TW202044973A - Memory device with lighting function - Google Patents

Abstract

A memory device with a lighting function is revealed. By setting a plurality of lighting elements on the circuit board, the circuit board can emit light guided by first, second and third light-guiding elements and a light-guiding and heat-dissipating element on the circuit board for lighting to outside. In the meanwhile, the heat from the circuit board can be dissipated by the light-guiding and heat-dissipating element and a heat-dissipating element adhered to the first surface and the second surface of the circuit board. Hereby, the memory device has the light function and better effect of heat-dissipating.

Description

Memory device with light-emitting function

The invention relates to a memory, especially a memory device with a light-emitting function.

Nowadays, computer hardware has been developed towards high speed and high frequency. In order to improve the operating efficiency of computers, computer hardware has been operating at high speed and high frequency for a long time, and relatively high temperature will be generated. In order for the memory to cooperate with the high-speed operation of the processor, the relative operating temperature of the memory is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the memory, and even cause the memory to be damaged.

However, in recent years, due to the popularity of e-sports and the popular trend of many computers being modified, many users or manufacturers of e-sports computers will change the case of e-sports computer to a see-through case. Modifications are gradually becoming popular. The internal components of gaming computers, such as CPUs, graphics cards, and memory, will have better performance than ordinary personal computers, and therefore relatively generate more heat, but excessive heat will decrease The effectiveness of electronic components, so people will install heat sinks on these electronic components. In the gaming industry, the heat dissipation components installed in the electronic components not only require excellent heat dissipation efficiency, but the design of the heat dissipation components is the highlight of comparison between gaming devices. As a result, the components inside the case of gaming computers, such as the graphics card or CPU or power supply, or the heat sink of the case, are no longer just the old traditional simplicity, they add a lot of eye-catching appearance and dazzling Luminous effect.

However, in today's gaming computers, commonly modified CPU fans, graphics card fans, or chassis fans are added with light-emitting elements. When the gaming computer is powered on, the CPU fan, graphics card fan, or chassis fan will emit a dazzling light source. Gaming memory devices are equipped with metal heat sinks to improve the heat dissipation effect. For memory devices with luminous effects, the circuit board of the memory device is covered with a light guide outer shell, but the heat dissipation effect is reduced.

Based on the above-mentioned problems, the present invention provides a memory device with a light-emitting function, which provides a structure that guides light and has a heat dissipation effect, so that the memory device can provide a dazzling light-emitting effect without affecting the heat dissipation effect.

The main purpose of the present invention is to provide a memory device with light-emitting function, which utilizes a circuit board to provide light-emitting elements and memory elements, and a heat sink to dissipate heat to the memory elements, and the light guide and heat sink and the light guide structure are aimed at the light-emitting element Conduct light source guidance and heat dissipation.

In order to achieve the above objective, the present invention discloses a memory device with a light-emitting function, which includes: a circuit board, a first light guide structure, a light guide and heat sink, a second light guide structure, and a third guide Light structure and a heat sink. The circuit board has a first surface, a second surface, a plurality of memory elements and a plurality of light-emitting elements, the memory elements and the light-emitting elements are arranged on the first surface , The second surface or a combination of the foregoing; the light guide and heat sink is attached to the first surface, and the heat sink is attached to the second surface and the memory elements, the first light guide structure, the first The second light guide structure and the third light guide structure are respectively disposed on the circuit board, the light guide and heat dissipation element, and the heat dissipation element, and the second light guide structure is located on a first side of the first light guide structure, The third light guide structure is disposed on a second side of the first light guide structure and engages with the second light guide structure to form an accommodating space to accommodate the first light guide structure. Thereby, the first light guide structure, the second light guide structure, the third light guide structure, and the light guide and heat dissipation element guide the light sources emitted by the light emitting elements, and the light guide and heat dissipation element and the The heat sink dissipates heat to the circuit board to obtain a better light emitting effect and heat dissipation effect.

The present invention provides an embodiment in which the light guide and heat dissipation element is provided with at least one positioning part, the second heat dissipation element is provided with at least one positioning element, and the positioning part is connected with the positioning element.

The present invention provides an embodiment in which the memory device further includes a first thermally conductive adhesive and a second thermally conductive adhesive, the first thermally conductive adhesive is disposed between the first heat sink and the circuit board , And the second thermally conductive adhesive is disposed between the second heat sink and the circuit board.

The present invention provides an embodiment in which the first thermally conductive adhesive and the second thermally conductive adhesive are thermally conductive double-sided adhesive tape, thermally conductive double-sided foam adhesive, or a combination of the foregoing.

The present invention provides an embodiment in which a first light-emitting direction of some of the light-emitting elements faces the first light guide structure, and a second light-emitting direction of the other light-emitting elements faces the light-transmitting heat sink.

The present invention provides an embodiment in which the memory device further includes a name plate disposed on the light-transmitting heat sink.

The present invention provides an embodiment in which an irregular surface or an uneven surface is provided on a side of the light guide structure facing the circuit board.

The present invention provides an embodiment in which the light-emitting elements include a plurality of first light-emitting elements and a plurality of second light-emitting elements, and one of the first light-emitting elements has a first light-emitting direction upward and the second light-emitting elements The second light-emitting direction of one of the elements is staggered or non-staggered.

The present invention provides an embodiment in which the second light guide structure has a connecting portion, the third light guide structure has a connecting piece on it, and the connecting piece is inserted into the connecting portion so that the third light guide structure The second light guide structure is clamped to form the accommodating space.

The present invention provides an embodiment in which the connecting portion is a groove, the connecting piece is a protruding piece, and the protruding piece is inserted into the groove.

In order to enable your reviewer to have a further understanding and understanding of the features of the present invention and the effects achieved, the following examples and accompanying descriptions are provided. The description is as follows:

In view of the fact that it is difficult for conventional memory devices to achieve better performance for both light emission and heat dissipation, the present invention proposes a memory device with light emission function to solve the problems caused by the conventional technology.

Hereinafter, the characteristics, the structure and the method included in the memory device with light-emitting function of the present invention will be further explained:

First, please refer to Figures 1 and 2, which are schematic diagrams of the structure and schematic diagrams of disassembly of an embodiment of the present invention. As shown in FIGS. 1 to 2, the memory device 1 of the present invention includes a circuit board 10, a first light guide structure 20, a light guide and heat sink 30, a second light guide structure 40, and a The third light guide structure 50 and a heat dissipation element 60. The circuit board 10 has a first surface 10A and a second surface 10B, and a plurality of light-emitting elements 12 and a plurality of memory elements 14 are provided on the circuit board 10. As shown in FIGS. 3 and 4, the circuit board 10 of this embodiment is provided with a plurality of light-emitting elements 12 on the first surface 10A. The light-emitting elements 12 include a plurality of first light-emitting elements 122 and a plurality of second light-emitting elements. The light-emitting element 124 is provided with a plurality of memory elements 14 on the second surface 10B. At the same time, both the first surface 10A and the second surface 10B are provided with a plurality of gold fingers 16 under the circuit board 10, the memory of this embodiment The device 1 is based on the specification of (Double Data Rate Synchronous Dynamic Random Access Memory), and has a notch 162. According to the specification of the memory, the setting method of the gold finger 16 corresponds to the setting, which is not limited to this.

Referring again to FIGS. 1 to 4, the first light guide structure 20 is arranged on the circuit board 10, the light guide and heat dissipation element 30 is adhered to the first surface 10A of the circuit board 10, and the heat dissipation element 60 is adhered to the circuit board 10. The second surface 10B and the memory element 14, the second light guide structure 40 is disposed on the light guide and heat sink 30, and is located on the first side 20A of the first light guide structure 20, and the third light guide structure 50 is disposed on the heat sink Above the member 60 and located on the second side 20B of the first light guide structure 20, the second light guide structure 40 has a limiting portion 42, and the third light guide structure 50 has a connecting member 52. The limiting portion 42 and The connecting member 52 is connected, so that the second light guide structure 40 and the third light guide structure 50 form an accommodating space S for accommodating the second light guide structure 20. In this embodiment, the limiting portion 42 is a groove , The connecting piece 52 is a protruding piece. In addition, the third light guide structure 50 is further provided with at least one positioning part 54 and the heat sink 60 is provided with at least one positioning part 62 correspondingly. The positioning part 62 is connected to the positioning part 54 so that the third light guide structure 50 is positioned on the heat sink. Above 60.

Referring again to Figure 3 and Figures 5 and 6 together, in this embodiment, the first light-emitting element 122 and the second light-emitting element 124 have different light-emitting directions, so the arrangement is the first light-emitting element 122 The light-emitting direction D1 is upward, and the second light-emitting direction D2 of the second light-emitting element 124 is downward. The first light-emitting element 122 and the second light-emitting element 124 are arranged alternately, but the present invention is not limited to this. The light-emitting elements 124 can be arranged in a non-staggered arrangement. The first light-emitting element 122 and the second light-emitting element 124 are light-emitting diodes (LEDs). Therefore, the general light-emitting angle of the LED is 120 degrees. The arrangement with the second light-emitting element 124 does not shield light from each other.

As shown in FIG. 5, the first light-emitting element 122 emits light upwards through the side of the second light-emitting element 124 and is conducted to the first light guide structure 20, and is further conducted to the second light guide structure 40 and the third light guide structure, respectively. 50, and the first light source L1 is formed. As shown in Figure 6, the second light-emitting element 124 emits downward light, passes through the side of the first light-emitting element 122, and is conducted to the protrusion 32 of the light guide and heat sink 30, and The second light source L2 is reflected internally, thus presenting a different light emitting direction. Therefore, the memory device 1 with light-emitting function of the present invention provides better light-emitting efficiency and dazzling light source through the first light source L1 and the second light source L2. In order to obtain a better incidence effect of the light emitted by the first light-emitting element 122 on the incident mask of the first light guide structure 20, the first light guide structure 20 is provided with an irregular surface or an uneven surface on one side facing the circuit board 10. In this embodiment, the first light guide structure 20 is provided on an uneven surface 22 as an example. The uneven surface 22 is a continuous V-shaped groove, but it is not limited thereto.

In addition, the memory device 1 of the present invention further utilizes the light guide and heat dissipation member 30 to be bonded to the first surface 10A of the circuit board 10 via the first thermally conductive bonding member 80, and the heat dissipating member 60 is bonded to the second thermally conductive bonding member 90. Connected to the second surface 10B of the circuit board 10 and the memory element 14, that is, the first thermally conductive adhesive 80 is disposed between the light guide and heat sink 30 and the circuit board 10, and the second thermally conductive adhesive 90 is disposed on the heat sink Between the component 60 and the circuit board 10, the first thermally conductive bonding component 80 and the second thermally conductive bonding component 90 are thermally conductive double-sided adhesive, thermally conductive double-sided foam adhesive or a combination of the above. The light guide and heat sink 30 of the present invention can be further provided with a nameplate 70 for marking a trademark, brand name, model or a combination of the above.

Therefore, the present invention is really novel, progressive, and available for industrial use. It should meet the patent application requirements of my country's patent law. Undoubtedly, I file an invention patent application in accordance with the law. I pray that the Bureau will grant the patent as soon as possible.

However, the above are only the preferred embodiments of the present invention, and are not used to limit the scope of implementation of the present invention. For example, the shapes, structures, features and spirits described in the scope of the patent application of the present invention are equally changed and modified. , Should be included in the scope of patent application of the present invention.

1: Memory device 10: Circuit board 10A: First surface 10B: second surface 12: Light-emitting element 122: The first light-emitting element 124: second light-emitting element 14: Memory components 16: gold finger 20: The first light guide structure 20A: First side 20B: second side 22: non-flat surface 30: Light guide and heat sink 32: protrusion 40: Second light guide structure 42: limit piece 50: The third light guide structure 52: connection 54: Positioning Department 60: heat sink 62: connection 70: nameplate 80: The first thermal conductive adhesive 90: The second thermal conductive adhesive D1: The first light emitting direction D2: second light emitting direction L1: first light source L2: second light source S: housing space

Figure 1: It is a schematic structural diagram of an embodiment of the present invention; Figure 2: It is a schematic diagram of disassembly of an embodiment of the present invention; Figure 3: It is a schematic diagram of the first surface of a circuit board according to an embodiment of the present invention; Figure 4: It is a schematic diagram of the second surface of the circuit board of an embodiment of the present invention; Figure 5: It is a schematic diagram of the light emission of the first light-emitting element according to an embodiment of the invention; Fig. 6: It is a schematic diagram of light emission of a second light-emitting element according to an embodiment of the invention.

1: Memory device

10: Circuit board

10A: First surface

10B: second surface

12: Light-emitting element

122: The first light-emitting element

124: second light-emitting element

14: Memory components

16: gold finger

20: The first light guide structure

20A: First side

20B: second side

22: non-flat surface

30: Light guide and heat sink

32: protrusion

40: Second light guide structure

42: limit piece

50: The third light guide structure

52: connection

54: Positioning Department

60: heat sink

62: connection

70: nameplate

80: The first thermal conductive adhesive

90: The second thermal conductive adhesive

Claims (10)

A memory device with light-emitting function, which includes: A circuit board having a first surface, a second surface, a plurality of memory elements and a plurality of light-emitting elements, the memory elements and the light-emitting elements are arranged on the first surface and the second surface Or a combination of the above; A first light guide structure, which is arranged on the circuit board; A light guide and heat dissipation element, which is adhered to the first surface; A second light guide structure disposed on the first heat sink and located on a first side of the first light guide structure; A third light guide structure disposed on a second side of the first light guide structure and engaged with the second light guide structure to form an accommodating space for accommodating the first light guide structure; and A heat dissipation element, which adheres the second surface and the memory elements and connects the third light guide structure. The memory device described in item 1 of the scope of patent application, wherein the third light guide structure is designed There is at least one positioning part, the heat sink is provided with at least one positioning part, and the positioning part is connected with the positioning part. The memory device described in item 1 of the scope of patent application further includes: A first thermally conductive bonding element disposed between the light guide and heat dissipation element and the circuit board; and A second thermally conductive bonding element is arranged between the heat dissipation element and the circuit board. The memory device described in item 3 of the scope of patent application, wherein the first thermally conductive adhesive The second thermally conductive bonding member is thermally conductive double-sided adhesive, thermally conductive double-sided foam adhesive or a combination of the above. In the memory device described in item 1 of the scope of patent application, some of the light-emitting elements One of the first light-emitting directions of the light-emitting elements faces the first light guide structure, and a second light-emitting direction of the other light-emitting elements faces the light-transmitting heat dissipation element. The memory device described in item 1 of the scope of patent application further includes a nameplate, which is set On the light guide and heat sink. In the memory device described in item 1 of the scope of patent application, the first light guide structure surface An irregular surface or an uneven surface is provided to one side of the circuit board. As the memory device described in item 1 of the scope of patent application, the light-emitting element packages It includes a plurality of first light-emitting elements and a plurality of second light-emitting elements, wherein a first light-emitting direction of the first light-emitting elements is upward and a second light-emitting direction of the second light-emitting elements is arranged in a staggered or non-staggered arrangement . As for the memory device described in item 1 of the scope of patent application, the second light guide structure has There is a limiting portion, and a connecting piece is provided on the third light guide structure, and the connecting piece is inserted into the limiting portion so that the third light guiding structure is engaged with the second light guiding structure to form the accommodating space . The memory device described in item 9 of the scope of patent application, wherein the connecting portion is a groove Slot, the connecting piece is a protruding piece, and the protruding piece is inserted in the groove.

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