TWM608745U - Heat-dissipation module - Google Patents

Abstract

This new creation provides a heat dissipation module suitable for an electronic component. The heat dissipation module includes a main body, two heat dissipation elements, and two bonding parts. The main body includes two bearing surfaces, the bearing surfaces are opposite to each other, and the bearing surfaces are respectively formed with at least one first latch; the heat dissipation element is disposed on the bearing surface and On the electronic component, these heat sinks are respectively formed with at least one second latching portion, and the first latching portion and the second latching portion are latched with each other; the bonding portion is disposed between the heat sink and the electronic component to bond these Heat sinks and electronic components.

Description

Cooling module

The present invention provides a heat dissipation module, and particularly relates to a heat dissipation module that can fix the body and the heat dissipation element by a latch.

The personal computer is one of the indispensable electronic products in many industries and the field of electronic games. Generally speaking, necessary electronic components such as random access memory (RAM) are installed on the motherboard of a personal computer. When the computer is operating, the above-mentioned electronic components will be energized and generate considerable heat. If the heat is not quickly dissipated to the outside of the computer, it may cause the components to overheat or even damage the entire computer. At present, the heat dissipation module suitable for the above-mentioned electronic components on the market includes a main body and heat sinks located on both sides of the main body, and the heat sink and the electronic components are fixed by bonding the heat sink and the electronic components through a viscous heat dissipation paste. This simple bonding The fixing method not only has low mechanical strength, but also the heat sink is easy to fall off from the body. For this reason, some manufacturers use screws and other fasteners to directly fasten the heat sink to the body. Although this method improves the strength of the combination, it makes the assembly process more complicated, and the fasteners also make the heat sink as a whole The volume is even larger.

The creator then exhausted his mind to study carefully, and then developed a heat dissipation module that can fix the body and the heat dissipation element by a latch, in order to achieve the effect of simplifying the assembly process and reducing the size of the heat dissipation module.

This new creation provides a heat dissipation module suitable for an electronic component. The heat dissipation module includes a main body, two heat dissipation elements, and two bonding parts. The main body includes two bearing surfaces, the bearing surfaces are opposite to each other, and the bearing surfaces are respectively formed with at least one first latch; the heat dissipation element is disposed on the bearing surface and On the electronic component, these heat sinks are respectively formed with at least one second latching portion, and the first latching portion and the second latching portion are latched with each other; the bonding portion is disposed between the heat sink and the electronic component to bond these Heat sinks and electronic components.

In one embodiment, the above-mentioned first latching portion is a groove, and the second latching portion is a buckle.

In one embodiment, the above-mentioned body further includes a crown, which is connected to the bearing surface and partly aligned with a surface of the heat dissipating elements, and a part of the groove is recessed relative to the crown and snapped against Connected to the crown.

In one embodiment, the above-mentioned crown includes a top portion and two side portions. The contour of the top portion is streamlined, and a plurality of visual features are arranged on the side portion, and these visual features are protruding or recessed relative to the reference surface of the side portion.

In one embodiment, the heat dissipation module further includes a light-emitting element, the light-emitting element is disposed inside the body, the crown is a light-transmitting body, and the light emitted by the light-emitting element is transmitted through the crown.

In an embodiment, the bottom surface of the groove is inclined with respect to the bearing surface.

In one embodiment, the above-mentioned bearing surface is further formed with a first positioning portion, the heat sink is also respectively formed with a second positioning portion, and the first positioning portion is embedded in the second positioning portion so that the two heat sinks are relative to each other. The body is fixed.

In an embodiment, the above-mentioned first positioning portion is a positioning hole, and the second positioning portion is a positioning post.

In an embodiment, the above-mentioned body further includes a limiting portion connected to the carrying surface and disposed outside the electronic component.

In one embodiment, the above-mentioned heat sink is further formed with a hollow portion, each hollow portion is disposed on each bearing surface, and each bearing surface communicates with the outside through each hollow portion.

In this way, the heat dissipation module created by the present invention can be locked with each other by the first locking part and the second locking part, so that the heat sink is fixed relative to the body, thereby achieving the effect of reducing the locking process and reducing the volume.

In order to make the above-mentioned features and advantages of the new creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

The aforementioned and other technical content, features and effects of the creation of the new model will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate, not to limit the creation of the new type. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

Please refer to FIGS. 1 and 2. FIG. 1 is a three-dimensional schematic diagram of an embodiment of the heat dissipation module created by the new type, and FIG. 2 is an exploded view of the components of the heat dissipation module in FIG. The heat dissipation module 1 of this embodiment is suitable for an electronic component 2, and includes a main body 100, two heat dissipation elements 200, and two bonding parts 300, wherein the heat dissipation member 200 is connected to the main body 100 and the electronic element 2, and the bonding part 300 It is arranged between the heat sink 200 and the electronic component 2.

In detail, the electronic component 2 is, for example, a random access memory and includes a plurality of integrated circuit chips. The body 100 is, for example, a core board made of plastic or acrylic, and the heat sink 200 is, for example, zinc. The sheet-like structure made of alloy can be attached to the electronic component 2 to assist in heat dissipation. In this embodiment, the bonding portion 300 is, for example, a layered structure formed by a thermally conductive glue, which can be directly pasted or disposed between the heat sink 200 and the electronic component 2 to bond the heat sink 200 and the electronic component 2, thereby The heat transfer efficiency between the two can be further improved.

Please refer to FIG. 3, which is a three-dimensional schematic diagram of the main body in FIG. 2. The body 100 of this embodiment includes two bearing surfaces 110, and the bearing surfaces 110 are opposite to each other and used for bearing the heat sink 200. Furthermore, at least one first latching portion 112 is respectively formed on the bearing surface 110, wherein the first latching portion 112 is, for example, a groove for latching with the heat sink 200. In addition, in order to make the connection between the main body 100 and the heat dissipating element 200 more stable, preferably, the bearing surface 110 is further formed with a first positioning portion 114, wherein the first positioning portion 114 is, for example, a positioning hole for The heat sink 200 is embedded with each other.

Preferably, the body 100 of this embodiment further includes a crown 120 and a limiting portion 130, wherein the crown 120 includes a top 122 and two side portions 124, the top 122 has a streamlined profile, and the side 124 is configured On both sides of the top 122; on the other hand, the limiting portion 130 is connected to the carrying surface 110, and is disposed on the outside of the electronic component 2 during assembly, and can limit the electronic component 2 in the length direction.

Please refer to FIGS. 4 and 5, where FIG. 4 is a bottom view of FIG. 3, and FIG. 5 is an enlarged schematic view of the circular area A in FIG. Specifically, the first latching portion 112, that is, a part of the groove, is recessed relative to the crown 120, and as shown in FIG. 5, the bottom surface 112a of the groove is inclined with respect to the bearing surface 110. Through this configuration, The heat sink 200 is easier and stronger when assembled on the main body 100. On the other hand, a plurality of visual features 124a are arranged on the side portion 124, wherein the visual features 124a are, for example, peaks and valleys formed by inclined planes, which not only provide the user with a novel visual experience, but also as shown in FIG. 5 These visual features 124a are protruding or recessed relative to the reference plane S of the side portion 124, so that the grasping ability can be improved when the user holds it, thereby preventing the body 100 from slipping off the hand or making it easier for the user to hold the body 100 and extract the entire heat dissipation module 1.

In addition to the above-mentioned functions, the heat dissipation module 1 of this embodiment also has the effect of improving the visual effect through the light-emitting element. In a possible embodiment, the electronic element 2 may be disposed on a light-emitting element (not shown) on a substrate, where the light-emitting element is, for example, a light-emitting diode, and the crown 120 may be a light-transmitting body. Thereby, when the heat dissipation module 1 is connected to the power supply, the light emitted by the light emitting element can be transmitted through the crown 120, and further diffuse through the protrusions and depressions of the visual feature 124a, which greatly improves the heat dissipation module 1 Give the user a visual experience.

Please refer to FIGS. 6 and 7, where FIG. 6 is a schematic front view of the heat sink in FIG. 2, and FIG. 7 is a schematic rear view of FIG. 6. The heat sink 200 of this embodiment is disposed on the carrying surface 110 and the electronic component 2, wherein at least one second latching portion 220 is respectively formed on the heat sink 200, wherein the second latching portion 220 is, for example, a latch for The first latch 112 is latched with each other. In this embodiment, the number of the first latching portion 112 and the second latching portion 220 are two respectively. The main body 100 and the heat sink 200 can be fixed at the front and rear positions of the main body 100 and the heat sink 200, but the invention is a creation There is no limitation on this. According to actual needs, the first latching portion 112 and the second latching portion 220 can also be provided with only one or more than three, as long as the effect of fixing the body 100 and the heat sink 200 can be achieved. That's it.

Preferably, the second heat sink 200 is further formed with a second positioning portion 230, wherein the second positioning portion 230 is, for example, a positioning column, which can be embedded in the first positioning portion 114 on the carrying surface 110 so that the heat sink 200 Relative to the main body 100 being fixed, the main body 100 and the heat sink 200 can have a tighter combination relationship except for the first latching portion 110 and the second latching portion 220 to be latched with each other through such a configuration.

In addition, in order to further improve the heat dissipation effect and visual experience of the heat sink 200, preferably, the heat sink 200 is further formed with a hollow portion 240, wherein the hollow portion 240 is, for example, a continuous through groove portion. When the heat sink 200 is disposed on the main body 100, each hollow portion 240 is disposed on each bearing surface 110, and each bearing surface 110 is connected to the outside through each hollow portion 240, so that the heat dissipation effect of the heat dissipation module 1 can be improved. good.

Please refer to FIG. 8, which is a schematic left side view of the heat dissipation module of FIG. 1 when assembled. When the user wants to assemble the heat dissipating module 1 on the electronic component 2, firstly, the bonding part 300 can be arranged at the position of the electronic component 2 corresponding to the heat dissipating element 2, and the second latching part 220 of the heat dissipating element 200 can be moved along the body The first latching portion 112 of 100 slides, because the bottom surface 112a of the first latching portion 112 is inclined with respect to the bearing surface 110, and a part of the first latching portion 112 is recessed with respect to the crown 120, so when assembling, Preferably, the heat sink 200 can gradually push the second latching portion 220 into the recessed portion of the first latching portion 112 with respect to the crown portion 120 in an inclined manner as shown in FIG. 8 until the second latching portion 220 is also That is, when the buckle abuts against the crown and a part of the crown 120 is aligned with the surface 210 of the heat sink 200, the heat sink 200 is then covered with the second latching portion 220 as the pivot point, so that the second positioning The portion 230 is embedded in the first positioning portion 114, and the inner surface of the heat sink 200 is also positioned on the bonding portion 300, so that while being fixed to the main body 100, it can be bonded to the electronic component 2 through the bonding portion 300. Provide good heat dissipation effect.

The creation of the present invention has been disclosed in the above preferred embodiments. However, those familiar with the technology should understand that the above-mentioned embodiments are only used to describe the creation of the present invention, and should not be interpreted as limiting the scope of the creation of the present invention. And it should be noted that all changes and replacements equivalent to the above-mentioned embodiments should be included in the scope of the creation of the new type. Therefore, the scope of protection for the creation of the new model shall be subject to the scope of the patent application.

1: Cooling module 100: body 110: bearing surface 112: The first card switch 112a: bottom surface 114: The first positioning part 120: Crown 122: top 124: Side 124a: visual features 130: limit part 200: heat sink 210: Surface 220: The second card switch 230: second positioning part 240: hollow part 300: Adhesive part 2: electronic components A: area S: datum plane

FIG. 1 is a three-dimensional schematic diagram of an embodiment of the heat dissipation module created by the new type. FIG. 2 is an exploded schematic diagram of components of the heat dissipation module in FIG. 1. FIG. 3 is a three-dimensional schematic diagram of the main body in FIG. 2. Fig. 4 is a schematic bottom view of Fig. 3. FIG. 5 is an enlarged schematic diagram of the circular area A in FIG. 4. Fig. 6 is a schematic front view of the heat sink in Fig. 2. Fig. 7 is a schematic rear view of Fig. 6. Fig. 8 is a schematic left side view of the heat dissipation module of Fig. 1 when assembled.

1: Cooling module

100: body

200: heat sink

300: Adhesive part

2: electronic components

Claims (10)

A heat dissipation module is suitable for an electronic component, and the heat dissipation module includes: A body, including two bearing surfaces, the two bearing surfaces are opposite to each other, and at least one first latching portion is respectively formed on the two bearing surfaces; Two heat sinks are arranged on the two bearing surfaces and the electronic component, the two heat sinks are respectively formed with at least one second latching portion, and the first latching portion and the second latching portion are latched with each other; and The two bonding parts are arranged between the two heat dissipation elements and the electronic element to bond the two heat dissipation elements and the electronic element. The heat dissipation module according to claim 1, wherein the first latch is a groove, and the second latch is a buckle. The heat dissipation module according to claim 2, wherein the body further includes a crown, the crown is connected to the two bearing surfaces and a part is aligned with a surface of the two heat dissipation elements, and a part of the groove It is recessed relative to the crown, and the buckle abuts against the crown. The heat dissipation module according to claim 3, wherein the crown includes a top portion and two side portions, the outline of the top portion is streamlined, the two side portions are configured with a plurality of visual features, and the plurality of visual features are opposite to each other The reference planes on the two sides are raised or recessed. The heat dissipation module according to claim 3, wherein the electronic element is disposed on a light-emitting element, the crown is a light-transmitting body, and the light emitted by the light-emitting element is transmitted through the crown. The heat dissipation module according to claim 2, wherein the bottom surface of the groove is inclined with respect to the carrying surface. The heat dissipation module according to claim 1, wherein the two bearing surfaces are respectively formed with a first positioning portion, the two heat dissipation members are also respectively formed with a second positioning portion, and the first positioning portion is embedded in the second positioning portion. The positioning part is used to fix the two heat dissipation elements relative to the main body. The heat dissipation module according to claim 7, wherein the first positioning portion is a positioning hole, and the second positioning portion is a positioning pillar. The heat dissipation module according to claim 1, wherein the body further includes a limiting portion connected to the carrying surface and disposed on the outside of the electronic component. The heat dissipation module according to claim 1, wherein each of the two heat dissipation members is further formed with a hollow portion, each hollow portion is disposed on each of the bearing surfaces, and each bearing surface communicates with the outside through each of the hollow portions.

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