TWI832796B - Transfer apparatus and method of manufacturing a transferred wafer using the same - Google Patents
Transfer apparatus and method of manufacturing a transferred wafer using the same Download PDFInfo
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- TWI832796B TWI832796B TW112131438A TW112131438A TWI832796B TW I832796 B TWI832796 B TW I832796B TW 112131438 A TW112131438 A TW 112131438A TW 112131438 A TW112131438 A TW 112131438A TW I832796 B TWI832796 B TW I832796B
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/004—Presses of the reciprocating type
- B41F16/0046—Presses of the reciprocating type with means for applying print under heat and pressure, e.g. using heat activable adhesive
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
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- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Structural Engineering (AREA)
- Public Health (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本發明涉及一種轉印裝置及利用其的實施了轉印的基板的生產方法。具體而言,根據本發明的一實施例,可以提供一種轉印裝置,其將粘接於膜的模的圖案轉印至基板,所述轉印裝置包括:脫模部,其能夠在所述模的表面進行脫模性塗布;以及轉印部,其能夠將在所述脫模部進行脫模性塗布後的所述模的圖案轉印至基板。 The present invention relates to a transfer device and a method for producing a transferred substrate using the transfer device. Specifically, according to an embodiment of the present invention, a transfer device that transfers a pattern of a mold adhered to a film to a substrate can be provided, and the transfer device includes a mold release portion that can A surface of the mold is releasably coated; and a transfer part is capable of transferring the pattern of the mold releasably coated on the release part to a substrate.
Description
本發明涉及一種轉印裝置及利用其的實施了轉印的基板的生產方法。 The present invention relates to a transfer device and a method for producing a transferred substrate using the transfer device.
以往,在半導體製程中,為了在基板(例如,晶片(Wafer))的表面形成圖案(例如,用於蝕刻或蒸鍍的掩膜板圖案)而利用光蝕刻(Photo Lithography)製程。這種光蝕刻製程是能夠在基板表面塗布諸如光蝕刻膠(Photoresist)的感光物質後照射光來形成期望的圖案的製程。 In the past, in semiconductor manufacturing processes, a photolithography process was used to form a pattern (eg, a mask pattern for etching or evaporation) on the surface of a substrate (eg, a wafer). This photolithography process is a process that can coat a photosensitive material such as photoresist on the surface of a substrate and then irradiate it with light to form a desired pattern.
然而,通過光蝕刻製程將奈米尺度的圖案形成於基板表面的製程存在量產性較低的問題,近來,為了改善這種問題,利用奈米壓印光蝕刻(Nano Imprint Lithography)製程。 However, the process of forming nanoscale patterns on the surface of a substrate through a photolithography process has a problem of low mass productivity. Recently, in order to improve this problem, a nanoimprint photolithography process is used.
奈米壓印光蝕刻製程是一種能夠經濟有效地製作奈米結構物(nano-structure)的技術。具體地,奈米壓印光蝕刻製程是利用轉印裝置(Transfer Apparatus)對形成有奈米尺度(nano-scale)的圖案的模(Mold)和形成有樹脂(Resin)的基板相互加壓來將圖案轉印於基板表面的製程。這種奈米壓印光蝕刻製程中使用的轉印裝置通過將模的圖案壓接於基板之後從基板分離模來執行製程。 The nanoimprint photolithography process is a technology that can cost-effectively produce nano-structures. Specifically, the nanoimprint photolithography process uses a transfer device (Transfer Apparatus) to press each other between a mold (Mold) formed with a nano-scale pattern and a substrate formed with resin (Resin). The process of transferring patterns to the surface of a substrate. The transfer device used in this nanoimprint photolithography process performs the process by pressing the pattern of the mold onto the substrate and then separating the mold from the substrate.
但是,就以往的轉印裝置而言,由於模的脫模性較低,同一個模使用複數次後,模的轉印效率下降,因而模以一次性地進行使用,為了改善這樣的模的再使用性,曾利用旋塗將脫模劑塗布於模來進行使用。 However, in conventional transfer devices, since the releasability of the mold is low, the transfer efficiency of the mold decreases after the same mold is used multiple times. Therefore, the mold must be used once. In order to improve the mold releasability of the mold, For reusability, the mold release agent has been applied to the mold by spin coating before use.
然而,當利用旋塗將脫模劑塗布於模來進行使用時,雖然模的再使用性增加,但由於脫模劑不均勻地塗布於模,因而存在塗布物成團或塗布時會留有異物的問題。此外,當將模的圖案形成為50nm以下的微細圖案時,塗布進行得較厚的旋塗會覆蓋微細圖案,因而存在難以將微細圖案轉印於基板的問題。 However, when the mold release agent is applied to the mold by spin coating and used, although the reusability of the mold is increased, the mold release agent is unevenly applied to the mold, so there is a possibility that the coating material will clump or residues will remain during the application. Foreign object problem. In addition, when the pattern of the mold is formed into a fine pattern of 50 nm or less, spin coating, which applies thick coating, will cover the fine pattern, making it difficult to transfer the fine pattern to the substrate.
此外,就以往的轉印裝置而言,轉印模的空間與分離模的空間彼此分離著,為此追加模移動的製程,因而存在製程的效率下降的問題。 In addition, in the conventional transfer device, the space of the transfer mold and the space of the separation mold are separated from each other. Therefore, a process of moving the mold is added, so there is a problem that the efficiency of the process decreases.
因此,需要一種將脫模劑均勻地塗布於模,且塗布時不會留有異物的轉印裝置,且需要一種能夠增加模的再使用性的轉印裝置。 Therefore, there is a need for a transfer device that can uniformly apply a release agent to a mold without leaving foreign matter during application, and a transfer device that can increase the reusability of the mold.
此外,需要一種能夠通過省略模移動的製程來提高製程的效率的轉印裝置。 In addition, there is a need for a transfer device that can improve the efficiency of the process by omitting the process of moving the mold.
本發明的一些實施例著眼於如上所述的背景而發明,旨在提供一種能夠通過降低形成有圖案的模的更換週期來提高在基板表面形成圖案的製程的效率的轉印裝置。 Some embodiments of the present invention are invented in view of the above background, and aim to provide a transfer device that can improve the efficiency of the process of forming a pattern on a substrate surface by reducing the replacement cycle of a pattern-forming mold.
此外,旨在提供一種去除模表面的異物來防止對模進行脫模性塗布時夾雜異物而成為不良的轉印裝置。 Furthermore, it is intended to provide a transfer device that removes foreign matter on the mold surface and prevents foreign matters from being included and causing defects when the mold is releasably coated.
此外,旨在提供一種能夠省略模移動的製程的轉印裝置。 Furthermore, it is intended to provide a transfer device that can omit a process of moving the mold.
根據本發明的一方面,可以提供一種轉印裝置,其將粘接於膜的模的圖案轉印至基板,所述轉印裝置包括:脫模部,其能夠在所述模的表面進行脫模性塗布;以及轉印部,其能夠將在所述脫模部進行脫模性塗布後的所述模的圖案轉印至基板,所述脫模部包括:等離子體處理模組,其以在對所述模的表面進行脫模性塗布之前利用等離子體處理所述模的表面的方式工作;以及蒸鍍模組,其在進行所述等離子體處理後的模的表面進行脫模性塗布。 According to one aspect of the present invention, a transfer device that transfers a pattern of a mold adhered to a film to a substrate can be provided, and the transfer device includes a mold release portion that can perform release on the surface of the mold. Mold coating; and a transfer part that can transfer the pattern of the mold after the mold release coating is performed on the mold release part to the substrate, and the mold release part includes: a plasma processing module, which The method operates by treating the surface of the mold with plasma before performing release coating on the surface of the mold; and an evaporation module that performs release coating on the surface of the mold after the plasma treatment. .
根據本發明的另一方面,可以提供一種轉印裝置,其將粘接於膜的模的圖轉印移至基板,所述轉印裝置包括:脫模部,其能夠在所述模的表面進行脫模性塗布;以及轉印部,其能夠將在所述脫模部進行脫模性塗布後的所述模的圖案轉印至基板,所述脫模部包括能夠在所述模的表面進行脫模性塗布的蒸鍍模組,在所述膜粘接有複數個模,所述蒸鍍模組中模所在的區域的中心點與所述轉印部中模所在的區域的中心點之間的間距與相鄰地配置於所述膜上的模的中心點之間的間距相同。 According to another aspect of the present invention, a transfer device can be provided that transfers a pattern of a mold adhered to a film to a substrate, and the transfer device includes a mold release portion capable of discharging a pattern on the surface of the mold. performing releasable coating; and a transfer part capable of transferring the pattern of the mold after releasable coating is performed on the releasable part to a substrate, the releasable part including a A vapor deposition module for performing release coating, in which a plurality of molds are bonded to the film, and the center point of the area where the mold is located in the vapor deposition module and the center point of the area where the mold is located in the transfer part The distance between them is the same as the distance between the center points of the molds adjacently arranged on the film.
此外,可以提供一種轉印裝置,其中,所述蒸鍍模組通過使脫模劑氣相化,並將氣相化後的所述脫模劑提供至所述模的表面來塗布所述模的表面。 Furthermore, a transfer device may be provided, in which the evaporation module vaporizes a release agent and supplies the vaporized release agent to a surface of the mold to coat the mold. s surface.
此外,可以提供一種轉印裝置,其中,所述轉印部構成為,當所述等離子體處理模組執行一次利用所述等離子體處理所述模的表面的過程,且所述蒸鍍模組執行一次對所述模的表面進行脫模性塗布的過程時,執行複數次將所述模的圖案壓接於通過所述蒸鍍模組脫模性塗布後的基板的過程和從所述基板分離所述模的過程。 Furthermore, a transfer device may be provided, wherein the transfer part is configured such that when the plasma processing module performs a process of processing the surface of the mold using the plasma once, the evaporation deposition module When the process of releasably coating the surface of the mold is performed once, the process of press-bonding the pattern of the mold to the substrate releasably coated by the evaporation module is performed a plurality of times and removing the pattern from the substrate. The process of separating the mold.
此外,可以提供一種轉印裝置,其中,所述轉印部包括:壓接模組,其能夠使所述模和所述基板壓接來將所述模的圖案壓接於基板;以及模分離單元,其在由所述壓接模組將所述模的圖案壓接於所述基板時從所述基板分離所述模。 Furthermore, a transfer device may be provided, in which the transfer part includes: a press-contacting module capable of press-contacting the mold and the substrate to press-contact the pattern of the mold to the substrate; and mold separation A unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping mold set.
此外,可以提供一種轉印裝置,其還包括:膜供給部,其能夠向所述脫模部供給粘接有所述模的所述膜;以及膜回收部,其能夠回收並卷取所述膜,在被卷取於所述膜回收部的所述膜粘接有脫模性下降至規定範圍以下的所述模。 In addition, a transfer device may be provided, further comprising: a film supply part capable of supplying the film to which the mold is adhered to the demoulding part; and a film recovery part capable of recovering and winding up the film. The film is wound up in the film recovery unit, and the mold in which the mold releasability falls below a predetermined range is bonded to the film.
此外,可以提供一種轉印裝置,其還包括:位置檢測部,其配置於所述蒸鍍模組與所述轉印部之間,由此檢測先行的模位於所述轉印部且後行的模位於所述蒸鍍模。 In addition, a transfer device may be provided, further comprising: a position detection unit disposed between the evaporation module and the transfer unit, thereby detecting that the preceding mold is located in the transfer unit and the succeeding mold The mold is located in the evaporation mold.
此外,可以提供一種轉印裝置,其還包括:膜供給部及膜回收部,其為了使所述膜移動而旋轉,所述轉印部構成為,在所述膜供給部及所述膜回收部中的一個以上未旋轉的狀態下,反復執行規定次數以上的將所述模的圖案壓接於所述基板的過程和從所述基板分離所述模的過程,所述轉印裝置還包括:控制部,其從所述位置檢測部接收所述模的位置資訊來控制所述膜供給部及膜回收部中的一個以上的驅動。 Furthermore, it is possible to provide a transfer device, further comprising: a film supply part and a film recovery part that rotate in order to move the film, and the transfer part is configured to be between the film supply part and the film recovery part. The process of pressing the pattern of the mold to the substrate and the process of separating the mold from the substrate are repeated a predetermined number of times or more while one or more of the parts are not rotated, and the transfer device further includes : A control unit that receives the position information of the mold from the position detection unit and controls the driving of one or more of the film supply unit and the film recovery unit.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組,該蒸鍍模組包括:第一腔室部;第二腔室部,其配置於比所述第一腔室部靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;以及流體供給部,其向所述塗布空間供給氣相化的脫模劑,以便能夠塗布所述模的表面,所述膜在所述第一腔室部與所述第二腔室部之間通過,所述流體供給 部包括:罐,其能夠容納液體狀態的所述脫模劑;以及起泡器,其能夠向容納於所述罐的液體狀態的所述脫模劑供給規定壓力以上的氣體來使所述脫模劑氣相化。 According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a gas-phase release agent to the coating space so that the The surface of the mold is coated, the film passes between the first chamber part and the second chamber part, the fluid supply The part includes: a tank capable of containing the release agent in a liquid state; and a bubbler capable of supplying gas above a predetermined pressure to the release agent in a liquid state accommodated in the tank to release the release agent. The molding agent is vaporized.
此外,可以提供一種轉印裝置,其中,所述起泡器通過在容納於所述罐的所述脫模劑的表面的下方向所述脫模劑排出所述氣體來使所述脫模劑氣相化。 Furthermore, a transfer device may be provided, wherein the bubbler causes the release agent to be released by discharging the gas to the release agent below a surface of the release agent accommodated in the tank. Vaporization.
此外,可以提供一種轉印裝置,其中,所述蒸鍍模組還包括:噴射裝置,其能夠通過在從液體狀態的所述脫模劑的表面向上側隔開規定距離的位置噴射所述氣體來防止氣相化的所述脫模劑成團。 Furthermore, a transfer device may be provided, wherein the evaporation module further includes an injection device capable of injecting the gas at a position spaced a predetermined distance upward from a surface of the release agent in a liquid state. To prevent the vaporized release agent from agglomerating.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組,該蒸鍍模組包括:第一腔室部;第二腔室部,其配置於比所述第一腔室部靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;以及流體供給部,其向所述塗布空間供給脫模劑,以便能夠對所述模的表面進行脫模性塗布,所述膜在所述第一腔室部與所述第二腔室部之間通過,在所述第二腔室部形成有流入口,該流入口的一側與所述流體供給部連通,另一側與所述塗布空間連通,所述流入口配置於比所述模靠下方。 According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface of the film is releasably coated, and the film passes between the first chamber part and the second chamber part. An inflow port is formed in the second chamber part, and one side of the inflow port It communicates with the said fluid supply part, and the other side communicates with the said coating space, and the said inlet is arrange|positioned below the said mold.
此外,可以提供一種轉印裝置,其中,在所述第二腔室部形成有排出口,該排出口用於向外部排出通過所述流入口流入所述塗布空間的所述脫模劑,從所述流入口流入所述塗布空間的所述脫模劑在通過所述排出口被排出至外部的期間與所述模的表面接觸。 Furthermore, it is possible to provide a transfer device in which a discharge port for discharging the release agent flowing into the coating space through the inlet to the outside is formed in the second chamber part, from The release agent flowing into the coating space through the inlet comes into contact with the surface of the mold while being discharged to the outside through the discharge port.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組,該蒸鍍模組包括:第一腔室部;第二腔室部,其配置於比所述第一腔室部 靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;以及流體供給部,其向所述塗布空間供給脫模劑,以便能夠對所述模的表面進行脫模性塗布,所述膜在所述第一腔室部與所述第二腔室部之間通過,所述第二腔室部包括:腔室底座;腔室凸出部,其從所述腔室底座凸出形成;以及腔室側壁,其從所述腔室底座沿所述腔室底座的邊緣延伸形成,且與所述腔室凸出部隔開規定距離而包圍所述腔室凸出部。 According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. department and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface is releasably coated, and the film passes between the first chamber part and the second chamber part, and the second chamber part includes: a chamber base; a chamber protruding part, Projecting from the chamber base; and a chamber side wall extending from the chamber base along the edge of the chamber base and surrounding the chamber protruding portion at a predetermined distance. Chamber bulge.
此外,可以提供一種轉印裝置,其中,所述第二腔室部包括:流入口,其形成於所述腔室側壁,且一側與所述流體供給部連通,另一側與所述塗布空間連通;以及排出口,其形成於腔室凸出部,用於向外部排出通過所述流入口流入所述塗布空間的所述脫模劑,從所述流入口流入所述塗布空間的所述脫模劑在通過所述排出口被排出至外部的期間與所述模的表面接觸。 Furthermore, a transfer device may be provided, in which the second chamber part includes an inlet formed on a side wall of the chamber and having one side connected to the fluid supply part and the other side connected to the coating part. spatial communication; and a discharge port formed on the protruding portion of the chamber for externally discharging the release agent flowing into the coating space through the inflow port, and all the release agent flowing into the coating space from the inflow port The release agent contacts the surface of the mold while being discharged to the outside through the discharge port.
此外,可以提供一種轉印裝置,其中,所述流入口形成於所述腔室側壁,且配置於比所述腔室凸出部的上面靠下方。 Furthermore, it is possible to provide a transfer device in which the inflow port is formed on the chamber side wall and is disposed below an upper surface of the chamber protrusion.
此外,可以提供一種轉印裝置,其中,在所述腔室底座的邊緣,在與所述流入口對應的位置形成有具有從所述腔室凸出部的上面向下側凹陷的形狀的凹部。 Furthermore, it is possible to provide a transfer device in which a recessed portion having a shape recessed downward from an upper surface of the chamber protruding portion is formed on an edge of the chamber base at a position corresponding to the inlet. .
此外,可以提供一種轉印裝置,其中,設有複數個所述流入口,所述複數個流入口中的至少一部分配置為彼此相向,所述排出口以配置於彼此相向的所述流入口之間的方式形成於所述第二腔室部的中心部。 Furthermore, it is possible to provide a transfer device in which a plurality of the inflow openings are provided, at least some of the plurality of inflow openings are arranged to face each other, and the discharge port is arranged between the facing inflow openings. is formed in the center part of the second chamber part.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組,該蒸鍍模組包括:第一腔室部;第二腔室部,其配置於比所述第一腔室部靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;以 及流體供給部,其向所述塗布空間供給脫模劑,以便能夠對所述模的表面進行脫模性塗布,所述膜在所述第一腔室部與所述第二腔室部之間通過,所述塗布空間的內部以膜為基準被劃分為上側空間和下側空間,在所述第一腔室部形成有氣體排出口,該氣體排出口用於向外部排出所述塗布空間的內部中以所述膜為基準殘留於上側空間的氣體,在所述第二腔室部形成有排出口,該排出口用於向外部排出所述塗布空間的內部中以所述膜為基準殘留於下側空間的脫模劑。 According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. The part is located below, and together with the first chamber part, forms a coating space for arranging the film to which the mold is adhered; to and a fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, and the film is between the first chamber part and the second chamber part. The inside of the coating space is divided into an upper space and a lower space based on the film, and a gas discharge port is formed in the first chamber part for discharging the coating space to the outside. The gas remaining in the upper space in the inside of the coating space based on the film is formed in the second chamber part, and the exhaust port is used to discharge the gas in the inside of the coating space based on the film to the outside. Release agent remaining in the lower space.
此外,可以提供一種轉印裝置,其中,所述蒸鍍模組還包括:加熱器,其通過加熱所述第一腔室部及所述第二腔室部中的一個以上來將塗布空間的溫度維持在30℃至80℃的範圍內。 In addition, a transfer device may be provided, wherein the evaporation module further includes a heater that heats at least one of the first chamber part and the second chamber part to heat the coating space. The temperature is maintained in the range of 30°C to 80°C.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組,該蒸鍍模組包括:第一腔室部;第二腔室部,其配置於比所述第一腔室部靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;以及流體供給部,其向所述塗布空間供給脫模劑,以便能夠對所述模的表面進行脫模性塗布,所述膜在所述第一腔室部與所述第二腔室部之間通過,所述蒸鍍模組還包括蒸鍍密封部,該蒸鍍密封部包圍所述塗布空間,以進行所述第一腔室部與所述第二腔室部之間的密封,所述蒸鍍密封部包括設於所述第一腔室部的第一蒸鍍密封部件及設於所述第二腔室部的第二蒸鍍密封部件,所述第一蒸鍍密封部件及所述第二蒸鍍密封部件中的某一個在不與另一個貼緊時具有平面形狀,所述另一個在不與所述某一個貼緊時具有圓弧形狀。 According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface is releasably coated, and the film passes between the first chamber part and the second chamber part. The evaporation module further includes an evaporation sealing part, and the evaporation sealing part surrounds The coating space is used to seal between the first chamber part and the second chamber part, and the vapor deposition sealing part includes a first vapor deposition sealing member provided in the first chamber part and a second vapor deposition sealing member provided in the second chamber part, one of the first vapor deposition sealing member and the second vapor deposition sealing member having a planar shape when not in close contact with the other. , the other one has an arc shape when it is not in close contact with the one.
根據本發明的另一方面,可以提供一種轉印裝置,包括蒸鍍模組和等離子體處理模組,所述蒸鍍模組包括:第一腔室部;第二腔室部,其配置 於比所述第一腔室部靠下方,並與所述第一腔室部一同形成用於配置粘接有模的膜的塗布空間;流體供給部,其向所述塗布空間供給脫模劑,以便能夠對所述模的表面進行脫模性塗布,所述等離子體處理模組利用等離子體處理所述模的表面,以對所述模的表面進行改質,所述膜在所述第一腔室部與所述第二腔室部之間通過,所述蒸鍍模組對由所述等離子體處理模組對所述表面進行等離子體處理後的模的表面進行脫模性塗布。 According to another aspect of the present invention, a transfer device can be provided, including an evaporation module and a plasma treatment module. The evaporation module includes: a first chamber part; a second chamber part, which is configured A coating space for arranging a film to which the mold is adhered is formed below the first chamber part and together with the first chamber part; a fluid supply part that supplies a release agent to the coating space , so that the surface of the mold can be releasably coated, the plasma treatment module uses plasma to treat the surface of the mold to modify the surface of the mold, and the film is in the first A cavity part and the second chamber part pass between each other, and the evaporation module performs release coating on the surface of the mold after the surface has been plasma treated by the plasma treatment module.
根據本發明的另一方面,可以提供一種轉印裝置,包括:壓接模組,其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元;以及模分離單元,其包括第一輥部,該第一輥部在作為所述膜的一面的相反側的所述膜的另一面支撐所述膜,所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板,所述第一輥部向所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間移動來從所述基板分離被壓接於所述基板的所述模。 According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second pressure-bonding unit; and a mold separation unit including a first roller portion supporting the film on the other side of the film opposite to one side of the film, the first pressing unit The connecting unit and the second pressing unit move toward the film on opposite sides of the film and are in close contact with each other to press the pattern formed on the mold to the substrate, and the first roller The mold is moved to the space between the first pressure bonding unit and the second pressure bonding unit where the substrate is pressure-bonded to the mold to separate the mold that is pressure-bonded to the substrate from the substrate. .
此外,可以提供一種轉印裝置,其中,所述模分離單元還包括第二輥部,其以使所述膜向包圍所述第一輥部的一部分的方向彎曲的方式支撐所述膜。 Furthermore, there may be provided a transfer device in which the mold separation unit further includes a second roller part that supports the film in a direction in which the film is bent in a direction surrounding a part of the first roller part.
此外,可以提供一種轉印裝置,其中,所述第二壓接單元包括基板安放部,其能夠在由所述壓接模組將所述模加壓於所述基板並由所述模分離單元從所述基板分離所述模時支撐所述基板,在所述基板安放部形成有能夠吸附所述基板的吸附口,以防止在將所述模加壓於所述基板並從所述基板分離所述模時所述基板從所述第二壓接單元脫離。 In addition, a transfer device may be provided, wherein the second crimping unit includes a substrate placement portion capable of pressing the mold to the substrate by the crimping module and by the mold separation unit. The substrate is supported when the mold is separated from the substrate, and an adsorption port capable of adsorbing the substrate is formed in the substrate placement portion to prevent the mold from being separated from the substrate while being pressed against the substrate. The substrate is detached from the second pressing unit during the molding process.
此外,可以提供一種轉印裝置,其還包括:框架,其能夠支撐所述壓接模組及所述模分離單元,所述第一壓接單元與所述第二壓接單元以支撐於所述框架的狀態相對於彼此移動,所述模分離單元以支撐於所述框架的狀態相對於所述模移動。 In addition, a transfer device may be provided, further comprising: a frame capable of supporting the pressure bonding module and the mold separation unit, the first pressure bonding unit and the second pressure bonding unit being supported on the The frames move relative to each other, and the mold separation unit moves relative to the mold while being supported on the frame.
根據本發明的另一方面,可以提供一種轉印裝置,包括:壓接模組,其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元;以及框架,其能夠支撐所述壓接模組,所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板,所述框架包括第一框架部及第二框架部,所述第一壓接單元包括:第一壓接體,其能夠對所述模加壓;以及第一導向部件,其固定支撐於所述第一框架部,且能夠對所述第一壓接體的移動進行導向,所述第二壓接單元包括:第二壓接體,其能夠支撐所述基板;以及第二導向部件,其固定支撐於所述第二框架部,且能夠對所述第二壓接體的移動進行導向,所述第一壓接體和所述第二壓接體分別通過所述第一導向部件和所述第二導向部件進行移動導向來相對於所述框架升降。 According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second crimping unit; and a frame capable of supporting the crimping module, the first crimping unit and the second crimping unit moving toward the membrane on opposite sides of the membrane. The pattern formed on the mold is press-bonded to the substrate by being in close contact with each other. The frame includes a first frame part and a second frame part. The first press-bonding unit includes: a first press-bonding body, which can pressurizing the mold; and a first guide member fixedly supported on the first frame part and capable of guiding the movement of the first crimping body. The second crimping unit includes: a second a crimping body capable of supporting the substrate; and a second guide member fixedly supported on the second frame part and capable of guiding the movement of the second crimping body, the first crimping body The second crimping body and the second crimping body are respectively moved and guided by the first guide member and the second guide member to rise and fall relative to the frame.
此外,可以提供一種轉印裝置,其中,所述第一壓接單元包括:第一壓接體,其能夠對所述模加壓;第一支撐部,其能夠支撐所述第一壓接體;以及推擠防止部,其一端固定支撐於所述第一框架部,另一端支撐於所述第一支撐部,所述推擠防止部能夠通過在所述第二壓接單元為了對所述基板加壓而上升時對所述第一支撐部加壓來防止因所述第二壓接單元上升而導致所述第一壓接體被推擠至上側。 Furthermore, a transfer device may be provided, wherein the first crimping unit includes: a first crimping body capable of pressurizing the mold; and a first supporting part capable of supporting the first crimping body ; And a pushing prevention part, one end of which is fixedly supported on the first frame part and the other end is supported on the first support part. The pushing prevention part can pass through the second crimping unit in order to press the When the substrate is pressurized and raised, the first support portion is pressurized to prevent the first crimping body from being pushed upward due to the rise of the second crimping unit.
此外,可以提供一種轉印裝置,其還包括:模分離單元,其移動至所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間來從所述基板分離被壓接於所述基板的所述模,所述框架還包括第三框架部,所述模分離單元包括:輥部,其能夠從所述基板分離被壓接於所述基板的所述模;以及輥導向部件,其固定支撐於所述第三框架部,且能夠對所述輥部的移動進行導向,所述輥部通過所述輥導向部件進行移動導向來相對於所述框架移動。 In addition, a transfer device may be provided, further comprising: a mold separation unit moved to a space between the first and second crimping units for crimping the substrate to the mold. The frame further includes a third frame part, and the mold separation unit includes a roller part capable of being separated from the base plate and being pressed against the base plate. the mold of the substrate; and a roller guide member that is fixedly supported on the third frame part and capable of guiding the movement of the roller part, and the roller part is relatively moved and guided by the roller guide member move in the frame.
此外,可以提供一種轉印裝置,其中,所述第一框架部、所述第二框架部及所述第三框架部相對於彼此被一體地固定支撐。 Furthermore, a transfer device may be provided in which the first frame part, the second frame part, and the third frame part are integrally and fixedly supported with respect to each other.
根據本發明的另一方面,可以提供一種轉印裝置,包括:壓接模組,其包括能夠朝向在一面粘接有形成有圖案的模的膜移動的第一壓接單元和能夠支撐基板的第二壓接單元;以及檢測單元,其包括能夠檢測所述第一壓接單元的第一停止位置、第二停止位置及減速位置的第1感測器部、和所述第二壓接單元的第一停止位置、第二停止位置及減速位置的第2感測器部中的一個以上,所述第一壓接單元與所述第二壓接單元在所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板,所述減速位置位於所述第一停止位置與所述第二停止位置之間,所述壓接模組被驅動為,當在從所述第一停止位置移動至所述第二停止位置的期間到達所述減速位置時減速。 According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second crimping unit; and a detection unit including a first sensor unit capable of detecting the first stop position, the second stop position, and the deceleration position of the first crimping unit, and the second crimping unit. at least one of the second sensor portions of the first stop position, the second stop position, and the deceleration position, and the first crimping unit and the second crimping unit are on opposite sides of the film. move toward the film and come into close contact with each other to press the pattern formed on the mold to the substrate, the deceleration position is between the first stop position and the second stop position, and the press contact The module is driven to decelerate when reaching the deceleration position while moving from the first stop position to the second stop position.
此外,可以提供一種轉印裝置,其還包括:控制部,其從所述檢測單元接收所述壓接模組的位置資訊來控制所述壓接模組的驅動。 In addition, a transfer device may be provided, further including: a control unit that receives position information of the crimping module from the detection unit to control driving of the crimping module.
根據本發明的另一方面,可以提供一種轉印裝置,包括:模分離單元,其能夠將在作為在一面粘接有形成有圖案的模的膜的兩面中的所述一面的相反側的所述膜的另一面支撐所述膜的第一輥部移動至基板側來從所述基板分離被壓接於所述基板的所述模;以及檢測單元,其能夠檢測所述模分離單元的第一停止位置、第二停止位置及減速位置,所述減速位置位於所述第一停止位置與所述第二停止位置之間,所述模分離單元被驅動為,當在從所述第一停止位置移動至所述第二停止位置的期間到達所述減速位置時減速。 According to another aspect of the present invention, there can be provided a transfer device including: a mold separation unit capable of separating all sides of a film on which a pattern-formed mold is bonded on one side opposite to the one side. The first roller portion that supports the film on the other side of the film moves to the substrate side to separate the mold that is pressed against the substrate from the substrate; and a detection unit capable of detecting the first step of the mold separation unit. a stop position, a second stop position and a deceleration position, the deceleration position being between the first stop position and the second stop position, the mold separation unit is driven to, when moving from the first stop position The vehicle decelerates when it reaches the deceleration position while moving to the second stop position.
此外,可以提供一種轉印裝置,其還包括:控制部,其從所述檢測單元接收所述模分離單元的位置資訊來控制所述模分離單元的驅動。 Furthermore, a transfer device may be provided, further including a control unit that receives position information of the mold separation unit from the detection unit to control driving of the mold separation unit.
此外,可以提供一種轉印裝置,其中,所述檢測單元包括:第一停止位置檢測感測器,其用於檢測所述第一停止位置;減速位置檢測感測器,其用於檢測所述減速位置;以及第二停止位置檢測感測器,其用於檢測所述第二停止位置。 Furthermore, a transfer device may be provided, wherein the detection unit includes: a first stop position detection sensor for detecting the first stop position; and a deceleration position detection sensor for detecting the first stop position. deceleration position; and a second stop position detection sensor for detecting the second stop position.
根據本發明的另一方面,可以提供一種轉印裝置,包括:第一壓接單元,其能夠朝向在一面粘接有形成有圖案的模的膜移動;第二壓接單元,其能夠支撐基板;壓接密封部,其包括插入於所述第一壓接單元的第一壓接密封部件、以及插入於所述第二壓接單元且具有與所述第一壓接密封部件不同的形狀的第二壓接密封部件,所述第一壓接單元與所述第二壓接單元在介於所述第一壓接單元與所述第二壓接單元之間的所述膜的彼此相反的一側朝向所述膜移動而相互貼緊來將形成於所述模的圖案壓接於所述基板,所述第一壓接密封部件及所述第二壓接密封部件中的某一個在不與另一個貼緊時具有平面形狀,且所述另一個在不與所述某一貼緊時具有圓弧形狀。 According to another aspect of the present invention, a transfer device may be provided, including: a first pressing unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a second pressing unit capable of supporting a substrate. ; A crimping sealing portion, which includes a first crimping sealing component inserted into the first crimping unit, and a crimping sealing component inserted into the second crimping unit and having a shape different from that of the first crimping sealing component; A second crimping sealing component, the first crimping unit and the second crimping unit are on opposite sides of the film between the first crimping unit and the second crimping unit. One side moves toward the film and comes into close contact with each other to press the pattern formed on the mold to the substrate. Either one of the first pressure sealing member and the second pressure sealing member is It has a planar shape when in close contact with the other, and the other has an arc shape when not in close contact with the one.
根據本發明的另一方面,可以提供一種實施了轉印的基板的生產方法,其生產轉印有粘接於膜的模的圖案的基板,所述實施了轉印的基板的生產方法包括:利用等離子體處理所述模的表面的等離子體處理步驟;在進行所述等離子體處理後的模的表面進行脫模性塗布的脫模性塗布步驟;以及將通過所述脫模性塗布步驟進行脫模性塗布後的所述模的圖案轉印於基板的轉印步驟。 According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: a plasma treatment step of treating the surface of the mold with plasma; a release coating step of performing release coating on the surface of the mold after the plasma treatment; and performing the release coating step A transfer step in which the pattern of the mold after release coating is transferred to the substrate.
根據本發明的另一方面,可以提供一種實施了轉印的基板的生產方法,其生產轉印有粘接於膜的模的圖案的基板,所述實施了轉印的基板的生產方法包括:在所述模的表面進行脫模性塗布的脫模性塗布步驟;以及將通過所述脫模性塗布步驟進行脫模性塗布後的所述模的圖案轉印於基板的轉印步驟,在所述模隔開規定距離而排列有多個模,在位置檢測部檢測到多個模的各個於用於執行所述脫模性塗布步驟的蒸鍍模組和用於執行所述轉印步驟的轉印部之後執行所述脫模性塗布步驟和所述轉印步驟。 According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: A releasable coating step of performing releasable coating on the surface of the mold; and a transfer step of transferring the pattern of the mold releasably coated by the releasable coating step to a substrate, in The mold has a plurality of molds arranged at a predetermined distance apart, and the position detection unit detects that each of the plurality of molds is a vapor deposition module for performing the releasable coating step and a vapor deposition module for performing the transfer step. The releasable coating step and the transfer step are performed after the transfer section.
此外,可以提供一種實施了轉印的基板的生產方法,其中,所述轉印步驟包括:使所述模和所述基板相互壓接的壓接步驟;以及從所述基板分離所述模的分離步驟,在為了使所述膜移動而旋轉的膜供給部及膜回收部中的一個以上未旋轉的狀態下執行所述壓接步驟和所述分離步驟。 Furthermore, there may be provided a production method of a transferred substrate, wherein the transfer step includes: a pressing step of pressing the mold and the substrate into mutual pressure; and separating the mold from the substrate. In the separation step, the pressure bonding step and the separation step are performed in a state where at least one of the film supply part and the film recovery part that rotates to move the film is not rotated.
此外,可以提供一種實施了轉印的基板的生產方法,其還包括:從所述基板分離所述模的分離步驟,當執行一次所述等離子體處理步驟和所述脫模性塗布步驟時,執行複數次所述轉印步驟和所述分離步驟。 In addition, a production method of a transferred substrate can be provided, which further includes: a separation step of separating the mold from the substrate, and when the plasma treatment step and the release coating step are performed once, The transfer step and the separation step are performed a plurality of times.
此外,可以提供一種實施了轉印的基板的生產方法,其還包括:當執行複數次所述壓接步驟和所述分離步驟使得所述模的脫模性下降至規定範圍以下時,回收粘接有所述模的所述膜的膜回收步驟。 Furthermore, a method for producing a transferred substrate can be provided, which further includes: when the pressing step and the separating step are performed a plurality of times so that the releasability of the mold falls below a predetermined range, recovering the adhesive A film recovery step of the film connected to the mold.
根據本發明的另一方面,可以提供一種實施了轉印的基板的生產方法,其生產轉印有粘接於膜的模的圖案的基板,所述實施了轉印的基板的生產方法包括:在所述模的表面進行脫模性塗布的脫模塗布步驟,所述脫模塗布步驟包括:使第一腔室部和第二腔室部密閉來形成塗布空間的空間形成步驟;向所述塗布空間供給氣相化的脫模劑的脫模劑供給步驟;以及在向所述塗布空間供給所述氣相化的脫模劑之後,向塗布空間供給氣體的吹掃步驟,在所述脫模劑供給步驟中,通過起泡器向容納於罐的液體狀態的脫模劑供給規定壓力以上的氣體來使所述脫模劑氣相化,並將所述氣相化的脫模劑供給至所述塗布空間,所述第二腔室部配置於比所述第一腔室部靠下方,所述膜在所述第一腔室部與所述第二腔室部之間通過。 According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: A release coating step of performing release coating on the surface of the mold. The release coating step includes a space forming step of sealing the first chamber part and the second chamber part to form a coating space; a release agent supplying step of supplying a vaporized release agent to the coating space; and a purging step of supplying gas to the coating space after supplying the vaporized release agent to the coating space. In the mold agent supply step, a gas of a predetermined pressure or higher is supplied to the liquid mold release agent contained in the tank through a bubbler to vaporize the mold release agent, and the vaporized mold release agent is supplied. In the coating space, the second chamber part is arranged below the first chamber part, and the film passes between the first chamber part and the second chamber part.
此外,可以提供一種實施了轉印的基板的生產方法,其還包括:供給至所述塗布空間的所述氣相化的脫模劑在塗布模的表面之後被排出至外部。 Furthermore, it is possible to provide a production method of a transferred substrate, which further includes: the vaporized release agent supplied to the coating space being discharged to the outside after coating the surface of the mold.
此外,可以提供一種實施了轉印的基板的生產方法,其還包括:對所述模的表面進行等離子體處理,以對所述模的表面進行改質的等離子體處理步驟,在所述脫模塗布步驟之前執行所述等離子體處理步驟。 In addition, a method for producing a transferred substrate can be provided, which further includes a plasma treatment step of performing plasma treatment on the surface of the mold to modify the surface of the mold. The plasma treatment step is performed before the die coating step.
根據本發明的另一方面,可以提供一種實施了轉印的基板的生產方法,包括:使第一壓接單元和第二壓接單元由一面粘接有形成有圖案的模的膜的彼此相反的一側朝向所述膜移動來將所述模壓接於基板的壓接步驟;以及 使模分離單元移動至所述基板側來使在所述壓接步驟中壓接於所述基板的所述模從所述基板分離的分離步驟,其中,所述模分離單元包括第一輥部,該第一輥部在作為所述膜的一面的相反側的所述膜的另一面支撐所述膜,所述分離步驟包括:使所述模分離單元移動至所述第一壓接單元與所述第二壓接單元之間的將所述基板壓接於所述模的空間來從所述基板分離被壓接於所述基板的所述模的模分離單元移動步驟。 According to another aspect of the present invention, a method for producing a transferred substrate can be provided, including: making a first pressure bonding unit and a second pressure bonding unit opposite to each other with a film on which a patterned mold is bonded on one side. A crimping step in which one side of the mold is moved toward the film to crimp the mold to the substrate; and a separation step of moving a mold separation unit to the substrate side to separate the mold pressed against the substrate in the pressure bonding step, wherein the mold separation unit includes a first roller part , the first roller part supports the film on the other side of the film opposite to one side of the film, and the separation step includes: moving the mold separation unit to the first crimping unit and A mold separation unit moving step of press-contacting the substrate to the space between the molds between the second crimping units to separate the mold crimped to the substrate from the substrate.
此外,可以提供一種實施了轉印的基板的生產方法,其中,所述壓接步驟包括:使所述第一壓接單元及所述第二壓接單元由所述膜的彼此相反的一側朝向所述膜移動的壓接單元靠近步驟;使所述第二壓接單元的波紋管朝向所述第一壓接單元延伸來使所述基板的周圍的空間相對於外部密閉的密閉步驟;以及向外部排出殘留於所述波紋管的內部的密閉的空間的氣體的氣體排出步驟。 Furthermore, there may be provided a production method of a transfer-implemented substrate, wherein the crimping step includes causing the first crimping unit and the second crimping unit from opposite sides of the film. a step of approaching the crimping unit moving toward the film; a sealing step of extending the bellows of the second crimping unit toward the first crimping unit to seal the space around the substrate with respect to the outside; and A gas discharging step of discharging the gas remaining in the sealed space inside the bellows to the outside.
此外,可以提供一種實施了轉印的基板的生產方法,其中,所述分離步驟還包括:在通過所述壓接步驟將所述模的圖案轉印於所述基板後,使所述第一壓接單元上升的壓接單元上升步驟。 In addition, a production method of a transferred substrate may be provided, wherein the separation step further includes: after the pattern of the mold is transferred to the substrate through the crimping step, causing the first The crimping unit rising step.
此外,可以提供一種實施了轉印的基板的生產方法,在為了使所述膜移動而旋轉的膜供給部及膜回收部中的一個以上未旋轉的狀態下,反復執行規定次數的所述壓接步驟和所述分離步驟。 Furthermore, it is possible to provide a production method of a transferred substrate, in which the pressing is repeated a predetermined number of times in a state where at least one of the film supply unit and the film recovery unit that rotates to move the film is not rotated. connecting step and said separation step.
本發明的一些實施例是著眼於如上所述的背景發明的,通過對模的表面進行脫模性塗布,具有能夠改善模表面的脫模性的效果。 Some embodiments of the present invention were invented with a view to the background as described above, and have the effect of improving the releasability of the mold surface by coating the surface of the mold with releasability.
此外,通過改善模表面的脫模性,能夠利用一個模將圖案轉印於複數個基板,從而具有能夠改善模的再使用性的效果。 In addition, by improving the releasability of the mold surface, a pattern can be transferred to a plurality of substrates using one mold, thereby improving the reusability of the mold.
此外,通過縮短模的更換週期,具有能夠縮短將圖案轉印於基板的時間,且提高製程的效率的效果。 In addition, by shortening the mold replacement cycle, it has the effect of shortening the time for transferring the pattern to the substrate and improving the efficiency of the process.
此外,通過省略使模與基板相互壓接的製程與使模與基板相互分離的製程之間的使模移動至能夠從基板分離模的位置的過程,具有能夠提高製程的效率的效果。 In addition, by omitting the process of moving the mold to a position where the mold can be separated from the substrate between the process of pressing the mold and the substrate to each other and the process of separating the mold and the substrate from each other, there is an effect of improving the efficiency of the process.
1:轉印裝置 1: Transfer device
10:膜 10:Membrane
20:模 20:Model
30:基板 30:Substrate
100:基板收納部 100:Substrate storage part
200:旋塗機 200:Spin coating machine
210:冷卻板 210:Cooling plate
300:整列單元 300: Entire column unit
400:膜供給部 400: Film supply department
500:進料輥 500: Feed roller
600:保護膜回收部 600: Protective film recycling department
700:脫模部 700:Demolding Department
710:等離子體處理模組 710:Plasma processing module
711:等離子體生成部 711:Plasma generation department
712:導向輥 712:Guide roller
720:蒸鍍模組 720: Evaporation module
721:第一腔室部 721: First chamber part
721a:第一腔室槽 721a: First chamber slot
721b:氣體排出口 721b:Gas discharge port
722:第二腔室部 722: Second chamber part
722a:腔室底座 722a: Chamber base
722b:腔室側壁 722b: Chamber side wall
722b-1:流入口 722b-1: Inlet
722b-2:第二腔室槽 722b-2: Second chamber slot
722c:腔室凸出部 722c: Chamber bulge
722c-1:排出口 722c-1: Discharge port
722c-2:凹部 722c-2: concave part
723:流體供給部 723: Fluid supply department
723a:流體容納體 723a: Fluid containing body
723b:罐 723b:can
723c:起泡器 723c: Aerator
723d:第一供給流路 723d: First supply flow path
723e:第二供給流路 723e: Second supply flow path
723f:噴射裝置 723f:Jet device
724:氣體排出部 724: Gas discharge part
724a:排出流路 724a: Discharge flow path
724b:排出泵 724b: discharge pump
725:蒸鍍密封部 725: Evaporation sealing part
725a:第一蒸鍍密封部件 725a: First evaporation sealing component
725b:第二蒸鍍密封部件 725b: Second evaporation sealing component
726:腔室驅動器 726: Chamber Drive
727:加熱器 727:Heater
728:壓力調節部 728: Pressure regulating department
728a:壓力調節流路 728a: Pressure adjustment flow path
800:轉印部 800: Transfer Department
810:框架 810:Frame
811:第一框架部 811:First Framework Department
812:第二框架部 812:Second Framework Department
813:第三框架部 813:Third Framework Department
820:壓接模組 820: Crimping module
821:第一壓接單元 821: First crimping unit
821a:第一壓接體 821a: First crimping body
821a-1:第一密封槽 821a-1: First sealing groove
821b:第一支撐部 821b: First support part
821c:照射部 821c: Irradiation Department
821d:推擠防止部 821d: Push prevention department
821d-1:支撐部件 821d-1: Support components
821d-2:旋轉部件 821d-2: Rotating parts
821e:第一導向部件 821e: First guide component
821f:固定件 821f: Fasteners
822:第二壓接單元 822: Second crimping unit
822a:第二壓接體 822a: Second crimping body
822a-1:基板安放部 822a-1: Substrate placement part
822a-2:波紋管安放部 822a-2: Bellows placement part
822a-3:吸附口 822a-3: Adsorption port
822a-4:排氣口 822a-4:Exhaust port
822b:波紋管 822b: Bellows
822b-1:第二密封槽 822b-1: Second sealing groove
822c:升降缸 822c: Lift cylinder
822d:第二支撐部 822d: Second support part
822e:第二導向部件 822e: Second guide component
823:排氣部 823:Exhaust part
823a:排氣通道 823a:Exhaust channel
823b:排氣泵 823b:Exhaust pump
824:吸附部 824:Adsorption department
824a:吸附通道 824a: Adsorption channel
824b:吸附泵 824b: Adsorption pump
825:驅動部 825:Drive Department
825a:第一驅動器 825a: first drive
825b:第二驅動器 825b: Second drive
826:壓接密封部 826: Crimp sealing part
826a:第一壓接密封部件 826a: First crimp sealing component
826b:第二壓接密封部件 826b: Second crimp sealing component
830:模分離單元 830: Mold separation unit
831:第一輥部 831: First roller part
832:第二輥部 832: Second roller part
833:輥支撐部 833:Roller support part
834:輥導向部件 834:Roller guide parts
835:輥驅動器 835:Roller drive
840:檢測單元 840:Detection unit
841:第1感測器部 841: 1st Sensor Department
841a:第1-1感測器 841a: No. 1-1 sensor
841b:第1-2感測器 841b: 1-2nd sensor
841c:第1-3感測器 841c: Sensor 1-3
842:第2感測器部 842: 2nd sensor unit
842a:第2-1感測器 842a: No. 2-1 sensor
842b:第2-2感測器 842b: 2-2nd sensor
842c:第2-3感測器 842c: 2nd-3rd sensor
843:第3感測器部 843: 3rd sensor unit
843a:第3-1感測器 843a: No. 3-1 sensor
843b:第3-2感測器 843b: 3-2 sensor
843c:第3-3感測器 843c: 3rd-3rd sensor
900:膜回收部 900: Film recycling department
T:移送單元 T: transfer unit
S10:實施了轉印的基板的生產方法 S10: Production method of transferred substrate
S100~600:步驟 S100~600: steps
圖1是本發明的一實施例的轉印裝置的概念圖。 FIG. 1 is a conceptual diagram of a transfer device according to an embodiment of the present invention.
圖2是圖1的轉印裝置的平面圖。 FIG. 2 is a plan view of the transfer device of FIG. 1 .
圖3是圖1的脫模部的分解立體圖。 FIG. 3 is an exploded perspective view of the mold release part of FIG. 1 .
圖4是沿圖3的A-A'剖切的剖視圖。 FIG. 4 is a cross-sectional view taken along line AA' of FIG. 3 .
圖5是在圖1的第二腔室部上升時沿A-A'剖切的剖視圖。 Fig. 5 is a cross-sectional view taken along AA' when the second chamber portion of Fig. 1 is raised.
圖6是圖1的轉印部的立體圖。 FIG. 6 is a perspective view of the transfer unit in FIG. 1 .
圖7是圖6的分解立體圖。 FIG. 7 is an exploded perspective view of FIG. 6 .
圖8是沿圖6的B-B'剖切的剖視圖。 FIG. 8 is a cross-sectional view taken along line BB′ in FIG. 6 .
圖9a是在圖6的壓接模組為了對模和基板加壓而移動時沿B-B'剖切的剖視圖。 Fig. 9a is a cross-sectional view taken along BB' when the crimping die set of Fig. 6 is moved to pressurize the mold and the substrate.
圖9b的(a)是當圖9a的波紋管縮小時放大C部分的放大圖,圖9b的(b)是當9a的波紋管伸長時放大C部分的放大圖。 (a) of FIG. 9b is an enlarged view of part C when the bellows of FIG. 9a is reduced, and (b) of FIG. 9b is an enlarged view of part C when the bellows of 9a is extended.
圖10是在圖6的第一壓接單元上升時沿B-B'剖切的剖視圖。 FIG. 10 is a cross-sectional view taken along BB′ when the first crimping unit of FIG. 6 is raised.
圖11時在圖6的模分離單元從基板分離模時沿B-B'進行剖切的剖視圖。 FIG. 11 is a cross-sectional view taken along BB′ when the mold separation unit of FIG. 6 separates the mold from the substrate.
圖12是在圖6的模分離單元從基板分離模之後移動時沿B-B'進行剖切的剖視圖。 FIG. 12 is a cross-sectional view taken along BB′ when the mold separation unit of FIG. 6 moves after separating the mold from the substrate.
圖13是圖7的下部框架和第二壓接單元的立體圖。 FIG. 13 is a perspective view of the lower frame and the second crimping unit of FIG. 7 .
圖14的(a)是圖6的模分離單元的仰視圖,圖14的(b)是在圖6的模分離單元朝向模移動時的模分離單元的仰視圖。 (a) of FIG. 14 is a bottom view of the mold separation unit of FIG. 6 , and (b) of FIG. 14 is a bottom view of the mold separation unit when the mold separation unit of FIG. 6 moves toward the mold.
圖15是示意性地示出利用本發明的一實施例的轉印裝置轉印圖案後的基板的生產方法的順序圖。 FIG. 15 is a sequence diagram schematically illustrating a method for producing a substrate after a pattern is transferred using a transfer device according to an embodiment of the present invention.
下面參照附圖對用於實現本發明的思想的具體實施例進行詳細說明。 Specific embodiments for implementing the ideas of the present invention will be described in detail below with reference to the accompanying drawings.
同時,在說明本發明時,當判斷為對相關的習知配置或功能的具體說明可能使本發明的要旨不清楚時,省略其詳細的說明。 Meanwhile, in describing the present invention, when it is judged that the detailed description of related conventional configurations or functions may make the gist of the present invention unclear, the detailed description thereof will be omitted.
此外,當提及某一構成要素“連接於”、“支撐於”、“流入”、“供給至”、“流動至”、“結合於”另一構成要素時,應理解為可能直接連接於、支撐於、流入、供給至、流動至、結合於該另一構成要素,但中間也可能存在別的構成要素。 In addition, when a constituent element is referred to as being "connected to," "supported by," "flowing into," "supplied to," "flowing to," or "combined with" another constituent element, it should be understood that it may be directly connected to , supports, flows into, supplies to, flows to, and is combined with another component, but there may be other components in between.
本說明書中使用的術語僅為說明特定的實施例而使用,而並非以限定本發明的意圖使用的。除非上下文中明確不同地定義,單數的表述包括複數的表述。 The terms used in this specification are used only to describe specific embodiments and are not used with the intention of limiting the present invention. Expressions in the singular include expressions in the plural unless the context clearly defines otherwise.
此外,如第一、第二等包括序數的術語可以用於說明多樣的構成要素,但這些構成要素不應為這樣的術語所限定。這些術語僅用作區分一構成要素與另一構成要素的目的。 In addition, terms including ordinal numbers such as first, second, etc. may be used to describe various constituent elements, but these constituent elements should not be limited by such terms. These terms are only used for the purpose of distinguishing one component from another component.
說明書中使用的“包括”的含義使特定特性、區域、定數、步驟、動作、要素和/或成分具體化,並非排除別的特定特性、區域、定數、步驟,動作、要素,成分和/或組的存在或附加。 The word "comprising" used in the specification means to embody specific characteristics, regions, factors, steps, actions, elements and/or components, and does not exclude other specific characteristics, regions, factors, steps, actions, elements, ingredients and /or the presence or attachment of a group.
此外,需要預先說明的是,本說明書中的上部、下部、上側、下側等表述是以圖中所示為基準說明的,當該物件的方向發生變化時,可能會不同地進行表述。另一方面,本說明書中的上下方向可以是圖1、3、7的上下方向。此外,左右方向可以是圖1、3及7的左右方向。 In addition, it should be noted in advance that the expressions such as upper part, lower part, upper side, and lower side in this specification are based on what is shown in the figure. When the direction of the object changes, the expressions may be different. On the other hand, the up-down direction in this specification may be the up-down direction in FIGS. 1, 3, and 7. In addition, the left-right direction may be the left-right direction of FIGS. 1, 3, and 7.
下面參照附圖對本發明的一實施例的轉印裝置1的具體配置進行說明。 The specific configuration of the transfer device 1 according to an embodiment of the present invention will be described below with reference to the drawings.
如下,參照圖1,本發明的一實施例的轉印裝置1可以對粘接於膜10的模20和基板30加壓來將形成於模20的圖案轉印於基板30。這樣的轉印裝置1可以使膜10向一方向移動來使模20移動。此外,轉印裝置1可以通過對模20的表面進行脫模性塗布,反復使用一個模20在複數個基板30形成圖案。這樣的轉印裝置1可以包括基板收納部100、旋塗機200、整列單元300、膜供給部400、進料輥500、保護膜回收部600、脫模部700、轉印部800、膜回收部900。 As shown below, referring to FIG. 1 , the transfer device 1 according to an embodiment of the present invention can pressurize the mold 20 and the substrate 30 adhered to the film 10 to transfer the pattern formed on the mold 20 to the substrate 30 . Such a transfer device 1 can move the film 10 in one direction to move the mold 20 . In addition, the transfer device 1 can repeatedly use one mold 20 to form patterns on a plurality of substrates 30 by performing release coating on the surface of the mold 20 . Such transfer device 1 may include a substrate storage unit 100, a spin coater 200, an alignment unit 300, a film supply unit 400, a feed roller 500, a protective film recovery unit 600, a demoulding unit 700, a transfer unit 800, and a film recovery unit. Department 900.
膜10可以通過轉印裝置1以依次經由膜供給部400、脫模部700、轉印部800及膜回收部900的方式移動。這裡,膜供給部400可以是上游側,膜回收部900可以是下游側。 The film 10 can be moved by the transfer device 1 so as to pass through the film supply part 400, the demoulding part 700, the transfer part 800, and the film recovery part 900 in order. Here, the film supply part 400 may be on the upstream side, and the film recovery part 900 may be on the downstream side.
參照圖2,基板收納部100可以提供收納在轉印部800轉印圖案之前的基板30的空間。這樣的基板收納部100可以層疊式地收納複數個基板30。此外,收納於基板收納部100的基板30可以由金屬、矽、藍寶石、玻璃等製作。這樣的基板30可以由移送單元T從基板收納部100抽出並移送至旋塗機200。例如,移送單元T可以是機械臂。此外,基板收納部100可以提供收納在轉印部800轉印圖案之後的基板30的空間。這樣的轉印有圖案的基板30可以由移送單元T從轉印部800移送並收納於基板收納部100。此外,在基板收納部100,收納轉印圖案之前的基板30的空間與收納轉印圖案之後的基板30的空間可以分離。 Referring to FIG. 2 , the substrate storage part 100 may provide a space for accommodating the substrate 30 before the transfer part 800 transfers the pattern. Such a substrate storage unit 100 can store a plurality of substrates 30 in a stacked manner. In addition, the substrate 30 stored in the substrate storage part 100 may be made of metal, silicon, sapphire, glass, or the like. Such a substrate 30 can be extracted from the substrate storage unit 100 by the transfer unit T and transferred to the spin coater 200 . For example, the transfer unit T may be a robot arm. In addition, the substrate storage section 100 can provide a space for accommodating the substrate 30 after the pattern is transferred by the transfer section 800 . The substrate 30 on which such a pattern is transferred can be transferred from the transfer unit 800 by the transfer unit T and stored in the substrate storage unit 100 . Furthermore, in the substrate accommodating portion 100, a space for accommodating the substrate 30 before the pattern is transferred and a space for accommodating the substrate 30 after the pattern is transferred can be separated.
旋塗機200可以通過旋塗(Spin Coating)方式將樹脂以規定厚度均勻地塗布於從基板收納部100移送的基板30的表面。這裡,對旋塗方式進行簡要的說明,在旋塗方式中,將基板30置於進行旋轉運動的支撐體上,並將液狀的流動性樹脂滴於基板30的表面。此時,可以通過利用支撐體的高速旋轉產生的離心力使流動性樹脂以規定的厚度均勻地蔓延於基板30的表面來用樹脂塗布基板30的表面。這樣的塗布於基板30的表面的樹脂可以包括具有通過UV(Ultra Violet,紫外光)發生反應而硬化的性質的習知的所有光硬化性樹脂。例如,樹脂可以包括丙烯酸系硬化樹脂。這樣的基板30可以在被移送至旋塗機200之前被移送至冷卻板210,以使表面被樹脂均勻地塗布。此外,基板30在冷卻板210被調節至規定範圍的溫度之後,可以再被移送至旋塗機200。例如,冷卻板210可以將基板30的溫度調節至30℃以下。在旋塗機200塗布樹脂後的基板30可以被移送單元T移送至整列單元300。 The spin coater 200 can uniformly coat the resin with a predetermined thickness on the surface of the substrate 30 transferred from the substrate storage unit 100 by spin coating. Here, the spin coating method will be briefly described. In the spin coating method, the substrate 30 is placed on a support that rotates, and liquid fluid resin is dropped on the surface of the substrate 30 . At this time, the surface of the substrate 30 can be coated with the resin by uniformly spreading the fluid resin to a predetermined thickness on the surface of the substrate 30 by utilizing the centrifugal force generated by the high-speed rotation of the support. Such resin coated on the surface of the substrate 30 may include any conventional photocurable resin that has a property of curing by reaction with UV (Ultra Violet, ultraviolet light). For example, the resin may include an acrylic hardened resin. Such a substrate 30 may be transferred to the cooling plate 210 before being transferred to the spin coater 200 so that the surface is uniformly coated with the resin. In addition, the substrate 30 may be transferred to the spin coater 200 after the cooling plate 210 is adjusted to a temperature within a prescribed range. For example, the cooling plate 210 can adjust the temperature of the substrate 30 to below 30°C. The substrate 30 after the resin is coated by the spin coater 200 can be transferred by the transfer unit T to the alignment unit 300 .
另一方面,以下,即使不另行說明,基板30可以被定義為通過旋塗機200塗布樹脂後的基板30,將模20的圖案轉印於基板30可以意指將模20的圖案轉印於形成在基板30的樹脂。 On the other hand, in the following, even if not otherwise stated, the substrate 30 may be defined as the substrate 30 coated with resin by the spin coater 200 , and transferring the pattern of the mold 20 to the substrate 30 may mean transferring the pattern of the mold 20 to Resin formed on the substrate 30 .
整列單元300可以在由旋塗機200塗布的基板30被移送至轉印部800之前朝已設定的方向對基板30進行整列。這樣的整列單元300可以通過使基板30向水平方向旋轉,以使形成在基板30的孔(厚度方向貫通孔或側面凹槽,未圖示)朝向已設定的方向的方式對基板30進行整列。此外,可以朝與待後述的模20的圖案對應的方向對基板30進行整列。例如,整列單元300可以通過光感測器對基板30進行整列。作為更詳細的示例,整列單元300可以包括能夠照射鐳射等的發光部件(未圖示)和能夠識別鐳射等的收光部件(未圖示)。這樣的發光部件可以向基板30側照射鐳射,收光部件可以識別通過了形成在基板30的一側的孔的鐳射。從而,可以將基板30置於進行旋轉運動的支撐體上,並在基板30通過支撐體旋轉的過程中基板30的孔朝向已設定的方向時,由收光部件通過孔識別由發光部件照射的鐳射,且基板30的旋轉可以停止。如此,當在整列單元300以基板30朝向已設定的方向的方式進行整列時,可以通過移送單元T移送至轉印部800。 The alignment unit 300 can align the substrates 30 coated by the spin coater 200 in a set direction before the substrates 30 are transferred to the transfer unit 800 . Such an alignment unit 300 can align the substrates 30 by rotating the substrate 30 in the horizontal direction so that holes (thickness direction through holes or side grooves, not shown) formed in the substrate 30 face a set direction. In addition, the substrates 30 may be aligned in a direction corresponding to a pattern of the mold 20 to be described later. For example, the alignment unit 300 can align the substrate 30 through a photo sensor. As a more detailed example, the alignment unit 300 may include a light-emitting component (not shown) capable of irradiating laser or the like, and a light-receiving component (not shown) capable of identifying laser or the like. Such a light-emitting component can irradiate laser to the substrate 30 side, and the light-receiving component can recognize the laser that has passed through the hole formed on one side of the substrate 30 . Therefore, the substrate 30 can be placed on a support body that rotates, and when the hole of the substrate 30 faces a set direction while the substrate 30 rotates through the support body, the light-emitting component can identify the light emitted by the light-emitting component through the hole. laser, and the rotation of the substrate 30 can be stopped. In this way, when the substrates 30 are aligned in the alignment unit 300 so that the substrates 30 face the set direction, they can be transferred to the transfer unit 800 by the transfer unit T.
膜供給部400可以支撐卷取的膜10。此外,通過膜供給部400旋轉,可以向脫模部700連續地供給所卷取的膜10。此外,在卷取於膜供給部400的膜10,可以粘接有形成有圖案的模20。在膜10,可以沿膜10延伸的方向隔開規定距離而排列有複數個模20。如此,在卷取於膜供給部400的膜10,可以在膜10的兩面粘接保護膜,以防止粘接有模20的面和其相反面粘接。這樣的膜供給部400可以以通過驅動器旋轉的方式進行驅動。此外,膜供給部400可以向一方 向旋轉來使膜10從膜供給部400移動至膜回收部900。另一方面,由膜供給部400供給的膜10例如可以是樹脂膜。 The film supply part 400 can support the rolled film 10. Moreover, by rotating the film supply part 400, the rolled film 10 can be continuously supplied to the demoulding part 700. In addition, the mold 20 in which a pattern is formed may be adhered to the film 10 wound up in the film supply unit 400 . In the film 10, a plurality of molds 20 may be arranged at a predetermined distance along the direction in which the film 10 extends. In this way, when the film 10 is wound up in the film supply unit 400, protective films can be bonded to both sides of the film 10 to prevent the surface to which the mold 20 is bonded from adhering to the opposite surface. Such a film supply unit 400 can be driven to rotate by a driver. In addition, the film supply unit 400 may be directed to one side The film 10 is moved from the film supply part 400 to the film recovery part 900 by rotating in the opposite direction. On the other hand, the film 10 supplied from the film supply part 400 may be a resin film, for example.
膜回收部900可以向一方向旋轉來回收並卷取從膜供給部400供給的膜10。粘接於這樣的被卷取於膜回收部900的膜10的模20可能是脫模性下降至規定範圍以下的模20。換言之,為了將圖案轉印於基板30而使用複數次的模20的脫模性可能下降至規定範圍以下,由於脫模性下降的模20無法將圖案轉印於基板30,因而可以被回收至膜回收部900。這樣的膜回收部900可以以通過驅動器旋轉的方式進行驅動。此外,膜回收部900可以向一方向旋轉來將膜10從膜供給部400移動至膜回收部900。例如,膜回收部900可以與膜供給部400同時旋轉來移送膜10。但是,這只是一示例,膜回收部900可以以與膜供給部400獨立地旋轉的方式進行驅動。此外,由於膜回收部900的旋轉力大於膜供給部400的旋轉力,因而膜回收部900的旋轉可以使膜供給部400旋轉。從而,也可以通過膜供給部400及膜回收部900中的某一個向一方向旋轉來使膜10移動。這樣的膜10可以以在移動的過程中依次經由脫模部700、轉印部800的方式由上游側移動至下游側。 The film recovery unit 900 can rotate in one direction to recover and wind up the film 10 supplied from the film supply unit 400 . The mold 20 adhered to the film 10 wound up in the film recovery unit 900 may have a mold releasability that falls below a predetermined range. In other words, the releasability of the mold 20 used multiple times to transfer the pattern to the substrate 30 may fall below a predetermined range. Since the mold 20 with reduced releasability cannot transfer the pattern to the substrate 30, it can be recycled. Film recovery unit 900. Such a film recovery unit 900 can be driven to rotate by a driver. In addition, the film recovery unit 900 may be rotated in one direction to move the film 10 from the film supply unit 400 to the film recovery unit 900 . For example, the film recovery unit 900 may rotate simultaneously with the film supply unit 400 to transfer the film 10 . However, this is just an example, and the film recovery part 900 may be driven to rotate independently from the film supply part 400. In addition, since the rotation force of the film recovery part 900 is greater than the rotation force of the film supply part 400, the rotation of the film recovery part 900 can rotate the film supply part 400. Therefore, the film 10 may be moved by rotating one of the film supply part 400 and the film recovery part 900 in one direction. Such a film 10 can be moved from the upstream side to the downstream side so as to pass through the demoulding part 700 and the transfer part 800 in sequence during movement.
進料輥500可以對膜10的移動進行導向,且可以支撐膜10。可以設有複數個這樣的進料輥500,複數個進料輥500可以配置於膜10的移動路徑。例如,進料輥500可以配置於膜供給部400、保護膜回收部600、脫模部700、轉印部800、膜回收部900中的至少一部分之間。此外,複數個進料輥500可以是通過膜10的移動等旋轉的被動輥。 The feed roller 500 can guide the movement of the film 10 and can support the film 10 . A plurality of such feed rollers 500 may be provided, and the plurality of feed rollers 500 may be arranged along the movement path of the film 10 . For example, the feed roller 500 may be disposed between at least part of the film supply unit 400 , the protective film recovery unit 600 , the demoulding unit 700 , the transfer unit 800 , and the film recovery unit 900 . In addition, the plurality of feed rollers 500 may be passive rollers rotated by movement of the film 10 or the like.
保護膜回收部600可以回收粘接於膜10的保護膜。可以設有複數個這樣的保護膜回收部600,以分別回收粘接在膜10的兩面的保護膜。此外,保護膜回收部600可以在模20被移送至脫模部700之前從膜10回收保護膜。 The protective film recovery unit 600 can recover the protective film adhered to the film 10 . A plurality of such protective film recovery units 600 may be provided to respectively recover the protective films adhered to both sides of the film 10 . In addition, the protective film recovery unit 600 may recover the protective film from the film 10 before the mold 20 is transferred to the demolding unit 700 .
參照圖3,脫模部700可以對模20的表面進行脫模性塗布,以改善模20的表面的脫模性。這樣的脫模部700可以向模20的表面供給脫模劑,以對模20的表面進行脫模性塗布。這樣的脫模劑可以包括氟系脫模劑及矽系脫模劑中的一個以上。此外,脫模部700可以在對模20的表面進行脫模性塗布之前通過等離子體(Plasma)對模20的表面進行等離子體處理。這樣的脫模部700可以包括等離子體處理模組710及蒸鍍模組720。 Referring to FIG. 3 , the release part 700 can perform release coating on the surface of the mold 20 to improve the release property of the surface of the mold 20 . Such a release part 700 can supply a release agent to the surface of the mold 20 to perform release coating on the surface of the mold 20 . Such a release agent may include at least one of a fluorine-based release agent and a silicon-based release agent. In addition, the release part 700 may perform plasma treatment on the surface of the mold 20 using plasma (Plasma) before performing release coating on the surface of the mold 20 . Such a demolding part 700 may include a plasma processing module 710 and an evaporation module 720 .
等離子體處理模組710可以在對模20的表面進行脫模性塗布之前對模20的表面進行等離子體處理來對模20的表面進行改質,以提高模20的表面與脫模劑之間的粘接力。此外,等離子體處理模組710可以在塗布脫模劑之前對模20的表面進行等離子體處理來清洗模20的表面,以防止在模20的表面在留有異物的狀態下對模20進行脫模性塗布。例如,等離子體處理模組710是常壓等離子體生成裝置,其可以以氬氣(Ar),氮氣(N2)及氧氣(O2)中的一個以上為媒介生成等離子體。此外,等離子體處理模組710可以包括等離子體生成部711及導向輥712,所述等離子體生成部711在模20的表面生成等離子體,以順暢地進行等離子體處理,所述導向輥712在膜10的上部對膜10的位置進行導向,以維持模20的表面維持與等離子體生成部711的間距為一定間距以下。在這樣的等離子體處理模組710對表面進行等離子體處理的模20可以被移送至蒸鍍模組720。 The plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before performing release coating on the surface of the mold 20 to modify the surface of the mold 20 to improve the relationship between the surface of the mold 20 and the release agent. of adhesion. In addition, the plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 to clean the surface of the mold 20 before coating the release agent, so as to prevent the mold 20 from being demoulded with foreign matter remaining on the surface of the mold 20 . Sexual coating. For example, the plasma processing module 710 is a normal pressure plasma generation device, which can generate plasma using at least one of argon (Ar), nitrogen (N 2 ), and oxygen (O 2 ) as a medium. In addition, the plasma processing module 710 may include a plasma generation part 711 that generates plasma on the surface of the mold 20 to smoothly perform plasma processing, and a guide roller 712 that The upper part of the membrane 10 guides the position of the membrane 10 so that the distance between the surface of the mold 20 and the plasma generation part 711 is maintained at a certain distance or less. The mold 20 whose surface has been subjected to plasma treatment in such a plasma treatment module 710 can be transferred to the vapor deposition module 720 .
如此,等離子體處理模組710具有對模20的表面進行改質來提高模20的表面與脫模劑之間的粘接力的效果。此外,具有通過清洗模20的表面來 防止因在模20的表面落有異物的狀態下進行脫模性塗布而發生不良的現象的效果。 In this way, the plasma treatment module 710 has the effect of modifying the surface of the mold 20 to improve the adhesive force between the surface of the mold 20 and the release agent. In addition, by cleaning the surface of the mold 20 This is an effect of preventing malfunctions caused by releasable coating being performed in a state where foreign matters are deposited on the surface of the mold 20 .
蒸鍍模組720可以利用脫模劑塗布模20的表面。換言之,蒸鍍模組720可以利用脫模劑塗布通過等離子體處理模組710對表面進行等離子體處理後的模20的表面。此外,蒸鍍模組720可以比等離子體處理模組710配置於下游。這樣的蒸鍍模組720可以利用脫模劑塗布模20的表面來改善模20的表面的脫模性。加之,蒸鍍模組720可以以由一個模20轉印複數個基板30的方式改善模20的表面的脫模性,由此能夠改善模20的再使用性。此外,蒸鍍模組720能夠對脫模劑進行氣相化。此外,蒸鍍模組720能夠將氣相化的脫模劑供給至模20的表面來將脫模劑均勻地塗布於模20的表面。這樣的蒸鍍模組720可以包括第一腔室部721、第二腔室部722、流體供給部723、氣體排出部724、蒸鍍密封部725、腔室驅動器726、加熱器727、以及壓力調節部728。 The evaporation module 720 can use a release agent to coat the surface of the mold 20 . In other words, the evaporation module 720 can use a release agent to coat the surface of the mold 20 after the surface is plasma treated by the plasma treatment module 710 . In addition, the evaporation module 720 may be disposed downstream of the plasma processing module 710 . Such an evaporation module 720 can use a release agent to coat the surface of the mold 20 to improve the release property of the surface of the mold 20 . In addition, the evaporation module 720 can improve the releasability of the surface of the mold 20 by transferring a plurality of substrates 30 from one mold 20 , thereby improving the reusability of the mold 20 . In addition, the evaporation module 720 can vaporize the release agent. In addition, the evaporation module 720 can supply the vaporized release agent to the surface of the mold 20 to uniformly apply the release agent to the surface of the mold 20 . Such an evaporation module 720 may include a first chamber part 721, a second chamber part 722, a fluid supply part 723, a gas exhaust part 724, an evaporation sealing part 725, a chamber driver 726, a heater 727, and a pressure Adjustment part 728.
參照圖4和圖5,第一腔室部721及第二腔室部722可以提供在模20的表面利用脫模劑進行塗布的塗布空間T1。這樣的塗布空間T1可以被定義為當第一腔室部721與第二腔室部722貼緊時形成於第一腔室部721與第二腔室部722的內部的空間。此外,塗布空間T1可以是第二腔室部722通過腔室驅動器726朝向第一腔室部721上升,使得第一腔室部721與第二腔室部722彼此間貼緊來形成的。這裡,第二腔室部722和第一腔室部721貼緊的含義指,雖然膜10介於第一腔室部721與第二腔室部722之間,但塗布空間T1與外部呈密閉狀態。另一方面,塗布空間T1可以提供配置模20的空間及在模20的表面供給脫模劑的空間。 Referring to FIGS. 4 and 5 , the first chamber portion 721 and the second chamber portion 722 may provide a coating space T1 for coating the surface of the mold 20 with a release agent. Such coating space T1 can be defined as a space formed inside the first chamber part 721 and the second chamber part 722 when the first chamber part 721 and the second chamber part 722 are in close contact with each other. In addition, the coating space T1 may be formed in which the second chamber part 722 is raised toward the first chamber part 721 by the chamber driver 726 so that the first chamber part 721 and the second chamber part 722 are in close contact with each other. Here, the second chamber part 722 and the first chamber part 721 are in close contact with each other. This means that although the film 10 is interposed between the first chamber part 721 and the second chamber part 722, the coating space T1 is sealed from the outside. condition. On the other hand, the coating space T1 can provide a space for arranging the mold 20 and a space for supplying the release agent on the surface of the mold 20 .
可以在第一腔室部721形成能夠插入待後述的第一蒸鍍密封部件725a的第一腔室槽721a。這樣的第一腔室槽721a可以在第一腔室部721第二腔室部722貼緊時與後述的第二腔室槽722b-2的位置對應地形成於第一腔室部721。 A first chamber groove 721a into which a first vapor deposition sealing member 725a to be described later can be inserted may be formed in the first chamber portion 721. Such first chamber groove 721a may be formed in the first chamber part 721 so as to correspond to the position of the second chamber groove 722b-2 described later when the first chamber part 721 and the second chamber part 722 are in close contact with each other.
此外,可以在第一腔室部721形成用於殘留在塗布空間T1的內部上側的氣體流動的氣體排出口721b。這樣的氣體排出口721b的一側可以與塗布空間T1連通,另一側可以與壓力調節流路728a連通。例如,氣體排出口721b可以形成於第一腔室部721的中心部,且可以在氣體排出口721b的下側配置模20。 In addition, a gas discharge port 721b may be formed in the first chamber portion 721 to allow the gas remaining on the upper side of the coating space T1 to flow. One side of such a gas discharge port 721b may be connected to the coating space T1, and the other side may be connected to the pressure adjustment flow path 728a. For example, the gas discharge port 721b may be formed in the center of the first chamber part 721, and the mold 20 may be disposed below the gas discharge port 721b.
第二腔室部722可以隔著膜10和模20與第一腔室部721貼緊來形成塗布空間T1。這樣的第二腔室部722可以通過腔室驅動器726朝向第一腔室部721上升。第二腔室部722可以包括腔室底座722a、腔室側壁722b及腔室凸出部722c。 The second chamber part 722 can be in close contact with the first chamber part 721 via the film 10 and the mold 20 to form the coating space T1. Such a second chamber part 722 can be raised toward the first chamber part 721 by the chamber driver 726 . The second chamber portion 722 may include a chamber base 722a, a chamber sidewall 722b, and a chamber protrusion 722c.
腔室底座722a可以支撐腔室側壁722b及腔室凸出部722c,且可以被腔室驅動器726支撐。 Chamber base 722a may support chamber sidewalls 722b and chamber protrusions 722c, and may be supported by chamber driver 726.
腔室側壁722b可以從腔室底座722a向上側凸出形成,且可以沿腔室底座722a的邊緣延伸形成。此外,可以在腔室側壁722b形成能夠插入待後述的第二蒸鍍密封部件725b的第二腔室槽722b-2。這樣的第二腔室槽722b-2可以在第一腔室部721與第二腔室部722貼緊時與第一腔室槽721a的位置對應地形成於第二腔室部722。這樣的腔室側壁722b可以形成為與腔室凸出部722c隔開規定距離而包圍腔室凸出部722c。此外,可以在腔室側壁722b形成用於脫模劑流動的流入口722b-1。 The chamber side wall 722b may be formed to protrude upward from the chamber base 722a, and may be formed to extend along an edge of the chamber base 722a. In addition, a second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed on the chamber side wall 722b. Such second chamber groove 722b-2 may be formed in the second chamber part 722 corresponding to the position of the first chamber groove 721a when the first chamber part 721 and the second chamber part 722 are in close contact with each other. Such chamber side wall 722b may be formed to surround the chamber protrusion 722c at a predetermined distance from the chamber protrusion 722c. In addition, an inlet 722b-1 for the release agent to flow may be formed in the chamber side wall 722b.
流入口722b-1可以提供用於從流體供給部723流入的脫模劑向塗布空間T流動的通道。這樣的流入口722b-1的一側可以與流體供給部723的待後 述的第二供給流路723e連通,另一側可以與塗布空間T1連通。此外,可以形成有複數個流入口722b-1,複數個流入口722b-1可以配置為沿腔室側壁722b的周向隔開。例如,可以設有4個流入口722b-1。如此,流入口722b-1形成於彼此不同的位置的腔室側壁722b,使得通過流入口722b-1流入的脫模劑在彼此不同的方向朝向模20流動。另一方面,通過流入口722b-1流入塗布空間T1的脫模劑可以在塗布空間T1內流動而與模20的表面接觸來塗布模20的表面。 The inflow port 722b-1 may provide a passage for the release agent flowing in from the fluid supply part 723 to flow into the coating space T. One side of the inflow port 722b-1 may be connected to the rear side of the fluid supply part 723. The second supply flow path 723e is connected to the second supply channel 723e, and the other side can be connected to the coating space T1. In addition, a plurality of inflow openings 722b-1 may be formed, and the plurality of inflow openings 722b-1 may be arranged to be spaced apart in the circumferential direction of the chamber side wall 722b. For example, four inlets 722b-1 may be provided. In this way, the inflow ports 722b-1 are formed in the chamber side walls 722b at different positions from each other, so that the release agents flowing in through the inflow ports 722b-1 flow toward the mold 20 in mutually different directions. On the other hand, the release agent flowing into the coating space T1 through the inlet 722b-1 can flow in the coating space T1 and come into contact with the surface of the mold 20 to coat the surface of the mold 20.
另一方面,流入口722b-1可以位於模20的下側,以防止與從塗布空間T1連通的一側噴射而朝向模20流動的脫模劑被直接噴射至模20。這裡,模20的下側指比以經過模20的表面中不粘接於膜10的表面的方式延伸的虛擬的平面更下側的位置。如此,流入口722b-1配置於模20的下側,使得從流入口722b-1朝向模20流動的脫模劑能夠在塗布空間T1均勻地分散,且能夠均勻地塗布模20的表面。 On the other hand, the inflow port 722b-1 may be located on the lower side of the mold 20 to prevent the release agent that is sprayed from the side communicating with the coating space T1 and flows toward the mold 20 from being directly sprayed to the mold 20. Here, the lower side of the mold 20 refers to a position lower than an imaginary plane extending through a surface that is not adhered to the film 10 among the surfaces of the mold 20 . In this way, the inlet 722b-1 is disposed on the lower side of the mold 20, so that the release agent flowing from the inlet 722b-1 toward the mold 20 can be uniformly dispersed in the coating space T1, and the surface of the mold 20 can be uniformly coated.
可以在腔室側壁722b形成能夠插入待後述的第二蒸鍍密封部件725b的第二腔室槽722b-2。這樣的第二腔室槽722b-2可以在第一腔室部721與第二腔室部722貼緊時與第一腔室槽721a的位置對應地形成於第二腔室部722。 A second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed on the chamber side wall 722b. Such second chamber groove 722b-2 may be formed in the second chamber part 722 corresponding to the position of the first chamber groove 721a when the first chamber part 721 and the second chamber part 722 are in close contact with each other.
腔室凸出部722c可以從腔室底座722a凸出形成。這樣的腔室凸出部722c可以被腔室側壁722b包圍,且可以以與腔室側壁722b隔開規定距離的方式形成於腔室底座722a。此外,可以在腔室凸出部722c形成排出口722c-1。 The chamber protrusion 722c may be formed to protrude from the chamber base 722a. Such a chamber protrusion 722c may be surrounded by the chamber side wall 722b, and may be formed on the chamber base 722a at a predetermined distance from the chamber side wall 722b. In addition, a discharge port 722c-1 may be formed in the chamber protruding portion 722c.
排出口722c-1可以提供用於向外部排出通過流入口722b-1流入塗布空間T1的脫模劑的通道。這樣的通過流入口722b-1流入塗布空間T1的脫模劑可以在塗布模20的表面之後朝向排出口722c-1被排出至外部。此外,排出口722c-1的一側可以與塗布空間T1連通,排出口722c-1的另一側可以與氣體排出部 724連通。排出口722c-1可以通過塗布空間T1與流入口722b-1連通。另一方面,排出口722c-1可以形成於腔室凸出部722c的中心部,且可以在排出口722c-1的上側配置模20。如此,排出口722c-1形成於腔室凸出部722c的中心部,且在其上側配置模20,使得通過複數個流入口722b-1流入的脫模劑能夠在彼此不同的方向塗布模20的表面之後被排出至外部。 The discharge port 722c-1 may provide a passage for externally discharging the release agent flowing into the coating space T1 through the inflow port 722b-1. The release agent that has flowed into the coating space T1 through the inflow port 722b-1 can be discharged to the outside toward the discharge port 722c-1 after coating the surface of the mold 20. In addition, one side of the discharge port 722c-1 may be connected to the coating space T1, and the other side of the discharge port 722c-1 may be connected to the gas discharge part. 724 connected. The discharge port 722c-1 can communicate with the inflow port 722b-1 through the coating space T1. On the other hand, the discharge port 722c-1 may be formed in the center part of the chamber protruding part 722c, and the mold 20 may be disposed above the discharge port 722c-1. In this way, the discharge port 722c-1 is formed at the center of the cavity protrusion 722c, and the mold 20 is disposed above it, so that the release agent flowing in through the plurality of inflow ports 722b-1 can coat the mold 20 in different directions. The surface is then discharged to the outside.
另一方面,腔室凸出部722c可以以腔室凸出部722c的上面比流入口722b-1配置於上側的方式形成於腔室底座722a。換言之,腔室凸出部722c可以以從腔室底座722a至腔室凸出部722c的上面的距離比從腔室底座722a至流入口722b-1的距離長的方式形成於腔室底座722a。如此,流入口722b-1比腔室凸出部722c的上面形成於下側,從而能夠通過腔室凸出部722c改變通過流入口722b-1流入塗布空間T1的脫模劑的流動方向,且脫模劑能夠在塗布空間T1內均勻地分散。此外,排出口722c-1可以改變通過複數個流入口722b-1流入的脫模劑的流動方向,以使脫模劑在塗布空間T1內分散。從而,模20的表面可以被脫模劑均勻地塗布。 On the other hand, the chamber protrusion 722c may be formed on the chamber base 722a so that the upper surface of the chamber protrusion 722c is disposed above the inlet 722b-1. In other words, the chamber protrusion 722c may be formed on the chamber base 722a such that the distance from the chamber base 722a to the upper surface of the chamber protrusion 722c is longer than the distance from the chamber base 722a to the inflow port 722b-1. In this way, the inflow port 722b-1 is formed lower than the upper surface of the chamber protruding portion 722c, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the chamber protruding portion 722c, and The release agent can be uniformly dispersed in the coating space T1. In addition, the discharge port 722c-1 can change the flow direction of the release agent flowing in through the plurality of inflow ports 722b-1 so that the release agent can be dispersed in the coating space T1. Thereby, the surface of the mold 20 can be evenly coated with the release agent.
如此,第一腔室部721及第二腔室部722具有能夠利用脫模劑均勻地塗布模20的表面的效果。 In this manner, the first cavity portion 721 and the second cavity portion 722 have the effect of being able to uniformly coat the surface of the mold 20 with the release agent.
再次參照圖3,可以在腔室凸出部722c形成能夠分散通過流入口722b-1流入塗布空間T1的脫模劑的凹部722c-2。這樣的凹部722c-2可以形成為具有從腔室凸出部722c的上面向下側凹陷的形狀,且可以形成於腔室凸出部722c的邊緣。如此,凹部722c-2引入形成於腔室凸出部722c的邊緣,從而可以在腔室凸出部722c的邊緣形成凹部722c-2產生的凸台。此外,凹部722c-2可以形成於與流入口722b-1相鄰的位置的腔室凸出部722c。 Referring again to FIG. 3 , a recess 722 c - 2 capable of dispersing the release agent flowing into the coating space T1 through the inlet 722 b - 1 may be formed in the cavity protruding part 722 c. Such a recessed portion 722c-2 may be formed in a shape that is recessed from the upper surface of the chamber protruding portion 722c to the lower side, and may be formed at an edge of the chamber protruding portion 722c. In this way, the recess 722c-2 is introduced into the edge of the cavity protrusion 722c, so that the boss generated by the recess 722c-2 can be formed on the edge of the cavity protrusion 722c. In addition, the recessed portion 722c-2 may be formed in the chamber protruding portion 722c adjacent to the inflow port 722b-1.
另一方面,可以形成複數個凹部722c-2,且複數個凹部722c-2可以與複數個流入口722b-1對應地形成。例如,可以形成有4個凹部722c-2,4個凹部722c-2可以形成於於4個流入口722b-1相鄰的位置。如此,凹部722c-2形成於與流入口722b-1相鄰的位置,從而能夠通過凹部722c-2改變通過流入口722b-1流入塗布空間T1的脫模劑的流動方向,且可以發生渦流現象。從而,通過凹部722c-2產生的渦流現象,脫模劑能夠在塗布空間T1內分散,而不會成團,且能夠均勻地接觸並塗布模20的表面。 On the other hand, a plurality of recessed portions 722c-2 may be formed, and the plurality of recessed portions 722c-2 may be formed corresponding to the plurality of inflow openings 722b-1. For example, four recessed portions 722c-2 may be formed, and the four recessed portions 722c-2 may be formed at positions adjacent to the four inflow openings 722b-1. In this way, the recessed portion 722c-2 is formed adjacent to the inflow port 722b-1, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the recessed portion 722c-2, and a vortex phenomenon can occur. . Therefore, due to the vortex phenomenon generated in the recessed portion 722c-2, the release agent can be dispersed in the coating space T1 without clumping, and can evenly contact and coat the surface of the mold 20.
如此,凹部722c-2具有通過渦流現象來防止脫模性塗層在模20上成團而發生不良的效果。 In this way, the recessed portion 722c-2 has the effect of preventing the mold release coating from clumping on the mold 20 and causing problems due to the eddy current phenomenon.
再次參照圖5,流體供給部723可以向塗布空間T1供給脫模劑來對配置於塗布空間T1的模20的表面進行脫模性塗布。此外,流體供給部723可以使脫模劑氣相化並通過流入口722b-1向塗布空間T1供給氣相化的脫模劑。這樣的流體供給部723可以包括流體容納體723a、罐723b、起泡器723c、第一供給流路723d、第二供給流路723e以及噴射裝置723f。 Referring again to FIG. 5 , the fluid supply unit 723 can supply the release agent to the coating space T1 to perform release coating on the surface of the mold 20 arranged in the coating space T1 . In addition, the fluid supply part 723 can vaporize the release agent and supply the vaporized release agent to the coating space T1 through the inlet 722b-1. Such a fluid supply part 723 may include a fluid container 723a, a tank 723b, a bubbler 723c, a first supply flow path 723d, a second supply flow path 723e, and an injection device 723f.
流體容納體723a可以提供容納非活性氣體的空間。容納於這樣的流體容納體723a的內部的非活性氣體可以是高壓的氣體狀態。此外,非活性氣體可以是氮氣(N2)。此外,流體容納體723a可以通過第一供給流路723d向起泡器723c及噴射裝置723f中的一個以上供給非活性氣體。 The fluid containing body 723a may provide a space for containing the inert gas. The inert gas accommodated in the interior of such a fluid container 723a may be in a high-pressure gas state. Additionally, the inert gas may be nitrogen (N 2 ). In addition, the fluid container 723a can supply the inert gas to one or more of the bubbler 723c and the injection device 723f through the first supply channel 723d.
罐723b可以提供容納脫模劑的空間。這樣的容納於罐723b的內部的脫模劑可以是液體狀態。此外,罐723b可以通過起泡器723c接受非活性氣體,接受非活性氣體的脫模劑可以被氣相化並供給至塗布空間T1。從而,氣相化的 脫模劑可以在塗布空間T1內分散,而不會成團,從而能夠均勻地接觸並塗布模20的表面。 Tank 723b may provide space to hold the release agent. Such a release agent accommodated in the inside of the tank 723b may be in a liquid state. In addition, the tank 723b may receive the inert gas through the bubbler 723c, and the release agent receiving the inert gas may be vaporized and supplied to the coating space T1. Therefore, the gas phase The release agent can be dispersed in the coating space T1 without clumping, so that it can evenly contact and coat the surface of the mold 20 .
起泡器723c可以向容納於罐723b的液體狀態的脫模劑供給規定壓力以上的非活性氣體,以使脫模劑氣相化。這樣的起泡器723c可以在容納於罐723b的脫模劑的表面下方排出非活性氣體。例如,起泡器723c可以是流路管或形成有複數個噴射孔的噴射口。但是,本發明並不因此而受限。 The bubbler 723c can supply an inert gas of a predetermined pressure or higher to the liquid release agent accommodated in the tank 723b so that the release agent can be vaporized. Such a bubbler 723c can discharge inert gas below the surface of the release agent contained in the tank 723b. For example, the bubbler 723c may be a flow tube or an injection port formed with a plurality of injection holes. However, the present invention is not limited thereby.
第一供給流路723d可以提供用於從流體容納體723a流入的非活性氣體向起泡器723c及噴射裝置723f中的一個以上流動的通道。這樣的第一供給流路723d的一側可以與流體容納體723a連通,另一側可以與起泡器723c及噴射裝置723f中的一個以上連通。 The first supply flow path 723d may provide a path for the inert gas flowing from the fluid container 723a to flow to one or more of the bubbler 723c and the injection device 723f. One side of the first supply flow path 723d may be connected to the fluid container 723a, and the other side may be connected to one or more of the bubbler 723c and the injection device 723f.
第二供給流路723e可以提供用於從罐723b流入的氣相化的脫模劑向第二腔室部722的流入口722b-1流動的通道。這樣的第二供給流路723e的一側可以與罐723b的內部連通,另一側可以通過流入口722b-1與塗布空間T1連通。 The second supply flow path 723e may provide a passage for the vaporized release agent flowing in from the tank 723b to flow into the inflow port 722b-1 of the second chamber part 722. One side of the second supply flow path 723e can be connected to the inside of the tank 723b, and the other side can be connected to the coating space T1 through the inlet 722b-1.
噴射裝置723f可以防止在罐723b的內部氣相化的脫模劑再次成團。這樣的噴射裝置723f可以配置於從容納於罐723b的液體狀態的脫模劑的表面向上側隔開規定距離的位置來供給非活性氣體。從而,噴射裝置723f可以在從脫模劑的表面隔開規定距離的位置噴射非活性氣體來防止氣相化的脫模劑再次成團。 The injection device 723f can prevent the release agent that has vaporized inside the tank 723b from forming agglomerates again. Such an injection device 723f may be arranged at a position spaced a predetermined distance upward from the surface of the liquid release agent contained in the tank 723b to supply the inert gas. Therefore, the injection device 723f can inject the inert gas at a position spaced a predetermined distance from the surface of the release agent to prevent the vaporized release agent from agglomerating again.
如此,流體供給部723具有能夠使脫模劑氣相化來無成團現象地均勻地塗布模20的表面的效果。此外,具有能夠防止氣相化的脫模劑再次成團的效果。 In this way, the fluid supply part 723 has the effect of being able to vaporize the release agent and uniformly coat the surface of the mold 20 without clumping. In addition, it has the effect of preventing the vaporized release agent from forming agglomerates again.
氣體排出部724可以向外部排出塗布空間T1的內部中以膜10為基準殘留於第二腔室部722側(例如,圖5的下側)的氣體及脫模劑。這樣的氣體排出部724可以包括排出流路724a及排出泵724b。 The gas discharge part 724 can discharge the gas and the release agent remaining on the second chamber part 722 side (for example, the lower side in FIG. 5 ) with respect to the film 10 in the coating space T1 to the outside. Such gas discharge part 724 may include a discharge flow path 724a and a discharge pump 724b.
排出流路724a可以提供用於塗布空間T1的內部下側的氣體及脫模劑向外部流動的通道。這樣的排出流路724a的一側可以通過第二腔室部722的排出口722c-1與塗布空間T1連通,另一側可以通過排出泵724b與外部連通。 The discharge flow path 724a can provide a passage for the gas and the release agent on the inner lower side of the coating space T1 to flow to the outside. One side of the discharge flow path 724a can communicate with the coating space T1 through the discharge port 722c-1 of the second chamber portion 722, and the other side can communicate with the outside through the discharge pump 724b.
壓力調節部728可以向外部排出塗布空間T1的內部中以膜10為基準殘留於上側的氣體。這樣的壓力調節部728可以包括壓力調節流路728a。 The pressure regulator 728 can discharge the gas remaining on the upper side with respect to the film 10 inside the coating space T1 to the outside. Such pressure adjustment part 728 may include a pressure adjustment flow path 728a.
壓力調節流路728a可以提供用於殘留在塗布空間T1的內部上側的氣體向外部流動的通道。這樣的壓力調節流路728a的一側可以與第一腔室部721的氣體排出口721b與塗布空間T1連通,另一側可以通過排出泵724b與外部連通。 The pressure adjustment flow path 728a can provide a passage for the gas remaining on the inner upper side of the coating space T1 to flow to the outside. One side of such a pressure adjustment flow path 728a can communicate with the gas discharge port 721b of the first chamber part 721 and the coating space T1, and the other side can communicate with the outside through the discharge pump 724b.
另一方面,在本實施例的附圖中,雖然圖示為壓力調節流路728a與氣體排出部724的排出泵724b連通,但本發明的思想並不限於此,壓力調節部728也可以進一步包括不同於氣體排出部724的排出泵724b的另外的泵,且可以通過這樣的另外的泵向外部排出壓力調節流路728a的氣體。 On the other hand, in the drawings of this embodiment, although the pressure adjustment flow path 728a is shown to be connected to the discharge pump 724b of the gas discharge part 724, the idea of the present invention is not limited to this, and the pressure adjustment part 728 may also be further A separate pump different from the discharge pump 724b of the gas discharge part 724 is included, and the gas in the pressure adjustment flow path 728a can be discharged to the outside by such a separate pump.
當氣體排出部724排出塗布空間T1的內部下側的氣體時,塗布空間T1的內部上側與下側的壓力差會使膜10晃動而阻礙模20的塗布,因而能夠防止因壓力調節部728排出塗布空間T1的內部上側的氣體而發生塗布空間T1的內部上側與下側的壓力差。 When the gas discharge part 724 discharges the gas on the lower side inside the coating space T1, the pressure difference between the upper and lower sides of the coating space T1 will cause the film 10 to shake and hinder the coating of the mold 20, thus preventing the gas from being discharged by the pressure regulator 728. The gas on the upper side inside the coating space T1 generates a pressure difference between the upper side and the lower side inside the coating space T1.
如此,壓力調節部728具有能夠防止塗布空間T1的內部上側與下側的壓力差來防止模20的塗布被阻礙的效果。 In this way, the pressure regulator 728 has the effect of preventing the pressure difference between the upper and lower sides of the coating space T1 and preventing the coating of the mold 20 from being hindered.
當第一腔室部721與第二腔室部722實質上貼緊時,蒸鍍密封部725可以使第一腔室部721與第二腔室部722之間密閉。這樣的蒸鍍密封部725可以通過使第一腔室部721與第二腔室部722之間密閉來阻隔塗布空間T1與外部。此外,蒸鍍密封部725可以形成為包圍塗布空間T1,以進行第一腔室部721與第二腔室部722之間的密封。這樣的蒸鍍密封部725可以包括第一蒸鍍密封部件725a及第二蒸鍍密封部件725b。 When the first chamber part 721 and the second chamber part 722 are substantially in contact with each other, the evaporation sealing part 725 can seal the first chamber part 721 and the second chamber part 722 . Such a vapor deposition sealing part 725 can seal the coating space T1 from the outside by sealing the first chamber part 721 and the second chamber part 722 . In addition, the vapor deposition sealing part 725 may be formed to surround the coating space T1 to seal between the first chamber part 721 and the second chamber part 722 . Such a vapor deposition sealing part 725 may include a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b.
第一蒸鍍密封部件725a可以插入配置與形成在第一腔室部721的第一腔室槽721a。此外,第二蒸鍍密封部件725b可以插入配置於形成在第二腔室部722的第二腔室槽722b-2。這樣的第一蒸鍍密封部件725a與第二蒸鍍密封部件725b可以配置為彼此相向。換言之,當第一腔室部721與第二腔室部722貼緊時,第一蒸鍍密封部件725a和第二蒸鍍密封部件725b可以彼此加壓,且可以對第一腔室部721與第二腔室部722之間的間隙進行密封。 The first vapor deposition sealing member 725a may be inserted into the first chamber groove 721a formed in the first chamber part 721. In addition, the second vapor deposition sealing member 725b may be inserted and disposed in the second chamber groove 722b-2 formed in the second chamber part 722. Such first vapor deposition sealing member 725a and second vapor deposition sealing member 725b may be arranged to face each other. In other words, when the first chamber part 721 and the second chamber part 722 are in close contact, the first evaporation sealing part 725a and the second evaporation sealing part 725b can pressurize each other, and the first chamber part 721 and the second evaporation sealing part 725b can be pressurized. The gap between the second chamber portions 722 is sealed.
另一方面,參照圖5的放大圖,當第一蒸鍍密封部件725a與第二蒸鍍密封部件725b相互貼緊時,膜10可以介於第一蒸鍍密封部件725a與第二蒸鍍密封部件725b之間。此外,第一蒸鍍密封部件725a可以在膜10的上部對膜10,第二蒸鍍密封部件725b可以在膜10的下部對膜10加壓。此時,第一蒸鍍密封部件725a及第二蒸鍍密封部件725b可以配置為具有既通過第一蒸鍍密封部件725a和第二蒸鍍密封部件725b的加壓防止膜10起皺又能夠有效地密封第一腔室部721與第二腔室部722之間的間隙的形狀。 On the other hand, referring to the enlarged view of FIG. 5 , when the first evaporation sealing part 725 a and the second evaporation sealing part 725 b are in close contact with each other, the film 10 may be interposed between the first evaporation sealing part 725 a and the second evaporation sealing part. between parts 725b. In addition, the first vapor deposition sealing member 725a may pressurize the film 10 at the upper part of the film 10, and the second vapor deposition sealing member 725b may pressurize the film 10 at the lower part of the film 10. At this time, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may be configured to effectively prevent the film 10 from wrinkling under pressure by the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b. The shape of the gap between the first chamber part 721 and the second chamber part 722 is effectively sealed.
例如,當第一蒸鍍密封部件725a及第二蒸鍍密封部件725b形成為相同的O型環(O-ring)形狀時,第一蒸鍍密封部件725a與第二蒸鍍密封部件725b貼緊時可能會導致膜10起皺。作為另一示例,當第一蒸鍍密封部件725a和第二 蒸鍍密封部件725b形成為相互接觸的面為平面形狀時,能夠防止膜10起皺。然而,由於第一蒸鍍密封部件725a與第二蒸鍍密封部件725b之間的加壓力較弱,因而無法正常地對第一腔室部721與第二腔室部722之間進行密封。因此,第一蒸鍍密封部件725a及第二蒸鍍密封部件725b有必要形成為彼此不同的形狀,以便既防止膜10起皺又能使塗布空間T1密閉。例如,第一蒸鍍密封部件725a及第二蒸鍍密封部件725b中的某一個可以在不與另一個貼緊時具有平面形狀,另一個可以在不與所述某一個貼緊時具有O型環等圓弧形狀。 For example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed in the same O-ring shape, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact with each other. This may cause the membrane 10 to wrinkle. As another example, when the first vapor deposition sealing member 725a and the second When the vapor deposition sealing member 725b is formed so that the surfaces in contact with each other have a flat shape, wrinkles of the film 10 can be prevented. However, since the pressing force between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b is weak, the first chamber portion 721 and the second chamber portion 722 cannot be properly sealed. Therefore, it is necessary to form the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b into shapes different from each other in order to prevent the film 10 from wrinkling and seal the coating space T1. For example, one of the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may have a planar shape when not in close contact with the other, and the other may have an O-shaped shape when not in close contact with the one. Ring and other arc shapes.
腔室驅動器726可以使第二腔室部722相對於第一腔室部721升降。這樣的腔室驅動器726可以與第二腔室部722連接。 The chamber driver 726 can raise and lower the second chamber part 722 relative to the first chamber part 721 . Such a chamber driver 726 may be connected to the second chamber portion 722 .
如此,蒸鍍密封部725具有防止膜10起皺的效果。 In this manner, the vapor deposition sealing portion 725 has the effect of preventing wrinkles of the film 10 .
加熱器727可以使塗布空間T1的溫度維持在規定範圍,以提高模20的表面與脫模劑之間的粘接力。這樣的加熱器727可以加熱第一腔室部721及第二腔室部722中的一個以上來提升塗布空間T1的溫度。例如,當塗布空間T1的溫度為30℃以下時,可能無法在模20的表面進行充分的脫模性塗布,當塗布空間T1的溫度為80℃以上時,膜10可能會受損。因此,加熱器727可以使將塗布空間T1的溫度維持在30℃至80℃的範圍內。 The heater 727 can maintain the temperature of the coating space T1 within a prescribed range to improve the adhesive force between the surface of the mold 20 and the release agent. Such a heater 727 can heat one or more of the first chamber part 721 and the second chamber part 722 to increase the temperature of the coating space T1. For example, when the temperature of the coating space T1 is 30°C or lower, the surface of the mold 20 may not be coated with sufficient mold releasability. When the temperature of the coating space T1 is 80°C or higher, the film 10 may be damaged. Therefore, the heater 727 can maintain the temperature of the coating space T1 in the range of 30°C to 80°C.
如此,加熱器727具有將塗布空間T1的溫度維持在規定範圍來提高模20的表面與脫模劑之間的粘接力的效果。 In this way, the heater 727 maintains the temperature of the coating space T1 within a predetermined range and has the effect of increasing the adhesive force between the surface of the mold 20 and the release agent.
如此,本發明的一實施例的蒸鍍模組720具有通過對模20的表面進行脫模性塗布來改善模20的表面脫模性的效果。此外,通過改善模20的表面的脫模性,能夠利用一個模20轉印複數個基板30,從而具有能夠提高模20的再 使用性的效果。此外,具有通過降低模20的更換週期,能夠縮短將圖案轉印於基板30的時間,且能夠提高製程的效率的效果。 In this way, the evaporation module 720 according to one embodiment of the present invention has the effect of improving the surface releasability of the mold 20 by applying the releasable coating to the surface of the mold 20 . In addition, by improving the releasability of the surface of the mold 20 , a plurality of substrates 30 can be transferred using one mold 20 , thereby improving the releasability of the mold 20 . usability effects. In addition, by reducing the replacement cycle of the mold 20 , the time required to transfer the pattern to the substrate 30 can be shortened, and the efficiency of the process can be improved.
參照圖6,轉印部800可以將模20的圖案轉印於基板30。例如,轉印部800可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下執行將模20的圖案壓接於基板30的過程和從基板30分離模20的過程來將圖案轉印於基板30。此外,在脫模部700對模20的表面進行脫模性塗布後,轉印部800可以將進行脫模性塗布的一個模20加壓於複數個基板30來將圖案轉印於複數個基板30。例如,轉印部800可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下反復執行規定次數的將模20的圖案壓接於基板30的過程和從基板30分離模20的過程來將圖案轉印於複數個基板30。作為更詳細的示例,當執行一次等離子體處理模組710利用等離子體處理模20的表面的過程,並執行一次蒸鍍模組720對模20的表面進行脫模性塗布的過程時,轉印部800可以執行複數次將模20的圖案壓接於通過蒸鍍模組720進行脫模性塗布後的基板30的過程和從基板30分離模20的過程。此外,可以省略將模20的圖案壓接於基板30的過程與從基板30分離模20的過程之間的轉印部800移動至用於使相互壓接的基板30與模20的位置的過程。這樣的轉印部800可以包括框架810、壓接模組820、模分離單元830及檢測單元840。 Referring to FIG. 6 , the transfer part 800 can transfer the pattern of the mold 20 to the substrate 30 . For example, the transfer unit 800 may perform the process of pressing the pattern of the mold 20 to the substrate 30 and removing the pattern from the substrate 30 in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . The pattern is transferred to the substrate 30 through the process of separating the mold 20 . In addition, after the release part 700 performs release coating on the surface of the mold 20, the transfer part 800 can press one mold 20 that has been used for release coating on the plurality of substrates 30 to transfer the pattern to the plurality of substrates. 30. For example, the transfer unit 800 may repeat the process of pressing the pattern of the mold 20 to the substrate 30 a predetermined number of times in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . and the process of separating the mold 20 from the substrate 30 to transfer the pattern to a plurality of substrates 30 . As a more detailed example, when the plasma treatment module 710 processes the surface of the mold 20 with plasma once, and the evaporation deposition module 720 performs a release coating process on the surface of the mold 20 , the transfer The unit 800 can perform a plurality of processes of pressing the pattern of the mold 20 onto the substrate 30 that has been releasably coated by the evaporation module 720 and of detaching the mold 20 from the substrate 30 . In addition, the process of moving the transfer unit 800 to a position for pressing the substrate 30 and the mold 20 between the process of pressing the pattern of the mold 20 to the substrate 30 and the process of separating the mold 20 from the substrate 30 can be omitted. . Such transfer part 800 may include a frame 810, a crimping die set 820, a die separation unit 830, and a detection unit 840.
參照圖6和圖7,框架810可以支撐壓接模組820、模分離單元830以及檢測單元840。這樣的框架810可以形成為圍繞壓接模組820及模分離單元830的至少一部分。從而,壓接模組820及模分離單元830可以以支撐於框架810的狀態在框架810的內側移動。換言之,壓接模組820及模分離單元830可以相對於框架810移動。例如,第一壓接單元821及第二壓接單元822可以以支撐於框架 810的狀態相對於彼此移動,模分離單元830可以以支撐於框架810的狀態相對於模20移動。從而,代替由壓接模組820向模分離單元830移動模20地,模分離單元830相對於模20移動,由此可以省略使模20與基板30相互壓接的製程與使模20與基板30相互分離的製程之間的壓接於基板30及基板30的模20移動至從基板30分離模20的位置的製程。此外,框架810可以包括支撐第一壓接單元821的第一框架部811、支撐第二壓接單元822的第二框架部812、以及支撐模分離單元830的第三框架部813。這樣的第一框架部811、第二框架部812及第三框架部813可以相對於彼此一體地固定支撐。此外,第二框架部812可以支撐第一框架部811及第三框架部813的荷重。 Referring to FIGS. 6 and 7 , the frame 810 may support the crimping die set 820 , the die separation unit 830 and the detection unit 840 . Such a frame 810 may be formed to surround at least a portion of the crimping die set 820 and the die separation unit 830 . Therefore, the crimping die set 820 and the die separation unit 830 can move inside the frame 810 while being supported on the frame 810 . In other words, the crimping die set 820 and the die separation unit 830 can move relative to the frame 810 . For example, the first crimping unit 821 and the second crimping unit 822 may be supported on the frame. 810 move relative to each other, the mold separation unit 830 may move relative to the mold 20 in a state supported on the frame 810 . Therefore, instead of moving the mold 20 from the pressing module 820 to the mold separation unit 830 , the mold separation unit 830 moves relative to the mold 20 , so that the process of pressing the mold 20 and the substrate 30 to each other and the process of pressing the mold 20 and the substrate can be omitted. 30 is a process in which the mold 20 pressed against the substrate 30 and the mold 20 of the substrate 30 is moved to a position where the mold 20 is separated from the substrate 30 . Furthermore, the frame 810 may include a first frame part 811 supporting the first crimping unit 821 , a second frame part 812 supporting the second crimping unit 822 , and a third frame part 813 supporting the mold separation unit 830 . Such first frame part 811, second frame part 812, and third frame part 813 can be fixedly supported integrally with each other. In addition, the second frame part 812 can support the load of the first frame part 811 and the third frame part 813.
壓接模組820可以將模20的圖案壓接於基板30。這樣的壓接模組820可以將通過脫模部700對表面進行等離子體處理並對表面進行脫模性塗布的模20的圖案壓接於基板30。此外,壓接模組820可以對模20與基板30相對於彼此加壓來將模20的圖案壓接於基板30。這樣的壓接模組820可以包括第一壓接單元821、第二壓接單元822、排氣部823、吸附部824、驅動部825以及壓接密封部826。 The pressing module 820 can press the pattern of the mold 20 onto the substrate 30 . Such a pressure-bonding module 820 can press-bond the pattern of the mold 20 whose surface is subjected to plasma treatment through the mold release part 700 and the surface is releasably coated to the substrate 30 . In addition, the pressing module 820 can press the mold 20 and the substrate 30 relative to each other to press the pattern of the mold 20 to the substrate 30 . Such a crimping module 820 may include a first crimping unit 821 , a second crimping unit 822 , an exhaust part 823 , an adsorption part 824 , a driving part 825 and a crimping sealing part 826 .
參照圖8,第一壓接單元821和第二壓接單元822可以相對於彼此移動而相互貼緊來將形成在模20的圖案壓接於基板30。換言之,第一壓接單元821和第二壓接單元822可以在介於所述第一壓接單元821與所述第二壓接單元822之間的膜10的相反的一側朝向膜10移動而相互貼緊。此外,第一壓接單元821及第二壓接單元822中的一個以上可以向相互貼緊的方向對模20或基板30加壓。如此,第一壓接單元821及第二壓接單元822中的一個以上對模20與基板30相互加壓,從而能夠將形成在模20的圖案壓接於基板30。例如,第一壓接單元821支撐模20,第二壓接單元822朝向模20對基板30加壓,由此能夠將模20的圖 案壓接於基板30。作為另一示例,第二壓接單元822可以支撐基板30,第一壓接單元821朝向基板30對模20加壓,由此能夠將模20的圖案壓接於基板30。 Referring to FIG. 8 , the first pressing unit 821 and the second pressing unit 822 can move relative to each other and come into close contact with each other to press the pattern formed on the mold 20 to the substrate 30 . In other words, the first crimping unit 821 and the second crimping unit 822 may move toward the film 10 on opposite sides of the film 10 between the first crimping unit 821 and the second crimping unit 822 And stick to each other. In addition, at least one of the first pressure bonding unit 821 and the second pressure bonding unit 822 may press the mold 20 or the substrate 30 in a direction in which they are in close contact with each other. In this way, at least one of the first pressure bonding unit 821 and the second pressure bonding unit 822 presses the mold 20 and the substrate 30 against each other, so that the pattern formed on the mold 20 can be pressure-bonded to the substrate 30 . For example, the first pressure bonding unit 821 supports the mold 20 and the second pressure bonding unit 822 presses the substrate 30 toward the mold 20, thereby making it possible to change the pattern of the mold 20. The case is crimped to the substrate 30 . As another example, the second pressing unit 822 may support the substrate 30 , and the first pressing unit 821 presses the mold 20 toward the substrate 30 , thereby being able to press the pattern of the mold 20 to the substrate 30 .
這樣的第一壓接單元821及第二壓接單元822可以通過驅動部825相對於彼此升降,第一壓接單元821及第二壓接單元822升降的速度可以個別地進行控制。此外,第一壓接單元821及第二壓接單元822可以相對於框架810移動。換言之,第一壓接單元821及第二壓接單元822可以以支撐於框架810的狀態在框架810的內側升降。 The first crimping unit 821 and the second crimping unit 822 can be raised and lowered relative to each other by the driving part 825, and the speed of the first crimping unit 821 and the second crimping unit 822 can be individually controlled. In addition, the first crimping unit 821 and the second crimping unit 822 can move relative to the frame 810 . In other words, the first crimping unit 821 and the second crimping unit 822 can move up and down inside the frame 810 while being supported on the frame 810 .
另一方面,第一壓接單元821可以包括第一壓接體821a、第一支撐部821b、照射部821c、推擠防止部821d、第一導向部件821e以及固定件821f。 On the other hand, the first crimping unit 821 may include a first crimping body 821a, a first support part 821b, an irradiation part 821c, a pushing prevention part 821d, a first guide member 821e, and a fixing member 821f.
第一壓接體821a可以與第二壓接單元822的待後述的波紋管822b貼緊,且可以對粘接有模20的膜10加壓來將模20的圖案壓接於基板30。這樣的第一壓接體821a可以支撐於第一支撐部821b,且可以通過使第一支撐部821b升降的第一驅動器825a與第一支撐部821b一同升降。此外,第一壓接體821a可以支撐於第一支撐部821b,但第一壓接體821a也可以固定設置於第一支撐部821b。此外,第一壓接體821a可以通過第一驅動器825a朝向膜10下降,並在膜10的上側對膜10加壓來將模20加壓於基板30。 The first crimping body 821a can be in close contact with the bellows 822b of the second crimping unit 822 to be described later, and can pressurize the film 10 to which the mold 20 is bonded to press the pattern of the mold 20 to the substrate 30 . Such first crimping body 821a can be supported by the first support portion 821b, and can be raised and lowered together with the first support portion 821b by the first driver 825a that raises and lowers the first support portion 821b. In addition, the first crimping body 821a may be supported on the first support part 821b, but the first crimping body 821a may also be fixedly provided on the first support part 821b. In addition, the first pressing body 821 a can be lowered toward the film 10 by the first driver 825 a and pressurize the film 10 on the upper side of the film 10 to press the mold 20 against the substrate 30 .
另一方面,可以在第一壓接體821a形成能夠插入待後述的第一壓接密封部件826a的第一密封槽821a-1。這樣的第一密封槽821a-1可以在第一壓接單元821與第二壓接單元822貼緊時與待後述的第二壓接單元822的第二密封槽822b-1的位置對應地形成於第一壓接體821a。 On the other hand, a first seal groove 821a-1 into which a first pressure-contact sealing member 826a to be described later can be inserted may be formed in the first pressure-contact body 821a. Such first sealing groove 821a-1 can be formed corresponding to the position of the second sealing groove 822b-1 of the second crimping unit 822 to be described later when the first crimping unit 821 and the second crimping unit 822 are in close contact. to the first crimping body 821a.
第一支撐部821b可以支撐第一壓接體821a,且可以被第一驅動器825a支撐。此外,可以通過第一導向部件821e對第一支撐部821b的移動進行導 向。換言之,第一導向部件821e以貫通的方式具備於第一支撐部821b,由此第一支撐部821b可以沿一方向(例如,圖7的上下方向)延伸的第一導向部件821e移動。如此,第一支撐部821b可以沿第一導向部件821e移動來相對於框架810移動。換言之,第一支撐部821b可以通過第一驅動器825a升降來與第一壓接體821a一同相對於框架810升降。 The first support part 821b may support the first crimping body 821a and may be supported by the first driver 825a. In addition, the movement of the first support portion 821b can be guided by the first guide member 821e. Towards. In other words, the first guide member 821e is provided through the first support part 821b, so that the first support part 821b can move along the first guide member 821e extending in one direction (for example, the up-and-down direction in FIG. 7 ). In this way, the first support part 821b can move along the first guide part 821e to move relative to the frame 810. In other words, the first support portion 821b can be raised and lowered by the first driver 825a to be raised and lowered relative to the frame 810 together with the first crimping body 821a.
照射部821c可以使通過模20壓接於基板30的圖案硬化。當通過第一壓接體821a將模20的圖案壓接於基板30時,這樣的照射部821c可以將紫外線(Ultraviolet Ray)照射至基板30來使形成在基板30的樹脂硬化。這樣的照射部821c可以包括用於照射紫外線的紫外線光源(未圖示)及紫外線光源透射的光源(未圖示)。這樣的光源可以包括藍寶石等石英。如此,照射部821c可以將紫外線照射至基板30來使形成在基板30的樹脂硬化。此外,膜10、模20以及基板30可以構成為紫外線透射。此外,照射部821c可以具備於第一壓接體821a的一側。此外,照射部821c可以與膜10的上側接觸來對膜10加壓。 The irradiation part 821c can harden the pattern pressed against the substrate 30 by the mold 20. When the pattern of the mold 20 is pressed against the substrate 30 by the first pressing body 821a, such an irradiation part 821c can irradiate ultraviolet rays to the substrate 30 to harden the resin formed on the substrate 30. Such irradiation part 821c may include an ultraviolet light source (not shown) for irradiating ultraviolet rays and a light source (not shown) through which the ultraviolet light source transmits. Such light sources may include quartz such as sapphire. In this way, the irradiation part 821c can irradiate ultraviolet rays to the substrate 30 to harden the resin formed on the substrate 30 . In addition, the film 10, the mold 20, and the substrate 30 may be configured to be ultraviolet transmissive. In addition, the irradiation part 821c may be provided on one side of the first crimping body 821a. In addition, the irradiation part 821c may contact the upper side of the film 10 to pressurize the film 10.
推擠防止部821d可以支撐第一支撐部821b來防止第一壓接體821a及第一支撐部821b由第二壓接單元822上升規定範圍以上。換言之,當第一壓接單元821支撐模20,且第二壓接單元822為了對基板30加壓而上升時,可以通過第二壓接單元822的加壓力防止第一壓接體821a及第一支撐部821b被推擠至上側。推擠防止部821d例如可以是缸體。這樣的推擠防止部821d可以包括支撐部件821d-1及旋轉部件821d-2。 The pushing prevention part 821d can support the first support part 821b to prevent the first crimping body 821a and the first support part 821b from rising beyond a predetermined range from the second crimping unit 822. In other words, when the first crimping unit 821 supports the mold 20 and the second crimping unit 822 rises to pressurize the substrate 30 , the first crimping body 821 a and the second crimping body 821 a can be prevented from being pressed by the pressing force of the second crimping unit 822 . A support portion 821b is pushed to the upper side. The pushing prevention part 821d may be a cylinder, for example. Such pushing prevention part 821d may include a support member 821d-1 and a rotation member 821d-2.
支撐部件821d-1可以固定支撐於框架810,並支撐旋轉部件821d-2的一端部。 The support member 821d-1 may be fixedly supported on the frame 810 and support one end of the rotating member 821d-2.
旋轉部件821d-2可以能夠旋轉地連接於支撐部件821d-1。這樣的旋轉部件821d-2的一端部可以支撐於支撐部件821d-1,另一端部可以選擇性地支撐固定件821f。例如,當第一壓接單元821向下側對模20加壓時,可以在固定件821f的上側對固定件821f支撐來防止第一支撐部821b向上側推擠規定範圍以上。此外,當第一壓接單元821對模20加壓後上升時,旋轉部件821d-2可以以從固定件821f分離的方式向一方向旋轉。 The rotating member 821d-2 may be rotatably connected to the supporting member 821d-1. One end of such a rotating member 821d-2 can be supported by the supporting member 821d-1, and the other end can selectively support the fixing member 821f. For example, when the first crimping unit 821 presses the mold 20 downward, the fixing member 821f may be supported on the upper side of the fixing member 821f to prevent the first support part 821b from being pushed upward beyond a predetermined range. In addition, when the first crimping unit 821 pressurizes the mold 20 and then rises, the rotating member 821d-2 may rotate in one direction in a manner to separate from the fixing member 821f.
另一方面,推擠防止部821d可以與第二壓接單元822的加壓力對應地對第一支撐部821b加壓。例如,當第二壓接單元822對第一壓接體821a加壓的力增加時,推擠防止部821d對第一支撐部821b加壓的力也可以隨之增加。如此,推擠防止部821d基於第二壓接單元822的加壓力對第一支撐部821b可變地加壓,由此能夠防止圖案被不完全地壓接於基板30。可以設有複數個這樣的推擠防止部821d,且複數個推擠防止部821d可以在彼此不同的位置對第一支撐部821b加壓。例如,可以設有4個推擠防止部821d。但是,這只是一示例,可以設置有任意個數的推擠防止部821d。 On the other hand, the pushing prevention part 821d can pressurize the first support part 821b in accordance with the pressing force of the second pressure bonding unit 822. For example, when the force with which the second crimping unit 822 presses the first crimping body 821a increases, the force with which the pushing prevention portion 821d presses the first support portion 821b may also increase accordingly. In this way, the pushing prevention part 821d variably pressurizes the first support part 821b based on the pressing force of the second pressure bonding unit 822, thereby preventing the pattern from being incompletely pressed against the substrate 30. A plurality of such pushing prevention parts 821d may be provided, and the plurality of pushing preventing parts 821d may pressurize the first support part 821b at mutually different positions. For example, four push preventing portions 821d may be provided. However, this is just an example, and any number of pushing prevention parts 821d may be provided.
第一導向部件821e可以對第一支撐部821b的移動進行導向。這樣的第一導向部件821e可以固定支撐於第一框架部811,且可以向上下方向延伸形成。此外,第一導向部件821e可以貫通第一支撐部821b來對第一支撐部821b的移動進行導向。例如,第一導向部件821e可以是向一方向延伸形成的條(bar)形態。第一支撐部821b沿這樣的支撐於框架810的第一導向部件821e移動,從而第一支撐部821b可以相對於框架810相對地升降。 The first guide member 821e can guide the movement of the first support portion 821b. Such first guide member 821e may be fixedly supported on the first frame part 811, and may be formed to extend in the up and down direction. In addition, the first guide member 821e may penetrate the first support part 821b to guide the movement of the first support part 821b. For example, the first guide member 821e may be in the form of a bar extending in one direction. The first support part 821b moves along the first guide member 821e supported on the frame 810, so that the first support part 821b can move up and down relative to the frame 810.
固定件821f可以提供被推擠防止部821d加壓的部分。這樣的固定件821f的一側可以被第一支撐部821b固定支撐,另一側可以選擇性地支撐於推擠 防止部821d。例如,固定件821f可以在第一壓接單元821與第二壓接單元822貼緊時被推擠防止部821d支撐。此時,可以通過推擠防止部821d防止固定設置於第一支撐部821b的第一壓接體821a被推擠。作為另一例,固定件821f可以在第一壓接單元821上升時與推擠防止部821d分離。此時,推擠防止部821d的旋轉部件821d-2可以向一方向旋轉來與固定件821f分離。 The fixing piece 821f may provide a portion pressed by the push preventing portion 821d. One side of such a fixing member 821f can be fixedly supported by the first support portion 821b, and the other side can be selectively supported by the pushing Prevention part 821d. For example, the fixing member 821f may be supported by the push preventing portion 821d when the first crimping unit 821 and the second crimping unit 822 are in close contact. At this time, the first crimping body 821a fixed to the first support part 821b can be prevented from being pushed by the pushing preventing part 821d. As another example, the fixing piece 821f may be separated from the pushing prevention part 821d when the first crimping unit 821 rises. At this time, the rotating member 821d-2 of the pushing preventing portion 821d can rotate in one direction to be separated from the fixing member 821f.
第二壓接單元822可以包括第二壓接體822a、波紋管822b、升降缸822c、第二支撐部822d及第二導向部件822e。 The second crimping unit 822 may include a second crimping body 822a, a bellows 822b, a lifting cylinder 822c, a second support part 822d, and a second guide member 822e.
參照圖9a,第二壓接體822a可以支撐基板30,且可以支撐波紋管822b。這樣的第二壓接體822a可以被第二支撐部822d支撐,且可以通過使第二支撐部822d升降的第二驅動器825b與第二支撐部822d一同升降。第二壓接體822a可以包括基板安放部822a-1、波紋管安放部822a-2、吸附口822a-3以及排氣口822a-4。 Referring to FIG. 9a, the second crimping body 822a may support the substrate 30 and may support the bellows 822b. Such a second crimping body 822a can be supported by the second support portion 822d, and can be raised and lowered together with the second support portion 822d by the second driver 825b that raises and lowers the second support portion 822d. The second crimping body 822a may include a substrate placement portion 822a-1, a bellows placement portion 822a-2, an adsorption port 822a-3, and an exhaust port 822a-4.
基板安放部822a-1可以提供安放基板30的部分,且可以支撐基板30。此外,基板安放部822a-1可以從波紋管安放部822a-2凸出形成。從而,基板安放部822a-1可以比波紋管安放部822a-2更與膜10相鄰地配置。 The substrate placing portion 822a-1 may provide a portion for placing the substrate 30 and may support the substrate 30. In addition, the substrate placement portion 822a-1 may be formed to protrude from the bellows placement portion 822a-2. Therefore, the substrate mounting part 822a-1 can be arranged adjacent to the film 10 rather than the bellows mounting part 822a-2.
波紋管安放部822a-2可以提供安放波紋管822b的部分。這樣的波紋管安放部822a-2可以支撐波紋管822b。此外,波紋管安放部822a-2可以形成有凸台,以安放波紋管822b。 The bellows receiving portion 822a-2 may provide a portion to receive the bellows 822b. Such bellows receiving portion 822a-2 can support the bellows 822b. In addition, the bellows placing portion 822a-2 may be formed with a boss to place the bellows 822b.
吸附口822a-3可以配置為用於將基板30吸附於基板安放部822a-1。這樣的吸附口822a-3可以形成於基板安放部822a-1。例如,吸附口822a-3可以形成於基板安放部822a-1的中心部。這樣的吸附口822a-3可以與吸附通道824a連通,且吸附口822a-3周圍的氣體可以通過吸附通道824a被排出至外部。作 為更詳細的示例,當基板30被安放在基板安放部822a-1時,吸附口822a-3的一側可以被基板30阻隔,而另一側可以與吸附通道824a連通。之後,當模20被加壓於基板30並從基板30分離模20時,可以通過吸附泵824b在吸附口822a-3周圍形成真空。因此,基板30可以被吸附於吸附口822a-3,從而不會從基板安放部822a-1脫離。 The adsorption port 822a-3 may be configured to adsorb the substrate 30 to the substrate placement portion 822a-1. Such an adsorption port 822a-3 may be formed in the substrate placement portion 822a-1. For example, the suction port 822a-3 may be formed in the center of the substrate placement portion 822a-1. Such adsorption port 822a-3 may be connected to the adsorption channel 824a, and the gas around the adsorption port 822a-3 may be discharged to the outside through the adsorption channel 824a. do For a more detailed example, when the substrate 30 is placed in the substrate placement portion 822a-1, one side of the adsorption port 822a-3 may be blocked by the substrate 30, and the other side may be connected to the adsorption channel 824a. Thereafter, when the mold 20 is pressurized to the substrate 30 and separated from the substrate 30, a vacuum may be formed around the adsorption port 822a-3 by the adsorption pump 824b. Therefore, the substrate 30 can be adsorbed to the adsorption port 822a-3 without being detached from the substrate placement portion 822a-1.
排氣口822a-4可以配置為用於向外部排出殘留於波紋管822b的內部的氣體。這樣的排氣口822a-4可以提供向外部排出殘留於波紋管822b包圍基板30的空間的氣體的通道。此外,排氣口822a-4的一側可以與波紋管822b的內部空間連通,另一側可以與排氣部823連通。這樣的排氣口822a-4可以形成於波紋管安放部822a-2。 The exhaust port 822a-4 may be configured to exhaust gas remaining inside the bellows 822b to the outside. Such exhaust port 822 a - 4 can provide a passage to discharge gas remaining in the space surrounding the substrate 30 by the bellows 822 b to the outside. In addition, one side of the exhaust port 822a-4 may be connected to the internal space of the bellows 822b, and the other side may be connected to the exhaust part 823. Such exhaust port 822a-4 may be formed in the bellows placement portion 822a-2.
參照圖9b,波紋管822b可以在使模20與基板30壓接時朝向第一壓接單元821伸縮來使基板30周圍的空間相對於外部密閉。這樣的波紋管822b可以配置為一端部支撐於波紋管安放部822a-2,另一端部能夠相對於第二壓接體822a伸縮。此外,波紋管822b可以配置為能夠伸縮。換言之,波紋管822b可以朝向第一壓接單元821伸長,以使基板30周圍的空間相對於外部密閉。此時,波紋管822b可以包圍基板30,且朝向波紋管822b的第一壓接單元821伸長的端部可以與第一壓接體821a貼緊。如此,波紋管822b與第一壓接體821a貼緊,從而基板30可以與外部阻隔。此外,波紋管822b可以在模20的圖案壓接於基板30時縮小。這樣的波紋管822b可以通過升降缸822c伸長或縮小。 Referring to FIG. 9 b , the bellows 822 b can expand and contract toward the first pressing unit 821 when the mold 20 is pressed against the substrate 30 to seal the space around the substrate 30 relative to the outside. Such a bellows 822b may be configured such that one end is supported by the bellows placement portion 822a-2 and the other end is expandable and contractible relative to the second crimping body 822a. Additionally, bellows 822b may be configured to telescope. In other words, the bellows 822b may be elongated toward the first crimping unit 821 so that the space around the substrate 30 is sealed with respect to the outside. At this time, the bellows 822b can surround the substrate 30, and the end portion extending toward the first crimping unit 821 of the bellows 822b can be in close contact with the first crimping body 821a. In this way, the bellows 822b is in close contact with the first crimping body 821a, so that the substrate 30 can be isolated from the outside. Additionally, the bellows 822b may shrink when the pattern of the mold 20 is pressed against the substrate 30. Such bellows 822b can be extended or contracted by the lifting cylinder 822c.
可以在這樣的波紋管822b形成能夠插入待後述的第二壓接密封部件826b的第二密封槽822b-1。這樣的第二密封槽822b-1可以在第一壓接單元 821與第二壓接單元822貼緊時,與第一密封槽821a-1的位置對應地形成於波紋管822b。 The bellows 822b may be formed with a second seal groove 822b-1 into which a second pressure-contact sealing member 826b to be described later can be inserted. Such a second sealing groove 822b-1 can be formed in the first crimping unit When 821 is in close contact with the second crimping unit 822, the bellows 822b is formed corresponding to the position of the first sealing groove 821a-1.
升降缸822c可以使波紋管822b的一端部升降來使波紋管822b伸縮。例如,升降缸822c可以在將圖案壓接於基板30時升降來使波紋管822b伸長,而在圖案被壓接於基板30後可以下降來使波紋管822b縮小。這樣的升降缸822c可以支撐於第二壓接體822a。 The lifting cylinder 822c can raise and lower one end of the bellows 822b to expand and contract the bellows 822b. For example, the lifting cylinder 822c can be raised and lowered to extend the bellows 822b when the pattern is pressed onto the substrate 30, and can be lowered to shrink the bellows 822b after the pattern is pressed onto the substrate 30. Such a lifting cylinder 822c may be supported on the second crimping body 822a.
第二支撐部822d可以支撐第二壓接體822a,且可以被第二驅動器825b支撐。此外,可以通過第二導向部件822e對第二支撐部822d的移動進行導向。換言之,第二支撐部822d能夠滑動移動地結合於第二導向部件822e,從而第二支撐部822d可以沿第二導向部件822e移動。如此,第二支撐部822d可以沿第二導向部件822e移動來相對於框架810移動。換言之,第二支撐部822d可以通過第二驅動器825b升降來與第二壓接體822a一同相對於框架810升降。 The second support part 822d may support the second crimping body 822a and may be supported by the second driver 825b. In addition, the movement of the second support portion 822d can be guided by the second guide member 822e. In other words, the second support portion 822d is slidably coupled to the second guide member 822e, so that the second support portion 822d can move along the second guide member 822e. In this way, the second support portion 822d can move along the second guide member 822e to move relative to the frame 810. In other words, the second support portion 822d can be raised and lowered by the second driver 825b to be raised and lowered relative to the frame 810 together with the second crimping body 822a.
第二導向部件822e可以對第二支撐部822d的移動進行導向。這樣的第二導向部件822e可以固定支撐於第二框架部812,且可以向上下方向延伸形成。例如,第二導向部件822e可以是向一方向延伸形成的軌條(rail)形態。第二支撐部822d沿這樣的支撐於框架810的第二導向部件822e部件移動,從而第二支撐部822d能夠相對於框架810升降。 The second guide member 822e can guide the movement of the second support portion 822d. Such a second guide member 822e may be fixedly supported on the second frame part 812 and may extend in an up-and-down direction. For example, the second guide member 822e may be in the form of a rail extending in one direction. The second support portion 822d moves along the second guide member 822e supported on the frame 810, so that the second support portion 822d can move up and down relative to the frame 810.
排氣部823可以在使基板30周圍的空間相對於外部密閉時向外部排出殘留於波紋管822b的內部中密閉的空間的氣體。換言之,排氣部823可以向外部排出殘留於波紋管822b與第一壓接單元821之間,即波紋管822b包圍基板30的空間的氣體來在基板30周圍形成規定的真空狀態。這樣的排氣部823可以包括排氣通道823a及排氣泵823b。 The exhaust part 823 can discharge the gas remaining in the sealed space inside the bellows 822b to the outside when the space around the substrate 30 is sealed with respect to the outside. In other words, the exhaust part 823 can exhaust the gas remaining between the bellows 822b and the first pressure bonding unit 821 to the outside, that is, the space in which the bellows 822b surrounds the substrate 30, to form a predetermined vacuum state around the substrate 30. Such exhaust part 823 may include an exhaust passage 823a and an exhaust pump 823b.
排氣通道823a可以提供用於從波紋管822b的內側流入的氣體向外部流動的通道。這樣的排氣通道823a的一側可以與波紋管822b的內側連通,另一側可以通過排氣泵823b與外部連通。此外,排氣泵823b可以通過排氣通道823a向外部移送波紋管822b的內側的氣體。 The exhaust passage 823a may provide a passage for gas flowing in from the inside of the bellows 822b to flow to the outside. One side of the exhaust passage 823a can be connected to the inside of the bellows 822b, and the other side can be connected to the outside through the exhaust pump 823b. In addition, the exhaust pump 823b can move the gas inside the bellows 822b to the outside through the exhaust passage 823a.
吸附部824可以在從基板30分離被壓接於基板30的模20時將基板30吸附於基板安放部822a-1,以防止基板30從基板安放部822a-1脫離。換言之,吸附部824可以在模分離單元830從基板30分離模20時吸附基板30,從而通過防止膜10的粘接防止基板30從基板安放部822a-1脫離。例如,吸附部824可以通過真空壓力來吸附基板30。但是,這只是一示例,本發明的思想並不因此而受限,可以採用能夠將基板30吸附於基板安放部822a-1的周知的技術。吸附部824可以包括吸附通道824a及吸附泵824b。 The adsorption part 824 can adsorb the substrate 30 to the substrate placement part 822a-1 when the mold 20 pressed against the substrate 30 is separated from the substrate 30 to prevent the substrate 30 from being detached from the substrate placement part 822a-1. In other words, the adsorption portion 824 can adsorb the substrate 30 when the mold separation unit 830 separates the mold 20 from the substrate 30 , thereby preventing the substrate 30 from being detached from the substrate placement portion 822 a - 1 by preventing the adhesion of the film 10 . For example, the adsorption part 824 may adsorb the substrate 30 using vacuum pressure. However, this is just an example, and the idea of the present invention is not limited thereto. A well-known technology capable of adsorbing the substrate 30 to the substrate placement portion 822a-1 may be used. The adsorption part 824 may include an adsorption channel 824a and an adsorption pump 824b.
吸附通道824a可以提供用於從基板安放部822a-1周圍流入的氣體通過吸附泵824b向外部流動的通道。這樣的吸附通道824a的一側可以通過吸附口822a-3與基板安放部822a-1的周圍連通,另一側可以通過吸附泵824b與外部連通。例如,當基板30被安放在基板安放部822a-1時,吸附通道824a的一側可以被基板30阻隔,而另一側可以與外部連通。此外,當基板30的一部分從基板安放部822a-1隔開時,吸附通道824a可以與波紋管822b的內部連通。 The adsorption channel 824a may provide a channel for the gas flowing in from around the substrate placement portion 822a-1 to flow to the outside through the adsorption pump 824b. One side of the adsorption channel 824a can be connected to the surroundings of the substrate placement portion 822a-1 through the adsorption port 822a-3, and the other side can be connected to the outside through the adsorption pump 824b. For example, when the substrate 30 is placed in the substrate placement portion 822a-1, one side of the adsorption channel 824a may be blocked by the substrate 30, and the other side may be connected to the outside. In addition, when a portion of the substrate 30 is spaced apart from the substrate placement portion 822a-1, the adsorption channel 824a may communicate with the inside of the bellows 822b.
吸附泵824b可以向外部移送基板安放部822a-1周圍的氣體。例如,吸附泵824b可以是真空泵。從而,通過由吸附泵824b生成的真空,可以在吸附口822a-3周圍產生真空,可以通過這樣的真空壓力將基板30吸附於基板安放部822a-1。從而,當通道824a的一側通過吸附口822a-3與基板30的周圍連通時,可以通過吸附泵824b將基板30吸附於吸附口822a-3。 The adsorption pump 824b can transfer the gas around the substrate placement portion 822a-1 to the outside. For example, adsorption pump 824b may be a vacuum pump. Therefore, the vacuum generated by the adsorption pump 824b can generate a vacuum around the adsorption port 822a-3, and the substrate 30 can be adsorbed to the substrate placement portion 822a-1 by such vacuum pressure. Therefore, when one side of the channel 824a is connected to the surroundings of the substrate 30 through the adsorption port 822a-3, the substrate 30 can be adsorbed to the adsorption port 822a-3 by the adsorption pump 824b.
驅動部825可以使第一壓接單元821及第二壓接單元822相對於彼此移動。這樣的驅動部825可以包括以使第一壓接單元821移動的方式進行驅動的時第一驅動器825a、以及以使第二壓接單元822移動的方式進行驅動的第二驅動器825b。 The driving part 825 can move the first crimping unit 821 and the second crimping unit 822 relative to each other. Such a driving part 825 may include a first driver 825a that drives the first crimping unit 821 and a second driver 825b that drives the second crimping unit 822.
第一驅動器825a可以使第一壓接單元821升降,且可以根據第一壓接單元821的位置調節第一壓接單元821移動的速度。此外,第二驅動器825b可以使第二壓接單元822升降,且可以根據第二壓接單元822的位置調節第二壓接單元822移動的速度。關於如此由第一驅動器825a及第二驅動器825b根據第一壓接單元821及第二壓接單元822的位置調節速度的配置,將在後面進行描述。 The first driver 825a can raise and lower the first crimping unit 821, and can adjust the moving speed of the first crimping unit 821 according to the position of the first crimping unit 821. In addition, the second driver 825b can raise and lower the second crimping unit 822, and can adjust the moving speed of the second crimping unit 822 according to the position of the second crimping unit 822. The configuration in which the first driver 825a and the second driver 825b adjust the speed according to the positions of the first and second crimping units 821 and 822 will be described later.
再次參照圖9a,壓接密封部826可以在第一壓接單元821與第二壓接單元822相對於彼此進行壓接時使第一壓接單元821與第二壓接單元822之間密閉。這樣的壓接密封部826可以使第一壓接單元821與第二壓接單元822之間密閉來阻隔基板30的周圍與外部。壓接密封部826可以包括第一壓接密封部件826a及第二壓接密封部件826b。 Referring again to FIG. 9a , the crimping sealing portion 826 may seal between the first crimping unit 821 and the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are crimped relative to each other. Such a pressure-bonding sealing portion 826 can seal the first pressure-bonding unit 821 and the second pressure-bonding unit 822 to isolate the surroundings and the outside of the substrate 30 . The pressure seal part 826 may include a first pressure seal part 826a and a second pressure seal part 826b.
第一壓接密封部件826a可以插入配置於形成在第一壓接單元821的第一密封槽821a-1。此外,第二壓接密封部件826b可以插入配置於形成在第二壓接單元822的第二密封槽822b-1。這樣的第一壓接密封部件826a和第二壓接密封部件826b可以配置為彼此相向。換言之,當第一壓接單元821與第二壓接單元822相互進行壓接時,第一壓接密封部件826a與第二壓接密封部件826b可以對彼此加壓,且可以密封第一壓接單元821與第二壓接單元822之間的間隙。 The first pressure-bonding sealing member 826a can be inserted and disposed in the first sealing groove 821a-1 formed in the first pressure-bonding unit 821. In addition, the second pressure-bonding sealing member 826b may be inserted and disposed in the second sealing groove 822b-1 formed in the second pressure-bonding unit 822. Such first pressure-contact sealing member 826a and second pressure-contact sealing member 826b may be arranged to face each other. In other words, when the first crimping unit 821 and the second crimping unit 822 crimp each other, the first crimping sealing part 826a and the second crimping sealing part 826b may pressurize each other and may seal the first crimping unit. The gap between the unit 821 and the second pressing unit 822.
另一方面,當第一壓接密封部件826a與第二壓接密封部件826b相互貼緊時,膜10可以介於第一壓接密封部件826a與第二壓接密封部件826b之 間。此外,第一壓接密封部件826a可以在膜10的上部對膜10,第二壓接密封部件826b可以在膜10的下部對膜10加壓。此時,第一壓接密封部件826a及第二壓接密封部件826b可以形成為具有既防止第一壓接密封部件826a與第二壓接密封部件826b的加壓使膜10起皺又能夠有效地密封第一壓接單元821與第二壓接單元822之間的間隙的形狀。 On the other hand, when the first crimp sealing component 826a and the second crimping sealing component 826b are in close contact with each other, the membrane 10 may be interposed between the first crimping sealing component 826a and the second crimping sealing component 826b. between. In addition, the first pressure sealing member 826a may pressurize the film 10 at an upper portion of the film 10, and the second pressure sealing member 826b may pressurize the film 10 at a lower portion of the film 10. At this time, the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b may be formed to effectively prevent the film 10 from wrinkling due to the pressure applied by the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b. The shape of the gap between the first crimping unit 821 and the second crimping unit 822 is effectively sealed.
例如,當第一壓接密封部件826a及第二壓接密封部件826b形成為相同的O型環(O-ring)形狀時,第一壓接密封部件826a與第二壓接密封部件826b貼緊時可能會使膜10起皺。作為另一示例,當第一壓接密封部件826a與第二壓接密封部件826b相互接觸的面形成為平面形狀時,可以防止膜10起皺。然而,可能會因第一壓接密封部件826a與第二壓接密封部件826b之間的加壓力較弱而無法正常地對第一壓接單元821與第二壓接單元822之間進行密封。因此,第一壓接密封部件826a與第二壓接密封部件826b有必要形成為彼此不同的形狀,以便既防止膜10起皺又使波紋管822b的內部空間密閉。例如,第一壓接密封部件826a及第二壓接密封部件826b中的某一個可以在不與另一個貼緊時具有平面形狀,另一個可以在不與所述某一個貼緊時具有O型環等圓弧形狀。 For example, when the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are formed in the same O-ring shape, the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are in close contact with each other. This may cause the membrane 10 to wrinkle. As another example, when the mutual contact surfaces of the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are formed into a planar shape, the film 10 can be prevented from being wrinkled. However, the first pressure-bonding unit 821 and the second pressure-bonding unit 822 may not be properly sealed because the pressing force between the first pressure-bonding sealing member 826a and the second pressure-bonding sealing member 826b is weak. Therefore, it is necessary to form the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b into shapes different from each other in order to prevent the film 10 from wrinkling and to seal the internal space of the bellows 822b. For example, one of the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b may have a planar shape when not in close contact with the other, and the other may have an O-shaped shape when not in contact with the one. Ring and other arc shapes.
如此,壓接密封部826具有防止膜10起皺的效果。 In this way, the pressure-contact sealing portion 826 has the effect of preventing the film 10 from wrinkling.
參照圖10至圖12,模分離單元830可以向一方向(例如,圖10的左右方向)移動,以從基板30分離被壓接於基板30的模20。這樣的模分離單元830可以在膜供給部400及膜回收部900中的一個以上未旋轉以使膜10的移動停止的狀態下向基板30側移動來從基板30分離模20。此外,在第一壓接單元821與第二壓接單元822之間,模分離單元830可以將基板30移動至壓接於模20的虛擬的空間來從基板30分離模20。而且,模分離單元830能夠將在作為在一面粘接有 形成有圖案的模20的膜10的兩面中的一面的相反側的膜10的另一面支撐膜的第一輥部831移動至基板30側來從基板30分離被壓接於基板30的模20。模分離單元830可以包括第一輥部831、第二輥部832、輥支撐部833、輥導向部件834以及輥驅動器835。 Referring to FIGS. 10 to 12 , the mold separation unit 830 may move in one direction (for example, the left-right direction in FIG. 10 ) to separate the mold 20 that is pressed against the base plate 30 from the base plate 30 . Such mold separation unit 830 can move toward the substrate 30 side to separate the mold 20 from the substrate 30 in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . In addition, between the first crimping unit 821 and the second crimping unit 822 , the mold separation unit 830 can move the substrate 30 to a virtual space that is crimped to the mold 20 to separate the mold 20 from the substrate 30 . Furthermore, the mold separation unit 830 can separate the one surface with the The first roller part 831 supporting the film on the opposite side of one of the two surfaces of the film 10 of the mold 20 on which the pattern is formed moves to the substrate 30 side to separate the mold 20 pressed against the substrate 30 from the substrate 30 . The mold separation unit 830 may include a first roller part 831, a second roller part 832, a roller support part 833, a roller guide part 834, and a roller driver 835.
第一輥部831可以在膜10的兩面中未粘接有模20的一面(非粘接面)支撐膜10。這樣的第一輥部831可以被輥支撐部833支撐,且與輥支撐部833一同向左右方向移動。 The first roller part 831 can support the film 10 on one side (non-adhesive side) to which the mold 20 is not adhered among both sides of the film 10 . Such first roller portion 831 can be supported by the roller support portion 833 and can move in the left and right direction together with the roller support portion 833 .
第二輥部832可以在膜10的兩面中粘接有模20的面(粘接面)側支撐膜10。此外,第二輥部832可以以使膜10向包圍第一輥部831的一部分的方向彎曲的方式支撐膜10。這樣的第二輥部832可以被輥支撐部833支撐,且與輥支撐部833一同向左右方向移動。此外,第二輥部832可以以與第一輥部831具有規定的高度差的方式支撐於輥支撐部833。如此,第一輥部831與第二輥部832具有高度差地支撐膜10的兩面,從而可以從基板30分離模20。此外,第一輥部831的旋轉中心軸與第二輥部832的旋轉中心軸的距離可以形成得比模20的長度長。這可以防止通過第一輥部831從基板30分離的模20與第二輥部832接觸。 The second roller part 832 can support the film 10 on the side (adhesive surface) of the two surfaces of the film 10 to which the mold 20 is bonded. In addition, the second roller part 832 may support the film 10 so that the film 10 is bent in a direction surrounding a part of the first roller part 831 . Such second roller part 832 can be supported by the roller support part 833 and can move in the left-right direction together with the roller support part 833. In addition, the second roller part 832 may be supported by the roller support part 833 with a predetermined height difference from the first roller part 831 . In this way, the first roller part 831 and the second roller part 832 support both surfaces of the film 10 with a height difference, so that the mold 20 can be separated from the substrate 30 . In addition, the distance between the rotation center axis of the first roller part 831 and the rotation center axis of the second roller part 832 may be formed longer than the length of the mold 20 . This can prevent the mold 20 separated from the substrate 30 by the first roller part 831 from coming into contact with the second roller part 832 .
輥支撐部833可以支撐第一輥部831及第二輥部832,且可以被輥驅動器835支撐。此外,輥支撐部833可以通過輥驅動器835向左右方向移動,且可以由輥導向部件834對輥支撐部833的移動進行導向。這樣的輥支撐部833可以沿輥導向部件834移動來相對於框架810移動。換言之,輥支撐部833可以通過輥驅動器835移動來與第一輥部831、第二輥部832一同相對於框架810移動。 The roller support part 833 may support the first roller part 831 and the second roller part 832 and may be supported by the roller driver 835 . In addition, the roller support part 833 can be moved in the left and right direction by the roller driver 835, and the movement of the roller support part 833 can be guided by the roller guide member 834. Such roller support portion 833 can move along roller guide member 834 to move relative to frame 810 . In other words, the roller support portion 833 can be moved by the roller driver 835 to move relative to the frame 810 together with the first roller portion 831 and the second roller portion 832 .
輥導向部件834可以對輥支撐部833的移動進行導向。這樣的輥導向部件834可以固定支撐於第三框架部813,且可以向左右方向延伸形成。例如, 輥導向部件834可以是向一方向延伸形成的軌條(rail)形態。輥支撐部833沿這樣的支撐於框架810的輥導向部件834部件移動,從而輥支撐部833能夠相對於框架810升降。 The roller guide member 834 can guide the movement of the roller support portion 833 . Such roller guide member 834 may be fixedly supported on the third frame part 813 and may be formed to extend in the left-right direction. For example, The roller guide member 834 may be in the form of a rail extending in one direction. The roller support portion 833 moves along the roller guide member 834 supported on the frame 810 so that the roller support portion 833 can move up and down relative to the frame 810 .
輥驅動器835可以使輥支撐部833向一方向移動,以從基板30分離模20。這樣的輥驅動器835可以支撐於框架810,且可以支撐輥支撐部833。如此,輥驅動器835使輥支撐部833移動,從而能夠使第一輥部831、第二輥部832朝向模20移動。 The roller driver 835 can move the roller support portion 833 in one direction to separate the mold 20 from the substrate 30 . Such a roller driver 835 may be supported on the frame 810 and may support the roller support 833 . In this way, the roller driver 835 moves the roller support part 833 and can move the first roller part 831 and the second roller part 832 toward the mold 20 .
檢測單元840可以檢測第一壓接單元821、第二壓接單元822及模分離單元830的位置。這樣的檢測單元840可以檢測第一壓接單元821、第二壓接單元822及模分離單元830的第一停止位置、第二停止位置及減速位置,且可以將檢測到的位置資訊傳遞至控制部。這樣的檢測單元840可以包括第1感測器部841、第2感測器部842、以及第3感測器部843。 The detection unit 840 may detect the positions of the first crimping unit 821, the second crimping unit 822, and the mold separation unit 830. Such a detection unit 840 can detect the first stop position, the second stop position and the deceleration position of the first crimping unit 821, the second crimping unit 822 and the mold separation unit 830, and can pass the detected position information to the control department. Such detection unit 840 may include a first sensor part 841, a second sensor part 842, and a third sensor part 843.
再次參照圖8和圖9,第1感測器部841可以檢測第一壓接單元821的第一停止位置、第二停止位置及減速位置,且可以將檢測到的位置資訊傳遞至控制部。這樣的第1感測器部841可以包括第1-1感測器841a、第1-2感測器841b、以及第1-3感測器841c。 Referring again to FIGS. 8 and 9 , the first sensor part 841 can detect the first stop position, the second stop position and the deceleration position of the first crimping unit 821 , and can transmit the detected position information to the control part. Such first sensor unit 841 may include a 1-1st sensor 841a, a 1-2nd sensor 841b, and a 1-3rd sensor 841c.
第1感測器部841的第1-1感測器841a可以檢測第一壓接單元821的第一停止位置。這裡,第1-1感測器841a可以被命名為第一壓接單元821的第一停止位置檢測感測器841a。此外,第一壓接單元821的第一停止位置可以被命名為第一壓接步驟開始位置,第1感測器部841的第1-1感測器841a可以被命名為第一壓接步驟開始位置檢測感測器841a。此外,第一停止位置指第一壓接單元821朝向膜10移動之前的位置,即第一壓接單元821的原位置。當第一壓接單元821為 原位置狀態時,這樣的第1感測器部841的第1-1感測器841a可以檢測第一壓接單元821的位置。此外,第1感測器部841的第1-1感測器841a可以支撐於框架810。 The 1-1th sensor 841a of the first sensor part 841 can detect the first stop position of the first crimping unit 821. Here, the 1-1th sensor 841a may be named as the first stop position detection sensor 841a of the first crimping unit 821. In addition, the first stop position of the first crimping unit 821 may be named as the first crimping step starting position, and the 1-1 sensor 841a of the first sensor part 841 may be named as the first crimping step. Start position detection sensor 841a. In addition, the first stop position refers to the position before the first crimping unit 821 moves toward the film 10 , that is, the original position of the first crimping unit 821 . When the first crimping unit 821 is In the original position state, the 1-1st sensor 841a of the first sensor part 841 can detect the position of the first pressure bonding unit 821. In addition, the 1-1st sensor 841a of the 1st sensor part 841 may be supported by the frame 810.
第1感測器部841的第1-2感測器841b可以檢測第一壓接單元821的第二停止位置。這裡,第1-2感測器841b可以被命名為第一壓接單元821的第二停止位置檢測感測器841b。此外,第一壓接單元821的第二停止位置可以被命名為第二壓接步驟結束位置,第1感測器部841的第1-2感測器841b可以被命名為第二壓接步驟結束位置檢測感測器841b。此外,第二停止位置指第一壓接單元821朝向膜10移動並由第一壓接單元821將模20加壓於基板30後,即與第二壓接單元822貼緊的位置。從而,第1-2感測器841b可以在第一壓接單元821與第二壓接單元822貼緊時檢測第一壓接單元821的位置。此外,第1-2感測器841b可以支撐於框架810。 The 1st-2nd sensor 841b of the 1st sensor part 841 can detect the 2nd stop position of the 1st crimping unit 821. Here, the 1-2th sensor 841b may be named the second stop position detection sensor 841b of the first crimping unit 821. In addition, the second stop position of the first crimping unit 821 may be named as the second crimping step end position, and the 1-2 sensor 841b of the first sensor part 841 may be named as the second crimping step. End position detection sensor 841b. In addition, the second stop position refers to the position in close contact with the second pressure bonding unit 822 after the first pressure bonding unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first pressure bonding unit 821 . Therefore, the 1-2nd sensor 841b can detect the position of the first pressing unit 821 when the first pressing unit 821 and the second pressing unit 822 are in close contact. In addition, the 1-2th sensor 841b may be supported on the frame 810.
第1感測器部841的第1-3感測器841c可以檢測第一壓接單元821的減速位置。這裡,第1-3感測器841c可以被命名為第一壓接單元821的減速位置檢測感測器841c。此外,第一壓接單元821的減速位置可以被命名為第一減速位置,第1感測器部841的第1-3感測器841c以被命名為第一減速檢測感測器841c。此外,減速位置指第一壓接單元821從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前第一壓接單元821開始減速的位置。此外,減速位置指第一壓接單元821朝向膜10移動並由第一壓接單元821將模20加壓於基板30之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外,第1-3感測器841c可以以配置於第1-1感測器841a與第1-2感測器841b之間的方式支撐於框架810。 The 1st-3rd sensor 841c of the 1st sensor part 841 can detect the deceleration position of the 1st crimping unit 821. Here, the 1-3th sensor 841c may be named as the deceleration position detection sensor 841c of the first crimping unit 821. In addition, the deceleration position of the first crimping unit 821 may be named the first deceleration position, and the 1-3 sensors 841c of the first sensor part 841 may be named the first deceleration detection sensor 841c. In addition, the deceleration position refers to a position where the first crimping unit 821 starts to decelerate before reaching the second stop position when the first crimping unit 821 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the first pressing unit 821 moves toward the film 10 and presses the mold 20 against the substrate 30 by the first pressing unit 821 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 1-3rd sensor 841c may be supported on the frame 810 so as to be disposed between the 1-1st sensor 841a and the 1-2nd sensor 841b.
參照圖13,第2感測器部842可以檢測第二壓接單元822的第一停止位置、第二停止位置以及減速位置,且可以將檢測到的位置資訊傳遞至控制部。這樣的第2感測器部842可以包括第2-1感測器842a、第2-2感測器842b,第2-3感測器842c。 Referring to FIG. 13 , the second sensor part 842 can detect the first stop position, the second stop position and the deceleration position of the second crimping unit 822 , and can transmit the detected position information to the control part. Such a second sensor unit 842 may include a 2-1st sensor 842a, a 2-2nd sensor 842b, and a 2-3rd sensor 842c.
第2感測器部842的第2-1感測器842a可以檢測第二壓接單元822的第一停止位置。這裡,第2-1感測器842a可以被命名為第二壓接單元822的第一停止位置檢測感測器842a。此外,第二壓接單元822的第一停止位置可以被命名為第二壓接步驟開始位置,第2感測器部842的第2-1感測器842a可以被命名為第二壓接步驟開始位置檢測感測器842a。此外,第一停止位置指第二壓接單元822朝向膜10移動之前的位置,即第二壓接單元822的原位置。當第二壓接單元822為原位置狀態時,這樣的第2感測器部842的第2-1感測器842a可以檢測第二壓接單元822的位置。此外,第2感測器部842的第2-1感測器842a可以支撐於框架810。 The 2-1 sensor 842a of the second sensor part 842 can detect the first stop position of the second crimping unit 822. Here, the 2-1th sensor 842a may be named as the first stop position detection sensor 842a of the second crimping unit 822. In addition, the first stop position of the second crimping unit 822 may be named as the second crimping step starting position, and the 2-1 sensor 842a of the second sensor part 842 may be named as the second crimping step. Start position detection sensor 842a. In addition, the first stop position refers to the position before the second pressing unit 822 moves toward the film 10 , that is, the original position of the second pressing unit 822 . When the second crimping unit 822 is in the home position state, the 2-1 sensor 842a of the second sensor part 842 can detect the position of the second crimping unit 822. In addition, the 2-1 sensor 842a of the second sensor part 842 may be supported by the frame 810.
第2感測器部842的第2-2感測器842b可以檢測第二壓接單元822的第二停止位置。這裡,第2-2感測器842b可以被命名為第二壓接單元822的第二停止位置檢測感測器842b。此外,第二壓接單元822的第二停止位置可以被命名為第二壓接步驟結束位置,第2感測器部842的第2-2感測器842b可以被命名為第二壓接步驟結束位置檢測感測器842b。此外,第二停止位置指第二壓接單元822朝向膜10移動並由第二壓接單元822將基板30加壓於模20後,即與第一壓接單元821貼緊的位置。從而,第2感測器部842的第2-2感測器842b可以在第一壓接單元821與第二壓接單元822貼緊時檢測第二壓接單元822的位置。此外,第2感測器部842的第2-2感測器842b可以支撐於框架810。 The 2-2 sensor 842b of the second sensor part 842 can detect the second stop position of the second crimping unit 822. Here, the 2-2th sensor 842b may be named as the second stop position detection sensor 842b of the second crimping unit 822. In addition, the second stop position of the second crimping unit 822 may be named as the second crimping step end position, and the 2-2 sensor 842b of the second sensor part 842 may be named as the second crimping step. End position detection sensor 842b. In addition, the second stop position refers to the position where the second pressing unit 822 is in close contact with the first pressing unit 821 after it moves toward the film 10 and presses the substrate 30 against the mold 20 by the second pressing unit 822 . Therefore, the 2-2 sensor 842b of the second sensor part 842 can detect the position of the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are in close contact. In addition, the 2nd-2nd sensor 842b of the 2nd sensor part 842 may be supported by the frame 810.
第2感測器部842的第2-3感測器842c可以檢測第二壓接單元822的減速位置。這裡,第2-3感測器842c可以被命名為第二壓接單元822的減速位置檢測感測器842c。此外,第二壓接單元822的減速位置可以被命名為第二減速位置,第2感測器部842的第2-3感測器842c可以被命名為第二減速檢測感測器842c。此外,減速位置指第二壓接單元822從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前第二壓接單元822開始減速的位置。此外,減速位置指第二壓接單元822朝向膜10移動並由第二壓接單元822將基板30加壓於模20之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外,第2感測器部842的第2-3感測器842c可以以配置於第2-1感測器842a與第2-2感測器842b之間的方式支撐於框架810。此外,第2感測器部842的第2-3感測器842c可以與波紋管822b的伸縮連動。例如,當先檢測第2感測器部842的第2-1感測器842a後檢測第2感測器部842的第2-3感測器842c時,波紋管822b可以伸長;當先檢測第2感測器部842的第2-2感測器842b後檢測第2感測器部842的第2-3感測器842c時,波紋管822b可以縮小。 The 2-3 sensor 842c of the second sensor part 842 can detect the deceleration position of the second crimping unit 822. Here, the 2-3rd sensor 842c may be named as the deceleration position detection sensor 842c of the second crimping unit 822. In addition, the deceleration position of the second crimping unit 822 may be named the second deceleration position, and the 2-3 sensor 842c of the second sensor part 842 may be named the second deceleration detection sensor 842c. In addition, the deceleration position refers to a position where the second crimping unit 822 starts to decelerate before reaching the second stop position when the second crimping unit 822 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the second pressing unit 822 moves toward the film 10 and presses the substrate 30 against the mold 20 by the second pressing unit 822 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 2-3rd sensor 842c of the second sensor part 842 may be supported on the frame 810 so as to be disposed between the 2-1st sensor 842a and the 2-2nd sensor 842b. In addition, the second-third sensor 842c of the second sensor unit 842 may be synchronized with the expansion and contraction of the bellows 822b. For example, when the 2-1 sensor 842a of the second sensor part 842 is detected first and then the 2-3 sensor 842c of the second sensor part 842 is detected, the bellows 822b can be extended; When the 2-2nd sensor 842b of the sensor unit 842 detects the 2-3rd sensor 842c of the second sensor unit 842, the bellows 822b can be reduced in size.
參照圖14,第3感測器部843可以檢測模分離單元830的第三停止位置、第二停止位置及減速位置,且可以將檢測到的位置資訊傳遞至控制部。這樣的第3感測器部843可以包括第3-1感測器843a、第3-2感測器843b、第3-3感測器843c。 Referring to FIG. 14 , the third sensor part 843 can detect the third stop position, the second stop position and the deceleration position of the mold separation unit 830 , and can transmit the detected position information to the control part. Such a third sensor unit 843 may include a 3-1st sensor 843a, a 3-2nd sensor 843b, and a 3-3rd sensor 843c.
第3感測器部843的第3-1感測器843a可以檢測模分離單元830的第一停止位置。這裡,第3-1感測器843a可以被命名為模分離單元830的第一停止位置檢測感測器843a。此外,模分離單元830的第一停止位置可以被命名為分離步驟開始位置,第3感測器部843的第3-1感測器843a可以被命名為分離步驟開始位 置檢測感測器843a。此外,第一停止位置指模分離單元830朝向模20移動之前的位置,即模分離單元830的原位置(參照圖14(a))。當模分離單元830為原位置狀態時,這樣的第3感測器部843的第3-1感測器843a可以檢測模分離單元830的位置。此外,第3感測器部843的第3-1感測器843a可以支撐於框架810。 The 3-1 sensor 843a of the third sensor unit 843 can detect the first stop position of the mold separation unit 830. Here, the 3-1th sensor 843a may be named as the first stop position detection sensor 843a of the mold separation unit 830. In addition, the first stop position of the mold separation unit 830 may be named a separation step start position, and the 3-1 sensor 843a of the third sensor part 843 may be named a separation step start position. Set detection sensor 843a. In addition, the first stop position refers to the position before the mold separation unit 830 moves toward the mold 20, that is, the original position of the mold separation unit 830 (see FIG. 14(a)). When the mold separation unit 830 is in the home position state, the 3-1 sensor 843a of the third sensor unit 843 can detect the position of the mold separation unit 830. In addition, the 3-1 sensor 843a of the third sensor part 843 may be supported on the frame 810.
第3感測器部843的第3-2感測器843b可以檢測模分離單元830的第二停止位置。這裡,第3-2感測器843b可以被命名為模分離單元830的第二停止位置檢測感測器843b。此外,模分離單元830的第二停止位置可以被命名為分離步驟結束位置,第3感測器部843的第3-2感測器843b可以被命名為分離步驟結束位置檢測感測器843b。此外,第二停止位置指模分離單元830從基板30分離模20後的位置(參照圖14(b))。此外,第3感測器部843的第3-2感測器843b可以支撐於框架810。 The 3-2 sensor 843b of the third sensor unit 843 can detect the second stop position of the mold separation unit 830. Here, the 3-2th sensor 843b may be named as the second stop position detection sensor 843b of the mold separation unit 830. In addition, the second stop position of the mold separation unit 830 may be named as the separation step end position, and the 3-2 sensor 843b of the third sensor part 843 may be named as the separation step end position detection sensor 843b. In addition, the second stop position refers to a position after the mold separation unit 830 separates the mold 20 from the substrate 30 (see FIG. 14(b) ). In addition, the 3-2 sensor 843b of the third sensor part 843 may be supported on the frame 810.
第3感測器部843的第3-3感測器843c可以檢測模分離單元830的減速位置。這裡,第3-3感測器843c可以被命名為模分離單元830的減速位置檢測感測器843c。此外,模分離單元830的減速位置可以被命名為第三減速位置,第3感測器部843的第3-3感測器843c可以被命名為第三減速檢測感測器843c。此外,減速位置指模分離單元830從第一停止位置移動至第二停止位置的過程中在到達第二停止位置之前模分離單元830開始減速的位置。此外,減速位置指模分離單元830從基板30分離模20之前的位置。這樣的減速位置可以位於第一停止位置與第二停止位置之間。此外,第3感測器部843的第3-3感測器843c可以以配置於第3-1感測器843a與第3-2感測器843b之間的方式支撐於框架810。 The 3rd-3rd sensor 843c of the 3rd sensor part 843 can detect the deceleration position of the mold separation unit 830. Here, the 3-3rd sensor 843c may be named as the deceleration position detection sensor 843c of the mold separation unit 830. In addition, the deceleration position of the mold separation unit 830 may be named the third deceleration position, and the 3-3 sensor 843c of the third sensor part 843 may be named the third deceleration detection sensor 843c. In addition, the deceleration position refers to a position at which the mold separation unit 830 starts to decelerate before reaching the second stop position when the mold separation unit 830 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the mold separation unit 830 separates the mold 20 from the substrate 30 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 3-3 sensor 843c of the third sensor part 843 may be supported on the frame 810 so as to be disposed between the 3-1 sensor 843a and the 3-2 sensor 843b.
如前述,檢測單元840可以檢測壓接模組820及模分離單元830的移動開始的位置、減速開始的位置、移動結束的位置,且可以將檢測到的位置 資訊傳遞至控制部。如此,由檢測單元840檢測到的位置資訊可以利用於控制驅動部825及輥驅動器835。此外,壓接模組820及模分離單元830可以對第一停止位置至減速位置進行移動速度的加速,並對減速位置至第二停止位置進行移動速度的減速。從而,可以通過檢測單元840調節壓接模組820及模分離單元830的移動速度。此外,可以僅在製程實際進行的位置進行對移動速度進行減速來提高製程的效率。此外,當第一壓接單元821及第二壓接單元822相對於彼此移動並相互貼緊時,可以通過檢測單元840調節第一壓接單元821及第二壓接單元822的移動速度,從而可以同時移動第一壓接單元821和第二壓接單元822,而不是依次移動第一壓接單元821和第二壓接單元822,由此能夠製程的效率。如此,檢測單元840僅在製程實際進行的位置進行移動速度的減速,從而具有能夠提高製程的效率的效果。 As mentioned above, the detection unit 840 can detect the movement start position, deceleration start position, and movement end position of the crimping module 820 and the mold separation unit 830, and can detect the detected positions. Information is passed to the control department. In this way, the position information detected by the detection unit 840 can be used to control the driving part 825 and the roller driver 835 . In addition, the crimping module 820 and the mold separation unit 830 may accelerate the movement speed from the first stop position to the deceleration position, and decelerate the movement speed from the deceleration position to the second stop position. Therefore, the moving speed of the crimping module 820 and the mold separation unit 830 can be adjusted through the detection unit 840 . In addition, the moving speed can be decelerated only at the position where the process is actually performed to improve the efficiency of the process. In addition, when the first crimping unit 821 and the second crimping unit 822 move relative to each other and are in close contact with each other, the moving speed of the first crimping unit 821 and the second crimping unit 822 can be adjusted through the detection unit 840, so that The first crimping unit 821 and the second crimping unit 822 can be moved simultaneously instead of sequentially, thereby improving process efficiency. In this way, the detection unit 840 only slows down the movement speed at the position where the process is actually performed, thereby having the effect of improving the efficiency of the process.
位置檢測部(未圖示)可以檢測模20的位置,且可以將檢測到的位置資訊傳遞至控制部。如此,由位置檢測部檢測到的模20的位置資訊可以利用於控制膜供給部400及膜回收部900。從而,當模20被移送而後位於脫模部700或轉印部800時,可以由位置檢測部對此進行檢測,並中斷膜供給部400及膜回收部900中的一個以上的旋轉來中止模20的移送。此外,位置檢測部可以配置於膜供給部400、保護膜回收部600、脫模部700、轉印部800、膜回收部900中的至少一部分之間。例如,位置檢測部可以通過識別膜10的標記的光感測器來檢測模20的位置,或通過光學設備來檢測模20的位置。 The position detection part (not shown) can detect the position of the mold 20 and can transmit the detected position information to the control part. In this way, the position information of the mold 20 detected by the position detection unit can be used to control the film supply unit 400 and the film recovery unit 900. Therefore, when the mold 20 is transferred and then positioned in the demoulding part 700 or the transfer part 800, the position detection part can detect this and interrupt the rotation of one or more of the film supply part 400 and the film recovery part 900 to stop the mold. 20 transfer. Moreover, the position detection part may be arrange|positioned between at least a part of the film supply part 400, the protective film recovery part 600, the demoulding part 700, the transfer part 800, and the film recovery part 900. For example, the position detection part may detect the position of the mold 20 through a photo sensor that recognizes the mark of the film 10, or detect the position of the mold 20 through an optical device.
在膜10上相鄰地配置的複數個模20之間的間距可以以分別位於蒸鍍模組720和轉印部800的方式和蒸鍍模組720與轉印部800之間的間距對應。換言之,蒸鍍模組720中模20所在的區域的中心點與轉印部800中模20所在的區 域的中心點之間的間距可以與貼附於膜10的複數個模20中相鄰地配置的模20的中心點之間的間距相同。例如,蒸鍍模組720中模20所在的區域的中心點可以是塗布空間T1的中心點。此外,轉印部800中模20所在的區域的中心點可以是能夠在第一壓接單元821與第二壓接單元822之間配置模20的虛擬的空間的中心點。因此,可以在轉印部800配置先行的模20,並在蒸鍍模組720配置後行的模20,從而可以在先行的模20在轉印部800進行製程的期間使後行的模20在蒸鍍模組720進行製程。此外,位置檢測部可以配置於蒸鍍模組720與轉印部800之間來檢測先行的模20位於轉印部800,且後行的模20位於蒸鍍模組720。 The distance between the plurality of molds 20 arranged adjacently on the film 10 may correspond to the distance between the vapor deposition module 720 and the transfer part 800 so that they are respectively located at the vapor deposition module 720 and the transfer part 800 . In other words, the center point of the area where the mold 20 is located in the evaporation module 720 is the same as the area where the mold 20 is located in the transfer unit 800 . The distance between the center points of the domains may be the same as the distance between the center points of adjacently arranged molds 20 among the plurality of molds 20 attached to the film 10 . For example, the center point of the area where the mold 20 is located in the evaporation module 720 may be the center point of the coating space T1. In addition, the center point of the area in which the mold 20 is located in the transfer unit 800 may be the center point of a virtual space in which the mold 20 can be disposed between the first pressure bonding unit 821 and the second pressure bonding unit 822 . Therefore, the leading mold 20 can be arranged in the transfer unit 800 , and the following mold 20 can be arranged in the evaporation module 720 , so that the following mold 20 can be used while the leading mold 20 is performing the process in the transfer unit 800 . The process is performed in the evaporation module 720. In addition, the position detection unit may be disposed between the evaporation module 720 and the transfer part 800 to detect that the preceding mold 20 is located in the transfer part 800 and the following mold 20 is located in the evaporation module 720 .
如此,轉印部800與蒸鍍模組720同時進行模20的製程,從而具有能夠提高製程的效率的效果。 In this way, the transfer unit 800 and the evaporation module 720 perform the process of the mold 20 at the same time, thereby having the effect of improving the efficiency of the process.
控制部可以控制壓接模組820及模分離單元830的驅動。這樣的控制部可以從檢測單元840接收壓接模組820及模分離單元830的位置資訊,且可以基於這樣的位置資訊來控制壓接模組820及模分離單元830的驅動。 The control unit can control the driving of the crimping module 820 and the mold separation unit 830 . Such a control part can receive the position information of the crimping module 820 and the mold separation unit 830 from the detection unit 840, and can control the driving of the crimping module 820 and the mold separation unit 830 based on such position information.
控制部可以為了向一方向移送膜10而控制膜供給部400及膜回收部900中的一個以上的驅動。這樣的控制部可以從位置檢測部接收所檢測到的模20的位置資訊,且可以基於這樣的位置資訊來控制膜供給部400及膜回收部900的驅動。 The control unit may control the driving of one or more of the film supply unit 400 and the film recovery unit 900 in order to transfer the film 10 in one direction. Such a control unit can receive the detected position information of the mold 20 from the position detection unit, and can control the driving of the film supply unit 400 and the film recovery unit 900 based on such position information.
控制部可以由包括微處理器的運算裝置、儲存介質、感測器、光學等測量裝置及記憶體來實現,由於其實現方式對所屬技術領域中具有通常知識者而言是顯而易見的,因而省略進一步的詳細的說明。 The control unit can be implemented by a computing device including a microprocessor, a storage medium, a sensor, an optical measurement device, and a memory. Since its implementation is obvious to those with ordinary knowledge in the technical field, it is omitted. Further detailed instructions.
如此,控制部具有能夠基於位置資訊來控制壓接模組820及模分離單元830的驅動的效果。此外,控制部具有能夠基於位置資訊來控制膜供給部400及膜回收部900的驅動的效果。 In this way, the control unit has the effect of being able to control the driving of the crimping module 820 and the mold separation unit 830 based on the position information. In addition, the control unit has the effect of being able to control the driving of the film supply unit 400 and the film recovery unit 900 based on the position information.
如此,本發明的一實施例的轉印部800能夠省略將模20與基板30相互壓接的製程與使模20與基板30相互分離的製程之間的被壓接於基板30及基板30的模20移動至從基板30分離模20的位置的製程,從而具有能夠提高製程的效率的效果。 In this way, the transfer unit 800 according to an embodiment of the present invention can omit the process of pressing the mold 20 and the substrate 30 to each other and the process of separating the mold 20 and the substrate 30 from each other. The process of moving the mold 20 to a position where the mold 20 is separated from the substrate 30 has the effect of improving the efficiency of the process.
下面,參照圖15對利用轉印裝置1實施了轉印的基板的生產方法(S10)進行說明。 Next, the production method ( S10 ) of the substrate transferred by the transfer device 1 will be described with reference to FIG. 15 .
實施了轉印的基板的生產方法S10可以生產利用本發明的一實施例的轉印裝置1將模20的圖案轉印於基板30而轉印有圖案的基板30。這樣的實施了轉印的基板的生產方法S10可以包括基板供給步驟S100、等離子體處理步驟S200、脫模性塗布步驟S300、轉印步驟S400、以及膜回收步驟S500。 The method S10 for producing a transferred substrate can produce a substrate 30 on which the pattern is transferred by transferring the pattern of the mold 20 to the substrate 30 using the transfer device 1 according to an embodiment of the present invention. The production method S10 of such a transferred substrate may include a substrate supply step S100, a plasma treatment step S200, a release coating step S300, a transfer step S400, and a film recovery step S500.
在基板供給步驟S100中,可以利用樹脂塗布基板30,並向已設定的方向整列之後供給至轉印部800。這樣的基板供給步驟S100可以包括基板塗布步驟S110及基板整列步驟S120。 In the substrate supply step S100 , the substrates 30 may be coated with resin, aligned in a set direction, and then supplied to the transfer unit 800 . Such substrate supply step S100 may include a substrate coating step S110 and a substrate alignment step S120.
在基板塗布步驟S110中,可以在從基板收納部100移送至旋塗機200的待轉印圖案的基板30的表面以規定厚度塗布樹脂。在這樣的基板塗布步驟S110中,可以在通過旋塗方式將基板30置於旋轉體上之後,在旋轉的基板30的表面滴落流動性樹脂來將樹脂均勻地塗布於基板30的表面。此外,在基板塗布步驟S110中,可以在塗布基板30之前在冷卻板210對基板30的溫度進行調節。 In the substrate coating step S110 , resin may be coated with a predetermined thickness on the surface of the substrate 30 to which the pattern is to be transferred from the substrate storage unit 100 to the spin coater 200 . In such substrate coating step S110 , after the substrate 30 is placed on the rotating body by spin coating, the fluid resin can be dropped on the surface of the rotating substrate 30 to uniformly apply the resin on the surface of the substrate 30 . In addition, in the substrate coating step S110 , the temperature of the substrate 30 may be adjusted on the cooling plate 210 before the substrate 30 is coated.
在基板整列步驟S120中,可以向已設定的方向整列從旋塗機200移送的表面塗布有樹脂的基板30。在這樣的基板整列步驟S120中,可以通過使基板30以朝向已設定的方向的方式旋轉來向相同的方向整列複數個基板30。此外,在基板整列步驟S120進行整列的基板30可以被供給至轉印部800。 In the substrate aligning step S120 , the substrates 30 whose surfaces are coated with resin and which are transferred from the spin coater 200 can be aligned in a set direction. In such substrate alignment step S120 , the plurality of substrates 30 can be aligned in the same direction by rotating the substrate 30 toward a set direction. In addition, the substrates 30 aligned in the substrate alignment step S120 may be supplied to the transfer unit 800 .
在等離子體處理步驟S200中,可以對模20的表面進行等離子體處理,以改善從膜供給部400供給的模20的脫模性。可以在脫模性塗布步驟S300之前執行這樣的等離子體處理步驟S200。從而,在等離子體處理步驟S200中,在將脫模劑塗布於模20的表面之前對模20進行等離子體處理,由此能夠對模20的表面進行改質。此外,在等離子體處理步驟S200中,可以清洗模20的表面。 In the plasma treatment step S200 , the surface of the mold 20 may be subjected to plasma treatment to improve the releasability of the mold 20 supplied from the film supply unit 400 . Such a plasma treatment step S200 may be performed before the release coating step S300. Therefore, in the plasma treatment step S200 , the surface of the mold 20 can be modified by subjecting the mold 20 to plasma treatment before applying the release agent to the surface of the mold 20 . In addition, in the plasma treatment step S200, the surface of the mold 20 may be cleaned.
在脫模性塗布步驟S300中,可以對進行等離子體處理後的模20的表面進行脫模性塗布。此外,在脫模性塗布步驟S300中,可以使氣相化的脫模劑與模20的表面接觸來塗布模20的表面。可以在為了使膜10移動而旋轉的膜供給部400及膜回收部900中的一個以上未旋轉的狀態下執行這樣的脫模性塗布步驟S300。脫模性塗布步驟S300可以包括脫模劑供給步驟S310、脫模劑塗布步驟S320以及脫模劑吹掃步驟S330。 In the releasable coating step S300, the surface of the mold 20 after the plasma treatment may be releasably coated. In addition, in the release coating step S300 , the surface of the mold 20 may be coated by bringing the vaporized release agent into contact with the surface of the mold 20 . Such a release coating step S300 may be performed in a state where one or more of the film supply unit 400 and the film recovery unit 900 that are rotated to move the film 10 is not rotated. The release coating step S300 may include a release agent supply step S310, a release agent coating step S320, and a release agent purge step S330.
脫模劑供給步驟S310可以將氣相化的脫模劑供給至由第一腔室部721與第二腔室部722貼緊而形成的塗布空間T1。在這樣的脫模劑供給步驟S310中,可以在使液體狀態的脫模劑氣相化之後供給至塗布空間T1。 The release agent supply step S310 can supply the vaporized release agent to the coating space T1 formed by the first chamber portion 721 and the second chamber portion 722 being in close contact with each other. In such a release agent supply step S310, the liquid release agent may be vaporized and then supplied to the coating space T1.
在脫模劑塗布步驟S320中,可以對模20的表面進行脫模性塗布。在脫模劑塗布步驟S320中,脫模劑可以從流入口722b-1流入並在塗布空間T1流動而與模20的表面接觸來對模20的表面進行塗布之後,通過排出口722c-1排出至外部。 In the release agent coating step S320, the surface of the mold 20 may be coated with a release agent. In the release agent coating step S320, the release agent can flow in from the inlet 722b-1 and flow in the coating space T1 to contact the surface of the mold 20 to coat the surface of the mold 20, and then be discharged through the discharge port 722c-1. to the outside.
在脫模劑吹掃步驟S330中,當模20的脫模性塗布結束時,可以中斷氣相化的脫模劑的供給,並向塗布空間T1供給空氣或非活性氣體(例如,氮氣)來將殘留於塗布空間T1的氣相化的脫模劑排出至外部。 In the release agent purging step S330, when the release coating of the mold 20 is completed, the supply of the vaporized release agent may be interrupted and air or inert gas (for example, nitrogen) may be supplied to the coating space T1. The vaporized release agent remaining in the coating space T1 is discharged to the outside.
在轉印步驟S400中,可以將形成於模20的圖案轉印於基板30。換言之,在轉印步驟S400中,可以使模20與基板30相互壓接並分離來將圖案轉印於基板30。此外,可以在為了使膜10移動而旋轉的膜供給部400及膜回收部900中的一個以上未旋轉的狀態下執行轉印步驟S400。這樣的轉印步驟S400可以包括壓接步驟S410及分離步驟S420。 In the transfer step S400, the pattern formed on the mold 20 may be transferred to the substrate 30. In other words, in the transfer step S400 , the mold 20 and the substrate 30 can be pressed against each other and separated to transfer the pattern to the substrate 30 . In addition, the transfer step S400 may be performed in a state where one or more of the film supply unit 400 and the film recovery unit 900 that are rotated to move the film 10 is not rotated. Such transfer step S400 may include a pressure bonding step S410 and a separation step S420.
在壓接步驟S410中,可以使第一壓接單元821與第二壓接單元822以相對於彼此相貼緊的方式移動來將形成於模20的圖案壓接於基板30。此外,可以使第一壓接單元821與第二壓接單元822在膜10的彼此相反的一側朝向膜10移動來使第一壓接單元821與第二壓接單元822相互貼緊。壓接步驟S410可以包括壓接單元靠近步驟S411、密閉步驟S412、氣體排出步驟S413以及壓接單元壓接步驟S414。 In the crimping step S410 , the first crimping unit 821 and the second crimping unit 822 can be moved in a manner close to each other to crimp the pattern formed on the mold 20 to the substrate 30 . In addition, the first pressure bonding unit 821 and the second pressure bonding unit 822 may be moved toward the film 10 on opposite sides of the film 10 so that the first pressure bonding unit 821 and the second pressure bonding unit 822 are in close contact with each other. The crimping step S410 may include a crimping unit approaching step S411, a sealing step S412, a gas discharge step S413, and a crimping unit crimping step S414.
在壓接單元靠近步驟S411中,可以使第一壓接單元821與第二壓接單元822相對於彼此靠近。換言之,第一壓接單元821可以靠近粘接有模20的膜10,第二壓接單元822可以靠近基板30。 In the pressing unit approaching step S411, the first pressing unit 821 and the second pressing unit 822 may be brought closer to each other. In other words, the first pressing unit 821 may be close to the film 10 to which the mold 20 is bonded, and the second pressing unit 822 may be close to the substrate 30 .
在密閉步驟S412中,波紋管822b可以朝向第一壓接單元821來使基板30相對於外部密閉。此時,波紋管822b的一端可以與第一壓接單元821貼緊,且波紋管822b可以圍繞基板30的周圍。如此,波紋管822b以圍繞基板30的周圍的方式貼緊於第一壓接單元821,從而可以阻隔基板30與外部。 In the sealing step S412, the bellows 822b may face the first pressing unit 821 to seal the substrate 30 relative to the outside. At this time, one end of the corrugated tube 822b can be in close contact with the first pressing unit 821, and the corrugated tube 822b can surround the substrate 30. In this way, the bellows 822b is in close contact with the first pressing unit 821 in a manner surrounding the periphery of the substrate 30, thereby blocking the substrate 30 from the outside.
在氣體排出步驟S413中,可以向外部排出殘留於通過密閉步驟S412密閉的波紋管822b的內部空間的氣體。通過這樣的氣體排出步驟S413,波紋管822b內部空間,即基板30的周圍可以是規定的真空狀態。 In the gas discharge step S413, the gas remaining in the internal space of the bellows 822b sealed in the sealing step S412 can be discharged to the outside. Through such gas discharge step S413, the internal space of the bellows 822b, that is, the periphery of the substrate 30 can be brought into a predetermined vacuum state.
在壓接單元壓接步驟S414中,第一壓接單元821與第二壓接單元822可以相對於彼此移動來相互貼緊。換言之,第一壓接單元821及第二壓接單元822中的一個以上以對模20和基板30加壓的方式相互貼緊,從而能夠將模20的圖案壓接於基板30。 In the crimping unit crimping step S414, the first crimping unit 821 and the second crimping unit 822 may move relative to each other to be in close contact with each other. In other words, at least one of the first pressing unit 821 and the second pressing unit 822 is in close contact with each other to pressurize the mold 20 and the substrate 30 , so that the pattern of the mold 20 can be pressed onto the substrate 30 .
在分離步驟S420中,可以使壓接有模20的圖案的基板30與模20分離。在這樣的分離步驟S420中,可以利用模分離單元830來從基板30分離模20。分離步驟S420可以包括吹掃步驟S421、密閉解除步驟S422、壓接單元上升步驟S423以及模分離單元移動步驟S424。 In the separation step S420, the substrate 30 to which the pattern of the mold 20 is pressed is separated from the mold 20. In such separation step S420 , the mold 20 may be separated from the substrate 30 using the mold separation unit 830 . The separation step S420 may include a purge step S421, a sealing release step S422, a crimping unit lifting step S423, and a mold separation unit moving step S424.
在吹掃步驟S421中,可以向波紋管822b的內部空間供給空氣或非活性氣體(例如,氮氣)來將通過氣體排出步驟S413成為規定的真空狀態的波紋管822b的內部空間製成大氣壓狀態。 In the purge step S421, air or an inert gas (for example, nitrogen gas) may be supplied to the internal space of the bellows 822b to bring the internal space of the bellows 822b into the predetermined vacuum state in the gas discharge step S413 into an atmospheric pressure state.
在密閉解除步驟S422中,可以使為了從外部阻隔基板30而伸長的波紋管822b縮小。此時,通過波紋管822b與外部阻隔的模20及基板30可以露出於外部。 In the sealing release step S422, the bellows 822b extended to block the substrate 30 from the outside may be reduced. At this time, the mold 20 and the substrate 30, which are blocked from the outside by the bellows 822b, can be exposed to the outside.
在壓接單元上升步驟S423中,可以使第一壓接單元821上升來確保模分離單元830待移動至基板30側的空間。 In the crimping unit raising step S423, the first crimping unit 821 may be raised to secure a space for the mold separation unit 830 to be moved to the substrate 30 side.
在模分離單元移動步驟S424中,可以使模分離單元830移動至基板30側來從基板30分離模20。在這樣的模分離單元移動步驟S424中,模分離單 元830可以移動至第一壓接單元821上升之前的空間,通過這樣的移動,可以從基板30分離模20。 In the mold separation unit moving step S424 , the mold separation unit 830 may be moved to the substrate 30 side to separate the mold 20 from the substrate 30 . In such mold separation unit moving step S424, the mold separation unit The unit 830 can move to the space before the first pressing unit 821 rises, and through such movement, the mold 20 can be separated from the base plate 30 .
當執行一次等離子體處理步驟S200和脫模性塗布步驟S300時,可以執行複數次轉印步驟S400和分離步驟S420,直至模20的脫模性下降至規定範圍以下,由此可以利用一個模20轉印複數個基板30。 When the plasma treatment step S200 and the releasability coating step S300 are performed once, the transfer step S400 and the separation step S420 can be performed a plurality of times until the releasability of the mold 20 drops below the prescribed range, whereby one mold 20 can be used. A plurality of substrates 30 are transferred.
在位置檢測部檢測到多個模20的各個位於用於執行脫模性塗布步驟S300的蒸鍍模組720和用於執行轉印步驟S400的轉印部800之後執行脫模性塗布步驟S300和轉印步驟S400。 The releasable coating steps S300 and S400 are performed after the position detection unit detects that each of the plurality of molds 20 is located in the vapor deposition module 720 for performing the releasable coating step S300 and the transfer unit 800 for performing the transfer step S400. Transfer step S400.
在基板回收步驟S500中,可以將轉印後的基板30移送至基板收納部100。 In the substrate recovery step S500 , the transferred substrate 30 may be transferred to the substrate storage unit 100 .
在膜回收步驟S600中,當執行複數次壓接步驟S410和分離步驟S420,使得模20的脫模性下降至規定範圍以下時,可以將模20回收至膜回收部900。 In the film recovery step S600, when the pressure bonding step S410 and the separation step S420 are performed a plurality of times and the releasability of the mold 20 falls below a predetermined range, the mold 20 can be recovered to the film recovery unit 900.
基板回收步驟S500與膜回收步驟S600可以同時或獨立地進行。 The substrate recovery step S500 and the film recovery step S600 may be performed simultaneously or independently.
儘管上文中以具體的實施方式對包括脫模部700和轉印部800的轉印裝置1進行可說明,但脫模部700與轉印部800可以獨立地構成轉印裝置。例如,脫模部700可以單獨地構成轉印裝置或與另一實施方式的轉印部構成轉印裝置,轉印部800可以單獨地構成轉印裝置或與另一實施方式的脫模部構成轉印裝置。此外,脫模部700可以選擇性地包括等離子體處理模組710。此外,轉印裝置1可以選擇性地包括基板收納部100、旋塗機200以及整列單元300。 Although the transfer device 1 including the demoulding part 700 and the transfer part 800 is described above with a specific implementation, the demolding part 700 and the transfer part 800 may independently constitute a transfer device. For example, the release part 700 may constitute a transfer device alone or together with the transfer part of another embodiment. The transfer part 800 may constitute a transfer device alone or together with the release part of another embodiment. Transfer device. In addition, the demolding part 700 may optionally include a plasma processing module 710 . In addition, the transfer device 1 may optionally include a substrate storage part 100, a spin coater 200, and an alignment unit 300.
儘管上面以具體的實施方式對本發明的一些實施例進行了說明,但這只是例示,本發明不限於此,而是應被解釋為具有基於本說明書中公 開的基礎思想的最廣的範圍。所屬技術領域中具有通常知識者可以組合/置換所公開的實施方式來實施未示出的形狀圖案,但這同樣不脫離本發明的範圍。除此之外,所屬技術領域中具有通常知識者可以基於本說明書容易對所公開的實施方式進行變更或變形,顯然,這樣的變更或變形也屬於本發明的權利範圍。 Although some embodiments of the present invention have been described above with specific implementation modes, these are only illustrations, and the present invention is not limited thereto, but should be interpreted as having the features based on the disclosures in this specification. open the widest scope of basic ideas. Those skilled in the art can combine/replace the disclosed embodiments to implement shape patterns not shown, but this does not depart from the scope of the present invention. In addition, those skilled in the art can easily make changes or modifications to the disclosed embodiments based on this description. Obviously, such changes or modifications also fall within the scope of the present invention.
1:轉印裝置 1: Transfer device
10:膜 10:Membrane
20:模 20:Model
30:基板 30:Substrate
400:膜供給部 400: Film supply department
500:進料輥 500: Feed roller
600:保護膜回收部 600: Protective film recycling department
700:脫模部 700:Demolding Department
710:等離子體處理模組 710:Plasma processing module
720:蒸鍍模組 720: Evaporation module
800:轉印部 800: Transfer Department
900:膜回收部 900: Film recycling department
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