TW202022963A - Substrate processing system - Google Patents

Abstract

A substrate processing system includes a processing device, a recycling tank, a drain pipe, and a coolant supply unit. The processing device processes the substrate by a liquid treatment agent. The recycling tank can accommodate the liquid treatment agent. The drain pipe is connected to the recycling tank. The coolant supply unit is connected to the drain pipe and is able to supply a coolant to the drain pipe so that the coolant and the liquid treatment agent mix and form a mixture. The drain pipe can discharge the mixture and the liquid treatment agent of the recycling tank to an exterior.

Description

Substrate processing system

The present invention relates to a substrate processing system, in particular to a substrate processing system using a processing liquid.

Current semiconductor device manufacturing methods require various wet processes, such as etching, cleaning, and electroplating. When performing these wet processes, a variety of processing liquids are used to process the substrate, and the processing liquids are, for example, etching liquids, cleaning liquids, and electroplating liquids. The treatment liquid is usually circulated in the production line and reused. In the circulation of the treatment liquid, the treatment liquid will be stored in the recovery tank, which can collect the used treatment liquid and output the usable treatment liquid Go to the wet process machine to perform the wet process.

In some wet processes, the temperature of the processing liquid will rise. For example, some etching processes use hot phosphoric acid to etch silicon nitride. When the temperature of the treatment liquid rises to a certain level, the treatment liquid may enter a boiling state. Sometimes, although the temperature of the treatment liquid is high enough to enter a boiling state, because the internal molecules of the treatment liquid have not yet vaporized, it will not boil. It will not boil suddenly until the treatment liquid is disturbed, producing a large amount of gas. This sudden boiling phenomenon is called sudden boiling. Since boiling will produce a large amount of gas, it is prone to explosion hazard. In addition, abrupt boiling usually generates a lot of heat energy and splashes the treatment liquid, which may result in personal burns or injury by the corrosive treatment liquid.

The present invention provides a substrate processing system, which utilizes cooling liquid supplied by a cooling liquid supply unit to reduce the temperature of the processing liquid to avoid the occurrence of bumping.

The present invention also provides a substrate processing system, which can help prevent the occurrence of bumping.

An embodiment of the present invention provides a substrate processing system, which includes a processing device, a recovery tank, a drain pipeline, and a cooling liquid supply unit. The processing device uses the processing liquid to process the substrate. The recovery tank is used to contain the treatment liquid. The drain pipeline is connected to the recovery tank and is used to discharge the treatment liquid in the recovery tank to the outer end. The cooling liquid supply unit is connected to the drain pipe and is used to supply the cooling liquid to the drain pipe so that the cooling liquid and the processing liquid are mixed into a mixed liquid, and the drain pipe is used to discharge the mixed liquid to the outer end.

In an embodiment of the present invention, the above-mentioned substrate processing system further includes a temperature monitoring unit connected to the drain pipe, which is used to monitor the drain temperature of the mixed liquid flowing to the outer end in the drain pipe. When the temperature monitoring unit detects that the discharge temperature is greater than the stop threshold, the discharge pipeline stops discharging the mixed liquid to the external end.

In an embodiment of the present invention, the above-mentioned substrate processing system further includes an abnormal temperature monitoring unit connected to the recovery tank, which is used to monitor the temperature of the processing liquid in the recovery tank. The cooling liquid supply unit is further connected to the recovery tank. When the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature value, the cooling liquid supply unit supplies the cooling liquid to the processing liquid in the recovery tank.

In an embodiment of the present invention, when the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature value, the temperature monitoring unit stops monitoring the discharge temperature, and the discharge pipeline recovers the The treatment liquid is discharged to the outer end.

In an embodiment of the present invention, the aforementioned substrate processing system further includes an exhaust device connected to the recovery tank. When the abnormal temperature monitoring unit detects that the temperature of the treatment liquid in the recovery tank is greater than or equal to the abnormal temperature value, the exhaust device exhausts the recovery tank.

Another embodiment of the present invention provides a substrate processing system, which includes a processing device, a recovery tank, an abnormal temperature monitoring unit, a drain pipeline, an exhaust device, and a coolant supply unit. The processing device uses the processing liquid to process the substrate. The recovery tank is used to contain the treatment liquid. The abnormal temperature monitoring unit is used to monitor the temperature of the treatment liquid in the recovery tank. The drain pipeline is connected to the recovery tank and is used to discharge the treatment liquid in the recovery tank to the outer end. The exhaust device is connected to the recovery tank and used to exhaust the recovery tank. The cooling liquid supply unit is connected to the recovery tank and used for supplying cooling liquid. When the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature value, the exhaust device exhausts the recovery tank, and the coolant supply unit supplies the cooling liquid to the processing liquid in the recovery tank to make The cooling liquid and the processing liquid are mixed to form a mixed liquid, and the liquid drain pipeline discharges the mixed liquid to the outer end.

In an embodiment of the present invention, when the abnormal temperature monitoring unit monitors that the temperature of the treatment liquid in the recovery tank is less than the abnormal temperature value, the exhaust device exhausts with the first exhaust volume. When the abnormal temperature monitoring unit monitors that the temperature of the treatment liquid in the recovery tank is greater than or equal to the abnormal temperature value, the exhaust device exhausts with a second exhaust volume, wherein the second exhaust volume is greater than the first exhaust volume.

In an embodiment of the present invention, when the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature value, the cooling liquid supply unit supplies the cooling liquid to the recovery tank and the drain line to recover The tank and the drain pipe form a mixed liquid, and the drain pipe discharges the mixed liquid to the outer end.

In an embodiment of the present invention, it further includes controlling the ratio of the flow rate of the cooling liquid supplied by the cooling liquid supply unit to the drain line and the flow rate of the mixed liquid discharged from the recovery tank by the drain line, wherein the ratio is between Between 2:1 and 5:1.

In an embodiment of the present invention, the aforementioned recovery tank includes a treatment liquid containing area and a gas buffer zone. The treatment liquid is contained in the treatment liquid containing area, and the gas generated by the treatment liquid is released to the gas buffer zone.

In an embodiment of the present invention, the above-mentioned substrate processing system further includes a housing and a liquid leakage detection unit, wherein the recovery tank and at least a part of the drain pipe are arranged in the housing, and the liquid leakage monitoring unit is connected to the housing. When the liquid leakage detection unit detects liquid leakage outside the casing, the liquid discharge pipe stops discharging the processing liquid to the external end.

Based on the above, the cooling liquid supplied by the cooling liquid supply unit can not only reduce the temperature of the processing liquid, but also eliminate the conditions for the sudden boiling of the processing liquid, so as to reduce the probability of sudden boiling. In this way, the present invention can protect the on-site personnel from the danger of sudden boiling and explosion.

In order to make the features and advantages of the present invention more comprehensible, the following specific embodiments are cited in conjunction with the accompanying drawings, which are described in detail as follows.

FIG. 1 is a schematic diagram of a substrate processing system according to an embodiment of the invention. Please refer to FIG. 1, the substrate processing system 10 includes a processing device 100, a recovery tank 200, a drain pipe 300 (represented by a slanted area in FIG. 1 ), and a cooling liquid supply unit 400. The substrate processing system 10 can be applied to a semiconductor manufacturing process, and the processing device 100 can use the processing liquid L1 to process a substrate (not shown), where the substrate is, for example, a wafer, but is not limited thereto. The above-mentioned substrate may be in the form of a substrate, a carrier, a wafer, a chip, etc., and may be a round or a square, and is not limited thereto. The processing device 100 can be applied to a wet process, such as etching, cleaning, or electroplating, and the processing liquid L1 can be an etching liquid, a cleaning liquid, or a plating liquid. Therefore, the processing device 100 may be an etching, cleaning or electroplating equipment. The processing device 100 can also be applied to single-substrate wet processing, multi-substrate wet processing, single square wafer under-ball metal etching, thinned wafer support/stripping, bonding/stripping process, silicon carbide regenerated wafer or regenerated silicon wafer , But not limited to this.

The recovery tank 200 can contain the treatment liquid L1 and may include a treatment liquid storage area 210 and a gas buffer area 220. The processing liquid L1 is contained in the processing liquid accommodating area 210, in which the gas generated by the processing liquid L1 is released to the gas buffer area 220, and the provision of the gas buffer area 220 helps the buffer space when the processing liquid L1 generates a large amount of gas. When a sudden boiling condition may occur, the gas buffer zone 220 contributes to the equipment safety of the recovery tank 200, in which the gas generated by the treatment liquid L1 is generated by evaporation. In other words, the space occupied by the processing liquid L1 in the recovery tank 200 is defined as the processing liquid containing area 210, and the space occupied by the gas generated by the processing liquid L1 in the recovery tank 200 is defined as the gas buffer zone 220, where The processing liquid containing area 210 and the gas buffer area 220 will vary with the amount of the processing liquid L1 in the recovery tank 200. From this, it can be seen that the treatment liquid L1 only occupies a part of the space in the recovery tank 200 and does not fill the entire recovery tank 200.

The drain line 300 is connected to the recovery tank 200 and can drain the processing liquid L1 from the substrate processing system 10 to the external end 20. For example, the drain line 300 can drain the processing liquid L1 in the recovery tank 200 to the external end 20. The drain line 300 may have an on-off valve 310, which is located in the conveying path of the treatment liquid L1 between the recovery tank 200 and the external end 20, wherein the on-off valve 310 may be a solenoid valve. When the on-off valve 310 is closed, the processing liquid L1 in the recovery tank 200 will not be discharged to the external end 20. When the on-off valve 310 is opened, the treatment liquid L1 in the recovery tank 200 can be discharged to the outer end 20. In addition, the external end 20 may be the waste liquid treatment equipment of the factory, so that the factory can properly process the treatment liquid L1 without affecting the environmental protection and causing industrial safety hazards.

The substrate processing system 10 may further include a recovery line 150a and a liquid supply line 150b, wherein the recovery line 150a and the liquid supply line 150b are connected to the processing device 100 and the recovery tank 200, so that the processing liquid L1 can pass through the recovery line 150a It is transported between the recovery tank 200 and the processing device 100 with the liquid supply line 150b. The processing liquid L1 in the processing device 100 can be transported to the recovery tank 200 via the recovery line 150a, and the processing liquid L1 in the recovery tank 200 can be transported to the processing device 100 via the liquid supply line 150b. In this way, the processing liquid L1 can be circulated and transported between the processing device 100 and the recovery tank 200 to supply the processing liquid L1 to the processing device 100 and make full use of the processing liquid L1.

In the embodiment shown in FIG. 1, the substrate processing system 10 may further include a chemical liquid supply unit 700 which is connected to the recovery tank 200. The liquid chemical supply unit 700 can supply the treatment liquid L1 to the recovery tank 200 to supplement the treatment liquid L1. After the old treatment liquid L1 in the recovery tank 200 is completely discharged to the external end 20, the chemical liquid supply unit 700 can supply the new treatment liquid L1 to the recovery tank 200 to replace the old treatment liquid L1. In addition, it should be noted that in other embodiments, the substrate processing system 10 may not include the chemical liquid supply unit 700, and the entire recovery tank 200 may be replaced with a new recovery tank 200. For example, the recovery tank 200 may be a container provided by the supplier that originally contained the treatment liquid L1, that is, the supplier provides the treatment liquid L1 together with the recovery tank 200 containing the treatment liquid L1, so the recovery tank 200 can also be replaced . Therefore, the chemical liquid supply unit 700 shown in FIG. 1 is for illustration only, and it is not limited to the substrate processing system 10 to include the chemical liquid supply unit 700.

The cooling liquid supply unit 400 is connected to the drain pipe 300 and can supply cooling liquid to the drain pipe 300 so that the cooling liquid and the processing liquid L1 in the drain pipe 300 are mixed into a mixed liquid. The cooling liquid can react chemically with the treatment liquid L1 to reduce the toxicity of the treatment liquid L1. Alternatively, no chemical reaction occurs between the cooling liquid and the processing liquid L1, and only cooling is performed. Taking this as an example, the cooling liquid may be deionized water and the cooling liquid supply unit 400 may be connected to a source of deionized water in a factory building or a liquid storage tank containing the cooling liquid.

The cooling liquid supply unit 400 may have a cooling liquid pipe 410a and an on-off valve 420, wherein the cooling liquid pipe 410a is connected to the drain pipe 300, and the on-off valve 420 is installed between the cooling liquid pipe 410a and the drain pipe 300 between. When the on-off valve 420 is opened, the cooling liquid supply unit 400 can supply the cooling liquid to the drain line 300 via the cooling liquid line 410a. When the on-off valve 420 is closed, the cooling liquid supply unit 400 stops supplying the cooling liquid to the drain pipe 300.

Before the cooling liquid is mixed with the processing liquid L1, the temperature of the cooling liquid may be lower than the processing liquid L1, so that the temperature of the above-mentioned mixed liquid can be lower than the temperature of the processing liquid L1. Therefore, the cooling liquid can lower the temperature of the processing liquid L1, thereby preventing the processing liquid L1 from overheating after bumping, which affects the safety of the drain pipe 300 and the outer end 20. Since the cooling liquid supply unit 400 is connected to the drain pipe 300, the drain pipe 300 can also discharge the above-mentioned mixed liquid to the outer end 20. In other words, the drain pipe 300 will drain the lowered temperature of the mixed liquid to the factory for subsequent waste liquid treatment.

The substrate processing system 10 further includes a temperature monitoring unit 510 connected to the drain pipe 300 for monitoring the drain temperature of the processing liquid L1 flowing to the outer end 20 in the drain pipe 300. Therefore, the temperature monitoring unit 510 monitors the temperature of the treatment liquid L1 received by the external terminal 20. The temperature monitoring unit 510 is essentially a thermometer and has a detection unit for temperature measurement. In this embodiment, the temperature monitoring unit 510 can be essentially an electronic thermometer and has a metal probe for measuring the temperature of the liquid (for example, the treatment liquid L1 or the mixed liquid). The drain pipe 300 may have an on-off valve 320, where the on-off valve 320 may be located in the conveying path between the temperature monitoring unit 510 and the external end 20, and at the end of the drain pipe 300. Therefore, the on-off valve 320 can be used as the last valve for the discharge pipe 300 to discharge to the external end 20, that is, whether the liquid in the discharge pipe 300 (for example, mixed liquid or treatment liquid L1) is finally discharged to the external end 20 will be determined by the on-off valve 320 decision.

FIG. 2 is a schematic diagram of the operation flow of the temperature monitoring unit in FIG. 1. 1 and 2, in the operation process of the temperature monitoring unit 510, first, step S101 is executed to activate the temperature monitoring unit 510 to monitor the discharge temperature of the treatment liquid L1 flowing to the external end 20 in the discharge pipe 300. In other words, the temperature monitoring unit 510 after activation will continuously measure the temperature of the treatment liquid L1 flowing to the external end 20 in the liquid discharge pipe 300 (ie, the liquid discharge temperature). Next, step S102 is executed to monitor whether the discharge temperature of the treatment liquid L1 is greater than the stop threshold.

When the temperature monitoring unit 510 detects that the discharge temperature is greater than the stop threshold, step S103 is executed to stop the discharge pipe 300 from discharging the treatment liquid L1 to the external end 20, that is, the on-off valve 320 will be closed to allow the discharge pipe 300 to flow The treatment liquid L1 stops being discharged to the outer end 20. When the temperature monitoring unit 510 detects that the liquid discharge temperature is less than the stop threshold, step S104 is executed to make the liquid discharge pipe 300 discharge the treatment liquid L1 to the external end 20, that is, the on-off valve 320 will be opened to allow the treatment liquid L1 to be discharged to the external end 20. In this way, the temperature of the treatment liquid L1 output from the external terminal 20 will not be greater than the stop threshold, which is beneficial to the factory for waste liquid treatment.

In addition, the temperature monitoring unit 510 may have a microprocessor that stores the stop threshold value, and the on-off valve 320 may be a solenoid valve and electrically connected to the microprocessor of the temperature monitoring unit 510 so that the temperature monitoring unit 510 can control the on-off valve 320 Close and open. Therefore, steps S101 to S104 shown in FIG. 2 can be executed by the microprocessor of the temperature monitoring unit 510. In addition, the microprocessor can also set the stop threshold to match different types of processing liquid L1.

In particular, in other embodiments, during the monitoring by the temperature monitoring unit 510, the cooling liquid supply unit 400 may supply the cooling liquid to the drain line 300 via the cooling liquid line 410a to form a mixed liquid, and The temperature monitoring unit 510 monitors the discharge temperature of the mixed liquid flowing to the outer end 20 in the discharge pipe 300. Similar to the operation process of the temperature monitoring unit 510 shown in FIG. 2, when the temperature monitoring unit 510 detects that the discharge temperature of the above-mentioned mixed liquid is greater than the stop threshold, the discharge pipe 300 stops discharging the mixed liquid to the external end 20. It can be seen that during the monitoring by the temperature monitoring unit 510, the cooling liquid supply unit 400 may supply or not supply the cooling liquid to the drain pipe 300, so that the temperature monitoring unit 510 monitors the flow of the drain pipe 300 to the external end 20. The discharge temperature of the mixed liquid or treatment liquid L1.

The temperature monitoring unit 510 performs monitoring when the substrate processing system 10 is in a normal state. Once the substrate processing system 10 is in an abnormal state, for example, when the temperature of the processing liquid L1 in the recovery tank 200 is too high, the temperature monitoring unit 510 will stop monitoring the discharge temperature of the processing liquid L1, and the discharge pipeline 300 will change the temperature in the recovery tank 200 The treated liquid L1 is discharged to the outer end 20 to avoid the high-temperature treatment liquid L1 in the recovery tank 200 from harming on-site personnel. In detail, the substrate processing system 10 further includes an abnormal temperature monitoring unit 520 connected to the recovery tank 200, which is used to monitor the temperature of the processing liquid L1 in the recovery tank 200 to determine whether to recover the processing liquid L1 whose temperature is too high in the recovery tank 200. Discharge to the outer end 20. In addition, the abnormal temperature monitoring unit 520 is essentially a thermometer (such as an electronic thermometer), and has a detection part for temperature measurement, like a metal probe for measuring the temperature of the liquid.

FIG. 3 is a schematic diagram of the operation flow of the abnormal temperature monitoring unit in FIG. 1. 1 and 3, in the operation process of the abnormal temperature monitoring unit 520, step S201 is executed to start the abnormal temperature monitoring unit 520 to monitor the temperature of the treatment liquid L1 in the recovery tank 200. In other words, the abnormal temperature monitoring unit 520 after activation will continuously measure the temperature of the processing liquid L1 in the recovery tank 200. Next, step S202 is performed to monitor whether the temperature of the treatment liquid L1 in the recovery tank 200 is greater than or equal to the abnormal temperature value, where the abnormal temperature value will be greater than the stop threshold value, and the temperature corresponding to the abnormal temperature value can make the treatment liquid L1 enter a boiling state Or the warning temperature that is about to enter the boiling state. In other words, when the temperature of the processing liquid L1 is at a temperature corresponding to the abnormal temperature value, the processing liquid L1 may suddenly boil.

When the abnormal temperature monitoring unit 520 detects that the temperature of the processing liquid L1 in the recovery tank 200 is greater than or equal to the abnormal temperature value, it indicates that the temperature of the processing liquid L1 in the recovery tank 200 is too high, and sudden boiling may occur, which may cause industrial safety accidents. At this time, step S203 and step S204 will be executed immediately, that is, the temperature monitoring unit 510 is stopped to monitor the discharge temperature, and the discharge pipeline 300 is caused to discharge the treatment liquid L1 in the recovery tank 200 to the external end 20 to prevent on-site personnel from being exposed to The high-temperature treatment liquid L1 damages and prevents the recovery tank 200 from exploding. In addition, the substrate processing system 10 may further include a pump 155 installed in the liquid discharge pipe 300, wherein the pump 155 can extract the processing liquid L1 in the recovery tank 200, thereby helping to discharge the processing liquid L1 to the outer end 20 .

The cooling liquid supply unit 400 is further connected to the recovery tank 200 and can supply cooling liquid to the recovery tank 200. Specifically, the cooling liquid supply unit 400 may further have a cooling liquid pipe 410b and an on-off valve 430, wherein the cooling liquid pipe 410b is connected to the recovery tank 200, and the on-off valve 430 is installed in the cooling liquid pipe 410b. When the on-off valve 430 is opened, the cooling liquid supply unit 400 can supply the cooling liquid to the recovery tank 200 via the cooling liquid pipe 410b. When the on-off valve 430 is closed, the cooling liquid supply unit 400 stops supplying the cooling liquid to the recovery tank 200.

Before step S204 is performed, the cooling liquid supply unit 400 can be made to supply the cooling liquid to the processing liquid L1 in the recovery tank 200, that is, the on-off valve 430 is opened to allow the cooling liquid to be delivered to the recovery tank 200, so that the cooling liquid and the processing liquid L1 are mixed into The mixed liquid further reduces the temperature of the processing liquid L1 in the recovery tank 200. In performing step S204, the liquid discharge pipe 300 discharges the above-mentioned mixed liquid including the treatment liquid L1 to the external end 20. In this way, the temperature of the treatment liquid L1 in the recovery tank 200 can be lowered to reduce the probability of bumping or reduce the damage to the equipment of the recovery tank 200 after bumping, and also allow the lower temperature mixture to be discharged to the outer end 20, thereby Conducive to waste liquid treatment in factories.

It is worth mentioning that the cooling liquid supply unit 400 is connected to the drain line 300, so the cooling liquid supply unit 400 can not only supply cooling liquid to the recovery tank 200, but also supply cooling liquid to the drain line 300. Therefore, during the period when the cooling liquid supply unit 400 supplies the cooling liquid to the recovery tank 200, the switch valve 420 will be opened so that the cooling liquid supply unit 400 can also supply cooling liquid to the drain line 300, so that the recovery tank 200 is connected to the drain line 300. A mixed liquid is formed in the liquid pipe 300. After that, the drain pipe 300 discharges the mixed liquid in the drain pipe 300 and the recovery tank 200 to the outer end 20. In an embodiment, it further includes controlling the ratio of the flow rate of the cooling liquid supplied by the cooling liquid supply unit 400 to the drain line 300 and the flow rate of the drain line 300 to discharge the mixed liquid in the recovery tank 200, where the ratio is It can be between 2:1 and 5:1.

When the abnormal temperature monitoring unit 520 detects that the temperature of the processing liquid L1 in the recovery tank 200 is not greater than or equal to (that is, less than) the abnormal temperature value, it means that the temperature of the processing liquid L1 is not overheated and no bump will occur, and the substrate processing system 10 is in normal condition. status. At this time, step S205 is executed to maintain the temperature monitoring unit 510 to monitor the discharge temperature, and the on-off valves 420 and 430 are closed, so that the cooling liquid supply unit 400 does not supply the cooling liquid.

It should be noted that in the embodiment shown in FIG. 1, the cooling liquid supply unit 400 is connected to the drain pipe 300 and the recovery tank 200, but in other embodiments, the cooling liquid supply unit 400 may only be connected to the drain The pipeline 300 and the recovery tank 200 are one of them, so the cooling liquid supply unit 400 may only supply cooling liquid to the recovery tank 200 or the drain pipeline 300. Therefore, the cooling liquid supply unit 400 is not limited to be connected to the recovery tank 200 and the drain pipe 300. In other words, the cooling liquid supply unit 400 may only supply the cooling liquid to the recovery tank 200 or the drain line 300.

The substrate processing system 10 may further include an exhaust device 600 which is connected to the recovery tank 200. The exhaust device 600 can exhaust the recovery tank 200 to release the gas in the gas buffer zone 220, thereby reducing the pressure in the recovery tank 200. When the abnormal temperature monitoring unit 520 detects that the temperature of the processing liquid L1 in the recovery tank 200 is greater than or equal to the abnormal temperature value, it will not only perform steps S203 and S204 in FIG. 2, and make the cooling liquid supply unit 400 supply cooling liquid to the recovery tank 200 and At least one of the drain pipes 300 is used to allow the exhaust device 600 to exhaust the recovery tank 200 to reduce the pressure in the recovery tank 200, thereby reducing the probability of explosion of the recovery tank 200.

The exhaust device 600 may include a valve and/or an exhaust fan, and can exhaust the recovery tank 200 with different exhaust volumes to adjust the pressure in the recovery tank 200. The above-mentioned valve is, for example, a butterfly valve or a ball valve. The exhaust device 600 can adjust the exhaust volume according to the temperature of the processing liquid L1 monitored by the abnormal temperature monitoring unit 520. When the abnormal temperature monitoring unit 520 detects that the temperature of the treatment liquid L1 in the recovery tank 200 is less than the abnormal temperature value, the exhaust device 600 will exhaust with the first exhaust volume. Alternatively, the exhaust device 600 may not exhaust. When the temperature of the treatment liquid L1 in the recovery tank 200 measured by the abnormal temperature monitoring unit 520 is greater than or equal to the abnormal temperature value, the exhaust device 600 will exhaust with a second exhaust volume, where the second exhaust volume is greater than the first A discharge volume, so that the pressure in the recovery tank 200 can be effectively reduced, and the recovery tank 200 is prevented from being damaged, so that on-site personnel can avoid injury.

Please refer to FIG. 1, the substrate processing system 10 may further include a housing S1 and a liquid leakage detection unit 800. The recovery tank 200 and at least part of the drain pipe 300 are arranged in the housing S1 so that the housing S1 can protect the recovery tank 200 and at least a part of the drain pipe 300. Taking FIG. 1 as an example, in addition to the processing device 100, other components of the substrate processing system 10, such as the temperature monitoring unit 510 and the abnormal temperature monitoring unit 520, are all disposed in the housing S1. In this way, the casing S1 can protect most components of the substrate processing system 10. The liquid leakage detection unit 800 is connected to the casing S1 and can detect liquid leakage that appears outside the casing S1, such as the processing liquid L1. The liquid leakage detection unit 800 is, for example, a liquid leakage sensor or a liquid leakage detection belt. When the liquid leakage detection unit 800 detects liquid leakage outside the casing S1, the liquid discharge pipe 300 stops discharging the treatment liquid L1 to the external end 20 to protect the personnel on site. Even though the abnormal temperature monitoring unit 520 has detected that the temperature of the treatment liquid L1 in the recovery tank 200 is greater than or equal to the abnormal temperature value, the drain pipe 300 still stops discharging the treatment liquid L1 to the external end 20 to protect the on-site personnel from the treatment liquid L1 s damage.

In particular, the substrate processing system 10 can be connected to the control device 90 in communication. The control device 90 is, for example, a desktop computer or an industrial computer, and the substrate processing system 10 can be electrically or wirelessly connected to the control device 90. Therefore, the substrate processing system 10 may use a wired network or a wireless network to communicate with the control device 90. In other words, the control device 90 can control the substrate processing system 10 via a wired network or a wireless network, for example, remotely or near-end control the substrate processing system 10.

In other words, the control device 90 can communicate with the electrical devices of the substrate processing system 10 in a wired or wireless manner: the processing device 100, the pump 155, the on-off valves 310, 420 and 430, the exhaust device 600, and abnormal temperature monitoring Unit 520. Using the control device 90, the substrate processing system 10 can execute steps S201 to S205 in FIG. 3, and control the on-off valves 420 and 430, so that the coolant supply unit 400 supplies coolant to at least one of the recovery tank 200 and the drain pipe 300 By. In addition, the substrate processing system 10 can also use the control device 90 to set the aforementioned abnormal temperature value and the first and second exhaust amounts of the exhaust device 600.

In addition, in one of the embodiments of the present invention, the temperature monitoring unit 510 may not have any microprocessor, and the temperature monitoring unit 510 and the on-off valve 320 are both wired or wirelessly connected to the control device 90 to control The device 90 can control the temperature monitoring unit 510 and the on-off valve 320 to execute steps S101 to S104 in FIG. 2. Therefore, steps S101 to S104 in FIG. 2 can also be executed by the control device 90, and are not limited to be executed only by the microprocessor of the temperature monitoring unit 510. In addition, the substrate processing system 10 may also use the control device 90 to set the stop threshold value, so the stop threshold value is not limited to be set only by the microprocessor.

In summary, the cooling liquid supplied by the cooling liquid supply unit can not only cool the processing liquid and eliminate the conditions of sudden boiling of the processing liquid, so as to reduce the probability of sudden boiling and safely control the elimination mechanism after sudden boiling occurs, but also can discharge to the outside. The treatment liquid at the end has a lower temperature. In this way, not only can the on-site personnel be protected from the dangers caused by sudden boiling and equipment damage, but also the burden of the external end (factory) on waste liquid treatment can be reduced. Secondly, the present invention also uses an abnormal temperature monitoring unit to monitor the temperature of the processing liquid in the recovery tank, so that the cooling liquid supply unit can supply the cooling liquid to the processing liquid in a timely manner to prevent the occurrence of bumping and safely control the elimination mechanism after the bump occurs. In addition, the present invention also uses an exhaust device to exhaust the gas in the recovery tank to avoid damage to the recovery tank.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent scope.

10: Substrate processing system 20: External end 90: Control device 100: Processing device 150a: Recovery pipeline 150b: Liquid supply pipeline 155: Pump 200: Recovery tank 210: Processing liquid storage area 220: Gas buffer 300: Drainage pipe 310, 320, 420, 430: On-off valve 400: Coolant supply unit 410a, 410b: Coolant pipe 510: Temperature monitoring unit 520: Abnormal temperature monitoring unit 600: Exhaust device 700: Liquid chemical supply unit 800: Leakage detection unit L1: Treatment liquid S1: Shell S101~S104, S201~S205: Step

FIG. 1 is a schematic diagram of a substrate processing system according to an embodiment of the invention. FIG. 2 is a schematic diagram of the operation flow of the temperature monitoring unit in FIG. 1. FIG. 3 is a schematic diagram of the operation flow of the abnormal temperature monitoring unit in FIG. 1.

10: Substrate processing system

20: external side

90: control device

100: processing device

150a: recovery line

150b: Liquid supply line

155: Pump

200: recovery tank

210: Treatment liquid holding area

220: Gas buffer

300: Drain line

310, 320, 420, 430: On-off valve

400: Coolant supply unit

410a, 410b: coolant pipe

510: temperature monitoring unit

520: Abnormal temperature monitoring unit

600: Exhaust device

700: liquid medicine supply unit

800: Leak detection unit

L1: Treatment liquid

S1: Shell

Claims (11)

A substrate processing system includes: a processing device for processing a substrate using a processing liquid; a recovery tank for accommodating the processing liquid; a liquid drain pipeline connected to the recovery tank and used for recovering the The processing liquid in the tank is discharged to an external end; and a cooling liquid supply unit is connected to the drain pipe and used to supply a cooling liquid to the drain pipe to mix the cooling liquid with the processing liquid A mixed liquid is formed, and the drain pipe is used to discharge the mixed liquid to the outer end. The substrate processing system described in item 1 of the scope of patent application further includes a temperature monitoring unit connected to the drain pipe for monitoring a drain temperature of the mixed liquid flowing to the outer end in the drain pipe When the temperature monitoring unit monitors that the discharge temperature is greater than a stop threshold, the discharge pipeline stops discharging the mixed liquid to the external end. The substrate processing system described in item 2 of the scope of patent application further includes an abnormal temperature monitoring unit connected to the recovery tank, which is used to monitor the temperature of the processing liquid in the recovery tank, and the cooling liquid supply unit is further connected to In the recovery tank, when the abnormal temperature monitoring unit monitors that the temperature of the processing liquid in the recovery tank is greater than or equal to an abnormal temperature value, the cooling liquid supply unit supplies the cooling liquid to the processing liquid in the recovery tank. The substrate processing system described in item 3 of the scope of patent application, wherein when the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature value, the temperature monitoring unit stops monitoring the drain Temperature, and the drain pipe drains the treatment liquid in the recovery tank to the outer end. For example, the substrate processing system described in item 3 of the scope of patent application further includes an exhaust device which is connected to the recovery tank. When the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to the abnormal temperature At the temperature value, the exhaust device exhausts the recovery tank. A substrate processing system includes: a processing device that uses a processing liquid to process a substrate; a recovery tank for accommodating the processing liquid; an abnormal temperature monitoring unit for monitoring the temperature of the processing liquid in the recovery tank Temperature; a drain pipe connected to the recovery tank and used to discharge the treatment liquid in the recovery tank to an external end; an exhaust device connected to the recovery tank and used to drain the recovery tank And a cooling liquid supply unit connected to the recovery tank and used to supply a cooling liquid; wherein when the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to an abnormal temperature value, the The exhaust device exhausts the recovery tank, and the cooling liquid supply unit supplies the cooling liquid to the processing liquid in the recovery tank, so that the cooling liquid and the processing liquid are mixed into a mixed liquid, the drain pipeline The mixed liquid is discharged to the outer end. For example, the substrate processing system described in item 5 or item 6 of the scope of patent application, wherein when the abnormal temperature monitoring unit monitors that the temperature of the processing liquid in the recovery tank is less than the abnormal temperature value, the exhaust device uses a first When the abnormal temperature monitoring unit detects that the temperature of the treatment liquid in the recovery tank is greater than or equal to the abnormal temperature value, the exhaust device uses a second exhaust volume to exhaust, wherein The second exhaust volume is greater than the first exhaust volume. For example, the substrate processing system described in item 5 or 6, wherein the recovery tank includes a processing liquid containing area and a gas buffer area, the processing liquid is contained in the processing liquid containing area, and the The gas generated by the treatment liquid is released to the gas buffer zone. The substrate processing system described in item 6 of the scope of patent application, wherein the cooling liquid supply unit is further connected to the drain pipe, wherein when the abnormal temperature monitoring unit detects that the temperature of the processing liquid in the recovery tank is greater than or equal to At the abnormal temperature value, the cooling liquid supply unit supplies the cooling liquid to the recovery tank and the drain line to form the mixed liquid in the recovery tank and the drain line, and the drain line connects The mixed liquid is discharged to the outer end. For example, the substrate processing system described in item 3 or item 9 of the scope of patent application further includes controlling the flow rate of the coolant supply unit to supply the coolant to the drain line and the drain line in the recovery tank. The ratio of the flow rate of the mixed liquid discharged. For example, the substrate processing system described in item 3 or item 6 of the scope of the patent application further includes: a housing, wherein the recovery tank and at least a part of the drain pipe are arranged in the housing; and a liquid leakage detection unit , Connect to the casing, and when the leakage detection unit detects liquid leakage outside the casing, the drain pipeline stops discharging the treatment liquid to the external end.

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