CN113299580A - Stripping device - Google Patents
Stripping device Download PDFInfo
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- CN113299580A CN113299580A CN202110187593.7A CN202110187593A CN113299580A CN 113299580 A CN113299580 A CN 113299580A CN 202110187593 A CN202110187593 A CN 202110187593A CN 113299580 A CN113299580 A CN 113299580A
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
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- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Provided is a peeling device which does not cause wafer breakage or paste residue when peeling a protective member from a wafer, and which does not take a long time to peel the protective member from the wafer. The peeling device peels a protective member, which protects one surface of a plate-shaped workpiece, from the one surface, and includes a peeling unit which grips an outer peripheral portion of the protective member, which covers the one surface of the plate-shaped workpiece held by a holding surface of a holding unit, peels the protective member from an outer periphery of the plate-shaped workpiece toward a center, and further peels the protective member from the center toward an outer periphery on the opposite side of the outer periphery. The peeling unit includes: a grip portion that grips an outer peripheral portion of the protective member; a moving means for moving the grip portion on a straight line from the outer periphery of the holding surface through the center in a direction away from the center; and a tensile load measuring unit that measures a tensile load applied to the protective member interposed between the grip portion and the holding surface.
Description
Technical Field
The present invention relates to a peeling apparatus for peeling a protective member from a plate-like workpiece.
Background
The tape bonder can bond the dicing tape to the other surface of the wafer having the protective tape bonded to one surface thereof and the ring frame, and can support the wafer by the ring frame via the dicing tape. After the dicing tape is bonded, the protective tape bonded to the wafer is peeled (see, for example, patent document 1).
Patent document 1: japanese patent laid-open publication No. 2015-167205
When the protective tape is peeled, for example, a peeling tape is stuck to an outer peripheral portion of the protective tape, and the protective tape is peeled by holding the peeling tape and pulling the peeling tape in a direction away from the wafer. However, if the speed of pulling the protective tape is high when the protective tape is peeled, the paste of the protective tape may remain on one surface of the wafer or the wafer may be damaged. On the other hand, if the speed of stretching the protective tape is slow, it takes an unnecessary time to reduce the work efficiency.
The adhesive strength of the protective tape differs depending on the type of device formed on one surface of the wafer to which the protective tape is attached. That is, even with the same protective tape, there are cases where the protective tape is strongly bonded and where the protective tape is weakly bonded depending on devices formed on the wafer, and it is necessary to change the stretching force (stretching speed) at the time of peeling depending on the difference in the adhesive strength.
Further, since the tensile force differs between a small peeled area immediately after the start of peeling of the circular protective tape and a large peeled area when the protective tape is peeled to the vicinity of the center of the wafer, the force applied to the wafer also differs depending on the position where the protective tape is peeled. However, conventionally, it takes a useless time to repeat a peeling test while gradually increasing the peeling speed for each wafer to determine a predetermined peeling speed and perform the peeling at the peeling speed, or to perform the peeling at a safe speed with a margin that makes it impossible to break the wafer.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a peeling apparatus capable of peeling a protective member from a wafer without taking a useless time without causing a crack in the wafer or a paste residue on the wafer when peeling the protective member from the wafer.
According to the present invention, there is provided a peeling apparatus for peeling a protective member that protects one surface of a plate-like workpiece from the one surface, the peeling apparatus comprising: a holding unit that holds the other surface of the plate-like workpiece by a holding surface; and a peeling unit configured to grip an outer peripheral portion of the protective member covering the one surface of the plate-shaped workpiece held by the holding surface, peel the protective member from an outer periphery of the plate-shaped workpiece toward a center, and further peel the protective member from the center toward an outer periphery on an opposite side of the outer periphery, the peeling unit including: a grip portion that grips an outer peripheral portion of the protective member; a moving unit that moves the grip portion and the holding unit relatively in a direction parallel to the holding surface, moves the grip portion from an outer periphery of the holding surface toward a center, and moves the grip portion that has passed through the center of the holding surface on a straight line in a direction away from the center; and a tensile load measuring unit that measures a tensile load applied to the protective member interposed between the holding unit and the holding surface, and optimizes the peeling operation of the peeling unit by measuring the tensile load applied to the protective member by the tensile load measuring unit.
Preferably, the tensile load measuring unit is constituted by a piezoelectric element disposed in a support portion that supports the holding unit.
Preferably, the tensile load measuring unit is configured by a piezoelectric element disposed in a grip supporting unit that supports the grip.
Preferably, the protective member is a protective tape, the plate-shaped workpiece has a cut portion in an outer peripheral portion thereof, the holding unit includes a partially peeled portion that lifts up the protective tape, which is not joined to the plate-shaped workpiece and is located in the cut portion, to peel the protective tape near the cut portion from the plate-shaped workpiece, and the holding portion holds the outer peripheral portion of the protective tape peeled by the partially peeled portion.
Preferably, the protective member is a protective tape, the peeling device further includes a peeling tape joining unit that joins a peeling tape to an outer peripheral portion of the protective tape, the grip portion grips the peeling tape joined to the protective tape instead of gripping the outer peripheral portion of the protective tape, and the tensile load measuring portion measures a tensile load applied to the peeling tape integrated with the protective tape interposed between the grip portion and the holding surface.
Preferably, the protective member has an extension portion slightly extending from an outer periphery of the plate-like workpiece, and the grip portion grips the extension portion.
According to the present invention, the peeling operation of the peeling unit can be optimized by measuring the tensile load applied to the protective member by the tensile load measuring unit. That is, the protective member can be peeled from the wafer at an optimum peeling speed without causing breakage of the wafer or generation of paste residue on the wafer, and without wasting time.
When the tensile load measuring unit is constituted by a piezoelectric element arranged in a support portion that supports the holding unit, the tensile load applied to the protective member can be accurately measured.
When the tensile load measuring unit is constituted by a piezoelectric element arranged in the grip supporting unit that supports the grip, the tensile load applied to the protective member can be accurately measured.
The protective member is a protective tape, the plate-like work has a cut portion in an outer peripheral portion thereof, and the holding unit has a partially peeled portion which lifts up the protective tape which is not joined to the plate-like work and is located in the cut portion, and peels the protective tape near the cut portion from the plate-like work, whereby the holding portion can easily hold the outer peripheral portion of the protective tape peeled by the partially peeled portion.
The protective member is a protective tape, and the separating operation of the separating unit can be optimized by providing a separating tape joining unit for joining a separating tape to the outer peripheral portion of the protective tape, wherein the grip portion grips the separating tape joined to the protective tape instead of gripping the outer peripheral portion of the protective tape, and the tensile load measuring portion measures the tensile load applied to the separating tape integrated with the protective tape interposed between the grip portion and the holding surface instead of measuring the tensile load applied to the protective tape.
The protection member has a protruding portion that slightly protrudes from the outer periphery of the plate-like workpiece, whereby the grip portion can easily grip the protruding portion of the outer peripheral portion of the protection member.
Drawings
Fig. 1 is a perspective view showing a peeling apparatus of embodiment 1.
Fig. 2 is a cross-sectional view illustrating a case where the holding unit is moved in the X-axis direction and the grip portion is moved in the horizontal direction with respect to the holding surface of the holding unit, while the load is measured by the grip portion-side tensile load measuring portion and the protective tape is peeled from the plate-like workpiece.
Fig. 3 is a cross-sectional view for explaining a case where the holding unit is moved in the X-axis direction without moving the gripping portion, the tensile load is measured by the belt-side tensile load measuring portion, and the protective belt is peeled from the plate-like workpiece.
Fig. 4 is a cross-sectional view for explaining a holding unit having a partially peeled portion which peels a protective tape in the vicinity of a cut portion of a plate-like work from the plate-like work.
Fig. 5 is a perspective view for explaining the peeling device of embodiment 2.
Fig. 6 is a cross-sectional view showing a state in which the gripping jig of the gripping portion grips the extension portion when the peeling of the protective member is started in the peeling apparatus according to embodiment 2.
Fig. 7 is a cross-sectional view illustrating a state in which the gripping jig of the gripping portion is peeling off a part of the protruding portion from the outer peripheral edge of the plate-like workpiece when peeling off of the protective member is started in the peeling-off device according to embodiment 2.
Fig. 8 is a cross-sectional view illustrating a state in which the protective member is caused to follow the side surface of the rotating roller after a part of the protruding portion is peeled from the outer peripheral edge of the plate-like workpiece by the gripping jig of the gripping portion when the peeling of the protective member is started in the peeling device according to embodiment 2.
Fig. 9 is a cross-sectional view illustrating a case where the tensile load is measured by the grip portion side tensile load measuring portion and the protective member is peeled off from the plate-like workpiece while the holding unit is moved in the Y-axis direction and the grip portion is moved obliquely downward with respect to the holding surface of the holding unit.
Fig. 10 is a cross-sectional view for explaining a case where the tensile load is measured by the pad-side tensile load measuring portion and the protective member is peeled off from the plate-like workpiece in a case where the holding unit is moved in the Y-axis direction and the gripping portion is not moved.
Description of the reference symbols
80: a plate-like workpiece; 800: a face; 801: the other side; 806: a cut-out portion; 82: scribing a tape; 84: an annular frame; 81: a protective tape (protective member); 1: the peeling apparatus of embodiment 1; 10: a base station; 19: a control unit; 17: a recycling bin; 30: a holding unit; 300: an adsorption part; 302: a holding surface; 301: a frame body; 31: a support portion; 32: a frame fixing unit; 33: a piston mechanism; 34: a partial peeling section; 341: a through hole; 342: jacking the pin; 346: a valve; 347: a fluid supply source; 345: an up-down driving part; 83: stripping the tape; 831: a belt roller; 4: a peeling unit; 13: a table moving unit; 130: a ball screw; 132: an electric motor; 133: a movable member; 35: a table-side tensile load measuring unit; 351: a 1 st stage side tensile load measuring section; 352: a 2 nd stage side tensile load measuring section; 40: a tape cutting unit; 400: a mounting table; 401: a cutter; 402: a tool moving unit; 403: a cutter lifting unit; 41: a grip portion; 412: a pair of holding claws; 4121: a fixed jaw; 4122: a movable claw; 48: a grip support portion; 480: a support table; 483: a piston rod; 484: a cylinder barrel; 42: a peeling tape supply unit; 420: a reel; 421: a pair of guide rollers; 422: a pair of delivery rollers; 44: a peeling tape attaching unit; 440: a support table; 441: a pressing plate lifting mechanism; 442: a pressing plate; 46: an X-axis direction moving unit; 460: a ball screw; 462: an electric motor; 47: a grip portion side tensile load measuring portion; 471: a vertical load measuring piezoelectric element; 472: a horizontal direction load measuring piezoelectric element; 80: a plate-like workpiece; 85: a protective member; 86: a circular sheet; 87: a resin film; 850: a protruding portion; 2: the peeling apparatus of embodiment 2; 20: a base; 21: a column; 50: a holding unit; 500: an adsorption part; 502: a holding surface; 509: a suction tube; 52: an arm portion; 53: a support portion; 6: a peeling unit; 60: a pad moving unit; 602: an electric motor; 600: a ball screw; 601: a movable plate; 61: a grip portion; 612: a holding jig; 610: a clamp base; 614: a connecting block; 616: a coupling member; 67: a grip portion side tensile load measuring portion; 673: a vertical load measuring piezoelectric element; 674: a horizontal direction load measuring piezoelectric element; 63: a grip moving unit; 630: a ball screw; 631: a pair of guide rails; 632: an electric motor; 633: a movable block; 680: a main shaft; 681: an arm-shaped housing; 64: a pad-side tensile load measuring unit; 641: a 1 st pad-side tensile load measuring unit; 642: a 2 nd pad-side tensile load measuring section; 66: a pad lifting unit; 660: a ball screw; 662: an electric motor; 661: a movable plate; 211: a rotating roller; 27: a loading table; 26: a drop unit; 28: a dust collecting box; 29: a control unit.
Detailed Description
(embodiment 1 of the peeling apparatus)
A peeling apparatus 1 according to embodiment 1 shown in fig. 1 is an example of a peeling apparatus for peeling a protective tape 81 as a protective member pasted to one surface 800 which is an upper surface in fig. 1 of a plate-like work 80 by using a tape-like peeling tape 83, and the peeling apparatus 1 includes at least: a holding unit 30 that holds the other face 801 of the plate-like workpiece 80 by the holding face 302; and a peeling unit 4 that grips an outer peripheral portion of the protective tape 81 covering the one surface 800 of the plate-shaped workpiece 80 held by the holding surface 302, peels the protective tape 81 from the outer periphery of the plate-shaped workpiece 80 toward the center, and further peels the protective tape from the center to the outer periphery on the opposite side of the outer periphery.
The plate-like workpiece 80 shown in fig. 1 is, for example, a semiconductor wafer having a circular outer shape and made of silicon, one surface 800 of which is divided into a lattice shape by a plurality of lines to divide 804 that are perpendicular to each other, and devices 805 such as ICs are formed in each of the areas divided into the lattice shape.
In the present embodiment, the protective member to be bonded so as to cover the entire surface 800 of the plate-shaped workpiece 80 is, for example, a protective tape 81, and the protective tape 81 has a base material layer made of a resin having a certain degree of flexibility (for example, a polyolefin resin) and an adhesive layer (paste layer) on the base material layer.
The plate-like workpiece 80 may be made of gallium arsenide, sapphire, ceramic, resin, gallium nitride, silicon carbide, or the like, in addition to silicon, and the protective member is not limited to the protective tape 81.
For example, the dicing tape 82 having a larger diameter than the plate-like work 80 is attached to the other surface 801 (lower surface in fig. 1) which is the opposite surface of the one surface 800 of the plate-like work 80. Further, since the outer peripheral portion of the paste layer of the dicing tape 82 is also bonded to the ring-shaped frame 84, the plate-shaped workpiece 80 is supported by the ring-shaped frame 84 via the dicing tape 82, and can be handled by the ring-shaped frame 84.
The peeling device 1 has a rectangular parallelepiped base 10 extending in the X-axis direction, and a stage moving means 13 for reciprocating a holding means 30 in the X-axis direction is disposed on the base 10. The table moving unit 13 includes: a ball screw 130 disposed on the base 10; a motor 132 connected to one end of the ball screw 130; a pair of guide rails 131 extending in parallel with the ball screw 130; and a movable member 133 movable in the X-axis direction. The holding unit 30 is disposed on the upper surface of the movable member 133 via the support portion 31. The pair of guide rails 131 are in sliding contact with the lower surface of the movable member 133, and the ball screw 130 is screwed to a nut, not shown, disposed on the lower surface of the movable member 133. The ball screw 130 is driven by the motor 132 to rotate, and the holding unit 30 moves in the X-axis direction along the guide rail 131 together with the movable member 133.
The table moving unit 13 is a part of the peeling unit 4, and functions as a moving unit that: the grip portion 41 and the holding unit 30 are relatively moved in the X-axis direction parallel to the holding surface 302, the grip portion 41 is moved from the outer periphery of the holding surface 302 toward the center, and the grip portion 41 passing through the center of the holding surface 302 is moved on a straight line in a direction away from the center.
In the present embodiment, the holding unit 30 is a holding table having: an adsorption part 300 which is made of a porous member or the like and adsorbs the plate-like work 80; and a housing 301 that supports the suction unit 300. The suction unit 300 communicates with a suction source, not shown, such as a vacuum generator, and the suction force generated by suction from the suction source is transmitted to a flat holding surface 302, which is an exposed surface of the suction unit 300, so that the holding unit 30 can suction and hold the plate-shaped workpiece 80 on the holding surface 302.
For example, the holding unit 30 is surrounded by the frame fixing unit 32 that fixes the ring frame 84. The frame fixing unit 32, which has an annular shape in plan view and on which the annular frame 84 is placed, is configured to suck and fix the annular frame 84 by a suction force generated by a suction source (not shown), and is configured to be movable up and down in the Z-axis direction (vertical direction) by the piston mechanisms 33 arranged uniformly in the circumferential direction. Instead of the frame fixing means 32, a mechanical jig that opens and closes a plurality of jigs by a spring or the like may be disposed around the holding means 30.
For example, as a tensile load measuring unit for measuring a tensile load applied to the protective tape 81 interposed between the gripping portion 41 and the holding surface 302 shown in fig. 1 described later, the peeling unit 4 includes a tensile load measuring unit 35, and the tensile load measuring unit 35 is constituted by a piezoelectric element disposed in the supporting portion 31 for supporting the holding unit 30. Hereinafter, the tensile load measuring unit 35 is referred to as a table-side tensile load measuring unit 35.
In the present embodiment, the support portion 31 that supports the holding unit 30 has, for example, a cylindrical shape, and the table-side tensile load measuring portion 35 is disposed at a connecting portion of the support portion 31 and the movable member 133 of the table moving unit 13. That is, the table-side tensile load measuring portion 35 is sandwiched between the support portion 31 and the movable member 133 from the vertical direction (Z-axis direction), and is disposed so as to receive the weight of the holding unit 30 attached to the support portion 31. In the present embodiment, two table-side tensile load measuring units 35 are disposed below the holding unit 30 so as to face each other in the X-axis direction. That is, the table-side tensile load measuring unit 35 includes a 1 st table-side tensile load measuring unit 351 and a 2 nd table-side tensile load measuring unit 352.
As a 1 st stage side tensile load measuring part 351 (2 nd stage side)Tensile load measuring unit 352), for example, barium titanate (BaTiO)3) Lead zirconate titanate (PZT), lithium niobate (LiNbO)3) Or lithium tantalate (LiTaO)3) The material is formed into a flat plate shape or a columnar shape, and the load received can be converted into a voltage signal and output to the control unit 19 that controls the entire peeling apparatus 1.
A peeling unit 4 for peeling the protective tape 81 of the plate-like work 80 held by the holding unit 30 is disposed above the moving path of the holding unit 30, and the peeling unit 4 includes, for example: a tape cutting unit 40 that cuts the release tape 83 by a predetermined length; a peeling tape supply unit 42 which pulls out the peeling tape 83 from a tape roller 831 having wound the peeling tape 83 into a roll shape and supplies the peeling tape 83 to the protective tape 81 pasted on one surface 800 of the plate-like work 80; a peel tape joining unit 44 joining the peel tape 83 to the outer peripheral portion of the protective tape 81; a grip portion 41 that grips the release tape 83 joined to the protective tape 81; and an X-axis direction moving unit 46 that moves the release tape application unit 44 and the grip portion 41 in the X-axis direction.
The X-axis direction moving means 46 functions as the following moving means: the grip portion 41 and the holding unit 30 are relatively moved in the X-axis direction parallel to the holding surface 302, the grip portion 41 is moved from the outer periphery of the holding surface 302 toward the center, and the grip portion 41 passing through the center of the holding surface 302 is moved on a straight line in a direction away from the center.
Specifically, the X-axis direction moving unit 46 includes: a ball screw 460 having an axis in the X-axis direction; a pair of guide rails 461 disposed in parallel with the ball screw 460; a motor 462 coupled to the ball screw 460 to rotate the ball screw 460; and a movable plate 463 having a nut screwed into the ball screw 460 and side portions slidably contacting the guide rails 461, wherein when the motor 462 rotates the ball screw 460, the movable plate 463 is guided by the guide rails 461 and reciprocates in the X-axis direction, and the peeling tape joining unit 44 and the holding portion 41 attached to the movable plate 463 also reciprocate in the X-axis direction.
The release tape supply unit 42 has: a reel 420 to which a belt roller 831 is mounted; a pair of guide rollers 421 for guiding the release tape 83 pulled out from the tape roller 831 downward; and a pair of delivery rollers 422 disposed below the pair of guide rollers 421. A back tension is applied to the reel 420 by a control mechanism, not shown, and the tension is adjusted so that the release tape 83 pulled out from the tape roller 831 does not slacken. The pair of guide rollers 421 turn back while sandwiching the peeling belt 83, apply tension and guide the peeling belt to the pair of feed rollers 422, and the pair of feed rollers 422 can feed the peeling belt 83 to the gripping portion 41.
The release tape 83 is, for example, a heat seal having a two-layer structure including an adhesive layer and a base material, which are bonded to the protective tape 81 by heating the outer peripheral portion of the protective tape 81. The material of the base material is, for example, a resin such as polyethylene terephthalate. The adhesive layer is made of a thermosetting resin such as an epoxy resin. The adhesion of the release tape 83 to the protective tape 81 is set to be stronger than the adhesion of the protective tape 81 to the plate-like workpiece 80. The release tape 83 is wound up with the adhesive layer positioned inside (lower surface side in a stretched state) to form a tape roller 831. The release tape 83 is not limited to heat sealing.
A grip supporting portion 48 is attached to a supporting base 480 fixed to a side surface of the movable plate 463 of the X-axis direction moving unit 46 shown in fig. 1, and a pair of gripping claws 412 constituting the grip 41 are vertically movable by the grip supporting portion 48.
The pair of gripping claws 412 includes, for example: a substantially L-shaped fixing claw 4121 in side view; and a movable claw 4122 that is disposed opposite to the fixed claw 4121 in the Z-axis direction and can be moved closer to or farther from the fixed claw 4121. In the gripping portion 41, the movable claw 4122 is moved closer to the fixed claw 4121, whereby one end of the release tape 83 can be gripped therebetween. The pair of gripping claws 412 gripping the release tape 83 can be positioned by the gripping portion supporting portion 48 at a height position suitable for tape joining on the protective tape 81 of the plate-like workpiece 80 held by the holding unit 30. On the other hand, the movable claw 4122 can be separated from the fixed claw 4121, whereby the grip state of the one end of the peeling tape 83 by the grip portion 41 can be released.
The peeling tape joining unit 44 shown in fig. 1 is disposed between the pair of feed rollers 422 and the grip portion 41. The release tape application unit 44 includes: a support table 440 fixed to a side surface of the movable plate 463 of the X-axis direction moving unit 46; a pressing plate lifting mechanism 441, which is composed of an air cylinder and the like, and is supported by the support base 440; and a pressing plate 442 that can be moved up and down by the pressing plate lifting mechanism 441.
A heater, not shown, that generates heat by the flow of current is attached to the pressing plate 442, and when the pressing plate 442 is lowered by the pressing plate lifting mechanism 441 to press and join the release tape 83 to the outer peripheral portion of the protective tape 81, the pressing plate 442 is heated by the heater, not shown, so that the release tape 83 can be locally heat-welded to the protective tape 81. This enables the release tape 83 to be satisfactorily joined to the protective tape 81.
The tape cutting unit 40 is disposed between the pair of feed rollers 422 and the release tape joining unit 44, for example. The tape cutting unit 40 includes: a mounting table 400 having a mounting surface 404 on which the adhesive layer side (lower side) of the release tape 83 is mounted, and a groove 405 that crosses the mounting surface 404 in the width direction of the release tape 83 (Y-axis direction perpendicular to the X-axis direction in the horizontal plane); a cutter 401 traveling within the groove 405 along the direction of extension of the groove 405; a tool moving unit 402 as a ball screw mechanism that supports the tool 401 via a tool lifting unit 403 and moves the tool 401 in the extending direction (Y-axis direction) of the groove 405; and a tool lifting and lowering unit 403 configured by an air cylinder or the like, which lifts and lowers the tool 401 in the Z-axis direction with respect to the mounting surface 404.
For example, as a tensile load measuring unit for measuring a tensile load applied to the protective tape 81 interposed between the grip portion 41 and the holding surface 302, the peeling unit 4 includes a tensile load measuring unit 47, and the tensile load measuring unit 47 is constituted by a piezoelectric element arranged in the grip portion supporting portion 48 for supporting the grip portion 41. Hereinafter, the tensile load measuring unit 47 is referred to as a gripping unit side tensile load measuring unit 47. The grip portion side tensile load measuring unit 47 includes, for example, a vertical load measuring piezoelectric element 471 and a horizontal load measuring piezoelectric element 472. The peeling device 1 may have at least one of the table-side tensile load measuring unit 35 and the grip-side tensile load measuring unit 47 as a tensile load measuring unit.
The grip support portion 48 is, for example, an electric cylinder or the like in which a piston rod 483 is movable up and down in the Z-axis direction from inside the cylinder 484. The vertical load measuring piezoelectric element 471 has a columnar outer shape, and is integrally disposed on the piston rod 483 so that two rods are vertically connected to form a single piston rod 483.
The horizontal load measuring piezoelectric element 472 is formed in a flat plate shape, for example, and is disposed in a state of being sandwiched by two members from both sides in the X axis direction at a coupling portion between the distal end portion of the piston rod 483 and the fixing claw 4121. The vertical load measuring piezoelectric element 471 and the horizontal load measuring piezoelectric element 472 are made of the same material as the table-side tensile load measuring unit 35 described above.
For example, a recovery box 17 is disposed at a position below the moving path of the grip 41, and the recovery box 17 drops and recovers the protective tape 81 peeled by the peeling unit 4.
The peeling apparatus 1 includes a control unit 19 for controlling each configuration of the apparatus, for example, the control unit 19 is configured by a CPU for performing arithmetic processing according to a control program, a storage medium such as a memory, and the like, and is electrically connected to a gripping portion support portion 48 such as an electric cylinder for moving up and down the table moving unit 13, the X-axis direction moving unit 46, and the gripping portion 41, and the like via a wired or wireless communication path, not shown, and performs control of the movement speed in the X-axis direction of the holding unit 30 for sucking and holding the plate-shaped workpiece 80 and control of alignment with the gripping portion 41 and the like under the control of the table moving unit 13 by the control unit 19. Further, under the control of the X-axis direction moving means 46 and the grip support portion 48 by the control means 19, the control of the moving speed and the control of the positioning of the grip 41 that grips the separation tape 83 of the protective tape 81 joined to the plate-like workpiece 80 are performed. For example, the control unit 19 controls the X-axis direction moving unit 46 by controlling the rotation speed of the motor 462. In addition, the control unit 19 can receive information on the tensile loads measured by the respective load measuring units from the table-side tensile load measuring unit 35 and the grip-portion-side tensile load measuring unit 47.
For example, when the motor 132 of the table moving means 13 is a servo motor, a rotary encoder of the servo motor is connected to the control means 19 which also functions as a servo amplifier, and after an operation signal is supplied to the servo motor from an output interface of the control means 19, the rotational speed of the servo motor is output as an encoder signal to an input interface of the control means 19. Then, the control unit 19 that has received the encoder signal can sequentially recognize the movement amount of the holding unit 30 according to the rotation angle of the motor 132, thereby sequentially recognizing the position of the holding unit 30 in the X-axis direction.
Next, a case where the protective tape 81 is peeled from the plate-like workpiece 80 by using the peeling apparatus 1 shown in fig. 1 will be described. First, the plate-like workpiece 80 integrated with the ring-like frame 84 is placed on the holding surface 302 of the holding unit 30 with the protective tape 81 facing upward, and the ring-like frame 84 is placed on the frame fixing unit 32 disposed on the outer peripheral side of the holding unit 30. Next, the suction source, not shown, is operated to suck and hold the plate-like workpiece 80 by the holding surface 302, and the ring-shaped frame 84 is sucked and fixed by the frame fixing unit 32. Then, the ring frame 84 is lowered to a position lower than the holding surface 302, for example.
The release tape 83 is fed out from the tape roller 831 toward the grip portion 41 by a pair of guide rollers 421 shown in fig. 1. The adhesive layer side (inside) of the release tape 83 is placed on the placement surface 404 of the placement table 400 of the tape cutting unit 40, and then, after one end of the release tape 83 is positioned on the upper surface of the fixed claw 4121 of the grip portion 41, the movable claw 4122 approaches the fixed claw 4121, and the grip portion 41 grips one end of the release tape 83. Subsequently, the gripping portion 41 is moved in the-X direction by the X-axis direction moving means 46, and the gripped release tape 83 is pulled in this direction. At this stage, the pressing plate 442 of the release tape joining unit 44 and the cutter 401 of the tape cutting unit 40 are in a standby state on the upper side of the release tape 83.
For example, the holding unit 30 is moved in the + X direction to position the outer peripheral portion of the protective tape 81 directly below the separation tape joining unit 44. Next, the pressing plate 442 heated by a heater, not shown, provided inside the protective tape is lowered, and the release tape 83 is pressed against the outer peripheral portion of the protective tape 81 from above by the lower end of the pressing plate 442, so that the adhesive layer of the release tape 83 is thermally fused to the protective tape 81.
In this state, the cutter 401 is positioned at one end of the groove 405 of the mounting table 400 exposed from one side edge of the release tape 83. Next, the tool 401 is lowered by the tool lifting and lowering unit 403 until the lowermost end of the tool 401 reaches the groove 405. Next, the cutter 401 advances in the-Y direction along the extending direction of the groove 405, and the peeling tape 83 is cut by the cutter 401. After the cutter 401 cuts the release tape 83, the cutter 401 and the pressing plate 442 rise in the + Z direction and retreat from the release tape 83.
(embodiment A for separating the protective tape 81 in the separating apparatus 1)
The following will be explained: in the peeling of the protective tape 81, after the holding unit 30 is moved in the X-axis direction and the grip portion 41 is positioned at a predetermined distance from the holding surface 302 of the holding unit 30, the grip portion 41 is moved in the horizontal direction.
The holding portion 41 holding the release tape 83 moves in the + Z direction, and a part of the protective tape 81 is released from one surface 800 of the plate-like workpiece 80. Subsequently, the grip 41 is moved in the-X direction by the X-axis direction moving means 46. Further, the holding unit 30 is moved in the + X direction by the table moving unit 13, and the holding portion 41 is moved relatively in the radial direction from the outer peripheral edge of the plate-like workpiece 80 toward the center, so that the protective tape 81 is peeled from the plate-like workpiece 80. Further, a rotating roller, not shown, may be disposed above the moving path of the holding unit 30, and the protective tape 81 may be separated by abutting the rotating roller, thereby preventing the protective tape 81 from being bent when the protective tape 81 is separated.
Further, for example, since the protective tape 81 can be peeled from the plate-like workpiece 80 by relatively moving the grip portion 41 in the radial direction from the outer peripheral edge of the plate-like workpiece 80 toward the center, the protective tape 81 may be peeled by moving only the grip portion 41 in the-X direction without moving the holding unit 30 in the + X direction, for example.
In the present embodiment, when the protective tape 81 is peeled from the plate-like workpiece 80, the grip-portion-side tensile load measuring portion 47 shown in fig. 2 can accurately measure the tensile load applied to the peeling tape 83 integrated with the protective tape 81 interposed between the grip portion 41 and the holding surface 302.
For example, the tensile load is measured by the grip-portion-side tensile load measuring unit 47 by the vertical load measuring piezoelectric element 471 and the horizontal load measuring piezoelectric element 472. In fig. 2, the peeling unit 4, the holding unit 30, and the like are partially simplified and shown.
In fig. 2, an arrow F1 directed obliquely upward indicates a tensile load F1 applied to the release tape 83 integrated with the protective tape 81 interposed between the grip portion 41 and the holding surface 302 of the holding unit 30. The tensile load F1 is a tensile load F1 obtained by combining an X-axis direction tensile load Fx1 in the-X direction and a Z-axis direction tensile load Fz1 in the + Z direction shown in fig. 2. Then, according to the pythagorean theorem, the following formula 1 holds.
(X-axis direction tensile load Fx1)2+ (tensile load in Z-axis Fz1)2Not (tensile load F1)2DEG (formula 1)
Here, the X-axis direction tensile load Fx1 is measured at predetermined time intervals by the horizontal direction load measuring piezoelectric element 472. That is, the horizontal load measuring piezoelectric element 472 is slightly deformed by the X-axis direction tensile load Fx1, and a potential difference corresponding to the load is generated in the horizontal load measuring piezoelectric element 472. By generating a potential difference in the horizontal direction load measuring piezoelectric element 472, a load detection signal is transmitted from the horizontal direction load measuring piezoelectric element 472 to the control unit 19 shown in fig. 1 at each measurement. The Z-axis direction tensile load Fz1 is measured at predetermined time intervals by the vertical direction load measuring piezoelectric elements 471, and a load detection signal is sent to the control unit 19 every time measurement is made.
The control unit 19 performs calculation processing in which the actual measurement value of the X-axis direction tensile load Fx1 and the actual measurement value of the Z-axis direction tensile load Fz1 are substituted for expression 1, and measures the tensile load F1 at predetermined time intervals. The control unit 19 uses the tensile load F1 measured at predetermined time intervals as information for optimizing the separating operation of the protective tape 81 by the separating unit 4. That is, the moving speed of the gripping portion 41 in the-X direction by the X-axis direction moving means 46 is optimized by the control means 19, for example, based on the value of the tensile load F1 measured at predetermined time intervals. As a result, the feedback control is performed as follows: the tensile load F1 when the grip 41 peels off the release tape 83 integrated with the protective tape 81 is an optimum tensile load that does not cause the plate-like workpiece 80 to break or cause paste residue on the plate-like workpiece 80. Further, the peeling speed of the grip portion 41 is not too slow, and the protective tape 81 is not peeled from the plate-like workpiece 80 with a long time.
When the protective tape 81 is completely peeled off from the one surface 800 of the plate-like workpiece 80, the grip portion 41 for gripping the peeling tape 83 joined to the protective tape 81 is moved to the collection box 17. Then, the grip portion 41 releases the grip of the release tape 83, and the protective tape 81 and the release tape 83 are dropped into the collection box 17.
As in the present embodiment, the protective member for protecting the plate-like workpiece 80 is the protective tape 81, and by having the peeling tape joining unit 44 for joining the peeling tape 83 to the outer peripheral portion of the protective tape 81, the grip portion 41 grips the peeling tape 83 joined to the protective tape 81 instead of gripping the outer peripheral portion of the protective tape 81, and the grip portion side tensile load measuring portion 47 measures the tensile load applied to the peeling tape 83 integrated with the protective tape 81 interposed between the grip portion 41 and the holding surface 302 instead of measuring the tensile load applied to the protective tape 81, the peeling operation of the peeling unit 4 can be optimized.
(embodiment B of separation of protective tape 81 in the separation apparatus 1)
After the grip portion 41 gripping the release tape 83 is moved in the + Z direction to separate a part of the protective tape 81 from the one surface 800 of the plate-like workpiece 80, when the protective tape 81 is further separated, as shown in fig. 3, the holding unit 30 is moved in the X-axis direction and the grip portion 41 is not moved by the X-axis direction moving unit 46, which will be described. In this case, the grip 41 is stopped at a predetermined height position and a predetermined position P2 in the X axis direction, and the control unit 19 recognizes the height position and the position P2 in the X axis direction at which the grip 41 is located.
The holding unit 30 is moved in the + X direction by the table moving unit 13, and the holding portion 41, which has stopped moving, is moved relatively in the radial direction from the outer peripheral edge of the plate-like workpiece 80 toward the center, so that the protective tape 81 is peeled from the plate-like workpiece 80. Further, a rotating roller, not shown, may be disposed above the moving path of the holding unit 30, and the protective tape 81 may be separated by abutting the rotating roller, thereby preventing the protective tape 81 from being bent when the protective tape 81 is separated.
In the present embodiment, when the protective tape 81 is peeled from the plate-like workpiece 80, the table-side tensile load measuring section 35 measures the tensile load applied to the peeling tape 83 integrated with the protective tape 81 interposed between the grip portion 41 and the holding surface 302.
In fig. 3, an arrow F2 indicates a tensile load F2 applied to the release tape 83 integrated with the protective tape 81 interposed between the grip portion 41 and the holding surface 302 of the holding unit 30. The tensile load F2 is a tensile load F2 obtained by combining an X-axis direction tensile load Fx2 in the-X direction and a Z-axis direction tensile load Fz2 in the + Z direction shown in fig. 3.
An arrow R1 shown in fig. 3 indicates a 1 st measurement load R1 that the 1 st stage-side tensile load measurement unit 351 can measure at predetermined time intervals in the Z-axis direction. The 1 st measurement load R1 has, for example, an orientation in the-Z direction. Information on the value of the 1 st measured load R1 is sent to the control unit 19 at regular time intervals.
Arrow R2 indicates a 2 nd measurement load R2 that the 2 nd table side tension load measuring unit 352 can measure at predetermined time intervals in the Z-axis direction. The 2 nd measurement load R2 has an orientation in the + Z direction, for example. Information on the value of the 2 nd measurement load R2 is sent to the control unit 19 at regular time intervals.
The distance L2 in the X axis direction between the 1 st stage-side tensile load measuring unit 351 and the 2 nd stage-side tensile load measuring unit 352 shown in fig. 3 is a device design value recognized in advance by the control unit 19, and is constant.
The changing distance M in the X axis direction of the gripping portion 41 from the 1 st stage side tensile load measuring portion 351 to the position P2 where the movement in the X axis direction is stopped is a variable that changes by the movement of the holding unit 30 in the X axis direction. Further, since the control unit 19 can grasp the position of the 1 st stage-side tensile load measuring unit 351 that moves together with the movable member 133 based on an encoder signal fed back to the control unit 19 from the rotary encoder of the motor 132 (servo motor 132) of the stage moving unit 13, the control unit 19 can also sequentially recognize the value of the change distance M at predetermined time intervals.
The distance N in the Z-axis direction between the 1 st table-side tensile load measuring portion 351, for which the height position has been recognized by the control unit 19, and the gripping portion 41 stopped at the position P2 becomes a constant recognized in advance by the control unit 19.
According to the pythagorean theorem, the following equation 2 holds.
(X-axis direction tensile load Fx2)2+ (tensile load in Z-axis Fz2)2Not (tensile load F2)2DEG (formula 2)
Further, the following expression 3 is established in accordance with the balance of forces in the Z-axis direction.
(Z-axis direction tensile load Fz2) (1 st measurement load R1) + (2 nd measurement load R2) · (equation 3)
Further, the following expression 4 is established from the balance of moments around the 1 st stage-side tensile load measuring unit 351 when the 1 st stage-side tensile load measuring unit 351 is assumed to be the origin.
(X-axis direction tensile load Fx2) × (constant distance N) (2 nd measurement load R2) × (distance L2) + (Z-axis direction tensile load Fz2) × (variation distance M) · (equation 4)
According to equation 3, the control unit 19 can measure the Z-axis direction tensile load Fz2 at predetermined time intervals. Further, the control unit 19 can measure the X-axis direction tensile load Fx2 at predetermined time intervals according to the following equation 5 obtained by modifying equation 4.
(X-axis direction tensile load Fx2) { (2 nd measurement load R2) × (distance L2) + (Z-axis direction tensile load Fz2) × (variation distance M) }/(constant distance N) · (equation 5)
The control unit 19 performs calculation processing in which the value of the tensile load Fx2 in the X-axis direction and the value of the tensile load Fz2 in the Z-axis direction are substituted for expression 2, and measures the tensile load F2 at predetermined time intervals. The control unit 19 uses the tensile load F2 measured at predetermined time intervals as information for optimizing the separating operation of the protective tape 81 by the separating unit 4. That is, the moving speed of the holding means 30 by the table moving means 13 is optimized by the control means 19, for example, based on the value of the tensile load F2 measured at predetermined time intervals. As a result, the feedback control is performed as follows: the tensile load F2 when the grip 41 peels off the release tape 83 integrated with the protective tape 81 is an optimum tensile load that does not cause the plate-like workpiece 80 to break or cause paste residue on the plate-like workpiece 80. Further, the peeling speed of the grip portion 41 relatively moved in the X-axis direction with respect to the moving holding unit 30 is not too slow, and the protective tape 81 is not peeled from the plate-like workpiece 80 with a long time.
As in the present embodiment, if the stage-side tensile load measuring unit 35, that is, the 1 st stage-side tensile load measuring unit 351 and the 2 nd stage-side tensile load measuring unit 352 are configured by piezoelectric elements arranged in the support portion 31 that supports the holding unit 30, the tensile load applied to the protective tape 81 as a protective member can be accurately measured.
When the protective tape 81 is completely peeled off from the one surface 800 of the plate-like workpiece 80, the grip portion 41 for gripping the peeling tape 83 joined to the protective tape 81 is moved to the collection box 17. Then, the grip portion 41 releases the grip of the release tape 83, and the protective tape 81 and the release tape 83 are dropped into the collection box 17.
The peeling apparatus 1 according to embodiment 1 of the present invention is not limited to the above-described embodiments, and may be implemented in various different ways within the scope of the technical idea thereof. The shapes and the like of the components of the peeling apparatus 1 shown in the drawings are not limited thereto, and can be modified as appropriate within the range in which the effects of the present invention can be exhibited.
For example, as shown in fig. 4, the plate-like workpiece 80 may have a notch 806 in an outer peripheral portion. The notch 806 is a notch, for example, a mark indicating a crystal orientation, and is formed in a state of being recessed radially inward toward the center of the plate-shaped workpiece 80 at the outer peripheral edge of the plate-shaped workpiece 80. Alternatively, cut-out 806 may be a flat orientation. In this case, the cut-out portion 806 is formed by cutting out a part of the outer periphery of the plate-shaped workpiece 80 flatly.
For example, as shown in fig. 4, the holding unit 30 shown in fig. 1 may have a partially peeled portion 34, and the partially peeled portion 34 may lift the protective tape 81 which is not joined to the plate-shaped workpiece 80 and is positioned in the cut portion 806 of the plate-shaped workpiece 80, and may peel the protective tape 81 in the vicinity of the cut portion 806 from the plate-shaped workpiece 80. Further, for example, the holding portion 41 shown in fig. 1 may hold the outer peripheral portion of the protective tape 81 separated by the partial separation portion 34 to separate the protective tape 81 from the plate-like workpiece 80.
A circular through hole 341 is formed in the outer periphery of the holding surface 302 so as to correspond to the cutout 806 of the plate-like workpiece 80 placed on the holding surface 302, and the through hole 341 constitutes the partially peeled portion 34 and penetrates the holding surface 302 and the lower surface of the holding unit 30 (the lower surface of the housing 301). Specifically, the through-hole 341 is disposed on the holding surface 302 so that the distance from the center of the plate-shaped workpiece 80 to the cutout 806 matches the distance from the center of the holding surface 302 to the through-hole 341.
The diameter of the through hole 341 is set to be slightly smaller than the width of the notch 806, for example. A jack pin 342 is provided just below the through hole 341 of the partially peeled portion 34 so as to be movable up and down by the up-and-down driving portion 345, and the jack pin 342 jacks up a part of the protective tape 81 joined to the one surface 800 of the plate-like work 80. The knock-up pin 342 is formed in a rod shape extending in the vertical direction, and the outer diameter of the knock-up pin 342 is slightly smaller than the through hole 341. For example, the lift-up pin 342 has a sharp front end (upper end) and can break through the dicing tape 82 stuck to the other surface 801 of the plate-like workpiece 80.
Further, for example, the jack-up pin 342 is formed with a not-shown ejection hole for ejecting the fluid from the tip end along the extending direction. A fluid supply source 347 is connected to the lower end of the ejection hole via a valve 346, and the fluid is supplied from the fluid supply source 347 into the jack pin 342 by opening the valve 346. The fluid supplied from the fluid supply source 347 is not particularly limited, and in the present embodiment, compressed air is used as the fluid.
The vertical driving unit 345 is constituted by, for example, a guide actuator driven by air or a motor, and can vertically move the jack pins 342 while guiding them in the vertical direction in the through holes 341 of the holding unit 30.
In this way, the lift pins 342 are configured to be raised by the vertical driving portion 345 while ejecting air from the outlets of the ejection holes, and break through the dicing tape 82. The jack pins 342 protrude from the holding surface 302 after breaking through the dicing tape 82, and can jack up the protective tape 81 in the notch 806 of the plate-like workpiece 80. That is, while the protective tape 81 is floated by ejecting air from the ejection holes of the jack pins 342, the jack pins 342 are further raised to jack the outer peripheral portion of the protective tape 81, or while the jack pins 342 are raised to jack the outer peripheral portion of the protective tape 81, air is ejected from the ejection holes to separate the outer peripheral portion of the protective tape 81 from the plate-like work 80.
Then, the holding portion 41 shown in fig. 4 can hold the outer peripheral portion of the protective tape 81 peeled by the partial peeling portion 34 to peel the protective tape 81 from the plate-like workpiece 80.
(embodiment 2 of the peeling apparatus)
A peeling apparatus 2 according to the present invention shown in fig. 5 (hereinafter, referred to as a peeling apparatus 2 according to embodiment 2) is an example of a peeling apparatus that peels off a protective member 85 attached to one surface 800 which is a lower surface in fig. 5 of a plate-like work 80, and includes at least: a holding unit 50 that holds the other surface 801 of the plate-like workpiece 80 by a holding surface 502; and a peeling unit 6 that grips an outer peripheral portion of the protective member 85 covering the one surface 800 of the plate-shaped workpiece 80 held by the holding surface 502, peels the protective member 85 from the outer periphery of the plate-shaped workpiece 80 toward the center, and further peels from the center toward the outer periphery on the opposite side of the outer periphery.
The protective member 85 attached so as to cover the entire downward facing surface 800 of the plate-shaped workpiece 80 is, for example, a protective member composed of a resin film 87 (see fig. 6) and a circular sheet 86, and the resin film 87 is formed by pressing the surface 800 of the plate-shaped workpiece 80 against a liquid resin supplied onto the circular sheet 86 having a larger diameter than the plate-shaped workpiece 80, spreading the liquid resin over the entire surface 800 from the center of the plate-shaped workpiece 80 toward the outer peripheral side, and then irradiating the liquid resin with, for example, ultraviolet rays to cure the liquid resin. In the present embodiment, the protective member 85 is composed of the circular piece 86 and the resin film 87, and has the protruding portion 850 shown in fig. 6 that slightly protrudes radially outward from the outer periphery of the plate-like workpiece 80.
A column 21 is vertically provided on the rear side (-X direction side) of the base 20 of the peeling apparatus 2 shown in fig. 5, and a pad moving means 60 is disposed on the upper portion of the front surface on the + X direction side of the column 21, and the pad moving means 60 reciprocates the holding means 50 disposed on the movable plate 601 in the Y axis direction by rotating the ball screw 600 by the motor 602.
The pad moving unit 60 is a part of the peeling unit 6, and functions as a moving unit that: the grip 61 and the holding unit 50 are relatively moved in the Y-axis direction parallel to the holding surface 502, the grip 61 is moved from the outer periphery of the holding surface 502 toward the center, and the grip 61 passing through the center of the holding surface 502 is moved on a straight line in a direction away from the center.
A pad lifting unit 66 for reciprocating the holding unit 50 in the Z-axis direction is disposed on the movable plate 601. The pad lifting and lowering unit 66 rotates the ball screw 66 by the motor 662, thereby reciprocating the holding unit 50 disposed on the movable plate 661 in the Z-axis direction.
The holding unit 50, which holds the other surface 801 of the plate-like workpiece 80 by the holding surface 502, is supported by the arm 52, one end of which is fixed to the movable plate 661 and extends in the X-axis direction, and is attached to the lower surface side of the other end of the arm 52 on the + X-direction side via the support portion 53.
As shown in fig. 6, in the present embodiment, the holding unit 50 is a suction holding pad, and includes: an adsorption part 500 which is composed of a porous member and adsorbs the plate-shaped workpiece 80; and a housing 501 that supports the suction unit 500. The suction unit 500 communicates with a suction source, not shown, via a suction tube 509, a resin tube, a joint, or the like. Then, the suction force generated by the suction source is transmitted to the holding surface 502 formed by the exposed surface of the suction portion 500 and the lower surface of the housing 501, and the holding unit 50 performs suction holding of the plate-like workpiece 80 by the holding surface 502.
The support portion 53 shown in fig. 5 has, for example, an annular plate-like outer shape, and the upper surface thereof is connected to the lower surface of the arm portion 52 by a fixing bolt or the like, not shown. A pad-side tensile load measuring unit 64 as a tensile load measuring unit is attached to the lower surface of the support portion 53, and the pad-side tensile load measuring unit 64 measures a tensile load applied to the protective member 85 interposed between the grip portion 61 and the holding surface 502.
The pad-side tensile load measuring unit 64 is constituted by a piezoelectric element arranged in the support portion 53 that supports the holding unit 50. That is, for example, the pad-side tensile load measuring unit 64 is a piezoelectric element such as barium titanate formed in a columnar shape or a prismatic shape, two (only one is shown in fig. 5) are arranged so as to face each other in the Y-axis direction, and is arranged so as to connect the support portion 53 and the holding unit 50 and receive the weight of the holding unit 50. That is, the mat-side tensile load measuring portion 64 is constituted by the 1 st mat-side tensile load measuring portion 641 and the 2 nd mat-side tensile load measuring portion 642 shown in fig. 6.
Below the moving path of the holding unit 50, which is the intermediate portion of the front surface on the + X direction side of the column 21 shown in fig. 5, there are arranged in order from the + Z direction side: a rotating roller 211 having an axis in the X-axis direction; each component of the peeling unit 6; a mounting table 27 on which a protective member 85 peeled off from the plate-like workpiece 80 is mounted; and a dropping unit 26 for dropping the peeled protection member 85 placed on the table 27 to the dust box 28.
The peeling unit 6 has: a grip portion 61 that grips an outer peripheral portion (in the present embodiment, an extension portion 850 as an outer peripheral portion) of the protective member 85; a moving means 63 for moving the grip 61 and the holding means 50 relative to each other in a direction (Y-axis direction) parallel to the holding surface 502, moving the grip 61 from the outer periphery of the holding surface 502 toward the center, and moving the grip 61 passing through the center of the holding surface 502 on a straight line in a direction away from the center; and a pad-side tensile load measuring unit 64 as a tensile load measuring unit that measures a tensile load applied to the protective member 85 interposed between the grip 61 and the holding surface 502.
The moving means 63 is hereinafter referred to as a grip moving means 63.
The grip moving unit 63 includes: a ball screw 630 having an axial center in the Y-axis direction; a pair of guide rails 631 arranged in parallel with the ball screw 630; a motor 632 that rotates the ball screw 630; and a movable block 633, in which a nut is screwed to the ball screw 630, and a side portion is in sliding contact with the guide rail 631. When the motor 632 rotates the ball screw 630, the movable block 633 is guided by the guide rail 631 and moves in the Y-axis direction, and the grip 61 disposed on the movable block 633 moves in the Y-axis direction in accordance with the movement of the movable block 633.
An arm housing 681 is attached to a side surface of the movable block 633, and the arm housing 681 rotatably supports a main shaft 680 having an X-axis direction in an axial direction. A connecting block 614 is attached to a coupling member 616 disposed at the front end of the main shaft 680 on the + X direction side, and this connecting block 614 supports the grip portion 61 via a vertical load measuring piezoelectric element 673 of the grip portion side tensile load measuring portion 67. A jig base 610 is attached to the connection block 614, and the jig base 610 supports the gripping jig 612 of the gripping portion 61 via the horizontal direction load measuring piezoelectric element 674 of the gripping portion side tensile load measuring portion 67. Although not shown, the arm housing 681 can be moved up and down in the Z-axis direction by an elevator unit such as a ball screw mechanism, not shown, and the grip 61 can also be moved up and down in the Z-axis direction.
The gripping jig 612 can sandwich a gripping target between a pair of gripping plates that can be moved closer to and away from each other, and can change the angle with respect to the gripping target by rotating the main shaft 680.
The grip-side tensile load measuring unit 67 as a tensile load measuring unit that measures a tensile load applied to the protective member 85 interposed between the grip 61 and the holding surface 502 of the holding unit 50 is composed of, for example, a horizontal-direction load measuring piezoelectric element 674 formed in a flat plate shape such as barium titanate and a flat-plate-shaped vertical-direction load measuring piezoelectric element 673 made of the same material. The vertical load measuring piezoelectric element 673 is disposed so as to be sandwiched between the lower surface of the block-shaped coupling member 616 attached to the distal end side of the main shaft 680 and the upper surface of the coupling block 614 from the Z-axis direction. The horizontal load measuring piezoelectric element 674 is disposed so as to be sandwiched between the connecting block 614 and the clamp base 610 of the grip portion 61 from both sides in the Y axis direction.
The rotating roller 211 shown in fig. 5 is formed in a cylindrical shape, for example, and is rotated about the axis in the X-axis direction by a motor, not shown. The rotating roller 211 comes into contact with the protective member 85, and thus functions to prevent the resin film 87 shown in fig. 6 from being folded when the protective member 85 is peeled off, for example. The rotating roller 211 may be movable in the Y-axis direction.
The mounting table 27 on which the protective member 85 peeled off from the plate-like workpiece 80 is mounted has, for example, a substantially rectangular outer shape and a bamboo-curtain-like mounting surface. That is, the placing table 27 is configured to: the plate-shaped linear members 271 are aligned with gaps formed by setting the longitudinal direction of the linear members 271 to the Y-axis direction and maintaining the linear members 271 at equal intervals in the X-axis direction, and one ends of the linear members 271 on the + Y-axis direction side are coupled and fixed by a rod-shaped coupling, not shown. For example, the placing table 27 is fixed to the + X direction side surface of the column 21 by a rod-shaped coupling member, not shown, that couples the linear members 271, and is disposed below the movement path of the gripping portion.
The drop unit 26 for dropping the protective member 85 on the mounting table 27 is constituted by: a ball screw 260 having an axial center in the Y-axis direction; a pair of guide rails 261 arranged in parallel with the ball screw 260; a motor 262 that rotates the ball screw 260; a substantially L-shaped movable member 263 in side view, in which a nut is screwed to the ball screw 260 and a side portion 2631 is in sliding contact with the guide rail 261; and a protruding pin 2634 provided to the movable member 263.
The movable member 263 has, for example: a side portion 2631 screwed with the ball screw 260; and a pin boss portion 2632 formed to protrude from an upper end portion side surface of the side portion 2631 toward the + X direction side. Two protruding pins 2634 protruding in the + Z direction are arranged on the upper surface of the pin table portion 2632. The protruding pins 2634 are spaced apart by a predetermined distance in the X-axis direction, and when the ball screw 260 is rotated by the motor 262, the movable member 263 is guided by the guide rail 261 and moves in the Y-axis direction, and the protruding pins 2634 disposed on the movable member 263 move in the Y-axis direction so as to pass through the gaps between the linear members 271 of the loading table 27.
The base 20 is provided with a dust box 28 for storing the peeled-off protective member 85. The dust box 28 is formed in a substantially rectangular parallelepiped shape, for example, and is opened below the + Y direction side end of the placing table 27. A transmission type photosensor having a light emitting section 280(-Y direction side) and a light receiving section 281(+ Y direction side), for example, is disposed on the upper portion of the dust box 28. The protection member 85 peeled off from the plate-like workpiece 80 and placed on the placement table 27 is dropped into the dust box 28 by the drop unit 26, the protection member 85 is stacked to a predetermined height in the dust box 28, the inspection light emitted from the light emitting portion 280 is blocked by the protection member 85 to reduce the amount of light received by the light receiving portion 281, and the light sensor detects that the amount of the protection member 85 to be collected has accumulated in the dust box 28.
For example, a table holding base 22 is attached to a position in the movable range of the gripping portion 61 of the peeling unit 6 on the front surface of the column 21, and a delivery table 221 on which the plate-like workpiece 80 to be peeled off the protective member 85 is placed is disposed on the table holding base 22. The delivery table 221 can suction and hold the plate-like workpiece 80 placed on the holding surface thereof, for example, with one surface 801 facing upward. Further, the delivery table 221 may not be disposed on the table holding base 22.
A plurality of (for example, 8) outer peeling units 23 are arranged on the table holding base 22 at regular intervals in the circumferential direction around the delivery table 221, and the outer peeling units 23 grip the protruding portions 850 and peel the outer portions of the protective member 85 from the plate-like workpiece 80. In fig. 5, the structure of the outer peeling unit 23 is enlarged and shown in detail.
The outer peeling unit 23 has: an extension holding part 230 for holding the extension 850; a vertical moving portion (not shown) that moves the extension holding portion 230 in the Z-axis direction (vertical direction); and a horizontal moving part 234 that moves the extension part holding part 230 in the horizontal direction.
As shown in fig. 5, the horizontally moving portion 234 reciprocates the projecting portion holding portion 230 disposed on, for example, an L-shaped slider 2342 in a side view via a vertically moving portion, not shown, in a radial direction of the delivery table 221 by rotating a ball screw 2341 extending in a horizontal direction by a motor 2340. The vertical movement unit, not shown, is constituted by, for example, a ball screw mechanism.
The extension holding portion 230 includes: a substantially rectangular parallelepiped gripping table 2301; a cylinder mechanism 2303 disposed on a side surface of the grip table 2301; and a gripping plate 2302 that moves up and down in the Z-axis direction by the cylinder mechanism 2303, and can sandwich a gripping object between the upper surface of the gripping table 2301 and the lower surface of the gripping plate 2302.
Each of the protruding portion grip portions 230 is disposed so that an opening portion between the grip plate 2302 and the grip base 2301 faces the delivery table 221.
The peeling apparatus 2 includes, for example, a control unit 29 for controlling each configuration of the apparatus, the control unit 29 is constituted by a CPU for performing arithmetic processing according to a control program, a storage medium such as a memory, and the like, and is electrically connected to the pad moving unit 60, the pad lifting unit 66, and the gripping portion moving unit 63 through a wired or wireless communication path, not shown, and controls the moving speed in the Y-axis direction and the Z-axis direction of the holding unit 50 for sucking and holding the plate-shaped workpiece 80 and the positioning control with respect to the gripping portion 61 and the like under the control of the pad moving unit 60 and the pad lifting unit 66 by the control unit 29. Further, under the control of the gripping portion moving means 63 by the control means 29, the control of the moving speed of the gripping portion 61 that grips the extension portion 850 of the protective member 85 that protects the plate-like workpiece 80, the control of the positioning, and the like are performed. In addition, the control unit 19 can receive information on the tensile loads measured by the respective load measuring portions from the pad-side tensile load measuring portion 64 and the grip-portion-side tensile load measuring portion 67.
For example, when the motor 602 of the pad moving means is a servo motor, a rotary encoder of the servo motor is connected to the control means 29 which also functions as a servo amplifier, and after an operation signal is supplied to the servo motor from an output interface of the control means 29, the rotational speed of the servo motor is output as an encoder signal to an input interface of the control means 29. Then, the control unit 29 that has received the encoder signal can sequentially recognize the movement amount of the holding unit 50 according to the rotation angle of the servo motor, thereby sequentially recognizing the position of the holding unit 50 in the Y axis direction.
The operation of the peeling apparatus 2 when peeling the protective member 85 from the plate-like workpiece 80 shown in fig. 5 will be described below. First, the plate-like workpiece 80 after grinding, for example, as shown in fig. 5, is placed on the delivery table 221 so that the other surface 801, which is the surface to be ground, is positioned above. The holding unit 50 is moved in the + Y direction, and is positioned above the plate-shaped workpiece 80 so that the center of the holding surface 502 substantially coincides with the center of the other surface 801 of the plate-shaped workpiece 80. Next, the holding unit 50 is lowered to bring the holding surface 502 into contact with the other surface 801 of the plate-like workpiece 80. Further, the holding unit 50 sucks and holds the other surface 801 of the plate-like workpiece 80 with the protective member 85 facing downward by transmitting a suction force generated by suction by a suction source, not shown, to the holding surface 502.
For example, the holding unit 50 that holds the plate-like workpiece 80 by suction is raised, and the plate-like workpiece 80 is separated from the delivery table 221. Next, the extension portion holding portion 230 is positioned by a vertical moving portion, not shown, at a predetermined height position at which the extension portion 850 of the protection member 85 can be held.
Further, each horizontal moving portion 234 moves each protruding portion holding portion 230 in the horizontal direction, and performs the alignment of the protruding portion holding portion 230 with the protruding portion 850 of the protection member 85 in the radial direction. The grip plate 2302 is lowered by the cylinder mechanism 2303, and the extension grip 230 grips the extension 850 of the protective member 85. The extension portion gripping portion 230 may grip the extension portion 850 of the protective member 85 of the plate-shaped workpiece 80 while holding the plate-shaped workpiece 80 on the delivery table 221.
Next, the horizontal moving portions 234 move the extension portion holding portions 230 of the extension portion 850 of the protective member 85 holding the plate-shaped workpiece 80 radially outward, whereby the extension portion 850 is pulled radially outward by the extension portion holding portions 230 and expanded. Further, by the movement of the extension holding portion 230, the resin film 87 attached to the outer peripheral portion of the plate-shaped workpiece 80 is easily peeled radially outward from the outer peripheral edge of the plate-shaped workpiece 80 by the spreading force applied to the resin film 87 attached to the outer peripheral portion of the plate-shaped workpiece 80 (see fig. 6) and the adhesive force acting between the circular piece 86 and the resin film 87.
Next, for example, after the extension portion gripping portions 230 are lowered to a predetermined height position and the extension portion 850 of the protection member 85 is pulled downward from the plate-like workpiece 80 to a certain extent and peeled off, the extension portion gripping portions 230 release the extension portion 850 of the protection member 85. Thus, for example, the protruding portion 850 is partially peeled off at a total of 8 points of the outer peripheral portion of the plate-shaped workpiece 80 at a uniform angle in the circumferential direction with respect to the center of the plate-shaped workpiece 80.
Next, the holding unit 50 that holds the plate-like workpiece 80 by suction moves in the-Y direction to be positioned above the rotating roller 211, and then moves down so that the side surface of the rotating roller 211 comes into contact with the vicinity of the outer peripheral portion on the + Y direction side of the lower surface of the protective member 85. As shown in fig. 6, the gripping section moving means 63 moves the gripping section 61 in the-Y direction, positions the gripping jig 612 with the extension section 850 of the protection member 85, and grips the extension section 850 with the gripping jig 612. In the example shown in fig. 6, the grip 61 grips the extension 850 of the outer portion of the protection member 85 that is not peeled off from the plate-like workpiece 80, but may grip the extension 850 of the outer portion of the protection member 85 that is peeled off from the plate-like workpiece 80 (the extension 850 on the-Y direction side in fig. 6).
For example, as shown in fig. 6, after the holding jig 612 holds the extension 850, the holding jig 612 is slightly moved to the + Y direction side, and the outer peripheral portion of the resin film 87 is peeled off from the outer peripheral edge of the plate-shaped workpiece 80. Next, as shown in fig. 7 to 8, the main shaft 680 is rotated by 180 degrees clockwise when viewed from the + X direction side, and thereby, in a state where the lower surface side of the protective member 85 is supported by the rotating roller 211, while the resin film 87 of the protective member 85 is gently bent along the side surface of the rotating roller 211, the protective member 85 is pulled in the-Z direction by the gripping jig 612, whereby a part of the protective member 85 is peeled off from the one surface 800 of the plate-like workpiece 80.
(embodiment C of peeling of protective member 85 in peeling apparatus 2)
When the protective member 85 is further peeled off, the holding unit 50 is moved in the Y-axis direction. Alternatively, a case will be described in which the grip 61 is moved in the Y-axis direction with respect to the holding surface 502 of the holding unit 50.
As shown in fig. 9, the grip 61 is moved in the-Y direction by the grip moving means 63 shown in fig. 5. The holding unit 50 may be moved in the + Y direction by the pad moving unit 60 (see fig. 5). The holding portion 61 is moved relatively in the radial direction from the outer peripheral edge of the plate-like workpiece 80 toward the center, and the protective member 85 is peeled off from the plate-like workpiece 80. The rotating roller 211 rotates about the axis in the X-axis direction, and the protective member 85 is peeled from the outer peripheral edge of the plate-shaped workpiece 80 on the + Y direction side toward the center of the plate-shaped workpiece 80 while maintaining the state in which the resin film 87 of the protective member 85 is gently bent along the side surface of the rotating roller 211. When the resin film 87 is bent during the peeling of the protective member 85, the resin film 87 may be partially left on the plate-shaped workpiece 80 after the peeling or an impact force may be instantaneously applied to the one surface 800 of the plate-shaped workpiece 80 from the resin film 87 due to a reaction caused by the bending of the resin to damage the one surface 800 of the plate-shaped workpiece 80.
In the present embodiment, when the protective member 85 is peeled off from the plate-like workpiece 80, the grip portion-side tensile load measuring portion 67 can accurately measure the tensile load applied to the protective member 85 interposed between the grip portion 61 and the holding surface 502.
For example, the grip portion side tensile load measuring portion 67 measures the tensile load by the vertical direction load measuring piezoelectric element 673 and the horizontal direction load measuring piezoelectric element 674.
In fig. 9, an arrow F3 indicates a tensile load F3 applied to the protective member 85 interposed between the grip 61 and the holding surface 502 of the holding unit 50. Since the plate-shaped workpiece 80 and the grip 61 are separated by a predetermined distance in the Z-axis direction, the tensile load F3 is a tensile load F3 obtained by combining a Y-axis direction tensile load Fy3 in the-Y direction and a Z-axis direction tensile load Fz3 in the-Z direction shown in fig. 9. Then, according to the pythagorean theorem, the following expression 11 holds.
(Y-axis direction tensile load Fy3)2+ (tensile load in Z-axis Fz3)2Not (tensile load F3)2DEG (formula 11)
Here, the Y-axis direction tensile load Fy3 is accurately measured at regular time intervals by the horizontal direction load measuring piezoelectric element 674, and a load detection signal is sent to the control unit 29 at each measurement. Further, the vertical load measuring piezoelectric element 673 accurately measures the Z-axis direction tensile load Fz3 at predetermined time intervals, and sends a load detection signal to the control unit 29 every time of measurement.
The control unit 29 performs calculation processing in which the actual measurement value for the Y-axis direction tensile load Fy3 and the actual measurement value for the Z-axis direction tensile load Fz3 are substituted for expression 11, and measures the tensile load F3 at predetermined time intervals. The control unit 29 uses the tensile load F3 measured at predetermined time intervals as information for optimizing the peeling operation of the protective member 85 by the peeling unit 6. That is, the moving speed of the grip 61 by the grip moving means 63 is optimized by the control means 29, for example, based on the value of the tensile load F3 measured at predetermined time intervals. As a result, the feedback control is performed as follows: the tensile load F3 when the protective member 85 is peeled off by the gripping portion 61 is an optimum tensile load that does not cause the plate-shaped workpiece 80 to break or cause paste residue on the plate-shaped workpiece 80. Further, the peeling speed of the grip portion 61 is not too slow, and the protective member 85 is not peeled off from the plate-like workpiece 80 in a useless time.
When the protective member 85 is completely peeled off from the one surface 800 of the plate-like workpiece 80, the holding portion 61 holding the extension portion 850 of the protective member 85 is moved onto the placing table 27 shown in fig. 5. Then, the grip portion 61 releases the grip of the extension portion 850, and the protective member 85 is dropped onto the placing table 27.
(embodiment D of separation of protective member 85 in separation apparatus 2)
A case will be described in which the holding unit 50 is moved in the Y-axis direction during the peeling of the protective member 85, and the grip portion 61 is not moved in the Y-axis direction as in embodiment C. In this case, for example, the rotating roller 211 moves in the same direction as the moving direction of the holding unit 50. In this case, the grip 61 rotated by 90 degrees as shown in fig. 10 from the state shown in fig. 8 is stopped at a predetermined height position and a position P3 in the Y axis direction, and the control unit 29 shown in fig. 5 recognizes that the grip 61 is located at the height position and the position P3 in the Y axis direction.
The pad moving means 60 moves the holding means 50 in the + Y direction, and the holding portion 61 stopped from moving is moved relatively in the radial direction from the outer peripheral edge of the plate-like workpiece 80 toward the center, thereby peeling the protective member 85 from the plate-like workpiece 80. Further, the side surface of the rotating roller 211 abuts against the circular piece 86, whereby the resin film 87 can be prevented from being broken or the like.
In the present embodiment, when the protective member 85 is peeled off from the plate-like workpiece 80, the pad-side tensile load measuring section 64 measures the tensile load applied to the protective member 85 interposed between the gripping section 61 and the holding surface 502. In fig. 10, an arrow F4 indicates a tensile load F4 applied to the protective member 85 interposed between the grip 61 and the holding surface 502 of the holding unit 50. The tensile load F4 is a tensile load F4 obtained by combining the Y-axis direction tensile load Fy4 in the-Y direction and the Z-axis direction tensile load Fz4 in the-Z direction shown in fig. 10.
An arrow R4 shown in fig. 10 indicates a 1 st measurement load R4 that the 1 st pad-side tensile load measurement unit 641 can measure at predetermined time intervals in the Z-axis direction. The 1 st measurement load R4 has an orientation in the + Z direction, for example. Arrow R5 indicates a 2 nd measurement load R5 that the 2 nd pad-side tensile load measurement unit 642 can measure at predetermined time intervals in the Z-axis direction. The 2 nd measurement load R5 has, for example, an orientation in the-Z direction. The distance L4 in the Y-axis direction between the 1 st pad-side tensile load measuring unit 641 and the 2 nd pad-side tensile load measuring unit 642 is a device design value recognized in advance by the control unit 29 and is constant.
The changing distance M1 in the Y-axis direction from the 1 st pad-side tensile load measuring portion 641 to the holding portion 61 at the position P3 at which the movement in the Y-axis direction is stopped is a variable that changes by the movement of the holding unit 50 in the Y-axis direction. Further, since the control unit 29 can grasp the position of the 1 st pad-side tensile load measuring unit 641 moving together with the movable plate 601 based on an encoder signal fed back to the control unit 29 from the rotary encoder of the motor 602 (servo motor 602) of the pad moving unit 60 shown in fig. 5, the control unit 29 can sequentially recognize the value of the variation distance M1 at predetermined time intervals. The distance N1 in the Z-axis direction between the 1 st pad-side tensile load measuring unit 641 and the grasping unit 61 stopped at the position P3 is a device design value recognized in advance by the control unit 29 and is constant.
According to the pythagorean theorem, the following equation 12 holds.
(Y-axis direction tensile load Fy4)2+ (tensile load in Z-axis Fz4)2Not (tensile load F4)2DEG G (formula 12)
Further, the following equation 13 is established in accordance with the balance of forces in the Z-axis direction.
(Z-axis direction tensile load Fz4) (1 st measurement load R4) + (2 nd measurement load R5) · (equation 13)
Further, the following expression 14 is established from the balance of moments around the 1 st pad-side tensile load measuring unit 641 when the 1 st pad-side tensile load measuring unit 641 is assumed to be the origin.
(Y-axis direction tensile load Fy4) × (distance N1) (2 nd measurement load R5) × (distance L4) + (Z-axis direction tensile load Fz4) × (variation distance M1) · (equation 14)
According to equation 13, the control unit 29 can measure the Z-axis direction tensile load Fz4 at predetermined time intervals. Further, the control unit 29 can measure the Y-axis direction tensile load Fy4 at predetermined time intervals according to the following equation 15 obtained by modifying equation 14.
(Y-axis direction tensile load Fy4) { (2 nd measurement load R5) × (distance L4) + (Z-axis direction tensile load Fz4) × (variation distance M1) }/(distance N1) · (equation 15)
The control unit 29 performs calculation processing in which the value of the Y-axis direction tensile load Fy4 and the value of the Z-axis direction tensile load Fz4 are substituted for formula 12, and measures the tensile load F4 at predetermined time intervals. The control unit 29 uses the tensile load F4 measured at predetermined time intervals as information for optimizing the peeling operation of the protective member 85 by the peeling unit 6. That is, the moving speed of the holding unit 50 by the pad moving unit 60 is optimized by the control unit 29, for example, based on the value of the tensile load F4 measured at predetermined time intervals. As a result, the feedback control is performed as follows: the tensile load F4 when the protective member 85 is peeled off by the gripping portion 61 is an optimum tensile load that does not cause the plate-shaped workpiece 80 to break or cause paste residue on the plate-shaped workpiece 80. Further, the peeling speed of the grip portion 61 relatively moved in the Y axis direction with respect to the moving holding unit 50 is not too slow, and the protective member 85 is not peeled off from the plate-like workpiece 80 with a useless time.
When the protective member 85 is completely peeled off from the one surface 800 of the plate-like workpiece 80, the holding portion 61 holding the extension portion 850 of the protective member 85 is moved onto the placing table 27 shown in fig. 5. Then, the grip portion 61 releases the grip of the extension portion 850, and the protective member 85 is dropped onto the placing table 27.
Claims (6)
1. A peeling apparatus which peels a protective member for protecting one surface of a plate-like work from the one surface,
the peeling device comprises:
a holding unit that holds the other surface of the plate-like workpiece by a holding surface; and
a peeling unit configured to grip an outer peripheral portion of the protective member covering the one surface of the plate-shaped workpiece held by the holding surface, peel the protective member from an outer periphery of the plate-shaped workpiece toward a center, and further peel the protective member from the center toward an outer periphery on an opposite side of the outer periphery,
the peeling unit includes:
a grip portion that grips an outer peripheral portion of the protective member;
a moving unit that moves the grip portion and the holding unit relatively in a direction parallel to the holding surface, moves the grip portion from an outer periphery of the holding surface toward a center, and moves the grip portion that has passed through the center of the holding surface on a straight line in a direction away from the center; and
a tensile load measuring unit that measures a tensile load applied to the protective member interposed between the grip portion and the holding surface,
the peeling operation of the peeling unit is optimized by measuring the tensile load applied to the protective member by the tensile load measuring unit.
2. The peeling apparatus as claimed in claim 1,
the tensile load measuring unit is configured by a piezoelectric element disposed in a support portion that supports the holding unit.
3. The peeling apparatus as claimed in claim 1,
the tensile load measuring unit is configured by a piezoelectric element arranged in a grip supporting unit that supports the grip.
4. The peeling apparatus according to any one of claims 1 to 3,
the protective member is a protective tape which is,
the plate-like work has a cutout portion at an outer peripheral portion,
the holding unit includes a partial peeling portion that lifts up the protective tape, which is not joined to the plate-like work and is located in the notch portion, to peel the protective tape near the notch portion from the plate-like work,
the holding portion holds the outer peripheral portion of the protective tape peeled by the partial peeling portion.
5. The peeling apparatus according to any one of claims 1 to 3,
the protective member is a protective tape which is,
the peeling device further has a peeling tape application unit that applies a peeling tape to an outer peripheral portion of the protective tape,
the grip portion grips the release tape joined to the protective tape instead of gripping the outer peripheral portion of the protective tape, and the tensile load measuring portion measures a tensile load applied to the release tape integrated with the protective tape interposed between the grip portion and the holding surface.
6. The peeling apparatus according to any one of claims 1 to 3,
the protective member has a protruding portion that slightly protrudes from the outer periphery of the plate-like workpiece,
the holding portion holds the protruding portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-028107 | 2020-02-21 | ||
| JP2020028107A JP7457524B2 (en) | 2020-02-21 | 2020-02-21 | Peeling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113299580A true CN113299580A (en) | 2021-08-24 |
Family
ID=77318935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110187593.7A Pending CN113299580A (en) | 2020-02-21 | 2021-02-18 | Stripping device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7457524B2 (en) |
| KR (1) | KR20210106887A (en) |
| CN (1) | CN113299580A (en) |
| SG (1) | SG10202101325SA (en) |
| TW (1) | TW202133306A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI806587B (en) * | 2022-05-03 | 2023-06-21 | 迅得機械股份有限公司 | Peeling mechanism |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003338474A (en) | 2002-05-21 | 2003-11-28 | Lintec Corp | Machining method of brittle member |
| JP5102138B2 (en) | 2008-07-31 | 2012-12-19 | 株式会社ディスコ | Protective tape peeling device |
| JP5442288B2 (en) | 2009-03-27 | 2014-03-12 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus using the same |
| JP2011103373A (en) | 2009-11-11 | 2011-05-26 | Lintec Corp | Method and apparatus for evaluating releasability |
| JP2013168488A (en) | 2012-02-15 | 2013-08-29 | Disco Abrasive Syst Ltd | Masking tape exfoliation device |
| JP6301685B2 (en) | 2014-03-04 | 2018-03-28 | 株式会社ディスコ | Protective tape peeling apparatus and protective tape peeling method |
| JP2017126412A (en) | 2016-01-12 | 2017-07-20 | 住友電装株式会社 | Terminal insertion state inspection device |
| JP2018051646A (en) | 2016-09-27 | 2018-04-05 | 株式会社ディスコ | Grinding device |
-
2020
- 2020-02-21 JP JP2020028107A patent/JP7457524B2/en active Active
-
2021
- 2021-01-19 KR KR1020210007137A patent/KR20210106887A/en unknown
- 2021-02-08 SG SG10202101325SA patent/SG10202101325SA/en unknown
- 2021-02-18 TW TW110105538A patent/TW202133306A/en unknown
- 2021-02-18 CN CN202110187593.7A patent/CN113299580A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SG10202101325SA (en) | 2021-09-29 |
| KR20210106887A (en) | 2021-08-31 |
| TW202133306A (en) | 2021-09-01 |
| JP2021132179A (en) | 2021-09-09 |
| JP7457524B2 (en) | 2024-03-28 |
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