TW202100263A - Processing apparatus for reducing internal surface roughness of workpiece - Google Patents

Abstract

This invention provides a processing apparatus for reducing internal surface roughness of workpiece comprising a grinding liquid supply system that provides pressurized grinding liquid, a guiding element of the workpiece fluidly communicating the grinding liquid supply system, an emission system, and a fixed station. The treatment of the internal surface of the workpiece by the processing apparatus of the present invention can thereby obtain the desired low internal surface roughness treatment effect.

Description

Treatment device for reducing surface roughness of inner cavity of workpiece

The invention relates to an inner surface treatment device of a workpiece, and more particularly relates to an inner surface treatment device that can be used for precision castings.

Recently, the selective laser melting (Selective Laser Melting; SLM) technology has attracted much attention in the field of molding process. Compared with the traditional precision casting technology, the SLM technology has a high degree of process flexibility. Precision castings with high complexity and good mechanical properties can be widely used in aerospace, automotive, home appliances and other industries. It is a process with great development potential.

However, products prepared by SLM technology are limited by the inherent limitations of the average particle size range of the powder used, and their surface roughness is generally greater than 20 microns, which is much higher than the surface roughness of current precision casting products, and it is difficult to achieve The vision to replace precision casting technology.

At present, the commonly used surface treatment technologies for castings are mainly sandblasting technology or vibration grinding technology. However, sandblasting technology cannot be applied to inner surface treatment, and vibration grinding is only suitable for Flat surfaces or concave surfaces with a small depth are difficult to use for the inner surface treatment of precision castings made by the highly complex SLM technology.

In view of this, it is necessary to propose an internal surface treatment device that can be used for precision castings made by SLM technology to solve the problems of the conventional technology.

In order to solve the above problems, the present invention provides a processing device for reducing the surface roughness of the inner cavity of a workpiece. The pressure of the polishing liquid is 100 to 1500 pounds per square inch; the inlet end of the workpiece and the guiding element of the polishing liquid supply system are respectively connected and fluidly connected, and the guiding element defines the input flow path of the polishing liquid. The grinding fluid supply system feeds the pressurized grinding fluid into the inner cavity of the workpiece via the guide element; a discharge system connected to the outlet end of the workpiece; and a fixing table for holding the workpiece.

In other embodiments of the present invention, the pressurized pressure of the polishing liquid may be 100 pounds per square inch, 120 pounds, 150 pounds, 180 pounds, 200 pounds, 250 pounds, 300 pounds, 400 pounds, 500 pounds, 600 pounds, 700 pounds, 800 pounds, 900 pounds, 1000 pounds, 1100 pounds, 1200 pounds, 1300 pounds, 1400 pounds, 1450 pounds or 1500 pounds, and not limited to this.

In a specific embodiment of the processing device of the present invention, the exhaust system is connected to the polishing liquid supply system to form a closed loop, so that the polishing liquid circulates in the loop.

In a specific embodiment of the processing device of the present invention, the polishing liquid supply system includes a storage tank that provides the polishing liquid and a drive unit that is in fluid communication with the storage tank and provides pressurized fluid to pressurize the polishing liquid .

In a specific embodiment of the processing device of the present invention, the flow area of the guide element is between 0.1 square centimeters and 1300 square centimeters.

In other embodiments of the present invention, the lower limit of the flow area of the guide element can be 0.1 square centimeters, 0.2 square centimeters, 0.5 square centimeters, 1 square centimeters, 2 square centimeters, 5 square centimeters, 10 square centimeters, 20 square centimeters, 50 square centimeters, 100 square centimeters, 250 square centimeters, 500 square centimeters, 750 square centimeters or 1000 square centimeters, and not limited to this, and the upper limit of the flow area of the guide element can be 1300 Square centimeters, 1256 square centimeters, 1200 square centimeters, 1100 square centimeters, 1000 square centimeters, or 900 square centimeters, and not limited thereto.

In a specific embodiment of the processing device of the present invention, the polishing liquid includes cutting particles and slurry, and the slurry includes ceramic particles.

In a specific embodiment of the processing device of the present invention, the fixing table includes: a base for carrying the workpiece; and a plurality of fixings detachably assembled on the periphery of the base to fix the workpiece on the base Components. In another embodiment, the base includes a positioning element and a non-slip element.

In a specific embodiment of the processing device of the present invention, the inner cavity of the workpiece is tubular, for example, the diameter of the inner cavity of the workpiece ranges from 1 cm to 20 cm; in another embodiment , The inner cavity of the workpiece includes a plurality of bending parts, and the R angle of the bending part is between 5 mm and 100 mm.

In other embodiments of the present invention, the diameter of the inner cavity of the workpiece may be 1.5 cm, 2 cm, 2.5 cm, 5 cm, 7.5 cm, 10 cm, 12.5 cm, 15 cm, 17.5 cm or 19.5 cm. And not limited to this.

In other embodiments of the present invention, the R angle of the bending portion may be 6 mm, 7.5 mm, 8 mm, 10 mm, 12 mm, 15 mm, 20 mm, 25 mm, 30 mm, 40 mm, 50 mm. Mm, 60 mm, 70 mm, 75 mm, 80 mm, 85 mm, 90 mm, 95 mm or 98 mm, and not limited to this.

In a specific embodiment of the processing device of the present invention, the workpiece includes a plurality of openings, and the openings are communicated with each other. In this embodiment, the processing device further includes a plurality of plugs corresponding to the opening of the workpiece, and the plugs are fixed to the fixing table under pressure.

By processing the inner cavity surface of the workpiece by the processing device provided by the present invention, the desired low inner surface roughness processing effect can be obtained, thus solving the problem of the high roughness of the inner cavity surface of the precision casting prepared by SLM technology, thereby improving the SLM Technical product competitiveness.

10‧‧‧Workpiece, tubular workpiece

11‧‧‧Grinding fluid supply system

12, 12’‧‧‧Guiding element

13‧‧‧Exhaust system

14‧‧‧Fixed table

15‧‧‧Base

15a‧‧‧Bottom plate

15b、15c‧‧‧Riser

101‧‧‧Entrance

102‧‧‧Exit port

103‧‧‧Open

104‧‧‧Bending part

105‧‧‧plug

106‧‧‧Concave

110‧‧‧Storage tank

112‧‧‧Drive unit

130‧‧‧Pipeline

131‧‧‧Filter

132‧‧‧ Waste liquid storage tank

151‧‧‧Positioning piece

152‧‧‧Slip Parts

160‧‧‧Lock firmware

161, 162, 163‧‧‧Fixed components

A‧‧‧Arrow

R‧‧‧R angle

The embodiment of the present invention will be explained by referring to the drawings illustratively: Figure 1 is a schematic diagram of the first embodiment of the processing device for reducing the surface roughness of the inner cavity of the workpiece; Figure 2 is the schematic diagram of the first embodiment of reducing the surface roughness of the inner cavity of the workpiece A schematic diagram of the second embodiment of the processing device; Figure 3 is a schematic diagram of the structure of the fixed table; Figure 4A is a schematic diagram of a workpiece with a plurality of openings; Fig. 4B is a schematic diagram of the bending part of the workpiece shown in Fig. 4A; and Fig. 4C is a schematic diagram of the bottom side of the workpiece shown in Fig. 4A.

The following is a specific embodiment to illustrate the implementation of the present invention. Those skilled in the art can easily understand the advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structure, ratio, size, etc. shown in the accompanying drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those familiar with this technique, and are not intended to limit the scope of the present invention. The implementation conditions are limited, so any structural modification, proportional relationship change, or size adjustment, without affecting the effects and objectives that can be achieved by the present invention, still fall within the technical content disclosed in the present invention. Can be covered. At the same time, the terms "上" and "一" cited in this specification are only for ease of description and are not used to limit the scope of implementation of the present invention. The change or adjustment of the relative relationship is insubstantial. Changes in the technical content should also be regarded as the scope of the present invention. In addition, all ranges and values in this specification are inclusive and combinable. Any value or point falling within the range described in this specification, such as any integer, can be used as the minimum or maximum value to derive the lower range.

Please refer to Figure 1, which is a schematic diagram illustrating the first embodiment of the processing device for reducing the surface roughness of the inner cavity of the workpiece according to the present invention. The processing device includes: a slurry supply system 11, a guide element 12, a discharge system 13, and Fixed table 14.

The grinding fluid supply system 11 provides pressurized grinding fluid to the inner cavity of the workpiece 10, and the pressure of the grinding fluid after pressurization is 100 to 1500 pounds per square inch. Through The shear stress friction generated by the high-pressure flow of the grinding fluid can enhance the surface treatment effect of the workpiece.

In order to provide pressurized polishing liquid, in a specific embodiment, the polishing liquid supply system includes a storage tank 110 for providing the polishing liquid and a driving unit 112 that is in fluid communication with the storage tank 110 and provides pressurized fluid, wherein The driving unit is a compressor or a high-pressure fluid tank, which adjusts the pressure of the polishing liquid to correspondingly adjust the flow speed of the polishing liquid. Alternatively, a pressurized fluid is provided by the driving unit 112, and when the polishing liquid provided by the storage tank 110 is combined with the pressurized fluid, the pressurized polishing liquid is formed.

In a specific embodiment, the pipeline of the slurry supply system may optionally include a meter or valve, such as a flow regulating valve or a check valve, to control the flow of the slurry and stabilize the pipeline pressure.

The grinding fluid includes cutting particles and slurry, wherein the slurry includes ceramic particles, and the cutting particles are selected from the group consisting of cerium oxide, diamond, boron nitride, zirconium oxide, aluminum oxide and silicon carbide balls At least one of the groups, the particle size of the aforementioned particles can be selected according to the desired grinding surface texture and actual operating conditions. In another specific embodiment, the storage tank 110 further includes a stirring device to reduce sedimentation problems in the slurry storage tank. In one embodiment, the polishing liquid further includes a solvent, a surfactant, or an auxiliary agent to provide an effective leveling treatment.

The guide element 12 is respectively connected and fluidly connected to the inlet end 101 of the workpiece 10 and the polishing liquid supply system 11, and the guide element 12 defines the input flow path of the polishing liquid, so that the pressurized polishing liquid is generated The desired flow pattern, such as fan-shaped, circular, etc., jets flow, and then feed into the inner cavity of the workpiece 10.

In a specific embodiment, the guide element 12 is a plug in which a pipeline is provided, so that the guide element and the inlet end are tightly connected.

In another embodiment, the guiding element 12 can be integrated with the fixing table 14.

In a specific implementation aspect, the flow area of the guide element 12 is 0.1 square centimeters to 1300 square centimeters. In a specific embodiment, the ratio of the flow area of the guide element 12 to the entrance area of the workpiece is 1:0.1 to 1:15.

In other embodiments, the ratio of the flow area of the guide element 12 to the entrance area of the workpiece may be 1:0.2, 1:0.5, 1:1, 1:2, 1:2.5, 1:3, 1:5 , 1:7.5, 1:10, 1:12 or 1:14, and not limited to this.

The exhaust system 13 is connected to the outlet end 102 of the workpiece 10 to drain the polishing liquid and surface abrasion debris from the inner cavity of the workpiece 10 after finishing the surface treatment. Specifically, the exhaust system 13 can also be connected and fluidly connected to another guide element 12', such as a plug with a pipeline therein, to drain the grinding fluid and abrasive debris from the inner cavity of the workpiece 10.

In a specific implementation aspect, the discharge system 13 includes a filter and a waste liquid storage tank for receiving and storing waste materials that are difficult to recycle.

In another embodiment, a negative pressure device may be connected to the downstream end of the exhaust system 13 as appropriate to speed up the exhaust process.

With the processing device for reducing the surface roughness of the inner cavity of the workpiece in the present invention, the surface texture characteristics of the workpiece can be improved to reduce the average surface roughness (R _a ) of the inner cavity surface of the workpiece and the height of the highest peak (R _p ) or the depth of the deepest valley on the surface (R _v ). In a specific embodiment, after processing by the processing device for reducing the surface roughness of the inner cavity of the workpiece in the present invention, the inner surface of the workpiece can be reduced from the initial roughness greater than 20 microns to less than 15 microns, less than 12 microns, Roughness less than 10 microns or less than 8 microns.

Please refer to Figure 2, in another specific embodiment, it is a schematic diagram illustrating the second embodiment of the processing device for reducing the surface roughness of the inner cavity of the workpiece according to the present invention. The exhaust system 13 of the processing device is combined with the grinding The liquid supply system 11 is connected to form a closed loop, so that the grinding liquid circulates in the loop.

Specifically, the discharge system 13 includes a filter 131 and a waste liquid storage tank 132, and the grinding liquid processed by the filter 131 is returned to the grinding liquid supply system 11 through the pipeline 130, which is difficult to recycle and reuse. The material is transferred to the waste liquid storage tank 132 to reduce the process cost.

Please refer to Figure 3, which is a schematic diagram illustrating the structure of the fixed platform 14 of the present invention. The fixed platform 14 includes: a base 15 for carrying the workpiece 10; and a plurality of fixed components 161, 162, 163, which are detachable Assemble on the periphery of the base 15 and fix the workpiece 10.

In an embodiment that is not intended to limit the present invention, for example, the base 15 has a bottom plate 15a, and vertical plates 15b, 15c provided on opposite sides of the bottom plate, which are designed to carry the workpiece 10 shown in Figure 4A. ; When applied to different workpieces, the design of the fixed table can be adjusted according to actual needs. In addition, in this embodiment, the plurality of fixing components include a fixing component 161 located above the base 15, a fixing component 162 located behind the base 15, and a fixing component 163 located in the front of the base 15. In addition, the base 15 includes a positioning member 151 and a non-slip member 152 that can be embedded with the workpiece 10, wherein the positioning member 151 can be a positioning pin to position the bottom side of the tubular workpiece 10 as shown in Figure 4C The plurality of recesses 106 are inlaid and fixed in the positioning member 151, and the anti-slip member 152 is made of wear-resistant material. In a specific embodiment, the anti-slip member 152 is selected from Teflon, Nylon (Nylon), acrylonitrile-butadiene-styrene copolymer (ABS resin) and polycarbonate (PC) form one of the group.

The fixing components 161, 162, and 163 include a plurality of locking members 160, which are designed according to the shape of the workpiece to tightly press against the workpiece 10 or a plurality of plugs 105 corresponding to the opening 103 of the workpiece 10 ( As shown in Fig. 4B), the workpiece 10 is prevented from moving relative to the fixed table 14 during the processing procedure.

The workpiece 10 applied to the processing device of the present invention is a workpiece having at least two openings. In a specific embodiment, the workpiece 10 may have a long and narrow inner cavity structure; specifically, the workpiece 10 is a tubular workpiece or the inner cavity of the workpiece is tubular.

In another embodiment, the pipe diameter of the tubular workpiece or the inner cavity of the workpiece 10 is 1 cm to 20 cm.

Please refer to FIG. 4A. In a specific embodiment, the tubular workpiece 10 includes a plurality of openings 103. In addition, the workpiece 10 may include a plurality of bending portions 104. As shown in FIG. 4B, the R angle of the bending portion 104 is 5 mm to 100 mm.

For a tubular workpiece with a plurality of openings, the processing device of the present invention includes a plurality of plugs 105 corresponding to the openings 103 of the workpiece 10, and as shown in Figure 4B, the plugs 105 are along the direction indicated by arrow A It is pressurized and fixed to the fixing table 14; specifically, the plug of the opening can be pressurized and fixed to the fixing table 14 through the locking member 160.

In summary, the processing device provided by the present invention for reducing the surface roughness of the inner cavity of a workpiece provides a pressurized grinding fluid to abrade the surface of the inner cavity of the workpiece, so that the processed workpiece obtains the desired low The processing effect of the inner surface roughness to solve the problem of the SLM technology The high roughness of the inner cavity surface of the prepared precision castings further enhances the product competitiveness of SLM technology.

The above-mentioned embodiments are only illustrative and not used to limit the present invention. Anyone familiar with this technique can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention is defined by the scope of the patent application attached to the present invention. As long as it does not affect the effect and implementation purpose of the present invention, it should be covered in the technical content of this disclosure.

10‧‧‧Workpiece

101‧‧‧Entrance

102‧‧‧Exit port

11‧‧‧Grinding fluid supply system

110‧‧‧Storage tank

112‧‧‧Drive unit

12, 12’‧‧‧Guiding element

13‧‧‧Exhaust system

14‧‧‧Fixed table

Claims (12)

A processing device for reducing the surface roughness of the inner cavity of a workpiece includes: a slurry supply system, which provides a pressurized slurry to the inner cavity of the workpiece, and the pressure of the slurry after the pressurization is 100 per square inch Pounds to 1500 pounds; guide elements are respectively connected and fluidly connected to the inlet end of the workpiece and the slurry supply system, and the guide element defines the input flow path of the slurry, so that the slurry supply system will pressurize Then the grinding fluid is fed into the cavity of the workpiece via the guide element; a discharge system is connected to the outlet end of the workpiece; and a fixing table is used to hold the workpiece. According to the processing device described in item 1 of the scope of patent application, wherein the exhaust system is connected with the polishing liquid supply system to form a closed loop, so that the polishing liquid circulates in the loop. The processing device described in claim 1, wherein the polishing liquid supply system includes a storage tank for providing the polishing liquid and a drive unit fluidly connected to the storage tank and providing pressurized fluid to pressurize the polishing liquid. The processing device described in item 1 of the scope of patent application, wherein the flow area of the guide element is 0.1 square centimeters to 1300 square centimeters. The processing device described in claim 1, wherein the polishing liquid includes cutting particles and a slurry containing ceramic particles. According to the processing device described in item 1 of the scope of patent application, wherein the fixed table includes: a base for supporting the workpiece; and A plurality of fixing components are detachably assembled on the periphery of the base to fix the workpiece on the base. For the processing device described in item 6 of the scope of patent application, the base includes a positioning member and a non-slip member. The processing device described in item 1 of the scope of patent application, wherein the inner cavity of the workpiece is tubular. The processing device described in item 8 of the scope of patent application, wherein the pipe diameter of the inner cavity of the workpiece is between 1 cm and 20 cm. The processing device described in item 8 of the scope of patent application, wherein the inner cavity of the workpiece includes a plurality of bending parts, and the R angle of the bending part is between 5 mm and 100 mm. The processing device described in item 1 of the scope of patent application, wherein the workpiece includes a plurality of openings. For example, the processing device described in item 11 of the scope of patent application includes a plurality of plugs corresponding to a plurality of openings of the workpiece, and the plurality of plugs are fixed to the fixing table under pressure.

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