CN101924066A - Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device - Google Patents
Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device Download PDFInfo
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- CN101924066A CN101924066A CN2009101469970A CN200910146997A CN101924066A CN 101924066 A CN101924066 A CN 101924066A CN 2009101469970 A CN2009101469970 A CN 2009101469970A CN 200910146997 A CN200910146997 A CN 200910146997A CN 101924066 A CN101924066 A CN 101924066A
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- flexible substrate
- support plate
- flexible
- electronic device
- substrate
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Abstract
The invention provides a method for separating a flexible substrate from a support plate and a manufacturing method of a flexible electronic device. The method comprises the following steps: providing the flexible substrate which is provided with a lower surface; carrying out surface treatment on the lower surface of the flexible substrate to form a lower surface with an anti-adhesion characteristic; configuring the flexible substrate on the support plate by an adhesive layer, wherein, the lower surface with the anti-adhesion characteristic faces towards the support plate; and cutting and separating the flexible substrate configured on the support plate.
Description
[technical field]
The present invention is about a kind of method of separating flexible substrate from support plate, particularly about a kind of by after the surface treatment with the method for separating flexible substrate from support plate.
[background technology]
Flat-panel screens is in the large tracts of land development, and the characteristic with lighter, thinner and deflection will become the target that following display is mainly pursued.Therefore, make the development trend that two-d display panel will become following display with flexible substrate.
The manufacture method of the thin-film transistor array base-plate of present bendable flat-panel screens, being to use existing glass substrate to prepare equipment makes, earlier plastic base is pasted on support plate by adhesive phase, on plastic base, carry out thin-film transistor (thin film transistor, TFT) manufacturing step of element such as grade again.Though this kind mode can reach the making flow process of sheet to sheet (Sheet to Sheet), also reach general preparation requirement, but after elements such as finishing thin-film transistor was made, the problem that must face was that the plastic base that how successfully this to be had thin film transistor (TFT) array takes off from support plate.
[summary of the invention]
One of the present invention execution mode proposes a kind of method of separating flexible substrate from support plate, comprising: flexible substrate is provided, and wherein this flexible substrate has lower surface; Lower surface to this flexible substrate carries out surface treatment, has the lower surface of anti-adhesion characteristic with formation; By adhesive phase this flexible substrate is disposed on the support plate, wherein this lower surface with anti-adhesion characteristic is towards this support plate; And, this flexible substrate that is disposed on this support plate is cut disengaging.
Another execution mode of the present invention also provides a kind of manufacture method of flexible electronic device, comprises: flexible substrate is provided, and wherein this flexible substrate has upper surface and lower surface; Lower surface to this flexible substrate carries out surface treatment, and the zone so that formation has anti-adhesion characteristic partly is not defined as the zone with tack and carry out surface-treated; By adhesive phase this flexible substrate is disposed on the support plate, wherein this adhesive phase cover this flexible substrate this have the zone of anti-adhesion characteristic and this has the zone of tack; Form electronic component in the upper surface of this flexible substrate; And, cut being positioned at this this flexible substrate with zone of anti-adhesion characteristic, obtain flexible electronic device.
Below by several embodiment and cooperate appended graphicly, illustrating further the present invention, but be not the scope that is used for limiting the present invention, scope of the present invention should be as the criterion with claims.
[description of drawings]
Fig. 1 a-1d is a series of profiles, shows the method for the described separating flexible substrate from support plate of an embodiment of the present invention.
Fig. 2 shows the described surface treatment that utilizes chemical reagent to carry out flexible substrate of an embodiment of the present invention.
Fig. 3 a-3e is a series of profiles, shows the method for the described separating flexible substrate from support plate of another execution mode of the present invention.
Fig. 4 is the upward view of structure shown in Fig. 3 c.
Fig. 5 shows the described surface treated flexible substrate of another execution mode of the present invention, and it comprises the zone that has anti-adhesion characteristic through patterned.
Fig. 6 is a profile, shows the flexible substrate of cutting gained, and its size can have the size in the zone of anti-adhesion characteristic less than this.
Fig. 7 a-7d is a series of profiles, and demonstration an embodiment of the present invention is described reacts chemical reagent and flexible substrate in the rotary coating mode, forms the manufacturing process in the zone with anti-adhesion characteristic.
Fig. 8 a-8d is a series of profiles, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the manufacturing process in the zone with anti-adhesion characteristic in the impression mode.
Fig. 9 a-9d is a series of profiles, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the manufacturing process in the zone with anti-adhesion characteristic with roll coating model.
Figure 10 is a profile, and demonstration an embodiment of the present invention with chemical reagent and flexible substrate reaction, forms the zone that patterning has anti-adhesion characteristic with roll-type letterpress technology.
Figure 11 a-11b is a series of profiles, shows the manufacture method of the described flexible electronic device of an embodiment of the present invention.
[main element symbol description]
10～flexible substrate;
11～lower surface;
12～chemical reagent;
13～have a zone of tack;
14～adhesive phase;
The lower surface of 15～tool anti-adhesion characteristic;
16～support plate;
17～have a zone of anti-adhesion characteristic;
18～roller;
19～pressing direction;
21～line of cut;
Flexible substrate after 22～cutting;
24～photoresist layer;
25～upper surface;
26～template;
28～roller;
29～coating direction;
30～electronic component; And
40～flexible electronic device.
[execution mode]
Below, please cooperate graphicly, describe the method for the described separating flexible substrate from support plate of the embodiment of the invention in detail:
At first, please refer to Fig. 1 a, flexible substrate 10 is provided, wherein this flexible substrate 10 has lower surface 11.This flexible substrate 10 can comprise polymeric substrate or metal substrate, in this execution mode, can be polymeric substrate, polyimides (polyimide for example, PI), Merlon (polycarbonate, PC), polyether sulfone (polyethersulfone, PES), polynorbornene (polynorbornene, PNB), Polyetherimide (polyetherimide, PEI), PEN (polyethylene naphthalate, PEN) or PETG (polyethylene terephthalate, PET).
Then, please refer to Fig. 1 b, the lower surface 11 of this flexible substrate 10 is carried out surface treatment, have the lower surface 15 of anti-adhesion characteristic with formation.At this, this surface treatment can comprise to provide on the lower surface 11 that chemical reagent 12 is formed at this flexible substrate 10 and with this flexible substrate 10 reacts (please refer to Fig. 2), obtains having the flexible substrate 10 (please refer to Fig. 1 b) of the lower surface 15 of anti-adhesion characteristic.In addition, another execution mode according to the present invention, the lower surface 11 of this flexible substrate 10 is carried out surface treatment can be plasma treatment, ion beam bombardment, electron bombard, etch processes, friction treatment or above-mentioned combination, mainly utilize plasma to come treatment surface, with the argon gas is carrier gas, and reaction atmosphere is CF
2, CF
3Or contain silica-based gas, under atmospheric environment, create stable plasma.
It should be noted that, the lower surface 11 of this flexible substrate 10 is after this surface treatment, can be consumed, cover or replace with the functional group that follow-up formed adhesive phase produces bond on this lower surface 11, cause the lower surface with anti-adhesion characteristic 15 of gained and the tack between the follow-up formed adhesive phase significantly to reduce.At this, the functional group of these flexible substrate 10 upper surfaces and the producible bond of adhesive phase comprise ionic bond, covalent bond or hydrogen bond, and wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
The employed chemical reagent 12 of one of the present invention execution mode has the structure that functional group with the lower surface 11 of flexible substrate 10 carries out addition reaction, sloughs reaction or substitution reaction, and for instance, this chemical reagent 12 can have following structure:
Wherein, W is C, Si or Ge; X is S or Se; Y is C or S;
R
1, R
2And R
3Independent separately, and be hydrogen, alkyl, alkyl ,-OR or its make up, wherein R is a carbon number between 1～18 alkyl;
R
4Be F, C1, Br, I, carboxyl, amido, amino, cyano group, amide groups, haloalkyl or its combination; And
R
5And R
6System is independent separately and be F, Cl, Br, I, alkyl, alkyl, carboxyl, amido, amide groups, haloalkyl or its combination.
In this application, R
1, R
2, R
3, R
4, R
5And R
6" alkyl " in the definition can comprise that carbon number is 1～6 alkyl; " alkyl " can comprise that carbon number is 1～6 straight or branched alkyl, for example methyl, ethyl group, 2-methyl ethane base etc.; " haloalkyl " can comprise that carbon number is 1～5 haloalkyl.
For instance, this chemical reagent 12 can comprise: dimethylchlorosilane, trim,ethylchlorosilane, trimethyl chloromethanes, 1-chloromethyl-1-trimethyl silane, 2-N-Propyl Bromide, dimethyldichlorosilane, trimethyl silicon fluoride, bromotrimethylsilane, Iodotrimethylsilane, trimethylsilyl cyanide, thionyl chloride, chlorotriethyl silane or its mixing.The use form of this chemical reagent 12 is also unrestricted, can be liquid state, gaseous state or solid-state reagent, and preferable is liquid reagent, and its boiling point can be less than 200 ℃, and preferable less than 100 ℃, better is just can dry liquid when normal temperature.
In one embodiment, handle flexible substrate with chemical reagent (is example with thionyl chloride (thionyl chloride) at this).In one of the present invention execution mode, the temperature of reacting can be room temperature, and the time of reaction can be 1 minute.
Then, please refer to Fig. 1 c, by adhesive phase 14 this flexible substrate 10 is disposed on the support plate 16, wherein this lower surface 15 with anti-adhesion characteristic contacts with this adhesive phase 14, and towards this support plate 16.Then, utilize roller 18, flexible substrate 10 closely is pasted to this adhesive phase 14 towards pressing direction 19.This support plate 16 is for generally having the hard substrate of certain rigidity material, and it can for example be metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer, in this execution mode, can be glass substrate.In this execution mode,, 15 surface energies of the lower surface with anti-adhesion characteristic of this flexible substrate 10 and this adhesive phase 14 consumed and convert to the functional group that other can not produce bond with adhesive phase 14 by this chemical reagent 12 because producing the functional group of bond.Therefore, this adhesive phase 14 and surface treated flexible substrate 10 degree of adhering to (adherence) are compared with not surface treated flexible substrate 10, can decline to a great extent.At last, please refer to Fig. 1 d, this flexible substrate 10 is separated.
In addition, please refer to following preparation process, be another execution mode of method of separating flexible substrate from support plate of the present invention.
At first, please refer to Fig. 3 a, flexible substrate 10 is provided, wherein this flexible substrate 10 has lower surface 11.Then, please refer to Fig. 3 b and 3c, the part lower surface 11 of this flexible substrate 10 is carried out surface treatment, the zone 17 that has anti-adhesion characteristic with formation, do not carry out surface-treated and partly then be defined as the zone 13 with tack, and please refer to Fig. 5, it is the upward view of Fig. 3 c.This surface treatment comprises providing on the part lower surface 11 that chemical reagent 12 is formed at this flexible substrate 10 and with this flexible substrate 10 reacts (please refer to Fig. 3 b), obtains comprising the flexible substrate 10 (please refer to Fig. 3 c) in the zone 17 with anti-adhesion characteristic.Formed zone 17 with anti-adhesion characteristic can be graphical form (for example rectangle, circle or other figures); In addition, this zone 17 with anti-adhesion characteristic also can comprise a plurality of blocks, as shown in Figure 4.
Then, please refer to Fig. 3 d, by adhesive phase 14 this flexible substrate 10 is disposed on the support plate 16, wherein this lower surface 15 with anti-adhesion characteristic contacts with this adhesive phase 14, and towards this support plate 16.Then, utilize roller 18, flexible substrate 10 closely is pasted to this adhesive phase 14 towards pressing direction 19.It should be noted that this adhesive phase 14 is pasted on the lower surface 11 of this flexible substrate 10, and this adhesive phase 14 covers this zone with anti-adhesion characteristic 17 simultaneously and this has the zone 13 of tack.This adhesive phase 14 and this flexible substrate in this has the zone of anti-adhesion characteristic 17 degree of adhering to less than this adhesive phase 14 and this flexible substrate degree of adhering to of 13 in this has tack regional, and this zone 13 with tack provides the anchorage of these flexible substrate 10 integral body on adhesive phase 14, helps the subsequent preparation process of this flexible substrate 10.For instance, when this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 13 of tack when maintaining 1B-5B, this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 17 of anti-adhesion characteristic is between 0B-1B; In another execution mode of the present invention, when this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 13 of tack when maintaining 2B-5B, this flexible substrate 10 and this adhesive phase 14 degree of adhering to (adherence) in this has the zone 17 of anti-adhesion characteristic is between 0B-2B.
At last, please refer to Fig. 3 e, prolong flexible substrates 10 that 21 pairs of lines of cut are formed in this zone with anti-adhesion characteristic 17 and cut the flexible substrate 22 after obtaining cutting.This line of cut 21 can drop on the edge of this zone with anti-adhesion characteristic 17 (flexible substrate of handling through chemical reagent 10 just), and the size of the flexible substrate 22 after this cutting like this then has zone 17 measure-alike of anti-adhesion characteristic with this.In addition, please refer to Fig. 6, this line of cut 21 also can drop on the inboard of this zone with anti-adhesion characteristic 17 (flexible substrate of handling through chemical reagent 10 just), and so the size of the flexible substrate 22 after this cutting then has the size in the zone 17 of anti-adhesion characteristic less than this.
Embodiment of the present invention is described carries out surface treatment to this flexible substrate, and its employed chemical reagent can utilize immersion technology, rotary coating technology, stamping technique, scrape technology or roller coating technology is formed on this flexible substrate 10.
The execution mode one of according to the present invention, this chemical reagent 12 is formed on the flexible substrate 10 with rotary coating.At first, please refer to Fig. 7 a, utilize little shadow technology, on this flexible substrate 10, (be defined as lower surface 11) and form graphical photoresist layer 24, and expose the lower surface 11 that desire forms this zone with anti-adhesion characteristic; Then, please refer to Fig. 7 b, utilize the rotary coating mode to form this chemical reagent 12 in this lower surface that exposes 11; Treat to form zone 17 after chemical reagent 12 and flexible substrate 10 react, remove this photoresist layer 24 afterwards, please refer to Fig. 7 c and 7d with anti-adhesion characteristic.
In addition, another execution mode according to the present invention, this chemical reagent 12 is formed on the flexible substrate 10 with stamping technique.At first, please refer to Fig. 8 a, on template 26, form chemical reagent 12 coatings, and this template 26 is aimed at (alignment) with this flexible substrate 10, make these chemical reagent 12 coatings aim at the lower surface 11 that desire forms this zone with anti-adhesion characteristic; Then, please refer to Fig. 8 b, this template 26 is impressed (imprint) to this flexible substrate 10; Lower surface 11 reactions for the treatment of chemical reagent 12 and flexible substrate 10 remove this template 26 after forming and having the zone 17 of anti-adhesion characteristic, please refer to Fig. 8 c and 8d.
Moreover, the another execution mode according to the present invention, this chemical reagent 12 with scrape or roller coating technology shape on flexible substrate 10.At first, please refer to Fig. 9 a and 9b, utilize roller 28 (or scraper), chemical reagent 12 is coated the lower surface 11 that desire forms this zone with anti-adhesion characteristic, can obtain having the zone 17 of anti-adhesion characteristic, please refer to Fig. 9 c and 9d towards coating direction 29.
In addition, can also roll-type letterpress technology with the lower surface 11 of chemical reagent 12 patterned coated in this flexible substrate 10, in order to form the zone with anti-adhesion characteristic 17 of patterning, please refer to Figure 10.
One of the present invention execution mode also provides a kind of manufacture method of flexible electronic device, described according to an embodiment of the present invention, after finishing the described preparation process that flexible substrate 10 is adhered on the support plate 16 with adhesive phase 14 of Fig. 3 d, please refer to Figure 11 a, electronic component 30 can be formed at the upper surface 25 (with these lower surface 11 object settings) of this flexible substrate 10, then again the flexible substrate 10 that is formed with electronic component 30 is cut, can obtain flexible electronic device 40, please refer to Figure 11 b.Wherein the kind of this electronic component 30 there is no special restriction, can be known any electronic component that is formed on the deflection base material, comprise: thin film transistor (TFT) array, memory cell, plane display element, solar cell, semiconductor circuit or its combination.
The method of the described separating flexible substrate from support plate of embodiment of the present invention and the manufacture method of flexible electronic device, can make flexible substrate after the cutting complete by peeling off on the support plate, this method utilize surface treatment make flexible substrate surface easily consume with the functional group that adhesive phase forms bond (or cover, replacement, make to lose activity) fall.The embodiment of the invention can make flexible substrate surface-treated preparation process simple and cheap.
Though the present invention discloses as above with embodiment, so it is not in order to limiting the present invention, any those skilled in the art, and without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection range of the present invention is as the criterion with claims.
Claims (24)
1. the method for a separating flexible substrate from support plate comprises:
Flexible substrate is provided, and wherein this flexible substrate has lower surface;
Lower surface to this flexible substrate carries out surface treatment, has the lower surface of anti-adhesion characteristic with formation;
By adhesive phase this flexible substrate is disposed on the support plate, wherein this lower surface with anti-adhesion characteristic is towards this support plate; And
This flexible substrate that is disposed on this support plate is cut disengaging.
2. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this support plate comprises metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer.
3. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this flexible substrate comprises polymeric substrate or metal substrate.
4. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this polymeric substrate comprises polyimides, Merlon, polyether sulfone, polynorbornene, Polyetherimide, PEN or PETG.
5. the method for separating flexible substrate from support plate as claimed in claim 1, wherein the lower surface of this flexible substrate can be consumed, cover or replace with the functional group that this adhesive phase produces bond on the lower surface of this flexible substrate after this surface treatment.
6. the method for separating flexible substrate from support plate as claimed in claim 5, wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
7. the method for separating flexible substrate from support plate as claimed in claim 5, the bond that the functional group of this flexible substrate lower surface and adhesive phase produce comprises ionic bond, covalent bond or hydrogen bond.
8. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this surface treatment comprises:
Provide the lower surface of chemical reagent and this flexible substrate to react.
9. the method for separating flexible substrate from support plate as claimed in claim 8, wherein this chemical reagent system with immersion technology, rotary coating technology, stamping technique, scrape the lower surface that technology or roller coating technology are formed at this flexible substrate.
10. the method for separating flexible substrate from support plate as claimed in claim 1, wherein this surface treatment comprises: plasma treatment, ion beam bombardment, electron bombard, etch processes, friction treatment or its combination.
11. the manufacture method of a flexible electronic device comprises:
Flexible substrate is provided, and wherein this flexible substrate has upper surface and lower surface;
Lower surface to this flexible substrate carries out surface treatment, and the zone so that formation has anti-adhesion characteristic partly is not defined as the zone with tack and carry out surface-treated;
By adhesive phase this flexible substrate is disposed on the support plate, wherein this adhesive phase cover this flexible substrate this have the zone of anti-adhesion characteristic and this has the zone of tack;
Form electronic component in the upper surface of this flexible substrate; And
Cut being positioned at this this flexible substrate, obtain flexible electronic device with zone of anti-adhesion characteristic.
12. the manufacture method of flexible electronic device as claimed in claim 11, wherein this support plate comprises metal substrate, plastic base, ceramic substrate, glass or Silicon Wafer.
13. the manufacture method of flexible electronic device as claimed in claim 11, wherein this flexible substrate comprises polymeric substrate or metal substrate.
14. the manufacture method of flexible electronic device as claimed in claim 13, wherein this polymeric substrate comprises polyimides, Merlon, polyether sulfone, polynorbornene, Polyetherimide, PEN or PETG.
15. the manufacture method of flexible electronic device as claimed in claim 11, wherein the lower surface of this flexible substrate can be consumed, cover or replace with the functional group of this adhesive phase generation bond on the lower surface of this flexible substrate after this surface treatment.
16. the manufacture method of flexible electronic device as claimed in claim 15, wherein this can comprise hydroxyl, carboxyl, amido or ester group with the functional group that adhesive phase produces bond.
17. the manufacture method of flexible electronic device as claimed in claim 15, the bond that the functional group of this flexible substrate lower surface and adhesive phase produce comprises ionic bond, covalent bond or hydrogen bond.
18. the manufacture method of flexible electronic device as claimed in claim 11, wherein this surface treatment comprises:
Provide the lower surface of chemical reagent and this flexible substrate to react.
19. the manufacture method of flexible electronic device as claimed in claim 18, wherein this chemical reagent system with immersion technology, rotary coating technology, stamping technique, scrape the lower surface that technology or roller coating technology are formed at this flexible substrate.
20. the manufacture method of flexible electronic device as claimed in claim 11, wherein this surface treatment comprises: plasma treatment, ion beam bombardment, electron bombard, etch processes, friction treatment or its combination.
21. the manufacture method of flexible electronic device as claimed in claim 11, wherein, this flexible substrate and this adhesive phase degree of adhering in this has the zone of anti-adhesion characteristic is less than this flexible substrate and this adhesive phase degree of adhering in this has tack regional.
22. the manufacture method of flexible electronic device as claimed in claim 11, wherein the size of this flexible electronic device and this have zone measure-alike of anti-adhesion characteristic.
23. the manufacture method of flexible electronic device as claimed in claim 11, wherein the size of this flexible electronic device has the size in the zone of anti-adhesion characteristic less than this.
24. the manufacture method of flexible electronic device as claimed in claim 11, wherein this electronic component comprises: thin film transistor (TFT) array, memory cell, plane display element, solar cell, semiconductor circuit or its combination.
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|---|---|---|---|
| CN 200910146997 CN101924066B (en) | 2009-06-09 | 2009-06-09 | Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device |
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|---|---|---|---|
| CN 200910146997 CN101924066B (en) | 2009-06-09 | 2009-06-09 | Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device |
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| CN101924066B CN101924066B (en) | 2013-05-08 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102637575A (en) * | 2011-02-09 | 2012-08-15 | 群康科技(深圳)有限公司 | Manufacturing method of component baseplate |
| CN103515313A (en) * | 2012-10-29 | 2014-01-15 | Tcl集团股份有限公司 | Stripping method of flexible substrate for displayer |
| CN105280841A (en) * | 2014-07-18 | 2016-01-27 | Tcl集团股份有限公司 | Flexible AMOLED display device and manufacture method thereof |
| CN106450027A (en) * | 2016-10-31 | 2017-02-22 | 昆山维信诺科技有限公司 | Flexible organic light-emitting display screen and preparation method thereof |
| CN108257913A (en) * | 2016-12-29 | 2018-07-06 | 上海和辉光电有限公司 | A kind of preparation method of flexible display |
| CN109840031A (en) * | 2018-12-28 | 2019-06-04 | 深圳莱宝高科技股份有限公司 | A kind of flexible base plate processing and treating method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313827A (en) * | 2005-05-09 | 2006-11-16 | Seiko Epson Corp | Method of manufacturing thin film device and electronic apparatus |
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2009
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637575A (en) * | 2011-02-09 | 2012-08-15 | 群康科技(深圳)有限公司 | Manufacturing method of component baseplate |
| CN103515313A (en) * | 2012-10-29 | 2014-01-15 | Tcl集团股份有限公司 | Stripping method of flexible substrate for displayer |
| CN103515313B (en) * | 2012-10-29 | 2015-10-28 | Tcl集团股份有限公司 | A kind of stripping means of display flexible base, board |
| CN105280841A (en) * | 2014-07-18 | 2016-01-27 | Tcl集团股份有限公司 | Flexible AMOLED display device and manufacture method thereof |
| CN105280841B (en) * | 2014-07-18 | 2017-06-06 | Tcl集团股份有限公司 | A kind of flexible displayer part and preparation method thereof |
| CN106450027A (en) * | 2016-10-31 | 2017-02-22 | 昆山维信诺科技有限公司 | Flexible organic light-emitting display screen and preparation method thereof |
| CN108257913A (en) * | 2016-12-29 | 2018-07-06 | 上海和辉光电有限公司 | A kind of preparation method of flexible display |
| CN108257913B (en) * | 2016-12-29 | 2020-10-16 | 上海和辉光电有限公司 | Preparation method of flexible display |
| CN109840031A (en) * | 2018-12-28 | 2019-06-04 | 深圳莱宝高科技股份有限公司 | A kind of flexible base plate processing and treating method |
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|---|---|
| CN101924066B (en) | 2013-05-08 |
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Effective date of registration: 20220420 Address after: 26, 1 song Chi Road, Xinyi District, Taipei, Taiwan, China Patentee after: HANNSTAR DISPLAY Corp. Address before: Hsinchu County, Taiwan, China Patentee before: Industrial Technology Research Institute |