TW202009504A - Electronic component test device and classification device thereof including a test mechanism, a carrier mechanism, and an imaging mechanism - Google Patents
Electronic component test device and classification device thereof including a test mechanism, a carrier mechanism, and an imaging mechanism Download PDFInfo
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本發明係提供一種可以更清楚準確的取像出各測試座內是否殘留有異物,以降低損壞率及提升測試品質之電子元件測試裝置及其應用之分類設備。 The present invention provides an electronic component testing device and its application classification device that can more clearly and accurately capture whether foreign matter remains in each test seat to reduce the damage rate and improve the testing quality.
按,電子元件於製作完成後,均會移載至電子元件測試裝置上進行電性測試作業或外觀檢測作業等,以淘汰出不良品,而確保產品品質;由於測試裝置之測試座內有時會殘留有電子元件或受損電子元件之餘屑或灰塵等異物,在不易察覺之情況下,易使後續置入之電子元件因壓抵到異物而陸續受損,且該異物亦會影響電子元件與測試座之探針接觸,造成電子元件損壞率增加及測試品質不佳之缺失。為了改善前述情形,即有業者設置取像器對測試座取像,請參閱第1、2圖,其係為本國專利申請第100209133號『具取像裝置之電子元件檢測機』新型專利案,其係於機台20上配置有測試裝置30、輸送裝置40及取像裝置50,該測試裝置30係於機台20上設有具二測試座32之測試電路板31,並以測試器將測試結果傳輸至中央控制單元,由中央控制單元控制各裝置作動,該輸送裝置40係於測試座32之一側設有一可作X軸向位移之入料載台41,用以載送待測之電子元件,並於另一側設有一可作X軸向位移之出料載台42,用以載送完測之電子元件,另該輸送裝置40係於測試裝置30之上方設有二可作Y-Z軸向位移且具有取放器431、441之第一、二移料臂43、44,第一移料臂43係於入料載台41及測試座32間移載待測之電子元件, 第二移料臂44則於出料載台42及測試座32間移載完測之電子元件,該取像裝置50係於機台20上架設有二為CCD之取像器52,並使二取像器52位於測試裝置30之側方,用以取像測試座32,另於取像器52之側方裝設有光源53;藉此,該取像裝置50之取像器52即可對測試座32取像,並將取像訊號傳輸至中央控制單元,以判別測試座32內是否殘留有異物。 Press, the electronic components will be transferred to the electronic component testing device for electrical testing or appearance testing after the production is completed, to eliminate defective products and ensure product quality; due to the sometimes Foreign objects such as scraps or dust of electronic components or damaged electronic components will remain, and it is easy to cause the subsequent placement of electronic components to be damaged by pressing the foreign objects under difficult circumstances, and the foreign objects will also affect the electronic The contact between the component and the probe of the test base results in an increase in the damage rate of the electronic component and the lack of poor test quality. In order to improve the aforementioned situation, that is, if an operator sets an image pickup device to take an image of the test base, please refer to Figures 1 and 2, which is a new patent case for the national patent application No. 100209133 "Electronic Component Inspection Machine with Image Acquisition Device", It is equipped with a
由於電子元件的發展日益精密且體積也日益縮小,而測試裝置也進化到一次同時可以對數顆電子元件(例如8顆)執行測試作業,導致該取像裝置50的設置方式已不敷現況使用;其原因在於該取像裝置50係於測試裝置30之一側方裝設二取像器52,而此將會使得越遠離二取像器52位置之測試座越難以清楚準確的取像,亦即越遠離二取像器52位置之測試座,二取像器52就必須以更偏斜的角度對該測試座取像,二取像器52越偏斜取像其影像就越容易失真,尤其日益縮小的電子元件,其對應縮小的測試座於偏斜取像後的影像更加可能失真,進而大幅提高中央控制單元誤判的情形,當然誤判的情形愈高就愈容易造成電子元件損壞率增加及測試品質不佳之缺失。 As the development of electronic components is becoming more precise and the volume is shrinking, and the testing device has evolved to be able to perform testing operations on several electronic components (such as 8) at a time, the setting method of the
有鑑於此,本發明人遂以其多年從事相關行業的研發與製作經驗,針對目前所面臨之問題深入研究,經過長期努力之研究與試作,終究研創出一種電子元件測試裝置及其應用之分類設備,以有效改善先前技術之缺點,此即為本發明之設計宗旨。 In view of this, the present inventors have used their years of experience in R&D and production in related industries to conduct in-depth research on the problems facing them. After long-term hard research and trial work, they finally developed a classification of electronic component test devices and their applications Equipment, to effectively improve the shortcomings of the prior art, this is the design aim of the present invention.
本發明之目的一,係提供一種電子元件測試裝置,其係於機台上配置有測試機構、載送機構及取像機構,該測試機構係設有測試電路板,並於該測試電路板設有第一區測試座及第二區測試座,用以測試複數個電子元件,該載送機構係設有至少一入、出 料載台,並於一機架上設有至少一具取放器之移載臂,用以移載待測/完測之電子元件,該取像機構係於對應該第一、二區測試座的上方機架上分別架設有第一、二取像器,並以該第一、二取像器分別對第一、二區測試座取像;藉此,利用該第一、二取像器對各區域中心的取像,即可取得各區域之測試座更加清楚的影像,進而準確的判斷出各測試座內是否殘留有異物,以防止後續置入之電子元件受損,達到降低損壞率及提升測試品質之效益。 The first object of the present invention is to provide an electronic component testing device, which is equipped with a testing mechanism, a carrying mechanism and an imaging mechanism on the machine table, the testing mechanism is provided with a test circuit board, and is provided on the test circuit board There is a first-zone test seat and a second-zone test seat for testing a plurality of electronic components. The carrying mechanism is provided with at least one inlet and outlet carrier, and at least one pick-and-place on a rack The transfer arm of the device is used to transfer the electronic components to be tested/completed. The imaging mechanism is mounted on the upper frame corresponding to the first and second zone test seats, and the first and second imagers are respectively mounted. The first and second imagers are used to take images of the first and second zone test seats respectively; by using the first and second imagers to take images of the center of each area, the test seats of each area can be obtained A clearer image, and then accurately determine whether there are foreign objects remaining in each test seat, to prevent subsequent damage to the electronic components placed, to achieve the benefits of reducing the damage rate and improving test quality.
本發明之目的二,係提供一種應用電子元件測試裝置之分類設備,其係於機台上配置有供料裝置、收料裝置、測試裝置、入出料裝置及控制裝置,該供料裝置係設有至少一容納待測電子元件之供料承置器,該收料裝置係設有至少一容納已測電子元件之收料承置器,該測試裝置係設有測試機構、載送機構及取像機構,用以移載及對電子元件執行測試作業,該入出料裝置設有至少一具取放器之移料臂,以於供料裝置、測試裝置及收料裝置間移載電子元件,該控制裝置係用以控制及整合各裝置作動,而執行自動化作業,並達到降低損壞率及提升測試品質之效益。 The second object of the present invention is to provide a sorting device using an electronic component testing device, which is equipped with a feeding device, a receiving device, a testing device, a feeding and discharging device and a control device on the machine table. The feeding device is designed There is at least one feed holder for containing the electronic components to be tested, the receiving device is provided with at least one feed holder for containing the tested electronic components, the testing device is provided with a testing mechanism, a carrying mechanism and a The image mechanism is used to transfer and perform testing operations on electronic components. The material feeding and discharging device is provided with at least one material moving arm with a pick and place device to transfer electronic components between the feeding device, the testing device and the receiving device. The control device is used to control and integrate the actions of each device, and perform automated operations, and achieve the benefits of reducing the damage rate and improving the quality of the test.
習知部分: Learn part:
20‧‧‧機台 20‧‧‧machine
30‧‧‧測試裝置 30‧‧‧Test device
31‧‧‧測試電路板 31‧‧‧Test circuit board
32‧‧‧測試座 32‧‧‧Test socket
40‧‧‧輸送裝置 40‧‧‧Conveying device
41‧‧‧入料載台 41‧‧‧ Feeding stage
42‧‧‧出料載台 42‧‧‧Discharge carrier
43‧‧‧第一移料臂 43‧‧‧ First material moving arm
431‧‧‧取放器 431‧‧‧ pick and place device
44‧‧‧第二移料臂 44‧‧‧Second shifting arm
441‧‧‧取放器 441‧‧‧ pick and place device
50‧‧‧取像裝置 50‧‧‧Acquisition device
52‧‧‧取像器 52‧‧‧Viewfinder
53‧‧‧光源 53‧‧‧Light source
本發明部份: Part of the invention:
60‧‧‧測試裝置 60‧‧‧Test device
61‧‧‧測試機構 61‧‧‧ Testing organization
611‧‧‧測試電路板 611‧‧‧Test circuit board
612‧‧‧第一區測試座 612‧‧‧
613‧‧‧第二區測試座 613‧‧‧Second District Test Block
62‧‧‧載送機構 62‧‧‧Carrier
621‧‧‧第一入料載台 621‧‧‧First loading stage
622‧‧‧第一出料載台 622‧‧‧The first discharge carrier
623‧‧‧第二入料載台 623‧‧‧ Second loading stage
624‧‧‧第二出料載台 624‧‧‧Second discharge platform
625‧‧‧第一移載臂 625‧‧‧ First transfer arm
6251‧‧‧第一取放器 6251‧‧‧First pick and place device
626‧‧‧第二移載臂 626‧‧‧Second transfer arm
6261‧‧‧第二取放器 6261‧‧‧Second pick and place device
627‧‧‧機架 627‧‧‧Rack
628‧‧‧承架 628‧‧‧Carrier
63‧‧‧取像機構 63‧‧‧Acquisition agency
631‧‧‧第一取像器 631‧‧‧ First viewfinder
632‧‧‧第二取像器 632‧‧‧Second viewfinder
633‧‧‧第一光源 633‧‧‧First light source
634‧‧‧第二光源 634‧‧‧Second light source
70‧‧‧電子元件 70‧‧‧Electronic components
71‧‧‧電子元件 71‧‧‧Electronic components
72‧‧‧電子元件 72‧‧‧Electronic components
80‧‧‧測試裝置 80‧‧‧Test device
81‧‧‧測試機構 81‧‧‧ Testing organization
812‧‧‧第一區測試座 812‧‧‧
813‧‧‧第二區測試座 813‧‧‧Second District Test Block
82‧‧‧載送機構 82‧‧‧Carrier
83‧‧‧取像機構 83‧‧‧Acquisition agency
831‧‧‧第一取像器 831‧‧‧ First viewfinder
832‧‧‧第二取像器 832‧‧‧ Second viewfinder
833‧‧‧第一光源 833‧‧‧First light source
834‧‧‧第二光源 834‧‧‧Second light source
835‧‧‧第一稜鏡 835‧‧‧The first Huang
836‧‧‧第二稜鏡 836‧‧‧Second
84‧‧‧外罩 84‧‧‧Outer cover
85‧‧‧熱測空間 85‧‧‧ Thermal measurement space
86‧‧‧升溫器 86‧‧‧heater
87‧‧‧隔熱板 87‧‧‧Insulation board
88‧‧‧絕熱空間 88‧‧‧insulated space
100‧‧‧供料裝置 100‧‧‧Feeding device
101‧‧‧供料承置器 101‧‧‧ Feeding holder
110‧‧‧收料裝置 110‧‧‧receiving device
111‧‧‧收料承置器 111‧‧‧receiving receiver
120‧‧‧入出料裝置 120‧‧‧Inlet and outfeed device
121‧‧‧第一移料臂 121‧‧‧ First material moving arm
122‧‧‧第二移料臂 122‧‧‧Second material moving arm
第1圖:申請第100209133號新型專利案之俯視示意圖。 Figure 1: A schematic top view of the application for the new patent case No. 100209133.
第2圖:申請第100209133號新型專利案之側視示意圖。 Figure 2: A schematic side view of the application for the new patent case No. 100209133.
第3圖:本發明第一實施例之俯視示意圖。 Figure 3: A schematic top view of the first embodiment of the present invention.
第4圖:本發明第一實施例之側視示意圖。 Figure 4: A schematic side view of the first embodiment of the present invention.
第5圖:本發明第一實施例之動作示意圖(一)。 Figure 5: Schematic diagram of the first embodiment of the present invention (1).
第6圖:第5圖之側視示意圖。 Figure 6: A schematic side view of Figure 5.
第7圖:本發明第一實施例之動作示意圖(二)。 Figure 7: A schematic diagram of the operation of the first embodiment of the present invention (2).
第8圖:本發明第一實施例之動作示意圖(三)。 Figure 8: Schematic diagram of the first embodiment of the present invention (3).
第9圖:本發明第一實施例之動作示意圖(四)。 Figure 9: Schematic diagram of the first embodiment of the present invention (four).
第10圖:本發明第一實施例之動作示意圖(五)。 Figure 10: Schematic diagram of the first embodiment of the present invention (5).
第11圖:本發明第一實施例之動作示意圖(六)。 Fig. 11: Schematic diagram of operation of the first embodiment of the present invention (6).
第12圖:本發明第二實施例之俯視示意圖。 Figure 12: A schematic top view of a second embodiment of the invention.
第13圖:本發明第二實施例之側視示意圖。 Figure 13: A schematic side view of a second embodiment of the present invention.
第14圖:本發明應用於分類設備之示意圖。 Figure 14: Schematic diagram of the present invention applied to a sorting device.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如后:請參閱第3、4圖,係為本發明第一實施例之電子元件測試裝置60,其係於機台上配置有測試機構61、載送機構62及取像機構63,該測試機構61係設有測試電路板611,並於該測試電路板611設有第一區測試座612及第二區測試座613,用以測試複數個電子元件,於本實施例中,該第一區測試座612係設有四個測試座,該第二區測試座613亦設有四個測試座,而可同時對8顆的電子元件執行測試作業,該測試機構61並以測試器(圖未示出)將測試結果傳輸至控制裝置(圖未示出),由控制裝置判讀並控制各裝置作動,該載送機構62係於測試機構61之兩側分別設有至少一可作第一軸向位移之入料載台及出料載台,用以載送待測/完測之電子元件,於本實施例中,該載送機構62係於測試機構61之一側設有一可作X軸向位移(即為第一軸向位移)之第一入料載台621及第一出料載台622,用以載送待測之電子元件及完測之電子元件,於本實施例中,該第一入料載台621及第一出料載台622所分別載送電子元件的數量係相同於第一區測試座612及第二區測試座613的數量總和;另於測試機構61之另側設有一可作X軸向位移(即為第一軸向位移)之 第二入料載台623及第二出料載台624,用以載送待測之電子元件及完測之電子元件,於本實施例中,該第二入料載台623及第二出料載台624所分別載送電子元件的數量係相同於第一區測試座612及第二區測試座613的數量總和;另該載送機構62於測試機構61上方以機架627架設有至少一可作第二、三軸向位移且具有取放器之移載臂,用以於第一入料載台621、第一出料載台622、第二入料載台623、第二出料載台624及測試機構61間移載待測之電子元件及完測之電子元件,於本實施例中,係於測試機構61上方之機架627架設有作Y-Z軸向位移(即為第二、三軸向位移)且具有第一取放器6251之第一移載臂625,該第一移載臂625係於第一入料載台621、第一出料載台622及測試機構61間移載待測之電子元件及完測之電子元件,於本實施例中,該第一移載臂625之第一取放器6251所取放電子元件的數量係相同於第一區測試座612及第二區測試座613的數量總和;另於測試機構61上方之機架627架設有作Y-Z軸向位移(即為第二、三軸向位移)且具有第二取放器6261之第二移載臂626,該第二移載臂626係於第二入料載台623、第二出料載台624及測試機構61間移載待測之電子元件及完測之電子元件,於本實施例中,該第二移載臂626之第二取放器6261所取放電子元件的數量係相同於第一區測試座612及第二區測試座613的數量總和;該取像機構63係於對應該第一區測試座612上方之承架628上架設有第一取像器631,以及於對應該第二區測試座613上方之承架628上架設有第二取像器632,而分別以該第一取像器631、第二取像器632對該第一區測試座612、第二區測試座613取像,於本實施例中,該第一取像器631係對第一區測試座612的區域中心 取像,而可取得第一區測試座612清楚的影像,另於該第一取像器631之側方裝設有第一光源633,以增加第一區測試座612四周之明亮度;該第二取像器632則對第二區測試座613的區域中心取像,而可取得第二區測試座613清楚的影像,另於該第二取像器632之側方裝設有第二光源634,以增加第二區測試座613四周之明亮度;該取像機構63之第一取像器631及第二取像器632可於每次執行測試作業前對第一區測試座612及第二區測試座613取像,亦或是採隨機的方式取像,以供控制裝置判別第一區測試座612及第二區測試座613內是否殘留有異物。 In order to make your examination committee understand the present invention further, here is a preferred embodiment with drawings, detailed as follows: please refer to Figures 3 and 4, which is the electronic component test of the first embodiment of the present invention The
請參閱第5、6圖,於測試電子元件70時,載送機構62之第一入料載台621係一批次載送8顆待測之電子元件70至測試機構61之側方,該第一移載臂625即作Y-Z軸向位移至第一入料載台621處取出待測之電子元件70,此時,該取像機構63之第一取像器631及第二取像器632即先對第一區測試座612及第二區測試座613進行取像作業,並供控制裝置判別第一區測試座612及第二區測試座613內是否殘留有異物,若發現有異物,則控制停機進行異常排除。請參閱第7圖,當測試機構61之第一區測試座612及第二區測試座613內並無異物時,該第一移載臂625係作Y-Z軸向位移,將待測之電子元件70移載至第一區測試座612及第二區測試座613,並壓抵電子元件70執行測試作業,此時,該第一入料載台621則移出準備承載後續待測之電子元件。請參閱第8圖,於第一區測試座612及第二區測試座613執行測試作業完畢後,該第二入料載台623係已載送下一批次8顆待測之電子元件71至第一區測試座612及第二區測試座613之另一側方,第一移載臂625則 離開第一區測試座612及第二區測試座613,並位移至第一出料載台622處,以將完測之電子元件70放置於第一出料載台622上;此時,該取像機構63之第一取像器631及第二取像器632即先對第一區測試座612及第二區測試座613進行取像作業,並供控制裝置判別第一區測試座612及第二區測試座613內是否殘留有異物,若發現有異物,則控制停機進行異常排除(同第6圖所示)。請參閱第9圖,當測試機構61之第一區測試座612及第二區測試座613內並無異物時,該第二移載臂626將待測之電子元件71移載至第一區測試座612及第二區測試座613,並壓抵電子元件71執行測試作業,此時,該第二入料載台623則移出準備承載後續待測之電子元件。請參閱第10圖,於第一區測試座612及第二區測試座613執行測試作業完畢後,該第一入料載台621已載送下一批次8顆待測之電子元件72至第一區測試座612及第二區測試座613之側方,第二移載臂626則離開第一區測試座612及第二區測試座613,並位移至第二出料載台624處,以將完測之電子元件71放置於第二出料載台624上;此時,該取像機構63之第一取像器631及第二取像器632即對第一區測試座612及第二區測試座613進行取像作業,並供控制裝置判別第一區測試座612及第二區測試座613內是否殘留有異物,若發現有異物,則控制停機進行異常排除(同第6圖所示)。請參閱第11圖,當測試機構61之第一區測試座612及第二區測試座613內並無異物時,該第一移載臂625將待測之電子元件72移載至第一區測試座612及第二區測試座613,並壓抵電子元件72執行測試作業,此時,該第一入料載台621則移出準備承載後續待測之電子元件。 Please refer to Figures 5 and 6. When testing the
請再參閱第5、6圖,該取像機構63之第一取像器 631及第二取像器632係每次取像檢查第一區測試座612及第二區測試座613,亦即當第一移載臂625或第二移載臂626將完測之電子元件移出第一區測試座612及第二區測試座613後,該取像機構63之第一取像器631及第二取像器632即對第一區測試座612及第二區測試座613的各區域中心進行取像作業,即可取得各區域之測試座更加清楚的影像,進而供控制裝置準確的判別第一區測試座612及第二區測試座613內是否殘留有異物,以防止後續置入之電子元件受損,達到降低損壞率及提升測試品質之效益。 Please refer to FIGS. 5 and 6 again. The
請再參閱第12、13圖,係為本發明第二實施例之電子元件測試裝置80,其係於機台上配置有測試機構81、載送機構82及取像機構83,相較於第一實施例,其差異僅在於該測試機構81的周邊區域以外罩84構成一封閉的熱測空間85,並於外罩84之內部裝配有升溫器86,而成為一模擬應用場所之高溫環境,另於該熱測空間85的上方以隔熱板87區隔出一絕熱空間88,該取像機構83係於對應該第一區測試座812上方之絕熱空間88內或於該絕熱空間88的上方架設有第一取像器831及第一光源833,於本實施例中,該第一取像器831及第一光源833係架設於該絕熱空間88內,且受限於該絕熱空間88的高度,該第一取像器831係以水平方向架設於該絕熱空間88內,並以一第一稜鏡835投射第一區測試座812的影像,以供該第一取像器831對第一區測試座812取像;另於對應該第二區測試座813上方之絕熱空間88內或於該絕熱空間88的上方架設有第二取像器832及第二光源834,於本實施例中,該第二取像器832及第二光源834係架設於該絕熱空間88內,且該第二取像器832相同的以水平方向架設於該絕熱空間88內, 並以一第二稜鏡836投射第二區測試座813的影像,以供該第二取像器832對第二區測試座813取像;該取像機構83之第一取像器831及第二取像器832即可對第一區測試座812及第二區測試座813的各區域中心進行取像作業,相同的可取得各區域之測試座更加清楚的影像,進而準確的判別第一區測試座812及第二區測試座813內是否殘留有異物,以防止後續置入之電子元件受損,達到降低損壞率及提升測試品質之效益。 Please refer to FIGS. 12 and 13 again, which is an electronic
請參閱第3、4、14圖,係本發明電子元件測試裝置應用於分類設備之示意圖,該分類設備係於機台上配置有供料裝置100、收料裝置110、入出料裝置120、控制裝置(圖未示出)及本發明之測試裝置60;該供料裝置100係於機台上設有至少一為供料盤之供料承置器101,用以容納至少一待測之電子元件;該收料裝置110係於機台上設有至少一為收料盤之收料承置器111,用以容納至少一完測之電子元件;該入出料裝置120係於機台上設有至少一具複數個取放器之移料臂,用以於該供料裝置100、該測試裝置60及該收料裝置110間移載電子元件,於本實施例中,該入出料裝置120係設有具複數個取放器之第一移料臂121,以於供料裝置100之供料承置器101取出待測之電子元件至測試裝置60執行測試作業,該入出料裝置120另設有具複數個取放器之第二移料臂122,以於該測試裝置60取出完測之電子元件,並依據測試結果將完測之電子元件輸送至收料裝置110之收料承置器111分類收置;該控制裝置係用以控制及整合各裝置作動,以執行自動化作業;本發明之測試裝置60,其取像機構之第一取像器631及第二取像器632係可對第一區測試座612及第二區測試座613的各區域中心進行取像作業,以取得各區域之測試座更加清楚的影像,進而供控制裝置準確 的判別第一區測試座612及第二區測試座613內是否殘留有異物,以防止後續置入之電子元件受損,使該分類設備達到降低損壞率及提升測試品質之效益。 Please refer to Figures 3, 4, and 14 for schematic diagrams of the electronic component testing device of the present invention applied to a sorting device. The sorting device is equipped with a
據此,本發明實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符發明專利申請要件,爰依法提出申請。 Accordingly, the present invention is a practical and progressive design. However, no similar products and publications have been disclosed, thus allowing the application of invention patents to be met, and the application is filed according to law.
61‧‧‧測試機構 61‧‧‧ Testing organization
611‧‧‧測試電路板 611‧‧‧Test circuit board
612‧‧‧第一區測試座 612‧‧‧
613‧‧‧第二區測試座 613‧‧‧Second District Test Block
625‧‧‧第一移載臂 625‧‧‧ First transfer arm
626‧‧‧第二移載臂 626‧‧‧Second transfer arm
63‧‧‧取像機構 63‧‧‧Acquisition agency
631‧‧‧第一取像器 631‧‧‧ First viewfinder
632‧‧‧第二取像器 632‧‧‧Second viewfinder
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