TW202021769A - Curing molding mold and method of curing molding to use the same - Google Patents

Abstract

A curing molding mold and method of curing molding to use the same is provided. The curing molding mold includes an upper mold set and a lower mold set which has a distance from the upper mold set. The upper mold set is for disposing a first substrate on. The lower mold set includes a carrier and an ejection base. The carrier has a carrier surface which is located under the first substrate for carrying a second substrate. The ejection base is moveably protrude out of or flush with the carrier surface. At least one of the first substrate or the second substrate is a medal plate.

Description

Curing forming mold and curing forming method using the curing forming mold

The present invention relates to a curing molding technology, in particular to a curing molding process that uses a metal plate with anti-adhesive properties instead of a release film to perform a curing molding process, which can simplify the manufacturing process, save costs, and reduce manpower and working hours. Curing molding method of curing molding mold.

In order to prevent the curing material from sticking to the mold during the curing process of the traditional curing molding mold using a curing material (for example, resin), the industry usually uses a release film to solve this problem.

As for the conventional structure for laying the release film, it is usually a roller device. For example, a roller set is provided on opposite sides of the mold to feed the release film between the upper mold and the lower mold. After the cured material is cured, the The finished product is taken out, and then the release film is peeled off to prevent the curing material from sticking to the mold.

However, in addition to the large volume, space, and cost of this type of roller device, the installation of the release film must consume manpower and man-hours, and the cost of the release film is even higher; as for the subsequent process of stripping the release film It must consume manpower and working hours.

Based on this, how can there be a "curing molding mold and curing molding method using the curing molding mold" that can replace the release film for the curing molding process to simplify the manufacturing process, save costs, and reduce manpower and man-hours is a related technical field Problems that need to be solved urgently.

In one embodiment, the present invention provides a curing molding mold, which includes: an upper module, suitable for arranging a first substrate; and a lower module, which is arranged at a distance from the upper module, and the lower module It includes a bearing seat and an ejection seat, wherein the bearing seat has a bearing surface suitable for bearing a second substrate, the bearing surface corresponds to the bottom of the first substrate, and the ejection seat is movably protruding or flush with the bearing Surface; Among them, at least one of the first substrate and the second substrate is a metal plate.

In another embodiment, the present invention proposes a curing molding method to provide the curing molding mold of the present invention; arranging the first substrate on the upper module; arranging the second substrate on the supporting surface; adding a curing material to the second On the substrate; press the upper module and the lower module together, and vacuum a chamber formed when the upper module and the lower module are pressed together to perform the thermo-compression curing process; break the vacuum in the chamber to make The distance between the upper module and the lower module; Move the ejector seat so that the ejector seat protrudes from the bearing surface to move the first substrate, the second substrate and the cured material out of the bearing surface; and Move the first substrate or The second substrate is separated from the cured material to take out the finished product.

The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and is disclosed in accordance with this specification. With the content, scope of patent application and drawings, anyone with ordinary knowledge in the field can easily understand the related purposes and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint. In the so-called schematic diagrams in this specification, the size, ratio, and angle may be exaggerated for illustration, but they are not used to limit the present invention. Various changes can be made without departing from the gist of the present invention.

Please refer to FIG. 1, the curing mold 1 includes an upper module 10 and a lower module 20. In this embodiment, the upper module 10 is disposed above the lower module 20.

The upper module 10 is suitable for configuring a first substrate 30. The upper module 10 further includes a plurality of suction holes 11, and the upper module 10 is adapted to pass through the suction holes 11 to be connected with an air extraction device (not shown in the figure). The suction holes 11 penetrate the upper module 10 to extract air The device can provide the upper module 10 with the adsorption force through the suction hole 11, so that the first substrate 30 is adsorbed on the side of the upper module 10 facing the lower module 20 (that is, the bottom surface of the upper module 10 shown in FIG. ).

The lower module 20 is arranged at a distance from the upper module 10. The lower module 20 includes a bearing seat 21 and an ejection seat 22. The bearing seat 21 has a bearing surface 211 suitable for bearing a second substrate 40 The supporting surface 211 corresponds to the bottom of the first substrate 30, and the ejector 22 movably protrudes or is flush with the supporting surface 211. FIG. 1 shows the state where the ejector 22 is flush with the supporting surface 211.

At least one of the first substrate 30 and the second substrate 40 is a metal plate. In this embodiment, the first substrate 30 is a chip substrate to be cured, molded and packaged, and the second substrate 40 is a metal plate. The material of the metal plate is not limited, for example, it can be steel plate. And the metal plate can be treated with anti-adhesion treatment according to requirements, for example, surface hydrophobic treatment or surface anti-adhesion and release treatment of one of Teflon, NiFlon or TiFlon, so that the contact angle of water droplets on the surface of the metal plate is greater than 90 degree.

Please refer to FIG. 1 and FIG. 2A to FIG. 2D to illustrate the curing molding method using the curing molding mold 1 shown in FIG. 1. First, as shown in FIG. 1, the first substrate 30 is disposed on the upper module 10, the second substrate 40 is disposed on the supporting surface 211, and then a curing material 50 is added on the second substrate 40. The method of disposing the first substrate 30 on the upper module 10 may be: turning on the air extraction device so that the upper module 10 has an adsorption force, thereby causing the first substrate 30 to be adsorbed on the upper module 10. As shown in FIG. 2A, the upper module 10 and the lower module 20 are pressed together, and the curing material 50 is filled in a cavity formed by the upper module 10 and the lower module 20 during the pressing process. Evacuate the vacuum for the thermo-compression curing process. A sealing gasket 70 can be provided between the upper module 10 and the lower module 20. When the upper module 10 and the lower module 20 are pressed together, the sealing property can be provided to facilitate the pressing of the upper module 10 and the lower module 20. The chamber formed in time is evacuated. As shown in FIG. 2B, after the thermo-compression curing process is completed, break the vacuum in the chamber to separate the upper module 10 and the lower module 20, and then move the ejector base 22 so that the ejector base 22 protrudes from the bearing The surface 211 in turn makes the second substrate 40 originally disposed on the carrying surface 211 separate from the carrying surface 211. In detail, the thermo-compression curing process integrates the first substrate 30 and the second substrate 40 with the cured cured material 50 into one body. Therefore, the air extraction device does not need to be turned on at this time, and the upper module 10 does not need to provide adsorption force to fix the second substrate. A substrate 30, but when the chamber is vacuum broken, the second substrate 40, the first substrate 30 and the cured material 50 after curing are left on the carrying surface 211. After that, the ejector base 22 is used to move the first substrate 30, the second substrate 40 and the cured cured material 50 out of the bearing surface 211. As shown in FIG. 2C again, if the first substrate 30 is a chip substrate, the cured material 50 is a chip packaging material, and the first substrate 30 and the cured material 50 are combined into a finished product F. As shown in FIG. 2D again, the second substrate 40 and the cured material 50 are separated to take out the finished product F.

Please refer to FIG. 3. This embodiment is based on the embodiment in FIG. 1 and has the structure of the solidification mold 1 in FIG. 1. In this embodiment, a plurality of adsorption holes 23 are provided on the bearing seat 21, and the adsorption holes 23 penetrate the bearing Surface 211, the supporting seat 21 is adapted to be connected to an air extraction device (not shown in the figure) through the adsorption hole 23. The air extraction device can pass through the adsorption hole 23 to provide the support surface 211 with adsorption force to adsorb the second substrate 40 To strengthen the fixing effect of the second substrate 40, for example, the second substrate 40 can be more evenly attached to the carrying surface 211.

Please refer to FIG. 4. This embodiment is based on the embodiment in FIG. 1 and has the structure of the curing mold 1 in FIG. 1. When the second substrate 40 is a metal plate with magnetic attraction, it can be provided on the carrier 21 The magnetic element 24, which can be a metal plate with magnetism or an electro-magnetic disk with magnetic attraction after energization, is arranged on the bearing surface 211 facing the bearing seat 21, by means of the magnetic metal plate or The electro-magnetic disk is electrically conductive, so that the magnetic attraction element 24 provides a magnetic force to adsorb and fix the second substrate 40 on the bearing surface 211 to strengthen the fixing effect of the second substrate 40, for example, to make the second substrate 40 more evenly attached to Bearing surface 211.

Please refer to FIG. 5, the curing mold 1A of this embodiment includes an upper module 10A, a lower module 20A, the upper module 10A is suitable for disposing a first substrate 30A, and the lower module 20A includes a carrier 21A and An ejector 22A has a bearing surface 211A suitable for bearing a second substrate 40A. In this embodiment, the first substrate 30A is a metal plate, and the second substrate 40A is a chip substrate to be cured, molded, and packaged.

Please refer to FIG. 5 and FIG. 6A to FIG. 6D to illustrate the curing molding method using the curing molding mold 1A shown in FIG. 5. First, as shown in FIG. 5, the first substrate 30A is disposed on the upper module 10A, the second substrate 40A is disposed on the supporting surface 211A, and then a curing material 50 is added on the second substrate 40A. The method of disposing the first substrate 30A on the upper module 10A may be: turning on the air extraction device so that the upper module 10A has an adsorption force, so that the first substrate 30A is adsorbed on the upper module 10A. As shown in FIG. 6A, the upper module 10A and the lower module 20A are pressed together, and the curing material 50 is filled in a cavity formed by the upper module 10A and the lower module 20A during the pressing process. Evacuate the vacuum for the thermo-compression curing process. As shown in Figure 6B, after the thermo-compression curing process is completed, break the vacuum in the chamber to separate the upper module 10A from the lower module 20A, and then move the ejector base 22A so that the ejector base 22A protrudes from the bearing The surface 211A in turn causes the second substrate 40A originally disposed on the carrying surface 211A to separate from the carrying surface 211A. In detail, the thermocompression curing process combines the first substrate 30A and the second substrate 40A with the cured cured material 50 into one body. Therefore, the air extraction device does not need to be opened, and the upper module 10A does not need to provide adsorption force to fix the first substrate. For the substrate 30A, the first substrate 30A, the second substrate 40A and the cured material 50 after curing are left on the carrying surface 211A when the vacuum is broken in the chamber. After that, the ejector base 22A is used to move the second substrate 40A, the first substrate 30A and the cured cured material 50 out of the bearing surface 211A. As shown in FIG. 6C again, the second substrate 40A and the curing material 50 have been combined into a finished product F. As shown in FIG. 6D again, the first substrate 30A and the cured material 50 are separated to take out the finished product F.

From the above curing molding method using the curing molding mold 1A shown in FIG. 5, it can be seen that the embodiment of FIG. 1 sets the chip substrate on the upper module and the metal plate on the lower module, while the embodiment of FIG. 5 sets the metal plate. In the upper module, the chip substrate is set in the lower module, but the steps of the curing and molding method of the two are substantially the same.

Please refer to FIG. 7. This embodiment is based on the embodiment in FIG. 5, and a plurality of suction holes 23A are provided in the bearing seat 21A. The suction holes 23A penetrate the bearing surface 211A, and the bearing seat 21A is suitable for passing through the suction holes 23A. Connected to an air extraction device (not shown in the figure), the air extraction device can provide the supporting surface 211A with adsorption force through the adsorption hole 23A, so as to adsorb the second substrate 40A to strengthen the fixing effect on the second substrate 40A, for example, The second substrate 40A can be more evenly attached to the carrying surface 211A.

Please refer to FIG. 8. This embodiment is based on the embodiment of FIGS. 5 and 7. When the first substrate 30A is a metal plate with magnetic attraction, the upper module 10A is provided with a magnetic attraction element 24A, which is arranged at The upper module 10A faces the surface of the lower module 20A, and the magnetic element 24A can be a metal plate with magnetism or an electro-magnetic disk with magnetic attraction after being energized. The magnetic metal plate or the electro-magnetic disk is electrically connected , The magnetic element 24A provides a magnetic force to adsorb and fix the first substrate 30A on the upper module 10A to strengthen the fixing effect of the first substrate 30A, for example, to make the first substrate 30A more evenly attached to the upper module 10A Facing the surface of the lower module 20A.

Please refer to FIG. 9, the curing mold 1B of this embodiment includes an upper module 10B and a lower module 20B. The upper module 10B is suitable for disposing a first substrate 30B, and the lower module 20B includes a bearing seat 21B and An ejector base 22B has a supporting surface 211B suitable for supporting a second substrate 40B. In this embodiment, a third substrate 60 is further included. The third substrate 60 is a double-sided chip substrate to be cured, molded and packaged. The first substrate 30B and the second substrate 40B are both metal plates, and the third substrate 60 is provided Between the first substrate 30B and the second substrate 40B.

Please refer to FIG. 9 and FIG. 10A to FIG. 10D to illustrate the curing method using the curing mold 1B shown in FIG. 9. First, as shown in Figure 9, the first substrate 30B is placed on the upper module 10B, the second substrate 40B is placed on the supporting surface 211B, and then a curing material 50 is added to the second substrate 40B and the third substrate 60 facing the first On the surface of the substrate 30B, the third substrate 60 is disposed between the first substrate 30B and the second substrate 40B. The method of arranging the first substrate 30B on the upper module 10B may be: turning on the air extraction device so that the upper module 10B has an adsorption force, so that the first substrate 30B is adsorbed on the upper module 10B. As shown in FIG. 10A, the upper module 10B and the lower module 20B are pressed together, and the third substrate 60 is sandwiched between the upper module 10B and the lower module 20B, and the curing material 50 is filled in the upper mold In the cavity formed when the group 10B and the lower module 20B are pressed together, the cavity is evacuated to perform a thermo-compression curing process. As shown in Figure 10B, after the thermo-compression curing process is completed, break the vacuum in the chamber to separate the upper module 10B from the lower module 20B, and then move the ejector base 22B so that the ejector base 22B protrudes from the bearing The surface 211B in turn makes the second substrate 40B originally disposed on the carrying surface 211B separate from the carrying surface 211B. In detail, the thermo-compression curing process integrates the first substrate 30B, the second substrate 40B, the third substrate 60 and the cured material 50 into one body, so the air extraction device does not need to be opened, and the upper module 10B does not need to provide adsorption The first substrate 30B is fixed by force, but when the chamber is vacuum broken, the first substrate 30B, the second substrate 40B, the third substrate 60 and the cured cured material 50 are left on the bearing surface 211B. After that, the ejector base 22B is used to move the first substrate 30B, the second substrate 40B, the third substrate 60 and the cured cured material 50 out of the bearing surface 211B. As shown in FIG. 10C again, the third substrate 60 and the curing material 50 have been combined into a finished product F. As shown in FIG. 10D, the first substrate 30B, the second substrate 40B, and the curing material 50 are separated to take out the finished product F.

It can be seen from the above curing molding method using the curing molding mold 1B shown in FIG. 9 that the structure of the embodiment of FIG. 9 combines the structures of the embodiments of FIG. 1 and FIG. 5, and the steps of the curing method are substantially the same.

Please refer to FIG. 11, this embodiment is based on the embodiment in FIG. 9, and a plurality of adsorption holes 23B are provided in the bearing seat 21B. The adsorption holes 23B penetrate the bearing surface 211B, and the bearing seat 21B is suitable for passing through the adsorption holes 23B. Connected to an air extraction device (not shown in the figure), the air extraction device can provide the supporting surface 211B with adsorption force through the adsorption hole 23B, so as to adsorb the second substrate 40B to strengthen the fixing effect on the second substrate 40B, for example, The second substrate 40B can be more evenly attached to the carrying surface 211B.

Please refer to FIG. 12, this embodiment is based on the embodiment in FIG. 9. Since both the first substrate 30B and the second substrate 40B are metal plates, the upper module 10B and the carrier 21B are equipped with magnetic attraction elements. 24B. The magnetic element 24B can be a metal plate with magnetism or an electro-magnetic disk with magnetic attraction after being energized. They are respectively arranged on the surface of the upper module 10B and the carrying surface 211B opposite to each other. The magnetic metal plate or The electro-magnetic disk is electrically conducted, so that the two magnetic attraction elements 24B provide a magnetic force to respectively adsorb and fix the first substrate 30B and the second substrate 40B on the upper module 10B and the supporting surface 211B. It should be noted that when the upper module 10B and the bearing seat 21B are provided with the magnetic element 24B, there is no need to provide suction holes on the upper module 10B and the bearing surface 211B, and the magnetic element 24B can be directly used to provide magnetic force to achieve fixation. Functions of the first substrate 30B and the second substrate 40B.

Please refer to FIG. 13 for an embodiment structure of the lower module used in the present invention. The lower module 20C has a plurality of movable side plates 21C and a plurality of fixed side plates 22C. A movable side plate is provided on two opposite sides of the lower module 20C. Side plate 21C, one end of each movable side plate 21C faces the side 221C of the adjacent fixed side plate 22C and has a groove 23C between the side 221C. The inner space enclosed by the movable side plate 21C and the fixed side plate 22C It is the curing area. The two movable side plates 21C are respectively driven by the driver 24C to move relative to the side 221C, so as to change the size of the groove 23C. In this embodiment, the moving directions of the two movable side plates 21C are opposite. In other embodiments, the moving directions of the two movable side plates 21C can also be the same. The function of the structure of this embodiment is that during the curing and molding process, the groove 23C is in an open state, and the squeezed curing material can overflow through the groove 23C, so that the quality of curing and molding will not be affected by excessive curing material. During the curing and molding process, the driver 24C drives the movable side plate 21C to move, which can close the groove 23C and cut off the overflowing cured material at the same time.

Please refer to the process 200 of the curing molding method using the curing molding mold provided by the present invention shown in FIG. 14 (please also cooperate with the embodiment of FIG. 1), which includes the following steps: Step 201: Place the first substrate 30 on the upper module 10; Step 202: Set the second substrate 40 on the bearing surface 211; Step 203: Add a curing material 50 on the second substrate 40; Step 204: Press the upper module 10 and the lower module 20 together, and Vacuum the chamber formed when the upper module 10 and the lower module 20 are pressed together to perform the thermo-compression curing process; Step 205: Break the vacuum in the chamber to make the upper module 10 and the lower module 20 separate; Step 206: Move the ejector base 22 so that the ejector base 22 protrudes from the bearing surface 211 to move the first substrate 30, the second substrate 40 and the cured material 50 after curing out of the bearing surface 211; Step 207: Move the second substrate The substrate 40 is separated from the cured material 50 to take out the finished product F. It should be noted that in step 207 in different embodiments, the first substrate 30 and the cured material 50 may be separated to take out the finished product F.

In summary, the curing molding mold of the present invention and the curing molding method using the curing molding mold use a metal plate with reusable characteristics to replace the release film for the curing molding process, which not only simplifies the manufacturing process, reduces manpower and man-hours , And can save costs.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

1, 1A, 1B: curing molding mold 10, 10A, 10B: upper module 11: suction holes 20, 20A, 20B, 20C: lower module 21, 21A, 21B: bearing seat 21C: movable side plate 221C: side 211 , 211A, 211B: bearing surface 22, 22A, 22B: ejector seat 22C: fixed side plate 23, 23A, 23B: suction hole 23C: groove 24, 24A: magnetic element 24C: driver 30, 30A, 30B: first Substrate 40, 40A, 40B: Second substrate 50: Curing material 60: Third substrate 70: Seal 200: Process of curing method 201~207: Step F of process of curing method: Finished product

FIG. 1 is a schematic diagram of the structure of an embodiment of the curing mold of the present invention. 2A to 2D are schematic diagrams of a curing molding method using the embodiment of the curing molding mold shown in FIG. 1. Fig. 3 is a schematic structural diagram of the embodiment of Fig. 1 with adsorption holes provided in the lower module. Fig. 4 is a schematic structural diagram of the embodiment of Fig. 1 with a magnetic attraction element provided on the lower module. Fig. 5 is a schematic structural diagram of another embodiment of the curing forming mold of the present invention. 6A to 6D are schematic diagrams of the curing molding method using the embodiment of the curing molding mold shown in FIG. 5. Fig. 7 is a schematic structural diagram of the embodiment of Fig. 5 with adsorption holes provided in the lower module. Fig. 8 is a schematic structural diagram of the embodiment of Fig. 5 with a magnetic attraction element provided on the upper module. Fig. 9 is a schematic structural view of another embodiment of the curing mold of the present invention. 10A to 10D are schematic diagrams of the curing molding method using the embodiment of the curing molding mold shown in FIG. 9. FIG. 11 is a schematic diagram of the structure of the embodiment in FIG. 9 with adsorption holes provided in the lower module. FIG. 12 is a schematic diagram of the structure of the embodiment of FIG. 9 with magnetic attraction elements provided on the upper module and the lower module. FIG. 13 is a schematic top view of the structure of the lower module with movable side plates of the present invention. Fig. 14 is a flowchart of the curing molding method of the present invention.

no

1: curing mold

10: Upper module

11: adsorption hole

20: Lower module

21: Bearing seat

211: bearing surface

22: Push out the seat

30: First substrate

40: second substrate

50: curing material

70: gasket

Claims (14)

A curing molding mold, comprising: an upper module, suitable for arranging a first substrate; and a lower module, which is arranged at a distance from the upper module, and the lower module includes a carrier and a top Out of the seat, wherein the bearing seat has a bearing surface suitable for bearing a second substrate, the bearing surface corresponds to the bottom of the first substrate, and the ejection seat is movably protruding or flush with the bearing surface; Wherein, at least one of the first substrate and the second substrate is a metal plate. The curing molding mold described in the first item of the scope of patent application further includes a third substrate, which is disposed between the first substrate and the second substrate, and the first substrate and the second substrate are both metal board. As described in the first item of the patent application, the lower module has a plurality of movable side plates and a plurality of fixed side plates. The movable side plates are respectively provided on two opposite sides of the lower module, and each movable side plate One end of the side plate faces a side edge of the fixed side plate adjacent to it and has a groove therebetween. The two movable side plates are displaced relative to the side edge to change the size of the grooves. For the curing forming mold described in item 3 of the scope of patent application, the moving directions of the two movable side plates are opposite. For the curing forming mold described in item 3 of the scope of patent application, the moving directions of the two movable side plates are the same. As described in the first item of the patent application, the upper module further includes a plurality of adsorption holes, and the upper module is adapted to be connected to an exhaust device through the adsorption holes, and the adsorption Holes penetrate the upper module, and the suction device can pass through the adsorption holes to provide the upper module with an adsorption force. As described in the first item of the scope of patent application, the solidification molding mold, wherein the supporting base further includes a plurality of adsorption holes, and the supporting base is adapted to be connected to an exhaust device through the adsorption holes, and the adsorption holes are Through the bearing surface, the suction device can pass through the adsorption holes to provide the bearing surface with adsorption force. According to the curing molding mold described in claim 1, wherein, when the first substrate is a metal plate with magnetic attraction, the upper module further includes a magnetic attraction element disposed on the upper module facing the lower On the face of the module, the magnetic attraction element provides a magnetic force to adsorb and fix the first substrate on the upper module. According to the curing molding mold described in item 8 of the scope of patent application, the magnetic attraction element is a metal plate with magnetism or an electro-magnetic disk with magnetic attraction after being energized. As described in the first item of the scope of patent application, the solidification molding mold, wherein, when the second substrate is a metal plate with magnetic attraction, the supporting base further includes a magnetic attraction element disposed on the supporting surface facing the supporting base On the surface, the magnetic attraction element provides a magnetic force to adsorb and fix the second substrate on the carrying surface. As described in the tenth item of the scope of patent application, the solidification molding mold, wherein the magnetic attraction element is a metal plate with magnetism or an electro-magnetic disk with magnetic attraction after being energized. A curing molding method, comprising: providing a curing molding mold described in any one of items 1-11 in the scope of the aforementioned patent application; arranging the first substrate on the upper module; arranging the second substrate on the carrying surface Adding a curing material on the second substrate; pressing the upper module and the lower module, and evacuating a cavity formed when the upper module and the lower module are pressed together to Carry out the thermo-compression curing process; Break the vacuum in the chamber to make the upper module and the lower module separate the distance; Move the ejector seat so that the ejector seat protrudes from the bearing surface, so that the first The substrate, the second substrate, and the cured material after curing are removed from the carrying surface; and the first substrate or the second substrate is separated from the cured material to take out the finished product. According to the method of curing and molding described in item 12 of the scope of patent application, wherein the metal plate is treated with anti-sticking treatment, and the contact angle of water droplets on its surface is greater than 90 degrees. According to the method of curing and molding described in claim 13, wherein the anti-adhesion treatment includes surface hydrophobic treatment or a surface anti-adhesion release treatment of one of Teflon, Niflon or Tieflon.

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