JP5497467B2 - Fine etching mask manufacturing method and exposure processing apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a fine etching mask, and more particularly to a method for manufacturing a fine etching mask by pattern transfer onto a workpiece and an exposure processing apparatus used therefor.

  With the recent development of photolithography technology, it has become possible to form a fine pattern having a light wavelength level pitch. Such a member or product having a very fine pattern with a very small pitch is useful not only in the semiconductor field but also in the optical field (Non-Patent Document 1). As a promising method for forming a nano-sized lithography mask structure using a fine pattern, a method of transferring a pattern by pressing a mold having a fine pattern against a thermoplastic resin or a photocurable resin is known. (Patent Document 1, Non-Patent Document 2). As such a method, literatures filed in 1975 (Patent Literature 2, Non-Patent Literature 3) can be referred to.

  As a method for continuously forming a fine pattern of a large area, a method using a cylindrical roller on which a fine pattern is formed is known (Patent Document 3 and Patent Document 4). In this method, a photocurable resin is sandwiched between a cylindrical roller and a film substrate, a fine pattern and the photocurable resin are pressed, and the photocurable resin is cured by irradiating ultraviolet rays. Transfer the pattern on top.

  Further, a method of transferring a pattern onto a workpiece using a pattern shaping film produced under a predetermined condition is known (Patent Document 5). In this method, since light can be irradiated through the pattern-forming film mold, the photocurable resin can be cured even if the workpiece is light-shielding. A method using a thermoplastic resin is also known (Patent Document 6).

  Patent Document 1 discloses a method of using a photocurable resin, which is pattern-transferred on a workpiece, as an etching mask. In this method, after forming a pattern shaping film mold, a mold release treatment is performed on the surface of the pattern shaping film mold, and pattern transfer is performed on the photocurable resin on the workpiece by the above method. Then, the cured material formed on the workpiece is used as an etching mask, and the workpiece is processed by etching.

JP 2009-145742 A Japanese Patent Publication No.53-22427 Japanese Patent Laid-Open No. 03-064701 JP 05-47048 A JP 2000-321675 A Japanese Patent No. 2925069

Bulletin of Japan Women's University Faculty of Science No. 14 (2006) Applied Physics Letters, vol. 96, 1995, pp. 3114-3116 IEICE technical report CPM76-125 (1977)

  By the way, when using the resin material that has been subjected to pattern transfer as an etching mask, the residual thickness of the concave portion of the resin material layer (pattern transfer layer) to which the fine concavo-convex shape has been transferred is thin and uniform within the surface of the film substrate. It is desirable to be. From such a viewpoint, Patent Document 5 discloses a coating amount of the photocurable resin.

  However, in the actual manufacturing of an etching mask, the surface of a work material for forming a fine pattern and the surface of a mold used for pattern transfer have a surface roughness of about several micrometers. It was difficult to make the residue thickness of the fine uneven shape thin and uniform. For this reason, it is necessary to suppress the influence of this surface roughness on the entire surface of the workpiece, to make the residual thickness of the pattern transfer layer uniform, and to construct a fine etching mask having a thickness of several tens of nanometers. Has been.

  The present invention has been made in view of the above points, and in the method of manufacturing a fine etching mask by pattern transfer onto a workpiece, the residual thickness of the pattern transfer layer after transfer is made uniform and thin in the transfer layer. It is another object of the present invention to provide a method for manufacturing a fine etching mask having a uniform thickness after etching and an exposure processing apparatus used therefor.

The method for producing a fine etching mask of the present invention is a method for producing a fine etching mask on a workpiece film provided with a substrate and a workpiece layer provided on the substrate, wherein the workpiece is processed. A resin mold is applied on the outer peripheral surface of the back roll provided with an elastic body layer by applying a photocurable resin on the workpiece material layer of the material film to form a composite film provided with the photocurable resin layer. A mold-curing process in which the transfer pattern and the photocurable resin layer of the composite film are exposed in surface contact to form a transfer pattern on the photocurable resin layer, and the mold-cured process after the mold-curing process A peeling step for peeling the composite film and the resin mold, and an etching step for removing a residual portion of the transfer pattern formed on the photocurable resin layer of the composite film after the peeling step. The shaping curing step, on the outer peripheral surface of the backing roller, the composite film and the resin mold is pressed against the outer circumferential surface of the back roll by a film tension of the resin mold and the composite film and the resin film Are in surface contact, and the transfer pattern is shaped under the condition that the Young's modulus E [MPa] of the elastic layer of the back roll satisfies the following relational expression (1).
0.1 ≦ E ≦ 1,000 × dσ Equation (1)
(In the formula (1), d represents the thickness of the elastic layer [μm], σ is the pressure [MPa] in the vertical direction with respect to the photocurable resin layer of the composite film by the film tension of the resin mold Represents.)
In the method for producing a fine etching mask of the present invention, the composite film and the resin mold are each separately transported to the outer peripheral surface of the back roll by a transport mechanism, and in surface contact with the outer peripheral surface of the back roll, It is preferable that the exposure is performed by a light source provided to face the back roll.

  In the method for producing a fine etching mask of the present invention, in the shaping and curing step, the back roll side of the back roll side with respect to a vertical plane connecting the center of the nip roll and the center of the back roll attached to the back roll. It is preferable to convey the composite film from an angle.

  In the method for producing a fine etching mask of the present invention, it is preferable that in the mold hardening step, the back roll is brought into surface contact under a condition where a pressure σ in a direction perpendicular to the elastic layer is 0.0001 MPa to 0.01 MPa. .

  In the method for producing a fine etching mask of the present invention, in the coating step, the amount of the photocurable resin applied is equal to or less than the apex of the transfer pattern convex portion in the in-plane vertical direction in the transfer pattern surface of the resin mold. The range of 50% to 120% of the pattern void volume is preferable.

  In the method for producing a fine etching mask of the present invention, in the coating step, a photocurable resin containing a fluorine component is applied, and in the mold curing step, a resin mold containing a fluorine component is used as the resin mold. It is preferable to use it.

An exposure processing apparatus according to the present invention includes a first transport mechanism that transports a workpiece film provided with a workpiece layer provided on a substrate and a photocurable resin layer provided on the workpiece layer. A second transport mechanism for transporting a resin mold provided with a transfer pattern on a substrate; and an elastic body layer on an outer peripheral surface; and the photocurable resin layer of the composite film on the elastic body layer A back roll that makes surface contact with the transfer pattern of the resin mold, a light source that exposes the surface-contacted composite film and the resin mold on the elastic layer of the back roll, the composite film, and the comprising a release mechanism for peeling the resin mold, and etching mechanism for removing the residue portion partial transfer pattern of said composite said photocurable resin layer which is Fugata in the photocurable resin layer of the film, the said On the outer peripheral surface of Kkuroru, the composite film and the resin mold is pressed against the outer circumferential surface of the back roll by a film tension of the resin mold and the composite film and the resin film are in surface contact, the The Young's modulus E [MPa] of the elastic layer of the back roll satisfies the following relational expression (1).
0.1 ≦ E ≦ 1,000 × dσ Equation (1)
(In the formula (1), d represents the thickness of the elastic layer [μm], σ is the pressure [MPa] in the vertical direction with respect to the photocurable resin layer of the composite film by the film tension of the resin mold Represents.)

  In the exposure processing apparatus of the present invention, it is preferable that a coating mechanism is provided in the first transport mechanism and before the back roll.

  According to the present invention, in the method of manufacturing a fine etching mask by pattern transfer onto a workpiece, the residual thickness of the pattern transfer layer after transfer can be made uniform and thin in the transfer layer, and after the etching process A method of manufacturing a fine etching mask having a uniform thickness and an exposure processing apparatus used therefor can be provided.

It is a cross-sectional schematic diagram of the to-be-processed material film which concerns on embodiment of this invention. It is a cross-sectional schematic diagram of the resin mold which concerns on embodiment of this invention. It is a cross-sectional schematic diagram of the composite film which concerns on embodiment of this invention. It is the schematic of the exposure processing apparatus which concerns on embodiment of this invention. It is a cross-sectional schematic diagram which shows the surface contact state of the resin mold and composite film in the shaping hardening process of the manufacturing process of the fine etching mask which concerns on embodiment of this invention. It is explanatory drawing of the conveyance direction of the composite film in the manufacturing process of the fine etching mask which concerns on embodiment of this invention. It is a schematic diagram of the composite film after the etching process which concerns on embodiment of this invention. It is a cross-sectional observation photograph of the photocurable resin layer after the pattern transfer which concerns on implementation of this invention. It is a cross-sectional observation photograph after the etching process which concerns on implementation of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The method for manufacturing a fine etching mask according to the present embodiment is a composite of forming a photocurable resin layer on a workpiece film provided with a substrate and a workpiece layer provided on the substrate. On the back roll provided with an elastic body layer, an application curing process for forming a film, and a mold curing process for transferring the transfer pattern formed on the resin mold to the photocurable resin layer of the composite film under a predetermined condition; The peeling process which peels the composite film and resin mold after a shaping hardening process, and the etching process which removes the residue part of the transfer pattern of a composite film are included. Each step will be described below.

  First, a workpiece film and a resin mold used in the method for manufacturing a fine etching mask according to the present embodiment will be described. FIG. 1 is a schematic cross-sectional view showing an example of a workpiece film 10 according to the present embodiment. A workpiece film 10 shown in FIG. 1 includes a film substrate 11 and workpiece layers 12 and 13 provided on the film substrate 11.

  The material constituting the film substrate 11 is not particularly limited as long as it is a film that can be bent substantially. For example, polymethyl methacrylate resin, polycarbonate resin, polystyrene resin, cycloolefin Amorphous such as resin (COP), crosslinked polyethylene resin, polyvinyl chloride resin, polyarylate resin, polyphenylene ether resin, modified polyphenylene ether resin, polyetherimide resin, polyether sulfone resin, polysulfone resin, polyether ketone resin Thermoplastic resin, polyethylene terephthalate (PET) resin, polyethylene naphthalate resin, polyethylene resin, polypropylene resin, polybutylene terephthalate resin, aromatic polyester resin, polyacetal resin, polyacrylate And crystalline thermoplastic resins, such as de resin, acrylic, epoxy, include ultraviolet (UV) is formed of a curable resin and a thermosetting resin film such as urethane. A substrate made of PET resin or polycarbonate resin is preferable because it is inexpensive and has good weather resistance. In some cases, a thin base material such as glass or stainless steel may be processed. In addition, the thickness of the film substrate 11 is desirably about 20 to 300 micrometers in consideration of operability and flexibility.

The work material layers 12 and 13 are layers processed after the fine etching mask is formed, and the material is not limited. Examples of the material used for the processed layers 12 and 13 include simple metals such as Cr, Cu, Ti, Ag, Pt, Au, Al, Ni, Fe, Pb, In, and Zn, SiOx, SiNx, and Al ₂ O. ₃ , ITO, TiO ₂ , Nb ₂ O ₅ , ZnO, CuO, Cu ₂ O, ZrO ₂ , WO ₃ and other dielectrics, Ni—Cr, SUS, Cu—Zn and other alloys, MgF ₂ and LiF, etc. A compound. These metals or dielectrics may be formed of one kind or a combination of two or more kinds, and the film may be formed of one layer or multiple layers. FIG. 1 shows an example in which two workpiece layers 12 and 13 are formed.

  For example, sputtering, vacuum deposition, CVD, plasma process, chemical adsorption, electroforming, plating, MBE, press, and coating can be used to form the workpiece layers 12 and 13 made of metal or dielectric on the film substrate 11. Can be mentioned. In order to improve the adhesion between the workpiece and the resin film, the surface of the resin substrate is subjected to, for example, easy adhesion coating, primer treatment, corona treatment, ozone treatment, high energy ray treatment, surface roughening treatment, and porous treatment Also good. The apparatus for forming the workpiece material layers 12 and 13 may be provided on the same conveyance path as a coating apparatus and an exposure processing apparatus to be described later, or may be provided on a different conveyance path as another apparatus.

  FIG. 2 is a schematic cross-sectional view showing an example of the resin mold 20. A resin mold 20 shown in FIG. 2 includes a transparent film substrate 21 and a resin pattern layer 22 provided on the transparent film substrate 21 as a transfer pattern having a fine uneven shape. On the upper surface side of the resin pattern layer 22, a fine pattern having a concavo-convex structure extending in the front-back direction of the paper is formed. In FIG. 2, the concave portions 24 between the convex vertices 23 of the fine pattern are the pattern gap cross-sectional areas.

  The material constituting the transparent film substrate 21 is substantially transparent at a wavelength for curing a photocurable resin, which will be described later, or has a high light transmittance and can be bent substantially. There is no particular limitation. Examples of such transparent film substrate 21 include polymethyl methacrylate resin, polycarbonate resin, polystyrene resin, cycloolefin resin (COP), crosslinked polyethylene resin, polyvinyl chloride resin, polyarylate resin, polyphenylene ether resin, modified Amorphous thermoplastic resins such as polyphenylene ether resin, polyetherimide resin, polyether sulfone resin, polysulfone resin, polyether ketone resin, polyethylene terephthalate (PET) resin, polyethylene naphthalate resin, polyethylene resin, polypropylene resin, Crystalline thermoplastic resins such as polybutylene terephthalate resin, aromatic polyester resin, polyacetal resin, polyamide resin, and ultraviolet light such as acrylic, epoxy, and urethane UV) curable resin or thermosetting resin transparent film substrate 21 formed with the like. The transparent film substrate 21 made of PET resin or polycarbonate resin is preferable because it is inexpensive and has good weather resistance. Moreover, what processed thin solid substrates, such as glass, may be used. In addition, the thickness of the transparent film substrate 21 is preferably about 20 to 300 micrometers in consideration of operability and flexibility.

  The resin pattern layer 22 is produced by the following procedure. First, a photocurable resin containing a fluorine component constituting the resin pattern layer 22 is applied to one side of the transparent film substrate 21 so that the film thickness is uniform, and then desired on the upper surface of the photocurable resin. A mold (A) on which a pattern reversed with respect to the transfer pattern shape is pressed. Next, the resin pattern layer 22 can be obtained by irradiating curing light from the transparent film substrate 21 side and curing the photocurable resin. In addition, when a light transmissive material is used as the mold (A), the photocurable resin can be cured by irradiating the curing light from the mold (A) side, and the resin pattern layer 22 is obtained. I can do it.

  As the resin mold 20, a reel-shaped resin mold may be used. The reel-shaped resin mold is manufactured by the following procedure. First, the photocurable resin containing the fluorine component which comprises the resin pattern layer 22 is apply | coated to the single side | surface of the transparent film base material 21 so that a film thickness may become uniform. Then, the said type | mold (A) is pressed on the upper surface of photocurable resin in the state affixed on the diameter surface of the roll. Next, curing light is irradiated from the transparent film substrate 21 side to cure the photocurable resin. The reel-shaped resin mold 20 can be obtained by continuously performing the above steps while rotating the roll to which the mold (A) is attached.

  Since the resin mold 20 contains a fluorine-based additive, there is no need for a mold release treatment, and the resin mold 20 can be used in the next step immediately after the resin mold 20 is manufactured. Immediately used in the next step here is not only used in the next step in a short time, but also used in the next step without performing chemical and physical mold release treatment on the surface of the resin mold 20 after the resin mold 20 is manufactured. It means that you can.

  The mold release process is performed as a coating process using an alcohol-based coating agent containing a fluorine component on the mold side. However, generally commercially available release treatment agents are expensive, and a large amount of release treatment agents are required in continuous production processes such as a roll-to-roll process. In addition, a plasma processing apparatus and a release processing agent coating apparatus used as a pre-stage of the mold release process are required, which not only increases the scale of the apparatus, but also increases the apparatus introduction cost. In the present embodiment, the necessity of the mold release treatment is eliminated by the above method and the addition of a fluorine component to the photocurable resin described later.

  Next, a coating process in the method for manufacturing a fine etching mask according to the present embodiment will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view of the composite film according to the present embodiment. As shown in FIG. 3, in the coating process, a photocurable resin having releasability is applied to the upper surfaces of the workpiece layers 12 and 13 of the workpiece film 10 shown in FIG. 14 is formed, and the composite film 15 is produced. The photocurable resin can be applied preferably by using reverse roll coating, gravure coating, die coating, bar coating, or the like. Details of each coating method are described in detail in the Converting Technology Handbook (2006) published by Processing Technology Research Institute, Inc. and can be referred to. In order to obtain an extremely thin photo-curing resin coating film (photo-curing resin layer), the photo-curing resin solution is coated with an organic solvent and the organic solvent is oven-dried after coating. Alternatively, an extremely thin coating film can be obtained by vaporization by air drying at room temperature or the like.

  The application amount of the photocurable resin is set between 50% and 120% of the pattern void volume below the convex vertex in the in-plane vertical direction in the pattern surface F1 of the resin mold 20 shown in FIG. It is preferable. This is to reduce the thickness of the residue after pattern transfer described later. The pattern void volume is the sum of the volumes of the pattern void cross-sectional areas of the resin mold 20 shown in FIG. The volume of the pattern void cross-sectional area refers to the volume of the pattern void cross-sectional area that is the concave portion 24 on the resin mold 20 side of the pattern surface F1 including each convex vertex 23 of the pattern of the resin mold 20.

The application amount of the photocurable resin can also be set based on the cross-sectional area of the resin mold 20. With reference to the pattern void cross-sectional area shown in FIG. 2, the coating amount of the photocurable resin based on the cross-sectional area of the resin mold 20 will be described. In the vertical sectional view shown in FIG. 2, the coating film of the photocurable resin is 50% to 150% of the cross-sectional area of the pattern gap formed on the resin mold 20 side from the pattern surface F <b> 1 including the convex vertex 23 of the resin mold 20. It is preferable to make the film thickness between. As an example of specific numerical values, when the resin mold 20 is a linear pattern, the pattern is a rectangular pattern having a pitch of 200 nm, a duty of 0.5, and a vertical distance from the top of the convex portion 23 to the bottom surface of the concave portion 24 is 100 nm. The void cross-sectional area is 10,000 nm ² . In this case, the coating film thickness is preferably set to a thickness of 25 nm to 60 nm in the same unit area.

  As the photocurable resin, a cationic curable monomer or a radical curable monomer can be used. The cationic curable monomer is excellent in the pattern transfer property of the resin mold 20 because it is not uncured due to oxygen inhibition. Specific examples of the cationic curable monomer include an epoxy compound, an oxetane compound, and a vinyl ether compound. Examples of the epoxy compound include an alicyclic epoxy compound and glycidyl ether.

  Moreover, you may use a fluorine-containing monomer as optical resin. The fluorine-containing monomer means a monomer in which at least one atom is replaced with a fluorine atom in the hydrogen atom of the photo-resin curable monomer. Examples of the fluorine-containing monomer include a fluorine-containing epoxy compound, a fluorine-containing vinyl ether compound, and a fluorine-containing acrylate compound.

  Examples of the fluorine-containing epoxy compound include glycidyl 1,1,2,2-tetrafluoroethyl ether, glycidyl 2,2,3,3-tetrafluoropropyl ether, glycidyl 2,2,3,3,4,4,5. , 5-octafluoropentyl ether, 3- (1H, 1H, 7H-dodecafluoroheptyloxy) -1,2-epoxypropane, hexafluoropropylene oxide, 3-perfluorobutyl-1,2-epoxypropane, 3 -Perfluorohexyl-1,2-epoxypropane, 1,4-bis (2 ', 3'-epoxypropyl) -perfluoro-n-butane, 1,6-bis (2', 3'-epoxypropyl) -Perfluoro-n-hexane. Examples of the fluorine-containing vinyl ether compound include 2,2,2-trifluoroethyl vinyl ether and perfluoropropyl vinyl ether.

  In this Embodiment, photocurable resin contains 10 weight part-50 weight part of fluorine-containing monomers in solid content except a solvent. The content of the fluorine-containing monomer is preferably 15 to 40 parts by weight, more preferably 20 to 35 parts by weight. When the amount exceeds 10 parts by weight, the effect of improving the releasability by the fluorine-containing monomer becomes remarkable. When the content is 50 parts by weight or less, the compatibility between the fluorine-containing monomer and other non-fluorine-containing monomers is maintained.

  The following are mentioned as photocurable monomers other than a fluorine-containing monomer. As an alicyclic epoxy compound, for example, 3 ′, 4′-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl, 3 ′, 4′-epoxy-6′-methylcyclohexanecarboxylic acid 3,4-epoxy-6 Examples include '-cyclohexylmethyl, vinylcyclohexylene monooxide 1,2-epoxy-4-vinylcyclohexane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the like.

  Examples of the glycidyl ether include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol. Examples include diglycidyl ether, trimethylolpropane triglycidyl ether, glycidyl methacrylate, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylethyldiethoxysilane, and 3-glycidyloxypropyltriethoxysilane.

  Examples of the vinyl ether include 2-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, 2-hydroxybutyl vinyl ether, 4-hydroxybutyl vinyl ether, triethylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, 1,4-butanediol divinyl ether, and the like. .

  Examples of the oxetane compound include 3-ethyl-3- (phenoxymethyl) oxetane, di [1-ethyl (3-oxetanyl)] methyl ether, 3-ethyl-3-allyloxymethyloxetane, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3-{[3- (triethoxysilyl) propoxy] methyl} oxetane, and the like can be given.

  Among the photocurable monomers other than the fluorine-containing monomers listed above, for example, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylethyl Monomers listed in diethoxysilane and 3-glycidyloxypropyltriethoxysilane are preferably added as a crosslinkable silane coupling agent since they have an effect of improving the film formation state of the resist film.

  The photocurable resin may contain a polymer component having a crosslinkable functional group. By including a polymer component having a crosslinkable functional group, flexibility can be imparted to the photocurable resin layer, which is preferable. Examples of the polymer component having a crosslinkable functional group include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and polyethylene glycol diglycidyl ether.

  Next, a mold-curing process for transferring the transfer pattern of the resin mold 20 to the photocurable resin layer of the composite film, a peeling process for separating the composite film after the mold-curing process and the resin mold 20, and a workpiece film An etching process for dry-etching the remaining portion of the photocurable resin layer 10 will be described.

  First, the exposure processing apparatus used for the shape hardening process, the peeling process, and the etching process will be described. FIG. 4 is a schematic diagram of an exposure processing apparatus according to the present embodiment. In the present embodiment, the shape hardening process, the peeling process, and the etching process are performed using the exposure processing apparatus shown in FIG. The above-described coating process may be performed by providing a coating apparatus in the exposure processing apparatus shown in FIG. 4, or only the coating process is performed in another apparatus, and the other processes are performed in the exposure processing apparatus shown in FIG. May be implemented.

  As shown in FIG. 4, the exposure processing apparatus according to the present embodiment includes a first transport mechanism that transports the composite film 15, a second transport mechanism that transports the resin mold 20, and the composite film 15 and the resin mold 20. A light irradiation unit provided on the transport path and a plasma processing apparatus 36 for dry etching the photocurable resin layer 14 of the composite film 15 after the light irradiation are provided.

  The first transport mechanism includes a transport roll 30a provided on the upstream side, a transport roll 30b provided on the downstream side of the transport roll 30a, a transport roll 30c provided on the downstream side of the transport roll 30b, and a transport roll 30c. It is comprised from the conveyance roll 30d provided in the downstream of this, and the winding roll 35 provided in the downstream of the conveyance roll 30d. The 2nd conveyance mechanism is comprised from the conveyance roll 30e provided in the upstream, and the winding roll 37 provided in the downstream of the conveyance roll 30e. The light irradiation unit includes a single back roll 31, two nip rolls 33 and 34, and a light irradiation device 32. Each of the nip rolls 33 and 34 is provided at a position where the composite film 15 and the resin mold 20 can be sandwiched between the outer peripheral surface of the back roll 31.

  The composite film 15 is transported by the transport roll 30 a, irradiated with light by the light irradiation device 32 on the outer peripheral surface of the back roll 31, and then transported by the transport rolls 30 b, 30 c, and 30 d and wound on the take-up roll 35. It is done. The resin mold 20 is conveyed by the conveyance roll 30e, and after being irradiated with light by the light irradiation device 32 on the outer peripheral surface of the back roll 31, the resin mold 20 is wound around the winding roll 37.

  In the present embodiment, the back roll 31 whose diameter surface (outer peripheral surface) is covered with a rubber-like elastic body (elastic body layer 31a) is used. By using the back roll 31 whose outer peripheral surface is covered with the elastic layer 31a in this way, the surface irregularities of each member such as the composite film 15 and the resin mold 20 in the mold hardening process can be absorbed, and the pattern transfer after transfer The layer residue thickness can be made uniform and thin.

  Materials for forming the elastic layer 31a of the back roll 31 include isoprene rubber, styrene butadiene rubber, acrylic rubber, chloroprene rubber, nitrile butyl rubber, ethylene propylene rubber, fluorine rubber, urethane rubber, butadiene rubber, butyl rubber, hyperon rubber, silicone. Synthetic rubber such as rubber, natural rubber, or sponge can be suitably selected and used. In particular, urethane rubber, nitrile butyl rubber, silicone rubber, and the like are preferably used because of versatility and ease of handling.

  The plasma processing apparatus 36 is provided between the transport roll 30d and the take-up roll 35 in the transport path of the composite film 15, and will be described later by dry-etching the photocurable resin layer 14 of the composite film 15 to which the pattern has been transferred. The residue part of the photocurable resin layer 14 is removed. In addition, when performing an application | coating process with the exposure processing apparatus shown in FIG. 4, an application | coating process can be implemented by installing application apparatuses, such as the gravure coater mentioned above, between the conveyance roll 30a and the back roll 31, for example.

  Next, the mold hardening process will be described. In the mold hardening process, the resin pattern layer 22 of the resin mold 20 is transferred to the photocurable resin layer 14 of the composite film 15 as described below. First, both the conveyance of the composite film 15 by the first conveyance mechanism and the conveyance of the resin mold 20 by the second conveyance mechanism are started. The composite film 15 is conveyed from the conveyance roll 30a so that the photocurable resin layer 14 is on the outer side (opposite side of the main surface in contact with the conveyance roll 30a) with respect to the conveyance roll 30a. The resin mold 20 is conveyed from the conveyance roll 30e so that the main surface on which the resin pattern layer 22 is formed is opposite to the conveyance roll 30e. That is, in the present embodiment, one main surface (resin pattern layer 22 formation surface) of the resin mold 20 is opposed to one main surface (photocurable resin layer 14 formation surface) of the composite film 15. The photocurable resin layer 14 of the composite film 15 and the resin pattern layer 22 of the resin mold 20 are in surface contact with each other on the outer peripheral surface of the back roll 31. In this way, the composite film 15 and the resin mold 20 are conveyed onto the outer peripheral surface of the back roll 31 via the back roll 31 and the nip roll 33.

  The composite film 15 and the resin mold 20 conveyed to the outer peripheral surface of the back roll 31 are pressed against the outer peripheral surface side of the back roll 31 by the film tension of the resin mold 20, and the composite film 15 and the resin mold 20 are integrated. Surface contact. Here, the resin pattern layer 22 of the resin mold 20 is in surface contact with the photocurable resin layer 14 of the composite film 15 with a predetermined pressure, and the resin pattern of the resin mold 20 is applied to the photocurable resin layer 14 of the composite film 15. The transfer pattern of layer 22 is transferred. At this time, the nip roll 33 may be used for pressurization or for improving the stability during conveyance of the composite film 15.

  Next, light is irradiated from the transparent film substrate 21 side of the resin mold 20 by the light irradiation device 32 in a state where the composite film 15 and the resin mold 20 are in surface contact, and the photocurable resin layer 14 of the composite film 15 is cured. Let FIG. 5 is a schematic view showing a state in which the resin mold 20 and the composite film 15 are in surface contact on the outer peripheral surface of the back roll 31. As shown in FIG. 5, the resin pattern layer 22 of the resin mold 20 comes into surface contact with the photocurable resin layer 14 formed on the composite film 15, and the uneven shape is transferred to the photocurable resin layer 14. I understand that. Here, in this embodiment, since the back roll 31 provided with the elastic body layer 31a is used on the outer peripheral surface, the surface irregularities of each member at the time of pattern transfer can be absorbed. As shown in FIG. The transfer pattern of the layer 22 can be accurately transferred to the photocurable resin layer 14. Thereby, the residue 41 in which the photocurable resin remains can be uniformly formed in the entire surface of the composite film 15 in the portion corresponding to the convex vertex 23 of the resin pattern layer 22. For this reason, an accurate fine etching mask can be formed by removing the residue 41 in an etching process described later, and a fine etching mask having a uniform thickness after the etching process can be obtained.

The Young's modulus E [MPa] of the elastic layer 31a of the back roll 31 satisfies the following relational expression (1) determined from the conditions for absorbing the surface irregularities of the film base material 11 and the transparent film base material 21. Use conditions. Since the elastic layer 31a can absorb surface irregularities such as the film base 11 and the transparent film base 21 by performing the shaping and curing step under the condition satisfying the following relational expression (1), The pressing can be made uniform in the film plane, and the residue portion 41 can be formed uniformly. The Young's modulus E [MPa] of the elastic layer 31a more preferably satisfies the following relational expression (2), and more preferably satisfies the following relational expression (3).
E ≦ 1,000 × dσ Formula (1)
E ≦ 0.200 × dσ Equation (2)
E ≦ 0.125 × dσ Equation (3)

  In the above relational expressions (1) to (3), d is the thickness [μm] of the elastic layer 31a, and σ is the pattern tension of the resin mold 20 that pushes the pattern surface of the resin mold 20 to the photocurable resin. The pressure [MPa] applied in the direction perpendicular to the photocurable resin when hitting is shown.

  Regarding the measuring method of (sigma), pressure can be evaluated by sticking a pressure sensitive paper on the surface where the composite film 15 contacts the resin mold 20, and actually pressing with the apparatus of FIG. Alternatively, the tension T [N / m] in the film winding direction applied to the composite film 15 can also be evaluated as a value divided by the radius R [m] of the back roll 31.

  In the relational expression (1) to the relational expression (3), the value of d depends on the actual size of the apparatus and the diameter of the back roll 31 but is generally between about 1 mm and 100 mm. Preferably, σ is a pressure that presses the composite film 15 against the back roll 31 due to the tension in the film winding direction of the resin mold 20, and greatly depends on the diameter of the back roll 31, but from 0.0001 [MPa] to 0 A value in the range between .01 [MPa] is preferable. When the pressure is in the range of 0.0001 [MPa] to 0.01 [MPa], the elastic layer 31a is deformed without the resin mold 22 being broken by the tension of the film winding method and without being insufficient at the time of pressing. It is preferable because it can be transferred well.

  The Young's modulus E [MPa] of the elastic layer 31a is desirably selected from the values of d and σ at the stage of actually performing the process so as to meet the above formula. For example, when the process is performed at d = 5000 μm and σ = 0.001 MPa, it is appropriate to select a rubber-like elastic body having a Young's modulus of 5.5 MPa or less. Further, when the coefficient applied to dσ is larger than 1, it has been made clear by the present inventor that it is substantially difficult to absorb surface irregularities of each member or the like.

  In the present embodiment, the angle at which the composite film 15 on which the photocurable resin layer 14 is formed is conveyed to the back roll 31 in the form hardening process is such that the center P1 of the back roll 31 and the nip roll are as shown in FIG. It is more preferable to convey from a position from the back roll 31 side with respect to a vertical plane F2 with respect to a straight line L1 connecting the center P2 of 33. Moreover, it is more preferable that the angle at which the composite film 15 is conveyed to the back roll is such that the angle θ shown in FIG. 6 is 0 ° or more. Here, the angle θ is defined by the straight line connecting the starting point where the composite film 15 is in surface contact with the surface of the elastic layer 31a and the center P1 of the back roll 31 in the conveyance path of the composite film 15, and the straight line L1. This is an angle formed, and in FIG. 6, the clockwise direction with respect to the center P1 of the back roll 31 is positive. By conveying the composite film 15 under the condition that the angle θ is 0 ° or more, the surface contact start point between the composite film 15 and the resin mold 20 is on the straight line L1 and is on the delivery side (free roll 30f side). Can be suppressed. Thus, by setting the surface contact start point on the straight line L1, it is preferable that air bubbles are not held.

  When the starting point of the surface contact between the composite film 15 and the resin mold 20 is not on the straight line L1, it means that the composite film 15 is conveyed from the lower side (nip roll side) than the surface F2, and holds bubbles. It becomes easy to put. In particular, in the case where the thickness of the photocurable resin layer 14 on the composite film 15 is thin, it is difficult to remove the bubbles if the bubbles are embraced even by a very small amount. Even in such a case, the entrapment of bubbles can be suppressed by transporting with the transport angle θ set to 0 ° or more. Since the upper limit value of θ depends on the actual device dimensions, the setting of the upper limit value is not practically meaningful, but is set to less than 360 °.

  The elastic layer 31a on the surface of the back roll 31 is preferably made of a material having a Young's modulus determined by the above relational expressions (1) to (3). It is preferable that the surface of the elastic layer 31a is hard to stick. Generally, a plasticizer is often added to a rubber-like elastic body to give flexibility, and adhesiveness is generated between the rubber surface and the film substrate. When stickiness occurs, in the configuration of FIG. 6, bubbles are embraced between the elastic body layer 31 a and the film base surface of the composite film 15, making it difficult to perform uniform pressing and peeling. When the composite film 15 is separated from the elastic layer 31a in the process, there is a possibility that smooth conveyance cannot be performed.

  Regarding the above problems, a method of oxidizing the surface of the rubber material constituting the elastic layer 31a using a chemical solution, a method of coating the surface, silicon rubber having relatively low adhesiveness among rubber materials, and the like are used. Can be solved.

The wavelength and irradiation amount irradiated from the light irradiation device 32 are determined by the curing characteristics of the photocurable resin layer 14. The extra wavelength irradiated from the light irradiation device 32 is absorbed by the elastic body or other device components and becomes heat, which may cause the resin mold 20 or the composite film 15 to be deformed. It is preferable to select only a necessary wavelength by inserting a low pass filter or the like. When the amount of light irradiated from the light irradiation device 32 is small, the photocurable resin layer 14 is in a semi-cured state due to insufficient irradiation light amount, and there is a concern that the pattern collapse or the like may occur after the resin mold 20 is peeled off. It is preferable that the amount of light irradiation is slightly higher. In addition, when the amount of light irradiation is excessive, it is absorbed by the apparatus constituent members and becomes heat, which may cause deformation of the resin mold 20 and the composite film 15, so it is necessary to select an appropriate amount of irradiation. . In the present embodiment, the irradiation amount of light from the light irradiation device ^32, is preferably irradiated between ^{10mJ / cm 2 ~1000mJ / cm 2} .

  Since the wavelength for photocuring the photocurable resin depends on the absorption wavelength of the photoacid generator added to the resin, it can be selected as appropriate. For example, when DTS-102 manufactured by Midori Chemical Co. is used, it is desirable to select a wavelength of 365 nm.

  Next, the peeling process will be described. The composite film 15 and the resin mold 20 on which the fine pattern is formed and cured are conveyed between the back roll 31 and the nip roll 34 via the outer peripheral surface of the back roll 31. From between the back roll 31 and the nip roll 34, the resin mold 20 is conveyed toward the take-up roll 37 and wound around the take-up roll 37. On the other hand, the composite film 15 is conveyed toward the take-up roll 35 via the conveyance rolls 30b to 30d. As described above, the composite film 15 and the resin mold 20 are peeled off. The resin mold 20 taken up by the take-up roll 37 can be reused as the resin mold 20 again after cleaning.

  Next, the etching process will be described. In the etching process, the residue 41 of the photocurable resin layer 14 of the composite film 15 that has been subjected to the mold curing process is dry-etched to form a fine pattern. In this step, the plasma processing apparatus 36 in the same film transport path as in the plasma processing apparatus 36 shown in FIG. 4 or the workpiece film is wound up and then etched by the plasma processing apparatus in another transport path. Is done. In the etching process, an atmospheric pressure discharge plasma process may be used because a uniform and thin residue portion is etched in the film surface, but a vacuum plasma process may be used.

The process gas in the plasma treatment may be any gas that selectively etches the resin layer, such as O ₂ gas, CF ₄ gas, C ₂ F ₆ gas, NF ₃ gas, COF ₂ gas, SF ₆ gas, etc. A gas obtained by mixing Ar, N ₂ or the like with this gas can be suitably selected. Further, it is necessary to appropriately select the conditions for the etching process time and applied voltage depending on the etching condition of the residue portion. However, as shown in the conceptual diagram of FIG. 7, the film thickness of the residue portion is zero after the etching process. It is desirable that only the pattern convex portions remain.

  The composite film 15 from which the residue 41 has been removed in the etching process is wound up on the winding roll 35. A fine etching mask is manufactured as described above.

  As described above, according to the present invention, in the method for manufacturing a fine etching mask by a series of steps, by absorbing the surface irregularities of each member using the back roll 31 provided with the elastic layer 31a on the outer peripheral surface, The residue thickness of the pattern resin layer after transfer can be made uniform and thin in the film plane, and a fine etching mask having a uniform height after the etching process can be produced.

  Next, examples performed for clarifying the effects of the present invention will be described. In addition, this invention is not limited at all by the following examples.

[Example 1]
1) Production of workpiece film In the workpiece film 10 shown in FIG. 1, the film substrate 11 is a polyethyl terephthalate (PET) film having a thickness of 80 μm, a length of 200 m, and a width of 0.3 m, and aluminum is formed by sputtering. Was formed in a thickness of 100 nm to form a layer to be processed 12, and SiO ₂ was stacked thereon in a thickness of 20 nm to form a layer to be processed 13.

2) Production of reel-shaped resin mold 20 A photocurable acrylic resin was applied to a PET film having a thickness of 80 μm, a length of 200 m, and a width of 0.3 m to a thickness of 10 μm. The coated photocurable acrylic resin had a pitch of 140 nm, a duty of 0.5, and a vertical distance between the top and bottom of the concavo-convex pattern of 175 nm. Then, bonded to nickel precursor having a structure of fine lines and spaces, ultraviolet 1000 mJ / cm ² and irradiation center wavelength from the PET film side using a 365nm ultraviolet lamp, to cure the coating portion. The original plate was peeled off, and the obtained PET film substrate was used as a resin mold. The resin mold was not particularly subjected to release treatment after the production.

3) Photocurable resin coating process (production of composite film 15)
The following resin materials were used as the photocurable resin.
A-1: 3-ethyl-3- (phenoxymethyl) oxetane (OXT-211 manufactured by Toa Gosei Co., Ltd.)
A-2: 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl (manufactured by Wako Pure Chemical Industries, Ltd.)
A-3: 3-glycidyloxypropyltrimethoxysilane (LS-2940, manufactured by Shin-Etsu Silicone)
B-1: Glycidyl 2,2,3,3,4,4,5,5-octafluoropentyl ether (manufactured by Aldrich)
C-1: AER260 (Asahi Kasei Chemicals)
D-1: DTS-102 (manufactured by Midori Chemical)
E-1: 1,9-dibutoxyanthracene (manufactured by Kawasaki Kasei Co., Ltd.)
・ Propylene glycol monomethyl ether

  A-1: 28.5 parts by weight, A-2: 9.5 parts by weight, A-3: 9.5 parts by weight, B-1: 23.5 parts by weight, C-1: 23 .5 parts by weight, D-1: 4.5 parts by weight, E-1: 1 part by weight, diluted to 5% with propylene glycol monomethyl ether, sufficiently stirred, and photocurable resin composition It was. Further, in an exposure processing apparatus (roll-to-roll coating / transfer apparatus) as shown in FIG. 4, a gravure coating apparatus is installed in front of the transport roll 30a, and the work film 10 is photocurable by a gravure coating method. A composite film 15 was produced by uniformly forming the photocurable resin layer 14 so that the film thickness of the resin layer was 80 nm.

4) Forming and curing step The composite film 15 and the resin mold 20 are placed between the back roll 31 and the nip roll 33 formed with nitrile butyl rubber (Young's modulus E = 1.1 MPa, thickness d = 20 mm) on the surface. No. 15 was conveyed from the direction where the angle θ shown in FIG. 6 was 10 degrees, and the resin mold 20 was conveyed along the conveying roll 30e shown in FIG. No entrapment of bubbles was confirmed. In the state where the composite film 15 is pressed against the back roll by the film tension of the resin mold 20 (press σ = 0.001 MPa), the resin mold 20 side is irradiated with 1000 mJ / cm ^{2 of} ultraviolet rays using an ultraviolet lamp having a center wavelength of 365 nm, The coating film portion was cured.

5) Peeling process The resin mold 20 and the composite film 15 were peeled, each was conveyed by another path | route, and it wound up with the winder. The conveyance speed is 1 m / min. The relational expression between E and dσ was E = 0.055 dσ. When the workpiece after peeling was cut out and the cross section was observed with an electron microscope, the pitch of the transferred concavo-convex pattern was 140 nm, the vertical distance between the top and valley bottom was 120 nm, and the thickness of the residue was It was 10 nm. An observation image is shown in FIG. As shown in FIG. 8, a fine pattern having a uniform uneven shape was transferred.

6) Etching Step The composite film 15 after the resin pattern was molded was placed in a vacuum chamber and evacuated until the vacuum pressure became 5.0 × 10 ⁻⁴ Pa, and then oxygen gas was introduced at a gas flow rate of 10 sccm. . Next, oxygen plasma was generated at an applied power amount of 50 W and a processing pressure of 0.2 Pa, and the uneven pattern (transfer pattern) on the surface of the composite film 15 was dry-etched. The treated composite film 15 was cut out and the cross section was observed with an electron microscope. As a result, the pitch of the concavo-convex pattern was 140 nm, the vertical distance between the top and valley bottom was 105 nm, and no residue was present. The electron microscope observation of the cross section observed three points in the width direction of the work piece: the end, the center, and the other end, all of which have the same shape and a uniform height in the film plane. It was confirmed that. An observation image is shown in FIG. As shown in FIG. 9, the residue part 41 hardly remained in the recessed part 24 of the photocurable resin layer.

[Example 2]
The same fine etching mask manufacturing method as in Example 1 was carried out with the photocuring resin gravure coating thickness set to 47 nm. Thereafter, the peeled composite film 15 was cut and the cross section was observed with an electron microscope. As a result, the pitch of the transferred concavo-convex pattern was 140 nm, the vertical distance between the top and the valley bottom was approximately 67 nm, and the residue 41 It was confirmed that the thickness was 10 nm. Further, when dry etching was performed in the same manner as in Example 1 in a time that the residue portion 41 was almost zero, the transfer pattern had a triangular shape, and the vertical distance between the top and the valley bottom was about 30 nm. The width of the bottom of the triangular shape was about 40 nm. The residue part 41 did not exist. The electron microscope observation of the cross section observed three points in the width direction of the work piece: the end, the center, and the other end, all of which have the same shape and a uniform height in the film plane. It was confirmed that.

[Example 3]
A fine etching mask was produced under the same conditions as in Example 1 with the gravure coating thickness of the photocurable resin being 100 nm. Thereafter, the peeled composite film 15 was cut and the cross section was observed with an electron microscope. As a result, the pitch of the transferred concavo-convex pattern was 140 nm, the vertical distance between the top and the bottom of the valley was approximately 120 nm, and the residue 41 The thickness was confirmed to be 18 nm. Further, when dry etching was performed in the same manner as in Example 1 for a time that the residue portion 41 was almost zero, the transfer pattern had a triangular shape, and the vertical distance between the top portion and the valley bottom portion was about 40 nm. The width of the triangular base was about 30 nm. The residue part 41 did not exist. The electron microscope observation of the cross section observed three points in the width direction of the work piece: the end, the center, and the other end, all of which have the same shape and a uniform height in the film plane. It was confirmed that.

[Example 4]
A fine etching mask was manufactured under the same conditions as in Example 1 using silicone rubber (Young's modulus E = 0.66 MPa, thickness d = 3 mm) as the rubber-like elastic body on the back roll 31 surface. The relational expression between E and dσ was E = 0.22 dσ. Then, when the composite film 15 after peeling was cut out and the transfer pattern was confirmed, the result similar to Example 1 was obtained and the thickness of the residue part 41 was 10 nm.

[Example 5]
A fine etching mask was manufactured under the same conditions as in Example 1 using nitrile butyl rubber (Young's modulus E = 8.1 MPa, thickness d = 10 mm) as the rubber-like elastic body on the back roll 31 surface. The relational expression between E and dσ was E = 0.81 dσ. Then, when the composite film 15 after peeling was cut out and the transfer pattern was confirmed, the result similar to Example 1 was obtained and the thickness of the residue part 41 was 10 nm.

[Comparative Example 1]
A fine etching mask was produced under the same conditions as in Example 1 with the gravure coating thickness of the photocurable resin being 40 nm. Thereafter, the peeled composite film 15 was cut and the cross section was observed with an electron microscope. As a result, the pitch of the transferred concavo-convex pattern was 140 nm, the vertical distance between the top and the valley bottom was about 50 nm, and the residue portion 41 It was confirmed that the top of the transfer pattern was not a rectangle, but a trapezoid or a sine wave. In addition, when dry etching was performed in the same manner as in Example 1 in a time that the residue portion 41 was almost zero, the transfer pattern had a triangular shape, and the vertical distance between the top portion and the valley bottom portion was about 20 nm. The width of the bottom of the triangular shape remained only about 20 nm. Further, a portion where the transfer pattern hardly remained was confirmed, and the film was non-uniform in the plane of the film.

[Comparative Example 2]
A fine etching mask was manufactured under the same conditions as in Example 1 with the gravure coating thickness of the photocurable resin being 120 nm. Thereafter, the peeled composite film 15 was cut and the cross section was observed with an electron microscope. As a result, the pitch of the transferred concavo-convex pattern was 140 nm, the vertical distance between the top and the bottom of the valley was approximately 120 nm, and the residue 41 The thickness was confirmed to be 50 nm. Further, when dry etching was performed for a time such that the residue portion 41 became substantially zero by the same method as in Example 1, almost no transfer pattern remained.

[Comparative Example 3]
A fine etching mask was produced under the same conditions as in Example 1 using nitrile butyl rubber (Young's modulus E = 9.5 MPa, thickness d = 8 mm) as the rubber-like elastic body on the surface of the back roll 31. The relational expression between E and dσ is E = 1.19 dσ. Thereafter, the peeled composite film 15 was cut and the surface of the transfer pattern was confirmed. As a result, it was confirmed that the portion where the pattern was transferred and the portion where the pattern did not exist were patchy.

[Comparative Example 4]
A fine etching mask was produced in the same manner as in Example 1 using a resin obtained by removing the fluorine component from the composition of the photocurable resin of Example 1. As a result, the resin mold 20 and the composite film 15 are peeled off to form a resin layer having a pattern transferred onto the surface of the workpiece. It was confirmed that the resin adhered. When the resin mold 20 to which the photocurable resin was adhered was cut out and the surface was observed with AFM, it was confirmed that the resin entered and filled the pattern recess 24 of the resin mold 20.

[Comparative Example 5]
After producing the composite film 15 and the resin mold 20 under the same conditions as in Example 1, between the back roll 31 and the nip roll 33 formed with nitrile butyl rubber (Young's modulus E = 1.1 MPa, thickness d = 20 mm) on the surface. In addition, the composite film 15 and the resin mold 20 are transported from the direction of the nip roll 33 side (the angle formed by F2 and the transport surface of the composite film 15 is set to about 30 degrees) with respect to F2 shown in FIG. Then, when the resin mold 20 was conveyed along the conveying roll 30e shown in FIG. 6, it was confirmed that the bubbles were embraced and the bubbles were spotted.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications. For example, the dimensions, materials, and the like in the above-described embodiment are illustrative, and can be changed as appropriate. Other modifications can be made without departing from the scope of the present invention.

  The method for producing a fine etching mask according to the present invention can produce a fine etching mask having a uniform height in the film plane, and is therefore useful in the semiconductor field and the optical field for producing members and products having a fine pattern.

DESCRIPTION OF SYMBOLS 10 Workpiece material film 11 Film base material 12,13 Workpiece material layer 14 Photocurable resin layer 15 Composite film 20 Resin mold 21 Transparent film base material 22 Resin pattern layer 23 Convex part vertex 24 Concave part 30a-30e Conveyance roll 30f Free Roll 31 Back roll 31a Elastic layer 32 Light irradiation device 33, 34 Nip roll 35, 37 Winding roll 36 Plasma processing device 41 Residue part

Claims (8)

A method for producing a fine etching mask on a workpiece film comprising a substrate and a workpiece layer provided on the substrate,
An application step of applying a photocurable resin on the workpiece layer of the workpiece film to form a composite film having a photocurable resin layer;
On the outer peripheral surface of the back roll provided with the elastic layer, the transfer pattern of the resin mold and the photocurable resin layer of the composite film are exposed while being in surface contact to impart the transfer pattern to the photocurable resin layer. Mold hardening process to mold,
A peeling step for peeling the composite film and the resin mold after the shaping and curing step;
An etching step of removing a residual portion of the transfer pattern formed on the photocurable resin layer of the composite film after the peeling step,
In the mold hardening step, the composite film and the resin mold are pressed against the outer peripheral surface side of the back roll by the film tension of the resin mold on the outer peripheral surface of the back roll, and the composite film and the resin film are pressed. The transfer pattern is molded under the condition that the Young's modulus E [MPa] of the elastic layer of the back roll satisfies the following relational expression (1): Method.
0.1 ≦ E ≦ 1,000 × dσ Equation (1)
(In the formula (1), d represents the thickness of the elastic layer [μm], σ is the pressure [MPa] in the vertical direction with respect to the photocurable resin layer of the composite film by the film tension of the resin mold Represents.) The composite film and the resin mold are separately transported to the outer peripheral surface of the back roll by a transport mechanism, and are brought into surface contact with the outer peripheral surface of the back roll by a light source provided facing the back roll. 2. The method of manufacturing a fine etching mask according to claim 1, wherein the fine etching mask is exposed. In the mold hardening step, the composite film is conveyed from an angle on the back roll side with respect to a vertical plane with respect to a straight line connecting the center of the nip roll and the center of the back roll provided side by side with the back roll. The manufacturing method of the fine etching mask of Claim 1 or Claim 2 to do . 4. The surface-contacting process is performed in the form hardening process, wherein the pressure σ in the vertical direction of the back roll with respect to the elastic layer is 0.0001 MPa to 0.01 MPa . 5. method for producing a fine etching mask according to. In the coating step, the amount of the photocurable resin applied is in the range of 50% to 120% of the pattern void volume below the apex of the transfer pattern convex portion in the in-plane vertical direction within the transfer pattern surface of the resin mold. The method for manufacturing a fine etching mask according to any one of claims 1 to 4 , wherein: The said application | coating process apply | coats the photocurable resin containing a fluorine component, The resin mold containing a fluorine component is used as the said resin mold in the said shaping | molding hardening process. 6. The method for producing a fine etching mask according to any one of 5 above. A first transport mechanism for transporting a workpiece film provided with a workpiece layer provided on a substrate and a photocurable resin layer provided on the workpiece layer;
A second transport mechanism for transporting a resin mold provided with a transfer pattern on a substrate;
A back roll comprising an elastic layer on an outer peripheral surface, and in surface contact with the photocurable resin layer of the composite film and the transfer pattern of the resin mold on the elastic layer;
On the elastic layer of the back roll, a light source that exposes the surface-contacted composite film and the resin mold;
A peeling mechanism for peeling the composite film and the resin mold;
Anda etching mechanism for removing the residue portion partial transfer pattern of the photocurable resin layer and the photocurable resin layer which is Fugata in the composite film,
On the outer peripheral surface of the back roll, the composite film and the resin mold are pressed against the outer peripheral surface side of the back roll by the film tension of the resin mold, and the composite film and the resin film are in surface contact. ,
An exposure processing apparatus, wherein a Young's modulus E [MPa] of the elastic layer of the back roll satisfies the following relational expression (1).
0.1 ≦ E ≦ 1,000 × dσ Equation (1)
(In the formula (1), d represents the thickness of the elastic layer [μm], σ is the pressure [MPa] in the vertical direction with respect to the photocurable resin layer of the composite film by the film tension of the resin mold Represents.) 8. The exposure processing apparatus according to claim 7 , wherein a coating mechanism is provided in front of the back roll in the first transport mechanism.