TW202010576A - Supply device, coating device, and supply method to efficiently remove the dissolved gas in the high-viscosity processing liquid, and to reduce the size of the device - Google Patents
Supply device, coating device, and supply method to efficiently remove the dissolved gas in the high-viscosity processing liquid, and to reduce the size of the device Download PDFInfo
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- TW202010576A TW202010576A TW108123250A TW108123250A TW202010576A TW 202010576 A TW202010576 A TW 202010576A TW 108123250 A TW108123250 A TW 108123250A TW 108123250 A TW108123250 A TW 108123250A TW 202010576 A TW202010576 A TW 202010576A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
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Abstract
Description
本發明是有關於一種將高粘度的液體供給至供給目標的供給裝置、包括所述供給裝置的塗覆裝置、以及供給高粘度液體的供給方法。The present invention relates to a supply device that supplies a high-viscosity liquid to a supply target, a coating device that includes the supply device, and a supply method that supplies a high-viscosity liquid.
以往,在液晶顯示裝置用玻璃基板、半導體基板、等離子體顯示面板(Plasma Display Panel,PDP)用玻璃基板、光掩模(photo mask)用玻璃基板、彩色濾光片(color filter)用基板、記錄盤(disk)用基板、太陽能電池用基板、電子紙(paper)用基板等精密電子裝置用基板、矩形玻璃基板、薄膜液晶用柔性(flexible)基板、有機電致發光(Electroluminescence,EL)用基板(以下簡稱作“基板”)的製造工序中,使用在基板的表面塗覆光致抗蝕劑(photo resist)等液體的塗覆裝置。關於以往的塗覆裝置,例如在專利文獻1中有所記載。專利文獻1的塗覆裝置針對由沿水平方向移動自如的載台(stage)所吸附保持的基板,從具有狹縫(slit)狀噴出口的縫模(slit die)噴出塗覆液。
[現有技術文獻]
[專利文獻]Conventionally, glass substrates for liquid crystal display devices, semiconductor substrates, glass substrates for plasma display panels (PDP), glass substrates for photo masks, and color filter substrates, Substrates for precision electronic devices such as substrates for disks, substrates for solar cells, substrates for electronic papers, rectangular glass substrates, flexible substrates for thin-film liquid crystals, and organic electroluminescence (EL) applications In the manufacturing process of a substrate (hereinafter simply referred to as a “substrate”), a coating device that applies a liquid such as photoresist on the surface of the substrate is used. The conventional coating device is described in
[專利文獻1]日本專利特開2017-23990號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-23990
[發明所要解決的問題] 此種塗覆裝置中,若在液體中存在溶解氣體,則容易在狹縫噴嘴中產生所謂的“起泡”。一旦產生“起泡”,則有時無法從噴出口均勻地塗覆液體,從而導致塗覆膜的均勻性下降。因此,以往進行從塗覆前的液體中去除溶解氣體的脫氣處理。以往的塗覆裝置中,通過將貯存有塗覆前的液體的脫氣用的槽內設為負壓,來預先使液體中的溶解氣體氣泡化。在液體粘度低的情況下,能夠使液體中產生的氣泡容易地上浮至液面,從而排出至容器外。[Problems to be solved by the invention] In such a coating device, if dissolved gas is present in the liquid, so-called "bubbling" easily occurs in the slit nozzle. Once "foaming" occurs, the liquid may not be uniformly applied from the discharge port, resulting in a decrease in the uniformity of the coating film. Therefore, conventionally, a degassing treatment is performed to remove dissolved gas from the liquid before coating. In the conventional coating apparatus, the dissolved gas in the liquid is bubbled in advance by setting the degassing tank in which the liquid before coating is stored to a negative pressure. When the viscosity of the liquid is low, the bubbles generated in the liquid can easily float up to the liquid surface and be discharged out of the container.
但是,在使用高粘度液體的情況下,氣泡上浮至液面需要耗費非常長的時間。尤其,存在越細小的氣泡越難以上浮的傾向。因此,在連續進行塗覆工序等液體消耗速度大的情況下,必須增加脫氣用的槽數。其結果,產生裝置整體大型化的問題。近年來,在柔性元件或電池的製造工序中,對成為處理對象的面塗覆高粘度液體的裝置的需求提高。伴隨於此,要求能夠從高粘度液體中效率良好地去除溶解氣體而不增大裝置的體積規格的技術。However, in the case of using a high-viscosity liquid, it takes a very long time for the bubbles to rise to the liquid surface. In particular, the finer bubbles tend to be more difficult to float. Therefore, when the liquid consumption rate such as a continuous coating process is high, the number of degassing tanks must be increased. As a result, there is a problem that the entire device is enlarged. In recent years, in the manufacturing process of a flexible element or a battery, the demand for a device that applies a high-viscosity liquid to the surface to be treated has increased. Along with this, a technique capable of efficiently removing dissolved gas from a high-viscosity liquid without increasing the volume specifications of the device is required.
本發明是有鑒於如上所述的情況而完成,其目的在於提供一種能夠效率良好地去除粘度高的液體中的溶解氣體的供給裝置、包括所述供給裝置的塗覆裝置、以及供給方法。 [解決問題的技術手段]The present invention has been completed in view of the circumstances described above, and an object thereof is to provide a supply device capable of efficiently removing dissolved gas in a liquid with high viscosity, a coating device including the supply device, and a supply method. [Technical means to solve the problem]
為了解決所述問題,本申請的第一發明是一種供給裝置,其用於將高粘度的處理液供給至供給目標,所述供給裝置包括:槽,貯存所述處理液;供給口,將所述處理液供給至所述供給目標;送液配管,對所述槽與所述供給口進行流路連接;主泵(main pump),介插在所述送液配管中,從所述槽朝向所述供給口輸送所述處理液;脫氣單元,在所述主泵的上游側介插在所述送液配管中;輔助泵(assist pump),在所述脫氣單元的上游側介插在所述送液配管中,朝向所述脫氣單元對所述處理液進行加壓;以及過濾器,在所述脫氣單元的上游側介插在所述送液配管中,所述脫氣單元包括:筒狀的殼體(casing);多個中空纖維膜,收容在所述殼體的內部;以及減壓機構,對所述殼體的內部且所述中空纖維膜外側的空間進行減壓。In order to solve the problem, the first invention of the present application is a supply device for supplying a high-viscosity processing liquid to a supply target. The supply device includes: a tank to store the processing liquid; The processing liquid is supplied to the supply target; a liquid supply pipe that connects the tank and the supply port with a flow path; a main pump is inserted in the liquid supply pipe and faces from the tank The supply port conveys the treatment liquid; a degassing unit, which is inserted into the liquid supply piping on the upstream side of the main pump; and an auxiliary pump, which is inserted on the upstream side of the degassing unit In the liquid feed pipe, the processing liquid is pressurized toward the degassing unit; and a filter is inserted in the liquid feed pipe on the upstream side of the degassing unit, the degassing The unit includes: a cylindrical casing; a plurality of hollow fiber membranes housed inside the casing; and a decompression mechanism that reduces the space inside the casing and outside the hollow fiber membrane Pressure.
本申請的第二發明是根據第一發明的供給裝置,其中,所述輔助泵包括:流體貯存室,能增減內部的體積;以及能收縮的管,構成流路,且配置在所述流體貯存室的內側,當所述流體貯存室的體積變小時,施加至所述管的外周面的壓力變大,所述管內的體積變小,由此來從所述管排出所述處理液。The second invention of the present application is the supply device according to the first invention, wherein the auxiliary pump includes: a fluid storage chamber capable of increasing or decreasing the internal volume; and a tube capable of contraction, constituting a flow path, and arranged in the fluid Inside the storage chamber, when the volume of the fluid storage chamber becomes smaller, the pressure applied to the outer circumferential surface of the tube becomes larger, and the volume inside the tube becomes smaller, thereby discharging the treatment liquid from the tube .
本申請的第三發明是根據第二發明的供給裝置,其中,所述輔助泵為同軸管道(Coaxial Tubephragm,CT)泵。The third invention of the present application is the supply device according to the second invention, wherein the auxiliary pump is a coaxial tube (Coaxial Tubephragm, CT) pump.
本申請的第四發明是根據第一發明至第三發明中任一發明的供給裝置,其中,所述處理液為包含聚醯亞胺前驅物的清漆,所述供給目標為噴出所述清漆的噴嘴。The fourth invention of the present application is the supply device according to any one of the first to third inventions, wherein the processing liquid is a varnish containing a polyimide precursor, and the supply target is the one that sprays the varnish nozzle.
本申請的第五發明是一種塗覆裝置,其對成為處理對象的面塗覆液體,所述塗覆裝置包括:第一發明至第四發明中任一發明的供給裝置;以及噴嘴,為所述供給裝置的所述供給目標,且具有噴出所述處理液的噴出口。A fifth invention of the present application is a coating device that applies liquid to a surface to be treated. The coating device includes: the supply device of any one of the first to fourth inventions; and the nozzle, which is The supply target of the supply device has a discharge port that discharges the processing liquid.
本申請的第六發明是根據第五發明的塗覆裝置,還包括:框體,在上表面具有載台,所述載台載置成為處理對象的基板,所述噴嘴能移動地配置於所述載台的上部,在所述框體的內部,收容所述主泵及所述脫氣單元。The sixth invention of the present application is a coating device according to the fifth invention, further comprising: a frame body having a stage on the upper surface, the stage being placed on a substrate to be processed, and the nozzle being movably arranged on the The upper part of the stage houses the main pump and the degassing unit inside the casing.
本申請的第七發明是一種供給方法,用於將高粘度的處理液供給至供給目標,所述供給方法包括下述工序:a)從貯存所述處理液的槽中,通過輔助泵朝向脫氣單元加壓並供給所述處理液;b)在所述脫氣單元中,所述處理液通過外側空間經減壓的多個中空纖維膜內,由此去除所述處理液中的溶解氣體;以及c)通過主泵來輸送通過了所述脫氣單元的所述處理液。 [發明的效果]The seventh invention of the present application is a supply method for supplying a high-viscosity treatment liquid to a supply target, the supply method including the following steps: a) From the tank storing the treatment liquid, the auxiliary pump The gas unit pressurizes and supplies the treatment liquid; b) In the degassing unit, the treatment liquid passes through a plurality of hollow fiber membranes in which the outer space is decompressed, thereby removing dissolved gas in the treatment liquid ; And c) The main pump is used to deliver the treatment liquid that has passed through the degassing unit. [Effect of invention]
根據本申請的第一發明至第七發明,能夠效率良好地去除粘度高的處理液中的溶解氣體,並且能夠使裝置小型化。According to the first to seventh inventions of the present application, it is possible to efficiently remove the dissolved gas in the processing liquid with high viscosity, and it is possible to miniaturize the device.
尤其,根據本申請的第二發明及第三發明,能夠抑制在輔助泵內產生顆粒(particle)而混入處理液中的現象。In particular, according to the second invention and the third invention of the present application, it is possible to suppress the phenomenon that particles are generated in the auxiliary pump and are mixed into the processing liquid.
尤其,根據本申請的第六發明,通過將脫氣單元配置在緊靠噴嘴附近,從而能夠將進行了脫氣處理的處理液在再次吸收氣體之前供給至噴嘴。In particular, according to the sixth invention of the present application, by arranging the degassing unit close to the nozzle, it is possible to supply the degassed treatment liquid to the nozzle before absorbing the gas again.
以下,參照附圖來說明本發明的實施方式。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<1.關於塗覆裝置的結構>
圖1是本發明的一實施方式的塗覆裝置1的概略圖。所述塗覆裝置1是在柔性元件的製造工序中,對玻璃制的載體基板9(以下稱作“基板9”)的上表面塗覆作為高粘度液體的處理液(被塗覆材料)的裝置。塗覆在基板9上表面的處理液隨後固化成為薄膜。而且,在所述薄膜的表面形成電極等的圖案(pattern),並從基板9剝離所述薄膜,由此來形成柔性元件。<1. About the structure of the coating device>
FIG. 1 is a schematic diagram of a
對於處理液,例如使用作為粘度高的流體的包含聚醯亞胺前驅物的溶融樹脂。處理液的粘度例如為千cP~一萬cP左右。以下,所謂“高粘度”,表示千cP以上。For the treatment liquid, for example, a melt resin containing a polyimide precursor as a fluid with high viscosity is used. The viscosity of the treatment liquid is, for example, about 1,000 cP to 10,000 cP. Hereinafter, the term "high viscosity" means 1000 cP or more.
如圖1所示,塗覆裝置1具有塗覆部20、對塗覆部20供給處理液的供給部30及控制部10。As shown in FIG. 1, the
塗覆部20是用於將從供給部30供給的處理液塗覆於基板9的結構。圖2是塗覆部20的立體圖。另外,以下,為了便於說明,將塗覆裝置1中的狹縫噴嘴22的移動方向稱作“前後方向”,將與前後方向正交的水平方向稱作“左右方向”。The
如圖2所示,本實施方式的塗覆部20具有框體21、狹縫噴嘴22、噴嘴保持部23及行走機構24。As shown in FIG. 2, the
框體21具有載置並保持基板9的載台210。在框體21的內部,收容供給部30的一部分。載台210的上表面為平坦,設有多個真空吸附孔(圖示省略)。當將基板9載置於載台210上時,借助真空吸附孔的抽吸力,基板9的下表面吸附於載台210的上表面。由此,基板9以水平姿勢固定於載台210上。而且,在載台210的內部,設有多個起模針(lift pin)。當從載台210搬出基板9時,多個起模針突出至載台210上。由此,從載台210的上表面分離基板9。The
狹縫噴嘴22是噴出處理液的噴嘴。狹縫噴嘴22具有在左右方向上長的噴嘴主體(nozzle body)221。在噴嘴主體221的下端部,設有沿左右方向延伸的狹縫狀的噴出口223。噴出口223朝向被載置於載台210上的基板9的上表面。當從供給部30向噴嘴主體221內供給處理液時,從狹縫噴嘴22的噴出口223朝向成為處理對象的基板9的上表面噴出處理液。The
噴嘴保持部23是用於將狹縫噴嘴22保持於載台210的上方的機構。噴嘴保持部23具有:架橋部231,沿左右方向延伸;以及一對柱狀的支撐部232,支撐架橋部231的兩端。狹縫噴嘴22安裝於架橋部231的下表面。而且,各支撐部232具有對架橋部231的端部的高度進行調節的升降機構233。當使左右的升降機構233動作時,與架橋部231一同,狹縫噴嘴22的高度及姿勢得到調節。The
行走機構24是用於使狹縫噴嘴22沿前後方向移動的機構。行走機構24具有一對行走軌道(rail)241及一對線性馬達(linear motor)242。一對行走軌道241是在載台210左右的側部沿前後方向延伸。行走軌道241一邊分別支撐一對支撐部232,一邊沿前後方向引導各支撐部232的下端部。即,一對行走軌道241作為在前後方向上限制一對支撐部232的移動方向的線性導軌(linear guide)發揮功能。The traveling
線性馬達242具有固定於載台210的定子242a、及固定於支撐部232的動子242b。定子242a沿著載台210左右的側緣部而沿前後方向延伸。在塗覆部20的運轉時,在定子242a與動子242b之間產生磁性吸引力或磁性斥力。由此,動子242b、噴嘴保持部23及狹縫噴嘴22作為一體而沿前後方向移動。The
供給部30具有供給槽31、送液配管32、主泵33、脫氣單元34、輔助泵35及過濾器36。供給部30是用於將高粘度的處理液供給至作為供給目標的塗覆部20的狹縫噴嘴22的供給裝置。The
供給槽31是用於貯存供給前的處理液的槽。本實施方式的供給部30具有六個供給槽31。The
送液配管32是用於將處理液從供給槽31供給至狹縫噴嘴22的配管。在送液配管32的一端(上游側的端部),連接有從各供給槽31延伸的供給配管311。送液配管32的另一端(下游側端部)成為將處理液供給至作為供給目標的狹縫噴嘴22的供給口320。即,送液配管32的另一端連接於狹縫噴嘴22。The
主泵33介插在送液配管32中。主泵33從供給槽31朝向供給口320輸送處理液。對於主泵33,例如使用同軸管道(Coaxial Tubephragm,CT)泵或定量噴出並列管道(Parallel Tubephragm,PT)泵等的管道泵。The
脫氣單元34是在主泵33的上游側且輔助泵35的下游側,介插於送液配管32中。圖3是表示脫氣單元34的結構的剖面圖。脫氣單元34是所謂的中空纖維膜脫氣模塊。如圖3所示,脫氣單元34具有筒狀的殼體41、多個中空纖維膜42及減壓機構43。The degassing
殼體41具有流入口411、流出口412以及兩個排氣口413。流入口411設於殼體41的一端,與送液配管32的較脫氣單元34為上游側的部分進行流路連接。流出口412設於殼體41的另一端,與送液配管32的較脫氣單元34為下游側的部分進行流路連接。排氣口413設於殼體41的側部,與減壓機構43相連接。The
中空纖維膜42為細筒狀的膜。所有中空纖維膜42的一端分別流路連接於流入口411。而且,所有中空纖維膜42的另一端分別流路連接於流出口412。由此,當送液配管32內產生處理液的流動時,處理液從流入口411被供給至中空纖維膜42,並從流出口412排出所述處理液。The
所述中空纖維膜42被用於脫氣處理,因此由不使液體通過且可使氣體透過的氣體透過膜所形成。本實施方式的脫氣單元34中所用的中空纖維膜42的內徑為0.5 mm~3 mm。而且,本實施方式的脫氣單元34中所用的中空纖維膜42的數量為100根~1000根左右。另外,脫氣單元34中所用的中空纖維膜42的內徑及數量根據處理液的種類或流量來適當變更。Since the
減壓機構43包含減壓配管431及減壓泵432。減壓配管431的一端分支為兩個,連接於殼體41的排氣口413。而且,減壓配管431的另一端連接於減壓泵432。當減壓泵432驅動時,經由減壓配管431及兩個排氣口413來從殼體41內的空間抽吸氣體。由此,殼體41內的空間的氣壓下降。即,中空纖維膜42的外部空間的氣壓下降。另外,圖3的示例中,排氣口413為兩個,但排氣口413也可為一個,還可為三個以上。The
如上所述,通過將中空纖維膜42的外部空間設為比中空纖維膜42的內部低的壓力,從而能夠將通過中空纖維膜42內部的液體中的氣泡、或溶解於所述液體中的氣體排出至中空纖維膜42的外部空間。由此,能夠對中空纖維膜42內的液體進行脫氣處理。As described above, by setting the outer space of the
輔助泵35在脫氣單元34的上游側且過濾器36的下游側,介插於送液配管32中。輔助泵35朝向脫氣單元34加壓並供給處理液。本實施方式的輔助泵35是被稱作同軸管道(Coaxial Tubephragm,CT)泵的管道泵的一種。圖4及圖5是表示輔助泵35的結構的剖面圖。如圖4及圖5所示,輔助泵35具有框體50、下側止回閥(check valve)51、上側止回閥52、管53及流體保持部54。The
框體50在其下端部具有流入口501,在上端部具有流出口502。在流入口501流路連接有送液配管32的較輔助泵35為上游側的部分。在流出口502流路連接有送液配管32的較輔助泵35為下游側的部分。從流入口501直至流出口502為止,依序流路連接有下側止回閥51、管53的內部空間及上側止回閥52,構成流路500。下側止回閥51及上側止回閥52均為僅使從下方朝向上方的流體的流動通過的止回閥。The
管53是配置在流體保持部54內側的可收縮的管狀構件。如上所述,管53構成流路500的一部分。The
流體保持部54是配置在管53外側的筒狀構件。流體保持部54的內部空間構成流體貯存室540。即,管53配置在流體貯存室540的內部。在流體貯存室540的較管53為外側的空間內,填充有間接流體。管53的內部空間與管53的外部空間不連通。因此,流經流路500內的處理液、與填充在流體貯存室540內的間接流體不混合。另外,間接流體既可為液體,也可為氣體。The
流體保持部54具有小徑波紋管(bellows)541、大徑波紋管542、波紋管中心(bellows center)543及移動機構544。小徑波紋管541及大徑波紋管542分別為沿著上下方向配置的蛇腹狀的管狀構件。波紋管中心543為環(ring)狀的構件。移動機構544是用於使波紋管中心543的上下方向的位置移動的機構。小徑波紋管541的管徑比大徑波紋管542的管徑小。小徑波紋管541的一端固定於框體50。小徑波紋管541的另一端與大徑波紋管542的一端固定於波紋管中心543。大徑波紋管542的另一端固定於框體50。The
如圖4所示,當波紋管中心543通過移動機構544而朝上方移動時,小徑波紋管541在上下方向上變短,並且大徑波紋管542在上下方向上變長。由此,流體貯存室540的體積增加,流體貯存室540內的壓力下降。其結果,管53內的壓力也下降,處理液從送液配管32的上游側經由流入口501及下側止回閥51而被抽吸至管53的內部。As shown in FIG. 4, when the
另一方面,如圖5所示,當波紋管中心543通過移動機構544而朝下方移動時,小徑波紋管541在上下方向上變長,並且大徑波紋管542在上下方向上變短。由此,流體貯存室540的體積減少,流體貯存室540內的壓力增加。其結果,來自間接流體的壓力施加至管53的外周面,管53內的處理液經由上側止回閥52及流出口502而排出至送液配管32的下游側。On the other hand, as shown in FIG. 5, when the
如上所述,通過移動波紋管中心543的位置,流體貯存室540的內部體積可增減。其結果,能夠進行輔助泵35中的處理液的抽吸及排出。As described above, by moving the position of the
對於輔助泵35,如上所述,優選使用通過將流體的壓力施加至可收縮的管的外周面來送液的類型的所謂管道泵。如上所述,通過從外側按壓填充有處理液的管來排出處理液,由此能夠抑制在輔助泵35內產生顆粒而混入處理液中的現象。As for the
圖6是表示另一例的輔助泵35A的結構的剖面圖。圖6的示例的輔助泵35A是被稱作定量噴出並列管道(Parallel Tubephragm,PT)泵的管道泵的一種。6 is a cross-sectional view showing another example of the configuration of the
圖6的示例的輔助泵35A中,流體貯存室540A包含:功能部61A,在內側配置管53A;軸配置部62A,在內部配置驅動軸55A;以及連接部63A,對功能部61A及軸配置部62A進行流路連接。驅動軸55A能夠突出至軸配置部62A的內部。另外,驅動軸55A的側面也可具有蛇腹狀的波紋管。In the
如圖6中的箭頭所示,當驅動軸55A突出至軸配置部62A內時,軸配置部62A內的間接流體的壓力增加。由此,在功能部61A內,間接流體的壓力也增加,來自間接流體的壓力施加至管53A的外周面。其結果,處理液從管53A經由流出口502A而排出。As indicated by the arrow in FIG. 6, when the
相反地,當突出的驅動軸55A返回原本的位置時,軸配置部62A內的間接流體的壓力下降。由此,在功能部61A內,間接流體的壓力也下降,管53A內的壓力也下降。其結果,處理液經由流入口501A而被抽吸至管53A內。Conversely, when the protruding
即便如圖6的示例的輔助泵35A那樣為CT泵以外的管道泵,也能夠抑制在輔助泵35A內產生顆粒而混入處理液中的現象。Even if the
過濾器36在脫氣單元34及輔助泵35的上游側介插在送液配管中。過濾器36去除流經送液配管32中的處理液中所含的異物。The
控制部10是用於對塗覆裝置1內的各部進行動作控制的部件。如圖1中概念性地所示,控制部10包含計算機(computer),所述計算機具有中央處理器(Central Processing Unit,CPU)等運算處理部11、隨機存取存儲器(Random Access Memory,RAM)等存儲器12以及硬盤驅動器(hard disk drive)等存儲部13。控制部10與所述起模針、行走機構24等塗覆部20內的各部分別電連接。而且,控制部10與供給部30內所設的閥或主泵33、輔助泵35、減壓泵432及移動機構544也電連接。控制部10將存儲在存儲部13中的計算機程序(computer program)或數據(data)暫時讀出到存儲器12中,基於所述計算機程序及數據,運算處理部11進行運算處理,由此對塗覆裝置1內的各部進行動作控制。由此,推進對基板9的塗覆處理。The
所述塗覆裝置1的供給部30中,作為用於進行處理液的脫氣的機構,配設有脫氣單元34及輔助泵35。在具有多個中空纖維膜42的脫氣單元34中,中空纖維膜42的內徑跟送液配管32的內徑相比非常小,因此脫氣單元34中的流路阻力大於送液配管32中的流路阻力。因此,與對狹縫噴嘴22中的噴出速度進行調整的主泵33獨立地,在緊靠脫氣單元34的上游側,配置有用於向脫氣單元34輸送處理液的輔助泵35。由此,能夠順暢地對脫氣單元34的各中空纖維膜42供給處理液。The
如上所述,以往的脫氣機構即脫氣用的槽中,脫氣耗費時間。因此,在處理液的消耗速度大的情況下,脫氣用的槽數變多,裝置整體大型化。與此相對,在所述供給部30中,能夠通過小型的脫氣單元34來進行脫氣。在使用中空纖維膜42的脫氣單元34中,即使在處理液以相對較大的流速通過的情況下,也能夠充分地進行脫氣處理。即,所述供給部30中,能夠效率良好地去除粘度高的處理液中的溶解氣體,並且能夠使裝置小型化。As described above, in the degassing tank which is a conventional degassing mechanism, degassing takes time. Therefore, when the consumption rate of the processing liquid is high, the number of degassing tanks increases, and the entire apparatus becomes large. On the other hand, in the
而且,本實施方式中,如圖1中概念性地所示,供給部30的脫氣單元34及主泵33收容在塗覆部20的框體21的內部。根據形成送液配管32的原材料,有時送液配管32會使氣體稍許透過。如上所述,脫氣單元34配置在緊靠狹縫噴嘴22附近,由此能夠將進行了脫氣處理的處理液在再次吸收氣體之前立即供給至狹縫噴嘴22。Furthermore, in this embodiment, as conceptually shown in FIG. 1, the degassing
<2.關於塗覆裝置中的各工序>
接下來,對塗覆裝置1中的各工序進行說明。圖7是表示在塗覆裝置1中對處理液進行的各工序的流程的流程圖。<2. About each process in the coating device>
Next, each step in the
如圖7所示,在塗覆裝置1中,當通過主泵33及輔助泵35而在送液配管32內產生從供給槽31朝向狹縫噴嘴22的流動時,從供給槽31供給至送液配管32的處理液首先在過濾器36中去除異物(步驟S101)。As shown in FIG. 7, in the
繼而,通過了過濾器36的處理液接下來供給至輔助泵35。接著,所述處理液通過輔助泵35,朝向脫氣單元34而加壓並供給至送液配管32的下游側(步驟S102)。由此,向流路阻力相對較大的脫氣單元34順暢地供給處理液。Then, the processing liquid that has passed through the
從輔助泵35供給的處理液在從輔助泵35排出後,立即被供給至脫氣單元34。在脫氣單元34中,處理液通過外側空間經減壓的多個中空纖維膜42內。由此,處理液中的溶解氣體被去除(步驟S103)。The processing liquid supplied from the
接著,在脫氣單元34中去除了溶解氣體的處理液通過主泵33輸送,供給至狹縫噴嘴22(步驟S104)。在主泵33中,以塗覆工序中所需的量,來供給狹縫噴嘴22中的塗覆工序所需的處理液。供給至狹縫噴嘴22的處理液朝向基板9的上表面而噴出、塗覆(步驟S105)。如上所述,供給槽31內的處理液經脫氣處理後,塗覆至基板9。Next, the processing liquid from which the dissolved gas has been removed in the
<3.變形例> 以上,對本發明的一實施方式進行了說明,但本發明並不限定於所述實施方式。<3. Modifications> In the above, one embodiment of the present invention has been described, but the present invention is not limited to the above embodiment.
所述實施方式中,供給高粘度處理液的供給裝置即供給部30是與具有作為供給目標的狹縫噴嘴22的塗覆部20一同使用,作為整體而構成塗覆裝置1。但是,本發明並不限於此。本發明的供給裝置也可將以處理液的塗覆為目的的塗覆部以外的裝置作為供給目標。In the above-described embodiment, the
而且,所述塗覆裝置1是用於製造柔性元件的基材自身的工藝(process),但本發明的塗覆裝置也可用於在元件形成後的基材表面形成保護膜的工藝。而且,本發明的塗覆裝置也可用於對貼合基板與基板時的粘合劑進行塗覆的工藝。而且,本發明的塗覆裝置也可用於柔性元件以外的液晶顯示裝置或半導體基板的製造工序。而且,本發明的塗覆裝置也可用於鋰離子(lithium ion)二次電池或燃料電池等電池的製造工序。即,本發明的塗覆裝置尤其適合於塗覆高粘度材料的工藝。Furthermore, the
而且,供給裝置及塗覆裝置的細節也可與本申請的各圖中所示的結構不同。而且,也可將在所述實施方式或變形例中出現的各元件在不產生矛盾的範圍內適當組合。Moreover, the details of the supply device and the coating device may be different from the structures shown in the drawings of the present application. Furthermore, each element appearing in the above-mentioned embodiment or modification may be appropriately combined within a range that does not cause conflicts.
1:塗覆裝置
9:基板(載體基板)
10:控制部
11:運算處理部
12:存儲器
13:存儲部
20:塗覆部
21:框體
22:狹縫噴嘴
23:噴嘴保持部
24:行走機構
30:供給部
31:供給槽
32:送液配管
33:主泵
34:脫氣單元
35、35A:輔助泵
36:過濾器
41:殼體
42:中空纖維膜
43:減壓機構
50:框體
51:下側止回閥
52:上側止回閥
53、53A:管
54:流體保持部
55A:驅動軸
61A:功能部
62A:軸配置部
63A:連接部
210:載台
221:噴嘴主體
223:噴出口
231:架橋部
232:支撐部
233:升降機構
241:行走軌道
242:線性馬達
242a:定子
242b:動子
311:供給配管
320:供給口
411、501、501A:流入口
412、502、502A:流出口
413:排氣口
431:減壓配管
432:減壓泵
500:流路
540、540A:流體貯存室
541:小徑波紋管
542:大徑波紋管
543:波紋管中心
544:移動機構
S101~S105:步驟1: coating device
9: substrate (carrier substrate)
10: Control Department
11: Operation processing section
12: memory
13: Storage Department
20: Coating Department
21: Frame
22: slit nozzle
23: Nozzle holder
24: Walking mechanism
30: Supply Department
31: Supply tank
32: Liquid delivery piping
33: main pump
34:
圖1是塗覆裝置的概略圖。 圖2是塗覆部的立體圖。 圖3是表示脫氣單元的結構的剖面圖。 圖4是表示輔助泵的結構的剖面圖。 圖5是表示輔助泵的結構的剖面圖。 圖6是表示另一例的輔助泵的結構的剖面圖。 圖7是表示在塗覆裝置中對處理液進行的各工序的流程的流程圖。FIG. 1 is a schematic diagram of a coating apparatus. Fig. 2 is a perspective view of a coating portion. 3 is a cross-sectional view showing the structure of the degassing unit. 4 is a cross-sectional view showing the structure of an auxiliary pump. 5 is a cross-sectional view showing the structure of an auxiliary pump. 6 is a cross-sectional view showing the structure of another example of an auxiliary pump. 7 is a flowchart showing the flow of each step performed on the processing liquid in the coating device.
1:塗覆裝置 1: coating device
10:控制部 10: Control Department
11:運算處理部 11: Operation processing section
12:存儲器 12: memory
13:存儲部 13: Storage Department
20:塗覆部 20: Coating Department
21:框體 21: Frame
22:狹縫噴嘴 22: slit nozzle
30:供給部 30: Supply Department
31:供給槽 31: Supply tank
32:送液配管 32: Liquid delivery piping
33:主泵 33: main pump
34:脫氣單元 34: Degassing unit
35:輔助泵 35: auxiliary pump
36:過濾器 36: filter
311:供給配管 311: Supply piping
320:供給口 320: supply port
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JP2008149523A (en) * | 2006-12-15 | 2008-07-03 | Sii Printek Inc | Ink jet recorder and method for deaerating ink |
JP2010076413A (en) * | 2007-12-11 | 2010-04-08 | Seiko Epson Corp | Liquid supply device and liquid jetting apparatus |
KR101849799B1 (en) * | 2012-02-16 | 2018-04-17 | 도쿄엘렉트론가부시키가이샤 | Liquid treatment method and removal system of gas in filter |
JP5949038B2 (en) * | 2012-03-27 | 2016-07-06 | 日本電気株式会社 | Coating device |
JP5741549B2 (en) * | 2012-10-09 | 2015-07-01 | 東京エレクトロン株式会社 | Treatment liquid supply method, treatment liquid supply apparatus, and storage medium |
JP2015136643A (en) * | 2014-01-21 | 2015-07-30 | 旭硝子株式会社 | Method for manufacturing composite, and coating apparatus |
JP6347708B2 (en) * | 2014-09-26 | 2018-06-27 | 株式会社Screenホールディングス | Coating apparatus and cleaning method |
JP2016087548A (en) * | 2014-11-05 | 2016-05-23 | 東レエンジニアリング株式会社 | Coating applicator and air accumulation removing method |
JP6445893B2 (en) * | 2015-02-18 | 2018-12-26 | 株式会社Screenホールディングス | Degassing device, coating device, and degassing method |
KR20180060361A (en) * | 2016-11-29 | 2018-06-07 | 주식회사 케이씨텍 | Chemical degassing device |
-
2018
- 2018-09-14 JP JP2018172545A patent/JP6808696B2/en active Active
-
2019
- 2019-06-18 CN CN201910525682.0A patent/CN110899051B/en active Active
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CN110899051A (en) | 2020-03-24 |
JP2020044465A (en) | 2020-03-26 |
CN110899051B (en) | 2022-02-11 |
JP6808696B2 (en) | 2021-01-06 |
TWI741316B (en) | 2021-10-01 |
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