TW202004949A - Coating apparatus, coating method and organic EL display in which the number of contact holes for auxiliary electrodes is optimized - Google Patents

Abstract

This invention provides an organic EL display in which the number of contact holes for auxiliary electrodes is optimized. The coating apparatus according to one embodiment of this invention comprises a substrate holding part, a discharge unit, and a moving mechanism. The discharge unit includes a plurality of nozzle?heads with a plurality of nozzles arranged in parallel in a first direction. The moving mechanism relatively moves the discharge unit and the substrate holding part along the second direction intersecting the first direction. The substrate includes a plurality of pixel electrodes disposed corresponding to the plurality of sub-pixels, a bank covering the plurality of pixel electrodes and having a plurality of openings for exposing at least one pixel electrode, and a plurality of contact holes for electrically connecting the counter electrodes opposed to the plurality of pixel electrodes to the auxiliary electrode. The contact hole is set for every two or more sub-pixels. The discharge unit discharges the droplet of an organic material from the nozzle toward the opening of the substrate held in the substrate holding part.

Description

Coating device, coating method and organic EL display

This publication discloses a coating device, a coating method, and an organic EL display.

Organic EL displays using organic light emitting diodes (OLED: Organic Light Emitting Diode) are thin, lightweight and have low power consumption. They have excellent advantages in response speed, viewing angle and contrast. The organic photodiode is composed of a pixel electrode and a counter electrode sandwiching an organic EL layer including a light-emitting layer.

Patent Document 1 discloses a technique for suppressing an increase in wiring resistance accompanying the enlargement of an organic EL display by connecting an auxiliary electrode formed of a low-resistivity material to a counter electrode. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2016-197240

[Problems to be solved by the invention]

This disclosure provides an organic EL display in which the number of contact holes for auxiliary electrodes is optimized. [Means to solve the problem]

The coating device according to one aspect of the present disclosure includes: a substrate holding portion; a discharge unit; and a moving mechanism. The substrate holding portion holds the substrate. The discharge unit includes a plurality of nozzle heads in which a plurality of nozzles are arranged in parallel in the first direction. The moving mechanism relatively moves the discharge unit and the substrate holding portion in the second direction crossing the first direction. The substrate includes: a plurality of pixel electrodes corresponding to the plurality of sub-pixels; a bank covering the plurality of pixel electrodes and forming a plurality of openings exposing at least one pixel electrode; and a plurality of contact holes, It is used to electrically connect the counter electrode facing the plurality of pixel electrodes to the auxiliary electrode. The contact holes are set for every two or more sub-pixels. The discharge unit discharges droplets of organic material from the nozzle toward the opening of the substrate held by the substrate holding portion. [Effect of the invention]

According to this disclosure, it is possible to provide an organic EL display that optimizes the number of contact holes for auxiliary electrodes.

Hereinafter, referring to the drawings, the coating device, the coating method, and the form of the organic EL display (hereinafter, referred to as "embodiment") for implementing the present disclosure will be described in detail. In addition, this embodiment is not intended to limit the coating device, coating method, and organic EL display of the present disclosure. In addition, each embodiment can be combined as appropriate within a range where the processing contents are not contradictory. In addition, in the following embodiments, the same parts are denoted by the same symbols, and repeated explanations are omitted.

In addition, in the drawings referred to below, for easy understanding of the description, it is defined that the mutually orthogonal X-axis direction, Y-axis direction, and Z-axis direction are defined, and the positive Z-axis direction is orthogonal to the vertical upward direction The situation of the coordinate system.

Organic EL displays using organic light-emitting diodes are thin, lightweight and have low power consumption. They have excellent advantages in response speed, viewing angle, and contrast. Therefore, in recent years, organic EL displays have attracted attention as the next-generation flat panel displays (FPD).

The organic light-emitting diode is composed of a pixel electrode and a counter electrode sandwiching an organic EL layer including a light-emitting layer. The organic EL layer is formed using an inkjet coating device.

In recent years, with the increase in the size of organic EL displays, the wiring length tends to become longer. As the wiring length becomes longer, the wiring resistance increases, and accordingly, for example, it may become difficult to supply power necessary for light emission to the pixel electrode located at a position away from the power source.

Here, as a technique for reducing wiring resistance, a technique of connecting a supplementary electrode formed of a material with low resistivity to a counter electrode is proposed. In this technique, the contact holes of the auxiliary electrodes are formed for each sub-pixel. The sub-pixel refers to the respective points of R (red), G (green), and B (blue) that constitute one pixel. That is, in the above technique, one contact hole is formed in each of the red sub-pixel, the green sub-pixel, and the blue sub-pixel.

FIG. 1 is a schematic plan view showing a configuration example of an organic EL display in which contact holes for auxiliary electrodes are formed for each sub-pixel. As shown in FIG. 1, the organic EL display 1X has a plurality of pixel electrodes 21X, and a bank 30X covering the plurality of pixel electrodes 21X. An opening 31X that exposes a part of the pixel electrode 21X is formed in the bank 30X for each pixel electrode 21X. That is, one opening 31X is formed for one pixel electrode 21X.

An organic EL layer 23X is formed in each opening 31X. The organic EL layer 23X is formed by ejecting droplets of an organic material to each opening 31X by an inkjet method.

A counter electrode (not shown) is arranged on the organic EL layer 23X. The counter electrode is the one shared by the plurality of pixel electrodes 21X and faces the plurality of pixel electrodes 21X. In this way, one sub-pixel is formed by sandwiching the organic EL layer 23X between the pixel electrode 21X and the counter electrode. Therefore, the area where the pixel electrode 21X overlaps the opening 31X in a plan view corresponds to the area of one sub-pixel.

The contact hole 50X for the auxiliary electrode is formed for each sub-pixel. In other words, in the organic EL display 1X, one contact hole 50X is formed with respect to one pixel electrode 21X or one opening 31X.

However, in recent years, in order to increase the pixel density of organic EL displays, there is a tendency to reduce the size of sub-pixels. Generally, openings for receiving liquid droplets of organic material are formed for each sub-pixel on the bank (see FIG. 1 ). Therefore, when the size of the opening is reduced as the size of the sub-pixel is reduced, the allowable error of the landing position of the droplet becomes smaller, and the droplet is likely to overflow from the opening.

Here, in order to alleviate the allowable error of the landing position of the droplet, it is proposed that the opening for the landing of the droplet not be formed for each sub-pixel, but for each plurality of adjacent sub-pixels of the same color (below Marked as "Pixel Link").

However, in the organic EL display 1X in which the contact hole 50X for the auxiliary electrode is provided for each sub-pixel, it is difficult to connect pixels. That is, as shown in FIG. 1, each contact hole 50X is formed in a region between two adjacent organic EL layers 23X of the same color. Therefore, assuming that one opening portion connecting two adjacent organic EL layers 23X of the same color shown in FIG. 1 is formed, the upper contact hole 50X of the two contact holes 50X shown in FIG. 1 is located at the opening Within the ministry. In this way, the organic material discharged into the opening will flow into the contact hole 50X, and the function of electrically connecting the counter electrode and the auxiliary electrode cannot be completed. Also, if the organic material flows into the contact hole 50X, the uniformity of the film thickness of the organic EL layer 23X may be reduced.

Here, the provision of an organic EL display in which the number of contact holes for auxiliary electrodes is optimized is expected.

<Organic EL display> FIG. 2 is a diagram showing an example of the circuit configuration of the organic EL display of the embodiment. In addition, one unit circuit 11 is enlarged and shown in FIG. 2.

As shown in FIG. 2, the organic EL display 1 includes: a substrate 10; a plurality of unit circuits 11; a scanning line drive circuit 14; and a data line drive circuit 15. A plurality of unit circuits 11, a scanning line drive circuit 14, and a data line drive circuit 15 are provided on the substrate 10.

The unit circuit 11 is provided in a region surrounded by a plurality of scan lines 16 connected to the scan line drive circuit 14 and a plurality of data lines 17 connected to the data line drive circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light-emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistor). One of the TFTs has a function as a switching element, and the other TFT has a function as a current control element that controls the amount of current flowing into the organic light-emitting diode 13. The TFT layer 12 is operated by the scanning line drive circuit 14 and the data line drive circuit 15 to supply current to the organic light-emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and a plurality of unit circuits 11 are independently controlled.

In addition, the TFT layer 12 may have a general structure, and is not limited to the structure shown in FIG. 2. In addition, in the embodiment, the driving method of the organic EL display 1 is described as an example in the case of an active matrix method, but the driving method may be a passive matrix method.

FIG. 3 is a schematic plan view showing the organic EL display 1 of the embodiment. In FIG. 3, illustration of the cathode 22 described later is omitted. In addition, in FIG. 3, the region where the light-emitting layer 26 of the same color is formed is indicated by the same diagonal line.

As shown in FIG. 3, in the organic EL display 1 of the embodiment, one opening 31 is formed for two sub-pixels. Specifically, in the organic EL display 1 of the embodiment, the opening 31 of the bank 30 exposes two anodes 21 provided corresponding to two adjacent sub-pixels of the same color. Here, a plurality of sub-pixels of the same color are arranged along the Y-axis direction, and the opening 31 exposes each part of the two anodes 21 adjacent in the Y-axis direction.

In this way, the opening 31 where the droplets of the organic material for forming the organic EL layer 23 land is formed not for each sub-pixel, but for every two adjacent sub-pixels of the same color. Alleviate the tolerance of the landing position of the droplet.

FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. As shown in FIG. 4, in the organic EL display 1, a TFT layer 12 is formed on a substrate 10, and a flattening layer 18 is formed on the TFT layer 12 to flatten the step formed by the TFT layer 12. The substrate 10 is, for example, a transparent substrate such as a glass substrate or a resin substrate.

The planarization layer 18 has insulating properties. A contact plug 19 is formed in the contact hole penetrating the planarization layer 18. The contact plug 19 electrically connects the anode 21 as the pixel electrode formed on the flat surface of the planarization layer 18 and the TFT layer 12. The contact plug 19 may be formed by the same material as the anode 21 at the same time.

The organic light emitting diode 13 is formed on the flat surface of the planarization layer 18. The organic light-emitting diode 13 has: an anode 21 as a pixel electrode; a cathode 22 as a counter electrode provided on the opposite side of the substrate 10 based on the pixel electrode; and an organic EL formed between the anode 21 and the cathode 22 Layer 23. By operating the TFT layer 12, a voltage is applied between the anode 21 and the cathode 22, and the organic EL layer 23 emits light.

The anode 21 as the pixel electrode is formed by, for example, ITO (Indium Tin Oxide) or the like, and transmits light from the organic EL layer 23. The light transmitted through the anode 21 passes through the substrate 10 and is taken out to the outside. The anode 21 is provided for each unit circuit 11, in other words, for each sub-pixel.

The cathode 22 as the counter electrode is formed of aluminum or the like, for example, and reflects the light from the organic EL layer 23 toward the organic EL layer 23. The light reflected by the cathode 22 passes through the organic EL layer 23, the anode 21, and the substrate 10 and is taken out to the outside. The cathode 22 is shared by a plurality of unit circuits 11.

In addition, here, an example in the case where the anode 21 is a pixel electrode and the cathode 22 is a counter electrode will be described, but the cathode 22 may be a pixel electrode and the anode 21 may be a counter electrode.

The organic EL layer 23 has, for example, a hole injection layer 24, a hole transport layer 25, a light-emitting layer 26, an electron transport layer 27, and an electron injection layer 28. The hole injection layer 24, the hole transport layer 25, the light emitting layer 26, the electron transport layer 27, and the electron injection layer 28 are sequentially stacked from the anode 21 side to the cathode 22 side.

When a voltage is applied between the anode 21 and the cathode 22, holes are injected into the hole injection layer 24 from the anode 21, and electrons are injected into the electron injection layer 28 from the cathode 22. The holes injected into the hole injection layer 24 are transported to the light emitting layer 26 via the hole transport layer 25. The electrons injected into the electron injection layer 28 are transported to the light-emitting layer 26 through the electron transport layer 27. The holes and electrons recombine in the light-emitting layer 26, the light-emitting material of the light-emitting layer 26 is excited, and the light-emitting layer 26 emits light.

As the light emitting layer 26, for example, as shown in FIG. 3, a red light emitting layer 26R, a green light emitting layer 26G, and a blue light emitting layer 26B are formed. The red light-emitting layer 26R is formed of a red light-emitting material that emits red light. The green light-emitting layer 26G is formed of a green light-emitting material that emits green light. The blue light-emitting layer 26B is formed of a blue light-emitting material that emits blue light.

One pixel in the organic EL display 1 includes a sub-pixel having a red light-emitting layer 26R, a sub-pixel adjacent to the sub-pixel and having a blue light-emitting layer 26B, and a green light-emitting layer 26G adjacent to the sub-pixel Sub-pixels. The red light-emitting layer 26R, the green light-emitting layer 26G, and the blue light-emitting layer 26B are emitted in a region where the anode 21 as the pixel electrode overlaps with the cathode 22 as the counter electrode in a plan view.

The bank 30 separates the coating liquid for the red light-emitting layer 26R, the coating liquid for the green light-emitting layer 26G, and the coating liquid for the blue light-emitting layer 26B to prevent mixing of the coating liquids. The bank 30 has insulating properties, and fills the contact hole penetrating the planarization layer 18.

As shown in FIG. 3, in the organic EL display 1 of the embodiment, one contact hole 50 is formed in one opening 31. In other words, the contact holes 50 are provided for every two anodes 21 of the same color corresponding to the two anodes 21 exposed by the opening 31.

FIG. 5 is a cross-sectional view taken along line V-V in FIG. 3. As shown in FIG. 5, the contact hole 50 is formed so as to penetrate the bank 30 and the planarization layer 18. The contact hole 50 is opened above the bank 30 to expose a part of the auxiliary electrode 51 provided on the substrate 10.

A conductive material such as W (tungsten) is buried in the contact hole 50, for example. According to this, the cathode 22 and the auxiliary electrode 51 can be electrically connected.

As shown in FIG. 3, the contact hole 50 is formed in one of the plurality of openings 31 in a region between the other opening 31 adjacent to the one opening 31 in the Y-axis direction. In other words, the contact hole 50 is formed in the region between the two openings 31 adjacent to each other in the Y-axis direction where the light-emitting layer 26 of the same color is formed. Therefore, during the coating process, the organic material does not easily enter the contact hole 50.

In this way, the contact hole 50 for the auxiliary electrode is provided for every two anodes 21 of the same color corresponding to the two anodes 21 exposed from the opening 31. According to this, the contact hole 50 does not become an obstacle during pixel connection. Therefore, even a large-scale organic EL display that is necessary for the auxiliary electrode can be applied to pixel connection. As described above, the cathode 22 as the counter electrode is shared by a plurality of unit circuits 11, and the contact holes 50 are not necessarily provided for each sub-pixel.

Here, although it is shown that one contact hole 50 is provided for every two sub-pixels, for example, it is possible to provide one contact hole 50 for every three or more sub-pixels according to the area of the anode 21 or the thickness of the wiring.

<Manufacturing method of organic light emitting diode> FIG. 6 is a flowchart showing a method of manufacturing the organic light emitting diode 13 of the embodiment. In each processing sequence shown in FIG. 6, the TFT layer 12, the auxiliary electrode 51, the planarization layer 18, the bank 30, the opening 31, and the contact hole 50 are formed on the substrate 10, and a conductive material is buried in the contact hole 50 The subsequent organic EL display is carried out.

First, in step S101, the anode 21 as a pixel electrode is formed. For the formation of the anode 21, for example, a vapor deposition method can be used. The anode 21 is formed for each unit circuit 11 on the flat surface of the planarization layer 18. Also, the anode 21 and the contact plug 19 may be formed at the same time.

Next, in step S102, the bank 30 is formed. The bank 30 is formed using a photoresist, for example, and is patterned into a predetermined pattern by photolithography. A part of the anode 21 is exposed in the opening 31 of the bank 30.

Next, in step S103, the hole injection layer 24 is formed. The hole injection layer 24 is formed by an inkjet method. The coating liquid for the hole injection layer 24 is applied on the anode 21 by an inkjet method to form a coating layer. After that, the coating layer is dried and sintered to form the hole injection layer 24 shown in FIG. 4.

Next, in step S104, the hole transport layer 25 is formed. The formation of the hole transport layer 25 is the same as the formation of the hole injection layer 24 using the inkjet method. The coating liquid for the hole transport layer 25 is applied on the hole injection layer 24 by an inkjet method to form a coating layer. After that, the coating layer is dried and sintered to form the hole transport layer 25.

Next, in step S105, the light emitting layer 26 is formed. The formation of the light-emitting layer 26 is the same as the formation of the hole injection layer 24 or the hole transport layer 25 using the inkjet method. The coating liquid for the light-emitting layer 26 is applied on the hole transport layer 25 by an inkjet method to form a coating layer. Thereafter, the coating layer is dried and sintered to form the light-emitting layer 26. As described above, as the light-emitting layer 26, for example, a red light-emitting layer 26R, a green light-emitting layer 26G, and a blue light-emitting layer 26B are formed.

Next, in step S106, the electron transport layer 27 is formed. For the formation of the electron transport layer 27, for example, a vapor deposition method or the like is used. Since the electron transport layer 27 may be shared by a plurality of unit circuits 11, it may be formed not only on the light-emitting layer 26 in the opening 31 of the bank 30 but also on the bank 30.

Next, in step S107, the electron injection layer 28 is formed. The electron injection layer 28 is formed using, for example, a vapor deposition method. The electron injection layer 28 is formed on the electron transport layer 27. Like the electron transport layer 27, the electron injection layer 28 may be shared by a plurality of unit circuits 11.

Next, in step S108, the cathode 22 is formed. For the formation of the cathode 22, for example, a vapor deposition method or the like is used. The cathode 22 is formed on the electron injection layer 28. The cathode 22 is shared by a plurality of unit circuits 11. When the driving method of the organic EL display 1 is a passive matrix method, the cathode 22 is patterned into a predetermined pattern.

The organic light emitting diode 13 is manufactured through the above process. Among the organic EL layers 23, a substrate processing system is used when forming the hole injection layer 24, the hole transport layer 25, and the light-emitting layer 26.

<Substrate processing system> 7 is a schematic plan view showing the configuration of the substrate processing system of the embodiment. The substrate processing system 100 shown in FIG. 7 forms the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 on the anode 21 by performing processes corresponding to steps S103 to S105 of FIG.

The substrate processing system 100 shown in FIG. 7 has a loading station 110; a processing station 120; a carrying station 130; and a control device 140.

The carrying-in station 110 carries in a substrate storage box C that stores a plurality of substrates 10 from the outside, and sequentially takes out the plurality of substrates 10 from the substrate storage box C. On each substrate 10, a TFT layer 12, a planarization layer 18, an anode 21, a bank 30, an opening 31, a contact hole 50, and the like are formed in advance.

The loading station 110 includes: a substrate storage box mounting table 111 on which the substrate storage box C is mounted; a transport path 112 provided between the substrate storage box mounting table 111 and the processing station 120; and a substrate transport body 113 provided on the transport path 112. The substrate transfer body 113 transfers the substrate 10 between the substrate storage box C placed on the substrate storage box mounting table 111 and the processing station 120.

The processing station 120 forms a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The processing station 120 includes a hole injection layer forming block 121 forming the hole injection layer 24; a hole transport layer forming block 122 forming the hole transport layer 25; and a light emitting layer forming block 123 forming the light emitting layer 26.

The hole injection layer forming block 121 applies the coating solution for the hole injection layer 24 on the anode 21 to form a coating layer, and the coating layer is dried and sintered to form the hole injection layer 24. The coating solution for the hole injection layer 24 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by sintering polymerization.

The hole injection layer forming block 121 includes: a coating device 121a; a buffer device 121b; a reduced-pressure drying device 121c; a heat treatment device 121d; and a temperature adjustment device 121e. The coating device 121 a causes the droplets of the coating liquid for the hole injection layer 24 to be discharged toward the opening 31 of the bank 30. The buffer device 121b temporarily stores the substrate 10 to be processed. The reduced-pressure drying device 121c dries the coating layer applied via the coating device 121a under reduced pressure, and removes the solvent contained in the coating layer. The heat treatment device 121d heat-treats the coating layer dried by the reduced-pressure drying device 121c. The temperature adjustment device 121e adjusts the temperature of the substrate 10 heated by the heat treatment device 121d to a predetermined temperature, for example, normal temperature.

The inside of the coating device 121a, the buffer device 121b, the heat treatment device 121d, and the temperature adjustment device 121e are maintained in a large atmosphere. The reduced-pressure drying device 121c switches the internal atmosphere to an atmospheric atmosphere and a reduced-pressure atmosphere.

In addition, in the hole injection layer forming block 121, the arrangement or number of the coating device 121a, the buffer device 121b, the reduced-pressure drying device 121c, the heat treatment device 121d, and the temperature adjustment device 121e, and the internal atmosphere can be arbitrarily selected.

In addition, the hole injection layer forming block 121 includes: substrate transfer devices CR1 to CR3; and transfer devices TR1 to TR3. The substrate transfer devices CR1 to CR3 transfer the substrate 10 to the adjacent devices, respectively. For example, the substrate transfer device CR1 transfers the substrate 10 to the adjacent coating device 121a and buffer device 121b. The substrate transfer device CR2 transfers the substrate 10 to the adjacent decompression drying device 121c. The substrate transfer device CR3 transfers the substrate 10 to the adjacent heat treatment device 121d and temperature adjustment device 121e. The transfer devices TR1 to TR3 are sequentially installed between the loading station 110 and the substrate transfer device CR1, between the substrate transfer device CR1 and the substrate transfer device CR2, and between the substrate transfer device CR2 and the substrate transfer device CR3, and between them. Relay of the substrate 10. The interior of the substrate transfer devices CR1 to CR3 or the transfer devices TR1 to TR3 is maintained in the atmosphere.

Between the substrate transport device CR3 of the hole injection layer forming block 121 and the substrate transport device CR4 of the hole transport layer forming block 122, a transfer device TR4 that relays the substrate 10 between them is provided. The interior of the transfer device TR4 is maintained in an atmospheric atmosphere.

The hole transport layer forming block 122 applies a coating solution for the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and the coating layer is dried and sintered to form the hole transport layer 25. The coating solution for the hole transport layer 25 contains organic materials and solvents. The organic material may be either a polymer or a monomer. In the case of a monomer, the polymer may be formed by sintering polymerization.

The hole transport layer forming block 122 includes a coating device 122a, a buffer device 122b, a reduced-pressure drying device 122c, a heat treatment device 122d, and a temperature adjustment device 122e. The coating device 122 a causes the droplets of the coating liquid for the hole transport layer 25 to be discharged toward the opening 31 of the bank 30. The buffer device 122b temporarily stores the substrate 10 to be processed. The reduced-pressure drying device 122c dries the coating layer applied via the coating device 122a under reduced pressure, and removes the solvent contained in the coating layer. The heat treatment device 122d heat-treats the coating layer dried by the reduced-pressure drying device 122c. The temperature adjustment device 122e adjusts the temperature of the substrate 10 heated by the heat treatment device 122d to a predetermined temperature, for example, normal temperature.

The inside of the coating device 122a and the buffer device 122b is maintained in an atmosphere. On the other hand, in order to suppress the deterioration of the organic material of the hole transport layer 25, the heat treatment device 122d and the temperature adjustment device 122e are maintained in a low oxygen and low dew point atmosphere. The decompression drying device 122c has a low-oxygen and low-dew point atmosphere and a reduced-pressure atmosphere.

Here, the low-oxygen atmosphere refers to an atmosphere with a lower oxygen concentration than the atmosphere, for example, an atmosphere with an oxygen concentration of 10 ppm or less. The low dew point atmosphere refers to an atmosphere with a dew point temperature lower than that of the atmosphere, for example, an atmosphere with a dew point temperature of -10°C or lower. An atmosphere with low oxygen and low dew point is formed by an inert gas such as nitrogen gas.

In the hole transport layer forming block 122, the arrangement or number of the coating device 122a, the buffer device 122b, the reduced pressure drying device 122c, the heat treatment device 122d, and the temperature adjustment device 122e, and the internal atmosphere can be arbitrarily selected.

In addition, the hole transport layer forming block 122 includes substrate transfer devices CR4 to CR6 and transfer devices TR5 to TR6. The substrate transfer devices CR4 to CR6 transfer the substrate 10 to the adjacent devices, respectively. The transfer devices TR5 to TR6 are sequentially provided between the substrate transfer device CR4 and the substrate transfer device CR5, and between the substrate transfer device CR5 and the substrate transfer device CR6, and relay the substrate 10 between them.

The interior of the substrate transfer device CR4 is maintained in an atmospheric atmosphere. On the other hand, the interior of the substrate transfer devices CR5 to CR6 is maintained in an atmosphere of low oxygen and low dew point. The inside of the reduced-pressure drying device 122c adjacent to the substrate transfer device CR5 is switched between an atmosphere of low oxygen and low dew point and a reduced-pressure atmosphere. In addition, the interior of the heat treatment device 122d or the temperature adjustment device 122e adjacent to the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point.

The transfer device TR5 is configured as a loadlock device that switches the internal atmosphere between the atmospheric atmosphere and the atmosphere of low oxygen and low dew point. A decompression drying device 122c is provided adjacent to the downstream side of the delivery device TR5. On the other hand, the interior of the transfer device TR6 is maintained in a low oxygen and low dew point atmosphere.

Between the substrate transport device CR6 of the hole transport layer forming block 122 and the substrate transport device CR7 of the light emitting layer forming block 123, a transfer device TR7 that relays the substrate 10 between them is provided. The interior of the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point, and the interior of the substrate transfer device CR7 is maintained in an atmospheric atmosphere. Therefore, the transfer device TR7 is configured as a load lock device that switches the internal atmosphere between a low-oxygen and low-dew point atmosphere and an atmospheric atmosphere.

The light-emitting layer forming block 123 applies the coating solution for the light-emitting layer 26 on the hole transport layer 25 to form a coating layer, and the formed coating layer is dried and sintered to form the light-emitting layer 26. The coating liquid for the light-emitting layer 26 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, the polymer may be formed by sintering polymerization.

The light emitting layer formation block 123 includes a coating device 123a, a buffer device 123b, a reduced-pressure drying device 123c, a heat treatment device 123d, and a temperature adjustment device 123e. The coating device 123a discharges the droplets of the coating liquid for the light-emitting layer 26 toward the opening 31 of the bank 30. The buffer device 123b temporarily stores the substrate 10 to be processed. The reduced-pressure drying device 123c dries the coating layer applied via the coating device 123a under reduced pressure, and removes the solvent contained in the coating layer. The heat treatment device 123d heat-treats the coating layer dried by the reduced-pressure drying device 123c. The temperature adjustment device 123e adjusts the temperature of the substrate 10 heated by the heat treatment device 123d to a predetermined temperature, for example, normal temperature.

The inside of the coating device 123a and the buffer device 123b is maintained in an atmosphere. On the other hand, in order to suppress the deterioration of the organic material of the light-emitting layer 26, the heat treatment device 123d and the temperature adjustment device 123e are maintained in a low oxygen and low dew point atmosphere. The reduced-pressure drying device 123c switches the internal atmosphere to a low oxygen and low dew point atmosphere and a reduced pressure atmosphere.

In the light-emitting layer formation block 123, the arrangement or number of the coating device 123a, the buffer device 123b, the reduced-pressure drying device 123c, the heat treatment device 123d, and the temperature adjustment device 123e, and the internal atmosphere can be arbitrarily selected.

In addition, the light-emitting layer formation block 123 includes substrate transfer devices CR7 to CR9 and transfer devices TR8 to TR9. The substrate transfer devices CR7 to CR9 transfer the substrate 10 to the adjacent devices, respectively. The transfer devices TR8 to TR9 are sequentially provided between the substrate transfer device CR7 and the substrate transfer device CR8, and between the substrate transfer device CR8 and the substrate transfer device CR9, and relay the substrate 10 between them.

The interior of the substrate transfer device CR7 is maintained in an atmospheric atmosphere. On the other hand, the interior of the substrate transfer devices CR8 to CR9 is maintained in an atmosphere of low oxygen and low dew point. The inside of the reduced-pressure drying device 123c adjacent to the substrate transfer device CR8 is switched between an atmosphere of low oxygen and low dew point and a reduced-pressure atmosphere. In addition, the interior of the heat treatment device 123d or the temperature adjustment device 123e adjacent to the substrate transfer device CR9 is maintained in an atmosphere of low oxygen and low dew point.

The transfer device TR8 is configured as a load lock device that switches the internal atmosphere between an atmospheric atmosphere and an atmosphere of low oxygen and low dew point. A decompression drying device 123c is provided adjacent to the downstream side of the transfer device TR8. The interior of the transfer device TR9 is maintained in a low oxygen and low dew point atmosphere.

A transfer device TR10 that relays the substrate 10 between them is provided between the substrate transfer device CR9 of the light-emitting layer formation block 123 and the transfer station 130. The interior of the substrate transfer device CR9 is maintained in a low oxygen and low dew point atmosphere, and the interior of the transfer station 130 is maintained in an atmospheric atmosphere. Therefore, the transfer device TR7 is configured as a load lock device that switches the internal atmosphere between a low-oxygen and low-dew point atmosphere and an atmospheric atmosphere.

The unloading station 130 sequentially stores the plurality of substrates 10 in the substrate storage box C, and transports the substrate storage box C out of the outside. The unloading station 130 includes: a substrate storage box mounting table 131 on which the substrate storage box C is mounted; a transport path 132 provided between the substrate storage box mounting table 131 and the processing station 120; and a substrate transport body 133 provided on the transport path 132. The substrate transport body 133 transports the substrate 10 between the processing station 120 and the substrate storage box C placed on the substrate storage box mounting table 131.

The control device 140 includes a control unit 141 and a memory unit 142. The control device 140 includes, for example, a computer or various circuits including a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), and I/O ports.

The CPU of the computer, for example, reads and executes programs stored in the ROM. Accordingly, the CPU of the computer functions as the control unit 141. Furthermore, part or all of the control unit 141 may be made of hardware. The hardware is, for example, ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array).

Moreover, the memory unit 142 corresponds to, for example, RAM or HDD. In addition, the control device 140 may obtain the above program or various information through another computer or a portable memory medium connected by a wired or wireless network. Examples of computer-readable memory media include hard disks (HD), floppy disks (FD), optical disks (CD), optical disks (MO), and memory cards.

Next, a substrate processing method using the substrate processing system 100 will be described. When the substrate storage box C storing the plurality of substrates 10 is placed on the substrate storage box mounting table 111, the substrate transport body 113 sequentially takes out the substrate 10 from the substrate storage box C on the substrate storage box mounting table 111 and transports it to the electric The hole injection layer forms block 121.

The hole injection layer forming block 121 applies the coating solution for the hole injection layer 24 to the anode 21 to form a coating layer, and the formed coating layer is dried and sintered to form the hole injection layer 24. The substrate 10 on which the hole injection layer 24 is formed is transferred from the hole injection layer formation block 121 to the hole transport layer formation block 122 via the transfer device TR4.

The hole transport layer forming block 122 applies the coating solution for the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and the formed coating layer is dried and sintered to form the hole transport layer 25. The substrate 10 on which the hole transport layer 25 is formed is transferred from the hole transport layer formation block 122 to the light emitting layer formation block 123 by the transfer device TR7.

The light-emitting layer forming block 123 applies the coating solution for the light-emitting layer 26 on the hole transport layer 25 to form a coating layer, and the formed coating layer is dried and sintered to form the light-emitting layer 26. The substrate 10 on which the light-emitting layer 26 is formed is transferred from the light-emitting layer formation block 123 to the carry-out station 130 by the transfer device TR10.

The substrate transport body 133 of the unloading station 130 is a predetermined substrate storage box C that stores the substrate 10 received from the transfer device TR10 on the substrate storage box mounting table 131. Accordingly, the series of processing of the substrate 10 in the substrate processing system 100 ends.

In a state where the substrate 10 is stored in the substrate storage box C, it is carried out from the carry-out station 130 to the outside. An electron transport layer 27, an electron injection layer 28, a cathode 22, and the like are formed on the substrate 10 carried out to the outside.

<Coating device and coating method> Next, the coating device 123a of the light-emitting layer formation block 123 will be described with reference to FIGS. 8 and 9. 8 is a schematic plan view showing the configuration of the coating device 123a of the embodiment. 9 is a schematic side view showing the configuration of the coating device 123a of the embodiment.

In FIGS. 8 and 9, the Y-axis direction is a row direction in which a plurality of nozzles ejecting droplets of the same coating liquid are aligned, and the X-axis direction is a scanning direction orthogonal to the Y-axis direction. In addition, the row direction and the scanning direction only need to cross, and need not be orthogonal.

As shown in FIGS. 8 and 9, the coating device 123 a includes, for example, a platform 150 that holds and moves the substrate 10; a discharge unit 160 that discharges liquid droplets to the substrate 10; and a maintenance unit 170 that maintains the function of the discharge unit 160.

The platform 150 and the maintenance unit 170 are arranged in parallel in the Y-axis direction. A Y-axis guide 180 is erected between the top of the platform 150 and the top of the maintenance unit 170. The discharge unit 160 is configured to move freely in the Y-axis direction along the Y-axis guide 180. As a driving unit that moves the discharge unit 160 in the Y-axis direction, a linear motor or the like can be used.

The platform 150 includes a substrate holding portion 151 that holds the substrate 10 horizontally, and a moving mechanism 152 that moves the substrate holding portion 151. The substrate holding portion 151 holds the substrate 10 with the coating surface of the droplets coating the substrate 10 upward. As the substrate holding portion 151, for example, a vacuum chuck, an electrostatic chuck or the like may be used. The moving mechanism 152 includes an X-axis direction driving portion 153 that moves the substrate holding portion 151 in the X-axis direction, a Y-axis direction driving portion 154 that moves the substrate holding portion 151 in the Y-axis direction, and moves the substrate holding portion 151 around the Z axis The rotation drive unit 155 and the like rotate.

The discharge unit 160 is freely movable between the position where the liquid droplet is discharged toward the substrate 10 above the platform 150 and the position subjected to the processing maintained by the function of the maintenance unit 170. A plurality of discharge units 160 are arranged in the Y-axis direction (here, 10). The plurality of discharge units 160 may move independently along the Y-axis direction, or may move integrally along the Y-axis direction.

Each discharge unit 160 includes a transport unit 161 and a plurality of heads 162 provided below the transport unit 161. Each nozzle 162 is provided with at least one nozzle row composed of a plurality of nozzles 163 aligned in the Y-axis direction. A plurality of nozzles 163 provided in the same head 162 eject droplets of the same coating liquid. Nozzle 163 for discharging liquid droplets of the coating liquid for the red light-emitting layer 26R, nozzle 163 for discharging liquid droplets of the coating liquid for the green light-emitting layer 26G, and nozzle 163 for discharging liquid droplets of the coating liquid for the blue light-emitting layer 26B It is set in the individual nozzle 162.

The maintenance unit 170 performs a process of maintaining the function of the discharge unit 160 to eliminate the discharge failure of the discharge unit 160. The maintenance unit 170 includes a wiping unit 171 that wipes around the discharge port of the nozzle; and a suction unit 172 that sucks liquid droplets from the discharge port of the nozzle. The suction unit 172 also achieves the discharge port that plugs the nozzle in the rest state, and suppresses the clogging task caused by drying.

Next, a coating method using the coating device 123a configured as described above will be described. The following operations of the coating device 123a are controlled by the control device 140. In addition, in FIG. 7, the control device 140 and the coating device 123a are provided separately, but they may be provided as part of the coating device 123a.

First, when the substrate 10 carried into the interior from the outside of the coating device 123a is placed on the substrate holding portion 151, the substrate holding portion 151 holds the substrate 10. Next, based on the image of the alignment mark of the substrate 10, the position of the substrate holding portion 151 by the moving mechanism 152 is corrected. Thereafter, the moving mechanism 152 moves the substrate holding portion 151 in the X-axis direction and passes under the discharge unit 160. During this period, the discharge unit 160 discharges the droplets of the coating liquid onto the substrate 10. After that, the moving mechanism 152 changes the position of the substrate holding portion 151 in the Y-axis direction, and moves the substrate holding portion 151 again in the X-axis direction to pass under the discharge unit 160. During this period, the discharge unit 160 discharges the droplets of the coating liquid onto the substrate 10. By repeating the above, the coating device 123a draws a predetermined pattern on the substrate 10.

The drawn substrate 10 is taken out from the substrate holding portion 151, and carried out from the inside of the coating device 123a to the outside. Next, the next substrate 10 is carried into the interior from the outside of the coating device 123 a, and the coating device 123 a draws a predetermined pattern on the substrate 10. In addition, the process of maintaining the function of the discharge unit 160 by the maintenance unit 170, the replacement of the substrate 10, and the like are appropriately performed.

In addition, the coating device 123a may move the discharge unit 160 that discharges liquid droplets to the substrate 10, or may move both the substrate holding portion 151 and the discharge unit 160. That is, the coating device 123a only needs to move the substrate holding portion 151 and the discharge unit 160 relatively.

<Drawing pattern drawn by the coating device> Next, the drawing pattern drawn by the coating device 123a will be described with reference to FIG. 10 is a plan view showing a drawing pattern drawn by the coating device 123a of the embodiment.

As shown in FIG. 10, the organic EL display 1 has, for example, a red light-emitting region 261R, a green light-emitting region 261G, and a blue light-emitting region 261B for each pixel.

The red light emitting region 261R corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the red light emitting layer 26R. The green light emitting region 261G corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the green light emitting layer 26G. The blue light emitting region 261B corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the blue light emitting layer 26B. Each light-emitting area 261R, 261G, 261B emits light independently for each anode 21, and the amount of light emitted is adjusted by the voltage between the anode 21 and the cathode 22.

The red light-emitting region 261R, the green light-emitting region 261G, and the blue light-emitting region 261B are repeatedly arranged at intervals along the X-axis direction according to the order, and accordingly, the light-emitting region group 262 is formed. In the organic EL display 1, a plurality of light-emitting region groups 262 are arranged at intervals along the Y-axis direction. Therefore, in the organic EL display 1, a plurality of light-emitting regions emitting the same color are arranged in parallel in the Y-axis direction.

A plurality of nozzles 163 are arranged side by side in the discharge unit 160 along the Y-axis direction in such a manner that a plurality of light-emitting areas spaced apart in the Y-axis direction and emit light of the same color can be discharged simultaneously and simultaneously Each nozzle 162. A plurality of nozzles 163 provided in the same head 162 eject droplets of the same coating liquid.

The coating device 123a discharge unit 160 relatively moves in the X-axis direction with the substrate holding portion 151, and applies droplets from the nozzle 163 toward the opening 31 of the bank 30 formed in advance on the substrate 10 held by the substrate holding portion 151.

As shown in FIG. 10, the opening 31 of the bank 30 spans two light-emitting regions adjacent in the Y-axis direction. Therefore, the tolerance of the landing position of the droplet of the coating liquid in the Y-axis direction can be alleviated.

In addition, since the droplets of the coating liquid are discharged from the two nozzles 163 toward one opening 31, the error in the discharge amount of each nozzle 163 is dispersed, and the variation in the total amount of discharge can be suppressed. In addition, the selection range of the nozzle 163 that ejects liquid droplets toward one opening 31 is increased, and the nozzle 163 with excellent controllability of the ejection amount can be selected for use. Accordingly, the thickness of the light-emitting layer 26 can be made uniform.

<Drawing pattern of the first modification> Next, the drawing pattern of the first modification in this embodiment will be described with reference to FIG. 11. Fig. 11 is a plan view showing a drawing pattern in a first modification of the embodiment.

The area ratio of the red light-emitting region 261R, the green light-emitting region 261G, and the blue light-emitting region 261B is appropriately set according to individual light-emitting characteristics, light-emitting life, and the like. For example, the luminous efficiency is good. The higher the luminous brightness per unit area, the smaller the area.

In FIG. 11, the area of the red light emitting region 261R is the smallest, the area of the green light emitting region 261G is the second smallest, and the area of the blue light emitting region 261B is the largest. The dimensions YR, YG, and YB of the light-emitting regions 261R, 261G, and 261B in the Y-axis direction are the same, and the dimensions XR, XG, and XB in the X-axis direction are different from each other. Specifically, the size YR of the red light emitting region 261R in the Y axis direction, the size YG of the green light emitting region 261G in the Y axis direction, and the size YB of the blue light emitting region 261B in the Y axis direction are the same. Moreover, the X-axis dimension XR of the red light-emitting region 261R is smaller than the X-axis direction XG of the green light-emitting region 261G, and the X-axis direction XG of the green light-emitting region 261G is smaller than the X-axis direction of the blue light-emitting region 261B The size XB is small.

In the first modification, a plurality of red light-emitting regions 261R, green light-emitting regions 261G, and blue light-emitting regions 261B are arranged along the X-axis direction so that two red light-emitting regions 261R are adjacent to each other. Specifically, the green light-emitting region 261G, the blue light-emitting region 261B, the red light-emitting region 261R, the red light-emitting region 261R, the green light-emitting region 261G, and the blue light-emitting region 261B are repeatedly arranged in sequence to form one light-emitting region group 262. In other words, in the two pixels adjacent in the X-axis direction, the arrangement order of the red light emitting region 261R, the green light emitting region 261G, and the blue light emitting region 261B is reversed.

In the first modification, the opening 31 of the bank 30 exposes two anodes 21 provided corresponding to two sub-pixels of the same color adjacent in the Y-axis direction, as in the above-described embodiment. According to this, the allowable error of the landing position of the droplet of the coating liquid in the Y-axis direction can be alleviated.

In the first modification, the opening 31 of the bank 30 exposes two anodes 21 provided corresponding to two sub-pixels of the same color adjacent in the X-axis direction. Here, the two anodes 21 corresponding to the two red light emitting regions 261R adjacent in the X-axis direction are exposed. According to this, it becomes easy to land the liquid droplet on the red opening 31R while moving the discharge unit 160 and the substrate holding portion 151 relatively in the X-axis direction. Therefore, the tolerance of the landing position of the droplet of the coating liquid for the red light-emitting region 261R in the X-axis direction can be alleviated. In addition, by connecting the red light emitting region 261R with the smallest dimension in the X-axis direction in the X-axis direction, the allowable error of the landing position of the droplet of the coating liquid in the X-axis direction can be effectively alleviated.

In this way, in the first modification, the opening 31 of the bank 30 exposes four anodes 21 provided corresponding to four sub-pixels of the same color (here, red) adjacent to the Y-axis direction and the X-axis direction. According to this, the allowable error of the landing position of the droplet of the coating liquid in the Y-axis direction and the X-axis direction can be alleviated. In addition, by connecting the red light-emitting region 261R with the smallest area in the Y-axis direction and the X-axis direction, the allowable error of the landing position of the droplet of the coating liquid in the Y-axis direction and the X-axis direction can be effectively alleviated.

In the first modification, in the organic EL display 1, one contact hole 50 is formed in one opening 31 in the same manner as in the above embodiment. Therefore, in the organic EL display 1 of the first modification, one contact hole 50 is formed for the four red light emitting regions 261R. Furthermore, in the organic EL display 1 of the first modification, one contact hole 50 is formed for two green light emitting regions 261G, and one contact hole 50 is formed for two blue light emitting regions 261B.

Here, an example is shown in which one opening 31 exposes two anodes 21 provided corresponding to two sub-pixels of the same color adjacent to the X-axis direction. However, it is not limited to this, and the opening 31 may expose two anodes 21 provided corresponding to three or more sub-pixels of the same color adjacent in the X-axis direction.

Here, an example is shown in which one opening 31 exposes four anodes 21 provided corresponding to four red light emitting regions 261R adjacent to the Y-axis direction and the X-axis direction. However, it is not limited to this, and the opening 31 may expose the four anodes 21 provided corresponding to the four green light emitting regions 261G adjacent to the Y-axis direction and the X-axis direction. In this case, for example, the light emitting region group 262 may be formed by repeatedly arranging the red light emitting region 261R, the blue light emitting region 261B, the green light emitting region 261G, the green light emitting region 261G, the blue light emitting region 261B, and the red light emitting region 261R in this order. .

Similarly, the opening 31 may expose the four anodes 21 provided corresponding to the four blue light emitting regions 261B adjacent to the Y-axis direction and the X-axis direction. In this case, the light-emitting region group 262, for example, as shown in FIG. 11, repeats the green light-emitting region 261G, the blue light-emitting region 261B, the red light-emitting region 261R, the red light-emitting region 261R, the green light-emitting region 261G, and the blue light-emitting region 261B sequentially It can be formed by arrangement.

Furthermore, in the first modification, the light-emitting regions are connected in both the Y-axis direction and the X-axis direction, but the opening 31 may be the one that connects the light-emitting regions only in the X-axis direction. That is, the opening 31 may be exposed only by two anodes 21 provided corresponding to two sub-pixels of the same color adjacent to the X-axis direction.

<Drawing pattern of the second modification> 12 is a plan view showing a drawing pattern of a second modification in the embodiment. As shown in FIG. 12, the organic EL display 1 of the second modification has an opening 31 that exposes a plurality of anodes 21 provided corresponding to a plurality of sub-pixels of the same color adjacent in the Y-axis direction. For example, the opening 31 of the second modification exposes each part of all anodes 21 juxtaposed in the Y-axis direction. In other words, the opening 31 of the second modification is formed across the anode 21 located closest to the positive side of the Y axis to the anode 21 closest to the negative side of the Y axis in the plurality of anodes 21 in the Y axis direction.

In the second modification, the contact hole 50 is formed in a region between two openings 31 adjacent in the X-axis direction. As in the second modification, when the opening 31 is long in the Y-axis direction, if a contact hole 50 is formed at a position adjacent to the opening 31 in the Y-axis direction, a sufficient number of contact holes 50 are formed in the organic EL display 1 There will be difficulties.

Here, in the second modification, the contact hole 50 is formed in a region between two openings 31 adjacent in the X-axis direction. According to this, even in the case where the long opening 31 in the Y-axis direction is formed in the organic EL display 1, the most suitable number of contact holes 50 can be formed in the organic EL display 1.

Here, in the area between the two openings 31 adjacent in the X-axis direction, it may be difficult to ensure the size of the contact hole 50 in the X-axis direction.

Here, as shown in FIG. 12, in the region between the two openings 31 adjacent in the X-axis direction, only the region where the contact hole 50 is formed may be partially enlarged in the X-axis direction. In other words, in the opening portion 31, the dimensions XR1, XG1, and XB1 in the X-axis direction in the portion adjacent to the contact hole 50 may be formed to be narrower than the dimensions XR2, XG2, and XB2 in the X-axis direction in the other portions. According to this, a space where the contact hole 50 is formed can be ensured without increasing the interval between the opening portions 31 in the X-axis direction.

When the area where the contact hole 50 is formed is enlarged in the X-axis direction as in the second modification, it is preferable to make the dimension XR1, XG1, XB1 in the X-axis direction of the opening 31 in the portion adjacent to the contact hole 50 It has a larger diameter than the discharge port of the nozzle 163. With such a formation, the droplets of the coating liquid discharged from the nozzle 163 can be prevented from overflowing the opening 31 and entering the contact hole 50.

Here, an example is shown in which one contact hole 50 is formed for two sub-pixels of the same color. However, it is not limited to this, and the contact hole 50 may be formed for every three or more sub-pixels of the same color.

<Drawing pattern of the third modification> 13 is a plan view showing a drawing pattern in a third modification of the embodiment. In the third modification, the contact holes 50 may be provided for each adjacent plurality of sub-pixels of different colors. For example, in the organic EL display 1 shown in FIG. 13, the contact holes 50 are provided for every three sub-pixels that constitute one pixel, that is, red sub-pixels, green sub-pixels, and blue sub-pixels. In other words, one contact hole 50 is provided per pixel.

Here, the distance between the opening 31 of the green light emitting region 261G and the opening 31 of the blue light emitting region 261B is formed to be larger than the distance between the opening 31 of the red light emitting region 261R and the opening 31 of the green light emitting region 261G. Therefore, it is preferable to form the contact hole 50 between the opening 31 of the green light emitting region 261G and the opening 31 of the blue light emitting region 261B. In addition, but not limited to this, the contact hole 50 may be formed, for example, in a region between two pixels adjacent in the Y-axis direction, or may be formed in a region between two pixels adjacent in the X-axis direction. In addition, the contact holes 50 may be provided for every plurality of adjacent pixels.

In addition, the contact hole 50 is not limited to the pixel unit (every 3 sub-pixels of red, blue, and green), and may be provided for every 2 sub-pixels of adjacent different colors, or each adjacent sub-pixel including different colors. 4 sub-pixels can also be set. The adjacent direction is not limited to up, down, left, and right, and may be diagonal. In addition, the contact holes 50 may be provided for every two or more sub-pixels that are not adjacent. In this way, the contact holes 50 may be provided in plural arbitrary sub-pixel units.

Here, the organic EL display 1 without pixel connection will be described as an example. However, the organic EL display 1 has, for example, as shown in FIGS. 10 and 12, openings of a plurality of light emitting regions of the same color adjacent in the Y-axis direction 31 is also possible.

As described above, the coating device 123a of the embodiment includes the substrate holding portion 151, the discharge unit 160, and the moving mechanism 152. The substrate holding portion 151 holds the substrate 10. The discharge unit 160 includes a plurality of heads 162, and the plurality of nozzles 163 are arranged in parallel in the first direction (an example is the Y-axis direction). The moving mechanism 152 moves the discharge unit 160 relative to the substrate holding portion 151 in a second direction (an example is the X-axis direction) crossing the first direction. The substrate 10 includes: a plurality of pixel electrodes (an anode 21) provided corresponding to the plurality of sub-pixels; a bank 30 covering the plurality of pixel electrodes, and a plurality of openings 31 exposing at least one pixel electrode are formed; And a plurality of contact holes 50 for electrically connecting the counter electrode facing the plurality of pixel electrodes to the auxiliary electrode 51. The contact holes 50 are provided for every two or more sub-pixels. The discharge unit 160 discharges droplets of organic material from the nozzle 163 toward the opening 31 of the substrate 10 held by the substrate holding portion 151.

Therefore, according to the coating device 123a of the embodiment, it is possible to provide the organic EL display 1 in which the number of contact holes 50 for the auxiliary electrode 51 is optimized.

The opening 31 may expose two or more pixel electrodes provided corresponding to two or more adjacent sub-pixels of the same color. In this case, the contact holes 50 may be provided for every two or more sub-pixels of the same color corresponding to the two or more pixel electrodes exposed by the opening 31.

The opening 31 for the landing of the droplet as an organic material is formed not for every sub-pixel, but for every two adjacent sub-pixels of the same color, so that the tolerance of the landing position of the droplet can be reduced. In addition, the contact holes 50 are provided for every two or more sub-pixels of the same color corresponding to the two or more pixel electrodes exposed through the opening 31, and the pixel connection is performed accordingly, so that the contact holes 50 do not obstruct.

The opening 31 may expose two or more pixel electrodes provided corresponding to two or more same-color sub-pixels adjacent in the first direction. According to this, the allowable error of the landing position of the droplet of the organic material in the first direction can be alleviated.

The opening 31 may expose two pixel electrodes provided corresponding to two sub-pixels of the same color adjacent in the second direction. Accordingly, the allowable error of the landing position of the organic material droplet in the second direction can be alleviated.

The opening 31 may expose four or more pixel electrodes provided corresponding to four or more sub-pixels of the same color adjacent in the first direction and the second direction. According to this, the allowable error of the landing position of the droplet of the organic material in the first direction and the second direction can be alleviated.

The contact hole 50 may be formed in a region between two openings 31 adjacent in the first direction. According to this, the pixel connection is performed and the contact hole 50 does not become an obstacle.

The contact hole 50 may be formed in a region between two openings 31 adjacent in the second direction. Even if the opening 31 long in the Y-axis direction is formed in the organic EL display 1, the most suitable number of contact holes 50 can be formed in the organic EL display 1.

In the opening portion 31, the size in the second direction in the portion adjacent to the contact hole 50 may be formed to be narrower than the size in the second direction in the other portion. According to this, it is possible to secure a space for forming the contact hole 50 without increasing the interval between the openings 31 in the second direction.

The embodiments disclosed this time are only examples and are not intended to be limiting. In fact, the above-mentioned embodiments can be realized in various forms. In addition, the above-mentioned embodiment can be omitted, replaced, or changed in various forms without departing from the scope of the patent application and its purport.

For example, the combination of luminescent colors is not limited to the three primary colors of red, green, and blue. In addition to the three primary colors of red, green, and blue, at least one of the intermediate colors of red and green, that is, yellow, and the intermediate color of green and blue, that is, cyan, can be used in addition to the three primary colors of luminescent colors.

In the above-mentioned embodiment and each modification, the bottom emission type organic EL display 1 which takes out the light from the light emitting layer 26 from the substrate 10 side is taken as an example. However, it is not limited to this, and the organic EL display 1 may be a top emission method in which the light from the light-emitting layer 26 is taken out from the opposite side of the substrate 10.

In the case of the top emission method, the substrate 10 does not necessarily need to be a transparent substrate. In the case of the top emission method, the anode 21 of the transparent electrode is used as a counter electrode, and the cathode 22 is used as a pixel electrode provided for each unit circuit 11. In this case, the arrangement of the anode 21 and the cathode 22 is reversed, so the electron injection layer 28, the electron transport layer 27, the light emitting layer 26, the hole transport layer 25, and the hole injection layer 24 are sequentially formed on the cathode 22.

In the above-described embodiment and each modification, an example in which the organic EL layer 23 has the hole injection layer 24, the hole transport layer 25, the light-emitting layer 26, the electron transport layer 27, and the electron injection layer 28 is described. However, the organic EL layer 23 It suffices to have at least the light emitting layer 26.

1‧‧‧ organic EL display 10‧‧‧ substrate 13‧‧‧ organic light emitting diode 21‧‧‧Anode 22‧‧‧Cathode 23‧‧‧ organic EL layer 26‧‧‧luminous layer 30‧‧‧Embankment 31‧‧‧Opening 50‧‧‧Contact hole 51‧‧‧Subsidiary electrode 100‧‧‧Substrate processing system 123a‧‧‧Coating device 151‧‧‧Substrate holding section 152‧‧‧Moving mechanism 160‧‧‧Spitting unit 162‧‧‧Sprinkler 163‧‧‧ nozzle 261R‧‧‧Red light emitting area 261G‧‧‧Green light emitting area 261B‧‧‧Blue light emitting area

[FIG. 1] FIG. 1 is a schematic plan view showing a configuration example of an organic EL display in which contact holes for auxiliary electrodes are formed for each sub-pixel. [FIG. 2] FIG. 2 is a diagram showing an example of a circuit configuration of an organic EL display of an embodiment. [Fig. 3] Fig. 3 is a schematic plan view showing an organic EL display of an embodiment. [Fig. 4] Fig. 4 is a sectional view taken along the line IV-IV in Fig. 3. [Fig. [Fig. 5] Fig. 5 is a sectional view taken along the line V-V in Fig. 3. [Fig. [Fig. 6] Fig. 6 is a flowchart showing a method of manufacturing an organic light-emitting diode according to an embodiment. [Fig. 7] Fig. 7 is a schematic plan view showing the configuration of the substrate processing system of the embodiment. [FIG. 8] FIG. 8 is a schematic plan view showing the configuration of the coating apparatus of the embodiment. [Fig. 9] Fig. 9 is a schematic side view showing the configuration of the coating apparatus of the embodiment. [Fig. 10] Fig. 10 is a plan view showing a drawing pattern drawn by the coating apparatus of the embodiment. [Fig. 11] Fig. 11 is a plan view showing a drawing pattern of a first modification in the embodiment. [Fig. 12] Fig. 12 is a plan view showing a drawing pattern of a second modification in the embodiment. [Fig. 13] Fig. 13 is a plan view showing a drawing pattern of a third modification in the embodiment.

1‧‧‧ organic EL display

21‧‧‧Anode

30‧‧‧Embankment

31‧‧‧Opening

50‧‧‧Contact hole

261R‧‧‧Red light emitting area

261G‧‧‧Green light emitting area

261B‧‧‧Blue light emitting area

262‧‧‧Glowing area group

Claims (13)

A coating device with: The substrate holding section holds the substrate; The discharge unit includes a plurality of nozzles, the nozzles are provided with a plurality of nozzles juxtaposed in the first direction; and A moving mechanism that relatively moves the discharge unit and the substrate holding portion along a second direction crossing the first direction; The above substrate has: A plurality of pixel electrodes corresponding to the plurality of sub-pixels; a bank covering the plurality of pixel electrodes and forming a plurality of openings exposing at least one of the pixel electrodes; and a plurality of contact holes for The counter electrode facing the plurality of pixel electrodes is electrically connected to the auxiliary electrode; The above-mentioned contact holes are provided for every two or more of the above-mentioned sub-pixels, The above spitting unit, The organic material is discharged from the nozzle toward the opening of the substrate held by the substrate holding portion. For example, the coating device according to item 1 of the patent application, where The above contact hole, It is set for every two or more sub-pixels of the same color. For example, the coating device according to item 2 of the patent application scope, in which The above opening, The two or more pixel electrodes provided corresponding to the two or more adjacent sub-pixels of the same color are exposed, The above contact hole, It is provided for every two or more sub-pixels of the same color corresponding to two or more pixel electrodes exposed from the opening. For example, the coating device according to item 3 of the patent application scope, in which The above opening, The two or more pixel electrodes provided corresponding to the two or more sub-pixels of the same color adjacent to the first direction are exposed. For example, the coating device according to item 3 of the patent application scope, in which The above opening, The two pixel electrodes provided corresponding to the two sub-pixels of the same color adjacent to the second direction are exposed. For example, the coating device according to item 3 of the patent application scope, in which The above opening, The four or more pixel electrodes provided corresponding to the four or more sub-pixels of the same color adjacent to the first direction and the second direction are exposed. The coating device according to any one of patent application items 3 to 6, wherein The above contact hole, It is formed in a region between the two openings adjacent in the first direction. The coating device according to any one of patent application items 3 to 6, wherein The above contact hole, It is formed in a region between two openings adjacent in the second direction. For example, the coating device according to item 8 of the patent application, where The above opening, The dimension in the second direction in the portion adjacent to the contact hole is formed to be narrower than the dimension in the second direction in the other portion. For example, the coating device according to item 1 of the patent application, where The above contact hole, It is set according to every two or more sub-pixels of different colors. For example, the coating device according to item 10 of the patent application scope, in which The above contact hole, Set one for at least one pixel. A coating method, including: A holding process for holding a substrate by using a substrate holding portion, the substrate including: a plurality of pixel electrodes corresponding to a plurality of sub-pixels; a bank covering the plurality of pixel electrodes and forming a plurality of at least one of the pixels Openings where the electrodes are exposed; and a plurality of contact holes for connecting the opposite electrode facing the plurality of pixel electrodes to the auxiliary electrode; A moving process to move the ejection unit and the substrate holding portion relatively in a second direction that intersects the first direction, the ejection unit being a head that includes a plurality of nozzles arranged in parallel in the first direction; and In the discharge process, a droplet of organic material is discharged from the nozzle toward the opening of the substrate held by the substrate holding portion; The above contact hole, It is set for every two or more of the above sub-pixels. An organic EL display with: A plurality of pixel electrodes are provided on the substrate corresponding to the plurality of sub-pixels; A bank covering the plurality of pixel electrodes and forming a plurality of openings that expose at least one of the pixel electrodes; The opposite electrode is opposite to the above-mentioned plurality of pixel electrodes; An organic EL layer provided between the pixel electrode and the counter electrode in the opening; Supplementary electrode; and A plurality of contact holes to connect the counter electrode to the auxiliary electrode; The above contact hole, It is set for every two or more of the above sub-pixels.

Images