TW202109653A - 研磨墊、研磨裝置、使用了該研磨裝置之研磨方法、及研磨墊的製造方法 - Google Patents

研磨墊、研磨裝置、使用了該研磨裝置之研磨方法、及研磨墊的製造方法 Download PDF

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Publication number
TW202109653A
TW202109653A TW109115833A TW109115833A TW202109653A TW 202109653 A TW202109653 A TW 202109653A TW 109115833 A TW109115833 A TW 109115833A TW 109115833 A TW109115833 A TW 109115833A TW 202109653 A TW202109653 A TW 202109653A
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TW
Taiwan
Prior art keywords
polishing
polishing pad
semiconductor silicon
silicon wafer
area
Prior art date
Application number
TW109115833A
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English (en)
Chinese (zh)
Inventor
佐藤一彌
志摩直
岳田考司
Original Assignee
日商信越半導體股份有限公司
日商霓塔杜邦股份有限公司
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Publication date
Application filed by 日商信越半導體股份有限公司, 日商霓塔杜邦股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW202109653A publication Critical patent/TW202109653A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW109115833A 2019-07-04 2020-05-13 研磨墊、研磨裝置、使用了該研磨裝置之研磨方法、及研磨墊的製造方法 TW202109653A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019125463A JP2021012922A (ja) 2019-07-04 2019-07-04 研磨パッド、研磨装置、それを用いた研磨方法、及び、研磨パッドの製造方法
JP2019-125463 2019-07-04

Publications (1)

Publication Number Publication Date
TW202109653A true TW202109653A (zh) 2021-03-01

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Application Number Title Priority Date Filing Date
TW109115833A TW202109653A (zh) 2019-07-04 2020-05-13 研磨墊、研磨裝置、使用了該研磨裝置之研磨方法、及研磨墊的製造方法

Country Status (3)

Country Link
JP (1) JP2021012922A (ja)
TW (1) TW202109653A (ja)
WO (1) WO2021002089A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779104B2 (ja) * 1998-12-28 2006-05-24 株式会社Ｓｕｍｃｏ ウェーハ研磨装置
JP2006068888A (ja) * 2004-09-06 2006-03-16 Speedfam Co Ltd 定盤の製造方法及び平面研磨装置

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Publication number Publication date
JP2021012922A (ja) 2021-02-04
WO2021002089A1 (ja) 2021-01-07

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