CN111986713A - Memory device with light-emitting function - Google Patents
Memory device with light-emitting function Download PDFInfo
- Publication number
- CN111986713A CN111986713A CN201910435514.2A CN201910435514A CN111986713A CN 111986713 A CN111986713 A CN 111986713A CN 201910435514 A CN201910435514 A CN 201910435514A CN 111986713 A CN111986713 A CN 111986713A
- Authority
- CN
- China
- Prior art keywords
- light
- light guide
- guide structure
- memory device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a memory device with a light-emitting function, which is characterized in that a plurality of light-emitting elements are arranged on a circuit board, so that when the memory device is inserted on a computer device, the light-emitting elements and a light-guiding heat-radiating piece on the first side of the circuit board can be guided by a first light-guiding structure, a second light-guiding structure and a third light-guiding structure on the circuit board to guide the light sources of the light-emitting elements to emit light outwards, and meanwhile, the heat is radiated on the first surface and the second surface of the circuit board through the light-guiding heat-radiating piece and the heat-radiating. The memory device has the light-emitting function and has a better heat dissipation effect.
Description
Technical Field
The present invention relates to a memory, and more particularly, to a memory device with a light emitting function.
Background
Computer hardware is developed toward high speed and high frequency to improve the operating efficiency of computers, and the computer hardware is operated in a high speed and high frequency environment for a long time and generates high temperature relatively. In order to cooperate with the high-speed operation of the processor, the operating temperature of the memory is higher and higher, and the continuously rising temperature will affect the performance of the memory and even cause the memory to be damaged.
However, in recent years, due to the prosperous trend of electronic games and the popularity of more or less computers being modified, many users or manufacturers of electronic games will change the housing of the electronic games to a transparent housing, and the modification becomes more and more popular, and the internal components of the electronic games, such as: the CPU, the display card, and the memory have better performance than the general pc, and thus relatively generate more heat, but the excessive heat may reduce the performance of the electronic components, so people may mount a heat sink on the electronic components. In the electronic competition industry, the heat dissipation element mounted on the electronic element not only needs excellent heat dissipation efficiency, but also has a design that is a heavy game compared with electronic competition equipment. Accordingly, the components inside the housing of the computer for electronic contest, such as the display card or the CPU or the power supply or the heat dissipation device of the housing, are not the traditional simple aspects of the display card or the CPU, but add many striking shapes and dazzling lighting effects.
However, in the existing electronic computer, a light emitting element is added to a conventional modified CPU fan or display card fan or chassis fan, when the electronic computer is powered on, the CPU fan or display card fan or chassis fan will emit a dazzling light source, and a metal heat sink is added to the electronic memory device to improve the heat dissipation effect.
In view of the above problems, the present invention provides a memory device with a light emitting function, which provides a structure with light guiding and heat dissipating effects, so that the memory device can provide a glaring light emitting effect without affecting the heat dissipating effect.
Disclosure of Invention
The present invention provides a memory device with a light emitting function, wherein a circuit board is provided with a light emitting device and a memory device, a heat dissipation member dissipates heat from the memory device, and a light guide heat dissipation member and a light guide structure guide and dissipate heat from a light source of the light emitting device.
In order to achieve the above object, the present invention discloses a memory device with a light emitting function, comprising: the light guide structure comprises a circuit board, a first light guide structure, a light guide heat dissipation part, a second light guide structure, a third light guide structure and a heat dissipation part, wherein the circuit board is provided with a first surface, a second surface, a plurality of memory elements and a plurality of light emitting elements, and the plurality of memory elements and the plurality of light emitting elements are arranged on the first surface, the second surface or the combination; the light guide heat dissipation part is adhered to the first surface, the heat dissipation part is adhered to the second surface and the plurality of memory elements, the first light guide structure, the second light guide structure and the third light guide structure are respectively arranged on the circuit board, the light guide heat dissipation part and the heat dissipation part, the second light guide structure is located on the first side of the first light guide structure, and the third light guide structure is arranged on the second side of the first light guide structure and clamped with the second light guide structure to form an accommodating space for accommodating the first light guide structure. Therefore, the first light guide structure, the second light guide structure, the third light guide structure and the light guide heat dissipation part guide the light sources emitted by the multiple light emitting elements, and the light guide heat dissipation part and the heat dissipation part dissipate heat of the circuit board, so that a better light emitting effect and a better heat dissipation effect are obtained.
The invention provides an embodiment, which is characterized in that the light guide heat dissipation member is provided with at least one positioning part, the second heat dissipation member is provided with at least one positioning part, and the positioning part is connected with the positioning part.
The present invention provides an embodiment, wherein the memory device further comprises a first thermal conductive adhesive member and a second thermal conductive adhesive member, the first thermal conductive adhesive member is disposed between the first heat sink and the circuit board, and the second thermal conductive adhesive member is disposed between the second heat sink and the circuit board.
The present invention provides an embodiment, wherein the first thermal conductive adhesive member and the second thermal conductive adhesive member are a thermal conductive double-sided tape, a thermal conductive double-sided foam adhesive, or a combination thereof.
The invention provides an embodiment, wherein a first light emitting direction of a part of the plurality of light emitting elements faces the first light guiding structure, and a second light emitting direction of the rest of the plurality of light emitting elements faces the light-transmitting heat dissipation member.
An embodiment of the present invention provides a memory device further comprising a nameplate disposed on the light-transmissive heat sink.
The present invention provides an embodiment, wherein an irregular surface or a non-flat surface is disposed on a side of the light guide structure facing the circuit board.
The present invention provides an embodiment, wherein the plurality of light emitting elements include a plurality of first light emitting elements and a plurality of second light emitting elements, and a first light emitting direction of the plurality of first light emitting elements is arranged in a staggered manner or a non-staggered manner with a second light emitting direction of the plurality of second light emitting elements.
The present invention provides an embodiment, wherein the second light guiding structure has a connecting portion, and the third light guiding structure has a connecting member thereon, and the connecting member is inserted into the connecting portion, so that the third light guiding structure is engaged with the second light guiding structure to form the accommodating space.
The present invention provides an embodiment, wherein the connecting portion is a groove, the connecting member is a protruding member, and the protruding member is inserted into the groove.
Drawings
FIG. 1: which is a schematic structural diagram of an embodiment of the present invention.
FIG. 2: which is a disassembled view of an embodiment of the present invention.
FIG. 3: which is a schematic diagram of a first surface of a circuit board according to an embodiment of the invention.
FIG. 4: which is a second surface schematic diagram of the circuit board according to an embodiment of the invention.
FIG. 5: which is a light-emitting schematic diagram of the first light-emitting element according to an embodiment of the invention.
FIG. 6: which is a schematic light-emitting diagram of the second light-emitting element according to an embodiment of the invention.
[ description of main element symbols ]
1: the memory device 10: circuit board
10A: first surface 10B: second surface
12: light-emitting element 122: first light emitting element
124: second light-emitting element 14: memory device
16: the golden finger 20: first light guide structure
20A: first side 20B: second side
22: non-flat surface 30: light-guiding heat sink
32: projection 40: second light guide structure
42: limiting member 50: third light guide structure
52: the connecting piece 54: positioning part
60: the heat sink 62: connecting piece
70: nameplate 80: first heat-conducting adhesive member
90: second thermally conductive adhesive D1: first light emitting direction
D2: second light emission direction L1: first light source
L2: second light source S: containing space
Detailed Description
In order to make the examiner further understand and appreciate the features and effects of the present invention, the embodiments and the accompanying descriptions are considered as follows:
in view of the difficulty in achieving better performance of both light-emitting and heat-dissipating effects of the conventional memory devices, the present invention provides a memory device with light-emitting function to solve the problems caused by the conventional techniques.
The characteristics, the associated structure and the method of the memory device with light-emitting function of the present invention will be further described as follows:
First, please refer to fig. 1 and fig. 2, which are a schematic structural diagram and a disassembly diagram according to an embodiment of the present invention. As shown in fig. 1 to 2, the memory device 1 of the present invention includes a circuit board 10, a first light guide structure 20, a light guide heat sink 30, a second light guide structure 40, a third light guide structure 50, and a heat sink 60. The circuit board 10 has a first surface 10A and a second surface 10B, and the circuit board 10 is provided with a plurality of light emitting devices 12 and a plurality of memory devices 14. As shown in fig. 3 and 4, in the circuit board 10 of the present embodiment, the first surface 10A is provided with a plurality of light emitting elements 12, the light emitting elements 12 include a plurality of first light emitting elements 122 and a plurality of second light emitting elements 124, the second surface 10B is provided with a plurality of Memory elements 14, and no matter the first surface 10A and the second surface 10B are provided with a plurality of gold fingers 16 under the circuit board 10, the Memory device 1 of the present embodiment has a gap 162 based on (Double Data Rate Dynamic Random Access Memory) specification, and is correspondingly disposed according to the Memory specification and the disposition manner of the gold fingers 16, but is not limited thereto.
Referring to fig. 1 to 4, the first light guiding structure 20 is disposed on the circuit board 10, the light guiding heat dissipating member 30 is disposed on the first surface 10A of the circuit board 10, the heat dissipating member 60 is disposed on the second surface 10B of the circuit board 10 and the memory device 14, the second light guiding structure 40 is disposed on the light guiding heat dissipating member 30 and located on the first side 20A of the first light guiding structure 20, the third light guiding structure 50 is disposed on the heat dissipating member 60 and located on the second side 20B of the first light guiding structure 20, wherein the second light guiding structure 40 has a position limiting portion 42, the third light guiding structure 50 has a connecting member 52, the position limiting portion 42 is connected to the connecting member 52, so that the second light guiding structure 40 and the third light guiding structure 50 form an accommodating space S for accommodating the second light guiding structure 20, in this embodiment, the position limiting portion 42 is a groove, and the connecting member 52 is a. In addition, the third light guiding structure 50 is further provided with at least one positioning portion 54, the heat sink 60 is correspondingly provided with at least one positioning member 62, and the positioning member 62 is connected with the positioning portion 54, so that the third light guiding structure 50 is positioned on the heat sink 60.
Referring to fig. 3 and fig. 5 and 6 together, in the present embodiment, the first light emitting element 122 and the second light emitting element 124 are arranged in different light emitting directions, so the first light emitting direction D1 of the first light emitting element 122 is upward, the second light emitting direction D2 of the second light emitting element 124 is downward, and the first light emitting element 122 and the second light emitting element 124 are arranged in a staggered manner, but the present invention is not limited thereto, and the first light emitting element 122 and the second light emitting element 124 may be further arranged in a non-staggered manner, wherein the first light emitting element 122 and the second light emitting element 124 are Light Emitting Diodes (LEDs), so that the general light emitting angle of the LEDs is 120 degrees, and the arrangement of the first light emitting element 122 and the second light emitting element 124 in the present embodiment does not shield light rays from each other.
As shown in fig. 5, the first light emitting element 122 emits light upward and is conducted to the first light guiding structure 20 through the side edge of the second light emitting element 124, and is further conducted to the second light guiding structure 40 and the third light guiding structure 50, respectively, to form a first light source L1, as shown in fig. 6, the second light emitting element 124 emits light downward and is conducted to the protrusion 32 of the light guiding heat sink 30 through the side edge of the first light emitting element 122, and is reflected internally, thereby presenting a second light source L2 with different light emitting directions. Therefore, the memory device 1 with the light emitting function of the present invention provides a better light emitting efficiency and a dazzling light source by the first light source L1 and the second light source L2. In order to obtain a better incident effect of the light emitted by the first light emitting element 122 on the incident surface of the first light guiding structure 20, an irregular surface or a non-flat surface is disposed on a side of the first light guiding structure 20 facing the circuit board 10, in this embodiment, the first light guiding structure 20 is disposed on the non-flat surface 22 as an example, and the non-flat surface 22 is a continuous V-shaped groove, but not limited thereto.
In addition, the memory device 1 further utilizes the light guiding heat dissipating member 30 to be bonded to the first surface 10A of the circuit board 10 through the first thermal adhesive member 80, and the heat dissipating member 60 is bonded to the second surface 10B of the circuit board 10 and the memory device 14 through the second thermal adhesive member 90, that is, the first thermal adhesive member 80 is disposed between the light guiding heat dissipating member 30 and the circuit board 10, and the second thermal adhesive member 90 is disposed between the heat dissipating member 60 and the circuit board 10, wherein the first thermal adhesive member 80 and the second thermal adhesive member 90 are a thermal double-sided tape, a thermal double-sided foam adhesive or a combination thereof. The light-guiding heat sink 30 of the present invention may further include a nameplate 70 for indicating a trademark, a brand name, a model number or a combination thereof.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent variations and modifications in the shape, structure, characteristics and spirit described in the claims of the present invention are included in the claims of the present invention.
Claims (10)
1. A memory device having a light emitting function, comprising:
a circuit board having a first surface, a second surface, a plurality of memory elements and a plurality of light emitting elements, the plurality of memory elements and the plurality of light emitting elements being disposed on the first surface, the second surface, or a combination thereof;
A first light guide structure disposed on the circuit board;
a light guide heat sink adhered to the first surface;
the second light guide structure is arranged on the first heat dissipation part and positioned on the first side of the first light guide structure;
the third light guide structure is arranged on the second side of the first light guide structure and clamped with the second light guide structure to form an accommodating space for accommodating the first light guide structure; and
and the heat dissipation part is adhered with the second surface and the plurality of memory elements and is connected with the third light guide structure.
2. The memory device of claim 1, wherein: the third light guide structure is provided with at least one positioning part, the heat dissipation part is provided with at least one positioning part, and the positioning part is connected with the positioning part.
3. The memory device of claim 1, further comprising:
the first heat conduction bonding piece is arranged between the light guide heat dissipation piece and the circuit board; and
and the second heat conduction bonding piece is arranged between the heat dissipation piece and the circuit board.
4. The memory device of claim 3, wherein: wherein the first and second thermally conductive bonding members are thermally conductive double-sided adhesive tape, thermally conductive double-sided foam adhesive tape, or a combination thereof.
5. The memory device of claim 1, wherein: wherein, the first light emitting directions of part of the plurality of light emitting elements face the first light guide structure, and the second light emitting directions of the rest of the plurality of light emitting elements face the light-transmitting heat dissipation member.
6. The memory device of claim 1, wherein: further comprises a nameplate disposed on the light-guiding heat sink.
7. The memory device of claim 1, wherein: wherein one side of the first light guide structure facing the circuit board is provided with an irregular surface or a non-flat surface.
8. The memory device of claim 1, wherein: the plurality of light-emitting elements comprise a plurality of first light-emitting elements and a plurality of second light-emitting elements, and the first light-emitting directions of the plurality of first light-emitting elements and the second light-emitting directions of the plurality of second light-emitting elements are arranged in a staggered or non-staggered mode.
9. The memory device of claim 1, wherein: the second light guide structure is provided with a limiting part, the third light guide structure is provided with a connecting piece, and the connecting piece is inserted into the limiting part to enable the third light guide structure to be clamped with the second light guide structure to form the accommodating space.
10. The memory device of claim 9, wherein: the connecting part is a groove, the connecting part is a protruding part, and the protruding part is inserted into the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435514.2A CN111986713A (en) | 2019-05-23 | 2019-05-23 | Memory device with light-emitting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435514.2A CN111986713A (en) | 2019-05-23 | 2019-05-23 | Memory device with light-emitting function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111986713A true CN111986713A (en) | 2020-11-24 |
Family
ID=73437477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910435514.2A Pending CN111986713A (en) | 2019-05-23 | 2019-05-23 | Memory device with light-emitting function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111986713A (en) |
-
2019
- 2019-05-23 CN CN201910435514.2A patent/CN111986713A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4386219B2 (en) | Heat dissipation mechanism and electronic device having the heat dissipation mechanism | |
| US7563070B2 (en) | Cooling fan | |
| US7832899B2 (en) | LED lamp with heat sink | |
| US20120075850A1 (en) | Led lamp | |
| US10900493B2 (en) | Luminous fan | |
| JP5729581B2 (en) | Surface emitting device | |
| TWM585921U (en) | Light guiding element and electronic device having the same | |
| US10585463B1 (en) | Luminous fan | |
| US11073648B2 (en) | Light guide element and electronic device having the same | |
| TWI652568B (en) | Electronic device | |
| CN210039639U (en) | Memory device with light-emitting function | |
| CN111986713A (en) | Memory device with light-emitting function | |
| TWM594068U (en) | Portable air pump | |
| TWI703920B (en) | Memory device with lighting function | |
| US20200072231A1 (en) | Luminous fan | |
| US10101523B1 (en) | Light guide heat dissipation module and electronic device | |
| TWM531987U (en) | Centrifugal fan module | |
| TWM584969U (en) | Memory device with lighting function | |
| JP3911525B2 (en) | Heat dissipation mechanism and electronic device having the heat dissipation mechanism | |
| TW201317676A (en) | Display device with heat dissipating structures and electronic device using the same | |
| TW201512583A (en) | Light condensation projecting light bulb with sideway light source | |
| US20220061196A1 (en) | Diversion structure for heat dissipation of display card | |
| CN214464982U (en) | Luminous fan | |
| CN112019706B (en) | Electronic device | |
| CN216414942U (en) | Electronic device and heat dissipation module thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |