TW202113877A - 電磁波屏蔽用組成物、電磁波屏蔽用片、電磁波屏蔽用燒結體以及電子零件裝置 - Google Patents

電磁波屏蔽用組成物、電磁波屏蔽用片、電磁波屏蔽用燒結體以及電子零件裝置 Download PDF

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Publication number
TW202113877A
TW202113877A TW109133531A TW109133531A TW202113877A TW 202113877 A TW202113877 A TW 202113877A TW 109133531 A TW109133531 A TW 109133531A TW 109133531 A TW109133531 A TW 109133531A TW 202113877 A TW202113877 A TW 202113877A
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TW
Taiwan
Prior art keywords
electromagnetic wave
wave shielding
metal particles
mass
sintered body
Prior art date
Application number
TW109133531A
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English (en)
Chinese (zh)
Inventor
山岸秀明
増田宏
曽根圭太
須方振一郎
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW202113877A publication Critical patent/TW202113877A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW109133531A 2019-09-27 2020-09-26 電磁波屏蔽用組成物、電磁波屏蔽用片、電磁波屏蔽用燒結體以及電子零件裝置 TW202113877A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019177659 2019-09-27
JP2019-177659 2019-09-27
JP2020101849 2020-06-11
JP2020-101849 2020-06-11

Publications (1)

Publication Number Publication Date
TW202113877A true TW202113877A (zh) 2021-04-01

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ID=75166265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109133531A TW202113877A (zh) 2019-09-27 2020-09-26 電磁波屏蔽用組成物、電磁波屏蔽用片、電磁波屏蔽用燒結體以及電子零件裝置

Country Status (3)

Country Link
JP (1) JPWO2021060525A1 (ja)
TW (1) TW202113877A (ja)
WO (1) WO2021060525A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120096928A (ko) * 2009-11-05 2012-08-31 오르멧 서키츠 인코퍼레이티드 야금 망상 조성물의 제조 및 그것의 사용 방법
EP3597330A4 (en) * 2017-03-15 2020-11-25 Hitachi Chemical Company, Ltd. METAL PASTE FOR BONDING, BONDED BODY AS WELL AS A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING THE SAME

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Publication number Publication date
JPWO2021060525A1 (ja) 2021-04-01
WO2021060525A1 (ja) 2021-04-01

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