KR20190126715A - Coating apparatus, coating method and organic el display - Google Patents

Abstract

An objective of the present invention is to provide an organic EL display with the optimal number of contact holes for an auxiliary electrode. According to one embodiment of the present invention, the coating apparatus comprises: a substrate holding unit; a discharge unit including a plurality of heads formed by arranging a plurality of nozzles in a first direction; and a moving mechanism relatively moving the discharge unit and the substrate holding unit in a second direction intersecting the first direction. The substrate comprises: a plurality of pixel electrodes disposed corresponding to a plurality of subpixels; a bank covering a plurality of pixel electrodes and having a plurality of opening parts exposing at least one pixel electrode; and a plurality of contact holes electrically connecting a facing electrode facing the pixel electrodes with an auxiliary electrode. The contact hole is disposed by two or more subpixels and the discharge unit discharges a droplet of an organic material from the nozzle toward the opening part of the substrate held in the substrate holding unit.

Description

Coating device, coating method and organic EL display {COATING APPARATUS, COATING METHOD AND ORGANIC EL DISPLAY}

The present disclosure relates to a coating apparatus, a coating method, and an organic EL display.

An organic EL display using an organic light emitting diode (OLED) has the advantages of being thin, lightweight, and low power consumption, and excellent in terms of response speed, viewing angle, and contrast ratio. The organic light emitting diode is constituted by sandwiching an organic EL layer containing a light emitting layer between the pixel electrode and the counter electrode.

Patent Literature 1 discloses a technique of suppressing an increase in wiring resistance caused by a large screen of an organic EL display by connecting an auxiliary electrode formed of a material having a low resistivity with a counter electrode.

Patent Document 1: Japanese Patent Application Laid-Open No. 2016-197240

The present disclosure provides an organic EL display in which the number of contact holes for the auxiliary electrode is optimized.

The coating apparatus which concerns on one aspect of this indication contains a board | substrate holding part, a discharge unit, and a moving mechanism. The substrate holding portion holds the substrate. The discharge unit includes a plurality of heads provided with a plurality of nozzles arranged in a first direction. The moving mechanism relatively moves the discharge unit and the substrate holding part along the second direction crossing the first direction. The substrate includes a plurality of pixel electrodes provided corresponding to the plurality of subpixels, a plurality of banks each including a plurality of openings covering the plurality of pixel electrodes and exposing at least one pixel electrode, And a plurality of contact holes for electrically connecting an opposite electrode facing the pixel electrode of the auxiliary electrode with the auxiliary electrode. The contact hole is provided for every two or more subpixels. The discharge unit discharges droplets of organic materials from the nozzle toward the opening of the substrate held in the substrate holding unit.

According to the present disclosure, it is possible to provide an organic EL display in which the number of contact holes for the auxiliary electrode is optimized.

BRIEF DESCRIPTION OF THE DRAWINGS It is a typical top view which shows the structural example of the organic electroluminescent display in which the contact hole for auxiliary electrodes was formed for every subpixel.
2 is a diagram illustrating an example of a circuit configuration of an organic EL display according to the embodiment.
3 is a schematic plan view of the organic EL display according to the embodiment.
4 is a cross-sectional view taken along the line IV-IV in FIG. 3.
5 is a cross-sectional view taken along the line VV in FIG. 3.
6 is a flowchart illustrating a method of manufacturing an organic light emitting diode according to the embodiment.
7 is a schematic plan view showing a configuration of a substrate processing system according to an embodiment.
8 is a schematic plan view showing a configuration of an application device according to an embodiment.
It is a typical side view which shows the structure of the coating device which concerns on embodiment.
It is a top view which shows the drawing pattern which the coating device which concerns on embodiment draws.
It is a top view which shows the drawing pattern which concerns on the 1st modified example in embodiment.
It is a top view which shows the drawing pattern which concerns on the 2nd modified example in embodiment.
It is a top view which shows the drawing pattern which concerns on the 3rd modified example in embodiment.

EMBODIMENT OF THE INVENTION Below, the form (it describes as "embodiment" hereafter) for implementing the coating apparatus, the coating method, and organic electroluminescent display which concern on this indication is demonstrated in detail, referring drawings. In addition, this embodiment does not limit the coating device, the coating method, and the organic EL display according to the present disclosure. In addition, each embodiment can be combined suitably in the range which does not contradict a process content. In addition, the same code | symbol is attached | subjected to the same site | part in each following embodiment, and the overlapping description is abbreviate | omitted.

In addition, in each drawing referred to below, in order to make the description clear, the Cartesian coordinate system which prescribes the X-axis direction, Y-axis direction, and Z-axis direction orthogonal to each other, and makes a Z-axis positive direction a perpendicular upward direction may be shown. .

An organic EL display using an organic light emitting diode has the advantages of being thin, lightweight, and low power consumption, and excellent in terms of response speed, viewing angle, and contrast ratio. For this reason, organic electroluminescent display is attracting attention as a next-generation flat panel display (FPD) in recent years.

The organic light emitting diode is constituted by sandwiching an organic EL layer including a light emitting layer with a pixel electrode and a counter electrode, and an inkjet coating apparatus is used to form the organic EL layer.

In recent years, as the large screen of an organic EL display becomes large, there exists a tendency for wiring length to become long. If the wiring length is increased, the wiring resistance increases, which may make it difficult to supply power for light emission, for example, to a pixel electrode located far from the power supply.

Therefore, as a technique of lowering wiring resistance, a technique of connecting an auxiliary electrode formed of a material having a low resistivity with an opposite electrode has been proposed. In this technique, contact holes for conduction of the auxiliary electrodes are formed for each subpixel. The subpixels refer to respective points of R (red), G (green), and B (blue) constituting one pixel. That is, in the above technique, one contact hole is formed in each of the red subpixel, the green subpixel, and the blue subpixel.

BRIEF DESCRIPTION OF THE DRAWINGS It is a typical top view which shows the structural example of the organic electroluminescent display in which the contact hole for auxiliary electrodes was formed for every subpixel. As shown in FIG. 1, the organic EL display 1X has a plurality of pixel electrodes 21X and a bank 30X covering the plurality of pixel electrodes 21X. In the bank 30X, an opening 31X for exposing a part of the pixel electrode 21X is formed for each pixel electrode 21X. That is, one opening 31X is formed for one pixel electrode 21X.

In each opening 31X, an organic EL layer 23X is formed. The organic EL layer 23X is formed by ejecting droplets of an organic material in each of the openings 31X in accordance with the inkjet method.

On the organic EL layer 23X, the counter electrode which is not shown in figure is arrange | positioned. The counter electrode is common to the plurality of pixel electrodes 21X and opposes the plurality of pixel electrodes 21X. In this way, one subpixel is formed by sandwiching the organic EL layer 23X between the pixel electrode 21X and the counter electrode. Therefore, the area where the pixel electrode 21X and the opening 31X overlap in plan view corresponds to the area of one subpixel.

The contact hole 50X for auxiliary electrodes is formed for every subpixel. In other words, in the organic EL display 1X, one contact hole 50X is formed for one pixel electrode 21X or one opening 31X.

By the way, in recent years, in order to raise the pixel density of an organic electroluminescent display, the dimension of a subpixel tends to be reduced. Usually, the opening part which receives the droplet of organic material is formed for every subpixel in a bank (refer FIG. 1). For this reason, when the dimension of an opening part shrinks with the reduction of the dimension of a subpixel, the tolerance of the impact position of a droplet becomes small, and a droplet becomes easy to protrude from an opening part.

Therefore, in order to alleviate the tolerance of the impact position of a droplet, the technique of forming the opening which impacts a droplet for every adjacent subpixel of the same color instead of every subpixel (henceforth "pixel connection") Is proposed).

However, in the organic EL display 1X in which contact holes 50X for auxiliary electrodes are provided for each subpixel, it is difficult to perform pixel connection. That is, as shown in FIG. 1, each contact hole 50X is formed in the area | region between two adjacent organic EL layers 23X of the same color. For this reason, if one opening which connects two adjacent organic EL layers 23X of the same color shown in FIG. 1 is formed, the upper contact hole 50X of the two contact holes 50X shown in FIG. ) Is located in the opening. As a result, the organic material discharged to the openings flows into the contact hole 50X, so that the function of electrically connecting the counter electrode and the auxiliary electrode cannot be achieved. In addition, when the organic material flows into the contact hole 50X, there is a fear that the film thickness uniformity of the organic EL layer 23X is lowered.

Therefore, it is expected to provide an organic EL display in which the number of contact holes for auxiliary electrodes is optimized.

<Organic EL display>

2 is a diagram illustrating an example of a circuit configuration of an organic EL display according to the embodiment. 2, one unit circuit 11 is enlarged and shown.

As shown in FIG. 2, the organic EL display 1 includes a substrate 10, a plurality of unit circuits 11, a scan line driver circuit 14, and a data line driver circuit 15. The plurality of unit circuits 11, the scan line driver circuit 14, and the data line driver circuit 15 are provided on the substrate 10.

The unit circuit 11 is provided in an area surrounded by a plurality of scan lines 16 connected to the scan line driver circuit 14 and a plurality of data lines 17 connected to the data line driver circuit 15. This unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistors). Among the plurality of TFTs, one TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scan line driver circuit 14 and the data line driver circuit 15 to supply a current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled.

In addition, the TFT layer 12 may be a general configuration, and is not limited to the configuration shown in FIG. 2. In addition, although embodiment demonstrates the example in the case where the drive system of the organic electroluminescent display 1 is an active matrix system, a passive matrix system may be sufficient as a drive system.

3 is a schematic plan view of the organic EL display 1 according to the embodiment. 3, the negative electrode 22 mentioned later is abbreviate | omitted and shown. 3, the area | region in which the light emitting layer 26 of the same color is formed is shown by the same hatching.

As shown in FIG. 3, in the organic EL display 1 according to the embodiment, one opening 31 is formed for two subpixels. Specifically, in the organic EL display 1 according to the embodiment, the opening 31 of the bank 30 exposes two anodes 21 provided corresponding to two adjacent subpixels of the same color. Here, a plurality of same-color subpixels are arranged along the Y-axis direction, and the opening portion 31 exposes a part of each of the two anodes 21 adjacent to the Y-axis direction.

Thus, the opening part 31 which impacts the droplet of the organic material for forming the organic electroluminescent layer 23 is formed not only for every subpixel, but for each adjacent two subpixels of the same color, so that the impact position of a droplet can be accepted. The error can be alleviated.

4 is a cross-sectional view taken along the line IV-IV in FIG. 3. As shown in FIG. 4, in the organic EL display 1, the TFT layer 12 is formed on the substrate 10, and the step formed by the TFT layer 12 is planarized on the TFT layer 12. The planarization layer 18 is formed. The substrate 10 is, for example, a transparent substrate such as a glass substrate or a resin substrate.

The planarization layer 18 has insulation. The contact plug 19 is formed in the contact hole penetrating the planarization layer 18. The contact plug 19 electrically connects the anode 21 as the pixel electrode formed on the flat surface of the planarization layer 18 and the TFT layer 12. The contact plug 19 may be formed of the same material as the anode 21 and formed at the same time.

The organic light emitting diode 13 is formed on the flat surface of the planarization layer 18. The organic light emitting diode 13 includes an anode 21 serving as a pixel electrode, a cathode 22 serving as an opposite electrode provided on a side opposite to the substrate 10 with respect to the pixel electrode, and an anode 21 and a cathode 22. ) And an organic EL layer 23 formed therebetween. By operating the TFT layer 12, a voltage is applied between the anode 21 and the cathode 22, and the organic EL layer 23 emits light.

The anode 21 as the pixel electrode is formed of, for example, indium tin oxide (ITO) or the like, and transmits light from the organic EL layer 23. Light transmitted through the anode 21 is extracted to the outside by passing through the substrate 10. The anode 21 is provided for each unit circuit 11, in other words, for each subpixel.

The cathode 22 as the counter electrode is formed of, for example, aluminum and reflects light from the organic EL layer 23 toward the organic EL layer 23. The light reflected by the cathode 22 is extracted to the outside by passing through the organic EL layer 23, the anode 21, and the substrate 10. The cathode 22 is common to the plurality of unit circuits 11.

In addition, although the example where the anode 21 is a pixel electrode and the cathode 22 is a counter electrode is demonstrated here, the cathode 22 may be a pixel electrode and the anode 21 may be a counter electrode.

The organic EL layer 23 includes, for example, a hole injection layer 24, a hole transport layer 25, a light emitting layer 26, an electron transport layer 27, and an electron injection layer 28. The hole injection layer 24, the hole transport layer 25, the light emitting layer 26, the electron transport layer 27, and the electron injection layer 28 are laminated in this order from the anode 21 side toward the cathode 22 side. .

When a voltage is applied between the anode 21 and the cathode 22, holes are injected from the anode 21 into the hole injection layer 24, and electrons are injected from the cathode 22 into the electron injection layer 28. The holes injected into the hole injection layer 24 are transported to the light emitting layer 26 by the hole transport layer 25. Electrons injected into the electron injection layer 28 are transported to the light emitting layer 26 by the electron transport layer 27. Holes and electrons recombine in the light emitting layer 26 to excite the light emitting material of the light emitting layer 26, and the light emitting layer 26 emits light.

As the light emitting layer 26, for example, as shown in FIG. 3, a red light emitting layer 26R, a green light emitting layer 26G, and a blue light emitting layer 26B are formed. The red light emitting layer 26R is formed of a red light emitting material that emits red light. The green light emitting layer 26G is formed of a green light emitting material that emits green light. The blue light emitting layer 26B is formed of a blue light emitting material that emits blue light.

One pixel in the organic EL display 1 includes a subpixel having a red light emitting layer 26R, a subpixel having a blue light emitting layer 26B, and a green pixel adjacent to the subpixel. It is comprised including the subpixel which has the light emitting layer 26G. The red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B emit light in a region where the anode 21 as the pixel electrode and the cathode 22 as the counter electrode overlap in plan view.

The bank 30 prevents mixing of these coating liquids by separating the coating liquid for the red light emitting layer 26R, the coating liquid for the green light emitting layer 26G, and the coating liquid for the blue light emitting layer 26B. The bank 30 has insulation and fills contact holes penetrating the planarization layer 18.

As shown in FIG. 3, in the organic EL display 1 according to the embodiment, one contact hole 50 is formed for one opening 31. In other words, the contact hole 50 is provided for every two same-color anodes 21 corresponding to the two anodes 21 exposed by the opening part 31.

5 is a cross-sectional view taken along the line V-V in FIG. 3. As shown in FIG. 5, the contact hole 50 is formed to penetrate the bank 30 and the planarization layer 18. The contact hole 50 is opened in the upper surface of the bank 30 to expose a part of the auxiliary electrode 51 provided on the substrate 10.

In the contact hole 50, for example, a conductive material such as W (tungsten) is embedded. Thereby, the cathode 22 and the auxiliary electrode 51 can be electrically connected.

As shown in FIG. 3, the contact hole 50 is an area between one opening 31 of the plurality of openings 31 and one opening 31 and the other opening 31 adjacent to the Y-axis direction. Is formed. In other words, the contact hole 50 is formed in the area | region between two opening parts 31 adjacent to the Y-axis direction in which the light emitting layer 26 of the same color is formed. For this reason, it can make it difficult for organic material to enter the contact hole 50 at the time of an application | coating process.

In this way, the contact hole 50 for the auxiliary electrode is provided for each of the two same-color anodes 21 corresponding to the two anodes 21 exposed by the opening 31. Thereby, the contact hole 50 is not disturbed in performing pixel connection. Therefore, it is possible to apply pixel connection also to the large size organic electroluminescent display in which an auxiliary electrode is needed. As described above, the cathode 22 serving as the counter electrode is common to the plurality of unit circuits 11, and the contact hole 50 is not necessarily provided for each subpixel.

In addition, although it is assumed here that one contact hole 50 is provided for every two subpixels, for example, one contact hole 50 for every three or more subpixels depends on the area of the anode 21 and the thickness of the wiring. It is also possible to provide).

<Method of manufacturing organic light emitting diode>

6 is a flowchart illustrating a method of manufacturing the organic light emitting diode 13 according to the embodiment. In the processing procedure shown in FIG. 6, the TFT layer 12, the auxiliary electrode 51, the planarization layer 18, the bank 30, the opening 31, and the contact hole 50 are formed on the substrate 10. And an organic EL display after the conductive material is embedded in the contact hole 50.

First, in step S101, the anode 21 as the pixel electrode is formed. For example, a vapor deposition method is used to form the anode 21. The anode 21 is formed for each unit circuit 11 with respect to the flat surface of the planarization layer 18. In addition, a contact plug 19 may be formed together with the anode 21.

Subsequently, in step S102, the bank 30 is formed. The bank 30 is formed using a photoresist, for example, and is patterned in a predetermined pattern by a photolithography process. In the opening 31 of the bank 30, a part of the anode 21 is exposed.

Subsequently, in step S103, the hole injection layer 24 is formed. The inkjet method is used for formation of the hole injection layer 24. The coating layer is formed by applying the coating liquid for the hole injection layer 24 on the anode 21 by the inkjet method. Then, the hole injection layer 24 shown in FIG. 4 is formed by drying and baking an application layer.

Subsequently, in step S104, the hole transport layer 25 is formed. As the formation of the hole injection layer 24, the inkjet method is used to form the hole transport layer 25. The coating layer is formed by applying the coating liquid for the hole transport layer 25 on the hole injection layer 24 by the inkjet method. Then, the hole transport layer 25 is formed by drying and baking an application layer.

Subsequently, in step S105, the light emitting layer 26 is formed. The inkjet method is used for forming the light emitting layer 26 similarly to the formation of the hole injection layer 24 and the hole transport layer 25. The coating layer is formed by applying the coating liquid for the light emitting layer 26 on the hole transport layer 25 by the inkjet method. Then, the light emitting layer 26 is formed by drying and baking an application layer. As described above, as the light emitting layer 26, for example, a red light emitting layer 26R, a green light emitting layer 26G, and a blue light emitting layer 26B are formed.

Subsequently, in step S106, the electron transport layer 27 is formed. For example, a vapor deposition method or the like is used for formation of the electron transport layer 27. Since the electron transport layer 27 may be common to the plurality of unit circuits 11, the electron transport layer 27 may be formed not only on the light emitting layer 26 in the opening 31 of the bank 30 but also on the bank 30.

Subsequently, in step S107, the electron injection layer 28 is formed. For example, a deposition method or the like is used to form the electron injection layer 28. The electron injection layer 28 is formed on the electron transport layer 27. Similarly to the electron transport layer 27, the electron injection layer 28 may be common to the plurality of unit circuits 11.

Subsequently, in step S108, the cathode 22 is formed. For example, evaporation or the like is used to form the cathode 22. The cathode 22 is formed on the electron injection layer 28. The cathode 22 is common to the plurality of unit circuits 11. When the drive system of the organic EL display 1 is a passive matrix system, the cathode 22 is patterned in a predetermined pattern.

According to the above process, the organic light emitting diode 13 is manufactured. The substrate processing system is used for formation of the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 among the organic EL layers 23.

<Substrate processing system>

7 is a schematic plan view showing a configuration of a substrate processing system according to an embodiment. The substrate processing system 100 shown in FIG. 7 performs each process corresponding to step S103-S105 of FIG. 6, and the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 on the anode 21 are performed. ).

The substrate processing system 100 shown in FIG. 7 has an import station 110, a processing station 120, a transport station 130, and a control device 140.

The carrying-in station 110 carries in the cassette C which accommodates the several board | substrate 10 from the exterior, and takes out several board | substrate 10 from the cassette C one by one. In each substrate 10, a TFT layer 12, a planarization layer 18, an anode 21, a bank 30, an opening 31, a contact hole 50, and the like are formed in advance.

The carrying-in station 110 is the cassette mounting table 111 which arrange | positions the cassette C, the conveyance path 112 provided between the cassette placing table 111, and the processing station 120, and the conveyance path 112 It includes the substrate carrier 113 provided in. The board | substrate conveyance body 113 conveys the board | substrate 10 between the cassette C arrange | positioned at the cassette mounting base 111, and the processing station 120. FIG.

The processing station 120 forms the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 on the anode 21. The processing station 120 forms the hole injection layer forming block 121 for forming the hole injection layer 24, the hole transport layer forming block 122 for forming the hole transport layer 25, and the light emitting layer 26. The light emitting layer forming block 123 is included.

The hole injection layer forming block 121 coats the coating liquid for the hole injection layer 24 on the anode 21 to form a coating layer, and the coating layer is dried and baked to form the hole injection layer 24. To form. The coating liquid for the hole injection layer 24 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may superpose | polymerize by baking and may be a polymer.

The hole injection layer forming block 121 includes an application device 121a, a buffer device 121b, a reduced pressure drying device 121c, a heat treatment device 121d, and a temperature control device 121e. The coating apparatus 121a discharges the droplet of the coating liquid for the hole injection layer 24 toward the opening part 31 of the bank 30. The buffer device 121b temporarily accommodates the substrate 10 in the process standby. The pressure reduction drying apparatus 121c dries under reduced pressure the coating layer apply | coated by the coating device 121a, and removes the solvent contained in an application layer. The heat treatment apparatus 121d heat-treats the application layer dried by the pressure reduction drying apparatus 121c. The temperature control apparatus 121e adjusts the temperature of the board | substrate 10 heat-processed by the heat processing apparatus 121d to predetermined temperature, for example, normal temperature.

The coating apparatus 121a, the buffer apparatus 121b, the heat processing apparatus 121d, and the temperature control apparatus 121e are maintained in the atmospheric atmosphere inside. The pressure reduction drying apparatus 121c switches internal atmosphere into an atmospheric atmosphere and a reduced pressure atmosphere.

Further, in the hole injection layer forming block 121, the arrangement and number of the coating device 121a, the buffer device 121b, the reduced pressure drying device 121c, the heat treatment device 121d, and the temperature regulating device 121e, The atmosphere inside can be selected arbitrarily.

In addition, the hole injection layer forming block 121 includes substrate transfer devices CR1 to CR3 and transfer devices TR1 to TR3. The board | substrate conveying apparatus CR1-CR3 conveys the board | substrate 10 to each adjacent apparatus, respectively. For example, the board | substrate conveyance apparatus CR1 conveys the board | substrate 10 to the coating apparatus 121a and the buffer apparatus 121b which adjoin. The board | substrate conveying apparatus CR2 conveys the board | substrate 10 to the adjacent pressure reduction drying apparatus 121c. The board | substrate conveyance apparatus CR3 conveys the board | substrate 10 to the adjacent heat processing apparatus 121d and the temperature control apparatus 121e. The transfer apparatuses TR1 to TR3 are each in turn, between the carrying-in station 110 and the substrate transfer apparatus CR1, between the substrate transfer apparatus CR1 and the substrate transfer apparatus CR2, and the substrate transfer apparatus CR2 and the substrate. It is provided between the conveying apparatus CR3, and relays the board | substrate 10 between them. The inside of board | substrate conveying apparatus CR1-CR3 and delivery apparatus TR1-TR3 is hold | maintained in air | atmosphere atmosphere.

Between the substrate conveyance apparatus CR3 of the hole injection layer formation block 121, and the substrate conveyance apparatus CR4 of the hole transport layer formation block 122, the transfer apparatus TR4 which relays the board | substrate 10 between them is provided. To be prepared. The delivery device TR4 is maintained inside in an atmospheric atmosphere.

The hole transport layer forming block 122 applies the coating liquid for the hole transport layer 25 onto the hole injection layer 24 to form a coating layer, and then dry and fire the coating layer to form the hole transport layer 25. Form. The coating liquid for the hole transport layer 25 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may superpose | polymerize by baking and may be a polymer.

The hole transport layer forming block 122 includes an application device 122a, a buffer device 122b, a reduced pressure drying device 122c, a heat treatment device 122d, and a temperature regulating device 122e. The coating apparatus 122a discharges the droplet of the coating liquid for the hole transport layer 25 toward the opening part 31 of the bank 30. The buffer device 122b temporarily accommodates the substrate 10 in the process standby. The pressure reduction drying apparatus 122c dries under reduced pressure the application layer apply | coated by the application apparatus 122a, and removes the solvent contained in an application layer. The heat treatment apparatus 122d heat-treats the application layer dried by the pressure reduction drying apparatus 122c. The temperature control apparatus 122e adjusts the temperature of the board | substrate 10 heat-processed by the heat processing apparatus 122d to predetermined temperature, for example, normal temperature.

The coating device 122a and the buffer device 122b are maintained inside in an atmospheric atmosphere. On the other hand, in order to suppress deterioration of the organic material of the hole-transporting layer 25, the heat processing apparatus 122d and the temperature control apparatus 122e are maintained in the atmosphere of low oxygen and low dew point. The reduced pressure drying device 122c switches the atmosphere inside to an atmosphere of low oxygen and low dew point and a reduced pressure atmosphere.

Here, the atmosphere of low oxygen means the atmosphere whose oxygen concentration is lower than the atmosphere, for example, the atmosphere whose oxygen concentration is 10 ppm or less. In addition, low dew point atmosphere means the atmosphere whose dew point temperature is lower than air | atmosphere, for example, the dew point temperature is -10 degrees C or less. The atmosphere of low oxygen and low dew point is formed of an inert gas such as nitrogen gas.

In the hole transport layer forming block 122, the arrangement, number, and interior of the coating device 122a, the buffer device 122b, the reduced pressure drying device 122c, the heat treatment device 122d, and the temperature regulating device 122e. The atmosphere of can be arbitrarily selected.

In addition, the hole transport layer forming block 122 includes substrate transfer devices CR4 to CR6 and transfer devices TR5 to TR6. The board | substrate conveying apparatus CR4-CR6 conveys the board | substrate 10 to each adjacent apparatus, respectively. The transmission apparatuses TR5 to TR6 are provided between the substrate conveying apparatus CR4 and the substrate conveying apparatus CR5, and between the substrate conveying apparatus CR5 and the substrate conveying apparatus CR6 in order, respectively, and the board | substrate ( Relay 10).

The inside of the board | substrate conveyance apparatus CR4 is hold | maintained in an atmospheric atmosphere. On the other hand, the inside of the board | substrate conveying apparatus CR5-CR6 is maintained by the atmosphere of low oxygen and low dew point. This is because the inside of the reduced pressure drying device 122c adjacent to the substrate transfer device CR5 is switched to an atmosphere of low oxygen and low dew point and a reduced pressure atmosphere. Moreover, it is because the inside of the heat processing apparatus 122d and the temperature control apparatus 122e provided adjacent to the board | substrate conveyance apparatus CR6 is maintained in the atmosphere of low oxygen and low dew point.

The transmission device TR5 is configured as a load lock device that switches the atmosphere inside thereof between an atmospheric atmosphere and a low oxygen and low dew point atmosphere. This is because the reduced pressure drying device 122c is provided adjacent to the downstream side of the delivery device TR5. On the other hand, the inside of the delivery apparatus TR6 is maintained in the atmosphere of low oxygen and low dew point.

The transfer apparatus TR7 which relays the board | substrate 10 is provided between the board | substrate conveyance apparatus CR6 of the positive hole transport layer formation block 122, and the board | substrate conveyance apparatus CR7 of the light emitting layer formation block 123. . The inside of the board | substrate conveying apparatus CR6 is maintained in the atmosphere of low oxygen, and low dew point, and the inside of the board | substrate conveying apparatus CR7 is maintained in the atmospheric atmosphere. Therefore, the transmission device TR7 is comprised as a load lock apparatus which switches the atmosphere inside it between the atmosphere of low oxygen, a low dew point, and an atmospheric atmosphere.

The light emitting layer formation block 123 forms the coating layer by apply | coating the coating liquid for the light emitting layer 26 on the hole transport layer 25, and forms the light emitting layer 26 by drying and baking the formed coating layer. The coating liquid for the light emitting layer 26 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may superpose | polymerize by baking and may be a polymer.

The light emitting layer forming block 123 includes an application device 123a, a buffer device 123b, a reduced pressure drying device 123c, a heat treatment device 123d, and a temperature control device 123e. The coating apparatus 123a discharges the droplet of the coating liquid for the light emitting layer 26 toward the opening part 31 of the bank 30. The buffer device 123b temporarily accommodates the substrate 10 in the process standby. The vacuum drying apparatus 123c vacuum-drys the coating layer apply | coated by the coating device 123a, and removes the solvent contained in an application layer. The heat treatment apparatus 123d heat-treats the application layer dried by the pressure reduction drying apparatus 123c. The temperature control apparatus 123e adjusts the temperature of the board | substrate 10 heat-processed by the heat processing apparatus 123d to predetermined temperature, for example, normal temperature.

The coating device 123a and the buffer device 123b are kept inside in an atmospheric atmosphere. On the other hand, in order to suppress deterioration of the organic material of the light emitting layer 26, the heat processing apparatus 123d and the temperature control apparatus 123e are maintained in the atmosphere of low oxygen and low dew point. The reduced pressure drying device 123c switches the atmosphere inside into an atmosphere of low oxygen and low dew point and a reduced pressure atmosphere.

Moreover, in the light emitting layer formation block 123, arrangement | positioning, number, and inside of the application apparatus 123a, the buffer apparatus 123b, the pressure reduction drying apparatus 123c, the heat processing apparatus 123d, and the temperature control apparatus 123e are carried out. The atmosphere can be arbitrarily selected.

In addition, the light emitting layer formation block 123 contains board | substrate conveying apparatus CR7-CR9, and delivery apparatus TR8-TR9. The board | substrate conveying apparatus CR7-CR9 conveys the board | substrate 10 to each adjacent apparatus, respectively. The transfer apparatuses TR8 to TR9 are provided between the substrate transfer apparatus CR7 and the substrate transfer apparatus CR8, and between the substrate transfer apparatus CR8 and the substrate transfer apparatus CR9, respectively, in order, and between them. Relay (10).

The inside of the board | substrate conveyance apparatus CR7 is hold | maintained in an atmospheric atmosphere. On the other hand, the inside of the board | substrate conveying apparatus CR8-CR9 is maintained in the atmosphere of low oxygen and low dew point. This is because the inside of the reduced pressure drying device 123c adjacent to the substrate transfer device CR8 is switched to an atmosphere of low oxygen and low dew point and a reduced pressure atmosphere. This is because the inside of the heat treatment device 123d and the temperature control device 123e provided adjacent to the substrate transfer device CR9 are kept in an atmosphere of low oxygen and low dew point.

The delivery device TR8 is configured as a loadlock device that switches the atmosphere inside the atmosphere between the atmosphere and the atmosphere of low oxygen and low dew point. This is because the reduced pressure drying device 123c is provided adjacent to the downstream side of the delivery device TR8. The interior of the delivery device TR9 is maintained in an atmosphere of low oxygen and low dew point.

Between the board | substrate conveyance apparatus CR9 of the light emitting layer formation block 123, and the unloading station 130, the transmission apparatus TR10 which relays the board | substrate 10 between them is provided. The inside of the substrate conveying apparatus CR9 is maintained in an atmosphere of low oxygen and low dew point, and the inside of the carrying out station 130 is maintained in an atmospheric atmosphere. Therefore, the transmission device TR7 is comprised as a load lock apparatus which switches the atmosphere inside it between the atmosphere of low oxygen, a low dew point, and an atmospheric atmosphere.

The carrying out station 130 accommodates the several board | substrate 10 in the cassette C one by one, and carries out the cassette C outside. The unloading station 130 includes a cassette placing table 131 for placing the cassette C, a conveying path 132 provided between the cassette placing table 131, and the processing station 120, and a conveying path 132. It includes the substrate carrier 133 provided in the. The board | substrate conveyance body 133 conveys the board | substrate 10 between the processing station 120 and the cassette C arrange | positioned at the cassette mounting base 131. As shown in FIG.

The control device 140 includes a control unit 141 and a storage unit 142. The control device 140 includes, for example, a computer having a central processing unit (CPU), a read only memory (ROM), a random access memory (RAM), a hard disk drive (HDD), an input / output port, and the like, and various circuits.

The computer CPU, for example, reads and executes a program stored in a ROM. As a result, the CPU of the computer functions as the control unit 141. In addition, some or all of the control part 141 may be comprised by hardware. The hardware is, for example, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or the like.

The storage unit 142 corresponds to, for example, a RAM or an HDD. In addition, the control device 140 may acquire the above-mentioned programs and various kinds of information through another computer or a portable storage medium connected via a wired or wireless network. Examples of storage media that can be read by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

Next, the substrate processing method using the substrate processing system 100 is demonstrated. When the cassette C which accommodated the several board | substrate 10 is arrange | positioned on the cassette mounting stand 111, the board | substrate carrier body 113 will remove the board | substrate 10 from the cassette C on the cassette mounting stand 111. FIG. It takes out sequentially and conveys to the hole injection layer formation block 121. FIG.

The hole injection layer forming block 121 coats the coating liquid for the hole injection layer 24 on the anode 21 to form a coating layer, and then dry and fire the formed coating layer to form the hole injection layer 24. ). The substrate 10 on which the hole injection layer 24 is formed is transferred from the hole injection layer formation block 121 to the hole transport layer formation block 122 by the delivery device TR4.

The hole transport layer forming block 122 coats the coating liquid for the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and the hole transport layer 25 is dried and baked. To form. The substrate 10 on which the hole transport layer 25 is formed is transferred from the hole transport layer formation block 122 to the light emitting layer formation block 123 by the transfer device TR7.

The light emitting layer formation block 123 forms the coating layer by apply | coating the coating liquid for the light emitting layer 26 on the hole transport layer 25, and forms the light emitting layer 26 by drying and baking the formed coating layer. The substrate 10 on which the light emitting layer 26 is formed is transferred from the light emitting layer forming block 123 to the carrying out station 130 by the transfer device TR10.

The board | substrate carrier body 133 of the unloading station 130 contains the board | substrate 10 received from the delivery apparatus TR10 in the predetermined cassette C on the cassette mounting table 131. As shown in FIG. Thereby, the process of the series of board | substrates 10 in the substrate processing system 100 is complete | finished.

The board | substrate 10 is carried out from the carrying out station 130 in the state contained in the cassette C. The electron transport layer 27, the electron injection layer 28, the cathode 22, etc. are formed in the board | substrate 10 carried outside.

<Application device and application method>

Next, the coating apparatus 123a of the light emitting layer formation block 123 is demonstrated with reference to FIG. 8 and FIG. FIG. 8: is a schematic top view which shows the structure of the coating device 123a which concerns on embodiment. 9 is a schematic side view which shows the structure of the coating device 123a which concerns on embodiment.

8 and 9, the Y-axis direction is a line direction in which a plurality of nozzles for ejecting droplets of the same coating liquid are arranged, and the X-axis direction is a scan direction orthogonal to the Y-axis direction. In addition, the line direction and the scan direction should just intersect and do not have to be orthogonal.

As shown to FIG. 8 and FIG. 9, the coating device 123a is the stage 150 which hold | maintains and moves the board | substrate 10, the discharge unit 160 which discharges a droplet toward the board | substrate 10, and And a maintenance unit 170 for maintaining the function of the discharge unit 160.

The stage 150 and the maintenance unit 170 are arranged in the Y-axis direction. The Y-axis guide 180 is hypothesized between the upper side of the stage 150 and the upper side of the maintenance unit 170. Along the Y axis guide 180, the discharge unit 160 can move in the Y axis direction. As the driving unit for moving the discharge unit 160 in the Y-axis direction, a linear motor or the like is used.

The stage 150 has a substrate holding part 151 for holding the substrate 10 horizontally, and a moving mechanism 152 for moving the substrate holding part 151. The board | substrate holding part 151 hold | maintains the board | substrate 10 with the application surface which apply | coats the droplet of the board | substrate 10 facing up. As the substrate holding unit 151, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used. The movement mechanism 152 includes the X-axis direction driver 153 for moving the substrate holding part 151 in the X-axis direction, the Y-axis direction driver 154 for moving the substrate holding part 151 in the Y-axis direction, and the substrate. And a rotation drive unit 155 for rotating the holding unit 151 around the Z axis.

The discharge unit 160 is movable between a position at which the droplet is discharged from the upper side of the stage 150 toward the substrate 10 and a position at which the processing for maintaining the function by the maintenance unit 170 is accepted. . The discharge units 160 are arranged in plural (here 10) in the Y-axis direction. The plurality of discharge units 160 may be independently moved in the Y-axis direction or may be integrally moved in the Y-axis direction.

Each discharge unit 160 has a carriage 161 and a plurality of heads 162 provided on the lower surface of the carriage 161. Each head 162 is provided with at least one row of nozzles composed of a plurality of nozzles 163 arranged in the Y-axis direction. The some nozzle 163 provided in the same head 162 discharges the droplet of the same coating liquid. Of the nozzle 163 for discharging droplets of the coating liquid for the red light emitting layer 26R, the nozzle 163 for discharging droplets of the coating liquid for the green light emitting layer 26G, and the coating liquid for the blue light emitting layer 26B. The nozzle 163 which discharges a droplet is provided in each head 162. As shown in FIG.

The maintenance unit 170 performs a process of maintaining the function of the discharge unit 160 to eliminate the discharge failure of the discharge unit 160. The maintenance unit 170 has a wiping unit 171 which cleans up the periphery of the discharge port of the nozzle, and a suction unit 172 which sucks droplets from the discharge port of the nozzle. The suction unit 172 blocks the discharge port of the nozzle in the stopped state, and achieves the role of suppressing clogging due to drying.

Next, the coating method using the coating apparatus 123a of the said structure is demonstrated. The following operation of the coating device 123a is controlled by the control device 140. In addition, although the control apparatus 140 is provided separately from the coating apparatus 123a in FIG. 7, you may provide as a part of the coating apparatus 123a.

First, when the board | substrate 10 carried in from the exterior of the coating device 123a is arrange | positioned at the board | substrate holding part 151, the board | substrate holding part 151 hold | maintains the board | substrate 10. FIG. Subsequently, based on the image which picked up the alignment mark of the board | substrate 10, the position correction of the board | substrate holding part 151 by the moving mechanism 152 is performed. Thereafter, the moving mechanism 152 moves the substrate holding part 151 in the X-axis direction and passes the discharge unit 160 below. In the meantime, the discharge unit 160 discharges the droplet of the coating liquid toward the substrate 10. After that, after the movement mechanism 152 changes the position of the substrate holding part 151 in the Y axis direction, the moving mechanism 152 moves the substrate holding part 151 again in the X axis direction to move the bottom of the discharge unit 160 down. Pass it through. In the meantime, the discharge unit 160 discharges the droplet of the coating liquid toward the substrate 10. By repeating this, the coating device 123a draws a predetermined pattern on the substrate 10.

The board | substrate 10 by which drawing was completed is removed from the board | substrate holding part 151, and is carried out from the inside of the coating device 123a to the outside. Subsequently, the next board | substrate 10 is carried in from the exterior of the coating device 123a, and the coating device 123a draws the predetermined pattern on the board | substrate 10. FIG. In addition, the process which hold | maintains the function of the discharge unit 160 by the maintenance unit 170 is performed suitably, for example, after replacing the board | substrate 10. FIG.

In addition, the coating apparatus 123a may move the discharge unit 160 which discharges a droplet toward the board | substrate 10, and may move both the board | substrate holding part 151 and the discharge unit 160. FIG. That is, the coating device 123a should just be able to move the board | substrate holding part 151 and the discharge unit 160 relatively.

<Drawing pattern drawn by application device>

Next, the drawing pattern which the coating device 123a draws is demonstrated with reference to FIG. FIG. 10: is a top view which shows the drawing pattern which the coating device 123a which concerns on embodiment draws.

As shown in FIG. 10, the organic EL display 1 has, for example, a red light emitting area 261R, a green light emitting area 261G, and a blue light emitting area 261B for each pixel.

The red light emitting region 261R corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the red light emitting layer 26R. The green light emitting region 261G corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the green light emitting layer 26G. The blue light emitting region 261B corresponds to a region sandwiched between the anode 21 and the cathode 22 in the organic EL layer 23 having the blue light emitting layer 26B. Each of the light emitting regions 261R, 261G, and 261B emits light independently for each of the anodes 21, and the amount of light emitted is adjusted by the voltage between the anodes 21 and the cathodes 22.

The red light emitting region 261R, the green light emitting region 261G, and the blue light emitting region 261B are repeatedly arranged at intervals in this order along the X-axis direction, thereby forming the light emitting region group 262. In the organic EL display 1, the plurality of light emitting region groups 262 are arranged at intervals in the Y-axis direction. Therefore, in the organic EL display 1, a plurality of light emitting regions emitting light of the same color are arranged in the Y axis direction.

Each head 162 of the discharging unit 160 has nozzles so as to discharge the droplets of the same coating liquid toward the plurality of light emitting regions arranged at intervals in the Y-axis direction and emitting the same color. A plurality of 163 are arranged in the Y-axis direction. The some nozzle 163 provided in the same head 162 discharges the droplet of the same coating liquid.

The coating device 123a moves the discharge unit 160 and the substrate holding part 151 relatively in the X-axis direction, so that the bank 30 formed in advance in the substrate 10 held by the substrate holding part 151 is formed. Droplets are applied from the nozzle 163 toward the opening 31.

As shown in FIG. 10, the opening 31 of the bank 30 spans two light emitting regions adjacent to the Y-axis direction. For this reason, the tolerance of the impact position of the droplet of the coating liquid in the Y-axis direction can be alleviated.

Further, since the droplets of the coating liquid are discharged from the two nozzles 163 toward one opening 31, the variation in the total amount of the discharge amount can be suppressed by dispersing the error of the discharge amount of each nozzle 163. FIG. . Furthermore, the choice of the nozzle 163 which discharges a droplet toward one opening part 31 increases, and the nozzle 163 which has controllability of discharge amount can be selectively used. As a result, the thickness of the light emitting layer 26 can be made uniform.

<Drawing pattern according to the first modification>

Next, the drawing pattern which concerns on the 1st modified example in this embodiment is demonstrated with reference to FIG. It is a top view which shows the drawing pattern which concerns on the 1st modified example in embodiment.

The area ratio of the red light emitting area 261R, the green light emitting area 261G, and the blue light emitting area 261B is appropriately set in accordance with the respective light emission characteristics, light emission life, and the like. For example, the light emission efficiency is good, and the higher the light emission luminance per unit area is, the smaller the area is.

In FIG. 11, the area of the red light emitting area 261R is the smallest, the area of the green light emitting area 261G is the second smallest, and the area of the blue light emitting area 261B is largest. These light emitting regions 261R, 261G, and 261B have the same dimensions YR, YG, and YB in the Y-axis direction, but differ in dimensions XR, XG, and XB in the X-axis direction, respectively. Specifically, the dimension YR in the Y-axis direction of the red light emitting area 261R, the dimension YG in the Y-axis direction of the green light emitting area 261G, and the dimension YB in the Y-axis direction of the blue light emitting area 261B. ) Is the same. Further, the dimension XR in the X-axis direction of the red light-emitting region 261R is smaller than the dimension XG in the X-axis direction of the green light-emitting region 261G, and the dimension (X-axis) of the green light-emitting region 261G ( XG) is smaller than the dimension XB in the X-axis direction of the blue light emitting area 261B.

In the first modification, a plurality of red light emitting regions 261R, green light emitting regions 261G, and blue light emitting regions 261B are arranged so that two red light emitting regions 261R are adjacent along the X-axis direction. Specifically, the green light emitting area 261G, the blue light emitting area 261B, the red light emitting area 261R, the red light emitting area 261R, the green light emitting area 261G, and the blue light emitting area 261B are in this order. By repeating arrangement, one light emitting region group 262 is formed. In other words, the arrangement order of the red light emitting area 261R, the green light emitting area 261G, and the blue light emitting area 261B is reversed in two pixels adjacent to the X-axis direction.

In the first modification, the opening 31 of the bank 30 exposes two anodes 21 provided corresponding to two same-color subpixels adjacent to the Y-axis direction similarly to the above-described embodiment. Thereby, the tolerance of the impact position of the droplet of the coating liquid in the Y-axis direction can be alleviated.

In the first modification, the opening 31 of the bank 30 exposes the two anodes 21 provided corresponding to the two same color subpixels adjacent to the X-axis direction. Here, two anodes 21 corresponding to two red light emitting regions 261R adjacent to the X-axis direction are exposed. Thereby, it becomes easy to make a liquid drop reach | attain the red opening part 31R, moving the discharge unit 160 and the board | substrate holding part 151 relatively to an X-axis direction. For this reason, the tolerance of the impact position of the droplet of the coating liquid for the red light emitting area 261R in the X-axis direction can be alleviated. In addition, by connecting the red light emitting region 261R having the smallest dimension in the X-axis direction in the X-axis direction, the tolerance of the impact position of the droplet of the coating liquid in the X-axis direction can be effectively alleviated.

As described above, in the first modification, the opening 31 of the bank 30 is provided with four anodes 21 corresponding to four same color sub-pixels (here, red) adjacent to the Y-axis direction and the X-axis direction. ). Thereby, the tolerance of the impact position of the droplet of the coating liquid in a Y-axis direction and an X-axis direction can be alleviated. In addition, by connecting the red light emitting area 261R having the smallest area in the Y-axis direction and the X-axis direction, the tolerance of the impact position of the droplets of the coating liquid in the Y-axis direction and the X-axis direction can be effectively alleviated.

In the first modification, the organic EL display 1 is formed with one contact hole 50 for one opening 31, as in the above-described embodiment. Therefore, in the organic EL display 1 according to the first modification, one contact hole 50 is formed for four red light emitting regions 261R. In addition, in the organic EL display 1 according to the first modification, one contact hole 50 is formed for two green light emitting regions 261G, and one contact for two blue light emitting regions 261B. The hole 50 is formed.

Here, an example is shown in which one opening 31 exposes two anodes 21 provided corresponding to two same color subpixels adjacent to the X-axis direction. Not limited to this, the opening part 31 may expose the two anodes 21 provided corresponding to three or more subpixels of the same color adjacent to the X-axis direction.

Here, an example in which one opening 31 exposes four anodes 21 provided corresponding to four red light emitting regions 261R adjacent to the Y-axis direction and the X-axis direction is shown. The opening 31 may expose four anodes 21 provided corresponding to the four green light emitting regions 261G adjacent to the Y-axis direction and the X-axis direction. In this case, the light emitting region group 262 includes, for example, a red light emitting region 261R, a blue light emitting region 261B, a green light emitting region 261G, a green light emitting region 261G, a blue light emitting region 261B, and a red light emitting region. The region 261R may be formed by being repeatedly arranged in this order.

Similarly, the opening 31 may expose four anodes 21 provided corresponding to the four blue light emitting regions 261B adjacent to the Y-axis direction and the X-axis direction. In this case, the light emitting region group 262 is, for example, similar to FIG. 11, for example, the green light emitting region 261G, the blue light emitting region 261B, the red light emitting region 261R, the red light emitting region 261R, and the green light emitting region ( 261G) and the blue light emitting region 261B may be formed by being repeatedly arranged in this order.

In the first modification, the light emitting regions are connected in both directions in the Y-axis direction and the X-axis direction. However, the opening 31 may connect the light-emitting regions only in the X-axis direction. That is, the opening part 31 may expose only the two anodes 21 provided corresponding to the two subpixels of the same color adjacent to the X-axis direction.

<Drawing pattern according to the second modification>

It is a top view which shows the drawing pattern which concerns on the 2nd modified example in embodiment. As shown in FIG. 12, the organic electroluminescent display 1 which concerns on 2nd modified example exposes the opening part 31 which exposes the some anode 21 provided corresponding to the some subpixel of the same color adjacent to the Y-axis direction. Has For example, the opening part 31 which concerns on a 2nd modification exposes each part of all the anodes 21 arrange | positioned in the Y-axis direction. In other words, the opening part 31 which concerns on a 2nd modified example is located in the Y-axis negative direction side from the anode 21 which is located in the most Y-axis positive direction side among the some anodes 21 arranged in the Y-axis direction. Is formed over the anode 21.

In the second modification, the contact hole 50 is formed in an area between two opening portions 31 adjacent to the X axis direction. As in the second modification, when the opening 31 is long in the Y-axis direction, it is assumed that the contact hole 50 is formed at a position adjacent to the opening 31 and the Y-axis direction. On the other hand, there is a possibility that it becomes difficult to form a sufficient number of contact holes 50.

Therefore, in the second modification, the contact hole 50 is formed in the region between the two opening portions 31 adjacent to the X axis direction. Thereby, even when the opening part 31 elongate in a Y-axis direction is formed in the organic electroluminescent display 1, the contact hole 50 of a suitable number can be formed in the organic electroluminescence display 1. As shown in FIG.

Here, in the area | region between two opening parts 31 adjacent to an X-axis direction, it may be difficult to ensure the dimension of the X-axis direction required in order to form the contact hole 50. FIG.

12, only the area | region in which the contact hole 50 is formed among the area | region between two opening parts 31 adjacent to an X-axis direction may be partially extended in the X-axis direction. In other words, the opening part 31 has the dimensions XR1, XG1, and XB1 in the X-axis direction in the portion adjacent to the contact hole 50, and the dimensions XR2, XG2, and XB2 in the X-axis direction in the other portions. It may be formed narrower than). By doing in this way, the space for forming the contact hole 50 can be ensured, without widening the space | interval of opening part 31 comrades in an X-axis direction.

As in the second modification, when the area where the contact hole 50 is formed is widened in the X-axis direction, the dimensions XR1, XG1, and XB1 of the opening 31 in the portion adjacent to the contact hole 50 are ) Is preferably formed larger than the diameter of the discharge port of the nozzle 163. By forming in this way, it can suppress that the droplet of the coating liquid discharged from the nozzle 163 protrudes from the opening part 31, and enters the contact hole 50. FIG.

Here, an example is shown in which one contact hole 50 is formed for two subpixels of the same color. It is not limited to this, The contact hole 50 may be formed for every three or more subpixels of the same color.

<Drawing pattern according to the third modification>

It is a top view which shows the drawing pattern which concerns on the 3rd modified example in embodiment. In the third modification, the contact hole 50 may be provided for each subpixel of a plurality of adjacent different colors. For example, in the organic EL display 1 shown in FIG. 13, the contact hole 50 is provided for each of the three subpixels constituting one pixel, the red subpixel, the green subpixel, and the blue subpixel. In other words, one contact hole 50 is provided for each pixel.

Here, the gap between the opening 31 of the green light emitting area 261G and the opening 31 of the blue light emitting area 261B is the opening 31 of the red light emitting area 261R and the opening of the green light emitting area 261G ( It is formed wider than the interval of 31). For this reason, it is preferable to form the contact hole 50 in the area between the opening part 31 of the green light emitting area 261G, and the opening part 31 of the blue light emitting area 261B. In addition, the contact hole 50 may be formed in the area | region between two pixels adjacent to a Y-axis direction, for example, and may be formed in the area | region between two pixels adjacent to a X-axis direction. The contact hole 50 may be provided for each of a plurality of adjacent pixels.

In addition, the contact hole 50 is not limited to a pixel unit (every three subpixels of red, blue, and green), and may be provided for every two subpixels of adjacent different colors, and adjacent to each other containing different colors. You may provide for every four subpixels. Adjacent directions are not limited to up, down, left and right, and may be oblique. In addition, the contact hole 50 may be provided for every 2 or more subpixels which are not adjacent. In this way, the contact hole 50 may be provided in a plurality of arbitrary subpixel units.

Although the organic EL display 1 without pixel connection has been described here as an example, the organic EL display 1 is formed in a plurality of light emitting regions of the same color adjacent to the Y-axis direction as shown in, for example, FIGS. 10 and 12. You may have the opening part 31 over.

As mentioned above, the coating device 123a which concerns on embodiment contains the board | substrate holding part 151, the discharge unit 160, and the moving mechanism 152. As shown in FIG. The substrate holding unit 151 holds the substrate 10. The discharge unit 160 includes a plurality of heads 162 in which a plurality of nozzles 163 are arranged in a first direction (for example, in the Y-axis direction). The movement mechanism 152 relatively moves the discharge unit 160 and the substrate holding part 151 along a second direction (for example, the X-axis direction) that intersects the first direction. The substrate 10 includes a plurality of pixel electrodes (for example, an anode 21) provided corresponding to the plurality of subpixels, and an opening 31 covering the plurality of pixel electrodes and exposing at least one pixel electrode. The bank 30 includes a plurality of banks 30 and a plurality of contact holes 50 for electrically connecting the counter electrodes facing the plurality of pixel electrodes with the auxiliary electrode 51. The contact hole 50 is provided for every two or more subpixels. The discharge unit 160 discharges the droplet of the organic material from the nozzle 163 toward the opening portion 31 of the substrate 10 held by the substrate holding unit 151.

Therefore, according to the coating device 123a which concerns on embodiment, the organic electroluminescent display 1 by which the number of the contact holes 50 for the auxiliary electrode 51 was optimized can be provided.

The opening 31 may expose two or more pixel electrodes provided corresponding to two or more adjacent subpixels of the same color. In this case, the contact hole 50 may be provided for every two or more sub-pixels of the same color corresponding to two or more pixel electrodes exposed by the opening part 31.

By forming the openings 31 for impacting the droplets of the organic material not on each of the subpixels but on each of the two adjacent subpixels of the same color, the tolerance of the impact position of the droplets can be alleviated. In addition, the contact hole 50 is disturbed when the pixel connection is made by providing the contact hole 50 for each of two or more subpixels of the same color corresponding to the two or more pixel electrodes exposed by the opening 31. There is no

The opening part 31 may expose two or more pixel electrodes provided corresponding to two or more same color subpixels adjacent to the first direction. Thereby, the tolerance of the impact position of the droplet of the organic material in a 1st direction can be alleviated.

The opening part 31 may expose two pixel electrodes provided corresponding to two same color subpixels adjacent to the second direction. Thereby, the tolerance of the impact position of the droplet of the organic material in a 2nd direction can be alleviated.

The opening part 31 may expose four or more pixel electrodes provided corresponding to four or more subpixels of the same color adjacent to the first direction and the second direction. Thereby, the tolerance of the impact position of the droplet of the organic material in a 1st direction and a 2nd direction can be alleviated.

The contact hole 50 may be formed in the area | region between two opening parts 31 adjacent to a 1st direction. Thereby, the contact hole 50 is not disturbed in performing pixel connection.

The contact hole 50 may be formed in the area | region between two opening parts 31 adjacent to a 2nd direction. Even when the openings 31 elongated in the Y-axis direction are formed in the organic EL display 1, an appropriate number of contact holes 50 can be formed in the organic EL display 1.

The opening part 31 may be formed so that the dimension of the 2nd direction in the part adjacent to the contact hole 50 may be narrower than the dimension of the 2nd direction in another part. Thereby, the space for forming the contact hole 50 can be ensured, without widening the space | interval of opening part 31 comrades in a 2nd direction.

It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. Indeed, the above-described embodiments may be implemented in various forms. In addition, the said embodiment may be omitted, substituted, and changed in various forms, without deviating from the attached Claim and its meaning.

For example, the combination of emission colors is not limited to the three primary colors of red, green, and blue. In addition to the three primary colors of red, green, and blue, at least one of yellow and green and cyan, which are intermediate colors of green and blue, may be used for the combination of emission colors.

In the above-mentioned embodiment and each modification, the organic EL display 1 of the lower emission system which takes out the light from the light emitting layer 26 from the board | substrate 10 side was mentioned as an example. The organic EL display 1 is not limited to this, and may be a top emission system that extracts light from the light emitting layer 26 from the side opposite to the substrate 10.

In the case of a top emission system, the board | substrate 10 does not necessarily need to be a transparent substrate. In the case of the top emission system, the anode 21 serving as the transparent electrode is used as the counter electrode, and the cathode 22 is used as the pixel electrode provided for each unit circuit 11. In this case, since the arrangement of the anode 21 and the cathode 22 is reversed, the electron injection layer 28, the electron transport layer 27, the light emitting layer 26, the hole transport layer 25, and The hole injection layer 24 is formed in this order.

In the above-described embodiment and each modification, the organic EL layer 23 includes a hole injection layer 24, a hole transport layer 25, a light emitting layer 26, an electron transport layer 27, and an electron injection layer 28. Although the example of the case was demonstrated, the organic EL layer 23 should just have the light emitting layer 26 at least.

Claims (13)

A substrate holding part for holding a substrate,
A discharge unit including a plurality of heads provided with a plurality of nozzles arranged in a first direction;
A moving mechanism for relatively moving the discharge unit and the substrate holding part along a second direction crossing the first direction,
The substrate,
A plurality of pixel electrodes provided corresponding to a plurality of subpixels, a bank formed with a plurality of openings covering the plurality of pixel electrodes and exposing at least one pixel electrode, and the plurality of pixel electrodes A plurality of contact holes for electrically connecting an opposite electrode facing the pixel electrode of the auxiliary electrode;
The contact hole is provided for each of two or more subpixels,
And the discharge unit discharges droplets of organic materials from the nozzle toward the opening of the substrate held in the substrate holding portion. The method of claim 1,
The said contact hole is a coating apparatus provided with every two or more subpixels of the same color. The method of claim 2,
The openings expose two or more pixel electrodes provided corresponding to the two or more adjacent subpixels of the same color,
The said contact hole is a coating apparatus provided with every 2 or more said subpixels of the same color corresponding to 2 or more said pixel electrodes exposed by the said opening part. The method of claim 3,
And the opening portion exposes the two or more pixel electrodes provided corresponding to the two or more sub-pixels of the same color adjacent to the first direction. The method of claim 3,
And the opening portion exposes the two pixel electrodes provided corresponding to the two sub-pixels of the same color adjacent to the second direction. The method of claim 3,
And the opening portion exposes the four or more pixel electrodes provided corresponding to the four or more same color subpixels adjacent to the first direction and the second direction. The method according to any one of claims 3 to 6,
The said contact hole is formed in the area | region between two said opening parts adjacent to a said 1st direction. The method according to any one of claims 3 to 6,
The said contact hole is a coating apparatus formed in the area | region between two said opening parts adjacent to the said 2nd direction. The method of claim 8,
The said opening part is a coating apparatus in which the dimension of the said 2nd direction in the part adjacent to the said contact hole is formed narrower than the dimension of the said 2nd direction in the other part. The method of claim 1,
And the contact hole is provided for each of two or more different subpixels. The method of claim 10,
And one contact hole is provided for at least one pixel. A bank including a plurality of pixel electrodes provided corresponding to the plurality of subpixels, a plurality of banks covering the plurality of pixel electrodes and exposing at least one pixel electrode, and an opposite electrode facing the plurality of pixel electrodes; A holding step of holding the substrate including the plurality of contact holes for connecting with the auxiliary electrode by using the substrate holding part;
A discharging unit including a plurality of heads provided with a plurality of nozzles arranged in a first direction, and a movement step of moving the substrate holding part relatively in a second direction crossing the first direction;
A discharge step of discharging droplets of organic materials from the nozzle toward the opening of the substrate held in the substrate holding part;
And said contact hole is provided for every two or more said subpixels. A plurality of pixel electrodes provided on the substrate corresponding to the plurality of subpixels;
A bank covering the plurality of pixel electrodes and having a plurality of openings exposing at least one pixel electrode;
An opposite electrode facing the plurality of pixel electrodes;
An organic EL layer provided between the pixel electrode and the counter electrode in the opening;
With an auxiliary electrode,
A plurality of contact holes for connecting the counter electrode with the auxiliary electrode,
And said contact hole is provided for each of two or more said subpixels.

Images