TW202119128A - Transfer apparatus and method of manufacturing a transferred wafer using the same - Google Patents

Abstract

The present invention relates to a transfer apparatus and a method for manufacturing a transferred substrate using the same. Specifically, according to an embodiment, a transfer apparatus is provided for transferring a pattern of a mold adhered to a film to a substrate. The transfer apparatus includes: a mold release part configured to perform a mold release coating on a surface of the mold; and a transfer part configured to transfer the pattern of the mold after the mold release coating is performed by the mold release part to the substrate.

Description

Transfer device and production method of transfer substrate using it

The present invention relates to a transfer device and a method for producing a transfer substrate using the transfer device.

In the past, in the semiconductor manufacturing process, a photolithography (Photo Lithography) process was used in order to form a pattern (for example, a mask pattern for etching or vapor deposition) on the surface of a substrate (for example, a wafer). This photoetching process is a process capable of coating a photosensitive material such as a photoresist on the surface of a substrate and then irradiating light to form a desired pattern.

However, the process of forming nano-scale patterns on the surface of the substrate through a photoetching process has a problem of low mass productivity. Recently, in order to improve this problem, a nano-imprint lithography process has been used.

The nano-imprint photolithography process is a technology that can produce nano-structures economically and efficiently. Specifically, the nano-imprint photolithography process uses a transfer device (Transfer Apparatus) to press a mold (Mold) formed with nano-scale patterns and a substrate formed with resin (Resin) to each other. The process of transferring the pattern to the surface of the substrate. The transfer device used in the nanoimprint photoetching process performs the process by crimping the pattern of the mold to the substrate and then separating the mold from the substrate.

However, in the conventional transfer device, due to the low mold releasability, the transfer efficiency of the mold is reduced after the same mold is used multiple times. Therefore, the mold is used at once. In order to improve the mold release For reusability, spin coating was used to apply a release agent to a mold.

However, when the mold release agent is applied to the mold by spin coating for use, although the reusability of the mold is increased, the mold release agent is unevenly applied to the mold, so the coating material may become agglomerated or remain during coating. The problem of foreign objects. In addition, when the pattern of the mold is formed into a fine pattern of 50 nm or less, thicker spin coating will cover the fine pattern, and thus there is a problem that it is difficult to transfer the fine pattern to the substrate.

In addition, in the conventional transfer device, the space of the transfer mold and the space of the separation mold are separated from each other. For this reason, the process of mold movement is added, and the efficiency of the process is reduced.

Therefore, there is a need for a transfer device that uniformly coats the mold release agent without leaving foreign matter during coating, and a transfer device that can increase the reusability of the mold.

In addition, there is a need for a transfer device that can improve the efficiency of the process by omitting the process of mold movement.

technical problem Some embodiments of the present invention are invented based on the background described above, and aim to provide a transfer device capable of improving the efficiency of the process of forming a pattern on the surface of a substrate by reducing the replacement period of the pattern-formed mold.

In addition, it is intended to provide a transfer device that removes foreign matter on the surface of the mold and prevents foreign matter from becoming a defect when the mold is releasable coating.

In addition, it is intended to provide a transfer device capable of omitting the process of mold movement.

Technical solutions According to an aspect of the present invention, there can be provided a transfer device that transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: a mold release part capable of performing a mold release on the surface of the mold. Moldable coating; and a transfer part capable of transferring the pattern of the mold after the mold release coating is performed on the mold release part to a substrate, the mold release part including: a plasma processing module, Before performing the mold release coating on the surface of the mold, it works by treating the surface of the mold with plasma; and an evaporation module that performs mold release coating on the surface of the mold after the plasma treatment .

According to another aspect of the present invention, there can be provided a transfer device that transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: a mold release portion that can be positioned on the surface of the mold. Performing releasable coating; and a transfer section capable of transferring the pattern of the mold after the releasable coating at the release section to a substrate, the release section including a surface that can be applied to the mold A vapor deposition module for releasing coating, a plurality of molds are bonded to the film, the center point of the region where the mold is located in the vapor deposition module and the center point of the region where the mold is located in the transfer part The spacing therebetween is the same as the spacing between the center points of the molds adjacently arranged on the film.

In addition, it is possible to provide a transfer device, wherein the vapor deposition module vaporizes a mold release agent and supplies the vaporized mold release agent to the surface of the mold to coat the mold. s surface.

In addition, it is possible to provide a transfer device, wherein the transfer part is configured such that when the plasma processing module executes a process of treating the surface of the mold with the plasma once, and the vapor deposition module When performing the process of releasable coating on the surface of the mold once, the process of crimping the pattern of the mold to the substrate after the releasability coating and the process of separating the mold from the substrate are performed multiple times .

In addition, it is possible to provide a transfer device, wherein the transfer part includes: a crimping module that can crimp the mold and the substrate to crimp the pattern of the mold to the substrate; and mold separation A unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping module.

In addition, it is possible to provide a transfer device, which further includes: a film supply section capable of supplying the film to which the mold is adhered to the demolding section; and a film recovery section capable of recycling and winding up the film In the film, the mold whose releasability has fallen below a predetermined range is adhered to the film wound in the film recovery section.

In addition, it is possible to provide a transfer device, which further includes: a position detection portion disposed between the vapor deposition module and the transfer portion, thereby detecting that the preceding mold is located in the transfer portion and the next The mold is located in the vapor deposition mold.

In addition, it is possible to provide a transfer device, which further includes a film supply section and a film recovery section that rotates in order to move the film, and the transfer section is configured so that the film supply section and the film recovery section In a state where one or more of the parts are not rotated, the process of crimping the pattern of the mold to the substrate and the process of separating the mold from the substrate are repeatedly performed more than a predetermined number of times, and the transfer device further includes : A control unit that receives position information of the mold from the position detection unit to control the driving of one or more of the film supply unit and the film recovery unit.

According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is located below, and together with the first chamber part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a vaporized release agent to the coating space so as to be able to The surface of the mold is coated, the film passes between the first cavity portion and the second cavity portion, and the fluid supply portion includes: a tank capable of containing the release agent in a liquid state And a bubbler capable of supplying a gas of a predetermined pressure or higher to the release agent in a liquid state contained in the tank to vaporize the release agent.

In addition, it is possible to provide a transfer device, wherein the bubbler discharges the gas from the mold release agent under the surface of the mold release agent contained in the tank to make the mold release agent Vaporization.

In addition, it is possible to provide a transfer device, wherein the vapor deposition module further includes a spraying device capable of spraying the gas at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state. To prevent the vaporized release agent from forming agglomerates.

According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied Releasable coating is performed on the surface of the film, the film passes between the first cavity portion and the second cavity portion, and an inflow port is formed in the second cavity portion, and one side of the inflow port It communicates with the fluid supply part, the other side communicates with the coating space, and the inflow port is arranged below the mold.

In addition, there may be provided a transfer device, wherein a discharge port is formed in the second chamber portion for discharging the release agent flowing into the coating space through the inflow port to the outside, and from The release agent flowing into the coating space from the inflow port contacts the surface of the mold while being discharged to the outside through the discharge port.

According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the cavities is subjected to release coating, the film passes between the first cavity portion and the second cavity portion, and the second cavity portion includes: a cavity base; a cavity protrusion, It is formed protruding from the chamber base; and the chamber side wall, which extends from the chamber base along the edge of the chamber base, and is separated from the chamber protrusion by a predetermined distance to surround the chamber The cavity protrusion.

In addition, it is possible to provide a transfer device, wherein the second chamber portion includes: an inflow port formed on the side wall of the chamber, one side of which is in communication with the fluid supply portion, and the other side is connected to the coating Space communication; and a discharge port, which is formed in the cavity protruding portion, for discharging the release agent that flows into the coating space through the inflow port to the outside, and flows into the coating space from the inflow port The mold release agent contacts the surface of the mold while being discharged to the outside through the discharge port.

In addition, it is possible to provide a transfer device in which the inflow port is formed on the side wall of the chamber and is arranged below the upper surface of the protruding portion of the chamber.

In addition, it is possible to provide a transfer device, wherein a concave portion having a shape recessed from the upper surface of the cavity protruding portion to the lower side is formed at a position corresponding to the inflow port on the edge of the chamber base .

In addition, a transfer device may be provided, wherein a plurality of the inflow ports are provided, at least a part of the plurality of inflow ports are arranged to face each other, and the discharge port is arranged between the inflow ports facing each other The method is formed in the central part of the second chamber part.

According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first chamber part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the coating is releasable coating, the film passes between the first cavity portion and the second cavity portion, and the interior of the coating space is divided into an upper space and a lower space based on the film , A gas discharge port is formed in the first chamber, and the gas discharge port is used to discharge the gas remaining in the upper space on the basis of the film in the coating space to the outside, in the second chamber The chamber part is formed with a discharge port for discharging to the outside the release agent remaining in the lower space on the basis of the film in the coating space.

In addition, it is possible to provide a transfer device, wherein the vapor deposition module further includes: a heater that heats one or more of the first chamber portion and the second chamber portion to reduce the thickness of the coating space The temperature is maintained in the range of 30°C to 80°C.

According to another aspect of the present invention, there can be provided a transfer device, including an evaporation module, the evaporation module including: a first chamber portion; a second chamber portion, which is arranged than the first chamber Part is positioned below, and together with the first cavity part, a coating space for arranging the film to which the mold is attached is formed; and a fluid supply part that supplies a release agent to the coating space so that the mold can be applied The surface of the film is subjected to release coating, the film passes between the first cavity portion and the second cavity portion, and the vapor deposition module further includes a vapor deposition sealing portion that surrounds The coating space is used for sealing between the first chamber portion and the second chamber portion, and the vapor deposition sealing portion includes a first vapor deposition sealing member provided in the first chamber portion And a second vapor deposition sealing member provided in the second chamber, wherein one of the first vapor deposition sealing member and the second vapor deposition sealing member has a planar shape when not in close contact with the other , The other has an arc shape when it is not in close contact with the one.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module and a plasma processing module, the evaporation module including: a first chamber portion; a second chamber portion, which is disposed in Lower than the first cavity portion, and together with the first cavity portion, form a coating space for arranging the film to which the mold is bonded; a fluid supply portion that supplies a release agent to the coating space, In order to be able to perform release coating on the surface of the mold, the plasma treatment module uses plasma to treat the surface of the mold to modify the surface of the mold, and the film is in the first The cavity portion and the second cavity portion pass between the vapor deposition module, and the surface of the mold after the plasma processing module has performed the plasma treatment on the surface of the mold.

According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a mold separating unit, which includes a first roller portion that supports the film on the other side of the film that is the opposite side of the one side of the film, and the first pressure The bonding unit and the second crimping unit move toward the film on the opposite side of the film and are in close contact with each other to crimp the pattern formed in the mold to the substrate, and the first roller The part moves to the space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate .

In addition, it is possible to provide a transfer device, wherein the mold separation unit further includes a second roller portion that supports the film in a manner to bend the film in a direction surrounding a part of the first roller portion.

In addition, it is possible to provide a transfer device, wherein the second crimping unit includes a substrate seating portion capable of pressing the mold against the substrate by the crimping module and the mold separating unit When the mold is separated from the substrate, the substrate is supported, and a suction port capable of adsorbing the substrate is formed in the substrate mounting portion to prevent the mold from being separated from the substrate by pressing the mold against the substrate. The substrate is detached from the second crimping unit during the mold.

In addition, a transfer device may be provided, which further includes: a frame capable of supporting the crimping module and the mold separating unit, the first crimping unit and the second crimping unit to support the The states of the frames move relative to each other, and the mold separation unit moves relative to the molds while being supported by the frame.

According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a frame capable of supporting the crimping module, the first crimping unit and the second crimping unit moving toward the film on opposite sides of the film The pattern formed in the mold is pressed against each other to press-bond the pattern formed on the mold to the substrate, the frame includes a first frame portion and a second frame portion, and the first crimping unit includes: a first crimping body capable of Pressing the mold; and a first guide member fixedly supported on the first frame portion and capable of guiding the movement of the first crimping body, and the second crimping unit includes: a second A crimping body capable of supporting the substrate; and a second guide member that is fixedly supported on the second frame portion and capable of guiding the movement of the second crimping body, the first crimping body And the second crimping body is moved and guided by the first guide member and the second guide member to move up and down relative to the frame.

In addition, a transfer device may be provided, wherein the first crimping unit includes: a first crimping body capable of pressing the mold; and a first supporting portion capable of supporting the first crimping body And a pushing prevention portion, one end of which is fixedly supported by the first frame portion, and the other end is supported by the first support portion, the pushing prevention portion can be passed in the second crimping unit in order to When the substrate is pressurized and raised, the first support portion is pressurized to prevent the first crimping body from being pushed to the upper side due to the rise of the second crimping unit.

In addition, a transfer device may be provided, which further includes: a mold separating unit that moves to a space between the first crimping unit and the second crimping unit for crimping the substrate to the mold To separate the mold crimped to the substrate from the substrate, the frame further includes a third frame portion, and the mold separating unit includes a roller portion that can be separated from the substrate and crimped to the substrate. The mold of the substrate; and a roller guide member that is fixedly supported by the third frame portion and can guide the movement of the roller portion, and the roller portion is guided by the roller guide member to move and guide relative to Move on the frame.

In addition, it is possible to provide a transfer device, wherein the first frame portion, the second frame portion, and the third frame portion are integrally fixedly supported with respect to each other.

According to another aspect of the present invention, there can be provided a transfer device including: a crimping module including a first crimping unit that can move toward a film on which a pattern-formed mold is adhered on one side, and a first crimping unit capable of supporting a substrate A second crimping unit; and a detection unit capable of detecting a first stop position, a second stop position, and a deceleration position of the crimping module, the first crimping unit and the second crimping unit are in place The opposite sides of the film move toward the film and are pressed against each other to press the pattern formed in the mold to the substrate, and the deceleration position is located at the first stop position and the second stop Between positions, the crimping module is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position.

In addition, a transfer device may be provided, which further includes: a control unit that receives position information of the crimping module from the detection unit to control the driving of the crimping module.

According to another aspect of the present invention, there can be provided a transfer device including: a mold separation unit capable of moving a first roller portion supporting the film on the other side of the film on the opposite side to the one side of the film. The substrate side separates the mold crimped to the substrate from the substrate; and a detection unit capable of detecting a first stop position, a second stop position, and a deceleration position of the mold separation unit, the deceleration position Located between the first stop position and the second stop position, the mold separation unit is driven to reach the deceleration position while moving from the first stop position to the second stop position Hourly slow down.

In addition, a transfer device may be provided, which further includes a control unit that receives position information of the crimping module from the detection unit to control the driving of the mold separation unit.

In addition, a transfer device may be provided, wherein the detection unit includes: a first stop position detection sensor for detecting the first stop position; a deceleration position detection sensor for detecting the Deceleration position; and a second stop position detection sensor for detecting the second stop position.

According to another aspect of the present invention, there may be provided a transfer device including: a first crimping unit capable of moving toward a film on which a pattern-formed mold is adhered on one side; and a second crimping unit capable of supporting a substrate A crimping sealing portion, which includes a first crimping sealing member inserted into the first crimping unit, and a shape different from the first crimping sealing member that is inserted into the second crimping unit The second crimping sealing member, the first crimping unit and the second crimping unit are moved toward the film on the opposite side of the film to be closely attached to each other to fix the pattern formed on the mold Crimped to the substrate, one of the first crimping sealing member and the second crimping sealing member has a planar shape when not in close contact with the other, and the other is not in contact with the It has an arc shape when it is tightly attached.

According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A plasma treatment step of treating the surface of the mold with plasma; a releasable coating step of performing a releasable coating on the surface of the mold after the plasma treatment; and a step of releasable coating The transfer step of transferring the pattern of the mold after the releasability coating to the substrate.

According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A releasable coating step of performing releasable coating on the surface of the mold; and a transfer step of transferring the pattern of the mold after releasable coating by the releasable coating step to a substrate, The position detection unit detects that the mold is located in the vapor deposition module for performing the releasable coating step and the transfer unit for performing the transfer step, and then the releasable coating step and the transfer are performed. step.

In addition, there may be provided a method for producing a substrate subjected to transfer, wherein the transfer step includes: a crimping step of crimping the mold and the substrate to each other; and separating the mold from the substrate In the separation step, the crimping step and the separation step are performed in a state where one or more of the film supply part and the film recovery part that are rotated in order to move the film are not rotated.

In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes a separation step of separating the mold from the substrate, and when the plasma treatment step and the release coating step are performed once, The transfer step and the separation step are performed a plurality of times.

In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes: when the crimping step and the separating step are performed a plurality of times so that the mold releasability of the mold falls below a specified range, recovering the adhesive A film recovery step of the film attached to the mold.

According to another aspect of the present invention, it is possible to provide a method of producing a substrate subjected to transfer, which produces a substrate to which a pattern of a mold adhered to a film is transferred, and the method of producing a substrate subjected to transfer includes: A release coating step of performing release coating on the surface of the mold, the release coating step including: a space forming step of sealing a first cavity portion and a second cavity portion to form a coating space; A release agent supply step of supplying vaporized mold release agent to the coating space; and a purge step of supplying gas to the coating space after supplying the vaporized mold release agent to the coating space. In the mold agent supply step, a gas of a predetermined pressure or higher is supplied to the liquid mold release agent contained in the tank through a bubbler to vaporize the mold release agent, and the vaporized mold release agent is supplied In the coating space, the second chamber part is arranged below the first chamber part, and the film passes between the first chamber part and the second chamber part.

In addition, it is possible to provide a production method of a substrate subjected to transfer, which further includes: the vaporized release agent supplied to the coating space is discharged to the outside after coating the surface of the mold.

In addition, it is possible to provide a method for producing a substrate subjected to transfer, which further includes a plasma treatment step of performing plasma treatment on the surface of the mold to modify the surface of the mold. The plasma treatment step is performed before the die coating step.

According to another aspect of the present invention, it is possible to provide a method for producing a substrate subjected to transfer, including: making a first crimping unit and a second crimping unit adhere to a film with a pattern formed on one side opposite to each other. Move the side toward the film to crimp the mold to the substrate in the crimping step; and move the mold separation unit to the substrate side to crimp the mold to the substrate in the crimping step The separating step of separating the mold from the substrate, wherein the mold separating unit includes a first roller portion supporting the film on the other side of the film that is the opposite side of the one side of the film, The separating step includes: moving the mold separating unit to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate from the substrate The mold separation unit moving step of the mold that is crimped to the substrate.

In addition, it is possible to provide a method for producing a substrate subjected to transfer, wherein the crimping step includes: causing the first crimping unit and the second crimping unit to switch from opposite sides of the film to each other. The step of approaching the crimping unit moving toward the film; the sealing step of extending the corrugated tube of the second crimping unit toward the first crimping unit to seal the space around the substrate from the outside; and A gas discharge step of discharging the gas remaining in the closed space inside the bellows to the outside.

In addition, it is possible to provide a method for producing a substrate subjected to transfer, wherein the separating step further includes: after the pattern of the mold is transferred to the substrate through the crimping step, the first The crimping unit ascending step of the crimping unit ascending.

In addition, it is possible to provide a method for producing a substrate subjected to a transfer, in which the pressing is repeatedly performed a predetermined number of times in a state where one or more of the film supply part and the film recovery part that are rotated in order to move the film are not rotated. Connecting step and said separating step.

The effect of the invention Some embodiments of the present invention are based on the above-mentioned background invention, and by coating the mold surface with mold release properties, it has the effect of improving the mold release properties of the mold surface.

In addition, by improving the releasability of the mold surface, the pattern can be transferred to a plurality of substrates with one mold, which has the effect of improving the reusability of the mold.

In addition, by shortening the mold replacement cycle, the time for transferring the pattern to the substrate can be shortened, and the efficiency of the manufacturing process can be improved.

In addition, by omitting the process of moving the mold to a position where the mold can be separated from the substrate between the process of crimping the mold and the substrate and the process of separating the mold and the substrate from each other, the efficiency of the process can be improved.

Specific embodiments for realizing the idea of the present invention will be described in detail below with reference to the accompanying drawings.

Meanwhile, when describing the present invention, when it is judged that the specific description of the related conventional configuration or function may make the gist of the present invention unclear, the detailed description thereof is omitted.

In addition, when a component is referred to as “connected to”, “supported by”, “flowed into”, “supply to”, “flowed to”, or “combined with” another component, it should be understood that it may be directly connected to , Support, flow in, supply to, flow to, and combine with this other component, but there may also be other components in between.

The terms used in this specification are only used to illustrate specific embodiments, and are not used for the purpose of limiting the present invention. Unless clearly defined differently in the context, singular expressions include plural expressions.

In addition, terms including ordinal numbers such as first and second can be used to describe various constituent elements, but these constituent elements should not be limited by such terms. These terms are only used for the purpose of distinguishing one component from another.

The meaning of "including" used in the specification makes specific characteristics, regions, constants, steps, actions, elements, and/or components specific, and does not exclude other specific characteristics, regions, constants, steps, actions, elements, components, and / Or the presence or addition of the group.

In addition, it should be noted in advance that the upper, lower, upper, lower and other expressions in this specification are described on the basis of what is shown in the figure, and when the direction of the object changes, the expressions may be different. On the other hand, the up-down direction in this specification may be the up-down direction in FIGS. 1, 3, and 7. In addition, the left-right direction may be the left-right direction of FIGS. 1, 3 and 7.

The specific configuration of the transfer device 1 according to an embodiment of the present invention will be described below with reference to the drawings.

As follows, referring to FIG. 1, the transfer device 1 according to an embodiment of the present invention can press the mold 20 and the substrate 30 adhered to the film 10 to transfer the pattern formed on the mold 20 to the substrate 30. Such a transfer device 1 can move the film 10 in one direction to move the mold 20. In addition, the transfer device 1 can repeatedly use one mold 20 to form patterns on a plurality of substrates 30 by applying a mold release coating to the surface of the mold 20. Such a transfer device 1 may include a substrate storage unit 100, a spin coater 200, an alignment unit 300, a film supply unit 400, a feed roller 500, a protective film recovery unit 600, a mold release unit 700, a transfer unit 800, and a film recovery unit. Department 900.

The film 10 can be moved by the transfer device 1 so as to sequentially pass through the film supply part 400, the release part 700, the transfer part 800, and the film recovery part 900. Here, the membrane supply part 400 may be the upstream side, and the membrane recovery part 900 may be the downstream side.

2, the substrate storage part 100 may provide a space for receiving the substrate 30 before the transfer part 800 transfers the pattern. Such a substrate storage unit 100 can store a plurality of substrates 30 in a stacked manner. In addition, the substrate 30 accommodated in the substrate accommodating part 100 may be made of metal, silicon, sapphire, glass, or the like. Such a substrate 30 can be drawn out from the substrate storage part 100 by the transfer unit T and transferred to the spin coater 200. For example, the transfer unit T may be a robot arm. In addition, the substrate accommodating part 100 may provide a space for accommodating the substrate 30 after the transfer of the pattern by the transfer part 800. The substrate 30 to which such a pattern has been transferred can be transferred from the transfer unit 800 by the transfer unit T and stored in the substrate storage unit 100. In addition, in the substrate accommodating portion 100, the space for accommodating the substrate 30 before the transfer pattern and the space for accommodating the substrate 30 after the transfer pattern may be separated.

The spin coater 200 can uniformly coat the resin with a predetermined thickness on the surface of the substrate 30 transferred from the substrate storage part 100 by a spin coating (Spin Coating) method. Here, the spin coating method will be briefly described. In the spin coating method, the substrate 30 is placed on a support that performs a rotational movement, and a liquid fluid resin is dropped on the surface of the substrate 30. At this time, the surface of the substrate 30 can be coated with resin by uniformly spreading the fluid resin on the surface of the substrate 30 with a predetermined thickness by the centrifugal force generated by the high-speed rotation of the support. Such a resin coated on the surface of the substrate 30 may include all conventional photocurable resins that have a property of being cured by UV (Ultra Violet) reaction. For example, the resin may include acrylic hardening resin. Such a substrate 30 may be transferred to the cooling plate 210 before being transferred to the spin coater 200 so that the surface is uniformly coated with resin. In addition, the substrate 30 may be transferred to the spin coater 200 after the temperature of the cooling plate 210 is adjusted to a predetermined range. For example, the cooling plate 210 can adjust the temperature of the substrate 30 to 30°C or less. The substrate 30 after coating the resin by the spin coater 200 may be transferred to the alignment unit 300 by the transfer unit T.

On the other hand, in the following, even if not otherwise stated, the substrate 30 may be defined as the substrate 30 after the resin is coated by the spin coater 200, and transferring the pattern of the mold 20 to the substrate 30 may mean that the pattern of the mold 20 is transferred to The resin formed on the substrate 30.

The aligning unit 300 can align the substrate 30 in a set direction before the substrate 30 coated by the spin coater 200 is transferred to the transfer unit 800. Such an aligning unit 300 can align the substrate 30 by rotating the substrate 30 in the horizontal direction so that the holes (thickness-direction through holes or side grooves, not shown) formed in the substrate 30 face a set direction. In addition, the substrate 30 may be aligned in a direction corresponding to the pattern of the mold 20 to be described later. For example, the aligning unit 300 may align the substrate 30 by a photo sensor. As a more detailed example, the aligning unit 300 may include a light emitting component (not shown) capable of irradiating a laser or the like and a light receiving member (not shown) capable of identifying a laser or the like. Such a light-emitting part can irradiate the laser beam to the side of the substrate 30, and the light-receiving part can recognize the laser beam that has passed through a hole formed on one side of the substrate 30. Therefore, the substrate 30 can be placed on the supporting body for rotating motion, and when the hole of the substrate 30 faces the set direction during the rotation of the substrate 30 through the supporting body, the light-receiving part passes through the hole to identify the light irradiated by the light-emitting part. Laser, and the rotation of the substrate 30 can be stopped. In this way, when the alignment unit 300 performs alignment such that the substrate 30 faces the set direction, it can be transferred to the transfer unit 800 by the transfer unit T.

The film supply part 400 may support the wound film 10. In addition, by rotating the film supply part 400, the film 10 wound up can be continuously supplied to the mold release part 700. As shown in FIG. In addition, the film 10 wound on the film supply part 400 may be bonded with a patterned mold 20. In the film 10, a plurality of molds 20 may be arranged with a predetermined distance in the direction in which the film 10 extends. In this way, in the film 10 wound on the film supply part 400, a protective film can be adhered to both surfaces of the film 10 to prevent adhesion of the surface to which the mold 20 is adhered and the opposite surface thereof. Such a film supply unit 400 can be driven in a manner of being rotated by a driver. In addition, the film supply part 400 can rotate in one direction to move the film 10 from the film supply part 400 to the film recovery part 900. On the other hand, the film 10 supplied by the film supply part 400 may be a resin film, for example.

The film recovery part 900 can rotate in one direction to recover and wind up the film 10 supplied from the film supply part 400. The mold 20 adhered to the film 10 wound up in the film recovery part 900 may be the mold 20 whose releasability has fallen below a predetermined range. In other words, the releasability of the mold 20 used multiple times to transfer the pattern to the substrate 30 may fall below the prescribed range. Since the mold 20 with reduced releasability cannot transfer the pattern to the substrate 30, it may be recycled to Film recovery part 900. Such a film recovery part 900 can be driven to be rotated by a driver. In addition, the film recovery part 900 can rotate in one direction to move the film 10 from the film supply part 400 to the film recovery part 900. For example, the film recovery part 900 may rotate simultaneously with the film supply part 400 to transfer the film 10. However, this is only an example, and the film recovery part 900 may be driven to rotate independently of the film supply part 400. In addition, since the rotation force of the film recovery part 900 is greater than the rotation force of the film supply part 400, the rotation of the film recovery part 900 can rotate the film supply part 400. Therefore, the film 10 may be moved by rotating one of the film supply part 400 and the film recovery part 900 in one direction. Such a film 10 can be moved from the upstream side to the downstream side so as to sequentially pass through the mold release section 700 and the transfer section 800 during the movement.

The feed roller 500 can guide the movement of the film 10 and can support the film 10. A plurality of such feed rollers 500 may be provided, and the plural feed rollers 500 may be arranged in the movement path of the film 10. For example, the feed roller 500 may be arranged between at least a part of the film supply part 400, the protective film recovery part 600, the release part 700, the transfer part 800, and the film recovery part 900. In addition, the plurality of feed rollers 500 may be passive rollers rotated by the movement of the film 10 or the like.

The protective film recovery part 600 can recover the protective film adhered to the film 10. A plurality of such protective film recovery parts 600 may be provided to recover the protective films adhered to both sides of the film 10, respectively. In addition, the protective film recovery part 600 may recover the protective film from the film 10 before the mold 20 is transferred to the demolding part 700.

Referring to FIG. 3, the mold release part 700 may perform mold release coating on the surface of the mold 20 to improve the mold release property of the surface of the mold 20. Such a mold release part 700 can supply a mold release agent to the surface of the mold 20 to apply a mold release coating to the surface of the mold 20. Such a mold release agent may include at least one of a fluorine-based mold release agent and a silicon-based mold release agent. In addition, the mold release part 700 may perform plasma treatment on the surface of the mold 20 by plasma (Plasma) before performing the mold release coating on the surface of the mold 20. Such a demolding part 700 may include a plasma processing module 710 and an _{evaporation module} 720.

The plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before releasable coating on the surface of the mold 20 to modify the surface of the mold 20 to improve the gap between the surface of the mold 20 and the release agent.的adhesion. In addition, the plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before applying the mold release agent to clean the surface of the mold 20, so as to prevent the mold 20 from being demolded with foreign matter remaining on the surface of the mold 20 Sexual coating. For example, the plasma processing module 710 is a normal pressure plasma generating device, which can generate plasma using one or more of _{argon (Ar), nitrogen (N 2} ), and oxygen (O _{2) as a medium.} In addition, the plasma processing module 710 may include a plasma generation part 711 and a guide roller 712. The plasma generation part 711 generates plasma on the surface of the mold 20 to smoothly perform plasma treatment. The guide roller 712 is The upper portion of the film 10 guides the position of the film 10 so as to maintain the surface of the mold 20 and the plasma generating portion 711 at a certain pitch or less. The mold 20 whose surface is plasma-treated in such a plasma processing module 710 can be transferred to the vapor deposition module 720.

In this way, the plasma processing module 710 has the effect of modifying the surface of the mold 20 to improve the adhesive force between the surface of the mold 20 and the release agent. In addition, there is an effect of cleaning the surface of the mold 20 to prevent the occurrence of defects due to releasability coating in a state where foreign matter is deposited on the surface of the mold 20.

The vapor deposition module 720 can coat the surface of the mold 20 with a release agent. In other words, the vapor deposition module 720 can coat the surface of the mold 20 whose surface is plasma-treated by the plasma processing module 710 with a release agent. In addition, the evaporation module 720 may be arranged downstream of the plasma processing module 710. Such a vapor deposition module 720 can coat the surface of the mold 20 with a mold release agent to improve the mold releasability of the surface of the mold 20. In addition, the vapor deposition module 720 can improve the releasability of the surface of the mold 20 by transferring a plurality of substrates 30 from one mold 20, thereby improving the reusability of the mold 20. In addition, the vapor deposition module 720 can vaporize the release agent. In addition, the vapor deposition module 720 can supply the vaporized mold release agent to the surface of the mold 20 to uniformly apply the mold release agent to the surface of the mold 20. Such an evaporation module 720 may include a first chamber part 721, a second chamber part 722, a fluid supply part 723, a gas discharge part 724, an evaporation sealing part 725, a chamber driver 726, a heater 727, and a pressure调部728。 Adjusting section 728.

4 and 5, the first cavity portion 721 and the second cavity portion 722 may provide a coating space T1 for coating the surface of the mold 20 with a release agent. Such a coating space T1 can be defined as a space formed inside the first cavity portion 721 and the second cavity portion 722 when the first cavity portion 721 and the second cavity portion 722 are in close contact. In addition, the coating space T1 may be formed by the second cavity portion 722 rising toward the first cavity portion 721 through the cavity driver 726, so that the first cavity portion 721 and the second cavity portion 722 are in close contact with each other. Here, the meaning that the second cavity portion 722 and the first cavity portion 721 are in close contact means that although the film 10 is interposed between the first cavity portion 721 and the second cavity portion 722, the coating space T1 is sealed to the outside. status. On the other hand, the coating space T1 can provide a space for arranging the mold 20 and a space for supplying a release agent on the surface of the mold 20.

The first cavity portion 721 may be formed with a first cavity groove 721a into which a first vapor deposition sealing member 725a to be described later can be inserted. Such a first cavity groove 721a may be formed in the first cavity portion 721 corresponding to the position of the second cavity groove 722b-2 described later when the first cavity portion 721 and the second cavity portion 722 are in close contact.

In addition, a gas discharge port 721 b for flowing the gas remaining on the upper side of the interior of the coating space T1 may be formed in the first chamber portion 721. One side of such a gas discharge port 721b may be in communication with the coating space T1, and the other side may be in communication with the pressure adjustment flow path 728a. For example, the gas discharge port 721b may be formed in the central part of the first chamber part 721, and the mold 20 may be arranged on the lower side of the gas discharge port 721b.

The second cavity portion 722 may be in close contact with the first cavity portion 721 via the film 10 and the mold 20 to form the coating space T1. Such a second chamber part 722 can be raised toward the first chamber part 721 by the chamber driver 726. The second cavity portion 722 may include a cavity base 722a, a cavity side wall 722b, and a cavity protrusion 722c.

The cavity base 722a can support the cavity sidewall 722b and the cavity protrusion 722c, and can be supported by the cavity driver 726.

The chamber side wall 722b may be formed to protrude upward from the chamber base 722a, and may be formed to extend along the edge of the chamber base 722a. In addition, a second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed in the chamber side wall 722b. Such a second cavity groove 722b-2 may be formed in the second cavity portion 722 corresponding to the position of the first cavity groove 721a when the first cavity portion 721 and the second cavity portion 722 are in close contact. Such a cavity side wall 722b may be formed to be separated from the cavity protrusion 722c by a predetermined distance to surround the cavity protrusion 722c. In addition, an inflow port 722b-1 for the release agent to flow may be formed on the side wall 722b of the cavity.

The inflow port 722b-1 may provide a passage for the release agent flowing in from the fluid supply part 723 to flow into the coating space T. One side of such an inflow port 722b-1 may be in communication with a second supply flow path 723e of the fluid supply part 723 to be described later, and the other side may be in communication with the coating space T1. In addition, a plurality of inflow ports 722b-1 may be formed, and the plurality of inflow ports 722b-1 may be arranged to be spaced apart along the circumferential direction of the chamber side wall 722b. For example, four inflow ports 722b-1 may be provided. In this way, the inflow port 722b-1 is formed in the chamber side wall 722b at different positions, so that the release agent flowing in through the inflow port 722b-1 flows toward the mold 20 in different directions. On the other hand, the release agent flowing into the coating space T1 through the inflow port 722b-1 can flow in the coating space T1 and contact the surface of the mold 20 to coat the surface of the mold 20.

On the other hand, the inflow port 722b-1 may be located on the lower side of the mold 20 to prevent the release agent sprayed from the side communicating with the coating space T1 and flowing toward the mold 20 from being directly sprayed to the mold 20. Here, the lower side of the mold 20 refers to a position lower than a virtual plane extending through the surface of the mold 20 so as not to adhere to the surface of the film 10. In this way, the inflow port 722b-1 is arranged on the lower side of the mold 20 so that the release agent flowing from the inflow port 722b-1 toward the mold 20 can be uniformly dispersed in the coating space T1 and the surface of the mold 20 can be uniformly coated.

A second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed in the chamber side wall 722b. Such a second cavity groove 722b-2 may be formed in the second cavity portion 722 corresponding to the position of the first cavity groove 721a when the first cavity portion 721 and the second cavity portion 722 are in close contact.

The cavity protrusion 722c may be formed to protrude from the cavity base 722a. Such a cavity protrusion 722c may be surrounded by the cavity side wall 722b, and may be formed on the cavity base 722a so as to be separated from the cavity side wall 722b by a predetermined distance. In addition, a discharge port 722c-1 may be formed in the cavity protrusion 722c.

The discharge port 722c-1 may provide a passage for discharging the release agent flowing into the coating space T1 through the inflow port 722b-1 to the outside. Such a release agent flowing into the coating space T1 through the inflow port 722b-1 can be discharged to the outside toward the discharge port 722c-1 after the surface of the coating die 20. In addition, one side of the discharge port 722c-1 may be in communication with the coating space T1, and the other side of the discharge port 722c-1 may be in communication with the gas discharge part 724. The discharge port 722c-1 may communicate with the inflow port 722b-1 through the coating space T1. On the other hand, the discharge port 722c-1 may be formed at the center of the cavity protrusion 722c, and the mold 20 may be arranged on the upper side of the discharge port 722c-1. In this way, the discharge port 722c-1 is formed at the center of the cavity protrusion 722c, and the mold 20 is arranged on the upper side thereof, so that the release agent flowing in through the plurality of inflow ports 722b-1 can coat the mold 20 in different directions. The surface is then discharged to the outside.

On the other hand, the cavity protrusion 722c may be formed on the cavity base 722a such that the upper surface of the cavity protrusion 722c is arranged on the upper side than the inlet 722b-1. In other words, the cavity protrusion 722c may be formed on the cavity base 722a such that the distance from the cavity base 722a to the upper surface of the cavity protrusion 722c is longer than the distance from the cavity base 722a to the inflow port 722b-1. In this way, the inflow port 722b-1 is formed on the lower side than the upper surface of the cavity protrusion 722c, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the cavity protrusion 722c, and The release agent can be uniformly dispersed in the coating space T1. In addition, the discharge port 722c-1 can change the flow direction of the release agent flowing in through the plurality of inflow ports 722b-1, so that the release agent is dispersed in the coating space T1. Thus, the surface of the mold 20 can be uniformly coated with the release agent.

In this way, the first cavity portion 721 and the second cavity portion 722 have the effect of being able to uniformly coat the surface of the mold 20 with the release agent.

3 again, a concave portion 722c-2 capable of dispersing the release agent flowing into the coating space T1 through the inflow port 722b-1 may be formed in the cavity convex portion 722c. Such a concave portion 722c-2 may be formed to have a shape recessed from the upper surface of the cavity convex portion 722c to the lower side, and may be formed on the edge of the cavity convex portion 722c. In this way, the concave portion 722c-2 is introduced into the edge of the cavity convex portion 722c, so that a boss generated by the concave portion 722c-2 can be formed on the edge of the cavity convex portion 722c. In addition, the concave portion 722c-2 may be formed in the cavity convex portion 722c at a position adjacent to the inflow port 722b-1.

On the other hand, a plurality of concave portions 722c-2 may be formed, and a plurality of concave portions 722c-2 may be formed corresponding to the plurality of inflow ports 722b-1. For example, four concave portions 722c-2 may be formed, and four concave portions 722c-2 may be formed at positions adjacent to the four inflow ports 722b-1. In this way, the concave portion 722c-2 is formed at a position adjacent to the inflow port 722b-1, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the concave portion 722c-2, and a vortex phenomenon can occur. . Therefore, the release agent can be dispersed in the coating space T1 by the vortex phenomenon generated by the concave portion 722c-2 without forming agglomerates, and can uniformly contact and coat the surface of the mold 20.

In this way, the recessed portion 722c-2 has the effect of preventing the mold-releasing coating from clumping on the mold 20 through the eddy current phenomenon and causing defects.

5 again, the fluid supply part 723 can supply a mold release agent to the coating space T1 to perform a mold release coating on the surface of the mold 20 arranged in the coating space T1. In addition, the fluid supply part 723 may vaporize the mold release agent and supply the vaporized mold release agent to the coating space T1 through the inflow port 722b-1. Such a fluid supply part 723 may include a fluid container 723a, a tank 723b, a bubbler 723c, a first supply flow path 723d, a second supply flow path 723e, and an ejection device 723f.

The fluid containing body 723a may provide a space for containing inert gas. The inert gas contained in such a fluid container 723a may be in a high-pressure gas state. In addition, the inert gas may be nitrogen (N ₂ ). In addition, the fluid container 723a can supply inert gas to one or more of the bubbler 723c and the ejector 723f through the first supply flow path 723d.

The tank 723b may provide a space for accommodating the release agent. Such a release agent contained in the tank 723b may be in a liquid state. In addition, the tank 723b can receive the inert gas through the bubbler 723c, and the release agent that receives the inert gas can be vaporized and supplied to the coating space T1. Therefore, the vaporized release agent can be dispersed in the coating space T1 without forming agglomerates, so that the surface of the mold 20 can be uniformly contacted and coated.

The bubbler 723c can supply an inert gas of a predetermined pressure or higher to the release agent in a liquid state contained in the tank 723b to vaporize the release agent. Such a bubbler 723c can discharge inert gas below the surface of the release agent contained in the tank 723b. For example, the bubbler 723c may be a flow pipe or an ejection port formed with a plurality of ejection holes. However, the present invention is not limited by this.

The first supply flow path 723d may provide a passage for the inert gas flowing in from the fluid container 723a to flow to one or more of the bubbler 723c and the injection device 723f. One side of such a first supply flow path 723d may be in communication with the fluid container 723a, and the other side may be in communication with one or more of the bubbler 723c and the injection device 723f.

The second supply flow path 723e may provide a channel for the vaporized mold release agent flowing in from the tank 723b to flow to the inlet 722b-1 of the second chamber part 722. One side of such a second supply flow path 723e may communicate with the inside of the tank 723b, and the other side may communicate with the coating space T1 through the inflow port 722b-1.

The injection device 723f can prevent the release agent vaporized inside the tank 723b from clumping again. Such an injection device 723f can be arranged at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state contained in the tank 723b to supply the inert gas. Therefore, the injection device 723f can inject an inert gas at a position spaced a predetermined distance from the surface of the release agent to prevent the vaporized release agent from clumping again.

In this way, the fluid supply part 723 has an effect of being able to vaporize the release agent to uniformly coat the surface of the mold 20 without agglomeration. In addition, it has the effect of preventing the release agent that has been vaporized from clumping again.

The gas discharge part 724 can discharge the gas and the release agent remaining on the second chamber part 722 side (for example, the lower side in FIG. 5) from the inside of the coating space T1 with the film 10 as a reference. Such a gas discharge part 724 may include a discharge flow path 724a and a discharge pump 724b.

The discharge flow path 724a may provide a passage for the gas and the release agent on the lower side of the inside of the coating space T1 to flow to the outside. One side of such a discharge flow path 724a may communicate with the coating space T1 through the discharge port 722c-1 of the second chamber portion 722, and the other side may communicate with the outside through a discharge pump 724b.

The pressure adjusting unit 728 can discharge the gas remaining on the upper side of the coating space T1 on the basis of the film 10 to the outside. Such a pressure adjustment part 728 may include a pressure adjustment flow path 728a.

The pressure adjustment flow path 728a may provide a passage for the gas remaining on the upper side of the inside of the coating space T1 to flow to the outside. One side of such a pressure regulating flow path 728a can communicate with the gas discharge port 721b of the first chamber portion 721 and the coating space T1, and the other side can communicate with the outside through a discharge pump 724b.

On the other hand, in the drawings of this embodiment, although the pressure adjustment flow path 728a is shown to communicate with the discharge pump 724b of the gas discharge part 724, the idea of the present invention is not limited to this, and the pressure adjustment part 728 may be further A different pump than the discharge pump 724b of the gas discharge part 724 is included, and the gas in the pressure adjustment flow path 728a can be discharged to the outside by such another pump.

When the gas discharge part 724 discharges the gas on the lower side of the inside of the coating space T1, the pressure difference between the upper side and the lower side of the coating space T1 will cause the film 10 to shake and hinder the coating of the mold 20, so it can be prevented from being discharged by the pressure regulating part 728 The gas on the upper side of the interior of the coating space T1 generates a pressure difference between the upper side and the lower side of the interior of the coating space T1.

In this way, the pressure adjusting part 728 has the effect of preventing the pressure difference between the upper side and the lower side of the inside of the coating space T1 and preventing the coating of the mold 20 from being hindered.

When the first cavity portion 721 and the second cavity portion 722 are substantially in close contact, the vapor deposition sealing portion 725 can seal the first cavity portion 721 and the second cavity portion 722. Such a vapor deposition sealing part 725 can block the coating space T1 from the outside by sealing the space between the first chamber part 721 and the second chamber part 722. In addition, the vapor deposition sealing part 725 may be formed to surround the coating space T1 to perform sealing between the first chamber part 721 and the second chamber part 722. Such a vapor deposition sealing part 725 may include a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b.

The first vapor deposition sealing member 725a may be inserted into the first chamber groove 721a arranged and formed in the first chamber portion 721. In addition, the second vapor deposition sealing member 725b may be inserted and arranged in the second chamber groove 722b-2 formed in the second chamber portion 722. Such a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b may be arranged to face each other. In other words, when the first cavity portion 721 and the second cavity portion 722 are in close contact, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b can pressurize each other, and can pressurize the first cavity portion 721 and the second vapor deposition sealing member 725b. The gap between the second chamber portions 722 is sealed.

On the other hand, referring to the enlarged view of FIG. 5, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact with each other, the film 10 may be interposed between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725a. Between parts 725b. In addition, the first vapor deposition sealing member 725 a can press the film 10 on the upper part of the film 10, and the second vapor deposition sealing member 725 b can press the film 10 on the lower part of the film 10. At this time, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b can be configured to have both the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b to prevent the film 10 from being wrinkled while being effective. The shape of the gap between the first cavity portion 721 and the second cavity portion 722 is sealed.

For example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed in the same O-ring shape, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact Time may cause the film 10 to wrinkle. As another example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed such that the surfaces in contact with each other are planar, the film 10 can be prevented from wrinkling. However, since the pressing force between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b is weak, the first chamber portion 721 and the second chamber portion 722 cannot be normally sealed. Therefore, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b need to be formed in different shapes to prevent the film 10 from being wrinkled and to seal the coating space T1. For example, one of the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may have a flat shape when not in close contact with the other, and the other may have an O-shape when not in close contact with the one. Circular arc shape such as ring.

The chamber driver 726 can raise and lower the second chamber part 722 with respect to the first chamber part 721. Such a chamber driver 726 may be connected to the second chamber part 722.

In this way, the vapor deposition sealing portion 725 has an effect of preventing the film 10 from wrinkling.

The heater 727 can maintain the temperature of the coating space T1 within a predetermined range to improve the adhesion between the surface of the mold 20 and the release agent. Such a heater 727 can heat more than one of the first cavity portion 721 and the second cavity portion 722 to increase the temperature of the coating space T1. For example, when the temperature of the coating space T1 is 30°C or less, sufficient release coating may not be performed on the surface of the mold 20, and when the temperature of the coating space T1 is 80°C or more, the film 10 may be damaged. Therefore, the heater 727 can maintain the temperature of the coating space T1 in the range of 30°C to 80°C.

In this way, the heater 727 has an effect of maintaining the temperature of the coating space T1 within a predetermined range to increase the adhesive force between the surface of the mold 20 and the release agent.

In this way, the vapor deposition module 720 according to an embodiment of the present invention has an effect of improving the releasability of the surface of the mold 20 by coating the surface of the mold 20 with releasability. In addition, by improving the releasability of the surface of the mold 20, it is possible to transfer a plurality of substrates 30 with one mold 20, and there is an effect that the reusability of the mold 20 can be improved. In addition, by reducing the replacement period of the mold 20, the time for transferring the pattern to the substrate 30 can be shortened, and the efficiency of the manufacturing process can be improved.

6, the transfer part 800 can transfer the pattern of the mold 20 to the substrate 30. For example, the transfer part 800 may perform the process of crimping the pattern of the mold 20 to the substrate 30 and removing the pattern of the mold 20 from the substrate 30 in a state where one or more of the film supply part 400 and the film recovery part 900 are not rotated to stop the movement of the film 10 The process of separating the mold 20 is to transfer the pattern to the substrate 30. In addition, after the mold release section 700 performs releasability coating on the surface of the mold 20, the transfer section 800 can press one mold 20 to be releasable coating on the plurality of substrates 30 to transfer the pattern to the plurality of substrates. 30. For example, the transfer part 800 may repeatedly perform the process of crimping the pattern of the mold 20 to the substrate 30 for a predetermined number of times in a state where one or more of the film supply part 400 and the film recovery part 900 is not rotated to stop the movement of the film 10 And the process of separating the mold 20 from the substrate 30 to transfer the pattern to the plurality of substrates 30. As a more detailed example, when the plasma processing module 710 uses plasma to treat the surface of the mold 20 once, and the vapor deposition module 720 performs a mold release coating process on the surface of the mold 20, the transfer The part 800 may perform the process of crimping the pattern of the mold 20 to the substrate 30 after the release coating and the process of separating the mold 20 from the substrate 30 multiple times. In addition, the process of moving the transfer part 800 between the process of crimping the pattern of the mold 20 to the substrate 30 and the process of separating the mold 20 from the substrate 30 to the position of the substrate 30 and the mold 20 for crimping each other can be omitted. . Such a transfer part 800 may include a frame 810, a crimping module 820, a mold separation unit 830, and a detection unit 840.

6 and 7, the frame 810 may support the crimping module 820, the mold separating unit 830, and the detecting unit 840. Such a frame 810 may be formed to surround at least a part of the crimping module 820 and the mold separating unit 830. Therefore, the crimping module 820 and the mold separating unit 830 can move inside the frame 810 while being supported by the frame 810. In other words, the crimping module 820 and the mold separating unit 830 can move relative to the frame 810. For example, the first crimping unit 821 and the second crimping unit 822 can move relative to each other while being supported by the frame 810, and the mold separating unit 830 can move relative to the mold 20 while being supported by the frame 810. Therefore, instead of moving the mold 20 from the crimping module 820 to the mold separating unit 830, the mold separating unit 830 moves relative to the mold 20, so that the process of crimping the mold 20 and the substrate 30 and making the mold 20 and the substrate can be omitted A process in which the mold 20 crimped to the substrate 30 and the substrate 30 is moved to a position where the mold 20 is separated from the substrate 30 between processes that are separated from each other. In addition, the frame 810 may include a first frame portion 811 supporting the first crimping unit 821, a second frame portion 812 supporting the second crimping unit 822, and a third frame portion 813 supporting the mold separating unit 830. The first frame portion 811, the second frame portion 812, and the third frame portion 813 may be integrally fixed and supported with respect to each other. In addition, the second frame portion 812 can support the loads of the first frame portion 811 and the third frame portion 813.

The crimping module 820 can crimp the pattern of the mold 20 to the substrate 30. Such a crimping module 820 can crimp the pattern of the mold 20 in which the surface is plasma-treated by the mold release section 700 and the surface is releasably coated to the substrate 30. In addition, the crimping module 820 can press the mold 20 and the substrate 30 relative to each other to crimp the pattern of the mold 20 to the substrate 30. Such a crimping module 820 may include a first crimping unit 821, a second crimping unit 822, an exhaust portion 823, a suction portion 824, a driving portion 825, and a crimping sealing portion 826.

Referring to FIG. 8, the first crimping unit 821 and the second crimping unit 822 can move relative to each other to be closely attached to each other to crimp the pattern formed on the mold 20 to the substrate 30. In other words, the first crimping unit 821 and the second crimping unit 822 can move toward the film 10 on the opposite side of the film 10 to be in close contact with each other. In addition, one or more of the first crimping unit 821 and the second crimping unit 822 can press the mold 20 or the substrate 30 in a direction in which they are in close contact with each other. In this way, one or more of the first crimping unit 821 and the second crimping unit 822 presses the mold 20 and the substrate 30 to each other, so that the pattern formed on the mold 20 can be crimped to the substrate 30. For example, the first crimping unit 821 supports the mold 20, and the second crimping unit 822 presses the substrate 30 toward the mold 20, whereby the pattern of the mold 20 can be crimped to the substrate 30. As another example, the second crimping unit 822 can support the substrate 30, and the first crimping unit 821 presses the mold 20 toward the substrate 30, so that the pattern of the mold 20 can be crimped to the substrate 30.

The first crimping unit 821 and the second crimping unit 822 can be raised and lowered relative to each other by the driving part 825, and the speed of raising and lowering the first crimping unit 821 and the second crimping unit 822 can be individually controlled. In addition, the first crimping unit 821 and the second crimping unit 822 can move relative to the frame 810. In other words, the first crimping unit 821 and the second crimping unit 822 can be raised and lowered inside the frame 810 while being supported by the frame 810.

On the other hand, the first crimping unit 821 may include a first crimping body 821a, a first supporting portion 821b, an irradiation portion 821c, a pushing preventing portion 821d, a first guide member 821e, and a fixing member 821f.

The first crimping body 821a can be in close contact with the bellows 822b of the second crimping unit 822 to be described later, and can press the film 10 to which the mold 20 is adhered to crimp the pattern of the mold 20 to the substrate 30. Such a first crimping body 821a can be supported by the first support portion 821b, and can be raised and lowered together with the first support portion 821b by the first driver 825a that lifts the first support portion 821b. In addition, the first crimping body 821a may be supported by the first supporting portion 821b, but the first crimping body 821a may also be fixedly disposed on the first supporting portion 821b. In addition, the first crimping body 821a can be lowered toward the film 10 by the first driver 825a, and press the film 10 on the upper side of the film 10 to press the mold 20 against the substrate 30.

On the other hand, the first pressure-bonding body 821a may be formed with a first sealing groove 821a-1 into which a first pressure-bonding sealing member 826a to be described later can be inserted. Such a first seal groove 821a-1 can be formed corresponding to the position of the second seal groove 822b-1 of the second crimping unit 822 to be described later when the first crimping unit 821 and the second crimping unit 822 are in close contact. In the first crimping body 821a.

The first support portion 821b may support the first crimping body 821a, and may be supported by the first driver 825a. In addition, the movement of the first support portion 821b can be guided by the first guide member 821e. In other words, the first guide member 821e is provided in the first support portion 821b in a penetrating manner, so that the first support portion 821b can move along the first guide member 821e extending in one direction (for example, the up-down direction in FIG. 7). In this way, the first support portion 821b can move along the first guide member 821e to move relative to the frame 810. In other words, the first support portion 821b can be raised and lowered relative to the frame 810 together with the first crimping body 821a by the first driver 825a being raised and lowered.

The irradiation part 821c can harden the pattern crimped to the substrate 30 by the mold 20. When the pattern of the mold 20 is crimped to the substrate 30 by the first crimping body 821a, such an irradiation part 821c can irradiate ultraviolet rays (Ultraviolet Ray) to the substrate 30 to harden the resin formed on the substrate 30. Such an irradiation unit 821c may include an ultraviolet light source (not shown) for irradiating ultraviolet light and a light source (not shown) through which the ultraviolet light source transmits. Such a light source may include quartz such as sapphire. In this way, the irradiation portion 821c can irradiate the substrate 30 with ultraviolet rays to harden the resin formed on the substrate 30. In addition, the film 10, the mold 20, and the substrate 30 may be configured to transmit ultraviolet rays. In addition, the irradiating portion 821c may be provided on one side of the first crimping body 821a. In addition, the irradiation portion 821c may be in contact with the upper side of the film 10 to pressurize the film 10.

The pushing preventing portion 821d can support the first supporting portion 821b to prevent the first crimping body 821a and the first supporting portion 821b from rising by the second crimping unit 822 by more than a predetermined range. In other words, when the first crimping unit 821 supports the mold 20 and the second crimping unit 822 is raised to pressurize the substrate 30, the pressure of the second crimping unit 822 can prevent the first crimping body 821a and the second crimping body 821a and the second crimping unit 822. A supporting portion 821b is pushed to the upper side. The pushing prevention part 821d may be a cylinder, for example. Such a pushing preventing portion 821d may include a supporting member 821d-1 and a rotating member 821d-2.

The supporting member 821d-1 may be fixedly supported to the frame 810 and support one end of the rotating member 821d-2.

The rotating member 821d-2 may be rotatably connected to the supporting member 821d-1. One end of such a rotating member 821d-2 may be supported by the supporting member 821d-1, and the other end may selectively support the fixing member 821f. For example, when the first crimping unit 821 presses the mold 20 downward, the fixing member 821f may be supported on the upper side of the fixing member 821f to prevent the first support portion 821b from pushing upward by more than a predetermined range. In addition, when the first crimping unit 821 presses the mold 20 and then rises, the rotating member 821d-2 may rotate in one direction in a manner of being separated from the fixing member 821f.

On the other hand, the pushing prevention portion 821d can pressurize the first support portion 821b corresponding to the pressing force of the second crimping unit 822. For example, when the force of the second crimping unit 822 to press the first crimping body 821a increases, the force of the pressing preventing portion 821d to press the first supporting portion 821b may also increase accordingly. In this way, the pressing preventing portion 821d variably presses the first support portion 821b based on the pressing force of the second crimping unit 822, thereby preventing the pattern from being incompletely crimped to the substrate 30. A plurality of such pushing prevention portions 821d may be provided, and the plurality of pushing prevention portions 821d may press the first support portion 821b at positions different from each other. For example, four push preventing parts 821d may be provided. However, this is only an example, and any number of push-prevention parts 821d may be provided.

The first guide member 821e can guide the movement of the first support portion 821b. Such a first guide member 821e can be fixedly supported by the first frame portion 811, and can be formed to extend upward and downward. In addition, the first guide member 821e may penetrate the first support portion 821b to guide the movement of the first support portion 821b. For example, the first guide member 821e may be in the form of a bar extending in one direction. The first support portion 821b moves along such a first guide member 821e supported by the frame 810, so that the first support portion 821b can be raised and lowered relative to the frame 810.

The fixing member 821f may provide a portion pressurized by the pushing prevention portion 821d. One side of such a fixing member 821f can be fixedly supported by the first supporting portion 821b, and the other side can be selectively supported by the pushing preventing portion 821d. For example, the fixing member 821f may be supported by the pushing preventing portion 821d when the first crimping unit 821 and the second crimping unit 822 are in close contact. At this time, it is possible to prevent the first crimping body 821a fixedly provided to the first support portion 821b from being pushed by the pushing preventing portion 821d. As another example, the fixing member 821f may be separated from the pushing prevention portion 821d when the first crimping unit 821 rises. At this time, the rotating member 821d-2 of the pushing preventing portion 821d can rotate in one direction to be separated from the fixing member 821f.

The second crimping unit 822 may include a second crimping body 822a, a bellows 822b, a lifting cylinder 822c, a second supporting portion 822d, and a second guide member 822e.

9a, the second crimping body 822a may support the substrate 30 and may support the corrugated tube 822b. Such a second crimping body 822a can be supported by the second support portion 822d, and can be raised and lowered together with the second support portion 822d by the second driver 825b that lifts the second support portion 822d. The second crimping body 822a may include a substrate seating portion 822a-1, a bellows seating portion 822a-2, a suction port 822a-3, and an exhaust port 822a-4.

The substrate seating portion 822a-1 may provide a portion where the substrate 30 is seated, and may support the substrate 30. In addition, the substrate seating portion 822a-1 may be formed to protrude from the corrugated tube seating portion 822a-2. Therefore, the substrate seating portion 822a-1 may be arranged adjacent to the film 10 than the corrugated tube seating portion 822a-2.

The bellows mounting part 822a-2 may provide a part where the bellows 822b is mounted. Such a bellows mounting portion 822a-2 can support the bellows 822b. In addition, the corrugated tube seating portion 822a-2 may be formed with a boss for seating the corrugated tube 822b.

The suction port 822a-3 may be configured to suction the substrate 30 to the substrate seating portion 822a-1. Such a suction port 822a-3 may be formed in the substrate mounting portion 822a-1. For example, the suction port 822a-3 may be formed in the central portion of the substrate mounting portion 822a-1. Such an adsorption port 822a-3 can communicate with the adsorption channel 824a, and the gas around the adsorption port 822a-3 can be discharged to the outside through the adsorption channel 824a. As a more detailed example, when the substrate 30 is placed on the substrate seating portion 822a-1, one side of the suction port 822a-3 may be blocked by the substrate 30, and the other side may communicate with the suction channel 824a. After that, when the mold 20 is pressurized on the substrate 30 and separated from the substrate 30, a vacuum can be formed around the suction port 822a-3 by the suction pump 824b. Therefore, the substrate 30 can be adsorbed to the suction port 822a-3 so as not to be separated from the substrate seating portion 822a-1.

The exhaust port 822a-4 may be arranged to exhaust the gas remaining inside the bellows 822b to the outside. Such an exhaust port 822a-4 can provide a passage for exhausting the gas remaining in the space surrounded by the substrate 30 by the bellows 822b to the outside. In addition, one side of the exhaust port 822a-4 may communicate with the inner space of the bellows 822b, and the other side may communicate with the exhaust portion 823. Such an exhaust port 822a-4 may be formed in the bellows mounting portion 822a-2.

9b, the bellows 822b can expand and contract toward the first crimping unit 821 when the mold 20 is crimped with the substrate 30 to seal the space around the substrate 30 from the outside. Such a corrugated tube 822b can be configured such that one end is supported by the corrugated tube seating portion 822a-2, and the other end can be expanded and contracted with respect to the second crimping body 822a. In addition, the bellows 822b may be configured to be able to expand and contract. In other words, the corrugated tube 822b may be elongated toward the first crimping unit 821 to seal the space around the substrate 30 from the outside. At this time, the corrugated tube 822b may surround the substrate 30, and the extended end of the first crimping unit 821 of the corrugated tube 822b may be in close contact with the first crimping body 821a. In this way, the corrugated tube 822b is in close contact with the first crimping body 821a, so that the substrate 30 can be blocked from the outside. In addition, the corrugated tube 822b can be reduced when the pattern of the mold 20 is crimped to the substrate 30. Such a bellows 822b can be extended or contracted by the lifting cylinder 822c.

The second sealing groove 822b-1 into which the second crimping sealing member 826b described later can be inserted can be formed in such a bellows 822b. Such a second sealing groove 822b-1 may be formed in the corrugated tube 822b corresponding to the position of the first sealing groove 821a-1 when the first crimping unit 821 and the second crimping unit 822 are in close contact.

The lifting cylinder 822c can raise and lower one end of the bellows 822b to expand and contract the bellows 822b. For example, the lifting cylinder 822c can be raised and lowered when the pattern is crimped to the substrate 30 to extend the corrugated tube 822b, and after the pattern is crimped to the substrate 30, it can be lowered to shrink the corrugated tube 822b. Such a lifting cylinder 822c can be supported by the second crimping body 822a.

The second supporting portion 822d may support the second crimping body 822a, and may be supported by the second driver 825b. In addition, the movement of the second support portion 822d can be guided by the second guide member 822e. In other words, the second support portion 822d is slidably coupled to the second guide member 822e, so that the second support portion 822d can move along the second guide member 822e. In this way, the second support portion 822d can move along the second guide member 822e to move relative to the frame 810. In other words, the second support portion 822d can be raised and lowered relative to the frame 810 together with the second crimping body 822a by the second driver 825b being raised and lowered.

The second guide member 822e can guide the movement of the second support portion 822d. Such a second guide member 822e can be fixedly supported by the second frame portion 812, and can be formed to extend upward and downward. For example, the second guide member 822e may be in the form of a rail extending in one direction. The second support portion 822d moves along the second guide member 822e supported by the frame 810, so that the second support portion 822d can be raised and lowered relative to the frame 810.

The exhaust part 823 can exhaust the gas remaining in the closed space inside the bellows 822b to the outside when the space around the substrate 30 is sealed from the outside. In other words, the exhaust part 823 can exhaust the gas remaining between the bellows 822b and the first crimping unit 821, that is, the space in which the bellows 822b surrounds the substrate 30, to form a predetermined vacuum state around the substrate 30. Such an exhaust part 823 may include an exhaust passage 823a and an exhaust pump 823b.

The exhaust passage 823a may provide a passage for the gas flowing in from the inside of the bellows 822b to flow to the outside. One side of such an exhaust passage 823a may communicate with the inner side of the bellows 822b, and the other side may communicate with the outside through an exhaust pump 823b. In addition, the exhaust pump 823b can transfer the gas inside the bellows 822b to the outside through the exhaust passage 823a.

The adsorption part 824 can adsorb the substrate 30 to the substrate seating part 822a-1 when separating the mold 20 crimped to the substrate 30 from the substrate 30, so as to prevent the substrate 30 from being detached from the substrate seating part 822a-1. In other words, the suction portion 824 can suction the substrate 30 when the mold separation unit 830 separates the mold 20 from the substrate 30, thereby preventing the substrate 30 from being separated from the substrate seating portion 822a-1 by preventing the adhesion of the film 10. For example, the adsorption part 824 can adsorb the substrate 30 by vacuum pressure. However, this is only an example, and the idea of the present invention is not limited by this, and a well-known technique capable of adsorbing the substrate 30 to the substrate mounting portion 822a-1 can be adopted. The adsorption part 824 may include an adsorption channel 824a and an adsorption pump 824b.

The adsorption channel 824a may provide a channel for the gas flowing in from around the substrate seating portion 822a-1 to flow to the outside through the adsorption pump 824b. One side of the adsorption channel 824a can communicate with the periphery of the substrate seating portion 822a-1 through the adsorption port 822a-3, and the other side can communicate with the outside through the adsorption pump 824b. For example, when the substrate 30 is placed on the substrate seating portion 822a-1, one side of the adsorption channel 824a may be blocked by the substrate 30, and the other side may communicate with the outside. In addition, when a part of the substrate 30 is partitioned from the substrate seating portion 822a-1, the suction channel 824a may communicate with the inside of the corrugated tube 822b.

The adsorption pump 824b can transfer the gas around the substrate mounting portion 822a-1 to the outside. For example, the adsorption pump 824b may be a vacuum pump. Therefore, the vacuum generated by the suction pump 824b can generate a vacuum around the suction port 822a-3, and the substrate 30 can be suctioned to the substrate mounting portion 822a-1 by such a vacuum pressure. Therefore, when one side of the channel 824a communicates with the periphery of the substrate 30 through the adsorption port 822a-3, the substrate 30 can be adsorbed to the adsorption port 822a-3 by the adsorption pump 824b.

The driving part 825 can move the first crimping unit 821 and the second crimping unit 822 relative to each other. Such a driving part 825 may include a first driver 825a that drives the first crimping unit 821 and a second driver 825b that drives the second crimping unit 822.

The first driver 825a can raise and lower the first crimping unit 821, and can adjust the moving speed of the first crimping unit 821 according to the position of the first crimping unit 821. In addition, the second driver 825b can lift the second crimping unit 822, and can adjust the moving speed of the second crimping unit 822 according to the position of the second crimping unit 822. The configuration of adjusting the speed by the first driver 825a and the second driver 825b according to the positions of the first crimping unit 821 and the second crimping unit 822 will be described later.

9a again, the crimping sealing portion 826 can seal the first crimping unit 821 and the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are crimped relative to each other. Such a crimping sealing portion 826 can seal the first crimping unit 821 and the second crimping unit 822 to block the periphery of the substrate 30 from the outside. The crimping and sealing part 826 may include a first crimping and sealing member 826a and a second crimping and sealing member 826b.

The first crimping sealing member 826a may be inserted and arranged in the first sealing groove 821a-1 formed in the first crimping unit 821. In addition, the second crimping sealing member 826b may be inserted and arranged in the second sealing groove 822b-1 formed in the second crimping unit 822. Such a first crimping sealing member 826a and a second crimping sealing member 826b may be arranged to face each other. In other words, when the first crimping unit 821 and the second crimping unit 822 are crimped to each other, the first crimping sealing member 826a and the second crimping sealing member 826b can pressurize each other, and can seal the first crimping The gap between the unit 821 and the second crimping unit 822.

On the other hand, when the first crimping sealing member 826a and the second crimping sealing member 826b are in close contact with each other, the film 10 may be interposed between the first crimping sealing member 826a and the second crimping sealing member 826b. In addition, the first crimping and sealing member 826a may press the film 10 at the upper part of the film 10, and the second crimping and sealing member 826b may press the film 10 at the lower part of the film 10. At this time, the first crimping sealing member 826a and the second crimping sealing member 826b can be formed so as to prevent the film 10 from wrinkling due to the pressure of the first crimping sealing member 826a and the second crimping sealing member 826b. The shape of the gap between the first crimping unit 821 and the second crimping unit 822 is ground-sealed.

For example, when the first crimping sealing member 826a and the second crimping sealing member 826b are formed in the same O-ring shape, the first crimping sealing member 826a and the second crimping sealing member 826b are in close contact At times, the film 10 may wrinkle. As another example, when the mutually contacting surfaces of the first crimping sealing member 826a and the second crimping sealing member 826b are formed in a planar shape, the film 10 can be prevented from wrinkling. However, the pressure between the first crimping sealing member 826a and the second crimping sealing member 826b may be weak, and the first crimping unit 821 and the second crimping unit 822 may not be properly sealed. Therefore, it is necessary for the first crimping sealing member 826a and the second crimping sealing member 826b to be formed in different shapes from each other in order to prevent the film 10 from wrinkling and to seal the internal space of the corrugated tube 822b. For example, one of the first crimping sealing member 826a and the second crimping sealing member 826b may have a flat shape when not in close contact with the other, and the other may have an O-shape when not in close contact with the one. Circular arc shape such as ring.

In this way, the crimping sealing portion 826 has an effect of preventing the film 10 from wrinkling.

Referring to FIGS. 10 to 12, the mold separating unit 830 may move in one direction (for example, the left-right direction of FIG. 10) to separate the mold 20 crimped to the substrate 30 from the substrate 30. Such a mold separation unit 830 can move to the substrate 30 side to separate the mold 20 from the substrate 30 in a state where one or more of the film supply part 400 and the film recovery part 900 is not rotated to stop the movement of the film 10. In addition, between the first crimping unit 821 and the second crimping unit 822, the mold separating unit 830 can move the substrate 30 to a virtual space crimped to the mold 20 to separate the mold 20 from the substrate 30. The mold separation unit 830 may include a first roller part 831, a second roller part 832, a roller support part 833, a roller guide member 834, and a roller driver 835.

The first roller portion 831 may support the film 10 on a surface (non-adhesive surface) on which the mold 20 is not adhered among both surfaces of the film 10. Such a first roller part 831 can be supported by the roller support part 833 and can move in the left-right direction together with the roller support part 833.

The second roller 832 can support the film 10 on the side (adhesive surface) where the mold 20 is adhered on both surfaces of the film 10. In addition, the second roller portion 832 may support the film 10 so as to bend the film 10 in a direction surrounding a part of the first roller portion 831. Such a second roller part 832 can be supported by the roller support part 833 and move in the left-right direction together with the roller support part 833. In addition, the second roller portion 832 may be supported by the roller support portion 833 with a predetermined height difference from the first roller portion 831. In this way, the first roller portion 831 and the second roller portion 832 support both surfaces of the film 10 with a height difference, so that the mold 20 can be separated from the substrate 30. In addition, the distance between the rotation center axis of the first roller portion 831 and the rotation center axis of the second roller portion 832 may be formed to be longer than the length of the mold 20. This can prevent the mold 20 separated from the substrate 30 by the first roller part 831 from contacting the second roller part 832.

The roller support part 833 can support the first roller part 831 and the second roller part 832 and can be supported by the roller driver 835. In addition, the roller support portion 833 can be moved in the left-right direction by the roller driver 835, and the movement of the roller support portion 833 can be guided by the roller guide member 834. Such a roller support part 833 can move along the roller guide 834 to move relative to the frame 810. In other words, the roller support portion 833 can move with the first roller portion 831 and the second roller portion 832 relative to the frame 810 by the movement of the roller driver 835.

The roller guide member 834 can guide the movement of the roller support part 833. Such a roller guide member 834 can be fixedly supported by the third frame portion 813 and can be formed to extend in the left-right direction. For example, the roller guide member 834 may be in the form of a rail extending in one direction. The roller support part 833 moves along such a roller guide member 834 member supported by the frame 810, so that the roller support part 833 can be raised and lowered with respect to the frame 810.

The roller driver 835 may move the roller supporting part 833 in one direction to separate the mold 20 from the substrate 30. Such a roller driver 835 can be supported by the frame 810 and can support the roller support part 833. In this way, the roller driver 835 moves the roller supporting portion 833 so that the first roller portion 831 and the second roller portion 832 can be moved toward the mold 20.

The detecting unit 840 can detect the positions of the first crimping unit 821, the second crimping unit 822, and the mold separating unit 830. Such a detection unit 840 can detect the first stop position, the second stop position, and the deceleration position of the first crimping unit 821, the second crimping unit 822, and the mold separation unit 830, and can transmit the detected position information to the control unit. Such a detection unit 840 may include a first sensor part 841, a second sensor part 842, and a third sensor part 843.

8 and 9 again, the first sensor part 841 can detect the first stop position, the second stop position, and the deceleration position of the first crimping unit 821, and can transmit the detected position information to the control part. Such a first sensor part 841 may include a 1-1 sensor 841a, a 1-2 sensor 841b, and a 1-3 sensor 841c.

The 1-1 sensor 841a of the first sensor part 841 can detect the first stop position of the first crimping unit 821. Here, the 1-1th sensor 841a may be named as the first stop position detection sensor 841a of the first crimping unit 821. In addition, the first stop position of the first crimping unit 821 may be named the first crimping step start position, and the 1-1 sensor 841a of the first sensor part 841 may be named the first crimping step The position detection sensor 841a is started. In addition, the first stop position refers to a position before the first crimping unit 821 moves toward the film 10, that is, the original position of the first crimping unit 821. When the first crimping unit 821 is in the home position, the 1-1st sensor 841a of the first sensor portion 841 can detect the position of the first crimping unit 821. In addition, the 1-1 sensor 841a of the first sensor part 841 may be supported by the frame 810.

The 1-2 sensor 841b of the first sensor part 841 can detect the second stop position of the first crimping unit 821. Here, the 1-2th sensor 841b may be named as the second stop position detection sensor 841b of the first crimping unit 821. In addition, the second stop position of the first crimping unit 821 may be named as the end position of the second crimping step, and the 1-2 sensor 841b of the first sensor part 841 may be named as the second crimping step The position detection sensor 841b is ended. In addition, the second stop position refers to a position where the first crimping unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first crimping unit 821, that is, a position that is in close contact with the second crimping unit 822. Therefore, the 1-2 first sensor 841b can detect the position of the first crimping unit 821 when the first crimping unit 821 is in close contact with the second crimping unit 822. In addition, the 1-2th sensor 841b may be supported by the frame 810.

The 1-3 sensor 841c of the first sensor part 841 can detect the deceleration position of the first crimping unit 821. Here, the 1-3th sensor 841c may be named as the deceleration position detection sensor 841c of the first crimping unit 821. In addition, the deceleration position of the first crimping unit 821 may be named the first deceleration position, and the 1-3 sensors 841c of the first sensor part 841 may be named the first deceleration detection sensor 841c. In addition, the deceleration position refers to a position where the first crimping unit 821 starts to decelerate before reaching the second stopping position during the movement of the first crimping unit 821 from the first stopping position to the second stopping position. In addition, the deceleration position refers to a position before the first crimping unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first crimping unit 821. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 1-3th sensor 841c may be supported by the frame 810 in a manner of being disposed between the 1-1th sensor 841a and the 1-2th sensor 841b.

13, the second sensor part 842 can detect the first stop position, the second stop position, and the deceleration position of the second crimping unit 822, and can transmit the detected position information to the control part. Such a second sensor unit 842 may include a 2-1 sensor 842a, a 2-2 sensor 842b, and a 2-3 sensor 842c.

The 2-1 sensor 842a of the second sensor part 842 can detect the first stop position of the second crimping unit 822. Here, the 2-1th sensor 842a may be named as the first stop position detection sensor 842a of the second crimping unit 822. In addition, the first stop position of the second crimping unit 822 may be named the second crimping step start position, and the 2-1 sensor 842a of the second sensor part 842 may be named the second crimping step Start position detection sensor 842a. In addition, the first stop position refers to a position before the second crimping unit 822 moves toward the film 10, that is, the original position of the second crimping unit 822. When the second crimping unit 822 is in the original position, the 2-1st sensor 842a of the second sensor portion 842 can detect the position of the second crimping unit 822. In addition, the 2-1 sensor 842a of the second sensor portion 842 may be supported by the frame 810.

The 2-2 sensor 842b of the second sensor part 842 can detect the second stop position of the second crimping unit 822. Here, the 2-2th sensor 842b may be named as the second stop position detection sensor 842b of the second crimping unit 822. In addition, the second stop position of the second crimping unit 822 may be named the end position of the second crimping step, and the 2-2 sensor 842b of the second sensor part 842 may be named the second crimping step End position detection sensor 842b. In addition, the second stop position refers to a position where the second crimping unit 822 moves toward the film 10 and the substrate 30 is pressed against the mold 20 by the second crimping unit 822, that is, a position that is in close contact with the first crimping unit 821. Therefore, the 2-2 sensor 842b of the second sensor portion 842 can detect the position of the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are in close contact. In addition, the 2-2 sensor 842b of the second sensor part 842 may be supported by the frame 810.

The 2-3 sensor 842c of the second sensor part 842 can detect the deceleration position of the second crimping unit 822. Here, the 2-3th sensor 842c may be named as the deceleration position detection sensor 842c of the second crimping unit 822. In addition, the deceleration position of the second crimping unit 822 may be named the second deceleration position, and the 2-3 sensor 842c of the second sensor part 842 may be named the second deceleration detection sensor 842c. In addition, the deceleration position refers to a position where the second crimping unit 822 starts to decelerate before reaching the second stopping position during the movement of the second crimping unit 822 from the first stopping position to the second stopping position. In addition, the deceleration position refers to a position before the second crimping unit 822 moves toward the film 10 and the substrate 30 is pressed against the mold 20 by the second crimping unit 822. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 2-3 sensor 842c of the second sensor part 842 may be supported by the frame 810 so as to be arranged between the 2-1 sensor 842a and the 2-2 sensor 842b. In addition, the 2-3 sensor 842c of the second sensor part 842 can be linked to the expansion and contraction of the bellows 822b. For example, when the 2-1 sensor 842a of the second sensor part 842 is detected first and then the 2-3 sensor 842c of the second sensor part 842 is detected, the bellows 822b can be extended; When the 2-2 sensor 842b of the sensor part 842 detects the 2-3 sensor 842c of the second sensor part 842, the bellows 822b can be reduced.

14, the third sensor unit 843 can detect the third stop position, the second stop position, and the deceleration position of the mold separation unit 830, and can transmit the detected position information to the control unit. Such a third sensor unit 843 may include a 3-1 sensor 843a, a 3-2 sensor 843b, and a 3-3 sensor 843c.

The 3-1 sensor 843 a of the third sensor portion 843 can detect the first stop position of the mold separation unit 830. Here, the 3-1 sensor 843a may be named as the first stop position detection sensor 843a of the mold separation unit 830. In addition, the first stop position of the mold separation unit 830 may be named the separation step start position, and the 3-1 sensor 843a of the third sensor section 843 may be named the separation step start position detection sensor 843a. In addition, the first stop position refers to a position before the mold separation unit 830 moves toward the mold 20, that is, the original position of the mold separation unit 830 (refer to FIG. 14(a)). When the mold separation unit 830 is in the original position, the 3-1 sensor 843a of the third sensor section 843 can detect the position of the mold separation unit 830. In addition, the 3-1 sensor 843 a of the third sensor portion 843 may be supported by the frame 810.

The 3-2 sensor 843 b of the third sensor part 843 can detect the second stop position of the mold separation unit 830. Here, the 3-2th sensor 843b may be named as the second stop position detection sensor 843b of the mold separation unit 830. In addition, the second stop position of the mold separation unit 830 may be named the separation step end position, and the 3-2 sensor 843b of the third sensor section 843 may be named the separation step end position detection sensor 843b. In addition, the second stop position refers to a position after the mold separation unit 830 separates the mold 20 from the substrate 30 (refer to FIG. 14( b )). In addition, the 3-2 sensor 843b of the third sensor portion 843 may be supported by the frame 810.

The 3-3 sensor 843c of the third sensor section 843 can detect the deceleration position of the mold separation unit 830. Here, the 3-3 sensor 843c may be named the deceleration position detection sensor 843c of the mold separation unit 830. In addition, the deceleration position of the mold separation unit 830 may be named the third deceleration position, and the 3-3 sensor 843c of the third sensor part 843 may be named the third deceleration detection sensor 843c. In addition, the deceleration position refers to a position where the mold separation unit 830 starts to decelerate before reaching the second stop position during the movement of the mold separation unit 830 from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the mold separation unit 830 separates the mold 20 from the substrate 30. Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 3-3 sensor 843c of the third sensor portion 843 may be supported by the frame 810 so as to be arranged between the 3-1 sensor 843a and the 3-2 sensor 843b.

As mentioned above, the detection unit 840 can detect the position where the movement of the crimping module 820 and the mold separation unit 830 starts, the position where the deceleration starts, and the position where the movement ends, and can transmit the detected position information to the control unit. In this way, the position information detected by the detection unit 840 can be used to control the driving part 825 and the roller driver 835. In addition, the crimping module 820 and the mold separating unit 830 can accelerate the movement speed from the first stop position to the deceleration position, and decelerate the movement speed from the deceleration position to the second stop position. Thus, the moving speed of the crimping module 820 and the mold separating unit 830 can be adjusted by the detecting unit 840. In addition, the movement speed can be decelerated only at the position where the process is actually performed to improve the efficiency of the process. In addition, when the first crimping unit 821 and the second crimping unit 822 move relative to each other and are in close contact with each other, the moving speed of the first crimping unit 821 and the second crimping unit 822 can be adjusted by the detecting unit 840, thereby The first crimping unit 821 and the second crimping unit 822 can be moved at the same time, instead of moving the first crimping unit 821 and the second crimping unit 822 sequentially, thereby enabling the efficiency of the manufacturing process. In this way, the detection unit 840 only decelerates the moving speed at the position where the process is actually performed, thereby having the effect of improving the efficiency of the process.

The position detection unit (not shown) can detect the position of the mold 20, and can transmit the detected position information to the control unit. In this way, the position information of the mold 20 detected by the position detection unit can be used to control the film supply unit 400 and the film recovery unit 900. Therefore, when the mold 20 is transferred and then located in the demolding section 700 or the transfer section 800, it can be detected by the position detection section, and the rotation of one or more of the film supply section 400 and the film recovery section 900 can be interrupted to stop the mold. 20's transfer. In addition, the position detection part may be arranged between at least a part of the film supply part 400, the protective film recovery part 600, the release part 700, the transfer part 800, and the film recovery part 900. For example, the position detection part may detect the position of the mold 20 by a light sensor that recognizes the mark of the film 10, or detect the position of the mold 20 by an optical device.

The spacing between the plurality of molds 20 arranged adjacently on the film 10 may correspond to the spacing between the vapor deposition module 720 and the transfer section 800 in such a way that they are respectively located in the vapor deposition module 720 and the transfer section 800. In other words, the distance between the center point of the area where the mold 20 is located in the vapor deposition module 720 and the center point of the area where the mold 20 is located in the transfer part 800 may be adjacent to the plurality of molds 20 attached to the film 10. The distance between the center points of the arranged molds 20 is the same. For example, the center point of the area where the mold 20 is located in the vapor deposition module 720 may be the center point of the coating space T1. In addition, the center point of the area where the mold 20 is located in the transfer part 800 may be the center point of a virtual space where the mold 20 can be arranged between the first crimping unit 821 and the second crimping unit 822. Therefore, the preceding mold 20 can be arranged in the transfer section 800, and the subsequent mold 20 can be arranged in the vapor deposition module 720, so that the subsequent mold 20 can be used while the preceding mold 20 is in the process of the transfer section 800. The process is performed in the vapor deposition module 720. In addition, the position detection unit may be disposed between the vapor deposition module 720 and the transfer unit 800 to detect that the preceding mold 20 is located in the transfer unit 800 and the subsequent mold 20 is located in the vapor deposition module 720.

In this way, the transfer unit 800 and the vapor deposition module 720 perform the process of the mold 20 at the same time, which has the effect of improving the efficiency of the process.

The control part can control the driving of the crimping module 820 and the mold separating unit 830. Such a control unit can receive position information of the crimping module 820 and the mold separating unit 830 from the detection unit 840, and can control the driving of the crimping module 820 and the mold separating unit 830 based on such position information.

The control unit may control the driving of one or more of the film supply unit 400 and the film recovery unit 900 in order to transport the film 10 in one direction. Such a control unit can receive the detected position information of the mold 20 from the position detection unit, and can control the driving of the film supply unit 400 and the film recovery unit 900 based on such position information.

The control unit can be realized by a computing device including a microprocessor, a storage medium, a sensor, an optical measuring device, and a memory. Since its realization is obvious to those with ordinary knowledge in the technical field, it is omitted. Further detailed description.

In this way, the control unit has the effect of being able to control the driving of the crimping module 820 and the mold separating unit 830 based on the position information. In addition, the control unit has an effect of being able to control the driving of the film supply unit 400 and the film recovery unit 900 based on the position information.

In this way, the transfer part 800 of an embodiment of the present invention can omit the process of crimping the mold 20 and the substrate 30 to each other and the process of separating the mold 20 and the substrate 30 from each other, which is crimped to the substrate 30 and the substrate 30. The process of moving the mold 20 to a position where the mold 20 is separated from the substrate 30 has the effect of improving the efficiency of the process.

Next, with reference to FIG. 15, the production method (S10) of the substrate subjected to transfer by the transfer device 1 will be described.

The production method S10 of a transferred substrate can produce a substrate 30 on which the pattern of the mold 20 is transferred to the substrate 30 by using the transfer device 1 of an embodiment of the present invention. The production method S10 of such a transferred substrate may include a substrate supply step S100, a plasma treatment step S200, a release coating step S300, a transfer step S400, and a film recovery step S500.

In the substrate supply step S100, the substrate 30 may be coated with a resin, aligned in a predetermined direction, and then supplied to the transfer unit 800. Such a substrate supply step S100 may include a substrate coating step S110 and a substrate alignment step S120.

In the substrate coating step S110, the resin may be coated with a predetermined thickness on the surface of the substrate 30 on which the pattern is to be transferred transferred from the substrate storage part 100 to the spin coater 200. In such a substrate coating step S110, after the substrate 30 is placed on the rotating body by spin coating, a fluid resin may be dropped on the surface of the rotating substrate 30 to uniformly apply the resin to the surface of the substrate 30. In addition, in the substrate coating step S110, the temperature of the substrate 30 may be adjusted on the cooling plate 210 before the substrate 30 is coated.

In the substrate aligning step S120, the substrate 30 on which the resin is coated on the surface transferred from the spin coater 200 may be aligned in a predetermined direction. In such a substrate aligning step S120, a plurality of substrates 30 can be aligned in the same direction by rotating the substrate 30 in a predetermined direction. In addition, the substrate 30 aligned in the substrate alignment step S120 may be supplied to the transfer part 800.

In the plasma treatment step S200, plasma treatment may be performed on the surface of the mold 20 to improve the releasability of the mold 20 supplied from the film supply part 400. Such a plasma treatment step S200 may be performed before the release coating step S300. Therefore, in the plasma treatment step S200, the mold 20 is plasma-treated before the mold release agent is applied to the surface of the mold 20, so that the surface of the mold 20 can be modified. In addition, in the plasma treatment step S200, the surface of the mold 20 may be cleaned.

In the releasability coating step S300, the surface of the mold 20 after the plasma treatment may be subjected to releasability coating. In addition, in the mold release coating step S300, the vaporized mold release agent may be brought into contact with the surface of the mold 20 to coat the surface of the mold 20. Such a releasable coating step S300 may be performed in a state where one or more of the film supply part 400 and the film recovery part 900 that are rotated in order to move the film 10 are not rotated. The release coating step S300 may include a release agent supplying step S310, a release agent coating step S320, and a release agent purging step S330.

In the release agent supply step S310, the vaporized release agent can be supplied to the coating space T1 formed by the first cavity portion 721 and the second cavity portion 722 in close contact. In such a release agent supply step S310, the release agent in a liquid state may be vaporized and then supplied to the coating space T1.

In the release agent coating step S320, the surface of the mold 20 may be coated with release properties. In the release agent coating step S320, the release agent may flow in from the inflow port 722b-1 and flow into the coating space T1 to contact the surface of the mold 20 to coat the surface of the mold 20, and then be discharged through the discharge port 722c-1. To the outside.

In the release agent purging step S330, when the release coating of the mold 20 is completed, the supply of vaporized release agent may be interrupted, and air or inert gas (for example, nitrogen) may be supplied to the coating space T1. The vaporized release agent remaining in the coating space T1 is discharged to the outside.

In the transfer step S400, the pattern formed on the mold 20 may be transferred to the substrate 30. In other words, in the transfer step S400, the mold 20 and the substrate 30 may be pressed against each other and separated to transfer the pattern to the substrate 30. In addition, the transfer step S400 may be performed in a state where one or more of the film supply part 400 and the film recovery part 900 that are rotated to move the film 10 are not rotated. Such a transfer step S400 may include a crimping step S410 and a separating step S420.

In the crimping step S410, the first crimping unit 821 and the second crimping unit 822 may be moved in close contact with each other to crimp the pattern formed on the mold 20 to the substrate 30. In addition, the first crimping unit 821 and the second crimping unit 822 can be moved toward the film 10 on the opposite side of the film 10 to make the first crimping unit 821 and the second crimping unit 822 close to each other. The crimping step S410 may include the crimping unit approaching step S411, the sealing step S412, the gas exhausting step S413, and the crimping unit crimping step S414.

In the crimping unit approaching step S411, the first crimping unit 821 and the second crimping unit 822 may be brought closer to each other. In other words, the first crimping unit 821 may be close to the film 10 to which the mold 20 is bonded, and the second crimping unit 822 may be close to the substrate 30.

In the sealing step S412, the corrugated tube 822b may face the first crimping unit 821 to seal the substrate 30 from the outside. At this time, one end of the bellows 822b may be in close contact with the first crimping unit 821, and the bellows 822b may surround the periphery of the substrate 30. In this way, the corrugated tube 822b is in close contact with the first crimping unit 821 so as to surround the periphery of the substrate 30, so that the substrate 30 can be blocked from the outside.

In the gas discharge step S413, the gas remaining in the internal space of the bellows 822b sealed in the sealing step S412 may be discharged to the outside. Through such a gas discharge step S413, the internal space of the bellows 822b, that is, the periphery of the substrate 30 can be in a predetermined vacuum state.

In the crimping unit crimping step S414, the first crimping unit 821 and the second crimping unit 822 can move relative to each other to be close to each other. In other words, one or more of the first crimping unit 821 and the second crimping unit 822 are pressed against each other by pressing the mold 20 and the substrate 30 so that the pattern of the mold 20 can be crimped to the substrate 30.

In the separating step S420, the substrate 30 on which the pattern of the mold 20 is crimped can be separated from the mold 20. In such a separation step S420, the mold separation unit 830 may be used to separate the mold 20 from the substrate 30. The separating step S420 may include a purging step S421, a sealing release step S422, a crimping unit raising step S423, and a mold separating unit moving step S424.

In the purging step S421, air or an inert gas (for example, nitrogen) may be supplied to the inner space of the bellows 822b to bring the inner space of the bellows 822b into a predetermined vacuum state by the gas exhausting step S413 into an atmospheric pressure state.

In the airtight release step S422, the corrugated tube 822b that is elongated to block the substrate 30 from the outside may be reduced. At this time, the mold 20 and the substrate 30 blocked from the outside by the bellows 822b may be exposed to the outside.

In the crimping unit raising step S423, the first crimping unit 821 may be raised to ensure a space where the mold separating unit 830 is to be moved to the side of the substrate 30.

In the mold separation unit moving step S424, the mold separation unit 830 may be moved to the side of the substrate 30 to separate the mold 20 from the substrate 30. In such a mold separation unit moving step S424, the mold separation unit 830 can be moved to the space before the first crimping unit 821 rises, and the mold 20 can be separated from the substrate 30 by such movement.

When the plasma treatment step S200 and the release coating step S300 are executed once, the transfer step S400 and the separation step S420 may be executed a plurality of times until the mold release property of the mold 20 falls below the specified range, so that one mold 20 can be used. A plurality of substrates 30 are transferred.

In the substrate recovery step S500, the substrate 30 after the transfer may be transferred to the substrate storage section 100.

In the film recovery step S600, when the crimping step S410 and the separation step S420 are executed a plurality of times and the releasability of the mold 20 falls below a predetermined range, the mold 20 can be recovered to the film recovery part 900.

The substrate recovery step S500 and the film recovery step S600 may be performed simultaneously or independently.

Although the transfer device 1 including the mold release part 700 and the transfer part 800 is described in the above in a specific embodiment, the mold release part 700 and the transfer part 800 may independently constitute a transfer device. For example, the release section 700 may constitute a transfer device alone or with the transfer section of another embodiment, and the transfer section 800 may constitute a transfer device alone or with the release section of another embodiment. Transfer device. In addition, the demolding part 700 may optionally include a plasma processing module 710. In addition, the transfer device 1 may optionally include a substrate storage section 100, a spin coater 200, and an alignment unit 300.

Although some embodiments of the present invention have been described above with specific implementations, these are only examples, and the present invention is not limited thereto, but should be interpreted as having the broadest scope based on the basic ideas disclosed in this specification. Those skilled in the art can combine/replace the disclosed embodiments to implement shapes and patterns that are not shown, but this also does not depart from the scope of the present invention. In addition, those with ordinary knowledge in the technical field can easily make changes or modifications to the disclosed embodiments based on this specification. Obviously, such changes or modifications also belong to the scope of the present invention.

1: transfer device 10: Membrane 20: Mode 30: substrate 100: Board storage section 200: Spin coater 210: cooling plate 300: entire column of cells 400: Membrane Supply Department 500: feed roller 600: Protective film recycling department 700: demolding department 710: Plasma processing module 711: Plasma Generation Department 712: Guide roller 720: Evaporation Module 721: first chamber part 721a: first chamber groove 721b: Gas outlet 722: second chamber part 722a: Chamber base 722b: Chamber side wall 722b-1: Inlet 722b-2: Second chamber groove 722c: cavity protrusion 722c-1: Outlet 722c-2: recess 723: Fluid Supply Department 723a: fluid container 723b: Can 723c: Bubbler 723d: The first supply flow path 723e: second supply flow path 723f: spray device 724: Gas discharge part 724a: discharge flow path 724b: discharge pump 725: vapor deposition sealing part 725a: The first vapor deposition sealing part 725b: The second vapor deposition sealing part 726: Chamber Drive 727: heater 728: Pressure Regulation Department 728a: Pressure regulating flow path 800: Transfer Department 810: Frame 811: The first frame part 812: The second frame part 813: Third Frame Department 820: crimping module 821: The first crimping unit 821a: The first crimping body 821a-1: The first seal groove 821b: The first support part 821c: Irradiation Department 821d: Pushing prevention department 821d-1: Supporting parts 821d-2: Rotating parts 821e: The first guide component 821f: fixed parts 822: Second crimping unit 822a: second crimp body 822a-1: Board placement department 822a-2: Bellows Placement Department 822a-3: Adsorption port 822a-4: Exhaust port 822b: bellows 822b-1: The second sealing groove 822c: Lifting cylinder 822d: second support part 822e: second guide component 823: Exhaust Department 823a: Exhaust channel 823b: Exhaust pump 824: Adsorption part 824a: Adsorption channel 824b: Adsorption pump 825: Drive 825a: first drive 825b: second drive 826: crimp seal 826a: The first crimping seal part 826b: The second crimp sealing part 830: Die separation unit 831: The first roller section 832: The second roller section 833: Roller support 834: Roller Guide Parts 835: Roller Drive 840: detection unit 841: The first sensor part 841a: 1-1 sensor 841b: 1-2 sensor 841c: 1-3 sensors 842: The second sensor part 842a: 2-1 sensor 842b: 2-2 sensor 842c: 2-3 sensor 843: The third sensor part 843a: 3-1 sensor 843b: 3-2 sensor 843c: 3-3 sensor 900: Membrane Recycling Department T: Transfer unit T1: Coating space S10: Production method of printed substrate S100～600: steps

Fig. 1 is a conceptual diagram of a transfer device according to an embodiment of the present invention.

Fig. 2 is a plan view of the transfer device of Fig. 1.

Fig. 3 is an exploded perspective view of the demolding part of Fig. 1.

Fig. 4 is a cross-sectional view taken along AA' of Fig. 3.

Fig. 5 is a cross-sectional view taken along AA' when the second chamber portion of Fig. 1 is ascending.

Fig. 6 is a perspective view of the transfer section of Fig. 1.

Fig. 7 is an exploded perspective view of Fig. 6.

Fig. 8 is a cross-sectional view taken along BB' of Fig. 6.

Fig. 9a is a cross-sectional view taken along BB' when the crimping module of Fig. 6 is moved in order to press the mold and the substrate.

Fig. 9b(a) is an enlarged view of the part C enlarged when the bellows of Fig. 9a is reduced, and Fig. 9b(b) is an enlarged view of the part C enlarged when the bellows of 9a is extended.

Fig. 10 is a cross-sectional view taken along BB' when the first crimping unit of Fig. 6 is ascending.

FIG. 11 is a cross-sectional view taken along BB' when the mold separation unit of FIG. 6 separates the mold from the substrate.

12 is a cross-sectional view taken along BB' when the mold separating unit of FIG. 6 moves after separating the mold from the substrate.

Fig. 13 is a perspective view of the lower frame and the second crimping unit of Fig. 7.

Fig. 14(a) is a bottom view of the mold separation unit of Fig. 6, and Fig. 14(b) is a bottom view of the mold separation unit when the mold separation unit of Fig. 6 is moved toward the mold.

15 is a sequence diagram schematically showing a production method of a substrate after a pattern is transferred by the transfer device of an embodiment of the present invention.

1: transfer device

10: Membrane

20: Mode

30: substrate

400: Membrane Supply Department

500: feed roller

600: Protective film recycling department

700: demolding department

710: Plasma processing module

720: Evaporation Module

800: Transfer Department

900: Membrane Recycling Department

Claims (48)

A transfer device which transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: A mold release part capable of performing mold release coating on the surface of the mold; and A transfer part capable of transferring the pattern of the mold after the release coating is applied to the substrate to the substrate, The demolding department includes: A plasma processing module, which works by treating the surface of the mold with a plasma before performing release coating on the surface of the mold; and An evaporation module, which performs release coating on the surface of the mold after the plasma treatment. A transfer device which transfers a pattern of a mold adhered to a film to a substrate. The transfer device includes: A mold release part capable of performing mold release coating on the surface of the mold; and A transfer part capable of transferring the pattern of the mold after the release coating is applied to the substrate to the substrate, The demolding part includes an evaporation module capable of releasable coating on the surface of the mold, There are multiple molds bonded to the film, The distance between the center point of the area where the mold is located in the vapor deposition module and the center point of the area where the mold is located in the transfer portion is between the center point of the mold adjacently arranged on the film The spacing is the same. The transfer device according to claim 1 or 2, wherein: The vapor deposition module coats the surface of the mold by vaporizing a mold release agent and providing the vaporized mold release agent to the surface of the mold. The transfer device according to claim 1, wherein: The transfer part is configured as: When the plasma processing module performs a process of using the plasma to treat the surface of the mold, and the evaporation module performs a process of releasable coating on the surface of the mold, The process of crimping the pattern of the mold to the substrate after the release coating and the process of separating the mold from the substrate are performed multiple times. The transfer device according to claim 1 or 2, wherein: The transfer unit includes: A crimping module capable of crimping the mold and the substrate to crimp the pattern of the mold to the substrate; and A mold separation unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping module. The transfer device according to claim 1 or 2, which further includes: A film supply part capable of supplying the film to which the mold is bonded to the demolding part; and A film recovery section, which can recover and wind up the film, The mold whose releasability has fallen below a predetermined range is adhered to the film wound on the film recovery part. The transfer device according to claim 2, which further includes: A position detection part is arranged between the evaporation module and the transfer part, thereby detecting that the preceding mold is located in the transfer part and the following mold is located in the evaporation module. The transfer device according to claim 7, which further includes: A film supply part and a film recovery part, which rotate in order to move the film, The transfer section is configured to repeatedly perform the process of crimping the pattern of the mold to the substrate and separating the substrate from the substrate in a state where one or more of the film supply section and the film recovery section are not rotated. The process of the model, The transfer device also includes: A control part receives position information of the mold from the position detection part to control the driving of more than one of the film supply part and the film recovery part. A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a vaporized release agent to the coating space so as to be able to coat the surface of the mold, The membrane passes between the first chamber portion and the second chamber portion, The fluid supply unit includes: A tank capable of containing the release agent in a liquid state; and A bubbler capable of supplying a gas of a predetermined pressure or higher to the mold release agent contained in the tank in a liquid state to vaporize the mold release agent. The transfer device according to claim 9, wherein: The bubbler discharges the gas from the mold release agent under the surface of the mold release agent contained in the tank to vaporize the mold release agent. The transfer device according to claim 9, wherein: The evaporation module also includes: A spraying device capable of spraying the gas at a position spaced upward by a predetermined distance from the surface of the release agent in a liquid state to prevent the release agent that has been vaporized from forming agglomerates. A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, A first-rate inlet is formed in the second chamber, one side of the inlet communicates with the fluid supply part, and the other side of the inlet communicates with the coating space, The inflow port is arranged below the mold. The transfer device according to claim 12, wherein: A discharge port is formed in the second chamber portion, and the discharge port is used to discharge the release agent flowing into the coating space through the inflow port to the outside, The release agent flowing into the coating space from the inflow port comes into contact with the surface of the mold while being discharged to the outside through the discharge port. A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The second chamber part includes: A chamber base; A cavity protrusion formed by protruding from the cavity base; and A cavity side wall is formed from the cavity base along the edge of the cavity base and is separated from the cavity protrusion by a predetermined distance to surround the cavity protrusion. The transfer device according to claim 14, wherein: The second chamber part includes: A first-rate inlet, which is formed on the side wall of the chamber, and communicates with the fluid supply part on one side and the coating space on the other side; A discharge port formed in the protruding part of the cavity for discharging the release agent flowing into the coating space through the inflow port to the outside, The release agent flowing into the coating space from the inflow port comes into contact with the surface of the mold while being discharged to the outside through the discharge port. The transfer device according to claim 8, wherein: The inflow port is formed on the side wall of the chamber and is arranged below the upper surface of the protruding portion of the chamber. The transfer device according to claim 15, wherein: On the edge of the cavity base, a recessed portion having a shape recessed from the upper surface of the cavity protruding portion to the lower side is formed at a position corresponding to the inflow port. The transfer device according to claim 13 or 15, wherein: There are a plurality of the flow inlets, At least a part of the plurality of inlets are arranged to face each other, The discharge port is formed in a central portion of the second chamber portion in a manner of being arranged between the inflow ports facing each other. A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The interior of the coating space is divided into an upper space and a lower space based on the film, A gas discharge port is formed in the first chamber portion, and the gas discharge port is used to discharge the gas remaining in the upper space in the coating space on the basis of the film to the outside, A discharge port is formed in the second chamber portion for discharging the release agent remaining in the lower space on the basis of the film in the coating space to the outside. The transfer device according to any one of claims 9 to 19, wherein: The evaporation module also includes: A heater that maintains the temperature of the coating space in the range of 30°C to 80°C by heating more than one of the first chamber portion and the second chamber portion. A transfer device, which includes an evaporation module, and the evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion and forming a coating space for arranging a film bonded with a mold together with the first cavity portion; and A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The membrane passes between the first chamber portion and the second chamber portion, The vapor deposition module further includes a vapor deposition sealing portion that surrounds the coating space to seal between the first cavity portion and the second cavity portion, The vapor deposition sealing part includes a first vapor deposition sealing component provided in the first chamber part and a second vapor deposition sealing component provided in the second chamber part, One of the first vapor deposition sealing member and the second vapor deposition sealing member has a planar shape when not in close contact with the other, and the other has an arc shape when not in close contact with the one. A transfer device, which includes an evaporation module and a plasma processing module, The evaporation module includes: A first chamber part; A second cavity portion arranged below the first cavity portion, and together with the first cavity portion, form a coating space for arranging a film bonded with a mold; A fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, The plasma processing module uses plasma to treat the surface of the mold to modify the surface of the mold, The membrane passes between the first chamber portion and the second chamber portion, The vapor deposition module performs release coating on the surface of the mold after plasma treatment is performed on the surface of the mold by the plasma processing module. A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A mold separation unit including a first roller portion supporting the film on the other side of the film that is the opposite side of the one side of the film, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The first roller portion moves to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate. The transfer device according to claim 23, wherein: The mold separation unit further includes a second roller portion that supports the film in a manner to bend the film in a direction surrounding a part of the first roller portion. The transfer device according to claim 23, wherein: The second crimping unit includes a substrate seating portion capable of supporting the substrate when the mold is pressed against the substrate by the crimping module and the mold is separated from the substrate by the mold separating unit, A suction port capable of sucking the substrate is formed in the substrate mounting portion to prevent the substrate from being detached from the second crimping unit when the mold is pressed against the substrate and the mold is separated from the substrate. The transfer device according to claim 23, which further includes: A frame capable of supporting the crimping module and the mold separating unit, The first crimping unit and the second crimping unit move relative to each other in a state of being supported by the frame, The mold separation unit moves relative to the mold in a state of being supported by the frame. A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A frame capable of supporting the crimping module, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The frame includes a first frame part and a second frame part, The first crimping unit includes: A first crimp body capable of pressing the mold; and A first guide member fixedly supported on the first frame portion and capable of guiding the movement of the first crimping body, The second crimping unit includes: A second crimping body capable of supporting the substrate; and A second guide member fixedly supported on the second frame portion and capable of guiding the movement of the second crimping body, The first crimping body and the second crimping body are moved and guided by the first guide member and the second guide member to move up and down relative to the frame. The transfer device according to claim 27, wherein: The first crimping unit includes: A first crimp body, which can pressurize the mold; A first supporting portion capable of supporting the first crimping body; and A pushing preventing part, one end of which is fixedly supported on the first frame part, and the other end is supported on the first supporting part, The pushing preventing portion can prevent the first crimping body from being damaged by the second crimping unit ascending by pressing the first supporting portion when the second crimping unit is raised to pressurize the substrate. Push to the upper side. The transfer device according to claim 27, which further includes: A mold separating unit that moves to a space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate the mold crimped to the substrate from the substrate, The frame also includes a third frame part, The mold separation unit includes: A roller part capable of separating the mold crimped to the substrate from the substrate; and A roller guide member fixedly supported on the third frame portion and capable of guiding the movement of the roller portion, The roller portion is moved and guided by the roller guide member to move relative to the frame. The transfer device according to claim 29, wherein: The first frame portion, the second frame portion, and the third frame portion are integrally fixed and supported with respect to each other. A transfer device, which includes: A crimping module, which includes a first crimping unit that can move toward a film on which a mold with a pattern formed on one surface is bonded, and a second crimping unit that can support a substrate; and A detection unit capable of detecting a first stop position, a second stop position and a deceleration position of the crimping module, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, The deceleration position is located between the first stop position and the second stop position, The crimping module is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position. The transfer device according to claim 31, which further includes: A control unit receives position information of the crimping module from the detection unit to control the driving of the crimping module. A transfer device, which includes: A mold separation unit capable of moving a first roller portion supporting the film on the other side of the film opposite to the one side of the film to the side of a substrate to separate the substrate that is crimped to the substrate Mold; and A detection unit capable of detecting a first stop position, a second stop position and a deceleration position of the mold separation unit, The deceleration position is located between the first stop position and the second stop position, The mold separation unit is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position. The transfer device according to claim 33, which further includes: A control unit receives position information of the crimping module from the detection unit to control the driving of the mold separation unit. The transfer device according to claim 31 or 33, wherein: The detection unit includes: A first stop position detection sensor for detecting the first stop position; A deceleration position detection sensor for detecting the deceleration position; and A second stop position detection sensor for detecting the second stop position. A transfer device, which includes: A first crimping unit capable of moving toward a film with a pattern formed on one side bonded to a film; A second crimping unit capable of supporting a substrate; A crimping and sealing portion, which includes a first crimping and sealing member inserted into the first crimping unit, and a first crimping and sealing member that is inserted into the second crimping unit and having a shape different from that of the first crimping and sealing member Two crimping and sealing parts, The first crimping unit and the second crimping unit move toward the film on the opposite sides of the film and are pressed against each other to crimp the pattern formed on the mold to the substrate, One of the first crimping sealing member and the second crimping sealing member has a planar shape when not in close contact with the other, and the other has an arc shape when not in close contact with the one . A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: A plasma treatment step of using a plasma to treat the surface of the mold; Performing a releasable coating step of releasable coating on the surface of the mold after the plasma treatment; and A transfer step of transferring the pattern of the mold after the release coating step is performed to the substrate. A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: Performing a release coating step of release coating on the surface of the mold; and A transfer step of transferring the pattern of the mold after the mold release coating step is performed to the substrate, After a position detection section detects that the mold is located in an evaporation module for performing the release coating step and a transfer section for performing the transfer step, the release coating step and the rotation are performed.印 step. The method for producing a substrate subjected to transfer according to claim 37 or 38, wherein: The transfer step includes: A crimping step of crimping the mold and the substrate to each other; and A separation step of separating the mold from the substrate, The crimping step and the separating step are performed in a state where one or more of a film supply part and a film recovery part that are rotated in order to move the film are not rotated. According to claim 37, the method for producing a substrate subjected to transfer, which further includes: A separation step of separating the mold from the substrate, When the plasma treatment step and the release coating step are performed once, the transfer step and the separation step are performed a plurality of times. According to claim 39, the method for producing a substrate subjected to transfer, which further includes: When the crimping step and the separating step are performed a plurality of times so that the mold releasability of the mold falls below the specified range, a film recovery step of recovering the film to which the mold is bonded. A method for producing a substrate subjected to transfer printing, which produces a substrate to which a pattern of a mold bonded to a film is transferred, and the method for producing a substrate subjected to transfer printing includes the following steps: Perform a release coating step of release coating on the surface of the mold, The release coating step includes: A space forming step of sealing a first chamber portion and a second chamber portion to form a coating space; A mold release agent supply step of supplying a vaporized mold release agent to the coating space; and After supplying the vaporized release agent to the coating space, a purge step of supplying gas to the coating space, In this release agent supply step, The release agent in a liquid state contained in a tank is supplied with a gas of a predetermined pressure or higher by a bubbler to vaporize the release agent, and the vaporized release agent is supplied to the coating space, The second chamber portion is arranged below the first chamber portion, The membrane passes between the first chamber part and the second chamber part. The method for producing a substrate subjected to transfer according to claim 42, which further includes: The vaporized release agent supplied to the coating space is discharged to the outside after coating the surface of the mold. The method for producing a substrate subjected to transfer according to claim 42, which further includes: Plasma treatment is performed on the surface of the mold to modify the surface of the mold by a plasma treatment step, The plasma treatment step is performed before the release coating step. A method for producing a substrate subjected to transfer printing, which includes: A first crimping unit and a second crimping unit are moved from opposite sides of a film on which a pattern-formed mold is bonded to the film to crimp the mold to a substrate. Steps; and A separating step of moving a mold separating unit to the side of the substrate to separate the mold crimped to the substrate in the crimping step from the substrate, wherein the mold separating unit includes a first roller portion, and the first The roller portion supports the film on the other side of the film that is the opposite side of the one side of the film, This separation step includes: The mold separation unit is moved to the space between the first crimping unit and the second crimping unit where the substrate is crimped to the mold to separate a mold of the mold crimped to the substrate from the substrate Separation unit moving step. The method for producing a substrate subjected to transfer according to claim 45, wherein: The crimping step includes: Bringing the first crimping unit and the second crimping unit closer to a crimping unit that moves from the opposite side of the film to the film; A sealing step of extending a bellows of the second crimping unit toward the first crimping unit to seal the space around the substrate with respect to the outside; and A gas discharge step of discharging the gas remaining in the closed space inside the bellows to the outside. The method for producing a substrate subjected to transfer according to claim 45, wherein: The separation step also includes: After transferring the pattern of the mold to the substrate through the crimping step, a crimping unit raising step of raising the first crimping unit. The method for producing a substrate subjected to transfer according to claim 45, wherein: In a state where one or more of the one film supply part and the one film recovery part that are rotated in order to move the film are not rotated, the pressure bonding step and the separation step are repeatedly performed a predetermined number of times.

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