TW202109726A - Mounting device for electronic component mounting the electronic component to the entire mounting area without offset and with high efficiency - Google Patents

Abstract

The present invention provides a mounting device for an electronic component, which can mount the electronic component to the entire mounting area without offset and with high efficiency. The mounting device (1) includes: a platform moving mechanism (22) that moves the platform (21) so that the first recognition unit and the second recognition unit for recognizing the position of the substrate (W) supported on the platform (21) can recognize a common mark; a recognition error correction data calculation section (54), based on the position of the common mark recognized by the first recognition unit and the second recognition unit, which calculates a recognition error correction data for correcting the recognition error between the first recognition unit and the second recognition unit; and a correction section (55), based on the recognition error correction data, which corrects the positioning position of the electronic component (t) with respective to the mounting position (ap) performed mounting by the first mounting head (43A) or the second mounting head (43B).

Description

Mounting device for electronic parts

The invention relates to a mounting device for electronic parts.

A manufacturing process called Wafer Level Package (WLP) has been known since before. WLP is a technology that does not use an interposer substrate (relay substrate), but forms a rewiring layer for setting input/output (I/O) terminals in a wafer state. Since WLP does not require an interposer substrate, it can achieve thinner semiconductor packages or reduce manufacturing costs.

Among WLPs, fan-in wafer-level packages (fan in-WLP: FI-WLP) or fan-out wafer-level packages (fan out-WLP: FO-WLP) are known. FI-WLP is to form a rewiring layer on the semiconductor chip in such a way that it does not extend beyond the area on the surface of the semiconductor chip on which the electrode pads are formed. In FO-WLP, the rewiring layer is formed beyond the area of the semiconductor chip.

FO-WLP can also be applied to semiconductor chips such as random access memory (RAM), flash memory, central processing unit (CPU), or diodes, capacitors, etc. in a package The multi-chip package (MCP) of a variety of electronic parts has attracted attention.

In the FO-WLP manufacturing process, first, a plurality of semiconductor chips are mounted in rows and columns at intervals on a substrate, and then the gaps between the semiconductor chips are sealed with resin to integrate the plurality of semiconductor chips化. Thereby, a dummy wafer that is shaped like a wafer formed by a semiconductor manufacturing process is formed. A rewiring layer for arranging I/O terminals is formed on the dummy wafer. After a plurality of semiconductor chips are sealed with resin and integrated, the substrate is peeled and removed. [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2019-29563

[The problem to be solved by the invention] In the above-mentioned WLP, the deviation of the mounting positions of the respective electronic components mounted in the same package may affect each other on the electrical characteristics of the packages. Therefore, high positional accuracy is required for the mounting of each electronic component. Here, in the manufacturing process of the semiconductor package using the interposer substrate, each mounting position on the interposer substrate is provided with alignment marks for position recognition. Therefore, by applying the following method of recognizing the alignment mark (hereinafter referred to as partial mark) of each mounting position to locate and install the electronic component at the mounting position, the mounting with high position accuracy is realized. . In this way, the method in which the position detection of the mounting area of the electronic component is performed every time the electronic component is mounted when the electronic component is mounted to the mounting position on the substrate is called a local recognition method.

However, in WLP, the substrate on which electronic components are mounted is only a board formed of silicon, metal, glass, or the like. Therefore, in the mounting position of the electronic component on the substrate, there is no part that can be used as a local mark such as a circuit pattern. In addition, as described above, the substrate may peel off from the dummy wafer and be removed. Therefore, if equipment and steps that form a local mark are installed at each installation position of the substrate, it will cause an increase in equipment costs, equipment installation space, and the number of steps. Furthermore, when the operation of recognizing the local mark is performed every time an electronic component is installed, the time required to install one electronic component also increases.

In order to deal with this situation, in WLP, the following method is applied: by recognizing the overall position of the substrate by recognizing the alignment mark (hereinafter referred to as the global mark) indicating the position of the outline of the substrate or the position of the entire substrate, and relying on The electronic components are mounted on the mounting area on the substrate at the overall position of the substrate. In this way, the following method, that is, when the electronic components are respectively mounted on the multiple mounting positions of the substrate, the method in which the electronic components are mounted on the multiple mounting positions on the substrate through a single detection of the position of the substrate is called the global Identification method.

Furthermore, in recent years, substrates used in WLP have increased in size. When installing this kind of substrate, in order to improve production efficiency, the installation is carried out in the following way: a pair of installation parts are provided, and each installation part is responsible for dividing a part of a substrate into two parts, so as to install in parallel Electronic parts. In this case, the installation position installed by each installation part can be accurately positioned by correcting each of the sub-regions.

However, the mounting positions for mounting by a pair of mounting parts may be offset from each other. If it is considered that the electronic components mounted on one substrate are processed together in a subsequent step, such an offset is not preferable. For example, the rewiring step is performed by application of photosensitive material, exposure of photosensitive material, development, etching, ion implantation, resist stripping, and the like. Therefore, if the mounting position of the electronic component is shifted, problems such as shifting of the position of the mask during exposure may occur. That is, all the electronic components on the substrate need to be accurately arranged at predetermined intervals in the vertical and horizontal directions.

In order to correct this deviation, after the electronic components are mounted on a partial area of the substrate using a pair of mounting parts, the substrate is taken out and transferred to an external measuring instrument, and the electronic parts mounted by the pair of mounting parts are measured on the external measuring instrument. , And make corrections based on the position offset. However, preparation of the external measuring instrument is costly, and it takes time to move the substrate to the external measuring instrument, so the production efficiency is not good.

The present invention is an invention proposed to solve the above-mentioned problems, and aims to provide an electronic component mounting device that can efficiently mount electronic components to the entire mounting area without shifting. [Technical means to solve the problem]

In order to achieve the object, the electronic component mounting device of the present invention includes: a platform for supporting a substrate on which the electronic component is mounted in a mounting area containing a plurality of mounting positions of electronic components; A first mounting head for mounting electronic components to the mounting position, and a first mounting head moving mechanism for moving the first mounting head; a second mounting portion having a first mounting head for mounting the electronic components to the mounting position Two mounting heads, and a second mounting head moving mechanism for moving the second mounting head; the first identification part is provided in a manner capable of moving together with the first mounting head, and is opposed to all supported on the platform The position of the substrate is recognized; the second recognition part is provided in a manner capable of moving together with the second mounting head, and recognizes the position of the substrate supported on the platform; a platform moving mechanism makes the The platform moves so that the first recognition unit and the second recognition unit can recognize the common mark on the platform; the recognition error correction data calculation unit is based on the first recognition unit and the second recognition unit The position of the recognized common mark calculates recognition error correction data for correcting the recognition error between the first recognition unit and the second recognition unit; and a correction unit, based on the recognition error correction data, Correcting the positioning position of the electronic component relative to the mounting position mounted by the first mounting head or the second mounting head. [Effects of the invention]

According to the present invention, it is possible to provide an electronic component mounting device, which can efficiently mount the electronic component to the entire mounting area without offset.

Hereinafter, the electronic component mounting apparatus of the embodiment will be described with reference to the drawings. Fig. 1 is a plan view showing a substrate W on which an electronic component t is mounted. 2 is a plan view showing the appearance of the mounting device 1, FIG. 3 is a front view of the mounting device 1, and FIG. 4 is a right side view. FIG. 5 is an explanatory diagram showing a calibration board 71 placed on a stage and a board recognition camera 43f that images the calibration board 71. Fig. 6 is an explanatory diagram showing a state where the movement error correction data of the platform is repeatedly acquired by the second recognition unit. FIG. 7 is a block diagram showing the control device 50 of the mounting device 1. 8(A) to 8(C) are explanatory diagrams showing the displacement of the electronic component t mounted on the substrate W. As shown in FIG.

[Electronic Parts] As shown in FIG. 1, the object to be mounted on the substrate W by the mounting device 1 of this embodiment is an electronic component t. An example of the electronic component t is a semiconductor chip. Among them, the electronic component t is not limited to one type of semiconductor chip, and can be a variety of semiconductor chips, as well as semiconductor chips and diodes, or capacitors. The mounting device 1 of this embodiment is a device that can mount various electronic components t including semiconductor chips, diodes, capacitors, and the like on a substrate W to manufacture MCP. Examples of the structure of the MCP include: examples including a variety of semiconductor chips; examples including one type of semiconductor chip and diodes or capacitors; and examples including multiple types of semiconductor chips and diodes or capacitors.

[Substrate] As shown in FIG. 1, the substrate W of this embodiment is, for example, an FO-PLP (fan out-panel level package) used in the manufacture of a dummy wafer based on a dummy panel. Rectangular substrate used. As the substrate W, a glass substrate, an organic substrate (glass-epoxy (FR-4) substrate, etc.), a silicon substrate, a metal substrate such as stainless steel, etc. can be used, but it is not limited to these. The so-called dummy panel, like the dummy wafer used in the manufacture of FO-WLP, is formed by arranging a plurality of singulated semiconductor chips and other electronic parts on a plane, and sealing the arranged electronic parts with resin. It is in a sheet-like state. The substrate W is preferably a substrate used when manufacturing MCP by the FO-PLP process, that is, a substrate on which a plurality of electronic components t such as semiconductor chips or capacitors are mounted in each mounting area. Of course, the substrate W may also be a substrate used in the formation of a dummy wafer used in the manufacture of FO-WLP.

One surface of the substrate W of this embodiment is a mounting surface ws on which a plurality of electronic components t are mounted. The installation area MA is set on the installation surface ws. The mounting area MA includes a plurality of mounting positions ap of each electronic component t (represented by a dotted circle in FIG. 1). In addition, the installation area MA includes a first area MA1 and a second area MA2 (both are areas indicated by a chain line in FIG. 1). Therefore, the first area MA1 and the second area MA2 are each a part of the installation area MA.

The first area MA1 and the second area MA2 of the present embodiment are areas adjacent to each other by halving the mounting area MA. The mounting area MA, the first area MA1, and the second area MA2 are rectangular. In the example shown in FIG. 1, the first area MA1 and the second area MA2 are rectangular areas that are short right and left and long vertically in the figure, respectively. Each electronic component t is mounted at the mounting position ap set in a matrix of multiple rows and multiple columns in the first area MA1 and the second area MA2. In the first area MA1 and the second area MA2 of the present embodiment, the row direction in which the mounting positions ap are arranged is the direction along the short side, and the column direction is the direction along the long side. The first area MA1 and the second area MA2 are adjacent to each other at the long side portion.

Furthermore, the mounting area MA, the mounting position ap, the first area MA1, and the second area MA2 are virtually set on the mounting surface ws of the substrate W, indicating the mounting area MA, the mounting position ap, the first area MA1, and the second area The mark of MA2 is not formed on the mounting surface ws. The mounting surface ws may include an alignment mark for global recognition that indicates the overall position of the substrate W, but does not include a mark for local recognition of each mounting position ap. In the following description, the mark widely includes a dot mark, an alignment mark, a circuit pattern, the outer shape of the electronic component t, etc., which are targets for reference for recognizing the position.

[Install device] (summary) 2-7, the structure of the mounting apparatus 1 of this embodiment is demonstrated. The mounting device 1 is a device that mounts the electronic component t on the substrate W. In the following description, in the surface parallel to the mounting surface ws of the electronic component t of the substrate W on the mounting device 1, the direction in which the first area MA1 and the second area MA2 are arranged is the X direction, and the X direction The orthogonal direction is set to the Y direction. In addition, the direction orthogonal to the mounting surface ws is referred to as the Z direction. In this embodiment, the side on which the first area MA1 and the second area MA2 are arranged side by side in the mounting surface ws is set to the front. When viewed from the front, the X direction is set to the left and right direction, and the Y direction is set to the front and rear. Direction, set the Z direction to the up and down direction.

As shown in FIG. 2, the mounting device 1 includes a parts supply unit 10, a platform unit 20, a transfer unit 30, a mounting unit 40, and a control device 50. The component supply unit 10 is a device for supplying electronic components t. The stage part 20 is a device including a stage 21 on which the substrate W is placed. The transfer unit 30 is a device that takes out the electronic component t from the component supply unit 10. The mounting unit 40 is a device that receives the electronic component t taken out by the transfer unit 30 and mounts the electronic component t on the substrate W placed on the platform 21. The parts supply part 10, the platform part 20, the transfer part 30, and the mounting part 40 are installed on the base part 1a, and the said base part 1a is a base installed on the installation surface. The control device 50 is a device that controls the operations of the parts supply unit 10, the platform unit 20, the transfer unit 30, and the mounting unit 40. Hereinafter, the details of each part will be explained.

(Parts Supply Department) The parts supply part 10 is arrange|positioned at the front part of the base part 1a, and when it sees from the front, the center of the X direction is arrange|positioned. The parts supply unit 10 includes a wafer ring 11, a ring holder 12, and a push-up mechanism not shown. The wafer ring 11 is a member that holds the wafer sheet S holding the electronic component t. The electronic component t is a semiconductor chip formed by singulating a semiconductor wafer T.

The ring holder 12 is provided with a wafer ring 11 in a detachable manner. In addition, the ring holder 12 is provided in such a way that the wafer ring 11 can be moved in the XY direction by an XY moving mechanism not shown. The push-up mechanism is a mechanism that pushes up the electronic component t from the lower side of the wafer sheet S held by the wafer ring 11 when the electronic component t is taken out by the transfer unit 30. The push-up mechanism is fixedly installed at a position (postion) where the electronic component t is taken out by the transfer unit 30.

In addition, although not shown, the parts supply unit 10 includes a replacement device. The replacement device supplies the new wafer ring 11 holding the electronic component t to the ring holder 12 from the storage portion in which the wafer ring 11 is stored, and stores the wafer ring 11 after the removal of the electronic component t is completed in the storage portion.

(Platform Department) When viewed from the front, the platform portion 20 is arranged at the center of the base portion 1a in the X direction behind the parts supply portion 10 on the base portion 1a. The platform part 20 has a platform 21 and a platform moving mechanism 22. The platform 21 is a table that supports the substrate W. In the platform 21 of the present embodiment, the substrate W is placed on the surface on the opposite side to the mounting surface ws. The stage moving mechanism 22 is a mechanism that moves the stage 21 in the XY direction. In addition, although not shown, the stage moving mechanism 22 has a θ moving mechanism in the horizontal rotation direction. In addition, the platform moving mechanism 22 has a linear encoder. The scale of the linear encoder is preferably a scale made of glass with a small thermal expansion coefficient to deal with heat.

Within the movement range in the Y direction of the coordinate system required for the movement of the platform 21 and on a straight line along the X direction, a mounting head 43 (first mounting head 43A, The second mounting head 43B) locates the mounting line BL (refer to Figure 1). The installation line BL can be set as the center of the platform 21 in the Y direction. The stage moving mechanism 22 is controlled to move the stage 21 so that the rows of the mounting positions ap of the substrate W placed on the stage 21 are sequentially positioned on the mounting line BL.

The stage moving mechanism 22 has a mechanism that can move the largest substrate W placed on the stage 21 in the X direction in a range slightly larger than half of the size of the substrate W in the X direction (1/2X+α). Move the stroke. In addition, the stage moving mechanism 22 has a movement stroke capable of moving the largest substrate W placed on the stage 21 in the Y direction in a range (Y+α) that is slightly larger than the size of the substrate W in the Y direction. The platform 21 is configured to be able to suck and hold the placed substrate W by a suction suction mechanism (not shown). Furthermore, by +α in the range of movement in the X direction, the platform 21 can move in such a manner that the center portion of the platform 21 in the X direction overlaps. Regarding the repeated movement, one half of the platform 21 (the left half when viewed from the front) and the other half (the right half when viewed from the front) can be repeated with each other, or only one of them can be repeated. The way of the stroke makes the center of the stroke deviate. The magnitude of +α (the amount of repetition) in the movement range of the platform 21 in the X direction will be described later.

(Transfer Department) The transfer unit 30 has a transfer device 30A, a transfer device 30B, an intermediate stage 31, and a wafer ring holding device 32. The transfer device 30A and the transfer device 30B are arranged side by side in the X direction on the front part of the base portion 1a with the component supply portion 10 interposed therebetween. The transfer device 30A and the transfer device 30B have the same structure except for the case where they are reversed left and right. Hereinafter, the structure of the transfer device 30A on the left will be described, and the description of the structure of the transfer device 30B on the right will be omitted.

As shown in FIGS. 2 to 4, the transfer device 30A includes a Y-direction moving device 33, a transfer head 37, and a wafer recognition camera 38. The Y-direction moving device 33 is a device that supports the Y-direction moving block 34 to be freely movable in the Y direction. The Y-direction moving device 33 extends from the front end of the base portion 1a to the vicinity of the center along the Y direction on the left side of the front portion of the base portion 1a. A support body 35 is provided on the back surface of the upper end side of the Y-direction moving block 34. The support body 35 has a rectangular plate shape, and extends from the Y-direction moving block 34 to the right direction along the X-direction. On the back side of the support 35, an X-direction movable body 36 is provided. The X-direction moving body 36 is supported by a not-shown X-direction moving device so as to be movable in the X direction.

The transfer head 37 is supported by the end of the X-direction movable body 36 on the side of the parts supply unit 10. The transfer head 37 has a suction nozzle (transfer nozzle) 37a, a suction nozzle (transfer nozzle) 37b, a Z-direction moving device 37c, a Z-direction moving device 37d, a reversing mechanism 37e, and a reversing mechanism 37f. The suction nozzle (transfer nozzle) 37a and the suction nozzle (transfer nozzle) 37b are connected to an unshown air pressure circuit, and are provided so as to be able to hold the electronic component t by negative pressure. The two suction nozzles (transfer nozzle) 37a and the suction nozzle (transfer nozzle) 37b are arranged in the X direction.

The Z-direction moving device 37c and the Z-direction moving device 37d are devices that move the suction nozzle 37a and the suction nozzle 37b in the Z direction, respectively. The reversing mechanism 37e and the reversing mechanism 37f are devices that respectively reverse the suction nozzle 37a and the suction nozzle 37b up and down. Thereby, the suction nozzle 37a and the suction nozzle 37b can selectively switch the postures between the state where the suction surface of the electronic component t is held downward and the state where the suction surface faces upward. Furthermore, the suction nozzle 37a is assembled to the reversing mechanism 37e, and the reversing mechanism 37e is assembled to the Z-direction moving device 37c. In addition, the suction nozzle 37b is assembled to the reversing mechanism 37f, and the reversing mechanism 37f is assembled to the Z direction moving device 37d. That is, the transfer head 37 has two suction nozzles which can be reversed up and down.

The wafer recognition camera 38 is a device that recognizes the position of the electronic component t on the wafer sheet S toward the wafer sheet S held by the wafer ring 11 of the component supply unit 10. The end portion of the wafer recognition camera 38 on the X-direction movable body 36 on the parts supply portion 10 side is provided on a surface opposite to the surface on which the transfer head 37 is supported. When the mounting device 1 is viewed from the front, the transfer head 37 of the transfer device 30A on the left is the first transfer head, and the transfer head 37 of the transfer device 30B on the right is the second transfer head.

The intermediate stage 31 is a device that temporarily places the electronic components t taken out by the suction nozzles 37a and 37b of the left and right transfer heads 37. The intermediate platform 31 is provided between the parts supply portion 10 and the platform portion 20 on the base portion 1a. The intermediate platform 31 includes a placement portion 31a to a placement portion 31d. The placement portion 31a to the placement portion 31d are respectively associated with the two suction nozzles 37a and 37b of the transfer head 37 of the transfer device 30A, and the two suction nozzles 37a and 37b of the transfer head 37 of the transfer device 30B. correspond.

The wafer ring holding device 32 is a device that supplies and stores the wafer ring 11 to the ring holder 12 of the parts supply unit 10. As shown in FIG. 2, the wafer ring holding device 32 is provided on the end of the support 35 of the transfer device 30A on the side of the parts supply portion 10, which is the opposite side to the surface on which the X-direction movable body 36 is provided, that is, the front surface. The wafer ring holding device 32 has a support arm 32a and a chuck portion 32b. The support arm 32a is provided so as to advance and retreat in the X direction by an X-direction moving device not shown such as an air cylinder. The chuck portion 32b is a member for holding the wafer ring 11, and is provided at the front end of the support arm 32a in the right direction in the figure. In addition, the wafer ring holding device 32 can be moved in the Y direction by the Y direction moving device 33 provided with the support 35. Such a wafer ring holding device 32 functions as a part of the replacement device. That is, the wafer ring 11 is held by the chuck portion 32b, and the support arm 32a and the Y-direction moving device 33 are used to supply and store the wafer ring 11 with respect to the storage portion and the ring holder 12 not shown.

Such a transfer unit 30 sequentially takes out the electronic components t from the component supply unit 10 and moves toward the mounting unit 40. When the transfer unit 30 mounts the electronic component t face-up on the substrate W, that is, when the electrode surface of the electronic component t is set up, the transfer unit 30 supplies the components via the intermediate platform 31 The electronic component t taken out by the part 10 is delivered to the mounting part 40. In addition, when the transfer unit 30 mounts the electronic component t face-down on the substrate, that is, when the electrode surface of the electronic component t is set downward, the suction nozzle 37a and the suction nozzle 37a are mounted on the substrate. With the nozzle 37b inverted vertically and the front and back of the electronic component t is inverted, the electronic component t taken out from the component supply unit 10 is delivered to the mounting unit 40.

(Installation Department) The mounting part 40 has a first mounting part 40A and a second mounting part 40B. The first mounting portion 40A and the second mounting portion 40B have the same structure except for the case where they are reversed left and right. The first attachment portion 40A and the second attachment portion 40B are arranged side by side in the X direction with the platform portion 20 interposed on the rear side of the base portion 1a. Hereinafter, only the structure of the first mounting portion 40A on the left will be described, and the description of the structure of the second mounting portion 40B on the right will be omitted.

The first mounting portion 40A has a support frame 41, a head support body 42, a mounting head 43, and an imaging unit 44. The support frame 41 has a door shape in a side view, and is provided along the Y direction on the left of the platform portion 20 on the base portion 1a (refer to FIG. 4). The head support body 42 is provided so as to be movable in the Y direction via the Y direction moving device 41a on the right side surface of the support frame 41. The head support 42 extends in the X direction to the vicinity of the center of the base portion 1a.

The mounting head 43 is a device for mounting electronic components to the mounting position ap. Hereinafter, the mounting head 43 of the first mounting portion 40A is set as the first mounting head 43A, and the mounting head 43 of the second mounting portion 40B is set as the second mounting head 43B, and when the two are not distinguished, Set as the mounting head 43 only. The mounting head 43 is provided so as to be movable in the X direction on the front surface of the head support body 42 via the X direction moving device 42a. The mounting head 43 has a mounting tool 43a, a mounting tool 43b, a Z-direction moving device 43c, a Z-direction moving device 43d, and an imaging unit 44. The mounting tool 43a and the mounting tool 43b are a pair of tools that hold the electronic component t and mount the electronic component t on the substrate W. The mounting tool 43a and the mounting tool 43b are suction nozzles, are connected to a pneumatic circuit not shown, and are installed so as to be able to hold the electronic component t by negative pressure. The mounting tool 43a and the mounting tool 43b are provided at the same arrangement interval as the suction nozzle 37a and the suction nozzle 37b of the transfer head 37.

The mounting tool 43a and the mounting tool 43b are provided with a window (not shown) at the end on the opposite side to the part where the electronic component t is sucked and held. The window is made of transparent components. In addition, the said member should just be a member which can transmit light, and it is not limited to being transparent. Thereby, the electronic component t sucked and held by the mounting tool 43a and the mounting tool 43b can be observed through the window. The mounting tool 43a and the mounting tool 43b include a rotating device not shown, which can rotate the sucked and held electronic component t in the XY plane.

Furthermore, in the mounting tool 43a and the mounting tool 43b, the mounting tool 43b located at the center side of the base portion 1a, that is, on the inner side, is equipped with a board recognition camera 43f as a recognition unit. The board recognition camera 43f is installed so as to be movable together with the mounting head 43, and recognizes the position of the board W. More specifically, the board recognition camera 43 f images the alignment mark (global mark) of the board W placed on the stage 21. In addition to the function of photographing an image, the board recognition camera 43f also has a function of processing the photographed image to recognize the position of a recognition target such as an alignment mark. Therefore, the board recognition camera 43f functions as a recognition unit for recognizing the position of the board W. In addition, the board recognition camera 43f images the dot marks 72 of the calibration board 71 described later. Furthermore, the board recognition camera 43f can recognize the mounting position ap where the electronic component t is mounted based on the recognized position of the board W. Hereinafter, the board recognition camera 43f of the first mounting portion 40A is referred to as the first recognition portion, and the board recognition camera 43f of the second mounting portion 40B is referred to as the second recognition portion. When the two are not distinguished, they are only used as the recognition unit.

The Z-direction moving device 43c and the Z-direction moving device 43d are devices that move the two mounting tools 43a and 43b in the Z direction, respectively. The Y-direction moving device 41a, the X-direction moving device 42a, the Z-direction moving device 43c, and the Z-direction moving device 43d constitute a mounting head moving mechanism. The mechanism that moves the first mounting head 43A of the first mounting portion 40A is set as a first mounting head moving mechanism, and the mechanism that moves the second mounting head 43B of the second mounting portion 40B is set as a second mounting head moving mechanism, When the two are not distinguished, only the mounting head moving mechanism is used.

The imaging unit 44 is a unit for imaging the electronic component t held by the mounting tool 43a and the mounting tool 43b. The imaging unit 44 has four chip recognition cameras 44a to 44d above the four mounting portions 31a to 31d of the intermediate platform 31, corresponding to the four mounting portions 31a to 31d.

The chip recognition camera 44a to the chip recognition camera 44d can photograph the electronic components t placed on the placement section 31a to the placement section 31d, and can be moved to the chip recognition camera 44a through the window pair of the mounting tool 43a and the mounting tool 43b. The electronic component t held by the mounting tool 43a and the mounting tool 43b below the chip recognition camera 44d is photographed. In addition, the chip recognition camera 44a to the chip recognition camera 44d have a function of processing the captured image and recognizing the position of the photographic object such as the electronic component t.

The chip recognition camera 44a to the chip recognition camera 44d are supported by a pair of XY moving device 44e and XY moving device 44f so as to be able to move in the XY direction as a set of two. The group of two chip recognition cameras (44a and 44b and 44c and 44d) are arranged at the same arrangement interval as the installation tool 43a, the installation tool 43b, and the suction nozzle 37a and the suction nozzle 37b. A pair of XY moving device 44e and XY moving device 44f are supported by the camera support frame 44g. The camera support frame 44g has a gate shape when viewed from the front, and extends in the X direction between the parts supply portion 10 and the platform portion 20 on the base portion 1a. The camera support frame 44g is installed on the left and right support frames 41 at the front end portions of the upper surfaces of the left and right support frames 41 of the mounting portion 40. The chip recognition camera 44a-the chip recognition camera 44d are supported on the lower side of the beam part of the camera support frame 44g.

This type of mounting unit 40 receives the electronic component t taken out from the component supply unit 10 by the transfer unit 30 and mounts the received electronic component t on the substrate W placed on the platform 21. In this embodiment, the mounting tool 43a and mounting tool 43b of the first mounting head 43A mount the electronic component t to the first area MA1, and the mounting tool 43a and mounting tool 43b of the second mounting head 43B mount the electronic component t to the first area MA1. The second area MA2. The mounting of the electronic component t by the first mounting head 43A and the mounting of the electronic component t by the second mounting head 43B are performed in parallel.

As shown in FIG. 2, in a state where the platform 21 is located at the center of the base portion 1a in the X direction and the substrate W is supported at the center of the platform 21, the first mounting head 43A during installation is disposed on one of the platforms 21 relative to the platform 21. On the other side (the left side in the figure), the second mounting head 43B is arranged on the other side (the right side in the figure) with respect to the platform 21. The movable range of the first mounting head 43A and the second mounting head 43B is divided into two with the center position of the base portion 1a in the X direction as a boundary. As a result, the first mounting head 43A and its substrate recognition camera 43f cannot pass the center position of the base portion 1a and move to the movement area of the second mounting head 43B, and the second mounting head 43B and its substrate recognition camera 43f cannot pass the base portion 1a. It moves to the movement area of the first mounting head 43A. Furthermore, FIG. 5 shows the platform 21 and the board recognition camera 43f. In FIG. 5, the state where the calibration board 71 mentioned later is mounted on the stage 21 is shown. The platform 21 is positioned at the center of its movement stroke in the X direction. In addition, FIG. 5 shows a state in which the first mounting head 43A and the second mounting head 43B are located at the left end of each movement range. Therefore, in FIG. 5, drawing is performed so that each board|substrate recognition camera 43f may be located at the left end of each movement range. In this embodiment, the range of movement of the first mounting head 43A and the second mounting head 43B is restricted by a physical mechanism. Among them, the range of movement can also be restricted by program control.

As described above, the moving ranges of the first recognition unit and the second recognition unit are restricted by the area that divides the base portion 1a into two. Therefore, even if one of the recognition parts is moved, the mark existing in the area of the other recognition part cannot be recognized. Therefore, the same mark (common mark) cannot be recognized only by the movement of the recognition unit. However, in this embodiment, the platform moving mechanism 22 can move the platform 21 so that the first recognition unit and the second recognition unit can recognize the common mark. That is, as described above, the platform 21 can move in such a manner that the center part of the platform 21 in the X direction overlaps. By moving the platform 21, for example, the dot mark 72 in the first area MA1 corresponding to the movement range of the first recognition section of the calibration board 71 as a common mark can be moved to the second mounting section as the second recognition section. The 40B board recognizes the position where the camera 43f can perform imaging. That is, the board recognition camera 43f of the first mounting portion 40A and the board recognition camera 43f of the second mounting portion 40B can image the same dot mark 72 (common mark). As described above, the stage moving mechanism 22 has a size (1/2X+α) that allows the largest substrate W placed on the stage 21 in the X direction to be slightly larger than half of the size of the substrate W in the X direction. The movement stroke of the movement within the range. Furthermore, the size of the +α can be determined based on the presence of the dot marks 72 used as a common mark in the row of dot marks 72 (a row along the Y direction) in the first area MA1 (refer to FIG. 1) of the correction substrate 71. To determine the number of columns. For example, when there are dot marks 72 used as common marks in two rows of the first area MA1 that are close to the second area MA2, it can be based on the length in the X direction of the area surrounding the two rows. To decide +α. (Refer to FIG. 6) According to the range of +α determined in this way, the platform moving mechanism 22 can move the platform 21 so that the first recognition unit and the second recognition unit can recognize the common mark.

More specifically, as in the area shown by the dotted line in FIG. 6, the platform 21 moves so that the board recognition camera 43f of the second mounting portion 40B can correct the first area MA1 of the board 71 near the second area MA2. The column of dot marks 72 (the column along the Y direction) is photographed. In FIG. 6, as in FIG. 5, both board recognition cameras 43f are located at the left end of each movement area. Among them, FIG. 6 shows a state where the platform 21 moves to the second area MA2 side, so that the board recognition camera 43f of the second mounting portion 40B can photograph the dot marks 72 in the first area MA1 indicated by the dotted line. For example, as shown in the area enclosed by the dotted line in FIG. 6, it is possible to image the dot marks 72 in two columns close to the second area MA2 among the dot marks 72 of the first area MA1. Furthermore, it can also be moved by the platform moving mechanism 22, and the board recognition camera 43f of the first mounting portion 40A can photograph the dot marks 72 in the second area MA2. In this case, for example, it is only necessary to be able to image the two columns close to the first area MA1 among the dot marks 72 of the second area MA2. Furthermore, it is not limited to two rows, and more than two rows may be used, as long as at least one row can be photographed.

(Control device) The structure of the control device 50 will be described with reference to the block diagram of FIG. 7. The control device 50 is a device that controls the operations of the parts supply unit 10, the platform unit 20, the transfer unit 30, and the mounting unit 40 based on the control information stored in the memory unit 56. The control device 50 may be constituted by, for example, a dedicated electronic circuit or a computer running in a predetermined program. That is, regarding the control of the parts supply unit 10, the platform unit 20, the transfer unit 30, and the mounting unit 40, the control content is programmed and executed by a processing device such as a programmable logic controller (PLC) or CPU .

The control device 50 has a mechanism control unit 51, an image processing unit 52, a movement error correction data calculation unit 53, an identification error correction data calculation unit 54, a correction unit 55, a storage unit 56, and an input/output control unit 57. The mechanism control unit 51 controls the operations of the parts supply unit 10, the platform unit 20, the transfer unit 30, and the mounting unit 40. The image processing unit 52 converts the image data from the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition camera 44a to the chip recognition camera 44d into a format suitable for display on the display.

The movement error correction data calculation unit 53 calculates movement error correction data for correcting the movement error caused by the movement of the platform 21. The movement error is an error caused by the accuracy of the guide rail that guides the movement of the platform 21, the accuracy of assembly to the metal frame, and the like.

The recognition error correction data calculation unit 54 calculates the recognition error correction for correcting the recognition error between the first recognition unit and the second recognition unit based on the position of the common mark recognized by the first recognition unit and the second recognition unit data. The reason for this recognition error is that there is an offset between the coordinate system of the first recognition portion of the first mounting portion 40A and the coordinate system of the recognition portion of the second mounting portion 40B.

If there is such an offset, for example, as shown in FIG. 8(C), the position of the electronic component t mounted in the first area MA1 shown in FIG. 8(A) is the same as that shown in FIG. 8(B). There is an offset d between the positions of the electronic parts t mounted to the second area MA2 shown. In (C) of FIG. 8, only the offset d in the Y direction is shown, but the offset in the X direction may also occur. The data for correcting this recognition error is the recognition error correction data.

In addition, as described above, in order for the first recognition unit or the second recognition unit to recognize the common mark, the platform 21 moves. In this case, a movement error of the platform 21 may also occur. The movement error correction data calculation unit 53 of the present embodiment also calculates movement error correction data for the movement of the platform 21 for identifying a common mark during repeated movement across the first area MA1 and the second area MA2 The movement error is corrected.

The calculation of the movement error correction data can be performed using the calibration board 71 with dot marks 72 or the board W on which the electronic component t has been mounted (which may be for products or for testing). Specifically, the calibration substrate 71 is placed on the platform 21. In a state where the left and right board recognition cameras 43f are stopped at a predetermined position, the stage 21 (correction board 71) is moved at a pitch in accordance with the arrangement of the dot marks 72 within a range in which the movement error correction data is to be obtained. Then, within the range, the positional deviation between the position of each point mark 72 recognized by the imaging by the board recognition camera 43f and the reference position (for example, the center of the imaging field of view) is obtained, and based on these, the movement error correction data is calculated . The same applies to the case of using the electronic component t that has been mounted on the substrate W instead of the dot mark 72 of the calibration substrate 71.

Furthermore, the movement error correction data may include not only the movement error of the platform 21, but also the movement error of the board recognition camera 43f, the mounting head 43A, and the mounting head 43B. That is, when the movement error correction data calculation unit 53 calculates the movement error correction data, not only the platform 21 but also the mounting head 43A and the mounting head 43B may obtain the movement error correction data and correct the movement error during the movement. The movement error correction data of the mounting head 43A and the mounting head 43B, similar to the movement error correction data of the stage 21, can be obtained using the correction board 71 with dot marks 72 or the board W on which the electronic component t has been mounted. Furthermore, since the board recognition camera 43f is mounted on the mounting head 43, the movement error correction data of the board recognition camera 43f is also regarded as the same as the movement error correction data of the mounting head 43.

Specifically, as described above, the calibration substrate 71 is placed on the platform 21. Set the stage 21 to be fixed (stop) at the origin position, and move the mounting head 43A and the mounting head 43B (board recognition camera 43f) in accordance with the arrangement of the dot marks 72 within the range where the movement error correction data is to be obtained. . Then, within the range, the positional deviation between the position of each point mark 72 recognized by the imaging by the board recognition camera 43f and the reference position (for example, the center of the imaging field of view) is obtained, and based on these, the movement error correction data is calculated . In this way, more accurate installation can be achieved. The same can be applied to the case of using the electronic component t that has been mounted on the substrate W instead of the dot mark 72 of the calibration substrate 71.

The correction unit 55 corrects the positioning position of the electronic component t with respect to the mounting position ap mounted by the mounting head 43 based on the movement position error data and the recognition error correction data. That is, the correction unit 55 uses the first mounting portion 40A and the second mounting portion 40B to position the electronic component t to the mounting position ap based on the movement position error data and the recognition error correction data. The amount of movement on the coordinates of the head 43B is corrected. The above situation refers to the correction of the target position on the coordinates as the positioning target.

The storage unit 56 stores various information required for the control of the mounting device 1. The information memorized in the memory unit 56 includes not only the operating program for each unit for mounting the electronic component t on the substrate W, but also the movement position error data, the recognition error correction data, the coordinates of each mounting position ap, and the mounting area MA. The coordinates of the position, the coordinates of the positioning position, the image data from the wafer recognition camera 38, the substrate recognition camera 43f, the chip recognition camera 44a to the chip recognition camera 44d, the position coordinates of the recognized mark, and the like.

Furthermore, an input device 61 and an output device 62 are connected to the control device 50. The input device 61 is an input component such as a touch screen, a joystick, a switch, a keyboard, and a mouse required for the operator to operate the installation device 1 via the control device 50.

The output device 62 is an output component such as a display, a lamp, a meter, a speaker, a buzzer, and the like that sets information for confirming the state of the device in a state that can be recognized by the operator. For example, the images taken by the wafer recognition camera 38, the substrate recognition camera 43f, and the chip recognition camera 44a to the chip recognition camera 44d can be displayed on the display and confirmed by the operator.

[Action of installing device] Next, in addition to referring to FIGS. 1 to 8(A) to 8(C), the operation of the mounting device 1 will be described with reference to FIGS. 9 and 10.

[summary] When electronic components such as the electronic component t are mounted on each mounting area of the substrate W, when only the global recognition method is applied, the position recognition of each mounting position ap based on the local mark is not performed. Therefore, the positioning accuracy of the electronic component t with respect to each mounting position ap depends on the recognition accuracy of the global mark of the substrate W, etc., the machining accuracy of the stage moving mechanism 22 of the stage 21, and the like.

However, it is substantially impossible in terms of metal processing to finish machining a guide rail or the like that guides the movement of the platform 21 with an accuracy of ± several μm or less within a desired range. Furthermore, it is even more impossible to assemble a guide rail having a desired length to a metal frame or the like with straightness and curvature of ± several μm or less. Therefore, the movement error correction data calculation unit 53 measures the movement position error of the platform 21, calculates the movement error correction data for correcting the movement error of the platform 21, and stores it in the memory unit 56.

In addition, in this embodiment, the coordinates of the common mark are recognized by the first recognition unit and the second recognition unit, the difference between the coordinates recognized by the two is calculated, the recognition error is measured, and the recognition for correcting the recognition error is calculated. The error correction data is stored in the memory unit 56. Furthermore, in the present embodiment, the platform 21 is moved in order for the first recognition unit or the second recognition unit to recognize the common mark. The movement error correction data for correcting the movement error in the movement of the platform 21 is also stored in the storage unit 56.

[calibration] The calculation and memory of the movement error correction data and the calculation and memory of the recognition error correction data are called calibration. First, the operation of the calibration performed before the mounting of the electronic component t will be described. As shown in Figs. 5, 6, and 9, the calibration uses a calibration substrate 71. The calibration substrate 71 is, for example, a substrate in which dot marks 72 for position recognition are provided in a matrix (column) at intervals of several mm on a glass substrate (illustration of a part of the dot marks 72 is omitted). The size of the calibration substrate 71 is not limited, but it is preferable to have the same size as the substrate W with the largest size applicable to the mounting device 1, and the range in which the dot mark 72 is provided is the same as the range on the substrate W including the mounting area MA The same size. In addition, the dot mark 72 is a mark for grasping the movement error of the platform 21, and does not correspond to the installation position ap. The arrangement of the mounting position ap mainly depends on the size of the electronic component t, but the dot marks 72 are preferably arranged at the maximum interval that can ensure the required accuracy. The shorter the interval of the dot marks 72 is, the more accurately the movement error can be grasped. On the other hand, the greater the number of recognitions between predetermined distances, the longer the time required for recognition. In addition, the dot mark 72 is formed of a metal thin film or the like, and can be formed using a film forming technique such as etching or sputtering. The calibration substrate 71 is placed on the platform 21. The method of placing the calibration substrate 71 is not particularly limited. For example, it is only by the movement of the platform 21 in the X direction, and all the dot marks 72 in the same row along the X direction within the movable range of the platform 21 pass through the substrate. The position of the calibration board 71 on the platform 21 is adjusted by recognizing the center of the imaging field of view V of the camera 43f.

(Calculation of movement error correction data) Next, the first recognition unit and the second recognition unit recognize the position of each point mark 72 of the calibration substrate 71 placed on the platform 21 using the method described above, and the movement error correction data calculation unit 53 calculates the movement error of the platform 21 Correct the information. That is, the board recognition camera 43f of the first recognition unit and the board recognition camera 43f of the second recognition unit recognize the position of the dot mark 72. Then, the movement error correction data calculation unit 53 calculates the movement error of the dot mark 72 and the movement error correction data based thereon. At this time, the dot mark 72 is regarded as the installation position ap, and the range in which the dot mark 72 is provided is assumed to be the installation area MA. The installation area MA is divided into two, and the first area MA1 and the second area MA2 are assumed. Hereinafter, the calibration board 71 is also simply referred to as the mounting area MA, the first area MA1, and the second area MA2.

The recognition of the dot mark 72 is performed by moving the calibration board 71 in a state where the board recognition camera 43f of the first recognition unit and the board recognition camera 43f of the second recognition unit are stopped at predetermined positions. Regarding the imaging of the dot mark 72 on the calibration substrate 71, for example, as shown in FIG. 9, from the dot mark 72 at the left end of the calibration substrate 71 (on the side on the rear side of the base portion 1a) toward the right in the X direction It starts to move at the arrangement interval of the dot marks 72, that is, in pitch units, and sequentially turns back toward the front portion (the side on the front portion side of the base portion 1a), and at the same time, photographs are taken.

At this time, the board recognition camera 43f of the first recognition unit photographs the dot marks 72 provided in the first area MA1 among the dot marks 72 on the calibration board 71. In addition, the board recognition camera 43f of the second recognition unit images the dot marks 72 provided in the second area MA2 among the dot marks 72 on the calibration board 71.

Specifically, for example, as shown in FIG. 9, in a state where the stage 21 is positioned at the center of the movement stroke of the stage moving mechanism 22 in the XY direction (this position is referred to as the origin position), the board of the first recognition unit The recognition camera 43f is positioned at the center 71A of the dot mark group existing on the correction substrate 71 corresponding to the first area MA1. In addition, the board recognition camera 43f of the second recognition unit is positioned at the center 71B of the dot mark group existing on the calibration board 71 corresponding to the second area MA2. That is, in a state where the center of the mounting area MA of the calibration board 71 is positioned at the origin position of the stage 21, the board recognition cameras 43f are positioned at the center positions of the first area MA1 and the second area MA2 of the calibration board 71. Therefore, the two substrate recognition cameras 43f are positioned at the same position in the Y direction, and are positioned at an interval (pitch) equivalent to the interval (pitch) of the first area MA1 and the second area MA2 in the X direction. In the state where the XY positions of both board recognition cameras 43f are stopped from the above state, the operator operates the stage moving mechanism 22 while looking at the display to move the calibration board 71 so that the dot mark group corresponding to the first area MA1 The point mark 72 on the upper left of the group is located at the center of the imaging field of view V of the board recognition camera 43f of the first recognition section. Thereby, the point mark 72 on the upper left of the point mark group corresponding to the first area MA1 is located within the imaging field of view V of the board recognition camera 43f of the first recognition unit. At this time, the relationship becomes such that the upper left dot mark 72 of the dot mark group corresponding to the second area MA2 is located within the imaging field of view V of the board recognition camera 43f of the second recognition section. In each dot mark group corresponding to the first area MA1 and the second area MA2, the dot mark 72 on the upper left becomes the first dot mark 72.

After the first dot mark 72 is positioned so as to be the center of the imaging field of view V of the board recognition camera 43f, the detection operation of the dot mark 72 by both board recognition cameras 43f is started. From then on, automatic control by the control device 50 is performed. The detection operation is started when the operator presses (touches) the start button of the detection operation displayed on the touch screen. When the detection operation of the point mark 72 is started, the first point mark 72 is photographed first. A well-known image recognition technique is used to process the image of the first point mark 72 that is taken, and the positional deviation of the point mark 72 with respect to the center of the imaging field of view V of the board recognition camera 43f is detected. The detected positional deviation is stored in the storage unit 56 as information paired with the moving position (XY coordinates) of the platform 21. In this way, the position recognition of the dot mark 72 includes recognition based on an image, grasping of the position, and detection of a position shift.

After the position recognition of the first point mark 72 is completed, the platform 21 moves according to the movement sequence, so as to position the next (second) point mark 72 in the field of view of the camera. In the example of FIG. 9, since the second dot mark 72 is located to the right of the first dot mark 72, the platform 21 is moved to the left in the X direction by one pitch.

The movement of the stage 21 is performed based on the read value of the linear encoder of the XY movement mechanism (the stage movement mechanism 22) provided on the stage 21. After the movement of the stage 21 is completed, the positional deviation of the second dot mark 72 is detected in the same way as the first dot mark 72, and is stored in the memory 56 as information paired with the XY coordinates of the stage 21 at this time. Using both board recognition cameras 43f to perform such an operation on the dot marks 72 of the respective target areas, the movement error correction data of the dot marks 72 corresponding to the respective positions of all the dot marks 72 on the calibration board 71 are calculated, and And it is memorized by the memory unit 56. After calculating the movement error correction data of all the dot marks 72 on the calibration board 71, the stage moving mechanism 22 is used to move the calibration board 71 by the amount of +α in the X-direction stroke of the stage 21, and the second recognition unit is used The board recognition camera 43f recognizes the dot mark 72 existing in the +α area, and further calculates and stores the movement error correction data for the +α area. Thereby, regarding the part where the movement of the platform 21 can be repeated, the part where the movement of the platform 21 is expanded also obtains movement error correction data.

(Calculation of recognition error correction data) Furthermore, the recognition error correction data calculation unit 54 performs calculations to obtain the recognition error correction data. The recognition error correction data is calculated by recognizing the common mark by the first recognition unit and the second recognition unit, and calculating the difference between the coordinates of the two.

For example, as shown by a dotted line in FIG. 9, at least one dot mark 72 located in two columns close to the second area MA2 among the dot marks 72 of the first area MA1 is set as a common mark. In this embodiment, the selected one dot mark 72 located in the two columns is set as a common mark.

More specifically, as shown in FIG. 9, the board recognition camera 43f of the first recognition unit is positioned at the center 71A of the dot mark group, and the board recognition camera 43f of the second recognition unit is positioned at the center of the dot mark group. In the state of the center 71B, the stage 21 is moved by the stage moving mechanism 22 so that the dot mark 72 used as a common mark among the dot marks 72 of the first area MA1 is positioned in the field of view of the board recognition camera 43f of the second recognition section Move in the center of the way to identify. That is, the area of the dot mark 72 recognized by the board recognition camera 43f of the second recognition unit is expanded, and the recognition of the dot mark recognized by the board recognition camera 43f of the first recognition unit is repeated as in the content shown in FIG. 72. Then, for the common point mark 72, the difference between the coordinates (X ₁ , Y ₁ ) recognized by the first recognition unit and the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit is calculated, and the error is calculated Recognition error correction data for correction. In this embodiment, the calculated difference is used as identification error correction data.

When moving the platform 21 to recognize the dot marks 72 that are overlapped in this way, the moving position of the platform 21 is corrected with reference to the movement error correction data obtained previously. In this way, the coordinates (X ₂ , Y ₂ ) recognized by the second recognition unit are memorized by the memory unit 56 together with the recognition error correction data and the movement error correction data.

The calculation of the movement error correction data and the recognition error correction data is basically carried out when the mounting device 1 is driven, and the movement of the platform 21 can be controlled based on the measurement result. Among them, a heater or the like that assists in the mounting of the electronic component t may be incorporated in the platform 21. In this case, the temperature of each part of the device rises, and there is a concern that the mechanical accuracy is lowered due to thermal expansion. In addition, as the mounting step of the electronic component t performed by the mounting device 1 progresses, the mechanical accuracy of each part of the device may be reduced due to heat generated by a motor of the moving device that moves the mounting head 43 and the like. When considering the movement error due to such a temperature rise, the calculation is not limited to only one time when the device is driven, and may be performed periodically.

In addition, after the electronic component t is mounted, at least one electronic component t among the electronic components t on the mounted substrate W may be used as a common mark. In this way, by recognizing the common mounted electronic component t by the first recognizing unit and the second recognizing unit, the recognition error correction data can be acquired in the same manner as described above. That is, the common mark recognized by the first recognition unit and the second recognition unit includes not only the dot mark 72 but also the electronic component t. In addition, the position recognition of the electronic component t can be performed by relying on the mark when there is a mark that can be distinguished such as an alignment mark or a circuit pattern on the upper surface of the mounted electronic component t, and if there is no such mark In the case of, it can be performed depending on the outer shape of the electronic component t (which is also included in a kind of mark). In addition, in the case of using the mounted electronic component t as a common mark, there is a possibility that there may be a mounting deviation due to individual differences between the first mounting portion 40A and the second mounting portion 40B, and this may also be possible. Kind of offset to be corrected.

[Revision of installation location] The mechanism control unit 51 controls the stage moving mechanism 22 so that the mounting positions ap virtually set on the substrate W placed on the stage 21 are sequentially located on the mounting line BL for each row of the mounting positions ap along the X direction. At this time, the correction process in which the correction unit 55 corrects the movement position of the platform 21 will be described.

The correction unit 55 refers to the movement error correction data of the platform 21 and corrects the movement position of the platform 21 when the row of the mounting position ap where the electronic component t is mounted this time is positioned on the mounting line BL. Furthermore, when installing in the second area MA2, you can refer to the movement error correction data and the recognition error correction data of the platform 21 to position the row of the mounting position ap where the electronic component t is mounted this time on the mounting line BL. The moving position of 21 is corrected.

[Installation of electronic parts] The mounting of the electronic component t on the substrate W performed after the calibration will be described with reference to the flowchart of FIG. 10. In addition, FIG. 10 shows the steps from the loading of the wafer ring 11 to the completion of the mounting of the electronic components t of the wafer ring 11.

(1) Loading the wafer ring (step S101) First, as shown in FIG. 2, a new wafer ring 11 holding an electronic component t is carried into the ring holder 12 from a storage portion not shown, and the wafer ring 11 is fixed to the ring holder 12. The wafer ring 11 positioned on the ring holder 12 is maintained in a state where the wafer sheet S is stretched by an unshown expansion mechanism included in the parts supply unit 10.

(2) Placement of the substrate (step S102) (Supply of substrate) The substrate W held by a transport robot (not shown) is supplied to the platform 21. An unillustrated transfer robot includes a transfer arm that mounts and holds the substrate W, and transfers the substrate W onto the platform 21 from the left side of the mounting device 1 through the space under the door of the support frame 41 of the first mounting portion 40A. After the substrate W is supplied on the platform 21, the transfer arm is retracted from the mounting device 1. The supply step of the substrate W may be performed in parallel with the loading of the wafer ring 11, or may be performed separately.

(Correction of substrate position shift) The global mark of the substrate W placed on the platform 21 is detected, and the position of the substrate W is recognized. For example, the board recognition camera 43f is used to photograph and detect the positions of the global markers provided at three corners of the four corners of the board W. Then, based on the detected positions of the three global markers, the positional deviation in the XY direction and the positional deviation in the θ direction (horizontal rotation direction) of the substrate W are obtained, and the positional deviation is corrected based on The correction data of the platform 21 is used to correct the position deviation through the platform moving mechanism 22 of the platform 21. Furthermore, here, the relative positional relationship between the global mark and each mounting position ap is stored in the storage unit 56, and the control device 50 can grasp the mounting position ap on the substrate W based on the position of the global mark. In addition, one of the substrate recognition cameras 43f cannot penetrate into another area. The platform 21 can also only move half of the substrate +α in the X direction. Therefore, the global marks at both ends of the substrate in the X direction are recognized by the substrate recognition cameras 43f in each area. Furthermore, as described above, when correcting the positional deviation of the substrate W placed on the platform 21, the detection position of the global mark is corrected based on the movement error correction data and the recognition error correction data. In this way, while correcting the positional deviation of the substrate W, the row of the mounting position ap to be mounted first is positioned on the mounting line BL set at the center position (origin position) of the Y-direction stroke of the stage 21. At this time, the center position of the substrate W in the X direction is positioned at the center position (origin position) of the X-direction stroke of the stage 21.

(3) Transfer of electronic parts (step S103) (Removal of electronic parts) If the wafer ring 11 is held by the ring holder 12, the electronic component t taken out first on the wafer ring 11 is positioned at the take-out position. Whenever the electronic component t is taken out, the ring holder 12 moves the wafer ring 11 in pitch according to the sequence stored in the memory 56 in advance, and sequentially positions the electronic component t at the take-out position.

The suction nozzle 37a and the suction nozzle 37b of the transfer head 37 of the transfer device 30A are respectively moved to directly above the electronic component t positioned at the extraction site. The Z-direction moving device 37c and the Z-direction moving device 37d lower the suction nozzle 37a and the suction nozzle 37b, respectively, and make the suction surfaces of the suction nozzle 37a and the suction nozzle 37b abut the upper surface (electrode forming surface) of the electronic component t, respectively. After the suction nozzle 37a and the suction nozzle 37b abut on the electronic component t, the suction nozzle 37a and the suction nozzle 37b suction and hold the electronic component t, respectively. For the electronic components t positioned sequentially, the electronic components t such as the suction nozzle 37a and the suction nozzle 37b are sucked and held in sequence. In addition, the removal of such electronic components t is performed alternately by the transfer device 30A and the transfer device 30B.

The suction nozzle 37a and the suction nozzle 37b of the transfer head 37 are positioned on the placement portion 31a and the placement portion 31b of the intermediate platform 31. In this state, the suction nozzle 37a and the suction nozzle 37b descend, and the electronic component t held by the suction nozzle 37a and the suction nozzle 37b is placed on the mounting portion 31a and the mounting portion 31b.

(Handover of electronic parts) If the electronic component t is placed on the placing portion 31a and the placing portion 31b of the intermediate platform 31, the first mounting head 43A of the first mounting portion 40A moves toward the intermediate platform 31, and the mounting tool 43a and the mounting tool 43b The mounting tool 43a and the mounting tool 43b are positioned above the mounting portion 31a and the mounting portion 31b, and after the mounting tool 43a and the mounting tool 43b are lowered to suck and hold the electronic component t, the mounting tool 43a and the mounting tool 43b are raised. Thereby, the mounting tool 43a and the mounting tool 43b simultaneously receive two electronic components t. Here, in parallel with the transfer of the electronic component t, the transfer device 30B is used to perform the removal of the electronic component t and the transfer of the intermediate stage 31 in the same manner as the transfer device 30A.

(4) Mounting of electronic components (step S104, step S105) (Position detection and movement of electronic parts) When the mounting tool 43a and the mounting tool 43b receive the electronic component t, the chip recognition camera 44a and the chip recognition camera 44b of the imaging unit 44 arranged above the mounting portion 31a and the mounting portion 31b are used to suck and hold the mounting tool 43a. , The electronic part t of the mounting tool 43b is photographed. The shooting is performed through the see-through members of the installation tool 43a and the installation tool 43b. Based on the captured images of the chip recognition camera 44a and the chip recognition camera 44b, the position of the electronic component t sucked and held by the mounting tool 43a and the mounting tool 43b is detected.

In addition, the position detection of the electronic component t can also be performed on the mounting part 31a and the mounting part 31b. In this case, after the electronic component t is photographed by the chip recognition camera 44a and the chip recognition camera 44b, the mounting tool 43a and the mounting tool 43b suck and hold the electronic component t. When the photographing of the electronic component t by the chip recognition camera 44a and the chip recognition camera 44b is completed, the mounting tool 43a and the mounting tool 43b are directed toward the mounting area MA of the substrate W positioned on the mounting line BL along the X direction. Move above the row of installation position ap.

(Installation of electronic parts) The first mounting head 43A of the first mounting portion 40A moves so that, among the mounting tool 43a and the mounting tool 43b, the electronic component t held by the mounting tool 43a is first positioned to mount the electronic component t held by the mounting tool 43a The installation location ap. In this case, the electronic component t held by the mounting tool 43a on the left is the electronic component t initially mounted on the substrate W. Therefore, the mounting tool 43a is moved to the mounting position ap positioned on the mounting line BL. At the leftmost mounting position ap, the mounting tool 43a is lowered and the electronic component t is brought into contact with the substrate W and then raised, and the electronic component t is detached from the mounting tool 43a, whereby the electronic component t is mounted on the substrate W.

The mounting is performed by bonding the electronic component t to the substrate W. The bonding is performed using the adhesive force of an adhesive sheet or die attach film (DAF) attached to the surface of the substrate W or the lower surface of the electronic component t in advance. The bonding of the electronic component t can also be implemented by installing a heater on the platform 21 and pressing the electronic component t against the heated substrate W.

After the installation by the installation tool 43a is completed, the first installation head 43A moves to position the electronic component t held by the installation tool 43b at the next installation position ap to be installed. If the electronic component t held by the mounting tool 43b is positioned on the mounting position ap, the electronic component t is mounted on the mounting position ap by the same operation as the mounting tool 43a. The first mounting head 43A after the completion of the mounting of the electronic component t by the mounting tool 43 a and the mounting tool 43 b moves toward the intermediate stage 31.

Here, in parallel with the mounting step of the electronic component t performed by the first mounting portion 40A, the electronic component t is transferred by the transfer device 30A, so the first mounting head 43A moves to the mounting portion 31a of the intermediate platform 31 When it is on the mounting portion 31b, the electronic component t to be mounted next is placed on the mounting portion 31a and the mounting portion 31b. Therefore, the first mounting head 43A that has moved to the intermediate platform 31 immediately receives the electronic component t from the mounting portion 31a and the mounting portion 31b, and performs the mounting again. After that, the operation is repeated until the electronic component t is installed at the installation position ap of the first area MA1.

Even in the middle of the mounting of the electronic component t using the mounting tool 43a and the mounting tool 43b of the first mounting head 43A, the transfer device 30B completes the placement of the electronic component t on the placement portion 31c and placement portion 31d of the intermediate platform 31 In the stage of the transfer, the mounting of the electronic component t by the second mounting head 43B of the second mounting portion 40B also starts. The operation is the same as the procedure described in the example of the first mounting portion 40A. The above-mentioned operation is repeatedly performed by the second mounting portion 40B until the mounting of the electronic component t is completed at the mounting position ap of the second area MA2.

The first mounting portion 40A and the second mounting portion 40B bisect the area on the substrate W in the left and right (X direction), and divide the areas into each area to mount the electronic component t. Therefore, the first mounting head 43A of the first mounting portion 40A and the second mounting head 43B of the second mounting portion 40B can not only perform the steps alternately, but also perform the steps in parallel. After the installation of one row (the entire width of MA1 and MA2) on the installation line BL is completed, the platform 21 is moved to change the row, the row of the installation position ap to be installed next is positioned on the installation line BL, and the installation is repeated. The mounting operation as described above is repeated until the mounting of the electronic component t is completed to all the mounting positions ap on the substrate W (No (NO) in step S105).

(5) Replacement of substrates (carry out, carry in) (step S105, step S106) After completing the mounting of the electronic component t to all the mounting positions ap on the substrate W (YES in step S105), the transfer unit 30 and the mounting unit 40 are temporarily stopped, and the mounting of the electronic component t is completed. The loading of the platform 21 and the loading of the new substrate W onto the platform 21 (step S106). The transfer of the substrate W from the platform 21 is performed by a transfer robot that is the same as or different from the transfer robot (not shown).

(6) Replacement of wafer ring (step S107, step S108) As described above, the mounting of the electronic component t on the substrate W is performed repeatedly, and when the electronic component t on the wafer ring 11 becomes absent (YES in step S107), the wafer ring 11 is replaced with a new wafer Ring 11 (step S108).

[Effect] (1) The electronic component t mounting apparatus 1 of the present embodiment includes: a platform 21 that supports the substrate W on which the electronic component t is mounted in the mounting area MA including the mounting positions ap of the plurality of electronic components t; the first mounting portion 40A , Having a first mounting head 43A that mounts the electronic component t to the mounting position ap, and a first mounting head moving mechanism that moves the first mounting head 43A; the second mounting portion 40B has the electronic component t mounted to the mounting position ap The second mounting head 43B, and the second mounting head moving mechanism that moves the second mounting head 43B; the first identification part is provided so as to be movable together with the first mounting head 43A, and is opposed to the substrate supported on the platform 21 The position of W is recognized; and the second recognition unit is provided so as to be movable together with the second mounting head 43B, and recognizes the position of the substrate W supported on the platform 21.

Furthermore, the installation device 1 includes: a platform moving mechanism 22 that moves the platform 21 so that the first recognition unit and the second recognition unit can recognize the common mark on the platform 21; the recognition error correction data calculation unit 54 is based on the first recognition unit And the position of the common mark recognized by the second recognition unit to calculate recognition error correction data for correcting the recognition error between the first recognition unit and the second recognition unit; and the correction unit 55, based on the recognition error correction data , Correct the positioning position of the electronic component t relative to the mounting position ap mounted by the first mounting head 43A or the second mounting head 43B.

In this way, the positioning position of the electronic component t with respect to the mounting position ap is corrected based on the recognition error correction data obtained by recognizing the common mark by the first recognition unit and the second recognition unit. Therefore, the deviation of the mounting position ap mounted by the first mounting portion 40A and the mounting position ap mounted by the second mounting portion 40B is eliminated, and the electronic component t can be accurately mounted on the entire substrate W without any deviation. In addition, there is no need to transfer the substrate W to an external measuring device to measure and correct the positional deviation, so that accurate mounting can be performed efficiently.

As a result, all the electronic components t on the substrate W are accurately arranged at predetermined intervals in the vertical and horizontal directions. Therefore, in the package manufacturing step, it is possible to prevent defects such as shifting of the position of the mask during exposure.

(2) The first mounting head 43A mounts the electronic component t to the mounting position ap of the first area MA1, which is one of the areas obtained by dividing the mounting area MA into two; the second mounting head 43B The electronic component t is installed in the installation position ap of the second area MA2, which is another area formed by dividing the installation area MA into two.

When the first area MA1 and the second area MA2, which are divided into two, the common installation area MA are installed using different first mounting heads 43A and second mounting heads 43B, installation positions are likely to occur. ap offset, but in this embodiment, this offset can be corrected. Therefore, for example, even in the case of mounting a large mounting area MA on a large substrate W, the electronic component t can be efficiently mounted using a plurality of mounting parts, and the electronic component t can be mounted accurately without shifting. .

(3) The first mounting head 43A is arranged on one side of the platform 21, the second mounting head 43B is arranged on the other side of the platform 21, and the first mounting head 43A and the second mounting head 43B are each movable The range of is located on one side and the other side and is divided into two. The substrate W is supported on the platform 21 in such a manner that the first area MA1 is located on one side and the second area MA2 is located on the other side.

In this way, even if the range of movement of the first recognition unit that moves together with the first mounting head 43A and the second recognition unit that moves together with the second mounting head 43B is limited, the platform 21 can be moved so that the first recognition unit and The range that can be recognized by any one of the second recognition units is expanded, thereby recognizing the common mark.

Expanding the movable range of the first mounting head 43A and the second mounting head 43B results in an increase in the size of the device. However, in this embodiment, since the platform 21 side is moved, the increase in size can be suppressed. Furthermore, in the present embodiment, the stage moving mechanism 22 has a structure that can repeatedly move the largest substrate W placed on the stage 21, for example, in the X direction slightly than half of the size of the substrate W in the X direction. Large (1/2X+α) range of movement stroke. Therefore, the footprint of the mounting device 1 is suppressed, while the overlapping parts are provided and the recognition errors of the two recognition parts are corrected accordingly, so that the mounting accuracy can be improved.

(4) A movement error correction data calculation unit 53 is included, which calculates movement error correction data for correcting movement errors caused by the movement of the platform 21; the correction unit 55 performs corrections on the electronic components based on the recognition error correction data and the movement error correction data. The positioning position of t relative to the installation position ap is corrected.

Therefore, in order to recognize the common mark, the error caused by the movement of the platform 21 and the positioning position of the electronic component t with respect to the mounting position ap are corrected, so that more accurate mounting can be performed.

[Other embodiments] The embodiment of the present invention and the modification examples of each part have been described, but the above-mentioned embodiment or the modification examples of each part are presented as an example and are not intended to limit the scope of the invention. The aforementioned novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or their modifications are included in the scope or spirit of the invention, and are included in the invention described in the scope of the patent application.

In the above embodiment, the movement error correction data for correcting the movement error of the platform 21 can be obtained in the entire area of the movable range of the platform 21, as long as each mounting area on the substrate W is positioned at the mounting position at least. It can be obtained within the range where the platform 21 is moving. Furthermore, the movement error correction data may use the actual measurement value of the movement error of the platform 21 itself, or may be a value obtained by processing the actual measurement value such as a correction value that cancels the movement position error. In short, it only needs to be data for correcting the error of the moving position of the platform 21. In addition, the recognition error correction data may use the actual measurement values of the recognition errors of the first recognition section and the second recognition section itself, or may be a value obtained by processing the actual measurement values such as a correction value that cancels the recognition error.

The correction unit 55 correcting the positioning position of the electronic component t relative to the mounting position ap based on the movement position error data and the recognition error correction data also includes correcting the coordinates of the mounting position ap to set the corrected position as the positioning position. In addition, in order to identify the common mark, the difference obtained as the identification error correction data may be corrected by adding a correction value based on the movement error correction data instead of correcting the movement error when the platform 21 is moved.

In the above-mentioned embodiment, the common mark used when obtaining the recognition error correction data is one dot mark 72 in two rows. However, it is not limited to this, and a common mark may be provided in multiple. In this case, the average value of the differences of the groups of the plurality of marks may be used as the identification error correction data.

In the case of recognizing the position of the electronic component t as a common mark, the board recognition camera 43f as the first recognition unit and the board recognition camera 43f as the second recognition unit can be positioned on the calibration board 71, respectively. The center 71A of the dot mark group of the one area MA1 and the center 71B of the dot mark group of the second area MA2, that is, the installation site, are performed in the same manner as the acquisition of the recognition error correction data based on the dot mark 72. Furthermore, the installation location is a predetermined fixed position on the installation line BL. More specifically, the mounting location is set at the positions indicated by reference numerals 71A and 71B in FIG. 9 with respect to the substrate W placed on the platform 21 positioned at the origin position in a regular positional relationship, for example.

In the case of recognizing the position of the dot mark 72 or the electronic component t as a common mark on the mounting line BL, the first recognition section and the second recognition section may be arranged at the center 71A of the dot mark group. The center 71B of the marking group is closer to the position of the origin of the platform 21, rather than the center 71A of the point marking group and the center 71B of the point marking group. With this arrangement, the distance between the first identification portion and the second identification portion can be made shorter than one-half of the size of the substrate W in the X direction, so that the +α ratio in the X-direction stroke of the platform 21 can be reduced as much as possible. size.

In the mounting device 1 of the above-mentioned embodiment, an example in which the electronic component t is mounted on the substrate W with the electrode forming surface facing up has been mainly described, but it is not limited to this, and can also be applied to The electronic component t is mounted on the substrate W with the electrode formation surface facing down, and the surface is mounted facing down.

When the mounting device 1 is used for face-down mounting, the electronic parts t taken out by the suction nozzle 37a and suction nozzle 37b of the transfer part 30 are not placed on the intermediate platform 31, but the reversing mechanism 37e and reverse The rotation mechanism 37f reverses the suction nozzle 37a and the suction nozzle 37b up and down. In this state, the suction nozzle 37a and the suction nozzle 37b are moved to the intermediate platform 31, and the electronic component t is transferred from the suction nozzle 37a and the suction nozzle 37b to the mounting tool 43a and the mounting tool 43b of the mounting portion 40.

In addition, in the above-described embodiment, the electronic component t is held on the wafer sheet S with the electrode surface as the upper side, but the electronic component t may be held on the wafer sheet S with the electrode surface as the lower side. In this case, the transfer actions of face-up installation and face-down installation are interchanged. That is, when the mounting device 1 is used for face-down mounting, the electronic components t taken out by the suction nozzle 37a and the suction nozzle 37b of the transfer section 30 are placed on the intermediate platform 31, and when the face-up mounting is performed The electronic component t is not placed on the intermediate platform 31, but the suction nozzle 37a and the suction nozzle 37b are reversed up and down by the reversing mechanism 37e and the reversing mechanism 37f. In this state, the suction nozzle 37a and the suction nozzle 37b are moved to the intermediate platform 31, and the electronic component t is transferred from the suction nozzle 37a and the suction nozzle 37b to the mounting tool 43a and the mounting tool 43b of the mounting portion 40.

In the above embodiment, an example in which two mounting tools 43a and 43b are provided on the mounting head 43 has been described, but it is not limited to this, and the number of mounting tools may be one or three or more. Corresponding to this, the number of placement sections 31a to 31d of the intermediate platform 31, the number of suction nozzles 37a and 37b of the transfer head 37, the number of Z-direction moving devices 37c, and the number of Z-direction moving devices 37d are also set. The number of reversing mechanisms 37e and 37f. Among them, as the number of mounting tools increases, the proximity interval increases accordingly. Therefore, it is preferable to set according to the size of the substrate W on which the electronic component t is to be mounted. When considering the intermediate stage 31 or the transfer head 37, it is more preferable to set the size of the electronic component t together.

Furthermore, in the above-mentioned embodiment, it is explained that the substrate W is removed during the manufacturing steps of the packaged parts, and a position detection mark (partial mark) is not provided for each mounting position ap, but it is not limited to this. According to the mounting device and the mounting method of the embodiment, for example, even a substrate that has a mark for position detection for each mounting area and is used as a part of a packaged component, of course, it is possible to not rely on a local mark. The electronic components t are mounted accurately and efficiently.

Furthermore, in the above-mentioned embodiment, the platform 21 is fixed, and the mounting head 43 moves on the mounting line BL in each of the two areas MA1 and the area MA2 to perform installation. In addition, when the second area MA2 is installed, the recognition error is reflected by the correction of the mounting head 43. More specifically, in a state where the X-direction center position of the substrate W is positioned at the X-direction center position of the stage 21, the mounting head 43 is moved along the mounting line BL to mount the electronic component t, but it is not limited to this .

For example, in the case of mounting the electronic component t in the first area MA1 and in the case of mounting the electronic component t in the second area MA2, the platform 21 may be moved. In this case, the platform 21 moves in coordination with the first mounting head 43A and the second mounting head 43B for installation. When the electronic component t is mounted in the second area MA2, the substrate W is positioned at a position where the movement error and the recognition error are corrected by the movement of the stage 21. Furthermore, in the above-mentioned form, the removal of the electronic component t is performed at one place, and therefore the mounting to the first area MA1 and the second area MA2 is performed alternately. That is, it operates in the manner of installation in the first area MA1, movement of the platform, installation in the second area MA2, movement of the platform, and installation in the first area MA1. Thereby, the same effect as the above-mentioned form can be exhibited.

In addition, the mounting locations when the first mounting head 43A and the second mounting head 43B are mounted can be fixed, and the platform 21 can be moved and controlled so that the mounting tools 43a and 43b can be sequentially positioned at the mounting locations. With regard to the movement control, movement is performed in a manner of being corrected based on the movement error correction data and the recognition error correction data stored in the memory unit 56. In this case, since the mounting position of the mounting head 43 is fixed during installation, the movement error of the first mounting head 43A and the second mounting head 43B is only the movement error from the handover of the electronic component t to the mounting line. . The movement error from the handover to the installation line is a fixed route, and the movement error of the installation tool can be ignored due to the small distance, so the installation accuracy can be improved.

In addition, in the mounting sequence of the electronic component t described along the above FIG. 10, it is explained that the substrate is replaced before the electronic component t is mounted on all the mounting areas MA of the substrate W and the electronic component t of the wafer ring becomes empty. In the case of W, before the mounting of the electronic component t on all the mounting areas MA of the substrate W is completed, the electronic component t of the wafer ring may first become absent. In this case, if the electronic component t of the wafer ring becomes absent, after the replacement of the wafer ring 11, the mounting of the electronic component t is continued. That is, the flow of the replacement of the substrate (step S105, step S106) and the replacement of the wafer ring (step S107, step S108) are interchangeable.

1: Install the device 1a: Base part 10: Parts supply department 11: Wafer ring 12: Ring supporter 20: Platform Department 21: Platform 22: Platform mobile mechanism 30: Transfer Department 30A, 30B: transfer device 31: Intermediate platform 31a～31d: Placement part 32: Wafer ring holding device 32a: Support arm 32b: Chuck part 33: Y direction moving device 34: Move block in Y direction 35: Support 36: Moving body in X direction 37: Transfer head 37a, 37b: suction nozzle (transfer nozzle) 37c, 37d: Z direction moving device 37e, 37f: Reversal mechanism 38: chip recognition camera 40: Installation Department 40A: The first installation part 40B: The second installation part 41: Support frame 41a: Y direction moving device 42: head support 42a: X-direction moving device 43: Mounting head 43A: The first mounting head 43B: second mounting head 43a, 43b: installation tools 43c, 43d: Z direction moving device 43f: substrate recognition camera 44: camera unit 44a～44d: Chip recognition camera 44e, 44f: XY mobile device 44g: Camera support frame 50: control device 51: Institutional Control Department 52: Image Processing Department 53: Movement error correction data calculation unit 54: Recognition error correction data calculation section 55: Correction Department 56: Memory Department 57: Input and output control unit 61: Input device 62: output device 71: Calibration board 71A, 71B: Dot mark the center of the group 72: point mark ap: installation location BL: Installation line d: offset MA: installation area MA1: the first area MA2: second area S: wafer sheet S101～S108: steps T: semiconductor wafer t: electronic parts V: shooting field of view W: substrate ws: mounting surface X, Y, Z: direction

Fig. 1 is a plan view showing a board on which electronic components are mounted according to the embodiment. Fig. 2 is a plan view showing the mounting device of the embodiment. Fig. 3 is a front view showing the mounting device of the embodiment. Fig. 4 is a right side view showing the mounting device of the embodiment. 5 is an explanatory diagram showing a calibration substrate placed on a stage and a substrate recognition camera that photographs the calibration substrate. Fig. 6 is an explanatory diagram showing a state where the movement error correction data of the platform is repeatedly acquired by the second recognition unit. Fig. 7 is a block diagram showing the structure of the control device of the embodiment. 8(A) to 8(C) are explanatory diagrams showing the shift of electronic components mounted on the substrate. Fig. 9 is a plan view showing a calibration substrate used in calibration. Fig. 10 is a flowchart showing a procedure of mounting electronic components by the mounting device of the embodiment.

21: Platform

43f: substrate recognition camera

71: Calibration board

72: point mark

MA: installation area

MA1: the first area

MA2: second area

X, Y: direction

Claims (4)

An installation device for electronic parts, characterized in that it comprises: A platform for supporting a substrate, and the substrate is installed with the electronic component in an installation area containing a plurality of installation positions of the electronic component; The first mounting part has a first mounting head for mounting the electronic component to the mounting position, and a first mounting head moving mechanism for moving the first mounting head; The second mounting part has a second mounting head for mounting the electronic component to the mounting position, and a second mounting head moving mechanism for moving the second mounting head; The first identification part is provided in a manner capable of moving together with the first mounting head, and identifies the position of the substrate supported on the platform; The second identification part is provided in a manner capable of moving together with the second mounting head, and identifies the position of the substrate supported on the platform; A platform moving mechanism to move the platform so that the first identification part and the second identification part can identify a common mark on the platform; The recognition error correction data calculation unit calculates the difference between the first recognition unit and the second recognition unit based on the position of the common mark recognized by the first recognition unit and the second recognition unit Identification error correction data for correction of identification errors; and The correction unit corrects the positioning position of the electronic component with respect to the mounting position mounted by the first mounting head or the second mounting head based on the recognition error correction data. The electronic component mounting device according to claim 1, wherein: The first mounting head mounts the electronic component to an installation position in a first area, where the first area is one of the areas formed by dividing the installation area into two; The second mounting head mounts the electronic component to an installation position in a second area, and the second area is another area formed by dividing the installation area into two. The electronic component mounting device according to claim 2, wherein: The first mounting head is disposed on one side of the platform relative to the platform, The second mounting head is disposed on the other side relative to the platform, The first mounting head and the second mounting head are arranged in such a manner that their movable ranges are respectively located on one side and the other side and are divided into two; The substrate is supported on the platform in such a manner that the first area is located on one side of the substrate and the second area is located on the other side. The electronic component mounting device according to claim 2 or claim 3, wherein: Comprising a movement error correction data calculation unit, which calculates movement error correction data for correcting the movement error caused by the movement of the platform; The correction unit corrects the positioning position of the electronic component relative to the mounting position based on the recognition error correction data and the movement error correction data.

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