TW202035049A - Laser control apparatus and pulsed laser outputting apparatus capable of reducing the intensity deviation of laser pulses cut from an laser oscillator - Google Patents

Laser control apparatus and pulsed laser outputting apparatus capable of reducing the intensity deviation of laser pulses cut from an laser oscillator Download PDF

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TW202035049A
TW202035049A TW109103832A TW109103832A TW202035049A TW 202035049 A TW202035049 A TW 202035049A TW 109103832 A TW109103832 A TW 109103832A TW 109103832 A TW109103832 A TW 109103832A TW 202035049 A TW202035049 A TW 202035049A
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laser
pulse
laser pulse
cut
time
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TW109103832A
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TWI734373B (en
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石原裕
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日商住友重機械工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094076Pulsed or modulated pumping

Abstract

The present invention provides a laser control apparatus that is capable of reducing the intensity deviation of laser pulses. The laser control apparatus synchronously instructs a cutting optical system to start cutting at the time while the output of the laser pulses from the laser oscillator rises, and to cut a part out of the laser pulses outputting from the laser oscillator.

Description

雷射控制裝置及脈衝雷射輸出裝置Laser control device and pulse laser output device

本發明係關於一種雷射控制裝置及脈衝雷射輸出裝置。The invention relates to a laser control device and a pulse laser output device.

已知有一種使用脈衝雷射束對印刷基板進行鑽孔加工之技術(專利文獻1)。在下述專利文獻1中所揭示之雷射加工裝置中,針對複數個雷射振盪指令,計測從雷射振盪指令時點到雷射脈衝的能量達到既定強度之時點為止的經過時間,以求出其平均值。將聲光調製器控制成如下:在從雷射振盪指令時點起經過了對該平均值追加了恆定時間之時間之後,使雷射脈衝開始向加工中所要使用之方向進行分叉(切出雷射脈衝)。 (先前技術文獻) (專利文獻)There is known a technique for drilling a printed circuit board using a pulsed laser beam (Patent Document 1). In the laser processing device disclosed in Patent Document 1 below, for a plurality of laser oscillation commands, the elapsed time from the point of the laser oscillation command to the point when the energy of the laser pulse reaches a predetermined intensity is measured to determine the average value. The acousto-optic modulator is controlled as follows: after the time of the laser oscillation command is added a constant time to the average value, the laser pulse starts to be branched in the direction to be used in the processing (cut out the mine Radio pulse). (Prior technical literature) (Patent Document)

專利文獻1:日本特開2018-99692號公報Patent Document 1: Japanese Patent Application Publication No. 2018-99692

(本發明所欲解決之課題)(Problems to be solved by the present invention)

從對雷射振盪器賦予開始振盪的指令到輸出雷射脈衝(雷射脈衝上升)為止的時間,在每個雷射脈衝中會產生偏差。又,通常,雷射脈衝的強度從雷射脈衝的上升時點起並不恆定,會隨著時間的經過而發生變動。若在從振盪開始的指令時點經過了恆定時間之時點開始雷射脈衝的切出,則致使從雷射脈衝的上升時點到切出開始時點為止的經過時間產生偏差。其結果,致使被切出之雷射脈衝的強度在雷射脈衝之間產生偏差。The time from when the instruction to start oscillation is given to the laser oscillator to when the laser pulse is output (laser pulse rise) will vary for each laser pulse. In addition, generally, the intensity of the laser pulse is not constant from the point when the laser pulse rises, and fluctuates over time. If the cutting out of the laser pulse is started when a constant time has elapsed from the start of the oscillation command, the elapsed time from the rising time of the laser pulse to the starting time of cutting out will vary. As a result, the intensity of the laser pulses that are cut out will vary between the laser pulses.

本發明的目的在於提供一種能夠減少雷射脈衝的強度偏差之雷射控制裝置及脈衝雷射輸出裝置。 (用以解決課題之手段)The object of the present invention is to provide a laser control device and a pulse laser output device that can reduce the intensity deviation of the laser pulse. (Means to solve the problem)

依本發明的一觀點, 提供一種雷射控制裝置,其與從雷射振盪器輸出之雷射脈衝的上升時刻同步地,對從輸出自前述雷射振盪器之雷射脈衝切出一部分之切出光學系統下令開始切出。According to a viewpoint of the present invention, Provided is a laser control device, which, in synchronization with the rising time of the laser pulse output from the laser oscillator, orders the cutting-out optical system to start cutting out a part of the laser pulse output from the aforementioned laser oscillator .

依本發明的另一觀點, 提供一種脈衝雷射輸出裝置,其具有: 雷射振盪器,輸出脈衝雷射束; 感測器,檢測從前述雷射振盪器輸出之脈衝雷射束的光強度; 切出光學系統,從輸出自前述雷射振盪器之脈衝雷射束的雷射脈衝切出一部分;及 控制裝置,從前述感測器獲取檢測結果,以檢測雷射脈衝的上升時點,並與雷射脈衝的上升時刻同步地,對前述切出光學系統下令開始切出雷射脈衝。 (發明之效果)According to another viewpoint of the present invention, A pulse laser output device is provided, which has: Laser oscillator, output pulse laser beam; The sensor detects the light intensity of the pulsed laser beam output from the aforementioned laser oscillator; Cut out the optical system to cut out a part of the laser pulse output from the pulsed laser beam of the aforementioned laser oscillator; and The control device obtains the detection result from the sensor to detect the rising time of the laser pulse, and in synchronization with the rising time of the laser pulse, orders the cutting-out optical system to start cutting out the laser pulse. (Effect of Invention)

由於與雷射脈衝的上升時刻同步地從雷射脈衝切出一部分,因此能夠減少所切出之雷射脈衝的強度偏差。Since a part of the laser pulse is cut out in synchronization with the rising time of the laser pulse, the intensity deviation of the cut laser pulse can be reduced.

參閱圖1及圖2,對基於實施例之脈衝雷射輸出裝置進行說明。 圖1係基於實施例之脈衝雷射輸出裝置的概略圖。基於實施例之脈衝雷射輸出裝置例如使用於印刷基板的鑽孔加工中。1 and 2, the pulse laser output device based on the embodiment will be described. Fig. 1 is a schematic diagram of a pulse laser output device based on the embodiment. The pulse laser output device based on the embodiment is used, for example, in the drilling of printed circuit boards.

雷射振盪器10依據來自控制裝置40的指令來輸出脈衝雷射束。作為雷射振盪器10,例如使用二氧化碳雷射振盪器等氣體雷射振盪器。從雷射振盪器10輸出之脈衝雷射束藉由分束鏡11分叉為兩個路徑。作為分束鏡11,例如使用部分反射鏡。The laser oscillator 10 outputs a pulsed laser beam in accordance with instructions from the control device 40. As the laser oscillator 10, for example, a gas laser oscillator such as a carbon dioxide laser oscillator is used. The pulsed laser beam output from the laser oscillator 10 is split into two paths by the beam splitter 11. As the beam splitter 11, for example, a partial reflection mirror is used.

藉由分束鏡11而分叉之兩個脈衝雷射束中的一方,經由照射光學系統12、孔徑13而入射於切出光學系統14中,另一方入射於感測器20中。照射光學系統12改變脈衝雷射束的發散角及光束直徑中的至少一方。作為照射光學系統12,例如使用擴束器。孔徑13對脈衝雷射束的光束截面進行整形。One of the two pulsed laser beams branched by the beam splitter 11 enters the cut-out optical system 14 through the illumination optical system 12 and the aperture 13, and the other enters the sensor 20. The irradiation optical system 12 changes at least one of the divergence angle and the beam diameter of the pulsed laser beam. As the irradiation optical system 12, for example, a beam expander is used. The aperture 13 shapes the beam cross section of the pulsed laser beam.

切出光學系統14從所入射之雷射脈衝LP1切出時間軸上的一部分,並產生加工中所要使用之雷射脈衝LP2。在雷射脈衝LP1中,除了雷射脈衝LP2以外的部分入射於射束阻尼器15中,所切出之雷射脈衝LP2沿著加工路徑而傳播。作為切出光學系統14,例如使用聲光調製器(AOM)。The cutting-out optical system 14 cuts out a part of the time axis from the incident laser pulse LP1, and generates the laser pulse LP2 to be used in processing. In the laser pulse LP1, the part other than the laser pulse LP2 is incident on the beam damper 15, and the cut laser pulse LP2 propagates along the processing path. As the cut-out optical system 14, for example, an acousto-optic modulator (AOM) is used.

從雷射脈衝LP1切出之雷射脈衝LP2經由折返鏡16、掃描光學系統17及透鏡19入射於加工對象物50中。掃描光學系統17使脈衝雷射束的行進方向在二維方向上擺動。作為掃描光學系統17,例如使用包括一對可動反射鏡18X、18Y之加爾瓦諾掃描儀(Galvo scanner)。透鏡19將藉由掃描光學系統17使行進方向擺動之脈衝雷射束聚光於加工對象物50的表面。作為透鏡19,例如使用fθ透鏡。藉由使掃描光學系統17進行動作,能夠使脈衝雷射束入射於加工對象物50的表面的一部分區域(掃描區域)內的任意的位置。The laser pulse LP2 cut out from the laser pulse LP1 enters the object 50 to be processed via the folding mirror 16, the scanning optical system 17 and the lens 19. The scanning optical system 17 swings the traveling direction of the pulsed laser beam in a two-dimensional direction. As the scanning optical system 17, for example, a Galvo scanner including a pair of movable mirrors 18X and 18Y is used. The lens 19 focuses the pulsed laser beam whose traveling direction is oscillated by the scanning optical system 17 on the surface of the object 50 to be processed. As the lens 19, for example, an fθ lens is used. By operating the scanning optical system 17, the pulsed laser beam can be incident on an arbitrary position within a partial area (scanning area) of the surface of the object 50.

加工對象物50例如是印刷基板,並且水平地保持於載台30上。移動機構31使載台30在平行於水平面之彼此正交之兩個方向上移動。藉由使載台30移動,能夠將加工對象物50的表面內的任意的區域配置於能夠由掃描光學系統17進行掃描之掃描區域內。The object 50 to be processed is, for example, a printed circuit board, and is held horizontally on the stage 30. The moving mechanism 31 moves the stage 30 in two directions that are parallel to the horizontal plane and orthogonal to each other. By moving the stage 30, an arbitrary area in the surface of the object 50 to be processed can be arranged in a scanning area that can be scanned by the scanning optical system 17.

感測器20檢測所入射之脈衝雷射束的光強度,並輸出與光強度對應之電訊號。作為感測器20,例如使用能夠高速響應之光電元件等。從感測器20輸出之電訊號輸入於控制裝置40中。The sensor 20 detects the light intensity of the incident pulsed laser beam, and outputs an electrical signal corresponding to the light intensity. As the sensor 20, for example, a photoelectric element capable of high-speed response is used. The electrical signal output from the sensor 20 is input into the control device 40.

控制裝置40輸出觸發訊號trg,該觸發訊號trg對雷射振盪器10下令雷射脈衝的輸出開始及輸出結束。此外,控制裝置40輸出切出訊號chp,該切出訊號chp對切出光學系統14下令雷射脈衝LP2的切出開始及切出結束。又,控制裝置40控制掃描光學系統17及移動機構31的動作。The control device 40 outputs a trigger signal trg, and the trigger signal trg orders the laser oscillator 10 to start and end the output of the laser pulse. In addition, the control device 40 outputs a cut-out signal chp, which instructs the cut-out optical system 14 to start and end the cut-out of the laser pulse LP2. In addition, the control device 40 controls the operations of the scanning optical system 17 and the movement mechanism 31.

在輸入裝置41中輸入規定雷射輸出條件之各種參數。作為輸入裝置41,例如使用鍵盤、觸控面板、指向裝置、通訊裝置及可移動媒體的讀取裝置等。輸入到輸入裝置41中之各種參數值被輸入於控制裝置40中。Various parameters that specify laser output conditions are input into the input device 41. As the input device 41, for example, a keyboard, a touch panel, a pointing device, a communication device, and a reading device for removable media are used. Various parameter values input into the input device 41 are input into the control device 40.

圖2係表示觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2的波形之圖表。圖2表示兩個雷射脈衝LP1輸出之期間。FIG. 2 is a chart showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulse LP2. Figure 2 shows the output period of two laser pulses LP1.

觸發訊號trg的上升相當於雷射脈衝的輸出開始的指令,下降相當於雷射脈衝的輸出停止的指令。切出訊號chp的上升相當於來自雷射脈衝LP1的切出開始的指令,下降相當於來自雷射脈衝LP1的切出結束的指令。The rise of the trigger signal trg is equivalent to a command to start the laser pulse output, and the fall is equivalent to a command to stop the laser pulse output. The rise of the cut-out signal chp corresponds to a command from the laser pulse LP1 to start the cut-out, and the drop corresponds to a command from the laser pulse LP1 to end the cut-out.

若控制裝置40(圖1)藉由使觸發訊號trg上升而對雷射振盪器10(圖1)下令開始輸出雷射脈衝LP1,則在從觸發訊號trg的上升時點t11僅經過了延遲時間td11之時點t12開始輸出雷射脈衝LP1(雷射脈衝LP1上升)。若控制裝置40藉由使觸發訊號trg下降而下令停止輸出雷射脈衝LP1,則雷射脈衝LP1從觸發訊號trg的下降時點t15下降(雷射脈衝LP1的波形下降)。從觸發訊號trg的上升時點t11到下降時點t15為止的經過時間,預先從輸入裝置41(圖1)被輸入,並儲存於控制裝置40。If the control device 40 (FIG. 1) instructs the laser oscillator 10 (FIG. 1) to start outputting the laser pulse LP1 by raising the trigger signal trg, only the delay time td11 has elapsed from the rising time point t11 of the trigger signal trg At the time point t12, laser pulse LP1 is output (laser pulse LP1 rises). If the control device 40 orders the stop of the output of the laser pulse LP1 by causing the trigger signal trg to fall, the laser pulse LP1 falls from the falling time point t15 of the trigger signal trg (the waveform of the laser pulse LP1 falls). The elapsed time from the rising time point t11 of the trigger signal trg to the falling time point t15 is previously input from the input device 41 (FIG. 1) and stored in the control device 40.

雷射脈衝LP1的波形取決於雷射振盪器10(圖1)的特性,在從雷射脈衝LP1的上升時點t12到下降時點t15為止的期間,雷射脈衝LP1的光強度與時間的經過一同發生變動。例如,在雷射脈衝LP1的上升時點t12上波形急劇上升而形成尖峰之後,持續光強度大致恆定的期間,然後,光強度緩慢地降低。又,還有具有如下特性之雷射振盪器,亦即,從雷射脈衝LP1的上升時點t12起,光強度緩慢地上升,然後,輸出光強度可持續大致恆定的期間之雷射脈衝。The waveform of the laser pulse LP1 depends on the characteristics of the laser oscillator 10 (Figure 1). During the period from the rising time point t12 of the laser pulse LP1 to the falling time point t15, the light intensity of the laser pulse LP1 coincides with the passage of time Changes. For example, after the waveform rises sharply at the point t12 when the laser pulse LP1 rises to form a spike, the light intensity continues for a period of approximately constant light intensity, and then the light intensity gradually decreases. In addition, there are laser oscillators that have the following characteristics. That is, from the rising time point t12 of the laser pulse LP1, the light intensity rises slowly, and then, the laser pulse whose light intensity continues to be substantially constant is output.

控制裝置40從感測器20獲取雷射脈衝LP1的光強度的檢測結果,以檢測雷射脈衝LP1的上升。例如,將雷射脈衝LP1的光強度達到既定的臨界值之時點,判定為雷射脈衝LP1的上升時點t12。該臨界值例如可以將在雷射脈衝剛上升之後出現之峰值的最大值、光強度成為大致恆定之期間的光強度的平均值等設定為基準。作為一例,可以將臨界值設定為峰值的最大值的10%。控制裝置40在從雷射脈衝LP1的上升時點t12起經過了恆定的待機時間tw11之時點t13,藉由使對切出光學系統14(圖1)的切出訊號chp上升而下令開始切出雷射脈衝LP2。恆定的待機時間tw11的值預先從輸入裝置41(圖1)被輸入,並儲存於控制裝置40中。The control device 40 obtains the detection result of the light intensity of the laser pulse LP1 from the sensor 20 to detect the rise of the laser pulse LP1. For example, the time point when the light intensity of the laser pulse LP1 reaches a predetermined critical value is determined as the rising time point t12 of the laser pulse LP1. This critical value can be set based on, for example, the maximum value of the peak that appears immediately after the laser pulse rises, the average value of the light intensity during the period when the light intensity becomes substantially constant, and the like. As an example, the critical value may be set to 10% of the maximum value of the peak value. The control device 40, at a time point t13 when the constant standby time tw11 has elapsed from the rising time point t12 of the laser pulse LP1, raises the cut-out signal chp of the cut-out optical system 14 (FIG. 1) to order the start of the cutout. Shoot pulse LP2. The value of the constant standby time tw11 is previously input from the input device 41 (FIG. 1) and stored in the control device 40.

控制裝置40在從對切出光學系統14已下令開始切出雷射脈衝LP2之時點t13起經過了相當於既定的脈衝寬度之時間之時點t14,藉由使切出訊號chp下降而對切出光學系統14下令結束切出雷射脈衝LP2。從切出訊號chp的上升時點t13到下降時點t14為止的期間,從雷射脈衝LP1切出雷射脈衝LP2。The control device 40 reduces the cut-out signal chp at the time point t14 when the time corresponding to the predetermined pulse width has elapsed from the time point t13 when the cut-out optical system 14 has instructed to start cutting out the laser pulse LP2. The optical system 14 orders the end of cutting out the laser pulse LP2. During the period from the rising time point t13 of the cut-out signal chp to the falling time point t14, the laser pulse LP2 is cut out from the laser pulse LP1.

從下令開始切出之時點t13到下令結束切出之時點t14為止的期間,例如設定於雷射脈衝LP1的光強度大致恆定地變化之期間內。The period from the time point t13 when the order is started to cut out to the time point t14 when the order is to end the cut out is set, for example, within a period in which the light intensity of the laser pulse LP1 changes substantially constantly.

從下令開始輸出第二發的雷射脈衝LP1之觸發訊號trg的上升時點t21到雷射脈衝LP1的上升時點t22為止的延遲時間td21,並不限定於與第一發的雷射脈衝LP1的延遲時間td11相等。控制裝置40在從檢測到開始輸出第二發的雷射脈衝LP1之時點t22起經過了恆定的待機時間tw21之時點t23,藉由使切出訊號chp上升而對切出光學系統14下令開始切出雷射脈衝LP2。第二發的待機時間tw21與第一發的待機時間tw11相等。The delay time td21 from the rising time t21 of the trigger signal trg of the second laser pulse LP1 to the rising time t22 of the laser pulse LP1 is not limited to the delay from the first laser pulse LP1 The time td11 is equal. The control device 40, at a time point t23 when the constant standby time tw21 has elapsed from the time point t22 when the second laser pulse LP1 is detected to start outputting, raises the cut-out signal chp to order the cut-out optical system 14 to start cutting. The laser pulse LP2 is emitted. The standby time tw21 of the second shot is equal to the standby time tw11 of the first shot.

從已下令開始切出之時點t23到下令結束切出之時點t24為止的經過時間,與從第一發當中之下令開始切出之時點t13到已下令結束切出之時點t14為止的經過時間相等。從觸發訊號trg的上升時點t21到觸發訊號trg的下降時點t25為止的經過時間,與從第一發當中之觸發訊號trg的上升時點t11到下降時點t15為止的經過時間相等。The elapsed time from the time point t23 when the order has been ordered to the time point t24 when the order is finished is equal to the elapsed time from the time point t13 when the order is started to be cut out in the first round to the time point t14 when the order is finished. . The elapsed time from the rising time point t21 of the trigger signal trg to the falling time point t25 of the trigger signal trg is equal to the elapsed time from the rising time point t11 of the trigger signal trg in the first transmission to the falling time point t15.

其次,一邊與圖3所示之比較例進行比較,一邊對上述實施例的優異之效果進行說明。 圖3係表示基於比較例之脈衝雷射輸出裝置中之觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2的波形之圖表。觸發訊號trg及雷射脈衝LP1的時刻及波形與圖2所示之實施例的情況相同。Next, while comparing with the comparative example shown in FIG. 3, the excellent effect of the said Example is demonstrated. FIG. 3 is a graph showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulse LP2 in the pulse laser output device based on the comparative example. The timing and waveform of the trigger signal trg and the laser pulse LP1 are the same as those in the embodiment shown in FIG. 2.

在比較例中,在從觸發訊號trg的上升時點t11經過了恆定的待機時間tw31之時點t13,藉由使切出訊號chp上升而下令開始切出。第二發當中亦同樣地,在從下令開始輸出雷射脈衝LP1之觸發訊號trg的上升時點t21起經過了恆定的待機時間tw41之時點t23,藉由使切出訊號chp上升而下令開始切出。第二發當中之待機時間tw41與第一發當中之待機時間tw31相等。In the comparative example, at the time point t13 when the constant standby time tw31 has elapsed from the rising time point t11 of the trigger signal trg, the cut-out signal chp is raised to order the start of the cut-out. The same is true in the second shot. At the time point t23 after the constant standby time tw41 has elapsed from the rising time point t21 of the trigger signal trg of the laser pulse LP1 that was ordered to start outputting, the cut-out signal chp is raised and the cut-out is ordered . The standby time tw41 in the second shot is equal to the standby time tw31 in the first shot.

在第一發當中,從已下令開始切出之時點t13到已下令結束切出之時點t14為止的期間,落在雷射脈衝LP1的光強度大致恆定地變化之期間內。然而,在第二發當中,延遲時間td21比第一發的延遲時間td11更長,藉此下令開始切出之時點t23位於雷射脈衝LP1剛上升之後的峰值內。因此,致使第二發的雷射脈衝LP2的波形與第一發的雷射脈衝LP2的波形明顯不同。其結果,第二發的雷射脈衝LP2的脈衝能量(每1脈衝的能量)與第一發的雷射脈衝LP2的脈衝能量不同。這是因為儘管在從下令開始輸出雷射脈衝LP1之觸發訊號trg的上升時點t11、t21到雷射脈衝LP1實際上升之時點t12、t22為止的延遲時間td11、td21上存在偏差,仍與觸發訊號trg的上升時刻同步地發出切出開始的指令。In the first shot, the period from the time point t13 when the cutting-out order has been ordered to the time point t14 when the cutting-out end has been ordered falls within the period during which the light intensity of the laser pulse LP1 changes substantially constantly. However, in the second shot, the delay time td21 is longer than the delay time td11 of the first shot, so that the time point t23 when ordering to start cutting is within the peak value just after the laser pulse LP1 rises. Therefore, the waveform of the second laser pulse LP2 is significantly different from the waveform of the first laser pulse LP2. As a result, the pulse energy (energy per pulse) of the second laser pulse LP2 is different from the pulse energy of the first laser pulse LP2. This is because although there are deviations in the delay times td11 and td21 from the rising time t11, t21 of the trigger signal trg of the laser pulse LP1 when the command is started to the actual rising time t12, t22 of the laser pulse LP1, it is still different from the trigger signal When trg rises, a command to start cutting is issued synchronously.

相對於此,在上述實施例中,與雷射脈衝LP1的實際的上升時點t12、t22同步地,控制裝置40對切出光學系統14發出切出開始的指令。因此,不會受到從觸發訊號trg的上升時點t11、t21到雷射脈衝LP1實際上升之時點t12、t22為止的延遲時間td11、td21的偏差的影響,而能夠從已確定雷射脈衝LP1的波形之位置切出雷射脈衝LP2。藉此,能夠抑制雷射脈衝LP2的脈衝能量的偏差。On the other hand, in the above-mentioned embodiment, in synchronization with the actual rising time points t12 and t22 of the laser pulse LP1, the control device 40 instructs the cutting-out optical system 14 to start cutting. Therefore, it is not affected by the deviation of the delay time td11, td21 from the rising time point t11, t21 of the trigger signal trg to the actual rising time point t12, t22 of the laser pulse LP1, and the waveform of the determined laser pulse LP1 The position of the laser pulse LP2 is cut out. This can suppress the deviation of the pulse energy of the laser pulse LP2.

其次,對待機時間tw11、tw21(圖2)的較佳長度進行說明。若將待機時間tw11、tw21設為過短,則致使雷射脈衝LP2的開頭部分覆蓋雷射脈衝LP1剛上升之後的峰值的一部分。若雷射脈衝LP2的開頭部分覆蓋雷射脈衝LP1的峰值的一部分,則致使雷射脈衝LP2的脈衝能量因雷射脈衝LP1的波形的微小變化,例如因峰值寬度的微小變化而大幅發生變動。為了抑制由雷射脈衝LP1的波形的變化引起之雷射脈衝LP2的脈衝能量的偏差,待機時間tw11、tw21設為比雷射脈衝LP1剛上升之後的峰值的時間寬度更長為較佳。Next, the preferable length of the standby time tw11, tw21 (FIG. 2) is demonstrated. If the standby times tw11 and tw21 are too short, the beginning of the laser pulse LP2 will cover a part of the peak just after the laser pulse LP1 rises. If the beginning of the laser pulse LP2 covers a part of the peak of the laser pulse LP1, the pulse energy of the laser pulse LP2 will vary greatly due to a small change in the waveform of the laser pulse LP1, for example, a small change in the peak width. In order to suppress the deviation of the pulse energy of the laser pulse LP2 caused by the change in the waveform of the laser pulse LP1, the standby times tw11 and tw21 are preferably set to be longer than the time width of the peak immediately after the laser pulse LP1 rises.

即使在雷射脈衝LP1的光強度大致恆定地變化之期間,光強度亦與雷射振盪器10的特性對應地緩慢地發生變化。以從雷射脈衝LP1的光強度的時間變化盡可能小的部分切出雷射脈衝LP2之方式來設定待機時間tw11、tw21為較佳。藉由如此設定待機時間tw11、tw21,即使雷射脈衝LP1的波形稍微發生變化,亦不易產生雷射脈衝LP2的脈衝能量的變動。Even during the period in which the light intensity of the laser pulse LP1 changes substantially constantly, the light intensity gradually changes in accordance with the characteristics of the laser oscillator 10. It is preferable to set the standby time tw11 and tw21 in such a way that the laser pulse LP2 is cut out from the portion where the time change of the light intensity of the laser pulse LP1 is as small as possible. By setting the standby time tw11 and tw21 in this way, even if the waveform of the laser pulse LP1 slightly changes, it is difficult to produce a fluctuation in the pulse energy of the laser pulse LP2.

從而,關於基於上述實施例之脈衝雷射輸出裝置中之待機時間tw11、tw21(圖2),以觀測實際的雷射脈衝LP1的波形,並從光強度維持大致恆定之期間起切出雷射脈衝LP2之方式進行設定為較佳。在上述實施例中,在雷射脈衝LP1顯示其他波形之情況下,亦能夠適用於例如光強度從輸出開始時點逐漸增大,此後成為大致恆定之情況。Therefore, regarding the standby time tw11 and tw21 (FIG. 2) of the pulse laser output device based on the above-mentioned embodiment, the waveform of the actual laser pulse LP1 can be observed, and the laser can be cut out from the period during which the light intensity remains approximately constant. It is better to set the pulse LP2. In the above-mentioned embodiment, when the laser pulse LP1 shows other waveforms, it can also be applied to a situation where the light intensity gradually increases from the point when the output starts, and then becomes substantially constant.

其次,對上述實施例的變形例進行說明。 在上述實施例中,將脈衝雷射輸出裝置使用於印刷基板的鑽孔加工中。此外,基於實施例之脈衝雷射輸出裝置能夠使用於如下用途,亦即,使用藉由從輸出自雷射振盪器之雷射脈衝切出一部分而得到之雷射脈衝來進行雷射加工之用途。Next, a modification of the above-mentioned embodiment will be described. In the above embodiment, the pulse laser output device is used in the drilling process of the printed circuit board. In addition, the pulse laser output device based on the embodiment can be used for the following purposes, that is, the use of laser processing using a laser pulse obtained by cutting a part of the laser pulse output from the laser oscillator .

其次,參閱圖4及圖5,對基於其他實施例之脈衝雷射輸出裝置進行說明。以下,關於與圖1及圖2所示之脈衝雷射輸出裝置通用的構成,省略說明。Next, referring to FIGS. 4 and 5, the pulse laser output device based on other embodiments will be described. Hereinafter, a description of the configuration common to the pulse laser output device shown in FIGS. 1 and 2 will be omitted.

圖4係基於本實施例之脈衝雷射輸出裝置的概略圖。在圖1所示之實施例中,藉由切出光學系統14從雷射脈衝LP1切出一個雷射脈衝LP2,並沿著一條加工路徑傳播。相對於此,在圖4所示之脈衝雷射輸出裝置中,藉由切出光學系統14從雷射脈衝LP1切出兩個雷射脈衝LP2、LP3,並沿著不同的加工路徑傳播雷射脈衝LP2、LP3。Fig. 4 is a schematic diagram of a pulse laser output device based on this embodiment. In the embodiment shown in FIG. 1, a laser pulse LP2 is cut out from the laser pulse LP1 by the cut-out optical system 14 and propagated along a processing path. In contrast, in the pulse laser output device shown in FIG. 4, the cutting-out optical system 14 cuts out two laser pulses LP2 and LP3 from the laser pulse LP1, and propagates the laser along different processing paths. Pulse LP2, LP3.

在雷射脈衝LP2、LP3傳播之加工路徑上,分別與圖1所示之脈衝雷射輸出裝置的加工路徑同樣地,配置有折返鏡16、掃描光學系統17、透鏡19、載台30及移動機構31。藉由雷射脈衝LP2、LP3而能夠同時加工兩片加工對象物50。In the processing path of the propagation of the laser pulses LP2 and LP3, respectively, similar to the processing path of the pulse laser output device shown in FIG. 1, a folding mirror 16, a scanning optical system 17, a lens 19, a stage 30 and a moving Agency 31. With the laser pulses LP2 and LP3, two workpieces 50 can be processed simultaneously.

圖5係表示觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2、LP3的波形之圖表。圖5表示一個雷射脈衝LP1輸出之期間。Fig. 5 is a chart showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulses LP2 and LP3. Figure 5 shows the output period of a laser pulse LP1.

觸發訊號trg及雷射脈衝LP1的波形及輸出時刻,與圖2所示之實施例的情況相同。控制裝置40若檢測到雷射脈衝LP1的上升,則在從雷射脈衝LP1的上升時點t12起經過了恆定的待機時間tw11之時點t13,藉由使對切出光學系統14(圖4)的切出訊號chp上升而下令開始切出雷射脈衝LP2。在從對切出光學系統14已下令開始切出雷射脈衝LP2之時點t13起經過了相當於既定的脈衝寬度之時間之時點t14,藉由使切出訊號chp下降而對切出光學系統14下令結束切出雷射脈衝LP2。The waveforms and output timing of the trigger signal trg and the laser pulse LP1 are the same as in the case of the embodiment shown in FIG. 2. When the control device 40 detects the rise of the laser pulse LP1, at the time t13 when the constant standby time tw11 has elapsed from the rise time t12 of the laser pulse LP1, the optical system 14 (FIG. 4) The cutting out signal chp rises and the laser pulse LP2 is ordered to start cutting out. At the time point t14 when the time corresponding to the predetermined pulse width has elapsed from the time point t13 when the cut-out optical system 14 has ordered to start cutting out the laser pulse LP2, the cut-out signal chp is lowered to cut out the optical system 14 Order to end the laser pulse LP2.

此外,控制裝置40在從雷射脈衝LP1的上升時點t12起經過了恆定的待機時間tw12之時點t16,藉由使對切出光學系統14(圖4)的切出訊號chp上升而下令開始切出雷射脈衝LP3。待機時間tw12比待機時間tw11與脈衝寬度(t14-t13)之總和更長。關於雷射脈衝LP2的切出開始的指令和雷射脈衝LP3的切出開始的指令,可藉由使切出訊號chp的大小,例如電壓值不同來區分。在從對切出光學系統14已下令開始切出雷射脈衝LP3之時點t16起經過了相當於既定的脈衝寬度之時間之時點t17,藉由使切出訊號chp下降而對切出光學系統14下令結束切出雷射脈衝LP3。In addition, the control device 40, at a time point t16 when the constant standby time tw12 has elapsed from the rising time point t12 of the laser pulse LP1, raises the cut-out signal chp of the cut-out optical system 14 (FIG. 4) to order the start of cutting. The laser pulse LP3 is emitted. The standby time tw12 is longer than the sum of the standby time tw11 and the pulse width (t14-t13). Regarding the instruction to start cutting out of the laser pulse LP2 and the instruction to start cutting out of the laser pulse LP3, it can be distinguished by the magnitude of the cutting out signal chp, such as a voltage value. At the time t17 when the time corresponding to the predetermined pulse width has elapsed from the time point t16 when the cut-out optical system 14 has instructed to start cutting out the laser pulse LP3, the cut-out signal chp is lowered to cut out the optical system 14 Order to end the laser pulse LP3.

從已下令開始切出雷射脈衝LP2之時點t13到已下令結束切出雷射脈衝LP3之時點t17為止的期間,設定於雷射脈衝LP1的光強度大致恆定地變化之期間內。The period from the time point t13 when the laser pulse LP2 has been ordered to cut out to the time point t17 when the laser pulse LP3 has been ordered to cut out is set within a period in which the light intensity of the laser pulse LP1 changes substantially constantly.

其次,對圖4及圖5所示之實施例的優異之效果進行說明。 在本實施例中,由於也是與雷射脈衝LP1的上升時點t12同步地發出雷射脈衝LP2、LP3的切出開始的指令,因此即使從觸發訊號trg的上升時點t11到雷射脈衝LP1的上升時點t12為止的延遲時間td11中存在偏差,亦能夠從雷射脈衝LP1的光強度維持大致恆定之期間起切出雷射脈衝LP2、LP3。Next, the excellent effects of the embodiment shown in FIGS. 4 and 5 will be described. In this embodiment, since the laser pulses LP2 and LP3 are also commanded to start cutting out in synchronization with the rising time t12 of the laser pulse LP1, even from the rising time t11 of the trigger signal trg to the rising time t12 of the laser pulse LP1 There is a deviation in the delay time td11 up to the time t12, and the laser pulses LP2 and LP3 can also be cut out from the period in which the light intensity of the laser pulse LP1 remains substantially constant.

此外,在本實施例中,在兩個加工路徑中能夠同時進行兩片加工對象物50的加工。藉此,雷射加工的處理能力提高。In addition, in this embodiment, two processing objects 50 can be processed simultaneously in two processing paths. As a result, the processing capacity of laser processing is improved.

其次,對本實施例的變形例進行說明。在本實施例中,將直至發出開始切出雷射脈衝LP3之指令為止的待機時間tw12,以從雷射脈衝LP1的上升時點t12起所經過時間來進行指定,然而,亦能夠以從與雷射脈衝LP2對應之切出訊號chp的下降時點t14起所經過時間來進行指定。在該情況下,由於預先設定有待機時間tw11及雷射脈衝LP2的脈衝寬度值,因此可以說發出開始切出雷射脈衝LP3之指令之時刻與雷射脈衝LP1的上升時刻同步。Next, a modification example of this embodiment will be described. In this embodiment, the standby time tw12 until the command to start cutting out the laser pulse LP3 is issued is specified by the time elapsed from the rising time point t12 of the laser pulse LP1. The elapsed time from the falling time t14 of the cut-out signal chp corresponding to the shot pulse LP2 is specified. In this case, since the standby time tw11 and the pulse width value of the laser pulse LP2 are preset, it can be said that the time at which the instruction to start cutting out the laser pulse LP3 is issued is synchronized with the rising time of the laser pulse LP1.

上述各實施例為示例,當然,不同實施例中所示出之構成能夠部分替換或組合。關於基於複數個實施例的相同構成之相同的作用效果,在各實施例中不逐一提及。此外,本發明並不限於上述實施例。例如,能夠進行各種變更、改進及組合等,這對本領域技術人員而言是顯而易見的。The foregoing embodiments are examples. Of course, the configurations shown in the different embodiments can be partially replaced or combined. Regarding the same action and effect based on the same configuration of the plural embodiments, it is not mentioned one by one in each embodiment. In addition, the present invention is not limited to the above-mentioned embodiment. For example, it is obvious to those skilled in the art that various changes, improvements and combinations can be made.

10:雷射振盪器 11:分束鏡 12:照射光學系統 13:孔徑 14:切出光學系統 15:射束阻尼器 16:折返鏡 17:掃描光學系統 18X,18Y:可動反射鏡 19:透鏡 20:感測器 30:載台 31:移動機構 40:控制裝置 41:輸入裝置 50:加工對象物10: Laser oscillator 11: Beam splitter 12: Illumination optical system 13: Aperture 14: Cut out the optical system 15: beam damper 16: reentrant mirror 17: Scanning optical system 18X, 18Y: movable mirror 19: lens 20: Sensor 30: Stage 31: mobile agency 40: control device 41: Input device 50: Object to be processed

[圖1]係基於實施例之脈衝雷射輸出裝置的概略圖。 [圖2]係表示基於實施例之脈衝雷射輸出裝置的觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2的波形之圖表。 [圖3]係表示基於比較例之脈衝雷射輸出裝置的觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2的波形之圖表。 [圖4]係基於另一實施例之脈衝雷射輸出裝置的概略圖。 [圖5]係表示基於另一實施例之脈衝雷射輸出裝置的觸發訊號trg、雷射脈衝LP1、切出訊號chp及雷射脈衝LP2的波形之圖表。[Fig. 1] A schematic diagram of a pulse laser output device based on the embodiment. [FIG. 2] A graph showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulse LP2 of the pulse laser output device based on the embodiment. [Fig. 3] A graph showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulse LP2 of the pulse laser output device based on the comparative example. [Fig. 4] A schematic diagram of a pulse laser output device based on another embodiment. [FIG. 5] A graph showing the waveforms of the trigger signal trg, the laser pulse LP1, the cut-out signal chp, and the laser pulse LP2 of the pulse laser output device based on another embodiment.

t11~t15:時點 t11~t15: time point

t21~t25:時點 t21~t25: time point

td11:延遲時間 td11: delay time

td21:延遲時間 td21: delay time

tw11:待機時間 tw11: standby time

tw21:待機時間 tw21: standby time

trg:觸發訊號 trg: trigger signal

LP1:雷射脈衝 LP1: Laser pulse

chp:切出訊號 chp: cut out signal

LP2:雷射脈衝 LP2: Laser pulse

Claims (6)

一種雷射控制裝置,其與從雷射振盪器輸出之雷射脈衝的上升時刻同步地,對從自前述雷射振盪器輸出之雷射脈衝切出一部分之切出光學系統下令開始切出。A laser control device which, in synchronization with the rising time of the laser pulse output from the laser oscillator, orders a cutting optical system that cuts a part of the laser pulse output from the laser oscillator to start cutting. 如請求項1所述之雷射控制裝置,其中,還對前述切出光學系統下令結束切出。The laser control device according to claim 1, wherein the cut-out optical system is also ordered to end the cut-out. 如請求項1或2所述之雷射控制裝置,其中,還獲取從雷射脈衝的上升時點到下令開始切出雷射脈衝之時點為止的待機時間值,在從檢測到雷射脈衝的上升之時點起經過了相當於所獲取之前述待機時間值之時間之時點,對前述切出光學系統下令開始切出雷射脈衝。The laser control device according to claim 1 or 2, wherein the value of the standby time from the point when the laser pulse rises to the point when the laser pulse is ordered to be cut out is also acquired, and after the rise of the laser pulse is detected At the time point when the time equivalent to the obtained standby time value has passed, the cutting-out optical system is ordered to start cutting out the laser pulse. 一種脈衝雷射輸出裝置,其具有: 雷射振盪器,輸出脈衝雷射束; 感測器,檢測從前述雷射振盪器輸出之脈衝雷射束的光強度; 切出光學系統,從自前述雷射振盪器輸出之脈衝雷射束的雷射脈衝切出一部分;及 控制裝置,從前述感測器獲取檢測結果以檢測雷射脈衝的上升時點,並與雷射脈衝的上升時刻同步地,對前述切出光學系統下令開始切出雷射脈衝。A pulse laser output device, which has: Laser oscillator, output pulse laser beam; The sensor detects the light intensity of the pulsed laser beam output from the aforementioned laser oscillator; Cut out the optical system, cut out a part of the laser pulse of the pulsed laser beam output from the aforementioned laser oscillator; and The control device obtains the detection result from the sensor to detect the rising time of the laser pulse, and in synchronization with the rising time of the laser pulse, orders the cutting-out optical system to start cutting out the laser pulse. 如請求項4所述之脈衝雷射輸出裝置,其中, 前述控制裝置儲存有應該切出之雷射脈衝的脈衝寬度值,在對前述切出光學系統下令開始切出雷射脈衝之後,經過了相當於應該切出之雷射脈衝的脈衝寬度之時間之時點,對前述切出光學系統下令結束切出。The pulse laser output device according to claim 4, wherein: The aforementioned control device stores the pulse width value of the laser pulse that should be cut out. After the cut-out optical system is instructed to start cutting out the laser pulse, a time period equivalent to the pulse width of the laser pulse that should be cut out has elapsed At this point, the cut-out optical system is ordered to end the cut-out. 如請求項4或5所述之脈衝雷射輸出裝置,其中, 還具有輸入裝置,該輸入裝置被輸入從雷射脈衝的上升時點到下令開始切出雷射脈衝之時點為止的待機時間值, 前述控制裝置在從檢測到雷射脈衝上升之時點起經過了相當於所獲取之前述待機時間值之時間之時點,對前述切出光學系統下令開始切出雷射脈衝。The pulse laser output device according to claim 4 or 5, wherein: It also has an input device that receives the value of the standby time from the rising time of the laser pulse to the time when the laser pulse is ordered to be cut out, The aforementioned control device orders the aforementioned cut-out optical system to start cutting out the laser pulse at the time point when the time equivalent to the obtained standby time value has elapsed from the point of detecting the rise of the laser pulse.
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Publication number Priority date Publication date Assignee Title
DE19963010B4 (en) * 1999-12-22 2005-02-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for laser processing of workpieces
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US7817685B2 (en) * 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
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US7817686B2 (en) * 2008-03-27 2010-10-19 Electro Scientific Industries, Inc. Laser micromachining using programmable pulse shapes
US20130200053A1 (en) * 2010-04-13 2013-08-08 National Research Council Of Canada Laser processing control method
JP5912287B2 (en) * 2011-05-19 2016-04-27 株式会社ディスコ Laser processing method and laser processing apparatus
TW201301695A (en) * 2011-06-30 2013-01-01 E & R Engineering Corp Pulse-type laser waveform feedback control device
JP5967122B2 (en) * 2014-03-20 2016-08-10 トヨタ自動車株式会社 Laser welding apparatus and laser welding method
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JP6415357B2 (en) * 2015-03-06 2018-10-31 住友重機械工業株式会社 Laser processing equipment
US9793683B2 (en) * 2015-08-21 2017-10-17 Vuemetrix, Inc. Digital pulse width modulation power supply with pico second resolution
JP2017159317A (en) * 2016-03-09 2017-09-14 住友重機械工業株式会社 Laser beam machining device
CN108022853B (en) * 2016-11-03 2021-08-06 住友重机械工业株式会社 Laser annealing device
JP6682148B2 (en) * 2016-12-13 2020-04-15 住友重機械工業株式会社 Laser pulse cutting device and cutting method
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