TW202119897A - Temperature-uniformizing board - Google Patents

Abstract

A temperature-uniformizing board is provided to solve the problem where the thinning of the conventional temperature-uniformizing board is difficult. The temperature-uniformizing board includes a heat-discharging plate, a heat-absorbing plate, a capillary structure, and a working fluid. At least one of the heat-discharging plate and the heat-absorbing plate includes a recess formed by an etching process. The heat-discharging plate and the heat-absorbing plate are engaged with each other face by face such that the recess can form a chamber. The capillary structure is disposed in the chamber. The chamber is filled with the working fluid.

Description

Temperature plate

The present invention relates to a heat dissipation device, in particular to a uniform temperature plate for dissipating electronic components.

In electronic products, the conventional uniform temperature plate is combined with the surface of the heat source. The interior of the conventional uniform temperature plate is filled with a working fluid. The heat source can heat the working fluid and vaporize the working fluid. A gaseous working flow system It evaporates to the side far away from the heat source and then condenses, so that the heat from the heat source can be taken away to achieve the purpose of heat dissipation. The conventional uniform temperature plate has an upper plate body and a lower plate body. The upper plate body and the lower plate body are bent by punching or die-casting so that the upper plate body and the lower plate body are respectively A groove is formed, whereby the upper plate body and the lower plate body can be butted to form a space, the space can be used to fill the working fluid, and the internal system of the space can have a capillary structure to help the working fluid Carry out the cycle of evaporation and condensation.

However, when the conventional uniform temperature plate is used for small electronic components and thinned, it is difficult to bend the upper plate body and the periphery of the lower plate body, which increases the difficulty in production. Due to the thinning, the thickness of the upper plate body and the lower plate body after bending is also limited, and the grooves formed by the upper plate body and the lower plate body are too shallow, resulting in the conventional uniform temperature plate. Lack of space affects the heat dissipation efficiency.

In view of this, there is indeed still a need to improve the conventional uniform temperature plate.

In order to solve the above problems, the purpose of the present invention is to provide a uniform temperature plate that can be easily processed to improve production efficiency.

The second objective of the present invention is to provide a uniform temperature plate which can improve the heat dissipation efficiency.

The directionality described in the full text of the present invention or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the direction of the attached drawings. The terms of the directionality or similar terms are only used to assist in the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.

The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

The uniform temperature plate of the present invention includes: a heat release sheet; a heat absorption sheet. At least one of the heat release sheet and the heat absorption sheet has a groove formed by an etching process. The heat release sheet and the heat absorption sheet are Align with each other to form a cavity by the groove; a capillary structure located in the cavity; and a working fluid filled in the cavity.

Accordingly, the uniform temperature plate of the present invention is formed by etching the grooves of the heat-radiating sheet and the grooves of the heat-absorbing sheet without bending the periphery of the heat-radiating sheet and the heat-absorbing sheet, and can be easily thinned The uniform temperature plate is processed, and by etching, the groove can be formed in a unit with a depth of less than mm to meet the production requirements of the thin uniform temperature plate, and the effect of improving production efficiency can be achieved. Furthermore, by forming the groove by etching, the capacity of the chamber of the housing can be increased by reducing the thickness of the heat-radiating sheet and the heat-absorbing sheet, and the amount of the working fluid can be increased without increasing the thickness of the uniform temperature plate, Or, by providing enough evaporation space for the working fluid, the effect of providing good heat dissipation efficiency can be achieved.

Wherein, the heat release sheet and the heat absorption sheet respectively have the groove. In this way, the system can achieve the effect of further providing good heat dissipation performance.

Wherein, the heat-radiating sheet or the heat-absorbing sheet has at least one supporting column, and the supporting pillar is located between the heat-radiating sheet and the heat-absorbing sheet. In this way, the strength of the shell can be improved, and the shell is not easy to be bent.

Wherein, the heat-radiating sheet or the heat-absorbing sheet has at least one positioning column, and the positioning column is positioned opposite to the supporting column. In this way, when the heat radiating fin and the heat absorbing fin are connected to each other, the positioning column can form a positioning with the supporting column, which has the effect of stably fixing the heat radiating fin and the heat absorbing fin.

Wherein, the groove of the heat release sheet and the groove of the heat absorption sheet respectively have a groove surface, and the peripheral edge of the groove surface forms a ring edge, the ring edge is surrounding the groove surface, the ring edge of the heat release sheet or the heat absorption sheet The ring edge is in contact with the groove surface of the heat absorption sheet or the groove surface of the heat release sheet. In this way, the overall thickness of the casing can be reduced, and it has the effect of meeting the requirements for thinning.

Wherein, the ring edge of the heat radiation sheet is adjacent to the ring edge of the heat absorption sheet. In this way, the volume of the cavity formed by the combination of the groove of the heat-radiating fin and the groove of the heat-absorbing fin can be increased, and it has the effect of providing good heat dissipation performance.

Wherein, the thickness of the ring edge of the heat radiating sheet or the ring edge of the heat absorbing sheet is greater than the depth of the groove of the heat absorbing sheet or the groove of the heat radiating sheet opposite, and the ring edge of the heat radiating sheet or the ring edge of the heat absorbing sheet abuts It is connected to the groove surface of the heat absorption sheet or the groove surface of the heat release sheet opposite to form a step. In this way, the laser welding can be conveniently carried out from the included angle of 30 to 75°, and the heat radiation sheet and the heat absorption sheet can be welded and combined without any gap.

Wherein, the heat-radiating sheet or the heat-absorbing sheet is attached to the ring edge to form a ring shoulder by an etching process, and the depth of the ring shoulder with respect to the ring edge is equal to the ring edge of the heat-radiating sheet or the heat-absorbing sheet. The thickness of the ring edge. In this way, the heat radiation sheet can be prevented from protruding from the heat absorption sheet, which has the effect of further reducing the overall thickness of the shell.

Wherein, the ring edge of the heat radiating fin is opposite to the ring edge of the heat absorbing fin. In this way, a larger cavity is formed, which has the effect of improving heat dissipation efficiency.

Wherein, the junction between the heat-radiating sheet and the heat-absorbing sheet after being joined does not have an opening. In this way, it can be more easily applied to the thinner temperature equalizing plate in small electronic products, and has the effect of improving the convenience of production.

Wherein, the junction of the heat radiating sheet and the heat absorbing sheet is welded by laser, and the angle of the laser welding is 30 to 75 degrees. In this way, it has the effect of ensuring that the heat radiating sheet and the heat absorbing sheet can be welded and combined without creating a gap.

Among them, the thickness of the capillary structure is 0.05 to 0.5 mm. In this way, it has the effect of reducing the thickness of the capillary structure.

Among them, the thickness of the capillary structure is 0.2~0.4 mm. In this way, it has the effect of reducing the thickness of the capillary structure.

Wherein, the capillary structure has at least one perforation, and the perforation is opposite to the supporting column. In this way, the capillary structure can be accurately aligned, which has the effect of improving the convenience of production.

Wherein, the capillary structure is located between the supporting column and the opposite heat radiating fin or the opposite heat absorbing fin, and the supporting column abuts against the capillary structure. In this way, the capillary structure can be adjacent to the heat-radiating sheet or the heat-absorbing sheet to ensure that the working fluid can gather on the groove surface of the heat-radiating sheet or the groove surface of the heat-absorbing sheet to fully absorb the heat of the heat source. Improve the efficiency of heat dissipation.

Wherein, the capillary structure is a thin sheet formed by sintering powder. In this way, the capillary structure can be placed in the groove, and difficult operations such as sintering on the heat radiating sheet or the heat absorption sheet can be avoided, and the uniform temperature plate that is easier to be applied to the thinning of small electronic products is provided. To enhance the efficiency of production convenience.

Wherein, there are several supporting columns, and several supporting columns are staggered and located in the grooves of the heat-radiating fin and the groove of the heat-absorbing fin at the same time, and the several supporting columns respectively abut against the capillary structure. In this way, the capillary structure forming the sheet can be made into a wave-like structure, and several gaps can be formed between the capillary structure, the heat release sheet and the heat absorption sheet, so as to improve the evaporation efficiency of the working fluid and further improve the uniform temperature. The effect of the overall heat dissipation efficiency of the board.

Wherein, the heat-radiating sheet or the heat-absorbing sheet does not have the groove and has at least one coupling hole, and the opposite heat-absorbing sheet or the heat-radiating sheet has an abutting post aligned with the coupling hole. In this way, it has the effect of streamlining the processing steps.

Wherein, the heat radiating sheet or the heat absorbing sheet is punched to form the coupling hole. In this way, it has the effect of streamlining the processing steps.

In order to make the above and other objectives, features and advantages of the present invention more comprehensible, the following describes the preferred embodiments of the present invention in conjunction with the accompanying drawings in detail as follows:

Please refer to Figures 1 and 2, which is the first embodiment of the uniform temperature plate structure of the present invention, which includes a heat radiating fin 1 and a heat absorbing fin 2, and the heat radiating fin 1 and the heat absorbing fin 2 are opposed to each other.

The uniform temperature plate structure can be made of materials with high thermal conductivity, such as copper or aluminum, so that it can be used to directly or indirectly connect a heat source to dissipate heat from the heat source. The heat source may be, for example, a mobile phone, The central processing unit of computers or other electrical products, or electronic components such as chips on the circuit board that generate heat due to operation. The uniform temperature plate structure can be filled with a working fluid. The working fluid can be water, alcohol or other low-boiling liquids. Preferably, the working fluid system can be a non-conductive liquid, so that the working fluid can be The liquid absorbs heat and evaporates into a gaseous state. The temperature equalizing plate structure can preferably be in a vacuum-sealed state to prevent the working fluid from being lost after being formed into a gaseous state, and to prevent the interior from being occupied by air and compressed into the space after the working fluid is formed into a gaseous state. , Which in turn affects the heat dissipation efficiency.

Please continue to refer to Figure 1, the heat radiating fin 1 may have at least one groove 11, and the groove 11 can be used to contain the working fluid, so that the heat carried by the working fluid can be transferred from the heat radiating fin 1, for example , Can be transferred to the outside, or the heat radiating fin 1 can be connected to other components with heat conduction effects, such as fins, metal pipes or fans, to take the heat away from the heat radiating fin 1 to achieve the purpose of heat dissipation.

It is worth noting that the groove 11 is formed by an etching process. For example, it can be formed by dry etching, wet etching or plasma etching. The present invention is not limited. In this way, it can be simply The heat sink 1 forms the groove 11, and the depth of the groove 11 can be precisely controlled in units of less than mm by etching. For example, in small electronic products, the thickness of the thinned temperature equalizing plate is less than or equal to 1 mm. The etching method can form the groove 11 in the thinned temperature equalizing plate, which has the effect of reducing the processing difficulty.

Please refer to FIG. 1 again, the groove 11 is etched to form a groove surface 12, and the periphery of the groove surface 12 forms a ring edge 13, and the ring edge 13 surrounds the groove surface 12. In this embodiment, the groove surface 12 may have at least one supporting column 14. The supporting column 14 can abut between the heat-radiating fin 1 and the heat-absorbing fin 2, and the supporting column 14 can be connected to the heat-radiating fin 1 After being manufactured separately, they are combined to the groove surface 12 by assembly. For example, they can be joined to the groove surface 12 by welding, or the support column 14 can be integrally formed on the groove surface 12, for example, the groove can be formed by etching. The supporting column 14 is formed at 11 o'clock, and the present invention is not limited. By this, the strength of the temperature equalizing plate structure can be improved, and the structure of the equal temperature plate can be prevented from being deformed and bending is not easy to occur.

The heat-absorbing fin 2 and the heat-radiating fin 1 can be connected to each other, so that the heat-absorbing fin 2 and the heat-radiating fin 1 can form a cavity S together, and the cavity S can be used to contain the working fluid for the working fluid. The fluid evaporates and condenses circulation to achieve the purpose of heat dissipation, and the heat absorption sheet 2 can be used to connect the heat source to absorb the heat generated by the heat source. In this embodiment, the heat absorption sheet 2 may also have at least one groove 21. The groove 21 is also formed by an etching process, and may be formed by, for example, dry etching, wet etching or plasma etching. The present invention does not By this limitation, the groove 21 can also be formed in the thinned temperature equalizing plate by etching, which has the effect of reducing the difficulty of processing. The groove 21 is etched to form a groove surface 22, and the periphery of the groove surface 22 forms a ring edge 23. The ring edge 23 surrounds the groove surface 22. The groove 21 of the heat absorption sheet 2 can be connected to the heat release sheet. The grooves 11 of 1 are aligned with each other, so that the grooves 21 of the heat absorption sheet 2 and the grooves 11 of the heat release sheet 1 can jointly form the cavity S. Preferably, a plurality of grooves 11, 21 having the ring edges 13, 23 can be formed on a substrate (panel) P by an etching process, and a plurality of penetrations can be formed around the plurality of ring edges 13, 23 A section P1 is formed between the plurality of penetrating portions P1. The plurality of penetrating portions P1 may be stamp-holes or slots (as shown in Figs. 11a and 11b). ), thereby, by cutting off the cut-off portion P2, a plurality of heat-radiating fins 1 or a plurality of the heat-absorbing fins 2 with the grooves 11 and 21 can be obtained, which can be manufactured in large quantities and has the effect of improving the convenience of production.

The groove surface 22 of the heat absorption sheet 2 may additionally have at least one positioning post 24 which is opposite to the support post 14 of the heat release sheet 1, preferably by spot welding so that the support post 14 can be welded In combination with the positioning column 24, the positioning column 24 in this embodiment may have a counterbore 241, and the counterbore 241 may be opposed to the column of the support column 14, whereby the heat release sheet 1 and the heat absorption sheet 2 are opposed to each other. When connected, the support column 14 and the positioning column 24 can form a positioning with each other, which has the function of stably fixing the heat release sheet 1 and the heat absorption sheet 2. In addition, the positioning column 24 may not have the counterbore 241, so that the positioning The end surface of the column 24 abuts against the end surface of the support column 14. The positioning column 24 can also be separately manufactured with the heat absorption sheet 2 and then combined with the groove surface 22 by assembly or welding, which is not limited by the present invention. It is worth noting that the supporting pillars 14 may be located on the heat-radiating sheet 1 or the heat-absorbing sheet 2, and the supporting pillars 14 may be several, and may be alternately positioned on the heat-radiating sheet 1 and the heat-absorbing sheet 2, thereby, It can be from the heat-radiating sheet 1 or from the heat-absorbing sheet 2 so that the end surface of the support column 14 directly abuts the opposite heat-radiating sheet 1 or the heat-absorbing sheet 2 (as shown in Fig. 8), and can be spot welded The support column 14 can be welded and combined with the heat radiating fin 1 or the heat absorbing fin 2. Similarly, the heat absorbing fin 2 and the heat radiating fin 1 can also have a positioning column 24 opposite to the support column 14, which can be used by those skilled in the art Understand, I won’t go into details here.

Please refer to Fig. 3, the ring edge 13 of the heat radiating sheet 1 may abut against the groove surface 22 of the heat absorbing sheet 2 or, alternatively, the ring edge 23 of the heat absorbing sheet 2 may abut against the heat radiating sheet 1 The present invention is not limited to the groove surface 12. In this embodiment, the ring edge 13 of the heat radiating sheet 1 abuts against the groove surface 22 of the heat absorption sheet 2 as an example for description, whereby the uniformity can be reduced. The overall thickness of the warm plate structure (that is, the thickness between the heat radiating sheet 1 and the heat absorbing sheet 2) can meet the requirements of thinning. At this time, it is possible to weld the junction of the heat-radiating sheet 1 and the heat-absorbing sheet 2 by laser. Preferably, the angle θ of the laser welding (the angle with the horizontal plane) is preferably 30 to 75 degrees, so that The heat radiating sheet 1 and the heat absorbing sheet 2 can be reliably welded together without a gap.

Please refer to Figures 3 to 5 again. Preferably, the ring edge 13 of the heat radiating fin 1 and the ring edge 23 of the heat absorbing fin 2 are adjacent to each other, so that the groove 11 and the heat radiating fin 1 can be lifted. The groove 21 of the heat absorbing sheet 2 forms the volume of the cavity S formed by the coincidence, wherein the thickness D1 of the ring edge 13 of the heat radiating sheet 1 can be greater than the depth D2 of the groove 21 of the heat absorbing sheet 2, so that the ring of the heat radiating sheet 1 When the side 13 abuts against the groove surface 22 of the heat-absorbing sheet 2 opposite, a difference D3 can be formed to facilitate laser welding at an angle θ of 30 to 75, or the heat-absorbing sheet 2 can be positioned on the ring side 23 is etched to form a ring shoulder 231. The depth D4 formed by the ring shoulder 231 relative to the ring edge 23 of the heat sink 2 can be equal to the thickness D1 of the ring edge 13 of the heat sink 1 (as shown in Figure 4). ), by this, the heat radiating fin 1 can be prevented from protruding from the heat absorbing fin 2, which has the effect of further reducing the overall thickness of the uniform temperature plate structure. In addition, the ring edge 13 of the heat radiating fin 1 and the ring edge 23 of the heat absorbing fin 2 can also be connected to each other (as shown in Fig. 5) to form a larger cavity S, which has the effect of improving heat dissipation efficiency. .

Please continue to refer to Figures 1 and 3, the temperature equalizing plate structure of the present invention may also include a capillary structure 3 located in the chamber S to help the condensed working fluid to re-assemble and flow back. To re-absorb the heat of the heat source, the capillary structure 3 can be a porous mesh structure, micro grooves or sintered powder structure to increase the flow of the working fluid due to capillary phenomenon. The capillary structure 3 can be sintered by a powder ( power sintering process), the powder can be copper powder or other suitable powders, and the present invention is not limited. In detail, the thickness of the capillary structure 3 can be 0.05 to 0.5 mm, preferably 0.2 to 0.4 mm, and the capillary structure 3 can be directly sintered on the groove surface 12 of the heat radiating sheet 1 or the groove surface of the heat absorption sheet 2 22. After the heat release sheet 1 and the heat absorption sheet 2 are relatively combined, the capillary structure 3 can be located in the cavity S. In this embodiment, a thin sheet can be pre-sintered from powder to serve as the capillary structure 3, and then the capillary structure 3 formed into the thin sheet is placed on the groove surface 12 of the heat-radiating sheet 1, or placed on the heat-absorbing sheet 2 Preferably, the groove surface 22 can be powder metallurgical sintered first, or the sintered powder can be processed by pressing and leveling to form the required thickness or size, and the flaky capillary structure of the appropriate shape. 3. At this time, grooves can be formed on the capillary structure 3 at the same time to improve the flow conductivity of the capillary structure 3, whereby the capillary structure forming a sheet can be placed in the chamber S in a vacuum environment 3. Inject the working fluid into the chamber S, and then weld the radiating fin 1 and the absorbing fin 2 to form the uniform temperature plate structure. According to this, it is possible to avoid the heat dissipating fin 1 or the absorbing fin 2 For difficult operations such as sintering, there is no need to reserve openings for injecting the working fluid and vacuuming the chamber S. It has a thinner temperature equalizing plate that is easier to apply to small electronic products to improve The role of production convenience. The capillary structure 3 may have at least one perforation 31, and the position and number of the perforations 31 may correspond to the support column 14 and the positioning column 24, so that the support column 14 and the positioning column 24 can pass through.

Please refer to Figures 6 and 7, the capillary structure 3 can be located between the supporting column 14 and the opposite heat radiating fin 1 or the heat absorbing fin 2. Preferably, the supporting column 14 can abut against the The capillary structure 3, for example, can be abutted against the capillary structure 3 by the support column 14 of the heat sink 1 (as shown in Figure 6), and the support column 14 can be welded and joined by spot welding The capillary structure 3, whereby the capillary structure 3 can be adjacent to the heat absorbing sheet 2 to ensure that the working fluid can gather on the groove surface 22 of the heat absorbing sheet 2 to fully absorb the heat of the heat source, thereby improving the heat dissipation efficiency The role of. Alternatively, a plurality of supporting pillars 14 staggered between the heat-radiating sheet 1 and the heat-absorbing sheet 2 may abut against the capillary structure 3 forming the sheet, so that the capillary structure 3 forming the sheet has a wavy structure (such as As shown in Fig. 7), by this, several gaps can be formed between the capillary structure 3 and the heat radiating fin 1 and the heat absorbing fin 2, so as to improve the evaporation efficiency of the working fluid and further improve the overall temperature of the uniform temperature plate. Heat dissipation efficiency.

Please refer to Figures 9 and 10, the heat radiating sheet 1 may not have the groove 11, and the heat radiating sheet 1 can be abutted against the ring shoulder 231 of the heat absorbing sheet 2, so that only the heat absorbing sheet can be 2 Etching has the effect of streamlining the processing steps. In detail, the heat sink 1 may have at least one coupling hole 15. The coupling hole 15 may be formed into an elongated hole by punching, for example, which has the effect of simplifying the manufacturing process. The heat sink 2 may be formed by an etching process to form at least one resistance. The abutting post 25 is positioned at the coupling hole 15. Preferably, the abutting post 25 may have an abutting shoulder 251, so that when the coupling hole 15 is coupled to the abutting post 25, the The joint surrounding system can abut against the abutting shoulder 251, whereby the ring shoulder 231 of the heat-absorbing sheet 2 and the abutting shoulder 251 can support the heat-radiating sheet 1 together. The junction of the heat-radiating sheet 1 and the heat-absorbing sheet 2 and the junction of the coupling hole 15 and the abutting post 25 can be welded by laser, so that the heat-radiating sheet 1 and the heat-absorbing sheet 2 form a seal. The capillary structure 3 may also be provided between the heat-radiating sheet 1 and the heat-absorbing sheet 2, and the perforation 31 of the capillary structure 3 may be positioned on the abutting post 25 for the abutting post 25 to pass through. In addition, the present invention does not limit the positions of the coupling hole 15 and the contact post 25, that is, the contact post 25 may be formed on the heat radiation sheet 1 by an etching process, and the heat absorption sheet 2 does not have the groove 21 and The coupling hole 15 is provided to abut against the abutment post 25 on the heat radiation sheet 1.

In summary, the uniform temperature plate structure of the present invention forms the grooves of the heat-radiating sheet and the grooves of the heat-absorbing sheet by etching, without bending the periphery of the heat-radiating sheet and the heat-absorbing sheet, and can simply The thinning of the temperature equalizing plate is processed, and by etching, the groove can be formed with a depth of less than mm to meet the production requirements of the thinning of the temperature equalizing plate, and the effect of improving production efficiency can be achieved. Furthermore, by forming the groove by etching, the capacity of the chamber of the housing can be increased by reducing the thickness of the heat-radiating sheet and the heat-absorbing sheet, and the amount of the working fluid can be increased without increasing the thickness of the uniform temperature plate, Or, by providing enough evaporation space for the working fluid, the effect of providing good heat dissipation efficiency can be achieved.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.

1: Exothermic film 11: Slot 12: Groove surface 13: Ring edge 14: Support column 15: Combination hole 2: Heat-absorbing film 21: Slot 22: Groove surface 23: ring edge 231: Ring shoulder 24: positioning column 241: Counterbore 25: abutment column 251: Abutting the Shoulder 3: Capillary structure 31: Piercing S: Chamber P: substrate P1: Penetration P2: Truncated part D1: thickness D2: depth D3: Difference D4: Depth θ: Angle

[Figure 1] An exploded perspective view of a preferred embodiment of the uniform temperature plate of the present invention. [Figure 2] The combined front view of a preferred embodiment of the temperature equalizing plate of the present invention. [Figure 3] A cross-sectional view along the line A-A in Figure 2. [Figure 4] A cross-sectional view of the connection type of the heat radiating fin and the heat absorbing fin of the uniform temperature plate of the present invention. [Figure 5] A cross-sectional view of another butt joint type of the heat radiating fin and the heat absorbing fin of the uniform temperature plate of the present invention. [Figure 6] A cross-sectional view of the second embodiment of the temperature equalizing plate of the present invention. [Figure 7] A cross-sectional view of the third embodiment of the temperature equalizing plate of the present invention. [Figure 8] A cross-sectional view of the fourth embodiment of the temperature equalizing plate of the present invention. [Figure 9] An exploded perspective view of the fifth embodiment of the uniform temperature plate of the present invention. [Figure 10] A cross-sectional view of the fifth embodiment of the temperature equalizing plate of the present invention. [Figure 11a] A top view of the heat absorption sheet of the uniform temperature plate of the present invention formed by a substrate. [Figure 11b] A top view of the heat sink of the uniform temperature plate of the present invention formed from a substrate.

1: Exothermic film

11: Slot

12: Groove surface

13: Ring edge

14: Support column

2: Heat-absorbing film

21: Slot

22: Groove surface

23: ring edge

24: positioning column

241: Counterbore

3: Capillary structure

31: Piercing

Claims (19)

A uniform temperature board, including: An exothermic piece; A heat-absorbing sheet, at least one of the heat-radiating sheet and the heat-absorbing sheet has a groove formed by an etching process, and the heat-radiating sheet and the heat-absorbing sheet are aligned with each other to form a cavity by the groove; A capillary structure, the capillary structure is located in the chamber; and A working fluid is filled in the chamber. For the uniform temperature plate described in item 1 of the scope of patent application, the heat-radiating sheet and the heat-absorbing sheet respectively have the groove. As for the temperature equalizing plate described in item 2 of the scope of patent application, the heat-radiating fin or the heat-absorbing fin has at least one supporting column, and the supporting column is located between the heat-radiating fin and the heat-absorbing fin. As described in item 3 of the scope of patent application, the heat-radiating fin or the heat-absorbing fin has at least one positioning column, and the positioning column is opposite to the supporting column. As described in the second item of the scope of patent application, the groove of the heat release sheet and the groove of the heat absorption sheet each have a groove surface, and the periphery of the groove surface forms a ring edge, and the ring edge surrounds the For the groove surface, the ring edge of the heat radiating fin is in contact with the groove surface of the opposite heat absorbing fin or the ring edge of the heat absorbing fin is in contact with the groove surface of the opposite heat radiating fin. As described in item 5 of the scope of patent application, the ring edge of the heat radiation sheet and the ring edge of the heat absorption sheet are adjacent to each other. As described in item 6 of the scope of patent application, the thickness of the ring edge of the heat radiating sheet or the ring edge of the heat absorbing sheet is greater than the depth of the groove of the heat absorbing sheet or the groove of the heat radiating sheet opposite, The ring edge of the heat radiating sheet or the ring edge of the heat absorbing sheet abuts against the groove surface of the heat absorbing sheet or the groove surface of the heat radiating sheet to form a gap. The temperature equalization plate according to item 5 of the scope of patent application, wherein the heat releasing sheet or the heat absorption sheet is etched on the ring edge to form a ring shoulder, and the depth of the ring shoulder relative to the ring edge is equal to the relative The thickness of the ring edge of the heat absorption sheet or the ring edge of the heat release sheet. As described in item 5 of the scope of patent application, the ring edge of the heat radiating fin is opposite to the ring edge of the heat absorbing fin. For example, the temperature equalizing plate described in item 2 of the scope of patent application, wherein the junction between the heat-radiating sheet and the heat-absorbing sheet after being joined does not have an opening. For the uniform temperature plate described in item 2 of the scope of patent application, the junction of the heat radiating sheet and the heat absorbing sheet is welded by laser, and the angle of the laser welding is 30 to 75 degrees. As described in item 2 of the scope of patent application, the thickness of the capillary structure is 0.05~0.5 mm. As described in item 12 of the scope of patent application, the thickness of the capillary structure is 0.2~0.4 mm. As described in item 2 of the scope of patent application, the capillary structure has at least one perforation. As described in the second item of the scope of patent application, the capillary structure is located between the supporting column and the opposite heat radiating fin or the opposite heat absorbing fin, and the supporting column abuts against the capillary structure. As described in item 2 of the scope of patent application, the capillary structure is a thin sheet formed by sintering powder. For example, the temperature equalization plate described in item 16 of the scope of patent application, wherein the supporting pillars are several, and the supporting pillars are staggered and located in the groove of the heat radiating fin and the groove of the heat absorbing fin at the same time, and the supporting pillars are respectively against Connected to the capillary structure. As described in the first item of the scope of patent application, the heat sink or the heat sink does not have the groove and has at least one bonding hole, and the opposite heat sink or the heat sink has a bonding hole with the heat sink or the heat sink. An abutting post in counterpoint. As described in item 18 of the scope of patent application, the heat sink or the heat sink is punched to form the coupling hole.

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