TWI665588B - Three-dimensional curved touch structure and manufacturing method thereof - Google Patents

Abstract

The invention provides a method for manufacturing a three-dimensional curved touch stack structure, which includes the following steps: a. A transferable film and a curved substrate are provided. b. Making an induction electrode on the transferable film by etching. c. A thermoplastic transfer material is disposed on the transferable film. d. thermally bonding the transferable film to the curved substrate through the thermoplastic transfer material, and creating an interpenetrating polymer network structure on the transferable film. e. The transferable film is cured using ultraviolet light. Through the above-mentioned method, the three-dimensional curved touch stacking structure will produce an interpenetrating polymer network structure with a thickness of about 50 to 100 nanometers during the thermal bonding transfer process, making the overall stacking structure more stable.

Description

Three-dimensional curved touch stack structure and manufacturing method thereof

The technology of the present invention relates to the field of touch control structures, and particularly to a three-dimensional curved touch stack structure and a manufacturing method thereof.

In response to the rapid development of touch devices, the touch stack structure has been extended from a single flat shape to a multi-axis curved shape. However, during the bonding process of the touch stack structure, it is easy to cause stress accumulation due to the expansion and contraction of different materials in the stack structure, which results in wrinkling. Eventually, the touch circuit will cause micro-cracks due to pulling and deflection. crack), the local resistance value rises, and the touch function is abnormal.

In addition, the partial application of the conductive film in a thermoplastic manner is likely to cause shrinkage due to the difference in the base film material at different temperatures, and the specific volume may also be caused by the too high stretch rate, which may cause the material to be produced. Silver streaks or worse lead to fracture, so there is still room for improvement.

The main purpose of the present invention is to improve the problem that the conventional technology is prone to abnormal touch functions during thermoplastic bonding. In order to achieve the above object, the present invention adopts the following technical means to achieve it, wherein the present invention provides a three-dimensional curved touch stacking structure and a manufacturing method thereof, including the following steps: a. Providing a transferable film and a curved surface Substrate. b. Making an induction electrode on the transferable film by etching. c. A thermoplastic transfer material is disposed on the transferable film. d. thermally bonding the transferable film to the curved substrate through the thermoplastic transfer material, and creating an interpenetrating polymer network structure on the transferable film. e. UV-curing the transferable film.

In an embodiment of the present invention, the manufacturing method of the sensing electrode includes: setting a photomask on the transferable film to perform exposure, removing the photomask and a base film, and performing exposure to form the sensing electrode.

In an embodiment of the present invention, the step d. Further includes a step d1. A three-dimensional inkjet printing technique is used to make an external circuit on the transferable film.

In one embodiment of the present invention, the external circuit is a single-layer conductive metal circuit.

In an embodiment of the present invention, the thickness of the interpenetrating polymer network structure is between 50 and 100 nanometers.

In an embodiment of the present invention, the step d. Further includes: the transferable film includes a functional layer and a developing layer, the functional layer is a decorative functional ink, a correction optical functional material or a surface modification material, The developing layer is a light-sensitive material or a heat-curable material.

In an embodiment of the present invention, the interpenetrating polymer network structure is formed on a contact surface between the functional layer and the developing layer.

1‧‧‧ transferable film

2‧‧‧ curved substrate

11‧‧‧ protective film

12‧‧‧ base film

13‧‧‧ transferable transparent conductive film

3‧‧‧Mask

4‧‧‧ Induction electrode

5‧‧‧ thermoplastic transfer material

10, 10a, 10b ‧‧‧ curved substrate

20,20a, 20b‧‧‧Function layer

30,30a‧‧‧Interpenetrating polymer network structure

40,40a‧‧‧Developing layer

50,50a‧‧‧Conductive circuit layer

60b‧‧‧metal conductive layer

100 ~ 150‧‧‧ steps

FIG. 1 is a method flowchart of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention.

FIG. 2A is a schematic view of a manufacturing process of a three-dimensional curved touch stack structure and a manufacturing method thereof according to an embodiment of the present invention.

FIG. 2B is a schematic diagram of a manufacturing process of a three-dimensional curved touch stack structure and a manufacturing method thereof according to an embodiment of the present invention.

FIG. 2C is a schematic view of a manufacturing process of a three-dimensional curved touch stack structure and a manufacturing method thereof according to an embodiment of the present invention.

FIG. 2D is a schematic diagram 4 of a process of an embodiment of a three-dimensional curved touch stacking structure and a manufacturing method thereof according to the present invention.

FIG. 3A is a schematic diagram of an internal wiring stack structure of a three-dimensional curved touch stack structure and a manufacturing method thereof according to an embodiment of the present invention.

FIG. 3B is a three-dimensional schematic diagram of an internal wiring layered structure of a three-dimensional curved touch stacking structure and a manufacturing method thereof according to an embodiment of the present invention.

FIG. 4A is a schematic diagram 1 of an external wiring stacking structure according to an embodiment of a three-dimensional curved touch stacking structure of the present invention and a manufacturing method thereof.

FIG. 4B is a second schematic diagram of an external wiring stacking structure of a three-dimensional curved touch stacking structure and a manufacturing method thereof according to an embodiment of the present invention.

In order to achieve the above-mentioned object and effect, the technical means and structure adopted by the present invention, the following is a detailed description of the features and functions of an embodiment of the present invention, which is fully understood, but it should be noted that the content does not constitute Limitations of the invention.

Please refer to FIG. 1, which is a method flowchart of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. The manufacturing method of the three-dimensional curved touch stack structure of the present invention includes the following steps:

Step 100: Provide a transferable film 1 and a curved substrate 2. The transferable film 1 includes a transparent conductive transfer film (TCTF) 13, a protective film 11 and a base film 12. The protective film 11 and the base film 12 They are respectively located on different surfaces of the transferable transparent conductive film 13. The curved substrate has a three-dimensional curved surface.

Step 110: An induction electrode 4 is formed on the transferable film by etching. Please refer to FIGS. 2A and 2B, which are a process schematic diagram 1 and a process schematic diagram 2 of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. The manufacturing method of the sensing electrode includes: A photomask 3 is provided on the film, and the photomask 3 may be adjacent to a surface of the base film 12; the transferable film 1 is irradiated with ultraviolet rays for exposure; and the photomask 13 on the transferable transparent conductive film 13 is removed. Photomask 3 and base film 12; the transferable transparent conductive film 13 is irradiated with ultraviolet rays for exposure; and the sensing electrode 4 is formed on the transferable transparent conductive film 13.

Step 120: A thermoplastic transfer material 5 is disposed on the transferable film. Please refer to FIG. 2C and FIG. 2D, which are a process schematic diagram 3 and a process schematic diagram 4 of an embodiment of a three-dimensional curved touch stack structure and a manufacturing method thereof according to the present invention. The thermoplastic transfer material can be a thermoplastic elastomer or a thermoplastic rubber, which has the dual advantages of processing properties of a thermoplastic and physical properties of a vulcanized rubber, and is suitable for use as a thermoplastic transfer material.

Step 130: thermally attach the transferable film to the curved substrate through the thermoplastic transfer material, and create an interpenetrating polymer network (IPN) on the transferable film. The penetrating polymer network structure may be a linear polymer or a branched chain. Using thermal transfer technology, the transparent transferable film can be attached to the curved substrate of the design. At the same time, the diffusion and fluidity of the material can be improved by heating, so that the contact surfaces of the two interlayer materials intersect and intersect. The formation of an interpenetrating polymer network structure can increase the adhesion between the transferable film and the curved substrate. Among them, controlling the temperature and pressure during thermal transfer can make the adhesion of the interpenetrating polymer network structure more obvious. In an embodiment of the present invention, the thickness of the interpenetrating polymer network structure is between 50 and 100 nanometers. In one embodiment, the transferable film includes a functional layer and a developing layer. The functional layer is a laminated material to increase the function of the transferable film. The functional layer can be a decorative functional ink, a correction optical A functional material or a surface modification material, etc., but is not limited thereto. The developing layer is a laminated material, which may be a light-sensitive material or a thermosetting material, and the interpenetrating polymer network structure is formed on a contact surface between the functional layer and the developing layer.

Step 140: Use ultraviolet light to cure the transferable film.

In an embodiment of the present invention, after step 140, a step 150 may be further included: an external circuit is made on the transferable film by using a three-dimensional inkjet printing technique, wherein the external circuit is a single-layer conductive metal circuit or a multi-layer conductive Metal lines. The three-dimensional inkjet printing technology is an electronic printing technology application, which has a fine inkjet printing ability and wider material applicability, and its special printing method is particularly suitable for being applied to three-dimensional three-dimensional curved surfaces.

Through the above manufacturing method, an in-plane wiring stack structure as shown in FIGS. 3A and 3B and an outer wiring stack structure shown in FIGS. 4A and 4B can be manufactured. 3A and 3B are a schematic diagram and a three-dimensional schematic diagram of an internal wiring stacking structure and an internal wiring stacking structure according to an embodiment of the present invention, respectively. It includes a curved substrate 10, a functional layer 20, an interpenetrating polymer network structure 30, a developing layer 40, and a conductive circuit layer 50. The curved substrate 10 can be made of glass, single-layer or multi-layer composite plastic parts, and one surface of the functional layer 20 is adhered to one surface of the substrate 10 so that the functional layer 20 is attached below the curved substrate 10. The functional layer 20 may be a decoration film or a treatment agent, such as a decorative functional ink, a correction optical function material, or a surface modification material. One surface of the developing layer 40 is in contact with the other surface of the functional layer 20, so that the developing layer 40 is attached below the functional layer 20, and the contact surfaces of the developing layer 40 and the functional layer 20 are formed. There is an interpenetrating polymer network structure 30. The developing layer 40 may be a light-sensitive material or a thermosetting material. One surface of the conductive circuit layer 50 is adhered to the other surface of the developing layer 40, so that the conductive circuit layer 50 is attached to the developing layer 40. Below, the conductive circuit layer 50 may be indium tin oxide (ITO), nanometer silver wire or nanometer carbon tube, but is not limited thereto.

The external wiring stack structure shown in FIG. 4A includes a curved substrate 10a, a functional layer 20a, an interpenetrating polymer network structure 30a, a developing layer 40a, and a conductive circuit layer 50a. The curved substrate 10a may be made of glass, single-layer or multi-layer composite plastic material, and one surface of the functional layer 20a is adhered to one surface of the substrate 10a, so that the functional layer 20a is attached below the curved substrate 10a. The functional layer 20a may be a decoration film or a treatment agent, such as a decorative ink, a correction optical function material, or a surface modification material. One surface of the developing layer 40a is in contact with the other surface of the functional layer 20a, so that the developing layer 40a is attached below the functional layer 20a, and the contact surfaces of the developing layer 40a and the functional layer 20a are formed. There is an interpenetrating polymer network structure 30a. The developing layer 40a may be a light-sensitive material or a thermosetting material. One surface of the conductive circuit layer 50a is bonded to the other surface of the developing layer 40a, so that the conductive circuit layer 50a is attached to the developing layer 40a. Below, the conductive circuit layer 50a may be indium tin oxide (ITO), nano-silver wire or nano-carbon tube, but is not limited thereto. The external trace stack structure shown in Figure 4B includes a curved The surface substrate 10b, the functional layer 20b, and the metal conductive layer 60b. The curved substrate 10b may be made of glass, single-layer or multilayer composite plastic material. One surface of the functional layer 20b is bonded to one surface of the substrate 10b, so that the functional layer 20b is attached below the substrate 10b. The functional layer 20b may be a decoration film or a treatment agent, such as a decorative functional ink, a correction optical function material, or a surface modification material. One surface of the metal conductive layer 60b is adhered to the other surface of the functional layer 20b, so that the metal conductive layer 60b is attached below the functional layer 20b. The metal conductive layer 60b is a single-layer or multi-layer conductive metal.

Therefore, referring to all the drawings, the present invention provides a three-dimensional curved touch stack structure and a manufacturing method thereof, which proposes a method for manufacturing a three-dimensional curved touch stack structure. Thickness can avoid the problem of transcribing the surface from the position of the neutral axis due to the thickness and allowing the material to bear more stress and break. In addition, an interpenetrating polymer network structure can be generated between the functional layer and the developing layer, and only the overall structure is more stable.

Through the above detailed description, it can fully show that the purpose and efficacy of the present invention are progressive in implementation, have great industrial utility value, and are new inventions that have never been seen on the market today, and fully meet the requirements of invention patents , Apply according to law. The above description is only an embodiment of the present invention, and therefore does not limit the implementation and protection scope of the present invention. For those skilled in the art, it should be able to realize the equivalents made by using the description and illustrations of the present invention. The solutions obtained by substitution and obvious changes should all be included in the protection scope of the present invention.

Claims (9)

A method for manufacturing a three-dimensional curved touch stack structure includes the following steps: a. Providing a transferable film and a curved substrate; b. Using an etching method to fabricate a sensing electrode on the transferable film, and manufacturing the sensing electrode The method includes: setting a photomask on the transferable film to perform exposure, removing the photomask and a base film, and performing exposure to form the sensing electrode; c. Setting up a thermoplastic transfer material on the transferable film D. Thermally attach the transferable film to the curved substrate through the thermoplastic transfer material, and create an interpenetrating polymer network structure on the transferable film, the interpenetrating polymer network structure used to Increasing the adhesion between the transferable film and the curved substrate; e. Curing the transferable film with ultraviolet light. According to the method for manufacturing a three-dimensional curved touch stack structure according to item 1 of the scope of patent application, the step d. Further includes a step d1 .: using a three-dimensional inkjet printing technology to make an external circuit on the transferable film. The method for manufacturing a three-dimensional curved touch stack structure according to item 2 of the scope of the patent application, wherein the external circuit is a single-layer conductive metal circuit. According to the manufacturing method of the three-dimensional curved touch stack structure according to item 1 of the scope of the patent application, the thickness of the interpenetrating polymer network structure is between 50 and 100 nanometers. The method for manufacturing a three-dimensional curved touch stack structure according to item 1 of the scope of patent application, wherein step d. Further includes: the transferable film includes a functional layer and a developing layer, and the functional layer is a decorative functional ink A correction optical function material or a surface modification material, and the developing layer is a light-sensitive material or a thermosetting material. The method for manufacturing a three-dimensional curved touch stacking structure according to item 5 of the scope of the patent application, wherein step d. Further includes: forming the interpenetrating polymer network structure on a contact surface between the functional layer and the developing layer. A three-dimensional curved touch stacking structure manufactured by using the method described in any one of claims 1 to 6 of a patent application scope, comprising: a curved substrate, a functional layer, an interpenetrating polymer network structure, a developing layer, and A conductive circuit layer, the curved substrate has a three-dimensional curved surface; a surface of the functional layer is adhered to a surface of the substrate so that the functional layer is attached below the curved substrate; a surface of the developing layer and the function The other surfaces of the layers are adhered, so that the developing layer is attached below the functional layer, and the interpenetrating polymer network structure is formed on the contact surface of the developing layer and the functional layer. The three-dimensional curved touch stack structure according to item 7 of the scope of the patent application, wherein the functional layer is a decorative functional ink, a correction optical functional material layer or a surface modified material layer. The three-dimensional curved touch stack structure according to item 7 of the patent application scope, wherein the developing layer is a photosensitive material layer or a thermosetting material layer.