TW202014085A - Peeling device - Google Patents

Abstract

A peeling device includes a vibrating assembly, a controller, a resonator plate, and a base. The controller is adapted to drive the vibrating assembly generates a supersonic shock wave. The resonator plate has a plurality of openings, and the resonator plate connects to the base in a floating manner in a predetermined area that is adapted to receive a conducted shock wave and generate a vibration.

Description

Film lifting mechanism

This case relates to a film lifting mechanism, especially a film lifting mechanism with a vibrating component.

Generally, there is a layer of foil film (such as copper foil) on the surface of the substrate to avoid damage to the surface of the substrate. Especially when the robot arm is handling or stacking the substrate, the surface of the substrate is more likely to be damaged.

Taking the carrier copper foil removal device (Patent Publication No. TW 201414378 A) as an example, when the opposite sides of the substrate have the first carrier copper foil and the second carrier copper foil, the cutting means respectively faces the first carrier copper foil and the second carrier copper foil 2 Cut the carrier copper foil until the remaining copper foil is retained. The removing means removes the first carrier copper foil from the substrate. After the turning means rotates the substrate 180∘, the removing means removes the second carrier copper foil from the substrate. However, when the carrier copper foil removing device removes the first carrier copper foil on one side of the substrate, the second carrier copper foil on the other side of the substrate cannot be removed. In addition, when the thicknesses of the first carrier copper foil and the second carrier copper foil on the substrate are different, the carrier copper foil removing device cannot efficiently cut off the first carrier copper foil and the second carrier copper foil.

Taking the copper foil peeling mechanism (patent publication number: TW 201507932 A) as an example, the toggle module has at least one elastic peeling sheet and a variable-speed power device for rotating the elastic peeling sheet. When the elastic peeling sheet rotates, it beats the side wall of the substrate While the partial protective film is peeled off from the copper foil, the air jet module blows away the peeled protective film from the copper foil, so that the blown away copper foil comes into contact with the blocking element. However, when each elastic peeling sheet is repeatedly rotated at the side wall of the copper foil, the substrate is prone to buckling and damage.

In view of the above problems, a film lifting mechanism is suitable for a substrate, and a surface of the substrate has a first foil film. The film lifting mechanism includes a base, a resonance plate, a vibration component, and a control component. The resonance plate is connected to the base and is suitable for carrying the substrate. The vibrating component is suitable for contact with the substrate. The control component is adapted to drive the vibration component to generate a supersonic shock wave, and the substrate transmits the supersonic shock wave to the resonance plate, so that the first foil film is separated from the substrate.

According to some embodiments, the resonance plate is floatingly connected to the base.

This case also provides a film lifting mechanism, which includes a vibration component, a control component, a base, and a resonance plate. The control component is adapted to drive the vibration component to generate a supersonic shock wave. The resonance plate has a plurality of holes, and the resonance plate is floatingly connected to the base in a predetermined space, and is suitable for receiving a conductive shock wave and generating a vibration.

According to some embodiments, the two convex posts abut the resonance plate. The groove is located between the protrusions and has a gap with the resonance plate.

According to some embodiments, wherein the holes are arranged at intervals on the resonance plate, and each protruding post respectively abuts the corner of the resonance plate.

According to some embodiments, wherein the holes are arranged at intervals on the resonance plate, and each convex post respectively abuts at least two adjacent holes of the holes.

According to some embodiments, the base includes a groove and at least two convex posts.

According to some embodiments, the base includes a plurality of floating parts and the resonance plate has a plurality of apertures. The floating joint is fixed to the convex posts, and the resonance plate has a gap between the convex posts and the floating joints, and each floating joint has a long axis outer diameter. Each aperture matches the outer diameter of the long axis of each floating joint, wherein the size of the apertures is larger than the outer diameter of the long axis of the floating joints, and the resonance plate has another between the floating joints and the apertures A gap.

According to some embodiments, the predetermined space means that the resonance plate is floatingly connected to the protrusions through the floating pieces; and the floating connection means that the resonance plate moves in the gaps when vibrating.

In summary, the vibration component of the membrane lifting device in this case can generate a supersonic shock wave, and the resonance plate can withstand a conduction shock wave to generate vibration. When the substrate is located on the resonance plate, the supersonic shock wave generated by the vibrating component can separate a part or all of the at least one first foil film from the substrate.

Referring to FIGS. 1A to 1C, FIGS. 1A to 1C illustrate a usage state diagram of an embodiment of the film lifting mechanism 10 in this case. The film lifting mechanism 10 includes a base 110, a resonance plate 120, a vibration element 130, and a control element 140 electrically connected to the base 110, the resonance plate 120 and the vibration element 130. The resonance plate 120 has a plurality of holes 121, and the resonance plate 120 is floatingly connected to the base 110 in a predetermined space, and is suitable for receiving a conductive shock wave and generating vibration. The control component 140 is adapted to drive the vibration component 130 to generate a supersonic shock wave.

Furthermore, the film lifting mechanism 10 is suitable for the substrate 30 having one or more foil films 21 and 22. For example, the film lifting mechanism 10 is suitable for the substrate 30 having the first foil film 21 and the second foil film 22, and the first foil film 21 and the second foil film 22 are respectively located on the surfaces of the substrate 30 on opposite sides.

The substrate 30 may be a ceramic substrate, a metal substrate, or other substrates, or a paper-based copper foil base plate, a glass-based copper foil base plate, a composite copper foil base plate, or a heat-resistant thermoplastic substrate.

The first foil film 21 and the second foil film 22 may be, but not limited to, a metal foil film, such as copper foil. When the first foil film 21 and the second foil film 22 are respectively located on opposite sides of the surface of the substrate 30, there may be an adhesive force (or bonding force) between the first foil film 21 and a surface of the substrate 30, and the second The foil film 22 may have an adhesive force (or bonding force) between the other surface opposite to the surface. In addition, the metal foil film may be provided on the surfaces of the opposite sides of the substrate 30 in such a manner as covering, sticking, attaching, contacting, placing, or attaching.

According to some embodiments, the first foil film 21 and the second foil film 22 may be, but not limited to, a protective film, such as polyethylene film (Polyethylene, PE) or polyethylene terephthalate (Polyethylene Terephthalate, PET) .

Referring to FIGS. 1A to 1C and FIG. 2 together, FIG. 2 shows a schematic structural view of the first embodiment of the base 110 and the resonance plate 120 of FIG. 1.

The material of the resonance plate 120 may be a ceramic material, a metal material or other materials, or a paper substrate copper foil material, a glass substrate material, a composite copper foil material, or a heat-resistant thermoplastic material. Furthermore, the plurality of holes 121 are arranged at intervals on a surface of the resonance plate 120, wherein the shape of the plurality of holes 121 may be round, square, diamond, arc, or any other shape.

The vibration component 130 may be, but not limited to, an ultrasonic vibrator to generate a supersonic shock wave. For example, when the substrate 30 is located on the resonance plate 120, the vibration component 130 above the substrate 30 contacts and transmits ultrasonic shock waves to the substrate 30 to cause the substrate 30 to vibrate and remove the vibrating second foil film 22 from a surface of the substrate Separate. Next, the resonance plate 120 receives a conduction shock wave transmitted by the vibration substrate 30 to generate vibration. At this time, the first foil film 21 is separated from the other surface of the substrate via the vibration of the resonance plate 120. Furthermore, the vibration component 130 has a contact 131 for contacting and vibrating the second foil film 22 on the substrate 30. The contact 131 may be, but not limited to, a plate, and the shape of the plate may be a rectangular, circular, triangular, diamond, or other shapes. In addition, the material of the contact 131 may be metal for conducting ultrasonic shock waves. That is to say, the material of the contact 131 is, for example but not limited to, ceramic material, metal material or other materials, and may also be a paper substrate copper foil material, a glass substrate material, a composite copper foil material, a heat-resistant thermoplastic material.

When the substrate 30 is located on the resonance plate 120, the supersonic shock wave generated by the vibration component 130 vibrates the resonance plate 120 and the second foil film 22, so that the substrate 30 generates a conductive shock wave and a part or all of the vibrated second foil film 22 Separated from the surface of the substrate 30. When the resonance plate 120 receives the supersonic shock wave generated by the vibration component 130 and the conductive shock wave generated by the substrate 30, a part or all of the vibrated first foil film 21 is separated from the surface of the substrate 30. Therefore, when the substrate 30 is located on the base 110, the supersonic shock wave generated by the vibration component 130 vibrates the second foil film 22, and the second foil film 22 is separated from a surface of the substrate 30, and the resonance plate 120 is subjected to the vibration component 130 to generate The supersonic shock wave and the conduction shock wave generated by the substrate 30 vibrate the first foil film 21, and the first foil film 21 is separated from the other surface of the substrate 30.

According to some embodiments, when a supersonic shock wave generated by the vibration component 130 vibrates the substrate 30, the resonance plate 120 receives the conductive shock wave generated by the substrate 30 and generates a part or all of the first foil film 21 to be vibrated. The surface of the substrate 30 is separated. When the resonance plate 120 receives the transmitted shock wave and generates vibration, the resonance plate 120 vibrates the first foil film 21 to separate the first foil film 21 from the surface of the substrate 30. That is to say, the vibration component 130 generates an ultrasonic shock wave to vibrate the second foil film 22 located on one surface of the substrate 30, so that the second foil film 22 is separated from the surface of the substrate 30, and at the same time, the other foil film 22 located on the substrate 30 is opposite to the surface The first foil film 21 on one surface is separated from the surface of the substrate 30 via the conducted shock wave vibration received by the resonance plate 120.

According to some embodiments, at least one foil film is located on a surface on the substrate 30. For example, a surface of the substrate has a first foil film 21. When the substrate 30 is located on the resonance plate 120, a supersonic shock wave generated by the vibration component 30 contacts and vibrates a partial area of the first foil film 21, so that the vibrated partial area of the first foil film 21 is separated from the surface of the substrate 30. In addition, a supersonic shock wave generated by the vibration component 30 vibrates the entire first foil film 21, so that the entire first foil film 21 is separated from the surface of the substrate 30.

2 and FIG. 3 together, FIG. 3 is a schematic cross-sectional view of the first embodiment of the base 110 and the resonance plate 120 of FIG. 1. The base 110 includes a groove 111 and at least two protrusions 113. The groove 111 is located between the protrusions 113 and has a gap with the resonance plate 120. The protrusions 113 abut the resonance plate 120. For example, the groove 111 may be, but is not limited to, a linear groove 111, and two rectangular protrusions 113 are respectively adjacent to the left and right sides of the linear groove 111, for abutting the resonance plate 120 The left and right sides.

According to some embodiments, the base 110 includes at least two floating members 115 for fixing to the protrusions 113, and each floating member 115 has a long-axis outer diameter, so that the resonance plate 120 passes through the floating connectors The member 115 penetrates and is floatingly connected to the protrusions 113. The floating member 115 may be, but not limited to, a constant-height screw. The resonance plate 120 has a plurality of apertures, and each aperture matches the outer diameter of the long axis of each floating member 115. The aperture of the resonance plate 120 is larger than the outer diameter of the long axis of the floating member 115, so that there is a gap between the long axis outer diameter of the floating member 115 and the aperture of the resonance plate 120 on the horizontal plane. Furthermore, when the floating member 115 is fixed to the convex post 113, there is a gap on the vertical plane between the long axis of the floating member 115 and the convex post 113. When the resonance plate 120 penetrates through the floating pieces 115 to be floatingly connected to the base 110 in a predetermined space, the resonance plate 120 can move in front of, behind, left, and right in the gap on the horizontal plane, and can move on the vertical plane The gap moves up and down.

For example, four equal-height screws penetrate through the four corners of the resonance plate 120 and are fixed to the corresponding convex posts 113. Since there is a gap between each equal-height screw and the corresponding boss 113, the resonance plate 120 can move up and down within the gap. In addition, each corner of the resonance plate 120 has an aperture, and the size of each aperture is larger than the outer diameter of the long axis of each constant-height screw. The equal-height screws penetrate the apertures of the resonance plate 120 and are fixed to the corresponding convexities When the column 113 is used, the resonance plate 120 can move forward, backward, left, and right on the plane of the convex column 113.

2 to 4 together, FIG. 4 shows an exploded schematic view of the first embodiment of the base 110 and the resonance plate 120 of FIG. 1. The corners of the resonance plate 120 each have an aperture that is larger than the outer diameter of the long axis of the floating member 115, and the base 110 has a screw hole for fitting the outer diameter of the long axis of the floating member 115. When the outer diameter of the long axis of the floating member 115 penetrates the aperture of the corner of the resonance plate 120 and is fitted into the screw hole of the base 110, the resonance plate 120 can not only move forward, backward, left, or on one plane of the base 110 Moving right can also move up and down the gap between the floating member 115 and the base 110, which means that the resonance plate 120 penetrates through a plurality of apertures of the resonance board 120 through a plurality of floating members 115 fixed to the base 110, The gap between the floating joint 115 and the base 110 can float.

Referring back to FIGS. 1A to 1B, the film lifting mechanism 10 includes a moving component 150 connected to the base 110. The moving component 150 may be a pneumatic cylinder, a motor or other components to raise or lower the base 110. Furthermore, the moving component 150 is electrically connected to the control component 140. When the substrate 30 is located on the resonance plate 120, the control component 140 drives the moving component 150 to move the base 110 until the control component 140 drives the vibration component 130 to contact the substrate 30.

Referring back to FIGS. 1A to 1B, the film lifting mechanism 10 includes a frame 160 having one or more guide rails. The base 110, the resonance plate 120, the vibration component 130, the control component 140, and the moving component 150 may be, but not limited to, disposed on the rack 160. On the frame 160, the arrangement positions of the vibration component 130 and the resonance plate 120 in the frame 160 are opposite to each other. In some embodiments, as shown in FIG. 1A, the resonance plate 120 is located below the vibration component 130; and In other embodiments, the resonance plate 120 is located above the vibration component 130.

The resonance plate 120 is floatingly connected to the base 110 below the resonance plate 120. The base 110 is connected to the moving component 150 below. For example, the vibration component 130 is disposed on the top of the frame 160. The base 110 and the resonance plate 120 are located between the vibration component 130 and the moving component 150 and fixed to the moving component 150. The control component 140 is disposed on the frame 160. When the mobile component 150 is driven to move the base 110, the base 110 moves along the guide rail until the substrate 30 on the resonance plate 120 contacts the vibration component 130.

According to some embodiments, the resonance plate 120 is connected to the base 110 below, and the resonance plate 120 and the base 110 are disposed at the bottom of the frame 160. The moving component 150 is disposed on the top of the frame 160 and fixed to the vibration component 130 between the resonance plate 120 and the moving component 150. When the substrate 30 is located on the resonance plate 120, the moving component 150 drives the vibration component 130 to move downward until the vibration component 130 contacts and vibrates the substrate 30.

According to some embodiments, referring to FIG. 5, FIG. 5 is a structural diagram of the second embodiment of the base 110 of FIG. 1. When the resonance plate 120 is floatingly connected to the base 110, the plurality of protrusions 113 respectively abut four corners of the resonance plate 120, and the cross-shaped groove 111 is located outside the four corners of the resonance plate 120.

According to some embodiments, please refer to FIG. 6, which illustrates a schematic structural view of a third embodiment of the base 110 of FIG. 1. The base 110 includes an adjustment jig 119 for positioning the substrate 30 on the base 110. For example, when the substrate 30 is located on the resonance plate 120, the adjusting jig 119 is pressed against at least one corner of the substrate 30 to position the substrate 30 on the base 110.

According to some embodiments, please refer to FIG. 7, which is a schematic structural view of the fourth embodiment of the base 110 of FIG. 1. When the resonance plate 120 is floatingly connected to the base 110, a plurality of protrusions 113 are located at four corners of the resonance plate 120 and on the cross-shaped groove 111, wherein each protrusion 113 in the cross-shaped groove 111 is used In order to abut on at least two adjacent holes 121 of the plurality of holes 121. For example, when the resonant plate 120 is located on the base 110, the plurality of protrusions 113 respectively abut the portions other than the plurality of holes 121 of the resonance plate 120, which means that the protrusion 113 abuts the corner of the resonance plate 120 and the plurality of holes 121 Adjacent parts of at least two holes in the.

According to some embodiments, please refer to FIG. 8, which illustrates a schematic structural view of the fifth embodiment of the base 110 of FIG. 1. When the resonance plate 120 is floatingly connected to the base 110, the plurality of protrusions 113 respectively abut on both sides of a surface of the resonance plate 120, and the groove 111 is located between the two sides of the resonance plate Between at least two adjacent protruding pillars 113 among the plurality of protruding pillars 113 on both sides of the resonance plate 120.

According to some embodiments, please refer to FIG. 9, which illustrates a schematic structural view of the second embodiment of the resonance plate 120 of FIG. 1. A plurality of holes 121 of the same size are arranged on the resonance plate 120, and another hole 121 of a different size is arranged between at least two adjacent holes 121. For example, a plurality of circular holes 121 are arranged on the resonance plate 120, and a rectangular hole 121 is arranged between two adjacent circular holes 121, and the size of the circular hole is larger than that of the rectangular hole size.

According to some embodiments, referring to FIG. 10, FIG. 10 is a schematic structural diagram of a third embodiment of the resonance plate 120 of FIG. A positioning groove 123 is disposed on the resonance plate 120 for fixing the positioning groove 123 of the substrate 30 on the resonance plate 120. Furthermore, a plurality of holes 121 are arranged in the positioning groove 123, wherein the size and shape of the hole may be the same as the size and shape of the hole 121 outside the positioning groove 123, but not limited thereto. The size and shape of the hole in the positioning groove 123 may be larger or smaller than the size and shape of the hole 121 outside the positioning groove 123.

According to some embodiments, please refer to FIG. 11, which illustrates a schematic structural view of the fourth embodiment of the resonance plate 120 of FIG. 1. An adjusting jig 125 is disposed on the resonance plate 120 to position the substrate 30 on the resonance plate 120. For example, when the substrate 30 is located on the resonance plate 120, the adjusting jig 125 is pressed against a corner of the substrate 30 to position the substrate 30 on the resonance plate 120.

The "vibration" means that the vibration component 130 repeatedly touches a part or the entire surface of the resonance plate 120 or the substrate 30 from top to bottom or bottom to top, and transmits a supersonic shock wave to the resonance plate 120, the first foil film 21, Or part or the entire surface of the second foil film 22. In addition, the “vibration” also means that the resonance plate 120 is subjected to the supersonic shock wave transmitted by the substrate 30, that is, the conduction shock wave, so that the resonance plate 120 repeatedly contacts a part or the entire surface of the substrate 30 from bottom to top or from top to bottom.

The "floating connection" means that when the floating member 115 penetrates the resonance plate 120 and is fixed to the boss 113 of the base 110, there is a distance between the diameter of the resonance plate 120 and the outer diameter of the long axis of the floating member 115 The gap between the horizontal plane and the floating part 115 and the convex column 113 also have a vertical gap, so that the resonance plate 120 can maintain a movable predetermined space in the gap between the horizontal plane and the vertical plane, wherein the predetermined space is defined by the aforementioned gap A three-dimensional space. In other words, the floating member 115 can restrict the resonance plate 120 to move up and down in the vertical plane gap between the floating member 115 and the base 110, as well as restrict the resonance plate 120 to the floating member 115 and the pores. The horizontal gap between the front, back, left and right move. However, this description is only to illustrate the component configuration and operation mode of the film lifting mechanism 10 in conjunction with the drawings, and does not limit the scope of patent protection.

In summary, the vibration component 130 of the membrane lifting mechanism 10 in this case can generate a supersonic shock wave, and the resonance plate 120 can withstand a conduction shock wave to generate vibration. When the substrate 30 is located on the resonance plate 120, the supersonic shock wave generated by the vibration component 130 can separate a part or all of the at least one first foil film 21 from the substrate.

10: Membrane lifting mechanism 110: base 111: groove 113: convex column 115: floating piece 119: adjustment jig 120: resonance plate 121: hole 123: positioning groove 125: adjustment jig 130: vibration component 131: contact Item 140: Control component 150: Mobile component 160: Frame 21: First foil film 22: Second foil film 30: Substrate

[FIGS. 1A to 1C] is a usage state diagram of an embodiment of the film lifting mechanism in this case. [FIG. 2] It is a schematic structural view of the first embodiment of the base and the resonance plate of FIG. [FIG. 3] is a schematic cross-sectional view of the first embodiment of the base and the resonance plate of FIG. 1. [FIG. 4] is an exploded schematic view of the first embodiment of the base and the resonance plate of FIG. [FIG. 5] is a schematic structural view of the second embodiment of the base of FIG. [FIG. 6] is a schematic structural view of a third embodiment of the base of FIG. [FIG. 7] is a schematic structural view of a fourth embodiment of the base of FIG. [FIG. 8] is a schematic structural view of the fifth embodiment of the base of FIG. 1. [FIG. 9] is a schematic structural view of a second embodiment of the resonance plate of FIG. [FIG. 10] is a schematic structural view of a third embodiment of the resonance plate of FIG. [FIG. 11] is a schematic structural view of a fourth embodiment of the resonance plate of FIG.

10: Film lifting mechanism

110: Dock

111: groove

113: convex column

115: floating joint

120: resonance plate

121: Hole

130: Vibration component

131: Contact

140: control component

150: mobile component

160: rack

21: First foil

22: Second foil

30: substrate

Claims (10)

A film lifting mechanism suitable for a substrate having a first foil film on one surface of the substrate. The film lifting mechanism includes: a base; a resonance plate connected to the base and suitable for carrying the substrate; a The vibrating component is suitable for contacting with the substrate; and a control component is suitable for driving the vibrating component to generate a supersonic shock wave. The substrate transmits the supersonic shock wave to the resonance plate, so that the first foil film is separated from the substrate. The film raising mechanism according to claim 1, wherein: the resonance plate is floatingly connected to the base. A film lifting mechanism, comprising: a vibrating component; a control component adapted to drive the vibrating component to generate a supersonic shock wave; a base; and a resonance plate with a plurality of holes, the resonance plate floatingly connected in a predetermined space The base and the resonance plate are suitable for receiving a conductive shock wave and generating a vibration. The film raising mechanism according to claim 3, wherein the base comprises: at least two convex posts, which abut the resonance plate; and a groove, located between the convex posts, and having a Void. The film raising mechanism according to claim 4, wherein: the holes are arranged at intervals on the resonance plate, and each of the convex columns respectively abuts a corner of the resonance plate. The film raising mechanism according to claim 4, wherein: the holes are arranged at intervals on the resonance plate, and each of the protrusions respectively abuts at least two adjacent holes of the holes. The film lifting mechanism according to claim 4, wherein: the base includes a plurality of floating joints, fixed to the convex posts, and there is a gap between the convex posts and the floating joints, each One of the floating parts has a long-axis outer diameter; and the resonance plate has a plurality of apertures, each of which matches the long-axis outer diameter of each of the floating parts, wherein the sizes of the apertures are larger than the floating parts The outer diameter of the long axis of the and has another gap between the floating parts and the apertures. The film raising mechanism according to claim 7, wherein: the predetermined space refers to the resonance plate penetrating through the floating joints and floatingly connected to the protrusions; and the floating connection refers to when the resonance plate vibrates, The gap between the protrusions and the floating joints and another gap between the floating joints and the apertures move. The film lifting mechanism according to claim 3, the film lifting mechanism is suitable for a substrate, wherein the base includes: an adjustment jig to position the substrate on the base; the resonance plate includes a positioning groove and the An adjustment jig, the positioning groove is used to fix the substrate in the positioning groove, and the adjustment jig positions the substrate on the resonance plate. The film lifting mechanism according to claim 3, the film lifting mechanism is suitable for a substrate, the film lifting mechanism further includes: a moving component connected to the base, and the control component is driven when the substrate is located on the resonance plate The moving component moves the base until the control component drives the vibration component to contact the substrate.

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