TW202133306A - Peeling apparatus which can prevent a wafer from cracking and no glue will remain on the wafer - Google Patents

Peeling apparatus which can prevent a wafer from cracking and no glue will remain on the wafer Download PDF

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Publication number
TW202133306A
TW202133306A TW110105538A TW110105538A TW202133306A TW 202133306 A TW202133306 A TW 202133306A TW 110105538 A TW110105538 A TW 110105538A TW 110105538 A TW110105538 A TW 110105538A TW 202133306 A TW202133306 A TW 202133306A
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holding
peeling
tensile load
plate
protective
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TW110105538A
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Chinese (zh)
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伊藤史哲
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日商迪思科股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling

Abstract

The object of the present invention is to peel a protective member from a wafer without breaking the wafer or generating residual glue and without wasting time while peeling the protective member from the wafer. A peeling apparatus for peeling a protective member, which protects a side surface of the plate-shaped workpiece, from that side surface, and includes: a peeling means for holding an outer periphery of a protective member, wherein the protective member covers a side surface of the plate-shaped workpiece held by the holding surface of the holding means, peels the protective member from the outer periphery of the plate-shaped workpiece toward the center, and then peels from the center to the outer periphery on the opposite side of the outer periphery. The peeling means includes: a holding part that holds the outer periphery of the protective member; a moving means that moves the holding part from the outer periphery of the holding surface through the center and moves away from the center in a straight line; and a tensile load measuring part that measures the tensile load applied to the protective member between the holding part and the holding surface.

Description

剝離裝置Peeling device

本發明關於將保護構件從板狀工件剝離之剝離裝置。The present invention relates to a peeling device for peeling a protective member from a plate-shaped workpiece.

膠膜安裝機可在一側之面已黏貼保護膠膜之晶圓的另一側之面及環形框架上黏貼切割膠膜,成為能透過切割膠膜而利用環形框架支撐晶圓之狀態。並且,在黏貼切割膠膜後,將黏貼於晶圓之保護膠膜剝離(例如,參考專利文獻1)。 [習知技術文獻] [專利文獻]The adhesive film mounting machine can paste a dicing film on the wafer on one side and the ring frame on the other side of the wafer with the protective film attached to it, so that the ring frame can support the wafer through the dicing film. In addition, after the dicing film is attached, the protective film attached to the wafer is peeled off (for example, refer to Patent Document 1). [Literature Technical Literature] [Patent Literature]

[專利文獻1]日本特開2015-167205號公報[Patent Document 1] JP 2015-167205 A

[發明所欲解決的課題] 在剝離保護膠膜之際,例如,使剝離膠膜黏貼於保護膠膜的外周部分,握持剝離膠膜並往離開晶圓之方向拉伸,藉此剝離保護膠膜。然而,若剝離保護膠膜之際拉伸保護膠膜的速度快,則有保護膠膜的膠可能殘留於晶圓的一側之面或可能使晶圓損壞之問題。相反的,若拉伸保護膠膜的速度慢,則有浪費時間而作業效率降低之問題。[The problem to be solved by the invention] When peeling off the protective adhesive film, for example, the peeling adhesive film is stuck to the outer peripheral part of the protective adhesive film, and the peeling adhesive film is held and stretched in a direction away from the wafer, thereby peeling off the protective adhesive film. However, if the speed of stretching the protective film when peeling off the protective film is fast, there is a problem that the protective film may remain on one side of the wafer or damage the wafer. On the contrary, if the speed of stretching the protective film is slow, there is a problem that time is wasted and work efficiency is reduced.

並且,保護膠膜的黏著力會依據在已黏貼保護膠膜之晶圓的一側之面上所形成之元件的種類等而異。亦即,即使是相同的保護膠膜,亦有被形成於晶圓之元件強力黏著之情形、及輕微黏著之情形,需要依據黏著力的差異而改變剝離時的拉伸力(拉伸速度)。In addition, the adhesive force of the protective adhesive film varies depending on the types of components formed on one side of the wafer to which the protective adhesive film has been attached. That is, even the same protective film, there are cases where the components formed on the wafer are strongly adhered or slightly adhered. It is necessary to change the tensile force (stretching speed) during peeling according to the difference in adhesion. .

再者,因拉力會依據圓形的保護膠膜在剝離開始初期的小剝離區域與保護膠膜已被剝離直到晶圓的中央附近時的大剝離區域而異,故晶圓所受之力也會依據保護膠膜被剝離之位置而異。然而,以往係逐漸加快剝離每個晶圓之剝離速度並重複剝離實驗,而決定預定的剝離速度並以該剝離速度逐步進行剝離,或設定具有絕不會使晶圓損壞之裕度的安全速度而逐步進行剝離,因此會浪費時間。Furthermore, because the pulling force varies according to the small peeling area of the circular protective film at the beginning of peeling and the large peeling area when the protective film has been peeled to near the center of the wafer, the force on the wafer is also different. It depends on where the protective film is peeled off. However, in the past, the peeling speed of each wafer was gradually increased and the peeling experiment was repeated, and the predetermined peeling speed was determined and the peeling was performed gradually at the peeling speed, or a safe speed with a margin that would never damage the wafer was set The peeling is carried out gradually, so time is wasted.

因此,本發明之目的係提供一種剝離裝置,其在將保護構件從晶圓剝離之際,使晶圓不會破裂或在晶圓上不會發生殘膠等,且能不浪費時間地將保護構件從晶圓剝離。Therefore, the object of the present invention is to provide a peeling device, which prevents the wafer from cracking or glue residue on the wafer when the protective member is peeled from the wafer, and the protection can be protected without wasting time. The component is peeled from the wafer.

[解決課題的技術手段] 根據本發明,提供一種剝離裝置,其將保護板狀工件的一側之面之保護構件從該一側之面剝離,且具備:保持手段,其藉由保持面保持該板狀工件的另一側之面;以及剝離手段,其握持保護構件的外周部分,該保護構件覆蓋被保持於該保持面之該板狀工件的該一側之面,將該保護構件從該板狀工件的外周朝向中央剝離,再從該中央往該外周的相反側的外周剝離,並且,該剝離手段包含:握持部,其握持該保護構件的外周部分;移動手段,其使該握持部與該保持手段在與該保持面平行之方向相對地移動,且使該握持部從該保持面的外周前往中心,使已通過該保持面的該中心之該握持部在一直線上往遠離該中心之方向移動;以及拉伸負載測量部,其測量施加至介於該握持部與該保持面之間的該保護構件之拉伸負載,並且,所述剝離裝置係藉由該拉伸負載測量部測量施加至該保護構件之拉伸負載,藉此使該剝離手段的剝離操作最佳化。[Technical means to solve the problem] According to the present invention, there is provided a peeling device that peels a protective member that protects one side of a plate-shaped workpiece from the one side surface, and is provided with a holding means that holds the other side of the plate-shaped workpiece by the holding surface Side surface; and peeling means, which grip the outer peripheral portion of the protective member, the protective member covering the surface of the side of the plate-shaped workpiece held on the holding surface, the protective member from the outer periphery of the plate-shaped workpiece Peel off toward the center, and then peel off from the center to the outer periphery on the opposite side of the outer periphery, and the peeling means includes: a grip portion that grips the outer peripheral portion of the protection member; and a moving means that makes the grip portion and the outer periphery of the The holding means relatively moves in a direction parallel to the holding surface, and moves the holding portion from the outer periphery of the holding surface to the center, so that the holding portion that has passed the center of the holding surface moves away from the center in a straight line And a tensile load measuring part, which measures the tensile load applied to the protective member between the holding part and the holding surface, and the peeling device is measured by the tensile load The tensile load applied to the protective member is measured partially, thereby optimizing the peeling operation of the peeling means.

較佳為,所述拉伸負載測量部係由被配設於支撐所述保持手段之支撐部之壓電元件而成。Preferably, the tensile load measuring part is formed by a piezoelectric element arranged on a supporting part supporting the holding means.

較佳為,所述拉伸負載測量部係由被配設於支撐所述握持部之握持部支撐部之壓電元件而成。Preferably, the tensile load measuring part is formed by a piezoelectric element arranged on a holding part supporting part supporting the holding part.

較佳為,所述保護構件係保護膠膜,所述板狀工件在外周部分具有切口部,所述保持手段包含部分剝離部,所述部分剝離部將位於該切口部之未黏貼於該板狀工件之該保護膠膜上推,使該切口部附近的該保護膠膜從該板狀工件剝離,所述握持部握持藉由該部分剝離部而被剝離之該保護膠膜的外周部分。Preferably, the protective member is a protective adhesive film, the plate-shaped workpiece has a cut-out portion on the outer peripheral portion, and the holding means includes a partially peeled portion, and the partially peeled portion will be located in the cut portion and not adhered to the plate The protective adhesive film of the shaped workpiece is pushed up, so that the protective adhesive film near the cut portion is peeled off from the plate-shaped workpiece, and the holding portion holds the outer periphery of the protective adhesive film peeled off by the partial peeling portion part.

較佳為,所述保護構件係保護膠膜,該保護膠膜的外周部分更具備黏貼剝離膠膜之剝離膠膜黏貼手段,所述握持部握持已黏貼於該保護膠膜之該剝離膠膜以取代握持該保護膠膜的外周部分,所述拉伸負載測量部測量施加至該剝離膠膜之拉伸負載,該剝離膠膜係與介於該握持部與該保持面之間的該保護膠膜成為一體。Preferably, the protective member is a protective adhesive film, and the outer peripheral portion of the protective adhesive film is further provided with a peeling adhesive film sticking means for sticking a peeling adhesive film, and the gripping portion holds the peeling adhesive film that has been attached to the protective adhesive film. Instead of holding the outer peripheral part of the protective adhesive film, the tensile load measuring part measures the tensile load applied to the peeling adhesive film. The protective film between them becomes one.

較佳為,所述保護構件具有從所述板狀工件的外周稍微突出之突出部,所述握持部握持該突出部。Preferably, the protection member has a protrusion slightly protruding from the outer periphery of the plate-shaped workpiece, and the gripping part grips the protrusion.

[發明功效] 根據本發明,藉由拉伸負載測量部測量施加至保護構件拉伸負載,藉此可使剝離手段的剝離操作最佳化。亦即,變得能使晶圓不會破裂或在晶圓上不會發生殘膠等,且不浪費時間地以最佳的剝離速度將保護構件從晶圓剝離。[Efficacy of invention] According to the present invention, the tensile load applied to the protective member is measured by the tensile load measuring part, whereby the peeling operation of the peeling means can be optimized. In other words, it becomes possible to prevent the wafer from cracking or causing adhesive residue on the wafer, and to peel the protective member from the wafer at an optimal peeling speed without wasting time.

若拉伸負載測量部係由被配設於支撐保持手段之支撐部之壓電元件而成,則變得能正確地測量施加至保護構件之拉伸負載。If the tensile load measuring part is formed of a piezoelectric element arranged on the supporting part of the supporting and holding means, it becomes possible to accurately measure the tensile load applied to the protective member.

若拉伸負載測量部係由被配設於支撐握持部之握持部支撐部之壓電元件而成,則變得能正確地測量施加至保護構件之拉伸負載。If the tensile load measuring part is formed of a piezoelectric element arranged on the holding part supporting part supporting the holding part, it becomes possible to accurately measure the tensile load applied to the protective member.

保護構件係保護膠膜,板狀工件在外周部分具備切口部,保持手段具備部分剝離部,所述部分剝離部將位於切口部之未黏貼於板狀工件之保護膠膜上推,使切口部附近的保護膠膜從板狀工件剝離,藉此握持部變得能輕易地握持藉由部分剝離部而被剝離之保護膠膜的外周部分。The protective member is a protective adhesive film. The plate-shaped workpiece is provided with a notch on the outer periphery, and the holding means is provided with a partial peeling portion that pushes the protective adhesive film located in the notched portion that is not adhered to the plate-shaped workpiece to make the cut portion The protective adhesive film in the vicinity is peeled off from the plate-shaped workpiece, whereby the gripping part can easily hold the outer peripheral part of the protective adhesive film peeled off by the partial peeling part.

保護構件係保護膠膜,保護膠膜的外周部分更具備黏貼剝離膠膜之剝離膠膜黏貼手段,藉此握持部握持已黏貼於保護膠膜之剝離膠膜以取代握持保護膠膜的外周部分,拉伸負載測量部測量施加至剝離膠膜之拉伸負載以取代測量施加至保護膠膜之拉伸負載,所述剝離膠膜係與介於握持部與保持面之間的保護膠膜成為一體,藉此變得能使剝離手段的剝離操作最佳化。The protective member is a protective film, and the outer peripheral part of the protective film is equipped with a peeling film sticking means for sticking a peeling film, whereby the gripping part holds the peeling film pasted to the protective film instead of holding the protective film Instead of measuring the tensile load applied to the protective film, the tensile load measuring part measures the tensile load applied to the peeling film, and the peeling film is between the grip and the holding surface The protective adhesive film is integrated, thereby making it possible to optimize the peeling operation of the peeling means.

保護構件具有從板狀工件的外周稍微突出之突出部,藉此握持部變得能輕易地握持保護構件之外周部分的突出部。The protection member has a protrusion slightly protruding from the outer circumference of the plate-shaped workpiece, whereby the gripping part becomes able to easily grip the protrusion of the outer circumference of the protection member.

(剝離裝置的第一實施方式) 圖1所示之第一實施方式的剝離裝置1係將保護膠膜81剝離之剝離裝置的一例,保護膠膜81係使用帶狀的剝離膠膜83而黏貼於板狀工件80在圖1中之上表面亦即一側之面800的保護構件,剝離裝置1至少具備:保持手段30,其藉由保持面302保持板狀工件80的另一側之面801;以及剝離手段4,其握持保護膠膜81的外周部分,保護膠膜81覆蓋被保持於保持面302之板狀工件80的一側之面800,將保護膠膜81從板狀工件80的外周朝向中央剝離,再從中央往外周的相反側的外周剝離。(First embodiment of peeling device) The peeling device 1 of the first embodiment shown in FIG. 1 is an example of a peeling device that peels off the protective adhesive film 81. The protective adhesive film 81 is adhered to a plate-shaped workpiece 80 using a strip-shaped peeling adhesive film 83. In FIG. 1 The upper surface, which is the protection member of the one side surface 800, the peeling device 1 at least has: a holding means 30 which holds the other side surface 801 of the plate-shaped workpiece 80 by the holding surface 302; and a peeling means 4 which holds Holding the outer peripheral portion of the protective adhesive film 81, the protective adhesive film 81 covers the surface 800 of one side of the plate-shaped workpiece 80 held on the holding surface 302, and peels the protective adhesive film 81 from the outer circumference of the plate-shaped workpiece 80 toward the center, and then from Peel off from the center to the outer periphery on the opposite side of the outer periphery.

圖1所示之板狀工件80例如為以矽作為母材且外形為圓形的半導體晶圓,其一側之面800被垂直交叉之多條分割預定線804劃分成網格狀,在被劃分成網格狀之各區域中分別形成有IC等元件805。 在本實施方式中,以覆蓋板狀工件80的一側之面800整面的方式所黏貼之保護構件,係例如具備基材層與基材層上的黏著層(膠層)之保護膠膜81,所述基材層係由具有一定程度的柔軟性之樹脂(例如,聚烯烴系樹脂等)而成。 此外,板狀工件80除了矽以外,亦可由砷化鎵、藍寶石、陶瓷、樹脂、氮化鎵或碳化矽等所構成,保護構件亦不限定於保護膠膜81。The plate-shaped workpiece 80 shown in FIG. 1 is, for example, a semiconductor wafer with silicon as a base material and a circular shape. Components 805 such as ICs are formed in each area divided into a grid. In this embodiment, the protective member pasted so as to cover the entire surface 800 of one side of the plate-shaped workpiece 80 is, for example, a protective adhesive film having a substrate layer and an adhesive layer (adhesive layer) on the substrate layer. 81. The substrate layer is made of a resin with a certain degree of flexibility (for example, polyolefin resin, etc.). In addition, the plate-shaped workpiece 80 may be composed of gallium arsenide, sapphire, ceramic, resin, gallium nitride, silicon carbide, etc., in addition to silicon, and the protective member is not limited to the protective film 81.

例如,板狀工件80係在一側之面800的相反面亦即另一側之面801(圖1中的下表面)上黏貼有直徑大於板狀工件80的切割膠膜82。然後,切割膠膜82的膠層的外周部亦黏貼於環狀框架84,藉此板狀工件80透過切割膠膜82被支撐於環狀框架84,而能進行由環狀框架84所進行之處理。For example, the plate-shaped workpiece 80 has a cutting glue film 82 having a diameter larger than that of the plate-shaped workpiece 80 pasted on the opposite surface of the surface 800 on one side, that is, the surface 801 (the lower surface in FIG. 1) on the other side. Then, the outer periphery of the glue layer of the cut glue film 82 is also adhered to the ring frame 84, whereby the plate-shaped workpiece 80 is supported on the ring frame 84 through the cut glue film 82, and can be carried out by the ring frame 84 deal with.

剝離裝置1具有在X軸方向延伸之長方體狀的基台10,在基台10之上配設有使保持手段30在X軸方向往返移動之工作台移動手段13。工作台移動手段13具備:滾珠螺桿130,其配設於基台10;馬達132,其與滾珠螺桿130的一端連接;一對導軌131,其與滾珠螺桿130平行地延伸;以及可動構件133,其能在X軸方向移動。在可動構件133的上表面透過支撐部31配設有保持手段30。在可動構件133的下表面與一對導軌131滑動接觸,配設於可動構件133的下表面之未圖示之螺帽與滾珠螺桿130螺合。滾珠螺桿130被馬達132驅動而轉動,藉此保持手段30與可動構件133一起沿著導軌131在X軸方向移動。The peeling device 1 has a rectangular parallelepiped base 10 extending in the X-axis direction, and a table moving means 13 for reciprocating the holding means 30 in the X-axis direction is arranged on the base 10. The table moving means 13 includes: a ball screw 130 which is arranged on the base 10; a motor 132 which is connected to one end of the ball screw 130; a pair of guide rails 131 which extend parallel to the ball screw 130; and a movable member 133, It can move in the X-axis direction. A holding means 30 is arranged on the upper surface of the movable member 133 through the support portion 31. The lower surface of the movable member 133 is in sliding contact with the pair of guide rails 131, and a nut (not shown) arranged on the lower surface of the movable member 133 is screwed with the ball screw 130. The ball screw 130 is driven by the motor 132 to rotate, whereby the holding means 30 and the movable member 133 move in the X-axis direction along the guide rail 131.

工作台移動手段13為剝離手段4的一部分,且發揮作為移動手段的功能,使握持部41與保持手段30在與保持面302平行之X軸方向相對地移動,且使握持部41從保持面302的外周前往中心,再使已通過保持面302的中心之握持部41在一直線上往遠離中心之方向移動。The table moving means 13 is a part of the peeling means 4 and functions as a moving means. The holding part 41 and the holding means 30 are relatively moved in the X-axis direction parallel to the holding surface 302, and the holding part 41 is moved from The outer periphery of the holding surface 302 goes to the center, and the grip 41 that has passed through the center of the holding surface 302 is moved in a straight line away from the center.

在本實施方式中,保持手段30為保持台,且具備:吸附部300,其係由多孔構件等而成且吸附板狀工件80;以及框體301,其支撐吸附部300。吸附部300與真空產生裝置等未圖示之吸引源連通,將藉由吸引源進行吸引而產生之吸引力傳遞至吸附部300的露出面亦即平坦之保持面302,藉此保持手段30可將板狀工件80吸引保持在保持面302上。In the present embodiment, the holding means 30 is a holding table, and includes: an adsorption part 300 which is made of a porous member or the like and adsorbs a plate-shaped workpiece 80; and a frame body 301 which supports the adsorption part 300. The suction part 300 communicates with a suction source not shown in the figure, such as a vacuum generator, and transfers the suction force generated by the suction source to the exposed surface of the suction part 300, that is, the flat holding surface 302, whereby the holding means 30 can The plate-shaped workpiece 80 is sucked and held on the holding surface 302.

例如,保持手段30係周圍被固定環狀框架84之框架固定手段32所圍繞。俯視下具備環狀的外形且載置環狀框架84之框架固定手段32係成為藉由未圖示之吸引源所產生之吸引力而將環狀框架84吸引固定的構成,且藉由均等地配設於圓周方向之活塞機構33而成為能在Z軸方向(垂直方向)上下移動。此外,亦可在保持手段30的周圍配設多個藉由彈簧等使夾具開閉之機械夾具以取代框架固定手段32。For example, the periphery of the holding means 30 is surrounded by the frame fixing means 32 for fixing the ring frame 84. The frame fixing means 32, which has a ring-shaped outer shape in a plan view and mounts the ring frame 84, has a structure that sucks and fixes the ring frame 84 by the attractive force generated by a suction source (not shown), and is uniformly grounded. The piston mechanism 33 arranged in the circumferential direction can be moved up and down in the Z-axis direction (vertical direction). In addition, instead of the frame fixing means 32, a plurality of mechanical clamps for opening and closing the clamps with springs or the like may be arranged around the holding means 30.

例如,剝離手段4具備由配設於支撐保持手段30之支撐部31之壓電元件而成之拉伸負載測量部35,以作為後述圖1所示之測量施加至介於握持部41與保持面302之間的保護膠膜81之拉伸負載之拉伸負載測量部。以下,將拉伸負載測量部35設為工作台側拉伸負載測量部35。For example, the peeling means 4 is provided with a tensile load measuring part 35 formed of a piezoelectric element arranged on the supporting part 31 of the supporting and holding means 30, and is applied as a measurement shown in FIG. 1 to be described later between the holding part 41 and The tensile load measuring part of the tensile load of the protective film 81 between the holding surfaces 302. Hereinafter, the tensile load measurement unit 35 is referred to as the table side tensile load measurement unit 35.

在本實施方式中,支撐保持手段30之支撐部31例如具備圓筒形狀,工作台側拉伸負載測量部35被配設於支撐部31與工作台移動手段13的可動構件133之連接部位。亦即,工作台側拉伸負載測量部35係以下述形式配設:從上下方向(Z軸方向)被夾於支撐部31與可動構件133之間,支撐裝設於支撐部31上之保持手段30的重量。然後,在本實施方式中,以在X軸方向對向的方式,於保持手段30的下方配設有2個工作台側拉伸負載測量部35。亦即,工作台側拉伸負載測量部35係由第一工作台側拉伸負載測量部351與第二工作台側拉伸負載測量部352所構成。In the present embodiment, the supporting portion 31 of the supporting and holding means 30 has, for example, a cylindrical shape, and the table-side tensile load measuring portion 35 is arranged at the connection portion between the supporting portion 31 and the movable member 133 of the table moving means 13. That is, the tensile load measuring part 35 on the table side is arranged in the form of being sandwiched between the supporting part 31 and the movable member 133 from the vertical direction (Z-axis direction), and supporting the holder mounted on the supporting part 31 Means the weight of 30. Then, in the present embodiment, two table-side tensile load measuring parts 35 are arranged below the holding means 30 so as to face each other in the X-axis direction. That is, the table-side tensile load measurement unit 35 is composed of a first table-side tensile load measurement unit 351 and a second table-side tensile load measurement unit 352.

第一工作台側拉伸負載測量部351(第二工作台側拉伸負載測量部352)亦即壓電元件,例如係以鈦酸鋇(BaTiO3 )、鋯鈦酸鉛(PZT)、鈮酸鋰(LiNbO3 )或鉭酸鋰(LiTaO3 )等材料形成為平板狀或柱狀,且可將所承受之負載轉換成電壓訊號,並輸出至控制剝離裝置1的裝置整體之控制手段19。The first table side tensile load measuring part 351 (the second table side tensile load measuring part 352) is also a piezoelectric element, such as barium titanate (BaTiO 3 ), lead zirconate titanate (PZT), niobium Lithium oxide (LiNbO 3 ) or lithium tantalate (LiTaO 3 ) and other materials are formed into a plate or column shape, and the load can be converted into a voltage signal, and output to the control means 19 of the entire device that controls the stripping device 1 .

在保持手段30的移動路徑上方,配設有將被保持於保持手段30之板狀工件80的保護膠膜81進行剝離之剝離手段4,剝離手段4例如具備:膠膜切斷手段40,其以預定的長度切斷剝離膠膜83;剝離膠膜供給手段42,其從已將剝離膠膜83捲繞成滾筒狀的膠膜滾筒831拉出剝離膠膜83,並供給至已黏貼於板狀工件80的一側之面800之保護膠膜81;剝離膠膜黏貼手段44,其將剝離膠膜83黏貼於保護膠膜81的外周部分;握持部41,其握持已黏貼於保護膠膜81之剝離膠膜83;以及X軸方向移動手段46,其使剝離膠膜黏貼手段44及握持部41在X軸方向移動。Above the moving path of the holding means 30, a peeling means 4 for peeling off the protective film 81 of the plate-shaped workpiece 80 held by the holding means 30 is arranged. The peeling means 4 includes, for example, a film cutting means 40, which Cut the peeling film 83 to a predetermined length; peeling film supply means 42, which pulls the peeling film 83 from the film roll 831 that has wound the peeling film 83 into a roll, and supplies it to the board that has been pasted The protective film 81 on the side 800 of the workpiece 80; the peeling film sticking means 44, which sticks the peeling film 83 to the outer peripheral part of the protective film 81; the grip 41, the grip of which has been stuck on the protection The peeling adhesive film 83 of the adhesive film 81; and the X-axis direction moving means 46 for moving the peeling adhesive film sticking means 44 and the holding portion 41 in the X-axis direction.

X軸方向移動手段46發揮作為移動手段的功能,使握持部41與保持手段30在與保持面302平行之X軸方向相對地移動,且使握持部41從保持面302的外周前往中心,再使已通過保持面302的中心之握持部41在一直線上往遠離中心之方向移動。 具體而言,X軸方向移動手段46具備:滾珠螺桿460,其具有X軸方向的軸心;一對導軌461,其被配設成與滾珠螺桿460平行;馬達462,其與滾珠螺桿460連結並使滾珠螺桿460轉動;以及可動板463,其內部的螺帽與滾珠螺桿460螺合,且側部與導軌461滑動接觸,若馬達462使滾珠螺桿460轉動,則伴隨於此,可動板463被導軌461引導而在X軸方向往返移動,被安裝於可動板463之剝離膠膜黏貼手段44及握持部41亦在X軸方向往返移動。The X-axis direction moving means 46 functions as a moving means, moving the holding portion 41 and the holding means 30 relatively in the X-axis direction parallel to the holding surface 302, and moving the holding portion 41 from the outer periphery of the holding surface 302 to the center , And then move the grip 41 that has passed through the center of the holding surface 302 in a straight line away from the center. Specifically, the X-axis direction moving means 46 includes: a ball screw 460 having an axis in the X-axis direction; a pair of guide rails 461 arranged in parallel with the ball screw 460; and a motor 462 connected to the ball screw 460 And make the ball screw 460 rotate; and the movable plate 463, the nut inside it is screwed with the ball screw 460, and the side is in sliding contact with the guide rail 461, if the motor 462 rotates the ball screw 460, it will be accompanied by this, the movable plate 463 It is guided by the guide rail 461 to move back and forth in the X-axis direction, and the peeling adhesive film sticking means 44 and the grip 41 attached to the movable plate 463 also move back and forth in the X-axis direction.

剝離膠膜供給手段42具備:捲筒420,其裝設有膠膜滾筒831;一對導引滾筒421,其將從膠膜滾筒831拉出之剝離膠膜83往下方引導;以及一對送出滾筒422,其被配置於一對導引滾筒421的下方側。藉由未圖示之控制機構對捲筒420施加逆張力,並調整張力狀況,以使從膠膜滾筒831拉出之剝離膠膜83不會產生鬆弛。一對導引滾筒421係將剝離膠膜83一邊夾持一邊往回捲而施加張力,並朝向一對送出滾筒422引導,一對送出滾筒422可將剝離膠膜83朝向握持部41送出。The peeling film supply means 42 includes: a roll 420 equipped with a film roll 831; a pair of guide rollers 421 that guide the peeling film 83 pulled out from the film roll 831 downward; and a pair of sending out The roller 422 is arranged on the lower side of the pair of guide rollers 421. A control mechanism not shown in the figure applies reverse tension to the roll 420 and adjusts the tension so that the peeling film 83 pulled out from the film roll 831 does not slack. The pair of guide rollers 421 clamp the peeling film 83 while rewinding to apply tension and guide it toward the pair of delivery rollers 422. The pair of delivery rollers 422 can feed the peeling film 83 toward the grip 41.

剝離膠膜83例如係由接著劑層與基材而成之兩層結構的熱封膜,所述接著劑層藉由加熱而接著於保護膠膜81的外周部分。基材的材質例如係由聚對苯二甲酸乙二醇酯等樹脂而成。接著劑層例如係由環氧樹脂等熱固性樹脂所構成。將剝離膠膜83對於保護膠膜81之黏著力設定成比保護膠膜81對於板狀工件80之黏著力更強。此剝離膠膜83係以接著劑層位於內側(在被拉伸之狀態中的下表面側)之狀態被捲繞而成為膠膜滾筒831。此外,剝離膠膜83並不限定於熱封膜。The peeling adhesive film 83 is, for example, a heat-sealing film with a two-layer structure formed by an adhesive layer and a substrate, and the adhesive layer is adhered to the outer peripheral portion of the protective adhesive film 81 by heating. The material of the base material is made of resin such as polyethylene terephthalate, for example. The adhesive layer is composed of, for example, a thermosetting resin such as epoxy resin. The adhesive force of the peeling adhesive film 83 to the protective adhesive film 81 is set to be stronger than the adhesive force of the protective adhesive film 81 to the plate-shaped workpiece 80. The peeling adhesive film 83 is wound with the adhesive layer located inside (the lower surface side in the stretched state) to become the adhesive film roll 831. In addition, the peeling adhesive film 83 is not limited to a heat-sealing film.

在圖1所示之固定於X軸方向移動手段46的可動板463的側面之支撐台480上,安裝有握持部支撐部48,再者,藉由握持部支撐部48,構成握持部41之一對握持爪412成為能上下移動。On the support stand 480 fixed to the side surface of the movable plate 463 of the X-axis direction moving means 46 shown in FIG. 1, a grip support 48 is installed. Furthermore, the grip support 48 constitutes a grip One of the parts 41 can move up and down with respect to the gripping claw 412.

一對握持爪412例如具備:側視下大致L字形的固定爪4121;以及可動爪4122,其與固定爪4121在Z軸方向對向配設,且能接近或離開固定爪4121。在握持部41中,藉由使可動爪4122接近固定爪4121,可將剝離膠膜83的一端握持於其間。然後,可藉由握持部支撐部48將已握持剝離膠膜83之一對握持爪412定位在保持於保持手段30之板狀工件80的保護膠膜81上適合膠膜黏貼之高度位置。另一方面,藉由使可動爪4122從固定爪4121離開,可解除握持部41中之剝離膠膜83的一端之握持狀態。The pair of gripping claws 412 includes, for example, a fixed claw 4121 that is substantially L-shaped in a side view, and a movable claw 4122 that is arranged opposite to the fixed claw 4121 in the Z-axis direction and can approach or leave the fixed claw 4121. In the holding portion 41, by bringing the movable claw 4122 close to the fixed claw 4121, one end of the peeling adhesive film 83 can be held therebetween. Then, one pair of the gripping claws 412 of the held peeling adhesive film 83 can be positioned on the protective adhesive film 81 of the plate-shaped workpiece 80 held by the holding means 30 by the holding portion support portion 48 to a height suitable for the adhesive film. Location. On the other hand, by separating the movable claw 4122 from the fixed claw 4121, the gripping state of one end of the peeling film 83 in the grip 41 can be released.

圖1所示之剝離膠膜黏貼手段44被配設於一對送出滾筒422與握持部41之間。剝離膠膜黏貼手段44具備:支撐台440,其被固定於X軸方向移動手段46的可動板463的側面;壓接板升降機構441,其係由氣缸等而成,且被支撐台440支撐;以及壓接板442,其藉由壓接板升降機構441而成為能上下移動。The peeling adhesive film sticking means 44 shown in FIG. 1 is arranged between the pair of delivery rollers 422 and the grip 41. The peeling adhesive film sticking means 44 includes a support stand 440 fixed to the side of the movable plate 463 of the X-axis direction moving means 46, and a crimping plate lifting mechanism 441, which is formed by an air cylinder or the like, and is supported by the support stand 440 And the crimping plate 442, which can be moved up and down by the crimping plate lifting mechanism 441.

在壓接板442上安裝有藉由流通電流而發熱之未圖示之加熱器,在藉由壓接板升降機構441使壓接板442下降而將剝離膠膜83壓接並黏貼於保護膠膜81的外周部分之際,未圖示之加熱器將壓接板442加熱,藉此可使剝離膠膜83部分地熱熔接於保護膠膜81。藉此,可將剝離膠膜83良好地黏貼於保護膠膜81。A heater (not shown) that generates heat by flowing current is installed on the crimping plate 442, and the crimping plate 442 is lowered by the crimping plate lifting mechanism 441 to crimp and bond the peeling adhesive film 83 to the protective glue. In the case of the outer peripheral portion of the film 81, a heater (not shown) heats the pressure-bonding plate 442, thereby allowing the peeling adhesive film 83 to be partially thermally welded to the protective adhesive film 81. Thereby, the peeling adhesive film 83 can be adhered to the protective adhesive film 81 well.

膠膜切斷手段40例如被配設於一對送出滾筒422與剝離膠膜黏貼手段44之間。膠膜切斷手段40具備:載置台400,其具備載置剝離膠膜83的接著劑層側(下側)之載置面404、以及在剝離膠膜83的寬度方向(在水平面內與X軸方向正交之Y軸方向)將載置面404橫切之槽405;切斷器401,其沿著槽405的延伸方向而在槽405內行進;切斷器移動手段402,其係透過切斷器升降手段403支撐切斷器401並使切斷器401在槽405的延伸方向(Y軸方向)移動之滾珠螺桿機構;以及切斷器升降手段403,其係由氣缸等而成,且使切斷器401相對於載置面404在Z軸方向升降。The adhesive film cutting means 40 is arranged between the pair of delivery rollers 422 and the peeling adhesive film sticking means 44, for example. The adhesive film cutting means 40 includes a mounting table 400 having a mounting surface 404 on the adhesive layer side (lower side) of the peeling adhesive film 83, and a width direction of the peeling adhesive film 83 (in the horizontal plane and X The Y-axis direction perpendicular to the axial direction) the groove 405 that crosses the placing surface 404; the cutter 401, which travels in the groove 405 along the extending direction of the groove 405; the cutter moving means 402, which passes through The cutter lifting means 403 supports the cutter 401 and moves the cutter 401 in the extending direction of the groove 405 (Y-axis direction) ball screw mechanism; and the cutter lifting means 403, which is formed by an air cylinder or the like, And the cutter 401 is raised and lowered in the Z-axis direction with respect to the mounting surface 404.

例如,剝離手段4具備由被配設於支撐握持部41之握持部支撐部48之壓電元件而成的拉伸負載測量部47,以作為測量施加至介於握持部41與保持面302之間的保護膠膜81之拉伸負載的拉伸負載測量部。以下,將拉伸負載測量部47設為握持部側拉伸負載測量部47。然後,握持部側拉伸負載測量部47例如具備:上下方向負載測量壓電元件471、及水平方向負載測量壓電元件472。此外,剝離裝置1只要具備工作台側拉伸負載測量部35或握持部側拉伸負載測量部47的至少任一者作為拉伸負載測量部即可。For example, the peeling means 4 is provided with a tensile load measuring portion 47 formed of a piezoelectric element arranged on the holding portion support portion 48 supporting the holding portion 41, and is applied as a measurement between the holding portion 41 and the holding portion. The tensile load measuring part of the tensile load of the protective film 81 between the surfaces 302. Hereinafter, the tensile load measuring part 47 is referred to as the grip-side tensile load measuring part 47. Then, the grip-side tensile load measuring unit 47 includes, for example, a vertical load measuring piezoelectric element 471 and a horizontal load measuring piezoelectric element 472. In addition, the peeling device 1 only needs to include at least one of the table side tensile load measuring section 35 or the grip section side tensile load measuring section 47 as a tensile load measuring section.

握持部支撐部48例如係活塞桿483能從壓缸管484內在Z軸方向上下移動之電動壓缸等。然後,例如,上下方向負載測量壓電元件471具備圓柱狀的外形,且以使兩個桿體上下連結而成為一個活塞桿483之方式,一體地被配設於活塞桿483。The grip support portion 48 is, for example, an electric cylinder that can move the piston rod 483 up and down in the Z-axis direction from the cylinder tube 484. Then, for example, the vertical load measuring piezoelectric element 471 has a cylindrical outer shape, and is integrally arranged on the piston rod 483 so that the two rod bodies are connected up and down to form a single piston rod 483.

水平方向負載測量壓電元件472例如被形成為平板狀,且以被活塞桿483的前端部與固定爪4121從X軸方向兩側夾住之狀態,被配設於活塞桿483的前端部與固定爪4121之連結部位。此外,上下方向負載測量壓電元件471及水平方向負載測量壓電元件472係由與先前說明之工作台側拉伸負載測量部35同樣的材質所構成。The horizontal load measuring piezoelectric element 472 is formed in, for example, a flat plate shape, and is sandwiched by the front end of the piston rod 483 and the fixing claw 4121 from both sides in the X-axis direction, and is arranged on the front end of the piston rod 483 and Fix the connection part of the claw 4121. In addition, the vertical load measuring piezoelectric element 471 and the horizontal load measuring piezoelectric element 472 are made of the same material as the table-side tensile load measuring part 35 described earlier.

例如,在成為握持部41的移動路徑下方之位置,配設有使剝離手段4所剝離之保護膠膜81投下並進行回收之回收箱17。For example, at a position below the moving path of the grip 41, a recovery box 17 for dropping the protective film 81 peeled off by the peeling means 4 and recovering it is arranged.

剝離裝置1例如具備控制裝置的各構成之控制手段19,控制手段19係由遵循控制程式進行運算處理之CPU及記憶體等儲存媒體等所構成,且透過未圖示之有線或無線的通信路徑,與工作台移動手段13、X軸方向移動手段46以及使握持部41升降移動之電動壓缸等握持部支撐部48等電氣連接,在由控制手段19所進行之工作台移動手段13的控制下,進行已吸引保持板狀工件80之保持手段30在X軸方向的移動速度的控制、對於握持部41等的對位控制。並且,在由控制手段19所進行之X軸方向移動手段46及握持部支撐部48的控制下,進行握持部41的移動速度的控制、對位的控制等,所述握持部41握持被黏貼於板狀工件80的保護膠膜81之剝離膠膜83。此外,例如,由控制手段19所進行之X軸方向移動手段46的控制係藉由控制馬達462的旋轉數而進行。並且,控制手段19可從工作台側拉伸負載測量部35及握持部側拉伸負載測量部47接收關於各負載測量部所測量之拉伸負載的資訊。The peeling device 1 is provided with, for example, a control means 19 of the various components of the control device. The control means 19 is composed of a storage medium such as a CPU and a memory that perform arithmetic processing in accordance with a control program, and passes through a wired or wireless communication path not shown in the figure. , Are electrically connected to the table moving means 13, the X-axis direction moving means 46, and the holding part support part 48 such as an electric cylinder that moves the holding part 41 up and down, and the table moving means 13 performed by the control means 19 Under the control of, the movement speed of the holding means 30 in the X-axis direction that has sucked and held the plate-shaped workpiece 80 is controlled, and the positioning control of the grip 41 and the like are performed. In addition, under the control of the X-axis direction moving means 46 and the grip support portion 48 performed by the control means 19, the control of the movement speed of the grip 41, the control of the positioning, etc. are performed. The grip 41 The peeling adhesive film 83 of the protective adhesive film 81 adhered to the plate-shaped workpiece 80 is held. In addition, for example, the control of the X-axis direction moving means 46 by the control means 19 is performed by controlling the number of rotations of the motor 462. In addition, the control means 19 can receive information about the tensile load measured by each load measurement unit from the table-side tensile load measuring unit 35 and the grip-side tensile load measuring unit 47.

例如,在工作台移動手段13的馬達132為伺服馬達之情形中,伺服馬達的旋轉編碼器與亦具有作為伺服放大器的功能之控制手段19連接,從控制手段19的輸出介面將操作訊號供給至伺服馬達後,將伺服馬達的旋轉數作為編碼器訊號而輸出至控制手段19的輸入介面。然後,接收到編碼器訊號之控制手段19以馬達132的旋轉角度為基準,逐次識別保持手段30的移動量,藉此可逐次識別保持手段30在X軸方向的位置。For example, in the case where the motor 132 of the table moving means 13 is a servo motor, the rotary encoder of the servo motor is connected to the control means 19 that also has the function of a servo amplifier, and the operation signal is supplied to the control means 19 from the output interface of the control means 19 After the servo motor, the rotation number of the servo motor is output to the input interface of the control means 19 as an encoder signal. Then, the control means 19 receiving the encoder signal uses the rotation angle of the motor 132 as a reference to successively identify the movement amount of the holding means 30, thereby successively identifying the position of the holding means 30 in the X-axis direction.

接著,說明使用圖1所示之剝離裝置1將保護膠膜81從板狀工件80剝離之情形。首先,將與環狀框架84成為一體的板狀工件80以保護膠膜81朝向上側之狀態載置於保持手段30的保持面302,同時將環狀框架84載置於被配設於保持手段30的外周側之框架固定手段32。接著,未圖示之吸引源進行運作,以保持面302吸引保持板狀工件80,同時藉由框架固定手段32吸引固定環狀框架84。然後,環狀框架84下降至例如低於保持面302的位置為止。Next, the case where the protective adhesive film 81 is peeled from the plate-shaped workpiece 80 using the peeling device 1 shown in FIG. 1 will be described. First, the plate-shaped workpiece 80 integrated with the ring frame 84 is placed on the holding surface 302 of the holding means 30 with the protective adhesive film 81 facing upward, and the ring frame 84 is placed on the holding means. Frame fixing means 32 on the outer peripheral side of 30. Next, a suction source not shown in the figure operates to suck and hold the plate-shaped workpiece 80 by the holding surface 302, and at the same time, the ring frame 84 is sucked and fixed by the frame fixing means 32. Then, the ring frame 84 is lowered to a position lower than the holding surface 302, for example.

藉由圖1所示的一對導引滾筒421,從膠膜滾筒831將剝離膠膜83朝向握持部41送出。將剝離膠膜83的接著劑層側(內側)載置於膠膜切斷手段40的載置台400的載置面404,再將剝離膠膜83的一端定位於握持部41的固定爪4121的上表面後,可動爪4122接近固定爪4121,握持部41握持剝離膠膜83的一端。接著,藉由X軸方向移動手段46,握持部41往-X方向移動,將所握持之剝離膠膜83往同方向拉伸。在此階段中,成為剝離膠膜黏貼手段44的壓接板442及膠膜切斷手段40的切斷器401在剝離膠膜83的上方側待機之狀態。With the pair of guide rollers 421 shown in FIG. 1, the peeling adhesive film 83 is sent out from the adhesive film roller 831 toward the grip 41. Place the adhesive layer side (inside) of the peeling film 83 on the mounting surface 404 of the mounting table 400 of the film cutting means 40, and then position one end of the peeling film 83 on the fixing claw 4121 of the holding portion 41 After the upper surface of the film, the movable claw 4122 approaches the fixed claw 4121, and the holding portion 41 holds one end of the peeling film 83. Next, by the X-axis direction moving means 46, the holding portion 41 moves in the −X direction, and the held peeling film 83 is stretched in the same direction. At this stage, the crimping plate 442 of the peeling adhesive film sticking means 44 and the cutter 401 of the adhesive film cutting means 40 are in a standby state on the upper side of the peeling adhesive film 83.

例如保持手段30往+X方向移動,將保護膠膜81的外周部分定位於剝離膠膜黏貼手段44的正下方。接著,已藉由內部所具備的未圖示之加熱器加熱之壓接板442會下降,以壓接板442的下端將剝離膠膜83從上方壓接至保護膠膜81的外周部分,並使剝離膠膜83的接著劑層與保護膠膜81熱熔接。For example, the holding means 30 moves in the +X direction, and the outer peripheral part of the protective adhesive film 81 is positioned directly below the peeling adhesive film attaching means 44. Next, the crimping plate 442 heated by a heater (not shown) provided inside will be lowered, and the release adhesive film 83 is crimped from above to the outer peripheral portion of the protective adhesive film 81 with the lower end of the crimping plate 442, and The adhesive layer of the peeling adhesive film 83 and the protective adhesive film 81 are thermally welded.

在此狀態,將切斷器401定位於從剝離膠膜83之一側邊之側露出的載置台400的槽405的一端的位置。再者,藉由切斷器升降手段403,切斷器401下降直至切斷器401的最下端到達槽405內為止。進一步,切斷器401沿著槽405的延伸方向往-Y方向行進,藉由切斷器401將剝離膠膜83切斷。切斷器401將剝離膠膜83切斷後,切斷器401及壓接板442往+Z方向上升而從剝離膠膜83退出。In this state, the cutter 401 is positioned at one end of the groove 405 of the mounting table 400 exposed from the side of one side of the peeling adhesive film 83. Furthermore, by the cutter lifting means 403, the cutter 401 descends until the lowermost end of the cutter 401 reaches the groove 405. Further, the cutter 401 travels in the -Y direction along the extending direction of the groove 405, and the peeling adhesive film 83 is cut by the cutter 401. After the cutter 401 cuts the peeling adhesive film 83, the cutter 401 and the crimping plate 442 rise in the +Z direction and withdraw from the peeling adhesive film 83.

(在剝離裝置1中剝離保護膠膜81的實施方式A) 說明以下情形:在保護膠膜81的剝離中,使保持手段30在X軸方向移動,且將握持部41定位於離保持手段30的保持面302預定的距離上後,使其在水平方向移動。 握持剝離膠膜83之握持部41往+Z方向移動,將保護膠膜81的一部分從板狀工件80的一側之面800剝離。接著,藉由X軸方向移動手段46使握持部41往-X方向移動。並且,藉由工作台移動手段13使保持手段30往+X方向移動,使握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動,且將保護膠膜81逐漸從板狀工件80剝離。此外,亦可在保持手段30的移動路徑上方配設未圖示之旋轉滾筒,使保護膠膜81抵接該旋轉滾筒且逐漸進行剝離,藉此抑制在剝離保護膠膜81之際可能發生之保護膠膜81的斷裂。(Embodiment A in which the protective adhesive film 81 is peeled off in the peeling device 1) The following case will be described: in the peeling of the protective adhesive film 81, the holding means 30 is moved in the X-axis direction, and the holding portion 41 is positioned at a predetermined distance from the holding surface 302 of the holding means 30, and then it is horizontal. move. The grip 41 holding the peeling adhesive film 83 moves in the +Z direction, and a part of the protective adhesive film 81 is peeled from the one side surface 800 of the plate-shaped workpiece 80. Next, the grip 41 is moved in the −X direction by the X-axis direction moving means 46. Furthermore, the holding means 30 is moved in the +X direction by the table moving means 13, so that the grip 41 is relatively moved in the diameter direction from the outer periphery of the plate-shaped workpiece 80 toward the center, and the protective film 81 is gradually moved from the plate The shaped workpiece 80 is peeled off. In addition, a rotating drum (not shown) may be arranged above the moving path of the holding means 30, so that the protective film 81 abuts against the rotating drum and gradually peels off, thereby preventing possible occurrence of peeling off the protective film 81 The protective film 81 is broken.

此外,例如,只要可使握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動且將保護膠膜81從板狀工件80剝離即可,因此例如保持手段30亦可不往+X方向移動,僅握持部41往-X方向移動,藉此將保護膠膜81剝離。In addition, for example, it is sufficient to move the grip 41 relatively from the outer periphery of the plate-shaped workpiece 80 toward the center in the diametrical direction and peel off the protective adhesive film 81 from the plate-shaped workpiece 80. Therefore, for example, the holding means 30 may not be moved. Moving in the +X direction, only the grip 41 moves in the -X direction, thereby peeling off the protective adhesive film 81.

在本實施方式中,在將保護膠膜81從上述板狀工件80剝離中,圖2所示之握持部側拉伸負載測量部47可正確地測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83係與介於握持部41與保持面302之間的保護膠膜81成為一體。In this embodiment, in peeling the protective adhesive film 81 from the plate-shaped workpiece 80, the gripping part side tensile load measuring section 47 shown in FIG. 2 can accurately measure the tensile load applied to the peeling adhesive film 83 The peeling adhesive film 83 is integrated with the protective adhesive film 81 between the holding portion 41 and the holding surface 302.

例如,由握持部側拉伸負載測量部47所進行之拉伸負載的測量,係藉由上下方向負載測量壓電元件471與水平方向負載測量壓電元件472進行。此外,圖2中係將剝離手段4及保持手段30等構成進行局部簡化而顯示。 在圖2中,朝向斜上方之箭頭F1表示施加至剝離膠膜83之拉伸負載F1,所述剝離膠膜83係與介於握持部41與保持手段30的保持面302之間的保護膠膜81成為一體。而且,拉伸負載F1係將圖2所示之方向為-X方向的X軸方向拉伸負載Fx1與方向為+Z方向的Z軸方向拉伸負載Fz1進行合成而成之拉伸負載F1。然後,由畢氏(Pythagoras)定理成立下述式1。 (X軸方向拉伸負載Fx1)2 +(Z軸方向拉伸負載Fz1)2 = (拉伸負載F1)2 ・・・・(式1)For example, the tensile load measurement performed by the grip side tensile load measuring unit 47 is performed by the vertical load measuring piezoelectric element 471 and the horizontal load measuring piezoelectric element 472. In addition, in FIG. 2, the configurations of the peeling means 4 and the holding means 30 are partially simplified and shown. In FIG. 2, the arrow F1 facing diagonally upward indicates the tensile load F1 applied to the peeling adhesive film 83, which protects between the holding portion 41 and the holding surface 302 of the holding means 30 The glue film 81 is integrated. Moreover, the tensile load F1 is a tensile load F1 obtained by combining the X-axis direction tensile load Fx1 with the direction shown in FIG. 2 as the −X direction and the Z-axis direction tensile load Fz1 with the direction of the +Z direction. Then, the following formula 1 is established by the Pythagoras theorem. (Tensile load Fx1 in the X-axis direction) 2 + (Tensile load Fz1 in the Z-axis direction) 2 = (Tensile load F1) 2 ・・・・ (Equation 1)

於此,藉由水平方向負載測量壓電元件472,在每隔預定的時間間隔時測量X軸方向拉伸負載Fx1。亦即,水平方向負載測量壓電元件472藉由X軸方向拉伸負載Fx1而稍微變形,在水平方向負載測量壓電元件472產生因應負載之電位差。藉由在水平方向負載測量壓電元件472產生電位差,在每次測量時將負載檢測訊號從水平方向負載測量壓電元件472發送至圖1所示之控制手段19。並且,藉由上下方向負載測量壓電元件471,在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz1,在每次測量時將負載檢測訊號發送至控制手段19。Here, the piezoelectric element 472 is measured by the horizontal load, and the X-axis tensile load Fx1 is measured every predetermined time interval. That is, the horizontal load measuring piezoelectric element 472 is slightly deformed by the X-axis direction tensile load Fx1, and the horizontal load measuring piezoelectric element 472 generates a potential difference corresponding to the load. The potential difference is generated by the horizontal load measuring piezoelectric element 472, and the load detection signal is sent from the horizontal load measuring piezoelectric element 472 to the control means 19 shown in FIG. 1 during each measurement. In addition, the piezoelectric element 471 is measured by the vertical load measurement, the Z-axis tensile load Fz1 is measured every predetermined time interval, and the load detection signal is sent to the control means 19 at each measurement.

控制手段19進行將針對X軸方向拉伸負載Fx1的實測值與針對Z軸方向拉伸負載Fz1的實測值代入式1之運算處理,測量每隔預定的時間間隔之拉伸負載F1。然後,控制手段19將在每隔預定的時間間隔時所測量之拉伸負載F1使用作為用於使由剝離手段4所進行之保護膠膜81的剝離操作最佳化之資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F1的值,例如,藉由控制手段19,將由X軸方向移動手段46所進行之握持部41往-X方向的移動速度最佳化。其結果成為下述狀態:在握持部41將已與保護膠膜81成為一體之剝離膠膜83剝離之際的拉伸負載F1會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由握持部41所進行之剝離速度亦不會太慢,不浪費時間地將保護膠膜81逐漸從板狀工件80剝離。The control means 19 performs a calculation process of substituting the actual measurement value for the X-axis direction tensile load Fx1 and the actual measurement value for the Z-axis direction tensile load Fz1 into Equation 1, and measures the tensile load F1 every predetermined time interval. Then, the control means 19 uses the tensile load F1 measured at every predetermined time interval as information for optimizing the peeling operation of the protective film 81 by the peeling means 4. That is, by the value of the tensile load F1 measured at every predetermined time interval, for example, by the control means 19, the grip 41 performed by the X-axis direction moving means 46 is moved in the -X direction Optimized movement speed. The result is a state where the tensile load F1 when the gripping portion 41 peels off the peeling film 83 integrated with the protective film 81 will be fed back so that the plate-like workpiece 80 will not be broken or on the plate. The optimal tensile load such as residual glue does not occur on the shaped workpiece 80. In addition, the peeling speed performed by the holding portion 41 is not too slow, and the protective film 81 is gradually peeled from the plate-shaped workpiece 80 without wasting time.

若將保護膠膜81從板狀工件80的一側之面800完全剝離,則握持被黏貼於保護膠膜81之剝離膠膜83的握持部41會移動直到回收箱17上。然後,握持部41解除剝離膠膜83的握持,使保護膠膜81及剝離膠膜83落下至回收箱17內。If the protective adhesive film 81 is completely peeled off from the side surface 800 of the plate-shaped workpiece 80, the grip 41 holding the peeling adhesive film 83 adhered to the protective adhesive film 81 will move to the recovery box 17. Then, the gripping portion 41 releases the grip of the peeling adhesive film 83 and drops the protective adhesive film 81 and the peeling adhesive film 83 into the recovery box 17.

如本實施方式,保護板狀工件80之保護構件為保護膠膜81,且在保護膠膜81之外周部分具備黏貼剝離膠膜83之剝離膠膜黏貼手段44,藉此握持部41握持已黏貼於保護膠膜81之剝離膠膜83以取代握持保護膠膜81的外周部分,握持部側拉伸負載測量部47測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83與介於握持部41與保持面302之間的保護膠膜81成為一體,以取代測量施加至保護膠膜81的拉伸負載,藉此變得能使剝離手段4的剝離操作最佳化。As in the present embodiment, the protective member for protecting the plate-shaped workpiece 80 is the protective adhesive film 81, and the peeling adhesive film sticking means 44 for sticking the peeling adhesive film 83 is provided on the outer periphery of the protective adhesive film 81, whereby the gripping portion 41 holds The peeling adhesive film 83 that has been adhered to the protective adhesive film 81 replaces the outer peripheral portion of the holding protective adhesive film 81, and the grip side tensile load measuring section 47 measures the tensile load applied to the peeling adhesive film 83. The peeling adhesive The film 83 is integrated with the protective adhesive film 81 between the grip 41 and the holding surface 302, instead of measuring the tensile load applied to the protective adhesive film 81, thereby making it possible to maximize the peeling operation of the peeling means 4 Jiahua.

(在剝離裝置1中剝離保護膠膜81的實施方式B) 說明以下情形:握持剝離膠膜83之握持部41往+Z方向移動,將保護膠膜81的一部分從板狀工件80的一側之面800剝離後,正當再將保護膠膜81逐漸剝離時,如圖3所示,使保持手段30在X軸方向移動,且不以X軸方向移動手段46使握持部41移動。在本情形中,握持部41在預定的高度位置及在預定的X軸方向的位置P2停止,控制手段19識別握持部41所位於之高度位置及在X軸方向的位置P2。(Embodiment B in which the protective adhesive film 81 is peeled off in the peeling device 1) Explain the following situation: the grip 41 holding the peeling adhesive film 83 moves in the +Z direction, and after peeling a part of the protective adhesive film 81 from the surface 800 of one side of the plate-shaped workpiece 80, the protective adhesive film 81 is just gradually removed. At the time of peeling, as shown in FIG. 3, the holding means 30 is moved in the X-axis direction, and the grip 41 is not moved by the X-axis direction moving means 46. In this case, the grip 41 stops at a predetermined height position and a predetermined position P2 in the X-axis direction, and the control means 19 recognizes the height position where the grip 41 is located and a position P2 in the X-axis direction.

藉由工作台移動手段13使保持手段30往+X方向移動,使停止移動之握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動,且將保護膠膜81逐漸從板狀工件80剝離。此外,亦可在保持手段30的移動路徑上方配設未圖示之旋轉滾筒,使保護膠膜81抵接該旋轉滾筒且逐漸進行剝離,藉此抑制在剝離保護膠膜81之際可能發生之保護膠膜81的斷裂。The holding means 30 is moved in the +X direction by the table moving means 13, so that the holding portion 41 that stops moving relatively moves in the diameter direction from the outer periphery of the plate-shaped workpiece 80 toward the center, and the protective film 81 is gradually moved from The plate-shaped workpiece 80 peels off. In addition, a rotating drum (not shown) may be arranged above the moving path of the holding means 30, so that the protective film 81 abuts against the rotating drum and gradually peels off, thereby preventing possible occurrence of peeling off the protective film 81 The protective film 81 is broken.

在本實施方式中,在將保護膠膜81從上述板狀工件80剝離中,工作台側拉伸負載測量部35測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83係與介於握持部41與保持面302之間的保護膠膜81成為一體。 在圖3中,箭頭F2表示施加至剝離膠膜83的拉伸負載F2,所述剝離膠膜83係與介於握持部41與保持手段30的保持面302之間的保護膠膜81成為一體。而且,拉伸負載F2係將圖3所示之方向為-X方向的X軸方向拉伸負載Fx2與方向為+Z方向的Z軸方向拉伸負載Fz2進行合成而成之拉伸負載F2。In the present embodiment, in peeling the protective adhesive film 81 from the plate-shaped workpiece 80, the table side tensile load measuring section 35 measures the tensile load applied to the peeling adhesive film 83, which is connected to The protective adhesive film 81 interposed between the holding portion 41 and the holding surface 302 is integrated. In FIG. 3, the arrow F2 represents the tensile load F2 applied to the peeling adhesive film 83. The peeling adhesive film 83 and the protective adhesive film 81 between the holding portion 41 and the holding surface 302 of the holding means 30 become One. Moreover, the tensile load F2 is a tensile load F2 obtained by combining a tensile load Fx2 in the X-axis direction shown in FIG. 3 in the −X direction and a tensile load Fz2 in the Z-axis direction in the +Z direction.

圖3所示之箭頭R1係第一工作台側拉伸負載測量部351在Z軸方向在每隔預定的時間間隔時可測量之第一測量負載R1。第一測量負載R1例如具有-Z方向的方向。關於第一測量負載R1之值的資訊,係在每隔預定的時間間隔時被發送至控制手段19。 箭頭R2係第二工作台側拉伸負載測量部352在Z軸方向在每隔預定的時間間隔時可測量之第二測量負載R2。第二測量負載R2例如具有+Z方向的方向。關於第二測量負載R2之值的資訊,係在每隔預定的時間間隔時被發送至控制手段19。 圖3所示之第一工作台側拉伸負載測量部351與第二工作台側拉伸負載測量部352在X軸方向的距離L2係控制手段19預先識別之裝置設計值,且成為常數。 從第一工作台側拉伸負載測量部351起至在X軸方向的移動停止而位於位置P2的握持部41為止之X軸方向的變化距離M,係藉由保持手段30在X軸方向移動而變化之變數。此外,藉由從工作台移動手段13的馬達132(伺服馬達132)的旋轉編碼器回饋至控制手段19之編碼器訊號,控制手段19可掌握與可動構件133一起移動之第一工作台側拉伸負載測量部351的位置,因此控制手段19亦可在每隔預定的時間間隔時逐次識別該變化距離M的值。 控制手段19識別高度位置之第一工作台側拉伸負載測量部351與停止於位置P2之握持部41在Z軸方向的距離N,係成為控制手段19預先識別之常數。The arrow R1 shown in FIG. 3 is the first measurement load R1 that can be measured at every predetermined time interval in the Z-axis direction by the tensile load measuring part 351 on the first table side. The first measurement load R1 has, for example, a direction of the -Z direction. Information about the value of the first measurement load R1 is sent to the control means 19 at predetermined time intervals. The arrow R2 indicates the second measurement load R2 that can be measured by the second table-side tensile load measurement unit 352 at predetermined time intervals in the Z-axis direction. The second measurement load R2 has a direction of the +Z direction, for example. Information about the value of the second measurement load R2 is sent to the control means 19 at predetermined time intervals. The distance L2 in the X-axis direction between the first table side tensile load measuring part 351 and the second table side tensile load measuring part 352 shown in FIG. 3 is a device design value previously recognized by the control means 19 and becomes a constant. The change distance M in the X-axis direction from the tensile load measuring portion 351 on the first table side to the grip portion 41 at the position P2 when the movement in the X-axis direction is stopped is determined by the holding means 30 in the X-axis direction Variables that move and change. In addition, by feeding back from the rotary encoder of the motor 132 (servo motor 132) of the table moving means 13 to the encoder signal of the control means 19, the control means 19 can grasp the side pull of the first table moving together with the movable member 133 The position of the tensile load measuring part 351, therefore, the control means 19 may also sequentially recognize the value of the change distance M at every predetermined time interval. The distance N in the Z-axis direction between the first table side tensile load measuring part 351 at the height position of the control means 19 and the grip part 41 stopped at the position P2 becomes a constant recognized by the control means 19 in advance.

由畢氏定理成立下述式2。 (X軸方向拉伸負載Fx2)2 +(Z軸方向拉伸負載Fz2)2 = (拉伸負載F2)2 ・・・・(式2) 並且,由於在Z軸方向的力的平衡,故成立下述式3。 (Z軸方向拉伸負載Fz2)=(第一測量負載R1)+(第二測量負載R2)・・・・(式3)According to Pythagorean theorem, the following formula 2 is established. (X-axis direction tensile load Fx2) 2 + (Z-axis direction tensile load Fz2) 2 = (Tensile load F2) 2 ・・・・(Equation 2) In addition, due to the balance of forces in the Z-axis direction, The following formula 3 is established. (Z-axis tensile load Fz2) = (first measurement load R1) + (second measurement load R2) ・・・・ (Equation 3)

再者,由於在將第一工作台側拉伸負載測量部351假設成原點之情形中,第一工作台側拉伸負載測量部351周圍的力矩的平衡,故成立下列式4。 (X軸方向拉伸負載Fx2)×(為常數的距離N)=(第二測量負載R2)×(距離L2)+(Z軸方向拉伸負載Fz2)×(變化距離M)・・・・(式4)Furthermore, in the case where the first table-side tensile load measuring part 351 is assumed to be the origin, the balance of the moment around the first table-side tensile load measuring part 351, the following equation 4 is established. (X-axis direction tensile load Fx2) × (constant distance N) = (second measurement load R2) × (distance L2) + (Z-axis direction tensile load Fz2) × (change distance M)・・・・ (Equation 4)

由式3,控制手段19可在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz2。並且,由將式4變形而成之下述式5,控制手段19可在每隔預定的時間間隔時測量X軸方向拉伸負載Fx2。 (X軸方向拉伸負載Fx2)={(第二測量負載R2)×(距離L2)+(Z軸方向拉伸負載Fz2)×(變化距離M)}/(為常數的距離N)・・・・(式5)According to Equation 3, the control means 19 can measure the tensile load Fz2 in the Z-axis direction every predetermined time interval. In addition, the following formula 5 is obtained by deforming the formula 4, and the control means 19 can measure the tensile load Fx2 in the X-axis direction at predetermined time intervals. (X-axis direction tensile load Fx2)={(second measurement load R2)×(distance L2)+(Z-axis direction tensile load Fz2)×(change distance M)}/(distance N which is constant)・・ ・・ (Equation 5)

控制手段19進行將針對X軸方向拉伸負載Fx2的值與針對Z軸方向拉伸負載Fz2的值代入式2之運算處理,在每隔預定的時間間隔時測量拉伸負載F2。然後,控制手段19將在每隔預定的時間間隔時所測量之拉伸負載F2使用作為用於使由剝離手段4所進行之保護膠膜81的剝離操作最佳化之資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F2的值,例如,藉由控制手段19將由工作台移動手段13所進行之保持手段30的移動速度最佳化。其結果成為下述狀態:在握持部41將已與保護膠膜81成為一體之剝離膠膜83剝離之際的拉伸負載F2會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由相對於移動之保持手段30而在X軸方向相對地移動之握持部41所進行之剝離速度亦不會太慢,不浪費時間地將保護膠膜81逐漸從板狀工件80剝離。The control means 19 performs a calculation process of substituting the value of the tensile load Fx2 in the X-axis direction and the value of the tensile load Fz2 in the Z-axis direction into Equation 2, and measures the tensile load F2 at predetermined time intervals. Then, the control means 19 uses the tensile load F2 measured at every predetermined time interval as information for optimizing the peeling operation of the protective film 81 by the peeling means 4. That is, based on the value of the tensile load F2 measured at every predetermined time interval, for example, the moving speed of the holding means 30 by the table moving means 13 is optimized by the control means 19. The result is a state in which the tensile load F2 at the time when the gripping portion 41 peels off the peeling film 83 integrated with the protective film 81 is feedback controlled so that the plate-shaped workpiece 80 will not be broken or on the plate. The optimal tensile load such as residual glue does not occur on the shaped workpiece 80. In addition, the peeling speed performed by the grip 41 relatively moving in the X-axis direction with respect to the moving holding means 30 is not too slow, and the protective film 81 is gradually peeled off the plate-shaped workpiece 80 without wasting time. .

如本實施方式,工作台側拉伸負載測量部35亦即第一工作台側拉伸負載測量部351及第二工作台側拉伸負載測量部352若係由被配設於支撐保持手段30之支撐部31之壓電元件而成,則變得能正確地測量施加至保護構件亦即保護膠膜81的拉伸負載。As in this embodiment, the table-side tensile load measuring section 35, that is, the first table-side tensile load measuring section 351 and the second table-side tensile load measuring section 352 are provided in the support and holding means 30. The supporting part 31 of the piezoelectric element is formed, and it becomes possible to accurately measure the tensile load applied to the protective member, that is, the protective film 81.

若將保護膠膜81從板狀工件80的一側之面800完全剝離,則握持已黏貼於保護膠膜81之剝離膠膜83的握持部41移動直到回收箱17上。然後,握持部41解除剝離膠膜83的握持,使保護膠膜81及剝離膠膜83落下至回收箱17內。If the protective adhesive film 81 is completely peeled off from the surface 800 of one side of the plate-shaped workpiece 80, the grip 41 holding the peeling adhesive film 83 pasted to the protective adhesive film 81 moves to the recovery box 17. Then, the gripping portion 41 releases the grip of the peeling adhesive film 83 and drops the protective adhesive film 81 and the peeling adhesive film 83 into the recovery box 17.

本發明之第一實施方式的剝離裝置1並不限定於上述實施方式,在其技術性思想的範圍內當然也可以各種不同的方式實施。並且,關於隨附圖式所圖示之剝離裝置1的各構成要素的形狀等,亦不限定於此,在可發揮本發明之功效的範圍內能適當變更。The peeling device 1 of the first embodiment of the present invention is not limited to the above-mentioned embodiment, and of course it can be implemented in various different ways within the scope of its technical idea. In addition, the shapes and the like of the respective components of the peeling device 1 illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within the range in which the effects of the present invention can be exhibited.

例如,如圖4所示,板狀工件80亦可在外周部分具備切口部806。切口部806例如係表示晶體方向之標記亦即缺口,且以朝向板狀工件80的中心往直徑方向內側凹入之狀態形成於板狀工件80的外周緣。或者,切口部806亦可為定向平面。此情形,將板狀工件80的外周的一部分切平,藉此形成切口部806。For example, as shown in FIG. 4, the plate-shaped workpiece|work 80 may be equipped with the notch part 806 in the outer peripheral part. The notch 806 is, for example, a notch that is a mark indicating the crystal direction, and is formed on the outer periphery of the plate-shaped workpiece 80 in a state of being recessed toward the center of the plate-shaped workpiece 80 toward the inner side in the diameter direction. Alternatively, the cutout portion 806 may also be an orientation plane. In this case, a part of the outer periphery of the plate-shaped workpiece 80 is cut flat, thereby forming the cutout portion 806.

如圖4所示,圖1所示之保持手段30例如亦可具備:部分剝離部34,其將位於板狀工件80的切口部806之未黏貼於板狀工件80的保護膠膜81上推,使切口部806附近的保護膠膜81從板狀工件80剝離。然後,例如,圖1所示之握持部41亦可握持藉由部分剝離部34而被剝離之保護膠膜81的外周部分,將保護膠膜81從板狀工件80剝離。As shown in FIG. 4, the holding means 30 shown in FIG. 1 may be provided, for example, with: a partial peeling portion 34 that pushes the protective adhesive film 81 that is located in the cutout portion 806 of the plate-shaped workpiece 80 that is not adhered to the plate-shaped workpiece 80 , The protective adhesive film 81 near the cut portion 806 is peeled off from the plate-shaped workpiece 80. Then, for example, the holding portion 41 shown in FIG. 1 may also hold the outer peripheral portion of the protective adhesive film 81 peeled off by the partial peeling portion 34 and peel the protective adhesive film 81 from the plate-shaped workpiece 80.

以與被載置於保持面302之板狀工件80的切口部806對應之方式,在保持面302的外周形成有圓形狀的貫通孔341,所述貫通孔341構成部分剝離部34,並使保持面302與保持手段30的下表面(框體301的下表面)貫通。具體而言,以使從板狀工件80的中心至切口部806為止的距離與從保持面302的中心至貫通孔341為止的距離一致之方式,將貫通孔341配設於保持面302。A circular through hole 341 is formed on the outer periphery of the holding surface 302 to correspond to the cutout portion 806 of the plate-shaped workpiece 80 placed on the holding surface 302. The through hole 341 constitutes a partial peeling portion 34 and makes The holding surface 302 penetrates the lower surface of the holding means 30 (the lower surface of the housing 301). Specifically, the through hole 341 is arranged on the holding surface 302 so that the distance from the center of the plate-shaped workpiece 80 to the cutout portion 806 and the distance from the center of the holding surface 302 to the through hole 341 coincide.

並且,將貫通孔341的直徑設定成例如稍小於切口部806的寬度。將已黏貼於板狀工件80的一側之面800的保護膠膜81的一部分上推之上推銷342,係藉由上下驅動部345而能上下移動地設置於部分剝離部34的貫通孔341的正下方。上推銷342被形成為在上下方向延伸之棒狀,上推銷342的外直徑成為稍小於貫通孔341。例如,上推銷342的前端(上端)具有尖的形狀,變得能將已黏貼於板狀工件80的另一側之面801的切割膠膜82戳破。In addition, the diameter of the through hole 341 is set to be slightly smaller than the width of the notch 806, for example. A part of the protective adhesive film 81 adhered to the side surface 800 of the plate-shaped workpiece 80 is pushed up by the upper push pin 342, which is provided in the through hole 341 of the partially peeled part 34 by the up and down driving part 345 so as to move up and down. Directly below. The upper push pin 342 is formed in a rod shape extending in the vertical direction, and the outer diameter of the upper push pin 342 is slightly smaller than the through hole 341. For example, the front end (upper end) of the upper push pin 342 has a pointed shape, and it becomes possible to puncture the dicing film 82 adhered to the surface 801 of the other side of the plate-shaped workpiece 80.

並且,例如在上推銷342上,係沿著延伸方向形成有從前端噴出流體之未圖示的噴出孔。在噴出孔的下端,透過閥346連接有流體供給源347,藉由開啟閥346而從流體供給源347將流體供給至上推銷342內。此外,從流體供給源347所供給之流體並無特別限定,在本實施方式中係使用壓縮空氣作為流體。In addition, for example, the upper push pin 342 is formed with an ejection hole (not shown) for ejecting fluid from the tip along the extending direction. At the lower end of the ejection hole, a fluid supply source 347 is connected to the transmission valve 346, and the fluid is supplied from the fluid supply source 347 to the upper push pin 342 by opening the valve 346. In addition, the fluid supplied from the fluid supply source 347 is not particularly limited, and compressed air is used as the fluid in this embodiment.

上下驅動部345例如係由空氣或馬達驅動的導引致動器所構成,變得能在保持手段30的貫通孔341內一邊在上下方向引導上推銷342一邊使其上下移動。The up-and-down driving part 345 is constituted by, for example, a guide actuator driven by air or a motor, and can move the upper push pin 342 up and down while guiding the upper push pin 342 in the up and down direction in the through hole 341 of the holding means 30.

如此,上推銷342被構成為一邊從噴出孔的出口噴出空氣一邊藉由上下驅動部345上升而戳破切割膠膜82。並且,上推銷342變得能在戳破切割膠膜82後從保持面302突出,將板狀工件80的切口部806上的保護膠膜81上推。亦即,一邊使空氣從上推銷342的噴出孔噴出而使保護膠膜81浮起,一邊使上推銷342進一步上升而將保護膠膜81的外周部分上推,或是一邊使上推銷342上升而將保護膠膜81的外周部分上推,一邊使空氣從噴出孔噴出空氣而使保護膠膜81的外周部分從板狀工件80剝離。 然後,圖4所示之握持部41可握持藉由部分剝離部34而被剝離之保護膠膜81的外周部分,並將保護膠膜81從板狀工件80剝離。In this way, the upper push pin 342 is configured to pierce the cutting film 82 by the up-and-down driving portion 345 while ejecting air from the outlet of the ejection hole. In addition, the push-up pin 342 becomes capable of protruding from the holding surface 302 after piercing the cut adhesive film 82 to push up the protective adhesive film 81 on the cut portion 806 of the plate-shaped workpiece 80. That is, while air is ejected from the ejection hole of the upper push pin 342 to float the protective film 81, the upper push pin 342 is further raised to push up the outer peripheral portion of the protective film 81, or the upper push pin 342 is raised. While pushing up the outer peripheral portion of the protective adhesive film 81, the air is blown out from the ejection hole, and the outer peripheral portion of the protective adhesive film 81 is peeled from the plate-shaped workpiece 80. Then, the holding portion 41 shown in FIG. 4 can hold the outer peripheral portion of the protective adhesive film 81 peeled by the partial peeling portion 34 and peel the protective adhesive film 81 from the plate-shaped workpiece 80.

(剝離裝置的第二實施方式) 圖5所示的本發明之剝離裝置2(以下稱為第二實施方式之剝離裝置2)係將黏貼於板狀工件80在圖5中之下表面亦即一側之面800的保護構件85進行剝離之剝離裝置的一例,且至少具備:保持手段50,其藉由保持面502保持板狀工件80的另一側之面801;以及剝離手段6,其握持保護構件85,保護構件85覆蓋被保持於保持面502之板狀工件80的一側之面800,將保護構件85從板狀工件80的外周朝向中央剝離,再從中央往外周的相反側的外周剝離。(Second embodiment of peeling device) The peeling device 2 of the present invention shown in FIG. 5 (hereinafter referred to as the peeling device 2 of the second embodiment) is a protective member 85 that adheres to the lower surface of the plate-shaped workpiece 80 in FIG. 5, that is, the side surface 800 An example of a peeling device that performs peeling, and at least includes: a holding means 50 that holds the other side surface 801 of the plate-shaped workpiece 80 by the holding surface 502; and a peeling means 6 that holds the protective member 85 and the protective member 85 Covering the one side surface 800 of the plate-shaped workpiece 80 held by the holding surface 502, the protective member 85 is peeled from the outer periphery of the plate-shaped workpiece 80 toward the center, and then from the center to the outer periphery on the opposite side of the outer periphery.

以覆蓋板狀工件80朝向下方的一側之面800整個表面之方式所黏貼之保護構件85,例如係由樹脂膜87(參考圖6)與圓形薄片86而成之保護構件,所述樹脂膜87係在未圖示之保護構件形成裝置中,將板狀工件80的一側之面800壓接至被供給至直徑大於板狀工件80的圓形薄片86上之液態樹脂,將液態樹脂從板狀工件80的中心朝向外周側擴展,使液態樹脂在一側之面800的整個表面展開後,對此液態樹脂例如照射紫外線,藉此使液態樹脂硬化而形成。然後,在本實施方式中,保護構件85係由圓形薄片86與樹脂膜87而成,且具備:圖6所示之突出部850,其從板狀工件80的外周往直徑方向外側稍微突出。The protective member 85 pasted so as to cover the entire surface 800 of the side of the plate-shaped workpiece 80 facing downward is, for example, a protective member composed of a resin film 87 (refer to FIG. 6) and a circular sheet 86. The resin The film 87 is formed in a protective member forming device not shown. The surface 800 of one side of the plate-shaped workpiece 80 is crimped to the liquid resin supplied to the circular sheet 86 having a larger diameter than the plate-shaped workpiece 80, and the liquid resin After spreading from the center of the plate-shaped workpiece 80 toward the outer peripheral side, and spreading the liquid resin on the entire surface of the one side surface 800, the liquid resin is irradiated with ultraviolet rays, for example, to harden the liquid resin. Then, in this embodiment, the protective member 85 is made up of a circular sheet 86 and a resin film 87, and is provided with: a protrusion 850 shown in FIG. .

在圖5所示之剝離裝置2的底座20上的後方側(-X方向側)立設有柱體21,在柱體21的+X方向側的前表面的上部配設有襯墊移動手段60,所述襯墊移動手段60係藉由馬達602而使滾珠螺桿600轉動,藉此使配設於可動板601之保持手段50在Y軸方向往返移動。 襯墊移動手段60為剝離手段6的一部分,且發揮作為移動手段的功能,以使握持部61與保持手段50在與保持面502平行之Y軸方向相對地移動,且使握持部61從保持面502的外周前往中心,並使已通過保持面502的中心之握持部61在一直線上往遠離中心之方向移動。A column 21 is erected on the rear side (-X direction side) of the base 20 of the peeling device 2 shown in FIG. 60. The pad moving means 60 rotates the ball screw 600 by the motor 602, thereby causing the holding means 50 arranged on the movable plate 601 to reciprocate in the Y-axis direction. The pad moving means 60 is a part of the peeling means 6 and functions as a moving means so that the grip 61 and the holding means 50 are relatively moved in the Y-axis direction parallel to the holding surface 502, and the grip 61 From the outer periphery of the holding surface 502 to the center, the grip 61 that has passed through the center of the holding surface 502 is moved in a straight line away from the center.

在可動板601上配設有使保持手段50在Z軸方向往返移動之襯墊升降手段66。襯墊升降手段66係藉由馬達662而使滾珠螺桿660轉動,藉此使配設於可動板661上之保持手段50在Z軸方向往返移動。The movable plate 601 is provided with a pad raising and lowering means 66 for reciprocating the holding means 50 in the Z-axis direction. The pad lifting means 66 rotates the ball screw 660 by the motor 662, thereby causing the holding means 50 arranged on the movable plate 661 to reciprocate in the Z-axis direction.

藉由保持面502保持板狀工件80的另一側之面801之保持手段50,係由一端被固定於可動板661上且在X軸方向延伸之臂部52所支撐,且透過支撐部53而被安裝於臂部52的+X方向側的另一端的下表面側。The holding means 50, which holds the surface 801 on the other side of the plate-shaped workpiece 80 by the holding surface 502, is supported by the arm 52 whose one end is fixed to the movable plate 661 and extends in the X-axis direction, and passes through the support 53 And it is attached to the lower surface side of the other end of the +X direction side of the arm part 52.

如圖6所示,在本實施方式中,保持手段50為吸引保持墊,且具備:吸附部500,其由多孔構件而成,並吸附板狀工件80;以及框體501,其支撐吸附部500。吸附部500係透過吸引管509以及樹脂管或接頭等而與未圖示之吸引源連通。然後,將吸引源所產生之吸引力傳遞至由吸附部500的露出面與框體501的下表面所形成之同一平面的保持面502,藉此保持手段50以保持面502吸引保持板狀工件80。As shown in FIG. 6, in this embodiment, the holding means 50 is a suction holding pad, and includes: an adsorption part 500, which is made of a porous member and adsorbs a plate-shaped workpiece 80; and a frame body 501, which supports the adsorption part 500. The suction part 500 communicates with a suction source (not shown) through a suction tube 509 and a resin tube or a joint. Then, the suction force generated by the suction source is transferred to the holding surface 502 formed by the exposed surface of the suction part 500 and the lower surface of the frame body 501 on the same plane, whereby the holding means 50 sucks and holds the plate-shaped workpiece with the holding surface 502 80.

圖5所示之支撐部53例如具備圓環板狀的外形,且其上表面係藉由未圖示之固定螺栓等而與臂部52的下表面連接。在支撐部53的下表面安裝有襯墊側拉伸負載測量部64,所述襯墊側拉伸負載測量部64係測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載之拉伸負載測量部。The support portion 53 shown in FIG. 5 has, for example, a circular plate-shaped outer shape, and its upper surface is connected to the lower surface of the arm portion 52 by a fixing bolt or the like not shown. A pad-side tensile load measuring portion 64 is installed on the lower surface of the support portion 53, and the pad-side tensile load measuring portion 64 measures the protective member 85 applied between the grip portion 61 and the holding surface 502 The tensile load measuring part of the tensile load.

襯墊側拉伸負載測量部64係由被配設於支撐保持手段50之支撐部53之壓電元件而成。亦即,例如,襯墊側拉伸負載測量部64係被形成為圓柱狀或角柱形之鈦酸鋇等壓電元件,且以在Y軸方向對向之方式,以將支撐部53與保持手段50連結並支撐保持手段50的重量之形式配設有2個(圖5中僅圖示1個)。亦即,襯墊側拉伸負載測量部64係由圖6所示之第一襯墊側拉伸負載測量部641與第二襯墊側拉伸負載測量部642所構成。The pad side tensile load measuring part 64 is formed of a piezoelectric element arranged on the supporting part 53 of the supporting and holding means 50. That is, for example, the pad-side tensile load measuring portion 64 is a piezoelectric element such as barium titanate formed in a cylindrical or angular column shape, and is opposed in the Y-axis direction to align the support portion 53 with the holding portion 53 Two means 50 are arranged to connect and support the weight of the holding means 50 (only one is shown in FIG. 5). That is, the pad side tensile load measuring part 64 is composed of the first pad side tensile load measuring part 641 and the second pad side tensile load measuring part 642 shown in FIG. 6.

在圖5所示之柱體21的+X方向側的前表面的中間部亦即保持手段50的移動路徑的下方,從+Z方向側依序排列配設有:旋轉滾筒211,其具有X軸方向的軸心;剝離手段6的各構成要素;載置台27,其載置已從板狀工件80剝離之保護構件85;以及落下手段26,其使載置台27上的剝離後的保護構件85落下至垃圾箱(dust box)28。In the middle part of the front surface of the column 21 shown in FIG. 5 on the +X direction side, that is, below the movement path of the holding means 50, there are arranged in order from the +Z direction side: a rotating drum 211 having X The axis in the axial direction; the constituent elements of the peeling means 6; the mounting table 27, which mounts the protective member 85 that has been peeled from the plate-shaped workpiece 80; and the dropping means 26, which causes the peeled protective member on the mounting table 27 85 falls to the dust box (dust box) 28.

剝離手段6具備:握持部61,其握持保護構件85的外周部分(在本實施方式中係成為外周部分之突出部850);移動手段63,其使握持部61與保持手段50在與保持面502平行之方向(Y軸方向)相對地移動,且使握持部61從保持面502的外周前往中心,並使已通過保持面502的中心之握持部61在一直線上往遠離中心之方向移動;以及襯墊側拉伸負載測量部64,其係測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載之拉伸負載測量部。 此外,移動手段63在以下說明中設為握持部移動手段63。The peeling means 6 is provided with: a grip 61 that grips the outer peripheral portion of the protection member 85 (in this embodiment, a protrusion 850 that becomes the outer peripheral portion); and a moving means 63 that positions the grip 61 and the holding means 50 Move relatively in a direction parallel to the holding surface 502 (Y-axis direction), and move the grip 61 from the outer periphery of the holding surface 502 to the center, and move the grip 61 that has passed through the center of the holding surface 502 away in a straight line The direction of the center movement; and the liner side tensile load measuring part 64, which measures the tensile load applied to the tensile load of the protective member 85 between the grip 61 and the holding surface 502. In addition, the moving means 63 is referred to as a grip moving means 63 in the following description.

握持部移動手段63係由下述所構成:滾珠螺桿630,其具有Y軸方向的軸心;一對導軌631,其被配設成與滾珠螺桿630平行;馬達632,其使滾珠螺桿630轉動;以及可動塊633,其內部的螺帽與滾珠螺桿630螺合,且側部與導軌631滑動接觸。然後,若馬達632使滾珠螺桿630轉動,則伴隨於此,可動塊633被導軌631引導而在Y軸方向移動,配設於可動塊633之握持部61伴隨可動塊633的移動而在Y軸方向移動。The grip moving means 63 is composed of the following: a ball screw 630, which has an axis in the Y-axis direction; a pair of guide rails 631, which are arranged in parallel with the ball screw 630; and a motor 632, which makes the ball screw 630 Rotation; and the movable block 633, the nut inside it is screwed with the ball screw 630, and the side part is in sliding contact with the guide rail 631. Then, when the motor 632 rotates the ball screw 630, the movable block 633 is guided by the guide rail 631 to move in the Y-axis direction. Axis direction movement.

在可動塊633的側面安裝有臂型外殼681,所述臂型外殼681支撐軸方向為X軸方向的主軸680且主軸680能旋轉。然後,在配設於主軸680的+X方向側的前端之連接構件616安裝有連結塊614,所述連結塊614透過握持部側拉伸負載測量部67的上下方向負載測量壓電元件673支撐握持部61。在連結塊614安裝有夾具基部610,所述夾具基部610透過握持部側拉伸負載測量部67的水平方向負載測量壓電元件674支撐握持部61的握持夾具612。並且,雖然未圖示,但臂型外殼681成為能利用未圖示之滾珠螺桿機構等升降手段而在Z軸方向升降,且握持部61亦成為能在Z軸方向升降。An arm-type housing 681 is installed on the side of the movable block 633, and the arm-type housing 681 supports a main shaft 680 whose axis direction is the X-axis direction, and the main shaft 680 can rotate. Then, a connecting block 614 is attached to the connecting member 616 arranged at the front end of the +X direction side of the main shaft 680, and the connecting block 614 passes through the vertical load measuring piezoelectric element 673 of the grip side tensile load measuring section 67 Support grip 61. A clamp base 610 is installed on the connecting block 614, and the clamp base 610 supports the holding jig 612 of the holding part 61 through the horizontal load measuring piezoelectric element 674 of the holding part side tensile load measuring part 67. In addition, although not shown, the arm-type housing 681 can be raised and lowered in the Z-axis direction by a lifting means such as a ball screw mechanism not shown, and the grip 61 can also be raised and lowered in the Z-axis direction.

握持夾具612可在能互相接近及分開之一對握持板之間夾住握持對象,藉由主軸680進行旋轉,可改變相對於握持對象之角度。The holding fixture 612 can clamp the holding object between a pair of holding plates that can be close to and separated from each other, and the angle of the holding object can be changed by rotating the spindle 680.

測量施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載之拉伸負載測量部亦即握持部側拉伸負載測量部67,例如係由被形成為平板狀之鈦酸鋇等水平方向負載測量壓電元件674、與由同樣材料構成之平板狀的上下方向負載測量壓電元件673所構成。然後,上下方向負載測量壓電元件673被配設成以下狀態:在安裝於主軸680的前端側之塊狀的連接構件616的下表面與連結塊614的上表面之間,從Z軸方向被夾住。並且,水平方向負載測量壓電元件674被配設成以下狀態:藉由連結塊614與握持部61的夾具基部610,從Y軸方向兩側被夾住。The tensile load measuring part that measures the tensile load applied to the protective member 85 between the holding part 61 and the holding surface 502 of the holding means 50, that is, the holding part side tensile load measuring part 67, for example, is A horizontal load measuring piezoelectric element 674 such as barium titanate formed in a flat plate shape is composed of a flat vertical load measuring piezoelectric element 673 made of the same material. Then, the vertical load measuring piezoelectric element 673 is arranged in the following state: between the lower surface of the block-shaped connecting member 616 and the upper surface of the connecting block 614 mounted on the front end side of the main shaft 680, it is moved from the Z-axis direction Clamped. In addition, the horizontal load measuring piezoelectric element 674 is arranged in a state in which the connecting block 614 and the clamp base 610 of the grip 61 are clamped from both sides in the Y-axis direction.

圖5所示之旋轉滾筒211,例如其外形被形成為圓柱狀,且藉由未圖示之馬達,以X軸方向的軸心為軸而旋轉。旋轉滾筒211藉由抵接保護構件85,例如發揮以下作用:防止剝離保護構件85之際可能發生之圖6所示之樹脂膜87的斷裂。此外,旋轉滾筒211亦能在Y軸方向移動。The rotating drum 211 shown in FIG. 5, for example, has an outer shape formed in a cylindrical shape, and is rotated about the axis in the X-axis direction by a motor (not shown). By contacting the protective member 85, the rotating drum 211 performs the following function, for example, to prevent breakage of the resin film 87 shown in FIG. 6 that may occur when the protective member 85 is peeled off. In addition, the rotating drum 211 can also move in the Y-axis direction.

載置已從板狀工件80剝離之保護構件85之載置台27,例如其外形為大致長方形狀,且具備柵狀的載置面。亦即,載置台27成為下述構成:以將板狀的直線材271的長邊方向作為Y軸方向而在X軸方向保持等間隔而形成間隙之方式,使板狀的直線材271並列地排列,並將各直線材271的+Y軸方向側的一端利用未圖示之棒狀的連結具連結並固定。例如,載置台27係藉由連結各直線材271之未圖示的棒狀的連結具而被固定於柱體21的+X方向側側面,且被配設於握持部61的移動路徑下。The mounting table 27 on which the protective member 85 peeled from the plate-shaped workpiece 80 is mounted has, for example, an outer shape of a substantially rectangular shape and a grid-shaped mounting surface. That is, the mounting table 27 has a configuration in which the longitudinal direction of the plate-shaped linear material 271 is set in the Y-axis direction, while the X-axis direction is kept at equal intervals to form gaps, and the plate-shaped linear materials 271 are arranged side by side. They are arranged, and one end on the +Y-axis direction side of each linear material 271 is connected and fixed by a rod-shaped connecting tool not shown. For example, the mounting table 27 is fixed to the side surface of the column 21 in the +X direction by connecting the linear members 271 with a rod-shaped connecting tool (not shown), and is arranged under the movement path of the grip 61 .

使載置台27上的保護構件85落下之落下手段26係由下述構件所構成:滾珠螺桿260,其具有Y軸方向的軸心;一對導軌261,其被配設成與滾珠螺桿260平行;馬達262,其使滾珠螺桿260轉動;側視下大致L字形的可動構件263,其內部的螺帽與滾珠螺桿260螺合,且側部2631與導軌261滑動接觸;以及突出銷2634,其被配設於可動構件263。The dropping means 26 for dropping the protective member 85 on the mounting table 27 is composed of the following members: a ball screw 260 having an axis in the Y-axis direction; a pair of guide rails 261 arranged in parallel with the ball screw 260 Motor 262, which rotates the ball screw 260; side view of the substantially L-shaped movable member 263, its inner nut is screwed with the ball screw 260, and the side portion 2631 is in sliding contact with the guide rail 261; and the protruding pin 2634, which It is arranged on the movable member 263.

可動構件263例如具備:側部2631,其與滾珠螺桿260螺合;以及銷座部2632,其係以從側部2631的上端部分側面朝向+X方向側突出之方式形成。在銷座部2632的上表面配設有朝向+Z方向突出之兩個突出銷2634。各突出銷2634係在X軸方向僅分開預定距離地被配置,若馬達262使滾珠螺桿260轉動,則伴隨於此,可動構件263被導軌261引導而在Y軸方向移動,以使配設於可動構件263上之突出銷2634通過載置台27的各直線材271間的間隙之方式在Y軸方向移動。The movable member 263 includes, for example, a side portion 2631 that is screwed with the ball screw 260 and a pin seat portion 2632 that is formed to protrude from the upper end portion side surface of the side portion 2631 toward the +X direction side. Two protruding pins 2634 protruding in the +Z direction are arranged on the upper surface of the pin seat portion 2632. The protruding pins 2634 are arranged at a predetermined distance apart in the X-axis direction. When the motor 262 rotates the ball screw 260, the movable member 263 is guided by the guide rail 261 to move in the Y-axis direction to cause the The protruding pin 2634 on the movable member 263 moves in the Y-axis direction through the gap between the linear members 271 of the mounting table 27.

在底座20上配設有容納已被剝離之保護構件85之垃圾箱28。垃圾箱28係例如外形被形成為大致長方體狀,且在載置台27的+Y方向側端的下方開口。在垃圾箱28的上部例如配設有穿透式的光感測器,所述穿透式的光感測器具備:發光部280(-Y方向側)與受光部281(+Y方向側)。從板狀工件80被剝離且被載置於載置台27上之保護構件85係藉由落下手段26而落入垃圾箱28內,保護構件85在垃圾箱28內堆積直到預定高度,從發光部280所射出之檢査光會被保護構件85遮住,而受光部281的受光量減少,藉此光感測器檢測垃圾箱28內已積存應回收的量的保護構件85。The base 20 is provided with a trash box 28 that contains the protective member 85 that has been peeled off. The trash box 28 is formed in a substantially rectangular parallelepiped shape, for example, and is opened below the +Y direction side end of the mounting table 27. For example, a transmissive photo sensor is arranged on the upper part of the trash bin 28, and the transmissive photo sensor includes a light-emitting part 280 (-Y direction side) and a light-receiving part 281 (+Y direction side) . The protective member 85 that is peeled from the plate-shaped workpiece 80 and placed on the mounting table 27 is dropped into the trash box 28 by the dropping means 26, and the protective member 85 is stacked in the trash box 28 to a predetermined height from the light emitting part The inspection light emitted by the 280 is shielded by the protective member 85, and the amount of light received by the light receiving portion 281 is reduced, whereby the light sensor detects the amount of the protective member 85 that should be collected in the trash bin 28.

例如,在柱體21的前表面中成為剝離手段6的握持部61的可動範圍內之位置安裝有工作台保持台22,且在工作台保持台22上配設有交接台221,所述交接台221載置剝離保護構件85之板狀工件80。交接台221可將載置於其保持面上之板狀工件80以例如將一側之面801朝向上側的狀態進行吸引保持。此外,亦可設為工作台保持台22上未配設交接台221之構成。For example, on the front surface of the column 21, a table holding table 22 is installed at a position within the movable range of the grip 61 of the peeling means 6, and a transfer table 221 is arranged on the table holding table 22. The transfer table 221 mounts the plate-shaped workpiece 80 of the peeling protection member 85. The transfer table 221 can suck and hold the plate-shaped workpiece 80 placed on its holding surface, for example, with the surface 801 on one side facing the upper side. In addition, it is also possible to have a configuration in which the transfer station 221 is not arranged on the workbench holding table 22.

在工作台保持台22上,係以交接台221為中心而在圓周方向隔開固定間隔地配設有多個(例如八個)外側部分剝離手段23,所述外側部分剝離手段23握持突出部850而將保護構件85的外側部分從板狀工件80剝離。此外,在圖5中,將外側部分剝離手段23的構成放大詳細顯示。On the table holding table 22, a plurality of (for example, eight) outer partial peeling means 23 are arranged at regular intervals in the circumferential direction with the transfer table 221 as the center, and the outer partial peeling means 23 grips the protrusions. The portion 850 peels the outer part of the protective member 85 from the plate-shaped workpiece 80. In addition, in FIG. 5, the structure of the outer part peeling means 23 is enlarged and shown in detail.

外側部分剝離手段23具備:突出部握持部230,其握持突出部850;未圖示之垂直移動部,其將突出部握持部230在Z軸方向(垂直方向)移動;以及水平移動部234,其將突出部握持部230在水平方向移動。The outer partial peeling means 23 is provided with: a protrusion holding part 230 that holds the protrusion 850; a vertical moving part (not shown) that moves the protrusion holding part 230 in the Z-axis direction (vertical direction); and horizontal movement 234, which moves the protrusion holding portion 230 in the horizontal direction.

如圖5所示,水平移動部234藉由馬達2340而使在水平方向延伸之滾珠螺桿2341轉動,藉此使突出部握持部230在交接台221的直徑方向往返移動,所述突出部握持部230係透過未圖示之垂直移動部而被配設於例如側視下形成為L字形之滑件2342上。未圖示之垂直移動部係例如由滾珠螺桿機構等所構成。As shown in FIG. 5, the horizontal moving portion 234 rotates the ball screw 2341 extending in the horizontal direction by the motor 2340, thereby causing the protrusion holding portion 230 to move back and forth in the diameter direction of the transfer platform 221, and the protrusion holding The holding portion 230 is disposed on, for example, a slider 2342 formed in an L shape in a side view through a vertical moving portion not shown. The not-shown vertical moving part is constituted by, for example, a ball screw mechanism.

突出部握持部230具備:大致長方體狀的握持台2301、配設於握持台2301的側面之汽缸機構2303、以及藉由汽缸機構2303而在Z軸方向上下移動之握持板2302,且可將握持對象夾在握持台2301的上表面與握持板2302的下表面之間。 各突出部握持部230係將握持板2302與握持台2301之間的開口部分朝向交接台221側而配設。The protrusion grip 230 includes a substantially rectangular parallelepiped gripping base 2301, a cylinder mechanism 2303 arranged on the side of the gripping base 2301, and a gripping plate 2302 that moves up and down in the Z-axis direction by the cylinder mechanism 2303, And the holding object can be clamped between the upper surface of the holding table 2301 and the lower surface of the holding plate 2302. Each protrusion grip 230 is arranged so that the opening between the grip plate 2302 and the grip base 2301 faces the transfer stand 221 side.

剝離裝置2例如具備進行裝置的各構成的控制之控制手段29,控制手段29係由遵循控制程式進行運算處理之CPU及記憶體等儲存媒體等所構成,且透過未圖示之有線或無線的通信路徑,與襯墊移動手段60、襯墊升降手段66以及握持部移動手段63等電氣連接,在由控制手段29所進行之襯墊移動手段60或襯墊升降手段66的控制下,進行已吸引保持板狀工件80之保持手段50在Y軸方向及Z軸方向的移動速度的控制、或對於握持部61等的對位的控制。並且,在由控制手段29所進行之握持部移動手段63的控制下,進行握持部61的移動速度的控制及對位的控制,所述握持部61握持保護板狀工件80之保護構件85的突出部850。並且,控制手段19可從襯墊側拉伸負載測量部64及握持部側拉伸負載測量部67接收關於各負載測量部所測量之拉伸負載的資訊。The peeling device 2 includes, for example, a control means 29 for controlling each component of the device. The control means 29 is composed of a storage medium such as a CPU and a memory that perform arithmetic processing in accordance with a control program, and is connected through a wired or wireless (not shown) The communication path is electrically connected to the pad moving means 60, the pad raising and lowering means 66, the grip moving means 63, etc., and is performed under the control of the pad moving means 60 or the pad raising and lowering means 66 performed by the control means 29 Control of the moving speed of the holding means 50 in the Y-axis direction and the Z-axis direction of the holding means 50 that has sucked and held the plate-shaped workpiece 80, or the control of the alignment of the grip 61 and the like. In addition, under the control of the grip moving means 63 performed by the control means 29, the control of the moving speed of the grip 61 and the control of the alignment are performed. The grip 61 holds and protects the plate-shaped workpiece 80 The protrusion 850 of the protection member 85. In addition, the control means 19 can receive information about the tensile load measured by each load measurement unit from the pad-side tensile load measurement unit 64 and the grip-side tensile load measurement unit 67.

例如,在襯墊移動手段的馬達602為伺服馬達之情形中,伺服馬達的旋轉編碼器與亦具有作為伺服放大器的功能之控制手段29連接,從控制手段29的輸出介面將操作訊號供給至伺服馬達後,將伺服馬達的旋轉數作為編碼器訊號而輸出至控制手段29的輸入介面。然後,接收到編碼器訊號之控制手段29以伺服馬達的旋轉角度為基準,逐次識別保持手段50的移動量,藉此可逐次識別保持手段50在Y軸方向的位置。For example, in the case where the motor 602 of the pad moving means is a servo motor, the rotary encoder of the servo motor is connected to the control means 29 which also functions as a servo amplifier, and the operation signal is supplied to the servo from the output interface of the control means 29 After the motor, the rotation number of the servo motor is output to the input interface of the control means 29 as an encoder signal. Then, the control means 29 receiving the encoder signal uses the rotation angle of the servo motor as a reference to successively identify the movement amount of the holding means 50, thereby successively identifying the position of the holding means 50 in the Y-axis direction.

以下說明圖5所示之將保護構件85從板狀工件80剝離之情形的剝離裝置2的操作。首先,將圖5所示之例如研削後的板狀工件80以使經研削之面的另一側之面801成為上側之方式載置於交接台221上。保持手段50往+Y方向移動,且以使保持面502的中心與板狀工件80的另一側之面801的中心大概一致之方式定位於板狀工件80的上方。再者,保持手段50下降,使保持面502與板狀工件80的另一側之面801接觸。再者,將藉由未圖示之吸引源進行吸引所產生之吸引力傳遞往保持面502,藉此保持手段50使保護構件85朝下而吸引保持板狀工件80的另一側之面801。The operation of the peeling device 2 in the case where the protective member 85 is peeled from the plate-shaped workpiece 80 shown in FIG. 5 will be described below. First, for example, the plate-shaped workpiece 80 after grinding as shown in FIG. 5 is placed on the transfer table 221 so that the surface 801 on the other side of the ground surface becomes the upper side. The holding means 50 moves in the +Y direction, and is positioned above the plate-shaped workpiece 80 so that the center of the holding surface 502 and the center of the surface 801 on the other side of the plate-shaped workpiece 80 approximately coincide. Furthermore, the holding means 50 is lowered to bring the holding surface 502 into contact with the surface 801 on the other side of the plate-shaped workpiece 80. Furthermore, the attraction force generated by the attraction source not shown in the figure is transferred to the holding surface 502, whereby the holding means 50 causes the protection member 85 to face downward to attract and hold the other side surface 801 of the plate-shaped workpiece 80 .

例如,已吸引保持板狀工件80之保持手段50上升,而使板狀工件80從交接台221上脫離。接著,藉由未圖示之垂直移動部,將突出部握持部230定位於可握持保護構件85的突出部850之預定高度位置。For example, the holding means 50 that has sucked and held the plate-shaped workpiece 80 rises, and the plate-shaped workpiece 80 is separated from the transfer table 221. Then, by a vertical moving part not shown, the protrusion holding part 230 is positioned at a predetermined height position where the protrusion 850 of the protection member 85 can be held.

並且,各水平移動部234使各突出部握持部230在水平方向移動,進行突出部握持部230與保護構件85的突出部850在直徑方向之對位。握持板2302藉由汽缸機構2303下降,突出部握持部230握持保護構件85的突出部850。此外,藉由突出部握持部230握持板狀工件80的保護構件85的突出部850等,亦可在已將板狀工件80保持於交接台221上之狀態下進行。In addition, each horizontal moving portion 234 moves each protrusion holding portion 230 in the horizontal direction, and aligns the protrusion holding portion 230 and the protrusion 850 of the protection member 85 in the diameter direction. The holding plate 2302 is lowered by the cylinder mechanism 2303, and the protrusion holding part 230 holds the protrusion 850 of the protection member 85. In addition, holding the protrusion 850 of the protective member 85 of the plate-shaped workpiece 80 by the protrusion-holding portion 230 can also be performed in a state where the plate-shaped workpiece 80 has been held on the transfer table 221.

接著,各水平移動部234使已握持板狀工件80的保護構件85的突出部850之各突出部握持部230朝向板狀工件80的直徑方向外側移動,藉此突出部850係藉由突出部握持部230而被朝向直徑方向外側拉伸並擴張。然後,藉由突出部握持部230的上述移動,藉由施加至附著於板狀工件80的外周部分之樹脂膜87(參考圖6)的擴張力、與在圓形薄片86與樹脂膜87之間發揮作用的接著力,而輕易地將附著於板狀工件80的外周部分上之樹脂膜87從板狀工件80的外周緣朝向直徑方向外側剝離。Next, each horizontal moving portion 234 moves each protrusion gripping portion 230 of the protrusion 850 of the protection member 85 that has gripped the plate-shaped workpiece 80 toward the outside in the diameter direction of the plate-shaped workpiece 80, whereby the protrusion 850 is moved by The protruding portion gripping portion 230 is stretched and expanded toward the outer side in the diameter direction. Then, by the above-mentioned movement of the protrusion holding portion 230, the expansion force applied to the resin film 87 (refer to FIG. 6) attached to the outer peripheral portion of the plate-shaped workpiece 80, and the circular sheet 86 and the resin film 87 The adhesive force acting therebetween can easily peel the resin film 87 attached to the outer peripheral portion of the plate-shaped workpiece 80 from the outer peripheral edge of the plate-shaped workpiece 80 toward the outer side in the diameter direction.

接著,例如,使各突出部握持部230下降直到預定的高度位置,將保護構件85的突出部850從板狀工件80往下方降低一定程度而剝離後,突出部握持部230放開保護構件85的突出部850。藉此,例如,以板狀工件80的中心為基準,在圓周方向以均等之角度,在板狀工件80的外周部分的至少共八處將突出部850部分地剝離。Next, for example, each protrusion holding portion 230 is lowered to a predetermined height position, and after the protrusion 850 of the protection member 85 is lowered to a certain extent from the plate-shaped workpiece 80 and peeled off, the protrusion holding portion 230 is released from the protection The protrusion 850 of the member 85. Thereby, for example, with the center of the plate-shaped workpiece 80 as a reference, the protrusions 850 are partially peeled off at least a total of eight locations in the outer peripheral portion of the plate-shaped workpiece 80 at an equal angle in the circumferential direction.

接著,已吸引保持板狀工件80之保持手段50往-Y方向移動直到位於旋轉滾筒211的上方後會下降,使旋轉滾筒211的側面抵接保護構件85的下表面的+Y方向側的外周部附近。如圖6所示,握持部移動手段63使握持部61往-Y方向移動,進行握持夾具612與保護構件85的突出部850之對位,握持夾具612握持突出部850。在圖6所示之例中,握持部61握持保護構件85的外側部分之中未從板狀工件80剝離之外側部分的突出部850,但亦可握持保護構件85的外側部分之中進行從板狀工件80的剝離之外側部分的突出部850(圖6中的-Y方向側的突出部850)。Next, the holding means 50 that has sucked and held the plate-shaped workpiece 80 moves in the -Y direction until it is located above the rotating drum 211 and then descends so that the side surface of the rotating drum 211 abuts against the outer periphery of the lower surface of the protective member 85 on the +Y direction side Department near. As shown in FIG. 6, the holding part moving means 63 moves the holding part 61 in the −Y direction to align the holding jig 612 with the protruding part 850 of the protection member 85, and the holding jig 612 holds the protruding part 850. In the example shown in FIG. 6, the grip portion 61 grips the outer portion of the protective member 85 that does not peel off the outer portion of the protrusion 850 from the plate-shaped workpiece 80, but it may also grip the outer portion of the protective member 85 The protrusion 850 (the protrusion 850 on the -Y direction side in FIG. 6) of the outer portion from the plate-shaped workpiece 80 is peeled off.

例如,如圖6所示,握持夾具612握持突出部850後,握持夾具612往+Y方向側稍微移動,將樹脂膜87的外周部分從板狀工件80的外周緣剝離。接著,如圖7至圖8所示,從+X方向側觀看,主軸680往順時針方向旋轉180度,藉此在旋轉滾筒211支撐保護構件85的下表面側之狀態下,保護構件85的樹脂膜87沿著旋轉滾筒211的側面而平緩地彎曲,且藉由握持夾具612將保護構件85朝向-Z方向拉伸,藉此將保護構件85的一部分從板狀工件80的一側之面800剝離。For example, as shown in FIG. 6, after the gripping jig 612 grips the protrusion 850, the gripping jig 612 slightly moves to the +Y direction side, and the outer peripheral portion of the resin film 87 is peeled from the outer peripheral edge of the plate-shaped workpiece 80. Next, as shown in FIGS. 7 to 8, when viewed from the +X direction side, the main shaft 680 rotates 180 degrees in the clockwise direction, whereby when the rotating drum 211 supports the lower surface side of the protection member 85, the protection member 85 The resin film 87 is gently curved along the side of the rotating drum 211, and the protective member 85 is stretched toward the -Z direction by the gripping jig 612, thereby pulling a part of the protective member 85 from one side of the plate-shaped workpiece 80 Face 800 peeled off.

(在剝離裝置2中剝離保護構件85的實施方式C) 在進一步剝離保護構件85中,使保持手段50在Y軸方向移動。或者,說明使握持部61相對於保持手段50的保持面502在Y軸方向移動之情形。(Embodiment C in which the protective member 85 is peeled off in the peeling device 2) In further peeling the protective member 85, the holding means 50 is moved in the Y-axis direction. Alternatively, a case where the grip 61 is moved in the Y-axis direction with respect to the holding surface 502 of the holding means 50 will be described.

藉由圖5所示之握持部移動手段63,如圖9所示,使握持部61往-Y方向移動。並且,亦可藉由襯墊移動手段60(參考圖5)使保持手段50往+Y方向移動。使握持部61相對地從板狀工件80的外周緣朝向中心在直徑方向移動,將保護構件85從板狀工件80逐漸剝離。並且,旋轉滾筒211係以X軸方向的軸心為軸進行旋轉,並維持保護構件85的樹脂膜87沿著旋轉滾筒211的側面平緩地彎曲之狀態,且將保護構件85從板狀工件80的+Y方向側的外周緣朝向板狀工件80的中央逐漸剝離。若在剝離保護構件85的期間發生樹脂膜87斷裂,則會有剝離後樹脂膜87仍部分地殘留於板狀工件80、或因樹脂斷裂所產生之反作用力而從樹脂膜87對板狀工件80的一側之面800瞬間地施加衝力而導致板狀工件80的一側之面800損傷之情形,但藉由旋轉滾筒211的側面抵接圓形薄片86,可防止發生此種問題。By the grip moving means 63 shown in FIG. 5, as shown in FIG. 9, the grip 61 is moved in the -Y direction. In addition, the holding means 50 may be moved in the +Y direction by the pad moving means 60 (refer to FIG. 5). The grip portion 61 is relatively moved in the diametrical direction from the outer peripheral edge of the plate-shaped workpiece 80 toward the center, and the protective member 85 is gradually peeled off from the plate-shaped workpiece 80. In addition, the rotating drum 211 rotates around the axis in the X-axis direction, and maintains the state that the resin film 87 of the protective member 85 is gently curved along the side surface of the rotating drum 211, and the protective member 85 is removed from the plate-shaped workpiece 80 The outer peripheral edge on the +Y direction side gradually peels off toward the center of the plate-shaped workpiece 80. If the resin film 87 is broken during the peeling of the protective member 85, the resin film 87 may still partially remain on the plate-shaped workpiece 80 after the peeling, or the resin film 87 may react to the plate-shaped workpiece due to the reaction force generated by the resin fracture. The side surface 800 on one side of 80 is momentarily impulsive and the side surface 800 on the side of the plate-shaped workpiece 80 is damaged. However, the side surface of the rotating drum 211 abuts against the circular sheet 86 to prevent such a problem.

在本實施方式中,在將保護構件85從上述板狀工件80剝離中,握持部側拉伸負載測量部67可正確地測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載。In this embodiment, in peeling the protective member 85 from the plate-like workpiece 80, the grip-side tensile load measuring section 67 can accurately measure the protection applied between the grip 61 and the holding surface 502. Tensile load of member 85.

例如,由握持部側拉伸負載測量部67所進行之拉伸負載的測量,係藉由上下方向負載測量壓電元件673與水平方向負載測量壓電元件674而進行。 在圖9中,箭頭F3表示施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載F3。而且,由於板狀工件80與握持部61在Z軸方向分開預定距離,故拉伸負載F3係將圖9所示之方向為-Y方向的Y軸方向拉伸負載Fy3與方向為-Z方向的Z軸方向拉伸負載Fz3進行合成而成之拉伸負載F3。然後,由畢氏定理成立下述式6。 (Y軸方向拉伸負載Fy3)2 +(Z軸方向拉伸負載Fz3)2 = (拉伸負載F3)2 ・・・・(式6)For example, the tensile load measurement performed by the grip side tensile load measuring unit 67 is performed by the vertical load measuring piezoelectric element 673 and the horizontal load measuring piezoelectric element 674. In FIG. 9, an arrow F3 indicates a tensile load F3 applied to the protective member 85 interposed between the grip 61 and the holding surface 502 of the holding means 50. Moreover, since the plate-shaped workpiece 80 and the grip 61 are separated by a predetermined distance in the Z-axis direction, the tensile load F3 is the Y-axis tensile load Fy3 and the direction shown in FIG. 9 as the -Y direction. The tensile load Fz3 in the Z-axis direction in the direction of the composite is the tensile load F3. Then, the following equation 6 is established by Pythot's theorem. (Tensile load Fy3 in the Y-axis direction) 2 + (Tensile load Fz3 in the Z-axis direction) 2 = (Tensile load F3) 2 ・・・・ (Equation 6)

在此,藉由水平方向負載測量壓電元件674,在每隔預定的時間間隔時,準確地測量Y軸方向拉伸負載Fy3,在每次測量時將負載檢測訊號發送至控制手段29。並且,藉由上下方向負載測量壓電元件673,在每隔預定的時間間隔時,準確地測量Z軸方向拉伸負載Fz3,在每次測量時將負載檢測訊號發送至控制手段29。Here, the piezoelectric element 674 is measured by the horizontal load, and the Y-axis tensile load Fy3 is accurately measured at predetermined time intervals, and the load detection signal is sent to the control means 29 for each measurement. In addition, the piezoelectric element 673 is measured by the vertical load measurement, and the Z-axis tensile load Fz3 is accurately measured at predetermined time intervals, and the load detection signal is sent to the control means 29 at each measurement.

控制手段29進行將針對Y軸方向拉伸負載Fy3的實測值與針對Z軸方向拉伸負載Fz3的實測值代入式6之運算處理,在每隔預定的時間間隔時,測量拉伸負載F3。然後,控制手段29將在每隔預定的時間間隔時所測量之拉伸負載F3使用作為用於使由剝離手段6所進行之保護構件85的剝離操作最佳化的資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F3的值,例如,藉由控制手段29將由握持部移動手段63所進行之握持部61的移動速度最佳化。其結果成為下述狀態:在握持部61將保護構件85剝離之際的拉伸負載F3會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由握持部61所進行之剝離速度亦不會太慢,不浪費時間地將保護構件85逐漸從板狀工件80剝離。The control means 29 performs a calculation process of substituting the actual measurement value for the Y-axis direction tensile load Fy3 and the actual measurement value for the Z-axis direction tensile load Fz3 into Equation 6, and measures the tensile load F3 at predetermined time intervals. Then, the control means 29 uses the tensile load F3 measured at every predetermined time interval as information for optimizing the peeling operation of the protective member 85 by the peeling means 6. That is, by the value of the tensile load F3 measured at every predetermined time interval, for example, the moving speed of the grip 61 by the grip moving means 63 is optimized by the control means 29 . The result is a state where the tensile load F3 when the holding part 61 peels off the protective member 85 is feedback controlled so that the plate-like workpiece 80 will not be broken or glue residue will not occur on the plate-like workpiece 80. The best tensile load. In addition, the peeling speed by the grip 61 is not too slow, and the protective member 85 is gradually peeled from the plate-shaped workpiece 80 without wasting time.

若將保護構件85從板狀工件80的一側之面800完全剝離,則握持保護構件85的突出部850之握持部61移動直到圖5所示之載置台27上。然後,握持部61解除突出部850的握持,使保護構件85落下至載置台27上。When the protective member 85 is completely peeled off from the surface 800 on one side of the plate-shaped workpiece 80, the grip 61 holding the protruding portion 850 of the protective member 85 moves to the mounting table 27 shown in FIG. 5. Then, the grip 61 releases the grip of the protrusion 850, and the protective member 85 is dropped onto the mounting table 27.

(在剝離裝置2中剝離保護構件85的實施方式D) 說明在剝離保護構件85中,使保持手段50在Y軸方向移動,且如實施方式C般不使握持部61在Y軸方向移動之情形。在此情形中,例如,旋轉滾筒211係在與保持手段50的移動方向相同的方向移動。在本情形中,如圖10所示,已從圖7所示之狀態旋轉180度之握持部61停止在預定的高度位置及Y軸方向的位置P3,圖5所示之控制手段29識別握持部61所位於之高度位置及Y軸方向的位置P3。(Embodiment D in which the protective member 85 is peeled off in the peeling device 2) In the peeling protection member 85, the case where the holding means 50 is moved in the Y-axis direction and the grip 61 is not moved in the Y-axis direction as in the embodiment C will be described. In this case, for example, the rotating drum 211 moves in the same direction as the moving direction of the holding means 50. In this case, as shown in FIG. 10, the grip 61 that has been rotated 180 degrees from the state shown in FIG. 7 stops at a predetermined height position and a position P3 in the Y-axis direction, and the control means 29 shown in FIG. 5 recognizes The height position where the grip 61 is located and the position P3 in the Y-axis direction.

藉由襯墊移動手段60使保持手段50往+Y方向移動,使停止移動之握持部61相對地從板狀工件80的外周緣朝向中心在直徑方向移動,將保護構件85從板狀工件80逐漸剝離。此外,旋轉滾筒211的側面抵接圓形薄片86,藉此防止樹脂膜87的破裂等。The holding means 50 is moved in the +Y direction by the pad moving means 60, and the holding part 61 stopped moving relatively moves in the diameter direction from the outer periphery of the plate-shaped workpiece 80 toward the center, and the protective member 85 is moved from the plate-shaped workpiece 80 gradually peeled off. In addition, the side surface of the rotating drum 211 abuts on the circular sheet 86, thereby preventing cracks and the like of the resin film 87.

在本實施方式中,在將保護構件85從上述板狀工件80剝離中,襯墊側拉伸負載測量部64測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載。在圖10中,箭頭F4表示施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載F4。而且,拉伸負載F4係將圖10所示之方向為-Y方向的Y軸方向拉伸負載Fy4與方向為-Z方向的Z軸方向拉伸負載Fz4進行合成而成之拉伸負載F4。In this embodiment, when the protective member 85 is peeled from the plate-shaped workpiece 80, the pad side tensile load measuring section 64 measures the tensile force applied to the protective member 85 between the grip 61 and the holding surface 502. Stretch the load. In FIG. 10, an arrow F4 represents a tensile load F4 applied to the protective member 85 interposed between the grip 61 and the holding surface 502 of the holding means 50. Furthermore, the tensile load F4 is a tensile load F4 obtained by combining a Y-axis direction tensile load Fy4 with a direction of -Y shown in FIG. 10 and a Z-axis direction tensile load Fz4 with a direction of -Z direction.

圖10所示之箭頭R4係第一襯墊側拉伸負載測量部641可在Z軸方向在每隔預定的時間間隔時測量之第一測量負載R4。第一測量負載R4例如具有+Z方向的方向。箭頭R5係第二襯墊側拉伸負載測量部642可在Z軸方向在每隔預定的時間間隔時測量之第二測量負載R5。第二測量負載R5例如具有-Z方向的方向。第一襯墊側拉伸負載測量部641與第二襯墊側拉伸負載測量部642在Y軸方向的距離L4係控制手段29預先識別之裝置設計值,且成為常數。The arrow R4 shown in FIG. 10 indicates the first measurement load R4 that the first pad side tensile load measurement unit 641 can measure at predetermined time intervals in the Z-axis direction. The first measurement load R4 has a direction of the +Z direction, for example. The arrow R5 indicates the second measurement load R5 that the second pad side tensile load measurement unit 642 can measure at predetermined time intervals in the Z-axis direction. The second measurement load R5 has, for example, a direction of the -Z direction. The distance L4 between the first pad side tensile load measuring unit 641 and the second pad side tensile load measuring unit 642 in the Y-axis direction is a device design value previously recognized by the control means 29 and becomes a constant.

從第一襯墊側拉伸負載測量部641起至在Y軸方向的移動停止而位於位置P3的握持部61為止之Y軸方向的變化距離M1,係藉由保持手段50在Y軸方向移動而變化之變數。此外,藉由從圖5所示之襯墊移動手段60的馬達602(伺服馬達602)的旋轉編碼器回饋至控制手段29之編碼器訊號,控制手段29可掌握與可動板601一起移動之第一襯墊側拉伸負載測量部641的位置,因此控制手段29亦可在每隔預定的時間間隔時逐次識別該變化距離M1的值。第一襯墊側拉伸負載測量部641與停止於位置P3之握持部61在Z軸方向的距離N1係控制手段29預先識別之裝置設計值,且成為常數。The change distance M1 in the Y-axis direction from the first pad side tensile load measuring portion 641 to the grip portion 61 at the position P3 when the movement in the Y-axis direction stops, is in the Y-axis direction by the holding means 50 Variables that move and change. In addition, by feeding back from the rotary encoder of the motor 602 (servo motor 602) of the pad moving means 60 shown in FIG. The position of the tensile load measuring part 641 on the side of the pad, so the control means 29 can also sequentially recognize the value of the change distance M1 at predetermined time intervals. The distance N1 in the Z-axis direction between the first pad side tensile load measuring portion 641 and the grip portion 61 stopped at the position P3 is a device design value previously recognized by the control means 29 and becomes a constant.

由畢氏定理成立下述式7。 (Y軸方向拉伸負載Fy4)2 +(Z軸方向拉伸負載Fz4)2 = (拉伸負載F4)2 ・・・・(式7) 並且,由於在Z軸方向的力的平衡,成立下述式8。 (Z軸方向拉伸負載Fz4)=(第一測量負載R4)+(第二測量負載R5)・・・・(式8)According to Pythagorean theorem, the following formula 7 is established. (Tensile load Fy4 in the Y-axis direction) 2 + (Tensile load Fz4 in the Z-axis direction) 2 = (Tensile load F4) 2 ・・・・(Equation 7) Also, due to the balance of the forces in the Z-axis direction, it holds The following formula 8. (Z-axis tensile load Fz4) = (first measurement load R4) + (second measurement load R5) ・・・・ (Equation 8)

再者,由於在將第一襯墊側拉伸負載測量部641假設成原點之情形中,第一襯墊側拉伸負載測量部641周圍的力矩的平衡,故成立下述式9。 (Y軸方向拉伸負載Fy4)×(距離N1)=(第二測量負載R5)×(距離L4)+(Z軸方向拉伸負載Fz4)×(變化距離M1)・・・・(式9)In addition, in the case where the first pad-side tensile load measuring part 641 is assumed to be the origin, the balance of the moment around the first pad-side tensile load measuring part 641, the following equation 9 is established. (Y-axis tensile load Fy4) × (distance N1) = (second measurement load R5) × (distance L4) + (Z-axis tensile load Fz4) × (change distance M1) ・・・・ (Equation 9 )

由式8,控制手段29可在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz4。並且,由將式9變形而成之下述式10,控制手段29可在每隔預定的時間間隔時測量Y軸方向拉伸負載Fy4。 (Y軸方向拉伸負載Fy4)={(第二測量負載R5)×(距離L4)+(Z軸方向拉伸負載Fz4)×(變化距離M1)}/(距離N1)・・・・(式10)According to Equation 8, the control means 29 can measure the tensile load Fz4 in the Z-axis direction every predetermined time interval. In addition, the control means 29 can measure the tensile load Fy4 in the Y-axis direction at predetermined time intervals from the following equation 10, which is obtained by deforming the equation 9. (Tensile load in the Y-axis direction Fy4)={(second measured load R5)×(distance L4)+(Tensile load in the Z-axis direction Fz4)×(change distance M1)}/(distance N1)・・・・( Equation 10)

控制手段29進行將針對Y軸方向拉伸負載Fy4的值與針對Z軸方向拉伸負載Fz4的值代入式7之運算處理,在每隔預定的時間間隔時測量拉伸負載F4。然後,控制手段29將在每隔預定的時間間隔時所測量之拉伸負載F4使用作為用於使由剝離手段6所進行之保護構件85的剝離操作最佳化的資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F4的值,例如,藉由控制手段29將由襯墊移動手段60所進行之保持手段50的移動速度最佳化。其結果成為下述狀態:在握持部61將已與保護構件85成為一體之剝離膠膜83剝離之際的拉伸負載F4會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由相對於移動之保持手段50而在Y軸方向相對地移動之握持部61所進行之剝離速度亦不會太慢,不浪費時間地將保護構件85逐漸從板狀工件80剝離。The control means 29 performs a calculation process of substituting the value of the tensile load Fy4 in the Y-axis direction and the value of the tensile load Fz4 in the Z-axis direction into Equation 7, and measures the tensile load F4 at predetermined time intervals. Then, the control means 29 uses the tensile load F4 measured at every predetermined time interval as information for optimizing the peeling operation of the protective member 85 by the peeling means 6. That is, with the value of the tensile load F4 measured at every predetermined time interval, for example, the moving speed of the holding means 50 by the pad moving means 60 is optimized by the control means 29. The result is a state where the tensile load F4 when the holding portion 61 peels off the peeling film 83 integrated with the protective member 85 will be fed back so that the plate-shaped workpiece 80 will not be broken or become plate-shaped. The optimal tensile load such as residual glue does not occur on the workpiece 80. In addition, the peeling speed by the holding portion 61 relatively moving in the Y-axis direction with respect to the moving holding means 50 is not too slow, and the protective member 85 is gradually peeled off the plate-shaped workpiece 80 without wasting time.

若將保護構件85從板狀工件80的一側之面800完全剝離,則握持保護構件85的突出部850之握持部61移動直到圖5所示之載置台27上。然後,握持部61解除突出部850的握持,使保護構件85落下至載置台27上。When the protective member 85 is completely peeled off from the surface 800 on one side of the plate-shaped workpiece 80, the grip 61 holding the protruding portion 850 of the protective member 85 moves to the mounting table 27 shown in FIG. 5. Then, the grip 61 releases the grip of the protrusion 850, and the protective member 85 is dropped onto the mounting table 27.

80:板狀工件 800:一側之面 801:另一側之面 806:切口部 82:切割膠膜 84:環狀框架 81:保護膠膜(保護構件) 1:第一實施方式的剝離裝置 10:基台 19:控制手段 17:回收箱 30:保持手段 300:吸附部 302:保持面 301:框體 31:支撐部 32:框架固定手段 33:活塞機構 34:部分剝離部 341:貫通孔 342:上推銷 346:閥 347:流體供給源 345:上下驅動部 83:剝離膠膜 831:膠膜滾筒 4:剝離手段 13:工作台移動手段 130:滾珠螺桿 132:馬達 133:可動構件 35:工作台側拉伸負載測量部 351:第一工作台側拉伸負載測量部 352:第二工作台側拉伸負載測量部 40:膠膜切斷手段 400:載置台 401:切斷器 402:切斷器移動手段 403:切斷器升降手段 41:握持部 412:一對握持爪 4121:固定爪 4122:可動爪 48:握持部支撐部 480:支撐台 483:活塞桿 484:壓缸管 42:剝離膠膜供給手段 420:捲筒 421:一對導引滾筒 422:一對送出滾筒 44:剝離膠膜黏貼手段 440:支撐台 441:壓接板升降機構 442:壓接板 46:X軸方向移動手段 460:滾珠螺桿 462:馬達 47:握持部側拉伸負載測量部 471:上下方向負載測量壓電元件 472:水平方向負載測量壓電元件 85:保護構件 86:圓形薄片 87:樹脂膜 850:突出部 2:第二實施方式的剝離裝置 20:底座 21:柱體 50:保持手段 500:吸附部 502:保持面 509:吸引管 52:臂部 53:支撐部 6:剝離手段 60:襯墊移動手段 602:馬達 600:滾珠螺桿 601:可動板 61:握持部 612:握持夾具 610:夾具基部 614:連結塊 616:連接構件 67:握持部側拉伸負載測量部 673:上下方向負載測量壓電元件 674:水平方向負載測量壓電元件 63:握持部移動手段 630:滾珠螺桿 631:一對導軌 632:馬達 633:可動塊 680:主軸 681:臂型外殼 64:襯墊側拉伸負載測量部 641:第一襯墊側拉伸負載測量部 642:第二襯墊側拉伸負載測量部 66:襯墊升降手段 660:滾珠螺桿 662:馬達 661:可動板 211:旋轉滾筒 27:載置台 26:落下手段 28:垃圾箱 29:控制手段80: Plate-shaped workpiece 800: One side face 801: The other side 806: Notch 82: cutting film 84: ring frame 81: Protective film (protective member) 1: The peeling device of the first embodiment 10: Abutment 19: Control 17: Recycle bin 30: Keep the means 300: Adsorption part 302: keep face 301: Frame 31: Support 32: Frame fixing means 33: Piston mechanism 34: Partially peeled part 341: Through hole 342: Promotion 346: Valve 347: fluid supply source 345: Up and down drive 83: Peel off the film 831: Film Roller 4: Stripping method 13: Workbench moving means 130: Ball screw 132: Motor 133: movable member 35: Tensile load measuring part on the worktable side 351: Tensile load measuring part on the side of the first worktable 352: The second worktable side tensile load measuring part 40: Film cutting means 400: Mounting table 401: Cutter 402: Cutting Device Moving Means 403: Cutter lifting means 41: Grip 412: A pair of gripping claws 4121: fixed claw 4122: Movable claw 48: Grip support part 480: support table 483: Piston Rod 484: Cylinder tube 42: Stripping film supply means 420: reel 421: A pair of guide rollers 422: A pair of delivery rollers 44: Peel off the adhesive film sticking method 440: support table 441: Crimping plate lifting mechanism 442: crimping plate 46: Means of movement in the X-axis direction 460: Ball screw 462: motor 47: Tensile load measuring part on the grip part side 471: up and down load measurement piezoelectric element 472: Piezoelectric element for horizontal load measurement 85: Protective member 86: round slice 87: Resin film 850: protrusion 2: The peeling device of the second embodiment 20: Base 21: Cylinder 50: keep the means 500: Adsorption part 502: keep face 509: Suction Tube 52: Arm 53: Support 6: Stripping means 60: Pad moving means 602: Motor 600: Ball screw 601: movable plate 61: Grip 612: Holding Fixture 610: Fixture base 614: connection block 616: connection member 67: Tensile load measuring part on the grip part side 673: up and down load measurement piezoelectric element 674: Piezoelectric element for horizontal load measurement 63: Grip moving means 630: Ball screw 631: a pair of rails 632: Motor 633: movable block 680: Spindle 681: Arm shell 64: Tensile load measuring part on pad side 641: First pad side tensile load measuring part 642: Second liner side tensile load measuring part 66: Pad lifting means 660: Ball screw 662: Motor 661: movable plate 211: Rotating drum 27: Mounting table 26: Falling means 28: trash can 29: Control

圖1係表示第一實施方式的剝離裝置之立體圖。 圖2係說明使保持手段在X軸方向移動,且一邊使握持部相對於保持手段的保持面朝向水平方向移動一邊藉由握持部側拉伸負載測量部測量拉伸負載,並將保護膠膜從板狀工件剝離之情形之剖面圖。 圖3係說明使保持手段在X軸方向移動且不使握持部移動,並藉由工作台側拉伸負載測量部測量拉伸負載,而將保護膠膜從板狀工件剝離之情形之剖面圖。 圖4係用於說明具備使板狀工件的切口部附近的保護膠膜從板狀工件剝離之部分剝離部之保持手段之剖面圖。 圖5係用於說明第二實施方式的剝離裝置之立體圖。 圖6係表示在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具握持突出部之狀態之剖面圖。 圖7係說明在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具將突出部的一部分從板狀工件的外周緣剝離之狀態之剖面圖。 圖8係說明在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具將突出部的一部分從板狀工件的外周緣剝離後,使保護構件沿著旋轉滾筒的側面之狀態之剖面圖。 圖9係說明使保持手段在Y軸方向移動,且一邊使握持部相對於保持手段的保持面朝向斜下方移動一邊藉由握持部側拉伸負載測量部測量拉伸負載,並從板狀工件將保護構件剝離之情形之剖面圖。 圖10係說明使保持手段在Y軸方向移動且不使握持部移動,並藉由襯墊側拉伸負載測量部測量拉伸負載,而將保護構件從板狀工件剝離之情形的剖面圖。FIG. 1 is a perspective view showing the peeling device of the first embodiment. Figure 2 illustrates that the holding means is moved in the X-axis direction, and the holding part is moved in the horizontal direction relative to the holding surface of the holding means while the holding part side tensile load measuring part measures the tensile load, and protects A cross-sectional view of the film peeling off the plate-shaped workpiece. Figure 3 is a cross-section illustrating the situation where the holding means is moved in the X-axis direction without moving the grip, and the tensile load is measured by the tensile load measuring part on the table side, and the protective film is peeled off from the plate-shaped workpiece picture. 4 is a cross-sectional view for explaining a holding means provided with a partial peeling portion for peeling the protective adhesive film near the cut portion of the plate-shaped workpiece from the plate-shaped workpiece. Fig. 5 is a perspective view for explaining the peeling device of the second embodiment. 6 is a cross-sectional view showing a state in which the gripping jig of the gripping portion grips the protruding portion when the peeling of the protective member is started in the peeling device of the second embodiment. 7 is a cross-sectional view illustrating a state in which the holding jig of the holding portion peels a part of the protrusion from the outer periphery of the plate-shaped workpiece when peeling of the protective member is started in the peeling device of the second embodiment. 8 illustrates that in the peeling device of the second embodiment, when peeling of the protective member is started, the holding jig of the holding portion peels off a part of the protrusion from the outer periphery of the plate-shaped workpiece, and then the protective member is rotated along Sectional view of the state of the side of the drum. Figure 9 illustrates that the holding means is moved in the Y-axis direction, and the holding part is moved obliquely downward with respect to the holding surface of the holding means while the tensile load is measured by the holding part side tensile load measuring part, and from the plate A cross-sectional view of the protective member peeled off from the shaped workpiece. 10 is a cross-sectional view illustrating a situation where the holding means is moved in the Y-axis direction without moving the grip, and the tensile load is measured by the liner side tensile load measuring part, and the protective member is peeled off from the plate-shaped workpiece .

80:板狀工件 80: Plate-shaped workpiece

800:一側之面 800: One side face

801:另一側之面 801: The other side

804:分割預定線 804: Divide the scheduled line

805:元件 805: component

82:切割膠膜 82: cutting film

84:環狀框架 84: ring frame

81:保護膠膜(保護構件) 81: Protective film (protective member)

1:第一實施方式的剝離裝置 1: The peeling device of the first embodiment

10:基台 10: Abutment

19:控制手段 19: Control

17:回收箱 17: Recycle bin

30:保持手段 30: Keep the means

300:吸附部 300: Adsorption part

302:保持面 302: keep face

301:框體 301: Frame

31:支撐部 31: Support

32:框架固定手段 32: Frame fixing means

33:活塞機構 33: Piston mechanism

83:剝離膠膜 83: Peel off the film

831:膠膜滾筒 831: Film Roller

4:剝離手段 4: Stripping method

13:工作台移動手段 13: Workbench moving means

130:滾珠螺桿 130: Ball screw

131:一對導軌 131: A pair of rails

132:馬達 132: Motor

133:可動構件 133: movable member

35:工作台側拉伸負載測量部 35: Tensile load measuring part on the worktable side

351:第一工作台側拉伸負載測量部 351: Tensile load measuring part on the side of the first worktable

352:第二工作台側拉伸負載測量部 352: The second worktable side tensile load measuring part

40:膠膜切斷手段 40: Film cutting means

400:載置台 400: Mounting table

401:切斷器 401: Cutter

402:切斷器移動手段 402: Cutting Device Moving Means

403:切斷器升降手段 403: Cutter lifting means

404:載置面 404: Mounting surface

405:槽 405: Slot

41:握持部 41: Grip

412:一對握持爪 412: A pair of gripping claws

4121:固定爪 4121: fixed claw

4122:可動爪 4122: Movable claw

48:握持部支撐部 48: Grip support part

480:支撐台 480: support table

483:活塞桿 483: Piston Rod

484:壓缸管 484: Cylinder tube

42:剝離膠膜供給手段 42: Stripping film supply means

420:捲筒 420: reel

421:一對導引滾筒 421: A pair of guide rollers

422:一對送出滾筒 422: A pair of delivery rollers

44:剝離膠膜黏貼手段 44: Peel off the adhesive film sticking method

440:支撐台 440: support table

441:壓接板升降機構 441: Crimping plate lifting mechanism

442:壓接板 442: crimping plate

46:X軸方向移動手段 46: Means of movement in the X-axis direction

460:滾珠螺桿 460: Ball screw

461:導軌 461: Rail

462:馬達 462: motor

463:可動板 463: movable plate

47:握持部側拉伸負載測量部 47: Tensile load measuring part on the grip part side

471:上下方向負載測量壓電元件 471: up and down load measurement piezoelectric element

472:水平方向負載測量壓電元件 472: Piezoelectric element for horizontal load measurement

Claims (6)

一種剝離裝置,其將保護板狀工件的一側之面之保護構件從該一側之面剝離,且具備: 保持手段,其藉由保持面保持該板狀工件的另一側之面;以及 剝離手段,其握持該保護構件的外周部分,該保護構件覆蓋被保持於該保持面之該板狀工件的該一側之面,將該保護構件從該板狀工件的外周朝向中央剝離,再從該中央往該外周的相反側的外周剝離, 該剝離手段包含:握持部,其握持該保護構件的外周部分;移動手段,其使該握持部與該保持手段在與該保持面平行之方向相對地移動,且使該握持部從該保持面的外周前往中心,使已通過該保持面的該中心之該握持部在一直線上往遠離該中心之方向移動;以及拉伸負載測量部,其測量施加至介於該握持部與該保持面之間的該保護構件之拉伸負載, 藉由該拉伸負載測量部測量施加至該保護構件之拉伸負載,藉此使該剝離手段的剝離操作最佳化。A peeling device, which peels a protective member that protects one side of a plate-shaped workpiece from the one side, and is provided with: Holding means, which holds the other side surface of the plate-shaped workpiece by the holding surface; and A peeling means for holding the outer peripheral portion of the protective member, the protective member covering the one surface of the plate-shaped workpiece held on the holding surface, and peeling the protective member from the outer peripheral portion of the plate-shaped workpiece toward the center, Then peel off from the center to the outer periphery on the opposite side of the outer periphery, The peeling means includes: a holding part that holds the outer peripheral portion of the protection member; a moving means that relatively moves the holding part and the holding means in a direction parallel to the holding surface, and makes the holding part From the outer periphery of the holding surface to the center, the grip part that has passed through the center of the holding surface is moved in a straight line away from the center; and a tensile load measuring part whose measurement is applied between the grip The tensile load of the protective member between the part and the holding surface, The tensile load measuring part measures the tensile load applied to the protective member, thereby optimizing the peeling operation of the peeling means. 如請求項1之剝離裝置,其中,所述拉伸負載測量部係由被配設於支撐所述保持手段之支撐部之壓電元件而成。The peeling device according to claim 1, wherein the tensile load measuring part is formed by a piezoelectric element arranged on a supporting part supporting the holding means. 如請求項1之剝離裝置,其中,所述拉伸負載測量部係由被配設於支撐所述握持部之握持部支撐部之壓電元件而成。The peeling device according to claim 1, wherein the tensile load measuring part is formed by a piezoelectric element arranged on a holding part supporting part supporting the holding part. 如請求項1至3中任一項之剝離裝置,其中, 所述保護構件係保護膠膜, 所述板狀工件在外周部分具有切口部, 所述保持手段包含部分剝離部,所述部分剝離部將位於該切口部之未黏貼於該板狀工件之該保護膠膜上推,使該切口部附近的該保護膠膜從該板狀工件剝離, 所述握持部握持藉由該部分剝離部而被剝離之該保護膠膜的外周部分。Such as the peeling device of any one of claims 1 to 3, wherein: The protective member is a protective film, The plate-shaped workpiece has a cut-out portion in an outer peripheral portion, The holding means includes a partially peeled portion that pushes the protective adhesive film located in the cut portion that is not adhered to the plate-shaped workpiece, so that the protective adhesive film near the cut portion is removed from the plate-shaped workpiece Stripping, The holding part holds the outer peripheral part of the protective adhesive film peeled off by the partial peeling part. 如請求項1至3中任一項之剝離裝置,其中, 所述保護構件係保護膠膜, 該保護膠膜的外周部分更具備黏貼剝離膠膜之剝離膠膜黏貼手段, 所述握持部握持已黏貼於該保護膠膜之該剝離膠膜以取代握持該保護膠膜的外周部分,所述拉伸負載測量部測量施加至該剝離膠膜之拉伸負載,該剝離膠膜係與介於該握持部與該保持面之間的該保護膠膜成為一體。Such as the peeling device of any one of claims 1 to 3, wherein: The protective member is a protective film, The outer peripheral part of the protective film is further equipped with peeling film sticking means for sticking peeling film, The gripping part holds the peeling adhesive film that has been adhered to the protective adhesive film instead of holding the outer peripheral part of the protective adhesive film, and the tensile load measuring part measures the tensile load applied to the peeling adhesive film, The peeling adhesive film is integrated with the protective adhesive film between the holding portion and the holding surface. 如請求項1至3中任一項之剝離裝置,其中, 所述保護構件具有從所述板狀工件的外周稍微突出之突出部, 所述握持部握持該突出部。Such as the peeling device of any one of claims 1 to 3, wherein: The protection member has a protrusion slightly protruding from the outer circumference of the plate-shaped workpiece, The gripping part grips the protruding part.
TW110105538A 2020-02-21 2021-02-18 Peeling apparatus which can prevent a wafer from cracking and no glue will remain on the wafer TW202133306A (en)

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