CN102637575A - Manufacturing method of component baseplate - Google Patents
Manufacturing method of component baseplate Download PDFInfo
- Publication number
- CN102637575A CN102637575A CN2011100350891A CN201110035089A CN102637575A CN 102637575 A CN102637575 A CN 102637575A CN 2011100350891 A CN2011100350891 A CN 2011100350891A CN 201110035089 A CN201110035089 A CN 201110035089A CN 102637575 A CN102637575 A CN 102637575A
- Authority
- CN
- China
- Prior art keywords
- material layer
- release structure
- device substrate
- manufacturing approach
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a manufacturing method of a component baseplate. The manufacturing method comprises following steps of: providing a load-bearing piece, wherein the load-bearing piece is provided with a first surface and a second surface, and the second surface is positioned on the periphery of the first surface; subsequently, forming a material layer on the load-bearing piece, wherein a part of the material layer covers the first surface, and the other part of the material layer covers the second surface, and the adhesive force between the material layer and the second surface is greater than the adhesive force between the material layer and the first surface; then, forming a component on the material layer; and carrying out cutting on the material layer along a cut line, and forming the component baseplate, wherein the component baseplate and the load-bearing piece are mutually separated.
Description
Technical field
The present invention relates to a kind of manufacturing approach of device substrate, and particularly relate to a kind of manufacturing approach of device substrate of the bearing part that in manufacture craft, utilizes different adhesive force.
Background technology
Along with the fast development that shows science and technology, the use of display is very general.Because glass itself has good light permeability and bearing strength, so display adopts glass as baseplate material on volume production mostly at present.Lightening is following trend of display.Yet the proportion of glass is bigger, and must have suitable thickness in order to keep bearing strength and surface smoothness, therefore accounts for the quite major part in the display overall weight at glass substrate.Many thickness and the weight of reducing glass substrate with the mode of chemical etching or grinding of present industry are so that display is lightening.Yet this dual mode tends to make the fraction defective of product and manufacturing cost to improve.In addition, glass substrate also has the shortcoming that is prone to fragmentation and bending property difference.
In comparison, flexible base plate not only has pliability, in light weight and impact-resistant advantage, and more because of directly adopting thin substrate thickness can save the manufacture craft of slimming in the past.Therefore, the development potentiality of flexible base plate is considerably high.The flexible base plate material can for example be plastic cement, resin or other macromolecular materials.Yet, because flexible base plate too soft (rigidity is low) and possibly when carrying out conveyance, clamping, storage or cleaning, bear bad influence for example is bump, compressing, deflection, vibration, pollution or static.In addition, the flexible nature of flexible base plate makes that also substrate itself maybe be by scratch or the aging phenomenon of generation in reliability test.
Moreover; Based on soft characteristic; Flexible base plate can't be separately directly gets in the production process of present most display manufacturer as the substrate of element; Therefore, it for example is the rigidity support plate of glass substrate that flexible base plate needs to arrange in pairs or groups extraly, to meet the standard of manufacture craft to curved substrate degree (plate is curved).The practice is to utilize a comprehensive adhesion coating with after flexible base plate and the applying of rigidity support plate at present; Forming for example is that thin-film transistor is on plastic substrate; Again through for example being that the mode of heating of laser radiation makes the adhesion coating interface between glass substrate and the plastic substrate produce thermal cracking, to separate plastic substrate and glass substrate.Yet, in case when the size of glass substrate and plastic substrate increases, the ability of regulation and control of laser will influence yield and production capacity widely, make production cost to significantly improve.
Summary of the invention
The object of the present invention is to provide a kind of manufacturing approach of device substrate, it comes to mutually combine with device substrate through the surface that bearing part has different adhesive force.Thus, at present the manufacture craft of display does not need significantly to change, and device substrate can be by process output so more simply, and therefore the device substrate after the completion also can have cost advantage via taking off easily behind the easy cutting step.
For reaching above-mentioned purpose, the present invention proposes a kind of manufacturing approach of device substrate, comprising: a bearing part is provided, and bearing part has a first surface and a second surface, second surface be positioned at first surface around; Form a material layer on bearing part, the layer of material covers first surface of a part, and the layer of material covers second surface of another part, the adhesive force of material layer and second surface is greater than the adhesive force of material layer and first surface; Form an element on material layer; And along a line of cut this material layer is cut, to form an element substrate, device substrate and bearing part are separated from each other.
The present invention also proposes a kind of manufacturing approach of device substrate, comprising: a support plate is provided; Form a release structure in support plate, to form a bearing part, release structure has a first surface and is formed on the second surface of support plate, second surface be positioned at first surface around; Form a material layer on bearing part, the layer of material covers first surface of a part, and the layer of material covers second surface of another part, the adhesive force of material layer and second surface is greater than the adhesive force of material layer and first surface; Form an element on material layer; And along a line of cut this material layer is cut, to form an element substrate, device substrate and bearing part are separated from each other.Device substrate comprises release structure.
For there is better understanding above-mentioned and other aspects of the present invention, hereinafter is special lifts preferred embodiment, and cooperates appended accompanying drawing, elaborates as follows:
Description of drawings
Fig. 1 is the flow chart of manufacturing approach of the device substrate of one embodiment of the invention;
Fig. 2 A～Fig. 2 E is the schematic flow sheet of first kind of manufacturing approach of the device substrate of first embodiment of the invention;
Fig. 3 A～Fig. 3 E is the schematic flow sheet of second kind of manufacturing approach of the device substrate of first embodiment of the invention;
Fig. 4 A～Fig. 4 E is the schematic flow sheet of manufacturing approach of the device substrate of second embodiment of the invention;
Fig. 5 A～Fig. 5 E is the schematic flow sheet of manufacturing approach of the device substrate of third embodiment of the invention;
Fig. 6 A～Fig. 6 C is the another kind of schematic flow sheet of release structure on support plate that forms patterning;
Fig. 7 A～Fig. 7 F is the schematic flow sheet of manufacturing approach of a kind of device substrate of fourth embodiment of the invention;
Fig. 8 A～Fig. 8 D is the schematic flow sheet of manufacturing approach of the another kind of device substrate of fourth embodiment of the invention;
Fig. 9 A～Fig. 9 E is the schematic flow sheet of manufacturing approach of the device substrate of fifth embodiment of the invention;
Figure 10 is the flow chart of manufacturing approach of the device substrate of fifth embodiment of the invention.
The main element symbol description
100,200,300,400,500,500 ', 600: device substrate
110,210,310,410,510,510 ', 610: bearing part
111,211,311,411,511,611: support plate
111s1,211s1,311s1,412s1,512s1,512s1 ', 612s1: first surface
112,212,412,612: release structure
112s2,212s2,311s2,411s2,512s2,512s2 ', 611s2: second surface
120,220,320,420,520,520 ', 620: material layer
130,230,330,430,530,530 ', 630: element
512a: the first release structure
512b: the second release structure
521: surface-treated layer
522: substrate material layer
700: the separated type material layer
800: mask arrangement
810: protuberance
B11, B12, B2, B3, B4, B4 ', B5: line of cut
S101～S107, S701～S709: process step
Embodiment
Please with reference to Fig. 1, it illustrates the flow chart of the manufacturing approach of device substrate according to an embodiment of the invention.
In step S101, bearing part is provided, bearing part has first surface and second surface, second surface be positioned at first surface around.Bearing part comprises support plate, and support plate has the curved characteristic of measuring little, high temperature resistant and resistance to chemical attack of plate.This support plate for example is glass substrate, composite base plate, metal substrate or polymeric substrate.
Then, in step S103, form material layer on bearing part.This material layer is the flexible base plate of deflection, high temperature resistant and resistance to chemical attack, for example is pi (Polyimide, PI) based material.Pi is a thermosetting plastic, and normal temperature is down stable solution kenel, is the stable solid kenel but handle the back via hot curing, chemical erosion that can anti-manufacture craft.(glass transition temperature Tg) is about 380 ℃ to the glass transition temperature of pi, can bear general element manufacture craft temperature after solidifying.In addition, can the light initiator be added in the pi, (Ultra Violet UV) is cured, and so can pass through photoetching making technology define pattern can to use ultraviolet light.In addition, pi also can add the additive of organic or inorganic, adjusts its adhesive force or other physicochemical characteristics.The layer of material covers first surface of a part, and the layer of material covers second surface of another part.The adhesive force of material layer and second surface is greater than the adhesive force of material layer and first surface.The adhesive force of first surface and material layer needs element base version and separating easily of bearing part are carried out.In addition, can the structure of integral body be exerted an adverse impact in the manufacture craft that the adhesive force of second surface and material layer here needs to avoid follow-up.For instance, the adhesive force between second surface and the material layer must guarantee that material layer separates with the unlikely splitting of bearing part (peeling) in being coated with in the etamine making process of display element; In addition for instance, the adhesive force between second surface and the material layer must guarantee that the chemical liquids in follow-up the processing can not be seeped between material layer and the bearing part easily, breaks away from manufacture craft to avoid material layer and bearing part.
Then, in step S105, form element on material layer.Element can for example be active formula element, passive type element, touch controllable function element or colored photic resist layer.Can be at present general display manufacture craft among the step S105.
Then, in step S107, this material layer is cut, to form device substrate along a line of cut.Cutting mode for example is laser cutting, flywheel knife cutting or die-cut.This line of cut is around element, and its scope is between the border of this element and those material layers.The border of those material layers here refers to cover the material layer and the boundary of the material layer of this part in addition that covers the bearing part second surface of this part of bearing part first surface.Then, device substrate and bearing part are separated from each other.The mode of separating utilizes and for example glutinously gets, tear get, physical methods such as vacsorb or Electrostatic Absorption, along line of cut device substrate is taken off.Because the material layer of this part of material layer and other of this part separates through the execution of step S107, therefore, in addition material layer and the element it on of this part little with first surface adhesive force can together break away from from bearing part easily, to form device substrate.
Below further specify the process step among Fig. 1 with several embodiment.
First embodiment
Please with reference to Fig. 2 A～Fig. 2 E, it illustrates the schematic flow sheet according to first kind of manufacturing approach of the device substrate of first embodiment of the invention.Fig. 2 A and Fig. 2 B correspond to the step S101 among Fig. 1, and Fig. 2 C～Fig. 2 E corresponds to the step S103～step S107 among Fig. 1 respectively.Below explanation at length.
The bearing part that flow process provided 110 through among Fig. 2 A and Fig. 2 B has first surface 111s1 and second surface 112s2, and second surface 112s2 be positioned at first surface 111s1 around.
In Fig. 2 A, support plate 111 is provided, support plate 111 has first surface 111s1.
Then, in Fig. 2 B, the release structure 112 that forms patterning is on the first surface 111s1 of support plate 111, to form bearing part 110.Release structure 112 has second surface 112s2.The release structure 112 here can for example be the patterning stratiform structure that the mode of film (Thin Film)-etching (Etch) manufacture craft, film-photoetching (Lithography)-etching process, letterpress, screen painting, transfer printing, ink-jet or applying forms.Form through film-etching process with the release structure of patterning 112, the separated type material layer is formed on earlier on the first surface 111s1 of support plate 111.Afterwards, put the top of mask arrangement,, and expose the separated type material layer of another part via the central opening of mask arrangement with the separated type material layer of cover part at least in the separated type material layer.Then, for example to be that the mode of plasma bombardment removes the separated type material layer that not masked structure covers, make remaining separated type material layer form the release structure 112 of patterning.In addition, form through film-photoetching-etching process with the release structure 112 of patterning, mask arrangement and photoresist need collocation each other to select for use.To select negative type photoresist for use; Forming separated type material layer and negative type photoresist in regular turn after on the first surface 111s1 of support plate 111; Mask arrangement covers the separated type material layer of not desire reservation and the top of negative type photoresist; That is to say that mask arrangement is positioned at the top of the negative type photoresist of middle body.Afterwards, make public and step of developing, make the negative type photoresist of the middle body that masked structure covers dissolve and the separated type material layer of exposed portions serve.Then, for example being that the mode of plasma bombardment removes the separated type material layer that is not covered by negative type photoresist, and remove negative type photoresist, make remaining separated type material layer form the release structure 112 of patterning.To select positive light anti-etching agent for use; Forming separated type material layer and positive light anti-etching agent in regular turn after on the first surface 111s1 of support plate 111; Mask arrangement covers the separated type material layer of desire reservation and the top of positive light anti-etching agent; That is to say that mask arrangement is the structure with central opening.Afterwards, make public and step of developing, make the positive light anti-etching agent of the middle body that not masked structure covers dissolve and the separated type material layer of exposed portions serve.Then, for example being that the mode of plasma bombardment removes the separated type material layer that is not covered by positive light anti-etching agent, and remove positive light anti-etching agent, make remaining separated type material layer form the release structure 112 of patterning.The material of release structure 112 for example is that (Polyimide PI), or mixes the high adhesion force additive with it to pi.The release structure 112 that forms this patterning does not need significantly to change the manufacture craft mode and the mechanism of present display, even need not change; In addition, because the material pi of release structure 112 is a present display manufacture craft material commonly used, so cost has advantage.
Then, in Fig. 2 C, form material layer 120 on bearing part 110.The material layer 120 of a part covers first surface 111s1, and the material layer 120 of another part covers second surface 112s2.Selecting for use of high adhesion force additive through material layer 120, the adhesive force of material layer 120 and second surface 112s2 is greater than the adhesive force of material layer 120 with first surface 111s1.
Then, in Fig. 2 D, form element 130 on material layer 120.
Then, in Fig. 2 E, this material layer 120 is cut, to form device substrate 100 along line of cut B11.Device substrate 100 and bearing part 110 are separated from each other.
Please with reference to Fig. 3 A～Fig. 3 E, it illustrates the schematic flow sheet according to second kind of manufacturing approach of the device substrate of first embodiment of the invention.Being compared to aforesaid release structure 112 and being patterning stratiform structure, below be that the patterning particulate gathers with release structure 212 is the example explanation.Fig. 3 A and Fig. 3 B correspond to the step S101 among Fig. 1, and Fig. 3 C～Fig. 3 E corresponds to the step S103～step S107 among Fig. 1 respectively.Below explanation at length.
The bearing part that flow process provided 210 through among Fig. 3 A and Fig. 3 B has first surface 211s1 and second surface 212s2, and second surface 212s2 be positioned at first surface 211s1 around.Below explanation at length.
In Fig. 3 A, support plate 211 is provided, support plate 211 has first surface 211s1.
Then, in Fig. 3 B, the release structure 212 that forms patterning is on the first surface 211s1 of support plate 211, to form bearing part 210.Release structure 212 has second surface 212s2.The release structure 212 here can for example be the patterning particulate set that the mode with film-etching process, letterpress, screen painting, transfer printing, ink-jet or applying forms, and the second surface 212s2 surface that particle assembly constituted slightly for this reason.Form through film-etching process with the release structure of patterning 212, comprise that the separated type material layer of particulate set is formed on earlier on the whole first surface 211s1 of support plate 211.Afterwards, put the top of mask arrangement,, and expose the separated type material layer of another part via the central opening of mask arrangement with the separated type material layer of cover part at least in the separated type material layer.Then, for example to be that the mode of plasma bombardment removes the separated type material layer that not masked structure covers, make remaining separated type material layer form the release structure 212 of patterning.This slightly particle assembly for example be high molecular particle epoxy glue material.In other words, Fig. 3 B formation of can be considered the release structure 212 through patterning comes the first surface 211s1 of the part of roughening support plate 211 to form the process step of bearing part 210.Because the release structure 212 that forms this patterning does not need significantly to change the manufacture craft mode and the mechanism of present display, even must not change, so cost has advantage.
Then, in Fig. 3 C, form material layer 220 on bearing part 210.The material layer 220 of a part covers first surface 211s1, and the material layer 220 of another part covers second surface 212s2.Because it is coarse than first surface 211s1 that particulate is gathered formed second surface 212s2, therefore, the adhesive force of material layer 220 and second surface 212s2 is greater than the adhesive force of material layer 220 with first surface 211s1.
Then, in Fig. 3 D, form element 230 on material layer 220.
Then, in Fig. 3 E, this material layer 220 is cut, to form device substrate 200 along line of cut B12.Device substrate 200 and bearing part 210 are separated from each other.
Second embodiment
Please with reference to Fig. 4 A～Fig. 4 E, it illustrates the schematic flow sheet according to the manufacturing approach of the device substrate of second embodiment of the invention.Compared to second kind of manufacturing approach of the device substrate 100 of first embodiment, the manufacturing approach of the device substrate 200 of present embodiment is come roughened surface in a different manner, to change the adhesive force on surface.Fig. 4 A and Fig. 4 B correspond to the step S101 among Fig. 1, and Fig. 4 C～Fig. 4 E corresponds to the step S103～step S107 among Fig. 1 respectively.Below explanation at length.
The bearing part that flow process provided 310 through among Fig. 4 A and Fig. 4 B has first surface 311s1 and second surface 311s2, and second surface 311s2 be positioned at first surface 311s1 around.
In Fig. 4 A, support plate 311 is provided, support plate 311 has first surface 311s1.
Then, in Fig. 4 B, the first surface 311s1 of a roughening part is to form bearing part 310.Formed second surface 311s2 by the first surface 311s1 of this part of roughening.The step of roughening for example is to carry out through the mode of etching, grinding or sandblast.For instance, mask arrangement can place the top of first surface 311s1, and hides the first surface 311s1 of middle body.Afterwards, for example to be the first surface 311s1 of the not masked structure covering of mode roughening of plasma bombardment, to form second surface 311s2.Because the step that forms the roughened surface of patterning does not need significantly to change the manufacture craft mode and the mechanism of present display, even need not change, so cost has advantage.
Then, in Fig. 4 C, form material layer 320 on bearing part 310.The material layer 320 of a part covers first surface 311s1, and the material layer 320 of another part covers second surface 311s2.In addition, second surface 311s2 is coarse than first surface 311s1, and therefore, the adhesive force of material layer 320 and second surface 311s2 is greater than the adhesive force of material layer 320 with first surface 311s1.
Then, in Fig. 4 D, form element 330 on material layer 320.
Then, in Fig. 4 E, this material layer 320 is cut, to form device substrate 300 along line of cut B2.Device substrate 300 and bearing part 310 are separated from each other.
The 3rd embodiment
Please with reference to Fig. 5 A～Fig. 5 E, it illustrates the schematic flow sheet according to the manufacturing approach of the device substrate of third embodiment of the invention.Compared to first kind of manufacturing approach of the device substrate 100 of first embodiment, the allocation position and the material of the release structure 412 of present embodiment are different.Fig. 5 A and Fig. 5 B correspond to the step S101 among Fig. 1, and Fig. 5 C～Fig. 5 E corresponds to the step S103～step S107 among Fig. 1 respectively.Below explanation at length.
The bearing part that flow process provided 410 through among Fig. 5 A and Fig. 5 B has first surface 412s1 and second surface 411s2, and second surface 411s2 be positioned at first surface 412s1 around.
Shown in Fig. 5 A, support plate 411 is provided, support plate 411 has second surface 411s2.
Then, shown in Fig. 5 B, the release structure 412 that forms patterning is on the second surface 411s2 of support plate 411, to form bearing part 410.Release structure 412 has first surface 412s1.The release structure 412 of patterning can for example be that the mode of film-etching process, film-photoetching-etching process, film-side washing manufacture craft, letterpress, screen painting, transfer printing, ink-jet or applying forms here, and the material of release structure 412 for example is a remover.In general, for the composite product that prevents moulding produces the situation of adhesion on mould, apply release agent between goods and the mould usually, from mould so that goods can be deviate from easily.Utilize the material of remover here, so that device substrate 400 can be separated from each other with bearing part 410 easily as release structure 412.Remover can be film-type, solution-type, paste or wax shape.The remover of film-type can be polyester, polyethylene, polyvinyl chloride, glassine paper or fluorine plastic film.The remover of solution-type can be slaine, ketone, acid amides and the halogenated hydrocarbons of hydro carbons, alcohols, carboxylic acid, carboxylate, carboxylic acid.The remover of paste and wax shape comprises the solution and the wax pattern of estersil, the heat-resisting ointment of HK-50, steam cylinder oil, gasoline and pitch.
Then, shown in Fig. 5 C, form material layer 420 on bearing part 410.The material layer 420 of a part covers first surface 412s1, and the material layer 420 of another part covers second surface 411s2.In addition, through the material of remover as release structure 412, the adhesive force between release structure 412 and the material layer 420 reduces.That is to say that the adhesive force of material layer 420 and second surface 411s2 is greater than the adhesive force of material layer 420 with first surface 412s1.
Then, in Fig. 5 D, form element 430 on material layer 420.
Then, in Fig. 5 E, this material layer 420 is cut, to form device substrate 400 along line of cut B3.Device substrate 400 and bearing part 410 are separated from each other.
In the present embodiment, if form the not release structure of patterning with film producing process, except side washing mode capable of using produces patterning, the etchant flow step of Fig. 6 A also capable of using～Fig. 6 C forms patterning.Please with reference to Fig. 6 A～Fig. 6 C, it illustrates the another kind of schematic flow sheet of release structure 412 on support plate 411 that forms patterning.
Shown in Fig. 6 A, form separated type material layer 700 on the second surface 411s2 of support plate 411.
Shown in Fig. 6 B, put the top of mask arrangement 800 in separated type material layer 700, mask arrangement 800 is the separated type material layer 700 of cover part at least.In the present embodiment, mask arrangement 800 has several protuberances 810.Through anchor clamps clamping protuberance 810, mask arrangement 800 can be positioned at the top of separated type material layer 700.
Shown in Fig. 6 C, remove not masked structure and cover 800 separated type material layer 700, make remaining separated type material layer 700 form the release structure 412 of patterning.This removes step can the plasma bombardment mode remove the separated type material layer 700 that not masked structure 800 covers, to form the release structure 412 of patterning.
Step among Fig. 6 A～Fig. 6 C for example is in single cavity, to accomplish.Mask arrangement 800 changes the position that covers separated type material layer 700 through the mode of rotating.Perhaps, aforesaid step also can be accomplished in dual chamber.When aforesaid step was accomplished in dual chamber, the position of the mask arrangement covering separated type material layer 700 in each cavity was different, formed the release structure 412 of patterning with the separated type material layer 700 that removes not masked structure covering.
Perhaps, the release structure 412 of patterning also can form through film-photoetching-etching process.To form the release structure 412 of patterning through film-photoetching-etching process, mask arrangement and photoresist need collocation each other to select for use.To select negative type photoresist for use; Forming separated type material layer and negative type photoresist in regular turn after on the second surface 411s2 of support plate 411; Mask arrangement covers the separated type material layer of not desire reservation and the top of negative type photoresist; That is to say that mask arrangement is the structure with central opening.Afterwards, make public and step of developing, the negative type photoresist on every side that makes masked structure cover is dissolved and the separated type material layer of exposed portions serve.Then, for example being that the mode of plasma bombardment removes the separated type material layer that is not covered by negative type photoresist, and remove negative type photoresist, make remaining separated type material layer form the release structure 412 of patterning.To select positive light anti-etching agent for use; Forming separated type material layer and positive light anti-etching agent in regular turn behind the second surface 411s2 of support plate 411; Mask arrangement covers the separated type material layer of desire reservation and the top of positive light anti-etching agent; That is to say that mask arrangement is positioned at the top of the positive light anti-etching agent of middle body.Afterwards, make public and step of developing, make the positive light anti-etching agent of peripheral part that not masked structure covers dissolve and the separated type material layer of exposed portions serve.Then, for example being that the mode of plasma bombardment removes the separated type material layer that is not covered by positive light anti-etching agent, and remove positive light anti-etching agent, make remaining separated type material layer form the release structure 412 of patterning.
The release structure 412 of this patterning of present embodiment formation does not need significantly to change the manufacture craft mode and the mechanism of present display, even need not change, so cost has advantage.
The 4th embodiment
Please with reference to Fig. 7 A～Fig. 7 F, it illustrates the schematic flow sheet according to the manufacturing approach of a kind of device substrate of fourth embodiment of the invention.Fig. 7 A～Fig. 7 C corresponds to the step S101 among Fig. 1, and Fig. 7 D～Fig. 7 F corresponds to the step S103～step S107 among Fig. 1 respectively.Below explanation at length.
The bearing part that step provided 510 through among Fig. 7 A～Fig. 7 C has first surface 512s1 and second surface 512s2, and second surface 512s2 be positioned at first surface 512s1 around.
Shown in Fig. 7 A, support plate 511 is provided.
Then, shown in Fig. 7 B, form the first release structure 512a on support plate 511, the first release structure 512a has first surface 512s1.The first release structure 512a can for example be that mode with film-etching process, film-photoetching-etching process, letterpress, screen painting, transfer printing, ink-jet or applying forms here.Be similar to the release structure 412 that forms the patterning of the 3rd embodiment through film-etching process and film-photoetching-etching process respectively owing to form the mode of the first release structure 512a of patterning through film-etching process and film-photoetching-etching process; Therefore, i.e. no longer repeat specification here.The first release structure 512a selects for use heavy industry easily and can resistant to elevated temperatures glue material.Heavy industry is easy to the glue material and can removes easily, makes that support plate 511 can repeat to recycle.In addition, the glue material has the situation that resistant to elevated temperatures characteristic can avoid in manufacture craft, producing bubble or cracking.Heavy industry easily and can resistant to elevated temperatures glue material can for example be that acryl is that glue material or silicon Li Kang (Silicone) are the glue material.Acryl is that the glue material can be pattern of fever attitude or UV kenel.The acryl of pattern of fever attitude is that the adhesion strength of glue material when low temperature descends, and the acryl of UV kenel is that glue material adhesion strength when exposing to the sun according to specific wavelength descends.In addition, silicon Li Kang is that the glue material main feature mode that man-hour can physics of attaching most importance to removes, and temperature tolerance is good.
Then, shown in Fig. 7 C, form the second release structure 512b on support plate 511, to form bearing part 510.The second release structure 512b has second surface 512s2.In the present embodiment; The second release structure 512b can film-etching process, the mode of film-photoetching-etching process, letterpress, screen painting, transfer printing, ink-jet or applying forms; And the second release structure 512b selects for use endurance good, high temperature resistant; And with the high material of support plate 511 adhesive force, for example frame glue (Seal).Be similar to the release structure 112 that forms the patterning of first embodiment through film-etching process and film-photoetching-etching process respectively owing to form the mode of the second release structure 512b of patterning through film-etching process and film-photoetching-etching process; Therefore, i.e. no longer repeat specification here.
Then, shown in Fig. 7 D, form material layer 520 on bearing part 510.In the present embodiment, material layer 520 comprises surface-treated layer 521 and substrate material layer 522.Both are unlikely to separate because selecting for use on the material, surface-treated layer 521 make in the element manufacture craft with the adhesive force of 522 of substrate material layers, and easily both is separated after accomplishing the device substrate cutting.The surface-treated layer 521 contact first surface 512s1 of a part, and the surface-treated layer 521 contact second surface 512s2 of another part, and substrate material layer 522 is positioned on the surface-treated layer 521.In other words, substrate material layer 522 can't touch first surface 512s1 and second surface 512s2.The material of surface-treated layer 521 can be the remover of being enumerated among the 3rd embodiment, and surface-treated layer 521 can for example be to be formed in advance on the substrate material layer 522, to form material layer 520.Because selecting for use on the material, the surface-treated layer 521 of material layer 520 and the adhesive force of second surface 512s2 are greater than the surface-treated layer 521 of material layer 520 and the adhesive force of first surface 512s1.
Then, in Fig. 7 E, form element 530 on material layer 520.
Then, in Fig. 7 F, material layer 520 is cut, to form device substrate 500 along line of cut B4.Device substrate 500 and bearing part 510 are separated from each other.
Owing to form first release structure 512a of this patterning and manufacture craft mode and the mechanism that this second release structure 512b does not need significantly to change present display, even need not change, so cost have advantage.
Please with reference to Fig. 8 A～Fig. 8 D, it illustrates the schematic flow sheet according to the manufacturing approach of the another kind of device substrate of fourth embodiment of the invention.Through being similar to the formed bearing part 510 ' of step among Fig. 7 A～Fig. 7 C shown in Fig. 8 A.Bearing part 510 ' has first surface 512s1 ' and second surface 512s2 ', and second surface 512s2 ' be positioned at first surface 512s1 ' around.
Then, shown in Fig. 8 B, form material layer 520 ' on bearing part 510 '.The material layer 520 ' of a part covers first surface 512s1 ', and the material layer 520 ' of another part covers second surface 512s2 '.In other words, material layer 520 ' the contact first surface 512s1 ' of this part, and the material layer 520 ' of this part contacts second surface 512s2 ' in addition.Because selecting for use on the material, the adhesive force of material layer 520 ' and second surface 512s2 ' is greater than the adhesive force of material layer 520 ' with first surface 512s1 '.
Then, in Fig. 8 C, form element 530 ' on material layer 520 '.
Then, in Fig. 8 D, material layer 520 ' is cut, to form device substrate 500 ' along line of cut B4 '.Device substrate 500 ' and bearing part 510 ' are separated from each other.
Thus, formed device substrate 500 ' can have the advantage of the device substrate 500 that is similar among Fig. 7 F among Fig. 8 D.
In above-mentioned first to the 4th embodiment according to the flow chart among Fig. 1, device substrate and the bearing part processed are separated from each other.That is to say that device substrate does not comprise any element or the structure of bearing part.Under comparing, the device substrate of the 5th following embodiment also comprises release structure.Below further specify.
The 5th embodiment
Please with reference to Fig. 9 A～Fig. 9 E and Figure 10, Fig. 9 A～Fig. 9 E illustrates the schematic flow sheet according to the manufacturing approach of the device substrate of fifth embodiment of the invention, and Figure 10 illustrates the flow chart according to the manufacturing approach of the device substrate of fifth embodiment of the invention.
Shown in Fig. 9 A, in step S701, support plate 611 is provided, support plate 611 has second surface 611s2.
Then; Shown in Fig. 9 B; In step S703; The release structure 612 that forms patterning with film-etching process, film-photoetching-etching process, letterpress, screen painting, transfer printing, ink-jet or laminating type is on the second surface 611s2 of support plate 611, to form bearing part 610.Be similar to the release structure 412 that forms the patterning of the 3rd embodiment through film-etching process and film-photoetching-etching process respectively owing to form the mode of the release structure 612 of patterning through film-etching process and film-photoetching-etching process; Therefore, i.e. no longer repeat specification here.Release structure 612 has first surface 612s1, second surface 611s2 be positioned at first surface 612s1 around.In the present embodiment, the material of release structure 612 for example is that (Polyimide PI), or mixes low adhesive force additive with it to pi.
Then, shown in Fig. 9 C, in step S705, form material layer 620 on bearing part 610.The material of material layer 620 for example is that (Polyimide PI) mixes the high adhesion force additive to pi.The material layer 620 of a part covers second surface 611s2, and the material layer 620 of another part covers first surface 612s1.Selecting for use of high adhesion force additive through material layer 620, the adhesive force of material layer 620 and second surface 611s2 is greater than the adhesive force of material layer 620 with first surface 612s1.The adhesive force of first surface 612s1 and material layer 620 needs device substrate 620 and separating easily of bearing part 610 are carried out.In addition, can the structure of integral body not exerted an adverse impact in the manufacture craft that the adhesive force of second surface 611s2 and material layer 620 here needs to avoid follow-up.For instance, the adhesive force between second surface 611s2 and the material layer 620 must be guaranteed in the element manufacture craft, and material layer 620 separates with bearing part 610 unlikely splittings (peeling); In addition for instance, the adhesive force between second surface 611s2 and the material layer 620 must guarantee that the chemical liquids in follow-up the processing can not be seeped between material layer 620 and the bearing part 610 easily, breaks away from manufacture craft to avoid material layer 620 and bearing part 610.
Then, shown in Fig. 9 D, in step S707, form element 630 on material layer 620.Element 630 can for example be active formula element, passive type element, touch controllable function element or colored photic resist layer.
Then, shown in Fig. 9 E, in step S709, this material layer 620 is cut, to form device substrate 600 along line of cut B5.Device substrate 600 is separated from each other with bearing part 610, and device substrate 600 comprises release structure 612.Step among Fig. 9 E for example is to cut through laser, flywheel knife or die-cut mode.This line of cut B5 is around element 630, and its scope is between the border of this element 630 and those material layers 620.In addition, the material layer 620 that refers to this layer of material covers first surface 612s1 between the border of those material layers 620 here and the material layer 620 of other this part cover the boundary of the material layer 620 of second surface 611s2.
The release structure 612 that forms this patterning does not need significantly to change the manufacture craft mode and the mechanism of present display, even need not change; In addition, because the material pi of release structure 612 is a present display manufacture craft material commonly used, so cost has advantage.
In sum, though combine above preferred embodiment to disclose the present invention, it is not in order to limit the present invention.Be familiar with this operator in the technical field under the present invention, do not breaking away from the spirit and scope of the present invention, can do various changes and retouching.Therefore, protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (22)
1. the manufacturing approach of a device substrate comprises:
One bearing part is provided, and this bearing part has first surface and second surface, this second surface be positioned at this first surface around;
Form a material layer on this bearing part, this first surface of this layer of material covers of a part, and this second surface of this layer of material covers of another part, the adhesive force of this material layer and this second surface is greater than the adhesive force of this material layer and this first surface;
Form an element on this material layer; And
Along a line of cut this material layer is cut, to form an element substrate, this device substrate and this bearing part are separated from each other.
2. the manufacturing approach of device substrate as claimed in claim 1 wherein provides this step of this bearing part to comprise:
One support plate is provided, and this support plate has this first surface; And
Form a release structure on this first surface of this support plate, to form this bearing part, this release structure has this second surface.
3. the manufacturing approach of device substrate as claimed in claim 2, wherein in this step that forms this release structure, this release structure forms with the mode of film-etching process.
4. the manufacturing approach of device substrate as claimed in claim 2, wherein in this step that forms this release structure, this release structure forms with film-photoetching-etching process, surface printing, screen painting, transfer printing, ink-jet or laminating type
5. the manufacturing approach of device substrate as claimed in claim 2, wherein in this step that forms this release structure, this release structure comprises pi.
6. the manufacturing approach of device substrate as claimed in claim 2, wherein in this step that forms this release structure, this release structure comprises a plurality of particulates.
7. the manufacturing approach of device substrate as claimed in claim 1 wherein provides this step of this bearing part to comprise:
One support plate is provided, and this support plate has this first surface; And
This first surface of a roughening part to form this bearing part, is formed this second surface by this first surface of this part of roughening, and the roughness of this second surface is greater than the roughness of this first surface.
8. the manufacturing approach of device substrate as claimed in claim 7, wherein this step of roughening comprises:
Form a plurality of particulates on this first surface of this part, make those particulates form this second surface.
9. the manufacturing approach of device substrate as claimed in claim 7, wherein this step of roughening comprises:
This first surface of this part of this support plate of etching.
10. the manufacturing approach of device substrate as claimed in claim 7, wherein this step of roughening comprises:
Grind this first surface of this part of this support plate.
11. the manufacturing approach of device substrate as claimed in claim 1 wherein provides this step of this bearing part to comprise:
One support plate is provided, and this support plate has this second surface; And
Form a release structure on this second surface of this support plate, to form this bearing part, this release structure has this first surface.
12. the manufacturing approach of device substrate as claimed in claim 11, wherein in this step that forms this release structure, this release structure forms with the mode of film-etching process or film-photoetching-etching process.
13. the manufacturing approach of device substrate as claimed in claim 11, wherein in this step that forms this release structure, this release structure forms with the mode of surface printing, screen painting, transfer printing, ink-jet or applying.
14. the manufacturing approach of device substrate as claimed in claim 11, this step that wherein forms this release structure comprises:
Form a separated type material layer on this second surface of this support plate;
Put a mask arrangement above this separated type material layer, this mask arrangement is this separated type material layer of cover part at least; And
Remove this separated type material layer that is not covered, make remaining this separated type material layer form this release structure by this mask arrangement.
15. the manufacturing approach of device substrate as claimed in claim 14, this step that wherein removes removes this separated type material layer that is not covered by this mask arrangement with the mode of plasma bombardment or side washing.
16. the manufacturing approach of device substrate as claimed in claim 1 wherein provides this step of this bearing part to comprise:
One support plate is provided;
Form one first release structure on this support plate, this first release structure has this first surface; And
Form this second release structure on this support plate, to form this bearing part, this second release structure has this second surface;
Wherein in this step that forms this material layer, this material layer of part contacts this first surface, in addition this material layer contact second surface.
17. the manufacturing approach of device substrate as claimed in claim 16 wherein forms in this step of this first release structure, this first release structure forms with the mode of film-etching process or film-photoetching-etching process.
18. the manufacturing approach of device substrate as claimed in claim 16 wherein forms in this step of this first release structure, this first release structure forms with the mode of surface printing, screen painting, transfer printing, ink-jet or applying.
19. the manufacturing approach of device substrate as claimed in claim 18, wherein the material of this first release structure is that acryl is that glue material or silicon Li Kang (Silicone) are the glue material.
20. the manufacturing approach of device substrate as claimed in claim 16 wherein forms in this step of this second release structure, this second release structure forms with the mode of film-etching process or film-photoetching-etching process.
21. the manufacturing approach of device substrate as claimed in claim 16 wherein forms in this step of this second release structure, this second release structure forms with the mode of surface printing, screen painting, transfer printing, ink-jet or applying.
22. the manufacturing approach of a device substrate comprises:
One support plate is provided;
Form a release structure on this support plate, to form a bearing part, this release structure has first surface and is formed on the second surface of this support plate, this second surface be positioned at this first surface around;
Form a material layer on this bearing part, this first surface of this layer of material covers of a part, and this second surface of this layer of material covers of another part, the adhesive force of this material layer and this second surface is greater than the adhesive force of this material layer and this first surface;
Form an element on this material layer; And
Along a line of cut this material layer is cut, to form an element substrate, this device substrate and this bearing part are separated from each other, and this device substrate comprises this release structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110035089.1A CN102637575B (en) | 2011-02-09 | 2011-02-09 | Manufacturing method of component baseplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110035089.1A CN102637575B (en) | 2011-02-09 | 2011-02-09 | Manufacturing method of component baseplate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102637575A true CN102637575A (en) | 2012-08-15 |
| CN102637575B CN102637575B (en) | 2015-07-01 |
Family
ID=46621929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110035089.1A Active CN102637575B (en) | 2011-02-09 | 2011-02-09 | Manufacturing method of component baseplate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102637575B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035490A (en) * | 2012-12-11 | 2013-04-10 | 京东方科技集团股份有限公司 | Preparation method for flexible display device |
| CN103700672A (en) * | 2013-12-24 | 2014-04-02 | 华映视讯（吴江）有限公司 | Flexible assembly substrate and manufacturing method thereof |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
| US9484552B2 (en) | 2013-12-17 | 2016-11-01 | Chunghwa Picture Tubes, Ltd. | Manufacturing method of flexible device substrate |
| CN109830469A (en) * | 2013-08-05 | 2019-05-31 | 日月光半导体制造股份有限公司 | Semiconductor package assembly and a manufacturing method thereof |
| CN111048461A (en) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | Release front structure of electronic device and manufacturing method of electronic device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1746733A (en) * | 2004-09-11 | 2006-03-15 | 三星电子株式会社 | Be used to transmit the anchor clamps of LCD panel and the manufacture method of LCD |
| CN101127343A (en) * | 2006-08-18 | 2008-02-20 | 巨擘科技股份有限公司 | Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device |
| WO2009126544A1 (en) * | 2008-04-08 | 2009-10-15 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| JP2010010247A (en) * | 2008-06-25 | 2010-01-14 | Sharp Corp | Substrate carrying tool and method of manufacturing element substrate |
| US20100124635A1 (en) * | 2008-11-18 | 2010-05-20 | Tae-Woong Kim | Method of Manufacturing Electronic Apparatus including Plastic Substrate, Electronic Apparatus Manufactured Using the Method, and Apparatus for Use in the Method |
| CN101833215A (en) * | 2009-03-09 | 2010-09-15 | 财团法人工业技术研究院 | Transfer structure of flexible electronic device and manufacturing method thereof |
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| CN101924066A (en) * | 2009-06-09 | 2010-12-22 | 财团法人工业技术研究院 | Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device |
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
-
2011
- 2011-02-09 CN CN201110035089.1A patent/CN102637575B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1746733A (en) * | 2004-09-11 | 2006-03-15 | 三星电子株式会社 | Be used to transmit the anchor clamps of LCD panel and the manufacture method of LCD |
| CN101127343A (en) * | 2006-08-18 | 2008-02-20 | 巨擘科技股份有限公司 | Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| WO2009126544A1 (en) * | 2008-04-08 | 2009-10-15 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| JP2010010247A (en) * | 2008-06-25 | 2010-01-14 | Sharp Corp | Substrate carrying tool and method of manufacturing element substrate |
| US20100124635A1 (en) * | 2008-11-18 | 2010-05-20 | Tae-Woong Kim | Method of Manufacturing Electronic Apparatus including Plastic Substrate, Electronic Apparatus Manufactured Using the Method, and Apparatus for Use in the Method |
| CN101833215A (en) * | 2009-03-09 | 2010-09-15 | 财团法人工业技术研究院 | Transfer structure of flexible electronic device and manufacturing method thereof |
| CN101924066A (en) * | 2009-06-09 | 2010-12-22 | 财团法人工业技术研究院 | Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device |
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035490A (en) * | 2012-12-11 | 2013-04-10 | 京东方科技集团股份有限公司 | Preparation method for flexible display device |
| US9131587B2 (en) | 2012-12-11 | 2015-09-08 | Boe Technology Group Co., Ltd. | Method for manufacturing a flexible display device |
| EP2743753B1 (en) * | 2012-12-11 | 2020-03-11 | Boe Technology Group Co. Ltd. | Method for manufacturing a flexible display device |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
| CN109830469A (en) * | 2013-08-05 | 2019-05-31 | 日月光半导体制造股份有限公司 | Semiconductor package assembly and a manufacturing method thereof |
| US9484552B2 (en) | 2013-12-17 | 2016-11-01 | Chunghwa Picture Tubes, Ltd. | Manufacturing method of flexible device substrate |
| CN103700672A (en) * | 2013-12-24 | 2014-04-02 | 华映视讯（吴江）有限公司 | Flexible assembly substrate and manufacturing method thereof |
| CN111048461A (en) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | Release front structure of electronic device and manufacturing method of electronic device |
| CN111048461B (en) * | 2018-10-12 | 2022-06-03 | 瀚宇彩晶股份有限公司 | Release front structure of electronic device and manufacturing method of electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102637575B (en) | 2015-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102637575A (en) | Manufacturing method of component baseplate | |
| TWI538815B (en) | Method and apparatus for joining together multiple functional layers of a flexible display | |
| US9626057B2 (en) | Touch panel with flexible touch sensor and method for manufacturing the same | |
| US10022947B2 (en) | Laminated structure manufacturing method, laminated structure, and electronic apparatus | |
| JP5143015B2 (en) | Polarizing plate protective film, polarizing plate and resistive touch panel | |
| US9594193B2 (en) | Printing plate, scattering layer, method for fabricating the same, and display apparatus | |
| US20160355003A1 (en) | Method of bonding cover plate and touch sensing film and touch screen | |
| US20110005815A1 (en) | Conductive plate and touch panel including the same | |
| JP5098450B2 (en) | Method for producing uneven pattern forming sheet and uneven pattern forming sheet | |
| JP2013045633A (en) | Method for producing transparent conductive film | |
| TW201212749A (en) | Method for patterning a flexible substrate | |
| JP6581200B2 (en) | Composition for electrode protective film of capacitance type input device, electrode protective film of capacitance type input device, transfer film, laminate, capacitance type input device and image display device. | |
| JP2016197554A (en) | Production method of transparent wiring member and transparent wiring member | |
| JP2015069508A (en) | Touch panel | |
| JP2015530942A (en) | Laminated body including pressure-sensitive adhesive layer and method for producing the same | |
| US20210333911A1 (en) | Touch Display Device | |
| JP2009180871A (en) | Optical component using compound substrate and its manufacturing method | |
| JP6677379B2 (en) | Circuit board manufacturing method | |
| CN107976864A (en) | Imprint mold and its manufacture method | |
| TWI486109B (en) | Method for manufacturing element substrate | |
| CN114020171B (en) | Manufacturing method of metal sensing electrode structure, touch display device and mobile terminal | |
| JP5679211B2 (en) | Transfer sheet for transfer printing and manufacturing method thereof | |
| JP2004521502A (en) | Transfer printing | |
| JP5760818B2 (en) | Manufacturing method of laminate | |
| CN104281302A (en) | Touch structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Shenzhen, Guangdong, China Longhua Town, Baoan District province Foxconn science and Technology Industrial Park E District 4, 1 floor Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Applicant after: Innolux Display Group Address before: Shenzhen, Guangdong, China Longhua Town, Baoan District province Foxconn science and Technology Industrial Park E District 4, 1 floor Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Applicant before: Chimei Optoelectronics Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: QIMEI ELECTRONIC CO LTD TO: INNOLUX DISPLAY CORPORATION |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |