TW202026776A - Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method - Google Patents

Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method Download PDF

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TW202026776A
TW202026776A TW109111519A TW109111519A TW202026776A TW 202026776 A TW202026776 A TW 202026776A TW 109111519 A TW109111519 A TW 109111519A TW 109111519 A TW109111519 A TW 109111519A TW 202026776 A TW202026776 A TW 202026776A
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stage
guide
axis direction
axis
substrate
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TW109111519A
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TWI727733B (en
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青木保夫
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日商尼康股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00Bearings for parts moving only linearly
    • F16C29/008Systems with a plurality of bearings, e.g. four carriages supporting a slide on two parallel rails
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00Bearings not otherwise provided for
    • F16C32/04Bearings not otherwise provided for using magnetic or electric supporting means
    • F16C32/0406Magnetic bearings
    • F16C32/0408Passive magnetic bearings
    • F16C32/041Passive magnetic bearings with permanent magnets on one part attracting the other part
    • F16C32/0421Passive magnetic bearings with permanent magnets on one part attracting the other part for both radial and axial load
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C39/00Relieving load on bearings
    • F16C39/04Relieving load on bearings using hydraulic or pneumatic means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C39/00Relieving load on bearings
    • F16C39/06Relieving load on bearings using magnetic means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816Bearings
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K16/00Machines with more than one rotor or stator
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K41/00Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02Linear motors; Sectional motors
    • H02K41/03Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K7/00Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/08Structural association with bearings
    • H02K7/09Structural association with bearings with magnetic bearings

Abstract

In a substrate stage (PST), when a Y coarse movement stage (23Y) moves in the Y-axis direction, an X coarse movement stage (23X), a weight cancellation device (40), and an X guide (102) move integrally in the Y-axis direction with the Y coarse movement stage (23Y), and when the X coarse movement stage (23X) moves in the X-axis direction on the Y coarse movement stage (23Y), the weight cancellation device (40) moves on the X guide (102) in the X-axis direction integrally with the X coarse movement stage (23X). Because the X guide (102) is provided extending in the X-axis direction while covering the movement range of the weight cancellation device (40) in the X-axis direction, the weight cancellation device (40) is constantly supported by the X guide (102), regardless of its position.

Description

曝光裝置、曝光方法、平板顯示器之製造方法、及元件製造方法Exposure device, exposure method, manufacturing method of flat panel display, and device manufacturing method

本發明係關於曝光裝置、移動體裝置、平板顯示器之製造方法、及元件製造方法,進一步詳言之,係關於在製造半導體元件、液晶顯示元件等之微影製程中所使用之曝光裝置,適合作為該曝光裝置保持曝光對象物體而移動之裝置的移動體裝置、使用前述曝光裝置之平板顯示器之製造方法、以及使用前述曝光裝置之元件製造方法。The present invention relates to an exposure device, a mobile device, a method of manufacturing a flat panel display, and a method of manufacturing a device. In more detail, it relates to an exposure device used in the lithography process for manufacturing semiconductor devices, liquid crystal display devices, etc., suitable for A moving body device which is a device that the exposure device moves while holding an object to be exposed, a method of manufacturing a flat panel display using the exposure device, and a method of manufacturing a device using the exposure device.

於習知用以製造液晶顯示元件、半導體元件(積體電電路等)等電子元件(微元件)之微影製程中,係使用一邊使光罩或標線片(以下,統稱為「光罩」)與玻璃板或晶圓(以下,統稱為「基板」)沿既定掃描方向(掃描方向)同步移動、一邊將形成於光罩之圖案使用能量束轉印至基板上之步進掃描(step & scan)方式之曝光裝置(所謂之掃描步進機(亦稱掃描機))等。In the conventional lithography process used to manufacture electronic components (microcomponents) such as liquid crystal display components and semiconductor components (integrated circuit, etc.), one side mask or reticle (hereinafter, collectively referred to as "mask") is used. ”) It moves synchronously with the glass plate or wafer (hereinafter collectively referred to as the “substrate”) along the predetermined scanning direction (scanning direction), while transferring the pattern formed on the mask to the substrate using an energy beam. & scan) exposure device (so-called scanning stepper (also known as scanning machine)) and so on.

此種曝光裝置,以具有可在掃描方向以長行程移動之X粗動載台上搭載可移動於掃描交叉方向(與掃描方向正交之方向)之Y粗動載台的重疊型(gantry型)載台裝置者廣為人知,作為該載台裝置,已知有例如在以石材形成之平台上重量消除(cancel)裝置沿水平面移動之構成者(例如,參照專利文獻1)。This type of exposure apparatus has an overlapping type (gantry type) with an X coarse movement stage that can move with a long stroke in the scanning direction and a Y coarse movement stage that can move in the scanning cross direction (direction orthogonal to the scanning direction). ) Stage devices are widely known, and as the stage device, for example, a structure in which a weight cancel device moves along a horizontal plane on a platform formed of stone is known (for example, refer to Patent Document 1).

然而,上述專利文獻1所記載之曝光裝置,由於重量消除裝置係以對應步進掃描(step & scan)動作之廣範圍移動,因此必須在一廣範圍將平台上面(重量消除裝置之移動導引面)之平面度做得非常高。加上近年來曝光裝置之曝光對象基板有日益大型化之傾向,隨之而來的平台亦大型化,因此除了成本増加外,曝光裝置之搬運性、組裝時之作業性悪化等亦受到極大關注。However, in the exposure device described in Patent Document 1, since the weight reduction device moves in a wide range corresponding to step & scan operations, it is necessary to move the platform over a wide range (the movement guide of the weight reduction device) The flatness of the surface is very high. In addition, in recent years, the exposure target substrate of exposure equipment has become increasingly large, and the accompanying platform has also become large. Therefore, in addition to the increase in cost, the transportability of the exposure equipment and the deterioration of the workability during assembly have also received great attention. .

又,上述專利文獻1所記載之曝光裝置,為了在平台(載台基座)與微動載台之間容納XY二軸載台、及用以微幅驅動微動載台之致動器等,因此在高度方向需要非常大的空間。為此,重量消除裝置不得不變得更大(高),而為了沿水平面驅動重量消除裝置,亦必須有大的驅動力。In addition, the exposure apparatus described in Patent Document 1 mentioned above is designed to accommodate an XY two-axis stage, an actuator for micro-driving the micro-motion stage, etc. between the stage (stage base) and the micro-motion stage. A very large space is required in the height direction. For this reason, the weight elimination device has to become larger (higher), and in order to drive the weight elimination device along a horizontal plane, a large driving force is also necessary.

一直以來,在驅動大質量之基板載台時,係採用可產生大驅動力(推力)之具有鐵心之線性馬達。此具有鐵心之線性馬達,在可動子(或固定子)中所含之磁石單元與固定子(或可動子)中所含之具有鐵心之線圈單元之間,可產生數倍於推力之磁吸力(吸引力)。具體而言,相對於4000N之推力,可產生10000~20000N之吸引力。For a long time, when driving a large-mass substrate stage, a linear motor with an iron core that can generate a large driving force (thrust) is used. This linear motor with iron core can generate magnetic attraction force several times the thrust between the magnet unit contained in the mover (or fixed piece) and the coil unit with iron core contained in the fixed piece (or mover) (Attraction). Specifically, relative to the thrust of 4000N, an attractive force of 10,000 to 20,000N can be generated.

因此,上述構成之習知基板載台裝置,會在X粗動載台與載台基座之間配置之一對單軸驅動單元,產生基板、Y粗動載台、X粗動載台等之大重量負載(及伴隨X粗動載台之移動之慣性力)之作用,且特別是從構成上述一對單軸驅動單元之具鐵心之線性馬達產生之大吸引力亦會作用於此。因此,單軸驅動單元、尤其是分別構成該單軸驅動單元之一部分之線性馬達及導引裝置必須具備大負載容量(能力),此外,亦必須將可動構件及固定構件牢固的構成為可耐來自線性馬達之吸引力。Therefore, in the conventional substrate stage device with the above structure, a pair of single-axis drive units are arranged between the X coarse motion stage and the stage base to generate substrates, Y coarse motion stages, X coarse motion stages, etc. The heavy load (and the inertial force accompanying the movement of the X coarse motion stage), and especially the large attractive force generated by the iron-core linear motor constituting the pair of single-axis drive units will also act here. Therefore, the single-axis drive unit, especially the linear motor and the guiding device that constitute a part of the single-axis drive unit, must have a large load capacity (capacity). In addition, the movable member and the fixed member must be firmly structured to withstand The attraction from linear motors.

另一方面,由於構成導引裝置(單軸導件)之線性導件(軌道)與滑件之間會作用大的摩擦阻抗,因此而導致驅動阻抗増加,因此需要能產生更大驅動力之線性馬達。除此之外,諸如基板載台裝置之大型化、在導引裝置之摩擦熱及在線性馬達之焦耳熱之產生、吸附物造成之機械損傷等附帶之問題亦日趨明顯。先行技術文獻 On the other hand, due to the large frictional resistance acting between the linear guide (rail) and the slider constituting the guiding device (single-axis guide), the driving resistance increases, so it is necessary to generate a greater driving force. Linear motor. In addition, incidental problems such as the enlargement of the substrate stage device, the generation of frictional heat in the guiding device, the generation of Joule heat in the linear motor, and the mechanical damage caused by the adsorbent have become increasingly obvious. Advanced technical literature

[專利文獻1]美國專利申請公開第2010/0018950號說明書[Patent Document 1] Specification of US Patent Application Publication No. 2010/0018950

本發明第1態樣之第1掃描型曝光裝置,係在曝光處理時相對曝光用之能量束使曝光對象之物體在與水平面平行之第1方向以既定第1行程移動,其具備:第1移動體,可於該第1方向至少以該既定第1行程移動;第2移動體,引導該第1移動體於該第1方向之移動,且能於該水平面内在與該第1方向正交之第2方向與該第1移動體一起以第2行程移動;物體保持構件,可保持該物體、與該第1移動體一起至少在與該水平面平行之方向移動;重量消除裝置,從下方支承該物體保持構件以消除該物體保持構件之重量;以及支承構件,係延伸於該第1方向,從下方支承該重量消除裝置並能在從下方支承有該重量消除裝置的狀態下,於該第2方向以該第2行程移動。The first scanning type exposure apparatus of the first aspect of the present invention moves the object of the exposure target in a first direction parallel to the horizontal plane with a predetermined first stroke relative to the energy beam for exposure during exposure processing, and it has: The moving body can move in the first direction with at least the predetermined first stroke; the second moving body guides the movement of the first moving body in the first direction and can be orthogonal to the first direction in the horizontal plane The second direction moves with the first moving body in a second stroke; the object holding member can hold the object and move together with the first moving body at least in a direction parallel to the horizontal plane; the weight reduction device supports from below The object holding member eliminates the weight of the object holding member; and the supporting member extends in the first direction, supports the weight elimination device from below and can support the weight elimination device from below in the first direction Move in the 2 direction by this second stroke.

根據此裝置,在對物體之曝光處理時,保持物體之物體保持構件係與第1移動體一起被驅動於與第1方向(掃描方向)平行之方向。此外,物體則藉由第2移動體被驅動於與第1方向正交之第2方向,而往第2方向移動。因此,可使物體沿與水平面平行之平面二維移動。此處,欲使物體往第1方向移動僅需驅動第1移動體(及物體保持構件)即可,因此,假設與在往第1方向移動之移動體上搭載往第2方向移動之另一移動體之情形相較,於掃描曝光時驅動之移動體(僅第1移動體、物體保持構件、重量消除裝置即可)質量小。因此,能使用以移動物體之致動器等小型化。又,從下方支承重量消除裝置之支承構件由於係由延伸於第1方向之構件構成、且能在從下方支承重量消除裝置之狀態下往第2方向移動,因此與水平面内之位置無關的,重量消除裝置恆被支承構件從下方支承。因此,與設置具有能涵蓋重量消除裝置之移動範圍之大導引面之大構件的情形相對較,能使裝置全體輕量化、小型化。According to this device, during exposure processing of an object, the object holding member holding the object is driven in a direction parallel to the first direction (scanning direction) together with the first moving body. In addition, the object is driven in a second direction orthogonal to the first direction by the second moving body to move in the second direction. Therefore, the object can be moved in two dimensions along a plane parallel to the horizontal plane. Here, it is only necessary to drive the first moving body (and the object holding member) to move the object in the first direction. Therefore, it is assumed that the other moving in the second direction is mounted on the moving body moving in the first direction. Compared with the case of the moving body, the moving body (only the first moving body, the object holding member, and the weight removing device) that are driven during the scanning exposure has a lower mass. Therefore, it is possible to use actuators for moving objects and the like to be downsized. In addition, since the support member supporting the weight elimination device from below is composed of a member extending in the first direction and can move to the second direction while supporting the weight elimination device from below, it has nothing to do with the position in the horizontal plane. The weight elimination device is always supported by the supporting member from below. Therefore, compared with the case where a large member having a large guide surface that can cover the moving range of the weight elimination device is provided, the weight and size of the entire device can be reduced.

本發明第2態樣之移動體裝置,具備:移動體,係在與水平面平行之面内至少移動於與第1軸平行之第1方向;基座,供支承該移動體;以及驅動裝置,包含分別朝向第1既定方向及與此交叉之第2既定方向設於該移動體之第1及第2可動子、以及與該第1及第2可動子之各個對向而在該基座上分別延設於該第1方向之第1及第2固定子,使用在該第1可動子與該第1固定子之間及該第2可動子與該第2固定子之間分別產生之該第1方向之驅動力將該移動體相對該基座驅動於該第1方向;該第1既定方向及第2既定方向中之至少一方,係在該水平面内與該第1軸正交之第2軸及與該水平面正交之第3軸交叉的方向;至少在該移動體之該第1方向之驅動時,在該第1可動子與該第1固定子之間、及該第2可動子與該第2固定子之間分別作用該第1既定方向及該第2既定方向之力。A moving body device according to a second aspect of the present invention includes: a moving body that moves at least in a first direction parallel to the first axis in a plane parallel to the horizontal plane; a base for supporting the moving body; and a driving device, Including the first and second movable elements respectively facing the first predetermined direction and the second predetermined direction intersecting with the first and second movable elements provided on the moving body, and each of the first and second movable elements facing each other on the base The first and second stators respectively extending in the first direction are used between the first movable component and the first stator and between the second movable component and the second stator. The driving force in the first direction drives the moving body relative to the base in the first direction; at least one of the first predetermined direction and the second predetermined direction is the first direction orthogonal to the first axis in the horizontal plane 2 axis and the direction intersecting the third axis orthogonal to the horizontal plane; at least when the movable body is driven in the first direction, between the first movable element and the first fixed element, and the second movable The force in the first predetermined direction and the second predetermined direction act between the element and the second fixed element.

此處,作用在第1可動子與第1固定子之間之第1既定方向(對向方向)之力、作用在第2可動子與第2固定子之間之第2既定方向(對向方向)之力,係對向方向之吸引力或斥力之任一種,例如可代表性的舉出磁力,但不限於此,亦可以是真空吸引力、氣體靜壓造成之壓力等。Here, the force acting in the first predetermined direction (opposing direction) between the first movable element and the first stator, and the second predetermined direction (opposing direction) acting between the second movable element and the second stator The force of the direction) is any of the attraction or repulsion in the opposite direction. For example, magnetic force can be representatively mentioned, but it is not limited to this. It can also be vacuum attraction, pressure caused by gas static pressure, etc.

根據此裝置,能利用在移動體之第1方向驅動時作用在第1可動子與第1固定子之間之第1既定方向之力、與作用在第2可動子與第2固定子之間之第2既定方向之力,減輕包含移動體自重之作用於基座之負荷,並在不損及驅動性能之情形下進行高精度之移動體驅動。According to this device, the force in the first predetermined direction acting between the first movable element and the first fixed element when the moving body is driven in the first direction, and the force acting between the second movable element and the second fixed element can be utilized The force in the second predetermined direction reduces the load on the base including the self-weight of the movable body, and drives the movable body with high precision without compromising the driving performance.

本發明第3態樣之第2曝光裝置,係照射能量束以在物體上形成圖案,其具備該物體被保持於該另一移動體之本發明之移動體裝置。The second exposure device of the third aspect of the present invention irradiates an energy beam to form a pattern on an object, and includes the moving body device of the present invention in which the object is held by the other moving body.

根據此裝置,由於能以高精度驅動保持物體之移動體,因此能進行對該物體之高精度曝光。According to this device, since the moving body holding the object can be driven with high precision, it is possible to perform high-precision exposure of the object.

本發明第4態樣之第3曝光裝置,具備:移動體,係保持物體在與水平面平行之面内至少移動於與第1軸平行之第1方向;基座,供支承該移動體;驅動裝置,包含分別朝向第1既定方向及與此交叉之第2既定方向設於該移動體之第1及第2可動子、以及與該第1及第2可動子之各個對向而在該基座上分別延設於該第1方向之第1及第2固定子,將該移動體相對該基座驅動於該第1方向,並在該驅動時,利用分別作用在該第1可動子與該第1固定子之間、該第2可動子與該第2固定子之間之該第1既定方向及該第2既定方向之力作為該移動體之浮力;以及圖案生成裝置,對該物體照射能量束以在該物體上生成圖案。A third exposure apparatus according to a fourth aspect of the present invention includes: a movable body for holding the object to move at least in a first direction parallel to the first axis in a plane parallel to the horizontal plane; a base for supporting the movable body; The device includes first and second movable elements provided on the movable body respectively facing a first predetermined direction and a second predetermined direction intersecting this, and each opposed to the first and second movable elements on the base The first and second fixed elements extending in the first direction are respectively arranged on the seat, the movable body is driven in the first direction relative to the base, and during the driving, the first movable element and the second fixed element The forces in the first predetermined direction and the second predetermined direction between the first fixed member, the second movable member and the second fixed member are used as the buoyancy of the moving body; and a pattern generating device for the object The energy beam is irradiated to generate a pattern on the object.

根據此裝置,在以驅動裝置進行移動體之驅動時,將在第1可動子與前述第1固定子之間、前述第2可動子與前述第2固定子之間分別作用之第1既定方向及第2既定方向之力利用為前述移動體之浮力,減輕包含移動體自重之作用於基座之負荷,並能在不損及驅動性能之情形下進行高精度之移動體驅動。According to this device, when the moving body is driven by the driving device, the first predetermined direction that acts between the first movable element and the first stator, and between the second movable element and the second stator, respectively And the force in the second predetermined direction is used as the buoyancy of the aforementioned moving body, which reduces the load on the base including the dead weight of the moving body, and enables high-precision driving of the moving body without compromising the driving performance.

本發明第5態樣提供一種平板顯示器之製造方法,其包含:使用上述第1至第3曝光裝置之任一種使前述基板曝光之動作;以及使曝光後之前述基板顯影之動作。A fifth aspect of the present invention provides a method for manufacturing a flat panel display, which includes: exposing the substrate using any one of the first to third exposure devices; and developing the substrate after the exposure.

本發明第6態樣提供一種元件製造方法,其包含:使用前述第1至第3曝光裝置之任一種使前述物體曝光之動作;以及使曝光後之前述物體顯影之動作。A sixth aspect of the present invention provides a device manufacturing method, which includes: exposing the object using any one of the first to third exposure devices; and developing the object after the exposure.

《第1實施形態》"First Embodiment"

以下,根據圖1~圖7説明第1實施形態。Hereinafter, the first embodiment will be described based on FIGS. 1 to 7.

圖1中,概略的顯示了第1實施形態之曝光裝置10之構成。曝光裝置10係以用於液晶顯示裝置(平板顯示器)之矩形玻璃基板P(以下,僅稱為基板P)作為曝光對象物之步進掃描方式之投影曝光裝置,所謂的掃描機。FIG. 1 schematically shows the structure of the exposure apparatus 10 of the first embodiment. The exposure device 10 is a projection exposure device of a step-and-scan method using a rectangular glass substrate P (hereinafter, simply referred to as substrate P) used in a liquid crystal display device (flat panel display) as an exposure target, a so-called scanner.

曝光裝置10,如圖1所示,具備照明系IOP、保持光罩M之光罩載台MST、投影光學系PL、一對基板載台架台19、將基板P保持成可沿水平面移動之基板載台裝置PST、以及此等之控制系等。以下之說明中,係設曝光時使光罩M與基板P相對投影光學系PL分別被掃描之水平面内之一方向為X軸方向、水平面内與此正交之方向為Y軸方向、與X軸及Y軸方向正交之方向為Z軸方向,並設繞X軸、Y軸及Z軸之旋轉(傾斜)方向分別為θx、θy及θz方向來進行説明。The exposure apparatus 10, as shown in FIG. 1, includes an illumination system IOP, a mask stage MST holding a mask M, a projection optical system PL, a pair of substrate stage stages 19, and a substrate that holds the substrate P to be movable along a horizontal plane. The stage device PST, and the control system of these, etc. In the following description, it is assumed that during exposure, one of the horizontal planes in which the mask M and the substrate P are scanned relative to the projection optical system PL is the X-axis direction, and the direction orthogonal to this in the horizontal plane is the Y-axis direction and X The direction perpendicular to the axis and the Y axis direction is the Z axis direction, and the rotation (tilt) directions around the X axis, Y axis, and Z axis are respectively the θx, θy, and θz directions.

照明系IOP,係與例如美國專利第6,552,775號說明書等所揭示之照明系同樣的構成。亦即,照明系IOP具有分別照明光罩M上被配置成鋸齒狀之複數個、例如5個照明區域的複數個、例如5個照明系,各照明系將從未圖示之光源(例如水銀燈)射出之光,經由未圖示之反射鏡、分光鏡(dichroic mirror)、遮簾、波長選擇濾波器、各種透鏡等,作為曝光用照明光(照明光)IL照射於光罩M。照明光IL,係使用例如i線(波長365nm)、g線(波長436nm)、h線(波長405nm)等之光(或上述i線、g線、h線之合成光)。又,照明光IL之波長可藉由波長選擇濾波器,例如視所要求之解析度適當的加以切換。The lighting system IOP has the same configuration as the lighting system disclosed in the specification of US Patent No. 6,552,775. That is, the illuminating system IOP has a plurality of illuminating masks M arranged in a zigzag shape, for example, a plurality of illuminating areas, for example, 5 illuminating systems, and each illuminating system uses a light source (such as a mercury lamp) not shown in the figure. ) The emitted light is irradiated to the mask M as exposure illumination light (illumination light) IL via a mirror, a dichroic mirror, a blind, a wavelength selection filter, various lenses, etc., not shown. The illumination light IL uses, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), etc. (or the aforementioned i-line, g-line, and h-line combined light). Moreover, the wavelength of the illumination light IL can be appropriately switched by a wavelength selection filter, for example, depending on the required resolution.

於光罩載台MST,例如以真空吸附着方式固定有其圖案面(圖1之下面)形成有電路圖案等之光罩M。光罩載台MST係以非接觸狀態搭載在未圖示之導件上,藉由例如包含線性馬達之光罩載台驅動系MSD(圖1中未圖示,參照圖7)以既定行程驅動於掃描方向(X軸方向),並被適當的微驅動於Y軸方向及θz方向。On the mask stage MST, for example, a mask M having a pattern surface (lower surface in FIG. 1) formed with a circuit pattern and the like is fixed by vacuum suction. The mask stage MST is mounted on a guide not shown in a non-contact state, and is driven with a predetermined stroke by, for example, a mask stage drive system MSD (not shown in FIG. 1, refer to FIG. 7) including a linear motor In the scanning direction (X-axis direction), it is appropriately micro-driven in the Y-axis direction and the θz direction.

光罩載台MST於XY平面内之位置資訊係藉由對固定(或形成)於光罩M之反射面照射雷射光束(測長光束)之雷射干涉儀(以下,稱「光罩干涉儀」)16,隨時例如以0.5~1nm程度之分解能力加以測量。此測量結果被供應至主控制裝置50(參照圖7)。The position information of the mask stage MST in the XY plane is achieved by a laser interferometer (hereinafter referred to as "mask interference") that irradiates a laser beam (length measuring beam) fixed (or formed) on the reflective surface of the mask M "Meter") 16, can be measured at any time, for example, with a resolution of about 0.5 to 1 nm. This measurement result is supplied to the main control device 50 (refer to FIG. 7).

主控制裝置50根據光罩干涉儀16之上述測量結果,透過光罩載台驅動系MSD(圖1中未圖示,參照圖4)進行光罩載台MST之驅動控制。又,亦可取代光罩干涉儀16、或與光罩干涉儀16一起使用編碼器(或由複數個編碼器構成之編碼器系統)。The main control device 50 performs drive control of the mask stage MST through the mask stage drive system MSD (not shown in FIG. 1, refer to FIG. 4) based on the above measurement result of the mask interferometer 16. In addition, an encoder (or an encoder system composed of a plurality of encoders) may be used instead of the reticle interferometer 16, or together with the reticle interferometer 16.

投影光學系PL配置在光罩載台MST之圖1中的下方。投影光學系PL具有與例如美國專利第6,552,775號說明書所揭示之投影光學系相同之構成。亦即,投影光學系PL對應前述複數個照明區域,包含光罩M之圖案像之投影區域配置成交錯狀之複數個、例如五個投影光學系(多透鏡投影光學系),與具有以Y軸方向為長邊方向之長方形單一像場之投影光學系具有相等之機能。本實施形態中,複數個投影光學系之各個係例如由具備沿光軸配置之稜鏡、光學元件群(透鏡群)、反射鏡各二組之2段透鏡中反射鏡(in mirror lens)光學系構成,例如使用兩側遠心之等倍系、形成正立正像者。The projection optical system PL is arranged below the mask stage MST in FIG. 1. The projection optical system PL has the same configuration as the projection optical system disclosed in the specification of US Patent No. 6,552,775, for example. That is, the projection optical system PL corresponds to the aforementioned plurality of illumination regions, and the projection regions including the pattern image of the mask M are arranged in a staggered pattern, for example, five projection optical systems (multi-lens projection optical systems), and have Y The projection optical system of a rectangular single image field whose axis direction is the long side direction has the same function. In this embodiment, each of the plurality of projection optical systems is composed of, for example, a two-stage lens with two groups of optical elements (lens group) arranged along the optical axis, an optical element group (lens group), and a mirror. System configuration, for example, using the equal magnification system of both sides telecentric, forming an erect image.

因此,當以來自照明系IOP之照明光IL照明光罩M上之照明區域時,即藉由通過被配置成投影光學系PL之第1面(物體面)與圖案面大致一致之光罩M的照明光IL,透過投影光學系PL將該照明區域内之光罩M之電路圖案之投影像(部分正立像),形成於與被配置在投影光學系PL之第2面(像面)側、表面塗有光阻劑(感應劑)之基板P上之照明區域共軛之照明光IL之照射區域(曝光區域)。並藉由光罩載台MST與構成基板載台裝置PST之一部分之後述微動載台21的同步驅動,相對照明區域(照明光IL)使光罩M移動於掃描方向(X軸方向)且相對曝光區域(照明光IL)使基板P移動於掃描方向(X軸方向),據以進行基板P上一個照射區域(區劃區域)之掃描曝光,於該照射區域轉印光罩M之圖案(光罩圖案)。亦即,本實施形態中,係以照明系IOP及投影光學系PL在基板P上生成光罩M之圖案,藉由使用照明光IL之基板P上感應層(光阻層)之曝光以在基板P上形成該圖案。Therefore, when the illumination area on the mask M is illuminated with the illumination light IL from the illumination system IOP, the first surface (object surface) and the pattern surface of the projection optical system PL are arranged so that the first surface (object surface) of the projection optical system PL substantially coincides with the pattern surface. The illuminating light IL passes through the projection optical system PL to form the projected image (partial erect image) of the circuit pattern of the mask M in the illumination area on the second surface (image surface) side of the projection optical system PL , The illumination area (exposure area) of the illumination light IL conjugated to the illumination area on the substrate P coated with photoresist (sensor). And by the synchronous driving of the mask stage MST and the micro-movement stage 21 that constitutes a part of the substrate stage device PST, the mask M is moved in the scanning direction (X-axis direction) relative to the illuminating area (illumination light IL) and facing each other. The exposure area (illumination light IL) moves the substrate P in the scanning direction (X-axis direction) to perform scanning exposure of an illuminated area (zoned area) on the substrate P, and transfer the pattern (light Mask pattern). That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the sensing layer (photoresist layer) on the substrate P using the illumination light IL is exposed to This pattern is formed on the substrate P.

一對基板載台架台19係分別由延伸於Y軸方向之構件構成(參照圖5),其長邊方向兩端部被設在地面F上之防振裝置13從下方支承。一對基板載台架台19係於X軸方向以既定間隔平行配置。一對基板載台架台19構成曝光裝置10之裝置本體(機體),投影光學系PL及光罩載台MST等係搭載於裝置本體。The pair of substrate stage stands 19 are each composed of members extending in the Y-axis direction (refer to FIG. 5), and both ends in the longitudinal direction are supported from below by vibration-proof devices 13 provided on the floor F. The pair of substrate stages 19 are arranged in parallel at a predetermined interval in the X-axis direction. A pair of substrate stage stages 19 constitute the main body (machine body) of the exposure apparatus 10, and the projection optical system PL, the mask stage MST, etc. are mounted on the main body.

基板載台裝置PST,如圖1所示,具備一對底床(bed)12、一對基座架14、粗動載台23、微動載台21、重量消除裝置40、及從下方支承重量消除裝置40之X導件102等。The substrate stage device PST, as shown in FIG. 1, includes a pair of beds 12, a pair of base frames 14, a coarse motion stage 23, a fine motion stage 21, a weight elimination device 40, and weight support from below Eliminate the X guide 102 of the device 40 and so on.

一對底床12,如圖2所示,分別由俯視(從+Z側觀察)以Y軸方向為長邊方向之矩形箱形構件(長方體狀構件)構成。一對底床12於X軸方向以既定間隔平行配置。+X側之底床12,如圖1所示,係搭載在+X側之基板載台架台19上,-X側之底床12則係搭載在-X側之基板載台架台19上。一對底床12各自之上面於Z軸方向之位置(以下,稱Z位置)被調整為大致相同。As shown in FIG. 2, the pair of bottom beds 12 are each composed of rectangular box-shaped members (cube-shaped members) whose longitudinal direction is the Y-axis direction in a plan view (viewed from the +Z side). The pair of bottom beds 12 are arranged in parallel at a predetermined interval in the X-axis direction. The bed 12 on the +X side, as shown in Fig. 1, is mounted on the substrate stage 19 on the +X side, and the bed 12 on the -X side is mounted on the substrate stage 19 on the -X side. The positions of the upper surfaces of the pair of bottom beds 12 in the Z-axis direction (hereinafter referred to as Z positions) are adjusted to be substantially the same.

一對底床12,由圖1及圖2可知,係藉由二個連結構件79將長邊方向兩端部近旁機械性的連結。一對底床12,如圖3(A)所示,分別由中空構件構成,於其上面部及下面部間於X軸方向以既定間隔設有複數個由與YZ平面平行之板狀構件構成之肋部,以確保剛性及強度。此外,雖未圖示,但在底床12之上面部及下面部之間,於Y軸方向亦以既定間隔設有複數個由與XZ平面平行之板狀構件構成之肋部。於複數個肋部各個之中央部及底床12之側面部,形成有用以輕量化及成形之圓形孔(參照圖5)。又,例如在不設置連結構件79亦能充分確保曝光精度之情形等時,亦可不設置連結構件79。As can be seen from FIGS. 1 and 2, the pair of bottom beds 12 are mechanically connected near both ends in the longitudinal direction by two connecting members 79. A pair of bottom beds 12, as shown in FIG. 3(A), are each composed of hollow members, and a plurality of plate-shaped members parallel to the YZ plane are provided at predetermined intervals in the X-axis direction between the upper face and the lower face. The ribs to ensure rigidity and strength. In addition, although not shown, a plurality of ribs composed of plate-shaped members parallel to the XZ plane are also provided at predetermined intervals in the Y-axis direction between the upper surface and the lower surface of the bed 12. In the center part of each of the plurality of ribs and the side part of the bottom bed 12, circular holes for weight reduction and shaping are formed (refer to FIG. 5). In addition, for example, when the exposure accuracy can be sufficiently ensured without providing the connecting member 79, the connecting member 79 may not be provided.

在一對底床12各自之上面,如圖2所示,於X軸方向以既定間隔固、彼此平行之方式固定有複數支機械性單軸導引裝置之要件的Y線性導件71A(本實施形態中,係一個底床設有例如四支)。On each of the pair of bottom beds 12, as shown in Fig. 2, a plurality of Y linear guides 71A (this is the main part of the mechanical uniaxial guide) are fixed in the X-axis direction at predetermined intervals and parallel to each other. In the embodiment, one bottom bed is provided with, for example, four branches).

一對基座架14中之一方,如圖1及圖3(A)所示,係配置在+X側底床12之+X側,另一方則配置在-X側底床12之-X側。一對基座架14由於具有相同構造,因此,以下僅針對-X側之基座架14加以説明。基座架14,如圖3(C)所示,包含:具有與YZ平面平行之一面與另一面、由延伸於Y軸方向之板狀構件構成之本體部14a與從下方支承本體部14a之複數個脚部14b(圖2及圖4中未圖示)。本體部14a之長度(長邊方向(Y軸方向)尺寸)被設定為較一對底床12各自於Y軸方向之長度長。脚部14b係於Y軸方向以既定間隔設有例如三個。於脚部14b之下端部,設有複數個調整器14c而能調整本體部14a之Z位置。One of the pair of base frames 14 is arranged on the +X side of the +X side bed 12, as shown in FIGS. 1 and 3(A), and the other is arranged on the -X side of the -X side bed 12. Since the pair of base frames 14 have the same structure, only the base frame 14 on the -X side will be described below. The base frame 14, as shown in FIG. 3(C), includes a body portion 14a having a surface parallel to the YZ plane and the other surface, a plate-shaped member extending in the Y-axis direction, and a body portion 14a supporting the body portion 14a from below A plurality of feet 14b (not shown in FIGS. 2 and 4). The length (the dimension in the longitudinal direction (Y-axis direction)) of the main body portion 14a is set to be longer than the length of the pair of bottom beds 12 in the Y-axis direction. The leg portions 14b are provided, for example, three at predetermined intervals in the Y-axis direction. A plurality of adjusters 14c are provided at the lower end of the foot 14b to adjust the Z position of the main body 14a.

於本體部14a之兩側面固定有分別為線性馬達之要件的Y固定子73。Y固定子73具有包含於Y軸方向以既定間隔排列之複數個永久磁石的磁石單元。此外,於本體部14a之上面及兩側面(上述Y固定子73之下方),固定有分別為機械性單軸導引裝置之要件的Y線性導件74A。Y fixers 73, which are elements of linear motors, are fixed to both side surfaces of the main body 14a. The Y stator 73 has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the Y-axis direction. In addition, Y linear guides 74A, which are components of the mechanical uniaxial guide device, are fixed to the upper surface and both side surfaces of the main body 14a (below the above-mentioned Y stator 73).

回到圖1,粗動載台23包含Y粗動載台23Y、與搭載在Y粗動載台23Y上之X粗動載台23X。粗動載台23位在上述一對底床12之上方(+Z側)。Returning to FIG. 1, the coarse motion stage 23 includes a Y coarse motion stage 23Y and an X coarse motion stage 23X mounted on the Y coarse motion stage 23Y. The coarse motion stage 23 is located above the pair of bottom beds 12 (+Z side).

Y粗動載台23Y,如圖2所示,具有一對X柱101。一對X柱101分別由延伸於X軸方向、YZ剖面為矩形之構件構成,於Y軸方向以既定間隔彼此平行的配置。又,各X柱101由於與Z軸方向(重力方向)之剛性相較未要求Y軸方向之剛性,因此YZ剖面之形狀可以是例如I字狀。The Y coarse motion stage 23Y has a pair of X columns 101 as shown in FIG. 2. The pair of X pillars 101 are respectively composed of members extending in the X-axis direction and having a rectangular YZ cross-section, and are arranged parallel to each other at a predetermined interval in the Y-axis direction. In addition, since each X column 101 does not require rigidity in the Y-axis direction compared with the rigidity in the Z-axis direction (gravity direction), the shape of the YZ cross-section may be, for example, an I-shape.

在一對X柱101各個之長邊方向兩端部近旁下面,如圖6所示,透過板片76固定有被稱為Y支架(carriage)75之構件。亦即,於Y粗動載台23Y下面,安裝有例如合計四個之Y支架75。板片76係由延伸於Y軸方向之與XY平面平行之板狀構件構成,將一對X柱101機械性的加以彼此連結。例如合計四個Y支架75之各個,由於具有相同構造,因此,以下僅說明對應-X側基座架14之一個Y支架75。Below each of the long side ends of the pair of X-pillars 101, as shown in FIG. 6, a member called a Y carriage 75 is fixed through a plate 76. That is, under the Y coarse motion stage 23Y, for example, four Y brackets 75 in total are attached. The plate 76 is composed of a plate-shaped member extending in the Y-axis direction parallel to the XY plane, and mechanically connects a pair of X-pillars 101 to each other. For example, each of the four Y brackets 75 in total has the same structure. Therefore, only one Y bracket 75 corresponding to the -X-side base frame 14 will be described below.

Y支架75,如圖3(C)所示,係由XZ剖面逆U字狀之構件構成,在一對對向面間插入基座架14之本體部14a。於Y支架75之一對對向面之各個,分別與一對Y固定子73之各個透過既定間隙分別固定有對向之一對Y可動子72。各Y可動子72包含未圖示之線圈單元,與對向之Y固定子73一起構成將Y粗動載台23Y(參照圖1)以既定行程驅動於Y軸方向之Y線性馬達YDM(參照圖7)。本實施形態,如上所述,由於Y支架75例如合計設有四個,因此Y粗動載台23Y係藉由例如合計八個Y線性馬達YDM驅動於Y軸方向。The Y bracket 75, as shown in FIG. 3(C), is composed of an inverted U-shaped member in the XZ section, and the main body portion 14a of the base frame 14 is inserted between a pair of opposed surfaces. A pair of Y movable members 72 facing each other is fixed to each of a pair of opposite surfaces of the Y bracket 75 and each of a pair of Y stators 73 through a predetermined gap. Each Y movable element 72 includes a coil unit not shown in the figure, and forms a Y linear motor YDM (see reference) that drives the Y coarse motion stage 23Y (see FIG. 1) in the Y axis direction with a predetermined stroke together with the opposite Y stator 73 Figure 7). In this embodiment, as described above, since a total of four Y brackets 75 are provided, for example, the Y coarse motion stage 23Y is driven in the Y-axis direction by, for example, eight Y linear motors YDM in total.

於Y支架75之一對對向面及頂面分別固定有包含轉動體(例如,複數個球等)、能滑動卡合於Y線性導件74A之滑件74B。又,圖3(C)中雖於紙面深度方向重疊而被遮蔽,但在Y支架75之一對對向面及頂面之各個,滑件74B係在紙面深度方向(Y軸方向)以既定間隔、例如各安裝有二個(參照圖5)。Y粗動載台23Y(參照圖1)係藉由包含Y線性導件74A與滑件74B之複數個Y線性導引裝置,被直進引導於Y軸方向。此外,雖未圖示,於上述基座架14之本體部14a固定有以Y軸方向為週期方向之Y標尺,於Y支架75則固定有編碼器讀頭,此編碼器讀頭係構成用以和Y標尺一起求出Y粗動載台23Y於Y軸方向之位置資訊的Y線性編碼器系統EY(參照圖7)。Y粗動載台23Y於Y軸方向之位置係根據上述編碼器讀頭之輸出由主控制裝置50(參照圖7)加以控制。A sliding member 74B including a rotating body (for example, a plurality of balls, etc.) that can be slidably engaged with the Y linear guide 74A is fixed to an opposite surface and the top surface of the Y bracket 75, respectively. In addition, although FIG. 3(C) overlaps in the depth direction of the paper surface and is shielded, in each of the opposite surface and the top surface of the Y bracket 75, the slider 74B is fixed in the depth direction of the paper surface (Y-axis direction). For example, two intervals are installed each (refer to FIG. 5). The Y coarse-movement stage 23Y (refer to FIG. 1) is guided linearly in the Y-axis direction by a plurality of Y linear guides including a Y linear guide 74A and a slider 74B. In addition, although not shown, a Y scale with the Y-axis direction as the periodic direction is fixed to the body portion 14a of the base frame 14, and an encoder read head is fixed to the Y bracket 75. This encoder read head is used for composition The Y linear encoder system EY (refer to FIG. 7) that obtains the position information of the Y coarse motion stage 23Y in the Y axis direction together with the Y scale. The position of the Y coarse motion stage 23Y in the Y-axis direction is controlled by the main control device 50 (refer to FIG. 7) based on the output of the encoder head.

此處,如圖1所示,於上述一對底床12之間配置有輔助導件框103。輔助導件框103係由延伸於Y軸方向之構件構成,透過複數個調整器設置在地面F上。於輔助導件框103之上端面(+Z側端面)固定有延伸於Y軸方向之機械性單軸導引裝置之要件的一條Y線性導件77A。輔助導件框103上端之Z位置被設定為與一對底床12之上面大致相同。又,輔助導件框103對一對底床12及一對基板載台架台19分別在振動上分離。此外,由於一對底床12係以連結構件79機械性的連結,因此,於輔助導件框103形成有用以使連結構件79通過之未圖示的貫通孔。Here, as shown in FIG. 1, an auxiliary guide frame 103 is arranged between the pair of bottom beds 12. The auxiliary guide frame 103 is composed of a member extending in the Y-axis direction, and is set on the ground F through a plurality of adjusters. On the upper end surface (+Z side end surface) of the auxiliary guide frame 103 is fixed a Y linear guide 77A, which is an essential part of the mechanical uniaxial guide device extending in the Y axis direction. The Z position of the upper end of the auxiliary guide frame 103 is set to be substantially the same as the upper surface of the pair of bottom beds 12. In addition, the auxiliary guide frame 103 is separated in vibration from the pair of bottom beds 12 and the pair of substrate stage tables 19, respectively. In addition, since the pair of bottom beds 12 are mechanically connected by the connecting member 79, the auxiliary guide frame 103 is formed with a through hole, not shown, through which the connecting member 79 can pass.

於一對X柱101各個之長邊方向中央部下面固定有輔助支架78(參照圖6)。輔助支架78由長方體狀構件構成,如圖1所示,於其下面固定有包含轉動體(例如複數個球等)、以滑動可能之方式卡合於Y線性導件77A之滑件77B。又,圖1中雖因在紙面深度方向重疊而無法看見,但針對一個輔助支架78,滑件77B係於紙面深度方向(Y軸方向)以既定間隔例如安裝有二個。如此,Y粗動載台23Y之長邊方向中央部透過輔助支架78而被輔助導件框103從下方支承,以抑制因自重產生之彎曲。An auxiliary bracket 78 is fixed to the lower surface of the center portion in the longitudinal direction of each of the pair of X-pillars 101 (refer to FIG. 6). The auxiliary bracket 78 is composed of a rectangular parallelepiped member. As shown in FIG. 1, a sliding member 77B including a rotating body (for example, a plurality of balls) and slidably engaged with the Y linear guide 77A is fixed on the bottom thereof. In addition, although FIG. 1 is not visible due to overlapping in the depth direction of the paper surface, for one auxiliary bracket 78, two sliders 77B are attached at a predetermined interval in the depth direction of the paper surface (Y-axis direction), for example. In this way, the center part in the longitudinal direction of the Y coarse motion stage 23Y is supported by the auxiliary guide frame 103 from below through the auxiliary bracket 78 to suppress bending due to its own weight.

回到圖2,於一對X柱101各個之上面,以彼此平行之方式、於Y軸方向子既定間隔固定有複數支(本實施形態中,係針對一個X柱101例如二支)延伸於X軸方向之機械性單軸導引裝置要件之X線性導件80A。又,於一對X柱101各個之上面的一對X線性導件80A間之區域,固定有X固定子81A。X固定子81A具有磁石單元,此磁石單元包含於X軸方向以既定間隔排列之複數個永久磁石。Returning to Fig. 2, on each of the pair of X-pillars 101, a plurality of branches (in this embodiment, for one X-pillar 101, for example, two branches) are fixed in parallel with each other at predetermined intervals in the Y-axis direction. The X linear guide 80A, which is the essential part of the mechanical single-axis guiding device in the X-axis direction. In addition, in the area between the pair of X linear guides 80A on the upper surface of each of the pair of X pillars 101, an X stator 81A is fixed. The X stator 81A has a magnet unit, and the magnet unit includes a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction.

如上所述,Y粗動載台23Y被一對基座架14及輔助導件框103從下方支承,與一對底床12及基板載台架台19在振動上分離。As described above, the Y coarse motion stage 23Y is supported from below by the pair of base frames 14 and the auxiliary guide frame 103, and is separated from the pair of bed 12 and the substrate stage 19 in terms of vibration.

X粗動載台23X由俯視矩形之板狀構件構成,如圖4所示,其中央部形成有開口部。於X粗動載台23X之下面,如圖5所示,固定有一對X可動子81B,此一對X可動子81B透過既定間隙與固定在一對X柱101各個之X固定子81A分別對向。各X可動子81B包含未圖示之線圈單元,與對向之X固定子81A一起構成將X粗動載台23X以既定行程驅動於X軸方向之X線性馬達XDM(參照圖7)。本實施形態中,X粗動載台23X係被與一對X柱101對應設置之例如一對(二個)X線性馬達XDM驅動於X軸方向。The X coarse motion stage 23X is composed of a rectangular plate-shaped member in a plan view, and as shown in FIG. 4, an opening is formed in the center. Under the X coarse motion stage 23X, as shown in FIG. 5, a pair of X movable elements 81B are fixed. This pair of X movable elements 81B respectively align with the X fixed elements 81A fixed to each of the pair of X pillars 101 through a predetermined gap. to. Each X movable element 81B includes a coil unit not shown, and forms an X linear motor XDM (see FIG. 7) that drives the X coarse motion stage 23X in the X-axis direction with a predetermined stroke together with the opposite X stator 81A. In this embodiment, the X coarse motion stage 23X is driven in the X-axis direction by, for example, a pair (two) of X linear motors XDM provided corresponding to the pair of X columns 101.

又,於X粗動載台23X之下面,如圖1所示,固定有複數個包含轉動體(例如複數個球等)、以可滑動之方式卡合於X線性導件80A之滑件80B。滑件80B係針對一支X線性導件80A於X軸方向以既定間隔設置例如四個,於X粗動載台23X之下面固定有例如合計16個之滑件80B。X粗動載台23X係被分別包含X線性導件80A與滑件80B之複數個X線性導引裝置直進引導於X軸方向。此外,X粗動載台23X係被複數個滑件80B限制相對Y粗動載台23Y往Y軸方向之移動,而與Y粗動載台23Y一體移動於Y軸方向。In addition, under the X coarse motion stage 23X, as shown in FIG. 1, there are fixed a plurality of sliding members 80B including rotating bodies (such as a plurality of balls) and slidably engaged with the X linear guide 80A. . For example, four sliders 80B are arranged at predetermined intervals in the X-axis direction with respect to one X linear guide 80A. For example, a total of 16 sliders 80B are fixed under the X coarse motion stage 23X. The X coarse-movement stage 23X is linearly guided in the X-axis direction by a plurality of X linear guides each including an X linear guide 80A and a slider 80B. In addition, the X coarse motion stage 23X is restricted from moving in the Y axis direction relative to the Y coarse motion stage 23Y by a plurality of sliders 80B, and moves in the Y axis direction integrally with the Y coarse motion stage 23Y.

又,雖未圖示,但於一對X柱101中之至少一方固定有以X軸方向為週期方向之X標尺,於X粗動載台23X固定有編碼器讀頭,此編碼器讀頭係與X標尺一起構成用來求出X粗動載台23X於X軸方向之位置資訊的X線性編碼器系統EX(參照圖7)。X粗動載台23X於X軸方向之位置係根據上述編碼器讀頭之輸出由主控制裝置50(參照圖7)加以控制。本實施形態中,包含上述X線性編碼器系統EX與前述Y線性編碼器系統EY,構成用以檢測粗動載台(X粗動載台23X)於XY平面内之位置資訊(含θz方向之旋轉)的編碼器系統20(參照圖7)。Also, although not shown, an X scale with the X axis direction as the periodic direction is fixed to at least one of the pair of X columns 101, and an encoder read head is fixed to the X coarse motion stage 23X. This encoder read head Together with the X scale, an X linear encoder system EX (refer to FIG. 7) for obtaining position information of the X coarse motion stage 23X in the X axis direction is constructed. The position of the X coarse motion stage 23X in the X-axis direction is controlled by the main control device 50 (refer to FIG. 7) based on the output of the encoder head. In this embodiment, the aforementioned X linear encoder system EX and the aforementioned Y linear encoder system EY are configured to detect the position information of the coarse motion stage (X coarse motion stage 23X) in the XY plane (including the θz direction) Rotating) encoder system 20 (refer to Fig. 7).

又,雖未圖示,於X粗動載台23X安裝有以機械方式限制微動載台21相對X粗動載台23X之可移動量的擋止(stopper)構件、或用以測量於X軸及Y軸方向之微動載台21相對X粗動載台23X之移動量的間隙感測器等。Also, although not shown, the X coarse motion stage 23X is equipped with a stopper member that mechanically restricts the movable amount of the fine motion stage 21 relative to the X coarse motion stage 23X, or is used to measure the X axis And a gap sensor for the amount of movement of the micro-movement stage 21 in the Y-axis direction relative to the X coarse-movement stage 23X.

微動載台21,由圖1及圖2可知,係由俯視大致正方形之板狀構件(或箱形(中空長方體)構件)構成,透過基板保持具PH將基板P以例如真空吸附(或靜電吸附)方式吸附保持在其上面。The micro-motion stage 21, as can be seen from FIGS. 1 and 2, is composed of a substantially square plate-shaped member (or box-shaped (hollow rectangular parallelepiped) member) in a plan view, and the substrate P is vacuum-attached (or electrostatically attached) through the substrate holder PH. ) Way to adsorb on it.

微動載台21係藉由微動載台驅動系26在X粗動載台23X上被微驅動於XY平面内之3自由度方向(X軸、Y軸及θz之各方向),該微動載台驅動系26(參照圖7)包含分別含固定於X粗動載台23X之固定子、與固定於微動載台21之可動子所構成之複數個音圈馬達(或線性馬達)。複數個音圈馬達,如圖2所示,將微動載台21微驅動於X軸方向之X音圈馬達18X係於Y軸方向分離設置一對,而將微動載台21微驅動於Y軸方向之Y音圈馬達18Y則於X軸方向分離設置一對。微動載台21,係使用上述X音圈馬達18X及/或Y音圈馬達18Y與X粗動載台23X同步被驅動(以同速度與X粗動載台23X被驅動於同方向),而與X粗動載台23X一起以既定行程移動於X軸方向、及/或Y軸方向。因此,微動載台21可相對投影光學系PL(參照圖1)於XY二軸方向以長行程移動(粗動),且能於X、Y、θz方向之三自由度方向微動。The micro-motion stage 21 is micro-driven on the X-coarse-motion stage 23X by the micro-motion stage drive system 26 in the 3 degrees of freedom direction (X-axis, Y-axis, and θz directions) in the XY plane. The micro-motion stage The driving system 26 (refer to FIG. 7) includes a plurality of voice coil motors (or linear motors) composed of a stator fixed to the X coarse motion stage 23X and a movable member fixed to the fine motion stage 21, respectively. A plurality of voice coil motors, as shown in FIG. 2, micro-drive the micro-movement stage 21 in the X-axis direction X voice coil motor 18X is separated in the Y-axis direction, and the micro-movement stage 21 is micro-driven on the Y-axis A pair of Y voice coil motors 18Y are arranged separately in the X axis direction. The fine motion stage 21 is driven synchronously with the X voice coil motor 18X and/or Y voice coil motor 18Y and the X coarse motion stage 23X (at the same speed and driven in the same direction as the X coarse motion stage 23X), and Together with the X coarse motion stage 23X, it moves in the X-axis direction and/or the Y-axis direction with a predetermined stroke. Therefore, the fine movement stage 21 can move with a long stroke (coarse movement) in the XY two-axis directions with respect to the projection optical system PL (refer to FIG. 1), and can be finely moved in the three degrees of freedom of the X, Y, and θz directions.

又,微動載台驅動系26,如圖3(B)所示,具有用以將微動載台21微驅動於θx、θy及Z軸方向之3自由度方向的複數個Z音圈馬達18Z。複數個Z音圈馬達18Z係配置在與微動載台21底面四角部之處(圖3(B)中僅顯示四個Z音圈馬達18Z中的二個,另二個則省略圖示)。關於包含複數個音圈馬達、微動載台驅動系之構成,例如已揭示於美國專利申請公開第2010/0018950號說明書。In addition, the micro-motion stage drive system 26, as shown in FIG. 3(B), has a plurality of Z voice coil motors 18Z for micro-driving the micro-motion stage 21 in the θx, θy, and 3-degree-of-freedom directions of the Z axis. A plurality of Z voice coil motors 18Z are arranged at the four corners of the bottom surface of the micro-movement stage 21 (Figure 3(B) only shows two of the four Z voice coil motors 18Z, and the other two are not shown). Regarding the structure including a plurality of voice coil motors and a micro-motion stage drive system, for example, it has been disclosed in the specification of US Patent Application Publication No. 2010/0018950.

本實施形態中,包含微動載台驅動系26、與由前述複數個Y線性馬達YDM及一對X線性馬達XDM構成之粗動載台驅動系,構成基板載台驅動系PSD(參照圖7)。In this embodiment, a micro-motion stage drive system 26 and a coarse-motion stage drive system composed of the aforementioned plural Y linear motors YDM and a pair of X linear motors XDM constitute a substrate stage drive system PSD (refer to Figure 7) .

於微動載台21之-X側側面,如圖3(A)所示,透過反射鏡(mirror)基座24X固定有具有與X軸正交之反射面的X移動鏡(棒狀反射鏡(bar mirror))22X。此外,於微動載台21之-Y側側面,如圖5所示,透過反射鏡基座24Y固定有具有與Y軸正交之反射面的Y移動鏡22Y。微動載台21於XY平面内之位置資訊係以使用X移動鏡22X及Y移動鏡22Y之雷射干涉儀系統(以下,稱基板干涉儀系統)92(參照圖1),以例如0.5~1nm程度之解析能力隨時加以檢測。又,實際上,基板干涉儀系統92具備複數個分別與X移動鏡22X對應之X雷射干涉儀及與Y移動鏡22Y對應之Y雷射干涉儀,但圖1中僅代表性的顯示X雷射干涉儀。複數個雷射干涉儀分別固定於裝置本體。又,微動載台21於θx、θy及Z軸方向之位置資訊係以固定在微動載台21下面之未圖示的感測器,使用例如固定在後述重量消除裝置40之靶加以求出。關於上述微動載台21之位置測量系之構成,已揭示於例如美國專利申請公開第2010/0018950號說明書。On the -X side of the micro-movement stage 21, as shown in FIG. 3(A), an X moving mirror (rod-shaped mirror (rod-shaped mirror) having a reflecting surface orthogonal to the X axis is fixed through a mirror base 24X bar mirror)) 22X. In addition, on the -Y side surface of the micro-movement stage 21, as shown in FIG. 5, a Y movable mirror 22Y having a reflection surface orthogonal to the Y axis is fixed to a transmission mirror base 24Y. The position information of the micro-movement stage 21 in the XY plane is based on the laser interferometer system (hereinafter referred to as the substrate interferometer system) 92 (refer to FIG. 1) using the X-moving mirror 22X and the Y-moving mirror 22Y, such as 0.5-1nm The degree of analytical ability can be tested at any time. In addition, actually, the substrate interferometer system 92 includes a plurality of X laser interferometers corresponding to the X moving mirror 22X and Y laser interferometers corresponding to the Y moving mirror 22Y, but only the representative X is shown in FIG. 1 Laser interferometer. A plurality of laser interferometers are respectively fixed to the device body. In addition, the position information of the micro-movement stage 21 in the θx, θy, and Z-axis directions is obtained by a sensor (not shown) fixed under the micro-movement stage 21, using, for example, a target fixed to the weight elimination device 40 described later. The structure of the position measurement system of the micro-movement stage 21 has been disclosed in, for example, the specification of US Patent Application Publication No. 2010/0018950.

重量消除裝置40,如圖3(A)所示,由延設於Z軸方向之柱狀構件構成,亦稱為心柱。重量消除裝置40被搭載在後述X導件102上,透過後述之調平(leveling)裝置57從下方支承微動載台21。重量消除裝置40之上半部插入X粗動載台23X之開口部内,其下半部則插入一對X柱101(參照圖4)之間。The weight elimination device 40, as shown in FIG. 3(A), is composed of a columnar member extending in the Z-axis direction, which is also called a stem. The weight elimination device 40 is mounted on the X guide 102 described later, and supports the fine movement stage 21 from below through a leveling device 57 described later. The upper half of the weight elimination device 40 is inserted into the opening of the X coarse motion stage 23X, and the lower half is inserted between a pair of X columns 101 (refer to FIG. 4).

重量消除裝置40,如圖3(B)所示,具有筐體41、空氣彈簧42及Z滑件43等。筐體41係由+Z側之面為開口之有底筒狀構件構成。於筐體41之下面安裝有複數個軸承面朝向-Z側之空氣軸承(以下,稱基座墊)44。空氣彈簧42係收容在筐體41内部。對空氣彈簧42從外部供應加壓氣體。Z滑件43由延伸於Z軸方向之筒狀構件構成,插入筐體41内而被搭載於空氣彈簧42上。於Z滑件43之+Z側端部安裝有軸承面朝向+Z側之未圖示的空氣軸承。The weight elimination device 40, as shown in FIG. 3(B), has a housing 41, an air spring 42, a Z slider 43, and the like. The housing 41 is composed of a bottomed cylindrical member whose +Z side surface is open. A plurality of air bearings (hereinafter referred to as base pads) 44 whose bearing surfaces face the -Z side are mounted on the lower surface of the housing 41. The air spring 42 is housed in the housing 41. The air spring 42 is supplied with pressurized gas from the outside. The Z slider 43 is constituted by a cylindrical member extending in the Z-axis direction, inserted into the housing 41 and mounted on the air spring 42. An air bearing (not shown) whose bearing surface faces the +Z side is attached to the +Z side end of the Z slider 43.

調平裝置57係用以將微動載台21支承為傾斜自如(相對XY平面於θx及θy方向擺動自如)之裝置,被安裝在Z滑件43之上述空氣軸承從下方以非接觸方式支承。重量消除裝置40係藉由空氣彈簧42產生之重力方向提升之力,透過Z滑件43及調平裝置57抵消(消除)含微動載台21之系的重量(重力方向向下之力),據以降低上述複數個Z音圈馬達18Z之負荷。The leveling device 57 is a device for supporting the micro-motion stage 21 to be tiltable (swing freely in the θx and θy directions with respect to the XY plane), and is supported by the air bearing mounted on the Z slider 43 in a non-contact manner from below. The weight elimination device 40 is lifted by the force of the gravity direction generated by the air spring 42, and the weight of the system including the micro-motion stage 21 (the downward force of the gravity direction) is offset (eliminated) by the Z slide 43 and the leveling device 57, Accordingly, the load on the plurality of Z voice coil motors 18Z is reduced.

重量消除裝置40透過複數個連結裝置45機械性的連接於X粗動載台23X。複數個連結裝置45之Z位置與重量消除裝置40於Z軸方向之重心位置大致一致。連結裝置45包含與XY平面平行之厚度薄的鋼板等,亦稱為彎曲(flexure)裝置。連結裝置45在重量消除裝置40之+X側、-X側、+Y側、-Y側將重量消除裝置40之筐體41與X粗動載台23X加以連結(圖3(B)中,+Y側、-Y側之連結裝置45未圖示。參照圖4)。因此,重量消除裝置40透過複數個連結裝置45之任一者被X粗動載台23X牽引,而與該X粗動載台23X一體的移動於X軸方向或Y軸方向。此時,於重量消除裝置40會在與包含其於Z軸方向之重心位置之XY平面平行的平面内作用一牽引力,因此不會產生(作用)繞與移動方向正交之軸線的力矩(俯仰力矩)。又,含調平裝置57、連結裝置45關於本實施形態之重量消除裝置40之詳細構成,已揭示於例如美國專利申請公開第2010/0018950號說明書。The weight elimination device 40 is mechanically connected to the X coarse motion stage 23X through a plurality of connecting devices 45. The Z position of the plurality of connecting devices 45 is substantially the same as the center of gravity position of the weight elimination device 40 in the Z axis direction. The connecting device 45 includes a thin steel plate parallel to the XY plane, etc., and is also called a flexure device. The connecting device 45 connects the housing 41 of the weight eliminating device 40 and the X coarse motion stage 23X on the +X side, -X side, +Y side, and -Y side of the weight eliminating device 40 (+Y side in FIG. 3(B)) ,-The connecting device 45 on the Y side is not shown. Refer to Fig. 4). Therefore, the weight elimination device 40 is pulled by the X coarse motion stage 23X through any one of the plurality of connecting devices 45, and moves in the X-axis direction or the Y-axis direction integrally with the X coarse motion stage 23X. At this time, the weight elimination device 40 acts on a traction force in a plane parallel to the XY plane including its center of gravity position in the Z-axis direction, and therefore does not generate (act) a moment (pitch) around an axis orthogonal to the moving direction. Moment). In addition, the detailed structure of the weight reduction device 40 of this embodiment including the leveling device 57 and the connecting device 45 has been disclosed in, for example, the specification of US Patent Application Publication No. 2010/0018950.

X導件102,如圖3(A)所示,包含由以X軸方向為長邊方向之YZ剖面為倒U字形之構件(參照圖5)構成的導件本體102a、與複數個肋部102b。X導件102係在上述一對底床12之上方(+Z側),以橫越一對底床12之方式配置。X導件102之長度(長邊方向(X軸方向)尺寸)係設定為較The X guide 102, as shown in FIG. 3(A), includes a guide body 102a composed of an inverted U-shaped member (see FIG. 5) with a YZ cross-section with the X axis as the longitudinal direction, and a plurality of ribs 102b. The X guide 102 is above the pair of bottom beds 12 (+Z side), and is arranged so as to cross the pair of bottom beds 12. The length of the X guide 102 (long side direction (X axis direction) dimension) is set to be relatively

於X軸方向以既定間隔配置之一對底床12各個之X軸方向尺寸、與一對底床12間之間隙於X軸方向之尺寸之和略長。因此,如圖2所示,X導件102之+X側端部較+X側底床12之+X側端部突出於+X側(底床12之外側),X導件102之-X側端部則較-X側底床12之-X側端部突出於-X側(底床12之外側)。The sum of the dimension in the X-axis direction of a pair of bed beds 12 and the gap between the pair of bed beds 12 in the X-axis direction is arranged at a predetermined interval in the X-axis direction. Therefore, as shown in Figure 2, the +X side end of the X guide 102 protrudes from the +X side (outside the bottom 12) of the +X side bed 12, and the -X side end of the X guide 102 Then, the -X side end of the -X side bed 12 protrudes from the -X side (outside the bed 12).

導件本體102a之上面(+Z側之面)與XY平面平行且平坦度被做得非常高。於導件本體102a之上面,透過複數個基座墊44以非接觸狀態搭載有重量消除裝置40。導件本體102a之上面被以良好精度調整為與水平面平行,具有作為重量消除裝置40移動時之導引面之機能。導件本體102a之長度(長邊方向之尺寸)係設定為較重量消除裝置40(亦即X粗動載台23X)往X軸方向之可移動量略長。導件本體102a上面之寬度(Y軸方向之尺寸)則設定成可與複數個基座墊44所有之軸承面對向之尺寸(參照圖4)。此外,導件本體102a之長邊方向兩端部係被與YZ平面平行之板狀構件閉塞。The upper surface (+Z side surface) of the guide body 102a is parallel to the XY plane and has a very high flatness. On the upper surface of the guide body 102a, a weight reduction device 40 is mounted through a plurality of base pads 44 in a non-contact state. The upper surface of the guide body 102a is adjusted to be parallel to the horizontal plane with good accuracy, and has a function as a guide surface when the weight reduction device 40 moves. The length of the guide body 102a (the dimension in the longitudinal direction) is set to be slightly longer than the movable amount of the weight elimination device 40 (that is, the X coarse motion stage 23X) in the X axis direction. The width of the upper surface of the guide body 102a (the dimension in the Y-axis direction) is set to a dimension that can face all the bearing surfaces of the plurality of base pads 44 (refer to FIG. 4). In addition, both ends in the longitudinal direction of the guide body 102a are closed by plate-shaped members parallel to the YZ plane.

複數個肋部102b係由分別與YZ平面平行之板狀構件構成,於X軸方向以既定間隔設置。複數個肋部102b之各個係連接於導件本體102a之對向的一對對向面及頂面。此處,含複數個肋部102b,X導件102之材質及製造方法雖無特別限定,但例如係以使用鐵等之鑄造形成之情形、以石材(例如輝長岩)形成之情形、以陶瓷或CFRP(Carbon Fiber Reinforced Plastics)材等形成之情形時,導件本體102a及複數個肋部102b係一體形成。不過,亦可將導件本體102a與複數個肋部102b作成不同構件,將複數個肋部102b例如以熔接等方式連接於導件本體102a。又,X導件102可以中實構件構成、亦可以下面側閉塞之箱形構件構成。The plurality of ribs 102b are composed of plate-shaped members parallel to the YZ plane, and are provided at predetermined intervals in the X-axis direction. Each of the plurality of ribs 102b is connected to a pair of facing surfaces and top surfaces of the guide body 102a. Here, a plurality of ribs 102b are included. Although the material and manufacturing method of the X guide 102 are not particularly limited, for example, it is formed by casting using iron, etc., formed by stone (for example, gabbro), or formed by ceramics. Or in the case of CFRP (Carbon Fiber Reinforced Plastics) material, etc., the guide body 102a and the plurality of ribs 102b are integrally formed. However, the guide body 102a and the plurality of ribs 102b may be made into different components, and the plurality of ribs 102b may be connected to the guide body 102a by, for example, welding. In addition, the X guide 102 may be formed of a solid member or a box-shaped member with the lower side closed.

於複數個肋部102b各個之下端部,固定有包含轉動體(例如複數個球等)、能在固定於上述一對底床12各個之上面之Y線性導件71A滑動的Y滑件71B。又,如圖4所示,Y滑件71B係於Y軸方向以既定間隔固定有複數個(本實施形態中,例如係對一支Y線性導件71A固定有二個)。導件本體102a上面之平面度調整,可在複數個肋部102b與Y滑件71B之間適當的插入墊片等來進行。At the lower end of each of the plurality of ribs 102b, a Y sliding member 71B including a rotating body (for example, a plurality of balls, etc.), which can slide on the Y linear guide 71A fixed on each of the above-mentioned pair of bottom beds 12, is fixed. Furthermore, as shown in FIG. 4, a plurality of Y sliders 71B are fixed at predetermined intervals in the Y-axis direction (in this embodiment, for example, two Y linear guides 71A are fixed). The flatness adjustment of the upper surface of the guide body 102a can be carried out by appropriately inserting spacers or the like between the plurality of ribs 102b and the Y slide 71B.

在設於X導件102長邊方向兩端部之上述板狀構件,如圖2所示,以和上述一對Y固定子73(參照圖3(C))分別隔著既定間隙之方式,對向固定有用以將X導件102以既定行程驅動於Y軸方向之Y線性馬達82(參照圖7)之要件的Y可動子72A(參照圖4。為易於理解,圖4中板片76未圖示)。各Y可動子72A具有未圖示之線圈單元。X導件102被分別包含Y固定子73與Y可動子72A之一對Y線性馬達82以既定行程驅動於Y軸方向。亦即,本實施形態中,用以將X導件102驅動於Y軸方向之一對Y線性馬達82及用以將Y粗動載台23Y驅動於Y軸方向之Y線性馬達YDM,係分別使用共通的固定子73。As shown in FIG. 2, the plate-shaped members provided at both ends of the X guide 102 in the longitudinal direction are separated from the pair of Y stators 73 (refer to FIG. 3(C)) by a predetermined gap, respectively. The Y movable element 72A (refer to Fig. 4) is the essential element of the Y linear motor 82 (refer to Fig. 7) that drives the X guide 102 in the Y axis direction with a predetermined stroke. For ease of understanding, the plate 76 in Fig. 4 Not shown). Each Y movable element 72A has a coil unit not shown. The X guide 102 is respectively composed of a Y fixed element 73 and a Y movable element 72A, and a pair of Y linear motors 82 are driven in the Y axis direction with a predetermined stroke. That is, in this embodiment, a pair of Y linear motors 82 for driving the X guide 102 in the Y-axis direction and a Y linear motor YDM for driving the Y coarse motion stage 23Y in the Y-axis direction are respectively Use the common fixator 73.

又,雖未圖示,於上述一對底床12中之一方固定有以Y軸方向為週期方向之Y標尺,於X導件102固定有和Y標尺一起構成用以求出X導件102於Y軸方向之位置資訊之Y線性編碼器系統104(參照圖7)的編碼器讀頭。X導件102及Y粗動載台23Y係由主控制裝置50(參照圖7)根據上述編碼器讀頭之輸出同步驅動於Y軸方向(不過,若有需要時亦可個別的控制Y位置)。Also, although not shown, a Y scale with the Y-axis direction as the periodic direction is fixed to one of the pair of beds 12, and a Y scale is fixed to the X guide 102 to obtain the X guide 102 The encoder read head of the Y linear encoder system 104 (refer to FIG. 7) for position information in the Y axis direction. The X guide 102 and the Y coarse motion stage 23Y are synchronously driven in the Y-axis direction by the main control device 50 (refer to FIG. 7) according to the output of the encoder reading head (but, if necessary, the Y position can be controlled individually ).

除此之外,於基板保持具PH之上面固定有以Y軸方向為長邊方向之矩形標記板(未圖示)。此標記板之高度被設定為其表面與裝載在基板保持具PH上之基板P表面大致同一面高。又,於標記板表面形成有複數個、此處為六個排列於Y軸方向之基準標記(未圖示)。In addition, a rectangular marking plate (not shown) with the Y-axis direction as the longitudinal direction is fixed on the upper surface of the substrate holder PH. The height of the marking plate is set so that its surface is approximately the same height as the surface of the substrate P loaded on the substrate holder PH. In addition, a plurality of fiducial marks (not shown) arranged in the Y-axis direction are formed on the surface of the marking plate.

此外,於基板保持具PH(微動載台21)内部,在六個基準標記各個之下方(-Z側)配置有包含透鏡系與攝影元件(CCD等)之六個標記像檢測系MD1 ~MD6 (參照圖7)。此等標記像檢測系MD1 ~MD6 同時檢測以五個投影光學系之各個與透鏡系形成之光罩M上之對準標記之投影像、以及以透鏡系形成之基準標記(未圖示)之像,測量以基準標記像之位置為基準之對準標記像之位置。其測量結果被供應至主控制裝置50,用於光罩M之位置對準(光罩對準)等。In addition, inside the substrate holder PH (fine movement stage 21), under each of the six reference marks (-Z side), six mark image detection systems MD 1 ~ including a lens system and imaging elements (CCD etc.) are arranged. MD 6 (refer to Figure 7). These mark image detection systems MD 1 to MD 6 simultaneously detect the projection images of the alignment marks on the mask M formed by each of the five projection optical systems and the lens system, and the fiducial marks formed by the lens system (not shown) ) Image, measure the position of the alignment mark image based on the position of the fiducial mark image. The measurement result is supplied to the main control device 50 and used for position alignment of the mask M (mask alignment) and so on.

進一步的,於曝光裝置10,為檢測六個基準標記及基板P上之對準標記,設有六個離軸方式之對準檢測系AL1 ~AL6 (參照圖7)。六個對準檢測系係在投影光學系PL之+X側沿Y軸依序配置。Further, in the exposure device 10, in order to detect the six fiducial marks and the alignment marks on the substrate P, six off-axis alignment detection systems AL 1 to AL 6 are provided (refer to FIG. 7). The six alignment detection systems are arranged in sequence along the Y axis on the +X side of the projection optical system PL.

各對準檢測系係採用影像處理方式之FIA(Field Image Alignment)系感測器。FIA系感測器,例如係對對象標記照射不會使基板P上之光阻感光之寬頻檢測光,並使用攝影元件(CCD)等拍攝由該來自對象標記之反射光在受光面成像之對象標記之像與指標(未圖示)之像。對準檢測系AL1 ~AL6 之檢測結果透過對準訊號處理系(未圖示)送至主控制裝置50。Each alignment detection system adopts FIA (Field Image Alignment) sensor based on image processing method. FIA is a sensor. For example, it irradiates the target mark with broadband detection light that does not sensitize the photoresist on the substrate P, and uses a photographic device (CCD) to photograph the object that is imaged by the reflected light from the target mark on the light-receiving surface The image of the mark and the image of the indicator (not shown). The detection results of the alignment detection systems AL 1 to AL 6 are sent to the main control device 50 through the alignment signal processing system (not shown).

此外,亦能單獨或適當組合使用能將同調檢測光照射於對象標記以檢測從該對象標記產生之散射光或繞射光、或是使從該對象標記產生之兩繞射光(例如同階數)干涉以檢測的對準感測器。In addition, it can also be used alone or in an appropriate combination. The coherent detection light can be irradiated to the target mark to detect scattered light or diffracted light generated from the target mark, or two diffracted lights generated from the target mark (for example, the same order) Interference to detect the alignment sensor.

圖7中,以曝光裝置10之控制系為中心構成,顯示統籌控制構成各部之主控制裝置50之輸出入關係的方塊圖。主控制裝置50包含工作站(或微電腦)等,統籌控制曝光裝置10之構成各部。In FIG. 7, the control system of the exposure device 10 is a block diagram showing the relationship between the input and output of the main control device 50 that collectively controls the components of the exposure device 10. The main control device 50 includes a workstation (or a microcomputer), etc., and overall controls the components of the exposure device 10.

接著,簡單説明在曝光裝置10之基板P的批次處理。Next, the batch processing of the substrate P in the exposure apparatus 10 will be briefly described.

由複數(例如50片或100片)基板P構成之處理對象之一批被掰入聯機於曝光裝置10之塗布顯影機(以下、稱「C/D」)(未圖示)後,批内之基板係依序被C/D内之塗布機(光阻塗布裝置)塗布光阻,並被搬送系(未圖示)搬送至曝光裝置10。此外,在主控制裝置50之管理下,藉由未圖示之光罩搬送裝置(光罩裝載器)進行光罩M至光罩載台MST上之裝載,接著進行前述光罩對準。After a batch of processing objects consisting of a plurality of (for example, 50 or 100) substrates P is broken into the coating and developing machine (hereinafter, referred to as "C/D") (not shown) (not shown) connected to the exposure device 10, the batch is The substrates are sequentially coated with photoresist by a coater (photoresist coating device) in the C/D, and are transported to the exposure device 10 by a transport system (not shown). In addition, under the management of the main control device 50, the photomask M is loaded onto the photomask stage MST by a photomask transport device (mask loader) not shown, and then the aforementioned photomask alignment is performed.

當塗有光阻之基板P被裝載於基板保持具PH上後,主控制裝置50即使用對準檢測系AL1 ~AL6 檢測基板保持具PH上之基準標記,進行基準線測量。After the substrate P coated with photoresist is loaded on the substrate holder PH, the main control device 50 uses the alignment detection systems AL 1 to AL 6 to detect the fiducial marks on the substrate holder PH, and perform baseline measurement.

接著,主控制裝置50使用對準檢測系AL1 ~AL6 檢測在前層之前之曝光時與圖案一起轉印形成於基板P上之複數個對準標記,以進行基板P之對準。Next, the main control device 50 uses the alignment detection systems AL 1 to AL 6 to detect a plurality of alignment marks transferred and formed on the substrate P together with the pattern during the exposure before the front layer to perform alignment of the substrate P.

基板P之對準結束後,由主控制裝置50之控制,進行為於基板P上之複數個照射區域,藉由前述掃描曝光依序轉印光罩M之圖案之步進掃描方式的曝光動作。由於此曝光動作於習知進行之步進掃描方式之曝光動作相同,因此省略其詳細説明。After the alignment of the substrate P is completed, the main control device 50 is controlled by the main control device 50 to perform a step-and-scan exposure operation in which the pattern of the mask M is sequentially transferred by the aforementioned scanning exposure to a plurality of irradiation areas on the substrate P . Since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, its detailed description is omitted.

此時,上述步進掃描方式之曝光動作,係對設在基板P上之複數個照射區域依序進行曝光處理。基板P在掃描動作時係於X軸方向以既定行程被等速驅動(以下稱X掃描動作),於步進動作時(照射區域間移動時)則係適當的被驅動於X軸方向及/或Y軸方向(以下,分別稱X步進動作、Y步進動作)。At this time, the exposure operation of the step-and-scan method is to sequentially perform exposure processing on a plurality of irradiation regions provided on the substrate P. The substrate P is driven at a constant speed with a predetermined stroke in the X-axis direction during the scanning operation (hereinafter referred to as X-scanning operation), and is appropriately driven in the X-axis direction during the stepping operation (when moving between irradiation areas) and/ Or Y-axis direction (hereinafter referred to as X stepping action and Y stepping action respectively).

在上述X掃描動作時及X步進動作時,使基板P往X軸方向移動之際,於基板載台裝置PST係依根據來自主控制裝置50之X線性編碼器系統EX之測量値的指示,在Y粗動載台23Y上以一對(二個)X線性馬達XDM將X粗動載台23X驅動於X軸方向,並依根據來自主控制裝置50之基板干涉儀系統92之測量値的指示,以複數個X音圈馬達18X與X粗動載台23X同步驅動微動載台21。又,當X粗動載台23X往X軸方向移動時,由於被此X粗動載台23X牽引,重量消除裝置40即與X粗動載台23X一起往X軸方向移動。此時,重量消除裝置40在X導件102上移動。又,上述X掃描動作及X步進動作時,雖有相對X粗動載台23X將微動載台21微驅動於Y軸方向及/或θz方向之情形,但由於重量消除裝置40之Y位置不會變化,因此重量消除裝置40恆僅在X導件102上移動。When the substrate P is moved in the X-axis direction during the above-mentioned X scanning operation and X stepping operation, the substrate stage device PST is based on the instruction of the measurement value from the X linear encoder system EX of the main control device 50 , On the Y coarse motion stage 23Y, the X coarse motion stage 23X is driven in the X-axis direction by a pair (two) X linear motors XDM, and according to the measurement value of the substrate interferometer system 92 from the main control device 50 According to the instructions, the fine motion stage 21 is driven in synchronization with the X voice coil motors 18X and the X coarse motion stage 23X. In addition, when the X coarse motion stage 23X moves in the X axis direction, the weight elimination device 40 moves in the X axis direction together with the X coarse motion stage 23X due to being pulled by the X coarse motion stage 23X. At this time, the weight elimination device 40 moves on the X guide 102. In addition, in the above-mentioned X scanning operation and X stepping operation, although the fine movement stage 21 is finely driven in the Y axis direction and/or the θz direction relative to the X coarse movement stage 23X, the Y position of the weight reduction device 40 There is no change, so the weight elimination device 40 always moves only on the X guide 102.

相對於此,上述Y步進動作時,於基板載台裝置PST則係依根據來自主控制裝置50之Y線性編碼器系統EY之測量値的指示,將Y粗動載台23Y以複數個Y線性馬達YDM在一對基座架14上以既定行程驅動於Y軸方向,X粗動載台23X與此Y粗動載台23Y一體既定行程移動於Y軸方向。又,重量消除裝置40與X粗動載台23X一體以既定行程移動於Y軸方向。此時,被重量消除裝置40從下方支承之X導件102則與Y粗動載台23Y同步被驅動。因此,重量消除裝置40恆被X導件102從下方支承。On the other hand, during the above Y stepping operation, the substrate stage device PST is based on the instruction of the measurement value of the Y linear encoder system EY from the main control device 50 to divide the Y coarse motion stage 23Y into plural Y The linear motor YDM is driven in the Y-axis direction with a predetermined stroke on the pair of base frames 14, and the X coarse motion stage 23X and the Y coarse motion stage 23Y move in the Y-axis direction integrally with a predetermined stroke. In addition, the weight elimination device 40 is integrated with the X coarse motion stage 23X to move in the Y-axis direction with a predetermined stroke. At this time, the X guide 102 supported by the weight elimination device 40 from below is driven in synchronization with the Y coarse motion stage 23Y. Therefore, the weight elimination device 40 is constantly supported by the X guide 102 from below.

如以上之説明,依據本實施形態之曝光裝置10,重量消除裝置40無論其XY平面之位置為何,恆被X導件102從下方支承。X導件102由於係由延伸於掃描方向之寬度窄的板狀構件構成,因此與使用例如具有能涵蓋重量消除裝置40之全移動範圍之大導引面之導件(例如以石材形成之平台)的情形相較,能使基板載台裝置PST輕量化。此外,上述具有大導引面之導件在大型基板之情形時加工及搬運會變得困難,但本實施形態之X導件102由於係由具有延伸於X軸方向之帶狀導引面之寬度窄的板狀構件構成,因此加工及搬運容易。As described above, according to the exposure apparatus 10 of this embodiment, the weight reduction apparatus 40 is always supported by the X guide 102 from below regardless of the position of the XY plane. Since the X guide 102 is composed of a narrow plate-shaped member extending in the scanning direction, it can be used with a guide having a large guide surface (such as a platform formed of stone) that can cover the full range of movement of the weight eliminating device 40 Compared with the case of ), the substrate stage device PST can be reduced in weight. In addition, the above-mentioned guide with a large guide surface will be difficult to process and transport in the case of a large substrate. However, the X guide 102 of this embodiment is composed of a belt-shaped guide surface extending in the X-axis direction. Since it is constructed with a narrow plate-shaped member, it is easy to process and transport.

此外,由於延伸於X軸方向之構件的X導件102係被一對底床12在複數處從下方支承,因此能抑制因X導件102之自重、或重量消除裝置40荷重而引起的彎曲。又,由於底床12之數量為二,因此與一個底床12之情形相較,能使二個底床12各個之尺寸小型化、輕量化。從而底床12之加工及搬運容易且能提升基板載台裝置PST組裝時之作業性。In addition, since the X guide 102 of the member extending in the X-axis direction is supported by a pair of bottom beds 12 from below in plural places, it is possible to suppress bending caused by the dead weight of the X guide 102 or the load of the weight removing device 40 . In addition, since the number of bottom beds 12 is two, compared with the case of one bottom bed 12, the size and weight of each of the two bottom beds 12 can be reduced. Therefore, the processing and transportation of the bed 12 are easy and the workability during assembly of the substrate stage device PST can be improved.

又,由於X導件102及將X導件102引導於Y軸方向之一對底床12皆為肋構造,因此輕量且易確保Z軸方向之剛性。從而,基板載台裝置PST之組裝作業亦較上述使用具有大導引面之導件的情形相較較佳。In addition, since the X guide 102 and the pair of bed 12 guiding the X guide 102 in the Y-axis direction are both ribbed structures, they are lightweight and easy to ensure rigidity in the Z-axis direction. Therefore, the assembly operation of the substrate stage device PST is also better than the above-mentioned case of using a guide with a large guide surface.

又,由於重量消除裝置40係以非接觸方式支承在X導件102上,因此因重量消除裝置40之移動而產生之振動不會傳遞至X導件102。從而,振動不會透過X導件102、一對底床12、基板載台架台19等而傳遞至例如投影光學系PL等,能以高精度進行曝光動作。又,由於X導件102係被包含固定於一對基座架14之Y固定子73的一對Y線性馬達82驅動於該Z軸方向之重心附近,因此不會產生繞X軸之力矩(俯仰力矩),此外,該驅動力之反力亦不會傳遞至基板載台架台19。從而,能以高精度進行曝光動作。In addition, since the weight reduction device 40 is supported on the X guide 102 in a non-contact manner, the vibration generated by the movement of the weight reduction device 40 is not transmitted to the X guide 102. Therefore, the vibration is not transmitted to, for example, the projection optical system PL through the X guide 102, the pair of bed 12, the substrate stage 19, etc., and the exposure operation can be performed with high accuracy. In addition, since the X guide 102 is driven near the center of gravity in the Z-axis direction by the pair of Y linear motors 82 that include the Y-fixers 73 fixed to the pair of base frames 14, no moment about the X-axis ( The pitching moment), in addition, the reaction force of the driving force will not be transmitted to the substrate stage 19. Therefore, the exposure operation can be performed with high accuracy.

由於,X導件102之Y軸方向移動係在不需要高度之定位精度的上述Y步進動作時進行,因此即使線性導引裝置之摩擦阻力或驅動產生之力矩作用於重量消除裝置40或X導件102,亦能在該Y步進動作後之X掃描動作之前,使起因於上述力矩之振動收斂。又,X導件102之Y軸方向驅動所造成之偏轉運動(繞Z軸之力矩,yawing),可藉由用以驅動X導件102之一對Y線性馬達82之驅動力差來嚴密的控制而加以抑制。Since the movement of the X guide 102 in the Y-axis direction is performed during the above-mentioned Y stepping motion that does not require high positioning accuracy, even if the frictional resistance of the linear guide device or the torque generated by the drive acts on the weight reduction device 40 or X The guide 102 can also converge the vibration caused by the above-mentioned moment before the X scanning operation after the Y stepping operation. In addition, the yaw movement (torque around the Z axis, yawing) caused by the Y-axis direction drive of the X guide 102 can be tightly controlled by the driving force difference between one of the X guides 102 and the Y linear motor 82 Control and restrain.

進一步的,由於本實施形態之粗動載台23(XY載台裝置)係在Y粗動載台23Y上搭載X粗動載台23X之構成,因此與例如在X粗動載台上搭載Y粗動載台之構成的習知XY載台裝置相較,於掃描方向之X軸方向以長行程移動之X粗動載台23X之慣性質量小。從而,於X掃描動作時地面F透過粗動載台23承受之驅動反力小。其結果,於X掃描動作時能抑制影響裝置全體之地面振動。相對於此,Y粗動載台23Y移動於Y軸方向時之驅動質量及驅動反力與上述習知XY載台裝置相較較大,但由於是不需要高精度定位之Y步進動作,因此地面振動對曝光動作之影響少。Furthermore, since the coarse motion stage 23 (XY stage device) of this embodiment is configured to mount the X coarse motion stage 23X on the Y coarse motion stage 23Y, it is different from, for example, the Y coarse motion stage mounted on the X coarse motion stage. Compared with the conventional XY stage device of the coarse motion stage, the inertial mass of the X coarse motion stage 23X that moves with a long stroke in the X-axis direction of the scanning direction is smaller. Therefore, the driving reaction force received by the ground surface F through the coarse motion stage 23 during the X scanning operation is small. As a result, it is possible to suppress floor vibration that affects the entire device during the X-scan operation. In contrast, the driving mass and driving reaction force when the Y coarse motion stage 23Y moves in the Y axis direction are larger than those of the above-mentioned conventional XY stage device, but because it is a Y stepping motion that does not require high-precision positioning, Therefore, ground vibration has little effect on the exposure action.

又,於粗動載台23,Y粗動載台23Y具有之一對X柱101係分別被配置在一對底床12間之輔助導件框103支承X方向中間部,因此能抑制因自重或X粗動載台23X之荷重造成之彎曲。從而,能提升固定在一對X柱101上之X線性導件80A之真直精度,而能以高精度將X粗動載台23X直進引導於X軸方向。又,與僅支承兩端部之情形相較,無需為了確保彎曲剛性而將一對X柱101分別作成堅固的構造(纖細之構件即可),可使其輕量化。 《第2實施形態》Moreover, in the coarse motion stage 23, the Y coarse motion stage 23Y has a pair of X-pillars 101. The auxiliary guide frame 103 is arranged between the pair of beds 12 to support the middle part in the X direction. Or the bending caused by the load of the X coarse motion stage 23X. Therefore, the straightness accuracy of the X linear guide 80A fixed on the pair of X columns 101 can be improved, and the X coarse motion stage 23X can be guided in the X axis direction with high precision. In addition, compared with the case where only the two ends are supported, the pair of X-pillars 101 need not be each made into a strong structure (a thin member) in order to ensure bending rigidity, and the weight can be reduced. "Second Embodiment"

其次,根據圖8~圖13説明第2實施形態。此處,與前述第1實施形態相同或同等之構成部分係使用相同或類似符號,並簡化或省略其説明。Next, the second embodiment will be described based on FIGS. 8 to 13. Here, the same or similar symbols are used for the same or similar components as those of the aforementioned first embodiment, and the description thereof is simplified or omitted.

圖8中概略顯示了第2實施形態之曝光裝置110之構成。曝光裝置110係以用於液晶顯示裝置(平板顯示器)之基板P為曝光對象物之步進掃描方式之投影曝光裝置、即所謂的掃描機(scanner)。FIG. 8 schematically shows the structure of the exposure apparatus 110 of the second embodiment. The exposure device 110 is a projection exposure device of a step-and-scan method using a substrate P used for a liquid crystal display device (flat panel display) as an exposure target, that is, a so-called scanner.

圖9係顯示圖8之曝光裝置110具有之基板載台裝置PSTa的俯視圖、圖10係圖9之D-D線剖面圖。此外,圖11係去除微動載台之基板載台裝置的俯視圖(圖10之E-E線剖面圖),圖12係圖9之F-F線剖面圖。又,圖13則係基板載台裝置PSTa具有之重量消除裝置的剖面圖。9 is a plan view showing the substrate stage device PSTa included in the exposure apparatus 110 of FIG. 8, and FIG. 10 is a cross-sectional view taken along the line D-D of FIG. 9. In addition, FIG. 11 is a plan view of the substrate stage device with the micro-movement stage removed (E-E line cross-sectional view of FIG. 10), and FIG. 12 is a cross-sectional view of F-F line in FIG. In addition, FIG. 13 is a cross-sectional view of the weight reduction device included in the substrate stage device PSTa.

比較圖8~圖13與前述第1實施形態之圖1~圖6可知,本第2實施形態之曝光裝置110,係取代前述基板載台裝置PST而設置基板載台裝置PSTa,此點與曝光裝置10不同。Comparing FIGS. 8 to 13 and FIGS. 1 to 6 of the foregoing first embodiment, it can be seen that the exposure device 110 of the second embodiment replaces the foregoing substrate stage device PST with a substrate stage device PSTa, which is similar to the exposure The device 10 is different.

基板載台裝置PSTa之整體構成雖與基板載台裝置PST相同,但取代重量消除裝置40設置重量消除裝置40’之點及X導件102之驅動系之構成與基板載台裝置PST部分相異等若干處,與基板載台裝置PST不同。以下,以相異點為中心加以説明。Although the overall structure of the substrate stage device PSTa is the same as that of the substrate stage device PST, the point where the weight reduction device 40' is installed instead of the weight reduction device 40 and the structure of the drive system of the X guide 102 are partly different from the substrate stage device PST It is different from the substrate stage device PST in several places. The following description focuses on the differences.

基板載台裝置PSTa,由圖8、圖10等可知,Y粗動載台23Y與X導件102於Z軸方向(鉛直方向)之位置(高度位置)部分重複。In the substrate stage device PSTa, as can be seen from FIGS. 8 and 10, the position (height position) of the Y coarse motion stage 23Y and the X guide 102 in the Z-axis direction (vertical direction) partially overlaps.

具體而言,基板載台裝置PSTa,如圖8及圖10所示,於一對X柱101各個之長邊方向兩側面(非兩端部近旁下面)固定有前述Y支架75。亦即,Y粗動載台23Y具有例如合計四個Y支架75。又,+X側的二個Y支架75之上面係以板片76加以機械性的連結,-X側的二個Y支架75之上面亦同樣的以板片76加以機械性的連結。此外,為易於理解,圖11中未圖示板片76。Specifically, as shown in FIG. 8 and FIG. 10, the substrate stage device PSTa has the aforementioned Y brackets 75 fixed to both sides (not the lower sides near both ends) in the longitudinal direction of each of the pair of X pillars 101. That is, the Y coarse motion stage 23Y has, for example, four Y brackets 75 in total. In addition, the upper surfaces of the two Y brackets 75 on the +X side are mechanically connected by the plates 76, and the upper surfaces of the two Y brackets 75 on the -X side are also mechanically connected by the plates 76. In addition, for ease of understanding, the plate 76 is not shown in FIG. 11.

又,作為重量消除裝置40’,例如圖10所示,係使用Z滑件43與調平裝置57被一體固定型之裝置。重量消除裝置40’搭載於X導件102上,其下半部插入X粗動載台23X之開口部内。又,圖8、圖10~圖12中,為避免圖之錯綜複雜,重量消除裝置40’及調平裝置57等係以示意方式顯示(詳細之構成參照圖13)。In addition, as the weight elimination device 40', as shown in Fig. 10, for example, a device in which the Z slider 43 and the leveling device 57 are integrally fixed is used. The weight elimination device 40' is mounted on the X guide 102, and its lower half is inserted into the opening of the X coarse motion stage 23X. In addition, in Figs. 8, 10 to 12, in order to avoid the intricacies of the drawings, the weight removing device 40' and the leveling device 57 are shown schematically (see Fig. 13 for the detailed structure).

重量消除裝置40’,如圖13所示,具有筐體41、空氣彈簧42、Z滑件43等。筐體41係由+Z側之面開口之有底筒狀構件構成。於筐體41之下面安裝有軸承面朝向-Z側之複數個基座墊44。於筐體41之外壁面固定有用以支承固定在微動載台21下面之複數個Z感測器52之靶46的複數個臂構件47。空氣彈簧42被收容在筐體41内部。從外部供應加壓氣體至空氣彈簧42。Z滑件43係由高度低於前述第1實施形態使用之Z滑件之延伸於Z軸方向的筒狀構件構成。Z滑件43插入筐體41内,搭載在空氣彈簧42上。Z滑件43係藉由於Z軸方向分離配置之一對包含與XY平面平行之板彈簧的平行板彈簧裝置48,連接於筐體41之内壁面。平行板彈簧裝置48係例如於Z滑件43之外周周圍(θz方向)以大致均等之間隔設有複數個(例如三個或四個)。Z滑件43藉由複數個板彈簧之於水平面平行方向之剛性(拉伸剛性),與筐體41一體沿XY平面移動。相對於此,Z滑件43可藉由板彈簧之柔軟性(可撓性)相對筐體41於Z軸方向微動。平行板彈簧裝置48具有之一對板彈簧係於Z軸方向分離,因此Z滑件43傾倒(往θx或θy方向之旋轉)受到抑制,實質上僅能於Z軸方向以微小行程相對筐體41移動。The weight elimination device 40', as shown in Fig. 13, has a housing 41, an air spring 42, a Z slider 43, and the like. The housing 41 is composed of a bottomed cylindrical member with an open surface on the +Z side. A plurality of base pads 44 whose bearing surfaces face the -Z side are mounted on the lower surface of the housing 41. A plurality of arm members 47 are fixed on the outer wall surface of the housing 41 to support the target 46 of the plurality of Z sensors 52 fixed under the micro-motion stage 21. The air spring 42 is housed in the housing 41. The air spring 42 is supplied with pressurized gas from the outside. The Z slider 43 is composed of a cylindrical member extending in the Z-axis direction that is lower in height than the Z slider used in the first embodiment. The Z slider 43 is inserted into the housing 41 and mounted on the air spring 42. The Z slider 43 is connected to the inner wall surface of the housing 41 by a pair of parallel leaf spring devices 48 including leaf springs parallel to the XY plane due to a separate arrangement in the Z axis direction. For example, a plurality of parallel plate spring devices 48 (for example, three or four) are provided at substantially equal intervals around the outer periphery of the Z slider 43 (thetaz direction). The Z slider 43 moves along the XY plane integrally with the housing 41 by the rigidity (tensile rigidity) parallel to the horizontal plane of a plurality of leaf springs. In contrast, the Z slider 43 can be slightly moved in the Z-axis direction relative to the housing 41 by the flexibility (flexibility) of the leaf spring. The parallel leaf spring device 48 has a pair of leaf springs separated in the Z-axis direction. Therefore, the Z slider 43 is suppressed from falling (rotation in the θx or θy direction), and can essentially only be opposed to the housing with a small stroke in the Z-axis direction. 41 moves.

調平裝置57係將微動載台21支承為可傾斜自如(相對XY平面於θx及θy方向擺動自如)之裝置,透過微動載台21下面形成之開口部21a,上半部插入微動載台21内。重量消除裝置40’藉由空氣彈簧42產生之重力方向朝上之力,透過Z滑件43及調平裝置57抵銷(消除)包含微動載台21之系的重量(重力方向朝下之力),據以降低複數個Z音圈馬達18Z之負荷。The leveling device 57 is a device that supports the micro-movement stage 21 to be tiltable (swing freely in the θx and θy directions relative to the XY plane), through the opening 21a formed under the micro-movement stage 21, the upper half is inserted into the micro-movement stage 21 Inside. The weight elimination device 40' uses the upward force of the gravity direction generated by the air spring 42 to offset (eliminate) the weight of the system including the micro-motion stage 21 (the downward force of the gravity direction through the Z slider 43 and the leveling device 57) ), so as to reduce the load of the plurality of Z voice coil motors 18Z.

調平裝置57包含+Z側之面開口之杯狀構件構成之調平杯49、插入調平杯49内徑側之多面體構件64、以及安裝在調平杯49内壁面之複數個空氣軸承65。調平杯49之下面透過板片68一體固定於Z滑件43之上面。又,於微動載台21之頂面安裝有為防止調平杯49脱落之複數個脱落防止裝置200。多面體構件64係由三角錐狀之構件構成,其前端部插入調平杯49内。多面體構件64之底面(朝向+Z側之面)透過間隔件51固定在微動載台21之頂面。空氣軸承65係在調平杯49之内壁面、繞θz以大致均等之間隔設有例如三個。調平裝置57藉由從複數個空氣軸承65對多面體構件64之側面噴射加壓氣體,以包含微動載台21之系之重心位置CG為旋轉中心、隔著微小間隙(空隙)以非接觸方式將微動載台21支承為可傾斜。又,為易於理解,圖13中顯示了例如三個空氣軸承65中二個的剖面(亦即,就調平裝置57而言,圖13並非與YZ平面平行之剖面的剖面圖)。The leveling device 57 includes a leveling cup 49 composed of a cup-shaped member with an opening on the +Z side, a polyhedron member 64 inserted into the inner diameter side of the leveling cup 49, and a plurality of air bearings 65 installed on the inner wall of the leveling cup 49. The lower surface of the leveling cup 49 is integrally fixed to the upper surface of the Z sliding member 43 through the plate 68. In addition, a plurality of fall-off prevention devices 200 for preventing the leveling cup 49 from falling off are installed on the top surface of the micro-motion stage 21. The polyhedral member 64 is composed of a triangular pyramid-shaped member, and the front end of the member is inserted into the leveling cup 49. The bottom surface (the surface facing the +Z side) of the polyhedral member 64 is fixed to the top surface of the micro-movement stage 21 through the spacer 51. The air bearings 65 are provided on the inner wall surface of the leveling cup 49 at approximately equal intervals around θz, for example, three. The leveling device 57 sprays pressurized gas from a plurality of air bearings 65 to the side surface of the polyhedral member 64, and uses the center of gravity position CG of the system including the micro-motion stage 21 as the center of rotation, with a small gap (clearance) interposed in a non-contact manner. The micro-movement stage 21 is supported to be tiltable. Moreover, for ease of understanding, FIG. 13 shows, for example, the cross-section of two of the three air bearings 65 (that is, as far as the leveling device 57 is concerned, FIG. 13 is not a cross-sectional view of a cross-section parallel to the YZ plane).

此處,當微動載台21往與XY平面平行之方向移動時,多面體構件64即與微動載台21一體往與XY平面平行之方向。此時,因空氣軸承65之軸承面與多面體構件64之間形成之氣體膜之剛性(靜壓),空氣軸承65被按壓向多面體構件64,據此,微動載台21與調平杯49即一體的與微動載台21往同方向移動。而由於調平杯49與Z滑件43係透過板片68固定,因此微動載台21與Z滑件43一體的移動於與水平面平行之方向。此外,如上所述,由於Z滑件43與筐體41係藉由複數個平行板彈簧裝置48連接,因此微動載台21與筐體41一體的移動於與水平面平行之方向。如此,微動載台21與重量消除裝置40’,包含被複數個音圈馬達18X、18Y微驅動之情形,恆一體的移動於與XY平面平行之方向。因此,本第2實施形態中,重量消除裝置40’與X粗動載台23X之間沒有設置前述連結裝置45。Here, when the fine movement stage 21 moves in a direction parallel to the XY plane, the polyhedron member 64 is integrated with the fine movement stage 21 in a direction parallel to the XY plane. At this time, due to the rigidity (static pressure) of the gas film formed between the bearing surface of the air bearing 65 and the polyhedral member 64, the air bearing 65 is pressed against the polyhedral member 64. Accordingly, the fine movement stage 21 and the leveling cup 49 are The unit moves in the same direction as the micro-movement stage 21. Since the leveling cup 49 and the Z slider 43 are fixed through the plate 68, the micro-movement stage 21 and the Z slider 43 move in a direction parallel to the horizontal plane as a whole. In addition, as described above, since the Z slider 43 and the housing 41 are connected by a plurality of parallel plate spring devices 48, the micro-movement stage 21 and the housing 41 move integrally in a direction parallel to the horizontal plane. In this way, the micro-movement stage 21 and the weight elimination device 40', including the case where they are micro-driven by a plurality of voice coil motors 18X, 18Y, move in a direction parallel to the XY plane. Therefore, in the second embodiment, the aforementioned coupling device 45 is not provided between the weight elimination device 40' and the X coarse motion stage 23X.

又,本第2實施形態中,導件本體102a之Z軸方向尺寸係設定為與X柱101之Z軸方向尺寸相等。此外,由圖9、圖10及圖12可知,導件本體102a係插在一對X柱101之間。亦即,X導件102之位置(鉛直方向之位置)與Y粗動載台23Y之Z位置是部分重複的。In the second embodiment, the dimension in the Z axis direction of the guide body 102a is set to be equal to the dimension in the Z axis direction of the X column 101. In addition, it can be seen from FIGS. 9, 10 and 12 that the guide body 102a is inserted between the pair of X-pillars 101. That is, the position of the X guide 102 (position in the vertical direction) and the Z position of the Y coarse motion stage 23Y partially overlap.

基板載台裝置PSTa之其他部分之構成與前述基板載台裝置PST相同。The structure of the other parts of the substrate stage device PSTa is the same as the aforementioned substrate stage device PST.

以上述方式構成之曝光裝置110,在步進掃描方式之曝光動作時、X掃描動作時、及X步進動作時使基板P移動於X軸方向之際,基板載台裝置PSTa,基本上,與前述第1實施形態相同之在Y粗動載台23Y上之X粗動載台23X之驅動、微動載台21與X粗動載台23X之同步驅動,係依據來自主控制裝置50之指示進行。不過,基板載台裝置PSTa中,重量消除裝置40’不被X粗動載台23X牽引,而是與微動載台21一起移動於X軸方向。又,上述X掃描動作及X步進動作時,雖會有微動載台21相對X粗動載台23X被微驅動於Y軸方向,而重量消除裝置40’之Y位置微幅變化之情形,但X導件102之寬度方向尺寸係被設定為即使重量消除裝置40’被微驅動於Y軸方向,基座墊44亦不致從X導件102上脱落。In the exposure device 110 configured as described above, when the substrate P is moved in the X-axis direction during the exposure operation of the step-and-scan method, the X-scan operation, and the X-step operation, the substrate stage device PSTa basically, The driving of the X coarse motion stage 23X on the Y coarse motion stage 23Y and the synchronous driving of the fine motion stage 21 and the X coarse motion stage 23X, which are the same as the first embodiment described above, are based on instructions from the main control device 50 get on. However, in the substrate stage device PSTa, the weight elimination device 40' is not pulled by the X coarse motion stage 23X, but moves together with the fine motion stage 21 in the X axis direction. In addition, during the aforementioned X scanning operation and X stepping operation, although the fine movement stage 21 is slightly driven in the Y-axis direction relative to the X coarse movement stage 23X, the Y position of the weight removing device 40' may slightly change. However, the width direction dimension of the X guide 102 is set so that even if the weight elimination device 40' is micro-driven in the Y axis direction, the base pad 44 will not fall off the X guide 102.

又,Y步進動作時,基板載台裝置PSTa,基本上,與前述第1實施形態相同之Y粗動載台23Y及X粗動載台23X之Y軸方向驅動、以及X粗動載台23X與微動載台21之同步驅動,係依據來自主控制裝置50之指示。不過,於基板載台裝置PSTa,重量消除裝置40’係與微動載台21一起移動於Y軸方向。此時,從下方支承重量消除裝置40’之X導件102係與Y粗動載台23Y同步被驅動。因此,重量消除裝置40’恆被X導件102從下方支承。Also, during the Y stepping operation, the substrate stage device PSTa is basically the same as the Y-axis direction driving of the Y coarse motion stage 23Y and the X coarse motion stage 23X and the X coarse motion stage which are the same as those of the first embodiment described above The synchronous driving of the 23X and the micro-motion stage 21 is based on the instruction from the main control device 50. However, in the substrate stage device PSTa, the weight reduction device 40' moves together with the fine movement stage 21 in the Y-axis direction. At this time, the X guide 102 supporting the weight elimination device 40' from below is driven in synchronization with the Y coarse motion stage 23Y. Therefore, the weight eliminating device 40' is constantly supported by the X guide 102 from below.

根據以上説明之本第2實施形態之曝光裝置110,能得到與前述第1實施形態之曝光裝置10同等的效果。除此之外,根據曝光裝置110,由於X導件102之Z位置(鉛直方向位置)與Y粗動載台23Y之Z位置部分重複,因此與例如在具有大導引面之導件上搭載重量消除裝置40’之情形相較,能縮短重量消除裝置40’之Z軸方向尺寸。此場合,由於能縮短筐體41及Z滑件43之Z軸方向尺寸,因此能使重量消除裝置40’輕量化。此外,當重量消除裝置40’得以輕量化時,用以微動載台21之致動器(複數個線性馬達及複數個音圈馬達)亦得以小型化。According to the exposure apparatus 110 of the second embodiment described above, the same effect as the exposure apparatus 10 of the aforementioned first embodiment can be obtained. In addition, according to the exposure apparatus 110, since the Z position (vertical position) of the X guide 102 and the Z position of the Y coarse motion stage 23Y partially overlap, it is similar to mounting on a guide with a large guide surface. Compared with the case of the weight elimination device 40', the Z-axis dimension of the weight elimination device 40' can be shortened. In this case, since the dimensions in the Z axis direction of the housing 41 and the Z slider 43 can be shortened, the weight reduction device 40' can be reduced in weight. In addition, when the weight reduction device 40' is reduced in weight, the actuators (a plurality of linear motors and a plurality of voice coil motors) used for the micro-movement stage 21 are also reduced in size.

又,由於重量消除裝置40’係對粗動載台23在振動上分離,因此能完全消除來自粗動載台23之振動傳遞而提升控制性能。再者,由於使重量消除裝置40’與微動載台21一體化而構造變得簡單,因此能更進一步的謀求輕量化並降低製造成本,故障率亦降低。此外,由於重量消除裝置40’與微動載台21之一體化使得微動載台21之重心位置CG降低,因此即使基板保持具PH大型化,亦能抑制重心位置的上升。In addition, since the weight elimination device 40' separates the coarse motion stage 23 in vibration, it can completely eliminate the transmission of vibration from the coarse motion stage 23 and improve the control performance. Furthermore, since the weight elimination device 40' is integrated with the micro-motion stage 21 to simplify the structure, it is possible to further reduce the weight and reduce the manufacturing cost, and the failure rate is also reduced. In addition, since the integration of the weight elimination device 40' and the micro-movement stage 21 reduces the center of gravity position CG of the micro-movement stage 21, even if the substrate holder PH is enlarged, the increase in the center of gravity position can be suppressed.

又,根據曝光裝置110,由於作為延伸於X軸方向之構件的X導件102被一對底床12在複數處從下方支承,因此能抑制X導件102之自重或包含重量消除裝置40之微動載台21之荷重造成的彎曲。In addition, according to the exposure apparatus 110, since the X guide 102, which is a member extending in the X-axis direction, is supported from below in plural places by the pair of beds 12, the self-weight of the X guide 102 can be suppressed or the weight reduction device 40 can be included. The bend caused by the load of the micro-motion stage 21.

又,由於重量消除裝置40’與粗動載台23是分離的,因此重量消除裝置40之移動引起之振動不會傳遞至X導件102。從而,振動不會經由X導件102、一對底床12、基板載台架台19等而傳遞至例如投影光學系等,能以高精度進行曝光動作。 《第3實施形態》In addition, since the weight elimination device 40' is separated from the coarse motion stage 23, the vibration caused by the movement of the weight elimination device 40 will not be transmitted to the X guide 102. Therefore, the vibration is not transmitted to, for example, the projection optical system through the X guide 102, the pair of bottom beds 12, the substrate stage 19, etc., and the exposure operation can be performed with high accuracy. "The third embodiment"

其次,根據圖14~圖16說明第3實施形態。第3實施形態之基板載台裝置PSTb,除X導件102之驅動方法不同外,具有與上述第2實施形態之基板載台裝置PSTa(參照圖9等)大致相同之構成,因此與第2實施形態相同或同等之構成部分係使用相同或類似符號,並簡化或省略其説明。Next, the third embodiment will be described based on FIGS. 14 to 16. The substrate stage device PSTb of the third embodiment has substantially the same structure as the substrate stage device PSTa (see FIG. 9 etc.) of the second embodiment, except for the difference in the driving method of the X guide 102, and is therefore similar to the second embodiment. The same or similar components in the embodiment are given the same or similar symbols, and their description is simplified or omitted.

相對於上述第2實施形態中,Y支架75係固定在X柱101之兩側面,本第3實施形態中,如圖15所示,Y支架75係與前述曝光裝置10同樣的,固定在X柱101之下面。因此,基座架14(為求方便,使用相同符號)與上述第2實施形態相較,其高度較低。據此,可使基板載台裝置PSTb之構成更為精簡。In contrast to the above-mentioned second embodiment, the Y bracket 75 is fixed on both sides of the X column 101. In the third embodiment, as shown in FIG. 15, the Y bracket 75 is fixed to the X Below column 101. Therefore, the base frame 14 (for convenience, the same symbols are used) has a lower height than the second embodiment described above. According to this, the structure of the substrate stage device PSTb can be simplified.

又,相較於上述第1、第2實施形態中X導件102係以一對Y線性馬達82以電磁方式加以驅動,本第3實施形態中,X導件102則係如圖14所示,在長邊方向之兩端部近旁,分別透過連接構件199以一對被稱為撓曲(flexure)裝置107之裝置機械性的連接於X柱101。又,為易於理解,圖14中連結一對X柱101之一對板片76(參照圖9)及微動載台21(參照圖8)並未圖示。In addition, compared to the above-mentioned first and second embodiments, the X guide 102 is electromagnetically driven by a pair of Y linear motors 82. In the third embodiment, the X guide 102 is shown in FIG. 14 In the vicinity of both ends in the longitudinal direction, a pair of devices called flexure devices 107 is mechanically connected to the X-pillar 101 through the connecting member 199, respectively. In addition, for ease of understanding, one pair of plates 76 (refer to FIG. 9) and the micro-movement stage 21 (refer to FIG. 8) connecting a pair of X pillars 101 are not shown in FIG.

各撓曲裝置107,包含配置成與XY平面平行、延伸於Y軸方向之薄鋼板(例如板彈簧),透過球接頭等之鉸接裝置架設在X柱101與X導件102之間。各撓曲裝置107藉由鋼板之Y軸方向剛性,於Y軸方向將X柱101與X導件102以高剛性加以連結。因此,X導件102透過撓曲裝置107被一對X柱101中之一方牽引而與Y粗動載台23Y一體往Y軸方向。相對於此,各撓曲裝置107藉由鋼板之柔軟性(或可撓性)及鉸接裝置之作用,除Y軸方向以外之5自由度方向使X導件102相對X柱101不受拘束,因此振動不易透過X柱101傳遞至X導件102。此外,複數個撓曲裝置107係在與包含X導件102之重心位置之XY平面平行的平面内將一對X柱101與X導件102加以連結。因此,牽引X導件102時,不會有θx方向之力矩作用於X導件102。Each flexure device 107 includes a thin steel plate (such as a leaf spring) arranged parallel to the XY plane and extending in the Y axis direction, and is erected between the X column 101 and the X guide 102 through a hinge device such as a ball joint. Each flexure device 107 connects the X column 101 and the X guide 102 with high rigidity in the Y axis direction by the rigidity of the steel plate in the Y axis direction. Therefore, the X guide 102 is pulled by one of the pair of X columns 101 through the flexure device 107, and is integrated with the Y coarse motion stage 23Y in the Y axis direction. In contrast to this, each flexure device 107 uses the softness (or flexibility) of the steel plate and the action of the hinge device to allow the X guide 102 to be unconstrained relative to the X column 101 in the direction of 5 degrees of freedom except the Y axis direction. Therefore, the vibration is not easily transmitted to the X guide 102 through the X column 101. In addition, a plurality of flexure devices 107 connect a pair of X columns 101 and X guide 102 in a plane parallel to the XY plane including the position of the center of gravity of the X guide 102. Therefore, when the X guide 102 is pulled, no moment in the θx direction will act on the X guide 102.

本第3實施形態之基板載台裝置PSTb,除第2實施形態之基板載台裝置PSTa所能獲得之效果外,係作成透過撓曲裝置107由X柱101牽引X導件102之構成,因此例如與設置用以驅動X導件102之致動器之情形相較,成本較低。此外,亦無需用以求出X導件102之位置資訊的測量系(例如線性編碼器等)。又,與第2實施形態相較,可將X導件102之X軸方向尺寸縮短,因此可降低成本。再者,一對基座架14與第2實施形態相較,係配置在X軸方向兩内側,因此可使裝置精簡。The substrate stage device PSTb of the third embodiment, in addition to the effects that can be obtained by the substrate stage device PSTa of the second embodiment, is configured to pull the X guide 102 by the X column 101 through the flexure device 107, so For example, compared with the case where an actuator for driving the X guide 102 is provided, the cost is lower. In addition, there is no need for a measurement system (such as a linear encoder, etc.) for obtaining the position information of the X-guide 102. In addition, compared with the second embodiment, the size of the X guide 102 in the X axis direction can be shortened, so that the cost can be reduced. Furthermore, the pair of base frames 14 are arranged on both inner sides in the X-axis direction compared with the second embodiment, so the device can be simplified.

又,由於撓曲裝置107具有Y軸方向以外之剛性極低的構造(形狀及材料),因此Y軸方向以外之力之傳遞造成之振動不易傳至X導件102,故微動載台21之控制性佳。即使,Y軸方向之振動侵入X導件102,亦因設置在重量消除裝置40’下面之氣體靜壓軸承的基座墊44,使X導件102與重量消除裝置40’在水平方向之力之傳遞上斷開,因此不會對微動載台21造成影響。又,由於X導件102與底床12係藉由Y線性導件71A而抑制了Y軸方向之力之連續(Y軸方向之力被釋放),因此不會對底床12(裝置本體)造成影響。同樣的,當然亦可使用一對撓曲裝置107將前述第1實施形態之基板載台裝置PST之一對X柱101與X導件102加以連接。 《第4實施形態》In addition, since the flexure device 107 has a structure (shape and material) with extremely low rigidity other than the Y-axis direction, the vibration caused by the transmission of the force other than the Y-axis direction is not easily transmitted to the X guide 102, so the micro-movement stage 21 Good controllability. Even if the vibration in the Y-axis direction penetrates the X guide 102, the force of the X guide 102 and the weight reduction device 40' in the horizontal direction is caused by the base pad 44 of the aerostatic bearing provided under the weight reduction device 40'. The transmission is disconnected, so it will not affect the micro-motion stage 21. In addition, since the X guide 102 and the bed 12 are suppressed by the Y linear guide 71A from the continuity of the force in the Y-axis direction (the force in the Y-axis direction is released), the bed 12 (device body) is not affected. Make an impact. Similarly, of course, a pair of flexure devices 107 can also be used to connect the X column 101 and the X guide 102, one of the substrate stage devices PST of the first embodiment. "Fourth Embodiment"

其次,根據圖17說明第4實施形態。第4實施形態之基板載台裝置PSTc,除X導件102之驅動方法不同點外,具有與上述第2實施形態之基板載台裝置PSTa(參照圖9等)大致相同之構成,因此針對與第2實施形態相同或同等之構成部分係使用相同或類似符號,並簡化或省略其説明。Next, the fourth embodiment will be described based on FIG. 17. The substrate stage device PSTc of the fourth embodiment has almost the same structure as the substrate stage device PSTa (see FIG. 9 etc.) of the second embodiment except for the difference in the driving method of the X guide 102. The same or similar components in the second embodiment are given the same or similar symbols, and their descriptions are simplified or omitted.

如圖17所示,於基板載台裝置PSTc,一對X柱101分別在彼此對向之對向面具有二個在X軸方向分離之推進(pusher)裝置108。亦即,推進裝置108合計設有四個。各推進裝置108具有與X導件102之+Y側側面或-Y側側面對向之鋼球。一般情況下,鋼球係與X導件102分離,於基板載台裝置PSTc當Y粗動載台23Y被驅動於Y軸方向時,被推進裝置108按壓而使X導件102被按壓,據此,Y粗動載台23Y與X導件102即一體的往Y軸方向移動。又,各推進裝置108並一定必須設於X柱101,亦可設在例如Y支架75之X軸方向内側且Y軸方向内側,來按壓X導件102。As shown in FIG. 17, in the substrate stage device PSTc, a pair of X-pillars 101 respectively have two pushers 108 separated in the X-axis direction on opposing surfaces facing each other. That is, there are four propulsion devices 108 in total. Each propulsion device 108 has a steel ball facing the +Y side or -Y side of the X guide 102. In general, the steel ball is separated from the X guide 102. When the Y coarse motion stage 23Y is driven in the Y axis direction in the substrate stage device PSTc, it is pressed by the pushing device 108 and the X guide 102 is pressed. Therefore, the Y coarse motion stage 23Y and the X guide 102 move in the Y-axis direction integrally. In addition, each propulsion device 108 does not necessarily have to be provided on the X column 101, and may be provided, for example, on the X-axis direction inner side and the Y-axis direction inner side of the Y bracket 75 to press the X guide 102.

又,於基板載台裝置PSTc,Y粗動載台23Y使X導件102Y步進移動至既定位置後,為防止振動傳遞而被驅動向離開X導件102之方向,據此,Y粗動載台23Y與X導件102即在振動上分離。作為使Y粗動載台23Y與X導件102在振動上分離之方法,例如可適當的微驅動X柱101,亦可於推進裝置108設置將鋼球微驅動於Y軸方向之未圖示的氣缸等致動器。此外,作為推進裝置,亦可取代鋼球而設置可繞Z軸或X軸旋轉約90°之旋轉橢圓體,藉由使該旋轉橢圓體適當的旋轉,以使X導件102與Y粗動載台23Y之Y軸方向間隙為可變(藉由旋轉橢圓體之旋轉量來切換接觸狀態與非接觸狀態)。In addition, in the substrate stage device PSTc, the Y coarse movement stage 23Y moves the X guide 102Y step by step to a predetermined position, and is driven in a direction away from the X guide 102 in order to prevent the transmission of vibration. Accordingly, Y coarse movement The carrier 23Y and the X guide 102 are separated in vibration. As a method of separating the Y coarse motion stage 23Y from the X guide 102 in vibration, for example, the X column 101 can be appropriately micro-driven, or the propulsion device 108 can be installed to micro-drive the steel ball in the Y-axis direction (not shown) The cylinder and other actuators. In addition, as a propulsion device, instead of a steel ball, a spheroid that can rotate about 90° around the Z axis or the X axis can be provided. By rotating the ellipsoid appropriately, the X guide 102 and the Y can be moved coarsely. The Y-axis direction gap of the stage 23Y is variable (the contact state and the non-contact state are switched by the amount of rotation of the spheroid).

本第4實施形態,在除了X導件102之掃描交叉方向移動時以外之曝光動作時,X柱101與X導件102間之機械性連結不存在,可完全的防止干擾進入X導件102。同樣的,於前述第1實施形態之基板載台裝置PST,當然亦可於一對X柱101與X導件102之任一者設置推進裝置108。In the fourth embodiment, during exposure operations other than when the X guide 102 is moved in the scanning cross direction, the mechanical connection between the X column 101 and the X guide 102 does not exist, which can completely prevent interference from entering the X guide 102 . Similarly, in the substrate stage device PST of the aforementioned first embodiment, it is of course also possible to provide the propulsion device 108 on any one of the pair of X pillars 101 and the X guide 102.

又,上述第1~第4實施形態之曝光裝置所具備之基板載台裝置之構成僅為一例,其構成不限定於此。以下,說明基板載台裝置具有之重量消除裝置及調平裝置之變形例。又,以下之説明中,為求説明之簡化及圖示之方便,僅對調平裝置與重量消除裝置進行説明,針對與上述第2實施形態具有相同構成者係賦予與上述第2實施形態相同之符號並省略其説明。 《第1變形例》In addition, the structure of the substrate stage device included in the exposure apparatus of the above-mentioned first to fourth embodiments is only an example, and the structure is not limited to this. Hereinafter, modified examples of the weight reduction device and the leveling device included in the substrate stage device will be described. In addition, in the following description, for the sake of simplification of the description and convenience of the illustration, only the leveling device and the weight elimination device are described, and those having the same configuration as the second embodiment described above are given the same as those of the second embodiment described above. Symbol and its description is omitted. "First Modification"

圖18中顯示了第1變形例之基板載台裝置所具有之重量消除裝置40A及調平裝置57A。第1變形例中,調平裝置57A與重量消除裝置40A雖具有與第2實施形態相同的構成,但係調平裝置57A從下方支承重量消除裝置40A之配置(亦即,係第2實施形態中之調平裝置57與重量消除裝置40’之配置在上下方向互換之形態)。具體而言,於多面體構件64之上面連接筐體41之下面。又,圖18中雖予以省略,但重量消除裝置40A之Z滑件43上面,透過間隔件51固定有微動載台21。FIG. 18 shows the weight reduction device 40A and the leveling device 57A included in the substrate stage device of the first modification. In the first modification, the leveling device 57A and the weight reduction device 40A have the same configuration as the second embodiment, but the leveling device 57A supports the weight reduction device 40A from below (that is, the second embodiment The arrangement of the leveling device 57 and the weight elimination device 40' in the middle is interchangeable in the vertical direction). Specifically, the upper surface of the polyhedral member 64 is connected to the lower surface of the housing 41. In addition, although omitted in FIG. 18, the micro-motion stage 21 is fixed to the upper surface of the Z slider 43 of the weight reduction device 40A through the spacer 51.

第1變形例之基板載台裝置與上述各實施形態相較,因將重量消除裝置40A設置在調平裝置57A上方,使得多面體構件64與基座墊44間之零件減少而重量減輕,在掃描時等之水平移動時的多面體構件64以下(從多面體構件64至基座墊44)之慣性質量變小,其重心位置接近驅動點(多面體構件64與空氣軸承65之接觸點),因此θx、θy方向之剛性變高(不易擺動),控制性獲得提升。 《第2變形例》Compared with the above-mentioned embodiments, the substrate stage device of the first modification example has the weight elimination device 40A installed above the leveling device 57A, so that the parts between the polyhedral member 64 and the base pad 44 are reduced and the weight is reduced. The inertial mass of the polyhedral member 64 or less (from the polyhedral member 64 to the base pad 44) during horizontal movement of the time and the like becomes smaller, and its center of gravity is close to the driving point (the contact point between the polyhedral member 64 and the air bearing 65), so θx, The rigidity in the θy direction becomes higher (not easy to swing), and the controllability is improved. "Second Modification"

圖19中顯示了第2變形例之基板載台裝置所具有之重量消除裝置40B及調平裝置57B。第2變形例中,除了空氣彈簧42與Z滑件43(亦含平行板彈簧裝置48)之位置在上下方向互換以外,與第1變形例(參照圖18)為相同構成。重量消除裝置40B中,筐體41B係由下面開口之有底筒狀構件構成,其上面固定於微動載台21(圖19中未圖示)而成一體。FIG. 19 shows the weight reduction device 40B and the leveling device 57B included in the substrate stage device of the second modification. In the second modification, except that the positions of the air spring 42 and the Z slider 43 (including the parallel plate spring device 48) are interchanged in the vertical direction, the configuration is the same as the first modification (see FIG. 18). In the weight elimination device 40B, the housing 41B is composed of a bottomed cylindrical member with a bottom opening, and the upper surface is fixed to a micro-movement stage 21 (not shown in FIG. 19) to form an integral body.

第2變形例之基板載台裝置,除第1變形例之基板載台裝置可獲得之效果外,由於平行板彈簧裝置48之位置變低,配置在更接近重量消除裝置40B之重心的位置,因此曝光動作之安定性獲得提升。 《第3變形例》In addition to the effects obtained by the substrate stage device of the first modification example, the substrate stage device of the second modification example has a lower position of the parallel plate spring device 48 and is arranged closer to the center of gravity of the weight reduction device 40B. Therefore, the stability of the exposure action is improved. "The third modification"

圖20中顯示了第3變形例之基板載台裝置所具有之重量消除裝置40C。重量消除裝置40C係由上面開口之有底筒狀構件的主體41C、收容在主體41C内之空氣彈簧42、連接在空氣彈簧42上面之調平杯49、複數個空氣軸承65、以及固定在未圖示之微動載台21的多面體構件64等構成。第3變形例中,排除了Z滑件,構成為直接以空氣彈簧42將調平杯49之下面壓向Z軸方向。於主體41C之外壁面固定有用以支承靶46之複數個臂構件47。FIG. 20 shows a weight reduction device 40C included in the substrate stage device of the third modification. The weight reduction device 40C is composed of a main body 41C of a bottomed cylindrical member with an upper opening, an air spring 42 housed in the main body 41C, a leveling cup 49 connected to the air spring 42, a plurality of air bearings 65, and a The illustrated micro-movement stage 21 includes a polyhedral member 64 and the like. In the third modification, the Z slider is eliminated, and the air spring 42 directly presses the lower surface of the leveling cup 49 in the Z-axis direction. A plurality of arm members 47 for supporting the target 46 are fixed to the outer wall surface of the main body 41C.

調平杯49,除了具有與上述第2實施形態等相同之功能外,亦具有上述第2實施形態等中之Z滑件43(參照圖13)之功能。因此,於調平杯49之外周部上端面及下端面連接有複數個(例如在上端面及下端面,於周方向均等的分別有各四個)平行板彈簧67e(不過,為避免圖之錯綜複雜,配置在±X側之平行板彈簧67e未圖示)。如此,調平杯49相對於主體41C之水平方向之相對受到限制、且僅能上下滑動。The leveling cup 49 has the same function as the above-mentioned second embodiment and the like, but also has the function of the Z slider 43 (see FIG. 13) in the above-mentioned second embodiment and the like. Therefore, a plurality of parallel plate springs 67e are connected to the upper end surface and the lower end surface of the outer peripheral portion of the leveling cup 49 (for example, the upper end surface and the lower end surface have four equal in the circumferential direction) parallel plate spring 67e (however, to avoid the Intricately, the parallel plate spring 67e arranged on the ±X side is not shown). In this way, the relative horizontal direction of the leveling cup 49 with respect to the main body 41C is restricted, and can only slide up and down.

第3變形例之基板載台裝置與上述各實施形態相較,由於無需Z滑件,因此重量消除裝置40C之構造變得單純,輕量且造價便宜。Compared with the above-described embodiments, the substrate stage device of the third modification does not require a Z slider, so the structure of the weight reduction device 40C becomes simple, lightweight, and inexpensive.

又,由於將設置在多面體構件64下部,作動時會擺動(振動)之零件中較大、且Z軸方向尺寸較大之調平杯49之上下端面附近,以平行板彈簧67e連接成相對主體41C於水平方向無法移動,因此多面體構件64下部之θx、θy方向剛性變高,藉由抑制水平移動時之慣性造成之多面體構件64下部零件之振動,使得控制性獲得提升。In addition, since it will be installed at the lower part of the polyhedral member 64, the larger part that will swing (vibrate) during operation and the larger dimension in the Z-axis direction is near the upper and lower end surfaces of the leveling cup 49, which is connected to the opposite main body by a parallel plate spring 67e 41C cannot move in the horizontal direction, so the rigidity in the θx and θy directions of the lower part of the polyhedron member 64 becomes higher. By suppressing the vibration of the lower part of the polyhedron member 64 caused by the inertia during horizontal movement, the controllability is improved.

又,由於平行板彈簧67e之作用,調平杯49係在相對主體41C維持高真直度之狀態下僅移動於Z方向,因此調平杯49之底面與空氣彈簧42之上面(金属板片)可不固定,而能容易的進行組裝及拆解,作業性可提升。In addition, due to the action of the parallel plate spring 67e, the leveling cup 49 moves only in the Z direction while maintaining a high degree of straightness relative to the main body 41C. Therefore, the bottom surface of the leveling cup 49 and the upper surface of the air spring 42 (metal plate) Can not be fixed, but can be easily assembled and disassembled, and the workability can be improved.

又,由於以空氣彈簧42進行之Z軸方向驅動及以多面體構件64進行之調平驅動(θx、θy)可獨立的控制(不干涉),因此控制性佳。In addition, since the Z-axis driving by the air spring 42 and the leveling driving (θx, θy) by the polyhedral member 64 can be independently controlled (without interference), the controllability is good.

又,上述各變形例之重量消除裝置40A~40C不限於XY雙軸載台,亦可適用於X軸(或Y軸)單方向之單軸載台、或在X粗動載台上搭載Y粗動載台之習知XY雙軸載台裝置。In addition, the weight elimination devices 40A-40C of the above-mentioned modification examples are not limited to XY dual-axis stages, and can also be applied to X-axis (or Y-axis) unidirectional single-axis stages, or to mount Y on the X coarse motion stage. The conventional XY dual-axis stage device for coarse motion stage.

又,上述第2~第4實施形態(及上述各變形例)中,雖然重量消除裝置之Z滑件43或調平杯49係因配置複數個平行板彈簧裝置48而僅能移動於Z軸方向,但不限於此,亦可使用例如空氣軸承或滾動導件等。In addition, in the above-mentioned second to fourth embodiments (and the above-mentioned modifications), although the Z slider 43 or the leveling cup 49 of the weight reduction device is arranged with a plurality of parallel plate spring devices 48, it can only move on the Z axis. The direction, but not limited to this, can also use, for example, air bearings or rolling guides.

又,上述第2~第4實施形態(及上述各變形例)中,雖係作成在Y粗動載台23Y上裝載X粗動載台23X之構成,但不限於此,若僅著眼於使重量消除裝置40之小型化、與微動載台21之一體化的話,粗動載台23可與習知裝置相同的,在X粗動載台23X上裝載Y粗動載台23Y。此時,即成為在將本實施形態所使用之X導件102配置成以Y軸方向為長邊方向之構件(假設為Y導件)上,重量消除裝置40步進移動於Y軸方向、或於掃描方向之X軸方向則與Y導件整個移動。In addition, in the above-mentioned second to fourth embodiments (and each of the above-mentioned modifications), although the X coarse-movement stage 23X is mounted on the Y coarse-movement stage 23Y, it is not limited to this. If the weight reduction device 40 is miniaturized and integrated with the fine movement stage 21, the coarse movement stage 23 can be the same as the conventional device, and the Y coarse movement stage 23Y can be mounted on the X coarse movement stage 23X. At this time, the X guide 102 used in this embodiment is arranged with the Y-axis direction as the longitudinal direction of the member (assumed as the Y guide), and the weight reduction device 40 moves stepwise in the Y-axis direction. Or the X-axis in the scanning direction moves with the Y guide.

又,上述第2~第4實施形態(及上述各變形例)中,X導件102係透過一對底床12設置在裝置本體(主體)之一部分之基板載台架台19上,但不限於此,亦可如圖22所示之基板載台裝置PSTd,於基板載台架台19上直接固定複數個Y線性導件71A。如此,即能省略底床12(參照圖8),使曝光裝置全體之重量更為輕量化,進而降低全高(Z軸方向尺寸)。上述第1實施形態,亦相同。In addition, in the above-mentioned second to fourth embodiments (and the above-mentioned modification examples), the X guide 102 is provided on the substrate stage 19 of a part of the apparatus body (main body) through a pair of bottom beds 12, but it is not limited to Therefore, the substrate stage device PSTd as shown in FIG. 22 can also directly fix a plurality of Y linear guides 71A on the substrate stage 19. In this way, the bottom bed 12 (refer to FIG. 8) can be omitted, the weight of the entire exposure apparatus can be reduced, and the overall height (dimension in the Z-axis direction) can be reduced. The same applies to the first embodiment described above.

又,上述第1至第4實施形態之各個(以下,稱各實施形態)中,係以二個底床12從下方支承X導件102,但不限於此,底床12之數量亦可以是三個以上。此場合,亦可增加配置在相鄰底床12間之輔助導件框103。又,在基板P於X軸方向之移動量較小之場合(或基板P本身為小型之場合),底床12可以是一個。又,底床12之形狀雖係設定為Y軸方向之長度較X軸方向之長度長,但不限定於此,亦可作成X方向之長度較長。再者,、複數個底床可於X軸、及/或Y軸方向分離。In addition, in each of the above-mentioned first to fourth embodiments (hereinafter referred to as each embodiment), the X guide 102 is supported from below by two bottom beds 12, but it is not limited to this. The number of bottom beds 12 may also be More than three. In this case, the auxiliary guide frame 103 arranged between the adjacent bottom beds 12 can also be added. In addition, when the amount of movement of the substrate P in the X-axis direction is small (or when the substrate P itself is small), there may be one bed 12. Moreover, although the shape of the bed 12 is set so that the length in the Y-axis direction is longer than the length in the X-axis direction, it is not limited to this, and the length in the X direction may be made longer. Furthermore, a plurality of beds can be separated in the X-axis and/or Y-axis directions.

又,在X導件102之彎曲小至可忽視程度之情形時,可不設置輔助導件框103。In addition, when the bending of the X guide 102 is so small that it can be ignored, the auxiliary guide frame 103 may not be provided.

又,上述各實施形態中,雖係構成為於一對底床12上固定複數個Y線性導件71A,X導件102沿該複數個Y線性導件71A移動於Y軸方向,但不限於此,亦可在例如X導件102之下面設置複數個氣體靜壓軸承或滾輪等之轉動體,以在底床12上以低摩擦移動。不過,為了將Y可動子72A與Y固定子73間之間隔保持一定,最好是能設置限制X導件102相對一對底床12往X軸方向移動之某種裝置。作為限制X導件102往X軸方向移動之裝置,可使用例如氣體靜壓軸承或機械性的單軸導引裝置等。如此,即無需用以將複數個Y線性導件71A配置成彼此平行之位置調整作業,基板載台裝置之組裝變得容易。In addition, in each of the above embodiments, although a plurality of Y linear guides 71A are fixed on a pair of bed 12, the X guide 102 moves in the Y axis direction along the plurality of Y linear guides 71A, but it is not limited to Therefore, for example, a plurality of rotating bodies such as aerostatic bearings or rollers can be arranged under the X guide 102 to move on the bed 12 with low friction. However, in order to keep the interval between the Y movable element 72A and the Y stator 73 constant, it is preferable to provide a device that restricts the X guide 102 from moving in the X axis direction relative to the pair of beds 12. As a device for restricting the movement of the X guide 102 in the X-axis direction, for example, a gas static pressure bearing or a mechanical uniaxial guide device can be used. In this way, there is no need to adjust the position of the plurality of Y linear guides 71A parallel to each other, and the assembly of the substrate stage device becomes easy.

又,亦可將使X導件102與Y滑件71B於X軸方向可相對移動微距離之裝置(離隙裝置),設置在例如X導件102與Y滑件71B之間。此場合,即使複數個Y線性導件71A彼此未配置成平行,X導件102亦能在複數個Y線性導件71A上順暢的直進於Y軸方向。作為可使X導件102與Y滑件71B相對移動於X軸方向之裝置,可使用例如鉸鏈裝置等。同樣的離隙裝置,可設於其他線性導引裝置。此外,亦可同樣的設置使一對X柱101與Y支架75於X軸方向相對移動微距離之裝置。此場合,即使一對基座架14未配置成平行,亦能將一對X柱101順暢的直進引導於Y軸方向。In addition, a device (relief device) that enables the X guide 102 and the Y slider 71B to be relatively movable in the X-axis direction by a small distance (relief device) may be provided, for example, between the X guide 102 and the Y slider 71B. In this case, even if the plurality of Y linear guides 71A are not arranged parallel to each other, the X guide 102 can smoothly move straight in the Y axis direction on the plurality of Y linear guides 71A. As a device capable of relatively moving the X guide 102 and the Y slider 71B in the X-axis direction, for example, a hinge device can be used. The same relief device can be installed in other linear guide devices. In addition, a device for relatively moving a pair of X pillars 101 and Y bracket 75 in the X-axis direction by a small distance can also be installed in the same manner. In this case, even if the pair of base frames 14 are not arranged in parallel, the pair of X-pillars 101 can be smoothly guided in the Y-axis direction.

又,如圖21(A)所示,上述第1或第2實施形態中,亦可於X導件102之兩端部安裝XZ剖面分別為J字形及倒J字形之一對Y支架83,再於該等Y支架83之各個固定Y可動子72A。此場合,Y固定子73(圖1,參照圖8)所具有之磁石單元與Y可動子72A所具有之線圈單元之間之磁吸力均等的作用於基座架14,可防止基座架14之傾倒。此外,用以驅動X導件102之推力亦提升。又,上述第1、第2實施形態中,複數個線性馬達皆為動圈方式,但不限於此,亦可以是動磁方式。又,上述第2實施形態以外之實施形態中,作為將Y支架75驅動於Y軸方向之驅動裝置,不限於線性馬達,可使用例如滾珠螺桿式驅動裝置、帶式驅動裝置、或齒條與小齒輪式驅動裝置等。In addition, as shown in FIG. 21(A), in the above-mentioned first or second embodiment, a pair of Y brackets 83 with a J-shape and an inverted J-shape in the XZ cross-section can also be installed on both ends of the X guide 102. Then, the Y movable element 72A is fixed to each of the Y brackets 83. In this case, the magnetic attraction force between the magnet unit of the Y stator 73 (FIG. 1, refer to FIG. 8) and the coil unit of the Y movable member 72A is equally applied to the base frame 14, which prevents the base frame 14 The dumping. In addition, the thrust used to drive the X guide 102 is also increased. In addition, in the above-mentioned first and second embodiments, the plural linear motors are all of the moving coil type, but it is not limited to this, and it may be a moving magnet type. In addition, in embodiments other than the above-mentioned second embodiment, the drive device for driving the Y bracket 75 in the Y axis direction is not limited to a linear motor. For example, a ball screw drive device, a belt drive device, or a rack and pinion can be used. Pinion type driving device, etc.

又,上述第1、第2實施形態中,固定於基座架14之Y固定子73(圖1,參照圖8)雖係共用於用以驅動X導件102之Y線性馬達、及用以驅動Y粗動載台23Y之Y線性馬達,但亦可將各個之Y線性馬達分別構成。此外,亦可將用以驅動Y粗動載台23Y之Y線性馬達之Y固定子固定於輔助導件框103,於輔助支架78安裝Y可動子。In addition, in the above-mentioned first and second embodiments, the Y stator 73 (FIG. 1, refer to FIG. 8) fixed to the base frame 14 is commonly used to drive the Y linear motor of the X guide 102 and to The Y linear motor that drives the Y coarse motion stage 23Y, but each Y linear motor can also be configured separately. In addition, the Y stator used to drive the Y linear motor of the Y coarse motion stage 23Y can be fixed to the auxiliary guide frame 103, and the Y movable element can be installed on the auxiliary bracket 78.

又,上述第1、第2實施形態中,一對X柱101雖係於X方向兩端部例如以板片76加以機械性的連結,但不限於此,但亦可例如藉由具有與X柱101相同程度剖面積之構件加以連結。此外,X導件102(導件本體102a)之Z軸尺寸可大於一對X柱101各自之Z軸尺寸。此場合,可更為縮短重量消除裝置40之Z軸尺寸。In addition, in the above-mentioned first and second embodiments, although the pair of X-pillars 101 are mechanically connected at both ends in the X-direction, for example, by the plate 76, it is not limited to this, but for example, it may be connected with X The members with the same cross-sectional area of the column 101 are connected. In addition, the Z-axis size of the X guide 102 (the guide body 102a) may be larger than the Z-axis size of the pair of X-pillars 101. In this case, the Z axis size of the weight reduction device 40 can be further shortened.

又,上述第1、第2實施形態中,雖於Y粗動載台23Y之+X側及-X側分別設有例如二個(合計四個)Y支架75,但不限於此,Y支架75可於Y粗動載台23Y之+X側及-X側分別設置例如一個。此場合,若將Y支架75之長度設定為與板片76同等,則無需板片76。又,於此場合之Y支架,形成有供安裝在X導件102之X軸方向兩端面之Y可動子72A插入之缺口。In addition, in the first and second embodiments described above, for example, two (four in total) Y brackets 75 are provided on the +X side and −X side of the Y coarse motion stage 23Y, respectively, but it is not limited to this. For example, one may be provided on the +X side and -X side of the Y coarse motion stage 23Y. In this case, if the length of the Y bracket 75 is set to be the same as that of the plate 76, the plate 76 is unnecessary. In addition, the Y bracket in this case is formed with notches for insertion of the Y movable elements 72A mounted on both end surfaces of the X guide 102 in the X axis direction.

又,上述各實施形態中,一對X柱101雖係機械性連結,但不限於此,亦可以是機械性分離。此場合,只要分別同步控制一對X柱101即可。In addition, although the pair of X-pillars 101 are mechanically connected in each of the above embodiments, it is not limited to this, and may be mechanically separated. In this case, it is only necessary to synchronously control a pair of X-pillars 101 respectively.

又,上述第4實施形態中,X導件102雖係透過推進裝置108以接觸狀態被按壓於X柱101,但不限於此,X導件10亦可以是以非接觸狀態被按壓於X柱101。例如,可如圖21(B)所示,於X柱101(或X導件102)安裝止推(thrust)型空氣軸承109(空氣墊),藉由從該軸承面噴出之氣體之靜壓,以非接觸方式按壓X導件102即可。或者,可如圖21(C)所示,於X柱101及X導件102分別以彼此對向之部分之磁極相同之方式安裝永久磁石100a、100b(一組永久磁石100),藉由於該對向之永久磁石100a、100b間產生之斥力(斥力),以非接觸方式按壓X導件102。此種使用一組永久磁石100之情形,由於無需供應加壓氣體、電氣等,因此裝置之構成簡單。上述止推型空氣軸承109、一組永久磁石100,可分別在+Y側之X柱101與X導件102之間、及-Y側之X柱101與X導件102之間,於X軸方向分離設置複數個(例如二個)。 《第5實施形態》In addition, in the above-mentioned fourth embodiment, the X guide 102 is pressed against the X column 101 in a contact state through the pusher 108, but it is not limited to this. The X guide 10 may also be pressed against the X column 101 in a non-contact state. 101. For example, as shown in Figure 21(B), a thrust type air bearing 109 (air cushion) can be installed on the X column 101 (or X guide 102), and the static pressure of the gas ejected from the bearing surface , Just press the X guide 102 in a non-contact manner. Alternatively, as shown in FIG. 21(C), permanent magnets 100a, 100b (a set of permanent magnets 100) can be installed on the X-pillar 101 and the X-guide 102, respectively, with the same magnetic poles of the parts facing each other. The repulsive force (repulsive force) generated between the opposing permanent magnets 100a and 100b presses the X guide 102 in a non-contact manner. In this case of using a set of permanent magnets 100, since there is no need to supply pressurized gas, electricity, etc., the structure of the device is simple. The above-mentioned thrust air bearing 109 and a set of permanent magnets 100 can be respectively located between the X column 101 and the X guide 102 on the +Y side, and between the X column 101 and the X guide 102 on the -Y side, on the X axis A plurality of directions (for example, two) are set separately. "Fifth Embodiment"

其次,依據圖23~圖28說明第5實施形態。Next, the fifth embodiment will be described with reference to Figs. 23 to 28.

本第5實施形態之曝光裝置,除了取代基板載台裝置PST而設置基板載台裝置PSTe之外,與前述第1實施形態之曝光裝置10為相同構成。The exposure apparatus of the fifth embodiment has the same configuration as the exposure apparatus 10 of the first embodiment, except that a substrate stage device PSTe is provided instead of the substrate stage device PST.

以下,以基板載台裝置PSTe為中心進行説明。此處,針對與前述第1實施形態之曝光裝置10相同或同等之構成部分係使用相同或類似符號,並簡化或省略其説明。Hereinafter, the description will be focused on the substrate stage device PSTe. Here, the same or similar reference numerals are used for the same or equivalent components as those of the exposure apparatus 10 of the first embodiment, and the description thereof is simplified or omitted.

本第5實施形態之曝光裝置,取代前述粗微動構成之基板載台,如圖23及圖24所示,係使用具備所謂之支架(gantry)型雙軸載台(基板載台)ST的基板載台裝置PSTe,此支架型雙軸載台(基板載台)ST具備移動於X軸方向之以Y軸方向為長邊的樑(beam)狀X載台STX、與在該X載台STX上保持基板(板片)P移動於Y軸方向之Y載台STY。基板載台裝置PSTe,雖未圖示,但與前述基板載台裝置PST同樣的,配置在投影光學系PL(圖23及圖24中,參照圖1)之下方(-Z側)。The exposure apparatus of this fifth embodiment replaces the substrate stage with the aforementioned coarse and fine motion structure. As shown in FIGS. 23 and 24, a substrate equipped with a so-called gantry-type biaxial stage (substrate stage) ST is used. The stage device PSTe. This bracket type two-axis stage (substrate stage) ST has a beam-shaped X stage STX that moves in the X-axis direction with the Y-axis direction as the long side, and the X stage STX The upper holding substrate (plate) P moves on the Y stage STY in the Y axis direction. The substrate stage device PSTe, although not shown, is arranged under the projection optical system PL (in FIGS. 23 and 24, refer to FIG. 1) (-Z side) like the aforementioned substrate stage device PST.

基板載台裝置PSTe具備基板載台ST、與驅動該基板載台ST之基板載台驅動系PSD(圖23及圖24中未圖示,參照圖25)。基板載台驅動系PSD,如圖24及圖25所示,具備將X載台STX驅動於X軸方向之一對X軸驅動單元XD1、XD2與在X載台STX上將Y載台STY驅動於Y軸方向之Y軸驅動單元YD。藉由基板載台驅動系PSD,保持基板P之Y載台STY以既定行程被驅動於X軸方向及Y軸方向。The substrate stage device PSTe includes a substrate stage ST and a substrate stage drive system PSD that drives the substrate stage ST (not shown in FIGS. 23 and 24, see FIG. 25). The substrate stage drive system PSD, as shown in Figure 24 and Figure 25, is equipped with a pair of X-axis drive units XD1 and XD2 that drive the X stage STX in the X-axis direction and drive the Y stage STY on the X stage STX Y-axis drive unit YD in the Y-axis direction. With the substrate stage driving system PSD, the Y stage STY holding the substrate P is driven in the X-axis direction and the Y-axis direction with a predetermined stroke.

詳言之,基板載台裝置PSTe,如圖23及圖24所示,具備在設置曝光裝置之無塵室之地面F上於XY二維方向排列設置之合計六個脚部61a~61f、被各三個脚部61a~61c及61d~61f分別支承之二個基墩62a、62b、設於二個基墩62a、62b之各個的一對(二個)X軸驅動單元XD1、XD2、被二個X軸驅動單元XD1、XD2驅動於X軸方向之X載台STX、設在X載台STX上之Y軸驅動單元YD、以及被Y軸驅動單元YD驅動於Y軸方向之Y載台STY等。In detail, the substrate stage device PSTe, as shown in FIGS. 23 and 24, has a total of six feet 61a to 61f arranged in two-dimensional XY directions on the floor F of the clean room where the exposure device is installed. Each of the three legs 61a-61c and 61d-61f supports two base piers 62a, 62b, and a pair (two) of X-axis drive units XD1, XD2, and a pair of X-axis drive units XD1, XD2, respectively supported by the two base piers 62a, 62b. Two X-axis drive units XD1 and XD2 drive the X stage STX in the X-axis direction, the Y-axis drive unit YD installed on the X-stage STX, and the Y stage that is driven in the Y-axis direction by the Y-axis drive unit YD STY etc.

脚部61a~61c,如圖23所示,係於X軸方向相隔既定間隔排列。同樣的,脚部61d~61f則分別在脚部61a~61c之+Y側(圖23中之紙面內側),於X軸方向相隔既定間隔排列。於脚部61a~61f各個之裙部設有各四個調整具61a0 ~61f0 。由圖23及圖24可知,例如於脚部61b,在其±Y側面之裙部設有各二個調整具61b0The legs 61a to 61c are arranged at a predetermined interval in the X-axis direction as shown in FIG. 23. Similarly, the feet 61d to 61f are arranged on the +Y side (inner side of the paper surface in FIG. 23) of the feet 61a to 61c, respectively, at a predetermined interval in the X-axis direction. Four adjusting tools 61a 0 to 61f 0 are provided on the skirts of each of the legs 61a to 61f. It can be seen from Fig. 23 and Fig. 24 that, for example, the foot 61b has two adjusting tools 61b 0 on the skirt of the ±Y side.

脚部61a~61c及61d~61f分別支承以長邊方向為X軸方向、於Y軸方向相隔既定距離隔彼此平行配置之基墩62a、62b。例如使用水平儀適當的調整設於各脚部61a~61f之調整具61a0 ~61f0 ,據以將基墩62a、62b支承為與和地軸(重力方向)正交之平面平行(對水平面呈平行)、且距地面F同一高度。The legs 61a to 61c and 61d to 61f respectively support the base piers 62a and 62b arranged in parallel with each other at a predetermined distance in the Y axis direction with the longitudinal direction as the X axis direction. For example, use a level to properly adjust the adjustment tools 61a 0 to 61f 0 provided on each leg 61a to 61f, so that the foundation piers 62a, 62b are supported parallel to the plane orthogonal to the earth axis (direction of gravity) (parallel to the horizontal plane ), and the same height from the ground F.

於基墩62a、62b,如圖24所示,分設有X軸驅動單元XD1、XD2。X軸驅動單元XD1、XD2分別從下方支承X載台STX之-Y側端部及+Y側端部,將X載台STX驅動於X軸方向。On the foundation piers 62a and 62b, as shown in FIG. 24, X-axis drive units XD1 and XD2 are separately provided. The X-axis drive units XD1 and XD2 respectively support the -Y-side end and the +Y-side end of the X stage STX from below, and drive the X stage STX in the X-axis direction.

一方(-Y側)之X軸驅動單元XD1,如圖23及圖24所示,包含複數個固定構件63與一個可動構件84、於X軸方向產生驅動力之一對線性馬達XDM1、XDM2、限制X載台STX往X軸方向以外之移動之一對導引裝置XG1、XG2、測量可動構件(X載台STX)相對於固定構件63(基墩62a)於X軸方向之位置的線性編碼器EX1(參照圖25)。The X-axis drive unit XD1 on one side (-Y side), as shown in Figs. 23 and 24, includes a plurality of fixed members 63 and a movable member 84, a pair of linear motors XDM1, XDM2, and a pair of linear motors XDM1, XDM2 that generate driving force in the X-axis direction A pair of guide devices XG1, XG2, which restrict the movement of the X stage STX in the direction other than the X axis, measure the linear encoding of the position of the movable member (X stage STX) relative to the fixed member 63 (foundation 62a) in the X axis direction器EX1 (refer to Figure 25).

於基墩62a之±Y側端部,如圖23及圖24所示,固定有分別排列於X軸方向之複數個(本實施形態中各十個)之固定構件63。又,為易於理解,圖23中未顯示-Y側之複數個固定構件63(含後述固定子XD12)中之一部分、或剖斷顯示。各固定構件63,係使用固定具(螺栓)630 將-Z端部固定於基墩62a之側面。此處,各固定構件63之内側面係如圖26所示,相對XZ平面向内傾斜角π/2-θ(對XY平面形成角θ)。其結果,將基墩62a與固定構件63組合而成之構件的YZ剖面形狀,呈+Z側開口之大致U字形(不過,一對對向面間之間隔,在+Z側(開口側)較-Z側窄)。On the ±Y side end of the base pier 62a, as shown in FIGS. 23 and 24, a plurality of fixing members 63 (ten in each of the present embodiment) arranged in the X-axis direction are fixed. In addition, for ease of understanding, part of the plurality of fixing members 63 (including the fixing member XD12 described later) on the -Y side is not shown in FIG. Each fixing member 63, having a fixed line (screw) 630 is fixed to the -Z side of the base end portion 62a of the pier. Here, as shown in FIG. 26, the inner surface of each fixing member 63 is inclined inwardly by an angle of π/2-θ with respect to the XZ plane (an angle θ is formed with respect to the XY plane). As a result, the YZ cross-sectional shape of the member formed by combining the base pier 62a and the fixing member 63 has a substantially U-shape with an opening on the +Z side (however, the distance between a pair of opposed surfaces is shorter on the +Z side (opening side)- The Z side is narrow).

可動構件84,如圖24所示,係由具有等邊梯形之YZ剖面之角柱構件構成,被配置成其上面及下面為水平(與XY平面平行)且以其長邊方向為可動方向(X軸方向)。可動構件84,透過固定在其上面之具有矩形YZ剖面的墊高塊85,安裝在以固定具(螺栓)660 固定在X載台STX之-Y端部近旁下面(-Z面)之固定板66。The movable member 84, as shown in FIG. 24, is composed of a corner post member with an equilateral trapezoid YZ section, and is arranged such that the upper and lower sides are horizontal (parallel to the XY plane) and the longitudinal direction is the movable direction (X Axis direction). The movable member 84 is fixed to the lower side (-Z surface) near the -Y end of the X stage STX with a fixture (bolt) 66 0 through a bumper 85 with a rectangular YZ cross-section fixed on it.板66.

可動構件84係配置在以基墩62a與固定構件63形成之空間内。此處,可動構件84之±Y側面係對XZ平面傾斜角π/2-θ(對XY平面形成角θ)。亦即,可動構件84之+Y側之面係相對+Y側之固定構件63之-Y側之面成平行且相隔既定間隙對向,而可動構件84之-Y側之面則相對-Y側之固定構件63之+Y側之面成平行且相隔既定間隙對向。可動構件84為謀求輕量化而為中空構造。又,可動構件84之±X端面不一定須為平行。此外,YZ剖面亦不一定須為梯形。又,若固定後述可動子XD11、XD21之面若係對XZ面(Z軸)傾斜角π/2-θ之形狀的話,可對可動構件84之角部進行去角等。The movable member 84 is arranged in a space formed by the base pier 62a and the fixed member 63. Here, the ±Y side surface of the movable member 84 is inclined at an angle of π/2-θ to the XZ plane (forms an angle θ to the XY plane). That is, the +Y side surface of the movable member 84 is parallel to and opposed to the -Y side surface of the +Y side fixed member 63 with a predetermined gap, while the -Y side surface of the movable member 84 is opposite to the -Y side surface The surface on the +Y side of the fixing member 63 is parallel and opposed to each other with a predetermined gap. The movable member 84 has a hollow structure in order to achieve weight reduction. In addition, the ±X end faces of the movable member 84 do not necessarily have to be parallel. In addition, the YZ section does not necessarily have to be trapezoidal. In addition, if the surfaces of the movable members XD11 and XD21 described later are fixed to the XZ plane (Z axis) at an inclination angle of π/2-θ, the corners of the movable member 84 can be chamfered.

如圖24所示,線性馬達XDM1係由可動子XD11與固定子XD12構成,線性馬達XDM2則由可動子XD21與固定子XD22構成。As shown in Fig. 24, the linear motor XDM1 is composed of a movable element XD11 and a fixed element XD12, and the linear motor XDM2 is composed of a movable element XD21 and a fixed element XD22.

上述一對固定子XD12、XD22,如圖24所示,分別固定在±Y側之固定構件63之内側面,如圖23所示,延設於X軸方向(圖23中,固定子XD12未圖示)。又,如圖23所示,於最+X側及最-X側之固定構件63,未固定有固定子XD12、XD22(固定子XD12未顯示於圖23)。上述一對可動子XD11、XD21分別固定在可動構件84之±Y側兩側面,與固定在兩側面分別對向之固定構件63之固定子XD12、XD22相對Z軸(XZ平面)形成角θ之方向,隔著些微間隙對向。The above-mentioned pair of holders XD12 and XD22, as shown in FIG. 24, are respectively fixed on the inner surface of the fixing member 63 on the ±Y side, as shown in FIG. 23, extending in the X-axis direction (in FIG. 23, the holder XD12 is not Icon). In addition, as shown in FIG. 23, the fixing members 63 on the most +X side and the most -X side are not fixed with the fixers XD12 and XD22 (the fixers XD12 are not shown in FIG. 23). The above-mentioned pair of movable elements XD11 and XD21 are respectively fixed on the two sides of the movable member 84 on the ±Y side, and form an angle θ with the fixed elements XD12 and XD22 of the fixed member 63 that are fixed on the two side surfaces respectively opposite to the Z axis (XZ plane). Direction, facing each other with a slight gap.

又,雖未圖示,但在可動子XD11、XD21各個之内部,於X軸方向排列有複數個線圈單元(分別包含鐵心繞有巻線之複數個線圈)。在固定子XD12、XD22各個之内部,於X軸方向排列有複數個磁石單元(分別包含複數個永久磁石)。本第5實施形態中,係以可動子XD11與固定子XD12構成動圈方式之線性馬達XDM1,以可動子XD21與固定子XD22構成動圈方式之XDM2。Also, although not shown, inside each of the movers XD11 and XD21, a plurality of coil units (respectively including a plurality of coils in which a coil is wound on an iron core) are arranged in the X-axis direction. Inside each of the stators XD12 and XD22, a plurality of magnet units (each including a plurality of permanent magnets) are arranged in the X-axis direction. In the fifth embodiment, the movable element XD11 and the fixed element XD12 constitute the linear motor XDM1 of the moving coil system, and the movable element XD21 and the fixed element XD22 constitute the moving coil system XDM2.

導引裝置XG1,如圖23及圖24所示,包含X軸線性導件(軌道)XGR1與二個滑件XGS1。同樣的,導引裝置XG2亦包含X軸線性導件(軌道)XGR2與二個滑件XGS2。The guide device XG1, as shown in Figs. 23 and 24, includes an X-axis linear guide (track) XGR1 and two sliding members XGS1. Similarly, the guiding device XG2 also includes an X-axis linear guide (track) XGR2 and two sliding pieces XGS2.

詳言之,於基墩62a之上面設定延伸於X軸方向之既定深度的凹溝,在從該溝部内部底面之Y軸方向中心於±Y側相距大致相同距離之位置,彼此平行的固定有延伸於X軸方向之X軸線性導件XGR1、XGR2。各二個滑件XGS1、XGS2,分別固定在可動構件84下面之與X軸線性導件XGR1、XGR2對向之位置。此處,滑件XGS1、XGS2具有倒U字形之剖面,-Y側的二個滑件XGS1卡合於X軸線性導件XGR1,+Y側的二個滑件XGS2卡合於X軸線性導件XGR2。於X軸線性導件XGR1、XGR2各個之±X端近旁,如圖23所示,設有防止X載台STX之越距(overrun)的停止裝置88、89。In detail, a groove extending to a predetermined depth in the X-axis direction is set on the upper surface of the base pier 62a, and at a position approximately the same distance from the center of the Y-axis direction of the inner bottom surface of the groove on the ±Y side, they are fixed parallel to each other. X-axis linear guides XGR1 and XGR2 extending in the X-axis direction. Each of the two sliders XGS1 and XGS2 are respectively fixed at positions opposite to the X-axis linear guides XGR1 and XGR2 under the movable member 84. Here, the sliders XGS1 and XGS2 have an inverted U-shaped cross-section. The two sliders XGS1 on the -Y side are engaged with the X-axis linear guide XGR1, and the two sliders XGS2 on the +Y side are engaged with the X-axis linear guide. XGR2. Near the ±X ends of the X-axis linear guides XGR1 and XGR2, as shown in FIG. 23, stop devices 88 and 89 are provided to prevent overrun of the X stage STX.

線性編碼器EX1,如圖4所示,包含讀頭EXh1與標尺EXs1。標尺EXs1,其表面形成有以X軸方向為週期方向之反射型繞射光柵,在基墩62a之凹溝内部底面之Y軸方向中央與X軸線性導件XGR1、XGR2平行的延設。讀頭EXh1設在可動構件84之下面(或+X側(或-X側)之側面)。讀頭EXh1,在可動構件84(X載台STX)之X軸方向移動行程内與標尺EXs1對向,藉由對標尺EXs1照射測量光並接收來自標尺EXs1之反射繞射光,據以測量可動構件84(X載台STX之-Y端部)相對基墩62a於X軸方向之位置資訊。其測量結果被送至主控制裝置50(參照圖25)。The linear encoder EX1, as shown in Figure 4, includes a read head EXh1 and a scale EXs1. The scale EXs1 has a reflection-type diffraction grating with the X-axis direction as the periodic direction formed on its surface, and extends in the center of the Y-axis direction on the inner bottom surface of the groove of the base pier 62a parallel to the X-axis linear guides XGR1 and XGR2. The reading head EXh1 is provided under the movable member 84 (or the side surface of the +X side (or -X side)). The reading head EXh1 is opposed to the scale EXs1 within the X-axis direction of the movable member 84 (X stage STX), and measures the movable member by irradiating the measuring light to the scale EXs1 and receiving the reflected diffracted light from the scale EXs1 84 (-Y end of X stage STX) relative to the position information of the base pier 62a in the X-axis direction. The measurement result is sent to the main control device 50 (refer to FIG. 25).

另一方(+Y側)之X軸驅動單元XD2,與上述X軸驅動單元XD1大致同樣的構成。不過,X軸驅動單元XD2中所含之可動構件84,則係透過取代前述墊高塊85設置之平行板彈簧86,安裝在使用固定具660 固定在X載台STX之+Y端部近旁下面(-Z面)之固定板66。平行板彈簧86係由以和XZ平面平行之X軸方向為長邊方向、於Y軸方向相隔既定距離之一對板彈簧構成。藉由此平行板彈簧86,固定板66與可動構件84在Y軸方向容許微小行程下之相對移動。因此,即使基墩62a與基墩62b之平行度降低,亦能藉由平行板彈簧86之作用降低對後述導引裝置XG3(由滑件XGS3與X軸線性導件(軌道)XGR3構成)之負荷。The X-axis drive unit XD2 on the other side (+Y side) has substantially the same structure as the above-mentioned X-axis drive unit XD1. However, the movable member 84 contained in the X-axis drive unit XD2 is installed under the +Y end of the X stage STX with a fixture 66 0 through the parallel plate spring 86 provided in place of the aforementioned bumper 85. (-Z side) of the fixed plate 66. The parallel leaf spring 86 is composed of a pair of leaf springs with the X-axis direction parallel to the XZ plane as the longitudinal direction and a predetermined distance in the Y-axis direction. With this parallel plate spring 86, the fixed plate 66 and the movable member 84 allow relative movement with a small stroke in the Y-axis direction. Therefore, even if the parallelism between the foundation pier 62a and the foundation pier 62b is reduced, the effect of the parallel plate spring 86 can reduce the resistance to the guide device XG3 (consisting of the slider XGS3 and the X-axis linear guide (track) XGR3) described later. load.

又,於固定構件63之上面,如上所述,安裝有容許在固定板66與可動構件84於Y軸方向以微小行程相對移動時產生之平行板彈簧86之變形、且覆蓋上面開口之蓋87。同樣的,於前述X軸驅動單元XD1側之固定構件63上面,安裝有容許隨平行板彈簧86之變形產生之墊高塊85往Y軸方向之移動、且覆蓋上面開口之蓋87。藉由此等蓋87,可防止從X軸驅動單元XD2、XD1之各個所具有之一對可動子XD11、XD21内之線圈單元產生之熱往X軸驅動單元XD2、XD1外部之擴散。In addition, on the upper surface of the fixed member 63, as described above, a cover 87 that allows deformation of the parallel plate spring 86 generated when the fixed plate 66 and the movable member 84 move relative to each other in the Y-axis direction with a small stroke and covers the upper opening is attached. . Similarly, on the above-mentioned fixing member 63 on the X-axis drive unit XD1 side, a cover 87 that allows the bumper 85 generated by the deformation of the parallel plate spring 86 to move in the Y-axis direction and covers the upper opening is mounted. With this cover 87, the heat generated from the coil unit in the pair of movable elements XD11 and XD21 of each of the X-axis drive units XD2 and XD1 can be prevented from spreading to the outside of the X-axis drive units XD2 and XD1.

於X軸驅動單元XD2,如圖24所示,僅設有一個與導引裝置XG1、XG2同樣的、由一個X軸線性導件XGR3及與此卡合之二個滑件XGS3構成的導引裝置XG3。於X軸驅動單元XD2,設有與前述線性編碼器EX1同樣的、由讀頭EXh2與標尺EXs2構成之線性編碼器EX2。線性編碼器EX2測量可動構件84相對基墩62b於X軸方向之位置資訊。其測量結果被送至主控制裝置50(參照圖25)。In the X-axis drive unit XD2, as shown in Figure 24, there is only one guide, which is the same as the guide XG1 and XG2, composed of an X-axis linear guide XGR3 and two sliders XGS3 engaged with this Device XG3. The X-axis drive unit XD2 is provided with a linear encoder EX2, which is the same as the aforementioned linear encoder EX1, composed of a read head EXh2 and a scale EXs2. The linear encoder EX2 measures the position information of the movable member 84 relative to the base pier 62b in the X-axis direction. The measurement result is sent to the main control device 50 (refer to FIG. 25).

進一步的,X軸驅動單元XD1、XD2之各個,如圖23所示,在-X側之端部及+X側之端部分別具有風扇70A及風扇70B。風扇70A係將外氣(空氣)送至X軸驅動單元之内部空間(基墩(62a或62b)與一對固定構件63間之空間)之供氣用風扇,風扇70B則係將通過X軸驅動單元内部空間之空氣排至外部之排氣用風扇。藉由此等風扇70A、70B,可以良好效率冷卻設在X軸驅動單元XD1、XD2各個之内部空間的一對可動子XD11、XD21内之線圈單元。Furthermore, each of the X-axis drive units XD1 and XD2, as shown in FIG. 23, has a fan 70A and a fan 70B at the end on the -X side and the end on the +X side, respectively. The fan 70A is a fan for air supply that sends outside air (air) to the internal space of the X-axis drive unit (the space between the base (62a or 62b) and the pair of fixed members 63), and the fan 70B passes through the X-axis A fan for exhausting air from the internal space of the drive unit to the outside. With such fans 70A and 70B, the coil units in the pair of movable elements XD11 and XD21 provided in the internal spaces of the X-axis drive units XD1 and XD2 can be cooled efficiently.

此處,X載台STX及之承在其上之Y載台STY等之荷重(及伴隨該等之移動的慣性力)會施加至X軸驅動單元XD1、XD2。此外,X軸驅動單元XD1、XD2中所含之線性馬達XDM1、XDM2,在各自之可動子與固定子之間會較驅動力大數倍之磁吸力。此處,相對固定子作用於可動子之磁吸力,對可動構件84而言係作用為浮力(反重力方向之力)。X軸驅動單元XD1、XD2利用該磁吸力(浮力)大致抵消上述荷重,在不致對導引裝置XG1~XG3施加大荷重(及慣性力)之情形下,支承並驅動X載台STX。又,在X軸驅動單元XD1(XD2)之X載台STX等之荷重與來自線性馬達XDM1、XDM2之磁吸力(浮力)的抵消(平衡),於後詳述。Here, the load of the X stage STX and the Y stage STY supported on it (and the inertial force accompanying the movement) is applied to the X-axis drive units XD1 and XD2. In addition, the linear motors XDM1 and XDM2 contained in the X-axis drive units XD1 and XD2 will have a magnetic attraction force that is several times larger than the driving force between the respective movable members and fixed members. Here, the magnetic attraction force acting on the mover with respect to the stator acts as a buoyancy force (force against the direction of gravity) for the moveable member 84. The X-axis drive units XD1 and XD2 use the magnetic attraction (buoyancy) to substantially offset the above-mentioned load, and support and drive the X stage STX without applying a large load (and inertial force) to the guiding devices XG1 to XG3. In addition, the offset (balance) between the load on the X stage STX of the X-axis drive unit XD1 (XD2) and the magnetic attraction (buoyancy) from the linear motors XDM1 and XDM2 will be described in detail later.

於X載台STX上,如圖23所示,透過構成Y軸驅動單元YD之一部分之導引裝置YG,支承有Y載台STY。於Y載台STY上保持有基板P。On the X stage STX, as shown in FIG. 23, the Y stage STY is supported through a guide device YG constituting a part of the Y-axis drive unit YD. The substrate P is held on the Y stage STY.

Y軸驅動單元YD,如圖23所示,包含於Y軸方向產生驅動力的線性馬達YDM、限制Y載台STY往Y軸方向以外之移動的導引裝置YG、以及測量Y載台STY相對X載台STX於Y軸方向之位置的線性編碼器EY(參照圖25)。The Y-axis drive unit YD, as shown in Figure 23, includes a linear motor YDM that generates a driving force in the Y-axis direction, a guide device YG that restricts the movement of the Y stage STY out of the Y-axis direction, and a measurement Y stage STY relative to Linear encoder EY at the position of the X stage STX in the Y axis direction (refer to Figure 25).

線性馬達YDM,如圖23所示,包含可動子YD1與固定子YD2。固定子YD2係在X載台STX上面之X軸方向中央延設於Y軸方向。可動子YD1係與固定子YD2於Z軸方向對向,固定在Y載台STY底面之X軸方向中央。The linear motor YDM, as shown in Fig. 23, includes a movable element YD1 and a fixed element YD2. The holder YD2 is extended in the Y-axis direction at the center of the X-axis direction on the upper surface of the X stage STX. The movable element YD1 is opposed to the fixed element YD2 in the Z-axis direction, and is fixed at the center of the X-axis direction on the bottom surface of the Y stage STY.

導引裝置YG包含一對Y軸線性導件(軌道)YGR與四個滑件YGS(圖23中,部分未圖示)。一對Y軸線性導件YGR之各個,係在X載台STX上面之-X側及+X側之端部近旁,彼此平行的延設於Y軸方向。四個滑件YGS分別固定在Y載台STY下面的四角近旁。此處,四個滑件YGS具有倒U字形之XZ剖面,四個中位於-X側之二個滑件YGS卡合於X載台STX上-X側之Y軸線性導件YGR,位於+X側之二個滑件YGS則卡合於+X側之Y軸線性導件YGR(參照圖24)。The guiding device YG includes a pair of Y-axis linear guides (tracks) YGR and four sliding members YGS (in FIG. 23, some are not shown). Each of the pair of Y-axis linear guides YGR is located near the ends of the X stage STX on the -X side and +X side, and extends parallel to each other in the Y-axis direction. The four sliding pieces YGS are respectively fixed near the four corners under the Y stage STY. Here, the four sliders YGS have an inverted U-shaped XZ section, and two of the four sliders YGS located on the -X side are engaged with the X stage STX on the -X side Y axis linear guide YGR, located at +X The two sliders YGS on the side are engaged with the Y-axis linear guide YGR on the +X side (refer to Figure 24).

線性編碼器EY(參照圖25)由讀頭與標尺構成。標尺(未圖示),其表面形成有以Y軸方向為週期方向之反射型繞射光柵,在X載台STX上與Y軸線性導件YGR平行的延設。讀頭(未圖示)係設在Y載台STY之下面(或+Y側(或-Y側)之側面)。讀頭在Y載台STY之Y軸方向移動行程内與標尺對向,藉由對標尺照射測量光並接收來自該標尺之反射繞射光,據以測量Y載台STY相對X載台STX於Y軸方向之位置資訊。該測量結果被送至主控制裝置50(參照圖25)。The linear encoder EY (refer to Figure 25) consists of a read head and a scale. The scale (not shown) has a reflection type diffraction grating with the Y-axis direction as the periodic direction formed on its surface, and extends parallel to the Y-axis linear guide YGR on the X stage STX. The reading head (not shown) is located under the Y stage STY (or the side of the +Y side (or -Y side)). The reading head is opposed to the scale within the Y-axis movement stroke of the Y stage STY. By irradiating the measuring light to the scale and receiving the reflected diffracted light from the scale, the Y stage STY is measured relative to the X stage STX in the Y The position information of the axis direction. The measurement result is sent to the main control device 50 (refer to FIG. 25).

基板載台ST(Y載台STY)在XY平面内之位置資訊(含偏轉(yawing、θz方向之旋轉量))係以由上述X軸驅動單元XD1、XD2之各個所含之線性編碼器EX1、EX2與Y軸驅動單元YD所含之線性編碼器EY構成之編碼器系統20(參照圖25),隨時加以測量。The position information of the substrate stage ST (Y stage STY) in the XY plane (including deflection (yawing, the amount of rotation in the θz direction)) is based on the linear encoder EX1 contained in each of the above-mentioned X-axis drive units XD1 and XD2 , EX2 and the encoder system 20 (refer to Figure 25) composed of the linear encoder EY contained in the Y-axis drive unit YD, can be measured at any time.

又,與編碼器系統20獨立的,藉由前述基板干涉儀系統92,透過設於(或形成於)Y載台STY之反射面(未圖示)測量Y載台STY(基板載台ST)於XY平面内之位置資訊(含θz)及相對Z軸之傾斜量資訊(pitching(θx方向之旋轉量)及rolling(θy方向之旋轉量))。基板干涉儀系統92之測量結果被供應至主控制裝置50(參照圖25)。In addition, independent of the encoder system 20, the Y stage STY (substrate stage ST) is measured through the reflective surface (not shown) provided on (or formed on) the Y stage STY by the aforementioned substrate interferometer system 92 Position information in the XY plane (including θz) and tilt information relative to the Z axis (pitching (rotation in the θx direction) and rolling (rotation in the θy direction)). The measurement result of the substrate interferometer system 92 is supplied to the main control device 50 (refer to FIG. 25).

主控制裝置50根據編碼器系統20及/或基板干涉儀系統92之測量結果,透過基板載台驅動系PSD(參照圖25),更正確而言,透過構成X軸驅動單元XD1、XD2及Y軸驅動單元YD各個之一部分的線性馬達XDM1、XDM2及YDM,驅動控制基板載台ST(Y載台STY及X載台STX)。According to the measurement result of the encoder system 20 and/or the substrate interferometer system 92, the main control device 50 transmits the substrate stage drive system PSD (refer to FIG. 25), more accurately, constitutes the X-axis drive units XD1, XD2, and Y The linear motors XDM1, XDM2, and YDM of each part of the axis drive unit YD drive and control the substrate stage ST (Y stage STY and X stage STX).

圖25,係顯示以本第5實施形態之曝光裝置之控制系為中心構成,統籌控制構成各部之主控制裝置50之輸出入關係的方塊圖。主控制裝置50包含工作站(或微電腦)等,統籌控制曝光裝置之構成各部。FIG. 25 is a block diagram showing the relationship between the input and output of the main control device 50, which is composed mainly of the control system of the exposure apparatus of the fifth embodiment, and which controls the components of the main control device 50. The main control device 50 includes a workstation (or a microcomputer), etc., and overall controls the constituent parts of the exposure device.

其次,說明在上述X軸驅動單元XD1(XD2)之X載台STX等之荷重與來自線性馬達XDM1、XDM2之磁吸力(浮力)的平衡。又,由於上述荷重與浮力間之平衡、和X軸驅動單元XD1與X軸驅動單元XD2相同,因此,以下針對X軸驅動單元XD1加以説明。Next, the balance between the load on the X stage STX of the X-axis drive unit XD1 (XD2) and the magnetic attraction (buoyancy) from the linear motors XDM1 and XDM2 will be described. In addition, since the balance between the load and buoyancy described above is the same as the X-axis drive unit XD1 and the X-axis drive unit XD2, the X-axis drive unit XD1 will be described below.

如圖26所示,在X載台STX(參照圖24)靜止的狀態下,鉛直方向朝下(以塗白箭頭所示之方向)之X載台STX、Y載台STY等總重量之約1/2之荷重W會作用於X軸驅動單元XD1之可動構件84。與此同時,構成線性馬達XDM1之可動子XD11與固定子XD12間產生之磁吸力F1會在對Z軸成角θ之方向、構成線性馬達XDM2之可動子XD21與固定子XD22間產生之磁吸力F2則會在對Z軸成角-θ之方向,分別作用於可動構件84。又,在例如Y載台STY位於其可移動範圍之中央的情形時,雖然X載台STX、Y載台STY等總重量之約一半的荷重W會分別大致均等作用於X軸驅動單元XD1及X軸驅動單元XD2之可動構件84,嚴格來說,作用於可動構件84之鉛直方向朝下之荷重(負荷)會隨著Y載台STY之位置變化。As shown in Figure 26, when the X stage STX (refer to Figure 24) is at rest, the total weight of the X stage STX and Y stage STY with the vertical direction down (in the direction indicated by the painted white arrow) is approximately 1/2 of the load W will act on the movable member 84 of the X-axis drive unit XD1. At the same time, the magnetic attraction F1 generated between the movable element XD11 and the fixed element XD12 of the linear motor XDM1 will be in the direction of the angle θ to the Z axis, and the magnetic attraction generated between the movable element XD21 and the fixed element XD22 of the linear motor XDM2 F2 will act on the movable member 84 in the direction of the angle -θ to the Z axis. In addition, when the Y stage STY is located in the center of its movable range, for example, the X stage STX, Y stage STY, etc., which are approximately half of the total weight of the load W, will act on the X-axis drive units XD1 and XD1 and The movable member 84 of the X-axis drive unit XD2, strictly speaking, the vertical downward load (load) acting on the movable member 84 changes with the position of the Y stage STY.

此處,假設於線性馬達XDM1、XDM2之各個產生之磁吸力F1、F2是彼此相等(亦即F1=F2=F)。因此,線性馬達XDM1、XDM2產生之磁吸力F1、F2於鉛直方向成分之合力P=Fz1+Fz2(=2Fcosθ),會於鉛直方向朝上(塗黒箭頭所示之方向)的作用於可動構件84。合力P係以和荷重W大致相等之方式設定其角θ。因此,遠小於荷重W之負荷(殘力)|W-P|會作用於導引裝置XG1、XG2。又,於水平方向(Y軸方向),由於磁吸力F1、F2各個之水平方向成分Fy1、Fy2會被抵消,因此合力不會作用於可動構件84(零合力作用)。此外,由於係藉由導引裝置XG1、XG2限制固定構件63與可動構件84之Z軸方向(+Z方向及-Z方向)相對移動,因此上述合力P與荷重W之關係可以是P<W、亦可以是P>W。Here, it is assumed that the magnetic attraction forces F1 and F2 generated by each of the linear motors XDM1 and XDM2 are equal to each other (that is, F1=F2=F). Therefore, the resultant force P=Fz1+Fz2 (=2Fcosθ) of the magnetic attraction forces F1 and F2 generated by the linear motors XDM1 and XDM2 in the vertical direction will act on the movable member 84 in the vertical direction upwards (the direction indicated by the painted black arrow). The resultant force P is to set its angle θ approximately equal to the load W. Therefore, a load (residual force) that is much smaller than the load W |W-P| will act on the guiding devices XG1 and XG2. Moreover, in the horizontal direction (Y-axis direction), since the horizontal components Fy1 and Fy2 of the magnetic attraction forces F1 and F2 are cancelled out, the resultant force does not act on the movable member 84 (zero resultant force action). In addition, since the relative movement of the fixed member 63 and the movable member 84 in the Z-axis direction (+Z direction and -Z direction) is restricted by the guide devices XG1 and XG2, the relationship between the above-mentioned resultant force P and the load W may be P<W, It can also be P>W.

上述構成之X軸驅動單元XD1(XD2),係視導引裝置XG1、XG2之負荷容量適當的決定可動構件84與固定構件63彼此對向之側面的傾斜(傾斜角θ),而能利用線性馬達XDM1、XDM2之磁吸力F1、F2,在不致對可動構件84賦予水平方向之力之情形下,抵消作用於鉛直方向之荷重W。The X-axis drive unit XD1 (XD2) of the above-mentioned structure determines the inclination (inclination angle θ) of the side surfaces facing each other of the movable member 84 and the fixed member 63 appropriately depending on the load capacity of the guide devices XG1 and XG2, and can utilize linearity The magnetic attraction forces F1 and F2 of the motors XDM1 and XDM2 cancel out the load W acting in the vertical direction without applying a horizontal force to the movable member 84.

另一方面,於固定在基墩62a之-Y側之固定構件63,會作用相對Z軸於θ方向由線性馬達XDM1產生之磁吸力(-F1)。此吸引力對固定構件63賦予剪力與彎曲力矩。同樣的,於固定在基墩62a之+Y側之固定構件63,會作用相對Z軸於-θ方向由線性馬達XDM2產生之磁吸力(-F2)。此吸引力對固定構件63賦予剪力與彎曲力矩。因此,兩固定構件63相對與基墩62a之固定端向內彎曲,其結果,固定構件63與可動構件84間之彼此對向之側面間的間隙尺寸可變化。On the other hand, the fixing member 63 fixed to the -Y side of the base pier 62a acts on the magnetic attraction force (-F1) generated by the linear motor XDM1 in the θ direction with respect to the Z axis. This attractive force imparts shear force and bending moment to the fixing member 63. Similarly, the fixing member 63 fixed on the +Y side of the base pier 62a will act on the magnetic attraction force (-F2) generated by the linear motor XDM2 in the -θ direction with respect to the Z axis. This attractive force imparts shear force and bending moment to the fixing member 63. Therefore, the two fixed members 63 are bent inwardly with respect to the fixed ends of the base pier 62a. As a result, the size of the gap between the fixed member 63 and the movable member 84 facing each other can be changed.

因固定構件63之彎曲產生之間隙尺寸之變化,可藉由使固定構件63之厚度(Y軸方向之寬度)最佳化來加以抑制。The change in the gap size due to the bending of the fixing member 63 can be suppressed by optimizing the thickness of the fixing member 63 (the width in the Y-axis direction).

例如,在X載台STX之驅動力(推力)小、相對磁吸力F1、F2(正確來說,係鉛直朝上之合力P=2Fcosθ)荷重W大之情形時(W>P),則將傾斜角θ定得小。如此,合力P、亦即施加於可動構件84之浮力變大,而作用於導引裝置XG1、XG2之負荷(殘力)|W-P|變小。此場合,由於磁吸力小,因此作用於固定構件63之剪力與彎曲力矩亦小。從而,可將固定構件63之厚度設定得較小。For example, when the driving force (thrust) of the X stage STX is small and the relative magnetic attraction force F1, F2 (correctly speaking, the vertical upward force P=2Fcosθ) and the load W is large (W>P), then The tilt angle θ is set small. In this way, the resultant force P, that is, the buoyancy force applied to the movable member 84 increases, and the load (residual force) |W-P| acting on the guide devices XG1 and XG2 decreases. In this case, since the magnetic attraction force is small, the shearing force and the bending moment acting on the fixing member 63 are also small. Therefore, the thickness of the fixing member 63 can be set small.

相反的,在X載台STX之驅動力(推力)大、相對磁吸力F1、F2(鉛直朝上之合力P=2Fcosθ)荷重W小之情形時(W<P),則將傾斜角θ定得較大。如此,即能取得合力P與荷重W之平衡。此場合,相對於大的傾斜角θ,磁吸力大,因此作用於固定構件63之剪力與彎曲力矩亦變大。從而,須將固定構件63之厚度設定得較大。Conversely, when the driving force (thrust) of the X stage STX is large, and the relative magnetic attraction F1, F2 (the resultant force of the vertical upward P=2Fcosθ) load W is small (W<P), the inclination angle θ is fixed Got bigger. In this way, the balance between the resultant force P and the load W can be achieved. In this case, the magnetic attraction force is large relative to the large inclination angle θ, and therefore the shearing force and the bending moment acting on the fixing member 63 also increase. Therefore, the thickness of the fixing member 63 must be set larger.

其次,參照圖27,說明求出固定構件63之厚度(Y軸方向之寬度幅)h的方法。如圖27所示,設可動子XD11、XD21與固定子XD12、XD22之寬度為s(Y軸方向之投影長a=scosθ)、可動構件84與固定構件63彼此對向之側面之間隙尺寸為c(Y軸方向之投影長d=csinθ)、固定構件63之X軸方向長度為b、固定構件63從固定端至内側面中心(固定子XD12、XD22之中心)為止之高度(Z軸方向之距離)為L=(s/2)sinθ+α。其中,α係尺寸裕度。又,假設磁吸力為F1=F2=F、亦即作用於可動構件84之浮力為P=2(Fcosθ)。將固定構件63之楊氏係數(縱彈性係數)及撓曲分別記為E及W時,固定構件63之厚度h,可使用直角力作用於單純懸臂樑之前端時之撓曲的關係式,如下式(1)般求出。

Figure 02_image001
Next, referring to FIG. 27, a method of obtaining the thickness (width in the Y-axis direction) h of the fixing member 63 will be described. As shown in Figure 27, the width of the movable elements XD11, XD21 and the fixed elements XD12, XD22 is s (the projection length in the Y-axis direction a=scosθ), and the gap size between the side surfaces of the movable member 84 and the fixed member 63 facing each other is c (the projection length in the Y-axis direction d=csinθ), the length of the fixing member 63 in the X-axis direction is b, the height of the fixing member 63 from the fixed end to the center of the inner surface (the center of the fixed sub XD12, XD22) (Z-axis direction The distance) is L=(s/2)sinθ+α. Among them, α is the size margin. Furthermore, it is assumed that the magnetic attraction force is F1=F2=F, that is, the buoyancy force acting on the movable member 84 is P=2 (Fcosθ). When the Young’s coefficient (longitudinal elastic coefficient) and the deflection of the fixed member 63 are denoted as E and W, respectively, the thickness h of the fixed member 63 can be expressed by the deflection when a right-angle force is applied to the front end of a simple cantilever beam. It can be calculated as the following formula (1).
Figure 02_image001

又,欲使X軸驅動單元XD1小型化(詳言之,縮短X軸驅動單元XD1之Y軸方向寬度尺寸)時,選定一使a+d+h小之傾斜角θ即可。In addition, when the X-axis drive unit XD1 is to be miniaturized (specifically, the Y-axis direction width dimension of the X-axis drive unit XD1 is shortened), an inclination angle θ that makes a+d+h small can be selected.

惟,如前所述,在固定構件63與可動構件84之間,為抑制可動構件84之真直度誤差(Y並進誤差及Z並進誤差)與旋轉及傾斜誤差、隨Y載台STY之移動產生之反力等,設有導引裝置XG1、XG2。因此,施加至可動構件84之荷重W,即使沒有僅被來自線性馬達XDM1、XDM2之浮力P完全抵消亦可。However, as mentioned above, between the fixed member 63 and the movable member 84, in order to suppress the straightness error (Y parallel error and Z parallel error) of the movable member 84, rotation and tilt errors, which occur with the movement of the Y stage STY The reaction force, etc., are equipped with guiding devices XG1 and XG2. Therefore, the load W applied to the movable member 84 may not be completely offset by the buoyancy P from the linear motors XDM1 and XDM2.

例如,相對於s=100mm、b=500mm、c=50mm、E=16000Kgf/mm2 、α=100mm、F=2000Kgf、W=0.1mm、W=800Kgf,θ、a、d、h、a+d+h、浮力P(=2Fcosθ)之關係可如下表1所示求出。For example, relative to s=100mm, b=500mm, c=50mm, E=16000Kgf/mm 2 , α=100mm, F=2000Kgf, W=0.1mm, W=800Kgf, θ, a, d, h, a+d+h, The relationship of the buoyancy P (=2Fcosθ) can be obtained as shown in Table 1 below.

[表1] θ(度) a(mm) d(mm) h(mm) a+d+h (mm) 2Fcosθ(Kgf) 10 98.5 8.7 13.1 120.3 3939.2 20 94.0 17.1 17.6 128.7 3758.8 30 86.6 25.0 21.4 133.0 3464.1 40 76.6 32.1 24.6 133.3 3064.2 50 64.3 38.3 27.3 129.9 2571.2 60 50.0 43.3 29.4 122.7 2000.0 70 34.2 47.0 31.0 112.2 1368.1 80 17.4 49.2 32.0 98.6 694.6 85 8.7 49.8 32.2 90.7 348.6 88 3.5 50.0 32.3 85.8 139.6 [Table 1] θ (degree) a(mm) d(mm) h(mm) a+d+h (mm) 2Fcosθ(Kgf) 10 98.5 8.7 13.1 120.3 3939.2 20 94.0 17.1 17.6 128.7 3758.8 30 86.6 25.0 21.4 133.0 3,464.1 40 76.6 32.1 24.6 133.3 3064.2 50 64.3 38.3 27.3 129.9 2571.2 60 50.0 43.3 29.4 122.7 2000.0 70 34.2 47.0 31.0 112.2 1368.1 80 17.4 49.2 32.0 98.6 694.6 85 8.7 49.8 32.2 90.7 348.6 88 3.5 50.0 32.3 85.8 139.6

根據上述表1,角θ以設定在θ=70~85度較佳。相對於荷重W=800Kgf,浮力P=1368.1~348.6Kgf、亦即作用於導引裝置XG1、XG2之殘力為-568.1~+451.4Kgf,可大致抵消荷重W。此外,由於可將殘力調整的極小,因此能使導引裝置XG1、XG2小型化。據此,構成導引裝置XG1、XG2之X軸線性導件與滑件間之摩擦阻抗亦變小。亦即,驅動可動構件84(X載台STX)所須之推力亦小,例如可以手動方式移動可動構件84,X載台STX之維修保養等之作業效率變佳。再者,可藉由將傾斜角θ設定得較大,使固定構件63、亦即使X軸驅動單元XD1小型化。According to Table 1, the angle θ is preferably set at θ=70 to 85 degrees. Relative to the load W=800Kgf, the buoyancy P=1368.1~348.6Kgf, that is, the residual force acting on the guiding devices XG1 and XG2 is -568.1~+451.4Kgf, which can roughly offset the load W. In addition, since the residual force can be adjusted extremely small, the guide devices XG1 and XG2 can be miniaturized. According to this, the frictional resistance between the X-axis linear guides and the sliders constituting the guide devices XG1 and XG2 is also reduced. That is, the thrust required to drive the movable member 84 (X stage STX) is also small. For example, the movable member 84 can be moved manually, and the work efficiency of the maintenance of the X stage STX becomes better. Furthermore, by setting the inclination angle θ to be larger, the fixing member 63 and even the X-axis drive unit XD1 can be miniaturized.

又,上述構成之X軸驅動單元XD1、XD2,可在不使用間隔件等調整板之情形下,容易的調整可動子XD11、XD21與固定子XD12、XD22間之間隙。以下,依據圖28說明調整程序。於調整時,作業員首先使用適當的固定具將可動構件84固定於基墩62a。其次,作業員將具有較可動子XD11、XD21大適當間隙量g份之厚度的非磁性體塊69,安裝於可動構件84之兩側面。接著,作業員在使固定於固定構件63内側面之固定子XD12、XD22接觸於非磁性體塊69之狀態下,使用固定具(螺栓)630 將固定構件63固定於基墩62a。此處,由於相對固定構件63之内側面(相對Z軸傾斜±角θ之面)固定面(與XZ平面平行之面)並非平行,因此可藉由使固定構件63於圖28中以塗白箭頭所示之上下方向滑動來調整固定位置(高度),據以調整間隙之尺寸。此處,為能進行該調整,於固定部63形成有固定具(螺栓)630 可上下滑動、XZ剖面與圓相較於Z軸方向較長之長孔。In addition, the X-axis drive units XD1 and XD2 of the above-mentioned structure can easily adjust the gap between the movable elements XD11 and XD21 and the fixed elements XD12 and XD22 without using adjustment plates such as spacers. Hereinafter, the adjustment procedure will be explained based on FIG. 28. When adjusting, the operator first fixes the movable member 84 to the base pier 62a using an appropriate fixture. Next, the operator installs a non-magnetic body block 69 having a thickness of g that is larger than the movable members XD11 and XD21 by an appropriate gap amount g to both sides of the movable member 84. Next, the operator uses a fixture (bolt) 63 0 to fix the fixing member 63 to the base pier 62a in a state where the fixing members XD12 and XD22 fixed to the inner surface of the fixing member 63 are in contact with the non-magnetic block 69. Here, since the fixed surface (a surface parallel to the XZ plane) relative to the inner surface of the fixed member 63 (a surface inclined by ± angle θ with respect to the Z axis) is not parallel, the fixed member 63 can be painted white in FIG. 28 Slide up and down as indicated by the arrow to adjust the fixed position (height) and adjust the size of the gap accordingly. Here, in order to be able to perform this adjustment, a fixing tool (bolt) 63 0 is formed with an elongated hole that is slidable up and down and whose XZ cross section and circle are longer in the Z axis direction than the Z axis.

接著,作業員一邊變化可動構件84之X位置、一邊同樣的將所有固定構件63(除最+X端及最-X端之固定構件63之外)固定於基墩62a。最後,作業員在使可動構件84退至+X端(或-X端)之狀態下,將非磁性體塊69更換為可動子XD11、XD21後,將±X端之固定構件63固定於基墩62a。Next, while changing the X position of the movable member 84, the operator similarly fixes all the fixing members 63 (except the fixing members 63 at the +X end and the -X end) to the base pier 62a. Finally, the operator retreats the movable member 84 to the +X end (or -X end), replaces the non-magnetic block 69 with the movable elements XD11, XD21, and fixes the ±X end fixing member 63 to the base pier. 62a.

據此,即能將固定子XD12、XD22牢牢的固定在固定構件63内側面之大範圍,亦能容量的調整與可動子XD11、XD21間之間隙。此外,由於X軸驅動單元XD1、XD2之構造物加工精度可較不精密,因此較為經濟。其結果,能以低價構成驅動精度高的基板載台裝置PSTe。又,由於固定子XD12、XD22(磁石單元)係固定在X軸驅動單元XD1、XD2之内側(固定構件63之内側面),因此即使磁性體接近固定構件63之外側面,亦不致被吸引。According to this, the fixed elements XD12 and XD22 can be firmly fixed to the wide range of the inner surface of the fixed member 63, and the gap between the volume and the movable elements XD11 and XD21 can also be adjusted. In addition, since the processing accuracy of the structures of the X-axis drive units XD1 and XD2 can be less precise, it is more economical. As a result, the substrate stage device PSTe with high driving accuracy can be constructed at low cost. In addition, since the stators XD12 and XD22 (magnet units) are fixed on the inner side of the X-axis drive units XD1 and XD2 (the inner side of the fixing member 63), even if the magnetic body approaches the outer side of the fixing member 63, it will not be attracted.

以上述方式構成之本第5實施形態之曝光裝置,雖省略詳細説明,但係以和前述第1實施形態之曝光裝置10相同之程序進行批次處理。Although the detailed description of the exposure apparatus of the fifth embodiment constructed as described above is omitted, batch processing is performed in the same procedure as the exposure apparatus 10 of the aforementioned first embodiment.

如以上之説明,根據本第5實施形態之曝光裝置,除能將基板載台ST(X載台STX)驅動於X軸方向之一對X軸驅動單元XD1、XD2之各個所具備之第1可動子XD11與第1固定子XD12之間產生之引力Fz1、與在第2可動子XD21與第2固定子XD22之間產生之引力Fz2之垂直分力的合力P,作為浮力加以利用來減輕含基板載台ST自重之施加於基墩62a、62b之負荷,並能在不損及驅動性能之情形下進行高精度之基板載台ST(X載台STX)之驅動控制。As described above, according to the exposure apparatus of the fifth embodiment, the substrate stage ST (X stage STX) can be driven in the X-axis direction. The first pair of X-axis drive units XD1 and XD2 are provided. The resultant force P of the vertical component of the gravitational force Fz1 generated between the movable member XD11 and the first stator XD12 and the gravitational force Fz2 generated between the second movable member XD21 and the second stator XD22 is used as buoyancy to reduce The substrate stage ST's own weight exerts a load on the base piers 62a, 62b, and can perform high-precision drive control of the substrate stage ST (X stage STX) without compromising the driving performance.

又,根據本第5實施形態之曝光裝置,由於能在基板P之掃描曝光時以高精度驅動保持基板P之基板載台ST(正確來說,是透過Y載台STY保持基板P之X載台STX),因此可進行對基板P之高精度的曝光。In addition, according to the exposure apparatus of the fifth embodiment, the substrate stage ST that holds the substrate P can be driven with high precision during scanning exposure of the substrate P (to be precise, the X stage that holds the substrate P through the Y stage STY Stage STX), so high-precision exposure of the substrate P can be performed.

又,上述第5實施形態中,雖係使用具有等邊梯形之剖面的可動構件84構成X軸驅動單元XD1(XD2),但亦可取代此,使用以下第1及第2變形例所示之非等邊梯形之梯形剖面的可動構件84來構成X軸驅動單元XD1(XD2)。In addition, in the above-mentioned fifth embodiment, although the X-axis drive unit XD1 (XD2) is constituted by the movable member 84 having an equilateral trapezoidal cross-section, it may be replaced by the following first and second modification examples. The movable member 84 with a trapezoidal cross-section of a non-equlateral trapezoid forms an X-axis drive unit XD1 (XD2).

圖29中顯示了第1變形例之X軸驅動單元XD1(XD2)之構成(惟,針對基墩62a、固定構件63、可動構件84,為方便起見,係賦予與上述第5實施形態相同之符號)。此圖29之構成中,可動構件84之±Y側面之傾斜角互異(θ1 >θ2 )。因此,線性馬達XDM1、XDM2之磁吸力F1、F2之水平方向成分彼此不會抵消,於可動構件84會作用-Y方向之合力Py。Fig. 29 shows the configuration of the X-axis drive unit XD1 (XD2) of the first modification (However, for the base pier 62a, the fixed member 63, and the movable member 84, for convenience, the same as the fifth embodiment described above is given The symbol). In the configuration of Fig. 29, the inclination angles of the ±Y side of the movable member 84 are different from each other (θ 12 ). Therefore, the horizontal direction components of the magnetic attraction forces F1 and F2 of the linear motors XDM1 and XDM2 will not cancel each other, and the resultant force Py in the -Y direction will act on the movable member 84.

此圖29之X軸驅動單元XD1(XD2)之構成中,作為導引裝置係使用止推型靜壓氣體軸承裝置XG3a、XG4。於基墩62a之凹溝内部底面及兩側面形成有高平坦度的導引面XGG3、XGG4(導引面XGG3、XGG4,分別具有凹溝底面與側面正交的二個導引面)。於可動構件84之底面,安裝有分別具有與導引面XGG3、XGG4對向之軸承面的複數個靜壓氣體軸承之空氣墊XGP3、XGP4。空氣墊XGP3、XGP4透過閥門(補償要件)對該等軸承面與導引面XGG3、XGG4間之些微的間隙(軸承間隙)内噴出高壓空氣。此處,空氣墊XGP3、XGP4之各個,具有限制可動構件84之縱搖(pitching)運動與偏轉(yawing)運動之二個空氣墊的功能。In the structure of the X-axis drive unit XD1 (XD2) in Fig. 29, thrust-type static pressure gas bearing devices XG3a, XG4 are used as guide devices. Highly flat guide surfaces XGG3 and XGG4 are formed on the inner bottom surface and both side surfaces of the recess 62a of the base pier 62a (the guide surfaces XGG3, XGG4 have two guide surfaces perpendicular to the bottom surface and the side surface of the recess respectively). On the bottom surface of the movable member 84, air cushions XGP3 and XGP4 of a plurality of static pressure gas bearings having bearing surfaces opposite to the guide surfaces XGG3 and XGG4 are installed. The air cushions XGP3, XGP4 spray high-pressure air into the slight gaps (bearing gaps) between the bearing surfaces and the guide surfaces XGG3, XGG4 through the valve (compensation element). Here, each of the air cushions XGP3 and XGP4 has the function of restricting the pitching movement and the yawing movement of the movable member 84.

於止推型靜壓氣體軸承裝置XG3a、XG4,藉由對可動構件84施加外力以將空氣墊XGP3、XGP4之軸承面壓於導引面XGG3、XGG4,可提升間隙内空氣膜(空氣墊)之剛性。因此,適當決定可動構件84之±Y側面之傾斜角θ1 、θ2 ,並調整線性馬達XDM1、XDM2之磁吸力F1、F2之鉛直方向成分之合力Pz與水平方向成分之合力Py,以調整施加於空氣墊XGP3、XGP4之鉛直方向之負荷與水平方向之負荷,即能任意的調整各空氣墊之剛性。In thrust-type static pressure gas bearing devices XG3a, XG4, by applying external force to the movable member 84 to press the bearing surfaces of the air cushions XGP3, XGP4 against the guide surfaces XGG3, XGG4, the air film (air cushion) in the gap can be lifted The rigidity. Therefore, appropriately determine the inclination angles θ 1 and θ 2 of the ±Y side of the movable member 84, and adjust the resultant force Pz of the vertical component of the magnetic attraction force F1, F2 of the linear motor XDM1, XDM2 and the resultant force Py of the horizontal component of the horizontal component to adjust The vertical load and horizontal load applied to the air cushions XGP3 and XGP4 can adjust the rigidity of each air cushion at will.

又,適當決定可動構件84之±Y側面之傾斜角θ1 、θ2 以調整合力Py,並調整施加於空氣墊XGP3、XGP4之水平方向之負荷,極能使空氣墊XGP3、XGP4中一方之剛性高於另一方之剛性。如此,可使可動構件84沿一方之導引面移動。因此,在凹溝兩側面形成之導引面XGG3、XGG4之平行度不佳時,可使可動構件84沿剛性高之一方之空氣墊對向之導引面移動。此外,在凹溝兩側面形成之導引面XGG3、XGG4之一方之真直度不佳時,可藉由提高與導引面XGG3、XGG4之另一方對向之空氣墊的剛性,來使可動構件84沿剛性高之一方之空氣墊對向之真直度較佳之導引面移動。In addition, the inclination angle θ 1 and θ 2 of the ±Y side of the movable member 84 are appropriately determined to adjust the resultant force Py, and the horizontal load applied to the air cushions XGP3 and XGP4 is adjusted, which can make one of the air cushions XGP3 and XGP4 extremely The rigidity is higher than the rigidity of the other party. In this way, the movable member 84 can be moved along one guide surface. Therefore, when the guide surfaces XGG3 and XGG4 formed on the two sides of the groove are not well parallel, the movable member 84 can be moved along the guide surface facing the air cushion with the higher rigidity. In addition, when the straightness of one of the guide surfaces XGG3, XGG4 formed on both sides of the groove is not good, the rigidity of the air cushion facing the other of the guide surfaces XGG3, XGG4 can be increased to make the movable member 84 moves along the guiding surface with the better straightness facing the air cushion with the higher rigidity.

圖30中顯示了X軸驅動單元XD1(XD2)之第2變形構成(惟,針對基墩62a、固定構件63、可動構件84,為方便起見,係賦予與上述第5實施形態相同之符號)。此圖30之構成中,於凹溝之-Y側,於其底面與側面形成有前述導引面XGG3,但於凹溝之+Y側,則僅於其底面形成有導引面XGG4’。而具有與此等導引面XGG3、XGG4’分別對向之軸承面的空氣墊XGP3、XGP4’安裝在可動構件84之底面。此場合,亦與上述第1變形例同樣的,可沿與空氣墊XGP3對向之導引面XGG3使可動構件84移動。Fig. 30 shows the second modified configuration of the X-axis drive unit XD1 (XD2) (However, for the base pier 62a, the fixed member 63, and the movable member 84, for convenience, the same symbols as in the above-mentioned fifth embodiment are given ). In the structure of Fig. 30, on the -Y side of the groove, the aforementioned guide surface XGG3 is formed on the bottom and side surfaces, but on the +Y side of the groove, only the guide surface XGG4' is formed on the bottom surface. On the bottom surface of the movable member 84, air cushions XGP3 and XGP4' having bearing surfaces facing these guide surfaces XGG3 and XGG4', respectively. In this case, as in the first modification described above, the movable member 84 can be moved along the guide surface XGG3 facing the air cushion XGP3.

又,由於在基墩62a之凹溝兩側面形成高平坦度之導引面,一般是不容易的,因此亦可使用複數個分割構件來構成基墩62a,而於凹溝兩側面設置導引面。Moreover, since it is generally not easy to form high-flatness guide surfaces on both sides of the groove of the base pier 62a, it is also possible to use a plurality of divided members to form the pier 62a, and guides are provided on both sides of the groove. surface.

又,上述第5實施形態,係針對於二個X軸驅動單元XD1、XD2所具備之線性馬達XDM1、XDM2之各個,在固定子(XD11、XD21)與可動子(XD12、XD22)之間產生磁吸力,該吸引力之鉛直方向成分係從固定子側拉起可動子之方向的情形做了說明。然而,並不限於此,亦可採用例如於上述第5實施形態之線性馬達XDM1、XDM2之各個中,將固定子(XD11、XD21)與可動子(XD12、XD22)之位置互換之構成。此場合,可作成在固定子(XD11、XD21)與可動子(XD12、XD22)之間,於X載台STX之X軸方向之驅動時產生磁性斥力,而該斥力之鉛直方向成分係從固定子側將可動子頂起的方向。在此種場合,亦能將固定子(XD11、XD21)與可動子(XD12、XD22)之間產生之力之鉛直方向成分之合力利用為浮力,而獲得與上述第5實施形態同等之效果。除此之外,亦可取代或在固定子(XD11、XD21)與可動子(XD12、XD22)之間之磁力再加上其他吸力(例如真空吸力等)或斥力(例如氣體靜壓等),至少在X載台STX之X軸方向驅動時作用。此種場合時,亦可將上述吸力或斥力之鉛直方向成分作為浮力加以利用。In addition, the above-mentioned fifth embodiment is directed to each of the linear motors XDM1 and XDM2 provided in the two X-axis drive units XD1 and XD2, which are generated between the fixed element (XD11, XD21) and the movable element (XD12, XD22) The magnetic attraction force, the vertical direction component of the attraction force is explained in the direction in which the movable element is pulled up from the fixed element side. However, it is not limited to this. For example, in each of the linear motors XDM1 and XDM2 of the fifth embodiment, the position of the fixed element (XD11, XD21) and the movable element (XD12, XD22) may be interchanged. In this case, it can be made to generate magnetic repulsion force between the fixed element (XD11, XD21) and the movable element (XD12, XD22) when the X stage STX is driven in the X-axis direction, and the vertical component of the repulsion force is from the fixed The direction in which the child side pushes the movable child up. In this case, the resultant force of the vertical component of the force generated between the fixed element (XD11, XD21) and the movable element (XD12, XD22) can also be used as buoyancy, and the same effect as the above-mentioned fifth embodiment can be obtained. In addition, it can also replace or add other attraction (such as vacuum suction, etc.) or repulsion (such as gas static pressure, etc.) to the magnetic force between the fixed element (XD11, XD21) and the movable element (XD12, XD22), It works at least when the X stage STX is driven in the X axis direction. In this case, the vertical component of the aforementioned attraction or repulsion can also be used as buoyancy.

又,上述第5實施形態中,雖係於Y載台STY上裝載基板P,但亦可如例如美國專利申請公開第2010/0018950號說明書所揭示之載台裝置般,設置相對Y載台STY能被微驅動於6自由度方向之微動載台,於該微動載台上裝載基板P。此場合,亦可設置如上述美國專利申請公開第2010/0018950號說明書所揭示之重量消除裝置,從下方支承上述微動載台。In addition, in the above-mentioned fifth embodiment, although the substrate P is mounted on the Y stage STY, for example, the stage device disclosed in the US Patent Application Publication No. 2010/0018950 may be provided with a relative Y stage STY. A micro-motion stage that can be micro-driven in a 6-degree-of-freedom direction, and a substrate P is mounted on the micro-motion stage. In this case, a weight reduction device as disclosed in the specification of the aforementioned US Patent Application Publication No. 2010/0018950 can also be installed to support the aforementioned micro-movement stage from below.

又,上述各實施形態之曝光裝置中,照明光可以是ArF準分子雷射光(波長193nm)、KrF準分子雷射光(波長248nm)等之紫外光、或F2 雷射光(波長157nm)等之真空紫外光。此外,作為照明光,亦可使用例如將從DFB半導體雷射或光纖雷射發出之紅外線帶或可見光帶之單一波長雷射光以例如摻雜有鉺(或鉺及鐿兩者)之光纖放大器加以増幅,使用非線性光學結晶加以波長轉換為紫外光之諧波。再者,亦可使用固體雷射(波長:355nm、266nm)等。Further, the above-described exposure apparatus of various embodiments, the illumination light may be ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength of 248 nm) of ultraviolet light and the like, or F 2 laser beam (wavelength 157 nm), etc. Vacuum ultraviolet light. In addition, as the illuminating light, for example, single-wavelength laser light in the infrared band or visible light band emitted from a DFB semiconductor laser or fiber laser can be used, for example, a fiber amplifier doped with erbium (or both erbium and ytterbium). Amplification, using nonlinear optical crystals to convert the wavelength into harmonics of ultraviolet light. Furthermore, a solid laser (wavelength: 355nm, 266nm) or the like can also be used.

又,上述各實施形態,雖係針對投影光學系PL是具備複數支投影光學單元之多透鏡方式之投影光學系的情形作了説明,但投影光學單元之支數不限於此,只要是一支以上即可。此外,不限於多透鏡方式之投影光學系,亦可以是例如使用歐夫那(Ofner)型大型反射鏡的投影光學系等。In addition, although the above-mentioned embodiments described the case where the projection optical system PL is a multi-lens projection optical system with a plurality of projection optical units, the number of projection optical units is not limited to this, as long as it is one That's all. In addition, it is not limited to the projection optical system of the multi-lens method, and may be, for example, a projection optical system using an Ofner type large mirror.

又,上述各實施形態之曝光裝置中之投影光學系不限於等倍系,亦可以是縮小系及放大系之任一種,亦可以是折反射系、反射系及折射系之任一種。又,其投影像可以是倒立像及正立像之任一種。In addition, the projection optical system in the exposure apparatus of each of the above embodiments is not limited to the equal magnification system, and may be either a reduction system or an enlargement system, or any of a catadioptric system, a reflection system, and a refraction system. In addition, the projected image can be either an inverted image or an upright image.

又,上述實施形態中,雖係使用在光透射性之光罩基板上形成有既定遮光圖案(或相位圖案、減光圖案)之光透射型光罩,但亦可取代此光罩,使用例如美國專利第6,778,257號說明書所揭示之根據待曝光圖案之電子資料,來形成透射圖案或反射圖案、或發光圖案之電子光罩(可變成形光罩),例如使用非發光型影像顯示元件(亦稱空間光調變器)之一種之DMD(Digital Micro-mirror Device))的可變成形光罩。In addition, in the above-mentioned embodiment, although a light-transmissive photomask having a predetermined light-shielding pattern (or a phase pattern or a dimming pattern) formed on a light-transmitting photomask substrate is used, it can be replaced with this photomask, for example, The specification of US Patent No. 6,778,257 discloses an electronic mask (variable shape mask) that forms a transmission pattern, a reflection pattern, or a light-emitting pattern according to the electronic data of the pattern to be exposed, for example, a non-luminous image display element (also DMD (Digital Micro-mirror Device), which is a kind of spatial light modulator, is a variable shaping mask.

又,上述各實施形態之曝光裝置,特別是對使尺寸(包含外徑、對角線、一邊之至少一個)為500mm以上之基板、例如液晶顯示元件等平板顯示器(FPD)用大型基板曝光之曝光裝置尤其有效。In addition, the exposure apparatus of each of the above-mentioned embodiments is particularly suitable for exposing large-scale substrates with dimensions (including at least one of the outer diameter, diagonal, and one side) of 500 mm or more, such as flat panel displays (FPDs) such as liquid crystal display elements. The exposure device is particularly effective.

又,上述各實施形態亦能適用於步進接合(step & stitch)方式之曝光裝置。此外,特別是上述第5實施形態可適用於例如靜止型曝光裝置。Moreover, each of the above-mentioned embodiments can also be applied to a step & stitch exposure apparatus. In addition, in particular, the fifth embodiment described above can be applied to, for example, a stationary exposure apparatus.

又,曝光裝置之用途並不限於將液晶顯示元件圖案轉印至方型玻璃板之液晶用曝光裝置,亦可廣泛適用於例如半導體製造用之曝光裝置、用以製造薄膜磁頭、微機器及DNA晶片等之曝光裝置。此外,不僅是半導體元件素子等之微元件,本發明亦能適用於為製造用於光曝光裝置、EUV曝光裝置、X線曝光裝置及電子線曝光裝置等之光罩或標線片,而將電路圖案轉印至玻基板或矽晶圓等之曝光裝置。再者,曝光對象之物體不限於玻璃板,亦可以是例如晶圓、陶瓷基板、薄膜構件或光罩基板(mask blank)等其他物體。又,曝光對象物是平板顯示器用基板之情形時,該基板之厚度並無特別限定,例如亦包含薄膜狀(具可撓性之片狀構件)者。In addition, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate, but can also be widely applied to, for example, exposure devices for semiconductor manufacturing, for the manufacture of thin film magnetic heads, micromachines, and DNA Exposure equipment for wafers, etc. In addition, not only micro-elements such as semiconductor elements, but also micro-elements, the present invention can also be applied to manufacture photomasks or reticles used in light exposure devices, EUV exposure devices, X-ray exposure devices, and electronic line exposure devices. The circuit pattern is transferred to exposure devices such as glass substrates or silicon wafers. Furthermore, the object to be exposed is not limited to a glass plate, and may also be other objects such as a wafer, a ceramic substrate, a thin film member, or a mask blank. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited. For example, a film-like (flexible sheet-like member) is also included.

此外,援用上述說明所引用之關於曝光裝置之所有公報、國際公開公報、美國專利及美國專利申請公開說明書之揭示作為本說明書記載之一部分。 《元件製造方法》In addition, the disclosures of all publications, international publications, U.S. patents, and U.S. patent application publications on exposure devices cited in the above description are cited as part of the description of this specification. "Component Manufacturing Method"

接著,說明於微影製程中使用上述各實施形態之曝光裝置之微元件製造方法。上述各實施形態之曝光裝置,亦可藉由在平板(玻璃基板)上形成既定圖案(電路圖案、電極圖案等),獲得作為微元件之液晶顯示元件。 〈圖案形成步驟〉Next, a description will be given of a method of manufacturing micro-elements using the exposure apparatus of the above-mentioned embodiments in the lithography process. The exposure apparatus of each of the above embodiments can also obtain a liquid crystal display element as a micro element by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a flat plate (glass substrate). <Pattern Formation Step>

首先,使用上述各實施形態之曝光裝置,實施將圖案像形成於感光性基板(塗有光阻之玻璃基板等)、所謂之微影製程。藉由此微影製程,於感光性基板上形成包含多數電極等之既定圖案。之後,曝光後之基板經由顯影步驟、蝕刻步驟、光阻剝離步驟等各步驟,於基板上形成既定圖案。 〈彩色濾光片形成步驟〉First, using the exposure device of each of the above embodiments, a so-called lithography process is performed to form a pattern image on a photosensitive substrate (a glass substrate coated with a photoresist, etc.). With this photolithography process, a predetermined pattern including many electrodes and the like is formed on the photosensitive substrate. After that, the exposed substrate undergoes various steps such as a development step, an etching step, and a photoresist stripping step to form a predetermined pattern on the substrate. <Color filter forming steps>

其次,形成對應R(Red)、G(Green)、B(Blue)之三個點之組多數排列成矩陣狀之彩色濾光片,或形成R、G、B三條線之濾光器之組複數排列於水平掃描線方向之彩色濾光片。 〈單元組裝步驟〉Secondly, form a group of three dots corresponding to R (Red), G (Green), and B (Blue). Most of the color filters arranged in a matrix, or a group of filters with three lines of R, G and B A plurality of color filters arranged in the horizontal scanning line direction. <Unit assembly steps>

接著,使用以圖案形成步驟所得之具有既定圖案之基板、以及於彩色濾光片形成步驟所得之彩色濾光片等組裝液晶面板(液晶單元)。例如,在圖案形成步驟所得之具有既定圖案之基板與彩色濾光片形成步驟所得之彩色濾光片之間注入液晶,以製造液晶面板(液晶單元)。 〈模組組裝步驟〉Next, a liquid crystal panel (liquid crystal cell) is assembled using a substrate with a predetermined pattern obtained in the pattern forming step, and a color filter obtained in the color filter forming step. For example, liquid crystal is injected between the substrate with a predetermined pattern obtained in the pattern forming step and the color filter obtained in the color filter forming step to manufacture a liquid crystal panel (liquid crystal cell). <Module assembly steps>

之後,安裝用以進行所組裝之液晶面板(液晶單元)之顯示動作之電路、背光單元等各零件而完成液晶顯示元件After that, install the circuit and backlight unit to perform the display operation of the assembled liquid crystal panel (liquid crystal unit) to complete the liquid crystal display element

此場合,於圖案形成步驟中,由於能使用上述各實施形態之曝光裝置以高生產率且高精度進行板片之曝光,其結果能提升液晶顯示元件之生産性。産業上之可利用性 In this case, in the pattern forming step, since the exposure device of each of the above embodiments can be used to expose the plate with high productivity and high precision, as a result, the productivity of the liquid crystal display element can be improved. Industrial availability

如以上之説明,本發明之曝光裝置適合於在曝光處理時相對曝光用能量束使曝光對象之物體於掃描方向以既定行程移動。又,本發明之移動體裝置非常適合用於移動體之驅動。此外,本發明之平板顯示器之製造方法非常適合用於平板顯示器之製造。本發明之元件製造方法適合微元件之生産。As explained above, the exposure device of the present invention is suitable for moving the object of the exposure target in the scanning direction with a predetermined stroke relative to the exposure energy beam during the exposure process. In addition, the mobile device of the present invention is very suitable for driving a mobile body. In addition, the method for manufacturing flat panel displays of the present invention is very suitable for manufacturing flat panel displays. The device manufacturing method of the present invention is suitable for the production of micro devices.

10、110:曝光裝置 12:底床 13:防振裝置 14:基座架 14a:基座架之本體部 14b:基座架之腳部 14c:基座架之調整器 16:光罩干涉儀 18X:X音圈馬達 18Y:Y音圈馬達 18Z:Z音圈馬達 19:基板載台架台 21:微動載台 22X:X移動鏡 22Y:Y移動鏡 23:粗動載台 23X:X粗動載台 23Y:Y粗動載台 24X、24Y:反射鏡基座 26:微動載台驅動系 40、40’、40A~40C:重量消除裝置 41:筐體 41C:主體 42:空氣彈簧 43:Z滑件 44:空氣軸承(基座墊) 45:連結裝置 46:靶 47:臂構件 48:平行板彈簧裝置 49:調平杯 50:主控制裝置 51:間隔件 52:Z感測器 57、57A:調平裝置 61a~61f:腳部 61a0~61f0:調整具 62a、62b:基墩 63:固定構件 630:固定具 64:多面體構件 65:空氣軸承 66:固定板 67e:平行板彈簧 68:板片 70A、70:風扇 71A:Y線性導件 71B:Y滑件 72A:Y可動子 73:Y固定子 74A:Y線性導件 74B:滑件 75:Y支架 76:板片 77A:Y線性導件 77B:滑件 78:輔助支架 79:連結構件 80A:X線性導件 80B:滑件 81A:X固定子 81B:X可動子 82:Y線性馬達 83:Y支架 84:可動構件 85:墊高塊 86:平行板彈簧 87:蓋 92:基板干涉儀系統 100:一組永久磁石 100a、100b:永久磁石 101:X柱 102:X導件 102a:導件本體 102b:肋部 103:輔助導件框 107:撓曲裝置 108:推進裝置 109:止推型空氣軸承 199:連接構件 200:脫落防止裝置 AL1~AL6:對準檢測系 EX:X線性編碼器系統 EXh1、EXh2:讀頭 EXs1、EXs2:標尺 EY:Y線性編碼器系統 F:地面 IL:曝光用照明光 IOP:照明系 M:光罩 MD1~MD6:標記像檢測系 MSD:光罩載台驅動系 MST:光罩載台 P:基板 PH:基板保持具 PL:投影光學系 PSD:基板載台驅動系 PST、PSTa~PSTe:基板載台裝置 STX:X載台 STY:Y載台 XD1、XD2:X軸驅動單元 XD11、XD21:可動子 XD12、XD22:固定子 XDM:X線性馬達 XG1、XG2、XG3:導引裝置 XG3a、XG4:止推型靜壓氣體軸承裝置 XGG3、XGG4:導引面 XGP3、XGP4:空氣墊 XGR1、XGR2、XGR3:X軸線性導件 XGS1、XGS2、XGS3:滑件 YD:Y軸驅動單元 YD1:可動子 YD2:固定子 YDM:Y線性馬達 YG:導引裝置 YGR:Y軸線性導件 YGS:滑件10.110: Exposure device 12: Bed 13: Anti-vibration device 14: Base frame 14a: Body part of the base frame 14b: Legs of the base frame 14c: Adjuster of the base frame 16: Optical mask interferometer 18X: X voice coil motor 18Y: Y voice coil motor 18Z: Z voice coil motor 19: substrate stage 21: fine movement stage 22X: X moving mirror 22Y: Y moving mirror 23: coarse movement stage 23X: X coarse movement Stage 23Y: Y Coarse movement stage 24X, 24Y: Mirror base 26: Micro-motion stage drive system 40, 40', 40A~40C: Weight reduction device 41: Chassis 41C: Main body 42: Air spring 43: Z Slide 44: Air bearing (base pad) 45: Connecting device 46: Target 47: Arm member 48: Parallel plate spring device 49: Leveling cup 50: Main control device 51: Spacer 52: Z sensor 57, 57A: Leveling device 61a to 61f: Legs 61a 0 to 61f 0 : Adjusters 62a, 62b: Foundation 63: Fixing member 63 0 : Fixing device 64: Polyhedral member 65: Air bearing 66: Fixing plate 67e: Parallel plate Spring 68: Plate 70A, 70: Fan 71A: Y Linear Guide 71B: Y Slider 72A: Y Movable Element 73: Y Fixer 74A: Y Linear Guide 74B: Slider 75: Y Bracket 76: Plate 77A : Y linear guide 77B: slider 78: auxiliary bracket 79: connecting member 80A: X linear guide 80B: slider 81A: X fixed member 81B: X movable member 82: Y linear motor 83: Y bracket 84: movable member 85: cushion block 86: parallel plate spring 87: cover 92: substrate interferometer system 100: a set of permanent magnets 100a, 100b: permanent magnet 101: X column 102: X guide 102a: guide body 102b: rib 103 : Auxiliary guide frame 107: Flexure device 108: Propulsion device 109: Thrust type air bearing 199: Connecting member 200: Falling prevention device AL 1 to AL 6 : Alignment detection system EX: X linear encoder system EXh1, EXh2 : Read head EXs1, EXs2: Scale EY: Y linear encoder system F: Floor IL: Exposure light IOP: Illumination system M: Mask MD 1 to MD 6 : Mark image detection system MSD: Mask stage drive system MST: Mask stage P: Substrate PH: Substrate holder PL: Projection optics PSD: Substrate stage drive system PST, PSTa~PSTe: Substrate stage device STX: X stage STY: Y stage XD1, XD2: X-axis drive unit XD11, XD21: movable element XD12, XD22: fixed element XDM: X linear motor XG1, XG2, XG3: guide device XG3a, XG4: thrust type hydrostatic gas bearing device XGG3, XGG4: guide surface XGP3 , XGP4: Air cushion XGR1, XGR2, XGR3: X axis linear guide XGS1, XGS2 XGS3: Slider YD: Y-axis drive unit YD1: Movable element YD2: Fixed element YDM: Y linear motor YG: Guide device YGR: Y-axis linear guide YGS: Slider

[圖1]係概略顯示第1實施形態之曝光裝置之構成的圖。 [圖2]係圖1之曝光裝置具有之基板載台的俯視圖。 [圖3](A)係從-Y方向觀察圖2之基板載台的側視圖(圖2之A-A線剖面圖)、圖3(B)係基板載台具有之重量消除裝置周邊的放大圖、圖3(C)則係基座架(-X側)周邊的放大圖。 [圖4]係除去微動載台後之基板載台的俯視圖(圖3(A)之B-B線剖面圖)。 [圖5]係圖2之C-C線剖面圖。 [圖6]係省略圖2之基板載台之一部分的立體圖。 [圖7]係顯示以第1實施形態之曝光裝置之控制系為中心構成之主控制裝置之輸出入關係的方塊圖。 [圖8]係概略顯示第2實施形態之曝光裝置之構成的圖。 [圖9]係圖8之曝光裝置具有之基板載台的俯視圖。 [圖10]係圖9之D-D線剖面圖。 [圖11]係除去微動載台後之基板載台的俯視圖(圖10之E-E線剖面圖)。 [圖12]係圖9之F-F線剖面圖。 [圖13]係圖9之基板載台裝置具有之重量消除裝置的剖面圖。 [圖14]係第3實施形態之基板載台的俯視圖。 [圖15]係圖14之G-G線剖面圖。 [圖16]係圖14之基板載台裝置具有之重量消除裝置的剖面圖。 [圖17]係第4實施形態之基板載台的俯視圖。 [圖18]係第1變形例之基板載台裝置所具有之重量消除裝置及調平裝置的剖面圖。 [圖19]係第2變形例之基板載台裝置所具有之重量消除裝置及調平裝置的剖面圖。 [圖20]係第3變形例之基板載台裝置所具有之重量消除裝置及調平裝置的剖面圖。 [圖21](A)係顯示X導件之變形例的圖、圖21(B)及圖21(C)係分別顯示其他變形例之基板載台裝置的圖。 [圖22]係顯示基板載台之其他變形例的圖。 [圖23]係顯示第5實施形態之曝光裝置所具備之載台裝置之概略構成的側視圖。 [圖24]係圖23之H-H線剖面圖。 [圖25]係用以說明第5實施形態之曝光裝置所具備之主控制裝置之輸出入關係的方塊圖。 [圖26]係顯示構成載台驅動系之單軸驅動單元之概略構成的剖面圖。 [圖27]係用以說明作用於單軸驅動單元之構成各部之力之平衡的圖。 [圖28]係用以說明單軸驅動單元之組裝方法的圖。 [圖29]係顯示單軸驅動單元之變形例(其1)的圖。 [圖30]係顯示單軸驅動單元之變形例(其2)的圖。[Fig. 1] A diagram schematically showing the structure of the exposure apparatus of the first embodiment. [Fig. 2] A plan view of a substrate stage included in the exposure apparatus of Fig. 1. [Fig. [Fig. 3] (A) is a side view of the substrate stage in Fig. 2 viewed from the -Y direction (a cross-sectional view along the line AA in Fig. 2), and Fig. 3(B) is the periphery of the weight reduction device of the substrate stage The enlarged view, Figure 3(C) is an enlarged view of the periphery of the base frame (-X side). [Fig. 4] It is a plan view of the substrate stage with the micro-movement stage removed (a cross-sectional view taken along line BB in Fig. 3(A)). [Figure 5] is a cross-sectional view taken along line CC in Figure 2. [Fig. 6] A perspective view of a part of the substrate stage of Fig. 2 omitted. [FIG. 7] A block diagram showing the input/output relationship of the main control device composed mainly of the control system of the exposure apparatus of the first embodiment. [Fig. 8] A diagram schematically showing the structure of the exposure apparatus of the second embodiment. Fig. 9 is a plan view of a substrate stage included in the exposure apparatus of Fig. 8. [Figure 10] is a cross-sectional view taken along the line D-D in Figure 9. [Fig. 11] It is a plan view of the substrate stage after the micro-movement stage is removed (E-E line cross-sectional view in Fig. 10). [Figure 12] is a cross-sectional view taken along the line F-F in Figure 9. [FIG. 13] A cross-sectional view of the weight reduction device included in the substrate stage device of FIG. 9. [Fig. 14] A plan view of the substrate stage of the third embodiment. [Figure 15] is a cross-sectional view taken along line G-G in Figure 14. [FIG. 16] A cross-sectional view of the weight reduction device included in the substrate stage device of FIG. 14. [Fig. 17] A plan view of the substrate stage of the fourth embodiment. [Fig. 18] is a cross-sectional view of the weight reduction device and the leveling device included in the substrate stage device of the first modification. [Fig. 19] is a cross-sectional view of the weight reduction device and the leveling device included in the substrate stage device of the second modification. Fig. 20 is a cross-sectional view of the weight reduction device and the leveling device included in the substrate stage device of the third modification. [FIG. 21] (A) is a diagram showing a modification of the X guide, and FIG. 21(B) and FIG. 21(C) are diagrams respectively showing a substrate stage device of another modification. [Fig. 22] A diagram showing another modification example of the substrate stage. Fig. 23 is a side view showing the schematic configuration of a stage device included in the exposure apparatus of the fifth embodiment. [Figure 24] is a cross-sectional view taken along the line H-H in Figure 23. [FIG. 25] A block diagram for explaining the input/output relationship of the main control device included in the exposure apparatus of the fifth embodiment. [Figure 26] is a cross-sectional view showing the schematic configuration of a single-axis drive unit constituting the stage drive system. [Fig. 27] A diagram for explaining the balance of forces acting on the components of the uniaxial drive unit. [Fig. 28] A diagram for explaining the assembly method of the single-axis drive unit. [Fig. 29] A diagram showing a modification (Part 1) of the single-axis drive unit. [Fig. 30] A diagram showing a modification (Part 2) of the single-axis drive unit.

12:底床 12: bottom bed

14:基座架 14: Pedestal frame

14a:基座架之本體部 14a: The body of the base frame

14b:基座架之腳部 14b: The feet of the base frame

14c:基座架之調整器 14c: Adjuster for base frame

18:音圈馬達 18: Voice coil motor

18X:X音圈馬達 18X: X voice coil motor

18Z:Z音圈馬達 18Z:Z voice coil motor

19:基板載台架台 19: Substrate carrier stage

21:微動載台 21: Micro-motion stage

22X:X移動鏡 22X:X moving mirror

22Y:Y移動鏡 22Y:Y moving mirror

23:粗動載台 23: coarse movement stage

23X:X粗動載台 23X:X coarse motion stage

23Y:Y粗動載台 23Y: Y coarse motion stage

24X、24Y:反射鏡基座 24X, 24Y: mirror base

40:重量消除裝置 40: Weight elimination device

41:筐體 41: Chassis

42:空氣彈簧 42: Air spring

43:Z滑件 43: Z Slide

44:空氣軸承(基座墊) 44: Air bearing (base pad)

45:連結裝置 45: Link device

57:調平裝置 57: leveling device

71A:Y線性導件 71A: Y linear guide

71B:Y滑件 71B: Y slider

72:Y可動子 72: Y movable element

73:Y固定子 73: Y anchor

74A:Y線性導件 74A: Y linear guide

74B:滑件 74B: Slide

75:Y支架 75: Y bracket

76:板片 76: plate

77A:Y線性導件 77A: Y linear guide

77B:滑件 77B: Slide

79:連結構件 79: Connection member

80A:X線性導件 80A: X linear guide

80B:滑件 80B: Slide

101:X柱 101: X column

102:X導件 102: X guide

102a:導件本體 102a: guide body

102b:肋部 102b: ribs

103:輔助導件框 103: auxiliary guide frame

F:地面 F: Ground

P:基板 P: substrate

PH:基板保持具 PH: substrate holder

PST:基板載台裝置 PST: substrate stage device

Claims (9)

一種曝光裝置,其一面使物體相對能量束移動於第1方向一面進行曝光,具備: 保持部,其保持該物體; 第1支承部,其支承該保持部,且能夠向該第1方向移動; 第2支承部,其支承向該第1方向移動之該第1支承部; 第1基座,其支承向與該第1方向交叉之第2方向移動之該第2支承部; 驅動部,其將該第1支承部相對該第2支承部驅動向該第1方向,且將該第2支承部驅動向該第2方向;以及 第2基座,其與該第1基座分離配置於該第1方向,且支承該驅動部。An exposure device, one side of which allows an object to move relative to an energy beam in a first direction while performing exposure, and includes: The holding part, which holds the object; A first supporting portion, which supports the holding portion and can move in the first direction; A second supporting portion that supports the first supporting portion that moves in the first direction; A first base that supports the second supporting portion that moves in a second direction that crosses the first direction; A driving portion that drives the first support portion in the first direction relative to the second support portion, and drives the second support portion in the second direction; and The second base is disposed in the first direction separately from the first base and supports the driving part. 如請求項1之曝光裝置,其進一步具備: 第1連結部,其將該第1支承部與該驅動部連結; 該驅動部係在該第1方向透過該第1連結部驅動該第1支承部。Such as the exposure device of claim 1, which further has: A first connecting portion which connects the first supporting portion with the driving portion; The driving part drives the first support part through the first connection part in the first direction. 如請求項1或2之曝光裝置,其進一步具備: 第2連結部,其將該第2支承部與該驅動部連結; 該驅動部係在該第2方向透過該第2連結部驅動該第2支承部。Such as the exposure device of claim 1 or 2, which further has: A second connecting portion which connects the second supporting portion with the driving portion; The driving part drives the second support part through the second connecting part in the second direction. 如請求項1至3項中任一項之曝光裝置,其中, 該驅動部具有將該第1支承部相對該第2支承部驅動向該第1方向之第1驅動系,以及將該第2支承部驅動向該第2方向之第2驅動系; 該第2驅動系支承該第1驅動系。Such as the exposure device of any one of claims 1 to 3, wherein: The driving portion has a first drive system that drives the first support portion in the first direction relative to the second support portion, and a second drive system that drives the second support portion in the second direction; The second drive system supports the first drive system. 如請求項1至4項中任一項之曝光裝置,其中, 該物體係用於平板顯示器之基板。Such as the exposure device of any one of claims 1 to 4, wherein: The material system is used for the substrate of flat panel display. 如請求項5之曝光裝置,其中, 該基板之至少一邊之長度或對角線長為500 mm以上。Such as the exposure device of claim 5, in which, The length or diagonal length of at least one side of the substrate is 500 mm or more. 一種平板顯示器之製造方法,其包含 使用請求項5或6之曝光裝置曝光該物體之動作;以及 使曝光後之該物體顯影之動作。A method for manufacturing a flat panel display, which comprises The action of exposing the object using the exposure device of claim 5 or 6; and The action of developing the object after exposure. 一種元件製造方法,其包含 使用請求項1至6項中任一項之曝光裝置曝光該物體之動作;以及 使曝光後之該物體顯影之動作。A component manufacturing method, which includes The action of exposing the object using the exposure device of any one of claim items 1 to 6; and The action of developing the object after exposure. 一種曝光方法,其一面使物體相對能量束移動於第1方向一面進行曝光,包含: 使支承保持該物體之保持部之第1支承部向該第1方向移動之動作; 藉由第2支承部支承向該第1方向移動之該第1支承部之動作; 藉由第1基座支承向與該第1方向交叉之第2方向移動之該第2支承部之動作; 藉由驅動系將該第1支承部相對該第2支承部驅動向該第1方向,且將該第2支承部驅動向該第2方向之動作;以及 藉由與該第1基座分離配置於該第1方向之第2基座支承該驅動系之動作。An exposure method, in which one side moves an object relative to the energy beam in the first direction while performing exposure, which includes: An action of moving the first supporting portion of the holding portion supporting and holding the object in the first direction; Supporting the movement of the first supporting portion moving in the first direction by the second supporting portion; The action of supporting the second supporting portion moving in a second direction crossing the first direction by the first base; An action of driving the first support portion in the first direction relative to the second support portion by a drive system, and driving the second support portion in the second direction; and The operation of the driving system is supported by a second base that is separated from the first base and arranged in the first direction.
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