CN106450027A - Flexible organic light-emitting display screen and preparation method thereof - Google Patents
Flexible organic light-emitting display screen and preparation method thereof Download PDFInfo
- Publication number
- CN106450027A CN106450027A CN201610927892.9A CN201610927892A CN106450027A CN 106450027 A CN106450027 A CN 106450027A CN 201610927892 A CN201610927892 A CN 201610927892A CN 106450027 A CN106450027 A CN 106450027A
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- China
- Prior art keywords
- organic light
- emitting display
- display screen
- chip
- light emitting
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to the field of flat panel display, in particular to a flexible organic light-emitting display screen and a preparation method thereof. The flexible organic light-emitting display screen comprises a display screen body and a glass reinforced substrate, the display screen body comprises a polyimide layer, an integrated circuit chip and a protective rubber layer, the protective rubber layer comprises a first surface and a second surface, the integrated circuit chip is attached to the first surface, the polyimide layer covers the first surface and the integrated circuit chip, and the glass reinforced substrate is attached to the second surface. The preparation method includes the steps: forming the display screen body on a glass substrate fitted with the second surface; cutting off the portion of the glass substrate corresponding to the integrated circuit chip from other portions of the glass substrate to form the glass reinforced substrate; completely stripping the glass substrate except for the glass reinforced substrate to form the flexible organic light-emitting display screen. According to the flexible organic light-emitting display screen and the preparation method thereof, the integrated circuit chip can be effectively prevented from bending and damage.
Description
Technical field
The application is related to plane display field, more particularly to a kind of flexibility organic light emitting display and preparation method thereof.
Background technology
In wearing product, a lot of products all can have using the organic light emitting display with bending function.Particularly handss
The projects such as ring, wrist-watch, people more pursue the product for meeting human oriented design, so in order that whole product more conforms to human nature
Change, to be done less of product, thinner, with more bending property.
In correlation technique, in order to ensure the bending performance of organic light emitting display, it will usually by used in production process
Glass substrate is completely exfoliated, and only retains polyimides (PI) layer and protection glue-line.However, due to integrated circuit (IC) chip
The hardness is bigger of itself, and the hardness of PI layer and protection glue-line is all relatively low, therefore in follow-up production and actually used
During, all it is easy to cause chip in IC chip or transmission line impaired when display screen is bent.
Content of the invention
This application provides a kind of flexibility organic light emitting display and preparation method thereof, can reduce integrated electricity in flexible screen
The probability of damage of road chip.
The first aspect of the application provides a kind of flexibility organic light emitting display, mends including display screen main body and glass
Strong basis plate,
The display screen main body includes polyimide layer, IC chip, protection glue-line, and the protection glue-line includes phase
To first surface and second surface, the IC chip fits on the first surface, the polyimide layer
The first surface and the IC chip is covered,
The glass reinforcement baseplate-laminating is on the second surface and relative with the position of the IC chip.
Preferably, projection of the IC chip on the protection glue-line is located at the glass reinforcement substrate in institute
State in the drop shadow spread of protection glue-line.
The second aspect of the application provides a kind of preparation method of flexibility organic light emitting display, comprises the following steps：
A () forms the display screen main body on a glass substrate, wherein, the glass substrate is affixed with the second surface
Close；
B the glass substrate is corresponded to the part of IC chip and is cut with other positions of the glass substrate by ()
Disconnected, form the glass reinforcement substrate；
C the glass substrate in addition to the glass reinforcement substrate is all peeled off by (), form organic of the flexibility
Light display screen.
Preferably, in the step (b), the cutting-off process is carried out using laser.
Preferably, in the step (b), the cutting-off process is carried out using break bar.
Preferably, described also comprise the following steps between the step (a) and the step (b)：
D thickness that () glass substrate is corresponded to the part of the IC chip is thinning.
Preferably, in the step (d), the thinning degree of the thickness be the glass substrate gross thickness 70%～
85%.
Preferably, in the step (d), the thinning degree of the thickness is the 80% of the glass substrate gross thickness.
Preferably, in the step (d), the thickness thinning process is carried out using etching mode.
The technical scheme that the application is provided can reach following beneficial effect：
Flexible organic light emitting display provided herein and preparation method thereof can utilize glass reinforcement substrate to collection
Become circuit chip that structural strengthening is carried out, can effectively prevent IC chip to be bent and damage when display screen is integrally bent
Bad.
It should be appreciated that above general description and detailed description hereinafter are only exemplary, this can not be limited
Application.
Description of the drawings
The structural representation of the product that Fig. 1 is formed after S10 is completed by the embodiment of the present application；
Fig. 2 is by the embodiment of the present application in the structural representation for completing the product that S20 is formed；
Fig. 3 is the structural representation of product of the embodiment of the present application when S30 is carried out；
Fig. 4 is by the embodiment of the present application in the structural representation for completing the flexible organic light emission screen that S40 is formed.
Specific embodiment
Below by specific embodiment and combine accompanying drawing the application is described in further detail.Described in text
"front", "rear", "left", "right", " on ", D score is all with the placement of the flexible organic light emitting display in accompanying drawing and preparation method thereof
State is reference.
As shown in figure 4, the embodiment of the present application provide a kind of flexibility organic light emitting display, including display screen main body 1 with
And glass reinforcement substrate 20, display screen main body 1 include polyimide layer 10, IC chip 12 and protection glue-line 14, protect
Shield glue-line 14 includes relative first surface 140 and second surface 142, and IC chip 12 is fitted in first surface 140
On, polyimide layer 10 covers first surface 140 and IC chip 12, forms protection to IC chip 12.Glass
Glass reinforcement substrate 20 is fitted on second surface 142, and relative with the position of IC chip 12.
When flexible organic light emitting display is bent, due to the back side of IC chip 12, to there is hardness higher
Glass reinforcement substrate 20, the part can be therefore cannot be bent, damage so as to protect IC chip 12 not to be bent.
For the IC chip 12 that adequately protects, the coverage of glass reinforcement substrate 20 is sufficiently large so that integrated
Projection of the circuit chip 12 on protection glue-line 14 is positioned at glass reinforcement substrate 20 in the drop shadow spread of protection glue-line 14.In reality
In the production process of border, generally can by glass reinforcement substrate 20 do some larger so as to protection glue-line 14 projected area
More than projected area of the IC chip 12 on protection glue-line 14, the close region of IC chip 12 is made also all can not
Bending, so as to more comprehensively protect IC chip 12.
The embodiment of the present application provides a kind of method for preparing above-mentioned flexibility organic light emission screen, and the method includes following step
Suddenly：
S10. in glass substrate 2, display screen main body 1 is formed, wherein, glass substrate 2 is fitted with second surface 142.Figure
1 for completing the structural representation of the product for being formed after S10, and the step can be carried out using existing process.
S20., glass substrate 2 is corresponded to the part of IC chip 12 and other position cut-outs of glass substrate 2, is formed
Glass reinforcement substrate 20, as shown in Figure 2.The step be in order to by the other parts phase of glass reinforcement substrate 20 and glass substrate 2
Depart from, so that subsequently when peeling off, glass reinforcement substrate 20 will not be peeled off in the lump.Cutting-off process can pass through laser or
Break bar is carried out.
Under normal circumstances, the thickness of the glass substrate 2 formed by S10 is larger, if directly carrying out S20 to form glass reinforcement
Substrate 20, then the thickness of glass reinforcement substrate 20 can keep consistent with glass substrate 2, this will certainly increase flexible organic light emission screen
Integral thickness.And for current display screen development trend, so thick display screen is not received by market,
Therefore in order to reduce thickness, the following steps are preferably increased between S10 and S20：
S15, the part that glass substrate 2 is corresponded to IC chip 12 thickness thinning.As the hardness of glass is very big,
Even if therefore a thinning part also disclosure satisfy that the requirement of protection, while flexible organic light emitting display can also be greatly reduced
General thickness so as to of the prior art flexibility organic light emission screen thickness difference within the acceptable range.In general, thick
The thinning degree of degree can be the 70%～85% of 2 gross thickness of glass substrate, that is, need all to remove most thickness,
Only retain 2 gross thickness of bare glass substrate less than three one-tenth.Preferably thinning degree is about 80%.Thinning mode has a lot
Kind, a kind of relatively simple mode is by etching solution, glass substrate 2 to be etched.Can be with respect to will protect in etching
The scope of the glass reinforcement substrate 20 for staying is some larger, is that the cut-out step of follow-up S20 reserves certain surplus.Fig. 2 is
Complete the structural representation of the product formed by S20.After the completion of cut-out, the following steps just can be carried out：
S30, the glass substrate 2 in addition to glass reinforcement substrate 20 is all peeled off, form flexible organic light emitting display.
Fig. 3 is the structural representation of the product when S30 is carried out, and the process of stripping may also be employed the stripping mode of prior art, here
Repeat no more.Just the flexible organic light emission screen shown in Fig. 4 is formed after the completion of stripping.
Flexible organic light emitting display provided herein and preparation method thereof can be when display screen be integrally bent
IC chip is effectively prevented to be bent and damage.
The preferred embodiment of the application is the foregoing is only, the application is not limited to, for the skill of this area
For art personnel, the application can have various modifications and variations.All within the design of the application and principle, made any repair
Change, equivalent, improvement etc., should be included within the protection domain of the application.
Claims (9)
1. a kind of flexibility organic light emitting display, it is characterised in that including display screen main body and glass reinforcement substrate,
The display screen main body includes polyimide layer, IC chip protection glue-line, and the protection glue-line includes relative
First surface and second surface, the IC chip is fitted on the first surface, and the polyimide layer is covered
The first surface and the IC chip,
The glass reinforcement baseplate-laminating is on the second surface and relative with the position of the IC chip.
2. according to claim 1 flexibility organic light emitting display, it is characterised in that the IC chip is described
Projection on protection glue-line is located at the glass reinforcement substrate in the drop shadow spread of the protection glue-line.
3. the preparation method of the flexible organic light emitting display according to claim 1 or 2 any one, it is characterised in that bag
Include the following steps：
A () forms the display screen main body on a glass substrate, wherein, the glass substrate is fitted with the second surface；
B () glass substrate is corresponded to the part of the IC chip and other position cut-outs of the glass substrate,
Form the glass reinforcement substrate；
C the glass substrate in addition to the glass reinforcement substrate is all peeled off by (), form the flexibility organic light emission and show
Display screen.
4. according to claim 3 flexibility organic light emitting display preparation method, it is characterised in that the step (b)
In, the cutting-off process is carried out using laser.
5. according to claim 3 flexibility organic light emitting display preparation method, it is characterised in that the step (b)
In, the cutting-off process is carried out using break bar.
6. the preparation method of the flexible organic light emitting display according to any one of claim 3 to 5, it is characterised in that
Also comprise the following steps between the step (a) and the step (b)：
D thickness that () glass substrate is corresponded to the part of the IC chip is thinning.
7. according to claim 6 flexibility organic light emitting display preparation method, it is characterised in that the step (d)
In, the thinning degree of the thickness is the 70%～85% of the glass substrate gross thickness.
8. according to claim 7 flexibility organic light emitting display preparation method, it is characterised in that the step (d)
In, the thinning degree of the thickness is the 80% of the glass substrate gross thickness.
9. according to claim 6 flexibility organic light emitting display preparation method, it is characterised in that the step (d)
In, the thickness thinning process is carried out using etching mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927892.9A CN106450027B (en) | 2016-10-31 | 2016-10-31 | Flexible organic light emitting display and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927892.9A CN106450027B (en) | 2016-10-31 | 2016-10-31 | Flexible organic light emitting display and preparation method thereof |
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| CN106450027A true CN106450027A (en) | 2017-02-22 |
| CN106450027B CN106450027B (en) | 2018-08-14 |
Family
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Cited By (7)
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| CN107170384A (en) * | 2017-04-17 | 2017-09-15 | 广东欧珀移动通信有限公司 | Display module and terminal device |
| CN107180599A (en) * | 2017-05-12 | 2017-09-19 | 广东欧珀移动通信有限公司 | Display screen, display device and mobile terminal |
| CN109256044A (en) * | 2017-07-12 | 2019-01-22 | 昆山工研院新型平板显示技术中心有限公司 | Display screen body and preparation method thereof |
| CN109613782A (en) * | 2019-02-02 | 2019-04-12 | Oppo广东移动通信有限公司 | Electrochromic device and preparation method, shell, electronic equipment |
| CN109935740A (en) * | 2017-12-18 | 2019-06-25 | 上海和辉光电有限公司 | A kind of manufacturing method and substrate, display device of substrate |
| CN110238526A (en) * | 2019-07-17 | 2019-09-17 | 昆山龙腾光电有限公司 | Display panel production method, display panel and welder |
| CN111490091A (en) * | 2020-04-30 | 2020-08-04 | 北京小米移动软件有限公司 | Display screen and display device |
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| CN107170384A (en) * | 2017-04-17 | 2017-09-15 | 广东欧珀移动通信有限公司 | Display module and terminal device |
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| CN109935740A (en) * | 2017-12-18 | 2019-06-25 | 上海和辉光电有限公司 | A kind of manufacturing method and substrate, display device of substrate |
| CN109935740B (en) * | 2017-12-18 | 2021-01-15 | 上海和辉光电股份有限公司 | Manufacturing method of substrate, substrate and display device |
| CN109613782A (en) * | 2019-02-02 | 2019-04-12 | Oppo广东移动通信有限公司 | Electrochromic device and preparation method, shell, electronic equipment |
| CN110238526A (en) * | 2019-07-17 | 2019-09-17 | 昆山龙腾光电有限公司 | Display panel production method, display panel and welder |
| CN111490091A (en) * | 2020-04-30 | 2020-08-04 | 北京小米移动软件有限公司 | Display screen and display device |
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| CN106450027B (en) | 2018-08-14 |
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