TW202035723A - Copper alloy plate, electronic component for passage of electricity, and electronic component for heat dissipation - Google Patents

Abstract

This copper alloy plate contains 0.1-0.6 mass% of Cr, and a total of 0.01-0.30 mass% of Zr and/or Ti, the remaining portion being copper and incidental impurities. Regarding the copper alloy plate, the Schmid factor as measured when tensile stress is applied in a direction parallel to a parallel rolling direction (RD) with respect to the peak orientation of an integrated intensity in an inverse pole figure in the RD obtained from an XRD measurement, is 0.40 or more.

Description

Copper alloy plates, electronic parts for energization and electronic parts for heat dissipation

The invention relates to a copper alloy plate, electronic parts for energization and electronic parts for heat dissipation. In detail, the present invention relates to a copper alloy plate used as a material for electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. mounted on motors/electronic devices, automobiles, etc., And the electronic parts for electricity and the electronic parts for heat dissipation using the copper alloy plate.

Mounted in terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks and other electronic parts of motors/electronic equipment, automobiles, etc., as a material for transmitting electricity or heat, it is widely used with strength and conductivity Copper alloy plate with excellent properties such as electrical conductivity and thermal conductivity.

In recent years, electronic parts for energization, such as connectors for electronic devices, have continuously developed higher currents. It is believed that they must have good flexibility, conductivity of 75% IACS or more, and guaranteed stress of 550 MPa or more. In addition, for example, the liquid crystal of a smart phone or a tablet PC uses electronic components for heat dissipation called a liquid crystal frame. The copper alloy plate used in this kind of heat dissipation application has also been continuously developing high thermal conductivity, and it is also believed that it must have good flexibility and high strength. Therefore, copper alloy plates used in heat dissipation applications must also have a conductivity of 75% IACS or more and a guaranteed stress of 550 MPa or more. Here, electrical conductivity and thermal conductivity are in a proportional relationship, so by increasing the electrical conductivity, the thermal conductivity is also increased.

However, it is difficult to achieve a conductivity of 75% or higher IACS from the Carson alloy-based copper alloy, so Cu-Cr-based or Cu-Zr-based copper alloys are gradually developed. For example, Patent Document 1 proposes a copper alloy material containing 0.1 to 0.8% by mass of Cr, and a total of 0.005 to 0.5% by mass of one or two of Mg, Ti, Zr, Zn, Fe, Sn, Ag, and Si The remaining part is composed of copper and unavoidable impurities. The average crystal grain size is 15-80 μm, and the coefficient of variation of crystal grain size (standard deviation of crystal grain size/average crystal grain size) is 0.40 or less. The copper alloy material has a conductivity above 75% IACS, and has good strength and bending workability.

In addition, Patent Document 2 proposes a copper alloy plate that contains 0.1 to 0.6% by mass of Cr, and a total of 0.01 to 0.30% by mass of one or both of Zr and Ti, and the remainder is made of copper and inevitable Constituted by impurities, I (220)/I ₀ (220) obtained by X-ray diffraction on the surface of the material satisfies 3≦I(220)/I ₀ (220)≦13, about I(200)/ I ₀ (200), which satisfies 0.2≦I (200)/I ₀ (200)≦2. The copper alloy plate has a conductivity above 80% IACS, and has good strength and bending workability. [Prior Art Document] [Patent Document]

[Patent Document 1] JP 2013-129889 A [Patent Document 2] JP 2017-179503 A

[The problem to be solved by the invention]

In the bending process of copper alloy plates, the bending surface of the bending part must also be good. The reason is that when the curved surface of the curved portion is not good, the contact area of the curved portion is reduced in a connector or the like, which becomes the main cause of the decrease in electrical conductivity. However, Patent Documents 1 and 2 judge the bendability only by the presence or absence of cracks, and even when there is no crack, the curved surface of the curved portion may be defective. Therefore, the techniques of Patent Documents 1 and 2 may not necessarily achieve good curved surfaces.

The embodiment of the present invention was completed in order to solve the above-mentioned problems, and the problem is to provide a copper alloy plate having high electrical conductivity and high strength, and capable of forming a curved portion with a good curved surface. In addition, the subject of the embodiments of the present invention is to provide an electronic component for energization and an electronic component for heat dissipation that can be manufactured by bending without deteriorating the curved surface of the curved portion with high electrical conductivity and high strength. [Technical means to solve the problem]

In order to solve the above-mentioned problems, the inventors have made diligent research. As a result, they focused on the copper alloy plate with a specific composition. The Schmid factor of the copper alloy plate is closely related to the curved surface of the bend. The compaction factor when the tensile stress is loaded in the direction parallel to the rolling direction (RD) is controlled to a specific range, and a curved portion with a good curved surface can be formed, thereby completing the present invention.

That is, the embodiment of the present invention is a copper alloy plate containing 0.1 to 0.6 mass% of Cr, a total of 0.01 to 0.30 mass% of one or two of Zr and Ti, and the remainder is made of copper and inevitable impurities The density factor is 0.40 or more when the tensile stress is loaded in the direction parallel to the RD relative to the peak orientation of the aggregation strength in the reverse pole map of the rolling parallel direction (RD) obtained by XRD measurement .

In addition, an embodiment of the present invention is an electronic component for energization or electronic component for heat dissipation using the above-mentioned copper alloy plate. [Effects of Invention]

According to the embodiment of the present invention, it is possible to provide a copper alloy plate having high conductivity and high strength, and forming a curved portion with a good curved surface. In addition, according to the embodiment of the present invention, it is possible to provide an electronic component for energization and an electronic component for heat dissipation that can be manufactured by bending without deteriorating the curved surface of the curved portion with high conductivity and high strength.

Hereinafter, the preferred embodiments of the present invention will be described in detail, but the present invention should not be limited to these explanations, as long as it does not deviate from the spirit of the present invention, various changes and improvements can be made based on the knowledge of the industry. The plurality of constituent elements disclosed in this embodiment can be combined appropriately to form various inventions. For example, some constituent elements may be deleted from all the constituent elements shown in this embodiment, or constituent elements of different embodiments may be appropriately combined.

(composition) The copper alloy plate of the embodiment of the present invention contains 0.1 to 0.6 mass% of Cr, 0.01 to 0.30 mass% of one or two of Zr and Ti in total, and the remainder is composed of copper and unavoidable impurities. In one embodiment, it is preferable to contain Cr in an amount of 0.15 to 0.3% by mass, and to contain one or two of Zr and Ti in a total amount of 0.05 to 0.20% by mass. If Cr exceeds 0.6% by mass, the bending workability is reduced, and if it is less than 0.1% by mass, it is difficult to obtain a 0.2% guaranteed stress of 550 MPa or more. If the total of one or both of Zr and Ti exceeds 0.30% by mass, the bending workability is reduced, and if it is less than 0.01% by mass, it is difficult to obtain a 0.2% guaranteed stress of 550 MPa or more. In addition, in this specification, the so-called "unavoidable impurities" means components that are inevitably mixed in during the process of melting the raw materials.

Furthermore, the copper alloy sheet of the embodiment of the present invention preferably contains a total of 1.0% by mass or less selected from Ag, Fe, Co, Ni, Mn, Zn, Mg, Si, P, Sn, Al, Ca, Y, Nb One or more of the group consisting of, Mo, Hf, W, Pt, Au and B. These elements contribute to the increase in strength by solid solution strengthening or precipitation strengthening. If the total amount of these elements exceeds 1.0% by mass, the electrical conductivity may decrease, or it may crack during hot rolling.

In addition, the industry can understand that the copper alloy plate with high strength and high conductivity can change the amount of each added element according to the combination of the added elements. In a typical implementation aspect, for example, Ag 1.0% by mass or less, Fe 0.1% by mass or less, Co 0.1% by mass or less, Ni 0.2% by mass or less, Mn 0.1% by mass or less, Zn 0.5% by mass or less, and Mg 0.1% by mass can be added. % Or less, Si 0.1 mass% or less, P 0.05 mass% or less, Sn 0.1 mass% or less, Al 0.1 mass% or less, Ca 0.1 mass% or less, Y 0.1 mass% or less, Nb 0.1 mass% or less, Mo 0.1 mass% or less , Hf 0.1% by mass or less, W 0.1% by mass or less, Pt 0.1% by mass or less, Au 0.1% by mass or less, B 0.05% by mass or less, but if the conductivity is not less than 75% IACS, the combination and amount of additive elements , The copper alloy plate of the present invention is not necessarily limited to these upper limits.

The thickness of the copper alloy sheet of the embodiment of the present invention is not particularly limited, and it can be set to 0.03 to 0.6 mm, for example.

(Solid density factor) The compactness factor of the copper alloy plate is an index indicating the ease of sliding deformation, and is closely related to the curved surface of the curved portion formed by the bending process. The inventors focused on the curved surface of GW: Good Way (the bending axis of the copper alloy plate is the direction at right angles to the rolling direction). As a result, it was confirmed that the increase in the rolling direction (RD) load stretched A good curved surface can be obtained at the value of the compact factor in the stress situation. It is believed that the reason is that the larger the value of the compaction factor, the easier the sliding surface will slide (in addition, the maximum value of the compaction factor is 0.5), so by increasing the compaction factor in the above direction, it is easier to apply a bending load along GW Sliding deformation occurs, and as a result, the yield stress is reduced.

，將負載軸與滑動方向所成之角設為λ，則分解剪切應力τ以τ＝（F／A）・cosλ・cos

＝σ・cosλ・cos

表示。其為史密德定律，cosλ・cos

為實密因子。實密因子於λ＝

＝45°時成為最大值（此外，關於實密因子，參照塑性加工技術系列2「材料」日本塑性加工學會編，可樂娜公司，p.12）。Fig. 3 shows a model for simply explaining the tensile decomposition shear stress of a single crystal. Specifically, FIG. 3 is a model diagram for simply explaining the compaction factor, and is a diagram schematically showing the plastic deformation of the single crystal. That is, when the single-wafer rod 10 with the cross-sectional area A is stretched by the uniaxial load F, the sliding surface 20 and the sliding direction 25 in the die of the single-wafer rod 10 generate decomposition shear stress. If the decomposed shear stress τ reaches the critical shear stress τc specific to the material, sliding deformation (plastic deformation) will occur. If the axial stress is set to σ, the angle formed by the load shaft and the normal line of the sliding surface is set to

, The angle between the load axis and the sliding direction is set to λ, and the shear stress τ is resolved by τ=(F/A)·cosλ·cos

＝σ・cosλ・cos

Said. It is Schmid’s law, cosλ·cos

Is the solid density factor. The density factor is at λ=

= 45°, it becomes the maximum value (in addition, for the compactness factor, refer to Plastic Processing Technology Series 2 "Materials", edited by the Society of Plastic Processing of Japan, Corona Corporation, p.12).

cosλ＝t・n／|t||n| cos

＝t・s／|t||s| 其中，

：負載軸與滑動面之法線所成之角 λ：負載軸與滑動方向所成之角 t：與拉伸載重負載方向平行之單位向量 n：與滑動面之法線向量平行之單位向量 s：與滑動方向平行之單位向量The above-mentioned density factor is the peak orientation of the concentration intensity in the reverse pole diagram relative to the rolling parallel direction (RD), and the value is calculated when the tensile stress is loaded in the direction parallel to the RD. The inverse pole figure is determined by XRD (X-ray diffraction) measurement. When the compactness factor obtained by this method shows a value above 0.40, a good curved surface is obtained. With a compaction factor of 0.40 or more, when a bending load is applied to the copper alloy plate, the differential movement becomes relatively easy. It is presumed that the main reason is that the sliding deformation is caused by the displacement movement, which can be continuously deformed, and it is difficult to produce large recesses on the material surface. In addition, the solid density factor is calculated using the following formula. (Solid density factor) = cosλ·cos

cosλ＝t・n／|t||n| cos

＝t·s／|t||s| where,

: The angle formed by the load axis and the normal of the sliding surface λ: the angle formed by the load axis and the sliding direction t: the unit vector parallel to the tensile load load direction n: the unit vector s parallel to the normal vector of the sliding surface : Unit vector parallel to the sliding direction

(Curved surface) The evaluation of the curved surface uses the surface roughness Ra of the curved part. The lower the value of Ra, the less unevenness on the surface of the curved part, and the larger the contact area when used in connectors, etc., thus ensuring good electrical conductivity. The Ra of the bent portion is preferably 2.0 μm or less, and more preferably 1.5 μm or less.

(Tensile Strength) In one embodiment of the present invention, the tensile strength (TS) is preferably 550 MPa or more, more preferably 600 MPa or more. By setting the tensile strength above 550 MPa, the required strength for the copper alloy sheet can be ensured.

(0.2% guaranteed stress) In one embodiment of the present invention, the 0.2% guaranteed stress (YS) is preferably 550 MPa or more, more preferably 580 MPa or more. By setting the 0.2% guaranteed stress to more than 550 MPa, the required strength for the copper alloy plate can be ensured.

(0.2% guaranteed stress/tensile strength) In one embodiment of the present invention, the value of the ratio (YS/TS) of 0.2% guaranteed stress (YS) to tensile strength (TS) is preferably 0.95 or more. If the value of YS/TS is 0.95 or more, the rolling texture is sufficiently formed, and the aggregation strength of the wave peaks becomes larger. The higher the gathering intensity of the wave crest, the higher the influence of the compaction factor showing the direction of the wave crest on the curved surface.

(Conductivity) In one embodiment of the present invention, the conductivity is preferably 75% IACS or higher, more preferably 80% IACS or higher. By setting the electrical conductivity to 75% IACS or higher, the electrical conductivity (thermal conductivity) required for the copper alloy plate can be ensured.

(Stress relaxation rate) In one embodiment of the present invention, the stress relaxation rate is preferably 15% or less, more preferably 14% or less. By setting the stress relaxation rate to 15% or less, the strength required for the copper alloy sheet can be ensured.

(use) The copper alloy plate of the embodiment of the present invention can be applied to electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc., especially for electric vehicles, hybrid vehicles, etc. It is useful for the use of electrical components such as connectors or terminals, or the use of heat dissipation electronic components such as liquid crystal frames used in smart phones or tablet PCs.

(Manufacturing method) The copper alloy plate of the embodiment of the present invention can be manufactured by the following manufacturing steps. First, the electrolytic copper used as the raw material of pure copper is dissolved, after reducing the oxygen concentration by carbon deoxidation, etc., Cr, and one or two of Zr and Ti, and other alloying elements as necessary are cast into copper alloy ingots. . Next, after hot rolling the ingot, first cold rolling, solution treatment, second cold rolling, and aging treatment are sequentially performed.

The thickness of the copper alloy ingot is not particularly limited, and is preferably 30 to 300 mm.

Hot rolling is preferably at a temperature of 800 to 1000°C to form a plate with a thickness of about 2 to 30 mm. In hot rolling, the total processing degree is set to 20% or more, so that the strain rate of the final stroke is greater than 30s ^-1 . By performing hot rolling under the above conditions, dynamic recrystallization can be fully exhibited. As a result, the peak orientation of the aggregation strength in the reverse pole diagram relative to the rolling direction parallel to the rolling direction (RD) can be made, along the line parallel to the RD. A copper alloy whose compaction factor has a value of 0.40 or more when tensile stress is loaded in the direction. The total processing degree is calculated by (thickness before hot rolling-thickness after hot rolling)/thickness before hot rolling×100%. The strain rate of the final stroke can be calculated using the following formula. dε/dt=(2πn/60r ^1/2 )·(R/H) 1/ ² ·In(1/(1-r)) Here, the meanings of dε/dt, n, r, R and H are as follows: dε/dt: strain speed of final stroke n: rotation speed of roller (rpm) r: processing degree (%)/100 R: roller radius (mm) H: plate thickness before final stroke (mm).

After the hot rolling, the first cold rolling is performed. In the first cold rolling, the thickness is preferably 0.15 to 5 mm, more preferably 0.25 to 1.0 mm.

The solution treatment is preferably maintained at 800-1000°C and then water-cooled.

After the solution treatment, the second cold rolling is performed. In the second cold rolling, it is preferable to set the total working degree to 75% or more. By this, the 0.2% guaranteed stress (MPa)/tensile strength (MPa) value after the final aging can be 0.95 or more, and the rolling texture can be sufficiently formed.

The aging treatment is preferably carried out at 300-500°C for 5-30 h.

The method of manufacturing a copper alloy sheet according to one embodiment of the present invention is to contain 0.1 to 0.6 mass% of Cr in a total of 0.01 to 0.30 mass% of one or two of Zr and Ti, and the remaining part is made of copper and non After the copper alloy ingot composed of the avoided impurities is hot rolled, it includes a first cold rolling step, a solution treatment step, a second cold rolling step, and an aging treatment step. In the above hot rolling step, the total processing degree is set to 20 % Above, so that the strain rate of the final stroke is greater than 30 s ^-1 .

With the above-mentioned manufacturing method, a copper alloy plate with high electrical conductivity and high strength can be manufactured, and a curved portion with a good curved surface can be formed. [Example]

Hereinafter, the embodiments of the present invention will be explained in more detail through examples, but the present invention is not limited by these examples.

After adding alloying elements to the molten copper at the ratio shown in Table 1, it was cast into a copper alloy ingot with a thickness of 200 mm. The copper alloy ingot was heated at 950° C. for 3 hours, and hot rolling of the total processing degree shown in Table 1 was performed. The strain rate of the final stroke in hot rolling is shown in Table 1. Secondly, the oxidized scale on the surface of the hot-rolled sheet is ground and removed by a grinder, and then cold-rolled to form a sheet with a thickness of 1.0 mm. Next, after solution treatment at 900°C, cold rolling with the total working degree shown in Table 1 was performed to make the plate thickness 0.2 mm. After that, aging treatment was carried out at 500°C for 10 h.

＜Tensile Strength (TS)＞ Measure the tensile strength (TS) in the direction parallel to the rolling direction by a tensile testing machine in accordance with JIS Z2241:2011.

＜0.2% Guaranteed Stress (YS)＞ Using a tensile testing machine, in accordance with JIS Z2241:2011, measure the 0.2% guaranteed stress (YS) in the direction parallel to the rolling direction.

＜Conductivity (EC)＞ The test piece was taken so that the longitudinal direction of the test piece became parallel to the rolling direction, and the electrical conductivity at 20°C was measured by the four-terminal method according to JIS H0505: 1975.

<Stress relaxation rate> Take a slender test piece with a width of 10 mm and a length of 100 mm so that the longitudinal direction of the test piece becomes parallel to the rolling direction. As shown in Figure 1, the position of l=50 mm is set as the point of action, and y ₀ is applied to the test piece. The load is equivalent to 80% of the 0.2% guaranteed stress in the rolling direction (measured in accordance with JIS Z2241:2011) The stress (s). y ₀ is obtained by the following formula. y ₀ =(2/3)·I ² ·s/(E·t) Here, E is the Young's modulus in the rolling direction, and t is the thickness of the sample. After heating at 150°C for 1000 hours, unloading is performed. As shown in Figure 2, the permanent deformation (height) y is measured, and the stress relaxation rate {[y(mm)/y ₀ (mm)]×100(%)} is calculated.

＜Curved surface＞ In the evaluation of the curved surface, a specimen cut into a width of 1 mm and a length of 20 mm is used as a curved test piece. According to JIS H3130:2012, the W bending test of G.W. (the bending axis is the direction perpendicular to the rolling direction) is carried out. The surface of the bending part is analyzed by a confocal laser microscope, and the Ra (μm) specified in JIS B 0601:2013 is calculated. If the Ra of the curved surface is 1.5 μm or less, it is recorded as ◎, if it is greater than 1.5 μm and less than 2.0 μm, it is recorded as ○, if it is greater than 2.0 μm and less than 3.0 μm, it is recorded as △, if it is greater than 3.0 μm, It is recorded as ╳.

＜Reverse pole figure＞ The inverse pole figure was determined using XRD measurement. The XRD measurement uses RINT-TTR manufactured by Rigaku Co., Ltd. to measure the X-ray diffraction in the thickness direction of the copper alloy plate surface. Furthermore, the X-ray diffraction of the fine powder copper was measured. Here, the X-ray system is set to Kα rays, the tube voltage is 30 KV, and the tube current is 100 mA. Divide the aggregation strength of the copper alloy plate in all directions by the aggregation strength of the micro-powdered copper to produce a standardized rolling parallel direction (RD) reverse pole diagram. Determine the direction of the peak of the concentration intensity display according to the obtained reverse pole diagram.

cosλ＝t・n／|t||n| cos

＝t・s／|t||s| 其中，

：負載軸與滑動面之法線所成之角 λ：負載軸與滑動方向所成之角 t：與拉伸載重負載方向平行之單位向量 n：與滑動面之法線向量平行之單位向量 s：與滑動方向平行之單位向量 由於沿與RD平行之方向負載有拉伸載重，故t與聚集強度自RD觀察時顯示波峰之方位平行。又，即使於主滑動系統中，實際活動之滑動系統亦為實密因子取最大值者，因此n、s必須選擇上式所規定之實密因子取最大值之類的組合。<Compact factor> The copper alloy of this composition has a face-centered cubic structure (FCC), so its main sliding system is {111}<110>. The density factor is calculated relative to the orientation of the peaks of the peaks of the aggregated intensity observed from the rolling parallel direction (RD), and the value in the main sliding system when the tensile load is loaded in the direction parallel to the RD. At this time, it must be noted that the focus intensity when viewed from the RD direction shows that the orientation of the wave peak is parallel to the RD direction. As described above, specifically, the following formula can be used to obtain the solid density factor. (Solid density factor) = cosλ·cos

cosλ＝t・n／|t||n| cos

＝t·s／|t||s| where,

: The angle formed by the load axis and the normal of the sliding surface λ: the angle formed by the load axis and the sliding direction t: the unit vector parallel to the tensile load load direction n: the unit vector s parallel to the normal vector of the sliding surface : The unit vector parallel to the sliding direction has a tensile load along the direction parallel to the RD, so t is parallel to the direction of the peaks when the aggregate strength is observed from the RD. Moreover, even in the main sliding system, the actual active sliding system is the one that takes the maximum value of the solid density factor. Therefore, n and s must choose the combination of the maximum value of the solid density factor specified by the above formula.

Table 1 shows the composition and manufacturing conditions of each test piece, and the results obtained for each example and comparative example. In addition, the comparative example was manufactured under the same conditions as the examples except for the manufacturing conditions described in Table 1.

[Table 1] Composition (mass%) Hot rolled 2nd cold rolling TS (MPa) YS (MPa) YS／TS EC (%IACS) Stress relaxation rate (%) Curved surface Solid factor Cr Zr Ti Add element Total processing degree (%) Strain speed (s ^-1 ) Total processing degree (%) Example 1 0.2 0.1 - - 25 50 80 620 603 0.97 83.4 11.4 ◎ 0.40 Example 2 0.2 0.2 - - 25 50 80 661 652 0.99 81.7 7.4 ◎ 0.44 Example 3 0.3 0.1 - - 25 50 80 660 638 0.97 80.3 8.3 ◎ 0.44 Example 4 0.4 0.05 - - 25 50 80 674 660 0.98 81.3 9.1 ◎ 0.45 Example 5 0.2 - 0.1 Si: 0.03 25 50 80 646 632 0.98 83.0 12.1 ◎ 0.40 Example 6 0.2 0.1 - Si: 0.03 25 50 80 629 609 0.97 82.3 11.8 ◎ 0.44 Example 7 0.2 0.1 - Ag: 0.01 25 50 80 627 603 0.96 82.2 12.2 ◎ 0.41 Example 8 0.2 0.1 - Ag: 1.0 25 50 80 634 624 0.99 82.8 10.1 ◎ 0.40 Example 9 0.2 - 0.1 Fe: 0.01 Mn: 0.01 25 50 80 623 601 0.96 84.0 11.4 ◎ 0.42 Example 10 0.2 0.1 - Co: 0.01 Ni: 0.01 25 50 80 634 618 0.98 82.3 6.9 ◎ 0.49 Example 11 0.2 0.1 - Zn: 0.01 P: 0.01 Sn: 0.01 25 50 80 637 631 0.99 84.7 7.3 ◎ 0.49 Example 12 0.2 0.1 - Mg: 0.01 25 50 80 632 609 0.96 83.4 10.3 ◎ 0.42 Example 13 0.2 0.1 - Al: 0.01 Ca: 0.01 25 50 80 637 629 0.99 82.7 11.7 ◎ 0.42 Example 14 0.2 0.1 - Y: 0.01 Nb: 0.01 Mo: 0.01 25 50 80 643 626 0.97 83.4 7.1 ◎ 0.40 Example 15 0.2 0.1 - Hf: 0.01 25 50 80 627 616 0.98 84.3 10.6 ◎ 0.40 Example 16 0.2 0.1 - W: 0.01 Pt: 0.01 Au: 0.01 25 50 80 641 613 0.96 84.9 6.4 ◎ 0.48 Example 17 0.2 0.1 - - 25 50 99 655 652 1.00 83.8 11.6 ◎ 0.44 Example 18 0.2 0.1 - - 25 50 75 608 579 0.95 82.3 13.8 ◎ 0.40 Example 19 0.2 0.1 - - 25 50 60 584 527 0.90 84.2 7.0 ○ 0.40 Example 20 0.2 0.1 - - 20 50 80 640 621 0.97 82.5 7.7 ◎ 0.40 Example 21 0.2 0.1 - - 25 35 80 643 626 0.97 84.2 9.2 ◎ 0.41 Comparative example 1 1.0 0.1 - - 25 50 90 730 715 0.98 72.0 5.6 X 0.43 Comparative example 2 0.2 0.5 - - 25 50 90 681 650 0.95 74.0 9.9 X 0.42 Comparative example 3 0.05 0.1 - - 25 50 90 536 511 0.95 87.5 19.2 ◎ 0.47 Comparative example 4 0.20 0.005 - - 25 50 90 538 513 0.95 85.8 19.7 ◎ 0.41 Comparative example 5 0.2 - 0.005 - 25 50 90 536 520 0.97 88.0 17.8 ◎ 0.49 Comparative example 6 0.2 0.1 - Sn: 10.0 25 50 90 Hot rolled crack Comparative example 7 0.2 0.1 - P: 10.0 25 50 90 Hot rolled crack Comparative example 8 0.2 0.1 - - 10 50 90 643 617 0.96 83.6 13.6 △ 0.32 Comparative example 9 0.2 0.1 - - 25 30 90 637 626 0.98 83.1 8.0 △ 0.37 Comparative example 10 0.2 0.1 - - 25 30 60 586 544 0.93 81.0 8.2 X 0.32

As shown in Table 1, the copper alloy plates of Examples 1 to 21 with a specific composition and a compactness factor of 0.40 or more have confirmed that TS is 550 MPa or more, EC is 75% IACS or more, and the stress relaxation rate is 15% or less. The curved surface is ◎ or ○, which has high conductivity and high strength, and can form a curved part with a good curved surface. In addition, in Example 19, the value of YS/TS was slightly lower and the curved surface was slightly deteriorated, but it was at a sufficiently satisfactory level.

On the other hand, the copper alloy plates of Comparative Examples 1 and 2 have too high content of Cr or Zr, so the EC is low and the curved surface is also poor. In the copper alloy sheets of Comparative Examples 3 to 5, since the content of Cr, Zr, or Ti is too low, TS becomes lower and the stress relaxation rate becomes higher. The copper alloy sheets of Comparative Examples 6 and 7 had too high Sn or P content, so cracks occurred during hot rolling. Since the copper alloy sheet of Comparative Example 8 was too low in total during hot rolling, the compactness factor was reduced, and the curved surface became poor. In the copper alloy sheet of Comparative Example 9, the strain rate during hot rolling was too slow, so the compactness factor was reduced, and the curved surface became poor. In the copper alloy sheet of Comparative Example 10, the strain rate during hot rolling was too slow, and the total processing in the second cooling rolling was too low, so the compactness factor was reduced and the curved surface became poor. In particular, the copper alloy plate of Comparative Example 10 has the lowest YS/TS, so the curved surface is the worst.

From the above results, it can be seen that according to the embodiment of the present invention, a copper alloy plate with high electrical conductivity and high strength can be provided, and a curved portion with a good curved surface can be formed. In addition, according to the embodiment of the present invention, it is possible to provide an electronic component for energization and an electronic component for heat dissipation that can be manufactured by bending without deteriorating the curved surface of the curved portion with high conductivity and high strength.

10: Single wafer rod 20: The sliding surface in the die of a single wafer rod 25: Sliding direction of single wafer rod 30: Normal of the sliding surface

[Figure 1] A diagram illustrating the principle of measuring the stress relaxation rate. [Figure 2] A diagram illustrating the principle of measuring the stress relaxation rate. [Figure 3] A diagram illustrating the solid density factor.

Claims (6)

A copper alloy plate containing 0.1 to 0.6% by mass of Cr, 0.01 to 0.30% by mass in total of one or two of Zr and Ti, and the remaining part is composed of copper and inevitable impurities, Relative to the peak orientation of the aggregation strength in the reverse pole map of the rolling parallel direction (RD) obtained by the XRD measurement, the Schmid factor (Schmid factor) is 0.40 or more when the tensile stress is loaded in the direction parallel to the RD . Such as the copper alloy plate of claim 1, where the 0.2% guaranteed stress (MPa) / tensile strength (MPa) value is 0.95 or more. For example, the copper alloy plate of claim 1 or 2 has a tensile strength of 550 MPa or more, a conductivity of 75% IACS or more, and a stress relaxation rate of 15% or less. For example, the copper alloy plate of any one of claims 1 to 3, which contains a total of 1.0% by mass or less selected from Ag, Fe, Co, Ni, Mn, Zn, Mg, Si, P, Sn, Al, Ca, One or more of the group consisting of Y, Nb, Mo, Hf, W, Pt, Au and B. An electronic component for energization, using a copper alloy plate with any one of claims 1 to 4. An electronic component for heat dissipation, using a copper alloy plate according to any one of claims 1 to 4.

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