TW202119128A - Transfer apparatus and method of manufacturing a transferred wafer using the same - Google Patents

Transfer apparatus and method of manufacturing a transferred wafer using the same Download PDF

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TW202119128A
TW202119128A TW109135273A TW109135273A TW202119128A TW 202119128 A TW202119128 A TW 202119128A TW 109135273 A TW109135273 A TW 109135273A TW 109135273 A TW109135273 A TW 109135273A TW 202119128 A TW202119128 A TW 202119128A
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mold
substrate
crimping
film
unit
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TW109135273A
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TWI785395B (en
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金泰完
權相民
金準基
鄭熙錫
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南韓商吉佳藍科技股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F16/00—Transfer printing apparatus
    • B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
    • B41F16/004—Presses of the reciprocating type
    • B41F16/0046—Presses of the reciprocating type with means for applying print under heat and pressure, e.g. using heat activable adhesive
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to a transfer apparatus and a method for manufacturing a transferred substrate using the same. Specifically, according to an embodiment, a transfer apparatus is provided for transferring a pattern of a mold adhered to a film to a substrate. The transfer apparatus includes: a mold release part configured to perform a mold release coating on a surface of the mold; and a transfer part configured to transfer the pattern of the mold after the mold release coating is performed by the mold release part to the substrate.

Description

轉印裝置及利用其的實施了轉印的基板的生產方法Transfer device and production method of transfer substrate using it

本發明涉及一種轉印裝置及利用其的實施了轉印的基板的生產方法。The present invention relates to a transfer device and a method for producing a transfer substrate using the transfer device.

以往，在半導體製程中，為了在基板（例如，晶片（Wafer））的表面形成圖案（例如，用於蝕刻或蒸鍍的掩膜板圖案）而利用光蝕刻（Photo Lithography）製程。這種光蝕刻製程是能夠在基板表面塗布諸如光蝕刻膠（Photoresist）的感光物質後照射光來形成期望的圖案的製程。In the past, in the semiconductor manufacturing process, a photolithography (Photo Lithography) process was used in order to form a pattern (for example, a mask pattern for etching or vapor deposition) on the surface of a substrate (for example, a wafer). This photoetching process is a process capable of coating a photosensitive material such as a photoresist on the surface of a substrate and then irradiating light to form a desired pattern.

然而，通過光蝕刻製程將奈米尺度的圖案形成於基板表面的製程存在量產性較低的問題，近來，為了改善這種問題，利用奈米壓印光蝕刻（Nano Imprint Lithography）製程。However, the process of forming nano-scale patterns on the surface of the substrate through a photoetching process has a problem of low mass productivity. Recently, in order to improve this problem, a nano-imprint lithography process has been used.

奈米壓印光蝕刻製程是一種能夠經濟有效地製作奈米結構物（nano-structure）的技術。具體地，奈米壓印光蝕刻製程是利用轉印裝置（Transfer Apparatus）對形成有奈米尺度（nano-scale）的圖案的模（Mold）和形成有樹脂（Resin）的基板相互加壓來將圖案轉印於基板表面的製程。這種奈米壓印光蝕刻製程中使用的轉印裝置通過將模的圖案壓接於基板之後從基板分離模來執行製程。The nano-imprint photolithography process is a technology that can produce nano-structures economically and efficiently. Specifically, the nano-imprint photolithography process uses a transfer device (Transfer Apparatus) to press a mold (Mold) formed with nano-scale patterns and a substrate formed with resin (Resin) to each other. The process of transferring the pattern to the surface of the substrate. The transfer device used in the nanoimprint photoetching process performs the process by crimping the pattern of the mold to the substrate and then separating the mold from the substrate.

但是，就以往的轉印裝置而言，由於模的脫模性較低，同一個模使用複數次後，模的轉印效率下降，因而模以一次性地進行使用，為了改善這樣的模的再使用性，曾利用旋塗將脫模劑塗布於模來進行使用。However, in the conventional transfer device, due to the low mold releasability, the transfer efficiency of the mold is reduced after the same mold is used multiple times. Therefore, the mold is used at once. In order to improve the mold release For reusability, spin coating was used to apply a release agent to a mold.

然而，當利用旋塗將脫模劑塗布於模來進行使用時，雖然模的再使用性增加，但由於脫模劑不均勻地塗布於模，因而存在塗布物成團或塗布時會留有異物的問題。此外，當將模的圖案形成為50nm以下的微細圖案時，塗布進行得較厚的旋塗會覆蓋微細圖案，因而存在難以將微細圖案轉印於基板的問題。However, when the mold release agent is applied to the mold by spin coating for use, although the reusability of the mold is increased, the mold release agent is unevenly applied to the mold, so the coating material may become agglomerated or remain during coating. The problem of foreign objects. In addition, when the pattern of the mold is formed into a fine pattern of 50 nm or less, thicker spin coating will cover the fine pattern, and thus there is a problem that it is difficult to transfer the fine pattern to the substrate.

此外，就以往的轉印裝置而言，轉印模的空間與分離模的空間彼此分離著，為此追加模移動的製程，因而存在製程的效率下降的問題。In addition, in the conventional transfer device, the space of the transfer mold and the space of the separation mold are separated from each other. For this reason, the process of mold movement is added, and the efficiency of the process is reduced.

因此，需要一種將脫模劑均勻地塗布於模，且塗布時不會留有異物的轉印裝置，且需要一種能夠增加模的再使用性的轉印裝置。Therefore, there is a need for a transfer device that uniformly coats the mold release agent without leaving foreign matter during coating, and a transfer device that can increase the reusability of the mold.

此外，需要一種能夠通過省略模移動的製程來提高製程的效率的轉印裝置。In addition, there is a need for a transfer device that can improve the efficiency of the process by omitting the process of mold movement.

技術問題 本發明的一些實施例著眼於如上所述的背景而發明，旨在提供一種能夠通過降低形成有圖案的模的更換週期來提高在基板表面形成圖案的製程的效率的轉印裝置。technical problem Some embodiments of the present invention are invented based on the background described above, and aim to provide a transfer device capable of improving the efficiency of the process of forming a pattern on the surface of a substrate by reducing the replacement period of the pattern-formed mold.

此外，旨在提供一種去除模表面的異物來防止對模進行脫模性塗布時夾雜異物而成為不良的轉印裝置。In addition, it is intended to provide a transfer device that removes foreign matter on the surface of the mold and prevents foreign matter from becoming a defect when the mold is releasable coating.

此外，旨在提供一種能夠省略模移動的製程的轉印裝置。In addition, it is intended to provide a transfer device capable of omitting the process of mold movement.

技術方案 根據本發明的一方面，可以提供一種轉印裝置，其將粘接於膜的模的圖案轉印至基板，所述轉印裝置包括：脫模部，其能夠在所述模的表面進行脫模性塗布；以及轉印部，其能夠將在所述脫模部進行脫模性塗布後的所述模的圖案轉印至基板，所述脫模部包括：等離子體處理模組，其以在對所述模的表面進行脫模性塗布之前利用等離子體處理所述模的表面的方式工作；以及蒸鍍模組，其在進行所述等離子體處理後的模的表面進行脫模性塗布。Technical solutions According to an aspect of the present invention, there can be provided a transfer device that transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: a mold release part capable of performing a mold release on the surface of the mold. Moldable coating; and a transfer part capable of transferring the pattern of the mold after the mold release coating is performed on the mold release part to a substrate, the mold release part including: a plasma processing module, Before performing the mold release coating on the surface of the mold, it works by treating the surface of the mold with plasma; and an evaporation module that performs mold release coating on the surface of the mold after the plasma treatment .

根據本發明的另一方面，可以提供一種轉印裝置，其將粘接於膜的模的圖轉印移至基板，所述轉印裝置包括：脫模部，其能夠在所述模的表面進行脫模性塗布；以及轉印部，其能夠將在所述脫模部進行脫模性塗布後的所述模的圖案轉印至基板，所述脫模部包括能夠在所述模的表面進行脫模性塗布的蒸鍍模組，在所述膜粘接有複數個模，所述蒸鍍模組中模所在的區域的中心點與所述轉印部中模所在的區域的中心點之間的間距與相鄰地配置於所述膜上的模的中心點之間的間距相同。According to another aspect of the present invention, there can be provided a transfer device that transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: a mold release portion that can be positioned on the surface of the mold. Performing releasable coating; and a transfer section capable of transferring the pattern of the mold after the releasable coating at the release section to a substrate, the release section including a surface that can be applied to the mold A vapor deposition module for releasing coating, a plurality of molds are bonded to the film, the center point of the region where the mold is located in the vapor deposition module and the center point of the region where the mold is located in the transfer part The spacing therebetween is the same as the spacing between the center points of the molds adjacently arranged on the film.

此外，可以提供一種轉印裝置，其中，所述蒸鍍模組通過使脫模劑氣相化，並將氣相化後的所述脫模劑提供至所述模的表面來塗布所述模的表面。In addition, it is possible to provide a transfer device, wherein the vapor deposition module vaporizes a mold release agent and supplies the vaporized mold release agent to the surface of the mold to coat the mold. s surface.

此外，可以提供一種轉印裝置，其中，所述轉印部構成為，當所述等離子體處理模組執行一次利用所述等離子體處理所述模的表面的過程，且所述蒸鍍模組執行一次對所述模的表面進行脫模性塗布的過程時，執行複數次將所述模的圖案壓接於脫模性塗布後的述基板的過程和從所述基板分離所述模的過程。In addition, it is possible to provide a transfer device, wherein the transfer part is configured such that when the plasma processing module executes a process of treating the surface of the mold with the plasma once, and the vapor deposition module When performing the process of releasable coating on the surface of the mold once, the process of crimping the pattern of the mold to the substrate after the releasability coating and the process of separating the mold from the substrate are performed multiple times .

此外，可以提供一種轉印裝置，其中，所述轉印部包括：壓接模組，其能夠使所述模和所述基板壓接來將所述模的圖案壓接於基板；以及模分離單元，其在由所述壓接模組將所述模的圖案壓接於所述基板時從所述基板分離所述模。In addition, it is possible to provide a transfer device, wherein the transfer part includes: a crimping module that can crimp the mold and the substrate to crimp the pattern of the mold to the substrate; and mold separation A unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping module.

此外，可以提供一種轉印裝置，其還包括：膜供給部，其能夠向所述脫模部供給粘接有所述模的所述膜；以及膜回收部，其能夠回收並卷取所述膜，在被卷取於所述膜回收部的所述膜粘接有脫模性下降至規定範圍以下的所述模。In addition, it is possible to provide a transfer device, which further includes: a film supply section capable of supplying the film to which the mold is adhered to the demolding section; and a film recovery section capable of recycling and winding up the film In the film, the mold whose releasability has fallen below a predetermined range is adhered to the film wound in the film recovery section.

此外，可以提供一種轉印裝置，其還包括：位置檢測部，其配置於所述蒸鍍模組與所述轉印部之間，由此檢測先行的模位於所述轉印部且後行的模位於所述蒸鍍模。In addition, it is possible to provide a transfer device, which further includes: a position detection portion disposed between the vapor deposition module and the transfer portion, thereby detecting that the preceding mold is located in the transfer portion and the next The mold is located in the vapor deposition mold.

此外，可以提供一種轉印裝置，其還包括：膜供給部及膜回收部，其為了使所述膜移動而旋轉，所述轉印部構成為，在所述膜供給部及所述膜回收部中的一個以上未旋轉的狀態下，反復執行規定次數以上的將所述模的圖案壓接於所述基板的過程和從所述基板分離所述模的過程，所述轉印裝置還包括：控制部，其從所述位置檢測部接收所述模的位置資訊來控制所述膜供給部及膜回收部中的一個以上的驅動。In addition, it is possible to provide a transfer device, which further includes a film supply section and a film recovery section that rotates in order to move the film, and the transfer section is configured so that the film supply section and the film recovery section In a state where one or more of the parts are not rotated, the process of crimping the pattern of the mold to the substrate and the process of separating the mold from the substrate are repeatedly performed more than a predetermined number of times, and the transfer device further includes : A control unit that receives position information of the mold from the position detection unit to control the driving of one or more of the film supply unit and the film recovery unit.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組，該蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；以及流體供給部，其向所述塗布空間供給氣相化的脫模劑，以便能夠塗布所述模的表面，所述膜在所述第一腔室部與所述第二腔室部之間通過，所述流體供給部包括：罐，其能夠容納液體狀態的所述脫模劑；以及起泡器，其能夠向容納於所述罐的液體狀態的所述脫模劑供給規定壓力以上的氣體來使所述脫模劑氣相化。According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is located below, and together with the first chamber part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a vaporized release agent to the coating space so as to be able to The surface of the mold is coated, the film passes between the first cavity portion and the second cavity portion, and the fluid supply portion includes: a tank capable of containing the release agent in a liquid state And a bubbler capable of supplying a gas of a predetermined pressure or higher to the release agent in a liquid state contained in the tank to vaporize the release agent.

此外，可以提供一種轉印裝置，其中，所述起泡器通過在容納於所述罐的所述脫模劑的表面的下方向所述脫模劑排出所述氣體來使所述脫模劑氣相化。In addition, it is possible to provide a transfer device, wherein the bubbler discharges the gas from the mold release agent under the surface of the mold release agent contained in the tank to make the mold release agent Vaporization.

此外，可以提供一種轉印裝置，其中，所述蒸鍍模組還包括：噴射裝置，其能夠通過在從液體狀態的所述脫模劑的表面向上側隔開規定距離的位置噴射所述氣體來防止氣相化的所述脫模劑成團。In addition, it is possible to provide a transfer device, wherein the vapor deposition module further includes a spraying device capable of spraying the gas at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state. To prevent the vaporized release agent from forming agglomerates.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組，該蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；以及流體供給部，其向所述塗布空間供給脫模劑，以便能夠對所述模的表面進行脫模性塗布，所述膜在所述第一腔室部與所述第二腔室部之間通過，在所述第二腔室部形成有流入口，該流入口的一側與所述流體供給部連通，另一側與所述塗布空間連通，所述流入口配置於比所述模靠下方。According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied Releasable coating is performed on the surface of the film, the film passes between the first cavity portion and the second cavity portion, and an inflow port is formed in the second cavity portion, and one side of the inflow port It communicates with the fluid supply part, the other side communicates with the coating space, and the inflow port is arranged below the mold.

此外，可以提供一種轉印裝置，其中，在所述第二腔室部形成有排出口，該排出口用於向外部排出通過所述流入口流入所述塗布空間的所述脫模劑，從所述流入口流入所述塗布空間的所述脫模劑在通過所述排出口被排出至外部的期間與所述模的表面接觸。In addition, there may be provided a transfer device, wherein a discharge port is formed in the second chamber portion for discharging the release agent flowing into the coating space through the inflow port to the outside, and from The release agent flowing into the coating space from the inflow port contacts the surface of the mold while being discharged to the outside through the discharge port.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組，該蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；以及流體供給部，其向所述塗布空間供給脫模劑，以便能夠對所述模的表面進行脫模性塗布，所述膜在所述第一腔室部與所述第二腔室部之間通過，所述第二腔室部包括：腔室底座；腔室凸出部，其從所述腔室底座凸出形成；以及腔室側壁，其從所述腔室底座沿所述腔室底座的邊緣延伸形成，且與所述腔室凸出部隔開規定距離而包圍所述腔室凸出部。According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the cavities is subjected to release coating, the film passes between the first cavity portion and the second cavity portion, and the second cavity portion includes: a cavity base; a cavity protrusion, It is formed protruding from the chamber base; and the chamber side wall, which extends from the chamber base along the edge of the chamber base, and is separated from the chamber protrusion by a predetermined distance to surround the chamber The cavity protrusion.

此外，可以提供一種轉印裝置，其中，所述第二腔室部包括：流入口，其形成於所述腔室側壁，且一側與所述流體供給部連通，另一側與所述塗布空間連通；以及排出口，其形成於腔室凸出部，用於向外部排出通過所述流入口流入所述塗布空間的所述脫模劑，從所述流入口流入所述塗布空間的所述脫模劑在通過所述排出口被排出至外部的期間與所述模的表面接觸。In addition, it is possible to provide a transfer device, wherein the second chamber portion includes: an inflow port formed on the side wall of the chamber, one side of which is in communication with the fluid supply portion, and the other side is connected to the coating Space communication; and a discharge port, which is formed in the cavity protruding portion, for discharging the release agent that flows into the coating space through the inflow port to the outside, and flows into the coating space from the inflow port The mold release agent contacts the surface of the mold while being discharged to the outside through the discharge port.

此外，可以提供一種轉印裝置，其中，所述流入口形成於所述腔室側壁，且配置於比所述腔室凸出部的上面靠下方。In addition, it is possible to provide a transfer device in which the inflow port is formed on the side wall of the chamber and is arranged below the upper surface of the protruding portion of the chamber.

此外，可以提供一種轉印裝置，其中，在所述腔室底座的邊緣，在與所述流入口對應的位置形成有具有從所述腔室凸出部的上面向下側凹陷的形狀的凹部。In addition, it is possible to provide a transfer device, wherein a concave portion having a shape recessed from the upper surface of the cavity protruding portion to the lower side is formed at a position corresponding to the inflow port on the edge of the chamber base .

此外，可以提供一種轉印裝置，其中，設有複數個所述流入口，所述複數個流入口中的至少一部分配置為彼此相向，所述排出口以配置於彼此相向的所述流入口之間的方式形成於所述第二腔室部的中心部。In addition, a transfer device may be provided, wherein a plurality of the inflow ports are provided, at least a part of the plurality of inflow ports are arranged to face each other, and the discharge port is arranged between the inflow ports facing each other The method is formed in the central part of the second chamber part.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組，該蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；以及流體供給部，其向所述塗布空間供給脫模劑，以便能夠對所述模的表面進行脫模性塗布，所述膜在所述第一腔室部與所述第二腔室部之間通過，所述塗布空間的內部以膜為基準被劃分為上側空間和下側空間，在所述第一腔室部形成有氣體排出口，該氣體排出口用於向外部排出所述塗布空間的內部中以所述膜為基準殘留於上側空間的氣體，在所述第二腔室部形成有排出口，該排出口用於向外部排出所述塗布空間的內部中以所述膜為基準殘留於下側空間的脫模劑。According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first chamber part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the coating is releasable coating, the film passes between the first cavity portion and the second cavity portion, and the interior of the coating space is divided into an upper space and a lower space based on the film , A gas discharge port is formed in the first chamber, and the gas discharge port is used to discharge the gas remaining in the upper space on the basis of the film in the coating space to the outside, in the second chamber The chamber part is formed with a discharge port for discharging to the outside the release agent remaining in the lower space on the basis of the film in the coating space.

此外，可以提供一種轉印裝置，其中，所述蒸鍍模組還包括：加熱器，其通過加熱所述第一腔室部及所述第二腔室部中的一個以上來將塗布空間的溫度維持在30℃至80℃的範圍內。In addition, it is possible to provide a transfer device, wherein the vapor deposition module further includes: a heater that heats one or more of the first chamber portion and the second chamber portion to reduce the thickness of the coating space The temperature is maintained in the range of 30°C to 80°C.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組，該蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；以及流體供給部，其向所述塗布空間供給脫模劑，以便能夠對所述模的表面進行脫模性塗布，所述膜在所述第一腔室部與所述第二腔室部之間通過，所述蒸鍍模組還包括蒸鍍密封部，該蒸鍍密封部包圍所述塗布空間，以進行所述第一腔室部與所述第二腔室部之間的密封，所述蒸鍍密封部包括設於所述第一腔室部的第一蒸鍍密封部件及設於所述第二腔室部的第二蒸鍍密封部件，所述第一蒸鍍密封部件及所述第二蒸鍍密封部件中的某一個在不與另一個貼緊時具有平面形狀，所述另一個在不與所述某一個貼緊時具有圓弧形狀。According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the film is subjected to release coating, the film passes between the first cavity portion and the second cavity portion, and the vapor deposition module further includes a vapor deposition sealing portion that surrounds The coating space is used for sealing between the first chamber portion and the second chamber portion, and the vapor deposition sealing portion includes a first vapor deposition sealing member provided in the first chamber portion And a second vapor deposition sealing member provided in the second chamber, wherein one of the first vapor deposition sealing member and the second vapor deposition sealing member has a planar shape when not in close contact with the other , The other has an arc shape when it is not in close contact with the one.

根據本發明的另一方面，可以提供一種轉印裝置，包括蒸鍍模組和等離子體處理模組，所述蒸鍍模組包括：第一腔室部；第二腔室部，其配置於比所述第一腔室部靠下方，並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間；流體供給部，其向所述塗布空間供給脫模劑，以便能夠對所述模的表面進行脫模性塗布，所述等離子體處理模組利用等離子體處理所述模的表面，以對所述模的表面進行改質，所述膜在所述第一腔室部與所述第二腔室部之間通過，所述蒸鍍模組對由所述等離子體處理模組對所述表面進行等離子體處理後的模的表面進行脫模性塗布。According to another aspect of the present invention, a transfer device may be provided, including an evaporation module and a plasma processing module, the evaporation module including: a first chamber portion; a second chamber portion, which is disposed in Lower than the first cavity portion, and together with the first cavity portion, form a coating space for arranging the film to which the mold is bonded; a fluid supply portion that supplies a release agent to the coating space, In order to be able to perform release coating on the surface of the mold, the plasma treatment module uses plasma to treat the surface of the mold to modify the surface of the mold, and the film is in the first The cavity portion and the second cavity portion pass between the vapor deposition module, and the surface of the mold after the plasma processing module has performed the plasma treatment on the surface of the mold.

根據本發明的另一方面，可以提供一種轉印裝置，包括：壓接模組，其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元；以及模分離單元，其包括第一輥部，該第一輥部在作為所述膜的一面的相反側的所述膜的另一面支撐所述膜，所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板，所述第一輥部向所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間移動來從所述基板分離被壓接於所述基板的所述模。According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a mold separating unit, which includes a first roller portion that supports the film on the other side of the film that is the opposite side of the one side of the film, and the first pressure The bonding unit and the second crimping unit move toward the film on the opposite side of the film and are in close contact with each other to crimp the pattern formed in the mold to the substrate, and the first roller The part moves to the space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate .

此外，可以提供一種轉印裝置，其中，所述模分離單元還包括第二輥部，其以使所述膜向包圍所述第一輥部的一部分的方向彎曲的方式支撐所述膜。In addition, it is possible to provide a transfer device, wherein the mold separation unit further includes a second roller portion that supports the film in a manner to bend the film in a direction surrounding a part of the first roller portion.

此外，可以提供一種轉印裝置，其中，所述第二壓接單元包括基板安放部，其能夠在由所述壓接模組將所述模加壓於所述基板並由所述模分離單元從所述基板分離所述模時支撐所述基板，在所述基板安放部形成有能夠吸附所述基板的吸附口，以防止在將所述模加壓於所述基板並從所述基板分離所述模時所述基板從所述第二壓接單元脫離。In addition, it is possible to provide a transfer device, wherein the second crimping unit includes a substrate seating portion capable of pressing the mold against the substrate by the crimping module and the mold separating unit When the mold is separated from the substrate, the substrate is supported, and a suction port capable of adsorbing the substrate is formed in the substrate mounting portion to prevent the mold from being separated from the substrate by pressing the mold against the substrate. The substrate is detached from the second crimping unit during the mold.

此外，可以提供一種轉印裝置，其還包括：框架，其能夠支撐所述壓接模組及所述模分離單元，所述第一壓接單元與所述第二壓接單元以支撐於所述框架的狀態相對於彼此移動，所述模分離單元以支撐於所述框架的狀態相對於所述模移動。In addition, a transfer device may be provided, which further includes: a frame capable of supporting the crimping module and the mold separating unit, the first crimping unit and the second crimping unit to support the The states of the frames move relative to each other, and the mold separation unit moves relative to the molds while being supported by the frame.

根據本發明的另一方面，可以提供一種轉印裝置，包括：壓接模組，其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元；以及框架，其能夠支撐所述壓接模組，所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板，所述框架包括第一框架部及第二框架部，所述第一壓接單元包括：第一壓接體，其能夠對所述模加壓；以及第一導向部件，其固定支撐於所述第一框架部，且能夠對所述第一壓接體的移動進行導向，所述第二壓接單元包括：第二壓接體，其能夠支撐所述基板；以及第二導向部件，其固定支撐於所述第二框架部，且能夠對所述第二壓接體的移動進行導向，所述第一壓接體和所述第二壓接體分別通過所述第一導向部件和所述第二導向部件進行移動導向來相對於所述框架升降。According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a frame capable of supporting the crimping module, the first crimping unit and the second crimping unit moving toward the film on opposite sides of the film The pattern formed in the mold is pressed against each other to press-bond the pattern formed on the mold to the substrate, the frame includes a first frame portion and a second frame portion, and the first crimping unit includes: a first crimping body capable of Pressing the mold; and a first guide member fixedly supported on the first frame portion and capable of guiding the movement of the first crimping body, and the second crimping unit includes: a second A crimping body capable of supporting the substrate; and a second guide member that is fixedly supported on the second frame portion and capable of guiding the movement of the second crimping body, the first crimping body And the second crimping body is moved and guided by the first guide member and the second guide member to move up and down relative to the frame.

此外，可以提供一種轉印裝置，其中，所述第一壓接單元包括：第一壓接體，其能夠對所述模加壓；第一支撐部，其能夠支撐所述第一壓接體；以及推擠防止部，其一端固定支撐於所述第一框架部，另一端支撐於所述第一支撐部，所述推擠防止部能夠通過在所述第二壓接單元為了對所述基板加壓而上升時對所述第一支撐部加壓來防止因所述第二壓接單元上升而導致所述第一壓接體被推擠至上側。In addition, a transfer device may be provided, wherein the first crimping unit includes: a first crimping body capable of pressing the mold; and a first supporting portion capable of supporting the first crimping body And a pushing prevention portion, one end of which is fixedly supported by the first frame portion, and the other end is supported by the first support portion, the pushing prevention portion can be passed in the second crimping unit in order to When the substrate is pressurized and raised, the first support portion is pressurized to prevent the first crimping body from being pushed to the upper side due to the rise of the second crimping unit.

此外，可以提供一種轉印裝置，其還包括：模分離單元，其移動至所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間來從所述基板分離被壓接於所述基板的所述模，所述框架還包括第三框架部，所述模分離單元包括：輥部，其能夠從所述基板分離被壓接於所述基板的所述模；以及輥導向部件，其固定支撐於所述第三框架部，且能夠對所述輥部的移動進行導向，所述輥部通過所述輥導向部件進行移動導向來相對於所述框架移動。In addition, a transfer device may be provided, which further includes: a mold separating unit that moves to a space between the first crimping unit and the second crimping unit for crimping the substrate to the mold To separate the mold crimped to the substrate from the substrate, the frame further includes a third frame portion, and the mold separating unit includes a roller portion that can be separated from the substrate and crimped to the substrate. The mold of the substrate; and a roller guide member that is fixedly supported by the third frame portion and can guide the movement of the roller portion, and the roller portion is guided by the roller guide member to move and guide relative to Move on the frame.

此外，可以提供一種轉印裝置，其中，所述第一框架部、所述第二框架部及所述第三框架部相對於彼此被一體地固定支撐。In addition, it is possible to provide a transfer device, wherein the first frame portion, the second frame portion, and the third frame portion are integrally fixedly supported with respect to each other.

根據本發明的另一方面，可以提供一種轉印裝置，包括：壓接模組，其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元；以及檢測單元，其能夠檢測所述壓接模組的第一停止位置、第二停止位置及減速位置，所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板，所述減速位置位於所述第一停止位置與所述第二停止位置之間，所述壓接模組被驅動為，當在從所述第一停止位置移動至所述第二停止位置的期間到達所述減速位置時減速。According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a detection unit capable of detecting a first stop position, a second stop position, and a deceleration position of the crimping module, the first crimping unit and the second crimping unit are in place The opposite sides of the film move toward the film and are pressed against each other to press the pattern formed in the mold to the substrate, and the deceleration position is located at the first stop position and the second stop Between positions, the crimping module is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position.

此外，可以提供一種轉印裝置，其還包括：控制部，其從所述檢測單元接收所述壓接模組的位置資訊來控制所述壓接模組的驅動。In addition, a transfer device may be provided, which further includes: a control unit that receives position information of the crimping module from the detection unit to control the driving of the crimping module.

根據本發明的另一方面，可以提供一種轉印裝置，包括：模分離單元，其能夠將在作為膜的一面的相反側的所述膜的另一面支撐所述膜的第一輥部移動至基板側來從所述基板分離被壓接於所述基板的所述模；以及檢測單元，其能夠檢測所述模分離單元的第一停止位置、第二停止位置及減速位置，所述減速位置位於所述第一停止位置與所述第二停止位置之間，所述模分離單元被驅動為，當在從所述第一停止位置移動至所述第二停止位置的期間到達所述減速位置時減速。According to another aspect of the present invention, there can be provided a transfer device including: a mold separation unit capable of moving a first roller portion supporting the film on the other side of the film on the opposite side to the one side of the film. The substrate side separates the mold crimped to the substrate from the substrate; and a detection unit capable of detecting a first stop position, a second stop position, and a deceleration position of the mold separation unit, the deceleration position Located between the first stop position and the second stop position, the mold separation unit is driven to reach the deceleration position while moving from the first stop position to the second stop position Hourly slow down.

此外，可以提供一種轉印裝置，其還包括：控制部，其從所述檢測單元接收所述壓接模組的位置資訊來控制所述模分離單元的驅動。In addition, a transfer device may be provided, which further includes a control unit that receives position information of the crimping module from the detection unit to control the driving of the mold separation unit.

此外，可以提供一種轉印裝置，其中，所述檢測單元包括：第一停止位置檢測感測器，其用於檢測所述第一停止位置；減速位置檢測感測器，其用於檢測所述減速位置；以及第二停止位置檢測感測器，其用於檢測所述第二停止位置。In addition, a transfer device may be provided, wherein the detection unit includes: a first stop position detection sensor for detecting the first stop position; a deceleration position detection sensor for detecting the Deceleration position; and a second stop position detection sensor for detecting the second stop position.

根據本發明的另一方面，可以提供一種轉印裝置，包括：第一壓接單元，其能夠朝向在一面粘接有形成有圖案的模的膜移動；第二壓接單元，其能夠支撐基板；壓接密封部，其包括插入於所述第一壓接單元的第一壓接密封部件、以及插入於所述第二壓接單元且具有與所述第一壓接密封部件不同的形狀的第二壓接密封部件，所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板，所述第一壓接密封部件及所述第二壓接密封部件中的某一個在不與另一個貼緊時具有平面形狀，且所述另一個在不與所述某一貼緊時具有圓弧形狀。According to another aspect of the present invention, there may be provided a transfer device including: a first crimping unit capable of moving toward a film on which a pattern-formed mold is adhered on one side; and a second crimping unit capable of supporting a substrate A crimping sealing portion, which includes a first crimping sealing member inserted into the first crimping unit, and a shape different from the first crimping sealing member that is inserted into the second crimping unit The second crimping sealing member, the first crimping unit and the second crimping unit are moved toward the film on the opposite side of the film to be closely attached to each other to fix the pattern formed on the mold Crimped to the substrate, one of the first crimping sealing member and the second crimping sealing member has a planar shape when not in close contact with the other, and the other is not in contact with the It has an arc shape when it is tightly attached.

根據本發明的另一方面，可以提供一種實施了轉印的基板的生產方法，其生產轉印有粘接於膜的模的圖案的基板，所述實施了轉印的基板的生產方法包括：利用等離子體處理所述模的表面的等離子體處理步驟；在進行所述等離子體處理後的模的表面進行脫模性塗布的脫模性塗布步驟；以及將通過所述脫模性塗布步驟進行脫模性塗布後的所述模的圖案轉印於基板的轉印步驟。According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A plasma treatment step of treating the surface of the mold with plasma; a releasable coating step of performing a releasable coating on the surface of the mold after the plasma treatment; and a step of releasable coating The transfer step of transferring the pattern of the mold after the releasability coating to the substrate.

根據本發明的另一方面，可以提供一種實施了轉印的基板的生產方法，其生產轉印有粘接於膜的模的圖案的基板，所述實施了轉印的基板的生產方法包括：在所述模的表面進行脫模性塗布的脫模性塗布步驟；以及將通過所述脫模性塗布步驟進行脫模性塗布後的所述模的圖案轉印於基板的轉印步驟，在位置檢測部檢測到模分別位於用於執行所述脫模性塗布步驟的蒸鍍模組和用於執行所述轉印步驟的轉印部之後執行所述脫模性塗布步驟和所述轉印步驟。According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A releasable coating step of performing releasable coating on the surface of the mold; and a transfer step of transferring the pattern of the mold after releasable coating by the releasable coating step to a substrate, The position detection unit detects that the mold is located in the vapor deposition module for performing the releasable coating step and the transfer unit for performing the transfer step, and then the releasable coating step and the transfer are performed. step.

此外，可以提供一種實施了轉印的基板的生產方法，其中，所述轉印步驟包括：使所述模和所述基板相互壓接的壓接步驟；以及從所述基板分離所述模的分離步驟，在為了使所述膜移動而旋轉的膜供給部及膜回收部中的一個以上未旋轉的狀態下執行所述壓接步驟和所述分離步驟。In addition, there may be provided a method for producing a substrate subjected to transfer, wherein the transfer step includes: a crimping step of crimping the mold and the substrate to each other; and separating the mold from the substrate In the separation step, the crimping step and the separation step are performed in a state where one or more of the film supply part and the film recovery part that are rotated in order to move the film are not rotated.

此外，可以提供一種實施了轉印的基板的生產方法，其還包括：從所述基板分離所述模的分離步驟，當執行一次所述等離子體處理步驟和所述脫模性塗布步驟時，執行複數次所述轉印步驟和所述分離步驟。In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes a separation step of separating the mold from the substrate, and when the plasma treatment step and the release coating step are performed once, The transfer step and the separation step are performed a plurality of times.

此外，可以提供一種實施了轉印的基板的生產方法，其還包括：當執行複數次所述壓接步驟和所述分離步驟使得所述模的脫模性下降至規定範圍以下時，回收粘接有所述模的所述膜的膜回收步驟。In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes: when the crimping step and the separating step are performed a plurality of times so that the mold releasability of the mold falls below a specified range, recovering the adhesive A film recovery step of the film attached to the mold.

根據本發明的另一方面，可以提供一種實施了轉印的基板的生產方法，其生產轉印有粘接於膜的模的圖案的基板，所述實施了轉印的基板的生產方法包括：在所述模的表面進行脫模性塗布的脫模塗布步驟，所述脫模塗布步驟包括：使第一腔室部和第二腔室部密閉來形成塗布空間的空間形成步驟；向所述塗布空間供給氣相化的脫模劑的脫模劑供給步驟；以及在向所述塗布空間供給所述氣相化的脫模劑之後，向塗布空間供給氣體的吹掃步驟，在所述脫模劑供給步驟中，通過起泡器向容納於罐的液體狀態的脫模劑供給規定壓力以上的氣體來使所述脫模劑氣相化，並將所述氣相化的脫模劑供給至所述塗布空間，所述第二腔室部配置於比所述第一腔室部靠下方，所述膜在所述第一腔室部與所述第二腔室部之間通過。According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A release coating step of performing release coating on the surface of the mold, the release coating step including: a space forming step of sealing a first cavity portion and a second cavity portion to form a coating space; A release agent supply step of supplying vaporized mold release agent to the coating space; and a purge step of supplying gas to the coating space after supplying the vaporized mold release agent to the coating space. In the mold agent supply step, a gas of a predetermined pressure or higher is supplied to the liquid mold release agent contained in the tank through a bubbler to vaporize the mold release agent, and the vaporized mold release agent is supplied In the coating space, the second chamber part is arranged below the first chamber part, and the film passes between the first chamber part and the second chamber part.

此外，可以提供一種實施了轉印的基板的生產方法，其還包括：供給至所述塗布空間的所述氣相化的脫模劑在塗布模的表面之後被排出至外部。In addition, it is possible to provide a production method of a substrate subjected to transfer, which further includes: the vaporized release agent supplied to the coating space is discharged to the outside after coating the surface of the mold.

此外，可以提供一種實施了轉印的基板的生產方法，其還包括：對所述模的表面進行等離子體處理，以對所述模的表面進行改質的等離子體處理步驟，在所述脫模塗布步驟之前執行所述等離子體處理步驟。In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes a plasma treatment step of performing plasma treatment on the surface of the mold to modify the surface of the mold. The plasma treatment step is performed before the die coating step.

根據本發明的另一方面，可以提供一種實施了轉印的基板的生產方法，包括：使第一壓接單元和第二壓接單元由一面粘接有形成有圖案的模的膜的彼此相反的一側朝向所述膜移動來將所述模壓接於基板的壓接步驟；以及使模分離單元移動至所述基板側來使在所述壓接步驟中壓接於所述基板的所述模從所述基板分離的分離步驟，其中，所述模分離單元包括第一輥部，該第一輥部在作為所述膜的一面的相反側的所述膜的另一面支撐所述膜，所述分離步驟包括：使所述模分離單元移動至所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間來從所述基板分離被壓接於所述基板的所述模的模分離單元移動步驟。According to another aspect of the present invention, it is possible to provide a method for producing a substrate subjected to transfer, including: making a first crimping unit and a second crimping unit adhere to a film with a pattern formed on one side opposite to each other. Move the side toward the film to crimp the mold to the substrate in the crimping step; and move the mold separation unit to the substrate side to crimp the mold to the substrate in the crimping step The separating step of separating the mold from the substrate, wherein the mold separating unit includes a first roller portion supporting the film on the other side of the film that is the opposite side of the one side of the film, The separating step includes: moving the mold separating unit to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate from the substrate The mold separation unit moving step of the mold that is crimped to the substrate.

此外，可以提供一種實施了轉印的基板的生產方法，其中，所述壓接步驟包括：使所述第一壓接單元及所述第二壓接單元由所述膜的彼此相反的一側朝向所述膜移動的壓接單元靠近步驟；使所述第二壓接單元的波紋管朝向所述第一壓接單元延伸來使所述基板的周圍的空間相對於外部密閉的密閉步驟；以及向外部排出殘留於所述波紋管的內部的密閉的空間的氣體的氣體排出步驟。In addition, it is possible to provide a method for producing a substrate subjected to transfer, wherein the crimping step includes: causing the first crimping unit and the second crimping unit to switch from opposite sides of the film to each other. The step of approaching the crimping unit moving toward the film; the sealing step of extending the corrugated tube of the second crimping unit toward the first crimping unit to seal the space around the substrate from the outside; and A gas discharge step of discharging the gas remaining in the closed space inside the bellows to the outside.

此外，可以提供一種實施了轉印的基板的生產方法，其中，所述分離步驟還包括：在通過所述壓接步驟將所述模的圖案轉印於所述基板後，使所述第一壓接單元上升的壓接單元上升步驟。In addition, it is possible to provide a method for producing a substrate subjected to transfer, wherein the separating step further includes: after the pattern of the mold is transferred to the substrate through the crimping step, the first The crimping unit ascending step of the crimping unit ascending.

此外，可以提供一種實施了轉印的基板的生產方法，在為了使所述膜移動而旋轉的膜供給部及膜回收部中的一個以上未旋轉的狀態下，反復執行規定次數的所述壓接步驟和所述分離步驟。In addition, it is possible to provide a method for producing a substrate subjected to a transfer, in which the pressing is repeatedly performed a predetermined number of times in a state where one or more of the film supply part and the film recovery part that are rotated in order to move the film are not rotated. Connecting step and said separating step.

發明的效果 本發明的一些實施例是著眼於如上所述的背景發明的，通過對模的表面進行脫模性塗布，具有能夠改善模表面的脫模性的效果。The effect of the invention Some embodiments of the present invention are based on the above-mentioned background invention, and by coating the mold surface with mold release properties, it has the effect of improving the mold release properties of the mold surface.

此外，通過改善模表面的脫模性，能夠利用一個模將圖案轉印於複數個基板，從而具有能夠改善模的再使用性的效果。In addition, by improving the releasability of the mold surface, the pattern can be transferred to a plurality of substrates with one mold, which has the effect of improving the reusability of the mold.

此外，通過縮短模的更換週期，具有能夠縮短將圖案轉印於基板的時間，且提高製程的效率的效果。In addition, by shortening the mold replacement cycle, the time for transferring the pattern to the substrate can be shortened, and the efficiency of the manufacturing process can be improved.

此外，通過省略使模與基板相互壓接的製程與使模與基板相互分離的製程之間的使模移動至能夠從基板分離模的位置的過程，具有能夠提高製程的效率的效果。In addition, by omitting the process of moving the mold to a position where the mold can be separated from the substrate between the process of crimping the mold and the substrate and the process of separating the mold and the substrate from each other, the efficiency of the process can be improved.

下面參照附圖對用於實現本發明的思想的具體實施例進行詳細說明。Specific embodiments for realizing the idea of the present invention will be described in detail below with reference to the accompanying drawings.

同時，在說明本發明時，當判斷為對相關的習知配置或功能的具體說明可能使本發明的要旨不清楚時，省略其詳細的說明。Meanwhile, when describing the present invention, when it is judged that the specific description of the related conventional configuration or function may make the gist of the present invention unclear, the detailed description thereof is omitted.

此外，當提及某一構成要素“連接於”、“支撐於”、“流入”、“供給至”、“流動至”、“結合於”另一構成要素時，應理解為可能直接連接於、支撐於、流入、供給至、流動至、結合於該另一構成要素，但中間也可能存在別的構成要素。In addition, when a component is referred to as “connected to”, “supported by”, “flowed into”, “supply to”, “flowed to”, or “combined with” another component, it should be understood that it may be directly connected to , Support, flow in, supply to, flow to, and combine with this other component, but there may also be other components in between.

本說明書中使用的術語僅為說明特定的實施例而使用，而並非以限定本發明的意圖使用的。除非上下文中明確不同地定義，單數的表述包括複數的表述。The terms used in this specification are only used to illustrate specific embodiments, and are not used for the purpose of limiting the present invention. Unless clearly defined differently in the context, singular expressions include plural expressions.

此外，如第一、第二等包括序數的術語可以用於說明多樣的構成要素，但這些構成要素不應為這樣的術語所限定。這些術語僅用作區分一構成要素與另一構成要素的目的。In addition, terms including ordinal numbers such as first and second can be used to describe various constituent elements, but these constituent elements should not be limited by such terms. These terms are only used for the purpose of distinguishing one component from another.

說明書中使用的“包括”的含義使特定特性、區域、定數、步驟、動作、要素和/或成分具體化，並非排除別的特定特性、區域、定數、步驟，動作、要素，成分和/或組的存在或附加。The meaning of "including" used in the specification makes specific characteristics, regions, constants, steps, actions, elements, and/or components specific, and does not exclude other specific characteristics, regions, constants, steps, actions, elements, components, and / Or the presence or addition of the group.

此外，需要預先說明的是，本說明書中的上部、下部、上側、下側等表述是以圖中所示為基準說明的，當該物件的方向發生變化時，可能會不同地進行表述。另一方面，本說明書中的上下方向可以是圖1、3、7的上下方向。此外，左右方向可以是圖1、3及7的左右方向。In addition, it should be noted in advance that the upper, lower, upper, lower and other expressions in this specification are described on the basis of what is shown in the figure, and when the direction of the object changes, the expressions may be different. On the other hand, the up-down direction in this specification may be the up-down direction in FIGS. 1, 3, and 7. In addition, the left-right direction may be the left-right direction of FIGS. 1, 3 and 7.

下面參照附圖對本發明的一實施例的轉印裝置1的具體配置進行說明。The specific configuration of the transfer device 1 according to an embodiment of the present invention will be described below with reference to the drawings.

如下，參照圖1，本發明的一實施例的轉印裝置1可以對粘接於膜10的模20和基板30加壓來將形成於模20的圖案轉印於基板30。這樣的轉印裝置1可以使膜10向一方向移動來使模20移動。此外，轉印裝置1可以通過對模20的表面進行脫模性塗布，反復使用一個模20在複數個基板30形成圖案。這樣的轉印裝置1可以包括基板收納部100、旋塗機200、整列單元300、膜供給部400、進料輥500、保護膜回收部600、脫模部700、轉印部800、膜回收部900。As follows, referring to FIG. 1, the transfer device 1 according to an embodiment of the present invention can press the mold 20 and the substrate 30 adhered to the film 10 to transfer the pattern formed on the mold 20 to the substrate 30. Such a transfer device 1 can move the film 10 in one direction to move the mold 20. In addition, the transfer device 1 can repeatedly use one mold 20 to form patterns on a plurality of substrates 30 by applying a mold release coating to the surface of the mold 20. Such a transfer device 1 may include a substrate storage unit 100, a spin coater 200, an alignment unit 300, a film supply unit 400, a feed roller 500, a protective film recovery unit 600, a mold release unit 700, a transfer unit 800, and a film recovery unit. Department 900.

膜10可以通過轉印裝置1以依次經由膜供給部400、脫模部700、轉印部800及膜回收部900的方式移動。這裡，膜供給部400可以是上游側，膜回收部900可以是下游側。The film 10 can be moved by the transfer device 1 so as to sequentially pass through the film supply part 400, the release part 700, the transfer part 800, and the film recovery part 900. Here, the membrane supply part 400 may be the upstream side, and the membrane recovery part 900 may be the downstream side.

參照圖2，基板收納部100可以提供收納在轉印部800轉印圖案之前的基板30的空間。這樣的基板收納部100可以層疊式地收納複數個基板30。此外，收納於基板收納部100的基板30可以由金屬、矽、藍寶石、玻璃等製作。這樣的基板30可以由移送單元T從基板收納部100抽出並移送至旋塗機200。例如，移送單元T可以是機械臂。此外，基板收納部100可以提供收納在轉印部800轉印圖案之後的基板30的空間。這樣的轉印有圖案的基板30可以由移送單元T從轉印部800移送並收納於基板收納部100。此外，在基板收納部100，收納轉印圖案之前的基板30的空間與收納轉印圖案之後的基板30的空間可以分離。2, the substrate storage part 100 may provide a space for receiving the substrate 30 before the transfer part 800 transfers the pattern. Such a substrate storage unit 100 can store a plurality of substrates 30 in a stacked manner. In addition, the substrate 30 accommodated in the substrate accommodating part 100 may be made of metal, silicon, sapphire, glass, or the like. Such a substrate 30 can be drawn out from the substrate storage part 100 by the transfer unit T and transferred to the spin coater 200. For example, the transfer unit T may be a robot arm. In addition, the substrate accommodating part 100 may provide a space for accommodating the substrate 30 after the transfer of the pattern by the transfer part 800. The substrate 30 to which such a pattern has been transferred can be transferred from the transfer unit 800 by the transfer unit T and stored in the substrate storage unit 100. In addition, in the substrate accommodating portion 100, the space for accommodating the substrate 30 before the transfer pattern and the space for accommodating the substrate 30 after the transfer pattern may be separated.

旋塗機200可以通過旋塗（Spin Coating）方式將樹脂以規定厚度均勻地塗布於從基板收納部100移送的基板30的表面。這裡，對旋塗方式進行簡要的說明，在旋塗方式中，將基板30置於進行旋轉運動的支撐體上，並將液狀的流動性樹脂滴於基板30的表面。此時，可以通過利用支撐體的高速旋轉產生的離心力使流動性樹脂以規定的厚度均勻地蔓延於基板30的表面來用樹脂塗布基板30的表面。這樣的塗布於基板30的表面的樹脂可以包括具有通過UV（Ultra Violet，紫外光）發生反應而硬化的性質的習知的所有光硬化性樹脂。例如，樹脂可以包括丙烯酸系硬化樹脂。這樣的基板30可以在被移送至旋塗機200之前被移送至冷卻板210，以使表面被樹脂均勻地塗布。此外，基板30在冷卻板210被調節至規定範圍的溫度之後，可以再被移送至旋塗機200。例如，冷卻板210可以將基板30的溫度調節至30℃以下。在旋塗機200塗布樹脂後的基板30可以被移送單元T移送至整列單元300。The spin coater 200 can uniformly coat the resin with a predetermined thickness on the surface of the substrate 30 transferred from the substrate storage part 100 by a spin coating (Spin Coating) method. Here, the spin coating method will be briefly described. In the spin coating method, the substrate 30 is placed on a support that performs a rotational movement, and a liquid fluid resin is dropped on the surface of the substrate 30. At this time, the surface of the substrate 30 can be coated with resin by uniformly spreading the fluid resin on the surface of the substrate 30 with a predetermined thickness by the centrifugal force generated by the high-speed rotation of the support. Such a resin coated on the surface of the substrate 30 may include all conventional photocurable resins that have a property of being cured by UV (Ultra Violet) reaction. For example, the resin may include acrylic hardening resin. Such a substrate 30 may be transferred to the cooling plate 210 before being transferred to the spin coater 200 so that the surface is uniformly coated with resin. In addition, the substrate 30 may be transferred to the spin coater 200 after the temperature of the cooling plate 210 is adjusted to a predetermined range. For example, the cooling plate 210 can adjust the temperature of the substrate 30 to 30°C or less. The substrate 30 after coating the resin by the spin coater 200 may be transferred to the alignment unit 300 by the transfer unit T.

另一方面，以下，即使不另行說明，基板30可以被定義為通過旋塗機200塗布樹脂後的基板30，將模20的圖案轉印於基板30可以意指將模20的圖案轉印於形成在基板30的樹脂。On the other hand, in the following, even if not otherwise stated, the substrate 30 may be defined as the substrate 30 after the resin is coated by the spin coater 200, and transferring the pattern of the mold 20 to the substrate 30 may mean that the pattern of the mold 20 is transferred to The resin formed on the substrate 30.

整列單元300可以在由旋塗機200塗布的基板30被移送至轉印部800之前朝已設定的方向對基板30進行整列。這樣的整列單元300可以通過使基板30向水平方向旋轉，以使形成在基板30的孔（厚度方向貫通孔或側面凹槽，未圖示）朝向已設定的方向的方式對基板30進行整列。此外，可以朝與待後述的模20的圖案對應的方向對基板30進行整列。例如，整列單元300可以通過光感測器對基板30進行整列。作為更詳細的示例，整列單元300可以包括能夠照射鐳射等的發光部件（未圖示）和能夠識別鐳射等的收光部件（未圖示）。這樣的發光部件可以向基板30側照射鐳射，收光部件可以識別通過了形成在基板30的一側的孔的鐳射。從而，可以將基板30置於進行旋轉運動的支撐體上，並在基板30通過支撐體旋轉的過程中基板30的孔朝向已設定的方向時，由收光部件通過孔識別由發光部件照射的鐳射，且基板30的旋轉可以停止。如此，當在整列單元300以基板30朝向已設定的方向的方式進行整列時，可以通過移送單元T移送至轉印部800。The aligning unit 300 can align the substrate 30 in a set direction before the substrate 30 coated by the spin coater 200 is transferred to the transfer unit 800. Such an aligning unit 300 can align the substrate 30 by rotating the substrate 30 in the horizontal direction so that the holes (thickness-direction through holes or side grooves, not shown) formed in the substrate 30 face a set direction. In addition, the substrate 30 may be aligned in a direction corresponding to the pattern of the mold 20 to be described later. For example, the aligning unit 300 may align the substrate 30 by a photo sensor. As a more detailed example, the aligning unit 300 may include a light emitting component (not shown) capable of irradiating a laser or the like and a light receiving member (not shown) capable of identifying a laser or the like. Such a light-emitting part can irradiate the laser beam to the side of the substrate 30, and the light-receiving part can recognize the laser beam that has passed through a hole formed on one side of the substrate 30. Therefore, the substrate 30 can be placed on the supporting body for rotating motion, and when the hole of the substrate 30 faces the set direction during the rotation of the substrate 30 through the supporting body, the light-receiving part passes through the hole to identify the light irradiated by the light-emitting part. Laser, and the rotation of the substrate 30 can be stopped. In this way, when the alignment unit 300 performs alignment such that the substrate 30 faces the set direction, it can be transferred to the transfer unit 800 by the transfer unit T.

膜供給部400可以支撐卷取的膜10。此外，通過膜供給部400旋轉，可以向脫模部700連續地供給所卷取的膜10。此外，在卷取於膜供給部400的膜10，可以粘接有形成有圖案的模20。在膜10，可以沿膜10延伸的方向隔開規定距離而排列有複數個模20。如此，在卷取於膜供給部400的膜10，可以在膜10的兩面粘接保護膜，以防止粘接有模20的面和其相反面粘接。這樣的膜供給部400可以以通過驅動器旋轉的方式進行驅動。此外，膜供給部400可以向一方向旋轉來使膜10從膜供給部400移動至膜回收部900。另一方面，由膜供給部400供給的膜10例如可以是樹脂膜。The film supply part 400 may support the wound film 10. In addition, by rotating the film supply part 400, the film 10 wound up can be continuously supplied to the mold release part 700. As shown in FIG. In addition, the film 10 wound on the film supply part 400 may be bonded with a patterned mold 20. In the film 10, a plurality of molds 20 may be arranged with a predetermined distance in the direction in which the film 10 extends. In this way, in the film 10 wound on the film supply part 400, a protective film can be adhered to both surfaces of the film 10 to prevent adhesion of the surface to which the mold 20 is adhered and the opposite surface thereof. Such a film supply unit 400 can be driven in a manner of being rotated by a driver. In addition, the film supply part 400 can rotate in one direction to move the film 10 from the film supply part 400 to the film recovery part 900. On the other hand, the film 10 supplied by the film supply part 400 may be a resin film, for example.

膜回收部900可以向一方向旋轉來回收並卷取從膜供給部400供給的膜10。粘接於這樣的被卷取於膜回收部900的膜10的模20可能是脫模性下降至規定範圍以下的模20。換言之，為了將圖案轉印於基板30而使用複數次的模20的脫模性可能下降至規定範圍以下，由於脫模性下降的模20無法將圖案轉印於基板30，因而可以被回收至膜回收部900。這樣的膜回收部900可以以通過驅動器旋轉的方式進行驅動。此外，膜回收部900可以向一方向旋轉來將膜10從膜供給部400移動至膜回收部900。例如，膜回收部900可以與膜供給部400同時旋轉來移送膜10。但是，這只是一示例，膜回收部900可以以與膜供給部400獨立地旋轉的方式進行驅動。此外，由於膜回收部900的旋轉力大於膜供給部400的旋轉力，因而膜回收部900的旋轉可以使膜供給部400旋轉。從而，也可以通過膜供給部400及膜回收部900中的某一個向一方向旋轉來使膜10移動。這樣的膜10可以以在移動的過程中依次經由脫模部700、轉印部800的方式由上游側移動至下游側。The film recovery part 900 can rotate in one direction to recover and wind up the film 10 supplied from the film supply part 400. The mold 20 adhered to the film 10 wound up in the film recovery part 900 may be the mold 20 whose releasability has fallen below a predetermined range. In other words, the releasability of the mold 20 used multiple times to transfer the pattern to the substrate 30 may fall below the prescribed range. Since the mold 20 with reduced releasability cannot transfer the pattern to the substrate 30, it may be recycled to Film recovery part 900. Such a film recovery part 900 can be driven to be rotated by a driver. In addition, the film recovery part 900 can rotate in one direction to move the film 10 from the film supply part 400 to the film recovery part 900. For example, the film recovery part 900 may rotate simultaneously with the film supply part 400 to transfer the film 10. However, this is only an example, and the film recovery part 900 may be driven to rotate independently of the film supply part 400. In addition, since the rotation force of the film recovery part 900 is greater than the rotation force of the film supply part 400, the rotation of the film recovery part 900 can rotate the film supply part 400. Therefore, the film 10 may be moved by rotating one of the film supply part 400 and the film recovery part 900 in one direction. Such a film 10 can be moved from the upstream side to the downstream side so as to sequentially pass through the mold release section 700 and the transfer section 800 during the movement.

進料輥500可以對膜10的移動進行導向，且可以支撐膜10。可以設有複數個這樣的進料輥500，複數個進料輥500可以配置於膜10的移動路徑。例如，進料輥500可以配置於膜供給部400、保護膜回收部600、脫模部700、轉印部800、膜回收部900中的至少一部分之間。此外，複數個進料輥500可以是通過膜10的移動等旋轉的被動輥。The feed roller 500 can guide the movement of the film 10 and can support the film 10. A plurality of such feed rollers 500 may be provided, and the plural feed rollers 500 may be arranged in the movement path of the film 10. For example, the feed roller 500 may be arranged between at least a part of the film supply part 400, the protective film recovery part 600, the release part 700, the transfer part 800, and the film recovery part 900. In addition, the plurality of feed rollers 500 may be passive rollers rotated by the movement of the film 10 or the like.

保護膜回收部600可以回收粘接於膜10的保護膜。可以設有複數個這樣的保護膜回收部600，以分別回收粘接在膜10的兩面的保護膜。此外，保護膜回收部600可以在模20被移送至脫模部700之前從膜10回收保護膜。The protective film recovery part 600 can recover the protective film adhered to the film 10. A plurality of such protective film recovery parts 600 may be provided to recover the protective films adhered to both sides of the film 10, respectively. In addition, the protective film recovery part 600 may recover the protective film from the film 10 before the mold 20 is transferred to the demolding part 700.

參照圖3，脫模部700可以對模20的表面進行脫模性塗布，以改善模20的表面的脫模性。這樣的脫模部700可以向模20的表面供給脫模劑，以對模20的表面進行脫模性塗布。這樣的脫模劑可以包括氟系脫模劑及矽系脫模劑中的一個以上。此外，脫模部700可以在對模20的表面進行脫模性塗布之前通過等離子體（Plasma）對模20的表面進行等離子體處理。這樣的脫模部700可以包括等離子體處理模組710及蒸鍍模組 720。Referring to FIG. 3, the mold release part 700 may perform mold release coating on the surface of the mold 20 to improve the mold release property of the surface of the mold 20. Such a mold release part 700 can supply a mold release agent to the surface of the mold 20 to apply a mold release coating to the surface of the mold 20. Such a mold release agent may include at least one of a fluorine-based mold release agent and a silicon-based mold release agent. In addition, the mold release part 700 may perform plasma treatment on the surface of the mold 20 by plasma (Plasma) before performing the mold release coating on the surface of the mold 20. Such a demolding part 700 may include a plasma processing module 710 and an evaporation module 720.

等離子體處理模組710可以在對模20的表面進行脫模性塗布之前對模20的表面進行等離子體處理來對模20的表面進行改質，以提高模20的表面與脫模劑之間的粘接力。此外，等離子體處理模組710可以在塗布脫模劑之前對模20的表面進行等離子體處理來清洗模20的表面，以防止在模20的表面在留有異物的狀態下對模20進行脫模性塗布。例如，等離子體處理模組710是常壓等離子體生成裝置，其可以以氬氣（Ar），氮氣（N2 ）及氧氣（O2 ）中的一個以上為媒介生成等離子體。此外，等離子體處理模組710可以包括等離子體生成部711及導向輥712，所述等離子體生成部711在模20的表面生成等離子體，以順暢地進行等離子體處理，所述導向輥712在膜10的上部對膜10的位置進行導向，以維持模20的表面維持與等離子體生成部711的間距為一定間距以下。在這樣的等離子體處理模組710對表面進行等離子體處理的模20可以被移送至蒸鍍模組720。The plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before releasable coating on the surface of the mold 20 to modify the surface of the mold 20 to improve the gap between the surface of the mold 20 and the release agent.的adhesion. In addition, the plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before applying the mold release agent to clean the surface of the mold 20, so as to prevent the mold 20 from being demolded with foreign matter remaining on the surface of the mold 20 Sexual coating. For example, the plasma processing module 710 is a normal pressure plasma generating device, which can generate plasma using one or more of argon (Ar), nitrogen (N 2 ), and oxygen (O 2) as a medium. In addition, the plasma processing module 710 may include a plasma generation part 711 and a guide roller 712. The plasma generation part 711 generates plasma on the surface of the mold 20 to smoothly perform plasma treatment. The guide roller 712 is The upper portion of the film 10 guides the position of the film 10 so as to maintain the surface of the mold 20 and the plasma generating portion 711 at a certain pitch or less. The mold 20 whose surface is plasma-treated in such a plasma processing module 710 can be transferred to the vapor deposition module 720.

如此，等離子體處理模組710具有對模20的表面進行改質來提高模20的表面與脫模劑之間的粘接力的效果。此外，具有通過清洗模20的表面來防止因在模20的表面落有異物的狀態下進行脫模性塗布而發生不良的現象的效果。In this way, the plasma processing module 710 has the effect of modifying the surface of the mold 20 to improve the adhesive force between the surface of the mold 20 and the release agent. In addition, there is an effect of cleaning the surface of the mold 20 to prevent the occurrence of defects due to releasability coating in a state where foreign matter is deposited on the surface of the mold 20.

蒸鍍模組720可以利用脫模劑塗布模20的表面。換言之，蒸鍍模組720可以利用脫模劑塗布通過等離子體處理模組710對表面進行等離子體處理後的模20的表面。此外，蒸鍍模組720可以比等離子體處理模組710配置於下游。這樣的蒸鍍模組720可以利用脫模劑塗布模20的表面來改善模20的表面的脫模性。加之，蒸鍍模組720可以以由一個模20轉印複數個基板30的方式改善模20的表面的脫模性，由此能夠改善模20的再使用性。此外，蒸鍍模組720能夠對脫模劑進行氣相化。此外，蒸鍍模組720能夠將氣相化的脫模劑供給至模20的表面來將脫模劑均勻地塗布於模20的表面。這樣的蒸鍍模組720可以包括第一腔室部721、第二腔室部722、流體供給部723、氣體排出部724、蒸鍍密封部725、腔室驅動器726、加熱器727、以及壓力調節部728。The vapor deposition module 720 can coat the surface of the mold 20 with a release agent. In other words, the vapor deposition module 720 can coat the surface of the mold 20 whose surface is plasma-treated by the plasma processing module 710 with a release agent. In addition, the evaporation module 720 may be arranged downstream of the plasma processing module 710. Such a vapor deposition module 720 can coat the surface of the mold 20 with a mold release agent to improve the mold releasability of the surface of the mold 20. In addition, the vapor deposition module 720 can improve the releasability of the surface of the mold 20 by transferring a plurality of substrates 30 from one mold 20, thereby improving the reusability of the mold 20. In addition, the vapor deposition module 720 can vaporize the release agent. In addition, the vapor deposition module 720 can supply the vaporized mold release agent to the surface of the mold 20 to uniformly apply the mold release agent to the surface of the mold 20. Such an evaporation module 720 may include a first chamber part 721, a second chamber part 722, a fluid supply part 723, a gas discharge part 724, an evaporation sealing part 725, a chamber driver 726, a heater 727, and a pressure调部728。 Adjusting section 728.

參照圖4和圖5，第一腔室部721及第二腔室部722可以提供在模20的表面利用脫模劑進行塗布的塗布空間T1。這樣的塗布空間T1可以被定義為當第一腔室部721與第二腔室部722貼緊時形成於第一腔室部721與第二腔室部722的內部的空間。此外，塗布空間T1可以是第二腔室部722通過腔室驅動器726朝向第一腔室部721上升，使得第一腔室部721與第二腔室部722彼此間貼緊來形成的。這裡，第二腔室部722和第一腔室部721貼緊的含義指，雖然膜10介於第一腔室部721與第二腔室部722之間，但塗布空間T1與外部呈密閉狀態。另一方面，塗布空間T1可以提供配置模20的空間及在模20的表面供給脫模劑的空間。4 and 5, the first cavity portion 721 and the second cavity portion 722 may provide a coating space T1 for coating the surface of the mold 20 with a release agent. Such a coating space T1 can be defined as a space formed inside the first cavity portion 721 and the second cavity portion 722 when the first cavity portion 721 and the second cavity portion 722 are in close contact. In addition, the coating space T1 may be formed by the second cavity portion 722 rising toward the first cavity portion 721 through the cavity driver 726, so that the first cavity portion 721 and the second cavity portion 722 are in close contact with each other. Here, the meaning that the second cavity portion 722 and the first cavity portion 721 are in close contact means that although the film 10 is interposed between the first cavity portion 721 and the second cavity portion 722, the coating space T1 is sealed to the outside. status. On the other hand, the coating space T1 can provide a space for arranging the mold 20 and a space for supplying a release agent on the surface of the mold 20.

可以在第一腔室部721形成能夠插入待後述的第一蒸鍍密封部件725a的第一腔室槽721a。這樣的第一腔室槽721a可以在第一腔室部721第二腔室部722貼緊時與後述的第二腔室槽722b-2的位置對應地形成於第一腔室部721。The first cavity portion 721 may be formed with a first cavity groove 721a into which a first vapor deposition sealing member 725a to be described later can be inserted. Such a first cavity groove 721a may be formed in the first cavity portion 721 corresponding to the position of the second cavity groove 722b-2 described later when the first cavity portion 721 and the second cavity portion 722 are in close contact.

此外，可以在第一腔室部721形成用於殘留在塗布空間T1的內部上側的氣體流動的氣體排出口721b。這樣的氣體排出口721b的一側可以與塗布空間T1連通，另一側可以與壓力調節流路728a連通。例如，氣體排出口721b可以形成於第一腔室部721的中心部，且可以在氣體排出口721b的下側配置模20。In addition, a gas discharge port 721 b for flowing the gas remaining on the upper side of the interior of the coating space T1 may be formed in the first chamber portion 721. One side of such a gas discharge port 721b may be in communication with the coating space T1, and the other side may be in communication with the pressure adjustment flow path 728a. For example, the gas discharge port 721b may be formed in the central part of the first chamber part 721, and the mold 20 may be arranged on the lower side of the gas discharge port 721b.

第二腔室部722可以隔著膜10和模20與第一腔室部721貼緊來形成塗布空間T1。這樣的第二腔室部722可以通過腔室驅動器726朝向第一腔室部721上升。第二腔室部722可以包括腔室底座722a、腔室側壁722b及腔室凸出部722c。The second cavity portion 722 may be in close contact with the first cavity portion 721 via the film 10 and the mold 20 to form the coating space T1. Such a second chamber part 722 can be raised toward the first chamber part 721 by the chamber driver 726. The second cavity portion 722 may include a cavity base 722a, a cavity side wall 722b, and a cavity protrusion 722c.

腔室底座722a可以支撐腔室側壁722b及腔室凸出部722c，且可以被腔室驅動器726支撐。The cavity base 722a can support the cavity sidewall 722b and the cavity protrusion 722c, and can be supported by the cavity driver 726.

腔室側壁722b可以從腔室底座722a向上側凸出形成，且可以沿腔室底座722a的邊緣延伸形成。此外，可以在腔室側壁722b形成能夠插入待後述的第二蒸鍍密封部件725b的第二腔室槽722b-2。這樣的第二腔室槽722b-2可以在第一腔室部721與第二腔室部722貼緊時與第一腔室槽721a的位置對應地形成於第二腔室部722。這樣的腔室側壁722b可以形成為與腔室凸出部722c隔開規定距離而包圍腔室凸出部722c。此外，可以在腔室側壁722b形成用於脫模劑流動的流入口722b-1。The chamber side wall 722b may be formed to protrude upward from the chamber base 722a, and may be formed to extend along the edge of the chamber base 722a. In addition, a second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed in the chamber side wall 722b. Such a second cavity groove 722b-2 may be formed in the second cavity portion 722 corresponding to the position of the first cavity groove 721a when the first cavity portion 721 and the second cavity portion 722 are in close contact. Such a cavity side wall 722b may be formed to be separated from the cavity protrusion 722c by a predetermined distance to surround the cavity protrusion 722c. In addition, an inflow port 722b-1 for the release agent to flow may be formed on the side wall 722b of the cavity.

流入口722b-1可以提供用於從流體供給部723流入的脫模劑向塗布空間T流動的通道。這樣的流入口722b-1的一側可以與流體供給部723的待後述的第二供給流路723e連通，另一側可以與塗布空間T1連通。此外，可以形成有複數個流入口722b-1，複數個流入口722b-1可以配置為沿腔室側壁722b的周向隔開。例如，可以設有4個流入口722b-1。如此，流入口722b-1形成於彼此不同的位置的腔室側壁722b，使得通過流入口722b-1流入的脫模劑在彼此不同的方向朝向模20流動。另一方面，通過流入口722b-1流入塗布空間T1的脫模劑可以在塗布空間T1內流動而與模20的表面接觸來塗布模20的表面。The inflow port 722b-1 may provide a passage for the release agent flowing in from the fluid supply part 723 to flow into the coating space T. One side of such an inflow port 722b-1 may be in communication with a second supply flow path 723e of the fluid supply part 723 to be described later, and the other side may be in communication with the coating space T1. In addition, a plurality of inflow ports 722b-1 may be formed, and the plurality of inflow ports 722b-1 may be arranged to be spaced apart along the circumferential direction of the chamber side wall 722b. For example, four inflow ports 722b-1 may be provided. In this way, the inflow port 722b-1 is formed in the chamber side wall 722b at different positions, so that the release agent flowing in through the inflow port 722b-1 flows toward the mold 20 in different directions. On the other hand, the release agent flowing into the coating space T1 through the inflow port 722b-1 can flow in the coating space T1 and contact the surface of the mold 20 to coat the surface of the mold 20.

另一方面，流入口722b-1可以位於模20的下側，以防止與從塗布空間T1連通的一側噴射而朝向模20流動的脫模劑被直接噴射至模20。這裡，模20的下側指比以經過模20的表面中不粘接於膜10的表面的方式延伸的虛擬的平面更下側的位置。如此，流入口722b-1配置於模20的下側，使得從流入口722b-1朝向模20流動的脫模劑能夠在塗布空間T1均勻地分散，且能夠均勻地塗布模20的表面。On the other hand, the inflow port 722b-1 may be located on the lower side of the mold 20 to prevent the release agent sprayed from the side communicating with the coating space T1 and flowing toward the mold 20 from being directly sprayed to the mold 20. Here, the lower side of the mold 20 refers to a position lower than a virtual plane extending through the surface of the mold 20 so as not to adhere to the surface of the film 10. In this way, the inflow port 722b-1 is arranged on the lower side of the mold 20 so that the release agent flowing from the inflow port 722b-1 toward the mold 20 can be uniformly dispersed in the coating space T1 and the surface of the mold 20 can be uniformly coated.

可以在腔室側壁722b形成能夠插入待後述的第二蒸鍍密封部件725b的第二腔室槽722b-2。這樣的第二腔室槽722b-2可以在第一腔室部721與第二腔室部722貼緊時與第一腔室槽721a的位置對應地形成於第二腔室部722。A second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed in the chamber side wall 722b. Such a second cavity groove 722b-2 may be formed in the second cavity portion 722 corresponding to the position of the first cavity groove 721a when the first cavity portion 721 and the second cavity portion 722 are in close contact.

腔室凸出部722c可以從腔室底座722a凸出形成。這樣的腔室凸出部722c可以被腔室側壁722b包圍，且可以以與腔室側壁722b隔開規定距離的方式形成於腔室底座722a。此外，可以在腔室凸出部722c形成排出口722c-1。The cavity protrusion 722c may be formed to protrude from the cavity base 722a. Such a cavity protrusion 722c may be surrounded by the cavity side wall 722b, and may be formed on the cavity base 722a so as to be separated from the cavity side wall 722b by a predetermined distance. In addition, a discharge port 722c-1 may be formed in the cavity protrusion 722c.

排出口722c-1可以提供用於向外部排出通過流入口722b-1流入塗布空間T1的脫模劑的通道。這樣的通過流入口722b-1流入塗布空間T1的脫模劑可以在塗布模20的表面之後朝向排出口722c-1被排出至外部。此外，排出口722c-1的一側可以與塗布空間T1連通，排出口722c-1的另一側可以與氣體排出部724連通。排出口722c-1可以通過塗布空間T1與流入口722b-1連通。另一方面，排出口722c-1可以形成於腔室凸出部722c的中心部，且可以在排出口722c-1的上側配置模20。如此，排出口722c-1形成於腔室凸出部722c的中心部，且在其上側配置模20，使得通過複數個流入口722b-1流入的脫模劑能夠在彼此不同的方向塗布模20的表面之後被排出至外部。The discharge port 722c-1 may provide a passage for discharging the release agent flowing into the coating space T1 through the inflow port 722b-1 to the outside. Such a release agent flowing into the coating space T1 through the inflow port 722b-1 can be discharged to the outside toward the discharge port 722c-1 after the surface of the coating die 20. In addition, one side of the discharge port 722c-1 may be in communication with the coating space T1, and the other side of the discharge port 722c-1 may be in communication with the gas discharge part 724. The discharge port 722c-1 may communicate with the inflow port 722b-1 through the coating space T1. On the other hand, the discharge port 722c-1 may be formed at the center of the cavity protrusion 722c, and the mold 20 may be arranged on the upper side of the discharge port 722c-1. In this way, the discharge port 722c-1 is formed at the center of the cavity protrusion 722c, and the mold 20 is arranged on the upper side thereof, so that the release agent flowing in through the plurality of inflow ports 722b-1 can coat the mold 20 in different directions. The surface is then discharged to the outside.

另一方面，腔室凸出部722c可以以腔室凸出部722c的上面比流入口722b-1配置於上側的方式形成於腔室底座722a。換言之，腔室凸出部722c可以以從腔室底座722a至腔室凸出部722c的上面的距離比從腔室底座722a至流入口722b-1的距離長的方式形成於腔室底座722a。如此，流入口722b-1比腔室凸出部722c的上面形成於下側，從而能夠通過腔室凸出部722c改變通過流入口722b-1流入塗布空間T1的脫模劑的流動方向，且脫模劑能夠在塗布空間T1內均勻地分散。此外，排出口722c-1可以改變通過複數個流入口722b-1流入的脫模劑的流動方向，以使脫模劑在塗布空間T1內分散。從而，模20的表面可以被脫模劑均勻地塗布。On the other hand, the cavity protrusion 722c may be formed on the cavity base 722a such that the upper surface of the cavity protrusion 722c is arranged on the upper side than the inlet 722b-1. In other words, the cavity protrusion 722c may be formed on the cavity base 722a such that the distance from the cavity base 722a to the upper surface of the cavity protrusion 722c is longer than the distance from the cavity base 722a to the inflow port 722b-1. In this way, the inflow port 722b-1 is formed on the lower side than the upper surface of the cavity protrusion 722c, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the cavity protrusion 722c, and The release agent can be uniformly dispersed in the coating space T1. In addition, the discharge port 722c-1 can change the flow direction of the release agent flowing in through the plurality of inflow ports 722b-1, so that the release agent is dispersed in the coating space T1. Thus, the surface of the mold 20 can be uniformly coated with the release agent.

如此，第一腔室部721及第二腔室部722具有能夠利用脫模劑均勻地塗布模20的表面的效果。In this way, the first cavity portion 721 and the second cavity portion 722 have the effect of being able to uniformly coat the surface of the mold 20 with the release agent.

再次參照圖3，可以在腔室凸出部722c形成能夠分散通過流入口722b-1流入塗布空間T1的脫模劑的凹部722c-2。這樣的凹部722c-2可以形成為具有從腔室凸出部722c的上面向下側凹陷的形狀，且可以形成於腔室凸出部722c的邊緣。如此，凹部722c-2引入形成於腔室凸出部722c的邊緣，從而可以在腔室凸出部722c的邊緣形成凹部722c-2產生的凸台。此外，凹部722c-2可以形成於與流入口722b-1相鄰的位置的腔室凸出部722c。3 again, a concave portion 722c-2 capable of dispersing the release agent flowing into the coating space T1 through the inflow port 722b-1 may be formed in the cavity convex portion 722c. Such a concave portion 722c-2 may be formed to have a shape recessed from the upper surface of the cavity convex portion 722c to the lower side, and may be formed on the edge of the cavity convex portion 722c. In this way, the concave portion 722c-2 is introduced into the edge of the cavity convex portion 722c, so that a boss generated by the concave portion 722c-2 can be formed on the edge of the cavity convex portion 722c. In addition, the concave portion 722c-2 may be formed in the cavity convex portion 722c at a position adjacent to the inflow port 722b-1.

另一方面，可以形成複數個凹部722c-2，且複數個凹部722c-2可以與複數個流入口722b-1對應地形成。例如，可以形成有4個凹部722c-2，4個凹部722c-2可以形成於於4個流入口722b-1相鄰的位置。如此，凹部722c-2形成於與流入口722b-1相鄰的位置，從而能夠通過凹部722c-2改變通過流入口722b-1流入塗布空間T1的脫模劑的流動方向，且可以發生渦流現象。從而，通過凹部722c-2產生的渦流現象，脫模劑能夠在塗布空間T1內分散，而不會成團，且能夠均勻地接觸並塗布模20的表面。On the other hand, a plurality of concave portions 722c-2 may be formed, and a plurality of concave portions 722c-2 may be formed corresponding to the plurality of inflow ports 722b-1. For example, four concave portions 722c-2 may be formed, and four concave portions 722c-2 may be formed at positions adjacent to the four inflow ports 722b-1. In this way, the concave portion 722c-2 is formed at a position adjacent to the inflow port 722b-1, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the concave portion 722c-2, and a vortex phenomenon can occur. . Therefore, the release agent can be dispersed in the coating space T1 by the vortex phenomenon generated by the concave portion 722c-2 without forming agglomerates, and can uniformly contact and coat the surface of the mold 20.

如此，凹部722c-2具有通過渦流現象來防止脫模性塗層在模20上成團而發生不良的效果。In this way, the recessed portion 722c-2 has the effect of preventing the mold-releasing coating from clumping on the mold 20 through the eddy current phenomenon and causing defects.

再次參照圖5，流體供給部723可以向塗布空間T1供給脫模劑來對配置於塗布空間T1的模20的表面進行脫模性塗布。此外，流體供給部723可以使脫模劑氣相化並通過流入口722b-1向塗布空間T1供給氣相化的脫模劑。這樣的流體供給部723可以包括流體容納體723a、罐723b、起泡器723c、第一供給流路723d、第二供給流路723e以及噴射裝置723f。5 again, the fluid supply part 723 can supply a mold release agent to the coating space T1 to perform a mold release coating on the surface of the mold 20 arranged in the coating space T1. In addition, the fluid supply part 723 may vaporize the mold release agent and supply the vaporized mold release agent to the coating space T1 through the inflow port 722b-1. Such a fluid supply part 723 may include a fluid container 723a, a tank 723b, a bubbler 723c, a first supply flow path 723d, a second supply flow path 723e, and an ejection device 723f.

流體容納體723a可以提供容納非活性氣體的空間。容納於這樣的流體容納體723a的內部的非活性氣體可以是高壓的氣體狀態。此外，非活性氣體可以是氮氣（N2 ）。此外，流體容納體723a可以通過第一供給流路723d向起泡器723c及噴射裝置723f中的一個以上供給非活性氣體。The fluid containing body 723a may provide a space for containing inert gas. The inert gas contained in such a fluid container 723a may be in a high-pressure gas state. In addition, the inert gas may be nitrogen (N 2 ). In addition, the fluid container 723a can supply inert gas to one or more of the bubbler 723c and the ejector 723f through the first supply flow path 723d.

罐723b可以提供容納脫模劑的空間。這樣的容納於罐723b的內部的脫模劑可以是液體狀態。此外，罐723b可以通過起泡器723c接受非活性氣體，接受非活性氣體的脫模劑可以被氣相化並供給至塗布空間T1。從而，氣相化的脫模劑可以在塗布空間T1內分散，而不會成團，從而能夠均勻地接觸並塗布模20的表面。The tank 723b may provide a space for accommodating the release agent. Such a release agent contained in the tank 723b may be in a liquid state. In addition, the tank 723b can receive the inert gas through the bubbler 723c, and the release agent that receives the inert gas can be vaporized and supplied to the coating space T1. Therefore, the vaporized release agent can be dispersed in the coating space T1 without forming agglomerates, so that the surface of the mold 20 can be uniformly contacted and coated.

起泡器723c可以向容納於罐723b的液體狀態的脫模劑供給規定壓力以上的非活性氣體，以使脫模劑氣相化。這樣的起泡器723c可以在容納於罐723b的脫模劑的表面下方排出非活性氣體。例如，起泡器723c可以是流路管或形成有複數個噴射孔的噴射口。但是，本發明並不因此而受限。The bubbler 723c can supply an inert gas of a predetermined pressure or higher to the release agent in a liquid state contained in the tank 723b to vaporize the release agent. Such a bubbler 723c can discharge inert gas below the surface of the release agent contained in the tank 723b. For example, the bubbler 723c may be a flow pipe or an ejection port formed with a plurality of ejection holes. However, the present invention is not limited by this.

第一供給流路723d可以提供用於從流體容納體723a流入的非活性氣體向起泡器723c及噴射裝置723f中的一個以上流動的通道。這樣的第一供給流路723d的一側可以與流體容納體723a連通，另一側可以與起泡器723c及噴射裝置723f中的一個以上連通。The first supply flow path 723d may provide a passage for the inert gas flowing in from the fluid container 723a to flow to one or more of the bubbler 723c and the injection device 723f. One side of such a first supply flow path 723d may be in communication with the fluid container 723a, and the other side may be in communication with one or more of the bubbler 723c and the injection device 723f.

第二供給流路723e可以提供用於從罐723b流入的氣相化的脫模劑向第二腔室部722的流入口722b-1流動的通道。這樣的第二供給流路723e的一側可以與罐723b的內部連通，另一側可以通過流入口722b-1與塗布空間T1連通。The second supply flow path 723e may provide a channel for the vaporized mold release agent flowing in from the tank 723b to flow to the inlet 722b-1 of the second chamber part 722. One side of such a second supply flow path 723e may communicate with the inside of the tank 723b, and the other side may communicate with the coating space T1 through the inflow port 722b-1.

噴射裝置723f可以防止在罐723b的內部氣相化的脫模劑再次成團。這樣的噴射裝置723f可以配置於從容納於罐723b的液體狀態的脫模劑的表面向上側隔開規定距離的位置來供給非活性氣體。從而，噴射裝置723f可以在從脫模劑的表面隔開規定距離的位置噴射非活性氣體來防止氣相化的脫模劑再次成團。The injection device 723f can prevent the release agent vaporized inside the tank 723b from clumping again. Such an injection device 723f can be arranged at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state contained in the tank 723b to supply the inert gas. Therefore, the injection device 723f can inject an inert gas at a position spaced a predetermined distance from the surface of the release agent to prevent the vaporized release agent from clumping again.

如此，流體供給部723具有能夠使脫模劑氣相化來無成團現象地均勻地塗布模20的表面的效果。此外，具有能夠防止氣相化的脫模劑再次成團的效果。In this way, the fluid supply part 723 has an effect of being able to vaporize the release agent to uniformly coat the surface of the mold 20 without agglomeration. In addition, it has the effect of preventing the release agent that has been vaporized from clumping again.

氣體排出部724可以向外部排出塗布空間T1的內部中以膜10為基準殘留於第二腔室部722側（例如，圖5的下側）的氣體及脫模劑。這樣的氣體排出部724可以包括排出流路724a及排出泵724b。The gas discharge part 724 can discharge the gas and the release agent remaining on the second chamber part 722 side (for example, the lower side in FIG. 5) from the inside of the coating space T1 with the film 10 as a reference. Such a gas discharge part 724 may include a discharge flow path 724a and a discharge pump 724b.

排出流路724a可以提供用於塗布空間T1的內部下側的氣體及脫模劑向外部流動的通道。這樣的排出流路724a的一側可以通過第二腔室部722的排出口722c-1與塗布空間T1連通，另一側可以通過排出泵724b與外部連通。The discharge flow path 724a may provide a passage for the gas and the release agent on the lower side of the inside of the coating space T1 to flow to the outside. One side of such a discharge flow path 724a may communicate with the coating space T1 through the discharge port 722c-1 of the second chamber portion 722, and the other side may communicate with the outside through a discharge pump 724b.

壓力調節部728可以向外部排出塗布空間T1的內部中以膜10為基準殘留於上側的氣體。這樣的壓力調節部728可以包括壓力調節流路728a。The pressure adjusting unit 728 can discharge the gas remaining on the upper side of the coating space T1 on the basis of the film 10 to the outside. Such a pressure adjustment part 728 may include a pressure adjustment flow path 728a.

壓力調節流路728a可以提供用於殘留在塗布空間T1的內部上側的氣體向外部流動的通道。這樣的壓力調節流路728a的一側可以與第一腔室部721的氣體排出口721b與塗布空間T1連通，另一側可以通過排出泵724b與外部連通。The pressure adjustment flow path 728a may provide a passage for the gas remaining on the upper side of the inside of the coating space T1 to flow to the outside. One side of such a pressure regulating flow path 728a can communicate with the gas discharge port 721b of the first chamber portion 721 and the coating space T1, and the other side can communicate with the outside through a discharge pump 724b.

另一方面，在本實施例的附圖中，雖然圖示為壓力調節流路728a與氣體排出部724的排出泵724b連通，但本發明的思想並不限於此，壓力調節部728也可以進一步包括不同於氣體排出部724的排出泵724b的另外的泵，且可以通過這樣的另外的泵向外部排出壓力調節流路728a的氣體。On the other hand, in the drawings of this embodiment, although the pressure adjustment flow path 728a is shown to communicate with the discharge pump 724b of the gas discharge part 724, the idea of the present invention is not limited to this, and the pressure adjustment part 728 may be further A different pump than the discharge pump 724b of the gas discharge part 724 is included, and the gas in the pressure adjustment flow path 728a can be discharged to the outside by such another pump.

當氣體排出部724排出塗布空間T1的內部下側的氣體時，塗布空間T1的內部上側與下側的壓力差會使膜10晃動而阻礙模20的塗布，因而能夠防止因壓力調節部728排出塗布空間T1的內部上側的氣體而發生塗布空間T1的內部上側與下側的壓力差。When the gas discharge part 724 discharges the gas on the lower side of the inside of the coating space T1, the pressure difference between the upper side and the lower side of the coating space T1 will cause the film 10 to shake and hinder the coating of the mold 20, so it can be prevented from being discharged by the pressure regulating part 728 The gas on the upper side of the interior of the coating space T1 generates a pressure difference between the upper side and the lower side of the interior of the coating space T1.

如此，壓力調節部728具有能夠防止塗布空間T1的內部上側與下側的壓力差來防止模20的塗布被阻礙的效果。In this way, the pressure adjusting part 728 has the effect of preventing the pressure difference between the upper side and the lower side of the inside of the coating space T1 and preventing the coating of the mold 20 from being hindered.

當第一腔室部721與第二腔室部722實質上貼緊時，蒸鍍密封部725可以使第一腔室部721與第二腔室部722之間密閉。這樣的蒸鍍密封部725可以通過使第一腔室部721與第二腔室部722之間密閉來阻隔塗布空間T1與外部。此外，蒸鍍密封部725可以形成為包圍塗布空間T1，以進行第一腔室部721與第二腔室部722之間的密封。這樣的蒸鍍密封部725可以包括第一蒸鍍密封部件725a及第二蒸鍍密封部件725b。When the first cavity portion 721 and the second cavity portion 722 are substantially in close contact, the vapor deposition sealing portion 725 can seal the first cavity portion 721 and the second cavity portion 722. Such a vapor deposition sealing part 725 can block the coating space T1 from the outside by sealing the space between the first chamber part 721 and the second chamber part 722. In addition, the vapor deposition sealing part 725 may be formed to surround the coating space T1 to perform sealing between the first chamber part 721 and the second chamber part 722. Such a vapor deposition sealing part 725 may include a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b.

第一蒸鍍密封部件725a可以插入配置與形成在第一腔室部721的第一腔室槽721a。此外，第二蒸鍍密封部件725b可以插入配置於形成在第二腔室部722的第二腔室槽722b-2。這樣的第一蒸鍍密封部件725a與第二蒸鍍密封部件725b可以配置為彼此相向。換言之，當第一腔室部721與第二腔室部722貼緊時，第一蒸鍍密封部件725a和第二蒸鍍密封部件725b可以彼此加壓，且可以對第一腔室部721與第二腔室部722之間的間隙進行密封。The first vapor deposition sealing member 725a may be inserted into the first chamber groove 721a arranged and formed in the first chamber portion 721. In addition, the second vapor deposition sealing member 725b may be inserted and arranged in the second chamber groove 722b-2 formed in the second chamber portion 722. Such a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b may be arranged to face each other. In other words, when the first cavity portion 721 and the second cavity portion 722 are in close contact, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b can pressurize each other, and can pressurize the first cavity portion 721 and the second vapor deposition sealing member 725b. The gap between the second chamber portions 722 is sealed.

另一方面，參照圖5的放大圖，當第一蒸鍍密封部件725a與第二蒸鍍密封部件725b相互貼緊時，膜10可以介於第一蒸鍍密封部件725a與第二蒸鍍密封部件725b之間。此外，第一蒸鍍密封部件725a可以在膜10的上部對膜10，第二蒸鍍密封部件725b可以在膜10的下部對膜10加壓。此時，第一蒸鍍密封部件725a及第二蒸鍍密封部件725b可以配置為具有既通過第一蒸鍍密封部件725a和第二蒸鍍密封部件725b的加壓防止膜10起皺又能夠有效地密封第一腔室部721與第二腔室部722之間的間隙的形狀。On the other hand, referring to the enlarged view of FIG. 5, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact with each other, the film 10 may be interposed between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725a. Between parts 725b. In addition, the first vapor deposition sealing member 725 a can press the film 10 on the upper part of the film 10, and the second vapor deposition sealing member 725 b can press the film 10 on the lower part of the film 10. At this time, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b can be configured to have both the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b to prevent the film 10 from being wrinkled while being effective. The shape of the gap between the first cavity portion 721 and the second cavity portion 722 is sealed.

例如，當第一蒸鍍密封部件725a及第二蒸鍍密封部件725b形成為相同的O型環（O-ring）形狀時，第一蒸鍍密封部件725a與第二蒸鍍密封部件725b貼緊時可能會導致膜10起皺。作為另一示例，當第一蒸鍍密封部件725a和第二蒸鍍密封部件725b形成為相互接觸的面為平面形狀時，能夠防止膜10起皺。然而，由於第一蒸鍍密封部件725a與第二蒸鍍密封部件725b之間的加壓力較弱，因而無法正常地對第一腔室部721與第二腔室部722之間進行密封。因此，第一蒸鍍密封部件725a及第二蒸鍍密封部件725b有必要形成為彼此不同的形狀，以便既防止膜10起皺又能使塗布空間T1密閉。例如，第一蒸鍍密封部件725a及第二蒸鍍密封部件725b中的某一個可以在不與另一個貼緊時具有平面形狀，另一個可以在不與所述某一個貼緊時具有O型環等圓弧形狀。For example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed in the same O-ring shape, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact Time may cause the film 10 to wrinkle. As another example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed such that the surfaces in contact with each other are planar, the film 10 can be prevented from wrinkling. However, since the pressing force between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b is weak, the first chamber portion 721 and the second chamber portion 722 cannot be normally sealed. Therefore, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b need to be formed in different shapes to prevent the film 10 from being wrinkled and to seal the coating space T1. For example, one of the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may have a flat shape when not in close contact with the other, and the other may have an O-shape when not in close contact with the one. Circular arc shape such as ring.

腔室驅動器726可以使第二腔室部722相對於第一腔室部721升降。這樣的腔室驅動器726可以與第二腔室部722連接。The chamber driver 726 can raise and lower the second chamber part 722 with respect to the first chamber part 721. Such a chamber driver 726 may be connected to the second chamber part 722.

如此，蒸鍍密封部725具有防止膜10起皺的效果。In this way, the vapor deposition sealing portion 725 has an effect of preventing the film 10 from wrinkling.

加熱器727可以使塗布空間T1的溫度維持在規定範圍，以提高模20的表面與脫模劑之間的粘接力。這樣的加熱器727可以加熱第一腔室部721及第二腔室部722中的一個以上來提升塗布空間T1的溫度。例如，當塗布空間T1的溫度為30℃以下時，可能無法在模20的表面進行充分的脫模性塗布，當塗布空間T1的溫度為80℃以上時，膜10可能會受損。因此，加熱器727可以使將塗布空間T1的溫度維持在30℃至80℃的範圍內。The heater 727 can maintain the temperature of the coating space T1 within a predetermined range to improve the adhesion between the surface of the mold 20 and the release agent. Such a heater 727 can heat more than one of the first cavity portion 721 and the second cavity portion 722 to increase the temperature of the coating space T1. For example, when the temperature of the coating space T1 is 30°C or less, sufficient release coating may not be performed on the surface of the mold 20, and when the temperature of the coating space T1 is 80°C or more, the film 10 may be damaged. Therefore, the heater 727 can maintain the temperature of the coating space T1 in the range of 30°C to 80°C.

如此，加熱器727具有將塗布空間T1的溫度維持在規定範圍來提高模20的表面與脫模劑之間的粘接力的效果。In this way, the heater 727 has an effect of maintaining the temperature of the coating space T1 within a predetermined range to increase the adhesive force between the surface of the mold 20 and the release agent.

如此，本發明的一實施例的蒸鍍模組720具有通過對模20的表面進行脫模性塗布來改善模20的表面脫模性的效果。此外，通過改善模20的表面的脫模性，能夠利用一個模20轉印複數個基板30，從而具有能夠提高模20的再使用性的效果。此外，具有通過降低模20的更換週期，能夠縮短將圖案轉印於基板30的時間，且能夠提高製程的效率的效果。In this way, the vapor deposition module 720 according to an embodiment of the present invention has an effect of improving the releasability of the surface of the mold 20 by coating the surface of the mold 20 with releasability. In addition, by improving the releasability of the surface of the mold 20, it is possible to transfer a plurality of substrates 30 with one mold 20, and there is an effect that the reusability of the mold 20 can be improved. In addition, by reducing the replacement period of the mold 20, the time for transferring the pattern to the substrate 30 can be shortened, and the efficiency of the manufacturing process can be improved.

參照圖6，轉印部800可以將模20的圖案轉印於基板30。例如，轉印部800可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下執行將模20的圖案壓接於基板30的過程和從基板30分離模20的過程來將圖案轉印於基板30。此外，在脫模部700對模20的表面進行脫模性塗布後，轉印部800可以將進行脫模性塗布的一個模20加壓於複數個基板30來將圖案轉印於複數個基板30。例如，轉印部800可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下反復執行規定次數的將模20的圖案壓接於基板30的過程和從基板30分離模20的過程來將圖案轉印於複數個基板30。作為更詳細的示例，當執行一次等離子體處理模組710利用等離子體處理模20的表面的過程，並執行一次蒸鍍模組720對模20的表面進行脫模性塗布的過程時，轉印部800可以執行複數次將模20的圖案壓接於進行脫模性塗布後的基板30的過程和從基板30分離模20的過程。此外，可以省略將模20的圖案壓接於基板30的過程與從基板30分離模20的過程之間的轉印部800移動至用於使相互壓接的基板30與模20的位置的過程。這樣的轉印部800可以包括框架810、壓接模組820、模分離單元830及檢測單元840。6, the transfer part 800 can transfer the pattern of the mold 20 to the substrate 30. For example, the transfer part 800 may perform the process of crimping the pattern of the mold 20 to the substrate 30 and removing the pattern of the mold 20 from the substrate 30 in a state where one or more of the film supply part 400 and the film recovery part 900 are not rotated to stop the movement of the film 10 The process of separating the mold 20 is to transfer the pattern to the substrate 30. In addition, after the mold release section 700 performs releasability coating on the surface of the mold 20, the transfer section 800 can press one mold 20 to be releasable coating on the plurality of substrates 30 to transfer the pattern to the plurality of substrates. 30. For example, the transfer part 800 may repeatedly perform the process of crimping the pattern of the mold 20 to the substrate 30 for a predetermined number of times in a state where one or more of the film supply part 400 and the film recovery part 900 is not rotated to stop the movement of the film 10 And the process of separating the mold 20 from the substrate 30 to transfer the pattern to the plurality of substrates 30. As a more detailed example, when the plasma processing module 710 uses plasma to treat the surface of the mold 20 once, and the vapor deposition module 720 performs a mold release coating process on the surface of the mold 20, the transfer The part 800 may perform the process of crimping the pattern of the mold 20 to the substrate 30 after the release coating and the process of separating the mold 20 from the substrate 30 multiple times. In addition, the process of moving the transfer part 800 between the process of crimping the pattern of the mold 20 to the substrate 30 and the process of separating the mold 20 from the substrate 30 to the position of the substrate 30 and the mold 20 for crimping each other can be omitted. . Such a transfer part 800 may include a frame 810, a crimping module 820, a mold separation unit 830, and a detection unit 840.

參照圖6和圖7，框架810可以支撐壓接模組820、模分離單元830以及檢測單元840。這樣的框架810可以形成為圍繞壓接模組820及模分離單元830的至少一部分。從而，壓接模組820及模分離單元830可以以支撐於框架810的狀態在框架810的內側移動。換言之，壓接模組820及模分離單元830可以相對於框架810移動。例如，第一壓接單元821及第二壓接單元822可以以支撐於框架810的狀態相對於彼此移動，模分離單元830可以以支撐於框架810的狀態相對於模20移動。從而，代替由壓接模組820向模分離單元830移動模20地，模分離單元830相對於模20移動，由此可以省略使模20與基板30相互壓接的製程與使模20與基板30相互分離的製程之間的壓接於基板30及基板30的模20移動至從基板30分離模20的位置的製程。此外，框架810可以包括支撐第一壓接單元821的第一框架部811、支撐第二壓接單元822的第二框架部812、以及支撐模分離單元830的第三框架部813。這樣的第一框架部811、第二框架部812及第三框架部813可以相對於彼此一體地固定支撐。此外，第二框架部812可以支撐第一框架部811及第三框架部813的荷重。6 and 7, the frame 810 may support the crimping module 820, the mold separating unit 830, and the detecting unit 840. Such a frame 810 may be formed to surround at least a part of the crimping module 820 and the mold separating unit 830. Therefore, the crimping module 820 and the mold separating unit 830 can move inside the frame 810 while being supported by the frame 810. In other words, the crimping module 820 and the mold separating unit 830 can move relative to the frame 810. For example, the first crimping unit 821 and the second crimping unit 822 can move relative to each other while being supported by the frame 810, and the mold separating unit 830 can move relative to the mold 20 while being supported by the frame 810. Therefore, instead of moving the mold 20 from the crimping module 820 to the mold separating unit 830, the mold separating unit 830 moves relative to the mold 20, so that the process of crimping the mold 20 and the substrate 30 and making the mold 20 and the substrate can be omitted A process in which the mold 20 crimped to the substrate 30 and the substrate 30 is moved to a position where the mold 20 is separated from the substrate 30 between processes that are separated from each other. In addition, the frame 810 may include a first frame portion 811 supporting the first crimping unit 821, a second frame portion 812 supporting the second crimping unit 822, and a third frame portion 813 supporting the mold separating unit 830. The first frame portion 811, the second frame portion 812, and the third frame portion 813 may be integrally fixed and supported with respect to each other. In addition, the second frame portion 812 can support the loads of the first frame portion 811 and the third frame portion 813.

壓接模組820可以將模20的圖案壓接於基板30。這樣的壓接模組820可以將通過脫模部700對表面進行等離子體處理並對表面進行脫模性塗布的模20的圖案壓接於基板30。此外，壓接模組820可以對模20與基板30相對於彼此加壓來將模20的圖案壓接於基板30。這樣的壓接模組820可以包括第一壓接單元821、第二壓接單元822、排氣部823、吸附部824、驅動部825以及壓接密封部826。The crimping module 820 can crimp the pattern of the mold 20 to the substrate 30. Such a crimping module 820 can crimp the pattern of the mold 20 in which the surface is plasma-treated by the mold release section 700 and the surface is releasably coated to the substrate 30. In addition, the crimping module 820 can press the mold 20 and the substrate 30 relative to each other to crimp the pattern of the mold 20 to the substrate 30. Such a crimping module 820 may include a first crimping unit 821, a second crimping unit 822, an exhaust portion 823, a suction portion 824, a driving portion 825, and a crimping sealing portion 826.

參照圖8，第一壓接單元821和第二壓接單元822可以相對於彼此移動而相互貼緊來將形成在模20的圖案壓接於基板30。換言之，第一壓接單元821和第二壓接單元822可以在膜10的相反的一側朝向膜10移動而相互貼緊。此外，第一壓接單元821及第二壓接單元822中的一個以上可以向相互貼緊的方向對模20或基板30加壓。如此，第一壓接單元821及第二壓接單元822中的一個以上對模20與基板30相互加壓，從而能夠將形成在模20的圖案壓接於基板30。例如，第一壓接單元821支撐模20，第二壓接單元822朝向模20對基板30加壓，由此能夠將模20的圖案壓接於基板30。作為另一示例，第二壓接單元822可以支撐基板30，第一壓接單元821朝向基板30對模20加壓，由此能夠將模20的圖案壓接於基板30。Referring to FIG. 8, the first crimping unit 821 and the second crimping unit 822 can move relative to each other to be closely attached to each other to crimp the pattern formed on the mold 20 to the substrate 30. In other words, the first crimping unit 821 and the second crimping unit 822 can move toward the film 10 on the opposite side of the film 10 to be in close contact with each other. In addition, one or more of the first crimping unit 821 and the second crimping unit 822 can press the mold 20 or the substrate 30 in a direction in which they are in close contact with each other. In this way, one or more of the first crimping unit 821 and the second crimping unit 822 presses the mold 20 and the substrate 30 to each other, so that the pattern formed on the mold 20 can be crimped to the substrate 30. For example, the first crimping unit 821 supports the mold 20, and the second crimping unit 822 presses the substrate 30 toward the mold 20, whereby the pattern of the mold 20 can be crimped to the substrate 30. As another example, the second crimping unit 822 can support the substrate 30, and the first crimping unit 821 presses the mold 20 toward the substrate 30, so that the pattern of the mold 20 can be crimped to the substrate 30.

這樣的第一壓接單元821及第二壓接單元822可以通過驅動部825相對於彼此升降，第一壓接單元821及第二壓接單元822升降的速度可以個別地進行控制。此外，第一壓接單元821及第二壓接單元822可以相對於框架810移動。換言之，第一壓接單元821及第二壓接單元822可以以支撐於框架810的狀態在框架810的內側升降。The first crimping unit 821 and the second crimping unit 822 can be raised and lowered relative to each other by the driving part 825, and the speed of raising and lowering the first crimping unit 821 and the second crimping unit 822 can be individually controlled. In addition, the first crimping unit 821 and the second crimping unit 822 can move relative to the frame 810. In other words, the first crimping unit 821 and the second crimping unit 822 can be raised and lowered inside the frame 810 while being supported by the frame 810.

另一方面，第一壓接單元821可以包括第一壓接體821a、第一支撐部821b、照射部821c、推擠防止部821d、第一導向部件821e以及固定件821f。On the other hand, the first crimping unit 821 may include a first crimping body 821a, a first supporting portion 821b, an irradiation portion 821c, a pushing preventing portion 821d, a first guide member 821e, and a fixing member 821f.

第一壓接體821a可以與第二壓接單元822的待後述的波紋管822b貼緊，且可以對粘接有模20的膜10加壓來將模20的圖案壓接於基板30。這樣的第一壓接體821a可以支撐於第一支撐部821b，且可以通過使第一支撐部821b升降的第一驅動器825a與第一支撐部821b一同升降。此外，第一壓接體821a可以支撐於第一支撐部821b，但第一壓接體821a也可以固定設置於第一支撐部821b。此外，第一壓接體821a可以通過第一驅動器825a朝向膜10下降，並在膜10的上側對膜10加壓來將模20加壓於基板30。The first crimping body 821a can be in close contact with the bellows 822b of the second crimping unit 822 to be described later, and can press the film 10 to which the mold 20 is adhered to crimp the pattern of the mold 20 to the substrate 30. Such a first crimping body 821a can be supported by the first support portion 821b, and can be raised and lowered together with the first support portion 821b by the first driver 825a that lifts the first support portion 821b. In addition, the first crimping body 821a may be supported by the first supporting portion 821b, but the first crimping body 821a may also be fixedly disposed on the first supporting portion 821b. In addition, the first crimping body 821a can be lowered toward the film 10 by the first driver 825a, and press the film 10 on the upper side of the film 10 to press the mold 20 against the substrate 30.

另一方面，可以在第一壓接體821a形成能夠插入待後述的第一壓接密封部件826a的第一密封槽821a-1。這樣的第一密封槽821a-1可以在第一壓接單元821與第二壓接單元822貼緊時與待後述的第二壓接單元822的第二密封槽822b-1的位置對應地形成於第一壓接體821a。On the other hand, the first pressure-bonding body 821a may be formed with a first sealing groove 821a-1 into which a first pressure-bonding sealing member 826a to be described later can be inserted. Such a first seal groove 821a-1 can be formed corresponding to the position of the second seal groove 822b-1 of the second crimping unit 822 to be described later when the first crimping unit 821 and the second crimping unit 822 are in close contact. In the first crimping body 821a.

第一支撐部821b可以支撐第一壓接體821a，且可以被第一驅動器825a支撐。此外，可以通過第一導向部件821e對第一支撐部821b的移動進行導向。換言之，第一導向部件821e以貫通的方式具備於第一支撐部821b，由此第一支撐部821b可以沿一方向（例如，圖7的上下方向）延伸的第一導向部件821e移動。如此，第一支撐部821b可以沿第一導向部件821e移動來相對於框架810移動。換言之，第一支撐部821b可以通過第一驅動器825a升降來與第一壓接體821a一同相對於框架810升降。The first support portion 821b may support the first crimping body 821a, and may be supported by the first driver 825a. In addition, the movement of the first support portion 821b can be guided by the first guide member 821e. In other words, the first guide member 821e is provided in the first support portion 821b in a penetrating manner, so that the first support portion 821b can move along the first guide member 821e extending in one direction (for example, the up-down direction in FIG. 7). In this way, the first support portion 821b can move along the first guide member 821e to move relative to the frame 810. In other words, the first support portion 821b can be raised and lowered relative to the frame 810 together with the first crimping body 821a by the first driver 825a being raised and lowered.

照射部821c可以使通過模20壓接於基板30的圖案硬化。當通過第一壓接體821a將模20的圖案壓接於基板30時，這樣的照射部821c可以將紫外線（Ultraviolet Ray）照射至基板30來使形成在基板30的樹脂硬化。這樣的照射部821c可以包括用於照射紫外線的紫外線光源（未圖示）及紫外線光源透射的光源（未圖示）。這樣的光源可以包括藍寶石等石英。如此，照射部821c可以將紫外線照射至基板30來使形成在基板30的樹脂硬化。此外，膜10、模20以及基板30可以構成為紫外線透射。此外，照射部821c可以具備於第一壓接體821a的一側。此外，照射部821c可以與膜10的上側接觸來對膜10加壓。The irradiation part 821c can harden the pattern crimped to the substrate 30 by the mold 20. When the pattern of the mold 20 is crimped to the substrate 30 by the first crimping body 821a, such an irradiation part 821c can irradiate ultraviolet rays (Ultraviolet Ray) to the substrate 30 to harden the resin formed on the substrate 30. Such an irradiation unit 821c may include an ultraviolet light source (not shown) for irradiating ultraviolet light and a light source (not shown) through which the ultraviolet light source transmits. Such a light source may include quartz such as sapphire. In this way, the irradiation portion 821c can irradiate the substrate 30 with ultraviolet rays to harden the resin formed on the substrate 30. In addition, the film 10, the mold 20, and the substrate 30 may be configured to transmit ultraviolet rays. In addition, the irradiating portion 821c may be provided on one side of the first crimping body 821a. In addition, the irradiation portion 821c may be in contact with the upper side of the film 10 to pressurize the film 10.

推擠防止部821d可以支撐第一支撐部821b來防止第一壓接體821a及第一支撐部821b由第二壓接單元822上升規定範圍以上。換言之，當第一壓接單元821支撐模20，且第二壓接單元822為了對基板30加壓而上升時，可以通過第二壓接單元822的加壓力防止第一壓接體821a及第一支撐部821b被推擠至上側。推擠防止部821d例如可以是缸體。這樣的推擠防止部821d可以包括支撐部件821d-1及旋轉部件821d-2。The pushing preventing portion 821d can support the first supporting portion 821b to prevent the first crimping body 821a and the first supporting portion 821b from rising by the second crimping unit 822 by more than a predetermined range. In other words, when the first crimping unit 821 supports the mold 20 and the second crimping unit 822 is raised to pressurize the substrate 30, the pressure of the second crimping unit 822 can prevent the first crimping body 821a and the second crimping body 821a and the second crimping unit 822. A supporting portion 821b is pushed to the upper side. The pushing prevention part 821d may be a cylinder, for example. Such a pushing preventing portion 821d may include a supporting member 821d-1 and a rotating member 821d-2.

支撐部件821d-1可以固定支撐於框架810，並支撐旋轉部件821d-2的一端部。The supporting member 821d-1 may be fixedly supported to the frame 810 and support one end of the rotating member 821d-2.

旋轉部件821d-2可以能夠旋轉地連接於支撐部件821d-1。這樣的旋轉部件821d-2的一端部可以支撐於支撐部件821d-1，另一端部可以選擇性地支撐固定件821f。例如，當第一壓接單元821向下側對模20加壓時，可以在固定件821f的上側對固定件821f支撐來防止第一支撐部821b向上側推擠規定範圍以上。此外，當第一壓接單元821對模20加壓後上升時，旋轉部件821d-2可以以從固定件821f分離的方式向一方向旋轉。The rotating member 821d-2 may be rotatably connected to the supporting member 821d-1. One end of such a rotating member 821d-2 may be supported by the supporting member 821d-1, and the other end may selectively support the fixing member 821f. For example, when the first crimping unit 821 presses the mold 20 downward, the fixing member 821f may be supported on the upper side of the fixing member 821f to prevent the first support portion 821b from pushing upward by more than a predetermined range. In addition, when the first crimping unit 821 presses the mold 20 and then rises, the rotating member 821d-2 may rotate in one direction in a manner of being separated from the fixing member 821f.

另一方面，推擠防止部821d可以與第二壓接單元822的加壓力對應地對第一支撐部821b加壓。例如，當第二壓接單元822對第一壓接體821a加壓的力增加時，推擠防止部821d對第一支撐部821b加壓的力也可以隨之增加。如此，推擠防止部821d基於第二壓接單元822的加壓力對第一支撐部821b可變地加壓，由此能夠防止圖案被不完全地壓接於基板30。可以設有複數個這樣的推擠防止部821d，且複數個推擠防止部821d可以在彼此不同的位置對第一支撐部821b加壓。例如，可以設有4個推擠防止部821d。但是，這只是一示例，可以設置有任意個數的推擠防止部821d。On the other hand, the pushing prevention portion 821d can pressurize the first support portion 821b corresponding to the pressing force of the second crimping unit 822. For example, when the force of the second crimping unit 822 to press the first crimping body 821a increases, the force of the pressing preventing portion 821d to press the first supporting portion 821b may also increase accordingly. In this way, the pressing preventing portion 821d variably presses the first support portion 821b based on the pressing force of the second crimping unit 822, thereby preventing the pattern from being incompletely crimped to the substrate 30. A plurality of such pushing prevention portions 821d may be provided, and the plurality of pushing prevention portions 821d may press the first support portion 821b at positions different from each other. For example, four push preventing parts 821d may be provided. However, this is only an example, and any number of push-prevention parts 821d may be provided.

第一導向部件821e可以對第一支撐部821b的移動進行導向。這樣的第一導向部件821e可以固定支撐於第一框架部811，且可以向上下方向延伸形成。此外，第一導向部件821e可以貫通第一支撐部821b來對第一支撐部821b的移動進行導向。例如，第一導向部件821e可以是向一方向延伸形成的條（bar）形態。第一支撐部821b沿這樣的支撐於框架810的第一導向部件821e移動，從而第一支撐部821b可以相對於框架810相對地升降。The first guide member 821e can guide the movement of the first support portion 821b. Such a first guide member 821e can be fixedly supported by the first frame portion 811, and can be formed to extend upward and downward. In addition, the first guide member 821e may penetrate the first support portion 821b to guide the movement of the first support portion 821b. For example, the first guide member 821e may be in the form of a bar extending in one direction. The first support portion 821b moves along such a first guide member 821e supported by the frame 810, so that the first support portion 821b can be raised and lowered relative to the frame 810.

固定件821f可以提供被推擠防止部821d加壓的部分。這樣的固定件821f的一側可以被第一支撐部821b固定支撐，另一側可以選擇性地支撐於推擠防止部821d。例如，固定件821f可以在第一壓接單元821與第二壓接單元822貼緊時被推擠防止部821d支撐。此時，可以通過推擠防止部821d防止固定設置於第一支撐部821b的第一壓接體821a被推擠。作為另一例，固定件821f可以在第一壓接單元821上升時與推擠防止部821d分離。此時，推擠防止部821d的旋轉部件821d-2可以向一方向旋轉來與固定件821f分離。The fixing member 821f may provide a portion pressurized by the pushing prevention portion 821d. One side of such a fixing member 821f can be fixedly supported by the first supporting portion 821b, and the other side can be selectively supported by the pushing preventing portion 821d. For example, the fixing member 821f may be supported by the pushing preventing portion 821d when the first crimping unit 821 and the second crimping unit 822 are in close contact. At this time, it is possible to prevent the first crimping body 821a fixedly provided to the first support portion 821b from being pushed by the pushing preventing portion 821d. As another example, the fixing member 821f may be separated from the pushing prevention portion 821d when the first crimping unit 821 rises. At this time, the rotating member 821d-2 of the pushing preventing portion 821d can rotate in one direction to be separated from the fixing member 821f.

第二壓接單元822可以包括第二壓接體822a、波紋管822b、升降缸822c、第二支撐部822d及第二導向部件822e。The second crimping unit 822 may include a second crimping body 822a, a bellows 822b, a lifting cylinder 822c, a second supporting portion 822d, and a second guide member 822e.

參照圖9a，第二壓接體822a可以支撐基板30，且可以支撐波紋管822b。這樣的第二壓接體822a可以被第二支撐部822d支撐，且可以通過使第二支撐部822d升降的第二驅動器825b與第二支撐部822d一同升降。第二壓接體822a可以包括基板安放部822a-1、波紋管安放部822a-2、吸附口822a-3以及排氣口822a-4。9a, the second crimping body 822a may support the substrate 30 and may support the corrugated tube 822b. Such a second crimping body 822a can be supported by the second support portion 822d, and can be raised and lowered together with the second support portion 822d by the second driver 825b that lifts the second support portion 822d. The second crimping body 822a may include a substrate seating portion 822a-1, a bellows seating portion 822a-2, a suction port 822a-3, and an exhaust port 822a-4.

基板安放部822a-1可以提供安放基板30的部分，且可以支撐基板30。此外，基板安放部822a-1可以從波紋管安放部822a-2凸出形成。從而，基板安放部822a-1可以比波紋管安放部822a-2更與膜10相鄰地配置。The substrate seating portion 822a-1 may provide a portion where the substrate 30 is seated, and may support the substrate 30. In addition, the substrate seating portion 822a-1 may be formed to protrude from the corrugated tube seating portion 822a-2. Therefore, the substrate seating portion 822a-1 may be arranged adjacent to the film 10 than the corrugated tube seating portion 822a-2.

波紋管安放部822a-2可以提供安放波紋管822b的部分。這樣的波紋管安放部822a-2可以支撐波紋管822b。此外，波紋管安放部822a-2可以形成有凸台，以安放波紋管822b。The bellows mounting part 822a-2 may provide a part where the bellows 822b is mounted. Such a bellows mounting portion 822a-2 can support the bellows 822b. In addition, the corrugated tube seating portion 822a-2 may be formed with a boss for seating the corrugated tube 822b.

吸附口822a-3可以配置為用於將基板30吸附於基板安放部822a-1。這樣的吸附口822a-3可以形成於基板安放部822a-1。例如，吸附口822a-3可以形成於基板安放部822a-1的中心部。這樣的吸附口822a-3可以與吸附通道824a連通，且吸附口822a-3周圍的氣體可以通過吸附通道824a被排出至外部。作為更詳細的示例，當基板30被安放在基板安放部822a-1時，吸附口822a-3的一側可以被基板30阻隔，而另一側可以與吸附通道824a連通。之後，當模20被加壓於基板30並從基板30分離模20時，可以通過吸附泵824b在吸附口822a-3周圍形成真空。因此，基板30可以被吸附於吸附口822a-3，從而不會從基板安放部822a-1脫離。The suction port 822a-3 may be configured to suction the substrate 30 to the substrate seating portion 822a-1. Such a suction port 822a-3 may be formed in the substrate mounting portion 822a-1. For example, the suction port 822a-3 may be formed in the central portion of the substrate mounting portion 822a-1. Such an adsorption port 822a-3 can communicate with the adsorption channel 824a, and the gas around the adsorption port 822a-3 can be discharged to the outside through the adsorption channel 824a. As a more detailed example, when the substrate 30 is placed on the substrate seating portion 822a-1, one side of the suction port 822a-3 may be blocked by the substrate 30, and the other side may communicate with the suction channel 824a. After that, when the mold 20 is pressurized on the substrate 30 and separated from the substrate 30, a vacuum can be formed around the suction port 822a-3 by the suction pump 824b. Therefore, the substrate 30 can be adsorbed to the suction port 822a-3 so as not to be separated from the substrate seating portion 822a-1.

排氣口822a-4可以配置為用於向外部排出殘留於波紋管822b的內部的氣體。這樣的排氣口822a-4可以提供向外部排出殘留於波紋管822b包圍基板30的空間的氣體的通道。此外，排氣口822a-4的一側可以與波紋管822b的內部空間連通，另一側可以與排氣部823連通。這樣的排氣口822a-4可以形成於波紋管安放部822a-2。The exhaust port 822a-4 may be arranged to exhaust the gas remaining inside the bellows 822b to the outside. Such an exhaust port 822a-4 can provide a passage for exhausting the gas remaining in the space surrounded by the substrate 30 by the bellows 822b to the outside. In addition, one side of the exhaust port 822a-4 may communicate with the inner space of the bellows 822b, and the other side may communicate with the exhaust portion 823. Such an exhaust port 822a-4 may be formed in the bellows mounting portion 822a-2.

參照圖9b，波紋管822b可以在使模20與基板30壓接時朝向第一壓接單元821伸縮來使基板30周圍的空間相對於外部密閉。這樣的波紋管822b可以配置為一端部支撐於波紋管安放部822a-2，另一端部能夠相對於第二壓接體822a伸縮。此外，波紋管822b可以配置為能夠伸縮。換言之，波紋管822b可以朝向第一壓接單元821伸長，以使基板30周圍的空間相對於外部密閉。此時，波紋管822b可以包圍基板30，且朝向波紋管822b的第一壓接單元821伸長的端部可以與第一壓接體821a貼緊。如此，波紋管822b與第一壓接體821a貼緊，從而基板30可以與外部阻隔。此外，波紋管822b可以在模20的圖案壓接於基板30時縮小。這樣的波紋管822b可以通過升降缸822c伸長或縮小。9b, the bellows 822b can expand and contract toward the first crimping unit 821 when the mold 20 is crimped with the substrate 30 to seal the space around the substrate 30 from the outside. Such a corrugated tube 822b can be configured such that one end is supported by the corrugated tube seating portion 822a-2, and the other end can be expanded and contracted with respect to the second crimping body 822a. In addition, the bellows 822b may be configured to be able to expand and contract. In other words, the corrugated tube 822b may be elongated toward the first crimping unit 821 to seal the space around the substrate 30 from the outside. At this time, the corrugated tube 822b may surround the substrate 30, and the extended end of the first crimping unit 821 of the corrugated tube 822b may be in close contact with the first crimping body 821a. In this way, the corrugated tube 822b is in close contact with the first crimping body 821a, so that the substrate 30 can be blocked from the outside. In addition, the corrugated tube 822b can be reduced when the pattern of the mold 20 is crimped to the substrate 30. Such a bellows 822b can be extended or contracted by the lifting cylinder 822c.

可以在這樣的波紋管822b形成能夠插入待後述的第二壓接密封部件826b的第二密封槽822b-1。這樣的第二密封槽822b-1可以在第一壓接單元821與第二壓接單元822貼緊時，與第一密封槽821a-1的位置對應地形成於波紋管822b。The second sealing groove 822b-1 into which the second crimping sealing member 826b described later can be inserted can be formed in such a bellows 822b. Such a second sealing groove 822b-1 may be formed in the corrugated tube 822b corresponding to the position of the first sealing groove 821a-1 when the first crimping unit 821 and the second crimping unit 822 are in close contact.

升降缸822c可以使波紋管822b的一端部升降來使波紋管822b伸縮。例如，升降缸822c可以在將圖案壓接於基板30時升降來使波紋管822b伸長，而在圖案被壓接於基板30後可以下降來使波紋管822b縮小。這樣的升降缸822c可以支撐於第二壓接體822a。The lifting cylinder 822c can raise and lower one end of the bellows 822b to expand and contract the bellows 822b. For example, the lifting cylinder 822c can be raised and lowered when the pattern is crimped to the substrate 30 to extend the corrugated tube 822b, and after the pattern is crimped to the substrate 30, it can be lowered to shrink the corrugated tube 822b. Such a lifting cylinder 822c can be supported by the second crimping body 822a.

第二支撐部822d可以支撐第二壓接體822a，且可以被第二驅動器825b支撐。此外，可以通過第二導向部件822e對第二支撐部822d的移動進行導向。換言之，第二支撐部822d能夠滑動移動地結合於第二導向部件822e，從而第二支撐部822d可以沿第二導向部件822e移動。如此，第二支撐部822d可以沿第二導向部件822e移動來相對於框架810移動。換言之，第二支撐部822d可以通過第二驅動器825b升降來與第二壓接體822a一同相對於框架810升降。The second supporting portion 822d may support the second crimping body 822a, and may be supported by the second driver 825b. In addition, the movement of the second support portion 822d can be guided by the second guide member 822e. In other words, the second support portion 822d is slidably coupled to the second guide member 822e, so that the second support portion 822d can move along the second guide member 822e. In this way, the second support portion 822d can move along the second guide member 822e to move relative to the frame 810. In other words, the second support portion 822d can be raised and lowered relative to the frame 810 together with the second crimping body 822a by the second driver 825b being raised and lowered.

第二導向部件822e可以對第二支撐部822d的移動進行導向。這樣的第二導向部件822e可以固定支撐於第二框架部812，且可以向上下方向延伸形成。例如，第二導向部件822e可以是向一方向延伸形成的軌條（rail）形態。第二支撐部822d沿這樣的支撐於框架810的第二導向部件822e部件移動，從而第二支撐部822d能夠相對於框架810升降。The second guide member 822e can guide the movement of the second support portion 822d. Such a second guide member 822e can be fixedly supported by the second frame portion 812, and can be formed to extend upward and downward. For example, the second guide member 822e may be in the form of a rail extending in one direction. The second support portion 822d moves along the second guide member 822e supported by the frame 810, so that the second support portion 822d can be raised and lowered relative to the frame 810.

排氣部823可以在使基板30周圍的空間相對於外部密閉時向外部排出殘留於波紋管822b的內部中密閉的空間的氣體。換言之，排氣部823可以向外部排出殘留於波紋管822b與第一壓接單元821之間，即波紋管822b包圍基板30的空間的氣體來在基板30周圍形成規定的真空狀態。這樣的排氣部823可以包括排氣通道823a及排氣泵823b。The exhaust part 823 can exhaust the gas remaining in the closed space inside the bellows 822b to the outside when the space around the substrate 30 is sealed from the outside. In other words, the exhaust part 823 can exhaust the gas remaining between the bellows 822b and the first crimping unit 821, that is, the space in which the bellows 822b surrounds the substrate 30, to form a predetermined vacuum state around the substrate 30. Such an exhaust part 823 may include an exhaust passage 823a and an exhaust pump 823b.

排氣通道823a可以提供用於從波紋管822b的內側流入的氣體向外部流動的通道。這樣的排氣通道823a的一側可以與波紋管822b的內側連通，另一側可以通過排氣泵823b與外部連通。此外，排氣泵823b可以通過排氣通道823a向外部移送波紋管822b的內側的氣體。The exhaust passage 823a may provide a passage for the gas flowing in from the inside of the bellows 822b to flow to the outside. One side of such an exhaust passage 823a may communicate with the inner side of the bellows 822b, and the other side may communicate with the outside through an exhaust pump 823b. In addition, the exhaust pump 823b can transfer the gas inside the bellows 822b to the outside through the exhaust passage 823a.

吸附部824可以在從基板30分離被壓接於基板30的模20時將基板30吸附於基板安放部822a-1，以防止基板30從基板安放部822a-1脫離。換言之，吸附部824可以在模分離單元830從基板30分離模20時吸附基板30，從而通過防止膜10的粘接防止基板30從基板安放部822a-1脫離。例如，吸附部824可以通過真空壓力來吸附基板30。但是，這只是一示例，本發明的思想並不因此而受限，可以採用能夠將基板30吸附於基板安放部822a-1的周知的技術。吸附部824可以包括吸附通道824a及吸附泵824b。The adsorption part 824 can adsorb the substrate 30 to the substrate seating part 822a-1 when separating the mold 20 crimped to the substrate 30 from the substrate 30, so as to prevent the substrate 30 from being detached from the substrate seating part 822a-1. In other words, the suction portion 824 can suction the substrate 30 when the mold separation unit 830 separates the mold 20 from the substrate 30, thereby preventing the substrate 30 from being separated from the substrate seating portion 822a-1 by preventing the adhesion of the film 10. For example, the adsorption part 824 can adsorb the substrate 30 by vacuum pressure. However, this is only an example, and the idea of the present invention is not limited by this, and a well-known technique capable of adsorbing the substrate 30 to the substrate mounting portion 822a-1 can be adopted. The adsorption part 824 may include an adsorption channel 824a and an adsorption pump 824b.

吸附通道824a可以提供用於從基板安放部822a-1周圍流入的氣體通過吸附泵824b向外部流動的通道。這樣的吸附通道824a的一側可以通過吸附口822a-3與基板安放部822a-1的周圍連通，另一側可以通過吸附泵824b與外部連通。例如，當基板30被安放在基板安放部822a-1時，吸附通道824a的一側可以被基板30阻隔，而另一側可以與外部連通。此外，當基板30的一部分從基板安放部822a-1隔開時，吸附通道824a可以與波紋管822b的內部連通。The adsorption channel 824a may provide a channel for the gas flowing in from around the substrate seating portion 822a-1 to flow to the outside through the adsorption pump 824b. One side of the adsorption channel 824a can communicate with the periphery of the substrate seating portion 822a-1 through the adsorption port 822a-3, and the other side can communicate with the outside through the adsorption pump 824b. For example, when the substrate 30 is placed on the substrate seating portion 822a-1, one side of the adsorption channel 824a may be blocked by the substrate 30, and the other side may communicate with the outside. In addition, when a part of the substrate 30 is partitioned from the substrate seating portion 822a-1, the suction channel 824a may communicate with the inside of the corrugated tube 822b.

吸附泵824b可以向外部移送基板安放部822a-1周圍的氣體。例如，吸附泵824b可以是真空泵。從而，通過由吸附泵824b生成的真空，可以在吸附口822a-3周圍産生真空，可以通過這樣的真空壓力將基板30吸附於基板安放部822a-1。從而，當通道824a的一側通過吸附口822a-3與基板30的周圍連通時，可以通過吸附泵824b將基板30吸附於吸附口822a-3。The adsorption pump 824b can transfer the gas around the substrate mounting portion 822a-1 to the outside. For example, the adsorption pump 824b may be a vacuum pump. Therefore, the vacuum generated by the suction pump 824b can generate a vacuum around the suction port 822a-3, and the substrate 30 can be suctioned to the substrate mounting portion 822a-1 by such a vacuum pressure. Therefore, when one side of the channel 824a communicates with the periphery of the substrate 30 through the adsorption port 822a-3, the substrate 30 can be adsorbed to the adsorption port 822a-3 by the adsorption pump 824b.

驅動部825可以使第一壓接單元821及第二壓接單元822相對於彼此移動。這樣的驅動部825可以包括以使第一壓接單元821移動的方式進行驅動的時第一驅動器825a、以及以使第二壓接單元822移動的方式進行驅動的第二驅動器825b。The driving part 825 can move the first crimping unit 821 and the second crimping unit 822 relative to each other. Such a driving part 825 may include a first driver 825a that drives the first crimping unit 821 and a second driver 825b that drives the second crimping unit 822.

第一驅動器825a可以使第一壓接單元821升降，且可以根據第一壓接單元821的位置調節第一壓接單元821移動的速度。此外，第二驅動器825b可以使第二壓接單元822升降，且可以根據第二壓接單元822的位置調節第二壓接單元822移動的速度。關於如此由第一驅動器825a及第二驅動器825b根據第一壓接單元821及第二壓接單元822的位置調節速度的配置，將在後面進行描述。The first driver 825a can raise and lower the first crimping unit 821, and can adjust the moving speed of the first crimping unit 821 according to the position of the first crimping unit 821. In addition, the second driver 825b can lift the second crimping unit 822, and can adjust the moving speed of the second crimping unit 822 according to the position of the second crimping unit 822. The configuration of adjusting the speed by the first driver 825a and the second driver 825b according to the positions of the first crimping unit 821 and the second crimping unit 822 will be described later.

再次參照圖9a，壓接密封部826可以在第一壓接單元821與第二壓接單元822相對於彼此進行壓接時使第一壓接單元821與第二壓接單元822之間密閉。這樣的壓接密封部826可以使第一壓接單元821與第二壓接單元822之間密閉來阻隔基板30的周圍與外部。壓接密封部826可以包括第一壓接密封部件826a及第二壓接密封部件826b。9a again, the crimping sealing portion 826 can seal the first crimping unit 821 and the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are crimped relative to each other. Such a crimping sealing portion 826 can seal the first crimping unit 821 and the second crimping unit 822 to block the periphery of the substrate 30 from the outside. The crimping and sealing part 826 may include a first crimping and sealing member 826a and a second crimping and sealing member 826b.

第一壓接密封部件826a可以插入配置於形成在第一壓接單元821的第一密封槽821a-1。此外，第二壓接密封部件826b可以插入配置於形成在第二壓接單元822的第二密封槽822b-1。這樣的第一壓接密封部件826a和第二壓接密封部件826b可以配置為彼此相向。換言之，當第一壓接單元821與第二壓接單元822相互進行壓接時，第一壓接密封部件826a與第二壓接密封部件826b可以對彼此加壓，且可以密封第一壓接單元821與第二壓接單元822之間的間隙。The first crimping sealing member 826a may be inserted and arranged in the first sealing groove 821a-1 formed in the first crimping unit 821. In addition, the second crimping sealing member 826b may be inserted and arranged in the second sealing groove 822b-1 formed in the second crimping unit 822. Such a first crimping sealing member 826a and a second crimping sealing member 826b may be arranged to face each other. In other words, when the first crimping unit 821 and the second crimping unit 822 are crimped to each other, the first crimping sealing member 826a and the second crimping sealing member 826b can pressurize each other, and can seal the first crimping The gap between the unit 821 and the second crimping unit 822.

另一方面，當第一壓接密封部件826a與第二壓接密封部件826b相互貼緊時，膜10可以介於第一壓接密封部件826a與第二壓接密封部件826b之間。此外，第一壓接密封部件826a可以在膜10的上部對膜10，第二壓接密封部件826b可以在膜10的下部對膜10加壓。此時，第一壓接密封部件826a及第二壓接密封部件826b可以形成為具有既防止第一壓接密封部件826a與第二壓接密封部件826b的加壓使膜10起皺又能夠有效地密封第一壓接單元821與第二壓接單元822之間的間隙的形狀。On the other hand, when the first crimping sealing member 826a and the second crimping sealing member 826b are in close contact with each other, the film 10 may be interposed between the first crimping sealing member 826a and the second crimping sealing member 826b. In addition, the first crimping and sealing member 826a may press the film 10 at the upper part of the film 10, and the second crimping and sealing member 826b may press the film 10 at the lower part of the film 10. At this time, the first crimping sealing member 826a and the second crimping sealing member 826b can be formed so as to prevent the film 10 from wrinkling due to the pressure of the first crimping sealing member 826a and the second crimping sealing member 826b. The shape of the gap between the first crimping unit 821 and the second crimping unit 822 is ground-sealed.

例如，當第一壓接密封部件826a及第二壓接密封部件826b形成為相同的O型環（O-ring）形狀時，第一壓接密封部件826a與第二壓接密封部件826b貼緊時可能會使膜10起皺。作為另一示例，當第一壓接密封部件826a與第二壓接密封部件826b相互接觸的面形成為平面形狀時，可以防止膜10起皺。然而，可能會因第一壓接密封部件826a與第二壓接密封部件826b之間的加壓力較弱而無法正常地對第一壓接單元821與第二壓接單元822之間進行密封。因此，第一壓接密封部件826a與第二壓接密封部件826b有必要形成為彼此不同的形狀，以便既防止膜10起皺又使波紋管822b的內部空間密閉。例如，第一壓接密封部件826a及第二壓接密封部件826b中的某一個可以在不與另一個貼緊時具有平面形狀，另一個可以在不與所述某一個貼緊時具有O型環等圓弧形狀。For example, when the first crimping sealing member 826a and the second crimping sealing member 826b are formed in the same O-ring shape, the first crimping sealing member 826a and the second crimping sealing member 826b are in close contact At times, the film 10 may wrinkle. As another example, when the mutually contacting surfaces of the first crimping sealing member 826a and the second crimping sealing member 826b are formed in a planar shape, the film 10 can be prevented from wrinkling. However, the pressure between the first crimping sealing member 826a and the second crimping sealing member 826b may be weak, and the first crimping unit 821 and the second crimping unit 822 may not be properly sealed. Therefore, it is necessary for the first crimping sealing member 826a and the second crimping sealing member 826b to be formed in different shapes from each other in order to prevent the film 10 from wrinkling and to seal the internal space of the corrugated tube 822b. For example, one of the first crimping sealing member 826a and the second crimping sealing member 826b may have a flat shape when not in close contact with the other, and the other may have an O-shape when not in close contact with the one. Circular arc shape such as ring.

如此，壓接密封部826具有防止膜10起皺的效果。In this way, the crimping sealing portion 826 has an effect of preventing the film 10 from wrinkling.

參照圖10至圖12，模分離單元830可以向一方向（例如，圖10的左右方向）移動，以從基板30分離被壓接於基板30的模20。這樣的模分離單元830可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下向基板30側移動來從基板30分離模20。此外，在第一壓接單元821與第二壓接單元822之間，模分離單元830可以將基板30移動至壓接於模20的虛擬的空間來從基板30分離模20。模分離單元830可以包括第一輥部831、第二輥部832、輥支撐部833、輥導向部件834以及輥驅動器835。Referring to FIGS. 10 to 12, the mold separating unit 830 may move in one direction (for example, the left-right direction of FIG. 10) to separate the mold 20 crimped to the substrate 30 from the substrate 30. Such a mold separation unit 830 can move to the substrate 30 side to separate the mold 20 from the substrate 30 in a state where one or more of the film supply part 400 and the film recovery part 900 is not rotated to stop the movement of the film 10. In addition, between the first crimping unit 821 and the second crimping unit 822, the mold separating unit 830 can move the substrate 30 to a virtual space crimped to the mold 20 to separate the mold 20 from the substrate 30. The mold separation unit 830 may include a first roller part 831, a second roller part 832, a roller support part 833, a roller guide member 834, and a roller driver 835.

第一輥部831可以在膜10的兩面中未粘接有模20的一面（非粘接面）支撐膜10。這樣的第一輥部831可以被輥支撐部833支撐，且與輥支撐部833一同向左右方向移動。The first roller portion 831 may support the film 10 on a surface (non-adhesive surface) on which the mold 20 is not adhered among both surfaces of the film 10. Such a first roller part 831 can be supported by the roller support part 833 and can move in the left-right direction together with the roller support part 833.

第二輥部832可以在膜10的兩面中粘接有模20的面（粘接面）側支撐膜10。此外，第二輥部832可以以使膜10向包圍第一輥部831的一部分的方向彎曲的方式支撐膜10。這樣的第二輥部832可以被輥支撐部833支撐，且與輥支撐部833一同向左右方向移動。此外，第二輥部832可以以與第一輥部831具有規定的高度差的方式支撐於輥支撐部833。如此，第一輥部831與第二輥部832具有高度差地支撐膜10的兩面，從而可以從基板30分離模20。此外，第一輥部831的旋轉中心軸與第二輥部832的旋轉中心軸的距離可以形成得比模20的長度長。這可以防止通過第一輥部831從基板30分離的模20與第二輥部832接觸。The second roller 832 can support the film 10 on the side (adhesive surface) where the mold 20 is adhered on both surfaces of the film 10. In addition, the second roller portion 832 may support the film 10 so as to bend the film 10 in a direction surrounding a part of the first roller portion 831. Such a second roller part 832 can be supported by the roller support part 833 and move in the left-right direction together with the roller support part 833. In addition, the second roller portion 832 may be supported by the roller support portion 833 with a predetermined height difference from the first roller portion 831. In this way, the first roller portion 831 and the second roller portion 832 support both surfaces of the film 10 with a height difference, so that the mold 20 can be separated from the substrate 30. In addition, the distance between the rotation center axis of the first roller portion 831 and the rotation center axis of the second roller portion 832 may be formed to be longer than the length of the mold 20. This can prevent the mold 20 separated from the substrate 30 by the first roller part 831 from contacting the second roller part 832.

輥支撐部833可以支撐第一輥部831及第二輥部832，且可以被輥驅動器835支撐。此外，輥支撐部833可以通過輥驅動器835向左右方向移動，且可以由輥導向部件834對輥支撐部833的移動進行導向。這樣的輥支撐部833可以沿輥導向部件834移動來相對於框架810移動。換言之，輥支撐部833可以通過輥驅動器835移動來與第一輥部831、第二輥部832一同相對於框架810移動。The roller support part 833 can support the first roller part 831 and the second roller part 832 and can be supported by the roller driver 835. In addition, the roller support portion 833 can be moved in the left-right direction by the roller driver 835, and the movement of the roller support portion 833 can be guided by the roller guide member 834. Such a roller support part 833 can move along the roller guide 834 to move relative to the frame 810. In other words, the roller support portion 833 can move with the first roller portion 831 and the second roller portion 832 relative to the frame 810 by the movement of the roller driver 835.

輥導向部件834可以對輥支撐部833的移動進行導向。這樣的輥導向部件834可以固定支撐於第三框架部813，且可以向左右方向延伸形成。例如，輥導向部件834可以是向一方向延伸形成的軌條（rail）形態。輥支撐部833沿這樣的支撐於框架810的輥導向部件834部件移動，從而輥支撐部833能夠相對於框架810升降。The roller guide member 834 can guide the movement of the roller support part 833. Such a roller guide member 834 can be fixedly supported by the third frame portion 813 and can be formed to extend in the left-right direction. For example, the roller guide member 834 may be in the form of a rail extending in one direction. The roller support part 833 moves along such a roller guide member 834 member supported by the frame 810, so that the roller support part 833 can be raised and lowered with respect to the frame 810.

輥驅動器835可以使輥支撐部833向一方向移動，以從基板30分離模20。這樣的輥驅動器835可以支撐於框架810，且可以支撐輥支撐部833。如此，輥驅動器835使輥支撐部833移動，從而能夠使第一輥部831、第二輥部832朝向模20移動。The roller driver 835 may move the roller supporting part 833 in one direction to separate the mold 20 from the substrate 30. Such a roller driver 835 can be supported by the frame 810 and can support the roller support part 833. In this way, the roller driver 835 moves the roller supporting portion 833 so that the first roller portion 831 and the second roller portion 832 can be moved toward the mold 20.

檢測單元840可以檢測第一壓接單元821、第二壓接單元822及模分離單元830的位置。這樣的檢測單元840可以檢測第一壓接單元821、第二壓接單元822及模分離單元830的第一停止位置、第二停止位置及減速位置，且可以將檢測到的位置資訊傳遞至控制部。這樣的檢測單元840可以包括第1感測器部841、第2感測器部842、以及第3感測器部843。The detecting unit 840 can detect the positions of the first crimping unit 821, the second crimping unit 822, and the mold separating unit 830. Such a detection unit 840 can detect the first stop position, the second stop position, and the deceleration position of the first crimping unit 821, the second crimping unit 822, and the mold separation unit 830, and can transmit the detected position information to the control unit. Such a detection unit 840 may include a first sensor part 841, a second sensor part 842, and a third sensor part 843.

再次參照圖8和圖9，第1感測器部841可以檢測第一壓接單元821的第一停止位置、第二停止位置及減速位置，且可以將檢測到的位置資訊傳遞至控制部。這樣的第1感測器部841可以包括第1-1感測器841a、第1-2感測器841b、以及第1-3感測器841c。8 and 9 again, the first sensor part 841 can detect the first stop position, the second stop position, and the deceleration position of the first crimping unit 821, and can transmit the detected position information to the control part. Such a first sensor part 841 may include a 1-1 sensor 841a, a 1-2 sensor 841b, and a 1-3 sensor 841c.

第1感測器部841的第1-1感測器841a可以檢測第一壓接單元821的第一停止位置。這裡，第1-1感測器841a可以被命名為第一壓接單元821的第一停止位置檢測感測器841a。此外，第一壓接單元821的第一停止位置可以被命名為第一壓接步驟開始位置，第1感測器部841的第1-1感測器841a可以被命名為第一壓接步驟開始位置檢測感測器841a。此外，第一停止位置指第一壓接單元821朝向膜10移動之前的位置，即第一壓接單元821的原位置。當第一壓接單元821為原位置狀態時，這樣的第1感測器部841的第1-1感測器841a可以檢測第一壓接單元821的位置。此外，第1感測器部841的第1-1感測器841a可以支撐於框架810。The 1-1 sensor 841a of the first sensor part 841 can detect the first stop position of the first crimping unit 821. Here, the 1-1th sensor 841a may be named as the first stop position detection sensor 841a of the first crimping unit 821. In addition, the first stop position of the first crimping unit 821 may be named the first crimping step start position, and the 1-1 sensor 841a of the first sensor part 841 may be named the first crimping step The position detection sensor 841a is started. In addition, the first stop position refers to a position before the first crimping unit 821 moves toward the film 10, that is, the original position of the first crimping unit 821. When the first crimping unit 821 is in the home position, the 1-1st sensor 841a of the first sensor portion 841 can detect the position of the first crimping unit 821. In addition, the 1-1 sensor 841a of the first sensor part 841 may be supported by the frame 810.

第1感測器部841的第1-2感測器841b可以檢測第一壓接單元821的第二停止位置。這裡，第1-2感測器841b可以被命名為第一壓接單元821的第二停止位置檢測感測器841b。此外，第一壓接單元821的第二停止位置可以被命名為第二壓接步驟結束位置，第1感測器部841的第1-2感測器841b可以被命名為第二壓接步驟結束位置檢測感測器841b。此外，第二停止位置指第一壓接單元821朝向膜10移動並由第一壓接單元821將模20加壓於基板30後，即與第二壓接單元822貼緊的位置。從而，第1-2感測器841b可以在第一壓接單元821與第二壓接單元822貼緊時檢測第一壓接單元821的位置。此外，第1-2感測器841b可以支撐於框架810。The 1-2 sensor 841b of the first sensor part 841 can detect the second stop position of the first crimping unit 821. Here, the 1-2th sensor 841b may be named as the second stop position detection sensor 841b of the first crimping unit 821. In addition, the second stop position of the first crimping unit 821 may be named as the end position of the second crimping step, and the 1-2 sensor 841b of the first sensor part 841 may be named as the second crimping step The position detection sensor 841b is ended. In addition, the second stop position refers to a position where the first crimping unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first crimping unit 821, that is, a position that is in close contact with the second crimping unit 822. Therefore, the 1-2 first sensor 841b can detect the position of the first crimping unit 821 when the first crimping unit 821 is in close contact with the second crimping unit 822. In addition, the 1-2th sensor 841b may be supported by the frame 810.

第1感測器部841的第1-3感測器841c可以檢測第一壓接單元821的減速位置。這裡，第1-3感測器841c可以被命名為第一壓接單元821的減速位置檢測感測器841c。此外，第一壓接單元821的減速位置可以被命名為第一減速位置，第1感測器部841的第1-3感測器841c以被命名為第一減速檢測感測器841c。此外，減速位置指第一壓接單元821從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前第一壓接單元821開始減速的位置。此外，減速位置指第一壓接單元821朝向膜10移動並由第一壓接單元821將模20加壓於基板30之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外，第1-3感測器841c可以以配置於第1-1感測器841a與第1-2感測器841b之間的方式支撐於框架810。The 1-3 sensor 841c of the first sensor part 841 can detect the deceleration position of the first crimping unit 821. Here, the 1-3th sensor 841c may be named as the deceleration position detection sensor 841c of the first crimping unit 821. In addition, the deceleration position of the first crimping unit 821 may be named the first deceleration position, and the 1-3 sensors 841c of the first sensor part 841 may be named the first deceleration detection sensor 841c. In addition, the deceleration position refers to a position where the first crimping unit 821 starts to decelerate before reaching the second stopping position during the movement of the first crimping unit 821 from the first stopping position to the second stopping position. In addition, the deceleration position refers to a position before the first crimping unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first crimping unit 821. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 1-3th sensor 841c may be supported by the frame 810 in a manner of being disposed between the 1-1th sensor 841a and the 1-2th sensor 841b.

參照圖13，第2感測器部842可以檢測第二壓接單元822的第一停止位置、第二停止位置以及減速位置，且可以將檢測到的位置資訊傳遞至控制部。這樣的第2感測器部842可以包括第2-1感測器842a、第2-2感測器842b，第2-3感測器842c。13, the second sensor part 842 can detect the first stop position, the second stop position, and the deceleration position of the second crimping unit 822, and can transmit the detected position information to the control part. Such a second sensor unit 842 may include a 2-1 sensor 842a, a 2-2 sensor 842b, and a 2-3 sensor 842c.

第2感測器部842的第2-1感測器842a可以檢測第二壓接單元822的第一停止位置。這裡，第2-1感測器842a可以被命名為第二壓接單元822的第一停止位置檢測感測器842a。此外，第二壓接單元822的第一停止位置可以被命名為第二壓接步驟開始位置，第2感測器部842的第2-1感測器842a可以被命名為第二壓接步驟開始位置檢測感測器842a。此外，第一停止位置指第二壓接單元822朝向膜10移動之前的位置，即第二壓接單元822的原位置。當第二壓接單元822為原位置狀態時，這樣的第2感測器部842的第2-1感測器842a可以檢測第二壓接單元822的位置。此外，第2感測器部842的 第2-1感測器842a可以支撐於框架810。The 2-1 sensor 842a of the second sensor part 842 can detect the first stop position of the second crimping unit 822. Here, the 2-1th sensor 842a may be named as the first stop position detection sensor 842a of the second crimping unit 822. In addition, the first stop position of the second crimping unit 822 may be named the second crimping step start position, and the 2-1 sensor 842a of the second sensor part 842 may be named the second crimping step Start position detection sensor 842a. In addition, the first stop position refers to a position before the second crimping unit 822 moves toward the film 10, that is, the original position of the second crimping unit 822. When the second crimping unit 822 is in the original position, the 2-1st sensor 842a of the second sensor portion 842 can detect the position of the second crimping unit 822. In addition, the 2-1 sensor 842a of the second sensor portion 842 may be supported by the frame 810.

第2感測器部842的第2-2感測器842b可以檢測第二壓接單元822的第二停止位置。這裡，第2-2感測器842b可以被命名為第二壓接單元822的第二停止位置檢測感測器842b。此外，第二壓接單元822的第二停止位置可以被命名為第二壓接步驟結束位置，第2感測器部842的第2-2感測器842b可以被命名為第二壓接步驟結束位置檢測感測器842b。此外，第二停止位置指第二壓接單元822朝向膜10移動並由第二壓接單元822將基板30加壓於模20後，即與第一壓接單元821貼緊的位置。從而，第2感測器部842的第2-2感測器842b可以在第一壓接單元821與第二壓接單元822貼緊時檢測第二壓接單元822的位置。此外，第2感測器部842的第2-2感測器842b可以支撐於框架810。The 2-2 sensor 842b of the second sensor part 842 can detect the second stop position of the second crimping unit 822. Here, the 2-2th sensor 842b may be named as the second stop position detection sensor 842b of the second crimping unit 822. In addition, the second stop position of the second crimping unit 822 may be named the end position of the second crimping step, and the 2-2 sensor 842b of the second sensor part 842 may be named the second crimping step End position detection sensor 842b. In addition, the second stop position refers to a position where the second crimping unit 822 moves toward the film 10 and the substrate 30 is pressed against the mold 20 by the second crimping unit 822, that is, a position that is in close contact with the first crimping unit 821. Therefore, the 2-2 sensor 842b of the second sensor portion 842 can detect the position of the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are in close contact. In addition, the 2-2 sensor 842b of the second sensor part 842 may be supported by the frame 810.

第2感測器部842的第2-3感測器842c可以檢測第二壓接單元822的減速位置。這裡，第2-3感測器842c可以被命名為第二壓接單元822的減速位置檢測感測器842c。此外，第二壓接單元822的減速位置可以被命名為第二減速位置，第2感測器部842的第2-3感測器842c可以被命名為第二減速檢測感測器842c。此外，減速位置指第二壓接單元822從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前第二壓接單元822開始減速的位置。此外，減速位置指第二壓接單元822朝向膜10移動並由第二壓接單元822將基板30加壓於模20之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外，第2感測器部842的第2-3感測器842c可以以配置於第2-1感測器842a與第2-2感測器842b之間的方式支撐於框架810。此外，第2感測器部842的第2-3感測器842c可以與波紋管822b的伸縮連動。例如，當先檢測第2感測器部842的第2-1感測器842a後檢測第2感測器部842的第2-3感測器842c時，波紋管822b可以伸長；當先檢測第2感測器部842的第2-2感測器842b後檢測第2感測器部842的第2-3感測器842c時，波紋管822b可以縮小。The 2-3 sensor 842c of the second sensor part 842 can detect the deceleration position of the second crimping unit 822. Here, the 2-3th sensor 842c may be named as the deceleration position detection sensor 842c of the second crimping unit 822. In addition, the deceleration position of the second crimping unit 822 may be named the second deceleration position, and the 2-3 sensor 842c of the second sensor part 842 may be named the second deceleration detection sensor 842c. In addition, the deceleration position refers to a position where the second crimping unit 822 starts to decelerate before reaching the second stopping position during the movement of the second crimping unit 822 from the first stopping position to the second stopping position. In addition, the deceleration position refers to a position before the second crimping unit 822 moves toward the film 10 and the substrate 30 is pressed against the mold 20 by the second crimping unit 822. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 2-3 sensor 842c of the second sensor part 842 may be supported by the frame 810 so as to be arranged between the 2-1 sensor 842a and the 2-2 sensor 842b. In addition, the 2-3 sensor 842c of the second sensor part 842 can be linked to the expansion and contraction of the bellows 822b. For example, when the 2-1 sensor 842a of the second sensor part 842 is detected first and then the 2-3 sensor 842c of the second sensor part 842 is detected, the bellows 822b can be extended; When the 2-2 sensor 842b of the sensor part 842 detects the 2-3 sensor 842c of the second sensor part 842, the bellows 822b can be reduced.

參照圖14，第3感測器部843可以檢測模分離單元830的第三停止位置、第二停止位置及減速位置，且可以將檢測到的位置資訊傳遞至控制部。這樣的第3感測器部843可以包括第3-1感測器843a、第3-2感測器843b、第3-3感測器843c。14, the third sensor unit 843 can detect the third stop position, the second stop position, and the deceleration position of the mold separation unit 830, and can transmit the detected position information to the control unit. Such a third sensor unit 843 may include a 3-1 sensor 843a, a 3-2 sensor 843b, and a 3-3 sensor 843c.

第3感測器部843的第3-1感測器843a可以檢測模分離單元830的第一停止位置。這裡，第3-1感測器843a可以被命名為模分離單元830的第一停止位置檢測感測器843a。此外，模分離單元830的第一停止位置可以被命名為分離步驟開始位置，第3感測器部843的第3-1感測器843a可以被命名為分離步驟開始位置檢測感測器843a。此外，第一停止位置指模分離單元830朝向模20移動之前的位置，即模分離單元830的原位置（參照圖14（a））。當模分離單元830為原位置狀態時，這樣的第3感測器部843的第3-1感測器843a可以檢測模分離單元830的位置。此外，第3感測器部843的第3-1感測器843a可以支撐於框架810。The 3-1 sensor 843 a of the third sensor portion 843 can detect the first stop position of the mold separation unit 830. Here, the 3-1 sensor 843a may be named as the first stop position detection sensor 843a of the mold separation unit 830. In addition, the first stop position of the mold separation unit 830 may be named the separation step start position, and the 3-1 sensor 843a of the third sensor section 843 may be named the separation step start position detection sensor 843a. In addition, the first stop position refers to a position before the mold separation unit 830 moves toward the mold 20, that is, the original position of the mold separation unit 830 (refer to FIG. 14(a)). When the mold separation unit 830 is in the original position, the 3-1 sensor 843a of the third sensor section 843 can detect the position of the mold separation unit 830. In addition, the 3-1 sensor 843 a of the third sensor portion 843 may be supported by the frame 810.

第3感測器部843的第3-2感測器843b可以檢測模分離單元830的第二停止位置。這裡，第3-2感測器843b可以被命名為模分離單元830的第二停止位置檢測感測器843b。此外，模分離單元830的第二停止位置可以被命名為分離步驟結束位置，第3感測器部843的第3-2感測器843b可以被命名為分離步驟結束位置檢測感測器843b。此外，第二停止位置指模分離單元830從基板30分離模20後的位置（參照圖14（b））。此外，第3感測器部843的第3-2感測器843b可以支撐於框架810。The 3-2 sensor 843 b of the third sensor part 843 can detect the second stop position of the mold separation unit 830. Here, the 3-2th sensor 843b may be named as the second stop position detection sensor 843b of the mold separation unit 830. In addition, the second stop position of the mold separation unit 830 may be named the separation step end position, and the 3-2 sensor 843b of the third sensor section 843 may be named the separation step end position detection sensor 843b. In addition, the second stop position refers to a position after the mold separation unit 830 separates the mold 20 from the substrate 30 (refer to FIG. 14( b )). In addition, the 3-2 sensor 843b of the third sensor portion 843 may be supported by the frame 810.

第3感測器部843的第3-3感測器843c可以檢測模分離單元830的減速位置。這裡，第3-3感測器843c可以被命名為模分離單元830的減速位置檢測感測器843c。此外，模分離單元830的減速位置可以被命名為第三減速位置，第3感測器部843的第3-3感測器843c可以被命名為第三減速檢測感測器843c。此外，減速位置指模分離單元830從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前模分離單元830開始減速的位置。此外，減速位置指模分離單元830從基板30分離模20之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外，第3感測器部843的第3-3感測器843c可以以配置於第3-1感測器843a與第3-2感測器843b之間的方式支撐於框架810。The 3-3 sensor 843c of the third sensor section 843 can detect the deceleration position of the mold separation unit 830. Here, the 3-3 sensor 843c may be named the deceleration position detection sensor 843c of the mold separation unit 830. In addition, the deceleration position of the mold separation unit 830 may be named the third deceleration position, and the 3-3 sensor 843c of the third sensor part 843 may be named the third deceleration detection sensor 843c. In addition, the deceleration position refers to a position where the mold separation unit 830 starts to decelerate before reaching the second stop position during the movement of the mold separation unit 830 from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the mold separation unit 830 separates the mold 20 from the substrate 30. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 3-3 sensor 843c of the third sensor portion 843 may be supported by the frame 810 so as to be arranged between the 3-1 sensor 843a and the 3-2 sensor 843b.

如前述，檢測單元840可以檢測壓接模組820及模分離單元830的移動開始的位置、減速開始的位置、移動結束的位置，且可以將檢測到的位置資訊傳遞至控制部。如此，由檢測單元840檢測到的位置資訊可以利用於控制驅動部825及輥驅動器835。此外，壓接模組820及模分離單元830可以對第一停止位置至減速位置進行移動速度的加速，並對減速位置至第二停止位置進行移動速度的減速。從而，可以通過檢測單元840調節壓接模組820及模分離單元830的移動速度。此外，可以僅在製程實際進行的位置進行對移動速度進行減速來提高製程的效率。此外，當第一壓接單元821及第二壓接單元822相對於彼此移動並相互貼緊時，可以通過檢測單元840調節第一壓接單元821及第二壓接單元822的移動速度，從而可以同時移動第一壓接單元821和第二壓接單元822，而不是依次移動第一壓接單元821和第二壓接單元822，由此能夠製程的效率。如此，檢測單元840僅在製程實際進行的位置進行移動速度的減速，從而具有能夠提高製程的效率的效果。As mentioned above, the detection unit 840 can detect the position where the movement of the crimping module 820 and the mold separation unit 830 starts, the position where the deceleration starts, and the position where the movement ends, and can transmit the detected position information to the control unit. In this way, the position information detected by the detection unit 840 can be used to control the driving part 825 and the roller driver 835. In addition, the crimping module 820 and the mold separating unit 830 can accelerate the movement speed from the first stop position to the deceleration position, and decelerate the movement speed from the deceleration position to the second stop position. Thus, the moving speed of the crimping module 820 and the mold separating unit 830 can be adjusted by the detecting unit 840. In addition, the movement speed can be decelerated only at the position where the process is actually performed to improve the efficiency of the process. In addition, when the first crimping unit 821 and the second crimping unit 822 move relative to each other and are in close contact with each other, the moving speed of the first crimping unit 821 and the second crimping unit 822 can be adjusted by the detecting unit 840, thereby The first crimping unit 821 and the second crimping unit 822 can be moved at the same time, instead of moving the first crimping unit 821 and the second crimping unit 822 sequentially, thereby enabling the efficiency of the manufacturing process. In this way, the detection unit 840 only decelerates the moving speed at the position where the process is actually performed, thereby having the effect of improving the efficiency of the process.

位置檢測部（未圖示）可以檢測模20的位置，且可以將檢測到的位置資訊傳遞至控制部。如此，由位置檢測部檢測到的模20的位置資訊可以利用於控制膜供給部400及膜回收部900。從而，當模20被移送而後位於脫模部700或轉印部800時，可以由位置檢測部對此進行檢測，並中斷膜供給部400及膜回收部900中的一個以上的旋轉來中止模20的移送。此外，位置檢測部可以配置於膜供給部400、保護膜回收部600、脫模部700、轉印部800、膜回收部900中的至少一部分之間。例如，位置檢測部可以通過識別膜10的標記的光感測器來檢測模20的位置，或通過光學設備來檢測模20的位置。The position detection unit (not shown) can detect the position of the mold 20, and can transmit the detected position information to the control unit. In this way, the position information of the mold 20 detected by the position detection unit can be used to control the film supply unit 400 and the film recovery unit 900. Therefore, when the mold 20 is transferred and then located in the demolding section 700 or the transfer section 800, it can be detected by the position detection section, and the rotation of one or more of the film supply section 400 and the film recovery section 900 can be interrupted to stop the mold. 20's transfer. In addition, the position detection part may be arranged between at least a part of the film supply part 400, the protective film recovery part 600, the release part 700, the transfer part 800, and the film recovery part 900. For example, the position detection part may detect the position of the mold 20 by a light sensor that recognizes the mark of the film 10, or detect the position of the mold 20 by an optical device.

在膜10上相鄰地配置的複數個模20之間的間距可以以分別位於蒸鍍模組720和轉印部800的方式和蒸鍍模組720與轉印部800之間的間距對應。換言之，蒸鍍模組720中模20所在的區域的中心點與轉印部800中模20所在的區域的中心點之間的間距可以與貼附於膜10的複數個模20中相鄰地配置的模20的中心點之間的間距相同。例如，蒸鍍模組720中模20所在的區域的中心點可以是塗布空間T1的中心點。此外，轉印部800中模20所在的區域的中心點可以是能夠在第一壓接單元821與第二壓接單元822之間配置模20的虛擬的空間的中心點。因此，可以在轉印部800配置先行的模20，並在蒸鍍模組720配置後行的模20，從而可以在先行的模20在轉印部800進行製程的期間使後行的模20在蒸鍍模組720進行製程。此外，位置檢測部可以配置於蒸鍍模組720與轉印部800之間來檢測先行的模20位於轉印部800，且後行的模20位於蒸鍍模組720。The spacing between the plurality of molds 20 arranged adjacently on the film 10 may correspond to the spacing between the vapor deposition module 720 and the transfer section 800 in such a way that they are respectively located in the vapor deposition module 720 and the transfer section 800. In other words, the distance between the center point of the area where the mold 20 is located in the vapor deposition module 720 and the center point of the area where the mold 20 is located in the transfer part 800 may be adjacent to the plurality of molds 20 attached to the film 10. The distance between the center points of the arranged molds 20 is the same. For example, the center point of the area where the mold 20 is located in the vapor deposition module 720 may be the center point of the coating space T1. In addition, the center point of the area where the mold 20 is located in the transfer part 800 may be the center point of a virtual space where the mold 20 can be arranged between the first crimping unit 821 and the second crimping unit 822. Therefore, the preceding mold 20 can be arranged in the transfer section 800, and the subsequent mold 20 can be arranged in the vapor deposition module 720, so that the subsequent mold 20 can be used while the preceding mold 20 is in the process of the transfer section 800. The process is performed in the vapor deposition module 720. In addition, the position detection unit may be disposed between the vapor deposition module 720 and the transfer unit 800 to detect that the preceding mold 20 is located in the transfer unit 800 and the subsequent mold 20 is located in the vapor deposition module 720.

如此，轉印部800與蒸鍍模組720同時進行模20的製程，從而具有能夠提高製程的效率的效果。In this way, the transfer unit 800 and the vapor deposition module 720 perform the process of the mold 20 at the same time, which has the effect of improving the efficiency of the process.

控制部可以控制壓接模組820及模分離單元830的驅動。這樣的控制部可以從檢測單元840接收壓接模組820及模分離單元830的位置資訊，且可以基於這樣的位置資訊來控制壓接模組820及模分離單元830的驅動。The control part can control the driving of the crimping module 820 and the mold separating unit 830. Such a control unit can receive position information of the crimping module 820 and the mold separating unit 830 from the detection unit 840, and can control the driving of the crimping module 820 and the mold separating unit 830 based on such position information.

控制部可以為了向一方向移送膜10而控制膜供給部400及膜回收部900中的一個以上的驅動。這樣的控制部可以從位置檢測部接收所檢測到的模20的位置資訊，且可以基於這樣的位置資訊來控制膜供給部400及膜回收部900的驅動。The control unit may control the driving of one or more of the film supply unit 400 and the film recovery unit 900 in order to transport the film 10 in one direction. Such a control unit can receive the detected position information of the mold 20 from the position detection unit, and can control the driving of the film supply unit 400 and the film recovery unit 900 based on such position information.

控制部可以由包括微處理器的運算裝置、儲存介質、感測器、光學等測量裝置及記憶體來實現，由於其實現方式對所屬技術領域中具有通常知識者而言是顯而易見的，因而省略進一步的詳細的說明。The control unit can be realized by a computing device including a microprocessor, a storage medium, a sensor, an optical measuring device, and a memory. Since its realization is obvious to those with ordinary knowledge in the technical field, it is omitted. Further detailed description.

如此，控制部具有能夠基於位置資訊來控制壓接模組820及模分離單元830的驅動的效果。此外，控制部具有能夠基於位置資訊來控制膜供給部400及膜回收部900的驅動的效果。In this way, the control unit has the effect of being able to control the driving of the crimping module 820 and the mold separating unit 830 based on the position information. In addition, the control unit has an effect of being able to control the driving of the film supply unit 400 and the film recovery unit 900 based on the position information.

如此，本發明的一實施例的轉印部800能夠省略將模20與基板30相互壓接的製程與使模20與基板30相互分離的製程之間的被壓接於基板30及基板30的模20移動至從基板30分離模20的位置的製程，從而具有能夠提高製程的效率的效果。In this way, the transfer part 800 of an embodiment of the present invention can omit the process of crimping the mold 20 and the substrate 30 to each other and the process of separating the mold 20 and the substrate 30 from each other, which is crimped to the substrate 30 and the substrate 30. The process of moving the mold 20 to a position where the mold 20 is separated from the substrate 30 has the effect of improving the efficiency of the process.

下面，參照圖15對利用轉印裝置1實施了轉印的基板的生產方法（S10）進行說明。Next, with reference to FIG. 15, the production method (S10) of the substrate subjected to transfer by the transfer device 1 will be described.

實施了轉印的基板的生產方法S10可以生產利用本發明的一實施例的轉印裝置1將模20的圖案轉印於基板30而轉印有圖案的基板30。這樣的實施了轉印的基板的生產方法S10可以包括基板供給步驟S100、等離子體處理步驟S200、脫模性塗布步驟S300、轉印步驟S400、以及膜回收步驟S500。The production method S10 of a transferred substrate can produce a substrate 30 on which the pattern of the mold 20 is transferred to the substrate 30 by using the transfer device 1 of an embodiment of the present invention. The production method S10 of such a transferred substrate may include a substrate supply step S100, a plasma treatment step S200, a release coating step S300, a transfer step S400, and a film recovery step S500.

在基板供給步驟S100中，可以利用樹脂塗布基板30，並向已設定的方向整列之後供給至轉印部800。這樣的基板供給步驟S100可以包括基板塗布步驟S110及基板整列步驟S120。In the substrate supply step S100, the substrate 30 may be coated with a resin, aligned in a predetermined direction, and then supplied to the transfer unit 800. Such a substrate supply step S100 may include a substrate coating step S110 and a substrate alignment step S120.

在基板塗布步驟S110中，可以在從基板收納部100移送至旋塗機200的待轉印圖案的基板30的表面以規定厚度塗布樹脂。在這樣的基板塗布步驟S110中，可以在通過旋塗方式將基板30置於旋轉體上之後，在旋轉的基板30的表面滴落流動性樹脂來將樹脂均勻地塗布於基板30的表面。此外，在基板塗布步驟S110中，可以在塗布基板30之前在冷卻板210對基板30的溫度進行調節。In the substrate coating step S110, the resin may be coated with a predetermined thickness on the surface of the substrate 30 on which the pattern is to be transferred transferred from the substrate storage part 100 to the spin coater 200. In such a substrate coating step S110, after the substrate 30 is placed on the rotating body by spin coating, a fluid resin may be dropped on the surface of the rotating substrate 30 to uniformly apply the resin to the surface of the substrate 30. In addition, in the substrate coating step S110, the temperature of the substrate 30 may be adjusted on the cooling plate 210 before the substrate 30 is coated.

在基板整列步驟S120中，可以向已設定的方向整列從旋塗機200移送的表面塗布有樹脂的基板30。在這樣的基板整列步驟S120中，可以通過使基板30以朝向已設定的方向的方式旋轉來向相同的方向整列複數個基板30。此外，在基板整列步驟S120進行整列的基板30可以被供給至轉印部800。In the substrate aligning step S120, the substrate 30 on which the resin is coated on the surface transferred from the spin coater 200 may be aligned in a predetermined direction. In such a substrate aligning step S120, a plurality of substrates 30 can be aligned in the same direction by rotating the substrate 30 in a predetermined direction. In addition, the substrate 30 aligned in the substrate alignment step S120 may be supplied to the transfer part 800.

在等離子體處理步驟S200中，可以對模20的表面進行等離子體處理，以改善從膜供給部400供給的模20的脫模性。可以在脫模性塗布步驟S300之前執行這樣的等離子體處理步驟S200。從而，在等離子體處理步驟S200中，在將脫模劑塗布於模20的表面之前對模20進行等離子體處理，由此能夠對模20的表面進行改質。此外，在等離子體處理步驟S200中，可以清洗模20的表面。In the plasma treatment step S200, plasma treatment may be performed on the surface of the mold 20 to improve the releasability of the mold 20 supplied from the film supply part 400. Such a plasma treatment step S200 may be performed before the release coating step S300. Therefore, in the plasma treatment step S200, the mold 20 is plasma-treated before the mold release agent is applied to the surface of the mold 20, so that the surface of the mold 20 can be modified. In addition, in the plasma treatment step S200, the surface of the mold 20 may be cleaned.

在脫模性塗布步驟S300中，可以對進行等離子體處理後的模20的表面進行脫模性塗布。此外，在脫模性塗布步驟S300中，可以使氣相化的脫模劑與模20的表面接觸來塗布模20的表面。可以在為了使膜10移動而旋轉的膜供給部400及膜回收部900中的一個以上未旋轉的狀態下執行這樣的脫模性塗布步驟S300。脫模性塗布步驟S300可以包括脫模劑供給步驟S310、脫模劑塗布步驟S320以及脫模劑吹掃步驟S330。In the releasability coating step S300, the surface of the mold 20 after the plasma treatment may be subjected to releasability coating. In addition, in the mold release coating step S300, the vaporized mold release agent may be brought into contact with the surface of the mold 20 to coat the surface of the mold 20. Such a releasable coating step S300 may be performed in a state where one or more of the film supply part 400 and the film recovery part 900 that are rotated in order to move the film 10 are not rotated. The release coating step S300 may include a release agent supplying step S310, a release agent coating step S320, and a release agent purging step S330.

脫模劑供給步驟S310可以將氣相化的脫模劑供給至由第一腔室部721與第二腔室部722貼緊而形成的塗布空間T1。在這樣的脫模劑供給步驟S310中，可以在使液體狀態的脫模劑氣相化之後供給至塗布空間T1。In the release agent supply step S310, the vaporized release agent can be supplied to the coating space T1 formed by the first cavity portion 721 and the second cavity portion 722 in close contact. In such a release agent supply step S310, the release agent in a liquid state may be vaporized and then supplied to the coating space T1.

在脫模劑塗布步驟S320中，可以對模20的表面進行脫模性塗布。在脫模劑塗布步驟S320中，脫模劑可以從流入口722b-1流入並在塗布空間T1流動而與模20的表面接觸來對模20的表面進行塗布之後，通過排出口722c-1排出至外部。In the release agent coating step S320, the surface of the mold 20 may be coated with release properties. In the release agent coating step S320, the release agent may flow in from the inflow port 722b-1 and flow into the coating space T1 to contact the surface of the mold 20 to coat the surface of the mold 20, and then be discharged through the discharge port 722c-1. To the outside.

在脫模劑吹掃步驟S330中，當模20的脫模性塗布結束時，可以中斷氣相化的脫模劑的供給，並向塗布空間T1供給空氣或非活性氣體（例如，氮氣）來將殘留於塗布空間T1的氣相化的脫模劑排出至外部。In the release agent purging step S330, when the release coating of the mold 20 is completed, the supply of vaporized release agent may be interrupted, and air or inert gas (for example, nitrogen) may be supplied to the coating space T1. The vaporized release agent remaining in the coating space T1 is discharged to the outside.

在轉印步驟S400中，可以將形成於模20的圖案轉印於基板30。換言之，在轉印步驟S400中，可以使模20與基板30相互壓接並分離來將圖案轉印於基板30。此外，可以在為了使膜10移動而旋轉的膜供給部400及膜回收部900中的一個以上未旋轉的狀態下執行轉印步驟S400。這樣的轉印步驟S400可以包括壓接步驟S410及分離步驟S420。In the transfer step S400, the pattern formed on the mold 20 may be transferred to the substrate 30. In other words, in the transfer step S400, the mold 20 and the substrate 30 may be pressed against each other and separated to transfer the pattern to the substrate 30. In addition, the transfer step S400 may be performed in a state where one or more of the film supply part 400 and the film recovery part 900 that are rotated to move the film 10 are not rotated. Such a transfer step S400 may include a crimping step S410 and a separating step S420.

在壓接步驟S410中，可以使第一壓接單元821與第二壓接單元822以相對於彼此相貼緊的方式移動來將形成於模20的圖案壓接於基板30。此外，可以使第一壓接單元821與第二壓接單元822在膜10的彼此相反的一側朝向膜10移動來使第一壓接單元821與第二壓接單元822相互貼緊。壓接步驟S410可以包括壓接單元靠近步驟S411、密閉步驟S412、氣體排出步驟S413以及壓接單元壓接步驟S414。In the crimping step S410, the first crimping unit 821 and the second crimping unit 822 may be moved in close contact with each other to crimp the pattern formed on the mold 20 to the substrate 30. In addition, the first crimping unit 821 and the second crimping unit 822 can be moved toward the film 10 on the opposite side of the film 10 to make the first crimping unit 821 and the second crimping unit 822 close to each other. The crimping step S410 may include the crimping unit approaching step S411, the sealing step S412, the gas exhausting step S413, and the crimping unit crimping step S414.

在壓接單元靠近步驟S411中，可以使第一壓接單元821與第二壓接單元822相對於彼此靠近。換言之，第一壓接單元821可以靠近粘接有模20的膜10，第二壓接單元822可以靠近基板30。In the crimping unit approaching step S411, the first crimping unit 821 and the second crimping unit 822 may be brought closer to each other. In other words, the first crimping unit 821 may be close to the film 10 to which the mold 20 is bonded, and the second crimping unit 822 may be close to the substrate 30.

在密閉步驟S412中，波紋管822b可以朝向第一壓接單元821來使基板30相對於外部密閉。此時，波紋管822b的一端可以與第一壓接單元821貼緊，且波紋管822b可以圍繞基板30的周圍。如此，波紋管822b以圍繞基板30的周圍的方式貼緊於第一壓接單元821，從而可以阻隔基板30與外部。In the sealing step S412, the corrugated tube 822b may face the first crimping unit 821 to seal the substrate 30 from the outside. At this time, one end of the bellows 822b may be in close contact with the first crimping unit 821, and the bellows 822b may surround the periphery of the substrate 30. In this way, the corrugated tube 822b is in close contact with the first crimping unit 821 so as to surround the periphery of the substrate 30, so that the substrate 30 can be blocked from the outside.

在氣體排出步驟S413中，可以向外部排出殘留於通過密閉步驟S412密閉的波紋管822b的內部空間的氣體。通過這樣的氣體排出步驟S413，波紋管822b內部空間，即基板30的周圍可以是規定的真空狀態。In the gas discharge step S413, the gas remaining in the internal space of the bellows 822b sealed in the sealing step S412 may be discharged to the outside. Through such a gas discharge step S413, the internal space of the bellows 822b, that is, the periphery of the substrate 30 can be in a predetermined vacuum state.

在壓接單元壓接步驟S414中，第一壓接單元821與第二壓接單元822可以相對於彼此移動來相互貼緊。換言之，第一壓接單元821及第二壓接單元822中的一個以上以對模20和基板30加壓的方式相互貼緊，從而能夠將模20的圖案壓接於基板30。In the crimping unit crimping step S414, the first crimping unit 821 and the second crimping unit 822 can move relative to each other to be close to each other. In other words, one or more of the first crimping unit 821 and the second crimping unit 822 are pressed against each other by pressing the mold 20 and the substrate 30 so that the pattern of the mold 20 can be crimped to the substrate 30.

在分離步驟S420中，可以使壓接有模20的圖案的基板30與模20分離。在這樣的分離步驟S420中，可以利用模分離單元830來從基板30分離模20。分離步驟S420可以包括吹掃步驟S421、密閉解除步驟S422、壓接單元上升步驟S423以及模分離單元移動步驟S424。In the separating step S420, the substrate 30 on which the pattern of the mold 20 is crimped can be separated from the mold 20. In such a separation step S420, the mold separation unit 830 may be used to separate the mold 20 from the substrate 30. The separating step S420 may include a purging step S421, a sealing release step S422, a crimping unit raising step S423, and a mold separating unit moving step S424.

在吹掃步驟S421中，可以向波紋管822b的內部空間供給空氣或非活性氣體（例如，氮氣）來將通過氣體排出步驟S413成為規定的真空狀態的波紋管822b的內部空間製成大氣壓狀態。In the purging step S421, air or an inert gas (for example, nitrogen) may be supplied to the inner space of the bellows 822b to bring the inner space of the bellows 822b into a predetermined vacuum state by the gas exhausting step S413 into an atmospheric pressure state.

在密閉解除步驟S422中，可以使為了從外部阻隔基板30而伸長的波紋管822b縮小。此時，通過波紋管822b與外部阻隔的模20及基板30可以露出於外部。In the airtight release step S422, the corrugated tube 822b that is elongated to block the substrate 30 from the outside may be reduced. At this time, the mold 20 and the substrate 30 blocked from the outside by the bellows 822b may be exposed to the outside.

在壓接單元上升步驟S423中，可以使第一壓接單元821上升來確保模分離單元830待移動至基板30側的空間。In the crimping unit raising step S423, the first crimping unit 821 may be raised to ensure a space where the mold separating unit 830 is to be moved to the side of the substrate 30.

在模分離單元移動步驟S424中，可以使模分離單元830移動至基板30側來從基板30分離模20。在這樣的模分離單元移動步驟S424中，模分離單元830可以移動至第一壓接單元821上升之前的空間，通過這樣的移動，可以從基板30分離模20。In the mold separation unit moving step S424, the mold separation unit 830 may be moved to the side of the substrate 30 to separate the mold 20 from the substrate 30. In such a mold separation unit moving step S424, the mold separation unit 830 can be moved to the space before the first crimping unit 821 rises, and the mold 20 can be separated from the substrate 30 by such movement.

當執行一次等離子體處理步驟S200和脫模性塗布步驟S300時，可以執行複數次轉印步驟S400和分離步驟S420，直至模20的脫模性下降至規定範圍以下，由此可以利用一個模20轉印複數個基板30。When the plasma treatment step S200 and the release coating step S300 are executed once, the transfer step S400 and the separation step S420 may be executed a plurality of times until the mold release property of the mold 20 falls below the specified range, so that one mold 20 can be used. A plurality of substrates 30 are transferred.

在基板回收步驟S500中，可以將轉印後的基板30移送至基板收納部100。In the substrate recovery step S500, the substrate 30 after the transfer may be transferred to the substrate storage section 100.

在膜回收步驟S600中，當執行複數次壓接步驟S410和分離步驟S420，使得模20的脫模性下降至規定範圍以下時，可以將模20回收至膜回收部900。In the film recovery step S600, when the crimping step S410 and the separation step S420 are executed a plurality of times and the releasability of the mold 20 falls below a predetermined range, the mold 20 can be recovered to the film recovery part 900.

基板回收步驟S500與膜回收步驟S600可以同時或獨立地進行。The substrate recovery step S500 and the film recovery step S600 may be performed simultaneously or independently.

儘管上文中以具體的實施方式對包括脫模部700和轉印部800的轉印裝置1進行可說明，但脫模部700與轉印部800可以獨立地構成轉印裝置。例如，脫模部700可以單獨地構成轉印裝置或與另一實施方式的轉印部構成轉印裝置，轉印部800可以單獨地構成轉印裝置或與另一實施方式的脫模部構成轉印裝置。此外，脫模部700可以選擇性地包括等離子體處理模組710。此外，轉印裝置1可以選擇性地包括基板收納部100、旋塗機200以及整列單元300。Although the transfer device 1 including the mold release part 700 and the transfer part 800 is described in the above in a specific embodiment, the mold release part 700 and the transfer part 800 may independently constitute a transfer device. For example, the release section 700 may constitute a transfer device alone or with the transfer section of another embodiment, and the transfer section 800 may constitute a transfer device alone or with the release section of another embodiment. Transfer device. In addition, the demolding part 700 may optionally include a plasma processing module 710. In addition, the transfer device 1 may optionally include a substrate storage section 100, a spin coater 200, and an alignment unit 300.

儘管上面以具體的實施方式對本發明的一些實施例進行了說明，但這只是例示，本發明不限於此，而是應被解釋為具有基於本說明書中公開的基礎思想的最廣的範圍。所屬技術領域中具有通常知識者可以組合/置換所公開的實施方式來實施未示出的形狀圖案，但這同樣不脫離本發明的範圍。除此之外，所屬技術領域中具有通常知識者可以基於本說明書容易對所公開的實施方式進行變更或變形，顯然，這樣的變更或變形也屬於本發明的權利範圍。Although some embodiments of the present invention have been described above with specific implementations, these are only examples, and the present invention is not limited thereto, but should be interpreted as having the broadest scope based on the basic ideas disclosed in this specification. Those skilled in the art can combine/replace the disclosed embodiments to implement shapes and patterns that are not shown, but this also does not depart from the scope of the present invention. In addition, those with ordinary knowledge in the technical field can easily make changes or modifications to the disclosed embodiments based on this specification. Obviously, such changes or modifications also belong to the scope of the present invention.

1:轉印裝置 10:膜 20:模 30:基板 100:基板收納部 200:旋塗機 210:冷卻板 300:整列單元 400:膜供給部 500:進料輥 600:保護膜回收部 700:脫模部 710:等離子體處理模組 711:等離子體生成部 712:導向輥 720:蒸鍍模組 721:第一腔室部 721a:第一腔室槽 721b:氣體排出口 722:第二腔室部 722a:腔室底座 722b:腔室側壁 722b-1:流入口 722b-2:第二腔室槽 722c:腔室凸出部 722c-1:排出口 722c-2:凹部 723:流體供給部 723a:流體容納體 723b:罐 723c:起泡器 723d:第一供給流路 723e:第二供給流路 723f:噴射裝置 724:氣體排出部 724a:排出流路 724b:排出泵 725:蒸鍍密封部 725a:第一蒸鍍密封部件 725b:第二蒸鍍密封部件 726:腔室驅動器 727:加熱器 728:壓力調節部 728a:壓力調節流路 800:轉印部 810:框架 811:第一框架部 812:第二框架部 813:第三框架部 820:壓接模組 821:第一壓接單元 821a:第一壓接體 821a-1:第一密封槽 821b:第一支撐部 821c:照射部 821d:推擠防止部 821d-1:支撐部件 821d-2:旋轉部件 821e:第一導向部件 821f:固定件 822:第二壓接單元 822a:第二壓接體 822a-1:基板安放部 822a-2:波紋管安放部 822a-3:吸附口 822a-4:排氣口 822b:波紋管 822b-1:第二密封槽 822c:升降缸 822d:第二支撐部 822e:第二導向部件 823:排氣部 823a:排氣通道 823b:排氣泵 824:吸附部 824a:吸附通道 824b:吸附泵 825:驅動部 825a:第一驅動器 825b:第二驅動器 826:壓接密封部 826a:第一壓接密封部件 826b:第二壓接密封部件 830:模分離單元 831:第一輥部 832:第二輥部 833:輥支撐部 834:輥導向部件 835:輥驅動器 840:檢測單元 841:第1感測器部 841a:第1-1感測器 841b:第1-2感測器 841c:第1-3感測器 842:第2感測器部 842a:第2-1感測器 842b:第2-2感測器 842c:第2-3感測器 843:第3感測器部 843a:第3-1感測器 843b:第3-2感測器 843c:第3-3感測器 900:膜回收部 T:移送單元 T1:塗布空間 S10:實施了轉印的基板的生產方法 S100～600:步驟1: transfer device 10: Membrane 20: Mode 30: substrate 100: Board storage section 200: Spin coater 210: cooling plate 300: entire column of cells 400: Membrane Supply Department 500: feed roller 600: Protective film recycling department 700: demolding department 710: Plasma processing module 711: Plasma Generation Department 712: Guide roller 720: Evaporation Module 721: first chamber part 721a: first chamber groove 721b: Gas outlet 722: second chamber part 722a: Chamber base 722b: Chamber side wall 722b-1: Inlet 722b-2: Second chamber groove 722c: cavity protrusion 722c-1: Outlet 722c-2: recess 723: Fluid Supply Department 723a: fluid container 723b: Can 723c: Bubbler 723d: The first supply flow path 723e: second supply flow path 723f: spray device 724: Gas discharge part 724a: discharge flow path 724b: discharge pump 725: vapor deposition sealing part 725a: The first vapor deposition sealing part 725b: The second vapor deposition sealing part 726: Chamber Drive 727: heater 728: Pressure Regulation Department 728a: Pressure regulating flow path 800: Transfer Department 810: Frame 811: The first frame part 812: The second frame part 813: Third Frame Department 820: crimping module 821: The first crimping unit 821a: The first crimping body 821a-1: The first seal groove 821b: The first support part 821c: Irradiation Department 821d: Pushing prevention department 821d-1: Supporting parts 821d-2: Rotating parts 821e: The first guide component 821f: fixed parts 822: Second crimping unit 822a: second crimp body 822a-1: Board placement department 822a-2: Bellows Placement Department 822a-3: Adsorption port 822a-4: Exhaust port 822b: bellows 822b-1: The second sealing groove 822c: Lifting cylinder 822d: second support part 822e: second guide component 823: Exhaust Department 823a: Exhaust channel 823b: Exhaust pump 824: Adsorption part 824a: Adsorption channel 824b: Adsorption pump 825: Drive 825a: first drive 825b: second drive 826: crimp seal 826a: The first crimping seal part 826b: The second crimp sealing part 830: Die separation unit 831: The first roller section 832: The second roller section 833: Roller support 834: Roller Guide Parts 835: Roller Drive 840: detection unit 841: The first sensor part 841a: 1-1 sensor 841b: 1-2 sensor 841c: 1-3 sensors 842: The second sensor part 842a: 2-1 sensor 842b: 2-2 sensor 842c: 2-3 sensor 843: The third sensor part 843a: 3-1 sensor 843b: 3-2 sensor 843c: 3-3 sensor 900: Membrane Recycling Department T: Transfer unit T1: Coating space S10: Production method of printed substrate S100～600: steps

圖1是本發明的一實施例的轉印裝置的概念圖。Fig. 1 is a conceptual diagram of a transfer device according to an embodiment of the present invention.

圖2是圖1的轉印裝置的平面圖。Fig. 2 is a plan view of the transfer device of Fig. 1.

圖3是圖1的脫模部的分解立體圖。Fig. 3 is an exploded perspective view of the demolding part of Fig. 1.

圖4是沿圖3的A-A'剖切的剖視圖。Fig. 4 is a cross-sectional view taken along AA' of Fig. 3.

圖5是在圖1的第二腔室部上升時沿A-A'剖切的剖視圖。Fig. 5 is a cross-sectional view taken along AA' when the second chamber portion of Fig. 1 is ascending.

圖6是圖1的轉印部的立體圖。Fig. 6 is a perspective view of the transfer section of Fig. 1.

圖7是圖6的分解立體圖。Fig. 7 is an exploded perspective view of Fig. 6.

圖8是沿圖6的B-B'剖切的剖視圖。Fig. 8 is a cross-sectional view taken along BB' of Fig. 6.

圖9a是在圖6的壓接模組為了對模和基板加壓而移動時沿B-B'剖切的剖視圖。Fig. 9a is a cross-sectional view taken along BB' when the crimping module of Fig. 6 is moved in order to press the mold and the substrate.

圖9b的（a）是當圖9a的波紋管縮小時放大C部分的放大圖，圖9b的（b）是當9a的波紋管伸長時放大C部分的放大圖。Fig. 9b(a) is an enlarged view of the part C enlarged when the bellows of Fig. 9a is reduced, and Fig. 9b(b) is an enlarged view of the part C enlarged when the bellows of 9a is extended.

圖10是在圖6的第一壓接單元上升時沿B-B'剖切的剖視圖。Fig. 10 is a cross-sectional view taken along BB' when the first crimping unit of Fig. 6 is ascending.

圖11時在圖6的模分離單元從基板分離模時沿B-B'進行剖切的剖視圖。FIG. 11 is a cross-sectional view taken along BB' when the mold separation unit of FIG. 6 separates the mold from the substrate.

圖12是在圖6的模分離單元從基板分離模之後移動時沿B-B'進行剖切的剖視圖。12 is a cross-sectional view taken along BB' when the mold separating unit of FIG. 6 moves after separating the mold from the substrate.

圖13是圖7的下部框架和第二壓接單元的立體圖。Fig. 13 is a perspective view of the lower frame and the second crimping unit of Fig. 7.

圖14的（a）是圖6的模分離單元的仰視圖，圖14的（b）是在圖6的模分離單元朝向模移動時的模分離單元的仰視圖。Fig. 14(a) is a bottom view of the mold separation unit of Fig. 6, and Fig. 14(b) is a bottom view of the mold separation unit when the mold separation unit of Fig. 6 is moved toward the mold.

圖15是示意性地示出利用本發明的一實施例的轉印裝置轉印圖案後的基板的生產方法的順序圖。15 is a sequence diagram schematically showing a production method of a substrate after a pattern is transferred by the transfer device of an embodiment of the present invention.

1:轉印裝置 1: transfer device

10:膜 10: Membrane

20:模 20: Mode

30:基板 30: substrate

400:膜供給部 400: Membrane Supply Department

500:進料輥 500: feed roller

600:保護膜回收部 600: Protective film recycling department

700:脫模部 700: demolding department

710:等離子體處理模組 710: Plasma processing module

720:蒸鍍模組 720: Evaporation Module

800:轉印部 800: Transfer Department

900:膜回收部 900: Membrane Recycling Department

Claims (48)

一種轉印裝置，其將粘接於一膜的一模的圖案轉印至一基板，該轉印裝置的其中，包括： 一脫模部，其能夠在該模的表面進行脫模性塗布；以及 一轉印部，其能夠將在該脫模部進行脫模性塗布後的該模的圖案轉印至該基板， 該脫模部包括： 一等離子體處理模組，其以在對該模的表面進行脫模性塗布之前利用一等離子體處理該模的表面的方式工作；以及 一蒸鍍模組，其在進行該等離子體處理後的該模的表面進行脫模性塗布。A transfer device which transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: A mold release part capable of performing mold release coating on the surface of the mold; and A transfer part capable of transferring the pattern of the mold after the release coating is applied to the substrate to the substrate, The demolding department includes: A plasma processing module, which works by treating the surface of the mold with a plasma before performing release coating on the surface of the mold; and An evaporation module, which performs release coating on the surface of the mold after the plasma treatment. 一種轉印裝置，其將粘接於一膜的一模的圖案轉印至一基板，該轉印裝置的其中，包括： 一脫模部，其能夠在該模的表面進行脫模性塗布；以及 一轉印部，其能夠將在該脫模部進行脫模性塗布後的該模的圖案轉印至該基板， 該脫模部包括能夠在該模的表面進行脫模性塗布的一蒸鍍模組， 在該膜粘接有複數個模， 該蒸鍍模組中該模所在的區域的中心點與該轉印部中該模所在的區域的中心點之間的間距與相鄰地配置於該膜上的該模的中心點之間的間距相同。A transfer device which transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: A mold release part capable of performing mold release coating on the surface of the mold; and A transfer part capable of transferring the pattern of the mold after the release coating is applied to the substrate to the substrate, The demolding part includes an evaporation module capable of releasable coating on the surface of the mold, There are multiple molds bonded to the film, The distance between the center point of the area where the mold is located in the vapor deposition module and the center point of the area where the mold is located in the transfer portion is between the center point of the mold adjacently arranged on the film The spacing is the same. 根據請求項1或2所述的轉印裝置，其其中， 該蒸鍍模組通過使一脫模劑氣相化，並將氣相化後的該脫模劑提供至該模的表面來塗布該模的表面。The transfer device according to claim 1 or 2, wherein: The vapor deposition module coats the surface of the mold by vaporizing a mold release agent and providing the vaporized mold release agent to the surface of the mold. 根據請求項1所述的轉印裝置，其其中， 該轉印部構成為， 當該等離子體處理模組執行一次利用該等離子體處理該模的表面的過程，且該蒸鍍模組執行一次對該模的表面進行脫模性塗布的過程時， 執行複數次將該模的圖案壓接於脫模性塗布後的該基板的過程和從該基板分離該模的過程。The transfer device according to claim 1, wherein: The transfer part is configured as: When the plasma processing module performs a process of using the plasma to treat the surface of the mold, and the evaporation module performs a process of releasable coating on the surface of the mold, The process of crimping the pattern of the mold to the substrate after the release coating and the process of separating the mold from the substrate are performed multiple times. 根據請求項1或2所述的轉印裝置，其其中， 該轉印部包括： 一壓接模組，其能夠使該模和該基板壓接來將該模的圖案壓接於該基板；以及 一模分離單元，其在由該壓接模組將該模的圖案壓接於該基板時從該基板分離該模。The transfer device according to claim 1 or 2, wherein: The transfer unit includes: A crimping module capable of crimping the mold and the substrate to crimp the pattern of the mold to the substrate; and A mold separation unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping module. 根據請求項1或2所述的轉印裝置，其其中，還包括： 一膜供給部，其能夠向該脫模部供給粘接有該模的該膜；以及 一膜回收部，其能夠回收並卷取該膜， 在被卷取於該膜回收部的該膜粘接有脫模性下降至規定範圍以下的該模。The transfer device according to claim 1 or 2, which further includes: A film supply part capable of supplying the film to which the mold is bonded to the demolding part; and A film recovery section, which can recover and wind up the film, The mold whose releasability has fallen below a predetermined range is adhered to the film wound on the film recovery part. 根據請求項2所述的轉印裝置，其其中，還包括： 一位置檢測部，其配置於該蒸鍍模組與該轉印部之間，由此檢測先行的該模位於該轉印部且後行的該模位於該蒸鍍模組。The transfer device according to claim 2, which further includes: A position detection part is arranged between the evaporation module and the transfer part, thereby detecting that the preceding mold is located in the transfer part and the following mold is located in the evaporation module. 根據請求項7所述的轉印裝置，其其中，還包括： 一膜供給部及一膜回收部，其為了使該膜移動而旋轉， 該轉印部構成為，在該膜供給部及該膜回收部中的一個以上未旋轉的狀態下，反復執行規定次數以上的將該模的圖案壓接於該基板的過程和從該基板分離該模的過程， 該轉印裝置還包括： 一控制部，其從該位置檢測部接收該模的位置資訊來控制該膜供給部及該膜回收部中的一個以上的驅動。The transfer device according to claim 7, which further includes: A film supply part and a film recovery part, which rotate in order to move the film, The transfer section is configured to repeatedly perform the process of crimping the pattern of the mold to the substrate and separating the substrate from the substrate in a state where one or more of the film supply section and the film recovery section are not rotated. The process of the model, The transfer device also includes: A control part receives position information of the mold from the position detection part to control the driving of more than one of the film supply part and the film recovery part. 一種轉印裝置，其其中，包括一蒸鍍模組，該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間；以及 一流體供給部，其向該塗布空間供給氣相化的一脫模劑，以便能夠塗布該模的表面， 該膜在該第一腔室部與該第二腔室部之間通過， 該流體供給部包括： 一罐，其能夠容納液體狀態的該脫模劑；以及 一起泡器，其能夠向容納於該罐的液體狀態的該脫模劑供給規定壓力以上的氣體來使該脫模劑氣相化。A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a vaporized release agent to the coating space so as to be able to coat the surface of the mold, The membrane passes between the first chamber portion and the second chamber portion, The fluid supply unit includes: A tank capable of containing the release agent in a liquid state; and A bubbler capable of supplying a gas of a predetermined pressure or higher to the mold release agent contained in the tank in a liquid state to vaporize the mold release agent. 根據請求項9所述的轉印裝置，其其中， 該起泡器通過在容納於該罐的該脫模劑的表面的下方向該脫模劑排出所述氣體來使該脫模劑氣相化。The transfer device according to claim 9, wherein: The bubbler discharges the gas from the mold release agent under the surface of the mold release agent contained in the tank to vaporize the mold release agent. 根據請求項9所述的轉印裝置，其其中， 該蒸鍍模組還包括： 一噴射裝置，其能夠通過在從液體狀態的該脫模劑的表面向上側隔開規定距離的位置噴射所述氣體來防止氣相化的該脫模劑成團。The transfer device according to claim 9, wherein: The evaporation module also includes: A spraying device capable of spraying the gas at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state to prevent the release agent that has been vaporized from forming agglomerates. 一種轉印裝置，其其中，包括一蒸鍍模組，該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間；以及 一流體供給部，其向該塗布空間供給一脫模劑，以便能夠對該模的表面進行脫模性塗布， 該膜在該第一腔室部與該第二腔室部之間通過， 在該第二腔室部形成有一流入口，該流入口的一側與該流體供給部連通，該流入口的另一側與該塗布空間連通， 該流入口配置於比該模靠下方。A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, A first-rate inlet is formed in the second chamber, one side of the inlet communicates with the fluid supply part, and the other side of the inlet communicates with the coating space, The inflow port is arranged below the mold. 根據請求項12所述的轉印裝置，其其中， 在該第二腔室部形成有一排出口，該排出口用於向外部排出通過該流入口流入該塗布空間的該脫模劑， 從該流入口流入該塗布空間的該脫模劑在通過該排出口被排出至外部的期間與該模的表面接觸。The transfer device according to claim 12, wherein: A discharge port is formed in the second chamber portion, and the discharge port is used to discharge the release agent flowing into the coating space through the inflow port to the outside, The release agent flowing into the coating space from the inflow port comes into contact with the surface of the mold while being discharged to the outside through the discharge port. 一種轉印裝置，其其中，包括一蒸鍍模組，該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間；以及 一流體供給部，其向該塗布空間供給一脫模劑，以便能夠對該模的表面進行脫模性塗布， 該膜在該第一腔室部與該第二腔室部之間通過， 該第二腔室部包括： 一腔室底座； 一腔室凸出部，其從該腔室底座凸出形成；以及 一腔室側壁，其從該腔室底座沿該腔室底座的邊緣延伸形成，且與該腔室凸出部隔開規定距離而包圍該腔室凸出部。A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The second chamber part includes: A chamber base; A cavity protrusion formed by protruding from the cavity base; and A cavity side wall is formed from the cavity base along the edge of the cavity base and is separated from the cavity protrusion by a predetermined distance to surround the cavity protrusion. 根據請求項14所述的轉印裝置，其其中， 該第二腔室部包括： 一流入口，其形成於該腔室側壁，且一側與該流體供給部連通，另一側與該塗布空間連通；以及 一排出口，其形成於該腔室凸出部，用於向外部排出通過該流入口流入該塗布空間的該脫模劑， 從該流入口流入該塗布空間的該脫模劑在通過該排出口被排出至外部的期間與該模的表面接觸。The transfer device according to claim 14, wherein: The second chamber part includes: A first-rate inlet, which is formed on the side wall of the chamber, and communicates with the fluid supply part on one side and the coating space on the other side; A discharge port formed in the protruding part of the cavity for discharging the release agent flowing into the coating space through the inflow port to the outside, The release agent flowing into the coating space from the inflow port comes into contact with the surface of the mold while being discharged to the outside through the discharge port. 根據請求項8所述的轉印裝置，其其中， 該流入口形成於該腔室側壁，且配置於比該腔室凸出部的上面靠下方。The transfer device according to claim 8, wherein: The inflow port is formed on the side wall of the chamber and is arranged below the upper surface of the protruding portion of the chamber. 根據請求項15所述的轉印裝置，其其中， 在該腔室底座的邊緣，在與該流入口對應的位置形成有具有從該腔室凸出部的上面向下側凹陷的形狀的一凹部。The transfer device according to claim 15, wherein: On the edge of the cavity base, a recessed portion having a shape recessed from the upper surface of the cavity protruding portion to the lower side is formed at a position corresponding to the inflow port. 根據請求項13或15所述的轉印裝置，其其中， 設有複數個該流入口， 該複數個流入口中的至少一部分配置為彼此相向， 該排出口以配置於彼此相向的該流入口之間的方式形成於該第二腔室部的一中心部。The transfer device according to claim 13 or 15, wherein: There are a plurality of the flow inlets, At least a part of the plurality of inlets are arranged to face each other, The discharge port is formed in a central portion of the second chamber portion in a manner of being arranged between the inflow ports facing each other. 一種轉印裝置，其其中，包括一蒸鍍模組，該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間；以及 一流體供給部，其向該塗布空間供給一脫模劑，以便能夠對該模的表面進行脫模性塗布， 該膜在該第一腔室部與該第二腔室部之間通過， 該塗布空間的內部以該膜為基準被劃分為一上側空間和一下側空間， 在該第一腔室部形成有一氣體排出口，該氣體排出口用於向外部排出該塗布空間的內部中以該膜為基準殘留於該上側空間的氣體， 在該第二腔室部形成有一排出口，該排出口用於向外部排出該塗布空間的內部中以該膜為基準殘留於該下側空間的該脫模劑。A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The interior of the coating space is divided into an upper space and a lower space based on the film, A gas discharge port is formed in the first chamber portion, and the gas discharge port is used to discharge the gas remaining in the upper space in the coating space on the basis of the film to the outside, A discharge port is formed in the second chamber portion for discharging the release agent remaining in the lower space on the basis of the film in the coating space to the outside. 根據請求項9至19中任一項所述的轉印裝置，其其中， 該蒸鍍模組還包括： 一加熱器，其通過加熱該第一腔室部及該第二腔室部中的一個以上來將該塗布空間的溫度維持在30℃至80℃的範圍內。The transfer device according to any one of claims 9 to 19, wherein: The evaporation module also includes: A heater that maintains the temperature of the coating space in the range of 30°C to 80°C by heating more than one of the first chamber portion and the second chamber portion. 一種轉印裝置，其其中，包括一蒸鍍模組，該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間；以及 一流體供給部，其向該塗布空間供給一脫模劑，以便能夠對該模的表面進行脫模性塗布， 該膜在該第一腔室部與該第二腔室部之間通過， 該蒸鍍模組還包括一蒸鍍密封部，該蒸鍍密封部包圍該塗布空間，以進行該第一腔室部與該第二腔室部之間的密封， 該蒸鍍密封部包括設於該第一腔室部的一第一蒸鍍密封部件及設於該第二腔室部的一第二蒸鍍密封部件， 該第一蒸鍍密封部件及該第二蒸鍍密封部件中的某一個在不與另一個貼緊時具有平面形狀，所述另一個在不與所述某一個貼緊時具有圓弧形狀。A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The vapor deposition module further includes a vapor deposition sealing portion that surrounds the coating space to seal between the first cavity portion and the second cavity portion, The vapor deposition sealing part includes a first vapor deposition sealing component provided in the first chamber part and a second vapor deposition sealing component provided in the second chamber part, One of the first vapor deposition sealing member and the second vapor deposition sealing member has a planar shape when not in close contact with the other, and the other has an arc shape when not in close contact with the one. 一種轉印裝置，其其中，包括一蒸鍍模組和一等離子體處理模組， 該蒸鍍模組包括： 一第一腔室部； 一第二腔室部，其配置於比該第一腔室部靠下方，並與該第一腔室部一同形成用於配置粘接有一模的一膜的一塗布空間； 一流體供給部，其向該塗布空間供給一脫模劑，以便能夠對該模的表面進行脫模性塗布， 該等離子體處理模組利用等離子體處理該模的表面，以對該模的表面進行改質， 該膜在該第一腔室部與該第二腔室部之間通過， 該蒸鍍模組對由該等離子體處理模組對該模的表面進行等離子體處理後的該模的表面進行脫模性塗布。A transfer device, which includes an evaporation module and a plasma processing module, The evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion, and together with the first cavity portion, form a coating space for arranging a film bonded with a mold; A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The plasma processing module uses plasma to treat the surface of the mold to modify the surface of the mold, The membrane passes between the first chamber portion and the second chamber portion, The vapor deposition module performs release coating on the surface of the mold after plasma treatment is performed on the surface of the mold by the plasma processing module. 一種轉印裝置，其其中，包括： 一壓接模組，其包括能夠朝向在一面粘接有形成有圖案的一模的一膜移動的一第一壓接單元和能夠支撐一基板的一第二壓接單元；以及 一模分離單元，其包括一第一輥部，該第一輥部在作為該膜的一面的相反側的該膜的另一面支撐該膜， 該第一壓接單元與該第二壓接單元在該膜的彼此相反的一側朝向該膜移動而相互貼緊來將形成於該模的圖案壓接於該基板， 該第一輥部向該第一壓接單元與該第二壓接單元之間的將該基板壓接於該模的空間移動來從該基板分離被壓接於該基板的該模。A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A mold separation unit including a first roller portion supporting the film on the other side of the film that is the opposite side of the one side of the film, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The first roller portion moves to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate. 根據請求項23所述的轉印裝置，其其中， 該模分離單元還包括一第二輥部，其以使該膜向包圍該第一輥部的一部分的方向彎曲的方式支撐該膜。The transfer device according to claim 23, wherein: The mold separation unit further includes a second roller portion that supports the film in a manner to bend the film in a direction surrounding a part of the first roller portion. 根據請求項23所述的轉印裝置，其其中， 該第二壓接單元包括一基板安放部，其能夠在由該壓接模組將該模加壓於該基板並由該模分離單元從該基板分離該模時支撐該基板， 在該基板安放部形成有能夠吸附該基板的一吸附口，以防止在將該模加壓於該基板並從該基板分離該模時該基板從該第二壓接單元脫離。The transfer device according to claim 23, wherein: The second crimping unit includes a substrate seating portion capable of supporting the substrate when the mold is pressed against the substrate by the crimping module and the mold is separated from the substrate by the mold separating unit, A suction port capable of sucking the substrate is formed in the substrate mounting portion to prevent the substrate from being detached from the second crimping unit when the mold is pressed against the substrate and the mold is separated from the substrate. 根據請求項23所述的轉印裝置，其其中，還包括： 一框架，其能夠支撐該壓接模組及該模分離單元， 該第一壓接單元與該第二壓接單元以支撐於該框架的狀態相對於彼此移動， 該模分離單元以支撐於該框架的狀態相對於該模移動。The transfer device according to claim 23, which further includes: A frame capable of supporting the crimping module and the mold separating unit, The first crimping unit and the second crimping unit move relative to each other in a state of being supported by the frame, The mold separation unit moves relative to the mold in a state of being supported by the frame. 一種轉印裝置，其其中，包括： 一壓接模組，其包括能夠朝向在一面粘接有形成有圖案的一模的一膜移動的一第一壓接單元和能夠支撐一基板的一第二壓接單元；以及 一框架，其能夠支撐該壓接模組， 該第一壓接單元與該第二壓接單元在該膜的彼此相反的一側朝向該膜移動而相互貼緊來將形成於該模的圖案壓接於該基板， 該框架包括一第一框架部及一第二框架部， 該第一壓接單元包括： 一第一壓接體，其能夠對該模加壓；以及 一第一導向部件，其固定支撐於該第一框架部，且能夠對該第一壓接體的移動進行導向， 該第二壓接單元包括： 一第二壓接體，其能夠支撐該基板；以及 一第二導向部件，其固定支撐於該第二框架部，且能夠對該第二壓接體的移動進行導向， 該第一壓接體和該第二壓接體分別通過該第一導向部件和該第二導向部件進行移動導向來相對於該框架升降。A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A frame capable of supporting the crimping module, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The frame includes a first frame part and a second frame part, The first crimping unit includes: A first crimp body capable of pressing the mold; and A first guide member fixedly supported on the first frame portion and capable of guiding the movement of the first crimping body, The second crimping unit includes: A second crimping body capable of supporting the substrate; and A second guide member fixedly supported on the second frame portion and capable of guiding the movement of the second crimping body, The first crimping body and the second crimping body are moved and guided by the first guide member and the second guide member to move up and down relative to the frame. 根據請求項27所述的轉印裝置，其其中， 該第一壓接單元包括： 一第一壓接體，其能夠對該模加壓； 一第一支撐部，其能夠支撐該第一壓接體；以及 一推擠防止部，其一端固定支撐於該第一框架部，另一端支撐於該第一支撐部， 該推擠防止部能夠通過在該第二壓接單元為了對該基板加壓而上升時對該第一支撐部加壓來防止因該第二壓接單元上升而導致該第一壓接體被推擠至上側。The transfer device according to claim 27, wherein: The first crimping unit includes: A first crimp body, which can pressurize the mold; A first supporting portion capable of supporting the first crimping body; and A pushing preventing part, one end of which is fixedly supported on the first frame part, and the other end is supported on the first supporting part, The pushing preventing portion can prevent the first crimping body from being damaged by the second crimping unit ascending by pressing the first supporting portion when the second crimping unit is raised to pressurize the substrate. Push to the upper side. 根據請求項27所述的轉印裝置，其其中，還包括： 一模分離單元，其移動至該第一壓接單元與該第二壓接單元之間的將該基板壓接於該模的空間來從該基板分離被壓接於該基板的該模， 該框架還包括一第三框架部， 該模分離單元包括： 一輥部，其能夠從該基板分離被壓接於該基板的該模；以及 一輥導向部件，其固定支撐於該第三框架部，且能夠對該輥部的移動進行導向， 該輥部通過該輥導向部件進行移動導向來相對於該框架移動。The transfer device according to claim 27, which further includes: A mold separating unit that moves to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate, The frame also includes a third frame part, The mold separation unit includes: A roller part capable of separating the mold crimped to the substrate from the substrate; and A roller guide member fixedly supported on the third frame portion and capable of guiding the movement of the roller portion, The roller portion is moved and guided by the roller guide member to move relative to the frame. 根據請求項29所述的轉印裝置，其其中， 該第一框架部、該第二框架部及該第三框架部相對於彼此被一體地固定支撐。The transfer device according to claim 29, wherein: The first frame portion, the second frame portion, and the third frame portion are integrally fixed and supported with respect to each other. 一種轉印裝置，其其中，包括： 一壓接模組，其包括能夠朝向在一面粘接有形成有圖案的一模的一膜移動的一第一壓接單元和能夠支撐一基板的一第二壓接單元；以及 一檢測單元，其能夠檢測該壓接模組的一第一停止位置、一第二停止位置及一減速位置， 該第一壓接單元與該第二壓接單元在該膜的彼此相反的一側朝向該膜移動而相互貼緊來將形成於該模的圖案壓接於該基板， 該減速位置位於該第一停止位置與該第二停止位置之間， 該壓接模組被驅動為，當在從該第一停止位置移動至該第二停止位置的期間到達該減速位置時減速。A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A detection unit capable of detecting a first stop position, a second stop position and a deceleration position of the crimping module, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The deceleration position is located between the first stop position and the second stop position, The crimping module is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position. 根據請求項31所述的轉印裝置，其其中，還包括： 一控制部，其從該檢測單元接收該壓接模組的位置資訊來控制該壓接模組的驅動。The transfer device according to claim 31, which further includes: A control unit receives position information of the crimping module from the detection unit to control the driving of the crimping module. 一種轉印裝置，其其中，包括： 一模分離單元，其能夠將在作為一膜的一面的相反側的該膜的另一面支撐該膜的一第一輥部移動至一基板側來從該基板分離被壓接於該基板的該模；以及 一檢測單元，其能夠檢測該模分離單元的一第一停止位置、一第二停止位置及一減速位置， 該減速位置位於該第一停止位置與該第二停止位置之間， 該模分離單元被驅動為，當在從該第一停止位置移動至該第二停止位置的期間到達該減速位置時減速。A transfer device, which includes: A mold separation unit capable of moving a first roller portion supporting the film on the other side of the film opposite to the one side of the film to the side of a substrate to separate the substrate that is crimped to the substrate Mold; and A detection unit capable of detecting a first stop position, a second stop position and a deceleration position of the mold separation unit, The deceleration position is located between the first stop position and the second stop position, The mold separation unit is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position. 根據請求項33所述的轉印裝置，其其中，還包括： 一控制部，其從該檢測單元接收該壓接模組的位置資訊來控制該模分離單元的驅動。The transfer device according to claim 33, which further includes: A control unit receives position information of the crimping module from the detection unit to control the driving of the mold separation unit. 根據請求項31或33所述的轉印裝置，其其中， 該檢測單元包括： 一第一停止位置檢測感測器，其用於檢測該第一停止位置； 一減速位置檢測感測器，其用於檢測該減速位置；以及 一第二停止位置檢測感測器，其用於檢測該第二停止位置。The transfer device according to claim 31 or 33, wherein: The detection unit includes: A first stop position detection sensor for detecting the first stop position; A deceleration position detection sensor for detecting the deceleration position; and A second stop position detection sensor for detecting the second stop position. 一種轉印裝置，其其中，包括： 一第一壓接單元，其能夠朝向在一面粘接有形成有圖案的一模的一膜移動； 一第二壓接單元，其能夠支撐一基板； 一壓接密封部，其包括插入於該第一壓接單元的一第一壓接密封部件、以及插入於該第二壓接單元且具有與該第一壓接密封部件不同的形狀的一第二壓接密封部件， 該第一壓接單元與該第二壓接單元在該膜的彼此相反的一側朝向該膜移動而相互貼緊來將形成於該模的圖案壓接於該基板， 該第一壓接密封部件及該第二壓接密封部件中的某一個在不與另一個貼緊時具有平面形狀，且所述另一個在不與所述某一貼緊時具有圓弧形狀。A transfer device, which includes: A first crimping unit capable of moving toward a film with a pattern formed on one side bonded to a film; A second crimping unit capable of supporting a substrate; A crimping and sealing portion, which includes a first crimping and sealing member inserted into the first crimping unit, and a first crimping and sealing member that is inserted into the second crimping unit and having a shape different from that of the first crimping and sealing member Two crimping and sealing parts, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, One of the first crimping sealing member and the second crimping sealing member has a planar shape when not in close contact with the other, and the other has an arc shape when not in close contact with the one . 一種實施了轉印的基板的生產方法，其生產轉印有粘接於一膜的一模的圖案的一基板，該實施了轉印的基板的生產方法的其中，包括下列步驟： 利用一等離子體處理該模的表面的一等離子體處理步驟； 在進行該等離子體處理後的該模的表面進行脫模性塗布的一脫模性塗布步驟；以及 將通過該脫模性塗布步驟進行脫模性塗布後的該模的圖案轉印於該基板的一轉印步驟。A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: A plasma treatment step of using a plasma to treat the surface of the mold; Performing a releasable coating step of releasable coating on the surface of the mold after the plasma treatment; and A transfer step of transferring the pattern of the mold after the release coating step is performed to the substrate. 一種實施了轉印的基板的生產方法，其生產轉印有粘接於一膜的一模的圖案的一基板，該實施了轉印的基板的生產方法的其中，包括下列步驟： 在該模的表面進行脫模性塗布的一脫模性塗布步驟；以及 將通過該模性塗布步驟進行脫模性塗布後的該模的圖案轉印於該基板的一轉印步驟， 在一位置檢測部檢測到該模分別位於用於執行該脫模性塗布步驟的一蒸鍍模組和用於執行該轉印步驟的一轉印部之後執行該脫模性塗布步驟和該轉印步驟。A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: Performing a release coating step of release coating on the surface of the mold; and A transfer step of transferring the pattern of the mold after the mold release coating step is performed to the substrate, After a position detection section detects that the mold is located in an evaporation module for performing the release coating step and a transfer section for performing the transfer step, the release coating step and the rotation are performed.印 step. 根據請求項37或38所述的實施了轉印的基板的生產方法，其其中， 該轉印步驟包括： 使該模和該基板相互壓接的一壓接步驟；以及 從該基板分離該模的一分離步驟， 在為了使該膜移動而旋轉的一膜供給部及一膜回收部中的一個以上未旋轉的狀態下執行該壓接步驟和該分離步驟。The method for producing a substrate subjected to transfer according to claim 37 or 38, wherein: The transfer step includes: A crimping step of crimping the mold and the substrate to each other; and A separation step of separating the mold from the substrate, The crimping step and the separating step are performed in a state where one or more of a film supply part and a film recovery part that are rotated in order to move the film are not rotated. 根據請求項37所述的實施了轉印的基板的生產方法，其其中，還包括： 從該基板分離該模的一分離步驟， 當執行一次該等離子體處理步驟和該脫模性塗布步驟時，執行複數次該轉印步驟和該離步驟。According to claim 37, the method for producing a substrate subjected to transfer, which further includes: A separation step of separating the mold from the substrate, When the plasma treatment step and the release coating step are performed once, the transfer step and the separation step are performed a plurality of times. 根據請求項39所述的實施了轉印的基板的生產方法，其其中，還包括： 當執行複數次該壓接步驟和該分離步驟使得該模的脫模性下降至規定範圍以下時，回收粘接有該模的該膜的一膜回收步驟。According to claim 39, the method for producing a substrate subjected to transfer, which further includes: When the crimping step and the separating step are performed a plurality of times so that the mold releasability of the mold falls below the specified range, a film recovery step of recovering the film to which the mold is bonded. 一種實施了轉印的基板的生產方法，其生產轉印有粘接於一膜的一模的圖案的一基板，該實施了轉印的基板的生產方法的其中，包括下列步驟： 在該模的表面進行脫模性塗布的一脫模塗布步驟， 該脫模塗布步驟包括： 使一第一腔室部和一第二腔室部密閉來形成一塗布空間的一空間形成步驟； 向該塗布空間供給氣相化的一脫模劑的一脫模劑供給步驟；以及 在向該塗布空間供給氣相化的該脫模劑之後，向該塗布空間供給氣體的一吹掃步驟， 在該脫模劑供給步驟中， 通過一起泡器向容納於一罐的液體狀態的該脫模劑供給規定壓力以上的氣體來使該脫模劑氣相化，並將氣相化的該脫模劑供給至該塗布空間， 該第二腔室部配置於比該第一腔室部靠下方， 該膜在該第一腔室部與該第二腔室部之間通過。A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: Perform a release coating step of release coating on the surface of the mold, The release coating step includes: A space forming step of sealing a first chamber portion and a second chamber portion to form a coating space; A mold release agent supply step of supplying a vaporized mold release agent to the coating space; and After supplying the vaporized release agent to the coating space, a purge step of supplying gas to the coating space, In this release agent supply step, The release agent in a liquid state contained in a tank is supplied with a gas of a predetermined pressure or higher by a bubbler to vaporize the release agent, and the vaporized release agent is supplied to the coating space, The second chamber portion is arranged below the first chamber portion, The membrane passes between the first chamber part and the second chamber part. 根據請求項42所述的實施了轉印的基板的生產方法，其其中，還包括： 供給至該塗布空間的氣相化的該脫模劑在塗布該模的表面之後被排出至外部。The method for producing a substrate subjected to transfer according to claim 42, which further includes: The vaporized release agent supplied to the coating space is discharged to the outside after coating the surface of the mold. 根據請求項42所述的實施了轉印的基板的生產方法，其其中，還包括： 對該模的表面進行等離子體處理，以對該模的表面進行改質的一等離子體處理步驟， 在該脫模塗布步驟之前執行該等離子體處理步驟。The method for producing a substrate subjected to transfer according to claim 42, which further includes: Plasma treatment is performed on the surface of the mold to modify the surface of the mold by a plasma treatment step, The plasma treatment step is performed before the release coating step. 一種實施了轉印的基板的生產方法，其其中，包括： 使一第一壓接單元和一第二壓接單元由一面粘接有形成有圖案的一模的一膜的彼此相反的一側朝向該膜移動來將該模壓接於一基板的一壓接步驟；以及 使一模分離單元移動至該基板側來使在該壓接步驟中壓接於該基板的該模從該基板分離的分離步驟，其中，該模分離單元包括一第一輥部，該第一輥部在作為該膜的一面的相反側的該膜的另一面支撐該膜， 該分離步驟包括： 使該模分離單元移動至該第一壓接單元與該第二壓接單元之間的將該基板壓接於該模的空間來從該基板分離被壓接於該基板的該模的一模分離單元移動步驟。A method for producing a substrate subjected to transfer printing, which includes: A first crimping unit and a second crimping unit are moved from opposite sides of a film on which a pattern-formed mold is bonded to the film to crimp the mold to a substrate. Steps; and A separating step of moving a mold separating unit to the side of the substrate to separate the mold crimped to the substrate in the crimping step from the substrate, wherein the mold separating unit includes a first roller portion, and the first The roller portion supports the film on the other side of the film that is the opposite side of the one side of the film, This separation step includes: The mold separation unit is moved to the space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate a mold of the mold crimped to the substrate from the substrate Separation unit moving step. 根據請求項45所述的實施了轉印的基板的生產方法，其其中， 該壓接步驟包括： 使該第一壓接單元及該第二壓接單元由該膜的彼此相反的一側朝向該膜移動的一壓接單元靠近步驟； 使該第二壓接單元的一波紋管朝向該第一壓接單元延伸來使該基板的周圍的空間相對於外部密閉的一密閉步驟；以及 向外部排出殘留於該波紋管的內部的密閉的空間的氣體的一氣體排出步驟。The method for producing a substrate subjected to transfer according to claim 45, wherein: The crimping step includes: Bringing the first crimping unit and the second crimping unit closer to a crimping unit that moves from the opposite side of the film to the film; A sealing step of extending a bellows of the second crimping unit toward the first crimping unit to seal the space around the substrate with respect to the outside; and A gas discharge step of discharging the gas remaining in the closed space inside the bellows to the outside. 根據請求項45所述的實施了轉印的基板的生產方法，其其中， 該分離步驟還包括： 在通過該壓接步驟將該模的圖案轉印於該基板後，使該第一壓接單元上升的一壓接單元上升步驟。The method for producing a substrate subjected to transfer according to claim 45, wherein: The separation step also includes: After transferring the pattern of the mold to the substrate through the crimping step, a crimping unit raising step of raising the first crimping unit. 根據請求項45所述的實施了轉印的基板的生產方法，其其中， 在為了使該膜移動而旋轉的一膜供給部及一膜回收部中的一個以上未旋轉的狀態下，反復執行規定次數的該壓接步驟和該分離步驟。The method for producing a substrate subjected to transfer according to claim 45, wherein: In a state where one or more of the one film supply part and the one film recovery part that are rotated in order to move the film are not rotated, the pressure bonding step and the separation step are repeatedly performed a predetermined number of times.
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CN106079955A (en) * 2016-06-12 2016-11-09 青岛海尔空调器有限总公司 Transfer device and in-mold transfer printing panel in inner mould transfer printing method, film
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KR20180105433A (en) * 2017-03-15 2018-09-28 주식회사 기가레인 Apparatus and method for imprinting
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KR102206491B1 (en) 2021-01-22
TWI818751B (en) 2023-10-11
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KR102203205B1 (en) 2021-01-14
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