TW202136326A - Modified hydrogenated block copolymer - Google Patents

Modified hydrogenated block copolymer Download PDF

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TW202136326A
TW202136326A TW110105686A TW110105686A TW202136326A TW 202136326 A TW202136326 A TW 202136326A TW 110105686 A TW110105686 A TW 110105686A TW 110105686 A TW110105686 A TW 110105686A TW 202136326 A TW202136326 A TW 202136326A
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block copolymer
hydrogenated block
modified
modified hydrogenated
unsaturated carboxylic
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石原稔久
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日商Mcpp創新有限責任公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/04Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/04Reduction, e.g. hydrogenation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/46Reaction with unsaturated dicarboxylic acids or anhydrides thereof, e.g. maleinisation

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Abstract

Provided are polyolefins that are soluble in organic solvents, have transparency, rigidity, and heat resistance, have excellent adhesiveness with base materials such as metals, and have suppressed generation of toxic gas during combustion. A modified hydrogenated block copolymer which is a product of modification of a hydrogenated block copolymer by an unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, wherein a modified hydrogenated block copolymer is used in which the hydrogenated block copolymer is a product of hydrogenation of a copolymer including a polymer block comprising an aromatic vinyl monomer unit and a polymer block comprising a conjugated diene monomer unit; the hydrogenated product of the polymer block comprising an aromatic vinyl monomer unit is a hydrogenated aromatic vinyl polymer block unit having a hydrogenation level of 90% or higher; and the hydrogenated product of the polymer block comprising a conjugated diene monomer unit is a hydrogenated conjugated diene polymer block unit having a hydrogenation level of 95% or higher.

Description

改質氫化嵌段共聚物Modified hydrogenated block copolymer

本發明之目的在於提供一種改質氫化嵌段共聚物,其可溶於有機溶劑,具有透明性,並且具有剛性及耐熱性,與金屬等基材之接著性優異。The object of the present invention is to provide a modified hydrogenated block copolymer which is soluble in organic solvents, has transparency, rigidity and heat resistance, and has excellent adhesion to metal and other substrates.

一般而言,聚乙烯或聚丙烯等聚烯烴類由於輕量、具有耐水性或耐化學品性、絕緣性,且亦容易操作,因此可由各種成形加工被賦予形狀而使用於各種工業材料。 又,聚烯烴類由於主要由碳-氫所組成,因此一般而言較難與其他素材、例如金屬或玻璃等複合化,為了改良其接著性,開始進行各種發明。 其中,藉由有機羧酸或其酸酐進行酸改質而實現重組,由此使得聚烯烴類與金屬類之熱接著性得到飛躍性改善(專利文獻1及2)。In general, polyolefins such as polyethylene or polypropylene are lightweight, have water resistance or chemical resistance, and are insulating, and are easy to handle. Therefore, they can be shaped by various molding processes and used in various industrial materials. In addition, since polyolefins are mainly composed of carbon-hydrogen, it is generally difficult to combine with other materials, such as metals, glass, etc., and various inventions have been initiated in order to improve the adhesiveness. Among them, reorganization is achieved by acid modification of organic carboxylic acid or its anhydride, thereby drastically improving the thermal adhesion between polyolefins and metals (Patent Documents 1 and 2).

另一方面,聚烯烴類正因耐化學品性較高,因此較難溶於各種有機溶劑中,一般而言較難以溶液之形式用於工業上。因此,為了改善酸改質聚烯烴類之溶劑溶解性,亦正在進行各種發明(專利文獻3~5)。 [先前技術文獻] [專利文獻]On the other hand, polyolefins are more difficult to dissolve in various organic solvents due to their higher chemical resistance. Generally speaking, it is more difficult to use in solution in the form of industrial applications. Therefore, in order to improve the solvent solubility of acid-modified polyolefins, various inventions are being made (Patent Documents 3 to 5). [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開平3-166283號公報 [專利文獻2]國際公開第2018/180862號 [專利文獻3]日本專利特開2004-217807號公報 [專利文獻4]日本專利特開2017-197651號公報 [專利文獻5]日本專利特開2003-012720號公報[Patent Document 1] Japanese Patent Laid-Open No. 3-166283 [Patent Document 2] International Publication No. 2018/180862 [Patent Document 3] Japanese Patent Laid-Open No. 2004-217807 [Patent Document 4] Japanese Patent Laid-Open No. 2017-197651 [Patent Document 5] Japanese Patent Laid-Open No. 2003-012720

[發明所欲解決之問題][The problem to be solved by the invention]

聚烯烴類或酸改質聚烯烴類係結晶性樹脂,其結晶係造成對於有機溶劑之溶解性下降之原因。進而,上述結晶性通常而言會阻礙聚烯烴類之透明性,使得塗膜之透明性或顯色性不佳。因此,上述之各發明中進行了如下述般之研究:降低聚烯烴類之結晶性,改良溶解性。 然而,儘管利用該等手法,溶解性亦不充分,除此以外還存在所獲得之聚烯烴類變得柔軟之趨勢,且存在耐熱性下降、或塗膜表面有黏膩感等之虞。Polyolefin-based or acid-modified polyolefin-based crystalline resins, whose crystals cause the decrease in solubility in organic solvents. Furthermore, the above-mentioned crystallinity generally hinders the transparency of polyolefins, resulting in poor transparency or color rendering of the coating film. Therefore, in each of the above-mentioned inventions, studies have been carried out as follows: to reduce the crystallinity of polyolefins and to improve the solubility. However, even with these methods, the solubility is not sufficient. In addition, the obtained polyolefins tend to become soft, and the heat resistance may decrease, or the surface of the coating film may feel sticky.

當聚烯烴類作為經被附體與被附體夾住之狀態的接著劑時,該聚烯烴類變得柔軟之趨勢發揮作用,但就一般之積層體或塗膜之觀點而言,多無法發揮作用。又,為了提昇溶解性,亦正在進行使聚烯烴類進行氯化反應之發明,但氯化手法不僅不簡單,且於透明性方面或燃燒時產生有害氣體之方面出現問題。When polyolefins are used as adhesives in a state sandwiched between the attached body and the attached body, the tendency of the polyolefins to become soft plays a role, but from the point of view of general laminates or coating films, it is often not possible Play a role. In addition, in order to improve the solubility, the invention of chlorinating polyolefins is also being carried out. However, the chlorination method is not only not simple, but also has problems in terms of transparency or generation of harmful gases during combustion.

如上所述,要求一種素材,其具有透明性及耐熱性,表面不會有黏膩感,可容易地塗佈或積層於被附材上,且燃燒時有毒氣體之產生得到抑制。 本發明係鑒於此類課題而成者。即,本發明提供一種聚烯烴類,其可溶於有機溶劑,具有透明性、剛性、及耐熱性,與金屬等基材之接著性優異,且燃燒時有毒氣體之產生得到了抑制。 [解決問題之技術方法]As mentioned above, a material is required that has transparency and heat resistance, does not have a sticky feeling on the surface, can be easily coated or laminated on the attached material, and the generation of toxic gases during combustion is suppressed. The present invention was made in view of such problems. That is, the present invention provides polyolefins that are soluble in organic solvents, have transparency, rigidity, and heat resistance, have excellent adhesion to metal and other substrates, and suppress the generation of toxic gases during combustion. [Technical method to solve the problem]

本發明者為了解決上述課題進行了銳意研究,結果發現了藉由使用屬於聚烯烴類的特定之氫化嵌段共聚物,並利用不飽和羧酸及/或不飽和羧酸酐使其改質,從而能夠解決上述課題。 即,本發明具有以下特徵。In order to solve the above-mentioned problems, the inventors have made intensive research and found that by using specific hydrogenated block copolymers belonging to polyolefins and modifying them with unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, The above-mentioned problems can be solved. That is, the present invention has the following characteristics.

[1]一種改質氫化嵌段共聚物,其係氫化嵌段共聚物藉由不飽和羧酸及/或不飽和羧酸酐進行改質而產生的改質體,且該氫化嵌段共聚物係包含含有芳香族乙烯基單體單元之聚合物嵌段及含有共軛二烯單體單元之聚合物嵌段的共聚物之氫化體,上述含有芳香族乙烯基單體單元之聚合物嵌段之氫化體係氫化水準為90%以上之氫化芳香族乙烯基聚合物嵌段單元,上述含有共軛二烯單體單元之聚合物嵌段之氫化體係氫化水準為95%以上之氫化共軛二烯聚合物嵌段單元。[1] A modified hydrogenated block copolymer, which is a modified body produced by modifying a hydrogenated block copolymer by an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, and the hydrogenated block copolymer The hydrogenated body of a copolymer comprising a polymer block containing an aromatic vinyl monomer unit and a polymer block containing a conjugated diene monomer unit, the above-mentioned polymer block containing an aromatic vinyl monomer unit The hydrogenation system has a hydrogenated aromatic vinyl polymer block unit with a hydrogenation level of more than 90%, and the above-mentioned polymer block containing a conjugated diene monomer unit has a hydrogenation system with a hydrogenation level of 95% or more of the hydrogenated conjugated diene polymerization物Block unit.

[2]如[1]中所記載之改質氫化嵌段共聚物,其中上述氫化嵌段共聚物具有至少2個上述氫化芳香族乙烯基聚合物嵌段單元,並且具有至少1個上述氫化共軛二烯聚合物嵌段單元。 [3]如[1]或[2]中所記載之改質氫化嵌段共聚物,其中藉由上述不飽和羧酸及/或不飽和羧酸酐進行改質之改質率為0.1~2質量%。 [4]如[1]至[3]中任一項所記載之改質氫化嵌段共聚物,其中上述不飽和羧酸及/或不飽和羧酸酐係順丁烯二酸酐。[2] The modified hydrogenated block copolymer as described in [1], wherein the hydrogenated block copolymer has at least two of the hydrogenated aromatic vinyl polymer block units, and has at least one of the hydrogenated copolymer Conjugated diene polymer block unit. [3] The modified hydrogenated block copolymer as described in [1] or [2], wherein the modification rate by the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is 0.1-2 mass %. [4] The modified hydrogenated block copolymer according to any one of [1] to [3], wherein the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is maleic anhydride.

[5]如[1]至[4]中任一項所記載之改質氫化嵌段共聚物,其中重量平均分子量(Mw)為5,000~100,000。 [6]一種改質氫化嵌段共聚物溶液或改質氫化嵌段共聚物漿料,其係使如[1]至[5]中任一項所記載之改質氫化嵌段共聚物以1~30質量%之濃度溶解或懸浮於有機溶劑中而成者。 [7]一種含有改質氫化嵌段共聚物之積層體,其係如[1]至[5]中任一項所記載之改質氫化嵌段共聚物積層於基材上而成者。[5] The modified hydrogenated block copolymer as described in any one of [1] to [4], wherein the weight average molecular weight (Mw) is 5,000 to 100,000. [6] A modified hydrogenated block copolymer solution or modified hydrogenated block copolymer slurry, which is obtained by making the modified hydrogenated block copolymer described in any one of [1] to [5] to 1 It is dissolved or suspended in an organic solvent with a concentration of ~30% by mass. [7] A laminate containing a modified hydrogenated block copolymer, which is obtained by laminating the modified hydrogenated block copolymer as described in any one of [1] to [5] on a substrate.

[8]如[7]中所記載之含有改質氫化嵌段共聚物之積層體,其中使上述改質氫化嵌段共聚物與1種或2種以上之其他熱塑性樹脂進行熔融共擠出成形。 [9]如[7]中所記載之含有改質氫化嵌段共聚物之積層體,其中將上述改質氫化嵌段共聚物熱層壓加工於金屬、紙、陶瓷、熱塑性樹脂或熱固性樹脂之上。 [10]如[9]中所記載之含有改質氫化嵌段共聚物之積層體,其中包含上述改質氫化嵌段共聚物之層的厚度為5~500 μm。[8] The laminate containing the modified hydrogenated block copolymer as described in [7], wherein the modified hydrogenated block copolymer and one or more other thermoplastic resins are subjected to melt co-extrusion molding . [9] The laminate containing the modified hydrogenated block copolymer as described in [7], wherein the modified hydrogenated block copolymer is thermally laminated to a metal, paper, ceramic, thermoplastic resin or thermosetting resin superior. [10] The laminate containing the modified hydrogenated block copolymer as described in [9], wherein the thickness of the layer containing the modified hydrogenated block copolymer is 5 to 500 μm.

[11]一種改質氫化嵌段共聚物之製造方法,其係製造如[1]至[5]中任一項所記載之改質氫化嵌段共聚物的方法,且利用熔融混練、溶液中反應、固相接枝之任一方法對上述氫化嵌段共聚物進行接枝改質。 [12]一種改質氫化嵌段共聚物之製造方法,其係製造如[1]至[5]中任一項所記載之改質氫化嵌段共聚物的方法,且藉由不飽和羧酸及/或不飽和羧酸酐對上述氫化嵌段共聚物進行接枝改質。[11] A method for producing a modified hydrogenated block copolymer, which is a method for producing the modified hydrogenated block copolymer as described in any one of [1] to [5], using melt kneading and in-solution Any method of reaction or solid phase grafting can graft and modify the above-mentioned hydrogenated block copolymer. [12] A method for producing a modified hydrogenated block copolymer, which is a method for producing the modified hydrogenated block copolymer as described in any one of [1] to [5], and using an unsaturated carboxylic acid And/or unsaturated carboxylic acid anhydride graft-modified the above-mentioned hydrogenated block copolymer.

[13]一種含有改質氫化嵌段共聚物之積層體之製造方法,其係將如[6]中所記載之改質氫化嵌段共聚物溶液或改質氫化嵌段共聚物漿料塗佈於基材上之後,去除溶劑,從而獲得積層體。 [14]如[13]中所記載之含有改質氫化嵌段共聚物之積層體之製造方法,其中包含上述改質氫化嵌段共聚物之層的厚度為1~100 μm。 [發明之效果][13] A method for producing a laminate containing a modified hydrogenated block copolymer by coating the modified hydrogenated block copolymer solution or modified hydrogenated block copolymer slurry as described in [6] After being on the substrate, the solvent is removed to obtain a laminate. [14] The method for producing a laminate containing a modified hydrogenated block copolymer as described in [13], wherein the thickness of the layer containing the modified hydrogenated block copolymer is 1-100 μm. [Effects of Invention]

本發明之改質氫化嵌段共聚物可溶於有機溶劑,藉由塗佈於金屬、玻璃、塑膠等基材上而成為具有透明性、剛性、及耐熱性、且具備良好之接著強度的塗膜,從而可獲得積層體。進而,由於本發明之改質氫化嵌段共聚物不進行氯化反應等,因此燃燒時不會產生有毒氣體。 又,本發明之溶液或漿料可塗佈於金屬、玻璃、塑膠等基材上,藉由去除有機溶劑,從而成為具有透明性、剛性、及耐熱性、且具備良好之接著強度的塗膜。 進而,本發明之積層體透明且具有剛性與耐熱性,且對於基材具備良好之接著強度。The modified hydrogenated block copolymer of the present invention is soluble in organic solvents, and by coating on metal, glass, plastic and other substrates, it becomes a coating with transparency, rigidity, heat resistance, and good adhesion strength. Film, thereby obtaining a laminate. Furthermore, since the modified hydrogenated block copolymer of the present invention does not undergo a chlorination reaction or the like, no toxic gas is generated during combustion. In addition, the solution or slurry of the present invention can be coated on metal, glass, plastic and other substrates, and by removing organic solvents, it becomes a coating film with transparency, rigidity, heat resistance, and good adhesion strength. . Furthermore, the laminate of the present invention is transparent, has rigidity and heat resistance, and has good adhesion strength to the substrate.

以下,對本發明詳細地進行說明,以下之說明係本發明之實施方式之一例,本發明只要不超過其主旨,則並不會受以下之記載內容所限定。 以下,於使用「~」之表現之情形時,係用作表示包含其前後之數值或物性值。Hereinafter, the present invention will be described in detail. The following description is an example of an embodiment of the present invention, and the present invention is not limited by the following description as long as it does not exceed the gist. Hereinafter, when the expression of "~" is used, it is used to indicate the numerical value or the physical property value before and after it is included.

本發明之改質氫化嵌段共聚物係氫化嵌段共聚物藉由不飽和羧酸及/或不飽和羧酸酐進行改質而產生的改質體。The modified hydrogenated block copolymer of the present invention is a modified body produced by modifying an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride of a hydrogenated block copolymer.

<氫化嵌段共聚物> 作為本發明之改質氫化嵌段共聚物之原料的氫化嵌段共聚物係包含含有至少1種芳香族乙烯基單體單元之聚合物嵌段、及含有至少1種共軛二烯單體單元之聚合物嵌段的嵌段共聚物之氫化體。即,該氫化嵌段共聚物具有氫化芳香族乙烯基聚合物嵌段單元、及氫化共軛二烯聚合物嵌段單元。<Hydrogenated block copolymer> The hydrogenated block copolymer used as the raw material for the modified hydrogenated block copolymer of the present invention contains a polymer block containing at least one type of aromatic vinyl monomer unit and at least one type of conjugated diene monomer unit The polymer block is the hydrogenated body of the block copolymer. That is, the hydrogenated block copolymer has a hydrogenated aromatic vinyl polymer block unit and a hydrogenated conjugated diene polymer block unit.

該氫化芳香族乙烯基聚合物嵌段單元係含有芳香族乙烯基單體單元之聚合物嵌段之氫化體,其氫化水準如後所述。 又,該氫化共軛二烯聚合物嵌段單元係含有共軛二烯單體單元之聚合物嵌段之氫化體,其氫化水準如後所述。 又,該氫化嵌段共聚物具有至少2個上述氫化芳香族乙烯基聚合物嵌段單元,並且具有至少1個上述氫化共軛二烯聚合物嵌段單元。 該氫化嵌段共聚物之透明性及材料強度優異。The hydrogenated aromatic vinyl polymer block unit is a hydrogenated body of a polymer block containing an aromatic vinyl monomer unit, and the hydrogenation level is as described later. In addition, the hydrogenated conjugated diene polymer block unit is a hydrogenated product of a polymer block containing a conjugated diene monomer unit, and the hydrogenation level is as described later. In addition, the hydrogenated block copolymer has at least two hydrogenated aromatic vinyl polymer block units and at least one hydrogenated conjugated diene polymer block unit. The hydrogenated block copolymer has excellent transparency and material strength.

再者,於本說明書中,所謂「嵌段」,係指自具有結構上或組成上不同之聚合鏈段的共聚物進行微層分離之聚合鏈段。因此,例如所謂「具有至少2個嵌段單元」,係指氫化嵌段共聚物之中具有至少2個進行微層分離之聚合鏈段。Furthermore, in this specification, the so-called "block" refers to a polymer segment that is microlayer separated from a copolymer having polymer segments that are different in structure or composition. Therefore, for example, the term "having at least two block units" means that the hydrogenated block copolymer has at least two polymer segments that undergo microlayer separation.

作為上述芳香族乙烯基單體單元之原料的芳香族乙烯基單體係通式(1)所表示之單體。A monomer represented by the general formula (1) of an aromatic vinyl mono-system as a raw material of the above-mentioned aromatic vinyl monomer unit.

[化1]

Figure 02_image003
此處,R係氫或烷基,Ar係苯基、聯苯基、鹵代苯基、烷基苯基、烷基鹵代苯基、萘基、吡啶基或蒽基。[化1]
Figure 02_image003
Here, R is hydrogen or alkyl, and Ar is phenyl, biphenyl, halophenyl, alkylphenyl, alkyl halophenyl, naphthyl, pyridyl, or anthracenyl.

上述烷基可經如鹵基、硝基、胺基、羥基、氰基、羰基及羧基等官能基單取代或者多重取代。烷基之碳數較佳為1~6。 上述Ar較佳為苯基或烷基苯基,更佳為苯基。The above-mentioned alkyl groups may be mono-substituted or multiple-substituted by functional groups such as halo, nitro, amine, hydroxyl, cyano, carbonyl and carboxyl groups. The carbon number of the alkyl group is preferably 1-6. The aforementioned Ar is preferably a phenyl group or an alkylphenyl group, and more preferably a phenyl group.

作為芳香族乙烯基單體,例如可例舉:苯乙烯、α-甲基苯乙烯、乙烯基甲苯(包括所有異構物,尤其是對乙烯基甲苯)、乙基苯乙烯、丙基苯乙烯、丁基苯乙烯、乙烯基聯苯、乙烯基萘、乙烯基蒽(所有異構物)、及其等之混合物。As the aromatic vinyl monomer, for example, styrene, α-methylstyrene, vinyl toluene (including all isomers, especially p-vinyl toluene), ethyl styrene, propyl styrene , Butyl styrene, vinyl biphenyl, vinyl naphthalene, vinyl anthracene (all isomers), and mixtures thereof.

作為上述共軛二烯單體單元之原料的共軛二烯單體只要係具有2個共軛雙鍵之單體即可,並無特別限定。 作為共軛二烯單體,例如可例舉:1,3-丁二烯、2-甲基-1,3-丁二烯(異戊二烯)、2-甲基-1,3戊二烯與其類似化合物、及其等之混合物。The conjugated diene monomer used as the raw material of the above-mentioned conjugated diene monomer unit is not particularly limited as long as it is a monomer having two conjugated double bonds. As the conjugated diene monomer, for example, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2-methyl-1,3-pentadiene Alkenes and similar compounds, and mixtures thereof.

作為上述1,3-丁二烯之聚合物的聚丁二烯可包含藉由氫化賦予1-丁烯重複單元之等價物的1,2配置、或藉由氫化賦予乙烯重複單元之等價物的1,4配置之任一者。The polybutadiene, which is the polymer of 1,3-butadiene, may include 1, 2 configurations that impart the equivalent of 1-butene repeating units by hydrogenation, or 1, 3-butadiene that imparts equivalents of ethylene repeating units by hydrogenation. Any of 4 configurations.

包含上述芳香族乙烯基單體、或含有1,3-丁二烯之上述共軛二烯單體的聚合性嵌段之氫化體屬於本發明中所使用之氫化嵌段共聚物。較佳為氫化嵌段共聚物係無官能基之嵌段共聚物。 再者,所謂「無官能基」,係指嵌段共聚物中不存在任何官能基,即不再包含碳與氫以外之元素的基。The hydrogenated body containing the above-mentioned aromatic vinyl monomer or the polymerizable block of the above-mentioned conjugated diene monomer containing 1,3-butadiene belongs to the hydrogenated block copolymer used in the present invention. Preferably, the hydrogenated block copolymer is a block copolymer without functional groups. Furthermore, the so-called "non-functional group" means that there is no functional group in the block copolymer, that is, a group that no longer contains elements other than carbon and hydrogen.

作為上述氫化芳香族乙烯基聚合物嵌段單元之較佳之例,可例舉含有氫化聚苯乙烯之單元,作為上述氫化共軛二烯聚合物嵌段單元之較佳之例,可列舉氫化聚丁二烯之單元。 並且,作為氫化嵌段共聚物之較佳之一態樣,可例舉:苯乙烯與丁二烯之氫化三嵌段或五嵌段共聚物,較佳為不包含其他任何官能基或結構性改質劑。As a preferred example of the above-mentioned hydrogenated aromatic vinyl polymer block unit, a unit containing hydrogenated polystyrene can be cited. As a preferred example of the above-mentioned hydrogenated conjugated diene polymer block unit, hydrogenated polybutylene can be cited. Diene unit. Moreover, as a preferred aspect of the hydrogenated block copolymer, for example, a hydrogenated triblock or pentablock copolymer of styrene and butadiene, preferably does not contain any other functional groups or structural modifications. Quality agent.

氫化芳香族乙烯基聚合物嵌段單元之含有率相對於上述氫化嵌段共聚物而言,較佳為50~99莫耳%,更佳為60~90莫耳%。 氫化芳香族乙烯基聚合物嵌段單元之比率若為上述下限以上,則剛性不會下降,若為上述上限以下,則脆性不會變差。The content of the hydrogenated aromatic vinyl polymer block unit is preferably 50 to 99 mol%, and more preferably 60 to 90 mol% relative to the above-mentioned hydrogenated block copolymer. If the ratio of the hydrogenated aromatic vinyl polymer block unit is more than the above lower limit, the rigidity will not decrease, and if it is less than the above upper limit, the brittleness will not deteriorate.

又,氫化共軛二烯聚合物嵌段單元之含有率相對於上述氫化嵌段共聚物而言,較佳為1~50莫耳%,更佳為10~40莫耳%。 氫化共軛二烯聚合物嵌段單元之比率若為上述下限以上,則脆性不會變差,若為上述上限以下,則剛性不會下降。In addition, the content of the hydrogenated conjugated diene polymer block unit is preferably 1 to 50 mol%, and more preferably 10 to 40 mol% with respect to the above-mentioned hydrogenated block copolymer. If the ratio of the hydrogenated conjugated diene polymer block unit is more than the above lower limit, the brittleness will not deteriorate, and if it is less than the above upper limit, the rigidity will not decrease.

本發明之氫化嵌段共聚物係藉由包含如SBS、SBSBS、SIS、SISIS、及SISBS(此處,S係指聚苯乙烯、B係指聚丁二烯、I係指聚異戊二烯)般之三嵌段、多嵌段、漸變嵌段及星形嵌段共聚物在內的嵌段共聚物之氫化而製得。The hydrogenated block copolymer of the present invention is obtained by including SBS, SBSBS, SIS, SISIS, and SISBS (here, S refers to polystyrene, B refers to polybutadiene, and I refers to polyisoprene ) It is prepared by hydrogenation of block copolymers including tri-block, multi-block, graded block and star-shaped block copolymers.

本發明之氫化嵌段共聚物於各自之末端包含含有芳香族乙烯基聚合物之鏈段。因此,本發明之氫化嵌段共聚物具有至少2個氫化芳香族乙烯基聚合物嵌段單元。並且,於該等2個氫化芳香族乙烯基聚合物嵌段單元之間具有至少1個氫化共軛二烯聚合物嵌段單元。The hydrogenated block copolymer of the present invention contains a segment containing an aromatic vinyl polymer at each end. Therefore, the hydrogenated block copolymer of the present invention has at least two hydrogenated aromatic vinyl polymer block units. In addition, there is at least one hydrogenated conjugated diene polymer block unit between the two hydrogenated aromatic vinyl polymer block units.

氫化前之嵌段共聚物可包含數個追加嵌段,該等嵌段可鍵結於三嵌段聚合物骨架之任何位置。如此,線狀嵌段例如包含SBS、SBSB、SBSBS、以及SBSBSB。共聚物亦可分支,且聚合鏈可沿著共聚物之骨架鍵結於任何位置。The block copolymer before hydrogenation can contain several additional blocks, which can be bonded to any position of the triblock polymer backbone. In this manner, the linear block includes, for example, SBS, SBSB, SBSBS, and SBSBSB. The copolymer can also be branched, and the polymer chain can be bonded at any position along the backbone of the copolymer.

氫化嵌段共聚物之重量平均分子量(以下,簡稱為「Mw」)之下限較佳為10,000以上,更佳為20,000以上。又,Mw之上限較佳為120,000以下,更佳為100,000以下,進而較佳為95,000以下,特佳為90,000以下,最佳為85,000以下,極其較佳為80,000以下。 Mw若為上述下限以上,則機械強度不會下降,若為上述上限以下,則所獲得之改質氫化嵌段共聚物之溶劑溶解性提昇。 氫化嵌段共聚物之Mw係由凝膠滲透層析法(GPC)之測定來決定,其具體之測定方法如實施例之項中所記載。The lower limit of the weight average molecular weight (hereinafter referred to as "Mw") of the hydrogenated block copolymer is preferably 10,000 or more, more preferably 20,000 or more. Furthermore, the upper limit of Mw is preferably 120,000 or less, more preferably 100,000 or less, still more preferably 95,000 or less, particularly preferably 90,000 or less, most preferably 85,000 or less, and extremely preferably 80,000 or less. If Mw is more than the aforementioned lower limit, the mechanical strength will not decrease, and if it is less than the aforementioned upper limit, the solvent solubility of the obtained modified hydrogenated block copolymer will be improved. The Mw of the hydrogenated block copolymer is determined by the gel permeation chromatography (GPC) measurement, and the specific measurement method is as described in the section of the examples.

上述氫化芳香族乙烯基聚合物嵌段單元之氫化水準較佳為90%以上,更佳為95%以上,進而較佳為98%以上,特佳為99.5%以上。 上述氫化共軛二烯聚合物嵌段單元之氫化水準較佳為95%以上,更佳為99%以上,進而較佳為99.5%以上。 如此,由於藉由高水準之氫化會表現出剛性與耐熱性,故較佳。The hydrogenation level of the hydrogenated aromatic vinyl polymer block unit is preferably 90% or more, more preferably 95% or more, still more preferably 98% or more, and particularly preferably 99.5% or more. The hydrogenation level of the above-mentioned hydrogenated conjugated diene polymer block unit is preferably 95% or more, more preferably 99% or more, and still more preferably 99.5% or more. In this way, it is preferable because it exhibits rigidity and heat resistance through high-level hydrogenation.

再者,所謂氫化芳香族乙烯基聚合物嵌段單元之氫化水準,係指芳香族乙烯基聚合物嵌段單元藉由氫化而飽和之比率,所謂氫化共軛二烯聚合物嵌段單元之氫化水準,係指共軛二烯聚合物嵌段單元藉由氫化而飽和之比率。 上述氫化水準係使用質子NMR(Nuclear Magnetic Resonance,核磁共振)來決定。Furthermore, the hydrogenation level of the hydrogenated aromatic vinyl polymer block unit refers to the ratio of the aromatic vinyl polymer block unit being saturated by hydrogenation, the so-called hydrogenation of the hydrogenated conjugated diene polymer block unit The level refers to the ratio of the conjugated diene polymer block unit being saturated by hydrogenation. The above-mentioned hydrogenation level is determined using proton NMR (Nuclear Magnetic Resonance).

本發明之氫化嵌段共聚物之熔體流動速率(MFR)通常而言為0.1 g/10分鐘以上,就成形方法或成形體之外觀之觀點而言,較佳為0.5 g/10分鐘以上。又,通常而言為200 g/10分鐘以下,就材料強度之觀點而言,較佳為100 g/10分鐘以下,更佳為50 g/10分鐘以下。 MFR係依據ISO R1133,於測定溫度230℃、測定負載2.16 kg之條件下進行測定。The melt flow rate (MFR) of the hydrogenated block copolymer of the present invention is generally 0.1 g/10 minutes or more, and from the viewpoint of the molding method or the appearance of the molded body, it is preferably 0.5 g/10 minutes or more. In addition, it is generally 200 g/10 minutes or less, and from the viewpoint of material strength, it is preferably 100 g/10 minutes or less, and more preferably 50 g/10 minutes or less. MFR is measured in accordance with ISO R1133 under the conditions of a measurement temperature of 230°C and a measurement load of 2.16 kg.

氫化嵌段共聚物可單獨地使用1種,亦可併用2種以上。 作為本發明之氫化嵌段共聚物,可使用市售者,具體而言,可例舉:三菱化學(股)製造之ZELAS(商標註冊)。A hydrogenated block copolymer may be used individually by 1 type, and may use 2 or more types together. As the hydrogenated block copolymer of the present invention, commercially available ones can be used. Specifically, ZELAS (trademark registration) manufactured by Mitsubishi Chemical Corporation can be mentioned.

<氫化嵌段共聚物之改質操作> 其次,對氫化嵌段共聚物之改質操作進行說明。該改質操作如下述般進行:藉由於氫化嵌段共聚物中添加不飽和羧酸及/或不飽和羧酸酐作為改質劑而使其進行反應。<Modification operation of hydrogenated block copolymer> Next, the modification operation of the hydrogenated block copolymer will be described. This modification operation is performed as follows: The hydrogenated block copolymer is reacted by adding an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride as a modifying agent.

作為上述改質劑之不飽和羧酸及/或不飽和羧酸酐,例如可例舉:丙烯酸、甲基丙烯酸、α-乙基丙烯酸、順丁烯二酸、反丁烯二酸、四氫鄰苯二甲酸、甲基四氫鄰苯二甲酸、亞甲基丁二酸、甲基順丁烯二酸、丁烯酸、異丁烯酸、耐地酸類等不飽和羧酸、及其等之酸酐。 又,作為不飽和羧酸酐,具體而言,可例舉:順丁烯二酸酐、甲基順丁烯二酸酐、耐地酸酐類。 再者,作為耐地酸類或其酸酐,可例舉:內順-雙環[2.2.1]庚烷-2,3-二羧酸(耐地酸(商標))、甲基-內順-雙環[2.2.1]庚烷-5-烯-2,3-二羧酸(甲基耐地酸(商標))等及其等之酸酐。As the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride of the above-mentioned modifier, for example, acrylic acid, methacrylic acid, α-ethacrylic acid, maleic acid, fumaric acid, tetrahydro-o- Unsaturated carboxylic acids such as phthalic acid, methyl tetrahydrophthalic acid, methylene succinic acid, methyl maleic acid, crotonic acid, methacrylic acid, and acid-resistant acids, and their anhydrides. Moreover, as an unsaturated carboxylic anhydride, specifically, maleic anhydride, methyl maleic anhydride, and ground-resistant acid anhydride are mentioned. Furthermore, as the terrestrial acid resistance or its anhydride, there may be mentioned: internal cis-bicyclo[2.2.1]heptane-2,3-dicarboxylic acid (resistance to terrestrial acid (trademark)), methyl-internal cis-bicyclo [2.2.1] Heptane-5-ene-2,3-dicarboxylic acid (methyl-resistant acid (trademark)), etc. and their anhydrides.

該等不飽和羧酸及/或不飽和羧酸酐之中,較佳為丙烯酸、順丁烯二酸、耐地酸、順丁烯二酸酐、耐地酸酐,更佳為順丁烯二酸酐。 不飽和羧酸及/或不飽和羧酸酐可單獨地使用1種,亦可併用2種以上。Among these unsaturated carboxylic acids and/or unsaturated carboxylic acid anhydrides, acrylic acid, maleic acid, tertiary acid, maleic anhydride, tertiary acid anhydride are preferred, and maleic anhydride is more preferred. Unsaturated carboxylic acid and/or unsaturated carboxylic anhydride may be used individually by 1 type, and may use 2 or more types together.

使上述氫化嵌段共聚物藉由上述不飽和羧酸及/或不飽和羧酸酐改質,藉而可獲得改質氫化嵌段共聚物。作為改質之方法,較適宜使用:溶液改質、熔融改質、利用電子束或電離輻射線之照射所進行之固相改質、於超臨界流體中所進行之改質等。 其中,較佳為設備或成本競爭力優異之熔融改質,更佳為連續生產性優異之使用擠出機所進行之熔融混練改質。 作為此時所使用之裝置,例如可例舉:單軸擠出機、雙軸擠出機、班布里混合機、輥式攪拌機。其中,較佳為連續生產性優異之單軸擠出機、雙軸擠出機。The above-mentioned hydrogenated block copolymer is modified by the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, whereby a modified hydrogenated block copolymer can be obtained. As a modification method, it is more suitable to use: solution modification, melting modification, solid phase modification by electron beam or ionizing radiation irradiation, modification in supercritical fluid, etc. Among them, melt modification with excellent equipment or cost competitiveness is preferable, and melt-kneading modification with an extruder with excellent continuous productivity is more preferable. As the device used at this time, for example, a single-screw extruder, a twin-screw extruder, a Bamburi mixer, and a roll mixer can be mentioned. Among them, a single-screw extruder and a twin-screw extruder excellent in continuous productivity are preferred.

一般而言,藉由不飽和羧酸及/或不飽和羧酸酐對氫化嵌段共聚物所進行之改質係利用如下述般之接枝反應進行:使作為構成氫化嵌段共聚物之嵌段單元之一的氫化共軛二烯聚合物嵌段單元之碳-氫鍵斷鍵而產生碳自由基,並使不飽和官能基與該碳自由基加成。 作為碳自由基之產生源,除了上述電子束或電離輻射線以外,亦可使用設為高溫之方法,還可使用偶氮化合物、無機過氧化物、有機過氧化物等自由基產生劑。作為自由基產生劑,就成本或操作性之觀點而言,較佳為使用有機過氧化物。Generally speaking, the modification of the hydrogenated block copolymer by unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is carried out by grafting reaction as follows: The carbon-hydrogen bond of one of the hydrogenated conjugated diene polymer block units is broken to generate carbon radicals, and the unsaturated functional groups are added to the carbon radicals. As a source of carbon radical generation, in addition to the above-mentioned electron beam or ionizing radiation, a high temperature method can also be used, and radical generators such as azo compounds, inorganic peroxides, and organic peroxides can also be used. As the radical generator, it is preferable to use an organic peroxide from the viewpoint of cost or operability.

作為上述偶氮化合物,例如可例舉:偶氮二異丁腈、偶氮雙二甲基戊腈、偶氮雙(2-甲基丁腈)、二偶氮硝基苯酚。 作為上述無機過氧化物,例如可例舉:過氧化氫、過氧化鉀、過氧化鈉、過氧化鈣、過氧化鎂、過氧化鋇。Examples of the azo compound include azobisisobutyronitrile, azobisdimethylvaleronitrile, azobis(2-methylbutyronitrile), and diazonitrophenol. Examples of the above-mentioned inorganic peroxide include hydrogen peroxide, potassium peroxide, sodium peroxide, calcium peroxide, magnesium peroxide, and barium peroxide.

作為上述有機過氧化物,可例舉屬於氫過氧化物、二烷基過氧化物、二乙醯過氧化物、過氧酯及酮過氧化物群中之有機過氧化物。 具體而言,可例舉:異丙苯氫過氧化物、第三丁基氫過氧化物等氫過氧化物;二異丙苯基過氧化物、二第三丁基過氧化物、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、2,5-二甲基-2,5-二(第三丁基過氧基)己炔-3等二烷基過氧化物;月桂基過氧化物、過氧化苯甲醯等二乙醯過氧化物;過氧化乙酸第三丁酯、過氧化苯甲酸第三丁酯、過氧化第三丁基碳酸異丙基酯等過氧酯;過氧化環己酮等酮過氧化物。 該等自由基產生劑可單獨地使用1種,亦可併用2種以上。Examples of the above-mentioned organic peroxides include organic peroxides belonging to the group of hydroperoxides, dialkyl peroxides, diacetyl peroxides, peroxy esters, and ketone peroxides. Specifically, examples include: hydroperoxides such as cumene hydroperoxide and tertiary butyl hydroperoxide; dicumyl peroxide, di-tertiary butyl peroxide, 2, 5-Dimethyl-2,5-bis(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyne-3, etc. Dialkyl peroxides; diethyl peroxides such as lauryl peroxide and benzyl peroxide; t-butyl peroxyacetate, t-butyl peroxybenzoate, t-butyl peroxycarbonic acid Peroxy esters such as isopropyl ester; ketone peroxides such as cyclohexanone peroxide. These radical generators may be used individually by 1 type, and may use 2 or more types together.

作為上述利用接枝反應所進行之改質,可例舉:利用熔融混練、溶液中反應、固相接枝之任一方法對上述氫化嵌段共聚物進行接枝改質;或藉由上述不飽和羧酸及/或不飽和羧酸酐進行接枝改質。As the above-mentioned modification by grafting reaction, for example, the above-mentioned hydrogenated block copolymer is graft-modified by any method of melt kneading, reaction in solution, and solid phase grafting; or by the above-mentioned non- Saturated carboxylic acid and/or unsaturated carboxylic anhydride undergo graft modification.

[利用熔融混練之改質] 通常使用之利用熔融混練所進行之改質如下述般進行:調配氫化嵌段共聚物、不飽和羧酸及/或不飽和羧酸酐、有機過氧化物並投入至混練機、擠出機中,一面進行加熱熔融混練一面擠出,將自前端模頭所擠出之熔融樹脂於水槽等中加以冷卻,從而獲得改質氫化嵌段共聚物。[Using melt kneading to modify] The commonly used modification by melt kneading is carried out as follows: hydrogenated block copolymer, unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, organic peroxide are formulated and put into a kneader or extruder, While heating, melting, kneading and extruding, the molten resin extruded from the front end die is cooled in a water tank or the like to obtain a modified hydrogenated block copolymer.

關於上述氫化嵌段共聚物與上述不飽和羧酸及/或不飽和羧酸酐之調配比率,相對於上述氫化嵌段共聚物100質量份而言,上述不飽和羧酸及/或不飽和羧酸酐為0.2~5質量份。 上述不飽和羧酸及/或不飽和羧酸酐相對於上述氫化嵌段共聚物之調配比率若為上述下限以上,則能夠獲得為了發揮本發明之效果所需的規定之改質率。又,若為上述上限以下,則不會殘留有未反應之不飽和羧酸及/或不飽和羧酸酐,且亦不會對接著強度產生不好的影響。Regarding the blending ratio of the hydrogenated block copolymer and the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, with respect to 100 parts by mass of the hydrogenated block copolymer, the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride It is 0.2-5 parts by mass. If the blending ratio of the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride to the hydrogenated block copolymer is greater than or equal to the above lower limit, a predetermined modification rate required to exert the effects of the present invention can be obtained. Moreover, if it is less than the said upper limit, unreacted unsaturated carboxylic acid and/or unsaturated carboxylic anhydride will not remain, and it will not have a bad influence on adhesive strength.

關於上述不飽和羧酸及/或不飽和羧酸酐與上述有機過氧化物之調配比率,相對於上述不飽和羧酸及/或不飽和羧酸酐100質量份而言,上述有機過氧化物為0.2~100質量份。 上述有機過氧化物相對於上述不飽和羧酸及/或不飽和羧酸酐之調配比率若為上述下限以上,則能夠獲得為了發揮本發明之效果所需的規定之改質率。又,若為上述上限以下,則不會發生氫化嵌段共聚物之劣化,且色相不會變差。Regarding the blending ratio of the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride and the above-mentioned organic peroxide, relative to 100 parts by mass of the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, the above-mentioned organic peroxide is 0.2 ~100 parts by mass. If the blending ratio of the organic peroxide with respect to the unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride is greater than or equal to the lower limit, a predetermined modification rate required to exert the effects of the present invention can be obtained. Moreover, if it is less than the above upper limit, deterioration of the hydrogenated block copolymer does not occur, and the hue does not deteriorate.

又,作為熔融混練改質條件,例如於單軸擠出機、雙軸擠出機中,較佳為於150~300℃之溫度下進行擠出。In addition, as melt-kneading modification conditions, for example, in a single-screw extruder or a twin-screw extruder, extrusion is preferably performed at a temperature of 150 to 300°C.

[利用溶液中反應之改質] 通常使用之利用溶液中反應所進行之改質如下述般進行:於有機溶劑中投入氫化嵌段共聚物、不飽和羧酸及/或不飽和羧酸酐、自由基產生劑,並進行加熱,從而獲得改質氫化嵌段共聚物。[Using the modification of the reaction in the solution] The commonly used modification by the reaction in the solution is carried out as follows: the hydrogenated block copolymer, unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and free radical generator are put into an organic solvent and heated to A modified hydrogenated block copolymer was obtained.

上述有機溶劑只要是不具有能夠與自由基產生劑進行反應之活性氫等官能基、且能夠使氫化嵌段共聚物溶解者,則並無特別制約。例如可例舉:苯、甲苯、二甲苯、氯苯、二氯苯、第三丁基苯,就溶解度及穩定性之觀點而言,較佳為二氯苯。The above-mentioned organic solvent is not particularly restricted as long as it does not have a functional group such as active hydrogen capable of reacting with the radical generator and can dissolve the hydrogenated block copolymer. For example, benzene, toluene, xylene, chlorobenzene, dichlorobenzene, and tertiary butylbenzene can be mentioned. From the viewpoint of solubility and stability, dichlorobenzene is preferred.

反應濃度根據氫化嵌段共聚物於有機溶劑中之溶解度、及溶液之黏度而有所不同,較佳為5~20質量%。反應濃度若為上述下限以上,則生產性良好,若為上述上限以下,則溶液黏度不會上升,容易進行攪拌或散熱。 不飽和羧酸及/或不飽和羧酸酐、及自由基產生劑相對於氫化嵌段共聚物之調配比率與利用熔融混練之改質相同。The reaction concentration varies according to the solubility of the hydrogenated block copolymer in the organic solvent and the viscosity of the solution, and is preferably 5-20% by mass. If the reaction concentration is more than the above lower limit, the productivity is good, and if the reaction concentration is less than the above upper limit, the viscosity of the solution does not increase, and stirring or heat dissipation is easy. The blending ratio of the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and the radical generator to the hydrogenated block copolymer is the same as the modification by melt kneading.

反應溫度根據有機溶劑之沸點或所使用之自由基產生劑之半衰期溫度而有所不同,較佳為80~150℃。反應溫度若為上述下限以上,則反應速度不會下降,若為上述上限以下,則氫化嵌段共聚物不會分解,反應穩定。 反應時間根據接枝率之目標值而有所不同,較佳為1~10小時。反應結束後,可根據公知之方法,對反應物實施晶析、過濾、洗淨、乾燥而進行回收。The reaction temperature varies according to the boiling point of the organic solvent or the half-life temperature of the radical generator used, and is preferably 80 to 150°C. If the reaction temperature is more than the above lower limit, the reaction rate will not decrease, and if it is less than the above upper limit, the hydrogenated block copolymer will not decompose and the reaction will be stable. The reaction time varies according to the target value of the grafting rate, and is preferably 1 to 10 hours. After the reaction is completed, the reaction product can be recovered by performing crystallization, filtration, washing, and drying according to a known method.

上述晶析可藉由降低反應溶液之溫度、進行減壓蒸餾去除而使溶液濃度上升、或投入不良溶劑而析出固體。 上述過濾可使用組合有濾紙、濾布等之過濾裝置進行。又,可使用離心過濾器或加壓過濾器、集洗滌乾燥為一體之過濾器等裝置。The above-mentioned crystallization can be carried out by lowering the temperature of the reaction solution, performing vacuum distillation to increase the concentration of the solution, or adding a poor solvent to precipitate a solid. The above-mentioned filtration can be performed using a filter device combined with filter paper, filter cloth, etc. In addition, centrifugal filters, pressure filters, filters that integrate washing and drying can be used.

上述洗淨較佳為使用不會使改質氫化嵌段共聚物溶解但會使未反應之不飽和羧酸及/或不飽和羧酸酐溶解者。具體而言,較佳為:甲醇、丙酮。 上述乾燥係藉由利用熱風乾燥器或減壓乾燥器去除殘留溶劑而進行。 藉由該等操作,可將利用溶液中反應而獲得之改質氫化嵌段共聚物與利用熔融混練之改質相同地用於實現本發明之目的。The above-mentioned washing preferably uses one that does not dissolve the modified hydrogenated block copolymer but dissolves unreacted unsaturated carboxylic acid and/or unsaturated carboxylic anhydride. Specifically, methanol and acetone are preferred. The above-mentioned drying is performed by removing the residual solvent with a hot air dryer or a reduced-pressure dryer. Through these operations, the modified hydrogenated block copolymer obtained by the reaction in the solution can be used for the purpose of the present invention in the same way as the modification by melt kneading.

[利用固相接枝之改質] 通常使用之利用固相接枝所進行之改質如下述般進行:於附有加熱套之攪拌機中,使氫化嵌段共聚物中含浸不飽和羧酸及/或不飽和羧酸酐、及自由基產生劑,繼而於不會使氫化嵌段共聚物熔融之程度的溫度區域內進行接枝反應,從而獲得改質氫化嵌段共聚物。 為了使得容易含浸,較佳為使氫化嵌段共聚物以粉體狀態投入。又,不飽和羧酸及/或不飽和羧酸酐較佳為液體狀態,於為粉體之情形時,較佳為將其加熱至熔點左右而以液體之形式投入。[Modification by solid phase grafting] The commonly used modification by solid phase grafting is carried out as follows: In a mixer with a heating mantle, the hydrogenated block copolymer is impregnated with unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and free radicals. The generator then undergoes a graft reaction in a temperature range that does not melt the hydrogenated block copolymer, thereby obtaining a modified hydrogenated block copolymer. In order to facilitate impregnation, it is preferable to feed the hydrogenated block copolymer in a powder state. In addition, the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride are preferably in a liquid state, and in the case of a powder, it is preferable to heat it to about the melting point and put it in as a liquid.

攪拌機之設定溫度較佳為不飽和羧酸及/或不飽和羧酸酐之熔點以上,且未達氫化嵌段共聚物之玻璃轉移點。因此,所選擇之自由基產生劑較佳為於上述溫度範圍內顯示活性者。 反應係藉由對混合物一面進行加熱一面加以攪拌而進行,反應結束後,以固體狀態獲得改質氫化嵌段共聚物。The setting temperature of the stirrer is preferably above the melting point of the unsaturated carboxylic acid and/or the unsaturated carboxylic anhydride, and does not reach the glass transition point of the hydrogenated block copolymer. Therefore, the selected radical generator is preferably one that exhibits activity within the above-mentioned temperature range. The reaction is performed by heating and stirring the mixture. After the reaction is completed, a modified hydrogenated block copolymer is obtained in a solid state.

[降低改質氫化嵌段共聚物之分子量] 於降低上述改質氫化嵌段共聚物之分子量之情形時,關於改質氫化嵌段共聚物與有機過氧化物之調配比率,相對於上述改質氫化嵌段共聚物100質量份而言,上述有機過氧化物為0.01~2質量份。 又,作為熔融混練改質條件,例如於單軸擠出機、雙軸擠出機中,較佳為以150~300℃之溫度下進行擠出。[Reduce the molecular weight of the modified hydrogenated block copolymer] When the molecular weight of the modified hydrogenated block copolymer is reduced, the blending ratio of the modified hydrogenated block copolymer and the organic peroxide is relative to 100 parts by mass of the modified hydrogenated block copolymer. The organic peroxide is 0.01 to 2 parts by mass. In addition, as melt-kneading modification conditions, for example, in a single-screw extruder or a twin-screw extruder, it is preferable to perform extrusion at a temperature of 150 to 300°C.

[改質率] 上述改質氫化嵌段共聚物藉由上述不飽和羧酸及/或不飽和羧酸酐進行改質之改質率較佳為0.1~2質量%。 改質率若為上述下限以上,則能夠獲得充分之接著強度。又,若為上述上限以下,則不會有臭氣之產生或顏色之變差,對有機溶劑之溶解性亦變得良好。 上述改質氫化嵌段共聚物之改質率係對上述改質氫化嵌段共聚物實施甲酯化處理之後,使用質子NMR來決定。[Modification rate] The modification rate of the modified hydrogenated block copolymer modified by the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is preferably 0.1-2% by mass. If the modification rate is more than the above lower limit, sufficient adhesive strength can be obtained. Moreover, if it is less than the said upper limit, there will be no generation of odor or deterioration of color, and the solubility to an organic solvent will also become favorable. The modification rate of the modified hydrogenated block copolymer is determined using proton NMR after the modified hydrogenated block copolymer is subjected to methyl esterification treatment.

<改質氫化嵌段共聚物> 本發明之改質氫化嵌段共聚物係氫化嵌段共聚物藉由不飽和羧酸及/或不飽和羧酸酐進行改質而產生的改質體。 該氫化嵌段共聚物係包含含有芳香族乙烯基單體單元之聚合物嵌段及含有共軛二烯單體單元之聚合物嵌段的共聚物之氫化體。 上述含有芳香族乙烯基單體單元之聚合物嵌段之氫化體係氫化水準為90%以上之氫化芳香族乙烯基聚合物嵌段單元,上述含有共軛二烯單體單元之聚合物嵌段之氫化體係氫化水準為95%以上之氫化共軛二烯聚合物嵌段單元。<Modified hydrogenated block copolymer> The modified hydrogenated block copolymer of the present invention is a modified body produced by modifying an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride of a hydrogenated block copolymer. The hydrogenated block copolymer is a hydrogenated body of a copolymer comprising a polymer block containing an aromatic vinyl monomer unit and a polymer block containing a conjugated diene monomer unit. The hydrogenation system of the above-mentioned polymer block containing aromatic vinyl monomer units is hydrogenated aromatic vinyl polymer block units with a hydrogenation level of 90% or more, and the above-mentioned polymer block containing conjugated diene monomer units is The hydrogenation system has a hydrogenation level of 95% or more of hydrogenated conjugated diene polymer block units.

上述氫化芳香族乙烯基聚合物嵌段單元之氫化水準較佳為95%以上,更佳為98%以上,進而較佳為99.5%以上。 又,上述氫化共軛二烯聚合物嵌段單元之氫化水準較佳為99%以上,更佳為99.5%以上。 如此,由於藉由高水準之氫化會表現出剛性與耐熱性,故較佳。 此處,氫化水準之含義、與氫化水準之決定方法與氫化嵌段共聚物之項中所記載之內容相同。The hydrogenation level of the hydrogenated aromatic vinyl polymer block unit is preferably 95% or more, more preferably 98% or more, and still more preferably 99.5% or more. In addition, the hydrogenation level of the hydrogenated conjugated diene polymer block unit is preferably 99% or more, more preferably 99.5% or more. In this way, it is preferable because it exhibits rigidity and heat resistance through high-level hydrogenation. Here, the meaning of the hydrogenation level and the method for determining the hydrogenation level are the same as those described in the section of the hydrogenated block copolymer.

上述氫化嵌段共聚物具有至少2個上述氫化芳香族乙烯基聚合物嵌段單元,並且具有至少1個上述氫化共軛二烯聚合物嵌段單元。 氫化芳香族乙烯基聚合物嵌段單元之含有率相對於改質氫化嵌段共聚物而言,較佳為50~99莫耳%,更佳為60~90莫耳%。 氫化芳香族乙烯基聚合物嵌段單元之比率若為上述下限以上,則剛性不會下降,若為上述上限以下,則脆性不會變差。The hydrogenated block copolymer has at least two hydrogenated aromatic vinyl polymer block units and at least one hydrogenated conjugated diene polymer block unit. The content of the hydrogenated aromatic vinyl polymer block unit is preferably 50 to 99 mol%, and more preferably 60 to 90 mol% relative to the modified hydrogenated block copolymer. If the ratio of the hydrogenated aromatic vinyl polymer block unit is more than the above lower limit, the rigidity will not decrease, and if it is less than the above upper limit, the brittleness will not deteriorate.

又,氫化共軛二烯聚合物嵌段單元之含有率相對於改質氫化嵌段共聚物而言,較佳為1~50莫耳%,更佳為10~40莫耳%。 氫化共軛二烯聚合物嵌段單元之比率若為上述下限以上,則脆性不會變差,若為上述上限以下,則剛性不會下降。In addition, the content of the hydrogenated conjugated diene polymer block unit is preferably 1 to 50 mol%, and more preferably 10 to 40 mol% relative to the modified hydrogenated block copolymer. If the ratio of the hydrogenated conjugated diene polymer block unit is more than the above lower limit, the brittleness will not deteriorate, and if it is less than the above upper limit, the rigidity will not decrease.

改質氫化嵌段共聚物之Mw之下限較佳為5,000以上,更佳為10,000以上。又,Mw之上限較佳為100,000以下,更佳為80,000以下。具體而言,較佳為5,000以上100,000以下,更佳為5,000以上80,000以下、或10,000以上100,000以下,進而較佳為10,000以上80,000以下。The lower limit of Mw of the modified hydrogenated block copolymer is preferably 5,000 or more, more preferably 10,000 or more. In addition, the upper limit of Mw is preferably 100,000 or less, more preferably 80,000 or less. Specifically, it is preferably 5,000 or more and 100,000 or less, more preferably 5,000 or more and 80,000 or less, or 10,000 or more and 100,000 or less, and still more preferably 10,000 or more and 80,000 or less.

改質氫化嵌段共聚物之Mw若為上述下限以上,則材料強度不會下降,且接著性及耐熱性不會下降,故較佳。又,Mw若為上述上限以下,則對有機溶劑之溶解性不會下降,故較佳。 改質氫化嵌段共聚物之Mw係由GPC之測定來決定。If the Mw of the modified hydrogenated block copolymer is more than the above lower limit, the strength of the material will not decrease, and the adhesiveness and heat resistance will not decrease, so it is preferable. In addition, if Mw is less than or equal to the above upper limit, the solubility in organic solvents will not decrease, which is preferable. The Mw of the modified hydrogenated block copolymer is determined by GPC measurement.

上述改質氫化嵌段共聚物之Mw可由使氫化嵌段共聚物改質時所使用之有機過氧化物之量來進行控制。 關於氫化嵌段共聚物之改質操作,如上所述。又,與氫化嵌段共聚物之改質操作同樣地,藉由於改質氫化嵌段共聚物中進而調配有機過氧化物,進行摻合後投入至混練機、擠出機中,一面進行加熱熔融混練一面擠出,從而可獲得Mw有所變化之改質氫化嵌段共聚物。The Mw of the modified hydrogenated block copolymer can be controlled by the amount of organic peroxide used when the hydrogenated block copolymer is modified. The modification operation of the hydrogenated block copolymer is as described above. Also, similar to the modification operation of the hydrogenated block copolymer, the modified hydrogenated block copolymer is further blended with organic peroxide, blended and then put into a kneader or extruder, and heated and melted. It is extruded while kneading to obtain a modified hydrogenated block copolymer with varying Mw.

氫化嵌段共聚物或改質氫化嵌段共聚物藉由與有機過氧化物進行處理,從而使作為構成氫化嵌段共聚物或改質氫化嵌段共聚物之嵌段單元之一的氫化共軛二烯聚合物嵌段單元之碳-氫鍵暫時斷鍵而產生碳自由基,自該碳自由基結構,隨著β氫脫離使得碳-碳鍵斷鍵而引起低分子量化,從而可由高分子量之氫化嵌段共聚物或改質氫化嵌段共聚物獲得低分子量之改質氫化嵌段共聚物。 該操作可於改質後進行,亦可與改質同時地進行。即,由於降低分子量與改質同時地進行,因此藉由較多地調配有機過氧化物,從而於進行改質之同時可使其低分子量化。The hydrogenated block copolymer or the modified hydrogenated block copolymer is treated with an organic peroxide to make the hydrogenated conjugate as one of the block units constituting the hydrogenated block copolymer or the modified hydrogenated block copolymer The carbon-hydrogen bond of the diene polymer block unit is temporarily broken to generate carbon radicals. From the carbon radical structure, the carbon-carbon bond breaks with the separation of β hydrogen, resulting in low molecular weight, which can be reduced by high molecular weight. The hydrogenated block copolymer or modified hydrogenated block copolymer to obtain a low molecular weight modified hydrogenated block copolymer. This operation can be performed after the modification or simultaneously with the modification. That is, since molecular weight reduction and modification are carried out at the same time, by blending more organic peroxides, the molecular weight can be reduced while being modified.

改質氫化嵌段共聚物之介電常數較佳為較低。具體而言,較佳為3.0以下,更佳為2.5以下。介電常數若為3.0以下,則信號傳輸速度不會下降。 改質氫化嵌段共聚物之介電損耗因數較佳為較低。具體而言,較佳為0.003以下,更佳為0.002以下。介電損耗因數若為0.003以下,則電氣信號之可靠性不會下降。The dielectric constant of the modified hydrogenated block copolymer is preferably lower. Specifically, it is preferably 3.0 or less, and more preferably 2.5 or less. If the dielectric constant is 3.0 or less, the signal transmission speed will not decrease. The dielectric loss factor of the modified hydrogenated block copolymer is preferably lower. Specifically, it is preferably 0.003 or less, and more preferably 0.002 or less. If the dielectric loss factor is less than 0.003, the reliability of the electrical signal will not decrease.

該等低介電特性係電氣・電子線路用積層板等電氣・電子零件之材料與樹脂材料所要求之重要的性能。 近年來,為了提高訊息傳輸量、速度,正在推進通信頻率之高頻化。例如,由於電氣信號之傳輸速度與物質之(相對)介電常數之平方根成反比,因此為了提高電氣信號之傳輸速度,介電常數較佳為較低。又,電氣信號會因傳送而產生損失,由於傳送損失與物質之介電損耗因數成正比,因此為了減少電氣信號之傳送損失,介電損耗因數較佳為較低。 即,藉由使用具有低介電常數、低介電損耗因數之物質,從而使得傳輸高速且訊息信號之衰減較少,可確保通信之高可靠性。These low dielectric properties are important properties required by materials and resin materials for electrical and electronic parts such as laminates for electrical and electronic circuits. In recent years, in order to increase the amount and speed of information transmission, the frequency of communication is being increased. For example, since the transmission speed of electrical signals is inversely proportional to the square root of the (relative) dielectric constant of the substance, in order to increase the transmission speed of electrical signals, the dielectric constant is preferably lower. In addition, the electrical signal will be lost due to transmission. Since the transmission loss is proportional to the dielectric loss factor of the substance, in order to reduce the transmission loss of the electrical signal, the dielectric loss factor is preferably lower. That is, by using materials with low dielectric constant and low dielectric loss factor, the transmission speed is high and the attenuation of the message signal is less, and the high reliability of communication can be ensured.

<改質氫化嵌段共聚物之溶液或漿料> 本發明之改質氫化嵌段共聚物可溶解或懸浮於有機溶劑中而製成溶液或漿料。 此處,所謂溶液,係指上述改質氫化嵌段共聚物溶解於有機溶劑中之狀態。即,表示改質氫化嵌段共聚物分子分散於有機溶劑中之狀態。 又,所謂漿料,係指於有機溶劑中混入有改質氫化嵌段共聚物之粒子而成之懸浮體。 一般而言,聚烯烴類對於有機溶劑之溶解性較差,假設溶解亦會發生凝膠化而不適合於塗佈,但本發明之改質氫化嵌段共聚物於該方面顯示出特異性之性質。<Solution or slurry of modified hydrogenated block copolymer> The modified hydrogenated block copolymer of the present invention can be dissolved or suspended in an organic solvent to prepare a solution or slurry. Here, the term “solution” refers to the state in which the above-mentioned modified hydrogenated block copolymer is dissolved in an organic solvent. That is, it represents a state where the molecules of the modified hydrogenated block copolymer are dispersed in an organic solvent. In addition, the term “slurry” refers to a suspension in which particles of the modified hydrogenated block copolymer are mixed in an organic solvent. Generally speaking, polyolefins have poor solubility in organic solvents. It is assumed that gelation will occur in dissolution and is not suitable for coating. However, the modified hydrogenated block copolymer of the present invention shows specific properties in this respect.

作為能夠使本發明之改質氫化嵌段共聚物溶解之有機溶劑,可例舉:芳香族系溶劑、脂肪族系溶劑、脂環式溶劑。 作為芳香族系溶劑,例如可例舉:苯、甲苯、二甲苯、乙基苯、氯苯、溴萘。作為脂肪族系溶劑,例如可例舉:己烷、庚烷、辛烷、壬烷、癸烷。作為脂環式溶劑,例如可例舉:環戊烷、環己烷、環庚烷、環癸烷。 其等可單獨地使用1種,亦可併用2種以上。 其等之中,要想提高操作性或蒸餾去除之容易程度,較佳為甲苯、環己烷。Examples of the organic solvent capable of dissolving the modified hydrogenated block copolymer of the present invention include aromatic solvents, aliphatic solvents, and alicyclic solvents. Examples of aromatic solvents include benzene, toluene, xylene, ethylbenzene, chlorobenzene, and bromonaphthalene. Examples of the aliphatic solvent include hexane, heptane, octane, nonane, and decane. As an alicyclic solvent, cyclopentane, cyclohexane, cycloheptane, and cyclodecane are mentioned, for example. These may be used individually by 1 type, and may use 2 or more types together. Among them, in order to improve operability or ease of distillation, toluene and cyclohexane are preferred.

又,只要是不會阻礙本發明之效果之程度,亦可添加上述以外之有機溶劑。作為可使用之其他有機溶劑,例如可例舉:丙酮、甲基乙基酮、環己酮、苯乙酮、二苯甲酮等酮類;甲醇、乙醇、異丙醇、丁醇等醇類;苯酚、甲酚、萘酚等酚類;乙二醇單甲醚等醚類;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺類。Moreover, as long as it does not hinder the effect of the present invention, an organic solvent other than the above may be added. Other organic solvents that can be used include, for example, ketones such as acetone, methyl ethyl ketone, cyclohexanone, acetophenone, and benzophenone; alcohols such as methanol, ethanol, isopropanol, butanol, etc. ; Phenols such as phenol, cresol and naphthol; ethers such as ethylene glycol monomethyl ether; amines such as N,N-dimethylformamide and N,N-dimethylacetamide.

上述溶液或漿料中,作為改質氫化嵌段共聚物之濃度,較佳為1~30質量%。 上述改質氫化嵌段共聚物之濃度若為上述下限以上,則溶液黏度適宜,較適合於塗佈作業。又,若為上述上限以下,則溶液黏度較適宜,亦不會發生凝膠化。 上述溶液或漿料中之改質氫化嵌段共聚物之濃度更佳為5~10質量%。The concentration of the modified hydrogenated block copolymer in the above-mentioned solution or slurry is preferably 1 to 30% by mass. If the concentration of the modified hydrogenated block copolymer is more than the above lower limit, the viscosity of the solution is appropriate, and it is more suitable for coating operations. In addition, if it is less than the above upper limit, the viscosity of the solution will be more suitable, and gelation will not occur. The concentration of the modified hydrogenated block copolymer in the above-mentioned solution or slurry is more preferably 5-10% by mass.

<其他成分> 本發明之溶液或漿料中,以進一步提高其功能性為目的,亦可包含以上所列舉出之成分以外的成分。 作為此類其他成分,可例舉:熱固性樹脂或光硬化性樹脂、硬化促進劑、紫外光抑制劑、抗氧化劑、偶合劑、塑化劑、助焊劑、阻燃劑、著色劑、分散劑、乳化劑、低彈性化劑、稀釋劑、消泡劑、離子捕捉劑、無機填料、有機填料等。<Other ingredients> The solution or slurry of the present invention may contain components other than those listed above for the purpose of further improving its functionality. Examples of such other components include thermosetting resins or photocurable resins, hardening accelerators, ultraviolet light inhibitors, antioxidants, coupling agents, plasticizers, fluxes, flame retardants, colorants, dispersants, Emulsifiers, low elasticizers, diluents, defoamers, ion scavengers, inorganic fillers, organic fillers, etc.

<改質氫化嵌段共聚物之積層體> 本發明之改質氫化嵌段共聚物對於金屬、玻璃及塑膠等基材之接著強度良好,能夠獲得無黏膩感之接著表面,且可獲得與金屬、玻璃或塑膠等基材之積層體。 積層之方法並無特別限定,可使用公知之積層方法,如:熔融共擠出成形、熱層壓加工、插入射出成形等。<Laminate of modified hydrogenated block copolymer> The modified hydrogenated block copolymer of the present invention has good bonding strength to metal, glass, plastic and other substrates, can obtain a non-sticky bonding surface, and can obtain a laminate with metal, glass, or plastic substrates. The method of lamination is not particularly limited, and well-known lamination methods such as melt co-extrusion molding, thermal lamination processing, insert injection molding, etc. can be used.

上述熔融共擠出成形係使本發明之改質氫化嵌段共聚物與1種或2種以上之其他熱塑性樹脂進行熔融共擠出成形之方法,藉此可製得含有改質氫化嵌段共聚物之積層體。The above-mentioned melt co-extrusion molding is a method of melt co-extrusion molding of the modified hydrogenated block copolymer of the present invention and one or more other thermoplastic resins, whereby a copolymer containing modified hydrogenated block copolymers can be prepared. The layered body of things.

作為上述其他熱塑性樹脂,例如可例舉:乙烯-乙酸乙烯酯共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯共聚物等乙烯-α-烯烴共聚物;聚乙烯、聚丙烯、聚丁烯-1樹脂等聚烯烴樹脂;聚苯醚系樹脂、尼龍6、尼龍66等聚醯胺系樹脂;芳香族聚醯胺系樹脂、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等芳香族聚酯系樹脂;聚乳酸、聚丁二酸丁二酯、聚己內酯等脂肪族聚酯系樹脂;聚碳酸酯系樹脂;聚芳酯系樹脂;改質聚苯醚樹脂;聚碸樹脂;聚苯硫醚樹脂;聚醚碸樹脂;聚醚酮樹脂;聚醚醚酮樹脂;聚醯亞胺樹脂;聚甲醛均聚物、聚甲醛共聚物等聚甲醛系樹脂;聚甲基丙烯酸甲酯系樹脂;二甲基聚矽氧烷、二苯基聚矽氧烷、二羥基聚矽氧烷等含矽之軟質聚合物;聚苯乙烯等乙烯基芳香族聚合物;乙烯-丙烯共聚合橡膠(EPM)、乙烯-丙烯-非共軛二烯共聚合橡膠(EPDM)、乙烯-丁烯共聚合橡膠(EBM)、乙烯-丙烯-丁烯共聚合橡膠等乙烯系彈性體;苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物、苯乙烯-乙烯/丙烯-苯乙烯嵌段共聚物等苯乙烯基彈性體;聚丁二烯;氫化乙烯基芳香族聚合物、包含氫化苯乙烯/丁二烯或苯乙烯/異戊二烯嵌段共聚物之其他氫化乙烯基芳香族嵌段共聚物;環烯烴(共)聚合物。 其等可單獨地使用1種,亦可併用2種以上。As the above-mentioned other thermoplastic resins, for example, ethylene-α-olefin copolymers such as ethylene-vinyl acetate copolymers, ethylene-(meth)acrylic acid copolymers, and ethylene-(meth)acrylate copolymers; polyethylene; , Polypropylene, polybutene-1 resin and other polyolefin resins; polyphenylene ether resins, nylon 6, nylon 66 and other polyamide resins; aromatic polyamide resins, polyethylene terephthalate, Aromatic polyester resins such as polybutylene terephthalate; aliphatic polyester resins such as polylactic acid, polybutylene succinate, and polycaprolactone; polycarbonate resins; polyarylate resins ; Modified polyphenylene ether resin; polysulfide resin; polyphenylene sulfide resin; polyether sulfide resin; polyether ketone resin; polyether ether ketone resin; polyimide resin; polyoxymethylene homopolymer and polyoxymethylene copolymer Polyoxymethylene series resins; polymethyl methacrylate series resins; silicon-containing soft polymers such as dimethyl polysiloxane, diphenyl polysiloxane, and dihydroxy polysiloxane; polystyrene and other ethylene -Based aromatic polymer; ethylene-propylene copolymer rubber (EPM), ethylene-propylene-non-conjugated diene copolymer rubber (EPDM), ethylene-butene copolymer rubber (EBM), ethylene-propylene-butene copolymer Vinyl elastomers such as polymer rubber; styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene/butylene-styrene block copolymer Styrene-based elastomers such as styrene-ethylene/propylene-styrene block copolymers; polybutadiene; hydrogenated vinyl aromatic polymers, including hydrogenated styrene/butadiene or styrene/isoprene Other hydrogenated vinyl aromatic block copolymers of olefin block copolymers; cyclic olefin (co)polymers. These may be used individually by 1 type, and may use 2 or more types together.

上述熱層壓加工係將本發明之改質氫化嵌段共聚物熱層壓加工於金屬、紙、陶瓷、熱塑性樹脂或熱固性樹脂等層壓基材之上,藉此,可製得含有改質氫化嵌段共聚物之積層體。 上述熱層壓加工係如下述般之方法:將預先製好之包含改質氫化嵌段共聚物的膜與作為層壓基材之膜或片材之表面接觸,並對其等進行加熱而使其等熔合。具體而言係如下述般之方法:藉由使複數片膜或片材以重疊之狀態通過加熱輥而使其熱熔。The above-mentioned thermal lamination process is the thermal lamination process of the modified hydrogenated block copolymer of the present invention on a laminated substrate such as metal, paper, ceramics, thermoplastic resin or thermosetting resin, whereby the modified hydrogenated block copolymer can be prepared. A laminate of hydrogenated block copolymers. The above-mentioned thermal lamination process is as follows: a pre-prepared film containing a modified hydrogenated block copolymer is brought into contact with the surface of a film or sheet as a laminate base material, and the surface of the film or sheet is heated to make It's so fused. Specifically, it is a method of heat-melting a plurality of films or sheets by passing them through a heating roller in an overlapped state.

欲將改質氫化嵌段共聚物製成膜,則可使用公知之方法。具體而言,可使用:T型熔融擠出壓鑄膜成形法、吹脹膜成形法、軋光膜成形法、擠出層壓成形法。此時,可成形為單層膜,亦可藉由共擠出成形法成形為複數層膜。 其中,較佳為成形性優異、且較容易進行調整之T型熔融擠出壓鑄膜成形法。To make the modified hydrogenated block copolymer into a film, a known method can be used. Specifically, a T-shaped melt extrusion die-casting film forming method, an inflation film forming method, a calendering film forming method, and an extrusion lamination forming method can be used. At this time, it can be formed into a single-layer film, or it can be formed into a multiple-layer film by a co-extrusion method. Among them, a T-shaped melt-extrusion die-cast film forming method that has excellent moldability and is relatively easy to adjust is preferred.

T型熔融擠出壓鑄膜成形法中,利用安裝於單軸或雙軸擠出機之前端且狹縫寬度為0.1~2 mm左右之T型狹縫型模頭,於溫度200~300℃下將改質氫化嵌段共聚物熔融擠出,繼而將擠出膜與設定為20~80℃之冷卻用輥表面接觸而使其冷卻,並進行捲取,從而可獲得膜。 亦能夠視需要對膜表面實施電暈處理。In the T-shaped melt extrusion die-casting film forming method, a T-shaped slit die head installed at the front end of a uniaxial or biaxial extruder with a slit width of about 0.1 to 2 mm is used at a temperature of 200 to 300 ℃ The modified hydrogenated block copolymer is melt-extruded, and then the extruded film is brought into contact with the surface of a cooling roll set at 20 to 80° C. to cool it and wind it up to obtain a film. It is also possible to perform corona treatment on the film surface as needed.

配置所獲得之膜使其與金屬、紙、陶瓷、熱塑性樹脂或熱固性樹脂等層壓基材重疊,並利用加熱金屬輥及橡膠輥一面施加壓力一面將其夾緊而進行熱壓接合,從而能夠利用熱層壓實現積層。 於所使用之包含改質氫化嵌段共聚物之膜係複數層構成之情形時,需要以包含改質氫化嵌段共聚物之層與層壓基材接觸之方式配置。The obtained film is arranged to overlap a laminated substrate such as metal, paper, ceramics, thermoplastic resin or thermosetting resin, and the heated metal roller and rubber roller are used to apply pressure while clamping them to perform thermocompression bonding. Use thermal lamination to achieve lamination. In the case of using multiple layers of the film containing the modified hydrogenated block copolymer, it needs to be arranged in such a way that the layer containing the modified hydrogenated block copolymer is in contact with the laminated substrate.

熱層壓加工時加熱輥之溫度視需要進行設定,需為改質氫化嵌段共聚物之玻璃轉移點以上。加熱輥之溫度根據熱層壓之加工速度、膜及層壓基材之厚度、或壓著壓力而有所不同,較佳為設定為高於改質氫化嵌段共聚物之玻璃轉移點10~50℃。 若設定溫度為玻璃轉移點之10℃以上,則藉由熱層壓加工能夠獲得充分之接著強度。又,若為玻璃轉移點之50℃以下,則包含改質氫化嵌段共聚物之膜不會發生熔解,或貼附於輥上等。During thermal lamination, the temperature of the heating roller can be set as needed, and it must be above the glass transition point of the modified hydrogenated block copolymer. The temperature of the heating roller varies according to the processing speed of the thermal lamination, the thickness of the film and the laminated substrate, or the pressing pressure, and it is preferably set to be 10~ higher than the glass transition point of the modified hydrogenated block copolymer. 50°C. If the set temperature is 10°C or more of the glass transition point, sufficient bonding strength can be obtained by thermal lamination. In addition, if it is 50°C or less of the glass transition point, the film containing the modified hydrogenated block copolymer will not melt or stick to a roll.

熱層壓加工時之壓接壓力以輥間線壓計,較佳為1~40 kg/m。壓接壓力若為上述下限以上,則藉由熱層壓加工能夠獲得充分之接著強度。又,壓接壓力若為上述上限以下,則不會產生皺褶,能夠獲得整齊之外觀。 關於熱層壓加工時之加工速度,要想均衡接著強度與生產性,較佳為0.5~50 m/分鐘。加工速度若為上述下限以上,則生產性充分,就經濟性而言較佳。又,加工速度若為上述上限以下,則能夠獲得充分之接著強度。The crimping pressure during the thermal lamination process is based on the linear pressure between the rolls, preferably 1-40 kg/m. If the crimping pressure is more than the above lower limit, sufficient adhesive strength can be obtained by thermal lamination. In addition, if the crimping pressure is below the above upper limit, no wrinkles are generated, and a neat appearance can be obtained. Regarding the processing speed during thermal lamination, in order to balance the bonding strength and productivity, it is preferably 0.5-50 m/min. If the processing speed is equal to or higher than the above lower limit, the productivity is sufficient and it is preferable in terms of economic efficiency. In addition, if the processing speed is equal to or lower than the above upper limit, sufficient adhesive strength can be obtained.

又,藉由將本發明之改質氫化嵌段共聚物之溶液或漿料塗佈於金屬、玻璃或塑膠等基材上,其後去除溶劑,亦可獲得積層體。 作為塗佈之方法,除了棒式塗佈機、刮刀塗佈機、模嘴塗佈機、凹版輥式塗佈機、噴塗等以外,亦能夠利用毛刷進行塗佈。In addition, by coating the solution or slurry of the modified hydrogenated block copolymer of the present invention on a substrate such as metal, glass, or plastic, and then removing the solvent, a laminate can also be obtained. As a coating method, in addition to a bar coater, a knife coater, a die nozzle coater, a gravure roll coater, spray coating, etc., it can also be coated with a brush.

亦能夠於進行塗佈之後自塗佈表面蒸餾去除溶劑。通常而言,較佳為吹送熱風,亦能夠組合減壓處理與加熱,或同時地進行加壓壓製等。The solvent can also be distilled off from the coated surface after coating. Generally speaking, it is preferable to blow hot air, and it is also possible to combine pressure reduction treatment and heating, or simultaneously pressurize and press.

作為獲得上述積層體之被塗佈素材的基材,例如可例舉:銅、鋁、鐵、不鏽鋼、鎳、鋅、鈦、鎢等金屬類或合金類;玻璃板、玻璃纖維氈、玻璃纖維布、玻璃棉等玻璃類;聚乙烯、聚丙烯、聚丁烯、乙烯-α烯烴共聚物、丙烯-α烯烴共聚物、乙烯-丙烯酸酯共聚物、乙烯-乙烯基單體共聚物、聚醯胺、乙烯-乙酸乙烯酯共聚物(EVOH)等塑膠。 其等可為板狀、膜狀、或被賦予其他形狀,亦可為單一素材或經複合化之素材,還可為單層或經積層化之複數層。As a substrate for obtaining the coated material of the above-mentioned laminate, for example, metals or alloys such as copper, aluminum, iron, stainless steel, nickel, zinc, titanium, tungsten, etc.; glass plate, glass fiber mat, glass fiber Glass such as cloth and glass wool; polyethylene, polypropylene, polybutene, ethylene-α olefin copolymer, propylene-α olefin copolymer, ethylene-acrylate copolymer, ethylene-vinyl monomer copolymer, polyamide Amine, ethylene-vinyl acetate copolymer (EVOH) and other plastics. They may be plate-shaped, film-shaped, or given other shapes, may be a single material or a composite material, and may be a single layer or a plurality of layers that are laminated.

該等基材之中,若面向電路基板等電子構件,要想提高導電性或經濟性,較佳為銅;若為扶手或合板用途,要想提高經濟性、剛性,較佳為鐵或不鏽鋼;若為電池包裝等用途,要想提高輕量性、加工性,較佳為鋁;若為食品包裝用途,要想表現阻氣性,較佳為聚醯胺或EVOH。Among these substrates, if they are facing electronic components such as circuit boards, copper or stainless steel is preferred if they want to improve conductivity or economy; if they are used for handrails or plywood, if they want to improve economy and rigidity, iron or stainless steel is preferred. ; For battery packaging and other purposes, aluminum is preferred for improving lightness and processability; for food packaging purposes, for gas barrier properties, polyamide or EVOH is preferred.

於藉由熱層壓加工所獲得之積層體中,包含改質氫化嵌段共聚物之層的厚度較佳為5~500 μm。 上述層之厚度若為5 μm以上,則作為層之強度充分,結果使得積層體之接著強度亦充分。 又,上述層之厚度若為500 μm以下,則熱層壓加工時之熱傳輸充分,且包含改質氫化嵌段共聚物之層的剛性不會變高,結果使得積層體之接著強度充分,亦不會喪失作為積層體之柔軟性。In the laminate obtained by the thermal lamination process, the thickness of the layer containing the modified hydrogenated block copolymer is preferably 5 to 500 μm. If the thickness of the above-mentioned layer is 5 μm or more, the strength as the layer is sufficient, and as a result, the adhesive strength of the laminate is also sufficient. In addition, if the thickness of the above-mentioned layer is 500 μm or less, the heat transfer during the thermal lamination process will be sufficient, and the rigidity of the layer containing the modified hydrogenated block copolymer will not increase. As a result, the adhesive strength of the laminate will be sufficient. It will not lose its flexibility as a laminate.

於藉由塗佈而獲得之積層體中,包含改質氫化嵌段共聚物之層的厚度較佳為1~100 μm。 上述層之厚度若為1 μm以上,則塗膜之密接強度不會下降。 又,上述層之厚度若為100 μm以下,則塗佈時容易進行厚度控制,不會對生產性造成影響。In the laminate obtained by coating, the thickness of the layer containing the modified hydrogenated block copolymer is preferably 1-100 μm. If the thickness of the above layer is 1 μm or more, the adhesion strength of the coating film will not decrease. In addition, if the thickness of the above-mentioned layer is 100 μm or less, thickness control during coating can be easily performed, and productivity will not be affected.

<用途> 本發明之改質氫化嵌段共聚物發揮如下述般之效果:透明,具有耐熱性,對於有機溶劑之溶解性優異,且對於金屬、玻璃及塑膠等基材之接著性優異。 又,包含本發明之改質氫化嵌段共聚物之溶液亦發揮如下述般之效果:可賦予對於金屬、玻璃及塑膠等基材之接著性優異之積層體。 因此,能夠應用於各種領域,如:接著劑、塗料、土木建築用材料、電氣・電子零件之絕緣材料等,尤其是作為電氣・電子領域中之絕緣澆鑄、積層材料、密封材料等有用。<Use> The modified hydrogenated block copolymer of the present invention exhibits the following effects: transparency, heat resistance, excellent solubility in organic solvents, and excellent adhesion to substrates such as metals, glass, and plastics. In addition, the solution containing the modified hydrogenated block copolymer of the present invention also exhibits the following effect: it can provide a laminate with excellent adhesion to substrates such as metals, glass, and plastics. Therefore, it can be used in various fields, such as adhesives, paints, civil construction materials, insulating materials for electrical and electronic parts, etc. It is especially useful as insulating casting, laminated materials, and sealing materials in the electrical and electronic fields.

作為本發明之改質氫化嵌段共聚物或使用其之溶液或漿料之用途的一例,可例舉:銅箔積層板、軟性印刷基板、多層印刷配線基板、電容器等電氣・電子線路用積層板;膜狀接著劑、液狀接著劑等接著劑;半導體密封材料、底部填充膠材料、3D-LSI(3D-Large Scale Integration,三維大規模積體電路)用晶片間填充膠、絕緣片、預浸體、散熱基板。As an example of the use of the modified hydrogenated block copolymer of the present invention or the solution or paste using it, examples include: copper foil laminates, flexible printed circuit boards, multilayer printed wiring boards, capacitors and other electrical and electronic circuit laminates Boards; film adhesives, liquid adhesives and other adhesives; semiconductor sealing materials, underfill materials, 3D-LSI (3D-Large Scale Integration, three-dimensional large scale integrated circuit) inter-chip filling glue, insulating sheet, Prepreg, heat dissipation substrate.

<含有導電性金屬層之積層體> 本發明之改質氫化嵌段共聚物、使用其之溶液或漿料亦適宜用作上述電氣・電子線路用積層板等含有導電性金屬層之積層體。 該含有導電性金屬層之積層體係積層有包含本發明之改質氫化嵌段共聚物的層、與導電性金屬層而成者,只要係積層有包含本發明之改質氫化嵌段共聚物的層、與導電性金屬層而成者,則除了包括上述電氣・電子線路以外,亦包括具有電容器之電路等積層體。 再者,含有導電性金屬層之積層體中,亦可形成有包含2種以上之改質氫化嵌段共聚物的層,且只要於至少1層中使用本發明之改質氫化嵌段共聚物即可。又,亦可形成有2種以上之導電性金屬層。 [實施例]<Laminated body containing conductive metal layer> The modified hydrogenated block copolymer of the present invention, and the solution or slurry using the same can also be suitably used as laminates containing conductive metal layers, such as the above-mentioned laminates for electrical and electronic circuits. The laminate system containing a conductive metal layer is formed by laminating a layer containing the modified hydrogenated block copolymer of the present invention and a conductive metal layer, as long as the laminate system containing the modified hydrogenated block copolymer of the present invention is laminated Layers and conductive metal layers include not only the above-mentioned electrical and electronic circuits, but also laminates such as circuits with capacitors. Furthermore, in a laminate containing a conductive metal layer, a layer containing two or more types of modified hydrogenated block copolymers may be formed, and as long as the modified hydrogenated block copolymer of the present invention is used in at least one layer That's it. In addition, two or more types of conductive metal layers may be formed. [Example]

以下,藉由實施例,對本發明更加詳細地進行說明,但本發明並不受本實施例任何限定。再者,以下之實施例及比較例中,利用下述方法測定各種物性。Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited in any way by this embodiment. In addition, in the following Examples and Comparative Examples, various physical properties were measured by the following methods.

<分子量> ・裝置:東曹(股)製造之GPC HLC-832GPC/HT ・檢測器:MIRAN公司製造之1A紅外分光光度計(測定波長:3.42 μm) ・管柱:昭和電工(股)製造之AD806M/S 3根(管柱之校準係測定東曹製造之單分散聚苯乙烯(A500、A2500、F1、F2、F4、F10、F20、F40、F288之各0.5 mg/ml溶液),利用3次式使溶出體積與分子量之對數值近似) ・測定溫度:135℃ ・濃度:20 mg/10mL ・注入量:0.2 ml ・溶劑:鄰二氯苯 ・流速:1.0 ml/分鐘<Molecular weight> ・Device: GPC HLC-832GPC/HT manufactured by Tosoh Corporation ・Detector: 1A infrared spectrophotometer manufactured by MIRAN (measurement wavelength: 3.42 μm) ・Tube column: 3 AD806M/S manufactured by Showa Denko Co., Ltd. (The calibration of the column is measured by monodisperse polystyrene manufactured by Tosoh (A500, A2500, F1, F2, F4, F10, F20, F40, F288) Each 0.5 mg/ml solution), the logarithmic value of the dissolution volume and molecular weight is approximated by using the third-order formula) ・Measurement temperature: 135℃ ・Concentration: 20 mg/10mL ・Injection volume: 0.2 ml ・Solvent: o-dichlorobenzene ・Flow rate: 1.0 ml/min

<聚合物嵌段之比率> [利用碳NMR之測定] ・裝置:Bruker公司製造之「AVANCE400分光計」 ・溶劑:鄰二氯苯-h4 /對二氯苯-d4 混合溶劑 ・濃度:0.3 g/2.5 ml ・測定:13 C-NMR ・共振頻率:400 MHz ・傾倒角度:45度 ・資料獲取時間:1.5秒鐘 ・脈衝重複時間:15秒鐘 ・累計次數:3600 ・測定溫度:100℃ ・1 H照射:完全去偶合<Polymer block ratio> [Measurement by carbon NMR] ・Device: "AVANCE400 Spectrometer" manufactured by Bruker Corporation ・Solvent: o-dichlorobenzene-h 4 /p-dichlorobenzene-d 4 mixed solvent ・Concentration: 0.3 g/2.5 ml ・Measurement: 13 C-NMR ・Resonance frequency: 400 MHz ・Tipping angle: 45 degrees ・Data acquisition time: 1.5 seconds ・Pulse repetition time: 15 seconds ・Cumulative count: 3600 ・Measurement temperature: 100 ℃ ・1 H irradiation: complete decoupling

<氫化芳香族乙烯基聚合物嵌段單元之氫化水準、氫化共軛二烯聚合物嵌段單元之氫化水準> [利用質子NMR之測定] ・裝置:Bruker公司製造之「AVANCE400分光計」 ・溶劑:四氯乙烷 ・濃度:0.045 g/1.0 ml ・測定:1 H-NMR ・共振頻率:400 MHz ・傾倒角度:45度 ・資料獲取時間:4秒鐘 ・脈衝重複時間:10秒鐘 ・累計次數:64 ・測定溫度:80℃ ・氫化芳香族乙烯基聚合物嵌段單元之氫化水準:6.8~7.5 ppm之積分值減少率 ・氫化共軛二烯聚合物嵌段單元之氫化水準:5.7~6.4 ppm之積分值減少率<Hydrogenation level of hydrogenated aromatic vinyl polymer block unit and hydrogenation level of hydrogenated conjugated diene polymer block unit> [Measurement by proton NMR] ・Device: "AVANCE400 Spectrometer" manufactured by Bruker Corporation ・Solvent : Tetrachloroethane · Concentration: 0.045 g/1.0 ml · Measurement: 1 H-NMR · Resonance frequency: 400 MHz · Pour angle: 45 degrees · Data acquisition time: 4 seconds · Pulse repetition time: 10 seconds · Cumulative Frequency: 64 ・Measuring temperature: 80℃ ・Hydrogenation level of hydrogenated aromatic vinyl polymer block unit: 6.8~7.5 ppm integral value reduction rate ・Hydrogenation level of hydrogenated conjugated diene polymer block unit: 5.7~ 6.4 ppm of integral value reduction rate

<改質氫化嵌段共聚物之改質率> [利用質子NMR之測定] ・裝置:BRUKER公司製造之「AVANCE400分光計」 ・溶劑:氘代鄰二氯苯 ・濃度:20 mg/0.62 ml ・測定:1 H-NMR ・共振頻率:400 MHz ・傾倒角度:45度 ・資料獲取時間:4秒鐘 ・脈衝重複時間:10秒鐘 ・累計次數:64 ・測定溫度:120℃ ・改質氫化嵌段共聚物之改質率:對改質氫化嵌段共聚物實施甲酯化處理之後,將3.42~3.94 ppm之訊號作為順丁烯二酸二甲酯進行計數,並根據其積分值之1/2算出改質氫化嵌段共聚物之改質率。<Modification rate of modified hydrogenated block copolymer> [Measurement by proton NMR] ・Device: "AVANCE400 Spectrometer" manufactured by BRUKER Corporation ・Solvent: Deuterated o-dichlorobenzene ・Concentration: 20 mg/0.62 ml ・Measurement: 1 H-NMR • Resonance frequency: 400 MHz • Pour angle: 45 degrees • Data acquisition time: 4 seconds • Pulse repetition time: 10 seconds • Cumulative number of times: 64 • Measurement temperature: 120°C • Modified hydrogenation Modification rate of segment copolymer: After the modified hydrogenated block copolymer is methylated, the signal of 3.42~3.94 ppm is counted as dimethyl maleate, and the integral value is 1/ 2 Calculate the modification rate of the modified hydrogenated block copolymer.

<透明性> 使用住友重機(股)製造之SE-18D射出成型機,於成形溫度220℃、模具溫度40℃之條件下射出成型為2 mm×40 mm×80 mm之平板。使用該板,依據JIS K7105(1981)中所記載之測定法,進行霧度測定。 基於所測得之霧度之值,對透明性進行評價。將評價結果示於表中。再者,霧度值越低,則透明性越良好。<Transparency> Using SE-18D injection molding machine manufactured by Sumitomo Heavy Industries Co., Ltd., injection molding into a flat plate of 2 mm×40 mm×80 mm at a molding temperature of 220°C and a mold temperature of 40°C. Using this plate, the haze measurement was performed in accordance with the measurement method described in JIS K7105 (1981). Based on the measured haze value, the transparency is evaluated. The evaluation results are shown in the table. Furthermore, the lower the haze value, the better the transparency.

<耐熱性> 使3張上述所獲得之板重疊,利用JIS K7206(1999)中所記載之方法,測定維氏軟化溫度。基於所測得之維氏軟化溫度之值,對耐熱性進行評價。將評價結果示於表中。再者,維氏軟化溫度越高,則耐熱性越高。<Heat resistance> The three plates obtained above were stacked, and the Vickers softening temperature was measured by the method described in JIS K7206 (1999). Based on the measured value of the Vickers softening temperature, the heat resistance was evaluated. The evaluation results are shown in the table. Furthermore, the higher the Vickers softening temperature, the higher the heat resistance.

<介電特性(介電常數、介電損耗因數)> 於成形溫度240℃下製得2 mm×100 mm×100 mm之壓製片材。將該片材作為試片,使用向量網路分析儀(KEYSIGHT PNA N5227A),於測定頻率50 GHz、溫度25℃、濕度40%之條件下,測定介電常數(ε')與介電損耗因數(tanδ)。<Dielectric characteristics (dielectric constant, dielectric loss factor)> A pressed sheet of 2 mm×100 mm×100 mm was produced at a forming temperature of 240°C. Use this sheet as a test piece and use a vector network analyzer (KEYSIGHT PNA N5227A) to measure the dielectric constant (ε') and dielectric loss factor under the conditions of a measuring frequency of 50 GHz, a temperature of 25 ℃, and a humidity of 40% (tanδ).

<接著性> 使用JISH4000 A5052P 1 mm×70 mm×150 mm之鋁板作為鋁板。 使用JISG4305 SUS304 BA 0.5 mm×70 mm×150 mm之不鏽鋼板作為不鏽鋼板。 使用JISH3100 C1100P 0.8 mm×25 mm×150 mm之銅板作為銅板。 使用如下述般之平板作為聚醯胺板,該平板係使用DSM公司製造之Novamid 1020C,利用住友重機(股)製造之SE-18D射出成型機,於成形溫度240℃、模具溫度40℃之條件下射出成型為2 mm×40 mm×80 mm之平板。 使用如下述般之平板作為EVOH板,該平板係使用可樂麗製造之Eval F101B,利用住友重機(股)製造之SE-18D射出成型機,於成形溫度220℃、模具溫度40℃之條件下射出成型為2 mm×40 mm×80 mm之平板。<Adhesion> Use JISH4000 A5052P 1 mm×70 mm×150 mm aluminum plate as the aluminum plate. Use JISG4305 SUS304 BA 0.5 mm×70 mm×150 mm stainless steel plate as the stainless steel plate. Use JISH3100 C1100P 0.8 mm×25 mm×150 mm copper plate as the copper plate. Use the following flat plate as the polyamide plate. The flat plate is made of Novamid 1020C manufactured by DSM Co., Ltd., using SE-18D injection molding machine manufactured by Sumitomo Heavy Industries Co., Ltd., at a molding temperature of 240°C and a mold temperature of 40°C. The bottom injection molding is 2 mm×40 mm×80 mm flat plate. Use the following flat plate as the EVOH plate. The flat plate is Eval F101B manufactured by Kuraray, using SE-18D injection molding machine manufactured by Sumitomo Heavy Industries Co., Ltd., and injected at a molding temperature of 220°C and a mold temperature of 40°C. It is formed into a flat plate of 2 mm×40 mm×80 mm.

對所使用之金屬板及樹脂板,利用丙酮擦拭表面之後,將溶液以厚度達到50 μm之方式利用線棒式塗佈機進行塗佈,吹送80℃之溫風而去除溶劑,並利用減壓乾燥器,於50℃下進行2小時減壓處理。 其後,利用NT切割機將塗佈面切出100個寬度1 mm之柵格,並於其上貼附米其邦製造之布膠帶LS NO.123,其後使其剝離,觀察100個柵格之中殘留之數量,從而對接著性進行評價。 將評價結果示於表1。殘留之柵格之數量越多,則接著性越良好。After wiping the surface of the metal plate and resin plate with acetone, apply the solution to a thickness of 50 μm using a wire bar coater, blow 80°C warm air to remove the solvent, and reduce the pressure In a desiccator, a reduced pressure treatment was carried out at 50°C for 2 hours. After that, use an NT cutter to cut out 100 grids with a width of 1 mm on the coated surface, and stick cloth tape LS NO.123 made by Miqibang on them, and then peel them off and observe the 100 grids The remaining amount in the grid, so as to evaluate the adhesion. The evaluation results are shown in Table 1. The greater the number of remaining grids, the better the adhesion.

<原材料> [氫化嵌段共聚物(a-1)] 三菱化學(股)製造之ZELAS(商標註冊)MC930 ・MFR(230℃、2.16 kg):1 g/10分鐘 ・氫化芳香族乙烯基聚合物嵌段單元:含有率65莫耳%、氫化水準99.5%以上之氫化聚苯乙烯 ・氫化共軛二烯聚合物嵌段單元:含有率35莫耳%、氫化水準99.5%以上之氫化聚丁二烯 ・嵌段結構:五嵌段結構、合計氫化水準:99.5%以上 氫化嵌段共聚物(a-1)係未藉由不飽和羧酸及/或不飽和羧酸酐得到改質之氫化嵌段共聚物。<Raw materials> [Hydrogenated block copolymer (a-1)] ZELAS (trademark registration) MC930 manufactured by Mitsubishi Chemical Co., Ltd. ・MFR (230°C, 2.16 kg): 1 g/10 minutes ・Hydrogenated aromatic vinyl polymer block unit: hydrogenated polystyrene with a content of 65 mol% and a hydrogenation level of 99.5% or more ・Hydrogenated conjugated diene polymer block unit: hydrogenated polybutadiene with a content of 35 mol% and a hydrogenation level of 99.5% or more ・Block structure: pentablock structure, total hydrogenation level: 99.5% or more The hydrogenated block copolymer (a-1) is a hydrogenated block copolymer that has not been modified by unsaturated carboxylic acid and/or unsaturated carboxylic anhydride.

[有機過氧化物] 日本油脂(股)製造之Perhexa 25B ・2,5-二甲基-2,5-二(第三丁基過氧基)己烷[Organic Peroxide] Perhexa 25B manufactured by Nippon Oil & Fat Co., Ltd. ・2,5-Dimethyl-2,5-bis(tert-butylperoxy)hexane

<實施例1> [改質氫化嵌段共聚物(A-1)] 相對於氫化嵌段共聚物(a-1)之100質量份而言,調配順丁烯二酸酐1.3質量份、有機過氧化物0.0065質量份,並充分地進行攪拌。 其後,使用雙軸擠出機(日本製鋼(股)製造之TEX25αⅢ),於汽缸溫度280℃、螺桿轉速400 rpm、噴出量10 kg/h之條件下進行熔融混練,對所擠出之熔融線料實施水冷、切割,從而獲得改質氫化嵌段共聚物(A-1)。 所獲得之A-1之物性如下所述,亦示於表1。 ・MFR(230℃、2.16 kg):3 g/10分鐘 ・氫化芳香族乙烯基聚合物嵌段單元:含有率65莫耳%、氫化水準99.5%以上之氫化聚苯乙烯 ・氫化共軛二烯聚合物嵌段單元:含有率35莫耳%、氫化水準99.5%以上之氫化聚丁二烯 ・嵌段結構:五嵌段結構、合計氫化水準:99.5%以上 ・順丁烯二酸酐改質率:1.2質量%<Example 1> [Modified hydrogenated block copolymer (A-1)] With respect to 100 parts by mass of the hydrogenated block copolymer (a-1), 1.3 parts by mass of maleic anhydride and 0.0065 parts by mass of organic peroxide were blended and sufficiently stirred. After that, use a twin-screw extruder (TEX25αⅢ manufactured by Nippon Steel Co., Ltd.) to melt and knead under the conditions of a cylinder temperature of 280°C, a screw speed of 400 rpm, and a discharge rate of 10 kg/h. The strand is water-cooled and cut to obtain a modified hydrogenated block copolymer (A-1). The physical properties of the obtained A-1 are as follows and are also shown in Table 1. ・MFR (230°C, 2.16 kg): 3 g/10 minutes ・Hydrogenated aromatic vinyl polymer block unit: hydrogenated polystyrene with a content of 65 mol% and a hydrogenation level of 99.5% or more ・Hydrogenated conjugated diene polymer block unit: hydrogenated polybutadiene with a content of 35 mol% and a hydrogenation level of 99.5% or more ・Block structure: pentablock structure, total hydrogenation level: 99.5% or more ・Modification rate of maleic anhydride: 1.2% by mass

於200 ml之可分離式燒瓶中投入5 g之A-1、及100 ml(86.2 g)之甲苯,於60℃下進行加熱,並攪拌1小時。A-1全部溶解,成為無色透明之溶液。 使用A-1及A-1之溶液,進行上述之各評價。將評價結果示於表1。Put 5 g of A-1 and 100 ml (86.2 g) of toluene into a 200 ml separable flask, heat at 60°C, and stir for 1 hour. All A-1 is dissolved and becomes a colorless and transparent solution. Using the solutions of A-1 and A-1, each of the above-mentioned evaluations was performed. The evaluation results are shown in Table 1.

<實施例2> [改質氫化嵌段共聚物(A-2)] 相對於所獲得之A-1之100質量份而言,調配有機過氧化物1質量份,並充分地進行攪拌。 其後,與實施例1同樣地進行熔融混練,從而獲得改質氫化嵌段共聚物(A-2)。將所獲得之A-2之物性示於表1。<Example 2> [Modified hydrogenated block copolymer (A-2)] With respect to 100 parts by mass of the obtained A-1, 1 part by mass of organic peroxide was blended and stirred sufficiently. After that, melt-kneading was performed in the same manner as in Example 1 to obtain a modified hydrogenated block copolymer (A-2). The physical properties of the obtained A-2 are shown in Table 1.

使用A-2代替A-1,除此以外,與實施例1同樣地進行操作,獲得甲苯溶液。A-2全部溶解,成為無色透明之溶液。 使用A-2及A-2之溶液,進行上述之各評價。將評價結果示於表1。Except having used A-2 instead of A-1, it carried out similarly to Example 1, and obtained the toluene solution. A-2 is completely dissolved into a colorless and transparent solution. Using the solutions of A-2 and A-2, each of the above-mentioned evaluations was performed. The evaluation results are shown in Table 1.

<比較例1> [氫化嵌段共聚物(a-1)] 使用a-1代替A-1,除此以外,與實施例1同樣地進行操作,獲得甲苯溶液。a-1全部溶解,成為無色透明之溶液。 使用a-1及a-1之溶液,進行上述之各評價。將評價結果示於表1。<Comparative example 1> [Hydrogenated block copolymer (a-1)] Except having used a-1 instead of A-1, it carried out similarly to Example 1, and obtained the toluene solution. a-1 is completely dissolved and becomes a colorless and transparent solution. Using the solutions of a-1 and a-1, each of the above-mentioned evaluations was performed. The evaluation results are shown in Table 1.

<比較例2> [改質嵌段共聚物(a-2)] 作為苯乙烯-丁二烯嵌段共聚物氫化物之順丁烯二酸酐改質體,使用旭化成(股)製造之Tuftec M1943。 a-2係嵌段共聚物之順丁烯二酸酐改質體,且係作為原料的嵌段共聚物之芳香族乙烯基聚合物嵌段單元未氫化者。 使用a-2代替A-1,除此以外,與實施例1同樣地進行操作,獲得甲苯溶液。a-2全部溶解,成為無色透明之溶液。 使用a-2及a-2之溶液,進行上述之各評價。將評價結果示於表1。<Comparative example 2> [Modified block copolymer (a-2)] As the maleic anhydride modifier of the hydrogenated styrene-butadiene block copolymer, Tuftec M1943 manufactured by Asahi Kasei Co., Ltd. was used. a-2 is a maleic anhydride modified product of block copolymer, and it is a block copolymer of aromatic vinyl polymer as a raw material that has not been hydrogenated. Except having used a-2 instead of A-1, it carried out similarly to Example 1, and obtained the toluene solution. a-2 is completely dissolved and becomes a colorless and transparent solution. Using the solutions of a-2 and a-2, each of the above-mentioned evaluations was performed. The evaluation results are shown in Table 1.

<比較例3> [改質聚烯烴(a-3)] 作為丙烯-丁烯共聚物,使用三井化學(股)Tafmer XM7070,與實施例1同樣地藉由順丁烯二酸酐使其改質,從而獲得酸改質丙烯-丁烯共聚物(a-3)。 使用a-3代替A-1,除此以外,與實施例1同樣地進行操作,獲得甲苯溶液。a-3全部溶解,成為無色透明之溶液。 使用a-3及a-3之溶液,進行上述之各評價。再者,由於a-3之透明性及耐熱性較差,因此未對介電特性進行評價。將評價結果示於表1。<Comparative example 3> [Modified polyolefin (a-3)] As the propylene-butene copolymer, Mitsui Chemicals Co., Ltd. Tafmer XM7070 was used, and it was modified with maleic anhydride in the same manner as in Example 1, to obtain an acid-modified propylene-butene copolymer (a-3 ). Except having used a-3 instead of A-1, it carried out similarly to Example 1, and obtained the toluene solution. All a-3 is dissolved and becomes a colorless and transparent solution. Using the solutions of a-3 and a-3, each of the above evaluations was performed. Furthermore, since a-3 has poor transparency and heat resistance, the dielectric properties were not evaluated. The evaluation results are shown in Table 1.

<比較例4> [改質聚乙烯(a-4)] 作為酸改質聚乙烯,使用三菱化學(股)製造之Modic M704。 使用a-4代替A-1,除此以外,與實施例1同樣地進行操作,雖欲使a-4溶解於甲苯中,但a-4並未全部溶解,而是成為渾濁之凝膠狀,無法提供於塗佈。因此,無法對接著性進行評價。又,由於a-4之透明性及耐熱性較差,因此未對介電特性進行評價。將評價結果示於表1。<Comparative Example 4> [Modified polyethylene (a-4)] As the acid-modified polyethylene, Modic M704 manufactured by Mitsubishi Chemical Co., Ltd. was used. A-4 was used instead of A-1, except that the operation was the same as in Example 1. Although a-4 was to be dissolved in toluene, a-4 was not completely dissolved, but became a cloudy gel. , Cannot be provided for coating. Therefore, the adhesiveness cannot be evaluated. In addition, since a-4 has poor transparency and heat resistance, the dielectric properties were not evaluated. The evaluation results are shown in Table 1.

<比較例5> [改質聚丙烯(a-5)] 作為酸改質聚丙烯,使用三菱化學(股)製造之Modic P908。 使用a-5代替A-1,除此以外,與實施例1同樣地進行操作,雖欲使a-5溶解於甲苯中,但a-5並未全部溶解,而無法提供於塗佈。因此,無法對接著性進行評價。又,由於a-5之透明性較差,因此未對介電特性進行評價。將評價結果示於表1。<Comparative Example 5> [Modified polypropylene (a-5)] As the acid-modified polypropylene, Modic P908 manufactured by Mitsubishi Chemical Co., Ltd. was used. Except for using a-5 instead of A-1, the operation was performed in the same manner as in Example 1. Although a-5 was to be dissolved in toluene, a-5 was not completely dissolved and could not be used for coating. Therefore, the adhesiveness cannot be evaluated. In addition, since a-5 has poor transparency, the dielectric properties were not evaluated. The evaluation results are shown in Table 1.

<比較例6> [嵌段共聚物(a-6)] 作為苯乙烯-丁二烯嵌段共聚物氫化物,使用Kraton Polymers公司製造之Kraton G1652。 a-6係芳香族乙烯基聚合物嵌段單元未氫化、亦未經酸改質之嵌段共聚物。 a-6係用於顯示先前製品之耐熱性及介電特性之水準者,僅對耐熱性及介電特性進行評價。將評價結果示於表1。<Comparative Example 6> [Block copolymer (a-6)] As the hydrogenated styrene-butadiene block copolymer, Kraton G1652 manufactured by Kraton Polymers was used. a-6 is a block copolymer of aromatic vinyl polymer without hydrogenation or acid modification. a-6 is used to show the level of heat resistance and dielectric properties of previous products, and only the heat resistance and dielectric properties are evaluated. The evaluation results are shown in Table 1.

[表1]    比較例 實施例 比較例 1 1 2 2 3 4 5 6 改質氫化嵌段共聚物、氫化嵌段共聚物或其他樹脂 a-1 A-1 A-2 a-2 a-3 a-4 a-5 a-6 物性 改質率 [質量%] 0 1.2 1.2 0.9 0.9 1 0.7 0 氫化芳香族乙烯基聚合物嵌段單元之氫化水準 [%] ≧99.5 ≧99.5 ≧99.5 0 - - - 0 氫化共軛二烯聚合物嵌段單元之氫化水準 [%] ≧99.5 ≧99.5 ≧99.5 ≧99 - - - ≧99 Mw 76000 68000 55000 100000 144000 123000 78000 68500 評價 透明性 霧度 [%] 0.4 0.5 0.8 97 58 82 83 -(*1) 耐熱性 維氏軟化溫度 [℃] 129 125 118 35 60 98 148 未達35 介電特性 介電常數(ε')    2.27 2.16 2.28 2.18 -(*1) -(*1) -(*1) 2.26 介電損耗因數(tan5)    0.0003 0.0011 0.0008 0.0010 -(*1) -(*1) -(*1) 0.0014 接著性 鋁板    84/100 100/100 100/100 0/100 97/100 -(*2) -(*3) -(*1) 不鏽鋼板    0/100 77/100 100/100 0/100 2/100 -(*2) -(*3) -(*1) 銅板    40/100 99/100 100/100 0/100 83/100 -(*2) -(*3) -(*1) 聚醯胺板    67/100 100/100 83/100 0/100 96/100 -(*2) -(*3) -(*1) EVOH板    55/100 95/100 99/100 0/100 100/100 -(*2) -(*3) -(*1) 註:*1…未測定。 *2…由於發生凝膠化,因此無法提供於塗佈,未進行評價。 *3…由於未溶解,因此無法提供於塗佈,未進行評價。 [Table 1] Comparative example Example Comparative example 1 1 2 2 3 4 5 6 Modified hydrogenated block copolymer, hydrogenated block copolymer or other resins a-1 A-1 A-2 a-2 a-3 a-4 a-5 a-6 Physical properties Modification rate [quality%] 0 1.2 1.2 0.9 0.9 1 0.7 0 Hydrogenation level of hydrogenated aromatic vinyl polymer block unit [%] ≧99.5 ≧99.5 ≧99.5 0 - - - 0 Hydrogenation level of hydrogenated conjugated diene polymer block unit [%] ≧99.5 ≧99.5 ≧99.5 ≧99 - - - ≧99 Mw 76000 68000 55,000 100000 144000 123000 78000 68500 Evaluation Transparency Haze [%] 0.4 0.5 0.8 97 58 82 83 -(*1) Heat resistance Vickers softening temperature [℃] 129 125 118 35 60 98 148 Less than 35 Dielectric properties Dielectric constant (ε') 2.27 2.16 2.28 2.18 -(*1) -(*1) -(*1) 2.26 Dielectric loss factor (tan5) 0.0003 0.0011 0.0008 0.0010 -(*1) -(*1) -(*1) 0.0014 Continuity Aluminum plate 84/100 100/100 100/100 0/100 97/100 -(*2) -(*3) -(*1) Stainless steel plate 0/100 77/100 100/100 0/100 2/100 -(*2) -(*3) -(*1) Copper plate 40/100 99/100 100/100 0/100 83/100 -(*2) -(*3) -(*1) Polyamide board 67/100 100/100 83/100 0/100 96/100 -(*2) -(*3) -(*1) EVOH board 55/100 95/100 99/100 0/100 100/100 -(*2) -(*3) -(*1) Note: *1...Not determined. *2...Because of gelation, it could not be applied to coating and was not evaluated. *3... Since it was not dissolved, it could not be used for coating and was not evaluated.

<實施例3> 利用Labtech Engineering公司製造之多層膜成形機,於260℃、速度5 m/分鐘之條件下,使用50 μm之a-1作為表面層,使用10 μm之a-1作為中間層,使用20 μm之A-1作為密封層,從而成形為3層膜。 利用TESTER SANGYO公司製造之貼合機,使用由尼龍/鋁箔所構成之膜與上述所獲得之3層膜,以使3層膜之密封層與鋁面接觸之方式進行設定,於輥溫度200℃、速度0.75 m/分鐘、壓軋壓力0.3 MPa(線壓1.5 kg/m)之條件下進行熱層壓。 其後,切成寬度15 mm之短條,利用下述方法進行90度剝離試驗,測定鋁接著強度。將結果示於表2。<Example 3> Using a multilayer film forming machine manufactured by Labtech Engineering, at 260°C and a speed of 5 m/min, use 50 μm a-1 as the surface layer, 10 μm a-1 as the intermediate layer, and 20 μm A-1 is used as a sealing layer to form a three-layer film. Using a laminating machine made by TESTER SANGYO, use a film composed of nylon/aluminum foil and the three-layer film obtained above, and set so that the sealing layer of the three-layer film is in contact with the aluminum surface. The roll temperature is 200°C. , The speed is 0.75 m/min, and the rolling pressure is 0.3 MPa (line pressure 1.5 kg/m) for thermal lamination. After that, it was cut into short strips with a width of 15 mm, and a 90-degree peel test was performed using the following method to measure the aluminum bonding strength. The results are shown in Table 2.

[90度剝離試驗] 90度剝離試驗係使用通常之拉伸試驗機、與90度剝離試驗用之夾具進行測定。藉由夾具將上述短條試片固定於水平方向,並預先將端部略微剝離。利用拉伸試驗機之上部抓持部抓住該剝離之部分,並向上方拉伸,藉此能夠以相對於短條試片之朝向為90度之角度進行剝離。 由於剝離點於進行剝離之同時水平地移動,故使固定有短條試片之夾具水平地滑動,從而以剝離點總是位於上部抓持部之正下之方式進行剝離。 拉伸速度為300 mm/分鐘,測定環境為溫度23℃,濕度為40%RH。[90 degree peel test] The 90-degree peel test is measured using a normal tensile testing machine and the jig for the 90-degree peel test. Fix the above-mentioned short test piece in the horizontal direction by a clamp, and peel off the end slightly in advance. The upper gripping part of the tensile testing machine grasps the peeled part and stretches it upward, thereby enabling peeling at an angle of 90 degrees with respect to the orientation of the short strip of test piece. Since the peeling point moves horizontally while peeling, the jig holding the short test piece is slid horizontally, so that the peeling point is always located directly under the upper gripping part. The stretching speed is 300 mm/min, and the measuring environment is 23°C and 40%RH.

<比較例7> 密封層使用a-1,除此以外,與實施例3同樣地進行操作,測定鋁接著強度。將結果示於表2。<Comparative Example 7> Except that a-1 was used for the sealing layer, the same procedure as in Example 3 was carried out, and the aluminum adhesive strength was measured. The results are shown in Table 2.

[表2] 3層膜之評價 實施例3 比較例7 表面層 厚度50 μm a-1 a-1 中間層 厚度10 μm a-1 a-1 密封層 厚度20 μm A-1 a-1 鋁接著強度        [N] 0.5 0 [Table 2] Evaluation of 3-layer film Example 3 Comparative example 7 Surface layer Thickness 50 μm a-1 a-1 middle layer Thickness 10 μm a-1 a-1 Sealing layer Thickness 20 μm A-1 a-1 Aluminum bonding strength [N] 0.5 0

根據表1可知,本發明之改質氫化嵌段共聚物(實施例1、2)具有良好之透明性及耐熱性,並且介電特性優異,對各種基材顯示良好之接著性。 與之相對,可知改質前之氫化嵌段共聚物(比較例1)雖具有良好之透明性及耐熱性,介電特性優異,但與基材之接著性並不充分。 關於芳香族乙烯基聚合物嵌段單元未氫化之改質嵌段共聚物(比較例2),可知透明性及耐熱性較差,雖介電特性優異,但幾乎無法獲得與基材之接著性。According to Table 1, it can be seen that the modified hydrogenated block copolymer of the present invention (Examples 1 and 2) has good transparency and heat resistance, and has excellent dielectric properties, and shows good adhesion to various substrates. In contrast, it can be seen that the hydrogenated block copolymer before modification (Comparative Example 1) has good transparency, heat resistance, and excellent dielectric properties, but the adhesion to the substrate is insufficient. Regarding the modified block copolymer in which the aromatic vinyl polymer block unit is not hydrogenated (Comparative Example 2), it can be seen that transparency and heat resistance are poor, and although the dielectric properties are excellent, adhesion to the substrate is hardly obtained.

關於改質聚烯烴(比較例3),可知透明性及耐熱性較差,與基材之接著性並不充分。 關於改質聚乙烯(比較例4)及改質聚丙烯(比較例5),由於未溶解於溶劑中,故無法對利用塗佈所產生之接著性進行評價。 嵌段共聚物(比較例6)係顯示先前技術者。根據與比較例6之對比可知,本發明之改質氫化嵌段共聚物具有良好之耐熱性,且介電特性與先前技術相比,為同等以上。Regarding the modified polyolefin (Comparative Example 3), it was found that the transparency and heat resistance were poor, and the adhesion to the substrate was insufficient. Regarding the modified polyethylene (Comparative Example 4) and the modified polypropylene (Comparative Example 5), since they were not dissolved in a solvent, it was not possible to evaluate the adhesiveness by coating. The block copolymer (Comparative Example 6) shows the prior art. According to the comparison with Comparative Example 6, it can be seen that the modified hydrogenated block copolymer of the present invention has good heat resistance, and the dielectric properties are equal to or more than that of the prior art.

根據表2可知,使用本發明之改質氫化嵌段共聚物的積層體(實施例3)藉由熱層壓加工於鋁箔上,從而顯示出對鋁箔良好之接著性。 與之相對,可知使用改質前之氫化嵌段共聚物的積層體(比較例7)儘管熱層壓加工於鋁箔上,但幾乎無法獲得與鋁箔之接著性。According to Table 2, it can be seen that the laminate (Example 3) using the modified hydrogenated block copolymer of the present invention was processed on the aluminum foil by thermal lamination, thereby showing good adhesion to the aluminum foil. On the other hand, it can be seen that the laminate using the hydrogenated block copolymer before modification (Comparative Example 7) is hardly able to obtain adhesiveness to the aluminum foil despite the heat lamination process on the aluminum foil.

Claims (14)

一種改質氫化嵌段共聚物,其係氫化嵌段共聚物藉由不飽和羧酸及/或不飽和羧酸酐進行改質而產生的改質體,且 該氫化嵌段共聚物係包含含有芳香族乙烯基單體單元之聚合物嵌段及含有共軛二烯單體單元之聚合物嵌段的共聚物之氫化體, 上述含有芳香族乙烯基單體單元之聚合物嵌段之氫化體係氫化水準為90%以上之氫化芳香族乙烯基聚合物嵌段單元,上述含有共軛二烯單體單元之聚合物嵌段之氫化體係氫化水準為95%以上之氫化共軛二烯聚合物嵌段單元。A modified hydrogenated block copolymer, which is a modified body produced by modifying the hydrogenated block copolymer by unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and The hydrogenated block copolymer is a hydrogenated body of a copolymer comprising a polymer block containing an aromatic vinyl monomer unit and a polymer block containing a conjugated diene monomer unit, The hydrogenation system of the above-mentioned polymer block containing aromatic vinyl monomer units is hydrogenated aromatic vinyl polymer block units with a hydrogenation level of 90% or more, and the above-mentioned polymer block containing conjugated diene monomer units is The hydrogenation system has a hydrogenation level of 95% or more of hydrogenated conjugated diene polymer block units. 如請求項1之改質氫化嵌段共聚物,其中上述氫化嵌段共聚物具有至少2個上述氫化芳香族乙烯基聚合物嵌段單元,並且具有至少1個上述氫化共軛二烯聚合物嵌段單元。The modified hydrogenated block copolymer of claim 1, wherein the hydrogenated block copolymer has at least two hydrogenated aromatic vinyl polymer block units and at least one hydrogenated conjugated diene polymer block unit. Segment unit. 如請求項1或2之改質氫化嵌段共聚物,其中藉由上述不飽和羧酸及/或不飽和羧酸酐進行改質之改質率為0.1~2質量%。The modified hydrogenated block copolymer according to claim 1 or 2, wherein the modification rate by the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is 0.1-2% by mass. 如請求項1至3中任一項之改質氫化嵌段共聚物,其中上述不飽和羧酸及/或不飽和羧酸酐係順丁烯二酸酐。The modified hydrogenated block copolymer according to any one of claims 1 to 3, wherein the above-mentioned unsaturated carboxylic acid and/or unsaturated carboxylic anhydride is maleic anhydride. 如請求項1至4中任一項之改質氫化嵌段共聚物,其重量平均分子量(Mw)為5,000~100,000。The modified hydrogenated block copolymer according to any one of claims 1 to 4 has a weight average molecular weight (Mw) of 5,000 to 100,000. 一種改質氫化嵌段共聚物溶液或改質氫化嵌段共聚物漿料,其係使如請求項1至5中任一項之改質氫化嵌段共聚物以1~30質量%之濃度溶解或懸浮於有機溶劑中而成者。A modified hydrogenated block copolymer solution or modified hydrogenated block copolymer slurry, which dissolves the modified hydrogenated block copolymer according to any one of claims 1 to 5 at a concentration of 1-30% by mass Or suspended in an organic solvent. 一種含有改質氫化嵌段共聚物之積層體,其係使如請求項1至5中任一項之改質氫化嵌段共聚物積層於基材上而成者。A laminate containing a modified hydrogenated block copolymer, which is obtained by laminating the modified hydrogenated block copolymer according to any one of claims 1 to 5 on a substrate. 如請求項7之含有改質氫化嵌段共聚物之積層體,其係使上述改質氫化嵌段共聚物與1種或2種以上之其他熱塑性樹脂進行熔融共擠出成形而成。For example, the laminate containing the modified hydrogenated block copolymer of claim 7 is formed by melt co-extrusion molding of the modified hydrogenated block copolymer and one or more other thermoplastic resins. 如請求項7之含有改質氫化嵌段共聚物之積層體,其係使上述改質氫化嵌段共聚物熱層壓加工於金屬、紙、陶瓷、熱塑性樹脂或熱固性樹脂之上而成。For example, the laminate containing the modified hydrogenated block copolymer of claim 7 is formed by thermally laminating the modified hydrogenated block copolymer on metal, paper, ceramics, thermoplastic resin or thermosetting resin. 如請求項9之含有改質氫化嵌段共聚物之積層體,其中包含上述改質氫化嵌段共聚物之層的厚度為5~500 μm。The laminate containing the modified hydrogenated block copolymer according to claim 9, wherein the thickness of the layer containing the modified hydrogenated block copolymer is 5 to 500 μm. 一種改質氫化嵌段共聚物之製造方法,其係製造如請求項1至5中任一項之改質氫化嵌段共聚物的方法,且 利用熔融混練、溶液中反應、固相接枝之任一方法對上述氫化嵌段共聚物進行接枝改質。A method for producing a modified hydrogenated block copolymer, which is a method for producing the modified hydrogenated block copolymer according to any one of claims 1 to 5, and The above-mentioned hydrogenated block copolymer is grafted and modified by any method of melt kneading, reaction in solution, and solid phase grafting. 一種改質氫化嵌段共聚物之製造方法,其係製造如請求項1至5中任一項之改質氫化嵌段共聚物的方法,且 藉由不飽和羧酸及/或不飽和羧酸酐對上述氫化嵌段共聚物進行接枝改質。A method for producing a modified hydrogenated block copolymer, which is a method for producing the modified hydrogenated block copolymer according to any one of claims 1 to 5, and The above-mentioned hydrogenated block copolymer is graft-modified by unsaturated carboxylic acid and/or unsaturated carboxylic anhydride. 一種含有改質氫化嵌段共聚物之積層體之製造方法,其係將如請求項6之改質氫化嵌段共聚物溶液或改質氫化嵌段共聚物漿料塗佈於基材上之後,去除溶劑,從而獲得積層體。A method for manufacturing a laminate containing a modified hydrogenated block copolymer, which is after coating the modified hydrogenated block copolymer solution or modified hydrogenated block copolymer slurry as in claim 6 on a substrate, The solvent is removed to obtain a laminate. 如請求項13之含有改質氫化嵌段共聚物之積層體之製造方法,其中包含上述改質氫化嵌段共聚物之層的厚度為1~100 μm。The method for producing a laminate containing a modified hydrogenated block copolymer according to claim 13, wherein the thickness of the layer containing the modified hydrogenated block copolymer is 1-100 μm.
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