TW202103175A - Overclocking test module of memory chip and method thereof enhance efficiency and reduce misjudgment through automatic equipment and add pre-testing two-stage screening - Google Patents

Abstract

The invention is an overclocking test module of memory chip and its method. It is applied in a two-stage memory chip testing process to screen the memory chips at different speeds, including a test panel area, a positioning temporary storage panel, at least one pre-testing machine, plural testing machines, and a robot arm. The robot arm is electrically connected to the test panel area, the positioning temporary storage panel, the pre-testing machine, and the testing machine. The pre-testing machine is set in the middle of the positioning temporary storage panel and the testing machine to test and screen the memory in the first stage. The memory that has passed and screened by the pre-testing machine in the first stage will undergo a complete memory chip test on the testing machine, thereby improving the efficiency, accuracy, and reducing the misjudgments.

Description

Memory chip overclocking test module and method thereof

The present invention relates to a memory chip overclocking test module and a method thereof, in particular to a project that performs preliminary screening of the memory chip through a pre-testing machine to achieve multi-speed classification.

At present, with the rapid development of science and technology, various memories are also used in daily life in different forms, so that various electronic devices have more functions and operability. For example, the random access memory (RAM) commonly used in personal computers (PCs) has the characteristics of reading and writing at any time and high speed, so it is often used as a storage for temporary data of the operating system or other running programs medium. It can be further subdivided into dynamic random access memory (Dynamic Random Access Memory, DRAM) and static random access memory (Static Random Access Memory, SRAM).

In addition, the e-sports industry has grown rapidly in recent years. Its primary equipment is to use high-end electronic equipment, such as motherboards, memory, etc., as standard equipment for winning, and match the intelligence and skills of the players. Competitors prioritize memory speed in the choice of hardware equipment. Therefore, in order to produce high-speed memory, it needs to increase the demand for manufacturing process, which is to start with particle testing, because particles are important raw materials for manufacturing memory. one.

Traditionally, the memory system process and testing method used a lot of manpower to classify the speed of particles, and the screening must be started from low speed. To detect overclocked memory, in order to avoid subsequent maintenance costs caused by machine failures , The use of a large amount of manpower also means a lot of time and management costs, and the fatigue and misjudgment caused by the eyesight and physical strength of the personnel will also increase, which is where breakthroughs and improvements are needed.

Due to the above-mentioned problems, the main purpose of the present invention for detecting overclocked memory is to provide a memory chip overclocking test module, which is used to screen memory chips of different speeds. The memory chip overclocking test module includes a test panel. , Positioning temporary storage disk, at least one pre-testing machine, multiple testing machines, and robotic arms. The robotic arm is electrically connected to the test panel, positioning temporary storage disk, pre-testing machines and testing machines.

Preferably, the test disk area can be subdivided into three types: different memory is placed, the first test disk of the memory to be tested is placed, the second test disk of the memory to be tested is placed, and the memory that is to be eliminated is placed. The third test disc.

Preferably, the positioning temporary storage disk can be divided into two areas, one is the positioning area, and the other is the temporary storage area. The purpose of the positioning area is to ensure that each memory to be tested is arranged neatly through the positioning area. The special design of the robot arm can be accurately positioned in the middle of the memory when it grabs the memory again, and the temporary storage area is used to store the memory ready for the next stage of testing.

The pre-test machine is set in the middle of the positioning temporary storage disk and the test machine, and the memory is tested and screened in the first stage. The pre-test machine contains a microprocessor (CPU), which directly controls the memory of the pre-test machine DC parameter test and AC parameter test are performed on the body, and the memory that has passed the first stage of pre-testing machine screening will undergo a complete memory chip test on the test machine.

Another object of the present invention is to provide a memory chip overclocking test method, which is applied in a two-stage memory chip test process. Before the first test (first screening), the memory to be tested is placed in the first test. A test disk, and set the first stage test (pre-test) parameters of the pre-test machine.

Move the memory chip to the pre-test machine, where the pre-test machine is only for simple power-on test. After the first stage of the test (pre-test), the memory that passes the test is the memory whose speed is higher than the parameter. When moving to the test machine, the memory that fails is divided into two categories. Among them, the memory that is waiting for the second test (downgrade and retesting) is moved to the second test disk, and the memory that is short-circuited to be eliminated is moved to The third test disk is used to classify and filter out the memory of a specific speed.

The present invention improves the high labor cost and time cost brought about by the traditional manufacturing process, instead of improving efficiency and reducing misjudgment through automated equipment. At the same time, the two-stage screening of pre-test is innovatively added to achieve the effect of one-time classification and multiple speeds, even Different from the traditional reverse test.

The following is a more detailed description of the implementation of the present invention in conjunction with the diagrams and component symbols, so that those who are familiar with the art can implement it after studying this specification.

The present invention is a memory chip overclocking test module and method thereof. For a preferred embodiment of the memory chip overclocking test module, please refer to FIG. 1. FIG. 1 is a schematic diagram of the memory chip overclocking test module of the present invention, including testing. The panel area 10, the positioning temporary storage disk 20, at least one pre-testing machine 30, a plurality of testing machines 40, and the robot arm 50 are mainly used to test the memory speed for screening and classification.

Furthermore, a plurality of memories are placed on the test panel 10, and the memories are moved between the test panel 10, the positioning temporary storage disk 20, the pre-test machine 30, and the test machine 40 through the grabbing of the robot arm 50. The test panel 10 of the invention can be subdivided into three types, and different memories are placed respectively. Please refer to Fig. 2. The test panel 10 shown in Fig. 2 is only for illustration and does not limit the arrangement of the memory on it. The test panel 10 It is divided into a first test disk 11 where the memory to be tested is placed, a second test disk 12 where the memory to be tested is placed a second time, and a third test disk 13 where the memory to be eliminated is placed.

The location temporary storage disk 20 can be divided into two areas, as shown in FIG. 3, one part is the positioning area 21, and the other part is the temporary storage area 22. Similarly, the positioning temporary storage disk 20 shown in FIG. 3 is only for illustration and is not limited. According to the arrangement of the memory, the robotic arm 50 grabs the memory from the first test disk 11 in the test panel 10 and places it in the positioning area 21 of the positioning temporary storage disk 20. The purpose of setting the positioning area 21 is to ensure that each The captured memory to be tested is arranged neatly, because the position where the robotic arm 50 grabs the memory from the test panel 10 is not necessarily in the middle of the memory, so the special design of the positioning area 21 is required to make the The memory on the positioning area 21 can be arranged neatly, so that the robotic arm 50 can be accurately positioned in the middle of the memory when it is grasped again, and the temporary storage area 22 is used to store the memory for the next stage of testing.

The pre-test machine 30 is set between the positioning temporary storage disk 20 and the test machine 40, and performs the first stage of testing and screening of the memory. The pre-test machine 30 contains a microprocessor (CPU), which directly controls the pre-test The machine performs fast DC parameter test and AC parameter test on the memory. Because it is controlled by the CPU, it does not need to be turned on, which can shorten the pre-test time. The memory that has passed the first stage pre-test machine 30 will be tested. The machine 40 performs a complete memory chip test.

Specifically, the memory to be tested is placed on the first test disk 11, and one row of the memory on the first test disk 11 is grabbed by the robotic arm 50 and placed in the positioning area 21 on the positioning temporary storage disk 20. Make the memory arrangement more orderly and consistent, and then move to the pre-test machine 30 via the robotic arm 50 for the first stage of testing. The first stage of testing here mainly measures the speed of the memory and the open/short circuit test. After the stage test, the memory that has passed the test (screening) is moved to the testing machine 40 by the robotic arm 50. The memory that has not passed is divided into two categories, among which is the memory that is waiting for the second test (downgrade and retest) , Move to the second test disk 12, and move the memory that is short-circuited to be eliminated to the third test disk 13.

One of the embodiments of the present invention can be referred to as shown in FIG. 4, the memory test module includes a test panel 10, a positioning temporary storage disk 20, a pre-testing machine 30, a plurality of testing machines 40, and a robotic arm 50. The positioning temporary The number of saving 20 and pre-testing machines 30 is not limited. This embodiment only illustrates one of many situations. Among them, the test panel area 10 may include a first test disk 11, a second test disk 12, and a third test disk 13. The number of the first test disk 11, the second test disk 12, and the third test disk 13 in the test disk area 10 is also not limited, and the positioning temporary storage disk 20 includes a positioning area 21 and a temporary storage area 22.

Before the first test (first screening), the memory to be tested is placed on the first test disk 11, and the first stage test (pre-test) parameters of the pre-test machine 30 are set. The speed of the memory is determined by filtering out. If you want to filter out the memory with a speed higher than 3200MHz, the parameters need to be set higher than the speed you want to filter out, for example, 3333MHz, so as to filter out the memory with a specific speed to improve efficiency .

The robotic arm 50 is electrically connected to the test panel 10, the positioning temporary storage disk 20, the pre-testing machine 30, and the testing machine 40. The robotic arm 50 is preferably arranged in the testing panel 10, the positioning temporary storage disk 20, and the pre-testing machine. The test machine 30 and the upper part of the test machine 40 not only save space but also increase mobility.

After the parameter setting of the first stage test (pre-test) is completed, the robotic arm 50 grabs a row of the memory to be tested in the first test disk 11 to the positioning area 21, adjusts the arrangement and moves to the pre-test machine 30 for pre-test The machine 30 contains a microprocessor (CPU), which directly controls the pre-test machine to perform fast DC parameter test and AC parameter test on the memory. Because it is directly controlled by the CPU and does not need to be turned on, it only takes about 8-10 seconds. It can be completed. After the first stage of the test (pre-test) is over, the memory that passes the test, that is, the memory with a speed higher than the parameter, will be moved to the testing machine 40, and the second stage of testing, that is, a complete memory chip test , Which is the so-called Burn in test. This second stage test takes a long time, and the memory that fails the test may include parameters that have not reached the set speed or chip open/short, and move to the second test respectively. Disk 12 and the third test disk 13.

Among them, whether the memory chip passes the screening of the pre-testing machine 30, the robot arm 50 can distinguish whether the memory chip passes the screening of the pre-test through the interface of the communication device.

After the complete memory chip test of the test machine 40, the memory speed can be classified, and the memory of a specific speed can be screened out. After all the memory of the first test disk 11 is completed, the preset can be reset. Test parameters, and the memory of the second test disk 12 will be moved to the first test disk 11, and then perform a two-stage test to classify and filter the memory of a specific speed.

Please refer to FIG. 5 for the overclocking test method of the memory chip of the present invention. FIG. 5 is a schematic diagram of the method flow of the present invention. Unlike the traditional test method, which can only start screening at a low speed, a complete screening of the present invention is divided into two stages of testing. Can filter out the memory of a specific speed according to the user's purpose.

First determine and set the pre-test parameters for the pre-test machine 30, place all the memory chips to be tested on the first test disk 11 in the test panel 10, for example, set the pre-test parameters to 3333MHz, and then the robot arm 50 will One row of memory chips on the first test disk 11 is grabbed and moved to the positioning area 21 of the positioning temporary storage disk 20, and the positioning is performed, that is, the arrangement of the memory chips is adjusted, so that the memory chips are arranged uniformly and neatly, so that the robot arm 50 grasping position is more accurate.

Then the robotic arm 50 moves the memory chip to be tested to the pre-testing machine 30, and performs a simple power-on test on the memory, including memory open/short test. The pre-test at this stage is the first stage test and can also be regarded as In the first stage of screening, the pre-test machine 30 contains a microprocessor (CPU), which directly controls the pre-test machine to perform fast DC parameter test and AC parameter test on the memory, and the memory chip is tested in the pre-test machine 30 It takes about 8-10 seconds.

Next, the robot arm 50 will move the memory chip to different places depending on the result of the pre-test of the memory chip. If the memory chip passes the pre-test of the pre-testing machine 30, it will grab the memory chip to the testing machine 40. Perform the second stage test (complete chip test), which is the so-called burn-in test. If the memory chip fails the pre-test of the pre-testing machine 30, the memory chip is grabbed to the second test disk 12 (waiting Decrease retest) or the third test disk 13 (eliminated), however, because the test machine 40 takes a long time to perform the second phase test, so when all the test machines 40 are performing the second phase test , The robot arm 50 will first move the memory chips that have passed the pre-test to the temporary storage area 22 in the positioning temporary storage disk 20 for waiting.

The memory chips that fail the pre-test will be placed on the second test disk 12 in the test disk area 10. After all the memory chips in the first test disk 11 have been screened for the first time, the pre-test machine will be tested again. The station 30 sets new pre-test parameters, for example, reduces the parameters to 2888MHz, and performs a step-down retest, which is the so-called second screening. Repeat the aforementioned steps to complete the second screening and classification until all memory is stored. The bulk wafer is finished after screening and sorting.

The main effect of the present invention is that to improve the traditional wafer testing process requires a lot of manpower to classify the speed, and the present invention uses automated equipment and robotic arms to reduce the cost of personnel management, and reduce the misjudgment caused by the eyesight and physical fatigue of personnel. , Improve accuracy and efficiency.

Another effect of the present invention is that to improve the traditional wafer testing process, it takes a lot of time to start screening at a low speed. The present invention uses a new two-stage test classification and screening method to achieve multiple speeds for one-time classification, and it can also specify a specific speed for screening. , Or different from the traditional reverse test from high speed, but also to ensure the stability of the test machine.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same spirit of the invention. , Should still be included in the scope of the present invention's intention to protect.

10: Test panel 11: The first test disk 12: The second test disc 13: The third test disc 20: locate temporary storage disk 21: Positioning area 22: Temporary storage area 30: Pre-test machine 40: Test machine 50: Robotic arm

FIG. 1 is a schematic diagram of the memory chip overclocking test module of the present invention; Figure 2 is a detailed schematic diagram of the test panel of the present invention; Figure 3 is a detailed schematic diagram of the positioning temporary storage disk of the present invention; 4 is a schematic diagram of an embodiment of the memory chip overclocking test module of the present invention; and FIG. 5 is a schematic flowchart of the overclocking test method of the memory chip of the present invention.

10: Test panel

20: locate temporary storage disk

30: Pre-test machine

40: Test machine

50: Robotic arm

Claims (10)

A memory chip overclocking test module, which is used to screen memory chips of different speeds, including: A test panel, where the memory chip to be tested is placed; A positioning temporary storage disk, the positioning temporary storage disk is divided into a positioning area and a temporary storage area, the positioning area is used to adjust the arrangement of memory chips; At least one pre-test machine, and a pre-test parameter is set in the pre-test machine; Multiple test machines; and A robotic arm for grabbing memory chips, and the robotic arm is electrically connected to the test panel, the positioning temporary storage disk, the at least one pre-test machine, and the test machines; The robot arm grabs the memory chip from the test panel to the positioning area of the positioning temporary storage disk, so that the memory chip is aligned uniformly, and then grabs the memory chip again and moves to the at least one pre-testing machine. At least one pre-testing machine performs a first-stage screening of memory chips according to the pre-testing parameters, and the memory chips that pass the first-stage screening are moved by the robotic arm to the testing machine to perform complete chip testing on the memory chips. For testing, the temporary storage area is used to store memory chips waiting for a complete chip test, and the memory chips that fail the test are moved back to the test panel by the robotic arm. According to the memory chip overclocking test module described in claim 1, wherein the test panel further includes at least one first test panel, at least one second test panel, and at least one third test panel, the at least one second test panel A test disk is placed with memory chips to be screened for the first time, the at least one second test disk is placed with memory chips waiting to be retested after downgrading, and the at least one third test disk is placed with memory chips to be eliminated. According to the memory chip overclocking test module described in item 1 of the scope of patent application, the pre-test parameters are set according to the memory chip that the user wants to filter out a specific speed, and the pre-test needs to be higher than the specific speed to be filtered out high. According to the memory chip overclocking test module described in item 1 of the scope of patent application, whether the memory chip passes the screening of the pre-testing machine is through the interface of a communication device, allowing the robotic arm to distinguish whether the memory chip is Pass the pre-test screening. According to the memory chip overclocking test module described in item 1 of the scope of patent application, the first stage screening performed by the pre-testing machine further includes a DC parameter test and an AC parameter test. A memory chip overclocking test method, which is applied in a two-stage memory chip test process, including: Determine and set a pre-test parameter and store it in a pre-test machine. Place all memory chips to be screened for the first time on a test panel, and a robotic arm will store one row of memory on the test panel The bulk chip is grasped and moved to a positioning area in a positioning temporary storage disk, and the positioning is performed, that is, the arrangement of the memory chip is adjusted; The robotic arm moves the memory chip to the pre-testing machine, and the pre-testing machine energizes the memory chip to test. The pre-test at this stage is regarded as the first-stage test; After completing the first stage of testing, the robotic arm will move the memory chip to different places based on the results of the pre-test of the memory chip. If the memory chip passes the pre-test of the pre-testing machine, it will grab the memory chip Go to a test machine for the second stage test. This second stage test is a complete chip test. If the memory chip fails the pre-test of the pre-test machine, the robotic arm will grab the memory chip back for the test When all the test machines are performing the second stage test, the robotic arm will first move the memory chips that pass the pre-test to a temporary location in the temporary storage disk. Storage area The memory chip that has passed the second stage of the complete chip test, that is, the speed of the memory chip is determined, and the classification of the memory chip can be completed; For memory chips that fail the pre-test, after waiting for all memory chips to complete the first screening, re-set new pre-test parameters for the pre-test machine, and repeat the above steps to perform downgrading and re-test; It will end after all memory chips have been screened and classified. According to the memory chip overclocking test method described in the scope of patent application, the test panel further includes at least one first test disk, at least one second test disk, and at least one third test disk, the at least one first test disk The test disk is placed with memory chips to be screened for the first time, the at least one second test disk is placed with memory chips to be retested after downgrading, and the at least one third test disk is placed with memory chips to be eliminated. According to the memory chip overclocking test method described in item 6 of the scope of patent application, the pre-test parameters are set according to the memory chip that the user wants to screen out a specific speed, and the pre-test needs to be higher than the specific speed to be screened out . According to the memory chip overclocking test method described in item 6 of the scope of patent application, whether the memory chip passes the first stage test of the pre-testing machine is through the interface of a communication device, allowing the robotic arm to distinguish the memory chip Whether to pass the pre-test screening. According to the memory chip overclocking test method described in item 6 of the scope of patent application, the first stage screening performed by the pre-testing machine further includes a DC parameter test and an AC parameter test.

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