TW202129718A - Semiconductor device and method of manufacturing the same - Google Patents

Abstract

Provided is a semiconductor device including a substrate of a first conductive type; a first well region of a second conductive type in the substrate; a second well of a first conductive type in the substrate; a source region and a drain region of the second conductive type in the second well and the first well, respectively; an isolation structure disposed between the source region and the drain region; a gate structure on the substrate between the source region and the drain region, and covering a portion of the isolation structure; a first top doped region below the source region in the second well; and a second top doped region below the isolation structure and in the first well. A method of manufacturing the semiconductor device is also provided.

Description

Semiconductor element and its manufacturing method

The present invention relates to a semiconductor element and a manufacturing method thereof, and more particularly to an ultra-high voltage semiconductor element and a manufacturing method thereof.

Ultra-high voltage semiconductor components must have a higher breakdown voltage and lower on-state resistance during operation. The current ultra-high voltage semiconductor device has a relatively high resistance value of the substrate, so that the breakdown voltage cannot be effectively increased.

The present invention provides a semiconductor element and a manufacturing method thereof, which can reduce the resistance of a current path and increase the breakdown voltage of the semiconductor element.

The semiconductor element of the present invention includes: a substrate having a first conductivity type; a first well region provided in the substrate and having a second conductivity type; a second well region provided in the substrate and having the first conductivity type; Conductivity type; a source region and a drain region are disposed in the substrate and have the second conductivity type, the drain region is located in the first well region, and the source region is located in the second In the well region; the isolation structure is disposed between the source region and the drain region; the gate structure is disposed on the substrate between the source region and the drain region, wherein The gate structure covers a portion of the isolation structure; a first top doped region is disposed in the second well region below the source region and has the first conductivity type; and a second top doped region The region is disposed in the first well region under the isolation structure and has the first conductivity type.

The manufacturing method of the semiconductor element of the present invention includes the following steps. Forming a first well region in a substrate having a first conductivity type, the first well region having a second conductivity type; forming a second well region in the substrate, the second well region having a first conductivity type; A first top doped region is formed in the second well region, and a second top doped region is formed in the first well region, the first top doped region and the second top doped region Having the first conductivity type; forming an isolation structure on the substrate, wherein the second top doped region is located under the isolation structure; forming a gate structure on the substrate, wherein the gate structure covers Part of the isolation structure; and a source region and a drain region having the second conductivity type are formed in the substrate on one side of the gate structure and one side of the isolation structure, wherein The source region is located on the first top doped region and is adjacent to the gate structure, and the drain region is adjacent to the isolation structure.

Based on the above, since the semiconductor device of the present invention adds the top doped region below the source region, the resistance of the current path can be reduced, and the breakdown voltage of the semiconductor device can be increased.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

In the following embodiments, the first conductivity type is P type, and the second conductivity type is N type; however, the present invention is not limited to this. In other embodiments, the first conductivity type may be P-type, and the second conductivity type may be N-type. The P-type dopant is, for example, boron, and the N-type dopant is, for example, phosphorus or arsenic.

The schematic diagrams herein are only used to illustrate some embodiments of the present invention. Therefore, the shape, number, and ratio of each element shown in the schematic diagram should not be used to limit the present invention.

FIG. 1A is a schematic top view of a semiconductor device according to an embodiment of the present invention. FIG. 1B is a schematic top view of the top doped region and other components of a semiconductor device according to an embodiment of the present invention. FIG. 2H is a schematic cross-sectional view of the semiconductor device according to FIG. 1A. It should be noted that FIG. 2H is a schematic cross-sectional view corresponding to the section line A-A' of FIG. 1A.

Please refer to FIG. 1A, FIG. 1B and FIG. 2H at the same time. The semiconductor device 10 of this embodiment is, for example, an ultra-high voltage device, and its operating voltage is, for example, 300V to 1000V. In an embodiment, the semiconductor device 10 includes a substrate 100, a first well region 110, a top doped region 120, an isolation structure 200, a gate structure 300, a source region 130 and a drain region 140. In this embodiment, a plurality of finger regions MF are formed between the source region 130 and the drain region 140. Therefore, the semiconductor device 10 of this embodiment can also be referred to as a finger ultra-high voltage device. In detail, the source region 130 and the drain region 140 include, for example, a plurality of linear regions L and a plurality of turning regions R. Two linear regions L parallel to each other and a turning region R connecting the two linear regions L can form a finger-like region. Therefore, multiple linear regions L and multiple turning regions R are connected to each other to form multiple fingers.状area MF. Each turning area R is, for example, a C-shaped, U-shaped, or track-shaped turning area.

The substrate 100 is, for example, a semiconductor substrate having a first conductivity type. For example, in this embodiment, the substrate 100 is a P-type substrate, and the material of the substrate 100 may be selected from the group consisting of Si, Ge, SiGe, GaP, GaAs, SiC, SiGeC, InAs, and InP, for example. At least one material in the group. In another embodiment, the substrate 100 may also be a silicon-on-insulator (SOI) substrate. In another embodiment, the substrate 100 may be a P-epi wafer.

The first well region 110 is disposed in the substrate 100 and has a second conductivity type. The first well area 110 is, for example, an N-type well area, and is, for example, a high-pressure N-type well area (HVNW).

In this embodiment, the semiconductor device 10 may further include a second well region 112. The second well region 112 has the first conductivity type. The second well area 112 is, for example, a P-type well area. In this embodiment, the second well region 112 is formed in the substrate 100 and its sidewall extends into the first well region 110. The second well region 112 is, for example, a source well region of the semiconductor device 10.

The source region 130 and the drain region 140 are, for example, disposed in the substrate 100 and have the second conductivity type. The source region 130 and the drain region 140 are, for example, N-type doped regions. In this embodiment, the source region 130 is located in the second well region 112, and the drain region 140 is located in the first well region 110. In FIG. 1A, the source region 130 is located in the outer region OR of the plurality of finger regions MF, and the drain region 140 is located in the inner region IR surrounded by the plurality of finger regions MF.

In this embodiment, the semiconductor device 10 may further include doped regions 132 and 134. The doped regions 132 and 134 have the first conductivity type, for example, are P-type doped regions. The doped region 132 is also called a bulk doped region, which is located in the second well region 112 and adjacent to the source region 130. The doped region 134 is located in the substrate 100.

The isolation structure 200 is located on the substrate 100 and between the source region 130 and the drain region 140. In this embodiment, the isolation structure 200 includes a first isolation structure 200a, a second isolation structure 200b, a third isolation structure 200c, and a fourth isolation structure 200d. The first isolation structure 200 a is located on the substrate 100 and adjacent to the doped region 134. The second isolation structure 200 b is located between the doped region 134 and the doped region 132 and covers a part of the second well region 112. The third isolation structure 200 c is located on the first well region 110 and between the source region 130 and the drain region 140. In FIG. 1A, the third isolation structure 200c is disposed on a plurality of finger regions MF between the source region 130 and the drain region 140. The fourth isolation structure 200 d is located on the first well region 110 and adjacent to the drain region 140. In other words, the source region 130 is located between the second isolation structure 200b and the third isolation structure 200c, and the drain region 140 is located between the third isolation structure 200c and the fourth isolation structure 200d. In this embodiment, the isolation structure 200 is, for example, a field oxide layer. That is, the material of the isolation structure 200 is, for example, an insulating material, and is, for example, undoped silicon oxide, silicon nitride, or a combination thereof.

The gate structure 300 is, for example, disposed on the substrate 100 between the source region 130 and the drain region 140 and the third isolation structure 200c. From another perspective, the gate structure 300 covers a part of the first well region 110 and the second well region 112, is adjacent to the source region 130, and covers a part of the third isolation structure 200c. In this embodiment, the gate structure 300 includes a gate oxide layer 302, a gate 304, and a spacer 306. The gate oxide layer 302 is, for example, disposed on the substrate 100 and located between the source region 130 and the third isolation structure 200c. The gate electrode 304 is, for example, disposed on the gate oxide layer 302 and the third isolation structure 200c. The spacer 306 is, for example, provided on the side wall of the gate electrode 304. The material of the gate oxide layer 302 and the spacer 306 is, for example, silicon oxide, silicon nitride, or a combination thereof. The material of the gate electrode 304 is, for example, metal or its alloy, polysilicon or a combination thereof.

In an embodiment of the present invention, the top doped region 120 includes a top doped region 120a and a top doped region 120b. The top doped region 120 has a first conductivity type, for example, a P type. The top doped region 120a is disposed under the source region 130 and the doped region 134. In some embodiments, the top doped region 120a is in the second well region 112 and extends downward into the substrate 100, so that the distance D1 between the bottom surface of the top doped region 120a and the top surface of the substrate 100 is greater than The distance D2 between the bottom surface of the second well region 112 and the top surface of the substrate 100. The top doped region 120b is disposed in the first well region 110 under the third isolation structure 200c (as described in FIG. 2H). In other embodiments, the top doped region 120a is disposed in the second well region 112, and the distance D1 between the bottom surface of the top doped region 120a and the top surface of the substrate 100 is smaller than the bottom of the second well region 112. The distance D2 between the surface and the top surface of the substrate 100 (not shown).

In FIG. 1A, the source region 130 is located in the peripheral region OR around the plurality of finger regions MF, and the top doped region 120 a is located below the source region 130. The top doped region 120b is disposed under the third isolation structure 200c among the plurality of finger regions MF. For the sake of clarity, in FIG. 1B, the source region 130 and the third isolation structure 200c are not shown to clearly show where the top doped regions 120a and 120b are located. In FIG. 1B, the top doped region 120a is located in the peripheral region OR of the periphery of the plurality of finger regions MF, and the top doped region 120b is disposed in the plurality of finger regions MF.

Curves S100 and S200 in FIG. 3 are the doping profiles of the top doped regions 120a and 120b of the section lines B-B' and C-C' in FIG. 2H, respectively. 1B, FIG. 2H and FIG. 3, in some embodiments, the peak of the curve S200 of the doping profile of the top doped region 120a is closer to the substrate 100 than the peak of the curve S100 of the doping profile of the top doped region 120b. s surface. That is, the peak of the top doped region 120b is deeper than the depth of the peak of the top doped region 120a.

Please refer to FIG. 1A and FIG. 2H. In this embodiment, the semiconductor device 10 may further include a stepped region 122. The terrace 122 includes terraces 122a and 122b. The terrace 122 has a second conductivity type, for example, an N type. The stepped region 122a is disposed in the second well region 112, between the source region 130, the doped region 134 and the top doped region 120a. The stepped region 122b is located between the third isolation structure 200c and the top doped region 120b. The stepped region 122 and the top doped region 120 may have the same or similar shapes.

In the semiconductor device 10 of this embodiment, a stepped region 122a and a top doped region 120a are added under the source region 130 and the doped region 132, which can reduce the current path between the drain region 140 and the doped region 132. Resistance to allow a larger current to pass through the current path and then flow out through the doped regions 130 and 132. Therefore, the breakdown voltage of the device can be increased by the stepped region 122a and the top doped region 120a, and the performance of the device can be improved.

2A to 2H are schematic cross-sectional views of a method of manufacturing a semiconductor device according to an embodiment of the present invention. It must be noted here that part of the description of the same technical content described above is omitted in this embodiment. For the description of the omitted parts, reference may be made to the description and effects of the foregoing embodiment, and the following embodiments will not be repeated.

2A, a substrate 100 having a first conductivity type is provided. Then, a first well region 110 of the second conductivity type is formed in the substrate 100. In this embodiment, the substrate 100 is a P-type substrate, and the first well region 110 is an N-type high-pressure well region. The method of forming the first well region 110 in the substrate 100 includes, for example, the following steps. First, a patterned mask layer 102 is formed on the substrate 100. Next, an ion implantation process 104 is performed to implant dopants in the substrate 100. The dopant implanted by the ion implantation process 104 is, for example, phosphorus or arsenic, and the doping dose is, for example, 2E12 cm ^-2 to 5E12 cm ^-2 . After the above-mentioned patterned mask layer 102 is removed, a heat treatment process may be performed to form the first well region 110.

Referring to FIG. 2B, a second well region 112 having a first conductivity type is formed in the first well region 110. In this embodiment, the second well area 112 is a P-type well area. The method of forming the second well region 112 includes, for example, the following steps. First, a patterned mask layer 106 is formed on the substrate 100. Next, an ion implantation process 108 is performed through the patterned mask layer 106. The dopant implanted in the aforementioned ion implantation process 108 is, for example, boron, and the doping dose is, for example, 8E12 cm ^-2 to 1.2E13 cm ^-2 . After that, the above-mentioned patterned mask layer 106 is removed and a heat treatment process is performed to form the second well area 112 in the first well area 110.

2C, a top doped region 120a is formed in the second well region 112, and a top doped region 120b is formed in the first well region 110. In this embodiment, the conductivity type of the top doped region 120 is P type. The top doped regions 120a and 120b can be formed at the same time in the same step. In some embodiments, the method of forming the top doped regions 120a and 120b includes the following steps, for example. First, a patterned mask layer 114 is formed on the substrate 100. Next, using the patterned mask layer 114 as a mask, an ion implantation process 116 is performed to form a top doped region 120a in the second well region 112 and a top doped region 120b in the first well region 110 . The dopant implanted by the ion implantation process 116 is, for example, boron, and the doping dose is, for example, 5E12 cm ^-2 to 1E13 cm ^-2 . After that, the above-mentioned patterned mask layer 114 is removed. The formed top doped region 120a extends downward from the top surface of the second well region 112. The formed top doped region 120b extends downward from the top surface of the first well region 110.

2D, a stepped region 122a of the second conductivity type is formed in the second well region 112, and a stepped region 122b of the second conductivity type is formed in the first well region 110. In this embodiment, the conductivity type of the terraces 122a and 122b is N-type. The terraces 122a and 122b can be formed at the same time in the same step. In some embodiments, forming the stepped regions 122a and 122b in the first well region 110 includes the following steps, for example. The ion implantation process 118 is performed by using the patterned mask layer 114 as a mask. The dopant implanted by the ion implantation process 118 is, for example, phosphorus or arsenic, and the doping dose is, for example, 1E12 cm ^-2 to 5E12 cm ^-2 . After that, the above-mentioned patterned mask layer 114 is removed. After the patterned mask layer 114 is removed, a heat treatment process is performed to diffuse the doping in the top doped regions 120a, 120b and the stepped regions 122a, 122b to a predetermined width and depth, so that the top doped region 120a , 120b and the stairs 122a, 122b have the required contours. The temperature of the above heat treatment process is, for example, 1000°C.

The formed step area 122a extends downward from the top surface of the second well area 112. The formed step area 122b extends downward from the top surface of the first well area 110. The depth of the stepped region 122 in the substrate 100 is smaller than the depth of the top doped region 120 in the substrate 100. In other words, the stepped region 122a is located above the top doped region 120a, and the stepped region 122b is located above the top doped region 120b.

2E, an isolation structure 200 is formed on the substrate 100. The formation method of the isolation structure 200 may be, for example, a local oxidation isolation method or a shallow trench isolation method. In this embodiment, the formation method of the isolation structure 200 is a local area oxidation method. The isolation structure 200 includes a first isolation structure 200a, a second isolation structure 200b, a third isolation structure 200c, and a fourth isolation structure 200d.

2F, a gate structure 300 is formed on the substrate 100, and the formed gate structure 300 covers a portion of the third isolation structure 200c. In this embodiment, the gate structure 300 includes a gate oxide layer 302, a gate 304, and a spacer 306. The method of forming the gate structure 300 on the substrate 100 includes, for example, the following steps. First, a gate oxide material layer and a gate material layer are formed on the substrate 100 by a thermal oxidation method (or chemical vapor deposition method). After that, the gate material layer and the gate oxide material layer are patterned by lithography and etching processes to form the gate electrode 304 and the gate oxide layer 302. Afterwards, a spacer material layer is formed by thermal oxidation or chemical vapor deposition, and then an anisotropic etching process is performed on the spacer material layer to form spacers 306 on the sidewalls of the gate electrode 304. The formed gate oxide layer 302 is, for example, adjacent to the third isolation structure 200c and located between the second isolation structure 200b and the third isolation structure 200c. The formed gate 304 is, for example, located on the gate oxide layer 302 and the third isolation structure 200c.

2G, a source region 130 and a drain region 140 are formed in the substrate 100 on one side of the gate structure 300 and on the side of the third isolation structure 200c, respectively. In this embodiment, the source region 130 and the drain region 140 have the second conductivity type, for example, the N-type. The formation of the source region 130 and the drain region 140 includes, for example, the following steps. First, a patterned mask layer (not shown) is formed on the substrate 100. Then, an ion implantation process is performed through the patterned mask layer. The dopant implanted in the ion implantation process is, for example, phosphorus or arsenic, and the doping dose is, for example, 1E15 cm ^-2 to 5E15 cm ^-2 . After that, the above-mentioned patterned mask layer is removed, and a heat treatment process is performed to form a source region 130 and a drain region 140 in the substrate 100, respectively. The formed source region 130 is, for example, located in the second well region 112 and adjacent to the gate structure 300, and is located between the second isolation structure 200b and the third isolation structure 200c. The formed drain region 140 is, for example, located in the first well region 110 and between the third isolation structure 200c and the fourth isolation structure 200d.

2H, doped regions 132 and 134 are formed in the substrate 100 and the second well region 112, respectively. In this embodiment, the doped regions 132 and 134 have the first conductivity type, for example, the P type. The method of forming the doped regions 132 and 134 in the substrate 100 and the second well region 112 respectively includes the following steps, for example. First, a patterned mask layer (not shown) is formed on the substrate 100. Then, an ion implantation process is performed through the patterned mask layer. The dopant implanted in the ion implantation process is, for example, boron, and the doping dose is, for example, 1E15 cm ^-2 to 5E15 cm ^-2 . Afterwards, the above-mentioned patterned mask layer is removed and a heat treatment process is performed to form doped regions 132 and 134 in the substrate 100 and the second well region 112, respectively. The formed doped region 134 is between the first isolation structure 200a and the second isolation structure 200b. The formed doped region 132 is located between the second isolation structure 200b and the source region 130.

1A, 1B and 2H, in the embodiment of the present invention, the patterned mask layer required by the stepped regions 122a, 122b and the top doped regions 120a, 120b can be formed through the same photomask process. Therefore, the current path resistance can be reduced without increasing the manufacturing cost, and the device performance can be improved.

Referring to FIG. 4, in some embodiments, the semiconductor device is an ultra-high voltage device, and its breakdown voltage in the off state is 500 volts. By adding a stepped region and a top doped region below the source region, it can be turned on (The gate voltage applied voltage is 7.5 volts). The breakdown voltage is increased from 375 volts (as shown in curve S10) to 398 volts (as shown in curve S20). Therefore, in the present invention, adding a stepped region and a top doped region under the source region and the doped region can improve the performance of the UHV device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10: Semiconductor components 100: base 102, 106, 114: patterned mask layer 104, 108, 116, 118: ion implantation process 110: The first well area 112: The second well area 120, 120a, 120b: top doped area 122, 122a, 122b: stairs 130: source region 132, 134: doped area 140: Drain Region 200: isolation structure 200a: the first isolation structure 200b: second isolation structure 200c: third isolation structure 200d: fourth isolation structure 300: gate structure 302: gate oxide layer 304: Gate 306: Clearance Wall A-A’, B-B’, C-C’: cut line D1, D2: distance IR: inner area L: straight area MF: Multiple finger areas R: turning area OR: Peripheral area S10, S20, S100, S200: curve

FIG. 1A is a schematic top view of a semiconductor device according to an embodiment of the present invention. FIG. 1B is a schematic top view of the top doped region and other components of a semiconductor device according to an embodiment of the present invention. 2A to 2H are schematic cross-sectional views of a method of manufacturing a semiconductor device according to an embodiment of the present invention, wherein FIG. 2H is a schematic cross-sectional view according to the section line A-A' of the semiconductor device of FIG. 1A. Figure 3 shows the doping profile of the top doped region. FIG. 4 is an electrical diagram of an ultra-high voltage semiconductor according to an embodiment of the present invention.

10: Semiconductor components

100: base

110: The first well area

112: The second well area

120, 120a, 120b: top doped area

122, 122a, 122b: stairs

130: source region

132, 134: doped area

140: Drain Region

200: isolation structure

200a: the first isolation structure

200b: second isolation structure

200c: third isolation structure

200d: fourth isolation structure

300: gate structure

302: gate oxide layer

304: Gate

306: Clearance Wall

B-B’, C-C’: cut line

D1, D2: distance

Claims (10)

A semiconductor component including: The substrate has the first conductivity type; The first well area is arranged in the substrate and has a second conductivity type; The second well area is arranged in the substrate and has the first conductivity type; The source region and the drain region are disposed in the substrate and have the second conductivity type, the drain region is located in the first well region, and the source region is located in the second well region ； An isolation structure, disposed between the source region and the drain region; A gate structure disposed on the substrate between the source region and the drain region, wherein the gate structure covers a part of the isolation structure; The first top doped region is disposed in the second well region below the source region and has the first conductivity type; and The second top doped region is disposed in the first well region under the isolation structure and has the first conductivity type. The semiconductor device described in item 1 of the scope of the patent application further includes a doped region having the first conductivity type, which is located in the second well region and above the first top doped region, and is connected to the source The polar regions are adjacent. The semiconductor device described in item 2 of the scope of the patent application further includes a first stepped region and a second stepped region having a first conductivity type, and the first stepped region is located between the doped region and the source region. In between, the second stepped region is located between the isolation structure and the second top doped region. The semiconductor device according to claim 3, wherein between the source region and the drain region includes a plurality of linear regions and a plurality of finger regions formed by a plurality of turning regions, and the isolation structure is formed On the multiple finger areas. The semiconductor device according to item 4 of the scope of patent application, wherein the first top doped region and the first stepped region are located in a peripheral region of the periphery of the plurality of finger regions; the first top doped region The area and the first step area are located in the plurality of finger-shaped areas. A method for manufacturing a semiconductor element includes: Forming a first well region in a substrate having a first conductivity type, the first well region having a second conductivity type; Forming a second well region in the substrate, the second well region having the first conductivity type; A first top doped region is formed in the second well region, and a second top doped region is formed in the first well region, the first top doped region and the second top doped region Having the first conductivity type; Forming an isolation structure on the substrate, wherein the second top doped region is located under the isolation structure; Forming a gate structure on the substrate, wherein the gate structure covers a portion of the isolation structure; and A source region and a drain region having the second conductivity type are respectively formed in the substrate on one side of the gate structure and one side of the isolation structure, wherein the source region is located in the first A top doped region is on and adjacent to the gate structure, and the drain region is adjacent to the isolation structure. The method for manufacturing a semiconductor device as described in item 6 of the scope of the patent application further includes forming a doped region having the first conductivity type, which is located in the second well region and above the first top doped region, Adjacent to the source region. According to the manufacturing method of the semiconductor device described in the scope of the patent application, the method further includes forming a first stepped region and a second stepped region having a first conductivity type, the first stepped region being located in the doped region and the Between the source regions, the second stepped region is located between the isolation structure and the second top doped region. The method for manufacturing a semiconductor device as described in the scope of patent application, wherein the source region and the drain region include a plurality of straight line regions and a plurality of finger regions formed by a plurality of turning regions, the The isolation structure is formed on the plurality of finger regions. The method for manufacturing a semiconductor device according to the ninth patent application, wherein the first top doped region and the first stepped region are formed in the peripheral region of the periphery of the plurality of finger regions; A top doped region and the first stepped region are formed in the plurality of finger regions.

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