JP2008291214A - Method for producing resin varnish containing thermosetting resin of semi-ipn-type compound material, resin varnish for printed wiring board, prepreg, and metal-clad laminated board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a thermosetting resin varnish which can be used for the production of a printed wiring board having good dielectric properties in a high frequency region, capable of significantly reducing a propagation loss, having excellent moisture absorption thermal resistance and thermal expansion properties, and satisfying peeling strength between the printed wiring board and a metal foil. <P>SOLUTION: The method for producing the thermosetting resin varnish containing a thermosetting resin composition being an uncured semi-IPN-type compound material includes a process for obtaining the uncured semi-IPN-type compound material by preliminarily reacting a butadiene polymer containing a 1,2-butadiene unit having a 1,2-vinyl group in a side chain in an amount of ≥40% and being chemically unmodified (B) and a cross-linking agent (C) in the presence of a polyphenylene ether (A) in an organic solvent (D), wherein the organic solvent (D) contains one or more kinds of aromatic hydrocarbons. The thermosetting resin varnish obtained by the method, a prepreg, and a metal clad laminated board are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for producing a resin varnish containing a thermosetting resin of a semi-IPN type composite, and a resin varnish for a printed wiring board, a prepreg, and a metal-clad laminate obtained using the same. More specifically, a novel method for producing a resin varnish for a printed wiring board corresponding to an electronic device whose operating frequency exceeds 1 GHz, and a resin varnish for a printed wiring board, a prepreg, and a metal-clad laminate obtained by using this production method Regarding the board.

  Mobile communication devices such as mobile phones, their base station devices, network-related electronic devices such as servers and routers, and large computers are required to transmit and process large amounts of information with low loss and high speed. Has been. When transmitting and processing large amounts of information, electrical signals with higher frequency can be transmitted and processed faster. However, the electrical signal basically has a property of being easily attenuated as the frequency is high, that is, the output is likely to be weak at a shorter transmission distance and the loss is likely to be increased. Therefore, in order to satisfy the above-mentioned requirements for low loss and high speed, it is necessary to further reduce the transmission loss, particularly the transmission loss in the high frequency band, in the characteristics of the printed wiring board itself that performs transmission and processing mounted on the device. There is.

  In order to obtain a printed wiring board with low transmission loss, conventionally, a substrate material using a fluorine-based resin having a low relative dielectric constant and a low dielectric loss tangent has been used. However, since the fluorine-based resin generally has a high melting temperature and melt viscosity and relatively low fluidity, there is a problem that it is necessary to set high-temperature and high-pressure conditions during press molding. In addition, the processability, dimensional stability, and adhesion to metal plating are insufficient for use as a high-layer printed wiring board used in the above-mentioned communication equipment, network-related electronic equipment, large computers, and the like. There is a problem.

  Therefore, research is being conducted on resin materials for printed wiring boards that can be used for high-frequency applications instead of fluororesins. Of these, the use of polyphenylene ether, which is known as one of the resins having the most excellent dielectric properties among heat resistant polymers, has attracted attention. However, polyphenylene ether is a thermoplastic resin having a high melting temperature and high melt viscosity, similar to the above fluororesin. Therefore, conventionally, for printed wiring board applications, the melting temperature and melt viscosity are lowered, the temperature and pressure conditions are set low during press molding, or the heat resistance above the melting temperature (230 to 250 ° C.) of polyphenylene ether. For the purpose of imparting, it has been used as a resin composition in which polyphenylene ether and a thermosetting resin are used in combination.

For example, a resin composition using an epoxy resin (see Patent Document 1), a resin composition using a bismaleimide (see Patent Document 2), a resin composition using a cyanate ester (see Patent Document 3), styrene-butadiene A resin composition using a copolymer or polystyrene and triallyl cyanurate or triallyl isocyanurate in combination (see Patent Documents 4 to 5), a resin composition using polybutadiene in combination (see Patent Documents 6 and 7), Resin composition obtained by pre-reaction of modified polybutadiene having a functional group such as hydroxyl group, epoxy group, carboxyl group, (meth) acryl group, and bismaleimide and / or cyanate ester (see Patent Document 8), unsaturated double bond The above-mentioned triallyl cyanu is added to a polyphenylene ether provided or grafted with a group-containing compound. Resin composition (see Patent Document 9 and Patent Document 10), a reaction product of polyphenylene ether and unsaturated carboxylic acid or unsaturated acid anhydride, and the above bismaleimide A polybutadiene or a styrene-butadiene copolymer is used in combination with a resin composition (see Patent Document 11) or the like, or a polyphenylene ether oligomer having an unsaturated double bond group at the terminal and a low molecular weight (oligomer) type. Resin compositions, and further, resin compositions in which an inorganic filler is used in combination with these polyphenylene ether resin compositions (see Patent Document 12) have been proposed.
According to these documents, it is disclosed that it is preferable that the cured resin does not have many polar groups in order to improve the above-described thermoplastic defects while maintaining the low transmission loss of polyphenylene ether. ing.

JP 58-69046 A JP-A-56-133355 Japanese Patent Publication No. 61-18937 JP-A-61-286130 JP-A-3-275760 JP-A-62-148512 JP 59-193929 A JP 58-164638 A JP-A-2-208355 JP-A-6-184213 JP-A-6-179734 Japanese Patent Laid-Open No. 2005-105061

  Applicants of the present invention, such as those described in Patent Documents 1 to 12, including a resin composition using a combination of polyphenylene ether and a thermosetting resin, for use as a laminated board for printed wiring boards We examined in detail.

  As a result, in the resin compositions shown in Patent Document 1, Patent Document 2 and Patent Document 11, the dielectric properties after curing are deteriorated by the influence of a highly polar epoxy resin or bismaleimide, and the application uses a high frequency band. It was unsuitable for.

  In the composition using the cyanate ester shown in Patent Document 3, the heat resistance after moisture absorption was lowered although the dielectric properties were excellent.

  In the composition using triallyl cyanurate and triallyl isocyanurate shown in Patent Documents 4 to 5, Patent Document 9 and Patent Document 10, the relative dielectric constant is slightly high, and it is accompanied by moisture absorption of dielectric characteristics. There was a tendency for large drift.

  In the resin composition combined with polybutadiene shown in Patent Documents 4 to 7 and Patent Document 10, although the dielectric properties are excellent, there is a problem that the strength of the resin itself is low and the coefficient of thermal expansion is high. It was inappropriate for printed wiring board use.

  Patent Document 8 is a resin composition in which a modified polybutadiene is used in combination in order to improve adhesion to metals and glass substrates. However, there is a problem that the dielectric characteristics are greatly deteriorated compared with the case of using unmodified polybutadiene, particularly in a high frequency region of 1 GHz or more.

  In the composition using the reaction product of polyphenylene ether and unsaturated carboxylic acid or unsaturated acid anhydride shown in Patent Document 11, it is usually caused by the influence of highly polar unsaturated carboxylic acid or unsaturated acid anhydride. Dielectric properties are worse than when polyphenylene ether is used.

In a composition having an unsaturated double bond group at the terminal and a low molecular weight (oligomer) type polyphenylene ether oligomer in combination with a thermosetting resin such as polybutadiene as shown in Patent Document 12, a curable polyphenylene ether is used. Since the oligomer itself has poor dielectric properties as compared to ordinary polyphenylene ether, as well as the cured polybutadiene resin, the good dielectric properties of polyphenylene ether are impaired. The dielectric properties of the cured composition are worse than if they were. In addition, this curable polyphenylene ether oligomer is significantly more expensive than ordinary polyphenylene ether.
Such a resin composition using a polyphenylene ether and a thermosetting resin in combination is not sufficient as a resin material for use in a laminated board for printed wiring boards that can be used for high frequency applications. Therefore, there is a demand for a thermosetting resin composition containing polyphenylene ether in which these problems are solved.

  In addition, the present inventors conducted research by paying attention to the point of reducing dielectric loss characteristics, particularly transmission loss, and using only a resin having a low dielectric constant and a low dielectric loss tangent, the frequency of electric signals in recent years has been further increased. It was found that it was insufficient as a response to. Transmission loss of electrical signals is classified into loss due to insulation layer (dielectric loss) and loss due to conductor layer (conductor loss), so when using a resin with low dielectric constant and low dielectric loss tangent, dielectric Only the loss is reduced. In order to further reduce the transmission loss, it is necessary to reduce the conductor loss.

  As a method for reducing the conductor loss, a metal foil having a small surface unevenness on the roughened surface (hereinafter referred to as “M surface”) side, which is an adhesive surface between the conductor layer and the insulating layer, specifically, M For example, a method using a metal-clad laminate using a metal foil (hereinafter referred to as “low profile foil”) having a surface roughness (ten-point average roughness; Rz) of 5 μm or less can be used.

  Therefore, the present inventors examined using a thermosetting resin having a low dielectric constant and a low dielectric loss tangent as a printed wiring board material for high frequency applications, and using a low profile foil as the metal foil.

  However, as a result of the study by the present inventors, when the resin composition described in Patent Documents 1 to 12 is used to form a laminated plate with a low profile foil, an insulating (resin) layer and a conductor (metal foil) layer are used. It was found that the adhesive strength (bonding strength) was weakened and the required peel strength between the metal foils could not be secured. This is presumably because the polarity of the resin is low and the anchor effect due to the unevenness of the M surface of the metal foil is reduced. Moreover, in the heat resistance test after moisture absorption in these laminated boards, the malfunction that peeling arises between resin and metal foil generate | occur | produced. This is considered because the adhesive force between the resin and the metal foil is low. From these results, the present inventors have found that the resin compositions described in these Patent Documents 1 to 12 are metal foils having a small surface roughness such as a low profile foil, in addition to the problems described above. I found the problem that it was difficult to apply.

  In particular, in the system of polyphenylene ether and butadiene homopolymer, the following was remarkable. These resins are inherently incompatible with each other, and it is difficult to obtain a uniform resin. Therefore, when the resin composition containing these is used as it is, there is a problem of tack which is a drawback of the butadiene homopolymer system in an uncured state, so that a prepreg having a uniform appearance and good handleability is obtained. It is not possible. In addition, when this prepreg and metal foil are used to form a metal-clad laminate, since the resin is cured in a non-uniform state (macro phase separation state), in addition to the appearance problems, The heat resistance is lowered, and further, the disadvantages of the butadiene homopolymer system are emphasized, and various problems such as low fracture strength and large thermal expansion coefficient are caused.

  In addition, the peel strength between the metal foil is low enough that the low profile foil can be applied, but this is lower than the low interfacial adhesion between the butadiene homopolymer and the metal foil. It is considered that the lower the cohesive fracture strength of the resin in the vicinity of the metal foil at the time of peeling, the greater the influence is.

In order to solve the above problems, the present invention has a good dielectric characteristic particularly in a high frequency band, and a change in the dielectric characteristic at the time of moisture absorption is small, and transmission loss can be significantly reduced. , A method for producing a resin varnish capable of producing a printed wiring board excellent in moisture absorption heat resistance and thermal expansion characteristics and satisfying the peeling strength between metal foils, and a resin varnish, a prepreg produced by this method, and An object is to provide a metal-clad laminate.
Embodiments of the present invention are not limited to inventions that solve all the problems of the prior art.

Japanese Patent Application No. 2007-115467, which is the priority application of the present invention, is incorporated herein in its entirety and for all purposes.
As a result of intensive research on the resin composition containing polyphenylene ether to solve the above-mentioned problems, the present inventors have made the prepolymer of polyphenylene ether, a butadiene polymer not chemically modified, and a cross-linking agent compatible. A method for producing a thermosetting resin varnish containing a polyphenylene ether-modified butadiene polymer which is an uncured semi-IPN type composite having an organic solvent and an organic solvent, and this novel unique compatibility method A resin varnish was found.
In addition, when the present inventors use this resin varnish for printed wiring board applications, the dielectric properties in the high frequency band and its moisture absorption dependency are good, so the transmission loss is excellent and the heat resistance is excellent. Clarity (particularly moisture absorption heat resistance) and low thermal expansion characteristics can be expressed.
Furthermore, since the present inventors have a high peel strength between the metal foil and the printed wiring board laminate using the resin varnish, the metal foil having a low surface roughness, such as a low profile foil. Has been found to be applicable, and the present invention has been completed.

  That is, this invention is a manufacturing method of the thermosetting resin varnish containing the thermosetting resin composition which is an uncured semi-IPN type composite, Comprising: (A) In presence of polyphenylene ether, (B) A butadiene polymer containing 1,2-butadiene units having a 1,2-vinyl group in the side chain in a molecule of 40% or more and not chemically modified, and (C) a crosslinking agent, (D) an organic solvent A process for obtaining an uncured semi-IPN type composite, wherein (D) the organic solvent contains one or more aromatic hydrocarbons. Regarding the method.

  The present invention also includes (A) 40% or more of 1,2-butadiene units in the molecule having 1,2-vinyl groups in the side chain in the presence of polyphenylene ether and chemically modified. A method for producing a thermosetting resin varnish containing a polyphenylene ether-modified butadiene prepolymer obtained by pre-reacting (C) a cross-linking agent with (C) a crosslinking agent in an organic solvent, D) The present invention relates to a method for producing a thermosetting resin varnish, wherein the organic solvent is at least one or more containing an aromatic hydrocarbon solvent.

  The present invention also relates to a method for producing a thermosetting resin varnish obtained by pre-reacting the polyphenylene ether-modified butadiene prepolymer at a nonvolatile content concentration of 35% by weight or less and then concentrating to a nonvolatile content concentration of 40% by weight or more. .

  The present invention relates to a method for producing a thermosetting resin varnish obtained by prereacting the polyphenylene ether-modified butadiene prepolymer so that the conversion rate of the component (C) is in the range of 5 to 100%.

  In the present invention, as the component (C), the general formula (1):

Wherein R ₁ is an m-valent aliphatic or aromatic organic group, and Xa and Xb are the same or different selected from a hydrogen atom, a halogen atom and an aliphatic organic group. And m represents an integer of 1 or more.) And relates to a method for producing a thermosetting resin varnish containing at least one or more maleimide compounds.

  In the present invention, the component (C) contains N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-methylphenyl) maleimide, N- (2,6-dimethylphenyl) maleimide, N- ( 2,6-diethylphenyl) maleimide, N- (2-methoxyphenyl) maleimide, N-benzylmaleimide, N-dodecylmaleimide, N-isopropylmaleimide and N-cyclohexylmaleimide It is related with the manufacturing method of the thermosetting resin varnish which is.

  As the component (C), the general formula (2):

(In the formula, R ₂ is —C (Xc) ₂ —, —CO—, —O—, —S—, —SO ₂ —, or a linking bond, and may be the same or different, Represents an alkyl group having 1 to 4 carbon atoms, —CF ₃ , —OCH ₃ , —NH ₂ , a halogen atom or a hydrogen atom, which may be the same or different, and the substitution positions of the benzene rings are mutually independent. And n and p each represent an integer of 0 to 10). The present invention relates to a method for producing a thermosetting resin varnish containing one or more maleimide compounds.

  The present invention relates to a method for producing a thermosetting resin varnish in which the component (C) is at least one maleimide compound containing 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane.

  The present invention relates to a method for producing a thermosetting resin varnish in which the component (C) is at least one maleimide compound containing bis (3-ethyl-5-methyl-4-maleimidophenyl) methane.

  The present invention relates to a method for producing a thermosetting resin varnish in which the component (C) is one or more maleimide compounds containing polyphenylmethanemaleimide or bis (4-maleimidophenyl) methane.

  The present invention relates to a method for producing a thermosetting resin varnish in which the component (C) is at least one vinyl compound containing divinylbiphenyl.

  In the present invention, the blending ratio of component (A) is in the range of 2 to 200 parts by weight with respect to 100 parts by weight of the total amount of component (B) and component (C), and the blending ratio of component (C) is , It relates to a method for producing a thermosetting resin varnish in the range of 2 to 200 parts by weight per 100 parts by weight of component (B).

  This invention relates to the manufacturing method of the thermosetting resin varnish whose (D) component is 1 or more types of organic solvents chosen from the group which consists of toluene, xylene, and mesitylene.

  In the present invention, the component (D) further comprises methanol, ethanol, butanol alcohol, ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, butyl carbitol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methoxyethyl acetate, Thermosetting resin containing at least one organic solvent selected from the group consisting of ethoxyethyl acetate, butoxyethyl acetate, ethyl acetate, N, N-dimethylformamide, N, N-dimethylacetamide, and N-methyl-2-pyrrolidone The present invention relates to a method for producing a varnish.

  The present invention further relates to a method for producing a thermosetting resin varnish, which further comprises (E) a step of incorporating a radical reaction initiator.

  The present invention further relates to a method for producing a thermosetting resin varnish including a step of blending (F) an inorganic filler.

  (F) The inorganic filler is blended in advance as a slurry dispersed in (G) a second organic solvent, and (G) the second organic solvent is acetone, methyl ethyl ketone, methyl isobutyl ketone, The present invention relates to a method for producing a thermosetting resin varnish containing one or more ketones selected from the group consisting of cyclohexanone.

  This invention relates to the manufacturing method of the thermosetting resin varnish whose content rate of said (G) 2nd organic solvent is 5 weight% or more in all the solvents.

  In the present invention, the inorganic filler (F) is composed of alumina, titanium oxide, mica, silica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide. An inorganic filler selected from clay, talc, aluminum borate, aluminum borate, silicon carbide, or at least of these, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, calcined clay, etc. The present invention relates to a method for producing a thermosetting resin varnish, which is a mixture of two or more kinds including one kind.

  The present invention also provides the thermosetting resin varnish, wherein the inorganic filler (F) is surface-treated with at least one selected from a silane coupling agent and a titanate coupling agent. It relates to a manufacturing method.

  The present invention provides a thermosetting resin in which the blending ratio of the component (F) is in the range of 1 to 1000 parts by weight with respect to 100 parts by weight of the total amount of the components (A), (B), and (C). The present invention relates to a method for producing a varnish.

  The present invention further relates to a method for producing a thermosetting resin varnish, which further comprises (H) a step of blending a crosslinkable monomer or crosslinkable polymer containing one or more ethylenically unsaturated double bond groups in the molecule.

  In the present invention, the component (H) is at least one or more ethylenically unsaturated double bond group-containing crosslinkable monomers or crosslinkable polymers selected from the group consisting of butadiene polymers and maleimide compounds that are not chemically modified. The present invention relates to a method for producing a thermosetting resin varnish.

  The present invention further relates to a method for producing a thermosetting resin varnish, which further comprises (I) a step of blending at least one selected from a brominated flame retardant and a phosphorus flame retardant.

  The present invention further relates to a method for producing a thermosetting resin varnish, which further comprises (J) a step of blending a saturated thermoplastic elastomer.

  In the present invention, the component (J) is a heat which contains at least one kind of saturated thermoplastic elastomer obtained by hydrogenating an unsaturated double bond group of the butadiene portion of the styrene-butadiene copolymer. The present invention relates to a method for producing a curable resin varnish.

  The present invention relates to (A) polyphenylene ether, and (B) a butadiene polymer containing 1,2-butadiene units having a 1,2-vinyl group in the side chain of 40% or more in the molecule and not chemically modified. (C) A thermosetting resin varnish containing a thermosetting resin composition which is an uncured semi-IPN composite that is compatible with an organic solvent containing (D) one or more aromatic hydrocarbons. About.

  The present invention relates to a thermosetting resin varnish having a viscosity of 30 to 300 mPa · s at 25 ° C.

  The present invention relates to a resin varnish for a printed wiring board obtained using the above-described method for producing a thermosetting resin varnish.

  The present invention relates to a prepreg obtained by impregnating a base material with the resin varnish for a printed wiring board and drying at 60 to 200 ° C.

  The present invention relates to a metal-clad laminate obtained by stacking one or more prepregs for a printed wiring board, placing a metal foil on one or both sides, and heating and pressing.

  According to the manufacturing method of the thermosetting resin varnish of the present invention, when it is a printed wiring board, it has excellent high frequency characteristics and its excellent moisture absorption dependency, good heat resistance (particularly moisture absorption heat resistance) and low thermal expansion characteristics. Can be achieved. Further, it is possible to provide a resin varnish, a prepreg, and a metal-clad laminate that can sufficiently increase the peel strength between the metal foil. Therefore, the thermosetting resin varnish obtained by the method of the present invention is a mobile communication device that handles high frequency signals of 1 GHz or higher, its base station device, network related electronic devices such as servers and routers, and various electric / electronic devices such as large computers. It is useful as a member / part of a printed wiring board used in electronic equipment.

Hereinafter, preferred embodiments of the present invention will be described in detail.
The reason why the thermosetting resin varnish containing the polyphenylene ether-modified butadiene polymer, which is a novel semi-IPN type composite obtained by the production method of the present invention, can achieve the above-mentioned object has been clarified in detail at present. Not. The present inventors speculate as follows, but do not exclude the involvement of other elements.

  In the present invention, polyphenylene ether which is a thermoplastic resin having good dielectric properties, and a butadiene polymer which is not chemically modified and known as one of thermosetting resins which exhibit the best dielectric properties after curing, It is intended that the dielectric properties are remarkably improved by containing as an essential component. As described above, the polyphenylene ether and the butadiene polymer that has not been chemically modified are inherently incompatible with each other, and it has been difficult to obtain a uniform resin. However, a thermosetting resin varnish containing a resin composition having a novel composition uniformly compatibilized by a method using a preliminary reaction in at least one organic solvent containing the aromatic hydrocarbon solvent of the present invention is obtained. Obtainable.

  In the present invention, the preliminary reaction means that radicals are generated while stirring the solution at a reaction temperature, for example, 60 to 170 ° C., and without volatilizing the organic solvent of component (D), and in the presence of component (A). Thus, reacting the component (B) and the component (C), the predetermined amount in the component (B) is crosslinked, and the predetermined amount of the component (C) is converted. That is, this state is an uncured state that has not yet been gelled. The mixture of component (A), component (B) and component (C) before and after this preliminary reaction and the semi-IPN polymer are affected by changes in characteristic peaks such as viscosity, turbidity, liquid chromatography, and spectrophotometric spectra. It can be easily distinguished. For example, when an analytical instrument such as liquid chromatography or a spectrophotometric spectrum is used, the disappearance of the characteristic peak of component (C) or the decrease in the peak ratio is observed after the preliminary reaction.

  The curing reaction in the present invention is a B-stage (semi-curing) in the coating process (solvent volatilization process during prepreg production or film production), or hot press for producing a copper-clad laminate. Alternatively, radicals are generated at a temperature higher than the solvent volatilization temperature and cured, and the difference from the preliminary reaction in the present invention is clear. That is, in the present invention, the components (A) to (C) are essential, and the step of reacting the components (A), (B) and (C) in the solvent of the component (D) and stirring them together. Unless the present invention including is applied, an uncured resin compatibilized with the component (A), the component (B) and the component (C) cannot be obtained. Therefore, when a B-stage (semi-curing) is performed using an ordinary varnish in which each of the above components is mixed, the prepreg or film after the solvent has volatilized is macrophase-separated even in a semi-cured state. . In addition, since the cured product using the cured product is also phase-separated, the copper foil peeling strength, thermal expansion characteristics, heat resistance, moisture absorption characteristics and the like are higher than those of the compatible cured product obtained by the present invention. Remarkably inferior.

  In the present invention, in the presence of polyphenylene ether as component (A), the component (B) contains 1,2-butadiene units having a 1,2-vinyl group in the side chain of 40% or more in the molecule, In addition, the butadiene polymer not chemically modified and the crosslinking agent of the component (C) are appropriately converted into the component (C) in at least one organic solvent containing the aromatic hydrocarbon solvent of the component (D). By pre-reacting at a rate (reaction rate), one linear polymer component (here, component (A), solid line portion in FIG. 1) and the other crosslinkable component in an uncured state before being completely cured (Here, the components (B) and (C), the dotted line in FIG. 1) are formed into a polyphenylene ether-modified butadiene prepolymer in which a so-called “semi-IPN” is formed, thereby forming a uniform resin composition (uncured) Semi-IP The thermosetting resin composition of the type complexes; see FIG. 1) it is possible to obtain a resin varnish containing. In this case, the homogenization (compatibility) does not mean that (A) component and other components (partially crosslinked product of (B) component and (C) component) form a chemical bond, It is considered that the molecular chains of the component A) and the other components are oligomerized while being partially and physically entangled with each other, so that a microphase separation structure is formed and apparently uniform (compatibilized). . As a reaction solvent used in the compatibilization (preliminary reaction), one or more kinds including the aromatic hydrocarbon solvent of component (D), which is a common good solvent for component (A) and component (B) By using this organic solvent, it is possible to obtain a polyphenylene ether-modified butadiene prepolymer that is further improved in uniformity (compatibility).

  The resin composition containing this polyphenylene ether-modified butadiene prepolymer (thermosetting resin composition of an uncured semi-IPN composite) can provide a resin film with an apparently uniform appearance. A polyphenylene ether-modified butadiene prepolymer as conventionally known, a simple mixture of polyphenylene ether and polybutadiene, or a mixture of a prepolymer obtained by pre-reacting a polybutadiene homopolymer and a bismaleimide compound in advance and a polyphenylene ether Does not form a semi-IPN, and since the constituent components are not compatible, it is in a state of phase separation. Therefore, unlike the composition of the present invention, a conventional polyphenylene ether-modified butadiene prepolymer, a simple mixture of polyphenylene ether and polybutadiene, or a prepolymer obtained by pre-reacting a polybutadiene homopolymer and a bismaleimide compound in advance. And a mixture of polyphenylene ether cause apparently non-uniform macrophase separation.

  A prepreg produced using a resin varnish containing a polyphenylene ether-modified butadiene prepolymer obtained by the production method of the present invention (solution containing a thermosetting resin composition of an uncured semi-IPN type composite) The tack problem is eliminated because the butadiene prepolymer which is uniform and cross-linked to some extent is compatible with the polyphenylene ether which is not tacky at the molecular level. Furthermore, the metal-clad laminate produced using this prepreg has no problem in appearance like the prepreg, and also cures while molecular chains are partially and physically entangled with each other. Compared with the case where the product is cured, the cross-linking density becomes pseudo and the elastic modulus is improved, so that the thermal expansion coefficient is lowered. Furthermore, by improving the elastic modulus and forming a uniform microphase separation structure, the fracture strength and heat resistance (especially during moisture absorption) of the resin can be significantly increased. Furthermore, by improving the breaking strength of the resin, a high metal foil peeling strength up to a level where a low profile foil can be applied can be exhibited. Furthermore, as a component (C), by selecting a specific cross-linking agent that enhances the resin strength and toughness when cured, or restricts the molecular motion, the metal foil peeling strength is increased. It has been found that the level of thermal expansion and thermal expansion properties can be improved.

  The process for producing a resin varnish containing the novel semi-IPN composite thermosetting resin composition of the present invention comprises (A) polyphenylene ether in the presence of (B) 1,2-vinyl group in the side chain. A polyphenylene obtained by pre-reacting a butadiene polymer containing 1,2-butadiene units having 40% or more in a molecule and not chemically modified with (C) a crosslinking agent in an organic solvent. In the resin varnish containing an ether-modified butadiene prepolymer, the (D) organic solvent contains one or more aromatic hydrocarbon solvents. Hereinafter, each component of the resin varnish of the present invention, a polyphenylene ether-modified butadiene prepolymer, and a preferred method for producing a resin varnish containing the same will be described.

  In the present invention, the component (A) used for the production of the polyphenylene ether-modified butadiene prepolymer is, for example, poly (2,6-trimethylphenol) obtained by homopolymerization of 2,6-dimethylphenol or 2,3,6-trimethylphenol. Dimethyl-1,4-phenylene) ether, poly (2,3,6-trimethyl-1,4-phenylene) ether, a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, etc. Can be mentioned. In addition, so-called modified polyphenylene ether such as an alloyed polymer of these with polystyrene or styrene-butadiene copolymer can also be used. In this case, poly (2,6-dimethyl-1,4-phenylene) ether component, It is a polymer containing 50% or more of a (2,3,6-trimethyl-1,4-phenylene) ether component and a copolymer component of 2,6-dimethylphenol and 2,3,6-trimethylphenol. More preferred.

  The molecular weight of the component (A) is not particularly limited, but considering the balance between the dielectric properties and heat resistance when used as a printed wiring board and the fluidity of the resin when used as a prepreg, the number average molecular weight is It is preferable that it is the range of 7000-30000. In addition, the number average molecular weight here is measured by gel permeation chromatography and converted by a calibration curve prepared using standard polystyrene.

  In the present invention, the component (B) used for the production of the polyphenylene ether-modified butadiene prepolymer contains 40% or more of 1,2-butadiene units having 1,2-vinyl groups in the side chain in the molecule, and The butadiene polymer is not particularly limited as long as it is not modified. That is, the component (B) is chemically epoxidized, glycolated, phenolated, maleated, (meth) acrylated, urethanized, etc., either at the side chain 1,2-vinyl group or at one or both ends in the molecule. It is an unmodified butadiene polymer, not a modified polybutadiene. When unmodified polybutadiene is used, the dielectric properties, moisture resistance, and heat resistance after moisture absorption can be favorably maintained. If the 1,2-butadiene unit having a 1,2-vinyl group is contained in the molecule by 40% or more, the crosslinking point can be secured to some extent, the curability of the resin composition is good, and the dielectric properties (particularly the dielectric loss tangent). ), Heat resistance (particularly heat resistance after moisture absorption) and thermal expansion coefficient can satisfy the use as a printed wiring board.

  The content of 1,2-butadiene units having a side chain 1,2-vinyl group in the molecule of the component (B) is more preferably 50% or more and 65% or more in view of the curability of the resin composition. Further preferred. In addition, the number average molecular weight of the component (B) is in the range of 500 to 10,000 in consideration of the balance between the curability of the resin composition and the dielectric properties when the cured product is used and the fluidity of the resin when the prepreg is used. It is preferable that it is, It is more preferable that it is the range of 700-8000, It is still more preferable that it is the range of 1000-5000. The number average molecular weight is the same as the definition of the number average molecular weight in the component (A).

  Specific examples of the component (B) preferably used in the present invention include B-1000, B-2000, B-3000 (trade name, manufactured by Nippon Soda Co., Ltd.), B-1000, B-2000, B-3000 ( New Nippon Petrochemical Co., Ltd., trade name), Ricon 142, Ricon 150, Ricon 152, Ricon 153, Ricon 154 (SARTOMER, trade name) are commercially available.

  In the present invention, the component (C) used in the production of the polyphenylene ether-modified butadiene prepolymer is a compound having a functional group having reactivity with the component (B) in the molecule. For example, one or more components in the molecule Examples thereof include a crosslinkable monomer or a crosslinkable polymer containing an ethylenically unsaturated double bond group. Specific examples of the component (C) include vinyl compounds, maleimide compounds, diallyl phthalates, (meth) acryloyl compounds, and unsaturated polyesters. Among these, as the component (C) preferably used, when it contains one or more maleimide compounds or one or more vinyl compounds, it is excellent in co-crosslinking property with the component (B), so that it is curable when used as a resin composition. Good storage stability, formability when printed wiring board, dielectric properties, dielectric properties after moisture absorption, thermal expansion properties, metal foil peeling strength, Tg (glass transition temperature), moisture absorption It is desirable from the viewpoint that the total balance of heat resistance, flame retardancy, etc. is excellent.

  The maleimide compound suitably used as the component (C) of the present invention can be a compound containing one or more maleimide groups in the molecule represented by the following general formula (1). A monomaleimide compound or a polymaleimide compound can be suitably used, and is represented by the following general formula (1), (2), (3), (4) or (5).

(In the formula, R ₁ is a monovalent or polyvalent organic group which is _one of m-valent aliphatic, alicyclic, aromatic and heterocyclic, and Xa and Xb are a hydrogen atom or a halogen atom. And a monovalent atom or an organic group which may be the same or different and selected from aliphatic organic groups, and m represents an integer of 1 or more.)
R ₁ is preferably phenyl, alkylphenyl, dialkylphenyl, alkoxyphenyl, alkyl, cycloalkyl, and Xa and Xb are preferably hydrogen atoms.

(Where
R ₃ is a monovalent or divalent organic group that is any of aliphatic, alicyclic, aromatic, and heterocyclic,
s is 0 or 1,
When s is 0 and R ₃ is a monovalent group, R ₃ is preferably phenyl, alkylphenyl, dialkylphenyl, alkoxyphenyl, alkyl, cycloalkyl, and s is 1, _{When 3} is a divalent group, R ₃ is preferably alkylene, fluorene, cyclohexylene-alkylene-cyclohexylene)

(In the formula, R ₂ is —C (Xc) ₂ —, —CO—, —O—, —S—, —SO ₂ —, or a linking bond, and may be the same or different, Represents an alkyl group having 1 to 4 carbon atoms, —CF ₃ , —OCH ₃ , —NH ₂ , a halogen atom or a hydrogen atom, which may be the same or different, and the substitution positions of the benzene rings are mutually independent. Yes, n and p represent 0 or an integer of 1 to 10)

  Specific examples of the monomaleimide compound represented by the general formula (1) or (5) include N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-methylphenyl) maleimide, N- ( 2,6-dimethylphenyl) maleimide, N- (2,6-diethylphenyl) maleimide, N- (2-methoxyphenyl) maleimide, N-benzylmaleimide, N-dodecylmaleimide, N-isopropylmaleimide and N-cyclohexylmaleimide Etc.

  Specific examples of the polymaleimide compound represented by the general formula (2) or (5) include 1,2-dimaleimidoethane, 1,3-dimaleimidopropane, bis (4-maleimidophenyl) methane, bis (3 -Ethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, 2,7-dimaleimidofluorene, N, N '-(1,3-phenylene) bismaleimide, N, N ′-(1,3- (4-methylphenylene)) bismaleimide, bis (4-maleimidophenyl) sulfone, bis (4-maleimidophenyl) sulfide, bis (4-maleimidophenyl) ether, 1 , 3-bis (3-maleimidophenoxy) benzene, 1,3-bis (3- (3-maleimidophenoxy) phenoxy) benzene, bis ( -Maleimidophenyl) ketone, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, bis (4- (4-maleimidophenoxy) phenyl) sulfone, bis [4- (4-maleimidophenoxy) phenyl] Sulfoxide, 4,4'-bis (3-maleimidophenoxy) biphenyl, 1,3-bis (2- (3-maleimidophenyl) propyl) benzene, 1,3-bis (1- (4- (3-maleimidophenoxy) ) Phenyl) -1-propyl) benzene, bis (maleimidocyclohexyl) methane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, Aliphatic properties such as bis (maleimidophenyl) thiophene, general formula (3) below and general formula (4) below Cycloaliphatic, aromatic and heterocyclic poly maleimide (however, each including isomers). Aromatic polymaleimide is preferred from the viewpoint of moisture resistance, heat resistance, breaking strength, metal foil peeling strength and low thermal expansion characteristics when used as a printed wiring board, and among them, the thermal expansion coefficient is particularly further reduced. In terms of point, it is more preferable to use bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, and in terms of further increasing the breaking strength and the metal foil peeling strength, 2,2-bis (4- ( More preferably, 4-maleimidophenoxy) phenyl) propane is used. Moreover, in order to improve the moldability when a prepreg is formed, monomaleimide that causes a gradual curing reaction is preferable, and among them, N-phenylmaleimide is more preferable in terms of cost. And the said maleimide compound may be used individually or in combination of 2 or more types, or you may use these at least 1 type or more of maleimide compounds and the crosslinking agent shown above in combination of 1 or more types.

  In the component (C), when the maleimide compound and other crosslinking agent are used in combination, the proportion of the maleimide compound in the component (C) is preferably 50% by weight or more, more preferably 80% by weight or more. And particularly preferably 100% by weight, that is, all of the component (C) are maleimide compounds.

(In the formula, q is an average value of 0 to 10.)

(In the formula, r is an average value of 0 to 10.)

Examples of the vinyl compound suitably used as the component (C) include styrene, divinylbenzene, vinyltoluene, and divinylbiphenyl. Divinylbiphenyl is preferred.
As a specific example of the component (B) preferably used in the present invention, divinylbiphenyl (manufactured by Nippon Steel Chemical Co., Ltd.) is commercially available.

  In the method for producing a thermosetting resin varnish of the present invention, the polyphenylene ether-modified butadiene prepolymer is prepared by mixing (B) component with (C) in the presence of (A) component developed in the organic solvent of (D) component; ) The component is preliminarily reacted to such an extent that it does not gel. As a result, a semi-IPN polymer in which molecular chains are physically entangled with each other is formed between the component (A), the component (B), and the component (C), which are inherently incompatible systems, and are completely cured. An apparently uniform (compatibilized) prepolymer is obtained in an uncured state in stages.

  In the method for producing a thermosetting resin varnish of the present invention, the component (D) used for producing the polyphenylene ether-modified butadiene prepolymer is one or more organic solvents including an aromatic hydrocarbon solvent, and the aromatic hydrocarbon As specific examples of the system solvent, toluene, xylene, mesitylene and the like are preferably used, and these may be used alone or in combination of two or more. The use of an aromatic hydrocarbon solvent means that at the preliminary reaction start temperature (for example, 60 to 170 ° C.), the (A) component, the (B) component, and the (C) component (particularly the (A) component and the (B) component ) Is preferable because it has a high role as a common solvent that improves the solubility and compatibility of This is because polyphenylene is produced when each of the components (A) to (C) is completely dissolved in the solvent (D) component at the pre-reaction temperature and pre-reacted in a solution that is as transparent as possible. This is because the compatibility of the ether-modified butadiene prepolymer becomes better. On the other hand, when only a solvent other than the aromatic hydrocarbon solvent (for example, a ketone solvent) is used, the solubility and compatibility of the component (A), the component (B), and the component (C) are low. When pre-reacted, the compatibility of the polyphenylene ether-modified butadiene prepolymer produced becomes low, and the printed wiring board using the polyphenylene ether-modified butadiene prepolymer has the strength of the cured resin (copper foil peeling strength) and heat resistance. The level of (particularly heat resistance after moisture absorption) and the coefficient of thermal expansion are inferior compared to the case of using a highly compatible polyphenylene ether-modified butadiene prepolymer using an aromatic hydrocarbon solvent. In addition, other solvents may be used in combination as long as an aromatic hydrocarbon solvent is included, and the solvent used in combination is not particularly limited, but specific examples include alcohols such as methanol, ethanol, and butanol. , Ethyl cellosolve, butyl cellosolve, ethers such as ethylene glycol monomethyl ether, carbitol, butyl carbitol, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, ethyl acetate Such as esters, N, N-dimethylformamide, N, N-dimethylacetamide, nitrogen-containing solvents such as N-methyl-2-pyrrolidone and the like, and these may be used alone. Combine two or more types It may be used to. For example, aromatic hydrocarbons such as toluene, or a mixed solution of aromatic hydrocarbons and ketones is preferable, toluene is more preferably used alone, and a mixed solution of toluene and methyl isobutyl ketone is particularly preferable. The mixing ratio in the case of using a mixed solvent in which another solvent is used in combination with the aromatic hydrocarbon solvent is preferably 50% by weight or more, and 70% by weight or more based on the total amount of the aromatic hydrocarbon solvent. More preferably, it is more preferably 80% by weight or more.

  According to the method for producing a thermosetting resin varnish of the present invention, after the component (A) is developed in the solvent of the component (D), the component (B) and the component (C) are dissolved or dispersed in the solution. And can be produced by heating and stirring at 60 to 170 ° C. for 0.1 to 20 hours. In the production of the polyphenylene ether-modified butadiene prepolymer, the polyphenylene ether-modified butadiene is preferably pre-reacted in a state where the solubility of the component (A) and the component (B) in the component (D) is enhanced (solution is transparent). Since the compatibility of the prepolymer becomes better, it is preferable to adjust the solvent amount of the component (D) during the reaction so that the solid content (nonvolatile content) concentration in the reaction solution is 80% by weight or less. It is more preferably 50% by weight or less, and further preferably 35% by weight or less.

  In the method for producing the thermosetting resin varnish of the present invention, the blending ratio of the component (A), the component (B) and the component (C) used for the production of the polyphenylene ether-modified butadiene prepolymer is the blending ratio of the component (A). However, it is preferable to set it as the range of 2-200 weight part with respect to 100 weight part of total amounts of (B) component and (C) component, It is more preferable to set it as 10-100 weight part, 15-50 weight More preferably, it is a part. The blending ratio of component (A) is a balance between the coefficient of thermal expansion, the dielectric properties and the coating workability resulting from the viscosity of the resin varnish, and the moldability of the printed wiring board resulting from the melt viscosity when used as a prepreg. In consideration of the above, it is preferable to blend with respect to 100 parts by weight of the total amount of the component (B) and the component (C). Moreover, it is preferable that the mixture ratio of (C) component shall be the range of 2-200 weight part with respect to 100 weight part of (B) component, It is more preferable to set it as 5-100 weight part, 10-75 weight More preferably, it is a part. The blending ratio of the component (C) is preferably blended with respect to 100 parts by weight of the component (B) in consideration of the thermal expansion coefficient, Tg, and the balance between the metal foil peeling strength and the dielectric properties.

  In the production method of the thermosetting resin varnish of the present invention, when the polyphenylene ether-modified butadiene prepolymer is produced, the pre-reaction is performed so that the conversion rate (reaction rate) of the component (C) is in the range of 5 to 100%. . More preferable range depends on the blending ratio of the component (B) and the component (C), and the blending ratio of the component (C) is in the range of 2 to 10 parts by weight with respect to 100 parts by weight of the component (B). More preferably, the conversion rate (reaction rate) of the component (C) is in the range of 10 to 100%, and in the range of 10 to 50 parts by weight, the conversion rate (reaction rate) of the component (C) is A range of 15 to 70% is more preferable, and a range of 25 to 40% is particularly preferable. In the case of 50 to 100 parts by weight, the conversion rate (reaction rate) of component (C) is more preferably 7 to 90%, and in the case of 100 to 200 parts by weight, (C) The component conversion (reaction rate) is more preferably in the range of 5 to 80%. The conversion rate (reaction rate) of component (C) is that the resin composition and prepreg in a solvent-dried state have a uniform appearance and no tack, heat resistance when absorbing moisture on the printed wiring board, and metal foil drawing Considering the peel strength and the thermal expansion coefficient, it is preferably 5% or more.

  In addition, the polyphenylene ether modified butadiene prepolymer in the present invention includes a state in which the component (C) is 100% converted. Moreover, the conversion of (C) component is less than 100%, and the state which has not reacted and the unconverted (C) component remains is also included.

  The conversion rate (reaction rate) of the component (C) is based on the residual amount of the component (C) in the polyphenylene ether-modified butadiene prepolymer measured by gel permeation chromatography and the calibration curve of the component (C) prepared in advance. It is converted.

  In the present invention, the purpose of initiating or accelerating the preliminary reaction between the component (B) and the component (C) in the production of the polyphenylene ether-modified butadiene prepolymer, and the production of a metal-clad laminate or a multilayer printed wiring board For the purpose of initiating or accelerating the curing reaction of the resin composition (prepreg), it is preferable to contain (E) a radical reaction initiator.

  Specific examples of the component (E) include dicumyl peroxide, t-butylcumyl peroxide, benzoyl peroxide, cumene hydroperoxide, 1,1-bis (t-hexylperoxy) -3,3,5- Trimethylcyclohexane, 1,1-bis (t-butylperoxy) -2-methylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 2 , 2-bis (4,4-di (t-butylperoxy) cyclohexyl) propane, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-bis (t -Butylperoxy) hexyne-3, di-t-butyl peroxide, α, α'-bis (t-butylperoxy) diisopropyl Pyrbenzene, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, di-t-butylperoxyisophthalate, t-butylperoxybenzoate, t-butylperoxyacetate, 2,2- Bis (t-butylperoxy) butane, 2,2-bis (t-butylperoxy) octane, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, bis (t-butylperoxy) Peroxides such as isophthalate, isobutyryl peroxide, di (trimethylsilyl) peroxide, trimethylsilyltriphenylsilyl peroxide, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- (4- Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, benzoin methyl Ether, although methyl -o- benzoyl benzoate, and the like, without limitation.

  Component (E) is used for the purpose of initiating or accelerating a pre-reaction during the production of the polyphenylene ether-modified butadiene prepolymer, and for the purpose of initiating or accelerating the curing reaction after the production of the polyphenylene ether-modified butadiene prepolymer. Are preferably blended separately before and after the production of the polyphenylene ether-modified butadiene prepolymer. In that case, (E) component mix | blended for each objective may use the same kind, may use a different kind, each may be used individually, and two or more types may be mixed. It may be used.

  To use for the purpose of initiating or promoting the preliminary reaction, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) -2 Methylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 2,2-bis (4,4-di (t-butylperoxy) Peroxyketal organic peroxides such as cyclohexyl) propane are preferred, among which 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperper Oxy) cyclohexane and 1,1-bis (t-butylperoxy) cyclohexane are more preferred, and these may be used alone or in appropriate combination. It can be. In order to use for the purpose of initiating or accelerating the curing reaction after the production of the polyphenylene ether-modified butadiene prepolymer, dicumyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-bis (t -Butylperoxy) hexyne-3, di-t-butyl peroxide, α, α'-bis (t-butylperoxy) diisopropylbenzene, 2,5-dimethyl-2,5-bis (t-butylperoxy ) Dialkyl peroxide organic peroxides such as hexane are preferred, among which dicumyl peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexyne-3 and α, α'-bis (T-Butylperoxy) diisopropylbenzene is preferred, and these can be used alone or in appropriate mixture. .

  The blending ratio of the component (E) in the method for producing the thermosetting resin varnish of the present invention can be determined according to the blending ratio of the component (B) and the component (C). ) It is preferable that it is 0.05-10 weight part with respect to 100 weight part of total amounts of a component. Even when blended separately before and after the production of the polyphenylene ether-modified butadiene prepolymer, if the radical reaction initiator of the component (E) is blended within this numerical range, the polyphenylene ether-modified butadiene prepolymer is produced. In the preliminary reaction, an appropriate reaction rate is obtained, and good curability is obtained in the curing reaction when producing a metal-clad laminate or a multilayer printed wiring board.

  Moreover, in the manufacturing method of the thermosetting resin varnish of this invention, the slurry which disperse | distributed (F) inorganic filler or (F) component in the (G) 2nd organic solvent previously as needed, ( H) at least one or more selected from crosslinkable monomers or crosslinkable polymers containing one or more ethylenically unsaturated double bond groups in the molecule, (I) bromine-based flame retardants and phosphorus-based flame retardants, (J ) Saturated thermoplastic elastomer, various thermosetting resins, various thermoplastic resins, various additives when used as printed wiring boards, dielectric properties, heat resistance, adhesion (metal foil peeling strength, glass, etc.) It may be further blended in a blending amount within a range not deteriorating properties such as adhesiveness to the material), moisture resistance, Tg, and thermal expansion properties.

  Although it does not specifically limit as an inorganic filler of (F) component used in the manufacturing method of the thermosetting resin varnish of this invention, Specifically, an alumina, a titanium oxide, mica, a silica, beryllia, barium titanate , Such as potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, calcined clay, etc. , Talc, aluminum borate, aluminum borate, silicon carbide, etc. are used. These inorganic fillers may be used alone or in combination of two or more. The shape and particle size of the inorganic filler are not particularly limited, but those having a particle size of 0.01 to 30 μm, preferably 0.1 to 15 μm are suitably used.

  The blending ratio of component (F) in the method for producing a thermosetting resin varnish of the present invention is not particularly limited, but the total amount of component (A), component (B), component (C) and component (D) is 100 weights. 1 to 1000 parts by weight, preferably 5 to 500 parts by weight, more preferably 10 to 350 parts by weight, and a desired dielectric constant control, improvement in heat resistance and prepreg moldability The amount can be determined as appropriate.

  The component (F) is preferably used as a slurry previously dispersed in the (G) second organic solvent because the dispersibility of the component (F) is improved, and the component (G) is used as the second organic solvent. At least one or more containing a ketone solvent is used. As specific examples of the ketone solvent, the above description of ketones is applied. The mixing ratio in the case of preparing a mixed solvent slurry in which another solvent is used in combination with the ketone solvent is preferably 50% by weight or more, more preferably 70% by weight or more of the ketone solvent in the total solvent. 80% by weight or more is more preferable. In addition, solvents used in combination with solvents other than ketones include the above aromatic hydrocarbons, alcohols, ethers, esters, N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl. A solvent such as nitrogen-containing compounds such as 2-pyrrolidone is used, and the above description is applied to each specific example.

  The component (F) is preferably surface-treated with at least one selected from a silane coupling agent and a titanate coupling agent, and among them, a vinyl group-containing silane coupling agent is preferably used. A vinyl group-containing silane coupling agent other than a highly polar (meth) acryloxysilane coupling agent is more preferable. Specific examples include vinyltrimethoxysilane, vinyltriethoxysilane, and p-styryltrimethoxy. Silane, dimethylvinylmethoxysilane, dimethylvinylethoxysilane, methylvinyldimethoxysilane, methylvinyldimethoxysilane, vinyltri (β-methoxyethoxy) silane and the like are preferably used. These vinyl group-containing silane coupling agents may be used alone or in combination of two or more. When these vinyl group-containing silane coupling agents are used, in addition to improving dispersibility and improving adhesion to the resin, adverse effects on dielectric properties (especially in the high frequency band and moisture absorption) can be reduced.

  In addition, the amount of the coupling agent attached to the inorganic filler of the component (F) is not particularly limited, but considering the dispersibility of the inorganic filler in the resin material and the heat resistance when the cured product is used, 0.01 to 20% by weight of the inorganic filler is usually suitable, preferably 0.05 to 10% by weight, and more preferably 0.1 to 7% by weight.

  In the case of using a coupling agent, the treatment method for the component (F) is not particularly limited, but the component (F) may be surface-treated in advance by a wet or dry method, or in the polyphenylene ether-modified butadiene prepolymer. In addition, a coupling agent and an inorganic filler may be blended and mixed and surface-treated, and it is more preferable to use the former component (F) which has been previously treated. At that time, when the treatment is performed by a wet method, it can be used as a slurry in which a coupling agent and an inorganic filler are dispersed in a second organic solvent or the like (dispersion medium) of the component (G), and is subjected to a dry method. Can be used as a slurry by dispersing in a second organic solvent or the like after the treatment. In addition, processing conditions such as time and temperature during the surface treatment are not particularly limited.

  The (H) crosslinkable monomer or crosslinkable polymer containing one or more ethylenically unsaturated double bond groups in the molecule is blended after the production of the polyphenylene ether-modified butadiene prepolymer, and is particularly limited. Not. Specifically, compounds selected from the group consisting of butadiene polymers and maleimide compounds that are not chemically modified, and the compounds mentioned as the component (B) and the component (C) can be used. Moreover, as a butadiene polymer not chemically modified, a butadiene polymer having a number average molecular weight exceeding 10,000 is not chemically modified. These compounds may be used alone or in a combination of two or more. When the same compound as exemplified as the component (B) and the component (C) is blended as the component (H), it is blended after the production of the polyphenylene ether-modified butadiene prepolymer, so the component (H) in that case The blending amount is distinguished from the blending amounts of the component (B) and the component (C), and preferable blending amounts are separately described below. When the same compound as exemplified as the component (B) and the component (C) is blended as the component (H), use the same type as that used when producing the polyphenylene ether-modified butadiene prepolymer. Alternatively, different types may be used.

  As the component (H), when a butadiene polymer having a number average molecular weight exceeding 10,000 is not chemically modified, it can be used in a liquid type or a solid type, and a 1,2-vinyl bond ratio and a 1,4-bond can be used. The ratio is not particularly limited.

  Although the compounding ratio of the said (H) component in the manufacturing method of the thermosetting resin varnish of this invention is not specifically limited, With respect to the total amount of 100 weight part of (A) component, (B) component, and (C) component. 2 to 100 parts by weight, preferably 2 to 80 parts by weight, more preferably 2 to 60 parts by weight.

  Although it does not specifically limit as a flame retardant of said (I) component, Flame retardants, such as a bromine type, a phosphorus type, and a metal hydroxide, are used suitably. More specifically, brominated flame retardants include brominated epoxy resins such as brominated bisphenol A type epoxy resin and brominated phenol novolac type epoxy resin, hexabromobenzene, pentabromotoluene, ethylenebis (pentabromophenyl). , Ethylenebistetrabromophthalimide, 1,2-dibromo-4- (1,2-dibromoethyl) cyclohexane, tetrabromocyclooctane, hexabromocyclododecane, bis (tribromophenoxy) ethane, brominated polyphenylene ether, brominated Brominated flame retardants such as polystyrene and 2,4,6-tris (tribromophenoxy) -1,3,5-triazine, tribromophenyl maleimide, tribromophenyl acrylate, tribromophenyl methacrylate, tetrabromide Bisphenol A dimethacrylate, brominated reactive flame retardant unsaturated double bond-containing, such as pentabromobenzyl acrylate and brominated styrene.

  Phosphorus flame retardants include aromatic phosphoric acids such as triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, cresyl di-2,6-xylenyl phosphate and resorcinol bis (diphenyl phosphate) Esters, phosphonic esters such as divinyl phenylphosphonate, diallyl phenylphosphonate and bis (1-butenyl) phenylphosphonate, phenyl diphenylphosphinate, methyl diphenylphosphinate, 9,10-dihydro-9-oxa-10-phos Phosphinic acid esters such as faphenanthrene-10-oxide derivatives, phosphazene compounds such as bis (2-allylphenoxy) phosphazene, dicresyl phosphazene, melamine phosphate, melamine pyrophosphate, Phosphorus flame retardants such as melamine phosphate, melam polyphosphate, ammonium polyphosphate, phosphorus-containing vinylbenzyl compounds and red phosphorus can be exemplified, and examples of metal hydroxide flame retardants include magnesium hydroxide and aluminum hydroxide. . Moreover, the above-mentioned flame retardant may be used individually by 1 type, and may be used in combination of 2 or more types.

  The blending ratio of the component (I) in the production method of the thermosetting resin varnish of the present invention is not particularly limited, but with respect to 100 parts by weight of the total amount of the component (A), the component (B) and the component (C), The amount is preferably 5 to 200 parts by weight, more preferably 5 to 150 parts by weight, and still more preferably 5 to 100 parts by weight. If the blending ratio of the flame retardant is less than 5 parts by weight, the flame resistance tends to be insufficient, and if it exceeds 200 parts by weight, the heat resistance and the metal foil peeling strength tend to decrease when a printed wiring board is formed. .

  The saturated thermoplastic elastomer of the component (J) is not particularly limited, but a styrene saturated thermoplastic elastomer having good compatibility with the component (A) is desirable. Specific examples of the component (J) preferably used in the present invention include a styrene-ethylene-butylene copolymer, and a method of hydrogenating an unsaturated double bond portion of a butadiene block of the styrene-butadiene copolymer. Etc. can be obtained. Further, when using a styrene-based saturated thermoplastic elastomer, the content ratio of the styrene block is 20 to 20 from the balance between the compatibility with the polyphenylene ether-modified butadiene prepolymer and the thermal expansion characteristics when the resin composition is cured. 70% is preferable. Furthermore, as the component (J), a chemically modified saturated thermoplastic elastomer having a functional group such as an epoxy group, a hydroxyl group, a carboxy group, an amino group, or an acid anhydride in the molecule can be used. In addition, the component (J) may be used alone or in combination of two or more. When a styrene saturated thermoplastic elastomer is used, two or more types having different styrene contents may be used in combination.

  The saturated thermoplastic elastomer of component (J) may be blended after the production of the polyphenylene ether-modified butadiene prepolymer, or (A) component and (J) component developed in the solvent of component (D). May be used as a polyphenylene ether-modified butadiene prepolymer combined with a saturated thermoplastic elastomer produced by pre-reacting the component (B) and the component (C) in the presence of When producing a saturated thermoplastic elastomer combined polyphenylene ether-modified butadiene prepolymer, the preferred specific examples and blending amounts in each component and the production method such as the conversion rate (reaction rate) of the component (C) are described above. The description in the production of modified butadiene prepolymers applies.

  The blending ratio of the component (J) in the method for producing the thermosetting resin varnish of the present invention is not particularly limited, but with respect to 100 parts by weight of the total amount of the component (A), the component (B) and the component (C), The amount is preferably 1 to 100 parts by weight, more preferably 2 to 50 parts by weight, and still more preferably 5 to 30 parts by weight. When the blending ratio of the component (J) is less than 1 part by weight, the effect of improving the dielectric characteristics tends to be insufficient, and when it exceeds 100 parts by weight, the thermal expansion characteristics of the cured product tend to deteriorate.

  Moreover, in the method for producing the thermosetting resin varnish of the present invention, various thermosetting resins to be blended as necessary are not particularly limited, but specific examples include epoxy resins, cyanate ester resins, phenol resins, A urethane resin, a melamine resin, a benzoxazine resin, a benzocyclobutene resin, a dicyclopentadiene resin, and the like are listed, and these curing agents and curing accelerators may also be used. Further, various thermoplastic resins to be blended as necessary are not particularly limited, but specific examples include polyolefins such as polyethylene, polypropylene, polybutene, ethylene / propylene copolymer, and poly (4-methyl-pentene). And derivatives thereof, polyesters and derivatives thereof, polycarbonate, polyacetal, polysulfone, (meth) acrylic acid ester copolymers, polystyrene, acrylonitrile styrene copolymers, acrylonitrile styrene butadiene copolymers, polyvinyl acetal, polyvinyl Butyrals, polyvinyl alcohols, polybutadiene complete hydrogenates, polyethersulfone, polyetherketone, polyetherimide, polyphenylene sulfite, polyamideimide, polyamide, heat Plastic polyimide, and a liquid crystal polymer such as aromatic polyester. Various additives are not particularly limited, but specific examples include silane coupling agents, titanate coupling agents, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, lubricants, and the like. Can be mentioned. These various thermosetting resins, various thermoplastic resins and various additives may be used alone or in combination of two or more.

  In the method for producing a thermosetting resin varnish of the present invention, a polyphenylene ether-modified butadiene prepolymer obtained by using the above-described components (A), (B), (C) and (D), (E) Radical reaction initiator, (F) inorganic filler or (G) component dispersed in a second organic solvent, (H) one or more ethylenic unsaturations in the molecule A crosslinkable monomer or crosslinkable polymer containing a double bond group, (I) a flame retardant, (J) a saturated thermoplastic elastomer, various thermosetting resins, various thermoplastic resins, and various additives by known methods. By blending, stirring and mixing, a resin varnish can be obtained.

  In addition, when the above-mentioned various components and compounding agents are mixed after producing the polyphenylene ether-modified butadiene prepolymer, the solvent of the component (D) is once completely removed by concentrating the polyphenylene ether-modified butadiene prepolymer solution. A polyphenylene ether-modified butadiene prepolymer as a solvent may be used, or a polyphenylene ether-modified butadiene prepolymer solution may be used as it is. In addition, even when used as a solution, it is easy to add an optimum solvent for the solubility and dispersibility of each component (E) to (J) to be blended and mixed in the polyphenylene ether-modified butadiene prepolymer solution. (Especially when component (F) is blended, (G) it is easy to use the second organic solvent together, or the range of the combined amount is easily increased), or during the production of prepreg (coating work) In order to make it easy to produce a resin varnish that has a solid content (non-volatile content) concentration and a varnish viscosity (for example, so that a good appearance and an appropriate resin adhesion amount are obtained), the solid content ( It is desirable to use it as a polyphenylene ether-modified butadiene prepolymer solution having a high concentration (nonvolatile content). Further, the concentration is preferably 40% by weight or more, preferably 50% by weight as the non-volatile content, but the resin varnish optimal for the above-described solubility, dispersibility and prepreg coating workability. It can adjust suitably according to manufacture. Furthermore, when the polyphenylene ether-modified butadiene prepolymer and other components are blended, stirred and mixed to form a varnish, an additional solvent can be blended, and the solvents described as the component (D) and the component (G) In addition, a resin varnish can also be produced using other solvents. The solvent used in addition to the component (D) and the component (G) is not particularly limited, and alcohols, ethers, esters, N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl A solvent such as nitrogen-containing compounds such as 2-pyrrolidone is used, and the above description is applied to each specific example. Moreover, as content of each solvent in a resin varnish, it is preferable that (D) component is 10 weight% or more in all the solvents, 20 weight% or more is more preferable, and 30 weight% or more is further more preferable. Moreover, when using the slurry of (F) component disperse | distributed in the (G) 2nd organic solvent, 5 weight% or more in all the solvents used for a resin varnish is (G) 2nd organic solvent. It is preferably 10% by weight or more, more preferably 20% by weight or more. Further, when a solvent other than the component (D) and the component (G) is used, the content thereof is preferably 30% by weight or less in the resin varnish, more preferably 20% by weight or less, and further preferably 10% by weight or less. preferable.

  Moreover, although it is preferable to adjust the usage-amount of a solvent so that the solid content (nonvolatile content) density | concentration in the resin varnish at the time of varnishing may be 5 to 80 weight%, as mentioned above, the coating operation of a prepreg It can be prepared so as to have a solid content (non-volatile content) concentration and varnish viscosity that are optimal for performance. For example, when an E-type viscometer is used, the viscosity of the varnish is preferably 30 to 300 mPa · s, more preferably 50 to 200 mPa · s at 25 ° C., and 60 to 100 mPa · s. Is particularly preferred.

  Using the resin varnish obtained by the above-described production method of the present invention, the prepreg or metal-clad laminate of the present invention can be produced by a known method. For example, the resin varnish obtained in the present invention is impregnated into a reinforcing fiber base material such as glass fiber or organic fiber, and then usually at a temperature of 60 to 200 ° C., preferably 80 to 170 ° C. in a drying furnace or the like. The prepreg is obtained by drying for -30 minutes, preferably 3-15 minutes. Next, a metal foil is disposed on one or both sides of one or a plurality of the prepregs, and a double-sided or single-sided metal-clad laminate is obtained by heating and / or pressing under predetermined conditions. The heating in this case can be carried out preferably in a temperature range of 100 ° C. to 250 ° C., and the pressurization can be carried out preferably in a pressure range of 0.5 to 10.0 MPa. Heating and pressing are preferably performed simultaneously using a vacuum press or the like. In this case, it is preferable to perform these treatments for 30 minutes to 10 hours. In addition, using the prepreg and metal-clad laminate manufactured as described above, drilling, metal plating, circuit formation by etching metal foil, and multilayer bonding are performed by known methods. Thus, a single-sided, double-sided or multilayer printed wiring board can be obtained.

  The present invention is not limited to the above-described embodiment, and can be arbitrarily changed and modified within a range not departing from the object of the invention.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

Preparation Example 1 of Resin Varnish
In a 1 liter separable flask equipped with a thermometer, a reflux condenser, a vacuum concentrator and a stirrer, 350 parts by weight of toluene as component (D) and polyphenylene ether (S202A, Asahi Kasei Chemicals) as component (A) 50 parts by weight of Mn: 16000) manufactured by the company were added, and the temperature in the flask was set to 90 ° C. and dissolved by stirring. Next, butadiene polymer (B-3000, manufactured by Nippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) 100 parts by weight as component (B) and component (C) 30 parts by weight of bis (4-maleimidophenyl) methane (BMI-1000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) and methyl isobutyl ketone (as a solvent) so that the solid content (nonvolatile content) concentration in the solution is 30% by weight. MIBK) was added and stirring was continued to confirm that these were dissolved or uniformly dispersed. Thereafter, the liquid temperature was raised to 110 ° C. While maintaining the temperature at 110 ° C., 0.5 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane (Perhexa TMH, manufactured by NOF Corporation) was used as a reaction initiator. Blended. The blended mixture is pre-reacted for about 1 hour with stirring, so that (A) polyphenylene ether, (B) non-chemically modified butadiene polymer, and (C) a cross-linking agent are compatible with each other. A polymer solution was obtained. When the conversion rate of bis (4-maleimidophenyl) methane in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography, the conversion rate was 33%. The conversion rate is a value obtained by subtracting the unconverted portion (measured value) of bis (4-maleimidophenyl) methane from 100.

  Subsequently, the liquid temperature in a flask was set to 80 degreeC. Thereafter, the solution was concentrated with stirring so that the solid concentration of the solution became 45% by weight. The solution was then cooled to room temperature. Next, 5 parts by weight of α, α'-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added as component (E). Next, methyl ethyl ketone (MEK) was blended to prepare the resin varnish of Preparation Example 1 (solid content concentration: about 40% by weight).

Preparation Example 2
In Preparation Example 1, polyphenylene methane maleimide (BMI-2000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) 30 parts by weight was used instead of bis (4-maleimidophenyl) methane in the same manner as Preparation Example 1 except that polyphenylene was used. An ether-modified butadiene prepolymer was obtained. The conversion ratio of BMI-2000 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 35%. Subsequently, a resin varnish (solid content concentration of about 40% by weight) of Preparation Example 2 was prepared using this solution in the same manner as Preparation Example 1.

Preparation Example 3
In Preparation Example 1, 35 parts by weight of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (BMI-5100, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was used instead of bis (4-maleimidophenyl) methane. Except that, a polyphenylene ether-modified butadiene prepolymer was obtained in the same manner as in Preparation Example 1. The conversion of BMI-5100 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 25%. Subsequently, a resin varnish (solid content concentration of about 40% by weight) of Preparation Example 3 was prepared in the same manner as Preparation Example 1 using this solution.

Preparation Example 4
In Preparation Example 1, 40 parts by weight of 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane (BMI-4000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was used instead of bis (4-maleimidophenyl) methane. A polyphenylene ether-modified butadiene prepolymer was obtained in the same manner as in Preparation Example 1 except that The conversion ratio of BMI-4000 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 30%. Subsequently, the resin varnish (solid content concentration of about 40% by weight) of Preparation Example 4 was prepared using this solution in the same manner as Preparation Example 1.

Preparation Example 5
(A) In the same manner as in Preparation Example 1, except that 15 parts by weight of N-phenylmaleimide (Imirex-P, manufactured by Nippon Shokubai Co., Ltd.) was used instead of bis (4-maleimidophenyl) methane in Preparation Example 1. Thus, a polyphenylene ether-modified butadiene prepolymer was obtained. The conversion of imilex-P in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 32%.
(B) Subsequently, this solution was concentrated in the same manner as in Preparation Example 1. Next, while maintaining the liquid temperature at 80 ° C., 25 parts by weight of 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane (BMI-4000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) as component (H) was added. Blended. Then it was cooled to room temperature with stirring. Subsequently, in the MIBK as the component (G), vinyl trimethoxysilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd.) is surface-treated with a treatment amount of 2% by weight, and the component (F) spherical silica (SO-25R). In addition, 128 parts by weight (solid content: 90 parts by weight) of slurry (solid content: 70% by weight) having an average particle size of 0.5 μm, manufactured by Admatex Co., Ltd. was blended. Next, 5 parts by weight of α, α'-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added as component (E). Subsequently, methyl ethyl ketone (MEK) was mix | blended and the resin varnish (solid content concentration of about 50 weight%) of the preparation example 5 was prepared.

Preparation Example 6
In Preparation Example 5 (a), the same as Preparation Example 5 except that 15 parts by weight of bis (4-maleimidophenyl) methane (BMI-1000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was used instead of N-phenylmaleimide. Thus, a polyphenylene ether-modified butadiene prepolymer was obtained. The conversion ratio of BMI-1000 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 32%.

  Subsequently, a resin varnish (solid content concentration of about 50% by weight) of Preparation Example 6 was prepared using this solution in the same manner as Preparation Example 5 (b).

Preparation Example 7
(A) In Preparation Example 5 (a), 25 parts by weight of 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane (BMI-4000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) instead of N-phenylmaleimide A polyphenylene ether-modified butadiene prepolymer was obtained in the same manner as in Preparation Example 5 except that was used. The conversion of BMI-4000 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 35%.
(B) Subsequently, this solution was concentrated in the same manner as in Preparation Example 1, and then bis (3-ethyl-5-methyl-4-maleimidophenyl as component (H) was maintained with the liquid temperature kept at 80 ° C. ) Hydrogenated product of styrene-butadiene copolymer as a saturated thermoplastic elastomer of 15 parts by weight of methane (BMI-5100, manufactured by Daiwa Kasei Kogyo Co., Ltd.) and component (J) (Tuftec H1051, styrene content ratio: 42% 30 parts by weight of Chemicals, Inc., styrene-ethylene-butylene-styrene block polymer (SEBS) was blended. After confirming dissolution, the mixture was cooled to room temperature while stirring, and 70 parts by weight of ethylenebis (pentabromophenyl) (SAYTEX8010, manufactured by Albemarle) was blended as a flame retardant for component (I). Next, after adding 5 parts by weight of α, α'-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) as component (E), methyl ethyl ketone (MEK) is blended, and a preparation example No. 7 resin varnish (solid content concentration of about 40% by weight) was prepared.

Preparation Example 8
In Preparation Example 7 (a), Ricon 142 (manufactured by SARTOMER, Mn: 3900, 1,2-vinyl structure: 55%) was used in place of B-3000 as the butadiene polymer not chemically modified as component (B). In addition, the same procedure as in Preparation Example 7 was conducted except that the amount of 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane (BMI-4000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was 40 parts by weight. Thus, a polyphenylene ether-modified butadiene prepolymer was obtained. The conversion ratio of BMI-4000 in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 30%.

  Subsequently, this solution was used to remove bis (3-ethyl-5-methyl-4-maleimidophenyl) methane and Tuftec H1051 in Preparation Example 7 (b), and instead of ethylene bis (pentabromophenyl), ethylene A resin varnish (solid content concentration of about 40% by weight) of Preparation Example 8 was prepared in the same manner as Preparation Example 7 except that 70 parts by weight of bistetrabromophthalimide (BT-93W, manufactured by Albemarle) was blended.

Preparation Example 9
In Preparation Example 1, a polyphenylene ether-modified butadiene prepolymer was prepared in the same manner as Preparation Example 1, except that 20 parts by weight of divinylbiphenyl (manufactured by Nippon Steel Chemical Co., Ltd.) was used instead of bis (4-maleimidophenyl) methane. Got. The conversion rate of divinylbiphenyl in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography and found to be 30%.

  Subsequently, the liquid temperature in a flask was set to 80 degreeC. Thereafter, the solution was concentrated with stirring so that the solid concentration of the solution became 45% by weight. The solution was then cooled to room temperature. Subsequently, strontium titanate (SL250, average) of component (F) obtained by subjecting vinyltrimethoxysilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd.) to a treatment amount of 2% by weight in MIBK as component (G) in advance. 1000 parts by weight (solid content: 700 parts by weight) of a slurry (solid content: 70% by weight, solvent: MIBK) of particle size: 0.85 μm, manufactured by Fuji Titanium Industry Co., Ltd. was blended. Next, 70 parts by weight of brominated polystyrene (PDBS64HW, manufactured by Great Lakes) as a flame retardant for component (I) and α, α'-bis (t-butylperoxy) diisopropylbenzene (perbutyl P, Japan) as component (E) 5 parts by weight were added. Next, methyl ethyl ketone (MEK) was blended to prepare a resin varnish of Preparation Example 9 (solid content concentration of about 60% by weight).

Preparation Example 10
In Preparation Example 1, except that the solid content (nonvolatile content) concentration adjusting solvent during production of the polyphenylene ether-modified butadiene prepolymer was changed from methyl isobutyl ketone (MIBK) to toluene, and the component (D) was changed to a toluene single solvent system. In the same manner as in Preparation Example 1, a polyphenylene ether-modified butadiene prepolymer was obtained. When the conversion rate of bis (4-maleimidophenyl) methane in this polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography, the conversion rate was 38%. Subsequently, a resin varnish (solid content concentration of about 40% by weight) of Preparation Example 10 was prepared using this solution in the same manner as Preparation Example 1.

Comparative Preparation Example 1
200 parts by weight of toluene and 50 parts by weight of polyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals Co., Ltd., Mn: 16000) were charged into a 1 liter separable flask equipped with a thermometer, a reflux condenser, and a stirring device, and the temperature in the flask Was set at 90 ° C. and dissolved by stirring. Next, 100 parts by weight of triallyl isocyanurate (TAIC, Nippon Kasei Co., Ltd.) was added, and after confirming that it was dissolved or uniformly dispersed, it was cooled to room temperature. Next, after cooling to room temperature with stirring, 5 parts by weight of α, α'-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added as a reaction initiator, and then methyl ethyl ketone (MEK). The resin varnish of Comparative Preparation Example 1 (solid content concentration of about 40% by weight) was prepared.

Comparative Preparation Example 2
In Comparative Preparation Example 1, except that 100 parts by weight of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (BMI-5100, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was used instead of triallyl isocyanurate. In the same manner as in Comparative Preparation Example 1, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 2 was prepared.

Comparative Preparation Example 3
In Comparative Preparation Example 1, instead of triallyl isocyanurate, 100 parts by weight of a butadiene polymer (B-3000, manufactured by Nippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) not chemically modified is used. A resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 3 was prepared in the same manner as in Comparative Preparation Example 1 except that it was not.

Comparative Preparation Example 4
In Comparative Preparation Example 3, the resin varnish of Comparative Preparation Example 4 (solid content concentration of about 40) was added in the same manner as Comparative Preparation Example 3 except that 50 parts by weight of triallyl isocyanurate (TAIC, manufactured by Nippon Kasei Co., Ltd.) was further added. % By weight) was prepared.

Comparative Preparation Example 5
In Comparative Preparation Example 4, the same procedure as in Comparative Preparation Example 4 was performed except that 30 parts by weight of bis (4-maleimidophenyl) methane (BMI-1000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) was added instead of triallyl isocyanurate. Thus, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 5 was prepared.

Comparative Preparation Example 6
350 parts by weight of toluene and 50 parts by weight of polyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals Co., Ltd., Mn: 16000) were charged into a 1 liter separable flask equipped with a thermometer, reflux condenser, vacuum concentrator and stirrer. The temperature in the flask was set to 90 ° C. and dissolved by stirring. Subsequently, glycol modified 1,2-polybutadiene having a hydroxyl group at the terminal (G-3000, manufactured by Nippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) 100 parts by weight, bis (4-maleimidophenyl) methane (BMI-1000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) 30 parts by weight and methyl isobutyl ketone (MIBK) was added so that the solid content (nonvolatile content) concentration in the solution was 30% by weight, and dissolved or uniformly dispersed. 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane (Perhexa TMH, manufactured by NOF Corporation) 0.5 weight as a reaction initiator while keeping the liquid temperature at 110 ° C. after confirmation Parts were blended. The blended mixture was pre-reacted with stirring for about 10 minutes. The conversion rate of BMI-1000 in this preliminary reaction product was measured by gel permeation chromatography and found to be 4%. Subsequently, the liquid temperature in a flask was set to 80 degreeC. Thereafter, the solution was concentrated so that the solid content (nonvolatile content) concentration of the solution became 45% by weight while stirring. Next, after cooling the solution to room temperature, 5 parts by weight of α, α′-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added as a reaction initiator. Then, methyl ethyl ketone (MEK) was mix | blended and the resin varnish (solid content concentration of about 40 weight%) of the comparative preparation example 6 was prepared.

Comparative Preparation Example 7
In Comparative Preparation Example 6, instead of glycol-modified 1,2-polybutadiene, a carboxylic acid-modified 1,2-polybutadiene having a carboxyl group at the terminal (C-1000, manufactured by Nippon Soda Co., Ltd., Mn: 1400, 1,2-vinyl) A preliminary reaction product was obtained in the same manner as in Comparative Preparation Example 6 except that 100 parts by weight of 89% of the structure was used. The conversion rate of BMI-1000 of this preliminary reaction product was measured by gel permeation chromatography and found to be 19%. Subsequently, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 7 was prepared using this solution in the same manner as Comparative Preparation Example 6.

Comparative Preparation Example 8
In Preparation Example 1, the same procedure as in Preparation Example 1 was conducted except that Ricon 130 (manufactured by SARTOMER, Mn: 2500, 1,2-vinyl structure: 28%) was used as the butadiene homopolymer instead of B-3000. A reaction product was obtained. When the conversion ratio of BMI-1000 in this preliminary reaction solution was measured by gel permeation chromatography, it was 24%. Subsequently, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 8 was prepared using this solution in the same manner as Preparation Example 1.

Comparative Preparation Example 9
In Comparative Preparation Example 6, a solution of the preliminary reaction product was obtained in the same manner as in Comparative Preparation Example 6 except that the preliminary reaction time was changed to 1 hour. The conversion rate of BMI-1000 in this preliminary reaction product was measured by gel permeation chromatography and found to be 35%. Subsequently, the resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 9 was obtained in the same manner as Comparative Preparation Example 6 using the solution of the preliminary reaction product.

Comparative Preparation Example 10
300 parts by weight of toluene and 50 parts by weight of polyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals Co., Ltd., Mn: 16000) are charged into a 1-liter separable flask equipped with a thermometer, reflux condenser, vacuum concentrator and stirrer. Then, the temperature in the flask was set to 90 ° C. and dissolved by stirring. Next, 100 parts by weight of a butadiene polymer that is not chemically modified (B-3000, manufactured by Nippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%), and the solid content (nonvolatile content) concentration in the solution is 30. Methyl isobutyl ketone (MIBK) as a solvent was added so as to be in% by weight, and stirring was continued to confirm that these were dissolved or uniformly dispersed. Thereafter, the liquid temperature was raised to 110 ° C., and 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane (Perhexa TMH, Nippon Oil & Fats was used as a reaction initiator while maintaining the temperature. 0.5 parts by weight) was mixed and pre-reacted with stirring for about 8 hours to obtain a solution of a pre-reacted product of polyphenylene ether and a butadiene polymer not chemically modified. A small amount of the solution was sampled and the solvent was evaporated to confirm the appearance. As a result, it was apparently compatible.

  Subsequently, after setting the liquid temperature in a flask to 80 degreeC, it concentrated so that solid content concentration of a solution might be 45 weight%, stirring. Next, after cooling the solution to room temperature, 5 parts by weight of α, α′-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added, and then methyl ethyl ketone (MEK) was added. Thus, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 10 was prepared.

Comparative Preparation Example 11
In a 1 liter separable flask equipped with a thermometer, a reflux condenser, a vacuum concentrator, and a stirrer, 350 parts by weight of toluene and a non-chemically modified butadiene polymer (B-3000, manufactured by Nippon Soda Co., Ltd., Mn: 3000, 1,2-vinyl structure: 90%) 100 parts by weight and 30 parts by weight of bis (4-maleimidophenyl) methane (BMI-1000, manufactured by Daiwa Kasei Kogyo Co., Ltd.) were added, and the solid content (nonvolatile) Min) Methyl isobutyl ketone (MIBK) as a solvent was added so that the concentration was 25% by weight, and the temperature in the flask was set to 110 ° C. and dissolved by stirring. Next, while maintaining the temperature, 0.5 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane (Perhexa TMH, manufactured by NOF Corporation) was used as a reaction initiator. The resulting mixture was pre-reacted with stirring for about 30 minutes to obtain a solution of a pre-reacted product of a butadiene polymer not chemically modified and a crosslinking agent (bismaleimide). Next, 50 parts by weight of polyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals Corporation, Mn: 16000) was added to this solution while stirring (the solution was slightly opaque). The conversion of bis (4-maleimidophenyl) methane in this solution was measured by gel permeation chromatography and found to be 33%.

  Subsequently, after setting the liquid temperature in a flask to 80 degreeC, it concentrated so that solid content concentration of a solution might be 45 weight%, stirring. Next, after cooling the solution to room temperature, 5 parts by weight of α, α′-bis (t-butylperoxy) diisopropylbenzene (Perbutyl P, manufactured by NOF Corporation) was added, and then methyl ethyl ketone (MEK) was added. Thus, a resin varnish (solid content concentration of about 40% by weight) of Comparative Preparation Example 11 was prepared.

  Table 1 summarizes the amount of each raw material used in the preparation of the resin varnishes of Preparation Examples 1 to 10 and Comparative Preparation Examples 1 to 11 and the viscosity of the prepared varnish at 25 ° C. (using an E-type viscometer). Show.

In the table, abbreviations have the following meanings.
BMI: bismaleimide compound imilex-P: N-phenylmaleimide TAIC: triallyl isocyanurate perhexa TMH: 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane-butyl P: α , Α′-bis (t-butylperoxy) diisopropylbenzene SAYTEX8010: ethylenebis (pentabromophenyl)
BT-93W: Ethylene bistetrabromophthalimide PBS 64HW: Brominated polystyrene H1051: Hydrogenated styrene-butadiene copolymer SO-25R: Spherical silica SL250: Strontium titanate KBM-1003: Vinyltrimethoxysilane

Preparation of Prepreg After impregnating the resin varnish obtained in Preparation Examples 1 to 10 and Comparative Preparation Examples 1 to 11 into a glass cloth (E glass, manufactured by Nitto Boseki Co., Ltd.), the temperature is 100 ° C. for 5 minutes. Heat drying was performed to prepare prepregs of Preparation Examples 1 to 10 and Comparative Preparation Examples 1 to 11 having a resin content of 50 wt% (inorganic filler blending system is 54 wt%). In addition, the case where the resin varnishes of Preparation Examples 1 to 10 correspond to Preparation Examples 1 to 10, respectively, and the case where the resin varnishes of Comparative Preparation Examples 1 to 11 are used correspond to Comparative Preparation Examples 1 to 11, respectively. .

Evaluation of Prepreg The appearance and tackiness of the prepregs of Production Examples 1 to 10 and Comparative Production Examples 1 to 11 described above were evaluated. The evaluation results are shown in Table 2. The appearance was evaluated by visual observation. The surface of the prepreg had some unevenness and streaks, and the surface lacking surface smoothness was evaluated as x. The tackiness of the prepreg was evaluated as x when the surface of the prepreg was somewhat sticky (tack) at 25 ° C, and ◯ when it was not.

Preparation of double-sided copper-clad laminate A component obtained by stacking the four prepregs of Preparation Examples 1 to 10 and Comparative Preparation Examples 1 to 11 described above is provided, and a low profile copper foil (F3-WS) having a thickness of 18 μm is provided on both upper and lower surfaces. , M-plane Rz: 3 μm, Furukawa Electric Co., Ltd.) is placed so that the M-plane is in contact, and heat-pressed under the press conditions of 200 ° C., 2.9 MPa, 70 minutes, double-sided copper-clad laminate (thickness) Thickness: 0.5 mm). For the prepregs of Production Example 1 and Comparative Production Example 1, a double-sided copper-clad laminate using a general copper foil (GTS, M-plane Rz: 8 μm, manufactured by Furukawa Electric Co., Ltd.) having a thickness of 18 μm is used as the copper foil. Each was produced under the same pressing conditions as when the profile copper foil was used. In addition, it shows in Table 2 about the combination of the preparation examples 1-10 in the copper clad laminated board of Examples 1-11 and Comparative Examples 1-12, and the prepreg of Comparative Preparation Examples 1-11, and use copper foil.

Characteristic evaluation of double-sided copper-clad laminate For the copper-clad laminates of Examples 1-11 and Comparative Examples 1-12 described above, transmission loss, dielectric properties, copper foil peel strength, solder heat resistance, thermal expansion coefficient, Tg Was evaluated. The evaluation results are shown in Table 2. The characteristic evaluation method of the copper clad laminate is as follows.

Measurement of transmission loss and dielectric properties The transmission loss of the copper clad laminate was measured by a triplate line resonator method using a vector network analyzer. The measurement conditions were: line width: 0.6 mm, insulating layer distance between upper and lower ground conductors: about 1.0 mm, line length: 200 mm, characteristic impedance: about 50Ω, frequency: 3 GHz, measurement temperature: 25 ° C. In addition, a dielectric characteristic (relative dielectric constant, dielectric loss tangent) of 3 GHz was calculated from the obtained transmission loss.

Measurement of peel strength of copper foil The peel strength of the copper clad laminate was measured in accordance with the copper clad laminate test standard JIS-C-6481.

Evaluation of solder heat resistance of copper clad laminate The copper foil on both sides and one side of the copper clad laminate cut into 50 mm square is etched, and its normal state and pressure cooker test (PCT) apparatus (conditions: 121 ° C., 2 .2 atm) is immersed in molten solder at 288 ° C. for 20 seconds, and the appearance of the obtained copper-clad laminate (3 sheets) is visually observed. Examined. The numbers in the table are the number of the copper-clad laminates that have been dipped in the solder, and the number of swells and mess rings that were not observed in the base material (in the insulating layer) and between the base material and the copper foil. Means.

Measurement of Thermal Expansion Coefficient of Copper Clad Laminate The thermal expansion coefficient (plate thickness direction, 30 to 130 ° C.) of the copper clad laminate obtained by etching the copper foils on both sides and cutting into 5 mm squares was measured by TMA.

  As is clear from Table 2, the prepregs of Examples 1 to 10 using the resin varnish obtained by the method for producing a thermosetting resin varnish of the present invention are uniform and have no unevenness and streaks in the appearance. Yes, with no tack (stickiness of the surface) and excellent prepreg characteristics. The laminated plate characteristics are excellent with a relative dielectric constant of 3.41 or less and a dielectric loss tangent of 0.0034 or less, except for Example 10 for the purpose of high dielectric constant, and solder heat resistance is measured in all three measurement samples. The occurrence of blistering and measling is not observed, which is good, and the thermal expansion coefficient is 60 ppm / ° C. or less and has good thermal expansion characteristics.

  And about the transmission loss and peeling strength, Example 2 which produced the copper clad laminated board using the resin varnish obtained by the manufacturing method of the thermosetting resin varnish of this invention and general foil is general, Compared with the comparative example 2 which produced the copper clad laminated board using foil, the transmission loss is remarkably excellent with 4.29, and the peeling strength is also excellent with 1.12 kN / m.

  The copper-clad laminate of each example using the resin varnish obtained by the method for producing the thermosetting resin varnish of the present invention and the low profile foil has a transmission loss except for Example 10 aiming at high dielectric constant. It is particularly excellent at 3.72 or less. Despite the use of the low profile foil, the peel strength is excellent at 0.77 kN / m or more. Therefore, it is clear that the resin varnish obtained by the method for producing the thermosetting resin varnish of the present invention is extremely effective in reducing transmission loss and attaining both peeling strength.

  Comparative Examples 1 and 2 are systems of polyphenylene ether and triallyl isocyanurate, and Comparative Example 1 corresponds to Patent Documents 4 and 5 in which a low profile foil is used instead of a general foil. Comparative Example 2 was equivalent to Patent Documents 4 and 5. This system has good prepreg characteristics. However, the thermal expansion coefficient is inferior compared with Examples 1-10. In addition, the relative dielectric constant, dielectric loss tangent, and transmission loss are inferior to those other than Example 10 for the purpose of high dielectric constant. Further, when a low profile foil is used, the peel strength is inferior, the solder heat resistance is inferior, and the overall performance is insufficient.

  Comparative Example 3 is a system of polyphenylene ether and bismaleimide compound, and corresponds to Patent Document 2 in which a low profile foil is used instead of a general foil. This system has good prepreg characteristics and thermal expansion coefficient. However, since the dielectric constant, dielectric loss tangent, and transmission loss are inferior, the peel strength is also inferior, and the solder heat resistance is also inferior, the overall performance is insufficient.

  Comparative Example 4 is a conventional system of polyphenylene ether and butadiene homopolymer that is not compatible, and corresponds to Patent Documents 6 and 7 in which a low profile foil is used instead of a general foil. This system has good relative dielectric constant, dielectric loss tangent, and transmission loss, but is inferior in prepreg characteristics, peel strength, solder heat resistance, and thermal expansion coefficient, and the overall performance is insufficient. Since this system is macroscopically phase-separated, it can be easily distinguished visually from a sample using a compatibilized composition used in the method for producing a thermosetting resin varnish of the present invention.

  Comparative Example 5 is a conventional system of polyphenylene ether, butadiene homopolymer, and triallyl isocyanurate that is not compatibilized. This system is insufficient in relative permittivity, dielectric loss tangent, and transmission loss, inferior in prepreg characteristics, peel strength, solder heat resistance, and thermal expansion coefficient, and generally inferior in performance. Since this system is macroscopically phase-separated, it can be easily distinguished visually from a sample using a compatibilized composition used in the method for producing a thermosetting resin varnish of the present invention.

  Comparative Example 6 is a system of polyphenylene ether, butadiene homopolymer, and maleimide compound, and corresponds to a resin composition that is not compatibilized with the same components as in the present invention, that is, not subjected to preliminary reaction. This system is slightly inferior in relative dielectric constant, dielectric loss tangent, and transmission loss, inferior in prepreg characteristics, peel strength, solder heat resistance, and thermal expansion coefficient, and generally inferior in performance. Since this system is macroscopically phase-separated, it can be easily distinguished visually from a sample using a compatibilized composition used in the method for producing a thermosetting resin varnish of the present invention.

  Comparative Example 7 is a system of a conventional polyphenylene ether, glycol-modified polybutadiene, and maleimide compound that are not compatible, and corresponds to Patent Document 8 in which a low profile foil is used instead of a general foil. This system is inferior in relative permittivity, dielectric loss tangent, and transmission loss, inferior in prepreg characteristics, peel strength, solder heat resistance, and thermal expansion coefficient, and generally inferior in performance. Since this system is macroscopically phase-separated, it can be easily discriminated visually from a sample using a compatibilized composition used in the method for producing a thermosetting resin varnish of the present invention.

  Comparative Example 8 is a system of polyphenylene ether, carboxylic acid-modified polybutadiene, and a maleimide compound, and corresponds to Patent Document 8 in which a low profile foil is used instead of a general foil. This system has good prepreg characteristics and peel strength, but is inferior in relative dielectric constant, dielectric loss tangent and transmission loss, inferior in solder heat resistance and thermal expansion coefficient, and has poor overall performance.

  Comparative Example 9 is a system produced in the same manner as in Example 1 using a butadiene polymer that is not chemically modified and has a 1,2-vinyl structure of less than 40%, which is not applied to the present invention. This system is inferior to that of Example 1 in terms of dielectric loss tangent and thermal expansion coefficient because the curability decreases as the crosslinking density decreases as compared with the present invention.

  Comparative Example 10 is a system of polyphenylene ether, glycol-modified polybutadiene, and maleimide compound that are compatibilized with the same resin composition as Comparative Example 7, and in Patent Document 8 in the case of using a low profile foil instead of a general foil Equivalent to. This system is different from Comparative Example 7 in that the prepreg characteristics are good and the thermal expansion characteristics, solder heat resistance, and peeling strength are slightly improved as compared with Comparative Example 7, but the thermosetting resin varnish of the present invention is manufactured. Compared with the composition obtained by using the butadiene homopolymer in the method, the dielectric constant, dielectric loss tangent and transmission loss are inferior, the peeling strength, the solder heat resistance and the thermal expansion coefficient are inferior, and the performance is generally inferior.

  Comparative Example 11 is a system of polyphenylene ether and butadiene homopolymer compatibilized with the same resin composition as Comparative Example 4, and the resin of Patent Documents 6 and 7 when a low profile foil is used instead of a general foil It corresponds to a system in which a compatibilizing step is added to the composition. This system has good relative permittivity, dielectric loss tangent, and transmission loss as in Comparative Example 4, and has good prepreg characteristics, unlike Comparative Example 4, but it has better peeling strength and solder than Comparative Example 4. Although the heat resistance and the thermal expansion coefficient are improved, the overall performance is inferior when compared with the case where the composition obtained by the method for producing the thermosetting resin varnish of the present invention is used.

  Comparative Example 12 has a resin composition similar to that of Comparative Example 6 and is a system in which a butadiene homopolymer and a bismaleimide compound are pre-reacted in advance to obtain a prepolymer, and then polyphenylene ether is added. The prepolymer with the maleimide compound and the polyphenylene ether are not compatible and basically correspond to a resin composition similar to that of Comparative Example 6. As in Comparative Example 6, this system has slightly insufficient relative permittivity, dielectric loss tangent, and transmission loss, inferior prepreg characteristics, peel strength, solder heat resistance, thermal expansion coefficient, and generally poor performance. . Since this system is macroscopically phase-separated, it can be easily distinguished visually from a sample using a compatibilized composition used in the method for producing a thermosetting resin varnish of the present invention.

  When the same resin varnish and prepreg are used, as can be seen from Examples 1 and 2 or Comparative Examples 1 and 2, the low profile foil is superior in transmission loss compared to the general foil, and conversely the metal foil. The low-profile foil is inferior in the peeling strength between the two (peeling strength). In particular, in Comparative Example 1 in which a low profile foil was used for a conventional resin composition, the transmission loss was slightly improved from 5.72 dB / m to 5.02 dB / m from the general foil, but the peel strength was high. The general foil 0.92 is inferior to the low profile foil 0.58 kN / m, which is insufficient for practical use. As described in the above-mentioned problem, the low profile foil is superior to the general foil in reducing the transmission loss, but the peel strength between the metal foil and the foil is opposite. This confirms that it was difficult to achieve both the reduction in transmission loss and the required peeling strength between the metal foils.

  The thermosetting resin varnish containing a novel semi-IPN composite polyphenylene ether-modified butadiene polymer obtained by the production method of the present invention has good dielectric properties and transmission in a high frequency band when used as a printed wiring board. It exhibits excellent electrical characteristics, good moisture absorption heat resistance and low thermal expansion characteristics that reduce loss, and the peel strength between the metal foils can be made sufficiently high. Therefore, resin varnishes, prepregs, and metal-clad laminates using the present invention are high frequency in order to approach from both aspects of reducing dielectric loss by improving dielectric properties and reducing conductor loss by applying metal foil with low surface roughness. Since transmission loss in the band can be reduced to a sufficient level, it can be suitably used for manufacturing printed wiring boards used in the high frequency field.

  The present invention is used in mobile communication devices that handle high-frequency signals in a high-frequency band, for example, 1 GHz or higher, network-related electronic devices such as base station devices, servers, and routers, and various electric and electronic devices such as large computers. It is useful as a printed wiring board member / part application.

It is the schematic diagram which showed the thermosetting resin composition of the uncured semi IPN type composite.

Claims (31)

A method for producing a thermosetting resin varnish containing a thermosetting resin composition that is an uncured semi-IPN type composite,
(A) in the presence of polyphenylene ether, (B) a butadiene polymer containing 1,2-butadiene units having a 1,2-vinyl group in the side chain in a molecule of 40% or more and not chemically modified; (C) a step of pre-reacting with a crosslinking agent in (D) an organic solvent to obtain an uncured semi-IPN type composite,
(D) The method for producing a thermosetting resin varnish, wherein the organic solvent contains one or more aromatic hydrocarbons.   (A) in the presence of polyphenylene ether, (B) a butadiene polymer containing 1,2-butadiene units having a 1,2-vinyl group in the side chain in a molecule of 40% or more and not chemically modified; (C) A method for producing a thermosetting resin varnish containing a polyphenylene ether-modified butadiene prepolymer obtained by pre-reacting with a crosslinking agent in (D) an organic solvent, wherein (D) the organic solvent is A method for producing a thermosetting resin varnish, comprising at least one kind containing an aromatic hydrocarbon solvent.   The method for producing a thermosetting resin varnish according to claim 2, wherein the polyphenylene ether-modified butadiene prepolymer is pre-reacted at a nonvolatile concentration of 35% by weight or less and then concentrated to a nonvolatile concentration of 40% by weight or more.   The method for producing a thermosetting resin varnish according to claim 2 or 3, wherein the polyphenylene ether-modified butadiene prepolymer is pre-reacted so that the conversion ratio of the component (C) is in the range of 5 to 100%. As the component (C), the general formula (1):

Wherein R ₁ is an m-valent aliphatic or aromatic organic group, and Xa and Xb are the same or different selected from a hydrogen atom, a halogen atom and an aliphatic organic group. A monovalent atom or an organic group, and m represents an integer of 1 or more.)
The manufacturing method of the thermosetting resin varnish of any one of Claims 1-4 containing the 1 or more types of maleimide compound represented by these.   Component (C) is N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-methylphenyl) maleimide, N- (2,6-dimethylphenyl) maleimide, N- (2,6- 2 or more maleimide compounds selected from the group consisting of (diethylphenyl) maleimide, N- (2-methoxyphenyl) maleimide, N-benzylmaleimide, N-dodecylmaleimide, N-isopropylmaleimide, and N-cyclohexylmaleimide. The manufacturing method of the thermosetting resin varnish of any one of 1-5. As the component (C), the general formula (2):

(In the formula, R ₂ is —C (Xc) ₂ —, —CO—, —O—, —S—, —SO ₂ —, or a linking bond, and may be the same or different, Represents an alkyl group having 1 to 4 carbon atoms, —CF ₃ , —OCH ₃ , —NH ₂ , a halogen atom or a hydrogen atom, which may be the same or different, and the substitution positions of the benzene rings are mutually independent. Yes, n and p represent 0 or an integer of 1 to 10)
The manufacturing method of the thermosetting resin varnish of any one of Claims 1-4 containing the 1 or more types of maleimide compound represented by these.   The component (C) is one or more maleimide compounds containing 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, according to any one of claims 1 to 4 or claim 7. A method for producing a thermosetting resin varnish.   The heat according to claim 1, wherein the component (C) is one or more maleimide compounds containing bis (3-ethyl-5-methyl-4-maleimidophenyl) methane. A method for producing a curable resin varnish.   The thermosetting resin according to claim 1, wherein the component (C) is one or more maleimide compounds containing polyphenylmethanemaleimide or bis (4-maleimidophenyl) methane. Manufacturing method of varnish.   The method for producing a thermosetting resin varnish according to claim 1, wherein the component (C) is one or more vinyl compounds containing divinylbiphenyl.   The blending ratio of the component (A) is in the range of 2 to 200 parts by weight with respect to 100 parts by weight of the total amount of the component (B) and the component (C), and the blending ratio of the component (C) is (B). It is the range of 2-200 weight part with respect to 100 weight part of components, The manufacturing method of the thermosetting resin varnish of any one of Claims 1-11.   (D) The manufacturing method of the thermosetting resin varnish of any one of Claims 1-12 whose component is 1 or more types of organic solvents chosen from the group which consists of toluene, xylene, and mesitylene.   (D) component is further methanol, ethanol, butanol alcohol, ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, butyl carbitol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methoxyethyl acetate, ethoxyethyl acetate, The thermosetting according to claim 13, comprising at least one organic solvent selected from the group consisting of butoxyethyl acetate, ethyl acetate, N, N-dimethylformamide, N, N-dimethylacetamide, and N-methyl-2-pyrrolidone. Manufacturing method of resin varnish.   Furthermore, the manufacturing method of the thermosetting resin varnish of any one of Claims 1-14 including the process of mix | blending (E) radical reaction initiator.   Furthermore, the manufacturing method of the thermosetting resin varnish of any one of Claims 1-15 including the process of mix | blending (F) inorganic filler. (F) An inorganic filler is blended in advance as a slurry dispersed in (G) a second organic solvent,
(G) The method for producing a thermosetting resin varnish according to claim 16, wherein the second organic solvent contains one or more ketones selected from the group consisting of acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone.   (G) The manufacturing method of the thermosetting resin varnish of Claim 17 whose content rate of a 2nd organic solvent is 5 weight% or more in all the solvents.   (F) The inorganic filler is alumina, titanium oxide, mica, silica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, 2 containing an inorganic filler selected from calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, calcined clay, etc., talc, aluminum borate, aluminum borate, silicon carbide, or at least one of these The manufacturing method of the thermosetting resin varnish of any one of Claims 16-18 which is a mixture of a kind or more.   The heat according to any one of claims 16 to 19, wherein (F) the inorganic filler is surface-treated with at least one selected from a silane coupling agent and a titanate coupling agent. A method for producing a curable resin varnish.   The blending ratio of the component (F) is in the range of 1 to 1000 parts by weight with respect to 100 parts by weight of the total amount of the component (A), the component (B), and the component (C). The manufacturing method of the thermosetting resin varnish of 1 item | term.   Furthermore, (H) The thermosetting of any one of Claims 1-21 including the process of mix | blending the crosslinkable monomer or crosslinkable polymer containing 1 or more ethylenically unsaturated double bond groups in a molecule | numerator. For producing a conductive resin varnish.   23. The component (H) is at least one ethylenically unsaturated double bond group-containing crosslinkable monomer or crosslinkable polymer selected from the group consisting of a butadiene polymer that is not chemically modified and a maleimide compound. Method for producing a thermosetting resin varnish.   Furthermore, (I) The manufacturing method of the thermosetting resin varnish of any one of Claims 1-23 including the process of mix | blending at least 1 or more types chosen from a brominated flame retardant and a phosphorus flame retardant.   Furthermore, the manufacturing method of the thermosetting resin varnish of any one of Claims 1-24 including the process of mix | blending (J) saturation type thermoplastic elastomer.   (J) The saturated thermoplastic elastomer is at least one kind including a saturated thermoplastic elastomer obtained by hydrogenating an unsaturated double bond group of a butadiene portion of a styrene-butadiene copolymer. The method for producing a thermosetting resin varnish according to claim 25.   (A) polyphenylene ether, and (B) a butadiene polymer containing 1,2-butadiene units having 1,2-vinyl groups in the side chain in a molecule of 40% or more and not chemically modified, and (C) crosslinking And (D) a thermosetting resin varnish containing a thermosetting resin composition which is an uncured semi-IPN type composite compatibilized in an organic solvent containing one or more aromatic hydrocarbons.   The thermosetting resin varnish according to claim 27, which has a viscosity of 30 to 300 mPa · s at 25 ° C.   The resin varnish for printed wiring boards obtained using the manufacturing method of the thermosetting resin varnish of any one of Claims 1-26.   A prepreg obtained by impregnating a substrate with the resin varnish for a printed wiring board according to claim 29 and drying at 60 to 200 ° C.   A metal-clad laminate obtained by disposing one or more prepregs according to claim 30, disposing a metal foil on one or both surfaces thereof, and heating and pressing.

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