CN110963137B - Film lifting mechanism - Google Patents
Film lifting mechanism Download PDFInfo
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- CN110963137B CN110963137B CN201811609196.9A CN201811609196A CN110963137B CN 110963137 B CN110963137 B CN 110963137B CN 201811609196 A CN201811609196 A CN 201811609196A CN 110963137 B CN110963137 B CN 110963137B
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- floating
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- 239000000758 substrate Substances 0.000 claims description 100
- 239000011888 foil Substances 0.000 claims description 53
- 239000012528 membrane Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 28
- 239000011889 copper foil Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002131 composite material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- -1 Polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
- B65B69/0025—Removing or cutting binding material, e.g. straps or bands
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
A film lifting mechanism comprises a vibration component, a control component, a base and a resonance plate. The control component is suitable for driving the vibration component to generate ultrasonic vibration waves. The resonance plate is provided with a plurality of holes, is connected with the base in a floating way in a preset space and is suitable for bearing a conduction seismic wave and generating vibration.
Description
Technical Field
The present disclosure relates to a film lifting mechanism, and more particularly, to a film lifting mechanism with a vibrating assembly.
Background
A foil (e.g., copper foil) is generally formed on the surface of the substrate to prevent the surface of the substrate from being damaged, especially when the substrate is transported or stacked by a robot arm.
Taking a carrier copper foil removing device (patent publication No. TW 201414378A) as an example, when the 1 st carrier copper foil and the 2 nd carrier copper foil are provided on the opposite sides of the substrate, the cutting means cuts the 1 st carrier copper foil and the 2 nd carrier copper foil respectively until the remaining copper foils remain. Removing means removes the 1 st carrier copper foil from the substrate. The turning means rotates the substrate by 180 degrees, and the removing means removes the 2 nd carrier copper foil from the substrate. However, when the carrier copper foil removing apparatus removes the 1 st carrier copper foil positioned at one side of the substrate, the 2 nd carrier copper foil positioned at the other side of the substrate cannot be removed. In addition, when the thicknesses of the 1 st and 2 nd carrier copper foils on the substrate are different, the carrier copper foil removing apparatus cannot efficiently cut the 1 st and 2 nd carrier copper foils.
Taking a copper foil peeling mechanism (patent publication No. TW 201507932A) as an example, the toggle module is provided with at least one elastic peeling sheet and a variable speed power device for rotating the elastic peeling sheet, when the elastic peeling sheet rotates, the side wall of the substrate is flapped to peel off a partial protective film from the copper foil, and the air injection module blows off the peeled protective film from the copper foil, so that the blown-off copper foil is contacted with the stop element. However, when each elastic peeling sheet is repeatedly rotated at the side wall of the copper foil, the substrate is easily dented and damaged.
Disclosure of Invention
In view of the above problems, a film peeling mechanism is suitable for a substrate having a first foil film on a surface thereof. The film drawing mechanism comprises a base, a resonant plate, a vibration component and a control component. The resonator plate is connected to the base and is suitable for bearing the substrate. The vibration assembly is adapted to contact the substrate. The control component is suitable for driving the vibration component to generate an ultrasonic vibration wave, and the substrate transmits the ultrasonic vibration wave to the resonance plate, so that the first foil membrane is separated from the substrate.
According to some embodiments, the resonator plate is floatingly coupled to the base.
The present disclosure further provides a film lifting mechanism, which includes a vibration assembly, a control assembly, a base, and a resonator plate. The control component is suitable for driving the vibration component to generate ultrasonic vibration waves. The resonance plate is provided with a plurality of holes, is connected with the base in a floating way in a preset space and is suitable for bearing a conduction seismic wave and generating vibration.
According to some embodiments, the two posts abut against the resonator plate. The groove is positioned between the convex columns, and a gap is formed between the groove and the resonance plate.
According to some embodiments, wherein: the holes are arranged on the resonance plate at intervals, and each convex column is respectively abutted against the corner of the resonance plate.
According to some embodiments, wherein: the holes are arranged on the resonance plate at intervals, and each convex column is respectively abutted against the adjacent parts of at least two holes in the holes.
According to some embodiments, wherein: the base comprises a groove and at least two convex columns.
According to some embodiments, the base comprises a plurality of floating members and the resonator plate has a plurality of apertures. The floating pieces are fixedly connected with the convex columns, a gap is formed between the convex columns and the floating pieces of the resonance plate, and each floating piece is provided with a long shaft outer diameter. Each aperture is matched with the outer diameter of the long shaft of each floating connecting piece, wherein the sizes of the apertures are larger than the outer diameters of the long shafts of the floating connecting pieces, and the resonance plate is provided with another gap between the floating connecting pieces and the apertures.
According to some embodiments, the predetermined space refers to the resonator plate passing through the floating members and floating connected to the protruding pillars; and the floating connecting finger moves in the gaps when the resonance plate vibrates.
In summary, the vibrating assembly of the film-lifting device can generate an ultrasonic vibration wave, and the resonance plate can bear a conductive vibration wave to generate vibration. When the substrate is located on the resonance plate, the ultrasonic vibration wave generated by the vibration component can separate a part or all of at least one first foil membrane from the substrate.
Drawings
Fig. 1A to 1C are diagrams illustrating a usage state of an embodiment of the film lifting mechanism of the present invention.
Fig. 2 is a schematic structural view of a first embodiment of the base and the resonator plate of fig. 1.
Fig. 3 is a cross-sectional view of a first embodiment of the base and resonator plate of fig. 1.
Fig. 4 is an exploded view of the first embodiment of the base and resonator plate of fig. 1.
Fig. 5 is a schematic structural view of a second embodiment of the base of fig. 1.
Fig. 6 is a schematic structural view of a third embodiment of the base of fig. 1.
Fig. 7 is a schematic structural view of a fourth embodiment of the base of fig. 1.
Fig. 8 is a schematic structural view of a fifth embodiment of the base of fig. 1.
Fig. 9 is a schematic structural view of a second embodiment of the resonator plate of fig. 1.
Fig. 10 is a schematic structural view of a third embodiment of the resonator plate of fig. 1.
Fig. 11 is a schematic structural view of a fourth embodiment of the resonator plate of fig. 1.
Wherein the reference numerals
10 film lifting mechanism
110 base
111 trench
113 convex column
115 floating joint
119 adjusting jig
120 resonator plate
121 hole
123 positioning groove
125 adjusting jig
130 vibration assembly
131 contact piece
140 control assembly
150 moving assembly
160 rack
21 first foil film
22 second foil film
30 substrate
Detailed Description
Referring to fig. 1A to 1C, fig. 1A to 1C are diagrams illustrating a film drawing mechanism 10 according to an embodiment of the present disclosure. The diaphragm lifting mechanism 10 includes a base 110, a resonator plate 120, a vibration element 130, and a control element 140 electrically connected to the base 110, the resonator plate 120, and the vibration element 130. The resonator plate 120 has a plurality of holes 121, and the resonator plate 120 is connected to the base 110 in a floating manner in a predetermined space, and is adapted to receive a conductive seismic wave and generate vibration. The control component 140 is adapted to drive the vibration component 130 to generate an ultrasonic vibration wave.
More specifically, the stripping mechanism 10 is adapted to a substrate 30 having one or more foil membranes 21, 22. For example, the film peeling mechanism 10 is suitable for a substrate 30 having a first foil 21 and a second foil 22, and the first foil 21 and the second foil 22 are respectively located on two opposite surfaces of the substrate 30.
The substrate 30 may be a ceramic substrate, a metal substrate, or other substrates, or may be a paper-based copper foil-based board, a glass-based copper foil-based board, a composite copper foil-based board, or a heat-resistant thermoplastic substrate.
The first foil 21 and the second foil 22 may be, but are not limited to, a metal foil, such as copper foil. When the first foil 21 and the second foil 22 are respectively located on two opposite sides of the surface of the substrate 30, an adhesive force (or a bonding force) may be formed between the first foil 21 and one surface of the substrate 30, and an adhesive force (or a bonding force) may be formed between the second foil 22 and the other surface opposite to the one surface. In addition, the metal foil films may be disposed on the surfaces of the opposite sides of the substrate 30 in a manner of covering, adhering, attaching, contacting, placing, or adhering.
According to some embodiments, the first foil 21 and the second foil 22 may be, but are not limited to, a protective film, such as Polyethylene (PE) or Polyethylene Terephthalate (PET).
Referring to fig. 1A to 1C and fig. 2 in combination, fig. 2 is a schematic structural diagram of a first embodiment of the base 110 and the resonator plate 120 of fig. 1.
The resonator plate 120 may be made of ceramic, metal or other materials, or may be made of paper-based copper foil, glass-based material, composite copper foil, or heat-resistant thermoplastic material. Further, the plurality of holes 121 are spaced on a surface of the resonator plate 120, wherein the plurality of holes 121 may have a circular, square, diamond, arc or any other shape.
The vibration element 130 may be, but is not limited to, an ultrasonic vibrator for generating an ultrasonic vibration wave. For example, when the substrate 30 is positioned on the resonator plate 120, the vibration element 130 positioned above the substrate 30 contacts and transmits the ultrasonic waves to the substrate 30 to vibrate the substrate 30 and separate the vibrating second foil 22 from a surface of the substrate. Then, the resonator plate 120 is vibrated by receiving a vibration wave transmitted from the vibration substrate 30, and the first foil 21 is separated from the other surface of the substrate by the vibration of the resonator plate 120. More specifically, the vibrating element 130 has a contact member 131 for contacting and vibrating the second foil 22 on the substrate 30. The contact 131 may be, but is not limited to, a plate, and the shape of the plate may be a rectangular, circular, triangular, diamond-shaped or other shaped plate. In addition, the material of the contact 131 may be a metal for conducting the ultrasonic vibration wave. That is, the material of the contact 131 is not limited to ceramic material, metal material or other materials, and may be paper-based copper foil material, glass-based material, composite copper foil material or heat-resistant thermoplastic material.
When the substrate 30 is positioned on the resonator plate 120, the ultrasonic vibration generated by the vibration element 130 vibrates the resonator plate 120 and the second foil 22, so that the substrate 30 generates a conductive vibration and a portion or all of the vibrated second foil 22 is separated from the surface of the substrate 30. When the resonator plate 120 is subjected to the ultrasonic vibration waves generated from the vibration element 130 and the guided vibration waves generated from the substrate 30, a part or the whole of the first foil 21 to be vibrated is separated from the surface of the substrate 30. Therefore, when the substrate 30 is positioned on the base 110, the ultrasonic vibration generated by the vibration element 130 vibrates the second foil 22 to separate the second foil 22 from one surface of the substrate 30, and the resonance plate 120 receives the ultrasonic vibration generated by the vibration element 130 and the conducted vibration generated by the substrate 30 to vibrate the first foil 21 to separate the first foil 21 from the other surface of the substrate 30.
According to some embodiments, when the substrate 30 is vibrated by an ultrasonic vibration generated by the vibration element 130, the resonator plate 120 receives the conductive vibration generated by the substrate 30 and generates vibration to separate a part or all of the first foil 21 to be vibrated from the surface of the substrate 30. When the resonance plate 120 vibrates by receiving the conducted seismic wave, the resonance plate 120 vibrates the first foil 21 to separate the first foil 21 from the surface of the substrate 30. That is, the vibration element 130 generates an ultrasonic vibration to vibrate the second foil 22 on one surface of the substrate 30, so that the second foil 22 is separated from the surface of the substrate 30, and simultaneously, the first foil 21 on the other surface of the substrate 30 opposite to the one surface is separated from the surface of the substrate 30 by the vibration of the resonance plate 120.
According to some embodiments, at least one foil membrane is located on a surface of the substrate 30. For example, a first foil 21 is disposed on one surface of the substrate. When the substrate 30 is positioned on the resonator plate 120, an ultrasonic vibration wave generated from the vibration member 30 contacts and vibrates a portion of the first foil 21, so that the first foil 21 of the vibrated portion is separated from the surface of the substrate 30. In addition, an ultrasonic vibration wave generated by the vibration unit 30 vibrates the entire first foil 21, so that the entire first foil 21 is separated from the surface of the substrate 30.
Referring to fig. 2 and 3 in combination, fig. 3 is a schematic cross-sectional view of a first embodiment of the base 110 and the resonator plate 120 of fig. 1. The base 110 includes a groove 111 and at least two pillars 113. The groove 111 is located between the pillars 113 and has a gap with the resonant plate 120. The protruding pillars 113 abut against the resonator plate 120. For example, the groove 111 may be, but is not limited to, a straight groove 111, and two rectangular protruding pillars 113 respectively adjacent to left and right sides of the straight groove 111 for abutting against left and right sides of the resonator plate 120.
According to some embodiments, the base 110 includes at least two floating members 115 for being fixed to the protruding pillars 113, and each floating member 115 has a long-axis outer diameter such that the resonator plate 120 is connected to the protruding pillars 113 in a floating manner through the floating members 115. The float 115 may be, but is not limited to, a contoured screw. The resonator plate 120 has a plurality of apertures, each matching the outer diameter of the long axis of each float 115. The aperture of the resonator plate 120 is larger than the outer diameter of the long axis of the float 115 such that there is a gap in the horizontal plane between the outer diameter of the long axis of the float 115 and the aperture of the resonator plate 120. Furthermore, when the floating connection element 115 is fixed on the convex column 113, a gap on the vertical plane is formed between the long axis of the floating connection element 115 and the convex column 113. When the resonator plate 120 is floatingly coupled to the base 110 in a predetermined space by the floating members 115, the resonator plate 120 can move forward, backward, leftward and rightward in a gap on a horizontal plane, and can move upward and downward in a gap on a vertical plane.
For example, four screws with equal height are respectively inserted through four corners of the resonator plate 120 and are fixed to the corresponding posts 113. Since a gap is formed between each of the equal-height screws and the corresponding protruding pillar 113, the resonator plate 120 can move up and down in the gap. In addition, each corner of the resonator plate 120 has an aperture, the size of each aperture is larger than the outer diameter of the long axis of each equal-height screw, and when the equal-height screws penetrate through the apertures of the resonator plate 120 and are fixed on the corresponding convex columns 113, the resonator plate 120 can move forward, backward, leftward and rightward on the plane of the convex columns 113.
Referring to fig. 2 to 4 in combination, fig. 4 is an exploded view of the base 110 and the resonator plate 120 of fig. 1 according to a first embodiment. The corners of the resonator plate 120 have an aperture, which is larger than the outer diameter of the long axis of the floating member 115, respectively, and the base 110 has a screw hole for fitting the outer diameter of the long axis of the floating member 115. When the outer diameter of the long axis of the floating member 115 penetrates the hole diameters of the corners of the resonator plate 120 and is fitted into the screw hole of the base 110, the resonator plate 120 can move not only forward, backward, leftward and rightward on a plane of the base 110, but also up and down in the gap between the floating member 115 and the base 110, that is, the resonator plate 120 can float in the gap between the floating member 115 and the base 110 by penetrating the floating members 115 fixed to the base 110 through the hole diameters of the resonator plate 120.
Referring back to fig. 1A to 1B, the film lifting mechanism 10 includes a moving member 150 connected to the base 110. The moving assembly 150 may be a pneumatic cylinder, motor, or other assembly to raise or lower the base 110. More specifically, the moving element 150 is electrically connected to the control element 140, and when the substrate 30 is located on the resonator plate 120, the control element 140 drives the moving element 150 to move the base 110 until the control element 140 drives the vibration element 130 to contact the substrate 30.
Referring again to fig. 1A-1B, the film raising mechanism 10 includes a frame 160 having one or more guide rails. The base 110, the resonator plate 120, the vibration assembly 130, the control assembly 140, and the movement assembly 150 may be, but are not limited to being, disposed on a frame 160. On the frame 160, the vibration assembly 130 and the soundboard 120 are disposed at a disposition position of the frame 160 opposite to each other, and in some embodiments, as shown in fig. 1A, the soundboard 120 is located below the vibration assembly 130; while in other embodiments the resonator plate 120 is positioned above the vibration assembly 130.
The resonator plate 120 is floatingly coupled to the base 110 under the resonator plate 120. The base 110 is connected to a lower moving assembly 150. For example, the vibration assembly 130 is disposed on the top of the frame 160. The base 110 and the resonator plate 120 are disposed between the vibration element 130 and the moving element 150, and are fixed to the moving element 150. The control assembly 140 is disposed on the frame 160, and when the moving assembly 150 is driven to move the base 110, the base 110 moves along the guide rail until the substrate 30 on the resonator plate 120 contacts the vibration assembly 130.
According to some embodiments, the resonator plate 120 is connected to the lower base 110, and the resonator plate 120 and the base 110 are disposed at the bottom of the frame 160. The moving member 150 is disposed on the top of the frame 160, and is fixed to the vibration member 130 between the resonator plate 120 and the moving member 150. When the substrate 30 is positioned on the resonator plate 120, the moving element 150 drives the vibration element 130 to move downward until the vibration element 130 contacts and vibrates the substrate 30.
Referring to fig. 5, fig. 5 is a schematic diagram illustrating a second embodiment of the base 110 of fig. 1 according to some embodiments. When the resonator plate 120 is floatingly coupled to the base 110, the plurality of protrusions 113 respectively abut against four corners of the resonator plate 120, and the cross-shaped groove 111 is located at a portion other than the four corners of the resonator plate 120.
Referring to fig. 6, fig. 6 is a schematic diagram illustrating a third embodiment of the base 110 of fig. 1 according to some embodiments. The base 110 includes an adjusting fixture 119 for positioning the substrate 30 on the base 110. For example, when the substrate 30 is located on the resonator plate 120, the adjusting fixture 119 abuts against at least one corner of the substrate 30 to position the substrate 30 on the base 110.
Referring to fig. 7, fig. 7 is a schematic diagram illustrating a fourth embodiment of the base 110 of fig. 1 according to some embodiments. When the resonator plate 120 is floatingly coupled to the base 110, the plurality of protruding pillars 113 are located at four corners of the resonator plate 120 and on the cross-shaped groove 111, wherein each protruding pillar 113 located in the cross-shaped groove 111 is configured to abut against at least two adjacent portions of the plurality of holes 121. For example, when the resonator plate 120 is located on the base 110, the plurality of protruding pillars 113 respectively abut against portions of the resonator plate 120 other than the plurality of holes 121, that is, the protruding pillars 113 abut against corners of the resonator plate 120, and at least two of the plurality of holes 121 abut against adjacent portions.
Referring to fig. 8, fig. 8 is a schematic structural diagram illustrating a fifth embodiment of the base 110 of fig. 1 according to some embodiments. When the base 110 is floatingly coupled to the resonance plate 120, the plurality of protruding columns 113 respectively abut against both sides of the resonance plate 120 on one surface, and the groove 111 is located below between both sides of the resonance plate, and located between at least two adjacent ones 113 of the plurality of protruding columns 113 for abutting against both sides of the resonance plate 120.
Referring to fig. 9, fig. 9 illustrates a structural view of a second embodiment of the resonator plate 120 of fig. 1, according to some embodiments. A plurality of holes 121 of the same size are disposed on the resonator plate 120, and another hole 121 of a different size is disposed between at least two adjacent holes 121. For example, a plurality of circular holes 121 are disposed on the resonator plate 120, and a rectangular hole 121 is disposed between two adjacent circular holes 121, and the size of the circular hole is larger than that of the rectangular hole.
Referring to fig. 10, according to some embodiments, fig. 10 illustrates a schematic structure diagram of a third embodiment of the resonator plate 120 of fig. 1. A positioning groove 123 is disposed on the resonator plate 120 for fixing the substrate 30 to the positioning groove 123 on the resonator plate 120. More specifically, a plurality of holes 121 are disposed in the positioning groove 123, wherein the size and shape of the holes may be the same as those of the holes 121 located outside the positioning groove 123, but not limited thereto. The size and shape of the hole in the positioning groove 123 may be larger or smaller than the size and shape of the hole 121 outside the positioning groove 123.
Referring to fig. 11, fig. 11 illustrates a schematic diagram of a fourth embodiment of the resonator plate 120 of fig. 1 according to some embodiments. An adjustment fixture 125 is disposed on the resonator plate 120 to position the substrate 30 on the resonator plate 120. For example, when the substrate 30 is located on the resonator plate 120, the adjusting fixture 125 abuts against a corner of the substrate 30 to position the substrate 30 on the resonator plate 120.
The "vibration" refers to the repeated contact of the vibration element 130 with the resonator plate 120 or the substrate 30 from top to bottom or from bottom to top, and the transmission of an ultrasonic wave to the resonator plate 120, the first foil 21, or the second foil 22. In addition, the vibration refers to that the resonator plate 120 receives the ultrasonic vibration transmitted from the substrate 30, i.e., transmits the vibration, so that the resonator plate 120 repeatedly contacts the partial or entire surface of the substrate 30 from bottom to top or from top to bottom.
The floating connection means that when the floating member 115 penetrates the resonator plate 120 and is fixedly connected to the protruding post 113 of the base 110, a horizontal gap is formed between the aperture of the resonator plate 120 and the outer diameter of the long axis of the floating member 115, and a vertical gap is also formed between the floating member 115 and the protruding post 113, so that the resonator plate 120 can maintain a movable predetermined space in the horizontal and vertical gaps, wherein the predetermined space is a three-dimensional space formed by the gaps. That is, the floating member 115 may limit the movement of the resonator plate 120 up and down in the gap between the floating member 115 and the base 110 in the vertical plane, and limit the movement of the resonator plate 120 forward, backward, left and right in the gap between the floating member 115 and the apertures in the horizontal plane. However, this description is only for the purpose of illustrating the arrangement and operation of the elements of the film forming mechanism 10 in accordance with the drawings, and is not intended to limit the scope of the patent protection.
In summary, the vibrating element 130 of the film lifting mechanism 10 can generate an ultrasonic vibration wave, and the resonator plate 120 can bear a conductive vibration wave to generate vibration. When the substrate 30 is located on the resonator plate 120, the ultrasonic vibration waves generated by the vibration element 130 can separate a part or all of the at least one first foil 21 from the substrate.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (10)
1. A film removing mechanism is suitable for a substrate, one surface of the substrate is provided with a first foil film, and the film removing mechanism comprises:
a base;
a resonance plate connected to the base in a predetermined space and adapted to carry the substrate;
a vibration component, which is suitable for contacting the substrate; and
a control component, adapted to drive the vibration component to generate an ultrasonic vibration wave, the substrate conducting the ultrasonic vibration wave to the resonance plate, so that the resonance plate repeatedly contacts the first foil of the substrate in the predetermined space and causes the first foil to separate from the surface of the substrate.
2. The film raising mechanism of claim 1, wherein:
the resonator plate is floatingly coupled to the base.
3. A film-drawing mechanism is suitable for a substrate, the substrate is provided with a first foil film and a second foil film of two opposite side surfaces, and the film-drawing mechanism is characterized by comprising:
a vibration component contacting the second foil film of the substrate;
a control component, which is suitable for driving the vibration component to generate an ultrasonic vibration wave, so that the vibration component transmits the ultrasonic vibration wave to the substrate;
a base for bearing the substrate; and
and the resonance plate is provided with a plurality of holes, is connected with the base in a floating way in a preset space, and is suitable for bearing a conduction seismic wave generated by the vibration of the substrate by the vibration component and generating vibration so as to vibrate the first foil membrane of the substrate in a mode of repeatedly contacting the substrate in the preset space.
4. The film raising mechanism of claim 3, wherein the base comprises:
at least two convex columns which are abutted against the resonance plate; and
a groove located between the convex columns and having a gap with the resonance plate.
5. The film raising mechanism of claim 4, wherein:
the holes are arranged on the resonance plate at intervals, and each convex column is respectively abutted against the corner of the resonance plate.
6. The film raising mechanism of claim 4, wherein:
the holes are arranged on the resonance plate at intervals, and each convex column is respectively abutted against the adjacent parts of at least two holes in the holes.
7. The film raising mechanism of claim 4, wherein:
the base comprises a plurality of floating pieces which are fixedly connected with the convex columns, a gap is arranged between the convex columns and the floating pieces, and each floating piece is provided with a long shaft outer diameter; and
the resonator plate has a plurality of apertures, each of which matches the outer diameter of the long axis of each of the floating connectors, wherein the apertures are larger than the outer diameters of the long axes of the floating connectors, and another gap is provided between the floating connectors and the apertures.
8. The film raising mechanism of claim 7, wherein:
the predetermined space means that the resonance plate is penetrated through the floating pieces and is connected with the convex columns in a floating way; and
the floating connection means that a gap between the protruding columns and the floating pieces and another gap between the floating pieces and the apertures move when the resonance plate vibrates.
9. The film removing mechanism of claim 3, wherein the film removing mechanism is adapted to the substrate, and wherein the base comprises: an adjusting tool for positioning the substrate on the base; the resonance plate comprises a positioning groove and the adjusting jig, the positioning groove is used for fixing the substrate in the positioning groove, and the adjusting jig is used for positioning the substrate on the resonance plate.
10. The film removing mechanism of claim 3, wherein the film removing mechanism is adapted to the substrate, the film removing mechanism further comprising:
and the control component drives the moving component to move the base when the base plate is positioned on the resonance plate until the control component drives the vibration component to contact the base plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107134546A TWI714890B (en) | 2018-09-28 | 2018-09-28 | Peeling device |
| TW107134546 | 2018-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110963137A CN110963137A (en) | 2020-04-07 |
| CN110963137B true CN110963137B (en) | 2022-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811609196.9A Active CN110963137B (en) | 2018-09-28 | 2018-12-27 | Film lifting mechanism |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110963137B (en) |
| TW (1) | TWI714890B (en) |
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2018
- 2018-09-28 TW TW107134546A patent/TWI714890B/en active
- 2018-12-27 CN CN201811609196.9A patent/CN110963137B/en active Active
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| CN1115958A (en) * | 1994-06-06 | 1996-01-31 | 苏马吕株式会社 | Method and device for peeling a film |
| JP2009029561A (en) * | 2007-07-26 | 2009-02-12 | U-Tec Kk | Film peeling method, and film peeling device |
| CN104228311A (en) * | 2013-06-24 | 2014-12-24 | 均豪精密工业股份有限公司 | Corner film tearing device |
| CN204123753U (en) * | 2014-03-19 | 2015-01-28 | 日东电工株式会社 | Stripping off device |
| CN205380974U (en) * | 2015-09-22 | 2016-07-13 | 联策科技股份有限公司 | Film stripping device and air blowing module thereof |
| CN206552885U (en) * | 2016-12-28 | 2017-10-13 | 江西省航宇新材料股份有限公司 | A kind of copper clad laminate prepreg separating device with air blowing clamping jaw |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110963137A (en) | 2020-04-07 |
| TW202014085A (en) | 2020-04-01 |
| TWI714890B (en) | 2021-01-01 |
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