TWI832796B - Transfer apparatus and method of manufacturing a transferred wafer using the same - Google Patents

Abstract

The present invention relates to a transfer device and a method for producing a transferred substrate using the transfer device. Specifically, according to an embodiment of the present invention, a transfer device that transfers a pattern of a mold adhered to a film to a substrate can be provided, and the transfer device includes a mold release portion that can A surface of the mold is releasably coated; and a transfer part is capable of transferring the pattern of the mold releasably coated on the release part to a substrate.

Description

Transfer device and method for producing transferred substrate using same

The present invention relates to a transfer device and a method for producing a transferred substrate using the transfer device.

In the past, in semiconductor manufacturing processes, a photolithography process was used to form a pattern (eg, a mask pattern for etching or evaporation) on the surface of a substrate (eg, a wafer). This photolithography process is a process that can coat a photosensitive material such as photoresist on the surface of a substrate and then irradiate it with light to form a desired pattern.

However, the process of forming nanoscale patterns on the surface of a substrate through a photolithography process has a problem of low mass productivity. Recently, in order to improve this problem, a nanoimprint photolithography process is used.

The nanoimprint photolithography process is a technology that can cost-effectively produce nano-structures. Specifically, the nanoimprint photolithography process uses a transfer device (Transfer Apparatus) to press each other between a mold (Mold) formed with a nano-scale pattern and a substrate formed with resin (Resin). The process of transferring patterns to the surface of a substrate. The transfer device used in this nanoimprint photolithography process performs the process by pressing the pattern of the mold onto the substrate and then separating the mold from the substrate.

However, in conventional transfer devices, since the releasability of the mold is low, the transfer efficiency of the mold decreases after the same mold is used multiple times. Therefore, the mold must be used once. In order to improve the mold releasability of the mold, For reusability, the mold release agent has been applied to the mold by spin coating before use.

However, when the mold release agent is applied to the mold by spin coating and used, although the reusability of the mold is increased, the mold release agent is unevenly applied to the mold, so there is a possibility that the coating material will clump or residues will remain during the application. Foreign object problem. In addition, when the pattern of the mold is formed into a fine pattern of 50 nm or less, spin coating, which applies thick coating, will cover the fine pattern, making it difficult to transfer the fine pattern to the substrate.

In addition, in the conventional transfer device, the space of the transfer mold and the space of the separation mold are separated from each other. Therefore, a process of moving the mold is added, so there is a problem that the efficiency of the process decreases.

Therefore, there is a need for a transfer device that can uniformly apply a release agent to a mold without leaving foreign matter during application, and a transfer device that can increase the reusability of the mold.

In addition, there is a need for a transfer device that can improve the efficiency of the process by omitting the process of moving the mold.

Some embodiments of the present invention are invented in view of the above background, and aim to provide a transfer device that can improve the efficiency of the process of forming a pattern on a substrate surface by reducing the replacement cycle of a pattern-forming mold.

Furthermore, it is intended to provide a transfer device that removes foreign matter on the mold surface and prevents foreign matters from being included and causing defects when the mold is releasably coated.

Furthermore, it is intended to provide a transfer device that can omit a process of moving the mold.

According to one aspect of the present invention, a transfer device that transfers a pattern of a mold adhered to a film to a substrate can be provided, and the transfer device includes a mold release portion that can perform release on the surface of the mold. Mold coating; and a transfer part that can transfer the pattern of the mold after the mold release coating is performed on the mold release part to the substrate, and the mold release part includes: a plasma processing module, which The method operates by treating the surface of the mold with plasma before performing release coating on the surface of the mold; and an evaporation module that performs release coating on the surface of the mold after the plasma treatment. .

According to another aspect of the present invention, a transfer device can be provided that transfers a pattern of a mold adhered to a film to a substrate, and the transfer device includes a mold release portion capable of discharging a pattern on the surface of the mold. performing releasable coating; and a transfer part capable of transferring the pattern of the mold after releasable coating is performed on the releasable part to a substrate, the releasable part including a A vapor deposition module for performing release coating, in which a plurality of molds are bonded to the film, and the center point of the area where the mold is located in the vapor deposition module and the center point of the area where the mold is located in the transfer part The distance between them is the same as the distance between the center points of the molds adjacently arranged on the film.

Furthermore, a transfer device may be provided, in which the evaporation module vaporizes a release agent and supplies the vaporized release agent to a surface of the mold to coat the mold. s surface.

Furthermore, a transfer device may be provided, wherein the transfer part is configured such that when the plasma processing module performs a process of processing the surface of the mold using the plasma once, the evaporation deposition module When the process of releasably coating the surface of the mold is performed once, the process of press-bonding the pattern of the mold to the substrate releasably coated by the evaporation module is performed a plurality of times and removing the pattern from the substrate. The process of separating the mold.

Furthermore, a transfer device may be provided, in which the transfer part includes: a press-contacting module capable of press-contacting the mold and the substrate to press-contact the pattern of the mold to the substrate; and mold separation A unit that separates the mold from the substrate when the pattern of the mold is crimped to the substrate by the crimping mold set.

In addition, a transfer device may be provided, further comprising: a film supply part capable of supplying the film to which the mold is adhered to the demoulding part; and a film recovery part capable of recovering and winding up the film. The film is wound up in the film recovery unit, and the mold in which the mold releasability falls below a predetermined range is bonded to the film.

In addition, a transfer device may be provided, further comprising: a position detection unit disposed between the evaporation module and the transfer unit, thereby detecting that the preceding mold is located in the transfer unit and the succeeding mold The mold is located in the evaporation mold.

Furthermore, it is possible to provide a transfer device, further comprising: a film supply part and a film recovery part that rotate in order to move the film, and the transfer part is configured to be between the film supply part and the film recovery part. The process of pressing the pattern of the mold to the substrate and the process of separating the mold from the substrate are repeated a predetermined number of times or more while one or more of the parts are not rotated, and the transfer device further includes : A control unit that receives the position information of the mold from the position detection unit and controls the driving of one or more of the film supply unit and the film recovery unit.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a gas-phase release agent to the coating space so that the The surface of the mold is coated, the film passes between the first chamber part and the second chamber part, the fluid supply The part includes: a tank capable of containing the release agent in a liquid state; and a bubbler capable of supplying gas above a predetermined pressure to the release agent in a liquid state accommodated in the tank to release the release agent. The molding agent is vaporized.

Furthermore, a transfer device may be provided, wherein the bubbler causes the release agent to be released by discharging the gas to the release agent below a surface of the release agent accommodated in the tank. Vaporization.

Furthermore, a transfer device may be provided, wherein the evaporation module further includes an injection device capable of injecting the gas at a position spaced a predetermined distance upward from a surface of the release agent in a liquid state. To prevent the vaporized release agent from agglomerating.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface of the film is releasably coated, and the film passes between the first chamber part and the second chamber part. An inflow port is formed in the second chamber part, and one side of the inflow port It communicates with the said fluid supply part, and the other side communicates with the said coating space, and the said inlet is arrange|positioned below the said mold.

Furthermore, it is possible to provide a transfer device in which a discharge port for discharging the release agent flowing into the coating space through the inlet to the outside is formed in the second chamber part, from The release agent flowing into the coating space through the inlet comes into contact with the surface of the mold while being discharged to the outside through the discharge port.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. department and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface is releasably coated, and the film passes between the first chamber part and the second chamber part, and the second chamber part includes: a chamber base; a chamber protruding part, Projecting from the chamber base; and a chamber side wall extending from the chamber base along the edge of the chamber base and surrounding the chamber protruding portion at a predetermined distance. Chamber bulge.

Furthermore, a transfer device may be provided, in which the second chamber part includes an inlet formed on a side wall of the chamber and having one side connected to the fluid supply part and the other side connected to the coating part. spatial communication; and a discharge port formed on the protruding portion of the chamber for externally discharging the release agent flowing into the coating space through the inflow port, and all the release agent flowing into the coating space from the inflow port The release agent contacts the surface of the mold while being discharged to the outside through the discharge port.

Furthermore, it is possible to provide a transfer device in which the inflow port is formed on the chamber side wall and is disposed below an upper surface of the chamber protrusion.

Furthermore, it is possible to provide a transfer device in which a recessed portion having a shape recessed downward from an upper surface of the chamber protruding portion is formed on an edge of the chamber base at a position corresponding to the inlet. .

Furthermore, it is possible to provide a transfer device in which a plurality of the inflow openings are provided, at least some of the plurality of inflow openings are arranged to face each other, and the discharge port is arranged between the facing inflow openings. is formed in the center part of the second chamber part.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. The part is located below, and together with the first chamber part, forms a coating space for arranging the film to which the mold is adhered; to and a fluid supply part that supplies a release agent to the coating space so that the surface of the mold can be releasably coated, and the film is between the first chamber part and the second chamber part. The inside of the coating space is divided into an upper space and a lower space based on the film, and a gas discharge port is formed in the first chamber part for discharging the coating space to the outside. The gas remaining in the upper space in the inside of the coating space based on the film is formed in the second chamber part, and the exhaust port is used to discharge the gas in the inside of the coating space based on the film to the outside. Release agent remaining in the lower space.

In addition, a transfer device may be provided, wherein the evaporation module further includes a heater that heats at least one of the first chamber part and the second chamber part to heat the coating space. The temperature is maintained in the range of 30°C to 80°C.

According to another aspect of the present invention, a transfer device may be provided, including an evaporation module. The evaporation module includes: a first chamber part; and a second chamber part, which is arranged at a position larger than the first chamber part. part is located below and together with the first chamber part forms a coating space for arranging the film to which the mold is adhered; and a fluid supply part that supplies a release agent to the coating space so that the mold can be The surface is releasably coated, and the film passes between the first chamber part and the second chamber part. The evaporation module further includes an evaporation sealing part, and the evaporation sealing part surrounds The coating space is used to seal between the first chamber part and the second chamber part, and the vapor deposition sealing part includes a first vapor deposition sealing member provided in the first chamber part and a second vapor deposition sealing member provided in the second chamber part, one of the first vapor deposition sealing member and the second vapor deposition sealing member having a planar shape when not in close contact with the other. , the other one has an arc shape when it is not in close contact with the one.

According to another aspect of the present invention, a transfer device can be provided, including an evaporation module and a plasma treatment module. The evaporation module includes: a first chamber part; a second chamber part, which is configured A coating space for arranging a film to which the mold is adhered is formed below the first chamber part and together with the first chamber part; a fluid supply part that supplies a release agent to the coating space , so that the surface of the mold can be releasably coated, the plasma treatment module uses plasma to treat the surface of the mold to modify the surface of the mold, and the film is in the first A cavity part and the second chamber part pass between each other, and the evaporation module performs release coating on the surface of the mold after the surface has been plasma treated by the plasma treatment module.

According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second pressure-bonding unit; and a mold separation unit including a first roller portion supporting the film on the other side of the film opposite to one side of the film, the first pressing unit The connecting unit and the second pressing unit move toward the film on opposite sides of the film and are in close contact with each other to press the pattern formed on the mold to the substrate, and the first roller The mold is moved to the space between the first pressure bonding unit and the second pressure bonding unit where the substrate is pressure-bonded to the mold to separate the mold that is pressure-bonded to the substrate from the substrate. .

Furthermore, there may be provided a transfer device in which the mold separation unit further includes a second roller part that supports the film in a direction in which the film is bent in a direction surrounding a part of the first roller part.

In addition, a transfer device may be provided, wherein the second crimping unit includes a substrate placement portion capable of pressing the mold to the substrate by the crimping module and by the mold separation unit. The substrate is supported when the mold is separated from the substrate, and an adsorption port capable of adsorbing the substrate is formed in the substrate placement portion to prevent the mold from being separated from the substrate while being pressed against the substrate. The substrate is detached from the second pressing unit during the molding process.

In addition, a transfer device may be provided, further comprising: a frame capable of supporting the pressure bonding module and the mold separation unit, the first pressure bonding unit and the second pressure bonding unit being supported on the The frames move relative to each other, and the mold separation unit moves relative to the mold while being supported on the frame.

According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second crimping unit; and a frame capable of supporting the crimping module, the first crimping unit and the second crimping unit moving toward the membrane on opposite sides of the membrane. The pattern formed on the mold is press-bonded to the substrate by being in close contact with each other. The frame includes a first frame part and a second frame part. The first press-bonding unit includes: a first press-bonding body, which can pressurizing the mold; and a first guide member fixedly supported on the first frame part and capable of guiding the movement of the first crimping body. The second crimping unit includes: a second a crimping body capable of supporting the substrate; and a second guide member fixedly supported on the second frame part and capable of guiding the movement of the second crimping body, the first crimping body The second crimping body and the second crimping body are respectively moved and guided by the first guide member and the second guide member to rise and fall relative to the frame.

Furthermore, a transfer device may be provided, wherein the first crimping unit includes: a first crimping body capable of pressurizing the mold; and a first supporting part capable of supporting the first crimping body ; And a pushing prevention part, one end of which is fixedly supported on the first frame part and the other end is supported on the first support part. The pushing prevention part can pass through the second crimping unit in order to press the When the substrate is pressurized and raised, the first support portion is pressurized to prevent the first crimping body from being pushed upward due to the rise of the second crimping unit.

In addition, a transfer device may be provided, further comprising: a mold separation unit moved to a space between the first and second crimping units for crimping the substrate to the mold. The frame further includes a third frame part, and the mold separation unit includes a roller part capable of being separated from the base plate and being pressed against the base plate. the mold of the substrate; and a roller guide member that is fixedly supported on the third frame part and capable of guiding the movement of the roller part, and the roller part is relatively moved and guided by the roller guide member move in the frame.

Furthermore, a transfer device may be provided in which the first frame part, the second frame part, and the third frame part are integrally and fixedly supported with respect to each other.

According to another aspect of the present invention, a transfer device may be provided, including: a press-bonding module including a first press-bonding unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a press-bonding unit capable of supporting a substrate. a second crimping unit; and a detection unit including a first sensor unit capable of detecting the first stop position, the second stop position, and the deceleration position of the first crimping unit, and the second crimping unit. at least one of the second sensor portions of the first stop position, the second stop position, and the deceleration position, and the first crimping unit and the second crimping unit are on opposite sides of the film. move toward the film and come into close contact with each other to press the pattern formed on the mold to the substrate, the deceleration position is between the first stop position and the second stop position, and the press contact The module is driven to decelerate when reaching the deceleration position while moving from the first stop position to the second stop position.

In addition, a transfer device may be provided, further including: a control unit that receives position information of the crimping module from the detection unit to control driving of the crimping module.

According to another aspect of the present invention, there can be provided a transfer device including: a mold separation unit capable of separating all sides of a film on which a pattern-formed mold is bonded on one side opposite to the one side. The first roller portion that supports the film on the other side of the film moves to the substrate side to separate the mold that is pressed against the substrate from the substrate; and a detection unit capable of detecting the first step of the mold separation unit. a stop position, a second stop position and a deceleration position, the deceleration position being between the first stop position and the second stop position, the mold separation unit is driven to, when moving from the first stop position The vehicle decelerates when it reaches the deceleration position while moving to the second stop position.

Furthermore, a transfer device may be provided, further including a control unit that receives position information of the mold separation unit from the detection unit to control driving of the mold separation unit.

Furthermore, a transfer device may be provided, wherein the detection unit includes: a first stop position detection sensor for detecting the first stop position; and a deceleration position detection sensor for detecting the first stop position. deceleration position; and a second stop position detection sensor for detecting the second stop position.

According to another aspect of the present invention, a transfer device may be provided, including: a first pressing unit capable of moving toward a film on which a pattern-formed mold is bonded on one side; and a second pressing unit capable of supporting a substrate. ; A crimping sealing portion, which includes a first crimping sealing component inserted into the first crimping unit, and a crimping sealing component inserted into the second crimping unit and having a shape different from that of the first crimping sealing component; A second crimping sealing component, the first crimping unit and the second crimping unit are on opposite sides of the film between the first crimping unit and the second crimping unit. One side moves toward the film and comes into close contact with each other to press the pattern formed on the mold to the substrate. Either one of the first pressure sealing member and the second pressure sealing member is It has a planar shape when in close contact with the other, and the other has an arc shape when not in close contact with the one.

According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: a plasma treatment step of treating the surface of the mold with plasma; a release coating step of performing release coating on the surface of the mold after the plasma treatment; and performing the release coating step A transfer step in which the pattern of the mold after release coating is transferred to the substrate.

According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: A releasable coating step of performing releasable coating on the surface of the mold; and a transfer step of transferring the pattern of the mold releasably coated by the releasable coating step to a substrate, in The mold has a plurality of molds arranged at a predetermined distance apart, and the position detection unit detects that each of the plurality of molds is a vapor deposition module for performing the releasable coating step and a vapor deposition module for performing the transfer step. The releasable coating step and the transfer step are performed after the transfer section.

Furthermore, there may be provided a production method of a transferred substrate, wherein the transfer step includes: a pressing step of pressing the mold and the substrate into mutual pressure; and separating the mold from the substrate. In the separation step, the pressure bonding step and the separation step are performed in a state where at least one of the film supply part and the film recovery part that rotates to move the film is not rotated.

In addition, a production method of a transferred substrate can be provided, which further includes: a separation step of separating the mold from the substrate, and when the plasma treatment step and the release coating step are performed once, The transfer step and the separation step are performed a plurality of times.

Furthermore, a method for producing a transferred substrate can be provided, which further includes: when the pressing step and the separating step are performed a plurality of times so that the releasability of the mold falls below a predetermined range, recovering the adhesive A film recovery step of the film connected to the mold.

According to another aspect of the present invention, a method for producing a transferred substrate can be provided, which produces a substrate with a pattern of a mold adhered to a film transferred thereto. The method for producing a transferred substrate includes: A release coating step of performing release coating on the surface of the mold. The release coating step includes a space forming step of sealing the first chamber part and the second chamber part to form a coating space; a release agent supplying step of supplying a vaporized release agent to the coating space; and a purging step of supplying gas to the coating space after supplying the vaporized release agent to the coating space. In the mold agent supply step, a gas of a predetermined pressure or higher is supplied to the liquid mold release agent contained in the tank through a bubbler to vaporize the mold release agent, and the vaporized mold release agent is supplied. In the coating space, the second chamber part is arranged below the first chamber part, and the film passes between the first chamber part and the second chamber part.

Furthermore, it is possible to provide a production method of a transferred substrate, which further includes: the vaporized release agent supplied to the coating space being discharged to the outside after coating the surface of the mold.

In addition, a method for producing a transferred substrate can be provided, which further includes a plasma treatment step of performing plasma treatment on the surface of the mold to modify the surface of the mold. The plasma treatment step is performed before the die coating step.

According to another aspect of the present invention, a method for producing a transferred substrate can be provided, including: making a first pressure bonding unit and a second pressure bonding unit opposite to each other with a film on which a patterned mold is bonded on one side. A crimping step in which one side of the mold is moved toward the film to crimp the mold to the substrate; and a separation step of moving a mold separation unit to the substrate side to separate the mold pressed against the substrate in the pressure bonding step, wherein the mold separation unit includes a first roller part , the first roller part supports the film on the other side of the film opposite to one side of the film, and the separation step includes: moving the mold separation unit to the first crimping unit and A mold separation unit moving step of press-contacting the substrate to the space between the molds between the second crimping units to separate the mold crimped to the substrate from the substrate.

Furthermore, there may be provided a production method of a transfer-implemented substrate, wherein the crimping step includes causing the first crimping unit and the second crimping unit from opposite sides of the film. a step of approaching the crimping unit moving toward the film; a sealing step of extending the bellows of the second crimping unit toward the first crimping unit to seal the space around the substrate with respect to the outside; and A gas discharging step of discharging the gas remaining in the sealed space inside the bellows to the outside.

In addition, a production method of a transferred substrate may be provided, wherein the separation step further includes: after the pattern of the mold is transferred to the substrate through the crimping step, causing the first The crimping unit rising step.

Furthermore, it is possible to provide a production method of a transferred substrate, in which the pressing is repeated a predetermined number of times in a state where at least one of the film supply unit and the film recovery unit that rotates to move the film is not rotated. connecting step and said separation step.

Some embodiments of the present invention were invented with a view to the background as described above, and have the effect of improving the releasability of the mold surface by coating the surface of the mold with releasability.

In addition, by improving the releasability of the mold surface, a pattern can be transferred to a plurality of substrates using one mold, thereby improving the reusability of the mold.

In addition, by shortening the mold replacement cycle, it has the effect of shortening the time for transferring the pattern to the substrate and improving the efficiency of the process.

In addition, by omitting the process of moving the mold to a position where the mold can be separated from the substrate between the process of pressing the mold and the substrate to each other and the process of separating the mold and the substrate from each other, there is an effect of improving the efficiency of the process.

1: Transfer device

10:Membrane

20:Model

30:Substrate

100:Substrate storage part

200:Spin coating machine

210:Cooling plate

300: Entire column unit

400: Film supply department

500: Feed roller

600: Protective film recycling department

700:Demolding Department

710:Plasma processing module

711:Plasma generation department

712:Guide roller

720: Evaporation module

721: First chamber part

721a: First chamber slot

721b:Gas discharge port

722: Second chamber part

722a: Chamber base

722b: Chamber side wall

722b-1: Inlet

722b-2: Second chamber slot

722c: Chamber bulge

722c-1: Discharge port

722c-2: concave part

723: Fluid supply department

723a: Fluid containing body

723b:can

723c: Aerator

723d: First supply flow path

723e: Second supply flow path

723f:Jet device

724: Gas discharge part

724a: Discharge flow path

724b: discharge pump

725: Evaporation sealing part

725a: First evaporation sealing component

725b: Second evaporation sealing component

726: Chamber Drive

727:Heater

728: Pressure regulating department

728a: Pressure adjustment flow path

800: Transfer Department

810:Frame

811:First Framework Department

812:Second Framework Department

813:Third Framework Department

820: Crimping module

821: First crimping unit

821a: First crimping body

821a-1: First sealing groove

821b: First support part

821c: Irradiation Department

821d: Push prevention department

821d-1: Support components

821d-2: Rotating parts

821e: First guide component

821f: Fasteners

822: Second crimping unit

822a: Second crimping body

822a-1: Substrate placement part

822a-2: Bellows placement part

822a-3: Adsorption port

822a-4:Exhaust port

822b: Bellows

822b-1: Second sealing groove

822c: Lift cylinder

822d: Second support part

822e: Second guide component

823:Exhaust part

823a:Exhaust channel

823b:Exhaust pump

824:Adsorption department

824a: Adsorption channel

824b: Adsorption pump

825:Drive Department

825a: first drive

825b: Second drive

826: Crimp sealing part

826a: First crimp sealing component

826b: Second crimp sealing component

830: Mold separation unit

831: First roller part

832: Second roller part

833:Roller support part

834:Roller guide parts

835:Roller drive

840:Detection unit

841: 1st Sensor Department

841a: No. 1-1 sensor

841b: 1-2nd sensor

841c: Sensor 1-3

842: 2nd sensor unit

842a: No. 2-1 sensor

842b: 2-2nd sensor

842c: 2nd-3rd sensor

843: 3rd sensor unit

843a: No. 3-1 sensor

843b: 3-2 sensor

843c: 3rd-3rd sensor

900: Film recycling department

T: transfer unit

S10: Production method of transferred substrate

S100~600: steps

FIG. 1 is a conceptual diagram of a transfer device according to an embodiment of the present invention.

FIG. 2 is a plan view of the transfer device of FIG. 1 .

FIG. 3 is an exploded perspective view of the mold release part of FIG. 1 .

FIG. 4 is a cross-sectional view taken along line AA' of FIG. 3 .

Fig. 5 is a cross-sectional view taken along AA' when the second chamber portion of Fig. 1 is raised.

FIG. 6 is a perspective view of the transfer unit in FIG. 1 .

FIG. 7 is an exploded perspective view of FIG. 6 .

FIG. 8 is a cross-sectional view taken along line BB′ in FIG. 6 .

Fig. 9a is a cross-sectional view taken along BB' when the crimping die set of Fig. 6 is moved to pressurize the mold and the substrate.

(a) of FIG. 9b is an enlarged view of part C when the bellows of FIG. 9a is reduced, and (b) of FIG. 9b is an enlarged view of part C when the bellows of 9a is extended.

FIG. 10 is a cross-sectional view taken along BB′ when the first crimping unit of FIG. 6 is raised.

FIG. 11 is a cross-sectional view taken along BB′ when the mold separation unit of FIG. 6 separates the mold from the substrate.

FIG. 12 is a cross-sectional view taken along BB′ when the mold separation unit of FIG. 6 moves after separating the mold from the substrate.

FIG. 13 is a perspective view of the lower frame and the second crimping unit of FIG. 7 .

(a) of FIG. 14 is a bottom view of the mold separation unit of FIG. 6 , and (b) of FIG. 14 is a bottom view of the mold separation unit when the mold separation unit of FIG. 6 moves toward the mold.

FIG. 15 is a sequence diagram schematically illustrating a method for producing a substrate after a pattern is transferred using a transfer device according to an embodiment of the present invention.

Specific embodiments for implementing the ideas of the present invention will be described in detail below with reference to the accompanying drawings.

Meanwhile, in describing the present invention, when it is judged that the detailed description of related conventional configurations or functions may make the gist of the present invention unclear, the detailed description thereof will be omitted.

In addition, when a constituent element is referred to as being "connected to," "supported by," "flowing into," "supplied to," "flowing to," or "combined with" another constituent element, it should be understood that it may be directly connected to , supports, flows into, supplies to, flows to, and is combined with another component, but there may be other components in between.

The terms used in this specification are used only to describe specific embodiments and are not used with the intention of limiting the present invention. Expressions in the singular include expressions in the plural unless the context clearly defines otherwise.

In addition, terms including ordinal numbers such as first, second, etc. may be used to describe various constituent elements, but these constituent elements should not be limited by such terms. These terms are only used for the purpose of distinguishing one component from another component.

The word "comprising" used in the specification means to embody specific characteristics, regions, factors, steps, actions, elements and/or components, and does not exclude other specific characteristics, regions, factors, steps, actions, elements, ingredients and /or the presence or attachment of a group.

In addition, it should be noted in advance that the expressions such as upper part, lower part, upper side, and lower side in this specification are based on what is shown in the figure. When the direction of the object changes, the expressions may be different. On the other hand, the up-down direction in this specification may be the up-down direction in FIGS. 1, 3, and 7. In addition, the left-right direction may be the left-right direction of FIGS. 1, 3, and 7.

The specific configuration of the transfer device 1 according to an embodiment of the present invention will be described below with reference to the drawings.

As shown below, referring to FIG. 1 , the transfer device 1 according to an embodiment of the present invention can pressurize the mold 20 and the substrate 30 adhered to the film 10 to transfer the pattern formed on the mold 20 to the substrate 30 . Such a transfer device 1 can move the film 10 in one direction to move the mold 20 . In addition, the transfer device 1 can repeatedly use one mold 20 to form patterns on a plurality of substrates 30 by performing release coating on the surface of the mold 20 . Such transfer device 1 may include a substrate storage unit 100, a spin coater 200, an alignment unit 300, a film supply unit 400, a feed roller 500, a protective film recovery unit 600, a demoulding unit 700, a transfer unit 800, and a film recovery unit. Department 900.

The film 10 can be moved by the transfer device 1 so as to pass through the film supply part 400, the demoulding part 700, the transfer part 800, and the film recovery part 900 in order. Here, the film supply part 400 may be on the upstream side, and the film recovery part 900 may be on the downstream side.

Referring to FIG. 2 , the substrate storage part 100 may provide a space for accommodating the substrate 30 before the transfer part 800 transfers the pattern. Such a substrate storage unit 100 can store a plurality of substrates 30 in a stacked manner. In addition, the substrate 30 stored in the substrate storage part 100 may be made of metal, silicon, sapphire, glass, or the like. Such a substrate 30 can be extracted from the substrate storage unit 100 by the transfer unit T and transferred to the spin coater 200 . For example, the transfer unit T may be a robot arm. In addition, the substrate storage section 100 can provide a space for accommodating the substrate 30 after the pattern is transferred by the transfer section 800 . The substrate 30 on which such a pattern is transferred can be transferred from the transfer unit 800 by the transfer unit T and stored in the substrate storage unit 100 . Furthermore, in the substrate accommodating portion 100, a space for accommodating the substrate 30 before the pattern is transferred and a space for accommodating the substrate 30 after the pattern is transferred can be separated.

The spin coater 200 can uniformly coat the resin with a predetermined thickness on the surface of the substrate 30 transferred from the substrate storage unit 100 by spin coating. Here, the spin coating method will be briefly described. In the spin coating method, the substrate 30 is placed on a support that rotates, and liquid fluid resin is dropped on the surface of the substrate 30 . At this time, the surface of the substrate 30 can be coated with the resin by uniformly spreading the fluid resin to a predetermined thickness on the surface of the substrate 30 by utilizing the centrifugal force generated by the high-speed rotation of the support. Such resin coated on the surface of the substrate 30 may include any conventional photocurable resin that has a property of curing by reaction with UV (Ultra Violet, ultraviolet light). For example, the resin may include an acrylic hardened resin. Such a substrate 30 may be transferred to the cooling plate 210 before being transferred to the spin coater 200 so that the surface is uniformly coated with the resin. In addition, the substrate 30 may be transferred to the spin coater 200 after the cooling plate 210 is adjusted to a temperature within a prescribed range. For example, the cooling plate 210 can adjust the temperature of the substrate 30 to below 30°C. The substrate 30 after the resin is coated by the spin coater 200 can be transferred by the transfer unit T to the alignment unit 300 .

On the other hand, in the following, even if not otherwise stated, the substrate 30 may be defined as the substrate 30 coated with resin by the spin coater 200 , and transferring the pattern of the mold 20 to the substrate 30 may mean transferring the pattern of the mold 20 to Resin formed on the substrate 30 .

The alignment unit 300 can align the substrates 30 coated by the spin coater 200 in a set direction before the substrates 30 are transferred to the transfer unit 800 . Such an alignment unit 300 can align the substrates 30 by rotating the substrate 30 in the horizontal direction so that holes (thickness direction through holes or side grooves, not shown) formed in the substrate 30 face a set direction. In addition, the substrates 30 may be aligned in a direction corresponding to a pattern of the mold 20 to be described later. For example, the alignment unit 300 can align the substrate 30 through a photo sensor. As a more detailed example, the alignment unit 300 may include a light-emitting component (not shown) capable of irradiating laser or the like, and a light-receiving component (not shown) capable of identifying laser or the like. Such a light-emitting component can irradiate laser to the substrate 30 side, and the light-receiving component can recognize the laser that has passed through the hole formed on one side of the substrate 30 . Therefore, the substrate 30 can be placed on a support body that rotates, and when the hole of the substrate 30 faces a set direction while the substrate 30 rotates through the support body, the light-emitting component can identify the light emitted by the light-emitting component through the hole. laser, and the rotation of the substrate 30 can be stopped. In this way, when the substrates 30 are aligned in the alignment unit 300 so that the substrates 30 face the set direction, they can be transferred to the transfer unit 800 by the transfer unit T.

The film supply part 400 can support the rolled film 10. Moreover, by rotating the film supply part 400, the rolled film 10 can be continuously supplied to the demoulding part 700. In addition, the mold 20 in which a pattern is formed may be adhered to the film 10 wound up in the film supply unit 400 . In the film 10, a plurality of molds 20 may be arranged at a predetermined distance along the direction in which the film 10 extends. In this way, when the film 10 is wound up in the film supply unit 400, protective films can be bonded to both sides of the film 10 to prevent the surface to which the mold 20 is bonded from adhering to the opposite surface. Such a film supply unit 400 can be driven to rotate by a driver. In addition, the film supply unit 400 may be directed to one side The film 10 is moved from the film supply part 400 to the film recovery part 900 by rotating in the opposite direction. On the other hand, the film 10 supplied from the film supply part 400 may be a resin film, for example.

The film recovery unit 900 can rotate in one direction to recover and wind up the film 10 supplied from the film supply unit 400 . The mold 20 adhered to the film 10 wound up in the film recovery unit 900 may have a mold releasability that falls below a predetermined range. In other words, the releasability of the mold 20 used multiple times to transfer the pattern to the substrate 30 may fall below a predetermined range. Since the mold 20 with reduced releasability cannot transfer the pattern to the substrate 30, it can be recycled. Film recovery unit 900. Such a film recovery unit 900 can be driven to rotate by a driver. In addition, the film recovery unit 900 may be rotated in one direction to move the film 10 from the film supply unit 400 to the film recovery unit 900 . For example, the film recovery unit 900 may rotate simultaneously with the film supply unit 400 to transfer the film 10 . However, this is just an example, and the film recovery part 900 may be driven to rotate independently from the film supply part 400. In addition, since the rotation force of the film recovery part 900 is greater than the rotation force of the film supply part 400, the rotation of the film recovery part 900 can rotate the film supply part 400. Therefore, the film 10 may be moved by rotating one of the film supply part 400 and the film recovery part 900 in one direction. Such a film 10 can be moved from the upstream side to the downstream side so as to pass through the demoulding part 700 and the transfer part 800 in sequence during movement.

The feed roller 500 can guide the movement of the film 10 and can support the film 10 . A plurality of such feed rollers 500 may be provided, and the plurality of feed rollers 500 may be arranged along the movement path of the film 10 . For example, the feed roller 500 may be disposed between at least part of the film supply unit 400 , the protective film recovery unit 600 , the demoulding unit 700 , the transfer unit 800 , and the film recovery unit 900 . In addition, the plurality of feed rollers 500 may be passive rollers rotated by movement of the film 10 or the like.

The protective film recovery unit 600 can recover the protective film adhered to the film 10 . A plurality of such protective film recovery units 600 may be provided to respectively recover the protective films adhered to both sides of the film 10 . In addition, the protective film recovery unit 600 may recover the protective film from the film 10 before the mold 20 is transferred to the demolding unit 700 .

Referring to FIG. 3 , the release part 700 can perform release coating on the surface of the mold 20 to improve the release property of the surface of the mold 20 . Such a release part 700 can supply a release agent to the surface of the mold 20 to perform release coating on the surface of the mold 20 . Such a release agent may include at least one of a fluorine-based release agent and a silicon-based release agent. In addition, the release part 700 may perform plasma treatment on the surface of the mold 20 using plasma (Plasma) before performing release coating on the surface of the mold 20 . Such a demolding part 700 may include a plasma processing module 710 and an evaporation module 720 .

The plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 before performing release coating on the surface of the mold 20 to modify the surface of the mold 20 to improve the relationship between the surface of the mold 20 and the release agent. of adhesion. In addition, the plasma treatment module 710 can perform plasma treatment on the surface of the mold 20 to clean the surface of the mold 20 before coating the release agent, so as to prevent the mold 20 from being demoulded with foreign matter remaining on the surface of the mold 20 . Sexual coating. For example, the plasma processing module 710 is a normal pressure plasma generation device, which can generate plasma using at least one of argon (Ar), nitrogen (N ₂ ), and oxygen (O ₂ ) as a medium. In addition, the plasma processing module 710 may include a plasma generation part 711 that generates plasma on the surface of the mold 20 to smoothly perform plasma processing, and a guide roller 712 that The upper part of the membrane 10 guides the position of the membrane 10 so that the distance between the surface of the mold 20 and the plasma generation part 711 is maintained at a certain distance or less. The mold 20 whose surface has been subjected to plasma treatment in such a plasma treatment module 710 can be transferred to the vapor deposition module 720 .

In this way, the plasma treatment module 710 has the effect of modifying the surface of the mold 20 to improve the adhesive force between the surface of the mold 20 and the release agent. In addition, by cleaning the surface of the mold 20 This is an effect of preventing malfunctions caused by releasable coating being performed in a state where foreign matters are deposited on the surface of the mold 20 .

The evaporation module 720 can use a release agent to coat the surface of the mold 20 . In other words, the evaporation module 720 can use a release agent to coat the surface of the mold 20 after the surface is plasma treated by the plasma treatment module 710 . In addition, the evaporation module 720 may be disposed downstream of the plasma processing module 710 . Such an evaporation module 720 can use a release agent to coat the surface of the mold 20 to improve the release property of the surface of the mold 20 . In addition, the evaporation module 720 can improve the releasability of the surface of the mold 20 by transferring a plurality of substrates 30 from one mold 20 , thereby improving the reusability of the mold 20 . In addition, the evaporation module 720 can vaporize the release agent. In addition, the evaporation module 720 can supply the vaporized release agent to the surface of the mold 20 to uniformly apply the release agent to the surface of the mold 20 . Such an evaporation module 720 may include a first chamber part 721, a second chamber part 722, a fluid supply part 723, a gas exhaust part 724, an evaporation sealing part 725, a chamber driver 726, a heater 727, and a pressure Adjustment part 728.

Referring to FIGS. 4 and 5 , the first chamber portion 721 and the second chamber portion 722 may provide a coating space T1 for coating the surface of the mold 20 with a release agent. Such coating space T1 can be defined as a space formed inside the first chamber part 721 and the second chamber part 722 when the first chamber part 721 and the second chamber part 722 are in close contact with each other. In addition, the coating space T1 may be formed in which the second chamber part 722 is raised toward the first chamber part 721 by the chamber driver 726 so that the first chamber part 721 and the second chamber part 722 are in close contact with each other. Here, the second chamber part 722 and the first chamber part 721 are in close contact with each other. This means that although the film 10 is interposed between the first chamber part 721 and the second chamber part 722, the coating space T1 is sealed from the outside. condition. On the other hand, the coating space T1 can provide a space for arranging the mold 20 and a space for supplying the release agent on the surface of the mold 20 .

A first chamber groove 721a into which a first vapor deposition sealing member 725a to be described later can be inserted may be formed in the first chamber portion 721. Such first chamber groove 721a may be formed in the first chamber part 721 so as to correspond to the position of the second chamber groove 722b-2 described later when the first chamber part 721 and the second chamber part 722 are in close contact with each other.

In addition, a gas discharge port 721b may be formed in the first chamber portion 721 to allow the gas remaining on the upper side of the coating space T1 to flow. One side of such a gas discharge port 721b may be connected to the coating space T1, and the other side may be connected to the pressure adjustment flow path 728a. For example, the gas discharge port 721b may be formed in the center of the first chamber part 721, and the mold 20 may be disposed below the gas discharge port 721b.

The second chamber part 722 can be in close contact with the first chamber part 721 via the film 10 and the mold 20 to form the coating space T1. Such a second chamber part 722 can be raised toward the first chamber part 721 by the chamber driver 726 . The second chamber portion 722 may include a chamber base 722a, a chamber sidewall 722b, and a chamber protrusion 722c.

Chamber base 722a may support chamber sidewalls 722b and chamber protrusions 722c, and may be supported by chamber driver 726.

The chamber side wall 722b may be formed to protrude upward from the chamber base 722a, and may be formed to extend along an edge of the chamber base 722a. In addition, a second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed on the chamber side wall 722b. Such second chamber groove 722b-2 may be formed in the second chamber part 722 corresponding to the position of the first chamber groove 721a when the first chamber part 721 and the second chamber part 722 are in close contact with each other. Such chamber side wall 722b may be formed to surround the chamber protrusion 722c at a predetermined distance from the chamber protrusion 722c. In addition, an inlet 722b-1 for the release agent to flow may be formed in the chamber side wall 722b.

The inflow port 722b-1 may provide a passage for the release agent flowing in from the fluid supply part 723 to flow into the coating space T. One side of the inflow port 722b-1 may be connected to the rear side of the fluid supply part 723. The second supply flow path 723e is connected to the second supply channel 723e, and the other side can be connected to the coating space T1. In addition, a plurality of inflow openings 722b-1 may be formed, and the plurality of inflow openings 722b-1 may be arranged to be spaced apart in the circumferential direction of the chamber side wall 722b. For example, four inlets 722b-1 may be provided. In this way, the inflow ports 722b-1 are formed in the chamber side walls 722b at different positions from each other, so that the release agents flowing in through the inflow ports 722b-1 flow toward the mold 20 in mutually different directions. On the other hand, the release agent flowing into the coating space T1 through the inlet 722b-1 can flow in the coating space T1 and come into contact with the surface of the mold 20 to coat the surface of the mold 20.

On the other hand, the inflow port 722b-1 may be located on the lower side of the mold 20 to prevent the release agent that is sprayed from the side communicating with the coating space T1 and flows toward the mold 20 from being directly sprayed to the mold 20. Here, the lower side of the mold 20 refers to a position lower than an imaginary plane extending through a surface that is not adhered to the film 10 among the surfaces of the mold 20 . In this way, the inlet 722b-1 is disposed on the lower side of the mold 20, so that the release agent flowing from the inlet 722b-1 toward the mold 20 can be uniformly dispersed in the coating space T1, and the surface of the mold 20 can be uniformly coated.

A second chamber groove 722b-2 into which a second vapor deposition sealing member 725b to be described later can be inserted may be formed on the chamber side wall 722b. Such second chamber groove 722b-2 may be formed in the second chamber part 722 corresponding to the position of the first chamber groove 721a when the first chamber part 721 and the second chamber part 722 are in close contact with each other.

The chamber protrusion 722c may be formed to protrude from the chamber base 722a. Such a chamber protrusion 722c may be surrounded by the chamber side wall 722b, and may be formed on the chamber base 722a at a predetermined distance from the chamber side wall 722b. In addition, a discharge port 722c-1 may be formed in the chamber protruding portion 722c.

The discharge port 722c-1 may provide a passage for externally discharging the release agent flowing into the coating space T1 through the inflow port 722b-1. The release agent that has flowed into the coating space T1 through the inflow port 722b-1 can be discharged to the outside toward the discharge port 722c-1 after coating the surface of the mold 20. In addition, one side of the discharge port 722c-1 may be connected to the coating space T1, and the other side of the discharge port 722c-1 may be connected to the gas discharge part. 724 connected. The discharge port 722c-1 can communicate with the inflow port 722b-1 through the coating space T1. On the other hand, the discharge port 722c-1 may be formed in the center part of the chamber protruding part 722c, and the mold 20 may be disposed above the discharge port 722c-1. In this way, the discharge port 722c-1 is formed at the center of the cavity protrusion 722c, and the mold 20 is disposed above it, so that the release agent flowing in through the plurality of inflow ports 722b-1 can coat the mold 20 in different directions. The surface is then discharged to the outside.

On the other hand, the chamber protrusion 722c may be formed on the chamber base 722a so that the upper surface of the chamber protrusion 722c is disposed above the inlet 722b-1. In other words, the chamber protrusion 722c may be formed on the chamber base 722a such that the distance from the chamber base 722a to the upper surface of the chamber protrusion 722c is longer than the distance from the chamber base 722a to the inflow port 722b-1. In this way, the inflow port 722b-1 is formed lower than the upper surface of the chamber protruding portion 722c, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the chamber protruding portion 722c, and The release agent can be uniformly dispersed in the coating space T1. In addition, the discharge port 722c-1 can change the flow direction of the release agent flowing in through the plurality of inflow ports 722b-1 so that the release agent can be dispersed in the coating space T1. Thereby, the surface of the mold 20 can be evenly coated with the release agent.

In this manner, the first cavity portion 721 and the second cavity portion 722 have the effect of being able to uniformly coat the surface of the mold 20 with the release agent.

Referring again to FIG. 3 , a recess 722 c - 2 capable of dispersing the release agent flowing into the coating space T1 through the inlet 722 b - 1 may be formed in the cavity protruding part 722 c. Such a recessed portion 722c-2 may be formed in a shape that is recessed from the upper surface of the chamber protruding portion 722c to the lower side, and may be formed at an edge of the chamber protruding portion 722c. In this way, the recess 722c-2 is introduced into the edge of the cavity protrusion 722c, so that the boss generated by the recess 722c-2 can be formed on the edge of the cavity protrusion 722c. In addition, the recessed portion 722c-2 may be formed in the chamber protruding portion 722c adjacent to the inflow port 722b-1.

On the other hand, a plurality of recessed portions 722c-2 may be formed, and the plurality of recessed portions 722c-2 may be formed corresponding to the plurality of inflow openings 722b-1. For example, four recessed portions 722c-2 may be formed, and the four recessed portions 722c-2 may be formed at positions adjacent to the four inflow openings 722b-1. In this way, the recessed portion 722c-2 is formed adjacent to the inflow port 722b-1, so that the flow direction of the release agent flowing into the coating space T1 through the inflow port 722b-1 can be changed by the recessed portion 722c-2, and a vortex phenomenon can occur. . Therefore, due to the vortex phenomenon generated in the recessed portion 722c-2, the release agent can be dispersed in the coating space T1 without clumping, and can evenly contact and coat the surface of the mold 20.

In this way, the recessed portion 722c-2 has the effect of preventing the mold release coating from clumping on the mold 20 and causing problems due to the eddy current phenomenon.

Referring again to FIG. 5 , the fluid supply unit 723 can supply the release agent to the coating space T1 to perform release coating on the surface of the mold 20 arranged in the coating space T1 . In addition, the fluid supply part 723 can vaporize the release agent and supply the vaporized release agent to the coating space T1 through the inlet 722b-1. Such a fluid supply part 723 may include a fluid container 723a, a tank 723b, a bubbler 723c, a first supply flow path 723d, a second supply flow path 723e, and an injection device 723f.

The fluid containing body 723a may provide a space for containing the inert gas. The inert gas accommodated in the interior of such a fluid container 723a may be in a high-pressure gas state. Additionally, the inert gas may be nitrogen (N ₂ ). In addition, the fluid container 723a can supply the inert gas to one or more of the bubbler 723c and the injection device 723f through the first supply channel 723d.

Tank 723b may provide space to hold the release agent. Such a release agent accommodated in the inside of the tank 723b may be in a liquid state. In addition, the tank 723b may receive the inert gas through the bubbler 723c, and the release agent receiving the inert gas may be vaporized and supplied to the coating space T1. Therefore, the gas phase The release agent can be dispersed in the coating space T1 without clumping, so that it can evenly contact and coat the surface of the mold 20 .

The bubbler 723c can supply an inert gas of a predetermined pressure or higher to the liquid release agent accommodated in the tank 723b so that the release agent can be vaporized. Such a bubbler 723c can discharge inert gas below the surface of the release agent contained in the tank 723b. For example, the bubbler 723c may be a flow tube or an injection port formed with a plurality of injection holes. However, the present invention is not limited thereby.

The first supply flow path 723d may provide a path for the inert gas flowing from the fluid container 723a to flow to one or more of the bubbler 723c and the injection device 723f. One side of the first supply flow path 723d may be connected to the fluid container 723a, and the other side may be connected to one or more of the bubbler 723c and the injection device 723f.

The second supply flow path 723e may provide a passage for the vaporized release agent flowing in from the tank 723b to flow into the inflow port 722b-1 of the second chamber part 722. One side of the second supply flow path 723e can be connected to the inside of the tank 723b, and the other side can be connected to the coating space T1 through the inlet 722b-1.

The injection device 723f can prevent the release agent that has vaporized inside the tank 723b from forming agglomerates again. Such an injection device 723f may be arranged at a position spaced a predetermined distance upward from the surface of the liquid release agent contained in the tank 723b to supply the inert gas. Therefore, the injection device 723f can inject the inert gas at a position spaced a predetermined distance from the surface of the release agent to prevent the vaporized release agent from agglomerating again.

In this way, the fluid supply part 723 has the effect of being able to vaporize the release agent and uniformly coat the surface of the mold 20 without clumping. In addition, it has the effect of preventing the vaporized release agent from forming agglomerates again.

The gas discharge part 724 can discharge the gas and the release agent remaining on the second chamber part 722 side (for example, the lower side in FIG. 5 ) with respect to the film 10 in the coating space T1 to the outside. Such gas discharge part 724 may include a discharge flow path 724a and a discharge pump 724b.

The discharge flow path 724a can provide a passage for the gas and the release agent on the inner lower side of the coating space T1 to flow to the outside. One side of the discharge flow path 724a can communicate with the coating space T1 through the discharge port 722c-1 of the second chamber portion 722, and the other side can communicate with the outside through the discharge pump 724b.

The pressure regulator 728 can discharge the gas remaining on the upper side with respect to the film 10 inside the coating space T1 to the outside. Such pressure adjustment part 728 may include a pressure adjustment flow path 728a.

The pressure adjustment flow path 728a can provide a passage for the gas remaining on the inner upper side of the coating space T1 to flow to the outside. One side of such a pressure adjustment flow path 728a can communicate with the gas discharge port 721b of the first chamber part 721 and the coating space T1, and the other side can communicate with the outside through the discharge pump 724b.

On the other hand, in the drawings of this embodiment, although the pressure adjustment flow path 728a is shown to be connected to the discharge pump 724b of the gas discharge part 724, the idea of the present invention is not limited to this, and the pressure adjustment part 728 may also be further A separate pump different from the discharge pump 724b of the gas discharge part 724 is included, and the gas in the pressure adjustment flow path 728a can be discharged to the outside by such a separate pump.

When the gas discharge part 724 discharges the gas on the lower side inside the coating space T1, the pressure difference between the upper and lower sides of the coating space T1 will cause the film 10 to shake and hinder the coating of the mold 20, thus preventing the gas from being discharged by the pressure regulator 728. The gas on the upper side inside the coating space T1 generates a pressure difference between the upper side and the lower side inside the coating space T1.

In this way, the pressure regulator 728 has the effect of preventing the pressure difference between the upper and lower sides of the coating space T1 and preventing the coating of the mold 20 from being hindered.

When the first chamber part 721 and the second chamber part 722 are substantially in contact with each other, the evaporation sealing part 725 can seal the first chamber part 721 and the second chamber part 722 . Such a vapor deposition sealing part 725 can seal the coating space T1 from the outside by sealing the first chamber part 721 and the second chamber part 722 . In addition, the vapor deposition sealing part 725 may be formed to surround the coating space T1 to seal between the first chamber part 721 and the second chamber part 722 . Such a vapor deposition sealing part 725 may include a first vapor deposition sealing member 725a and a second vapor deposition sealing member 725b.

The first vapor deposition sealing member 725a may be inserted into the first chamber groove 721a formed in the first chamber part 721. In addition, the second vapor deposition sealing member 725b may be inserted and disposed in the second chamber groove 722b-2 formed in the second chamber part 722. Such first vapor deposition sealing member 725a and second vapor deposition sealing member 725b may be arranged to face each other. In other words, when the first chamber part 721 and the second chamber part 722 are in close contact, the first evaporation sealing part 725a and the second evaporation sealing part 725b can pressurize each other, and the first chamber part 721 and the second evaporation sealing part 725b can be pressurized. The gap between the second chamber portions 722 is sealed.

On the other hand, referring to the enlarged view of FIG. 5 , when the first evaporation sealing part 725 a and the second evaporation sealing part 725 b are in close contact with each other, the film 10 may be interposed between the first evaporation sealing part 725 a and the second evaporation sealing part. between parts 725b. In addition, the first vapor deposition sealing member 725a may pressurize the film 10 at the upper part of the film 10, and the second vapor deposition sealing member 725b may pressurize the film 10 at the lower part of the film 10. At this time, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may be configured to effectively prevent the film 10 from wrinkling under pressure by the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b. The shape of the gap between the first chamber part 721 and the second chamber part 722 is effectively sealed.

For example, when the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are formed in the same O-ring shape, the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b are in close contact with each other. This may cause the membrane 10 to wrinkle. As another example, when the first vapor deposition sealing member 725a and the second When the vapor deposition sealing member 725b is formed so that the surfaces in contact with each other have a flat shape, wrinkles of the film 10 can be prevented. However, since the pressing force between the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b is weak, the first chamber portion 721 and the second chamber portion 722 cannot be properly sealed. Therefore, it is necessary to form the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b into shapes different from each other in order to prevent the film 10 from wrinkling and seal the coating space T1. For example, one of the first vapor deposition sealing member 725a and the second vapor deposition sealing member 725b may have a planar shape when not in close contact with the other, and the other may have an O-shaped shape when not in close contact with the one. Ring and other arc shapes.

The chamber driver 726 can raise and lower the second chamber part 722 relative to the first chamber part 721 . Such a chamber driver 726 may be connected to the second chamber portion 722 .

In this manner, the vapor deposition sealing portion 725 has the effect of preventing wrinkles of the film 10 .

The heater 727 can maintain the temperature of the coating space T1 within a prescribed range to improve the adhesive force between the surface of the mold 20 and the release agent. Such a heater 727 can heat one or more of the first chamber part 721 and the second chamber part 722 to increase the temperature of the coating space T1. For example, when the temperature of the coating space T1 is 30°C or lower, the surface of the mold 20 may not be coated with sufficient mold releasability. When the temperature of the coating space T1 is 80°C or higher, the film 10 may be damaged. Therefore, the heater 727 can maintain the temperature of the coating space T1 in the range of 30°C to 80°C.

In this way, the heater 727 maintains the temperature of the coating space T1 within a predetermined range and has the effect of increasing the adhesive force between the surface of the mold 20 and the release agent.

In this way, the evaporation module 720 according to one embodiment of the present invention has the effect of improving the surface releasability of the mold 20 by applying the releasable coating to the surface of the mold 20 . In addition, by improving the releasability of the surface of the mold 20 , a plurality of substrates 30 can be transferred using one mold 20 , thereby improving the releasability of the mold 20 . usability effects. In addition, by reducing the replacement cycle of the mold 20 , the time required to transfer the pattern to the substrate 30 can be shortened, and the efficiency of the process can be improved.

Referring to FIG. 6 , the transfer part 800 can transfer the pattern of the mold 20 to the substrate 30 . For example, the transfer unit 800 may perform the process of pressing the pattern of the mold 20 to the substrate 30 and removing the pattern from the substrate 30 in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . The pattern is transferred to the substrate 30 through the process of separating the mold 20 . In addition, after the release part 700 performs release coating on the surface of the mold 20, the transfer part 800 can press one mold 20 that has been used for release coating on the plurality of substrates 30 to transfer the pattern to the plurality of substrates. 30. For example, the transfer unit 800 may repeat the process of pressing the pattern of the mold 20 to the substrate 30 a predetermined number of times in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . and the process of separating the mold 20 from the substrate 30 to transfer the pattern to a plurality of substrates 30 . As a more detailed example, when the plasma treatment module 710 processes the surface of the mold 20 with plasma once, and the evaporation deposition module 720 performs a release coating process on the surface of the mold 20 , the transfer The unit 800 can perform a plurality of processes of pressing the pattern of the mold 20 onto the substrate 30 that has been releasably coated by the evaporation module 720 and of detaching the mold 20 from the substrate 30 . In addition, the process of moving the transfer unit 800 to a position for pressing the substrate 30 and the mold 20 between the process of pressing the pattern of the mold 20 to the substrate 30 and the process of separating the mold 20 from the substrate 30 can be omitted. . Such transfer part 800 may include a frame 810, a crimping die set 820, a die separation unit 830, and a detection unit 840.

Referring to FIGS. 6 and 7 , the frame 810 may support the crimping die set 820 , the die separation unit 830 and the detection unit 840 . Such a frame 810 may be formed to surround at least a portion of the crimping die set 820 and the die separation unit 830 . Therefore, the crimping die set 820 and the die separation unit 830 can move inside the frame 810 while being supported on the frame 810 . In other words, the crimping die set 820 and the die separation unit 830 can move relative to the frame 810 . For example, the first crimping unit 821 and the second crimping unit 822 may be supported on the frame. 810 move relative to each other, the mold separation unit 830 may move relative to the mold 20 in a state supported on the frame 810 . Therefore, instead of moving the mold 20 from the pressing module 820 to the mold separation unit 830 , the mold separation unit 830 moves relative to the mold 20 , so that the process of pressing the mold 20 and the substrate 30 to each other and the process of pressing the mold 20 and the substrate can be omitted. 30 is a process in which the mold 20 pressed against the substrate 30 and the mold 20 of the substrate 30 is moved to a position where the mold 20 is separated from the substrate 30 . Furthermore, the frame 810 may include a first frame part 811 supporting the first crimping unit 821 , a second frame part 812 supporting the second crimping unit 822 , and a third frame part 813 supporting the mold separation unit 830 . Such first frame part 811, second frame part 812, and third frame part 813 can be fixedly supported integrally with each other. In addition, the second frame part 812 can support the load of the first frame part 811 and the third frame part 813.

The pressing module 820 can press the pattern of the mold 20 onto the substrate 30 . Such a pressure-bonding module 820 can press-bond the pattern of the mold 20 whose surface is subjected to plasma treatment through the mold release part 700 and the surface is releasably coated to the substrate 30 . In addition, the pressing module 820 can press the mold 20 and the substrate 30 relative to each other to press the pattern of the mold 20 to the substrate 30 . Such a crimping module 820 may include a first crimping unit 821 , a second crimping unit 822 , an exhaust part 823 , an adsorption part 824 , a driving part 825 and a crimping sealing part 826 .

Referring to FIG. 8 , the first pressing unit 821 and the second pressing unit 822 can move relative to each other and come into close contact with each other to press the pattern formed on the mold 20 to the substrate 30 . In other words, the first crimping unit 821 and the second crimping unit 822 may move toward the film 10 on opposite sides of the film 10 between the first crimping unit 821 and the second crimping unit 822 And stick to each other. In addition, at least one of the first pressure bonding unit 821 and the second pressure bonding unit 822 may press the mold 20 or the substrate 30 in a direction in which they are in close contact with each other. In this way, at least one of the first pressure bonding unit 821 and the second pressure bonding unit 822 presses the mold 20 and the substrate 30 against each other, so that the pattern formed on the mold 20 can be pressure-bonded to the substrate 30 . For example, the first pressure bonding unit 821 supports the mold 20 and the second pressure bonding unit 822 presses the substrate 30 toward the mold 20, thereby making it possible to change the pattern of the mold 20. The case is crimped to the substrate 30 . As another example, the second pressing unit 822 may support the substrate 30 , and the first pressing unit 821 presses the mold 20 toward the substrate 30 , thereby being able to press the pattern of the mold 20 to the substrate 30 .

The first crimping unit 821 and the second crimping unit 822 can be raised and lowered relative to each other by the driving part 825, and the speed of the first crimping unit 821 and the second crimping unit 822 can be individually controlled. In addition, the first crimping unit 821 and the second crimping unit 822 can move relative to the frame 810 . In other words, the first crimping unit 821 and the second crimping unit 822 can move up and down inside the frame 810 while being supported on the frame 810 .

On the other hand, the first crimping unit 821 may include a first crimping body 821a, a first support part 821b, an irradiation part 821c, a pushing prevention part 821d, a first guide member 821e, and a fixing member 821f.

The first crimping body 821a can be in close contact with the bellows 822b of the second crimping unit 822 to be described later, and can pressurize the film 10 to which the mold 20 is bonded to press the pattern of the mold 20 to the substrate 30 . Such first crimping body 821a can be supported by the first support portion 821b, and can be raised and lowered together with the first support portion 821b by the first driver 825a that raises and lowers the first support portion 821b. In addition, the first crimping body 821a may be supported on the first support part 821b, but the first crimping body 821a may also be fixedly provided on the first support part 821b. In addition, the first pressing body 821 a can be lowered toward the film 10 by the first driver 825 a and pressurize the film 10 on the upper side of the film 10 to press the mold 20 against the substrate 30 .

On the other hand, a first seal groove 821a-1 into which a first pressure-contact sealing member 826a to be described later can be inserted may be formed in the first pressure-contact body 821a. Such first sealing groove 821a-1 can be formed corresponding to the position of the second sealing groove 822b-1 of the second crimping unit 822 to be described later when the first crimping unit 821 and the second crimping unit 822 are in close contact. to the first crimping body 821a.

The first support part 821b may support the first crimping body 821a and may be supported by the first driver 825a. In addition, the movement of the first support portion 821b can be guided by the first guide member 821e. Towards. In other words, the first guide member 821e is provided through the first support part 821b, so that the first support part 821b can move along the first guide member 821e extending in one direction (for example, the up-and-down direction in FIG. 7 ). In this way, the first support part 821b can move along the first guide part 821e to move relative to the frame 810. In other words, the first support portion 821b can be raised and lowered by the first driver 825a to be raised and lowered relative to the frame 810 together with the first crimping body 821a.

The irradiation part 821c can harden the pattern pressed against the substrate 30 by the mold 20. When the pattern of the mold 20 is pressed against the substrate 30 by the first pressing body 821a, such an irradiation part 821c can irradiate ultraviolet rays to the substrate 30 to harden the resin formed on the substrate 30. Such irradiation part 821c may include an ultraviolet light source (not shown) for irradiating ultraviolet rays and a light source (not shown) through which the ultraviolet light source transmits. Such light sources may include quartz such as sapphire. In this way, the irradiation part 821c can irradiate ultraviolet rays to the substrate 30 to harden the resin formed on the substrate 30 . In addition, the film 10, the mold 20, and the substrate 30 may be configured to be ultraviolet transmissive. In addition, the irradiation part 821c may be provided on one side of the first crimping body 821a. In addition, the irradiation part 821c may contact the upper side of the film 10 to pressurize the film 10.

The pushing prevention part 821d can support the first support part 821b to prevent the first crimping body 821a and the first support part 821b from rising beyond a predetermined range from the second crimping unit 822. In other words, when the first crimping unit 821 supports the mold 20 and the second crimping unit 822 rises to pressurize the substrate 30 , the first crimping body 821 a and the second crimping body 821 a can be prevented from being pressed by the pressing force of the second crimping unit 822 . A support portion 821b is pushed to the upper side. The pushing prevention part 821d may be a cylinder, for example. Such pushing prevention part 821d may include a support member 821d-1 and a rotation member 821d-2.

The support member 821d-1 may be fixedly supported on the frame 810 and support one end of the rotating member 821d-2.

The rotating member 821d-2 may be rotatably connected to the supporting member 821d-1. One end of such a rotating member 821d-2 can be supported by the supporting member 821d-1, and the other end can selectively support the fixing member 821f. For example, when the first crimping unit 821 presses the mold 20 downward, the fixing member 821f may be supported on the upper side of the fixing member 821f to prevent the first support part 821b from being pushed upward beyond a predetermined range. In addition, when the first crimping unit 821 pressurizes the mold 20 and then rises, the rotating member 821d-2 may rotate in one direction in a manner to separate from the fixing member 821f.

On the other hand, the pushing prevention part 821d can pressurize the first support part 821b in accordance with the pressing force of the second pressure bonding unit 822. For example, when the force with which the second crimping unit 822 presses the first crimping body 821a increases, the force with which the pushing prevention portion 821d presses the first support portion 821b may also increase accordingly. In this way, the pushing prevention part 821d variably pressurizes the first support part 821b based on the pressing force of the second pressure bonding unit 822, thereby preventing the pattern from being incompletely pressed against the substrate 30. A plurality of such pushing prevention parts 821d may be provided, and the plurality of pushing preventing parts 821d may pressurize the first support part 821b at mutually different positions. For example, four push preventing portions 821d may be provided. However, this is just an example, and any number of pushing prevention parts 821d may be provided.

The first guide member 821e can guide the movement of the first support portion 821b. Such first guide member 821e may be fixedly supported on the first frame part 811, and may be formed to extend in the up and down direction. In addition, the first guide member 821e may penetrate the first support part 821b to guide the movement of the first support part 821b. For example, the first guide member 821e may be in the form of a bar extending in one direction. The first support part 821b moves along the first guide member 821e supported on the frame 810, so that the first support part 821b can move up and down relative to the frame 810.

The fixing piece 821f may provide a portion pressed by the push preventing portion 821d. One side of such a fixing member 821f can be fixedly supported by the first support portion 821b, and the other side can be selectively supported by the pushing Prevention part 821d. For example, the fixing member 821f may be supported by the push preventing portion 821d when the first crimping unit 821 and the second crimping unit 822 are in close contact. At this time, the first crimping body 821a fixed to the first support part 821b can be prevented from being pushed by the pushing preventing part 821d. As another example, the fixing piece 821f may be separated from the pushing prevention part 821d when the first crimping unit 821 rises. At this time, the rotating member 821d-2 of the pushing preventing portion 821d can rotate in one direction to be separated from the fixing member 821f.

The second crimping unit 822 may include a second crimping body 822a, a bellows 822b, a lifting cylinder 822c, a second support part 822d, and a second guide member 822e.

Referring to FIG. 9a, the second crimping body 822a may support the substrate 30 and may support the bellows 822b. Such a second crimping body 822a can be supported by the second support portion 822d, and can be raised and lowered together with the second support portion 822d by the second driver 825b that raises and lowers the second support portion 822d. The second crimping body 822a may include a substrate placement portion 822a-1, a bellows placement portion 822a-2, an adsorption port 822a-3, and an exhaust port 822a-4.

The substrate placing portion 822a-1 may provide a portion for placing the substrate 30 and may support the substrate 30. In addition, the substrate placement portion 822a-1 may be formed to protrude from the bellows placement portion 822a-2. Therefore, the substrate mounting part 822a-1 can be arranged adjacent to the film 10 rather than the bellows mounting part 822a-2.

The bellows receiving portion 822a-2 may provide a portion to receive the bellows 822b. Such bellows receiving portion 822a-2 can support the bellows 822b. In addition, the bellows placing portion 822a-2 may be formed with a boss to place the bellows 822b.

The adsorption port 822a-3 may be configured to adsorb the substrate 30 to the substrate placement portion 822a-1. Such an adsorption port 822a-3 may be formed in the substrate placement portion 822a-1. For example, the suction port 822a-3 may be formed in the center of the substrate placement portion 822a-1. Such adsorption port 822a-3 may be connected to the adsorption channel 824a, and the gas around the adsorption port 822a-3 may be discharged to the outside through the adsorption channel 824a. do For a more detailed example, when the substrate 30 is placed in the substrate placement portion 822a-1, one side of the adsorption port 822a-3 may be blocked by the substrate 30, and the other side may be connected to the adsorption channel 824a. Thereafter, when the mold 20 is pressurized to the substrate 30 and separated from the substrate 30, a vacuum may be formed around the adsorption port 822a-3 by the adsorption pump 824b. Therefore, the substrate 30 can be adsorbed to the adsorption port 822a-3 without being detached from the substrate placement portion 822a-1.

The exhaust port 822a-4 may be configured to exhaust gas remaining inside the bellows 822b to the outside. Such exhaust port 822 a - 4 can provide a passage to discharge gas remaining in the space surrounding the substrate 30 by the bellows 822 b to the outside. In addition, one side of the exhaust port 822a-4 may be connected to the internal space of the bellows 822b, and the other side may be connected to the exhaust part 823. Such exhaust port 822a-4 may be formed in the bellows placement portion 822a-2.

Referring to FIG. 9 b , the bellows 822 b can expand and contract toward the first pressing unit 821 when the mold 20 is pressed against the substrate 30 to seal the space around the substrate 30 relative to the outside. Such a bellows 822b may be configured such that one end is supported by the bellows placement portion 822a-2 and the other end is expandable and contractible relative to the second crimping body 822a. Additionally, bellows 822b may be configured to telescope. In other words, the bellows 822b may be elongated toward the first crimping unit 821 so that the space around the substrate 30 is sealed with respect to the outside. At this time, the bellows 822b can surround the substrate 30, and the end portion extending toward the first crimping unit 821 of the bellows 822b can be in close contact with the first crimping body 821a. In this way, the bellows 822b is in close contact with the first crimping body 821a, so that the substrate 30 can be isolated from the outside. Additionally, the bellows 822b may shrink when the pattern of the mold 20 is pressed against the substrate 30. Such bellows 822b can be extended or contracted by the lifting cylinder 822c.

The bellows 822b may be formed with a second seal groove 822b-1 into which a second pressure-contact sealing member 826b to be described later can be inserted. Such a second sealing groove 822b-1 can be formed in the first crimping unit When 821 is in close contact with the second crimping unit 822, the bellows 822b is formed corresponding to the position of the first sealing groove 821a-1.

The lifting cylinder 822c can raise and lower one end of the bellows 822b to expand and contract the bellows 822b. For example, the lifting cylinder 822c can be raised and lowered to extend the bellows 822b when the pattern is pressed onto the substrate 30, and can be lowered to shrink the bellows 822b after the pattern is pressed onto the substrate 30. Such a lifting cylinder 822c may be supported on the second crimping body 822a.

The second support part 822d may support the second crimping body 822a and may be supported by the second driver 825b. In addition, the movement of the second support portion 822d can be guided by the second guide member 822e. In other words, the second support portion 822d is slidably coupled to the second guide member 822e, so that the second support portion 822d can move along the second guide member 822e. In this way, the second support portion 822d can move along the second guide member 822e to move relative to the frame 810. In other words, the second support portion 822d can be raised and lowered by the second driver 825b to be raised and lowered relative to the frame 810 together with the second crimping body 822a.

The second guide member 822e can guide the movement of the second support portion 822d. Such a second guide member 822e may be fixedly supported on the second frame part 812 and may extend in an up-and-down direction. For example, the second guide member 822e may be in the form of a rail extending in one direction. The second support portion 822d moves along the second guide member 822e supported on the frame 810, so that the second support portion 822d can move up and down relative to the frame 810.

The exhaust part 823 can discharge the gas remaining in the sealed space inside the bellows 822b to the outside when the space around the substrate 30 is sealed with respect to the outside. In other words, the exhaust part 823 can exhaust the gas remaining between the bellows 822b and the first pressure bonding unit 821 to the outside, that is, the space in which the bellows 822b surrounds the substrate 30, to form a predetermined vacuum state around the substrate 30. Such exhaust part 823 may include an exhaust passage 823a and an exhaust pump 823b.

The exhaust passage 823a may provide a passage for gas flowing in from the inside of the bellows 822b to flow to the outside. One side of the exhaust passage 823a can be connected to the inside of the bellows 822b, and the other side can be connected to the outside through the exhaust pump 823b. In addition, the exhaust pump 823b can move the gas inside the bellows 822b to the outside through the exhaust passage 823a.

The adsorption part 824 can adsorb the substrate 30 to the substrate placement part 822a-1 when the mold 20 pressed against the substrate 30 is separated from the substrate 30 to prevent the substrate 30 from being detached from the substrate placement part 822a-1. In other words, the adsorption portion 824 can adsorb the substrate 30 when the mold separation unit 830 separates the mold 20 from the substrate 30 , thereby preventing the substrate 30 from being detached from the substrate placement portion 822 a - 1 by preventing the adhesion of the film 10 . For example, the adsorption part 824 may adsorb the substrate 30 using vacuum pressure. However, this is just an example, and the idea of the present invention is not limited thereto. A well-known technology capable of adsorbing the substrate 30 to the substrate placement portion 822a-1 may be used. The adsorption part 824 may include an adsorption channel 824a and an adsorption pump 824b.

The adsorption channel 824a may provide a channel for the gas flowing in from around the substrate placement portion 822a-1 to flow to the outside through the adsorption pump 824b. One side of the adsorption channel 824a can be connected to the surroundings of the substrate placement portion 822a-1 through the adsorption port 822a-3, and the other side can be connected to the outside through the adsorption pump 824b. For example, when the substrate 30 is placed in the substrate placement portion 822a-1, one side of the adsorption channel 824a may be blocked by the substrate 30, and the other side may be connected to the outside. In addition, when a portion of the substrate 30 is spaced apart from the substrate placement portion 822a-1, the adsorption channel 824a may communicate with the inside of the bellows 822b.

The adsorption pump 824b can transfer the gas around the substrate placement portion 822a-1 to the outside. For example, adsorption pump 824b may be a vacuum pump. Therefore, the vacuum generated by the adsorption pump 824b can generate a vacuum around the adsorption port 822a-3, and the substrate 30 can be adsorbed to the substrate placement portion 822a-1 by such vacuum pressure. Therefore, when one side of the channel 824a is connected to the surroundings of the substrate 30 through the adsorption port 822a-3, the substrate 30 can be adsorbed to the adsorption port 822a-3 by the adsorption pump 824b.

The driving part 825 can move the first crimping unit 821 and the second crimping unit 822 relative to each other. Such a driving part 825 may include a first driver 825a that drives the first crimping unit 821 and a second driver 825b that drives the second crimping unit 822.

The first driver 825a can raise and lower the first crimping unit 821, and can adjust the moving speed of the first crimping unit 821 according to the position of the first crimping unit 821. In addition, the second driver 825b can raise and lower the second crimping unit 822, and can adjust the moving speed of the second crimping unit 822 according to the position of the second crimping unit 822. The configuration in which the first driver 825a and the second driver 825b adjust the speed according to the positions of the first and second crimping units 821 and 822 will be described later.

Referring again to FIG. 9a , the crimping sealing portion 826 may seal between the first crimping unit 821 and the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are crimped relative to each other. Such a pressure-bonding sealing portion 826 can seal the first pressure-bonding unit 821 and the second pressure-bonding unit 822 to isolate the surroundings and the outside of the substrate 30 . The pressure seal part 826 may include a first pressure seal part 826a and a second pressure seal part 826b.

The first pressure-bonding sealing member 826a can be inserted and disposed in the first sealing groove 821a-1 formed in the first pressure-bonding unit 821. In addition, the second pressure-bonding sealing member 826b may be inserted and disposed in the second sealing groove 822b-1 formed in the second pressure-bonding unit 822. Such first pressure-contact sealing member 826a and second pressure-contact sealing member 826b may be arranged to face each other. In other words, when the first crimping unit 821 and the second crimping unit 822 crimp each other, the first crimping sealing part 826a and the second crimping sealing part 826b may pressurize each other and may seal the first crimping unit. The gap between the unit 821 and the second pressing unit 822.

On the other hand, when the first crimp sealing component 826a and the second crimping sealing component 826b are in close contact with each other, the membrane 10 may be interposed between the first crimping sealing component 826a and the second crimping sealing component 826b. between. In addition, the first pressure sealing member 826a may pressurize the film 10 at an upper portion of the film 10, and the second pressure sealing member 826b may pressurize the film 10 at a lower portion of the film 10. At this time, the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b may be formed to effectively prevent the film 10 from wrinkling due to the pressure applied by the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b. The shape of the gap between the first crimping unit 821 and the second crimping unit 822 is effectively sealed.

For example, when the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are formed in the same O-ring shape, the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are in close contact with each other. This may cause the membrane 10 to wrinkle. As another example, when the mutual contact surfaces of the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b are formed into a planar shape, the film 10 can be prevented from being wrinkled. However, the first pressure-bonding unit 821 and the second pressure-bonding unit 822 may not be properly sealed because the pressing force between the first pressure-bonding sealing member 826a and the second pressure-bonding sealing member 826b is weak. Therefore, it is necessary to form the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b into shapes different from each other in order to prevent the film 10 from wrinkling and to seal the internal space of the bellows 822b. For example, one of the first pressure-contact sealing member 826a and the second pressure-contact sealing member 826b may have a planar shape when not in close contact with the other, and the other may have an O-shaped shape when not in contact with the one. Ring and other arc shapes.

In this way, the pressure-contact sealing portion 826 has the effect of preventing the film 10 from wrinkling.

Referring to FIGS. 10 to 12 , the mold separation unit 830 may move in one direction (for example, the left-right direction in FIG. 10 ) to separate the mold 20 that is pressed against the base plate 30 from the base plate 30 . Such mold separation unit 830 can move toward the substrate 30 side to separate the mold 20 from the substrate 30 in a state where one or more of the film supply unit 400 and the film recovery unit 900 is not rotated to stop the movement of the film 10 . In addition, between the first crimping unit 821 and the second crimping unit 822 , the mold separation unit 830 can move the substrate 30 to a virtual space that is crimped to the mold 20 to separate the mold 20 from the substrate 30 . Furthermore, the mold separation unit 830 can separate the one surface with the The first roller part 831 supporting the film on the opposite side of one of the two surfaces of the film 10 of the mold 20 on which the pattern is formed moves to the substrate 30 side to separate the mold 20 pressed against the substrate 30 from the substrate 30 . The mold separation unit 830 may include a first roller part 831, a second roller part 832, a roller support part 833, a roller guide part 834, and a roller driver 835.

The first roller part 831 can support the film 10 on one side (non-adhesive side) to which the mold 20 is not adhered among both sides of the film 10 . Such first roller portion 831 can be supported by the roller support portion 833 and can move in the left and right direction together with the roller support portion 833 .

The second roller part 832 can support the film 10 on the side (adhesive surface) of the two surfaces of the film 10 to which the mold 20 is bonded. In addition, the second roller part 832 may support the film 10 so that the film 10 is bent in a direction surrounding a part of the first roller part 831 . Such second roller part 832 can be supported by the roller support part 833 and can move in the left-right direction together with the roller support part 833. In addition, the second roller part 832 may be supported by the roller support part 833 with a predetermined height difference from the first roller part 831 . In this way, the first roller part 831 and the second roller part 832 support both surfaces of the film 10 with a height difference, so that the mold 20 can be separated from the substrate 30 . In addition, the distance between the rotation center axis of the first roller part 831 and the rotation center axis of the second roller part 832 may be formed longer than the length of the mold 20 . This can prevent the mold 20 separated from the substrate 30 by the first roller part 831 from coming into contact with the second roller part 832 .

The roller support part 833 may support the first roller part 831 and the second roller part 832 and may be supported by the roller driver 835 . In addition, the roller support part 833 can be moved in the left and right direction by the roller driver 835, and the movement of the roller support part 833 can be guided by the roller guide member 834. Such roller support portion 833 can move along roller guide member 834 to move relative to frame 810 . In other words, the roller support portion 833 can be moved by the roller driver 835 to move relative to the frame 810 together with the first roller portion 831 and the second roller portion 832 .

The roller guide member 834 can guide the movement of the roller support portion 833 . Such roller guide member 834 may be fixedly supported on the third frame part 813 and may be formed to extend in the left-right direction. For example, The roller guide member 834 may be in the form of a rail extending in one direction. The roller support portion 833 moves along the roller guide member 834 supported on the frame 810 so that the roller support portion 833 can move up and down relative to the frame 810 .

The roller driver 835 can move the roller support portion 833 in one direction to separate the mold 20 from the substrate 30 . Such a roller driver 835 may be supported on the frame 810 and may support the roller support 833 . In this way, the roller driver 835 moves the roller support part 833 and can move the first roller part 831 and the second roller part 832 toward the mold 20 .

The detection unit 840 may detect the positions of the first crimping unit 821, the second crimping unit 822, and the mold separation unit 830. Such a detection unit 840 can detect the first stop position, the second stop position and the deceleration position of the first crimping unit 821, the second crimping unit 822 and the mold separation unit 830, and can pass the detected position information to the control department. Such detection unit 840 may include a first sensor part 841, a second sensor part 842, and a third sensor part 843.

Referring again to FIGS. 8 and 9 , the first sensor part 841 can detect the first stop position, the second stop position and the deceleration position of the first crimping unit 821 , and can transmit the detected position information to the control part. Such first sensor unit 841 may include a 1-1st sensor 841a, a 1-2nd sensor 841b, and a 1-3rd sensor 841c.

The 1-1th sensor 841a of the first sensor part 841 can detect the first stop position of the first crimping unit 821. Here, the 1-1th sensor 841a may be named as the first stop position detection sensor 841a of the first crimping unit 821. In addition, the first stop position of the first crimping unit 821 may be named as the first crimping step starting position, and the 1-1 sensor 841a of the first sensor part 841 may be named as the first crimping step. Start position detection sensor 841a. In addition, the first stop position refers to the position before the first crimping unit 821 moves toward the film 10 , that is, the original position of the first crimping unit 821 . When the first crimping unit 821 is In the original position state, the 1-1st sensor 841a of the first sensor part 841 can detect the position of the first pressure bonding unit 821. In addition, the 1-1st sensor 841a of the 1st sensor part 841 may be supported by the frame 810.

The 1st-2nd sensor 841b of the 1st sensor part 841 can detect the 2nd stop position of the 1st crimping unit 821. Here, the 1-2th sensor 841b may be named the second stop position detection sensor 841b of the first crimping unit 821. In addition, the second stop position of the first crimping unit 821 may be named as the second crimping step end position, and the 1-2 sensor 841b of the first sensor part 841 may be named as the second crimping step. End position detection sensor 841b. In addition, the second stop position refers to the position in close contact with the second pressure bonding unit 822 after the first pressure bonding unit 821 moves toward the film 10 and the mold 20 is pressed against the substrate 30 by the first pressure bonding unit 821 . Therefore, the 1-2nd sensor 841b can detect the position of the first pressing unit 821 when the first pressing unit 821 and the second pressing unit 822 are in close contact. In addition, the 1-2th sensor 841b may be supported on the frame 810.

The 1st-3rd sensor 841c of the 1st sensor part 841 can detect the deceleration position of the 1st crimping unit 821. Here, the 1-3th sensor 841c may be named as the deceleration position detection sensor 841c of the first crimping unit 821. In addition, the deceleration position of the first crimping unit 821 may be named the first deceleration position, and the 1-3 sensors 841c of the first sensor part 841 may be named the first deceleration detection sensor 841c. In addition, the deceleration position refers to a position where the first crimping unit 821 starts to decelerate before reaching the second stop position when the first crimping unit 821 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the first pressing unit 821 moves toward the film 10 and presses the mold 20 against the substrate 30 by the first pressing unit 821 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 1-3rd sensor 841c may be supported on the frame 810 so as to be disposed between the 1-1st sensor 841a and the 1-2nd sensor 841b.

Referring to FIG. 13 , the second sensor part 842 can detect the first stop position, the second stop position and the deceleration position of the second crimping unit 822 , and can transmit the detected position information to the control part. Such a second sensor unit 842 may include a 2-1st sensor 842a, a 2-2nd sensor 842b, and a 2-3rd sensor 842c.

The 2-1 sensor 842a of the second sensor part 842 can detect the first stop position of the second crimping unit 822. Here, the 2-1th sensor 842a may be named as the first stop position detection sensor 842a of the second crimping unit 822. In addition, the first stop position of the second crimping unit 822 may be named as the second crimping step starting position, and the 2-1 sensor 842a of the second sensor part 842 may be named as the second crimping step. Start position detection sensor 842a. In addition, the first stop position refers to the position before the second pressing unit 822 moves toward the film 10 , that is, the original position of the second pressing unit 822 . When the second crimping unit 822 is in the home position state, the 2-1 sensor 842a of the second sensor part 842 can detect the position of the second crimping unit 822. In addition, the 2-1 sensor 842a of the second sensor part 842 may be supported by the frame 810.

The 2-2 sensor 842b of the second sensor part 842 can detect the second stop position of the second crimping unit 822. Here, the 2-2th sensor 842b may be named as the second stop position detection sensor 842b of the second crimping unit 822. In addition, the second stop position of the second crimping unit 822 may be named as the second crimping step end position, and the 2-2 sensor 842b of the second sensor part 842 may be named as the second crimping step. End position detection sensor 842b. In addition, the second stop position refers to the position where the second pressing unit 822 is in close contact with the first pressing unit 821 after it moves toward the film 10 and presses the substrate 30 against the mold 20 by the second pressing unit 822 . Therefore, the 2-2 sensor 842b of the second sensor part 842 can detect the position of the second crimping unit 822 when the first crimping unit 821 and the second crimping unit 822 are in close contact. In addition, the 2nd-2nd sensor 842b of the 2nd sensor part 842 may be supported by the frame 810.

The 2-3 sensor 842c of the second sensor part 842 can detect the deceleration position of the second crimping unit 822. Here, the 2-3rd sensor 842c may be named as the deceleration position detection sensor 842c of the second crimping unit 822. In addition, the deceleration position of the second crimping unit 822 may be named the second deceleration position, and the 2-3 sensor 842c of the second sensor part 842 may be named the second deceleration detection sensor 842c. In addition, the deceleration position refers to a position where the second crimping unit 822 starts to decelerate before reaching the second stop position when the second crimping unit 822 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the second pressing unit 822 moves toward the film 10 and presses the substrate 30 against the mold 20 by the second pressing unit 822 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 2-3rd sensor 842c of the second sensor part 842 may be supported on the frame 810 so as to be disposed between the 2-1st sensor 842a and the 2-2nd sensor 842b. In addition, the second-third sensor 842c of the second sensor unit 842 may be synchronized with the expansion and contraction of the bellows 822b. For example, when the 2-1 sensor 842a of the second sensor part 842 is detected first and then the 2-3 sensor 842c of the second sensor part 842 is detected, the bellows 822b can be extended; When the 2-2nd sensor 842b of the sensor unit 842 detects the 2-3rd sensor 842c of the second sensor unit 842, the bellows 822b can be reduced in size.

Referring to FIG. 14 , the third sensor part 843 can detect the third stop position, the second stop position and the deceleration position of the mold separation unit 830 , and can transmit the detected position information to the control part. Such a third sensor unit 843 may include a 3-1st sensor 843a, a 3-2nd sensor 843b, and a 3-3rd sensor 843c.

The 3-1 sensor 843a of the third sensor unit 843 can detect the first stop position of the mold separation unit 830. Here, the 3-1th sensor 843a may be named as the first stop position detection sensor 843a of the mold separation unit 830. In addition, the first stop position of the mold separation unit 830 may be named a separation step start position, and the 3-1 sensor 843a of the third sensor part 843 may be named a separation step start position. Set detection sensor 843a. In addition, the first stop position refers to the position before the mold separation unit 830 moves toward the mold 20, that is, the original position of the mold separation unit 830 (see FIG. 14(a)). When the mold separation unit 830 is in the home position state, the 3-1 sensor 843a of the third sensor unit 843 can detect the position of the mold separation unit 830. In addition, the 3-1 sensor 843a of the third sensor part 843 may be supported on the frame 810.

The 3-2 sensor 843b of the third sensor unit 843 can detect the second stop position of the mold separation unit 830. Here, the 3-2th sensor 843b may be named as the second stop position detection sensor 843b of the mold separation unit 830. In addition, the second stop position of the mold separation unit 830 may be named as the separation step end position, and the 3-2 sensor 843b of the third sensor part 843 may be named as the separation step end position detection sensor 843b. In addition, the second stop position refers to a position after the mold separation unit 830 separates the mold 20 from the substrate 30 (see FIG. 14(b) ). In addition, the 3-2 sensor 843b of the third sensor part 843 may be supported on the frame 810.

The 3rd-3rd sensor 843c of the 3rd sensor part 843 can detect the deceleration position of the mold separation unit 830. Here, the 3-3rd sensor 843c may be named as the deceleration position detection sensor 843c of the mold separation unit 830. In addition, the deceleration position of the mold separation unit 830 may be named the third deceleration position, and the 3-3 sensor 843c of the third sensor part 843 may be named the third deceleration detection sensor 843c. In addition, the deceleration position refers to a position at which the mold separation unit 830 starts to decelerate before reaching the second stop position when the mold separation unit 830 moves from the first stop position to the second stop position. In addition, the deceleration position refers to a position before the mold separation unit 830 separates the mold 20 from the substrate 30 . Such a deceleration position may be located between the first stop position and the second stop position. In addition, the 3-3 sensor 843c of the third sensor part 843 may be supported on the frame 810 so as to be disposed between the 3-1 sensor 843a and the 3-2 sensor 843b.

As mentioned above, the detection unit 840 can detect the movement start position, deceleration start position, and movement end position of the crimping module 820 and the mold separation unit 830, and can detect the detected positions. Information is passed to the control department. In this way, the position information detected by the detection unit 840 can be used to control the driving part 825 and the roller driver 835 . In addition, the crimping module 820 and the mold separation unit 830 may accelerate the movement speed from the first stop position to the deceleration position, and decelerate the movement speed from the deceleration position to the second stop position. Therefore, the moving speed of the crimping module 820 and the mold separation unit 830 can be adjusted through the detection unit 840 . In addition, the moving speed can be decelerated only at the position where the process is actually performed to improve the efficiency of the process. In addition, when the first crimping unit 821 and the second crimping unit 822 move relative to each other and are in close contact with each other, the moving speed of the first crimping unit 821 and the second crimping unit 822 can be adjusted through the detection unit 840, so that The first crimping unit 821 and the second crimping unit 822 can be moved simultaneously instead of sequentially, thereby improving process efficiency. In this way, the detection unit 840 only slows down the movement speed at the position where the process is actually performed, thereby having the effect of improving the efficiency of the process.

The position detection part (not shown) can detect the position of the mold 20 and can transmit the detected position information to the control part. In this way, the position information of the mold 20 detected by the position detection unit can be used to control the film supply unit 400 and the film recovery unit 900. Therefore, when the mold 20 is transferred and then positioned in the demoulding part 700 or the transfer part 800, the position detection part can detect this and interrupt the rotation of one or more of the film supply part 400 and the film recovery part 900 to stop the mold. 20 transfer. Moreover, the position detection part may be arrange|positioned between at least a part of the film supply part 400, the protective film recovery part 600, the demoulding part 700, the transfer part 800, and the film recovery part 900. For example, the position detection part may detect the position of the mold 20 through a photo sensor that recognizes the mark of the film 10, or detect the position of the mold 20 through an optical device.

The distance between the plurality of molds 20 arranged adjacently on the film 10 may correspond to the distance between the vapor deposition module 720 and the transfer part 800 so that they are respectively located at the vapor deposition module 720 and the transfer part 800 . In other words, the center point of the area where the mold 20 is located in the evaporation module 720 is the same as the area where the mold 20 is located in the transfer unit 800 . The distance between the center points of the domains may be the same as the distance between the center points of adjacently arranged molds 20 among the plurality of molds 20 attached to the film 10 . For example, the center point of the area where the mold 20 is located in the evaporation module 720 may be the center point of the coating space T1. In addition, the center point of the area in which the mold 20 is located in the transfer unit 800 may be the center point of a virtual space in which the mold 20 can be disposed between the first pressure bonding unit 821 and the second pressure bonding unit 822 . Therefore, the leading mold 20 can be arranged in the transfer unit 800 , and the following mold 20 can be arranged in the evaporation module 720 , so that the following mold 20 can be used while the leading mold 20 is performing the process in the transfer unit 800 . The process is performed in the evaporation module 720. In addition, the position detection unit may be disposed between the evaporation module 720 and the transfer part 800 to detect that the preceding mold 20 is located in the transfer part 800 and the following mold 20 is located in the evaporation module 720 .

In this way, the transfer unit 800 and the evaporation module 720 perform the process of the mold 20 at the same time, thereby having the effect of improving the efficiency of the process.

The control unit can control the driving of the crimping module 820 and the mold separation unit 830 . Such a control part can receive the position information of the crimping module 820 and the mold separation unit 830 from the detection unit 840, and can control the driving of the crimping module 820 and the mold separation unit 830 based on such position information.

The control unit may control the driving of one or more of the film supply unit 400 and the film recovery unit 900 in order to transfer the film 10 in one direction. Such a control unit can receive the detected position information of the mold 20 from the position detection unit, and can control the driving of the film supply unit 400 and the film recovery unit 900 based on such position information.

The control unit can be implemented by a computing device including a microprocessor, a storage medium, a sensor, an optical measurement device, and a memory. Since its implementation is obvious to those with ordinary knowledge in the technical field, it is omitted. Further detailed instructions.

In this way, the control unit has the effect of being able to control the driving of the crimping module 820 and the mold separation unit 830 based on the position information. In addition, the control unit has the effect of being able to control the driving of the film supply unit 400 and the film recovery unit 900 based on the position information.

In this way, the transfer unit 800 according to an embodiment of the present invention can omit the process of pressing the mold 20 and the substrate 30 to each other and the process of separating the mold 20 and the substrate 30 from each other. The process of moving the mold 20 to a position where the mold 20 is separated from the substrate 30 has the effect of improving the efficiency of the process.

Next, the production method ( S10 ) of the substrate transferred by the transfer device 1 will be described with reference to FIG. 15 .

The method S10 for producing a transferred substrate can produce a substrate 30 on which the pattern is transferred by transferring the pattern of the mold 20 to the substrate 30 using the transfer device 1 according to an embodiment of the present invention. The production method S10 of such a transferred substrate may include a substrate supply step S100, a plasma treatment step S200, a release coating step S300, a transfer step S400, and a film recovery step S500.

In the substrate supply step S100 , the substrates 30 may be coated with resin, aligned in a set direction, and then supplied to the transfer unit 800 . Such substrate supply step S100 may include a substrate coating step S110 and a substrate alignment step S120.

In the substrate coating step S110 , resin may be coated with a predetermined thickness on the surface of the substrate 30 to which the pattern is to be transferred from the substrate storage unit 100 to the spin coater 200 . In such substrate coating step S110 , after the substrate 30 is placed on the rotating body by spin coating, the fluid resin can be dropped on the surface of the rotating substrate 30 to uniformly apply the resin on the surface of the substrate 30 . In addition, in the substrate coating step S110 , the temperature of the substrate 30 may be adjusted on the cooling plate 210 before the substrate 30 is coated.

In the substrate aligning step S120 , the substrates 30 whose surfaces are coated with resin and which are transferred from the spin coater 200 can be aligned in a set direction. In such substrate alignment step S120 , the plurality of substrates 30 can be aligned in the same direction by rotating the substrate 30 toward a set direction. In addition, the substrates 30 aligned in the substrate alignment step S120 may be supplied to the transfer unit 800 .

In the plasma treatment step S200 , the surface of the mold 20 may be subjected to plasma treatment to improve the releasability of the mold 20 supplied from the film supply unit 400 . Such a plasma treatment step S200 may be performed before the release coating step S300. Therefore, in the plasma treatment step S200 , the surface of the mold 20 can be modified by subjecting the mold 20 to plasma treatment before applying the release agent to the surface of the mold 20 . In addition, in the plasma treatment step S200, the surface of the mold 20 may be cleaned.

In the releasable coating step S300, the surface of the mold 20 after the plasma treatment may be releasably coated. In addition, in the release coating step S300 , the surface of the mold 20 may be coated by bringing the vaporized release agent into contact with the surface of the mold 20 . Such a release coating step S300 may be performed in a state where one or more of the film supply unit 400 and the film recovery unit 900 that are rotated to move the film 10 is not rotated. The release coating step S300 may include a release agent supply step S310, a release agent coating step S320, and a release agent purge step S330.

The release agent supply step S310 can supply the vaporized release agent to the coating space T1 formed by the first chamber portion 721 and the second chamber portion 722 being in close contact with each other. In such a release agent supply step S310, the liquid release agent may be vaporized and then supplied to the coating space T1.

In the release agent coating step S320, the surface of the mold 20 may be coated with a release agent. In the release agent coating step S320, the release agent can flow in from the inlet 722b-1 and flow in the coating space T1 to contact the surface of the mold 20 to coat the surface of the mold 20, and then be discharged through the discharge port 722c-1. to the outside.

In the release agent purging step S330, when the release coating of the mold 20 is completed, the supply of the vaporized release agent may be interrupted and air or inert gas (for example, nitrogen) may be supplied to the coating space T1. The vaporized release agent remaining in the coating space T1 is discharged to the outside.

In the transfer step S400, the pattern formed on the mold 20 may be transferred to the substrate 30. In other words, in the transfer step S400 , the mold 20 and the substrate 30 can be pressed against each other and separated to transfer the pattern to the substrate 30 . In addition, the transfer step S400 may be performed in a state where one or more of the film supply unit 400 and the film recovery unit 900 that are rotated to move the film 10 is not rotated. Such transfer step S400 may include a pressure bonding step S410 and a separation step S420.

In the crimping step S410 , the first crimping unit 821 and the second crimping unit 822 can be moved in a manner close to each other to crimp the pattern formed on the mold 20 to the substrate 30 . In addition, the first pressure bonding unit 821 and the second pressure bonding unit 822 may be moved toward the film 10 on opposite sides of the film 10 so that the first pressure bonding unit 821 and the second pressure bonding unit 822 are in close contact with each other. The crimping step S410 may include a crimping unit approaching step S411, a sealing step S412, a gas discharge step S413, and a crimping unit crimping step S414.

In the pressing unit approaching step S411, the first pressing unit 821 and the second pressing unit 822 may be brought closer to each other. In other words, the first pressing unit 821 may be close to the film 10 to which the mold 20 is bonded, and the second pressing unit 822 may be close to the substrate 30 .

In the sealing step S412, the bellows 822b may face the first pressing unit 821 to seal the substrate 30 relative to the outside. At this time, one end of the corrugated tube 822b can be in close contact with the first pressing unit 821, and the corrugated tube 822b can surround the substrate 30. In this way, the bellows 822b is in close contact with the first pressing unit 821 in a manner surrounding the periphery of the substrate 30, thereby blocking the substrate 30 from the outside.

In the gas discharge step S413, the gas remaining in the internal space of the bellows 822b sealed in the sealing step S412 can be discharged to the outside. Through such gas discharge step S413, the internal space of the bellows 822b, that is, the periphery of the substrate 30 can be brought into a predetermined vacuum state.

In the crimping unit crimping step S414, the first crimping unit 821 and the second crimping unit 822 may move relative to each other to be in close contact with each other. In other words, at least one of the first pressing unit 821 and the second pressing unit 822 is in close contact with each other to pressurize the mold 20 and the substrate 30 , so that the pattern of the mold 20 can be pressed onto the substrate 30 .

In the separation step S420, the substrate 30 to which the pattern of the mold 20 is pressed is separated from the mold 20. In such separation step S420 , the mold 20 may be separated from the substrate 30 using the mold separation unit 830 . The separation step S420 may include a purge step S421, a sealing release step S422, a crimping unit lifting step S423, and a mold separation unit moving step S424.

In the purge step S421, air or an inert gas (for example, nitrogen gas) may be supplied to the internal space of the bellows 822b to bring the internal space of the bellows 822b into the predetermined vacuum state in the gas discharge step S413 into an atmospheric pressure state.

In the sealing release step S422, the bellows 822b extended to block the substrate 30 from the outside may be reduced. At this time, the mold 20 and the substrate 30, which are blocked from the outside by the bellows 822b, can be exposed to the outside.

In the crimping unit raising step S423, the first crimping unit 821 may be raised to secure a space for the mold separation unit 830 to be moved to the substrate 30 side.

In the mold separation unit moving step S424 , the mold separation unit 830 may be moved to the substrate 30 side to separate the mold 20 from the substrate 30 . In such mold separation unit moving step S424, the mold separation unit The unit 830 can move to the space before the first pressing unit 821 rises, and through such movement, the mold 20 can be separated from the base plate 30 .

When the plasma treatment step S200 and the releasability coating step S300 are performed once, the transfer step S400 and the separation step S420 can be performed a plurality of times until the releasability of the mold 20 drops below the prescribed range, whereby one mold 20 can be used. A plurality of substrates 30 are transferred.

The releasable coating steps S300 and S400 are performed after the position detection unit detects that each of the plurality of molds 20 is located in the vapor deposition module 720 for performing the releasable coating step S300 and the transfer unit 800 for performing the transfer step S400. Transfer step S400.

In the substrate recovery step S500 , the transferred substrate 30 may be transferred to the substrate storage unit 100 .

In the film recovery step S600, when the pressure bonding step S410 and the separation step S420 are performed a plurality of times and the releasability of the mold 20 falls below a predetermined range, the mold 20 can be recovered to the film recovery unit 900.

The substrate recovery step S500 and the film recovery step S600 may be performed simultaneously or independently.

Although the transfer device 1 including the demoulding part 700 and the transfer part 800 is described above with a specific implementation, the demolding part 700 and the transfer part 800 may independently constitute a transfer device. For example, the release part 700 may constitute a transfer device alone or together with the transfer part of another embodiment. The transfer part 800 may constitute a transfer device alone or together with the release part of another embodiment. Transfer device. In addition, the demolding part 700 may optionally include a plasma processing module 710 . In addition, the transfer device 1 may optionally include a substrate storage part 100, a spin coater 200, and an alignment unit 300.

Although some embodiments of the present invention have been described above with specific implementation modes, these are only illustrations, and the present invention is not limited thereto, but should be interpreted as having the features based on the disclosures in this specification. open the widest scope of basic ideas. Those skilled in the art can combine/replace the disclosed embodiments to implement shape patterns not shown, but this does not depart from the scope of the present invention. In addition, those skilled in the art can easily make changes or modifications to the disclosed embodiments based on this description. Obviously, such changes or modifications also fall within the scope of the present invention.

1: Transfer device

10:Membrane

20:Model

30:Substrate

400: Film supply department

500: Feed roller

600: Protective film recycling department

700:Demolding Department

710:Plasma processing module

720: Evaporation module

800: Transfer Department

900: Film recycling department

Claims (18)

A transfer device, which includes: a pressure bonding module, which includes a first pressure bonding unit that can move toward a film with a mold formed on one side bonded with a pattern, and a second pressure bonding unit that can support a substrate. a press-bonding unit; and a mold separation unit including a first roller portion supporting the film on the other side of the film opposite to the side of the film, the first press-bonding unit and The second pressing unit moves toward the film on opposite sides of the film and is in close contact with each other to press the pattern formed on the mold to the substrate. The first roller portion moves toward the first pressing unit and the substrate. The space between the second pressing units that presses the substrate to the mold moves to separate the mold that is pressed to the substrate from the substrate. The transfer device according to claim 1, wherein the mold separation unit further includes a second roller part that supports the film in a manner to bend the film in a direction surrounding a part of the first roller part. The transfer device according to claim 1, wherein the second crimping unit includes a substrate placement portion that can press the mold to the substrate by the crimping module and remove the mold from the substrate by the mold separation unit. The substrate is supported when the mold is separated from the substrate, and an adsorption port capable of adsorbing the substrate is formed in the substrate placement portion to prevent the substrate from being separated from the second substrate when the mold is pressed against the substrate and separated from the substrate. The crimping unit is detached. The transfer device according to claim 1, further comprising: a frame capable of supporting the crimping module and the mold separation unit, the first crimping unit and the second crimping unit being supported on the The frames move relative to each other, and the mold separation unit moves relative to the mold in a state supported on the frame. The transfer device according to claim 1, further comprising: A frame capable of supporting the crimping module, the frame including a first frame part and a second frame part, the first crimping unit including: a first crimping body capable of pressurizing the mold; And a first guide component, which is fixedly supported on the first frame part and can guide the movement of the first crimping body. The second crimping unit includes: a second crimping body, which can support the movement of the first crimping body. the base plate; and a second guide member, which is fixedly supported on the second frame part and can guide the movement of the second crimping body. The first crimping body and the second crimping body pass through the third crimping body respectively. A guide part and the second guide part carry out movement guidance to lift relative to the frame. The transfer device according to claim 5, wherein the first crimping unit includes: a first crimping body capable of pressurizing the mold; and a first supporting part capable of supporting the first crimping body; and a push prevention part, one end of which is fixedly supported on the first frame part, and the other end is supported on the first support part, the push prevention part can pass through the second crimping unit in order to pressurize the substrate When rising, the first support portion is pressurized to prevent the first crimping body from being pushed to the upper side due to the rise of the second crimping unit. The transfer device according to claim 5, wherein the mold separation unit moves to a space between the first crimping unit and the second crimping unit for crimping the substrate to the mold to separate from the substrate. The mold is crimped to the substrate, The frame also includes a third frame part, and the mold separation unit includes: a roller guide member, which is fixedly supported on the third frame part and can guide the movement of the first roller part. The first roller part passes The roller guide member guides movement relative to the frame. The transfer device according to claim 7, wherein the first frame part, the second frame part and the third frame part are integrally fixedly supported relative to each other. The transfer device according to claim 1, further comprising: a detection unit including a first stop position, a second stop position and a deceleration position of the first crimping unit. The sensor part, and at least one of the first stop position, the second stop position and the deceleration position of the second crimping unit, the first crimping unit and the third The two pressing units move toward the film on opposite sides of the film and are in close contact with each other to press the pattern formed on the mold to the substrate. The deceleration position is located at the first stop position and the second stop position. During this period, the crimping module is driven to decelerate when it reaches the deceleration position while moving from the first stop position to the second stop position. The transfer device according to claim 9, further comprising: a control unit that receives the position information of the crimping module from the detection unit to control the driving of the crimping module. The transfer device according to claim 1, wherein the mold separation unit is capable of separating the other side of the film on the opposite side of the one side of the film on which the mold on which the pattern is formed is bonded. The first roller part supporting the film moves to a substrate side to separate the mold that is pressed against the substrate from the substrate; The transfer device also includes: a detection unit capable of detecting a first stop position, a second stop position and a deceleration position of the mold separation unit. The deceleration position is located between the first stop position and the second stop position. , the mold separation unit is driven to decelerate when reaching the deceleration position while moving from the first stop position to the second stop position. The transfer device according to claim 11, further comprising: a control unit that receives the position information of the mold separation unit from the detection unit to control the driving of the mold separation unit. The transfer device according to claim 9 or 11, wherein the detection unit includes: a first stop position detection sensor for detecting the first stop position; a deceleration position detection sensor for for detecting the deceleration position; and a second stop position detection sensor for detecting the second stop position. The transfer device according to claim 1, further comprising: a pressure-bonding sealing part, which includes a first pressure-bonding sealing component inserted into the first pressure-bonding unit, and a pressure-bonding sealing component inserted into the second pressure-bonding unit. and having a second pressure-contact sealing part having a different shape from the first pressure-contact sealing part, the first pressure-contacting unit and the second pressure-contacting unit moving toward each other on opposite sides of the film toward the film The pattern formed on the mold is pressed closely to the substrate, and the first pressing unit and the second pressing unit are on the film between the first pressing unit and the second pressing unit. The opposite sides of the film move toward the film and are in close contact with each other to press the pattern formed on the mold to the substrate. Either one of the first pressure sealing member and the second pressure sealing member is not in contact with each other. The other has a planar shape when in close contact, and the other has an arc shape when not in close contact with the one. A method for producing a transfer-printed substrate, which includes the following steps: making a first pressure bonding unit and a second pressure bonding unit have opposite sides bonded with a film forming a mold having a pattern on one side. a crimping step of moving the mold side toward the film to crimp the mold to a substrate; and moving a mold separation unit to the substrate side to separate the mold crimped to the substrate in the crimping step from the substrate The separation step, wherein the mold separation unit includes a first roller part that supports the film on another side of the film opposite to the side of the film, the separation step includes: causing the mold The separation unit moves to a space between the first crimping unit and the second crimping unit that crimps the substrate to the mold to separate the mold that is crimped to the substrate from the substrate. steps. The method for producing a transferred substrate according to claim 15, wherein the pressing step includes: moving the first pressing unit and the second pressing unit from opposite sides of the film toward the film. a pressing step of moving the film close to the pressing unit; a sealing step of extending a bellows of the second pressing unit toward the first pressing unit to seal the space around the substrate relative to the outside; and discharging to the outside A gas discharge step of gas remaining in the sealed space inside the bellows. The production method of a transferred substrate according to claim 15, wherein the separation step further includes: after the pattern of the mold is transferred to the substrate through the crimping step, the first crimping unit The rising step of a crimping unit. The production method of a transferred substrate according to claim 15, wherein at least one of a film supply unit and a film recovery unit that is rotated to move the film is not rotated. In the state, the crimping step and the separation step are repeated a prescribed number of times.