TW202122941A - Calibration device, calibration method and operating equipment applied thereto capable of adjusting and compensating the operating position of the working device to have a precise alignment - Google Patents
Calibration device, calibration method and operating equipment applied thereto capable of adjusting and compensating the operating position of the working device to have a precise alignment Download PDFInfo
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本發明係提供一種可使作業單元之作業器與承置器之承置部件準確對位,進而提升作業精準性之校正裝置及校正方法。The present invention provides a calibration device and a calibration method that can accurately align the working device of the working unit and the supporting part of the holder, thereby improving the working accuracy.
在現今,作業設備係以作業單元(如移料單元或檢查單元或清潔單元)之作業器(如移料器或CCD或清潔器)於不同承置器(如載台或測試器或預溫盤 )之承置部件執行取放電子元件之移料作業,或執行取像承置部件之檢查作業,亦或執行清潔承置部件的清潔作業;由於電子元件日後會應用於高溫場所或低溫場所,為確保電子元件之品質,業者必須對電子元件執行熱測作業或冷測作業,例如電子元件熱測作業,作業設備係設置一為載台之承置器,載台具有複數個為容置槽之承置部件以供承置電子元件,另於載台配置加熱件,以供升溫待測之電子元件,一為移料單元之作業單元,係設有複數個為移料器之作業器,並以複數個移料器將複數個待測之電子元件移入載台之複數個容置槽,載台於載送複數個電子元件之過程中,即利用加熱件先行預熱升溫複數個電子元件,而縮短複數個電子元件於複數個測試器之升溫作業時間;惟,在電子元件日趨精密微小之設計下,其移料器將電子元件移入載台之容置槽的精準度要求相當高,然因載台易受加熱件之高溫影響而膨脹變形增大,導致複數個容置槽之位置發生偏移問題,但移料器的作業位置係依變形前載台之容置槽位置而作相對配置,致使移料器的作業位置與變形後載台之容置槽的位置具有偏差量,以致移料器無法準確將電子元件移入變形後載台之容置槽,進而影響後續作業或碰損電子元件。Nowadays, the working equipment is based on the working device (such as the shifter or CCD or cleaner) of the working unit (such as the material moving unit or the inspection unit or the cleaning unit) on different holders (such as the stage or the tester or the preheating unit). plate ) Carry out the material transfer operation of picking and placing electronic components, or perform the inspection operation of the image receiving component, or perform the cleaning operation of cleaning the supporting parts; since the electronic components will be used in high temperature or low temperature places in the future, In order to ensure the quality of electronic components, the industry must perform thermal or cold testing of electronic components. For example, thermal testing of electronic components. The operating equipment is equipped with a carrier for the carrier, and the carrier has multiple accommodating slots. The supporting part is used to hold the electronic components, and the heating element is arranged on the stage to heat up the electronic components to be tested. One is the operating unit of the material moving unit, which is equipped with multiple operating devices as the material moving device. And use a plurality of shifters to move the plurality of electronic components to be tested into the plurality of accommodating slots of the carrier, the carrier is in the process of carrying the plurality of electronic components, that is, the heating element is used to preheat the plurality of electronic components. , And shorten the heating operation time of a plurality of electronic components in a plurality of testers; However, under the increasingly sophisticated and miniaturized design of electronic components, the accuracy requirements for the shifter to move the electronic components into the accommodating slot of the carrier are quite high. However, because the carrier is easily affected by the high temperature of the heating element, the expansion and deformation increase, which causes the position of the plurality of accommodating grooves to shift, but the working position of the material shifter is based on the position of the accommodating groove of the carrier before the deformation The relative configuration results in a deviation between the working position of the shifter and the position of the receiving slot of the deformed carrier, so that the shifter cannot accurately move the electronic components into the receiving slot of the deformed carrier, which affects subsequent operations or collisions. Damage to electronic components.
本發明之目的一,係提供一種校正裝置,以供校正具有作業取像器及作業器之作業單元,校正裝置包含校正機構及控制機構,校正機構係設置校正取像器及校準件,校準件係設有校位部,校正取像器係取像該校準件之校位部及作業單元之作業器;控制機構係具有控制器,以接收該校正取像器所傳輸之影像資料,並分析作業器與作業取像器之距離;藉以取得作業器的初始位置,而供校正調整作業器之實際作業位置,達到提升作業準確性之實用效益。The first object of the present invention is to provide a calibration device for calibrating a working unit with a working imager and a working device. The calibration device includes a calibration mechanism and a control mechanism. The calibration mechanism is provided with a calibration imager and a calibration piece. The calibration piece It is equipped with a calibration unit. The calibration imager is an operating device that captures the calibration unit and operation unit of the calibration part; the control mechanism has a controller to receive the image data transmitted by the calibration imager and analyze it The distance between the operating device and the operating imager; in order to obtain the initial position of the operating device, it can be used to correct and adjust the actual operating position of the operating device to achieve the practical benefit of improving the accuracy of the operation.
本發明之目的二,係提供一種校正裝置,更包含調整機構,該調整機構係設有至少一調整器,以於校正取像器之第二中心與校準件之校位部具有偏差時,利用調整器調整該校正取像器之位置,以利準確取像該作業單元之作業器,達到提升校正準確性之實用效益。The second objective of the present invention is to provide a calibration device, which further includes an adjustment mechanism. The adjustment mechanism is provided with at least one adjuster for correcting the deviation between the second center of the imager and the calibration part of the calibration part. The adjuster adjusts the position of the calibrated image taker, so as to accurately capture the operating device of the operating unit, and achieve the practical benefit of improving the accuracy of the calibration.
本發明之目的三,係提供一種校正裝置,其校準件之校位部可供作業單元之作業取像器取像,以利作業單元調整該作業取像器的第一中心準確對位校準件之校位部,而使作業取像器的第一中心與校正取像器之第二中心準確對位,以利分析作業器與作業取像器之距離,達到提升校正準確性之實用效益。The third object of the present invention is to provide a calibration device, the calibration part of the calibration part can be used to capture images of the working imager of the working unit, so that the working unit can adjust the first center of the working imager to accurately align the calibration part The alignment part makes the first center of the working imager accurately align with the second center of the calibration imager to facilitate the analysis of the distance between the working imager and the working imager to achieve the practical benefit of improving the accuracy of the calibration.
本發明之目的四,係提供一種校正方法,其承置器檢知程序係取得變形後承置器之承置部件的位置,並執行作業器檢知程序,係以校正裝置之校正機構取得校準件之校位部與作業單元之作業器的距離,以得知作業單元之作業取像器的第一中心位置與作業器的距離,於執行對位程序,以令作業取像器之第一中心對位承置器之第三中心,以得知作業器與承置部件間的偏差量,再執行作業器調校程序,係以校正裝置之控制機構依據偏差量而計算出補償值 ,加以調整補償作業器之作業位置,使作業器與承置部件準確對位,達到提升作業精準性之實用效益。The fourth object of the present invention is to provide a calibration method in which the carrier detection program is to obtain the position of the supporting part of the carrier after deformation, and the working tool detection program is executed to obtain the calibration by the calibration mechanism of the calibration device The distance between the alignment part of the piece and the working device of the working unit to know the distance between the first center position of the working imager of the working unit and the working device. The center is aligned with the third center of the supporting device to know the deviation amount between the working device and the supporting part, and then the working device adjustment program is executed, and the control mechanism of the correction device calculates the compensation value according to the deviation amount , To adjust the working position of the compensation working device to make the working device and the supporting part accurately align, to achieve the practical benefit of improving the accuracy of the operation.
本發明之目的五,係提供一種應用校正裝置之作業設備,包含機台、供料裝置、收料裝置、作業裝置、本發明校正裝置及中央控制裝置,供料裝置係配置於機台,並設有至少一供料器,以供容納待作業之電子元件;收料裝置係配置於機台,並設有至少一收料器,以供容納已作業之電子元件;作業裝置係配置於機台,並設有至少一承置器及至少一作業單元,承置器係承置電子元件,作業單元係設置作業器及作業取像器,並以作業器對電子元件執行預設作業;本發明校正裝置係配置於機台,並包含校正機構及控制機構,以校正電子元件;中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。The fifth object of the present invention is to provide a working equipment using a calibration device, including a machine, a feeding device, a receiving device, a working device, a calibration device of the present invention, and a central control device. The feeding device is arranged on the machine and At least one feeder is provided to accommodate the electronic components to be operated; the receiving device is arranged on the machine, and at least one receiver is provided to accommodate the electronic components that have been operated; the operating device is arranged on the machine The table is equipped with at least one holder and at least one working unit. The holder is for holding electronic components. The working unit is equipped with a working device and a working imager, and the working device is used to perform preset operations on the electronic components; The calibration device of the invention is configured in the machine and includes a calibration mechanism and a control mechanism to calibrate electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of enhancing operational performance.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given with the accompanying drawings. The details are as follows:
請參閱第1、2、3圖,本發明作業設備包含機台10、供料裝置20、收料裝置30、作業裝置40、本發明校正裝置50及中央控制裝置(圖未示出);供料裝置20係配置於機台10,並設有至少一供料器21,以供容納待作業之電子元件;收料裝置30係配置於機台10,並設有至少一收料器31,以供容納已作業之電子元件;作業裝置40係配置於機台10,並設有至少一承置器及至少一作業單元,承置器係承置電子元件,作業單元係設置作業器及作業取像器,並以作業器對電子元件執行預設作業;更進一步,承置器可為載台或測試器或預溫盤,作業單元可為移料單元或檢查單元或清潔單元,作業器可為移料器或CCD或清潔器;於本實施例中,作業裝置40係設有第一承置器、第二承置器及第三承置器,第一承置器係為第一載台41,其中心係為第三中心L3,第一載台41並設有複數個為第一容置槽411之第一承置部件,以供承置待作業之電子元件,另於至少一承置器設有至少一溫控件,以供溫控電子元件,溫控件可為加熱件、致冷晶片或預溫流體,於本實施例中,第一載台41之內部設有為加熱件412之溫控件,以供預熱電子元件;第二承置器係為第二載台42,並設有複數個為第二容置槽421之第二承置部件,以供承置已作業之電子元件;第三承置器係為測試器,測試器包含電性連接之電路板431及具電性承接件(如探針)之測試座432,以供測試電子元件;又作業裝置40係設有第一作業單元、第二作業單元及第三作業單元,第一作業單元係設有第一作業取像器441及複數個為第一移料器442之第一作業器,第一移料器442之中心係為第一中心為L1,第一移料器442係於供料裝置20、校正裝置50及第一載台41間移載待作業之電子元件,第二作業單元係設有第二作業取像器451及複數個為第二移料器452之第二作業器,以於第一載台41取出待作業之電子元件,並將電子元件移載且壓抵於測試座432而執行測試作業,以及將測試座432之已作業電子元件移載至第二載台42,第二載台42係載出已作業之電子元件
,第三作業單元係設有第三作業取像器461及複數個為第三移料器462之第三作業器,第三移料器462於第二載台42取出已作業之電子元件,並依作業結果,將已作業之電子元件移載至收料裝置30而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。Please refer to Figures 1, 2 and 3, the working equipment of the present invention includes a
校正裝置50係配置於機台10,包含校正機構51及控制機構52,更包含基座53及調整機構54。The
校正機構51係設置校準件511及校正取像器512,校準件511係設有校位部5111,更進一步,校準件511可裝配於機台10或基座53,校準件511可作固定式配置或可作至少一方向位移配置,校位部5111可為標記圖案或標記塊;於本實施例中,校準件511係以透明材質製作,並於預設位置設有為標記圖案之校位部5111,校準件511係於遠離校位部5111之一端裝設有支撐架5112;校正取像器512係取像該校準件511之校位部5111及作業單元之作業器,更進一步,校正取像器512可裝配於機台10或基座53,校正取像器512可作固定式配置或可作至少一方向位移配置,校正取像器512可配置於校準件511之上方或下方,亦或搭配菱鏡使用而配置於校準件511之側方;於本實施例中,校正取像器512係為CCD,其中心係為第二中心L2,校正取像器512並位於校準件511之下方,而供取像校準件511之校位部5111及複數個第一移料器442。The
控制機構52係具有控制器521,以接收校正機構51之校正取像器512所傳輸之影像資料,並分析作業器與作業取像器之距離,以取得作業器的初始位置,而供校正調整該作業器之實際作業位置;於本實施例中,控制器521可接收校正取像器512所傳輸之校位部5111的影像資料及複數個第一移料器442的影像資料,控制器521並接收第一作業取像器441所傳輸之第一載台41的影像資料
;控制機構52更包含資料庫522,資料庫522具有作業器之基準影像資料,以供控制器521作一比對分析,於本實施例中,資料庫522具有第一載台41的基準影像資料。The
基座53係供裝配校正機構51,於本實施例中,基座53係設有底板531及側板532,底板531供裝配校正機構51之校正取像器512,側板532與校準件511之支撐架5112間設有第一驅動源533,第一驅動源533帶動校準件511之支撐架5112作第一方向(如Z方向)位移,而調整校準件511之作業高度。The
調整機構54係裝配校正取像器512或基座53,以供調整校正取像器512或基座53之位置,於本實施例中,調整機構54係設有至少一調整器541,調整器541裝配於校正取像器512之下方,以供調整該校正取像器512之位置。The
請參閱第4至8圖(配合參閱第1至3圖),本發明校正方法包含承置器檢知程序551、作業器檢知程序552、對位程序553及作業器調校程序554。Please refer to FIGS. 4 to 8 (see FIGS. 1 to 3 for reference). The calibration method of the present invention includes a
承置器檢知程序551係取得變形後承置器之承置部件的位置;承置器檢知程序551更包含建立承置器樣本程序,建立承置器樣本程序係於控制機構52之資料庫522建立承置器之基準影像資料,於本實施例中,建立承置器樣本程序係於控制機構52之資料庫522建立第一載台41之基準影像資料;承置器檢知程序551係以作業單元之作業取像器取像變形後之承置器,並將影像資料傳輸至控制機構52之控制器521;於本實施例中,當第一載台41因受熱而發生膨脹變形增大,由於第一載台41具有複數個定位點413,承置器檢知程序551係以第一作業取像器441取像變形後之第一載台41的複數個定位點413,並將複數個定位點413的影像資料傳輸至控制機構52之控制器521,控制機構52之控制器521可由複數個定位點413計算出第一載台41的變形量,亦或將變形後第一載台41的影像資料與資料庫522的第一載台41基準影像資料作比對分析,上述方式均可取得變形後第一載台41之第一容置槽411的位置,使得控制器521獲知變形後第一載台41之第一容置槽411的位置。The supporting
作業器檢知程序552係以校正裝置50之校正機構51取得校準件511之校位部5111與作業單元之作業器的距離,以得知作業單元之作業取像器的第一中心L1位置與作業器的距離;於本實施例中,第一作業單元依預設行程驅動第一移料器442位移至校正裝置50之校準件511上方,且相對於校正取像器512,校正取像器512即取像校位部5111與第一移料器442,以取得校位部5111與第一移料器442之距離,然在第一作業取像器441之第一中心L1與校準件511之校位部5111作中心對位的要件下,而可獲得第一作業取像器441與第一移料器442之相對位置
,當複數個第一移料器442依序位移至校準件511之上方而供取像後,即可獲得複數個第一移料器442與第一作業取像器441間之相對位置,並將資料傳輸至控制機構52之控制器521。The working
作業器檢知程序552更包含作業取像器校位程序,作業取像器校位程序係於校正取像器512取像該作業器之前,以作業取像器的第一中心L1與校準件511之校位部512作校位;於本實施例中,於校正取像器512執行取像複數個第一移料器442之前,第一作業單元係驅動第一作業取像器441位移至校準件511之上方,令第一作業取像器441之第一中心L1與校準件511之校位部5111作校正對位,以利正確取得複數個第一移料器442與第一作業取像器441間之相對位置。The working
作業器檢知程序552更包含校正取像器校位程序,校正取像器校位程序係於執行作業取像器校位程序前,校正取像器512之第二中心L2係與校準件511之校位部5111作校位;於本實施例中,校正取像器512係取像校準件511之校位部5111,若有誤差,可由控制器521增設補償值,亦或利用調整機構54之調整器541調整校正取像器512之位置,使校正取像器512之第二中心L2對位該校準件511之校位部5111,以利校正取像器512正確取像第一移料器442之位置。The working
作業器檢知程序552更包含校正取像器與作業取像器校位程序,校正取像器與作業取像器校位程序係於執行作業取像器校位程序後,以使作業取像器之第一中心L1與校正取像器512之第二中心L2作校正對位;於本實施例中,當校準件511之校位部5111分別與第一作業取像器441的第一中心L1及校正取像器512之第二中心L2作校正對位後,即可使第一作業取像器441的第一中心L1與校正取像器512之第二中心L2作校正對位,以利校正取像器512正確取像第一移料器442之位置。The operating
對位程序553係以作業取像器之第一中心對位承置器之第三中心
,以得知作業器與承置部件間的偏差量;於本實施例中,對位程序553係以第一作業取像器441的第一中心L1對位變形後第一載台41之第三中心L3,進而取得第一載台41之第三中心L3與複數個第一移料器442間之相對位置,使得控制機構52之控制器521得知複數個第一移料器442與變形後第一載台41之複數個第一容置槽411的偏差量。The
作業器調校程序554係以校正裝置之控制機構依據偏差量而計算出補償值,加以調整補償作業器之作業位置,使作業器與承置部件準確對位;於本實施例中,控制機構52之控制器521於得知複數個第一移料器442與變形後第一載台41之複數個第一容置槽411的偏差量後,由於第一作業取像器441的第一中心L1對位第一載台41之第三中心L3,即可以第一作業取像器441的第一中心L1為基準,而於複數個第一移料器442之位置值加入補償值,以調整複數個第一移料器442之實際作業位置,令複數個第一移料器442精準對位變形後第一載台41之複數個第一容置槽411,使得複數個第一移料器442準確於變形後第一載台41之複數個第一容置槽411取放電子元件。The working
10:機台 20:供料裝置 21:供料器 30:收料裝置 31:收料器 40:作業裝置 41:第一載台 411:第一容置槽 412:加熱件 413:定位點 42:第二載台 421:第二容置槽 431:電路板 432:測試座 441:第一作業取像器 442:第一移料器 451:第二作業取像器 452:第二移料器 461:第三作業取像器 462:第三移料器 50:校正裝置 51:校正機構 511:校準件 5111:校位部 5112:支撐架 512:校正取像器 52:控制機構 521:控制器 522:資料庫 53:基座 531:底板 532:側板 533:第一驅動源 54:調整機構 541:調整器 551:承置器檢知程序 552:作業器檢知程序 553:對位程序 554:作業器調校程序 L1:第一中心 L2:第二中心 L3:第三中心10: Machine 20: Feeding device 21: feeder 30: Receiving device 31: Receiver 40: operating device 41: First stage 411: first housing tank 412: heating element 413: Anchor Point 42: second stage 421: second holding tank 431: Circuit Board 432: Test Block 441: First job imager 442: first shifter 451: Second job imager 452: Second Shifter 461: Third job imager 462: Third Shifter 50: Calibration device 51: Correction mechanism 511: Calibration part 5111: School Position Department 5112: Support frame 512: Calibration viewfinder 52: control mechanism 521: Controller 522: Database 53: Pedestal 531: bottom plate 532: Side Panel 533: first drive source 54: adjustment mechanism 541: Adjuster 551: Holder detection program 552: Working device detection program 553: Alignment Program 554: Work Device Calibration Program L1: First center L2: second center L3: Third Center
第1圖:本發明作業設備之示意圖。 第2圖:本發明承置器、作業單元及校正裝置之配置圖。 第3圖:本發明校正裝置之示意圖。 第4圖:校正方法之流程圖。 第5圖:校正方法之校正示意圖(一)。 第6圖:校正方法之校正示意圖(二)。 第7圖:校正方法之校正示意圖(三)。 第8圖:校正方法之校正示意圖(四)。 第9圖:校正方法之校正示意圖(五)。Figure 1: Schematic diagram of the working equipment of the present invention. Figure 2: The layout diagram of the holder, working unit and calibration device of the present invention. Figure 3: A schematic diagram of the calibration device of the present invention. Figure 4: Flow chart of the calibration method. Figure 5: Schematic diagram of the calibration method (1). Figure 6: Schematic diagram of the calibration method (2). Figure 7: Schematic diagram of the calibration method (3). Figure 8: Schematic diagram of the calibration method (4). Figure 9: Schematic diagram of the calibration method (5).
41:第一載台41: First stage
411:第一容置槽411: first housing tank
441:第一作業取像器441: First job imager
442:第一移料器442: first shifter
50:校正裝置50: Calibration device
511:校準件511: Calibration part
512:校正取像器512: Calibration viewfinder
52:控制機構52: control mechanism
521:控制器521: Controller
522:資料庫522: database
53:基座53: Pedestal
54:調整機構54: adjustment mechanism
L1:第一中心L1: First center
L3:第三中心L3: Third Center
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