TW202001512A - Three-dimensional curved touch structure and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a three-dimensional curved touch structure and manufacturing method thereof, comprising the steps of: (a) Provide a touch sensing film. (b) Manufacturing a sensing electrode on the transferable film by using an etching method. (c) Disposing a thermoplastic transfer material on the transferable film. (d) Applying the transferable film to the curved substrate through the thermoplastic transfer material, and creating an interpenetrating polymer network (IPN) structure on the transferable film. (e) Curing the transferable film via ultraviolet rays. Through the above method, the 3D curved touch-sensing laminated structure will produce an IPN structure with a thickness of about 50 to 100 nanometers during the heat transfer, so that the overall laminated structure is more stable.

Description

Three-dimensional curved surface touch laminated structure and manufacturing method thereof

The technology of the present invention relates to the field of touch control structures, in particular to a three-dimensional curved touch stack structure and a manufacturing method thereof.

In response to the vigorous development of touch devices, the touch stack structure has been extended from a single plane to the application of multi-axis curved surface modeling. However, during the lamination process of the touch laminated structure, stress is easily accumulated due to expansion and contraction of different materials in the laminated structure, which causes wrinkles, which ultimately leads to micro-cracking (micro crack), local resistance increase, abnormal touch function and other defects.

In addition, the conductive film is biased by thermoplastic, which is easy to cause shrinkage due to the difference of the base film material at different temperatures, and the specific volume may also be caused by the excessively high stretch rate. Silver streaks or more severe fractures, so there is still room for improvement.

The main purpose of the present invention is to improve the problem that the conventional technology is prone to abnormal touch function during thermoplastic bonding. In order to achieve the above object, the present invention adopts the following technical means to achieve, wherein, the present invention provides a three-dimensional curved touch laminated structure and its manufacturing method, which includes the following steps: a. Provide a transferable film and a curved surface Substrate. b. An etching electrode is formed on the transferable film by etching. c. Set a thermoplastic transfer material on the transferable film. d. Through the thermoplastic transfer material, the transferable film is thermally bonded to the curved substrate, and an interpenetrating polymer network structure is generated on the transferable film. e. Use UV to cure the transferable film.

In an embodiment of the present invention, the manufacturing method of the sensing electrode includes: setting a photomask on the transferable film to perform exposure, removing the photomask and a base film, and performing exposure to form the sensing electrode.

In an embodiment of the present invention, after the step d., a step d1 is further included: an external circuit is formed on the transferable film using three-dimensional printing technology.

In an embodiment of the invention, the external circuit is a single-layer conductive metal circuit.

In an embodiment of the invention, the thickness of the interpenetrating polymer network structure is between 50 and 100 nm.

In an embodiment of the present invention, the step d. further includes: the transferable film includes a functional layer and a developing layer, the functional layer is a decorative functional ink, a modified optical functional material or a surface modification material, The developing layer is a light-sensitive material or a thermosetting material.

In an embodiment of the invention, the interpenetrating polymer network structure is formed on the contact surface of the functional layer and the developing layer.

In order to achieve the above objectives and effects, the technical means and structure adopted by the present invention, the drawings and details of an embodiment of the present invention are described in detail below. The features and functions are as follows. Poli fully understands, but it should be noted that the content does not constitute Limitation of the invention.

Please refer to FIG. 1, which is a method flowchart of an embodiment of a three-dimensional curved touch laminated structure and a manufacturing method thereof according to the present invention. The manufacturing method of the three-dimensional curved touch laminated structure of the present invention includes the following steps:

Step 100: Provide a transferable film 1 and a curved substrate 2. The transferable film 1 includes a transferable transparent conductive film (Transparent Conductive Transfer Film, TCTF) 13, a protective film (Cover Film) 11 and a base film (Base Film) 12, the protective film 11 and the base film 12 They are respectively located on different surfaces of the transferable transparent conductive film 13. The curved substrate has a three-dimensional curved surface.

Step 110: Make an induction electrode 4 on the transferable film by etching. Please refer to FIGS. 2A and 2B, which are schematic diagrams 1 and 2 of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. The manufacturing method of the sensing electrode includes: A mask 3 is provided on the film, and the mask 3 may be adjacent to a surface of the base film 12; the transferable film 1 is irradiated with ultraviolet rays for exposure; and the transferable transparent conductive film 13 is removed The photomask 3 and the base film 12; the transferable transparent conductive film 13 is irradiated with ultraviolet rays for exposure; and the sensing electrode 4 is formed on the transferable transparent conductive film 13.

Step 120: Set a thermoplastic transfer material 5 on the transferable film. Please refer to FIG. 2C and FIG. 2D, which are a schematic process diagram 3 and a fourth process diagram of an embodiment of the three-dimensional curved touch stacking structure and the manufacturing method of the present invention. The thermoplastic transfer material may be a thermoplastic elastomer or a thermoplastic rubber, which has the processing advantages of thermoplastics and also has the dual advantages of the physical properties of vulcanized rubber, and is suitable for use as a thermoplastic transfer material.

Step 130: Thermally attach the transferable film to the curved substrate through the thermoplastic transfer material, and generate an interpenetrating polymer network (IPN) on the transferable film. The through polymer network structure may be a linear polymer or a branched chain. Using thermal transfer technology, the transparent transferable film can be attached to the designed curved substrate. At the same time, the material diffusion fluidity is improved by heating, and the contact surface of the two interlayer materials interpenetrate and entangle. The formation of an interpenetrating polymer network structure can increase the adhesion between the transferable film and the curved substrate. Among them, controlling the temperature and pressure during thermal transfer can make the adhesion of the interpenetrating polymer network structure more obvious. In an embodiment of the invention, the thickness of the interpenetrating polymer network structure is between 50 and 100 nm. In one embodiment, the transferable film includes a functional layer and a developing layer. The functional layer is a stack of materials to increase the function of the transferable film. It can be a decorative functional ink and a modified optics. Functional materials or a surface modification material, etc., but not limited to this. The developing layer is a laminated material, which may be a light-sensitive material or a thermosetting material, and the interpenetrating polymer network structure is formed on the contact surface of the functional layer and the developing layer.

Step 140: Curing the transferable film using ultraviolet rays.

In an embodiment of the present invention, after the step 140, a step 150 may be further included: an external circuit is formed on the transferable film using three-dimensional printing technology, wherein the external circuit is a single-layer conductive metal circuit or a multi-layer conductive Metal line. The three-dimensional printing technology is an application of electronic printing technology, has fine printing capabilities and wider material application, and its special printing method is particularly suitable for three-dimensional three-dimensional curved surfaces.

Through the above manufacturing method, the in-plane wiring laminate structure shown in FIGS. 3A and 3B and the external wiring laminate structure shown in FIGS. 4A and 4B can be produced. 3A and 3B are respectively a schematic diagram and a three-dimensional schematic diagram of an internal wiring laminate structure according to an embodiment of the present invention. The internal wiring laminate structure includes a curved substrate 10, a functional layer 20, an interpenetrating polymer network structure 30, a developing layer 40, and conductive线层50。 50 line layer. The curved substrate 10 may be made of glass, single-layer or multi-layer composite plastic materials. A surface of the functional layer 20 is bonded to a surface of the substrate 10 so that the functional layer 20 is attached under the curved substrate 10. The functional layer 20 may be a decorative film or treatment agent, such as decorative functional ink, modified optical functional material, or surface modification material. One surface of the developing layer 40 is bonded to the other surface of the functional layer 20, so that the developing layer 40 is attached under the functional layer 20, and a contact surface of the developing layer 40 and the functional layer 20 is formed There are interpenetrating polymer network structure 30. The developing layer 40 may be a photosensitive material or a thermosetting material. One surface of the conductive circuit layer 50 is bonded to the other surface of the developing layer 40 so that the conductive circuit layer 50 is attached to the developing layer 40 Below, the conductive circuit layer 50 may be indium tin oxide (ITO), nano silver wire, or carbon nanotube, etc., but is not limited thereto.

The external wiring laminate structure shown in FIG. 4A includes a curved substrate 10a, a functional layer 20a, an interpenetrating polymer network structure 30a, a developing layer 40a, and a conductive circuit layer 50a. The curved substrate 10a may be made of glass, single-layer or multi-layer composite plastic materials. A surface of the functional layer 20a is bonded to a surface of the substrate 10a, so that the functional layer 20a is attached below the curved substrate 10a. The functional layer 20a may be a decorative film or treatment agent, such as decorative functional ink, modified optical functional material or surface modification material. One surface of the developing layer 40a is bonded to the other surface of the functional layer 20a, so that the developing layer 40a is attached below the functional layer 20a, and the contact surface of the developing layer 40a and the functional layer 20a is formed There is an interpenetrating polymer network structure 30a. The developing layer 40a may be a photosensitive material or a thermosetting material. One surface of the conductive circuit layer 50a is bonded to the other surface of the developing layer 40a, so that the conductive circuit layer 50a is attached to the developing layer 40a Below, the conductive circuit layer 50a may be indium tin oxide (ITO), nano silver wire, or carbon nanotube, etc., but is not limited thereto. The external wiring stack structure shown in FIG. 4B includes a curved substrate 10b, a functional layer 20b, and a metal conductive layer 60b. The curved substrate 10b can be made of glass, single-layer or multi-layer composite plastic materials. A surface of the functional layer 20b is bonded to a surface of the substrate 10b, so that the functional layer 20b is attached under the substrate 10b. The functional layer 20b may be a decorative film or treatment agent, such as decorative functional ink, modified optical functional material, or surface modification material. One surface of the metal conductive layer 60b is bonded to the other surface of the functional layer 20b, so that the metal conductive layer 60 is attached under the functional layer 20b. The metal conductive layer 60b is a single-layer or multi-layer conductive metal.

Therefore, please refer to all the drawings, the present invention provides a three-dimensional curved touch laminated structure and its manufacturing method, which proposes a three-dimensional curved touch laminated structure manufacturing method, using the first transfer method to reduce the base film Thickness can avoid the problem that the thickness of the surface deviates from the neutral axis on the curved surface, and the material is subjected to greater stress and breaks. In addition, an interpenetrating polymer network structure can also be created between the functional layer and the development layer, only the overall structure is more stable.

Through the above detailed description, it can be fully shown that the purpose and effectiveness of the present invention are progressive in implementation, extremely useful for the industry, and are new inventions that have never been seen on the market, and fully meet the requirements of the invention patent , Xuan filed an application in accordance with the law. However, the above is only an example of the present invention, which does not limit the implementation and protection scope of the present invention. Those skilled in the art should be able to realize the equivalence made by using the description and illustration content of the present invention. The solutions obtained by replacement and obvious changes should be included in the protection scope of the present invention.

1‧‧‧transferable film 2‧‧‧Curved substrate 11‧‧‧Protective film 12‧‧‧ Base film 13‧‧‧Transferable transparent conductive film 3‧‧‧mask 4‧‧‧Induction electrode 5‧‧‧thermoplastic transfer material 10,10a,10b‧‧‧curved substrate 20,20a,20b‧‧‧functional layer 30,30a‧‧‧Interpenetrating polymer network structure 40,40a‧‧‧Development layer 50,50a‧‧‧conductive circuit layer 60b‧‧‧Metal conductive layer 100～150‧‧‧step

FIG. 1 is a method flowchart of an embodiment of a three-dimensional curved surface touch stack structure and a manufacturing method thereof according to the present invention. FIG. 2A is a manufacturing process diagram 1 of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. FIG. 2B is a second schematic manufacturing process diagram of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. 2C is a schematic diagram 3 of a manufacturing process of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. FIG. 2D is a manufacturing process diagram 4 of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. FIG. 3A is a schematic diagram of an internal wiring stack structure according to an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. FIG. 3B is a three-dimensional schematic diagram of an internal wiring stack structure according to an embodiment of the three-dimensional curved touch stack structure of the present invention and a manufacturing method thereof. 4A is a schematic diagram 1 of an external wiring stack structure according to an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. 4B is a schematic diagram 2 of an external wiring stack structure according to an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention.

100~150‧‧‧step

Claims (10)

A method for manufacturing a three-dimensional curved touch laminated structure, including the following steps: a. provide a transferable film and a curved substrate; b. use an etching method to form a sensing electrode on the transferable film; c. A thermoplastic transfer material is provided on the transfer film; d. The transferable film is thermally bonded to the curved substrate through the thermoplastic transfer material, and an interpenetrating polymer network structure is generated on the transferable film , The interpenetrating polymer network structure is used to increase the adhesion between the transferable film and the curved substrate; e. curing the transferable film with ultraviolet light. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 1 of the patent application scope, wherein the manufacturing method of the sensing electrode includes: providing a photomask on the transferable film, performing exposure, removing the photomask, and A base film is exposed to form the sensing electrode. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 1 of the patent application scope, wherein after step d., a step d1 is further included: an external circuit is formed on the transferable film using three-dimensional printing technology. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 3 of the patent scope, wherein the external circuit is a single-layer conductive metal circuit. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 1 of the patent application scope, wherein the thickness of the interpenetrating polymer network structure is between 50 and 100 nm. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 1 of the patent scope, wherein the step d. further includes: the transferable film includes a functional layer and a developing layer, the functional layer is a decorative functional ink 1. A modified optical functional material or a surface-modified material, the developing layer is a light-sensitive material or a thermosetting material. The method for manufacturing a three-dimensional curved touch laminated structure as described in item 6 of the patent scope, wherein the step d. further includes: the interpenetrating polymer network structure is formed on the contact surface of the functional layer and the developing layer. A three-dimensional curved touch laminated structure manufactured by the method described in any one of the first to seventh patent applications includes: a curved substrate, a functional layer, an interpenetrating polymer network structure, a developing layer and A conductive circuit layer, the curved substrate has a three-dimensional curved surface; a surface of the functional layer is bonded to a surface of the substrate so that the functional layer is attached under the curved substrate; a surface of the developing layer and the function The other surface of the layer is bonded together, so that the developing layer is attached below the functional layer, and the interpenetrating polymer network structure is formed on the contact surface of the developing layer and the functional layer. The three-dimensional curved touch laminated structure as described in item 8 of the patent application range, wherein the functional layer is a decorative functional ink, a modified optical functional material layer or a surface modified material layer. The three-dimensional curved touch laminated structure as described in item 8 of the patent application range, wherein the developing layer is a light-sensitive material layer or a thermosetting material layer.

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