulsed laser beam is focused at a spot inside the wafer 11, and the wafer 11 is processed by multiphoton absorption (so-called stealth dicing). The laser beam may also have a wavelength that is absorbed by the wafer 11. In this case, the wafer 11 is ablated with a pulsed laser beam.

Claims (2)

1. A method for setting an alignment mark, in a processing apparatus for processing a wafer having a plurality of marks formed on a front surface side, a region including 1 or more marks designated by an operator is set as the alignment mark,
the method for setting the alignment mark comprises the following steps:
an imaging step of imaging the 1 or more marks formed on the wafer by an imaging unit;
an information acquisition step of acquiring information of respective circumscribed rectangles constituting the 1 or more marks with respect to the 1 or more marks photographed by the photographing step;
a frame line adjusting step of, after the information acquiring step, moving the center of the circumscribed rectangle of the 1 or more marks to the center of a quadrangular frame line used when the alignment mark is to be set in the processing apparatus, based on the fact that 1 or more marks among the 1 or more marks have been designated, and automatically adjusting the position and size of the frame line with respect to the circumscribed rectangle so as to accommodate the circumscribed rectangle in the frame line and adjust the interval between the circumscribed rectangle and the frame line to a predetermined distance; and
a registration step of registering a region including the 1 mark or the plurality of marks on the inner side of the frame wire whose size has been adjusted in the processing apparatus as an alignment mark.
2. A processing apparatus capable of setting a region including 1 or more marks designated by an operator as an alignment mark when processing a wafer having a plurality of marks formed on a front surface side,
the processing device is provided with:
a chuck table for sucking and holding the wafer;
an imaging unit having an imaging element, the imaging unit being disposed above the chuck table and imaging the wafer sucked and held on the chuck table;
a display device that displays the image acquired by the photographing unit;
a control unit having a processor, the control unit controlling the operations of the chuck table, the photographing unit, and the display device; and
an input device that inputs an instruction of an operator to the control unit,
the control unit includes:
an information acquisition unit that acquires information of each circumscribed rectangle constituting the 1 or more marks, for the 1 or more marks imaged by the imaging unit;
a frame line adjusting unit that moves the center of the circumscribed rectangle of the 1 or more marks to the center of a frame line of a quadrangle used when the alignment mark is set in the processing device, based on the designation of 1 or more marks among the 1 or more marks by the input device, and automatically adjusts the position and size of the frame line with respect to the circumscribed rectangle so that the circumscribed rectangle is accommodated in the frame line and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and
and an alignment mark registration unit that registers, as an alignment mark, a region including the 1 mark or the plurality of marks on the inner side of the frame line whose size has been adjusted.
CN202110347211.2A 2020-04-03 2021-03-31 Method for setting alignment mark and processing device Pending CN113496933A (en)

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JP2020067834A JP7399576B2 (en) 2020-04-03 2020-04-03 Alignment mark setting method and processing equipment
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JP2617870B2 (en) 1993-10-04 1997-06-04 株式会社ディスコ Alignment method
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