TW202004161A - Film peeling monitoring system for electronic substrate - Google Patents

Abstract

The invention relates to a device and method for monitoring whether protective film for semiconductor substrate is peeled off or not. The monitoring device comprises light-emitting device, polarizer, phase retarder, PCB substrate, light-receiving device, and control unit. The light-emitting device, polarizer, and phase retarder are configured in the forward direction. The light polarized by the polarizer is projected to the inspection object PCB substrate through the phase retarder. The PCB substrate is positioned in front of the phase retarder to reflect incident circular polarized light or elliptical polarized light. The reflected light traveling backward after the reflection of the PCB substrate sequentially passes through the phase retarder and the polarizer. The light-receiving device behind the polarizer condenses the reflected light and transforms the reflected light into an electric signal, and the control unit judges whether or not a film is attached to the surface of the PCB substrate. The method solves the problem of the existing confirmation method with visual or non-polarized image to determine whether the film is peeled off, and can automatically and quickly determine whether the film is peeled off or whether there is a residual part.

Description

Device and method for monitoring whether protective film peeled off for semiconductor substrate

The invention relates to a device and method for monitoring whether a protective film for a semiconductor substrate is peeled or not.

Authorized patent No. 10-1119571 (automatic protective film peeling machine and film peeling method for semiconductor printed circuit boards) provides an automatic protective film peeling machine for semiconductor printed circuit boards, which includes: a loader, which will be attached to the upper and lower surfaces The substrate of the film is loaded on the table; the aligner aligns the substrate on the table; the scraper, which forms upper and lower scratches on the edge of one side of the film (the side in which the substrate travels), on the substrate and A gap is formed between the films; the upper carrier, which adsorbs the upper part of the substrate on the table, is configured to reciprocate according to the first reciprocating distance; the lower tape unit, which attaches the first adhesive tape to the lower part where the scratches are formed On one side of the film, the upper carrier moves the substrate to one side, or the lower belt unit moves to the other side to peel off the lower film; the lower carrier, which receives the substrate from which the lower film has been peeled off, is transferred from the upper carrier and Holding, constituted to reciprocate by a second reciprocating distance; upper belt unit, which attaches the second adhesive tape to the side of the upper film where the scratch portion is formed, the lower carrier moves the substrate to the side, or the upper belt The unit moves to the other side and peels off the upper film.

Granted Patent No. 10-1837443 (Owner: Same as the applicant of the present invention) discloses "a system for confirming the peeling of a protective film for a semiconductor substrate using a video camera and the peeling of a protective film for a semiconductor substrate using a video camera The image processing algorithm used in the confirmation system includes: a video camera 10 that illuminates the peeled substrate to obtain an image; an image processing unit 20 that executes to confirm whether the film remains in the image obtained by the video camera 10 An image processing algorithm that distinguishes between the substrate and the film; the control unit 30, based on the processing result of the image processing unit 20, controls the automatic film peeling device or warns the operator or the administrator."

As mentioned above, there is a need for a device or method to confirm whether the film is completely peeled off by the automatic film peeling device. The applicant's several test results have shown that in the case of non-polarized image analysis, there are problems caused by misperception and non-perception . This has become a factor that affects mass production and reduces equipment reliability. Therefore, there is a need for a system that accurately judges whether the stripping is performed correctly.

After the applicant developed an automatic film peeling device a few years ago and commercialized it successfully, for several years, it tried to develop a device for judging whether there is a residual film that can be applied on-site, but there were obstacles in technical development and on-site applicability, and finally the on-site application was finally developed. This system has excellent performance, minimal difference error and uncomplicated device configuration.

The present invention aims to provide a device and method for monitoring the peeling of a protective film for a semiconductor substrate, which can solve the problem of confirming the peeling of a film by visual inspection or non-polarized image analysis in the past, and automatically and accurately determine the peeling of a film or not Whether part of the film remains.

The present invention aims to provide a device and method for monitoring the peeling of a protective film for a semiconductor substrate, which uses the birefringence phenomenon caused by the residual film after circular polarized light is incident to amplify the difference in the light receiving characteristics (difference in light intensity) of the reflected light with or without the film Using a light sensor, with a small amount of data processing, quickly determine whether the film in a given area remains.

The present invention aims to provide a device and method for monitoring the peeling of a protective film for a semiconductor substrate, which does not perform conventional precision image analysis and the like, but only uses the photodiode signal and the discriminator based on the difference in the intensity of the amplified light. It is possible to accurately determine whether the film in the inspection area is left. Therefore, compared with excellent performance, the device can be embodied with simple and relatively low-cost components, so the semiconductor production line has excellent field applicability, productivity, and commerciality.

A monitoring device for peeling of a protective film for a semiconductor substrate of the present invention includes:

Light emitting device, polarizer, phase retarder, PCB substrate, light receiving device and control section,

The light emitting device, the polarizer, and the phase retarder are sequentially arranged in the forward direction, and the polarized light passing through the polarizer passes through the phase retarder and is projected onto the PCB substrate to be inspected.

The PCB substrate is located in front of the phase retarder and reflects the incident circularly polarized light or elliptically polarized light.

The reflected light traveling backwards after being reflected by the PCB substrate passes through the phase retarder and the polarizer in turn. The light receiving device behind the polarizer condenses the reflected light and converts it into an electrical signal.

The control unit uses the electrical signal related to the light intensity generated by the light receiving device to determine whether a film is attached to the surface of the PCB substrate.

A device for monitoring the peeling of protective film for semiconductor substrate, including:

The light-emitting device, which emits the first light (without polarized light) and advances it;

A polarizer, which is located in front of the light-emitting device at a distance, and converts the first light of the light-emitting device that is advancing forward into second linearly polarized light;

A quarter wave plate (Quarter wave plate), which is adjacent to the front of the polarizer, converts the second linearly polarized light transmitted forward into third circular polarized light or elliptical polarized light;

An optical lens that condenses the light that hits the surface of the PCB substrate that is the object of film adhesion judgment and reflects through the 1/4λ wavelength plate and polarizer in reverse order after being reflected;

A light sensor, which receives the light passing through the optical lens, generates an electrical signal related to the light and transmits it to the control section;

The control unit uses the light-related electrical signals transmitted from the photo sensor to calculate the intensity value of the light, and uses the calculated intensity value of the light to determine whether the film adheres to the surface of the PCB substrate to be inspected (film peeling or not).

In the device for monitoring the peeling of a protective film for a semiconductor substrate of the present invention, it is preferable that the first light emitted by the light emitting device passes through the polarizer and the 1/4λ wavelength plate (Quarter wave plate) in the positive direction in sequence and encounters the film adhesion and No. After judging the surface of the PCB substrate of the object and reflecting it, reversely pass through the 1/4λ wavelength plate and polarizer in turn, and the polarized light blocking effect (reflected light removal effect) occurs,

When there is no film on the surface of the PCB substrate to be inspected (compared with a film), the degree of refraction or birefringence is small, the polarization blocking effect is large, and the intensity of light reaching the lens is weak (dark),

When there is a film on the surface of the PCB substrate to be inspected (compared to no film), the degree of refraction or birefringence is large, the polarization blocking effect is small, and the intensity of light reaching the lens is relatively large (bright),

The control part uses the light-related electrical signals transmitted from the light sensor to calculate the light intensity value, compares the calculated light intensity value with the light intensity related comparison value, and determines whether the film is attached to the PCB substrate surface (film peeling and no).

A monitoring method for peeling of protective film for semiconductor substrate, which includes:

Emit the first light from the light-emitting device and make the previous steps;

The step of the light of the light-emitting device is forward, and is converted into the second linear polarized light through the polarizer;

The step of forwarding the second linearly polarized light through the 1/4λ wavelength plate to become third circularly polarized light or elliptically polarized light;

The step of retro-reflecting the fourth reflected light when the third circularly polarized light or elliptically polarized light hits the surface of the PCB substrate that is the object of film adhesion determination;

The fourth reflected light reversely transmits through the 1/4λ wavelength plate to become the fifth reflection-intermediate wave step;

The step of transforming the fifth reflection-intermediate wave through the polarizer into a fifth reflection-reception wave;

The fifth reflection-received light wave passes through the optical lens and reaches the light sensor, and the light sensor generates an electrical signal related to the arriving light and transmits it to the light receiving and transmission steps of the control section;

The control unit uses the light-related electrical signals transmitted from the light sensor to calculate the light intensity value, compares the calculated light intensity value with the comparison value related to the light intensity, and determines whether the film is attached to the PCB substrate surface .

The beneficial effects of the present invention are: According to the present invention, there is provided a device and method for monitoring the peeling of a protective film for a semiconductor substrate, which can solve the problem of confirming the peeling of a film by visual inspection or non-polarized image analysis in the past, accurately and quickly automatically Determine whether the film peels off or whether a part of the film remains.

In addition, a device and method for monitoring the peeling of a protective film for a semiconductor substrate is provided, which can use the birefringence phenomenon caused by the residual film after the circular polarized light is incident to amplify the difference in the light receiving characteristics (difference in light intensity) of the reflected light with or without the film. Using a light sensor, with a small amount of data processing, quickly determine whether the film in a given area remains.

In addition, a device and method for monitoring the peeling of a protective film for a semiconductor substrate are provided, which does not perform conventional precision image analysis and the like, but can accurately use only the photodiode signal and the discriminator based on the difference in the intensity of the amplified light It is possible to distinguish whether the film remains in the inspection area, so that the device can be embodied with simple and relatively low-cost constituent elements compared to excellent performance, so the semiconductor production line has excellent field applicability, productivity, and commerciality.

Hereinafter, a device and method for monitoring whether a protective film for a semiconductor substrate is peeled or not will be described in detail with reference to the drawings.

In the present invention, the term "polarization blocking effect" refers to the fact that the linearly polarized light transmitted through the polarizer (linear polarizer or linear polarizer) is transmitted forward through the 1/4λ wavelength plate retarder, and then reversely transmitted after being reflected by the substrate Polarization blocking effect (reflected light removal effect, for example, when it is P polarized light, when the substrate is reflected and then reversely transmitted, the main S polarized light and the vibration direction of the radio wave are changed by 90°, and most of the reflected light cannot be transmitted through the polarizer again. The blocking effect is shown in Figure 1. In the present invention, the polarizer refers to a linear or linear polarizer.

A quarter-wave plate refers to a birefringent plate of a predetermined thickness that causes a 1/4-wavelength optical path difference between linearly polarized lights that vibrate in mutually perpendicular directions. If linearly polarized light is put in, the transmitted light becomes circularly polarized light.

The first and second embodiments share, as shown in FIGS. 1 to 3, the device for monitoring the peeling of a protective film for a semiconductor substrate of the present invention includes:

The light emitting device 10, the polarizer 20, the phase retarder (for example, a 1/4λ wavelength plate is used), the PCB substrate T, the light receiving device 450, and the control unit 60,

The light emitting device 10, the polarizer 20, and the phase retarder 30 are sequentially arranged in the forward direction, and the polarized light passing through the polarizer passes through the phase retarder and is projected onto the inspection target PCB substrate T,

The PCB substrate T is located in front of the phase retarder, and reflects the incident circularly polarized light or elliptically polarized light.

In addition, the reflected light that travels backward after being reflected by the PCB substrate passes through the phase retarder and the polarizer in turn. The light receiving device 450 located behind (reverse) the polarizer 20 condenses the reflected light and converts it into an electrical signal. The control unit 60 uses the received light The electrical signal related to the light intensity generated by the device 450 determines whether a film is attached to the surface of the PCB substrate T (whether the film is peeled or not).

As shown in FIGS. 1 to 3, the device for monitoring the peeling of a protective film for a semiconductor substrate of the present invention includes: a light emitting device 10 that emits first light L1 (unpolarized light) and advances it; a polarizer 20, which It is located in front of the light-emitting device 10 at a distance, so that the first light L1 of the light-emitting device 10 moving forward is converted into second linearly polarized light L2; the 1/4λ wavelength plate 30 is adjacent to the front of the polarizer 20, The second linearly polarized light L2 transmitted in the forward direction is converted into third circularly polarized light L3 or elliptically polarized light.

In addition, it further includes: an optical lens 40 that condenses the light that hits the surface of the PCB substrate T that is the object of film adhesion determination after being reflected and then reversely sequentially passes through the 1/4λ wavelength plate 30 and the polarizer 20;

The photo sensor 50 receives the light transmitted through the optical lens 40, generates an electric signal related to the light, and transmits it to the control unit 60.

The control unit 60 calculates the light intensity value V_1 using the light-related electrical signals transmitted from the photo sensor 50, compares the calculated light intensity value with the pre-stored light intensity-related reference value V_0, and determines that the film is on the PCB substrate Whether the surface of T is attached or not (film peeling or not).

Among them, the first light L1 emitted by the light emitting device 10 passes through the polarizer 20 and the quarter wave plate (Quarter wave plate) 30 in the forward direction, and then hits the surface of the PCB substrate T that is the object of film adhesion judgment and is reflected. The quarter wave plate (Quarter wave plate) 30 and the polarizer 20 are reversely transmitted in this order, and a polarization blocking effect (reflected light removal effect) occurs. When there is no film on the surface of the PCB substrate T to be inspected (compared with a film), the degree of refraction or birefringence is small, the polarization blocking effect is large, and the intensity of light reaching the lens is weak (dark). When there is a film on the surface of the inspection target PCB substrate T (compared to no film), the degree of refraction or birefringence is large, the polarization blocking effect is small, and the intensity of light reaching the lens behaves relatively (compared to the case without film) Large (bright).

In the first embodiment of the present invention, the control unit 60 calculates the light intensity value V_1 by using the light-related electrical signal transmitted from the light sensor 50, and compares the calculated light intensity value with the light intensity-related comparison value V_0 (for example In order to reduce the judgment error, the light intensity value measured when there is no film is added to the value obtained by adding a predetermined value) to compare and judge whether the film adheres to the surface of the PCB substrate T (film peeling or not).

Among them, the light intensity-related comparison value V_0 may be, for example, a value obtained by adding a predetermined value to the light intensity value measured when there is no film to reduce the judgment error, or a pre-stored experiment based on repeated unpolarized and polarized incident projection experiments The value judged as having a film based on experience and experience refers to the value entered in the discriminating program or stored in the memory in advance before real-time measurement.

As shown in FIG. 2, the preferred photo sensor 50 is a photo sensor or a photodiode. The device for monitoring the peeling of a protective film for a semiconductor substrate of the present invention further includes: a rear case 110, which is formed of plastic resin; a front case 150, which is formed of plastic resin and is bonded to the front of the rear case 110; a fixing port 130, which Located in the middle of the inner cavity formed by the rear case 110 and the front case 150.

The light emitting device 10, the optical lens 40, and the light sensor 50 are located between the back of the fixed port 130 and the rear case 110; the polarizer 20 and the 1/4λ wavelength plate 30 are located in front of the fixed port 130 and the front case 150 The light-emitting device 10 is located in front of the rear case 110, and the light sensor 50 and the optical lens 40 of the light-receiving device 450 are sequentially arranged in a positive direction.

A glass cover 140 is fixed to the front of the fixing portion 130, and a polarizer 20 and a quarter wave plate (Quarter wave plate) 30 are fixed to the front of the glass cover 140 in sequence; the LED-type light emitting device 10 and the photo sensor 50 are The control unit 60 is electrically connected by a wired or wireless method.

As shown in FIG. 2, the fixed port 130 includes a light-emitting opening 131 formed at a position corresponding to the light-emitting device 10, and a light-receiving opening 133 formed at a position corresponding to the optical lens 40. The case 150 includes a third opening 153 through which the light of the light emitting device 10 and the reflected light for light reception pass. The front case 150 and the rear case 110 are combined to form a movable inspection body B, which is connected to the displacement The device (forward and backward and/or lifting device) can be displaced in the three-dimensional space according to an instruction of the control unit 60 formed integrally or independently with the movable inspection body B.

In the device for monitoring the peeling of a protective film for a semiconductor substrate according to the first and second embodiments of the present invention, the light emitting device 10, the polarizer 20, the 1/4λ wavelength plate 30, the optical lens 40, and the photo sensor 50 are built in In the space formed by the front case 150 and the rear case 110, a movable inspection body B is constituted, and the inspection body B is connected to the displacement device so as to be able to be formed integrally or independently with the control unit 60 that is movable with the inspection body B In the three-dimensional space, the photo sensor 50 is a photo sensor or a photodiode, and the distance between the front of the inspection body B and the inspection area of the PCB substrate T of the inspection object is 0.1 to 10 cm . With the method of the present invention, it is possible to accurately determine whether the film remains at a short distance.

The method for monitoring the peeling of a protective film for a semiconductor substrate according to the first embodiment of the present invention includes: emitting the first light (non-polarized light) L1 from the light emitting device 10 and making the previous step S10; the light of the light emitting device 10 is forward, Step S20 of converting the second linearly polarized light L2 through the polarizer 20; the second linearly polarized light L2 is forwardly transmitted through a quarter wave plate (Quarter wave plate) 30 to become the third circular polarized light L3 or elliptically polarized light S30; Step S40 where the third circularly polarized light L3 or elliptically polarized light hits the surface of the PCB substrate T that is the object of film adhesion determination, and the fourth reflected light L4 is retroreflected.

Then execute: Step S50 where the fourth reflected light L4 reversely transmits through a quarter wave plate (Quarter wave plate) to become the fifth reflection-intermediate wave L5; the fifth reflection-intermediate wave L5 passes through the polarizer and is converted into the fifth Step S60 of the reflected-received wave L6; the fifth reflected-received wave L6 passes through the optical lens 40 to reach the photo sensor 50, and the photo sensor 50 generates an electric signal related to the arriving light and transmits it to the control unit 60 The light receiving and transmitting step S70.

Finally, the control unit 60 calculates the light intensity value V_1 using the light-related electrical signals transmitted from the light sensor 50, compares the calculated light intensity value with the pre-stored light intensity-related reference value V_0, and determines that the film is on the PCB Whether or not the surface of the substrate T is adhered (film peeled or not) S80.

Second embodiment

As shown in FIGS. 3 and 4, compared with the first embodiment, the device for monitoring the peeling of a protective film for a semiconductor substrate according to a second embodiment of the present invention further includes irradiating incident polarized light to the PCB substrate to be inspected Of the second light-emitting device 12, the control unit 60 uses the light-related electrical signals transmitted from the light sensor 50 to calculate the intensity value of the light, and the control unit 60 compares the intensity value V_1 of the received light from the polarized incident light with the incidence The intensity value V_2 of the received light of light (incident light that does not pass through the polarizer at the time of incidence), when the difference value exceeds the critical value, it is determined that there is a film remaining on the surface of the PCB substrate T.

As shown in FIG. 3, the device for monitoring the peeling of a protective film for a semiconductor substrate according to a second embodiment of the invention further includes: a second light emitting device 12 for radiating unpolarized incident light to the PCB substrate to be inspected;

The rear case 110, which is formed of plastic resin; the front case 150, which is formed of plastic resin and is combined with the front of the rear case 110; the fixing port 130, which is located in the middle of the inner cavity formed by the rear case 110 and the front case 150 .

The light emitting device 10, the optical lens 40, and the light sensor 50 are located between the back of the fixed port 130 and the rear case 110; the polarizer 20 and the quarter wave plate (Quarter wave plate) 30 are located at the fixed port 130 Between the front and the front case 150; the light-emitting device 10 is located in front of the rear case 110, and the light sensor 50 and the optical lens 40 constituting the light-receiving device 450 are sequentially arranged in the forward direction.

A glass cover 140 is fixed to the front of the fixing port 130, and a polarizer 20 and a quarter wave plate (Quarter wave plate) 30 are fixed in front of the glass cover 140; the light emitting device 10 and the light sensor 50 are wired or wireless Mode, and is electrically connected to the control unit 60.

Slightly different from the first embodiment, in which the first light emitted by the light-emitting device 10 passes through the light-emitting opening 131 and the polarizer 20 during incidence, but the light emitted by the second light-emitting device 12 passes through the first In the three openings 135, the polarizer 20 does not exist in the front-back direction of the third opening 135. Therefore, the polarizer 20 does not pass through the polarizer 20, but enters the inspection target PCB substrate in a non-polarized state.

As shown in FIGS. 3 and 4, the method for monitoring the peeling of a protective film for a semiconductor substrate according to a second embodiment of the present invention includes: emitting a first unpolarized light from a first light emitting device and advancing it through the polarizer 20 and Step S110 of transforming into second linearly polarized light L2; the second linearly polarized light is transmitted through a quarter wave plate (Quarter wave plate) 30 in the forward direction to become circularly polarized light or elliptical polarized light S120; the third circularly polarized light or elliptical polarized light Step S130 in which the surface of the PCB substrate T that is the object of film adhesion determination is reflected retroreflectively, and transmits through the 1/4λ wavelength plate 30 and the polarizer 20.

Then, the reflected light transmitted through the quarter wave plate (Quarter wave plate) 30 and the polarizer 20 passes through the optical lens 40 to reach the photo sensor 50 which generates telecommunications related to the arriving light The reflected light derived from polarized light and transmitted to the control unit 60 is received in step S140.

On this basis, the second unpolarized light is emitted from the second light-emitting device and is advanced, and the non-polarized light reflection step S150 that does not pass through the polarizer and hits the surface of the inspection target PCB substrate T and retroreflects; reflects from the PCB substrate The light of the unpolarized reflected light passes through the optical lens and reaches the photo sensor. The photo sensor generates an electrical signal related to the arriving light and transmits it to the control unit 60. The reflected light from the unpolarized light is received in step S160.

Finally, the control unit 60 receives the electrical signal transmitted in step S140 and calculates the corresponding light intensity value V_1, the control unit 60 receives the electrical signal transmitted in step S160 and calculates the corresponding light intensity value V_2, the control unit Step 60: Find the difference between the two light intensity values; when the difference exceeds the critical value, it is determined that there is a film remaining on the surface of the PCB substrate T in step S170.

The present invention has described the above-mentioned preferred embodiments, but the scope of the present invention is not limited to such embodiments. The scope of the present invention is determined by the scope of the following patent applications, including plural modifications and Deformed.

It should be pointed out that the component symbols described in the following patent applications are only used to assist in the understanding of the invention, and do not affect the interpretation of the scope of rights, and the scope of rights should not be narrowly interpreted based on the component symbols described.

10‧‧‧Lighting device 12‧‧‧Second light emitting device 20‧‧‧Polarizer 30‧‧‧1/4λ wavelength plate 40‧‧‧Optical lens 50‧‧‧Photosensor 60‧‧‧Control unit 110 ‧‧‧Rear case 130‧‧‧Fixed port 131‧‧‧Lighting opening 133‧‧‧Light receiving opening 135‧‧‧ Third opening 140‧‧‧Glass cover 150‧‧‧Front case 153‧‧ ‧Third opening 450 through which reflected light passes through

FIG. 1 is a schematic diagram illustrating the polarization blocking effect of the present invention.

Fig. 2 is a configuration diagram of a device for monitoring the peeling of a protective film for a semiconductor substrate according to a first embodiment of the present invention.

Fig. 3 is a configuration diagram of a device for monitoring the peeling of a protective film for a semiconductor substrate according to a second embodiment of the present invention.

FIG. 4 is a flowchart of a method for monitoring the peeling of a protective film for a semiconductor substrate according to a second embodiment of the present invention.

10‧‧‧Lighting device

20‧‧‧ Polarizer

30‧‧‧1/4λ wavelength plate

40‧‧‧Optical lens

50‧‧‧Light sensor

60‧‧‧Control Department

110‧‧‧back shell

130‧‧‧ Fixed mouth

131‧‧‧Lighting opening

133‧‧‧Light-receiving opening

140‧‧‧glass cover

150‧‧‧Front shell

153‧‧‧The third opening through which reflected light passes through

450‧‧‧Receiving device

Claims (11)

A monitoring device for peeling of a protective film for a semiconductor substrate, comprising: a light emitting device (10), a polarizer (20), a phase retarder (30), a PCB substrate (T), and a light receiving device (450) And a control unit (60), the light-emitting device (10), the polarizer (20), and the phase retarder (30) are sequentially arranged in the forward direction, and the polarized light passing through the polarizer passes through the phase retarder and is projected onto the inspection object The PCB substrate (T), which is located in front of the phase retarder, reflects the incident circularly polarized light or elliptically polarized light, and the reflected light traveling backwards after the PCB substrate passes through the phase retarder in turn And the polarizer, the light receiving device (450) located behind the polarizer (20) condenses the reflected light and converts it into an electrical signal, and the control unit (60) uses the light generated by the light receiving device (450) The strength-related electrical signal determines whether a film is attached to the surface of the PCB substrate (T). A monitoring device for peeling of a protective film for a semiconductor substrate, comprising: a light emitting device (10) which emits a first light (L1) and advances; a polarizer (20) which is spaced apart from the light emitting In front of the device (10), the first light (L1) of the light-emitting device (10) moving forward is converted into a second linearly polarized light (L2); a 1/4λ wavelength plate (30), which is located adjacent to the In front of the polarizer (20), the forwardly transmitted second linearly polarized light (L2) is transformed into a third circularly polarized light (L3) or an elliptically polarized light; an optical lens (40), which becomes a film adhesion and Whether to judge the surface of the PCB substrate (T) of the object and reflect the light that has passed through the 1/4λ wavelength plate (30) and the polarizer (20) in reverse order to condense; a light sensor (50) The light passing through the optical lens (40) is received to generate electrical signals related to the light and transmitted to a control unit (60); the control unit (60) uses the light transmitted from the light sensor (50) Relevant electrical signals calculate the intensity value of the light, and use the calculated intensity value of the light to determine whether the film is attached to the surface of the PCB substrate to be inspected. The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 2 of the patent application range, wherein the light emitting device (10) emits the first light (L1) in the forward direction through the polarizer (20) and the 1 /4λ wavelength plate (30), after reflecting on the surface of the PCB substrate (T) that is the object of film adhesion judgment, and then re-transmitting the 1/4λ wavelength plate (30) and the polarizer (20) in sequence, The polarized light blocking effect occurs. When there is no film on the surface of the PCB substrate (T) of the inspection object, the degree of refraction or birefringence is small, the polarized light blocking effect is large, and the intensity of the light reaching the lens is weak. When there is a film on the surface of the PCB substrate (T) of the object, the degree of refraction or birefringence is large, the polarization blocking effect is small, and the intensity of light reaching the lens is relatively large. The control unit (60) uses the light sensitivity The light-related electrical signal transmitted by the detector (50) calculates the light intensity value, and compares the calculated light intensity value with the light intensity-related comparison value to determine whether the film is attached to the surface of the PCB substrate (T). The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 2 of the patent application range, wherein the photo sensor (50) is a photo sensor or a photodiode. The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 2 of the scope of the patent application further includes: a rear case (110) formed of plastic resin; a front case (150) formed of plastic resin , Combined with the front of the rear case (110); a fixed port (130) located in the middle of the inner cavity formed by the rear case (110) and the front case (150); the light emitting device (10), the The optical lens (40) and the light sensor (50) are located between the back of the fixed port (130) and the rear case (110); the polarizer (20) and the 1/4λ wavelength plate (30) are located Between the front of the fixed port (130) and the front case (150); the light emitting device (10) is located in front of the rear case (110), forming the light sensor (50) of a light receiving device (450) And the optical lens (40) are sequentially arranged in a positive direction; a glass cover (140) is fixed in front of the fixing portion (130), and the polarizer (20) and the 1 are sequentially fixed in front of the glass cover (140) /4λ wavelength plate (30); the light emitting device (10) and the light sensor (50) are electrically connected to the control unit (60) in a wired or wireless manner. A device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 5 of the patent application range, wherein the fixing port (130) includes a light-emitting opening formed at a position corresponding to the light-emitting device (10) ( 131), a light-receiving opening portion (133) formed at a position corresponding to the optical lens (40), the front case (150) includes the light for the light-emitting device (10) and the light-receiving reflected light passing through A third opening (153), the front shell (150) and the rear shell (110) are combined to form a movable inspection body (B), the inspection body (B) is connected to a displacement device, so as to be able to It is displaced in the three-dimensional space according to an instruction of the control unit (60) formed integrally or independently with the movable inspection body (B). The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 2 of the patent application scope, wherein the light emitting device (10), the polarizer (20), the 1/4λ wavelength plate (30), the optical lens (40) and the light sensor (50) are built in the space formed by a front shell (150) and a rear shell (110) to form a movable inspection body (B), the inspection body (B) ) Is connected to a displacement device so that it can be displaced in three-dimensional space according to the instruction of the control unit (60) formed integrally or independently with the movable inspection body (B), and the light sensor (50) is A photoelectric sensor or a photodiode, the distance between the front of the inspection body (B) and the inspection area of the PCB substrate (T) of the inspection object is 0.1 to 10 cm. The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 1 of the scope of the patent application further includes a second light emitting device (12) for irradiating the PCB substrate to be inspected with unpolarized incident light, the control The unit (60) uses the light-related electrical signals transmitted from the light sensor (50) to calculate the intensity value of the light, and the control unit (60) compares the intensity value of the received light from the polarized incident light with the incident light from the unpolarized light When the difference value exceeds the critical value, it is determined that there is a film remaining on the surface of the PCB substrate (T). The device for monitoring the peeling of a protective film for a semiconductor substrate as described in item 1 of the scope of the patent application, further comprising: a second light emitting device (12) for irradiating incident light without polarization to the PCB substrate to be inspected A rear shell (110), which is formed of plastic resin; a front shell (150), which is formed of plastic resin, combined with the front of the rear shell (110); a fixed port (130), which is located by the rear The middle of the inner cavity formed by the shell (110) and the front shell (150); the light-emitting device (10), the optical lens (40), and the light sensor (50) are located behind the fixed port (130) and Between the back shell (110); the polarizer (20) and the 1/4λ wavelength plate (30) are located between the front of the fixed port (130) and the front shell (150); the light device (10) Located in front of the rear case (110), the light sensor (50) and the optical lens (40) constituting the light receiving device (450) are sequentially arranged in the positive direction; a glass is fixed in front of the fixing port (130) A cover (140), the polarizer (20) and the 1/4λ wavelength plate (30) are fixed in sequence in front of the glass cover (140); the light emitting device (10) and the light sensor (50) are Wired or wirelessly connected to the control unit (60), the first light emitted by the light emitting device (10) passes through a light emitting opening (131) and the polarizer (20) during the incident, the second The light emitted by the light-emitting device (12) passes through a third opening (135) during the incident, but the polarizer (20) does not exist in the front-back direction of the third opening (135) and therefore does not transmit the polarized light Sheet (20), but the PCB substrate that is incident on the inspection object in a non-polarized state. A method for monitoring the peeling of a protective film for a semiconductor substrate, comprising: emitting a first light (L1) from a light-emitting device (10) and causing the previous step (S10); the light of the light-emitting device (10) is forward Step forward (S20) through a polarizer (20) and converted into a second linearly polarized light (L2); the second linearly polarized light (L2) is forwardly transmitted through a 1/4λ wavelength plate (30) to become a third Step of circularly polarized light (L3) or an elliptically polarized light (S30); the third circularly polarized light (L3) or the elliptically polarized light hits the surface of a PCB substrate (T) that becomes the object of film adhesion judgment, a fourth reflected light (L4) Step of retroreflecting (S40); Step (S50) of the fourth reflected light (L4) retrotransmitting through the 1/4λ wavelength plate (30) to become a fifth reflection-intermediate wave (L5); Five reflection-intermediate wave (L5) is converted into a fifth reflection-reception wave (L6) through the polarizer (S60); the fifth reflection-reception wave (L6) passes through the optical lens (40) to reach a light sensor Detector (50), the light sensor (50) generates an electric signal related to the arriving light and transmits it to a light receiving and transmitting step (S70) of a control unit (60); the control unit (60) uses the slave light The light-related electrical signal transmitted by the sensor (50) calculates the light intensity value, compares the calculated light intensity value with the comparison value related to the light intensity, and determines whether the film adheres to the surface of the PCB substrate (T) Step (S80). A method for monitoring the peeling of a protective film for a semiconductor substrate, which includes: emitting a first unpolarized light from a first light-emitting device and forwarding it, transforming it into a second linearly polarized light (L2) through a polarizer (20) Step (S110); the second linearly polarized light passes through a 1/4λ wavelength plate (30) in the forward direction to become a third circularly polarized light or an elliptically polarized light (S120); the third circularly polarized light or the elliptically polarized light touches Step (S130) of the surface of a PCB substrate (T) that becomes the object of film adhesion determination and retroreflective transmission through the 1/4λ wavelength plate (30) and the polarizer (20); through the 1/4λ wavelength The reflected light of the plate (30) and the polarizer (20) reaches an optical sensor (50) through an optical lens (40), and the optical sensor (50) generates electrical signals related to the arriving light And transmitted to a control unit (60), the reflected light originating from the polarized light receiving step (S140); a second unpolarized light is emitted from a second light-emitting device and advances, and the object that does not pass through the polarizer and hits the inspection object Step of unpolarized light reflection on the surface of the PCB substrate (T) and retroreflected (S150); the light of the unpolarized light reflected from the PCB substrate passes through the optical lens to reach the light sensor, the light sensor generates and arrives The electric signal related to the light of the light is transmitted to the control part (60) from the unpolarized reflected light receiving step (S160); the control part (60) receives the electric signal transmitted in step (S140) and calculates the corresponding Light intensity value, the control unit (60) receives the electrical signal transmitted in step (S160) and calculates the corresponding light intensity value, the control unit (60) finds the difference between the two light intensity values; when the difference exceeds At the critical value, it is determined that there is a film remaining on the surface of the PCB substrate (T) (S170).

Images