TW202133306A - Peeling apparatus which can prevent a wafer from cracking and no glue will remain on the wafer - Google Patents
Peeling apparatus which can prevent a wafer from cracking and no glue will remain on the wafer Download PDFInfo
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- TW202133306A TW202133306A TW110105538A TW110105538A TW202133306A TW 202133306 A TW202133306 A TW 202133306A TW 110105538 A TW110105538 A TW 110105538A TW 110105538 A TW110105538 A TW 110105538A TW 202133306 A TW202133306 A TW 202133306A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Abstract
Description
本發明關於將保護構件從板狀工件剝離之剝離裝置。The present invention relates to a peeling device for peeling a protective member from a plate-shaped workpiece.
膠膜安裝機可在一側之面已黏貼保護膠膜之晶圓的另一側之面及環形框架上黏貼切割膠膜,成為能透過切割膠膜而利用環形框架支撐晶圓之狀態。並且,在黏貼切割膠膜後,將黏貼於晶圓之保護膠膜剝離(例如,參考專利文獻1)。 [習知技術文獻] [專利文獻]The adhesive film mounting machine can paste a dicing film on the wafer on one side and the ring frame on the other side of the wafer with the protective film attached to it, so that the ring frame can support the wafer through the dicing film. In addition, after the dicing film is attached, the protective film attached to the wafer is peeled off (for example, refer to Patent Document 1). [Literature Technical Literature] [Patent Literature]
[專利文獻1]日本特開2015-167205號公報[Patent Document 1] JP 2015-167205 A
[發明所欲解決的課題] 在剝離保護膠膜之際,例如,使剝離膠膜黏貼於保護膠膜的外周部分,握持剝離膠膜並往離開晶圓之方向拉伸,藉此剝離保護膠膜。然而,若剝離保護膠膜之際拉伸保護膠膜的速度快,則有保護膠膜的膠可能殘留於晶圓的一側之面或可能使晶圓損壞之問題。相反的,若拉伸保護膠膜的速度慢,則有浪費時間而作業效率降低之問題。[The problem to be solved by the invention] When peeling off the protective adhesive film, for example, the peeling adhesive film is stuck to the outer peripheral part of the protective adhesive film, and the peeling adhesive film is held and stretched in a direction away from the wafer, thereby peeling off the protective adhesive film. However, if the speed of stretching the protective film when peeling off the protective film is fast, there is a problem that the protective film may remain on one side of the wafer or damage the wafer. On the contrary, if the speed of stretching the protective film is slow, there is a problem that time is wasted and work efficiency is reduced.
並且,保護膠膜的黏著力會依據在已黏貼保護膠膜之晶圓的一側之面上所形成之元件的種類等而異。亦即,即使是相同的保護膠膜,亦有被形成於晶圓之元件強力黏著之情形、及輕微黏著之情形,需要依據黏著力的差異而改變剝離時的拉伸力(拉伸速度)。In addition, the adhesive force of the protective adhesive film varies depending on the types of components formed on one side of the wafer to which the protective adhesive film has been attached. That is, even the same protective film, there are cases where the components formed on the wafer are strongly adhered or slightly adhered. It is necessary to change the tensile force (stretching speed) during peeling according to the difference in adhesion. .
再者,因拉力會依據圓形的保護膠膜在剝離開始初期的小剝離區域與保護膠膜已被剝離直到晶圓的中央附近時的大剝離區域而異,故晶圓所受之力也會依據保護膠膜被剝離之位置而異。然而,以往係逐漸加快剝離每個晶圓之剝離速度並重複剝離實驗,而決定預定的剝離速度並以該剝離速度逐步進行剝離,或設定具有絕不會使晶圓損壞之裕度的安全速度而逐步進行剝離,因此會浪費時間。Furthermore, because the pulling force varies according to the small peeling area of the circular protective film at the beginning of peeling and the large peeling area when the protective film has been peeled to near the center of the wafer, the force on the wafer is also different. It depends on where the protective film is peeled off. However, in the past, the peeling speed of each wafer was gradually increased and the peeling experiment was repeated, and the predetermined peeling speed was determined and the peeling was performed gradually at the peeling speed, or a safe speed with a margin that would never damage the wafer was set The peeling is carried out gradually, so time is wasted.
因此,本發明之目的係提供一種剝離裝置,其在將保護構件從晶圓剝離之際,使晶圓不會破裂或在晶圓上不會發生殘膠等,且能不浪費時間地將保護構件從晶圓剝離。Therefore, the object of the present invention is to provide a peeling device, which prevents the wafer from cracking or glue residue on the wafer when the protective member is peeled from the wafer, and the protection can be protected without wasting time. The component is peeled from the wafer.
[解決課題的技術手段] 根據本發明,提供一種剝離裝置,其將保護板狀工件的一側之面之保護構件從該一側之面剝離,且具備:保持手段,其藉由保持面保持該板狀工件的另一側之面;以及剝離手段,其握持保護構件的外周部分,該保護構件覆蓋被保持於該保持面之該板狀工件的該一側之面,將該保護構件從該板狀工件的外周朝向中央剝離,再從該中央往該外周的相反側的外周剝離,並且,該剝離手段包含:握持部,其握持該保護構件的外周部分;移動手段,其使該握持部與該保持手段在與該保持面平行之方向相對地移動,且使該握持部從該保持面的外周前往中心,使已通過該保持面的該中心之該握持部在一直線上往遠離該中心之方向移動;以及拉伸負載測量部,其測量施加至介於該握持部與該保持面之間的該保護構件之拉伸負載,並且,所述剝離裝置係藉由該拉伸負載測量部測量施加至該保護構件之拉伸負載,藉此使該剝離手段的剝離操作最佳化。[Technical means to solve the problem] According to the present invention, there is provided a peeling device that peels a protective member that protects one side of a plate-shaped workpiece from the one side surface, and is provided with a holding means that holds the other side of the plate-shaped workpiece by the holding surface Side surface; and peeling means, which grip the outer peripheral portion of the protective member, the protective member covering the surface of the side of the plate-shaped workpiece held on the holding surface, the protective member from the outer periphery of the plate-shaped workpiece Peel off toward the center, and then peel off from the center to the outer periphery on the opposite side of the outer periphery, and the peeling means includes: a grip portion that grips the outer peripheral portion of the protection member; and a moving means that makes the grip portion and the outer periphery of the The holding means relatively moves in a direction parallel to the holding surface, and moves the holding portion from the outer periphery of the holding surface to the center, so that the holding portion that has passed the center of the holding surface moves away from the center in a straight line And a tensile load measuring part, which measures the tensile load applied to the protective member between the holding part and the holding surface, and the peeling device is measured by the tensile load The tensile load applied to the protective member is measured partially, thereby optimizing the peeling operation of the peeling means.
較佳為,所述拉伸負載測量部係由被配設於支撐所述保持手段之支撐部之壓電元件而成。Preferably, the tensile load measuring part is formed by a piezoelectric element arranged on a supporting part supporting the holding means.
較佳為,所述拉伸負載測量部係由被配設於支撐所述握持部之握持部支撐部之壓電元件而成。Preferably, the tensile load measuring part is formed by a piezoelectric element arranged on a holding part supporting part supporting the holding part.
較佳為,所述保護構件係保護膠膜,所述板狀工件在外周部分具有切口部,所述保持手段包含部分剝離部,所述部分剝離部將位於該切口部之未黏貼於該板狀工件之該保護膠膜上推,使該切口部附近的該保護膠膜從該板狀工件剝離,所述握持部握持藉由該部分剝離部而被剝離之該保護膠膜的外周部分。Preferably, the protective member is a protective adhesive film, the plate-shaped workpiece has a cut-out portion on the outer peripheral portion, and the holding means includes a partially peeled portion, and the partially peeled portion will be located in the cut portion and not adhered to the plate The protective adhesive film of the shaped workpiece is pushed up, so that the protective adhesive film near the cut portion is peeled off from the plate-shaped workpiece, and the holding portion holds the outer periphery of the protective adhesive film peeled off by the partial peeling portion part.
較佳為,所述保護構件係保護膠膜,該保護膠膜的外周部分更具備黏貼剝離膠膜之剝離膠膜黏貼手段,所述握持部握持已黏貼於該保護膠膜之該剝離膠膜以取代握持該保護膠膜的外周部分,所述拉伸負載測量部測量施加至該剝離膠膜之拉伸負載,該剝離膠膜係與介於該握持部與該保持面之間的該保護膠膜成為一體。Preferably, the protective member is a protective adhesive film, and the outer peripheral portion of the protective adhesive film is further provided with a peeling adhesive film sticking means for sticking a peeling adhesive film, and the gripping portion holds the peeling adhesive film that has been attached to the protective adhesive film. Instead of holding the outer peripheral part of the protective adhesive film, the tensile load measuring part measures the tensile load applied to the peeling adhesive film. The protective film between them becomes one.
較佳為,所述保護構件具有從所述板狀工件的外周稍微突出之突出部,所述握持部握持該突出部。Preferably, the protection member has a protrusion slightly protruding from the outer periphery of the plate-shaped workpiece, and the gripping part grips the protrusion.
[發明功效] 根據本發明,藉由拉伸負載測量部測量施加至保護構件拉伸負載,藉此可使剝離手段的剝離操作最佳化。亦即,變得能使晶圓不會破裂或在晶圓上不會發生殘膠等,且不浪費時間地以最佳的剝離速度將保護構件從晶圓剝離。[Efficacy of invention] According to the present invention, the tensile load applied to the protective member is measured by the tensile load measuring part, whereby the peeling operation of the peeling means can be optimized. In other words, it becomes possible to prevent the wafer from cracking or causing adhesive residue on the wafer, and to peel the protective member from the wafer at an optimal peeling speed without wasting time.
若拉伸負載測量部係由被配設於支撐保持手段之支撐部之壓電元件而成,則變得能正確地測量施加至保護構件之拉伸負載。If the tensile load measuring part is formed of a piezoelectric element arranged on the supporting part of the supporting and holding means, it becomes possible to accurately measure the tensile load applied to the protective member.
若拉伸負載測量部係由被配設於支撐握持部之握持部支撐部之壓電元件而成,則變得能正確地測量施加至保護構件之拉伸負載。If the tensile load measuring part is formed of a piezoelectric element arranged on the holding part supporting part supporting the holding part, it becomes possible to accurately measure the tensile load applied to the protective member.
保護構件係保護膠膜,板狀工件在外周部分具備切口部,保持手段具備部分剝離部,所述部分剝離部將位於切口部之未黏貼於板狀工件之保護膠膜上推,使切口部附近的保護膠膜從板狀工件剝離,藉此握持部變得能輕易地握持藉由部分剝離部而被剝離之保護膠膜的外周部分。The protective member is a protective adhesive film. The plate-shaped workpiece is provided with a notch on the outer periphery, and the holding means is provided with a partial peeling portion that pushes the protective adhesive film located in the notched portion that is not adhered to the plate-shaped workpiece to make the cut portion The protective adhesive film in the vicinity is peeled off from the plate-shaped workpiece, whereby the gripping part can easily hold the outer peripheral part of the protective adhesive film peeled off by the partial peeling part.
保護構件係保護膠膜,保護膠膜的外周部分更具備黏貼剝離膠膜之剝離膠膜黏貼手段,藉此握持部握持已黏貼於保護膠膜之剝離膠膜以取代握持保護膠膜的外周部分,拉伸負載測量部測量施加至剝離膠膜之拉伸負載以取代測量施加至保護膠膜之拉伸負載,所述剝離膠膜係與介於握持部與保持面之間的保護膠膜成為一體,藉此變得能使剝離手段的剝離操作最佳化。The protective member is a protective film, and the outer peripheral part of the protective film is equipped with a peeling film sticking means for sticking a peeling film, whereby the gripping part holds the peeling film pasted to the protective film instead of holding the protective film Instead of measuring the tensile load applied to the protective film, the tensile load measuring part measures the tensile load applied to the peeling film, and the peeling film is between the grip and the holding surface The protective adhesive film is integrated, thereby making it possible to optimize the peeling operation of the peeling means.
保護構件具有從板狀工件的外周稍微突出之突出部,藉此握持部變得能輕易地握持保護構件之外周部分的突出部。The protection member has a protrusion slightly protruding from the outer circumference of the plate-shaped workpiece, whereby the gripping part becomes able to easily grip the protrusion of the outer circumference of the protection member.
(剝離裝置的第一實施方式)
圖1所示之第一實施方式的剝離裝置1係將保護膠膜81剝離之剝離裝置的一例,保護膠膜81係使用帶狀的剝離膠膜83而黏貼於板狀工件80在圖1中之上表面亦即一側之面800的保護構件,剝離裝置1至少具備:保持手段30,其藉由保持面302保持板狀工件80的另一側之面801;以及剝離手段4,其握持保護膠膜81的外周部分,保護膠膜81覆蓋被保持於保持面302之板狀工件80的一側之面800,將保護膠膜81從板狀工件80的外周朝向中央剝離,再從中央往外周的相反側的外周剝離。(First embodiment of peeling device)
The
圖1所示之板狀工件80例如為以矽作為母材且外形為圓形的半導體晶圓,其一側之面800被垂直交叉之多條分割預定線804劃分成網格狀,在被劃分成網格狀之各區域中分別形成有IC等元件805。
在本實施方式中,以覆蓋板狀工件80的一側之面800整面的方式所黏貼之保護構件,係例如具備基材層與基材層上的黏著層(膠層)之保護膠膜81,所述基材層係由具有一定程度的柔軟性之樹脂(例如,聚烯烴系樹脂等)而成。
此外,板狀工件80除了矽以外,亦可由砷化鎵、藍寶石、陶瓷、樹脂、氮化鎵或碳化矽等所構成,保護構件亦不限定於保護膠膜81。The plate-
例如,板狀工件80係在一側之面800的相反面亦即另一側之面801(圖1中的下表面)上黏貼有直徑大於板狀工件80的切割膠膜82。然後,切割膠膜82的膠層的外周部亦黏貼於環狀框架84,藉此板狀工件80透過切割膠膜82被支撐於環狀框架84,而能進行由環狀框架84所進行之處理。For example, the plate-
剝離裝置1具有在X軸方向延伸之長方體狀的基台10,在基台10之上配設有使保持手段30在X軸方向往返移動之工作台移動手段13。工作台移動手段13具備:滾珠螺桿130,其配設於基台10;馬達132,其與滾珠螺桿130的一端連接;一對導軌131,其與滾珠螺桿130平行地延伸;以及可動構件133,其能在X軸方向移動。在可動構件133的上表面透過支撐部31配設有保持手段30。在可動構件133的下表面與一對導軌131滑動接觸,配設於可動構件133的下表面之未圖示之螺帽與滾珠螺桿130螺合。滾珠螺桿130被馬達132驅動而轉動,藉此保持手段30與可動構件133一起沿著導軌131在X軸方向移動。The
工作台移動手段13為剝離手段4的一部分,且發揮作為移動手段的功能,使握持部41與保持手段30在與保持面302平行之X軸方向相對地移動,且使握持部41從保持面302的外周前往中心,再使已通過保持面302的中心之握持部41在一直線上往遠離中心之方向移動。The table moving means 13 is a part of the peeling means 4 and functions as a moving means. The
在本實施方式中,保持手段30為保持台,且具備:吸附部300,其係由多孔構件等而成且吸附板狀工件80;以及框體301,其支撐吸附部300。吸附部300與真空產生裝置等未圖示之吸引源連通,將藉由吸引源進行吸引而產生之吸引力傳遞至吸附部300的露出面亦即平坦之保持面302,藉此保持手段30可將板狀工件80吸引保持在保持面302上。In the present embodiment, the holding means 30 is a holding table, and includes: an
例如,保持手段30係周圍被固定環狀框架84之框架固定手段32所圍繞。俯視下具備環狀的外形且載置環狀框架84之框架固定手段32係成為藉由未圖示之吸引源所產生之吸引力而將環狀框架84吸引固定的構成,且藉由均等地配設於圓周方向之活塞機構33而成為能在Z軸方向(垂直方向)上下移動。此外,亦可在保持手段30的周圍配設多個藉由彈簧等使夾具開閉之機械夾具以取代框架固定手段32。For example, the periphery of the holding means 30 is surrounded by the frame fixing means 32 for fixing the
例如,剝離手段4具備由配設於支撐保持手段30之支撐部31之壓電元件而成之拉伸負載測量部35,以作為後述圖1所示之測量施加至介於握持部41與保持面302之間的保護膠膜81之拉伸負載之拉伸負載測量部。以下,將拉伸負載測量部35設為工作台側拉伸負載測量部35。For example, the
在本實施方式中,支撐保持手段30之支撐部31例如具備圓筒形狀,工作台側拉伸負載測量部35被配設於支撐部31與工作台移動手段13的可動構件133之連接部位。亦即,工作台側拉伸負載測量部35係以下述形式配設:從上下方向(Z軸方向)被夾於支撐部31與可動構件133之間,支撐裝設於支撐部31上之保持手段30的重量。然後,在本實施方式中,以在X軸方向對向的方式,於保持手段30的下方配設有2個工作台側拉伸負載測量部35。亦即,工作台側拉伸負載測量部35係由第一工作台側拉伸負載測量部351與第二工作台側拉伸負載測量部352所構成。In the present embodiment, the supporting
第一工作台側拉伸負載測量部351(第二工作台側拉伸負載測量部352)亦即壓電元件,例如係以鈦酸鋇(BaTiO3
)、鋯鈦酸鉛(PZT)、鈮酸鋰(LiNbO3
)或鉭酸鋰(LiTaO3
)等材料形成為平板狀或柱狀,且可將所承受之負載轉換成電壓訊號,並輸出至控制剝離裝置1的裝置整體之控制手段19。The first table side tensile load measuring part 351 (the second table side tensile load measuring part 352) is also a piezoelectric element, such as barium titanate (BaTiO 3 ), lead zirconate titanate (PZT), niobium Lithium oxide (LiNbO 3 ) or lithium tantalate (LiTaO 3 ) and other materials are formed into a plate or column shape, and the load can be converted into a voltage signal, and output to the control means 19 of the entire device that controls the
在保持手段30的移動路徑上方,配設有將被保持於保持手段30之板狀工件80的保護膠膜81進行剝離之剝離手段4,剝離手段4例如具備:膠膜切斷手段40,其以預定的長度切斷剝離膠膜83;剝離膠膜供給手段42,其從已將剝離膠膜83捲繞成滾筒狀的膠膜滾筒831拉出剝離膠膜83,並供給至已黏貼於板狀工件80的一側之面800之保護膠膜81;剝離膠膜黏貼手段44,其將剝離膠膜83黏貼於保護膠膜81的外周部分;握持部41,其握持已黏貼於保護膠膜81之剝離膠膜83;以及X軸方向移動手段46,其使剝離膠膜黏貼手段44及握持部41在X軸方向移動。Above the moving path of the holding means 30, a peeling means 4 for peeling off the
X軸方向移動手段46發揮作為移動手段的功能,使握持部41與保持手段30在與保持面302平行之X軸方向相對地移動,且使握持部41從保持面302的外周前往中心,再使已通過保持面302的中心之握持部41在一直線上往遠離中心之方向移動。
具體而言,X軸方向移動手段46具備:滾珠螺桿460,其具有X軸方向的軸心;一對導軌461,其被配設成與滾珠螺桿460平行;馬達462,其與滾珠螺桿460連結並使滾珠螺桿460轉動;以及可動板463,其內部的螺帽與滾珠螺桿460螺合,且側部與導軌461滑動接觸,若馬達462使滾珠螺桿460轉動,則伴隨於此,可動板463被導軌461引導而在X軸方向往返移動,被安裝於可動板463之剝離膠膜黏貼手段44及握持部41亦在X軸方向往返移動。The X-axis direction moving means 46 functions as a moving means, moving the holding
剝離膠膜供給手段42具備:捲筒420,其裝設有膠膜滾筒831;一對導引滾筒421,其將從膠膜滾筒831拉出之剝離膠膜83往下方引導;以及一對送出滾筒422,其被配置於一對導引滾筒421的下方側。藉由未圖示之控制機構對捲筒420施加逆張力,並調整張力狀況,以使從膠膜滾筒831拉出之剝離膠膜83不會產生鬆弛。一對導引滾筒421係將剝離膠膜83一邊夾持一邊往回捲而施加張力,並朝向一對送出滾筒422引導,一對送出滾筒422可將剝離膠膜83朝向握持部41送出。The peeling film supply means 42 includes: a
剝離膠膜83例如係由接著劑層與基材而成之兩層結構的熱封膜,所述接著劑層藉由加熱而接著於保護膠膜81的外周部分。基材的材質例如係由聚對苯二甲酸乙二醇酯等樹脂而成。接著劑層例如係由環氧樹脂等熱固性樹脂所構成。將剝離膠膜83對於保護膠膜81之黏著力設定成比保護膠膜81對於板狀工件80之黏著力更強。此剝離膠膜83係以接著劑層位於內側(在被拉伸之狀態中的下表面側)之狀態被捲繞而成為膠膜滾筒831。此外,剝離膠膜83並不限定於熱封膜。The peeling
在圖1所示之固定於X軸方向移動手段46的可動板463的側面之支撐台480上,安裝有握持部支撐部48,再者,藉由握持部支撐部48,構成握持部41之一對握持爪412成為能上下移動。On the support stand 480 fixed to the side surface of the movable plate 463 of the X-axis direction moving means 46 shown in FIG. 1, a
一對握持爪412例如具備:側視下大致L字形的固定爪4121;以及可動爪4122,其與固定爪4121在Z軸方向對向配設,且能接近或離開固定爪4121。在握持部41中,藉由使可動爪4122接近固定爪4121,可將剝離膠膜83的一端握持於其間。然後,可藉由握持部支撐部48將已握持剝離膠膜83之一對握持爪412定位在保持於保持手段30之板狀工件80的保護膠膜81上適合膠膜黏貼之高度位置。另一方面,藉由使可動爪4122從固定爪4121離開,可解除握持部41中之剝離膠膜83的一端之握持狀態。The pair of
圖1所示之剝離膠膜黏貼手段44被配設於一對送出滾筒422與握持部41之間。剝離膠膜黏貼手段44具備:支撐台440,其被固定於X軸方向移動手段46的可動板463的側面;壓接板升降機構441,其係由氣缸等而成,且被支撐台440支撐;以及壓接板442,其藉由壓接板升降機構441而成為能上下移動。The peeling adhesive film sticking means 44 shown in FIG. 1 is arranged between the pair of
在壓接板442上安裝有藉由流通電流而發熱之未圖示之加熱器,在藉由壓接板升降機構441使壓接板442下降而將剝離膠膜83壓接並黏貼於保護膠膜81的外周部分之際,未圖示之加熱器將壓接板442加熱,藉此可使剝離膠膜83部分地熱熔接於保護膠膜81。藉此,可將剝離膠膜83良好地黏貼於保護膠膜81。A heater (not shown) that generates heat by flowing current is installed on the crimping
膠膜切斷手段40例如被配設於一對送出滾筒422與剝離膠膜黏貼手段44之間。膠膜切斷手段40具備:載置台400,其具備載置剝離膠膜83的接著劑層側(下側)之載置面404、以及在剝離膠膜83的寬度方向(在水平面內與X軸方向正交之Y軸方向)將載置面404橫切之槽405;切斷器401,其沿著槽405的延伸方向而在槽405內行進;切斷器移動手段402,其係透過切斷器升降手段403支撐切斷器401並使切斷器401在槽405的延伸方向(Y軸方向)移動之滾珠螺桿機構;以及切斷器升降手段403,其係由氣缸等而成,且使切斷器401相對於載置面404在Z軸方向升降。The adhesive film cutting means 40 is arranged between the pair of
例如,剝離手段4具備由被配設於支撐握持部41之握持部支撐部48之壓電元件而成的拉伸負載測量部47,以作為測量施加至介於握持部41與保持面302之間的保護膠膜81之拉伸負載的拉伸負載測量部。以下,將拉伸負載測量部47設為握持部側拉伸負載測量部47。然後,握持部側拉伸負載測量部47例如具備:上下方向負載測量壓電元件471、及水平方向負載測量壓電元件472。此外,剝離裝置1只要具備工作台側拉伸負載測量部35或握持部側拉伸負載測量部47的至少任一者作為拉伸負載測量部即可。For example, the peeling means 4 is provided with a tensile
握持部支撐部48例如係活塞桿483能從壓缸管484內在Z軸方向上下移動之電動壓缸等。然後,例如,上下方向負載測量壓電元件471具備圓柱狀的外形,且以使兩個桿體上下連結而成為一個活塞桿483之方式,一體地被配設於活塞桿483。The
水平方向負載測量壓電元件472例如被形成為平板狀,且以被活塞桿483的前端部與固定爪4121從X軸方向兩側夾住之狀態,被配設於活塞桿483的前端部與固定爪4121之連結部位。此外,上下方向負載測量壓電元件471及水平方向負載測量壓電元件472係由與先前說明之工作台側拉伸負載測量部35同樣的材質所構成。The horizontal load measuring
例如,在成為握持部41的移動路徑下方之位置,配設有使剝離手段4所剝離之保護膠膜81投下並進行回收之回收箱17。For example, at a position below the moving path of the
剝離裝置1例如具備控制裝置的各構成之控制手段19,控制手段19係由遵循控制程式進行運算處理之CPU及記憶體等儲存媒體等所構成,且透過未圖示之有線或無線的通信路徑,與工作台移動手段13、X軸方向移動手段46以及使握持部41升降移動之電動壓缸等握持部支撐部48等電氣連接,在由控制手段19所進行之工作台移動手段13的控制下,進行已吸引保持板狀工件80之保持手段30在X軸方向的移動速度的控制、對於握持部41等的對位控制。並且,在由控制手段19所進行之X軸方向移動手段46及握持部支撐部48的控制下,進行握持部41的移動速度的控制、對位的控制等,所述握持部41握持被黏貼於板狀工件80的保護膠膜81之剝離膠膜83。此外,例如,由控制手段19所進行之X軸方向移動手段46的控制係藉由控制馬達462的旋轉數而進行。並且,控制手段19可從工作台側拉伸負載測量部35及握持部側拉伸負載測量部47接收關於各負載測量部所測量之拉伸負載的資訊。The
例如,在工作台移動手段13的馬達132為伺服馬達之情形中,伺服馬達的旋轉編碼器與亦具有作為伺服放大器的功能之控制手段19連接,從控制手段19的輸出介面將操作訊號供給至伺服馬達後,將伺服馬達的旋轉數作為編碼器訊號而輸出至控制手段19的輸入介面。然後,接收到編碼器訊號之控制手段19以馬達132的旋轉角度為基準,逐次識別保持手段30的移動量,藉此可逐次識別保持手段30在X軸方向的位置。For example, in the case where the
接著,說明使用圖1所示之剝離裝置1將保護膠膜81從板狀工件80剝離之情形。首先,將與環狀框架84成為一體的板狀工件80以保護膠膜81朝向上側之狀態載置於保持手段30的保持面302,同時將環狀框架84載置於被配設於保持手段30的外周側之框架固定手段32。接著,未圖示之吸引源進行運作,以保持面302吸引保持板狀工件80,同時藉由框架固定手段32吸引固定環狀框架84。然後,環狀框架84下降至例如低於保持面302的位置為止。Next, the case where the
藉由圖1所示的一對導引滾筒421,從膠膜滾筒831將剝離膠膜83朝向握持部41送出。將剝離膠膜83的接著劑層側(內側)載置於膠膜切斷手段40的載置台400的載置面404,再將剝離膠膜83的一端定位於握持部41的固定爪4121的上表面後,可動爪4122接近固定爪4121,握持部41握持剝離膠膜83的一端。接著,藉由X軸方向移動手段46,握持部41往-X方向移動,將所握持之剝離膠膜83往同方向拉伸。在此階段中,成為剝離膠膜黏貼手段44的壓接板442及膠膜切斷手段40的切斷器401在剝離膠膜83的上方側待機之狀態。With the pair of
例如保持手段30往+X方向移動,將保護膠膜81的外周部分定位於剝離膠膜黏貼手段44的正下方。接著,已藉由內部所具備的未圖示之加熱器加熱之壓接板442會下降,以壓接板442的下端將剝離膠膜83從上方壓接至保護膠膜81的外周部分,並使剝離膠膜83的接著劑層與保護膠膜81熱熔接。For example, the holding means 30 moves in the +X direction, and the outer peripheral part of the
在此狀態,將切斷器401定位於從剝離膠膜83之一側邊之側露出的載置台400的槽405的一端的位置。再者,藉由切斷器升降手段403,切斷器401下降直至切斷器401的最下端到達槽405內為止。進一步,切斷器401沿著槽405的延伸方向往-Y方向行進,藉由切斷器401將剝離膠膜83切斷。切斷器401將剝離膠膜83切斷後,切斷器401及壓接板442往+Z方向上升而從剝離膠膜83退出。In this state, the
(在剝離裝置1中剝離保護膠膜81的實施方式A)
說明以下情形:在保護膠膜81的剝離中,使保持手段30在X軸方向移動,且將握持部41定位於離保持手段30的保持面302預定的距離上後,使其在水平方向移動。
握持剝離膠膜83之握持部41往+Z方向移動,將保護膠膜81的一部分從板狀工件80的一側之面800剝離。接著,藉由X軸方向移動手段46使握持部41往-X方向移動。並且,藉由工作台移動手段13使保持手段30往+X方向移動,使握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動,且將保護膠膜81逐漸從板狀工件80剝離。此外,亦可在保持手段30的移動路徑上方配設未圖示之旋轉滾筒,使保護膠膜81抵接該旋轉滾筒且逐漸進行剝離,藉此抑制在剝離保護膠膜81之際可能發生之保護膠膜81的斷裂。(Embodiment A in which the
此外,例如,只要可使握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動且將保護膠膜81從板狀工件80剝離即可,因此例如保持手段30亦可不往+X方向移動,僅握持部41往-X方向移動,藉此將保護膠膜81剝離。In addition, for example, it is sufficient to move the
在本實施方式中,在將保護膠膜81從上述板狀工件80剝離中,圖2所示之握持部側拉伸負載測量部47可正確地測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83係與介於握持部41與保持面302之間的保護膠膜81成為一體。In this embodiment, in peeling the
例如,由握持部側拉伸負載測量部47所進行之拉伸負載的測量,係藉由上下方向負載測量壓電元件471與水平方向負載測量壓電元件472進行。此外,圖2中係將剝離手段4及保持手段30等構成進行局部簡化而顯示。
在圖2中,朝向斜上方之箭頭F1表示施加至剝離膠膜83之拉伸負載F1,所述剝離膠膜83係與介於握持部41與保持手段30的保持面302之間的保護膠膜81成為一體。而且,拉伸負載F1係將圖2所示之方向為-X方向的X軸方向拉伸負載Fx1與方向為+Z方向的Z軸方向拉伸負載Fz1進行合成而成之拉伸負載F1。然後,由畢氏(Pythagoras)定理成立下述式1。
(X軸方向拉伸負載Fx1)2
+(Z軸方向拉伸負載Fz1)2
=
(拉伸負載F1)2
・・・・(式1)For example, the tensile load measurement performed by the grip side tensile
於此,藉由水平方向負載測量壓電元件472,在每隔預定的時間間隔時測量X軸方向拉伸負載Fx1。亦即,水平方向負載測量壓電元件472藉由X軸方向拉伸負載Fx1而稍微變形,在水平方向負載測量壓電元件472產生因應負載之電位差。藉由在水平方向負載測量壓電元件472產生電位差,在每次測量時將負載檢測訊號從水平方向負載測量壓電元件472發送至圖1所示之控制手段19。並且,藉由上下方向負載測量壓電元件471,在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz1,在每次測量時將負載檢測訊號發送至控制手段19。Here, the
控制手段19進行將針對X軸方向拉伸負載Fx1的實測值與針對Z軸方向拉伸負載Fz1的實測值代入式1之運算處理,測量每隔預定的時間間隔之拉伸負載F1。然後,控制手段19將在每隔預定的時間間隔時所測量之拉伸負載F1使用作為用於使由剝離手段4所進行之保護膠膜81的剝離操作最佳化之資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F1的值,例如,藉由控制手段19,將由X軸方向移動手段46所進行之握持部41往-X方向的移動速度最佳化。其結果成為下述狀態:在握持部41將已與保護膠膜81成為一體之剝離膠膜83剝離之際的拉伸負載F1會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由握持部41所進行之剝離速度亦不會太慢,不浪費時間地將保護膠膜81逐漸從板狀工件80剝離。The control means 19 performs a calculation process of substituting the actual measurement value for the X-axis direction tensile load Fx1 and the actual measurement value for the Z-axis direction tensile load Fz1 into
若將保護膠膜81從板狀工件80的一側之面800完全剝離,則握持被黏貼於保護膠膜81之剝離膠膜83的握持部41會移動直到回收箱17上。然後,握持部41解除剝離膠膜83的握持,使保護膠膜81及剝離膠膜83落下至回收箱17內。If the
如本實施方式,保護板狀工件80之保護構件為保護膠膜81,且在保護膠膜81之外周部分具備黏貼剝離膠膜83之剝離膠膜黏貼手段44,藉此握持部41握持已黏貼於保護膠膜81之剝離膠膜83以取代握持保護膠膜81的外周部分,握持部側拉伸負載測量部47測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83與介於握持部41與保持面302之間的保護膠膜81成為一體,以取代測量施加至保護膠膜81的拉伸負載,藉此變得能使剝離手段4的剝離操作最佳化。As in the present embodiment, the protective member for protecting the plate-shaped
(在剝離裝置1中剝離保護膠膜81的實施方式B)
說明以下情形:握持剝離膠膜83之握持部41往+Z方向移動,將保護膠膜81的一部分從板狀工件80的一側之面800剝離後,正當再將保護膠膜81逐漸剝離時,如圖3所示,使保持手段30在X軸方向移動,且不以X軸方向移動手段46使握持部41移動。在本情形中,握持部41在預定的高度位置及在預定的X軸方向的位置P2停止,控制手段19識別握持部41所位於之高度位置及在X軸方向的位置P2。(Embodiment B in which the
藉由工作台移動手段13使保持手段30往+X方向移動,使停止移動之握持部41相對地從板狀工件80的外周緣朝向中心在直徑方向移動,且將保護膠膜81逐漸從板狀工件80剝離。此外,亦可在保持手段30的移動路徑上方配設未圖示之旋轉滾筒,使保護膠膜81抵接該旋轉滾筒且逐漸進行剝離,藉此抑制在剝離保護膠膜81之際可能發生之保護膠膜81的斷裂。The holding means 30 is moved in the +X direction by the table moving means 13, so that the holding
在本實施方式中,在將保護膠膜81從上述板狀工件80剝離中,工作台側拉伸負載測量部35測量施加至剝離膠膜83的拉伸負載,所述剝離膠膜83係與介於握持部41與保持面302之間的保護膠膜81成為一體。
在圖3中,箭頭F2表示施加至剝離膠膜83的拉伸負載F2,所述剝離膠膜83係與介於握持部41與保持手段30的保持面302之間的保護膠膜81成為一體。而且,拉伸負載F2係將圖3所示之方向為-X方向的X軸方向拉伸負載Fx2與方向為+Z方向的Z軸方向拉伸負載Fz2進行合成而成之拉伸負載F2。In the present embodiment, in peeling the
圖3所示之箭頭R1係第一工作台側拉伸負載測量部351在Z軸方向在每隔預定的時間間隔時可測量之第一測量負載R1。第一測量負載R1例如具有-Z方向的方向。關於第一測量負載R1之值的資訊,係在每隔預定的時間間隔時被發送至控制手段19。
箭頭R2係第二工作台側拉伸負載測量部352在Z軸方向在每隔預定的時間間隔時可測量之第二測量負載R2。第二測量負載R2例如具有+Z方向的方向。關於第二測量負載R2之值的資訊,係在每隔預定的時間間隔時被發送至控制手段19。
圖3所示之第一工作台側拉伸負載測量部351與第二工作台側拉伸負載測量部352在X軸方向的距離L2係控制手段19預先識別之裝置設計值,且成為常數。
從第一工作台側拉伸負載測量部351起至在X軸方向的移動停止而位於位置P2的握持部41為止之X軸方向的變化距離M,係藉由保持手段30在X軸方向移動而變化之變數。此外,藉由從工作台移動手段13的馬達132(伺服馬達132)的旋轉編碼器回饋至控制手段19之編碼器訊號,控制手段19可掌握與可動構件133一起移動之第一工作台側拉伸負載測量部351的位置,因此控制手段19亦可在每隔預定的時間間隔時逐次識別該變化距離M的值。
控制手段19識別高度位置之第一工作台側拉伸負載測量部351與停止於位置P2之握持部41在Z軸方向的距離N,係成為控制手段19預先識別之常數。The arrow R1 shown in FIG. 3 is the first measurement load R1 that can be measured at every predetermined time interval in the Z-axis direction by the tensile
由畢氏定理成立下述式2。
(X軸方向拉伸負載Fx2)2
+(Z軸方向拉伸負載Fz2)2
=
(拉伸負載F2)2
・・・・(式2)
並且,由於在Z軸方向的力的平衡,故成立下述式3。
(Z軸方向拉伸負載Fz2)=(第一測量負載R1)+(第二測量負載R2)・・・・(式3)According to Pythagorean theorem, the following
再者,由於在將第一工作台側拉伸負載測量部351假設成原點之情形中,第一工作台側拉伸負載測量部351周圍的力矩的平衡,故成立下列式4。
(X軸方向拉伸負載Fx2)×(為常數的距離N)=(第二測量負載R2)×(距離L2)+(Z軸方向拉伸負載Fz2)×(變化距離M)・・・・(式4)Furthermore, in the case where the first table-side tensile
由式3,控制手段19可在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz2。並且,由將式4變形而成之下述式5,控制手段19可在每隔預定的時間間隔時測量X軸方向拉伸負載Fx2。
(X軸方向拉伸負載Fx2)={(第二測量負載R2)×(距離L2)+(Z軸方向拉伸負載Fz2)×(變化距離M)}/(為常數的距離N)・・・・(式5)According to Equation 3, the control means 19 can measure the tensile load Fz2 in the Z-axis direction every predetermined time interval. In addition, the following formula 5 is obtained by deforming the
控制手段19進行將針對X軸方向拉伸負載Fx2的值與針對Z軸方向拉伸負載Fz2的值代入式2之運算處理,在每隔預定的時間間隔時測量拉伸負載F2。然後,控制手段19將在每隔預定的時間間隔時所測量之拉伸負載F2使用作為用於使由剝離手段4所進行之保護膠膜81的剝離操作最佳化之資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F2的值,例如,藉由控制手段19將由工作台移動手段13所進行之保持手段30的移動速度最佳化。其結果成為下述狀態:在握持部41將已與保護膠膜81成為一體之剝離膠膜83剝離之際的拉伸負載F2會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由相對於移動之保持手段30而在X軸方向相對地移動之握持部41所進行之剝離速度亦不會太慢,不浪費時間地將保護膠膜81逐漸從板狀工件80剝離。The control means 19 performs a calculation process of substituting the value of the tensile load Fx2 in the X-axis direction and the value of the tensile load Fz2 in the Z-axis direction into
如本實施方式,工作台側拉伸負載測量部35亦即第一工作台側拉伸負載測量部351及第二工作台側拉伸負載測量部352若係由被配設於支撐保持手段30之支撐部31之壓電元件而成,則變得能正確地測量施加至保護構件亦即保護膠膜81的拉伸負載。As in this embodiment, the table-side tensile
若將保護膠膜81從板狀工件80的一側之面800完全剝離,則握持已黏貼於保護膠膜81之剝離膠膜83的握持部41移動直到回收箱17上。然後,握持部41解除剝離膠膜83的握持,使保護膠膜81及剝離膠膜83落下至回收箱17內。If the
本發明之第一實施方式的剝離裝置1並不限定於上述實施方式,在其技術性思想的範圍內當然也可以各種不同的方式實施。並且,關於隨附圖式所圖示之剝離裝置1的各構成要素的形狀等,亦不限定於此,在可發揮本發明之功效的範圍內能適當變更。The
例如,如圖4所示,板狀工件80亦可在外周部分具備切口部806。切口部806例如係表示晶體方向之標記亦即缺口,且以朝向板狀工件80的中心往直徑方向內側凹入之狀態形成於板狀工件80的外周緣。或者,切口部806亦可為定向平面。此情形,將板狀工件80的外周的一部分切平,藉此形成切口部806。For example, as shown in FIG. 4, the plate-shaped workpiece|work 80 may be equipped with the
如圖4所示,圖1所示之保持手段30例如亦可具備:部分剝離部34,其將位於板狀工件80的切口部806之未黏貼於板狀工件80的保護膠膜81上推,使切口部806附近的保護膠膜81從板狀工件80剝離。然後,例如,圖1所示之握持部41亦可握持藉由部分剝離部34而被剝離之保護膠膜81的外周部分,將保護膠膜81從板狀工件80剝離。As shown in FIG. 4, the holding means 30 shown in FIG. 1 may be provided, for example, with: a
以與被載置於保持面302之板狀工件80的切口部806對應之方式,在保持面302的外周形成有圓形狀的貫通孔341,所述貫通孔341構成部分剝離部34,並使保持面302與保持手段30的下表面(框體301的下表面)貫通。具體而言,以使從板狀工件80的中心至切口部806為止的距離與從保持面302的中心至貫通孔341為止的距離一致之方式,將貫通孔341配設於保持面302。A circular through
並且,將貫通孔341的直徑設定成例如稍小於切口部806的寬度。將已黏貼於板狀工件80的一側之面800的保護膠膜81的一部分上推之上推銷342,係藉由上下驅動部345而能上下移動地設置於部分剝離部34的貫通孔341的正下方。上推銷342被形成為在上下方向延伸之棒狀,上推銷342的外直徑成為稍小於貫通孔341。例如,上推銷342的前端(上端)具有尖的形狀,變得能將已黏貼於板狀工件80的另一側之面801的切割膠膜82戳破。In addition, the diameter of the through
並且,例如在上推銷342上,係沿著延伸方向形成有從前端噴出流體之未圖示的噴出孔。在噴出孔的下端,透過閥346連接有流體供給源347,藉由開啟閥346而從流體供給源347將流體供給至上推銷342內。此外,從流體供給源347所供給之流體並無特別限定,在本實施方式中係使用壓縮空氣作為流體。In addition, for example, the
上下驅動部345例如係由空氣或馬達驅動的導引致動器所構成,變得能在保持手段30的貫通孔341內一邊在上下方向引導上推銷342一邊使其上下移動。The up-and-down driving
如此,上推銷342被構成為一邊從噴出孔的出口噴出空氣一邊藉由上下驅動部345上升而戳破切割膠膜82。並且,上推銷342變得能在戳破切割膠膜82後從保持面302突出,將板狀工件80的切口部806上的保護膠膜81上推。亦即,一邊使空氣從上推銷342的噴出孔噴出而使保護膠膜81浮起,一邊使上推銷342進一步上升而將保護膠膜81的外周部分上推,或是一邊使上推銷342上升而將保護膠膜81的外周部分上推,一邊使空氣從噴出孔噴出空氣而使保護膠膜81的外周部分從板狀工件80剝離。
然後,圖4所示之握持部41可握持藉由部分剝離部34而被剝離之保護膠膜81的外周部分,並將保護膠膜81從板狀工件80剝離。In this way, the
(剝離裝置的第二實施方式)
圖5所示的本發明之剝離裝置2(以下稱為第二實施方式之剝離裝置2)係將黏貼於板狀工件80在圖5中之下表面亦即一側之面800的保護構件85進行剝離之剝離裝置的一例,且至少具備:保持手段50,其藉由保持面502保持板狀工件80的另一側之面801;以及剝離手段6,其握持保護構件85,保護構件85覆蓋被保持於保持面502之板狀工件80的一側之面800,將保護構件85從板狀工件80的外周朝向中央剝離,再從中央往外周的相反側的外周剝離。(Second embodiment of peeling device)
The
以覆蓋板狀工件80朝向下方的一側之面800整個表面之方式所黏貼之保護構件85,例如係由樹脂膜87(參考圖6)與圓形薄片86而成之保護構件,所述樹脂膜87係在未圖示之保護構件形成裝置中,將板狀工件80的一側之面800壓接至被供給至直徑大於板狀工件80的圓形薄片86上之液態樹脂,將液態樹脂從板狀工件80的中心朝向外周側擴展,使液態樹脂在一側之面800的整個表面展開後,對此液態樹脂例如照射紫外線,藉此使液態樹脂硬化而形成。然後,在本實施方式中,保護構件85係由圓形薄片86與樹脂膜87而成,且具備:圖6所示之突出部850,其從板狀工件80的外周往直徑方向外側稍微突出。The
在圖5所示之剝離裝置2的底座20上的後方側(-X方向側)立設有柱體21,在柱體21的+X方向側的前表面的上部配設有襯墊移動手段60,所述襯墊移動手段60係藉由馬達602而使滾珠螺桿600轉動,藉此使配設於可動板601之保持手段50在Y軸方向往返移動。
襯墊移動手段60為剝離手段6的一部分,且發揮作為移動手段的功能,以使握持部61與保持手段50在與保持面502平行之Y軸方向相對地移動,且使握持部61從保持面502的外周前往中心,並使已通過保持面502的中心之握持部61在一直線上往遠離中心之方向移動。A
在可動板601上配設有使保持手段50在Z軸方向往返移動之襯墊升降手段66。襯墊升降手段66係藉由馬達662而使滾珠螺桿660轉動,藉此使配設於可動板661上之保持手段50在Z軸方向往返移動。The
藉由保持面502保持板狀工件80的另一側之面801之保持手段50,係由一端被固定於可動板661上且在X軸方向延伸之臂部52所支撐,且透過支撐部53而被安裝於臂部52的+X方向側的另一端的下表面側。The holding means 50, which holds the
如圖6所示,在本實施方式中,保持手段50為吸引保持墊,且具備:吸附部500,其由多孔構件而成,並吸附板狀工件80;以及框體501,其支撐吸附部500。吸附部500係透過吸引管509以及樹脂管或接頭等而與未圖示之吸引源連通。然後,將吸引源所產生之吸引力傳遞至由吸附部500的露出面與框體501的下表面所形成之同一平面的保持面502,藉此保持手段50以保持面502吸引保持板狀工件80。As shown in FIG. 6, in this embodiment, the holding means 50 is a suction holding pad, and includes: an
圖5所示之支撐部53例如具備圓環板狀的外形,且其上表面係藉由未圖示之固定螺栓等而與臂部52的下表面連接。在支撐部53的下表面安裝有襯墊側拉伸負載測量部64,所述襯墊側拉伸負載測量部64係測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載之拉伸負載測量部。The
襯墊側拉伸負載測量部64係由被配設於支撐保持手段50之支撐部53之壓電元件而成。亦即,例如,襯墊側拉伸負載測量部64係被形成為圓柱狀或角柱形之鈦酸鋇等壓電元件,且以在Y軸方向對向之方式,以將支撐部53與保持手段50連結並支撐保持手段50的重量之形式配設有2個(圖5中僅圖示1個)。亦即,襯墊側拉伸負載測量部64係由圖6所示之第一襯墊側拉伸負載測量部641與第二襯墊側拉伸負載測量部642所構成。The pad side tensile
在圖5所示之柱體21的+X方向側的前表面的中間部亦即保持手段50的移動路徑的下方,從+Z方向側依序排列配設有:旋轉滾筒211,其具有X軸方向的軸心;剝離手段6的各構成要素;載置台27,其載置已從板狀工件80剝離之保護構件85;以及落下手段26,其使載置台27上的剝離後的保護構件85落下至垃圾箱(dust box)28。In the middle part of the front surface of the
剝離手段6具備:握持部61,其握持保護構件85的外周部分(在本實施方式中係成為外周部分之突出部850);移動手段63,其使握持部61與保持手段50在與保持面502平行之方向(Y軸方向)相對地移動,且使握持部61從保持面502的外周前往中心,並使已通過保持面502的中心之握持部61在一直線上往遠離中心之方向移動;以及襯墊側拉伸負載測量部64,其係測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載之拉伸負載測量部。
此外,移動手段63在以下說明中設為握持部移動手段63。The peeling means 6 is provided with: a
握持部移動手段63係由下述所構成:滾珠螺桿630,其具有Y軸方向的軸心;一對導軌631,其被配設成與滾珠螺桿630平行;馬達632,其使滾珠螺桿630轉動;以及可動塊633,其內部的螺帽與滾珠螺桿630螺合,且側部與導軌631滑動接觸。然後,若馬達632使滾珠螺桿630轉動,則伴隨於此,可動塊633被導軌631引導而在Y軸方向移動,配設於可動塊633之握持部61伴隨可動塊633的移動而在Y軸方向移動。The grip moving means 63 is composed of the following: a
在可動塊633的側面安裝有臂型外殼681,所述臂型外殼681支撐軸方向為X軸方向的主軸680且主軸680能旋轉。然後,在配設於主軸680的+X方向側的前端之連接構件616安裝有連結塊614,所述連結塊614透過握持部側拉伸負載測量部67的上下方向負載測量壓電元件673支撐握持部61。在連結塊614安裝有夾具基部610,所述夾具基部610透過握持部側拉伸負載測量部67的水平方向負載測量壓電元件674支撐握持部61的握持夾具612。並且,雖然未圖示,但臂型外殼681成為能利用未圖示之滾珠螺桿機構等升降手段而在Z軸方向升降,且握持部61亦成為能在Z軸方向升降。An arm-
握持夾具612可在能互相接近及分開之一對握持板之間夾住握持對象,藉由主軸680進行旋轉,可改變相對於握持對象之角度。The holding
測量施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載之拉伸負載測量部亦即握持部側拉伸負載測量部67,例如係由被形成為平板狀之鈦酸鋇等水平方向負載測量壓電元件674、與由同樣材料構成之平板狀的上下方向負載測量壓電元件673所構成。然後,上下方向負載測量壓電元件673被配設成以下狀態:在安裝於主軸680的前端側之塊狀的連接構件616的下表面與連結塊614的上表面之間,從Z軸方向被夾住。並且,水平方向負載測量壓電元件674被配設成以下狀態:藉由連結塊614與握持部61的夾具基部610,從Y軸方向兩側被夾住。The tensile load measuring part that measures the tensile load applied to the
圖5所示之旋轉滾筒211,例如其外形被形成為圓柱狀,且藉由未圖示之馬達,以X軸方向的軸心為軸而旋轉。旋轉滾筒211藉由抵接保護構件85,例如發揮以下作用:防止剝離保護構件85之際可能發生之圖6所示之樹脂膜87的斷裂。此外,旋轉滾筒211亦能在Y軸方向移動。The
載置已從板狀工件80剝離之保護構件85之載置台27,例如其外形為大致長方形狀,且具備柵狀的載置面。亦即,載置台27成為下述構成:以將板狀的直線材271的長邊方向作為Y軸方向而在X軸方向保持等間隔而形成間隙之方式,使板狀的直線材271並列地排列,並將各直線材271的+Y軸方向側的一端利用未圖示之棒狀的連結具連結並固定。例如,載置台27係藉由連結各直線材271之未圖示的棒狀的連結具而被固定於柱體21的+X方向側側面,且被配設於握持部61的移動路徑下。The mounting table 27 on which the
使載置台27上的保護構件85落下之落下手段26係由下述構件所構成:滾珠螺桿260,其具有Y軸方向的軸心;一對導軌261,其被配設成與滾珠螺桿260平行;馬達262,其使滾珠螺桿260轉動;側視下大致L字形的可動構件263,其內部的螺帽與滾珠螺桿260螺合,且側部2631與導軌261滑動接觸;以及突出銷2634,其被配設於可動構件263。The dropping means 26 for dropping the
可動構件263例如具備:側部2631,其與滾珠螺桿260螺合;以及銷座部2632,其係以從側部2631的上端部分側面朝向+X方向側突出之方式形成。在銷座部2632的上表面配設有朝向+Z方向突出之兩個突出銷2634。各突出銷2634係在X軸方向僅分開預定距離地被配置,若馬達262使滾珠螺桿260轉動,則伴隨於此,可動構件263被導軌261引導而在Y軸方向移動,以使配設於可動構件263上之突出銷2634通過載置台27的各直線材271間的間隙之方式在Y軸方向移動。The
在底座20上配設有容納已被剝離之保護構件85之垃圾箱28。垃圾箱28係例如外形被形成為大致長方體狀,且在載置台27的+Y方向側端的下方開口。在垃圾箱28的上部例如配設有穿透式的光感測器,所述穿透式的光感測器具備:發光部280(-Y方向側)與受光部281(+Y方向側)。從板狀工件80被剝離且被載置於載置台27上之保護構件85係藉由落下手段26而落入垃圾箱28內,保護構件85在垃圾箱28內堆積直到預定高度,從發光部280所射出之檢査光會被保護構件85遮住,而受光部281的受光量減少,藉此光感測器檢測垃圾箱28內已積存應回收的量的保護構件85。The
例如,在柱體21的前表面中成為剝離手段6的握持部61的可動範圍內之位置安裝有工作台保持台22,且在工作台保持台22上配設有交接台221,所述交接台221載置剝離保護構件85之板狀工件80。交接台221可將載置於其保持面上之板狀工件80以例如將一側之面801朝向上側的狀態進行吸引保持。此外,亦可設為工作台保持台22上未配設交接台221之構成。For example, on the front surface of the
在工作台保持台22上,係以交接台221為中心而在圓周方向隔開固定間隔地配設有多個(例如八個)外側部分剝離手段23,所述外側部分剝離手段23握持突出部850而將保護構件85的外側部分從板狀工件80剝離。此外,在圖5中,將外側部分剝離手段23的構成放大詳細顯示。On the table holding table 22, a plurality of (for example, eight) outer partial peeling means 23 are arranged at regular intervals in the circumferential direction with the transfer table 221 as the center, and the outer partial peeling means 23 grips the protrusions. The
外側部分剝離手段23具備:突出部握持部230,其握持突出部850;未圖示之垂直移動部,其將突出部握持部230在Z軸方向(垂直方向)移動;以及水平移動部234,其將突出部握持部230在水平方向移動。The outer partial peeling means 23 is provided with: a
如圖5所示,水平移動部234藉由馬達2340而使在水平方向延伸之滾珠螺桿2341轉動,藉此使突出部握持部230在交接台221的直徑方向往返移動,所述突出部握持部230係透過未圖示之垂直移動部而被配設於例如側視下形成為L字形之滑件2342上。未圖示之垂直移動部係例如由滾珠螺桿機構等所構成。As shown in FIG. 5, the horizontal moving
突出部握持部230具備:大致長方體狀的握持台2301、配設於握持台2301的側面之汽缸機構2303、以及藉由汽缸機構2303而在Z軸方向上下移動之握持板2302,且可將握持對象夾在握持台2301的上表面與握持板2302的下表面之間。
各突出部握持部230係將握持板2302與握持台2301之間的開口部分朝向交接台221側而配設。The
剝離裝置2例如具備進行裝置的各構成的控制之控制手段29,控制手段29係由遵循控制程式進行運算處理之CPU及記憶體等儲存媒體等所構成,且透過未圖示之有線或無線的通信路徑,與襯墊移動手段60、襯墊升降手段66以及握持部移動手段63等電氣連接,在由控制手段29所進行之襯墊移動手段60或襯墊升降手段66的控制下,進行已吸引保持板狀工件80之保持手段50在Y軸方向及Z軸方向的移動速度的控制、或對於握持部61等的對位的控制。並且,在由控制手段29所進行之握持部移動手段63的控制下,進行握持部61的移動速度的控制及對位的控制,所述握持部61握持保護板狀工件80之保護構件85的突出部850。並且,控制手段19可從襯墊側拉伸負載測量部64及握持部側拉伸負載測量部67接收關於各負載測量部所測量之拉伸負載的資訊。The
例如,在襯墊移動手段的馬達602為伺服馬達之情形中,伺服馬達的旋轉編碼器與亦具有作為伺服放大器的功能之控制手段29連接,從控制手段29的輸出介面將操作訊號供給至伺服馬達後,將伺服馬達的旋轉數作為編碼器訊號而輸出至控制手段29的輸入介面。然後,接收到編碼器訊號之控制手段29以伺服馬達的旋轉角度為基準,逐次識別保持手段50的移動量,藉此可逐次識別保持手段50在Y軸方向的位置。For example, in the case where the
以下說明圖5所示之將保護構件85從板狀工件80剝離之情形的剝離裝置2的操作。首先,將圖5所示之例如研削後的板狀工件80以使經研削之面的另一側之面801成為上側之方式載置於交接台221上。保持手段50往+Y方向移動,且以使保持面502的中心與板狀工件80的另一側之面801的中心大概一致之方式定位於板狀工件80的上方。再者,保持手段50下降,使保持面502與板狀工件80的另一側之面801接觸。再者,將藉由未圖示之吸引源進行吸引所產生之吸引力傳遞往保持面502,藉此保持手段50使保護構件85朝下而吸引保持板狀工件80的另一側之面801。The operation of the
例如,已吸引保持板狀工件80之保持手段50上升,而使板狀工件80從交接台221上脫離。接著,藉由未圖示之垂直移動部,將突出部握持部230定位於可握持保護構件85的突出部850之預定高度位置。For example, the holding means 50 that has sucked and held the plate-shaped
並且,各水平移動部234使各突出部握持部230在水平方向移動,進行突出部握持部230與保護構件85的突出部850在直徑方向之對位。握持板2302藉由汽缸機構2303下降,突出部握持部230握持保護構件85的突出部850。此外,藉由突出部握持部230握持板狀工件80的保護構件85的突出部850等,亦可在已將板狀工件80保持於交接台221上之狀態下進行。In addition, each horizontal moving
接著,各水平移動部234使已握持板狀工件80的保護構件85的突出部850之各突出部握持部230朝向板狀工件80的直徑方向外側移動,藉此突出部850係藉由突出部握持部230而被朝向直徑方向外側拉伸並擴張。然後,藉由突出部握持部230的上述移動,藉由施加至附著於板狀工件80的外周部分之樹脂膜87(參考圖6)的擴張力、與在圓形薄片86與樹脂膜87之間發揮作用的接著力,而輕易地將附著於板狀工件80的外周部分上之樹脂膜87從板狀工件80的外周緣朝向直徑方向外側剝離。Next, each horizontal moving
接著,例如,使各突出部握持部230下降直到預定的高度位置,將保護構件85的突出部850從板狀工件80往下方降低一定程度而剝離後,突出部握持部230放開保護構件85的突出部850。藉此,例如,以板狀工件80的中心為基準,在圓周方向以均等之角度,在板狀工件80的外周部分的至少共八處將突出部850部分地剝離。Next, for example, each
接著,已吸引保持板狀工件80之保持手段50往-Y方向移動直到位於旋轉滾筒211的上方後會下降,使旋轉滾筒211的側面抵接保護構件85的下表面的+Y方向側的外周部附近。如圖6所示,握持部移動手段63使握持部61往-Y方向移動,進行握持夾具612與保護構件85的突出部850之對位,握持夾具612握持突出部850。在圖6所示之例中,握持部61握持保護構件85的外側部分之中未從板狀工件80剝離之外側部分的突出部850,但亦可握持保護構件85的外側部分之中進行從板狀工件80的剝離之外側部分的突出部850(圖6中的-Y方向側的突出部850)。Next, the holding means 50 that has sucked and held the plate-shaped
例如,如圖6所示,握持夾具612握持突出部850後,握持夾具612往+Y方向側稍微移動,將樹脂膜87的外周部分從板狀工件80的外周緣剝離。接著,如圖7至圖8所示,從+X方向側觀看,主軸680往順時針方向旋轉180度,藉此在旋轉滾筒211支撐保護構件85的下表面側之狀態下,保護構件85的樹脂膜87沿著旋轉滾筒211的側面而平緩地彎曲,且藉由握持夾具612將保護構件85朝向-Z方向拉伸,藉此將保護構件85的一部分從板狀工件80的一側之面800剝離。For example, as shown in FIG. 6, after the
(在剝離裝置2中剝離保護構件85的實施方式C)
在進一步剝離保護構件85中,使保持手段50在Y軸方向移動。或者,說明使握持部61相對於保持手段50的保持面502在Y軸方向移動之情形。(Embodiment C in which the
藉由圖5所示之握持部移動手段63,如圖9所示,使握持部61往-Y方向移動。並且,亦可藉由襯墊移動手段60(參考圖5)使保持手段50往+Y方向移動。使握持部61相對地從板狀工件80的外周緣朝向中心在直徑方向移動,將保護構件85從板狀工件80逐漸剝離。並且,旋轉滾筒211係以X軸方向的軸心為軸進行旋轉,並維持保護構件85的樹脂膜87沿著旋轉滾筒211的側面平緩地彎曲之狀態,且將保護構件85從板狀工件80的+Y方向側的外周緣朝向板狀工件80的中央逐漸剝離。若在剝離保護構件85的期間發生樹脂膜87斷裂,則會有剝離後樹脂膜87仍部分地殘留於板狀工件80、或因樹脂斷裂所產生之反作用力而從樹脂膜87對板狀工件80的一側之面800瞬間地施加衝力而導致板狀工件80的一側之面800損傷之情形,但藉由旋轉滾筒211的側面抵接圓形薄片86,可防止發生此種問題。By the grip moving means 63 shown in FIG. 5, as shown in FIG. 9, the
在本實施方式中,在將保護構件85從上述板狀工件80剝離中,握持部側拉伸負載測量部67可正確地測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載。In this embodiment, in peeling the
例如,由握持部側拉伸負載測量部67所進行之拉伸負載的測量,係藉由上下方向負載測量壓電元件673與水平方向負載測量壓電元件674而進行。
在圖9中,箭頭F3表示施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載F3。而且,由於板狀工件80與握持部61在Z軸方向分開預定距離,故拉伸負載F3係將圖9所示之方向為-Y方向的Y軸方向拉伸負載Fy3與方向為-Z方向的Z軸方向拉伸負載Fz3進行合成而成之拉伸負載F3。然後,由畢氏定理成立下述式6。
(Y軸方向拉伸負載Fy3)2
+(Z軸方向拉伸負載Fz3)2
=
(拉伸負載F3)2
・・・・(式6)For example, the tensile load measurement performed by the grip side tensile
在此,藉由水平方向負載測量壓電元件674,在每隔預定的時間間隔時,準確地測量Y軸方向拉伸負載Fy3,在每次測量時將負載檢測訊號發送至控制手段29。並且,藉由上下方向負載測量壓電元件673,在每隔預定的時間間隔時,準確地測量Z軸方向拉伸負載Fz3,在每次測量時將負載檢測訊號發送至控制手段29。Here, the
控制手段29進行將針對Y軸方向拉伸負載Fy3的實測值與針對Z軸方向拉伸負載Fz3的實測值代入式6之運算處理,在每隔預定的時間間隔時,測量拉伸負載F3。然後,控制手段29將在每隔預定的時間間隔時所測量之拉伸負載F3使用作為用於使由剝離手段6所進行之保護構件85的剝離操作最佳化的資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F3的值,例如,藉由控制手段29將由握持部移動手段63所進行之握持部61的移動速度最佳化。其結果成為下述狀態:在握持部61將保護構件85剝離之際的拉伸負載F3會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由握持部61所進行之剝離速度亦不會太慢,不浪費時間地將保護構件85逐漸從板狀工件80剝離。The control means 29 performs a calculation process of substituting the actual measurement value for the Y-axis direction tensile load Fy3 and the actual measurement value for the Z-axis direction tensile load Fz3 into
若將保護構件85從板狀工件80的一側之面800完全剝離,則握持保護構件85的突出部850之握持部61移動直到圖5所示之載置台27上。然後,握持部61解除突出部850的握持,使保護構件85落下至載置台27上。When the
(在剝離裝置2中剝離保護構件85的實施方式D)
說明在剝離保護構件85中,使保持手段50在Y軸方向移動,且如實施方式C般不使握持部61在Y軸方向移動之情形。在此情形中,例如,旋轉滾筒211係在與保持手段50的移動方向相同的方向移動。在本情形中,如圖10所示,已從圖7所示之狀態旋轉180度之握持部61停止在預定的高度位置及Y軸方向的位置P3,圖5所示之控制手段29識別握持部61所位於之高度位置及Y軸方向的位置P3。(Embodiment D in which the
藉由襯墊移動手段60使保持手段50往+Y方向移動,使停止移動之握持部61相對地從板狀工件80的外周緣朝向中心在直徑方向移動,將保護構件85從板狀工件80逐漸剝離。此外,旋轉滾筒211的側面抵接圓形薄片86,藉此防止樹脂膜87的破裂等。The holding means 50 is moved in the +Y direction by the pad moving means 60, and the holding
在本實施方式中,在將保護構件85從上述板狀工件80剝離中,襯墊側拉伸負載測量部64測量施加至介於握持部61與保持面502之間的保護構件85之拉伸負載。在圖10中,箭頭F4表示施加至介於握持部61與保持手段50的保持面502之間的保護構件85之拉伸負載F4。而且,拉伸負載F4係將圖10所示之方向為-Y方向的Y軸方向拉伸負載Fy4與方向為-Z方向的Z軸方向拉伸負載Fz4進行合成而成之拉伸負載F4。In this embodiment, when the
圖10所示之箭頭R4係第一襯墊側拉伸負載測量部641可在Z軸方向在每隔預定的時間間隔時測量之第一測量負載R4。第一測量負載R4例如具有+Z方向的方向。箭頭R5係第二襯墊側拉伸負載測量部642可在Z軸方向在每隔預定的時間間隔時測量之第二測量負載R5。第二測量負載R5例如具有-Z方向的方向。第一襯墊側拉伸負載測量部641與第二襯墊側拉伸負載測量部642在Y軸方向的距離L4係控制手段29預先識別之裝置設計值,且成為常數。The arrow R4 shown in FIG. 10 indicates the first measurement load R4 that the first pad side tensile
從第一襯墊側拉伸負載測量部641起至在Y軸方向的移動停止而位於位置P3的握持部61為止之Y軸方向的變化距離M1,係藉由保持手段50在Y軸方向移動而變化之變數。此外,藉由從圖5所示之襯墊移動手段60的馬達602(伺服馬達602)的旋轉編碼器回饋至控制手段29之編碼器訊號,控制手段29可掌握與可動板601一起移動之第一襯墊側拉伸負載測量部641的位置,因此控制手段29亦可在每隔預定的時間間隔時逐次識別該變化距離M1的值。第一襯墊側拉伸負載測量部641與停止於位置P3之握持部61在Z軸方向的距離N1係控制手段29預先識別之裝置設計值,且成為常數。The change distance M1 in the Y-axis direction from the first pad side tensile
由畢氏定理成立下述式7。 (Y軸方向拉伸負載Fy4)2 +(Z軸方向拉伸負載Fz4)2 = (拉伸負載F4)2 ・・・・(式7) 並且,由於在Z軸方向的力的平衡,成立下述式8。 (Z軸方向拉伸負載Fz4)=(第一測量負載R4)+(第二測量負載R5)・・・・(式8)According to Pythagorean theorem, the following formula 7 is established. (Tensile load Fy4 in the Y-axis direction) 2 + (Tensile load Fz4 in the Z-axis direction) 2 = (Tensile load F4) 2 ・・・・(Equation 7) Also, due to the balance of the forces in the Z-axis direction, it holds The following formula 8. (Z-axis tensile load Fz4) = (first measurement load R4) + (second measurement load R5) ・・・・ (Equation 8)
再者,由於在將第一襯墊側拉伸負載測量部641假設成原點之情形中,第一襯墊側拉伸負載測量部641周圍的力矩的平衡,故成立下述式9。
(Y軸方向拉伸負載Fy4)×(距離N1)=(第二測量負載R5)×(距離L4)+(Z軸方向拉伸負載Fz4)×(變化距離M1)・・・・(式9)In addition, in the case where the first pad-side tensile
由式8,控制手段29可在每隔預定的時間間隔時測量Z軸方向拉伸負載Fz4。並且,由將式9變形而成之下述式10,控制手段29可在每隔預定的時間間隔時測量Y軸方向拉伸負載Fy4。
(Y軸方向拉伸負載Fy4)={(第二測量負載R5)×(距離L4)+(Z軸方向拉伸負載Fz4)×(變化距離M1)}/(距離N1)・・・・(式10)According to Equation 8, the control means 29 can measure the tensile load Fz4 in the Z-axis direction every predetermined time interval. In addition, the control means 29 can measure the tensile load Fy4 in the Y-axis direction at predetermined time intervals from the following
控制手段29進行將針對Y軸方向拉伸負載Fy4的值與針對Z軸方向拉伸負載Fz4的值代入式7之運算處理,在每隔預定的時間間隔時測量拉伸負載F4。然後,控制手段29將在每隔預定的時間間隔時所測量之拉伸負載F4使用作為用於使由剝離手段6所進行之保護構件85的剝離操作最佳化的資訊。亦即,藉由在每隔預定的時間間隔時所測量之拉伸負載F4的值,例如,藉由控制手段29將由襯墊移動手段60所進行之保持手段50的移動速度最佳化。其結果成為下述狀態:在握持部61將已與保護構件85成為一體之剝離膠膜83剝離之際的拉伸負載F4會進行回饋控制,以成為板狀工件80不會破裂或在板狀工件80上不會發生殘膠等之最佳拉伸負載。並且,由相對於移動之保持手段50而在Y軸方向相對地移動之握持部61所進行之剝離速度亦不會太慢,不浪費時間地將保護構件85逐漸從板狀工件80剝離。The control means 29 performs a calculation process of substituting the value of the tensile load Fy4 in the Y-axis direction and the value of the tensile load Fz4 in the Z-axis direction into Equation 7, and measures the tensile load F4 at predetermined time intervals. Then, the control means 29 uses the tensile load F4 measured at every predetermined time interval as information for optimizing the peeling operation of the
若將保護構件85從板狀工件80的一側之面800完全剝離,則握持保護構件85的突出部850之握持部61移動直到圖5所示之載置台27上。然後,握持部61解除突出部850的握持,使保護構件85落下至載置台27上。When the
80:板狀工件 800:一側之面 801:另一側之面 806:切口部 82:切割膠膜 84:環狀框架 81:保護膠膜(保護構件) 1:第一實施方式的剝離裝置 10:基台 19:控制手段 17:回收箱 30:保持手段 300:吸附部 302:保持面 301:框體 31:支撐部 32:框架固定手段 33:活塞機構 34:部分剝離部 341:貫通孔 342:上推銷 346:閥 347:流體供給源 345:上下驅動部 83:剝離膠膜 831:膠膜滾筒 4:剝離手段 13:工作台移動手段 130:滾珠螺桿 132:馬達 133:可動構件 35:工作台側拉伸負載測量部 351:第一工作台側拉伸負載測量部 352:第二工作台側拉伸負載測量部 40:膠膜切斷手段 400:載置台 401:切斷器 402:切斷器移動手段 403:切斷器升降手段 41:握持部 412:一對握持爪 4121:固定爪 4122:可動爪 48:握持部支撐部 480:支撐台 483:活塞桿 484:壓缸管 42:剝離膠膜供給手段 420:捲筒 421:一對導引滾筒 422:一對送出滾筒 44:剝離膠膜黏貼手段 440:支撐台 441:壓接板升降機構 442:壓接板 46:X軸方向移動手段 460:滾珠螺桿 462:馬達 47:握持部側拉伸負載測量部 471:上下方向負載測量壓電元件 472:水平方向負載測量壓電元件 85:保護構件 86:圓形薄片 87:樹脂膜 850:突出部 2:第二實施方式的剝離裝置 20:底座 21:柱體 50:保持手段 500:吸附部 502:保持面 509:吸引管 52:臂部 53:支撐部 6:剝離手段 60:襯墊移動手段 602:馬達 600:滾珠螺桿 601:可動板 61:握持部 612:握持夾具 610:夾具基部 614:連結塊 616:連接構件 67:握持部側拉伸負載測量部 673:上下方向負載測量壓電元件 674:水平方向負載測量壓電元件 63:握持部移動手段 630:滾珠螺桿 631:一對導軌 632:馬達 633:可動塊 680:主軸 681:臂型外殼 64:襯墊側拉伸負載測量部 641:第一襯墊側拉伸負載測量部 642:第二襯墊側拉伸負載測量部 66:襯墊升降手段 660:滾珠螺桿 662:馬達 661:可動板 211:旋轉滾筒 27:載置台 26:落下手段 28:垃圾箱 29:控制手段80: Plate-shaped workpiece 800: One side face 801: The other side 806: Notch 82: cutting film 84: ring frame 81: Protective film (protective member) 1: The peeling device of the first embodiment 10: Abutment 19: Control 17: Recycle bin 30: Keep the means 300: Adsorption part 302: keep face 301: Frame 31: Support 32: Frame fixing means 33: Piston mechanism 34: Partially peeled part 341: Through hole 342: Promotion 346: Valve 347: fluid supply source 345: Up and down drive 83: Peel off the film 831: Film Roller 4: Stripping method 13: Workbench moving means 130: Ball screw 132: Motor 133: movable member 35: Tensile load measuring part on the worktable side 351: Tensile load measuring part on the side of the first worktable 352: The second worktable side tensile load measuring part 40: Film cutting means 400: Mounting table 401: Cutter 402: Cutting Device Moving Means 403: Cutter lifting means 41: Grip 412: A pair of gripping claws 4121: fixed claw 4122: Movable claw 48: Grip support part 480: support table 483: Piston Rod 484: Cylinder tube 42: Stripping film supply means 420: reel 421: A pair of guide rollers 422: A pair of delivery rollers 44: Peel off the adhesive film sticking method 440: support table 441: Crimping plate lifting mechanism 442: crimping plate 46: Means of movement in the X-axis direction 460: Ball screw 462: motor 47: Tensile load measuring part on the grip part side 471: up and down load measurement piezoelectric element 472: Piezoelectric element for horizontal load measurement 85: Protective member 86: round slice 87: Resin film 850: protrusion 2: The peeling device of the second embodiment 20: Base 21: Cylinder 50: keep the means 500: Adsorption part 502: keep face 509: Suction Tube 52: Arm 53: Support 6: Stripping means 60: Pad moving means 602: Motor 600: Ball screw 601: movable plate 61: Grip 612: Holding Fixture 610: Fixture base 614: connection block 616: connection member 67: Tensile load measuring part on the grip part side 673: up and down load measurement piezoelectric element 674: Piezoelectric element for horizontal load measurement 63: Grip moving means 630: Ball screw 631: a pair of rails 632: Motor 633: movable block 680: Spindle 681: Arm shell 64: Tensile load measuring part on pad side 641: First pad side tensile load measuring part 642: Second liner side tensile load measuring part 66: Pad lifting means 660: Ball screw 662: Motor 661: movable plate 211: Rotating drum 27: Mounting table 26: Falling means 28: trash can 29: Control
圖1係表示第一實施方式的剝離裝置之立體圖。 圖2係說明使保持手段在X軸方向移動,且一邊使握持部相對於保持手段的保持面朝向水平方向移動一邊藉由握持部側拉伸負載測量部測量拉伸負載,並將保護膠膜從板狀工件剝離之情形之剖面圖。 圖3係說明使保持手段在X軸方向移動且不使握持部移動,並藉由工作台側拉伸負載測量部測量拉伸負載,而將保護膠膜從板狀工件剝離之情形之剖面圖。 圖4係用於說明具備使板狀工件的切口部附近的保護膠膜從板狀工件剝離之部分剝離部之保持手段之剖面圖。 圖5係用於說明第二實施方式的剝離裝置之立體圖。 圖6係表示在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具握持突出部之狀態之剖面圖。 圖7係說明在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具將突出部的一部分從板狀工件的外周緣剝離之狀態之剖面圖。 圖8係說明在第二實施方式的剝離裝置中,正當開始保護構件的剝離時,握持部的握持夾具將突出部的一部分從板狀工件的外周緣剝離後,使保護構件沿著旋轉滾筒的側面之狀態之剖面圖。 圖9係說明使保持手段在Y軸方向移動,且一邊使握持部相對於保持手段的保持面朝向斜下方移動一邊藉由握持部側拉伸負載測量部測量拉伸負載,並從板狀工件將保護構件剝離之情形之剖面圖。 圖10係說明使保持手段在Y軸方向移動且不使握持部移動,並藉由襯墊側拉伸負載測量部測量拉伸負載,而將保護構件從板狀工件剝離之情形的剖面圖。FIG. 1 is a perspective view showing the peeling device of the first embodiment. Figure 2 illustrates that the holding means is moved in the X-axis direction, and the holding part is moved in the horizontal direction relative to the holding surface of the holding means while the holding part side tensile load measuring part measures the tensile load, and protects A cross-sectional view of the film peeling off the plate-shaped workpiece. Figure 3 is a cross-section illustrating the situation where the holding means is moved in the X-axis direction without moving the grip, and the tensile load is measured by the tensile load measuring part on the table side, and the protective film is peeled off from the plate-shaped workpiece picture. 4 is a cross-sectional view for explaining a holding means provided with a partial peeling portion for peeling the protective adhesive film near the cut portion of the plate-shaped workpiece from the plate-shaped workpiece. Fig. 5 is a perspective view for explaining the peeling device of the second embodiment. 6 is a cross-sectional view showing a state in which the gripping jig of the gripping portion grips the protruding portion when the peeling of the protective member is started in the peeling device of the second embodiment. 7 is a cross-sectional view illustrating a state in which the holding jig of the holding portion peels a part of the protrusion from the outer periphery of the plate-shaped workpiece when peeling of the protective member is started in the peeling device of the second embodiment. 8 illustrates that in the peeling device of the second embodiment, when peeling of the protective member is started, the holding jig of the holding portion peels off a part of the protrusion from the outer periphery of the plate-shaped workpiece, and then the protective member is rotated along Sectional view of the state of the side of the drum. Figure 9 illustrates that the holding means is moved in the Y-axis direction, and the holding part is moved obliquely downward with respect to the holding surface of the holding means while the tensile load is measured by the holding part side tensile load measuring part, and from the plate A cross-sectional view of the protective member peeled off from the shaped workpiece. 10 is a cross-sectional view illustrating a situation where the holding means is moved in the Y-axis direction without moving the grip, and the tensile load is measured by the liner side tensile load measuring part, and the protective member is peeled off from the plate-shaped workpiece .
80:板狀工件 80: Plate-shaped workpiece
800:一側之面 800: One side face
801:另一側之面 801: The other side
804:分割預定線 804: Divide the scheduled line
805:元件 805: component
82:切割膠膜 82: cutting film
84:環狀框架 84: ring frame
81:保護膠膜(保護構件) 81: Protective film (protective member)
1:第一實施方式的剝離裝置 1: The peeling device of the first embodiment
10:基台 10: Abutment
19:控制手段 19: Control
17:回收箱 17: Recycle bin
30:保持手段 30: Keep the means
300:吸附部 300: Adsorption part
302:保持面 302: keep face
301:框體 301: Frame
31:支撐部 31: Support
32:框架固定手段 32: Frame fixing means
33:活塞機構 33: Piston mechanism
83:剝離膠膜 83: Peel off the film
831:膠膜滾筒 831: Film Roller
4:剝離手段 4: Stripping method
13:工作台移動手段 13: Workbench moving means
130:滾珠螺桿 130: Ball screw
131:一對導軌 131: A pair of rails
132:馬達 132: Motor
133:可動構件 133: movable member
35:工作台側拉伸負載測量部 35: Tensile load measuring part on the worktable side
351:第一工作台側拉伸負載測量部 351: Tensile load measuring part on the side of the first worktable
352:第二工作台側拉伸負載測量部 352: The second worktable side tensile load measuring part
40:膠膜切斷手段 40: Film cutting means
400:載置台 400: Mounting table
401:切斷器 401: Cutter
402:切斷器移動手段 402: Cutting Device Moving Means
403:切斷器升降手段 403: Cutter lifting means
404:載置面 404: Mounting surface
405:槽 405: Slot
41:握持部 41: Grip
412:一對握持爪 412: A pair of gripping claws
4121:固定爪 4121: fixed claw
4122:可動爪 4122: Movable claw
48:握持部支撐部 48: Grip support part
480:支撐台 480: support table
483:活塞桿 483: Piston Rod
484:壓缸管 484: Cylinder tube
42:剝離膠膜供給手段 42: Stripping film supply means
420:捲筒 420: reel
421:一對導引滾筒 421: A pair of guide rollers
422:一對送出滾筒 422: A pair of delivery rollers
44:剝離膠膜黏貼手段 44: Peel off the adhesive film sticking method
440:支撐台 440: support table
441:壓接板升降機構 441: Crimping plate lifting mechanism
442:壓接板 442: crimping plate
46:X軸方向移動手段 46: Means of movement in the X-axis direction
460:滾珠螺桿 460: Ball screw
461:導軌 461: Rail
462:馬達 462: motor
463:可動板 463: movable plate
47:握持部側拉伸負載測量部 47: Tensile load measuring part on the grip part side
471:上下方向負載測量壓電元件 471: up and down load measurement piezoelectric element
472:水平方向負載測量壓電元件 472: Piezoelectric element for horizontal load measurement
Claims (6)
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JP (1) | JP7457524B2 (en) |
KR (1) | KR20210106887A (en) |
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JP2003338474A (en) | 2002-05-21 | 2003-11-28 | Lintec Corp | Machining method of brittle member |
JP5102138B2 (en) | 2008-07-31 | 2012-12-19 | 株式会社ディスコ | Protective tape peeling device |
JP5442288B2 (en) | 2009-03-27 | 2014-03-12 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus using the same |
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