TW202000801A - Polymerizable composition, ink, transfer matrix, and method for manufacturing electrode member - Google Patents

Abstract

As an ionizing-radiation-curable polymerizable composition which can be dissolved by an aqueous solution and which can suitably maintain the cured shape thereof even in a high-temperature environment, there is provided a polymerizable composition characterized by containing: a monofunctional acrylic compound comprising one or more compounds selected from the group consisting of a monofunctional acrylic acid ester compound and a monofunctional acrylamide compound; a monofunctional N-vinyl compound; and a polymerization initiator for generating a radical by irradiation with ionizing radiation.

Description

Method for manufacturing polymerizable composition, ink, transfer mold and electrode member

The present invention relates to a polymerizable composition that can be preferably used when forming electrodes in batches corresponding to high-density mounting, an ink containing the polymerizable composition, and including irradiation of the polymerizable composition A transfer mold of an ionized radiation hardened product obtained by ionizing radiation, and a method of manufacturing an electrode member including an electrode group formed on a base material using the polymerizable composition.

Patent Document 1 relates to a plurality of semiconductor devices (integrated bodies) formed on a wafer in a wafer level chip size packaging (WL-CSP) as a form of high-density mounting The technique of forming electrodes in batches in an integrated circuit (IC) describes a lower layer containing a non-radiation sensitive resin composition and an upper layer containing a negative radiation sensitive resin composition, allowing high resolution A layered film with easy peelability and a method for forming bumps using the layered film. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-79550

[Problems to be solved by the invention] In the two-layer laminated film described in Patent Document 1, when developing, only the portion irradiated with radiation remains in the upper layer, and the portion in the lower layer corresponding to the removed portion (radiation non-irradiated portion) in the upper layer is dissolved and removed. Therefore, only the portion irradiated with radiation remains in the double-layer laminated film, and the non-irradiated portion of the double-layer laminated film is removed in the development stage. The metal paste is buried in the portion where the double-layer laminated film has been removed, and heated together with the wafer to reflow the metal paste, thereby forming a plurality of bumps on the wafer in batches. After the bumps are formed in batches in this way, an organic solvent-based stripping solution such as dimethyl sulfoxide (DMSO) is used to remove the remaining double-layer laminated film on the wafer.

In recent years, the mounting density has been continuously improved. Therefore, the shape of the negative pattern (transfer mold) formed on the wafer to form the bumps is complicated (including three-dimensionalization). However, if a negative pattern with a complicated shape is to be formed by the process of forming a negative pattern using the double-layer laminated film as described above, the steps become cumbersome. Therefore, simplification of manufacturing steps is expected. In addition, it is required that the material constituting the negative pattern remaining on the wafer be removed surely after the bumps are formed. However, due to the increased attention to environmental issues, it is possible to seek a stripping solution that does not use the organic solvent system as described above. The material is removed by an aqueous stripping liquid, especially an aqueous stripping liquid that does not substantially contain an inorganic alkaline substance (such as sodium hydroxide can be exemplified) or an organic alkaline substance (such as tetramethylammonium hydroxide can be exemplified).

Furthermore, in recent high-density mounting technologies, fan-out wafer level packaging (WLP), which forms a redistribution layer over a large area exceeding the wafer area, has also realized the fan Outlet type WLP multi-layer stacking module (stack module). In such a fan-out type WLP, a large number of conductive pillars containing copper or the like are formed on the redistribution layer, and connecting materials such as solder balls are arranged on the conductive pillars. The configuration accuracy of the connection material needs to be higher as the mounting density increases, so it is required that the connection material be more accurately arranged on the conductive pillar.

An object of the present invention is to provide an ionizing radiation-curable polymerizable composition that is sought along with the development of such mounting technology, which can appropriately maintain the cured shape even after a high-temperature environment like a reflow process, and can be utilized Dissolve in the aqueous solution. In addition, an object of the present invention is also to provide an ink containing the polymerizable composition, a transfer mold including an ionized radiation cured product obtained by irradiating the polymerizable composition with ionizing radiation, and using the polymerizable composition To manufacture an electrode member including an electrode group on a substrate. Furthermore, in this specification, "ionizing radiation" means electromagnetic waves such as γ-rays, X-rays, ultraviolet rays, visible light, etc., and electrons, protons, or ions can be irradiated to the polymerization initiator or the polymerization start Generic term for an energy source that generates free radicals when the agent collides. [Means to solve the problem]

The present invention provided to solve the above problems is as follows. [1] A polymerizable composition for forming a transfer mold. The polymerizable composition is characterized by containing: a monofunctional acrylic compound including a monofunctional acrylate compound and a monofunctional acrylic amide One or two or more compounds in the group consisting of compounds; monofunctional N-vinyl compounds; and polymerization initiators, which generate free radicals by irradiation with ionizing radiation. [2] The polymerizable composition according to the above [1], wherein the monofunctional N-vinyl compound is a monofunctional N-vinylamide compound. [3] The polymerizable composition according to the above [2], wherein the monofunctional N-vinylamide compound comprises a member selected from N-vinylformamide, N-vinylacetamide, N -One or more compounds of vinyl-ε-caprolactam. [4] The polymerizable composition according to any one of [1] to [3], which has a viscosity at 60° C. of 15 mPa･s or less. [5] The polymerizable composition according to any one of [1] to [4], which contains a volatile solvent of 30% by mass or less with respect to the entire polymerizable composition. [6] An ink for inkjet comprising the polymerizable composition according to any one of [1] to [5]. [7] A transfer mold including the ionizing radiation hardened product of the polymerizable composition according to any one of [1] to [5]. [8] The transfer mold as described in [7] above, wherein in the case where the ionizing radiation hardened product has a film shape of 13 μm to 18 μm thick formed on a glass substrate, even in the atmosphere at 150 Heating at ℃ for 2 hours, the residual film rate of the hardened ionizing radiation is also 80% or more. [9] The transfer mold as described in [7] or [8], wherein the ionizing radiation hardened material is heated by 5 in the aqueous solution even when heated in the atmosphere at 150° C. for 2 hours. Dissolve by dipping within minutes. [10] The transfer casting mold according to the above [9], wherein the aqueous dissolution liquid is a water-alcohol mixed liquid. The alcohol is preferably an alcohol having miscibility with water, and more preferably an alcohol having a carbon number of 4 or less. [11] The transfer mold according to [9] or [10], wherein the pH of the aqueous solution is 8 or less. [12] A method of forming an electrode member, which is a method of manufacturing an electrode member on a surface of an insulating substrate in which wiring is buried, and a plurality of electrodes each having a recessed portion to be exposed. The method of forming the electrode member is characterized by including: A disposing step, disposing the polymerizable composition as described in any one of [1] to [5] on a substrate; a hardening step, disposing the polymerizable composition disposing on the substrate The object is irradiated with ionizing radiation to harden the polymerizable composition to obtain a transfer mold containing the ionized radiation hardened material; a conductive member forming step, a conductive material is arranged to cover the transfer mold to form a conductive member; a peeling step , Peeling off the structure including the transfer mold and the conductive member from the base material, so that the plurality of conductive members corresponding to the plurality of electrodes and the transfer attached to the conductive member The surfaces of the mold on the base material side are exposed together; and a dissolving step of dissolving the transfer mold adhered to each of the plurality of conductive members using an aqueous dissolution liquid to obtain a reverse shape including the transfer mold The plurality of electrodes of the recess. [13] The method for forming an electrode member according to [12], further including performing the transfer casting mold on the substrate after the hardening step and before the dissolution step is started Heating heating step. [14] The method for forming the electrode member according to [12] or [13], wherein in the disposing step, the polymerizable composition is supplied to the base material, thereby the The pattern of the coating film of the polymerizable composition is arranged on the substrate, and in the hardening step, the pattern of the coating film of the polymerizable composition on the substrate is hardened to irradiate the ionizing radiation The pattern of the cured product is formed on the base material as the transfer mold. [15] The method for forming an electrode member according to [14], wherein the polymerizable composition is an inkjet ink, and in the disposing step, the polymerizable composition is formed using an inkjet printer The pattern of the coating film of the object is arranged on the substrate. [16] The method for forming an electrode member according to [12] or [13], wherein in the disposing step, a layer of the polymerizable composition is formed on the base material, In the hardening step, the layer of the ionizing radiation hardened layer is formed from the layer of the polymerizable composition, and the method of forming the electrode member further includes a patterning step before the conductive member forming step, the patterning The step of irradiating a part of the layer of the ionized radiation hardened material with high energy rays to remove the ionized radiation hardened material, thereby forming the pattern of the ionized radiation hardened material as the transfer mold on the substrate . [17] The method for forming an electrode member according to any one of [14] to [16], wherein in the conductive member forming step, a plurality of electrically independent materials are formed on the substrate Patterns of the conductive members, and further form the wiring electrically connected to the patterns of the plurality of conductive members, and arrange an insulating material around the patterns of the plurality of conductive members and the wiring The insulating substrate is formed on the base material. In the peeling step, the structure peeled from the base material includes the transfer mold and the insulating substrate. [Effect of invention]

According to the present invention, there is provided a polymerizable composition capable of forming an ionizing radiation hardened product that can appropriately maintain a cured shape even after passing through a high-temperature environment, and can be dissolved by an aqueous solution. In addition, according to the present invention, there is provided an ink containing the polymerizable composition, an ionizing radiation hardened product obtained by irradiating the polymerizable composition with ionizing radiation, and manufacturing using the polymerizable composition on a substrate Method of electrode member of electrode group.

Hereinafter, a method of manufacturing the polymerizable composition, ink, ionizing radiation cured product, and electrode member according to the embodiment of the present invention will be described.

The polymerizable composition of one embodiment of the present invention is a polymerizable polymerizable composition used to form a transfer mold, and contains: a monofunctional acrylic compound selected from the group consisting of monofunctional acrylate compounds and monofunctional One or more than two compounds in the group consisting of type acrylamide compounds; monofunctional N-vinyl compounds; and polymerization initiators that generate free radicals by irradiation with ionizing radiation.

The monofunctional acrylic compound includes one or two or more compounds selected from the group consisting of monofunctional acrylate compounds and monofunctional acrylamide compounds. The monofunctional acrylate compound is a (meth)acrylate and a compound having a partial structure based on (meth)acrylate and having an ethylenic double bond in the molecule, as a compound having (meth)acrylate based Specific examples of the partially structured compound include methyl (meth)acrylate. In addition, in this specification, one or both of "acrylic acid" and "methacrylic acid" are sometimes expressed as "(meth)acrylic acid". Terms related to (meth)acrylic acid, such as "(meth)acrylate" and "(meth)acrylic acid" also have the same meaning.

The monofunctional acrylate compound preferably has a hydroxyl group (—OH) from the viewpoint of ensuring the solubility of the ionized radiation hardened product irradiated to the polymerizable composition in the aqueous solution. Specific examples of such a monofunctional acrylate compound containing a hydroxyl group (-OH) include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxyl Butyl (meth)acrylate, 1,4-cyclohexanedimethanol mono (meth)acrylate, N-hydroxyethyl (meth)acrylamide, and polyoxyethylene monoacrylate. Among these, 4-hydroxybutyl acrylate and 1,4-cyclohexanedimethanol monoacrylic acid are preferred from the viewpoint of relatively low volatility, and thus easy to ensure printability and storage stability of the polymerizable composition. The ester is particularly preferably 4-hydroxybutyl acrylate from the viewpoint of the ease of dissolution of the obtained ionizing radiation hardened product in an aqueous solution.

Specific examples of the monofunctional acrylamide compound include N-isopropylacrylamide, N,N-dimethyl(meth)acrylamide, N,N-dimethylaminoethyl (Meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-diethylaminoethyl(meth)acrylamide, and N,N-dimethyl Aminopropyl (meth)acrylamide and (meth)acryl morpholine. Among these, from the viewpoint of being relatively less volatile, it is easy to ensure the printability of the polymerizable composition, storage stability, and the viewpoint of the ease of dissolution of the obtained ionizing radiation cured product with respect to the aqueous solution, preferably It is (meth)acryloyl morpholine.

The monofunctional N-vinyl compound is a compound having a structure in which an ethylenically unsaturated group is bonded to an amine group, and the amine group may also constitute a carbonyl group and an amide bond. In this specification, such a monofunctional compound in which an amine group bonded with an ethylenically unsaturated group constitutes an amide bond is also referred to as a "monofunctional N-vinyl amide compound". The monofunctional N-vinylamide compound is a preferable example of the monofunctional N-vinyl compound. Specific examples of the monofunctional N-vinylamide compound include N-vinylformamide, N-vinylacetamide, N-vinyl-ε-caprolactam, and the like. As the monofunctional type Specific examples of the monofunctional N-vinyl compound other than the N-vinyl amide compound include 1-vinylimidazole and 9-vinylcarbazole. Among these compounds, N-vinylformamide, N-vinylacetamide, and N-vinyl group are preferred from the viewpoint of the ease of dissolution of the obtained ionizing radiation hardened product in an aqueous solution. -ε-caprolactam and 1-vinylimidazole, from the viewpoint of restrictions on the transportation of products, particularly preferred are N-vinylformamide, N-vinylacetamide and N-vinyl- ε-caprolactam.

The polymerization initiator is not limited as long as it can generate radicals by irradiation with ionizing radiation and can start the polymerization reaction of the monofunctional acrylic compound and the monofunctional N-vinyl compound. The content of the polymerization initiator is also appropriately set according to the types and contents of the monofunctional acrylic compound and the monofunctional N-vinyl compound and the type of the polymerization initiator. If not limited, the content of the polymerization initiator relative to the total amount of the polymerizable composition is preferably 0.1 to 20 parts by weight, more preferably 1 to 15 parts by weight, and particularly preferably 2 Parts by weight ~ 12 parts by weight.

Specific examples of the polymerization initiator include benzophenone, Michler's ketone, 4,4'-bis(diethylamino)benzophenone, xanthone, and sulfur Heteranthracene, isopropyl xanthone, 2,4-diethylthioxanthone, 2-ethylanthraquinone, acetophenone, 2-hydroxy-2-methylbenzeneacetone, 2-hydroxy- 2-methyl-4'-isopropyl phenylacetone, 1-hydroxycyclohexyl phenyl ketone, isopropyl benzoin ether, isobutyl benzoin ether, 2,2-diethoxyacetophenone, 2,2 -Dimethoxy-2-phenylacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, camphorquinone, benzanthrone, 2-hydroxy-1 -[4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl]-2-methyl-propane-1-one, 1-[4-(2-hydroxyethyl Oxy)-phenyl]-2-hydroxy-2-methyl-1-propane-1-one, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2-methyl- 1-[4-(methylthio)phenyl]-2-morpholinyl-1-acetone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-1 -Butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinylphenyl)-1-butanone, oxy-phenyl-acetic acid 2-( 2-oxo-2-phenyl-acetoxy-ethoxy)-ethyl ester, oxy-phenyl-acetic acid 2-(2-hydroxy-ethoxy)-ethyl ester, oxy- Phenyl-acetic acid 2-(2-oxo-2-phenyl-acetoxy-ethoxy)-ethyl ester and oxy-phenyl-acetic acid 2-(2-hydroxy-ethoxy)- A mixture of ethyl esters, phenylglyoxylic acid methyl ester, 4-dimethylaminobenzoic acid ethyl ester, 4-dimethylaminobenzoic acid isoamyl ester, 4,4'-bis (third butyl Peroxycarbonyl) benzophenone, 3,4,4'-tris (third butylperoxycarbonyl) benzophenone, 3,3',4,4'-tetra (tert-butylperoxy (Carbonyl) benzophenone, 3,3',4,4'-tetra (third hexyl peroxycarbonyl) benzophenone, 3,3'-bis (methoxycarbonyl)-4,4'-di( Third butyl peroxycarbonyl) benzophenone, 3,4'-bis(methoxycarbonyl)-4,3'-di (third butyl peroxycarbonyl) benzophenone, 4,4'- Bis(methoxycarbonyl)-3,3'-bis(t-butylperoxycarbonyl)benzophenone, 2-(4'-methoxystyryl)-4,6-bis(trichloromethane Group)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(2',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(2'-methoxystyryl)-4,6-bis(trichloromethyl) -S-triazine, 2-(4'-pentyloxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-bis(ethoxycarbonyl Methyl)]-2,6-bis(trichloromethyl)-s-triazine, 1,3-bis(trichloromethyl)-5- (2'-chlorophenyl)-s-triazine, 1,3-bis(trichloromethyl)-5-(4'-methoxyphenyl)-s-triazine, 2-(p-dimethyl Aminostyryl)benzoxazole, 2-(p-dimethylaminostyryl)benzothiazole, 2-mercaptobenzothiazole, 3,3'-carbonylbis(7-diethylamine Coumarin), 2-(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2-chlorophenyl) -4,4',5,5'-tetra(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4, 4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl -1,2'-biimidazole, 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 3-(2-methyl-2-dimethylaminopropionyl)carbazole, 3,6-bis(2-methyl-2-morpholinylpropionyl)-9-n-dodecyl Carbazole, 1-hydroxycyclohexyl phenyl ketone, bis(η ⁵ -2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1Η-pyrrol-1-yl )-Phenyl) titanium, bis (2,4,6-trimethylbenzyl) phenyl phosphine oxide and 2,4,6-trimethyl benzoyl diphenyl phosphine oxide. These compounds can be used alone, and it is effective to use two or more of them in combination. Among them, 2-benzyl-2-dimethylamino group is preferred from the viewpoint of high sensitivity and photocurability relative to an ultraviolet-light emitting diode (UV-LED) light source. 1-(4-morpholinylphenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinylphenyl)-1- Butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinyl-1-acetone, bis(2,4,6-trimethylbenzyl)-benzene Phosphine oxide, 2,4,6-trimethylbenzyl-diphenyl-phosphine oxide.

From the viewpoint of simplifying the step of forming the ionizing radiation hardened product, the polymerizable composition of this embodiment may not substantially contain a volatile solvent, but from the viewpoint of adjusting the viscosity of the polymerizable composition, etc., May also contain volatile solvents. When used, volatile solvents can be mixed with other compositions to form a polymerizable composition. In the case where the polymerizable composition contains a volatile solvent, the volatile solvent may start to volatilize in a state where the polymerizable composition is not hardened, preferably by before, during, and/or after irradiation with ionizing radiation It is suitable for heating to volatilize at least in the stage where the ionizing radiation hardened product is formed. If the uncured solvent remains excessively in a state where the polymerizable composition has been cured to some extent, the final cured product (ionized radiation cured product) has a porous structure and has a reverse casting mold for reverse transfer ( Negative pattern) and the required surface properties (surface smoothness) decrease. Therefore, the content of the volatile solvent is preferably 30% by mass or less with respect to the entire polymerizable composition.

Specific examples of volatile solvents include methanol, ethanol, propanol, butanol, butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, and ethyl oxyacetate , Butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, 3- Methyl oxypropionate, Ethyl 3-oxypropionate, Methyl 3-methoxypropionate, Ethyl 3-methoxypropionate, Methyl 3-ethoxypropionate , Ethyl 3-ethoxypropionate, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate Ester, 2-methoxypropionic acid ethyl ester, 2-methoxypropionic acid propyl ester, 2-ethoxypropionic acid methyl ester, 2-ethoxypropionic acid ethyl ester, 2-oxo Methyl-2-methylpropanoate, 2-oxy-2-methylpropanoate, 2-methoxy-2-methylpropanoate, 2-ethoxy-2 -Ethyl methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate , Ethyl 2-oxobutyrate, dioxane, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monophenyl ether, ethylene glycol monobutyl Ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol Alcohol monophenyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monophenyl ether, ethylene glycol, diethylene glycol, Propylene glycol, dipropylene glycol, glycerol, benzyl alcohol, cyclohexanol, 1,4-butanediol, triethylene glycol, tripropylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate , Propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, di Ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether Ether, diethylene glycol methyl ethyl ether, toluene, xylene, anisole, γ-butyrolactone, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and Dimethyl imidazolinone and so on. These compounds can be used alone, and it is effective to use two or more of them in combination.

The polymerizable composition of this embodiment may contain components other than the above components as other additives. Specific examples of other additives include surfactants, polymerization inhibitors, plasticizers, antioxidants, ultraviolet absorbers, antistatic agents, flame retardants, flame retardant aids, fillers, pigments, dyes, etc. It is not particularly limited as long as it can be uniformly mixed with other components without departing from the gist of the present invention.

The polymerizable composition of the present embodiment is supplied onto the base material by coating, dropping or the like during use, thereby having a film-like shape or a predetermined pattern on the base material. From the viewpoint of improving the ease of supplying the polymerizable composition onto the substrate in this manner, the viscosity of the polymerizable composition of the present embodiment at 25° C. is preferably 100 mPa･s or less. In particular, when the inkjet printer is used to supply the polymerizable composition onto the substrate, it is preferable to satisfy the viscosity range. Furthermore, the viscosity at the discharge temperature (for example, 60° C.) of the inkjet ink containing the polymerizable composition of the present embodiment is preferably 15 mPa･s or less, and particularly preferably 10 mPa･s or less.

The polymerizable composition of this embodiment is hardened by irradiation with ionizing radiation and becomes a hardened ionizing radiation. The hardened ionizing radiation can be dissolved in an aqueous solution even after heating at 150°C for 2 hours in the atmosphere. To give a specific example, the ionizing radiation hardened product after the heat treatment (150°C for 2 hours) is immersed in an aqueous solution within 15 minutes, and in a preferred aspect within 5 minutes Dissolve by dipping.

The aqueous solution is a solution containing water and can be composed of water, but it is preferably a mixed solvent with a polar solvent, and more preferably a mixed solution with a protic polar solvent such as alcohol. From the viewpoint of improving the uniformity of the mixed liquid, the alcohol preferably has high solubility in water, that is, has a miscibility with water. The content of water in the aqueous solution is appropriately set according to the type of components other than water contained in the aqueous solution and the composition of the ionizing radiation hardened product. When the aqueous solution contains a mixture of water and alcohol, that is, a water-alcohol mixture, and the alcohol contained in the water-alcohol mixture contains a substance with a carbon number of 4 or less, such as ethanol or isopropanol, the alcohol The content is preferably 25% by mass or more and 90% by mass or less, more preferably 50% by mass or more and 85% by mass or less, and particularly preferably 70% by mass or more and 80% by mass or less.

The aqueous solution may also contain organic solvents other than alcohol. Examples of such organic solvents include aprotic organic solvents such as N-methylpyrrolidone, acetone, acetonitrile, and dimethyl sulfoxide. From the viewpoint of reducing the environmental load, the content of the organic solvent other than alcohol in the aqueous solution is preferably 20% by mass or less of the entire aqueous solution.

The aqueous solution may be alkali-free, that is, non-alkali. When the aqueous solution contains an inorganic alkaline substance such as sodium hydroxide or an organic alkaline substance such as tetramethylammonium hydroxide in order to make the aqueous solution alkaline, the processability of the aqueous solution may also decrease. In addition, since the pH of a general alkali-based dissolving solution is 9 or more, in this specification, the term “alkali-free aqueous dissolving solution” means that the pH is less than 9. From the viewpoint of being more alkali-free, the pH of the aqueous solution is preferably 8 or less, and more preferably 7.5 or less.

Even if the ionizing radiation hardened material of this embodiment is heated, the shape change is unlikely to occur. To cite specific examples, in the case where the ionizing radiation cured product of the present embodiment has a film shape formed on a glass substrate and has a thickness of 13 μm to 18 μm, even if heated in the atmosphere at 150°C for 2 hours, the (Thickness)/(Thickness before heat treatment) The residual film ratio defined is also 80% or more, in the preferred example, 85% or more, and in the more preferred example, 90% or more. Therefore, even in the case where a metal such as copper is directly formed by a dry process such as vapor deposition or sputtering on a pattern including a hardened ionizing radiation, the shape of the pattern is not likely to change.

Hereinafter, an electrode member in which a plurality of electrodes each have a recessed portion on one surface of an insulating substrate on which wiring is embedded, which can also be used as a re-distribution layer (RDL) used in a fan-out type WLP or the like, is exposed The method is explained. The material constituting the electrode includes, for example, copper (Cu), and the material constituting the insulating substrate includes, for example, polyimide.

FIG. 1 is a flowchart of the manufacturing method of this embodiment. As shown in FIG. 1, the manufacturing method includes a configuration step (step S101), a hardening step (step S102), a conductive member configuration step (step S104), a peeling step (step S105), and a dissolution step (step S106) as necessary steps . This manufacturing method may include a patterning step (step S103) between the hardening step (step S102) and the conductive member disposition step (step S104) as needed, and may also be followed by a dissolving step (step S106) after the hardening step (step S102) The period before the start further includes a heating step (step S107).

FIGS. 2( a) to 2 (d) are diagrams for explaining an arrangement step (step S101) to a curing step (step S102) included in an example of the manufacturing method of this embodiment.

In the disposing step (step S101), the polymerizable composition 10 is disposed on one main surface of a plate-shaped or sheet-shaped base material SB (FIG. 2(a)) that will eventually be peeled off, such as a glass substrate or a silicon substrate . The method of disposing the polymerizable composition 10 is not limited. In FIGS. 2(a) to 2(d), as shown in FIG. 2(b), the following examples are shown: a screen printing machine PS (left side), a lithographic printing machine PR using a transfer roller (center ). Various well-known placement units such as an inkjet printer PJ (on the right) form a pattern 11 of the coating of the polymerizable composition on the substrate SB.

In the curing step, the pattern 11 of the coating material of the polymerizable composition disposed on the substrate SB is irradiated with ionizing radiation LR (FIG. 2( c )) to harden the pattern 11 of the coating material of the polymerizable composition. Thus, the pattern 20 of the ionized radiation hardened material is obtained on the base material SB as a transfer mold (FIG. 2( d )). The type of ionizing radiation LR is not particularly limited, and examples thereof include visible light, ultraviolet light, X-rays, γ-rays, electron beams, and ion beams. The irradiation device LS can be appropriately set according to the type of ionizing radiation LR. Specific examples include LEDs, halogen lamps, radiation irradiation devices, electron beam irradiation devices, and ion beam generation sources. From the viewpoint of ease of acquisition, ease of handling, and the like, a UV-LED or halogen lamp having a light emission peak at about 350 nm to about 400 nm can be preferably used.

FIGS. 3( a) to 3 (e) are diagrams for explaining the arrangement step (step S101 ), curing step (step S102) and patterning step (step S103) included in another example of the manufacturing method of this embodiment. .

In the arrangement step (step S101), on one of the main surfaces of the base material SB (FIG. 3(a)), as shown in FIG. 3(b), the layer 12 of the polymerizable composition is formed. As a method of forming the layer 12 of the polymerizable composition, spin coating, dipping method, spray coating and the like can be exemplified. Thereafter, by performing a hardening step (step S102), as shown in FIG. 3(c), a layer 21 of an ionizing radiation hardened material is formed on one of the main surfaces of the base material SB.

Thereafter, a portion of the layer 21 of the ionizing radiation hardened material is irradiated with high-energy rays PE (specifically, a laser or an ion beam can be exemplified), and the unnecessary ionizing radiation hardened material 12d is removed. In this manner, the patterning step of forming the transfer mold including the pattern 20 containing the ionizing radiation hardened material on the base material SB is performed (step S103 ).

FIGS. 4( a) to 4 (g) are used to explain the conductive member arrangement step (step S104 ), peeling step (step S105 ), and dissolution step (step S106) included in an example of the manufacturing method of this embodiment. Figure.

After going through the manufacturing steps shown in FIG. 2(a) to FIG. 2(d) or FIG. 3(a) to FIG. 3(e), a structure having the pattern 20 of the ionizing radiation hardened material formed on the substrate SB is obtained Then, a conductive member forming step of forming a film 30 of a conductive member by arranging a conductive material so as to cover the pattern 20 of the ionized radiation hardened material on the base material SB (step S104). In FIG. 4(a), as a specific example of the conductive member forming step (step S104), a film 30 in which a conductive material is uniformly arranged on one of the main surfaces of the base material SB to form a film-like conductive member is shown. Case.

The type of conductive material is not particularly limited, as long as the film 30 of the conductive member is impermeable to water and has the function of a protective layer of the pattern 20 of the ionizing radiation hardened material, the degree of freedom of setting of the subsequent process is improved, which is preferable. From this point of view, examples of the conductive material include metallic materials such as copper (Cu) and aluminum (Al); and inorganic oxide systems such as indium-tin oxide (ITO) and zinc oxide (ZnO) Materials; conductive materials such as conductive nanowires dispersed in resin. The method of manufacturing the conductive member film 30 is appropriately set according to the type of conductive material. In the case where the conductive material is composed of a metal-based material such as copper (Cu), the following methods can be cited as specific examples: a method of forming the entire film 30 of the conductive member by a dry process such as evaporation or sputtering; A thin layer of conductive material is formed by a dry process such as evaporation or sputtering to cover the pattern 20 of the ionizing radiation hardened material on the substrate SB, and then the conductive material is deposited by a wet process such as plating, Thus, a method of forming the film 30 of the conductive member on the base material SB, and the like.

In addition, when the conductive material is deposited by a dry process, the conductive material toward the base material SB may be at a high temperature or may have high kinetic energy. In this case, the base material SB is heated, and as a result, the pattern 20 of the ionizing radiation hardened material on the base material SB sometimes becomes high temperature. In this case, the heating step (step S107) is substantially performed in the conductive member forming step (step S104). Even when the heating step (step S107) is substantially performed in this way, as described above, the pattern 20 of the ionizing radiation hardened material can be appropriately dissolved by the aqueous dissolving liquid in the dissolving step described later, and the The shape change caused is also small.

After the film 30 of the conductive member is formed on the base material SB in this way, a part of the film 30 of the conductive member is removed by irradiating high-energy rays such as laser light to obtain a conductive pattern formed so as to cover the pattern 20 of each ionizing radiation hardened product The pattern 31 of the member (FIG. 4(b)). In this process, the irradiated high-energy rays may heat the substrate 31 or the pattern 31 of the conductive member. In this case, in the conductive member forming step (step S104), the heating step (step S107) may be substantially performed. As described above, even if the pattern 20 heated and transferred to the ionizing radiation cured material is heated in this manner, the solubility in the aqueous solution can be appropriately maintained, and the shape change is less likely to occur.

In addition, in FIGS. 4( a) and 4 (b ), the conductive member pattern 31 is formed after the conductive member forming step (step S104) is formed, but it is not limited to this. The pattern 31 of the conductive member may be directly formed by using an appropriate masking material or the like.

Then, in order to further facilitate the stacking of the member on the pattern 31 of the conductive member provided on the base material SB, an insulating material 40 such as polyimide is disposed on the base material SB as shown in FIG. 4(c). Around the pattern 31 of the member. The specific method of this process is arbitrary. For example, it can be arranged by photolithography (including hardening) in which the insulating material 40 is applied by spin coating or the like and heat-treated. In this case, heat treatment is performed, so the pattern 20 of the ionizing radiation hardened material covered by the pattern 31 of the conductive member in contact with the insulating material 40 is also heated. Therefore, this heating process corresponds to the heating step (step S107) performed before the peeling step (step S105) described below is started. As described above, even if the ionizing radiation hardened material of this embodiment is heated, the solubility in the aqueous solution is not likely to decrease, and the shape change due to heating is not likely to occur, so this type of heating can be performed. Step (step S107).

After the insulating material 40 is appropriately arranged around the pattern 31 of the conductive member in this way, the conductive material is further laminated and patterned (it may also be laminated simultaneously with the patterning) to form the pattern 31 of the conductive member The wiring member 32 is formed thereon, and an insulating material 41 such as polyimide is arranged around the wiring member 32 (FIG. 4( d )). In some cases, a plurality of layers including the wiring member 32 and the insulating material 41 are provided. As described above, even if the process of forming the layer including the wiring member 32 and the insulating material 41 includes a heating process and is substantially implemented as a heating step (step S107), the ionizing radiation hardened material is appropriately maintained in the aqueous solution Solubility, and is not easy to produce shape changes caused by heating. In this manner, on the base material SB, the structure 200 including the pattern 20 of the hardened ionizing radiation constituting the transfer mold, the pattern 31 of the conductive member constituting the electrode, the wiring member 32 constituting the wiring, and The insulating substrate 50 of the insulating portion 42 composed of the insulating material 40 and the insulating material 41.

The structure 200 obtained in this way is inverted so that the base material SB is positioned on the upper side of the structure body 200 (FIG. 4(e)), the base material SB is peeled off, and the pattern 20 of the ionizing radiation hardened material in the structure body 200 is removed. The surface 20S on the side of the base material SB (the surface disposed facing the base material SB) is exposed (FIG. 4( f )). The pattern 20 of the ionized radiation hardened material including the exposed surface 20S is brought into contact with the aqueous dissolution liquid, whereby the pattern 20 of the ionized radiation hardened material can be dissolved and removed. As a result, as shown in FIG. 4(g), the pattern 31 of the conductive member having the surface of the concave portion 31R of the inverted shape as the pattern 20 of the ionizing radiation hardened material is exposed. The patterns 31 become electrodes of the electrode members, respectively. In this way, an electrode member 100 is obtained in which a plurality of electrodes (patterns 31 of conductive members) each have a recess 31R on one surface of the insulating substrate 50 in which the wiring (wiring member 32) is buried.

When the exposed portion of the electrode has the recess 31R in this way, when the electrode member is used as a rewiring, the recess 31R functions as a solder ball receiving portion, so the stability of the placed solder ball is improved. Therefore, the arrangement density of the electrodes in the rewiring can be increased, and the mounting density can be improved.

With the above manufacturing method, it is possible to manufacture an electrode member in which each conductive member constituting the pattern 31 of the conductive member becomes an electrode, and the electrode and the wiring electrically connected to the electrode are embedded in the support member (including the insulating material 40 and the insulating material 41) .

The present invention has been described with reference to the above-mentioned embodiments, but the present invention is not limited to the above-mentioned embodiments, and may be improved or changed for the purpose of improvement or within the scope of the idea of the present invention. [Example]

Hereinafter, the present invention will be further specifically described with examples and the like, but the scope of the present invention is not limited to these examples and the like.

(Example 1) Preparation of 7.06 parts by mass of acryloylmorpholine (ACMO) containing monofunctional acrylic compound as a monofunctional acrylic compound, and N-vinyl formamide as a monofunctional N-vinyl compound 3.55 parts by mass of amine (N-vinyl formamide, NVF), 1.27 parts by mass of IRGACURE 379EG (manufactured by BASF, hereinafter referred to as "IRG379") as a polymerization initiator, and as a surfactant 0.0053 parts by mass of polymerizable composition of BYK 342 (manufactured by BYK Chemie Japan). In the polymerizable composition, the monofunctional acrylic compound and the monofunctional N-vinyl compound are equal moles (the mole ratio is 1:1). In the following other examples and comparative examples, the number of ethylenically unsaturated bonds of each compound of the two compounds having an ethylenically unsaturated bond contained in the polymerizable composition is equal to each other (in terms of the number of functional groups) It becomes an equivalent method), and sets the content of each compound in the polymerizable composition. In the polymerizable composition, the polymerization initiator is equivalent to 12% of the total mass of the monofunctional acrylic compound and the monofunctional N-vinyl compound, and the surfactant is equivalent to the monofunctional acrylic The amount of the compound and the monofunctional N-vinyl compound is 500 ppm by mass. In the following other examples and comparative examples, the content of the polymerization initiator and the content of the surfactant are also set so as to satisfy the relationship of the total mass parts. The obtained polymerizable composition had a viscosity of 10.4 mPa･s at 25°C and 8.8 mPa･s at 30°C. Therefore, when the polymerizable composition of Example 1 is 30° C. or higher, it is particularly preferable as an inkjet ink.

(Example 2) Preparation of 7.06 parts by mass of acryloyl morpholine (ACMO) containing monofunctional acrylamide as a monofunctional acrylic compound, and N-vinyl-ε-hexyl as a monofunctional N-vinyl compound N-vinyl caprolactam (NVC) 6.96 parts by mass, IRG379 1.68 parts by mass as a polymerization initiator, and BYK 342 0.0070 parts by mass as a polymerizable composition as a surfactant. The viscosity of the obtained polymerizable composition at 25°C was 10.8 mPa･s, and at 30°C it was 9.0 mPa･s. Therefore, when the polymerizable composition of Example 2 is 30° C. or higher, it is particularly preferable as an inkjet ink.

(Example 3) 7.06 parts by mass of acryloyl morpholine (ACMO) containing monofunctional acrylamide compound as a monofunctional acrylic compound, and N-vinylacetamide as a monofunctional N-vinyl compound were prepared ( N-vinyl acetamide (NVAc) 4.26 parts by mass, 1.36 parts by mass of IRG379 as a polymerization initiator, and 342 0.0057 parts by mass of BYK as a surfactant. The viscosity of the obtained polymerizable composition at 25°C was 6.8 mPa･s. Therefore, if the polymerizable composition of Example 3 is 25° C. or higher, it is particularly preferable as an inkjet ink.

(Example 4) 7.06 parts by mass of acryloyl morpholine (ACMO) containing monofunctional acrylamide compound as a monofunctional acrylic compound, and N-vinylimidazole (N- Vinyl imidazole (NVIM) 4.71 parts by mass, IRG379 1.41 parts by mass as a polymerization initiator, and BYK 342 0.0059 parts by mass as a polymerizable composition as a surfactant. The viscosity of the obtained polymerizable composition at 25°C was 7.5 mPa･s. Therefore, when the polymerizable composition of Example 4 is 25° C. or higher, it is particularly preferable as an inkjet ink.

(Example 5) Preparation of 7.21 parts by mass of 4-hydroxybutyl acrylate (4HBA), which is a monofunctional acrylate compound, which is a monofunctional acrylate compound, as a monofunctional N-vinyl compound, N- A polymerizable composition of 3.55 parts by mass of vinylformamide (NVF), 1.29 parts by mass of IRG379 as a polymerization initiator, and 342 0.0054 parts by mass of BYK as a surfactant. The viscosity of the obtained polymerizable composition at 25°C was 9.0 mPa･s. Therefore, when the polymerizable composition of Example 5 is 25° C. or higher, it is particularly preferable as an inkjet ink.

(Example 6) Preparation of 6.36 parts by mass of diethyl acrylamide (diethyl acetoacetamide (DEAA)) containing monofunctional acrylamide as a monofunctional acrylic compound, as a monofunctional type The polymerizable composition of N-vinylformamide (NVF) 3.55 parts by mass of N-vinyl compound, 1.19 parts by mass of IRG379 as a polymerization initiator, and 342 0.0050 parts by mass of BYK as a surfactant Thing. The viscosity of the obtained polymerizable composition at 25°C was 3.7 mPa･s. Therefore, if the polymerizable composition of Example 6 is 25° C. or higher, it is particularly preferable as an inkjet ink.

(Comparative example 1) Preparation of 7.06 parts by mass of acryloyl morpholine (ACMO) which is a monofunctional acrylic compound as a monofunctional acrylic compound, 4 as a monofunctional acrylic compound as a type of monofunctional acrylic compound -7.21 parts by mass of hydroxybutyl acrylate (4HBA), 1.71 parts by mass of IRG379 as a polymerization initiator, and 342 0.0071 parts by mass of BYK (BYK) as a surfactant. The viscosity of the obtained polymerizable composition at 25°C was 12.8 mPa･s, and at 40°C it was 7.9 mPa･s. Therefore, if the polymerizable composition of Comparative Example 1 is 40° C. or higher, it is particularly preferable as an ink for inkjet.

(Comparative example 2) Polyethylene glycol #400 diacrylate containing 7.06 parts by mass of acryloyl morpholine (ACMO) as a monofunctional acrylic compound, which is a monofunctional acrylic compound, was prepared as a difunctional acrylic compound ( 9EG-A) 6.53 parts by mass, 1.21 parts by mass of IRG379 as a polymerization initiator, and 342 0.0071 parts by mass of BYK as a surfactant. The molar ratio of the monofunctional acrylic compound to the difunctional acrylic compound in the polymerizable composition was set to 1:0.5 so that the number of functional groups became equal. The viscosity of the obtained polymerizable composition at 25°C was 52.8 mPa･s, and at 60°C it was 14.9 mPa･s. Therefore, if the polymerizable composition of Comparative Example 2 is 60° C. or higher, it is particularly preferred as an inkjet ink.

(Comparative example 3) Preparation of 6.53 parts by mass of polyethylene glycol #400 diacrylate (9EG-A) as a difunctional acrylic compound and 1.78 parts of N-vinylformamide (NVF) as a monofunctional N-vinyl compound Parts, 1.00 parts by mass of IRG379 as a polymerization initiator, and 342 0.0042 parts by mass of BYK (BYK) as a surfactant. The molar ratio of the difunctional acrylic compound and the monofunctional N-vinyl compound in the polymerizable composition was set to 0.5:1 so that the number of functional groups became equal. The viscosity of the obtained polymerizable composition at 25°C was 52.8 mPa･s, and at 60°C it was 14.6 mPa･s. Therefore, if the polymerizable composition of Comparative Example 3 is 60° C. or higher, it is particularly preferable as an inkjet ink.

(Evaluation Example 1) Evaluation of photocurability The polymerizable compositions of Examples 1 to 6 and Comparative Examples 1 to 3 were spin-coated on glass substrates for 10 seconds to obtain coating films. . The coating film of the obtained polymerizable composition was cured under the following conditions to obtain an ionizing radiation cured product. UV irradiation device: "ASM1503 NM-UV-LED" manufactured by Asumi Giken Company Lamp wavelength: 365 nm Exposure: 500 mJ/cm ² , 1000 mJ/cm ² , 1500 mJ/cm ² , 2000 mJ/ cm ² illuminance: 700 mW/cm ² UV light is measured using a UV monitor ("UV-Pad" manufactured by Opsytec) that measures UVA (315 nm to 400 nm). The polymerizable compositions of Examples 1 to 6 and Comparative Examples 1 to 3 were applied and exposed to form a film of an ionizing radiation cured product on a glass substrate. After that, the surface of the cured film was finger-touched to find out the exposure amount when completely in a non-sticky state. The results are shown in Table 1.

[Table 1]

As shown in Table 1, in Examples 1 to 6 and Comparative Examples 2 and 3, the non-stick exposure is 1500 mJ/cm ² or less, in particular, Examples 1, 3, and 3 4 and Example 6 and Comparative Example 2 and Comparative Example 3 are particularly good at 500 mJ/cm ² . On the other hand, in Comparative Example 1, even if the exposure amount was 2000 mJ/cm ² , the non-sticky state was not achieved, and the curing of the polymerizable composition was not completed.

(Evaluation Example 2) Evaluation of residual film ratio after heat treatment The polymerizable compositions of Examples 1 to 6 and Comparative Examples 2 and 3 were applied and cured under the same conditions as in Evaluation Example 1, respectively. To obtain a film of hardened ionizing radiation. As the photo-curing conditions, exposure was performed at an exposure amount that was the non-stick exposure amount confirmed in Evaluation Example 1. Thereafter, the obtained film of the ionized radiation cured product was further subjected to heat treatment under the following conditions. In addition, in Comparative Example 1, even if the exposure amount was set to 2000 mJ/cm ² , the non-sticky state was not achieved, so it was not evaluated and additional heat treatment was not performed. Clean oven: "DT610" manufactured by Yamato Scientific Co., Ltd. Temperature: 150°C Heating time: 2 hours The film thickness (unit: μm) of the hardened ionizing radiation is measured before and after heat treatment, and the thickness is calculated from (after heat treatment) / (Thickness before heat treatment) Define the residual film rate (unit: %). Table 2 shows the film thickness and the residual film ratio before and after the heat treatment.

[Table 2]

As shown in Table 2, in Examples 1 to 6 and Comparative Examples 2 and 3, the residual film rate was 80% or more, of which Examples 1 and 5 and Comparative Examples 2 and 3 The film ratio is more than 90% and is particularly good.

(Evaluation Example 3) Evaluation of solubility The polymerizable compositions of Examples 1 to 6 and Comparative Examples 2 and 3 were applied and cured under the same conditions as in Evaluation Example 2 to obtain ionizing radiation. Hardening. In addition, thereafter, the obtained ionizing radiation cured product was subjected to heat treatment under the same conditions as in Evaluation Example 2. In addition, in Comparative Example 1, even if the exposure amount was set to 2000 mJ/cm ² , the non-viscous state was not achieved. Therefore, it was not evaluated and the solubility was not evaluated. Next, a mixed solution of water and ethanol (EtOH) (mixing ratio: water/EtOH=25/75) was prepared as a dissolving solution, and the ionized radiation hardened product after heat treatment was immersed in a solution at 25°C to observe the ionized radiation hardened product The dissolved state. The evaluation criteria are as follows. A: Dissolved within 5 minutes B: Dissolved within 5 to 15 minutes C: Dissolved after 15 minutes

[table 3]

In the ionizing radiation hardened materials of Examples 1 to 6, the ionized radiation hardened material after the heat treatment dissolves within 5 minutes and is good. On the other hand, in the ionizing radiation hardened materials of Comparative Example 2 and Comparative Example 3, the ionized radiation hardened material after the heat treatment did not dissolve even after 15 minutes of immersion.

10‧‧‧polymerizable composition 11‧‧‧Coated pattern of polymerizable composition 12‧‧‧Layer of polymerizable composition 12d‧‧‧Ionizing radiation hardener 20‧‧‧Ionized radiation hardened pattern 20S‧‧‧ noodles 21‧‧‧Layer of hardened ionizing radiation 30‧‧‧Conducting member film 31‧‧‧Pattern of conductive members 31R‧‧‧Recess 32‧‧‧Wiring components 40、41‧‧‧Insulating materials 42‧‧‧Insulation Department 50‧‧‧Insulated substrate 100‧‧‧electrode component 200‧‧‧Structure LR‧‧‧Ionizing radiation LS‧‧‧irradiation device PE‧‧‧High energy line PJ‧‧‧Inkjet printer PR‧‧‧lithographic printing machine PS‧‧‧ Screen printing machine SB‧‧‧ Base material S101, S102, S103, S104, S105, S106, S107

FIG. 1 is a flowchart of the manufacturing method of this embodiment. FIGS. 2( a) to 2 (d) are diagrams for explaining the arrangement step (step S101) to the hardening step (step S102 ). FIGS. 3( a) to 3 (e) are diagrams for explaining the arrangement step (step S101 ), the curing step (step S102 ), and the patterning step (step S103 ). FIGS. 4( a) to 4 (g) are diagrams for explaining the conductive member arrangement step (step S104 ), the peeling step (step S105 ), and the dissolution step (step S106 ).

S101, S102, S103, S104, S105, S106, S107

Claims (17)

A polymerizable composition, characterized in that it is used to form a transfer mold and contains: The monofunctional acrylic compound includes one or two or more compounds selected from the group consisting of monofunctional acrylate compounds and monofunctional acrylamide compounds; Monofunctional N-vinyl compounds; and The polymerization initiator generates free radicals by the irradiation of ionizing radiation. The polymerizable composition as described in item 1 of the patent application range, wherein the monofunctional N-vinyl compound is a monofunctional N-vinylamide compound. The polymerizable composition as described in item 2 of the patent application scope, wherein the monofunctional N-vinyl amide compound comprises a member selected from the group consisting of N-vinyl formamide, N-vinyl acetamide, and N-ethylene One or more than two compounds based on -ε-caprolactam. The polymerizable composition as described in any one of claims 1 to 3 has a viscosity at 60°C of 15 mPa･s or less. The polymerizable composition according to any one of the first to fourth patent application ranges, which contains a volatile solvent of 30% by mass or less with respect to the entire polymerizable composition. An ink for inkjet comprising the polymerizable composition according to any one of claims 1 to 5 of the patent application. A transfer casting mold comprising the ionizing radiation hardened product of the polymerizable composition as described in any one of claims 1 to 5. The transfer mold as described in item 7 of the patent application range, wherein in the case where the ionizing radiation hardened product has a film shape of 13 μm to 18 μm formed on a glass substrate, it is heated at 150°C even in the atmosphere In 2 hours, the residual film rate of the hardened ionizing radiation was also 80% or more. The transfer casting mold according to item 7 or 8 of the patent application scope, wherein the ionizing radiation hardened product is immersed in an aqueous solution within 5 minutes even if heated at 150°C for 2 hours in the atmosphere And dissolve. The transfer casting mold as described in item 9 of the patent application range, wherein the aqueous solution is a water-alcohol mixture. The transfer mold as described in item 9 or 10 of the patent application, wherein the pH of the aqueous solution is 8 or less. A method of forming an electrode member is characterized in that it is a method of manufacturing an electrode member on a surface of an insulating substrate in which wiring is embedded, and a plurality of electrodes each have a recessed portion to be exposed, and includes: The disposing step, disposing the polymerizable composition as described in any one of claims 1 to 5 on the substrate; In the hardening step, the polymerizable composition disposed on the base material is irradiated with ionizing radiation, and the polymerizable composition is hardened to obtain a transfer mold containing the hardened ionizing radiation; A conductive member forming step, a conductive material is arranged so as to cover the transfer mold to form a conductive member; In the peeling step, the structure including the transfer mold and the conductive member is peeled from the base material, and the plurality of conductive members corresponding to the plurality of electrodes and the The surfaces of the transfer mold on the substrate side are exposed together; and In the dissolving step, the transfer mold adhered to each of the plurality of conductive members is dissolved using an aqueous dissolving liquid to obtain the plurality of electrodes having the concave portion including the inverted shape of the transfer mold. The method for forming an electrode member as described in item 12 of the patent application, which further includes heating the transfer mold on the substrate after the hardening step and before the dissolution step starts Heating step. The method for forming an electrode member as described in item 12 or item 13 of the patent application scope, wherein In the disposing step, the polymerizable composition is supplied to the substrate, so that the pattern of the coating film of the polymerizable composition is arranged on the substrate, In the hardening step, the pattern of the coating film of the polymerizable composition on the base material is hardened to form the pattern of the ionized radiation hardened material as the transfer mold on the base material on. The method for forming an electrode member as described in item 14 of the patent application range, wherein the polymerizable composition is ink for inkjet, and in the configuration step, an inkjet printer is used The pattern of the coating film is arranged on the substrate. The method for forming an electrode member as described in item 12 or item 13 of the patent application scope, wherein In the disposing step, a layer of the polymerizable composition is formed on the substrate, In the hardening step, the layer of the hardened ionizing radiation is formed from the layer of the polymerizable composition, The method of forming the electrode member further includes a patterning step before the conductive member forming step starts, the patterning step irradiating a part of the layer of the ionizing radiation hardened material with high energy rays to harden the ionizing radiation hardened material After removing, the pattern of the hardened ionizing radiation is formed on the base material as the transfer mold. The method for forming an electrode member according to any one of claims 14 to 16, wherein in the conductive member forming step, a plurality of electrically independent conductive members are formed on the substrate A pattern, further forming the wiring electrically connected to the patterns of the plurality of conductive members, and disposing an insulating material around the patterns of the plurality of conductive members and the wiring to form on the substrate In the insulating substrate, in the peeling step, the structure peeled from the base material includes the transfer mold and the insulating substrate.

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