JP7314938B2 - Polymerizable composition, ink, transfer matrix, and method for producing electrode member - Google Patents

Description

The present invention relates to a polymerizable composition that can be suitably used when forming electrodes collectively in response to high-density mounting, an ink comprising such a polymerizable composition, a transfer matrix comprising an ionizing radiation cured product obtained by irradiating the polymerizable composition with ionizing radiation, and a method for producing an electrode member comprising an electrode group formed on a substrate using the polymerizable composition.

Patent Document 1 describes, as a technique for collectively forming electrodes on a plurality of semiconductor devices (ICs) formed on a wafer in WL-CSP (Wafer Level-Chip Size Package), which is one form of high-density mounting, a double-layered film having a lower layer made of a non-radiation-sensitive resin composition and an upper layer made of a negative-type radiation-sensitive resin composition and capable of achieving both high resolution and easy peelability, and a method of forming bumps using such a double-layered film.

Japanese Unexamined Patent Application Publication No. 2007-79550

In the above-described double layered film described in Patent Document 1, during development, only the portion of the upper layer irradiated with radiation remains, and the portion of the lower layer corresponding to the removed portion (non-radiation-irradiated portion) in the upper layer is dissolved and removed. Therefore, only the radiation-irradiated portion of the double-layered film remains, and the non-radiation-irradiated portion of the double-layered film is removed in the development step. A metal paste is embedded in the portions from which the double layered film has been removed, and the wafer is heated together to reflow the metal paste, thereby forming a plurality of bumps on the wafer all at once. After the bumps are collectively formed in this manner, the double laminated film remaining on the wafer is removed with an organic solvent-based stripping solution such as dimethylsulfoxide (DMSO).

In recent years, as mounting density has increased, the shape of a negative pattern (transfer matrix) formed on a wafer to form bumps has become complicated (including three-dimensional). However, if a negative pattern having a complicated shape is to be formed by the process of forming a negative pattern using a double layered film as described above, the process becomes complicated. Therefore, simplification of the manufacturing process is expected. In addition, it is required that the material constituting the negative pattern remaining on the wafer be reliably removed after the bumps are formed. However, due to the growing interest in environmental issues, there is a demand for a material that can be removed by a water-based stripping solution, in particular, a water-based stripping solution that does not substantially contain an inorganic alkaline substance (such as sodium hydroxide) or an organic alkaline substance (such as tetramethylammonium hydroxide), rather than the above organic solvent-based stripping solution.

Furthermore, in recent high-density mounting technology, a fan-out WLP that forms a rewiring layer in a wide area exceeding the chip area has been adopted, and a stack module that stacks this fan-out WLP in multiple layers has also been realized. In such a fan-out type WLP, a large number of conductive pillars made of copper or the like are formed in a rewiring layer, and connection materials such as solder balls are arranged on the conductive pillars. Since the placement accuracy of this connection material increases as the mounting density increases, there is a demand for more accurate placement of the connection material on the conductive pillars.

An object of the present invention is to provide an ionizing radiation-curable polymerizable composition that can appropriately retain its shape after curing even after undergoing a high-temperature environment such as a reflow process, which is required with the progress of such mounting technology, and that can be dissolved in a water-based dissolving liquid. Another object of the present invention is to provide an ink comprising such a polymerizable composition, a transfer matrix comprising an ionizing radiation cured product obtained by irradiating the above polymerizable composition with ionizing radiation, and a method for producing an electrode member having an electrode group on a substrate using the above polymerizable composition. In the present specification, the term "ionizing radiation" is a general term for energy sources that can generate radicals by irradiating or colliding with a polymerization initiator, such as electromagnetic waves such as gamma rays, X-rays, ultraviolet rays, and visible light, and electrons, protons, ions, and the like.

The present invention provided to solve the above problems is as follows.
[1] A polymerizable composition for forming a transfer matrix, comprising a monofunctional acrylic compound consisting of one or more compounds selected from the group consisting of monofunctional acrylic acid ester compounds and monofunctional acrylamide compounds, a monofunctional N-vinyl compound, and a polymerization initiator that generates radicals upon exposure to ionizing radiation.
[2] The polymerizable composition according to [1] above, wherein the monofunctional N-vinyl compound is a monofunctional N-vinylamide compound.
[3] The polymerizable composition according to [2] above, wherein the monofunctional N-vinylamide compound comprises one or more compounds selected from N-vinylformamide, N-vinylacetamide, and N-vinyl-ε-caprolactam.
[4] The polymerizable composition according to any one of [1] to [3] above, which has a viscosity at 60° C. of 15 mPa·s or less.
[5] The polymerizable composition according to any one of [1] to [4] above, containing 30% by mass or less of a volatile solvent relative to the entire polymerizable composition.
[6] An inkjet ink comprising the polymerizable composition described in any one of [1] to [5] above.
[7] A transfer matrix comprising an ionizing radiation-cured product of the polymerizable composition described in any one of [1] to [5] above.
[8] The transfer master according to [7] above, wherein when the ionizing radiation cured product has a film shape of 13 to 18 μm thick formed on a glass substrate, the ionizing radiation cured product has a residual film rate of 80% or more even after being heated at 150° C. for 2 hours in the atmosphere.
[9] The transfer matrix according to [7] or [8] above, wherein the ionizing radiation-cured material is dissolved within 5 minutes of immersion in an aqueous solution even when heated at 150° C. for 2 hours in the atmosphere.
[10] The transfer matrix according to [9] above, wherein the aqueous solution is a water-alcohol mixture. The above alcohol is preferably an alcohol miscible with water, and more preferably an alcohol having 4 or less carbon atoms.
[11] The transcription matrix according to [9] or [10] above, wherein the aqueous solution has a pH of 8 or less.
[12] On one side of the insulating substrate where the wiring is buried, it is a method of producing an electrode member in which multiple electrodes are represented by each concave portion. The process of irradiating the ionizing radiation, curing a polymerized composition and obtaining a transfer mother type consisting of ionization radioscopic objects, a conductive material formation process that forms a conductive material by placing a conductive material to cover the transitional mother type, and a structure containing a structure containing a transition of the copyright and the conductor containing the duplicate material. Dissolve from the base material and use multiple electrodes corresponding to multiple electrodes, the transition process that is exposed to the surface of the base material side of the above -mentioned substrate that attaches to the above -mentioned boarding material, and the above -mentioned parent type adhered to each of the multiple conductors is dissolved using a aquatic solution. A method for forming an electrode member that is characterized by a dissolving step that obtains multiple electrodes with a concave part of the inverted shape of the type.
[13] The method for forming an electrode member according to [12] above, further comprising a heating step of heating the reverse matrix on the substrate after the curing step and before the melting step is started.
[14] The method of forming an electrode member according to [12] or [13] above, wherein in the placement step, the polymerizable composition is supplied to the substrate to place a pattern of the coating film of the polymerizable composition on the substrate, and in the curing step, the pattern of the coating film of the polymerizable composition on the substrate is cured to form the pattern of the ionizing radiation cured product as the transfer matrix on the substrate.
[15] The method for forming an electrode member according to [14] above, wherein the polymerizable composition is an inkjet ink, and in the disposing step, an inkjet printer is used to dispose a pattern of the coating film of the polymerizable composition on the substrate.
[16] The electrode member according to [12] or [13] above, further comprising a patterning step of forming a layer of the polymerizable composition on the base material in the disposing step, forming the layer of the cured ionizing radiation material from the layer of the polymerizable composition in the curing step, and removing the cured ionizing radiation material by irradiating a part of the layer of the cured ionizing radiation material with high-energy rays to remove the cured ionizing radiation material before starting the conductive member forming step, thereby forming a pattern of the cured ionizing radiation material as the transfer matrix on the base material. method of formation.
[17] In the conductive member forming step, forming a plurality of electrically independent patterns of the conductive members on the base material, further forming the wiring electrically connected to each of the patterns of the plurality of conductive members, and forming the insulating substrate on the base material by arranging an insulating material around the patterns of the plurality of conductive members and the wirings, wherein the structure peeled off from the base material in the peeling step comprises the transfer matrix and the insulating substrate. The method for forming an electrode member according to any one of [16].

ADVANTAGE OF THE INVENTION According to this invention, the polymerizable composition which can maintain the shape after hardening appropriately even if it passes through a high-temperature environment, and can form the ionizing-radiation hardened|cured material which can be melt|dissolved with an aqueous solution is provided. Further, according to the present invention, there are provided an ink comprising the above polymerizable composition, an ionizing radiation cured product obtained by irradiating the above polymerizable composition with ionizing radiation, and a method for producing an electrode member having an electrode group on a substrate using the above polymerizable composition.

It is a flow chart of the manufacturing method concerning this embodiment. It is a figure for demonstrating the hardening process (step S102) from the arrangement|positioning process (step S101). FIG. 5 is a diagram for explaining an arrangement step (step S101), a curing step (step S102), and a patterning step (step S103); FIG. 4 is a diagram for explaining a conductive member placement step (step S104), a peeling step (step S105), and a dissolving step (step S106);

Hereinafter, a method for producing a polymerizable composition, an ink, an ionizing radiation cured product, and an electrode member according to embodiments of the present invention will be described.

A polymerizable composition according to one embodiment of the present invention is for forming a transfer matrix, and is a polymerizable composition containing a monofunctional acrylic compound composed of one or more compounds selected from the group consisting of monofunctional acrylic acid ester compounds and monofunctional acrylamide compounds, a monofunctional N-vinyl compound, and a polymerization initiator that generates radicals upon irradiation with ionizing radiation.

The monofunctional acrylic compound consists of one or more compounds selected from the group consisting of monofunctional acrylate compounds and monofunctional acrylamide compounds. A monofunctional acrylic acid ester compound is a compound having a partial structure based on a (meth)acrylic acid ester and a (meth)acrylic acid ester, and is a general term for compounds having one ethylenic double bond in the molecule. Specific examples of compounds having a partial structure based on (meth)acrylic acid include methyl (meth)acrylate. In addition, in this specification, in order to show one or both of "acrylic acid" and "methacrylic acid", it may be described as "(meth)acrylic acid". Terms relating to (meth)acrylic acid, such as "(meth)acrylate", "(meth)acryloxy", have similar meanings.

From the viewpoint of ensuring the solubility in an aqueous solution of the ionizing radiation cured product obtained by irradiating the polymerizable composition with ionizing radiation, the monofunctional acrylic acid ester compound preferably has a hydroxyl group (--OH). Specific examples of such hydroxyl group (-OH)-containing monofunctional acrylate compounds include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 1,4-cyclohexanedimethanol mono (meth) acrylate, N-hydroxyethyl (meth) acrylamide, and polyoxyethylene monoacrylate. Among these, 4-hydroxybutyl acrylate and 1,4-cyclohexanedimethanol monoacrylate are preferable from the viewpoint of relatively low volatility and therefore easy to ensure the printability and storage stability of the polymerizable composition, and 4-hydroxybutyl acrylate is particularly preferable from the viewpoint of the ease of dissolving the resulting ionizing radiation cured product in an aqueous solution.

Specific examples of monofunctional acrylamide compounds include N-isopropylacrylamide, N,N-dimethyl(meth)acrylamide, N,N-dimethylaminoethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-diethylaminoethyl(meth)acrylamide, and N,N-dimethylaminopropyl(meth)acrylamide and (meth)acryloylmorpholine. Among these, (meth)acryloylmorpholine is preferred because it is relatively difficult to volatilize, and therefore the printability and storage stability of the polymerizable composition can be easily ensured, and the resulting ionizing radiation cured product can be easily dissolved in an aqueous solution.

A monofunctional N-vinyl compound is a compound having a structure in which an ethylenically unsaturated group is bonded to an amino group, and the amino group may form an amide bond with a carbonyl group. In the present specification, a monofunctional compound in which an amino group to which an ethylenically unsaturated group is bonded constitutes an amide bond is also referred to as a "monofunctional N-vinylamide compound." A monofunctional N-vinylamide compound is a preferred example of a monofunctional N-vinyl compound. Specific examples of monofunctional N-vinylamide compounds include N-vinylformamide, N-vinylacetamide, N-vinyl-ε-caprolactam, etc. Specific examples of monofunctional N-vinyl compounds other than monofunctional N-vinylamide compounds include 1-vinylimidazole and 9-vinylcarbazole. Among these compounds, N-vinylformamide, N-vinylacetamide, N-vinyl-ε-caprolactam, and 1-vinylimidazole are preferred from the viewpoint of the ease of dissolving the resulting ionizing radiation-cured product in an aqueous solution, and N-vinylformamide, N-vinylacetamide, and N-vinyl-ε-caprolactam are particularly preferred from the viewpoint of restrictions on product transportation.

The type of the polymerization initiator is not limited as long as it can generate radicals upon irradiation with ionizing radiation and can initiate the polymerization reaction of the monofunctional acrylic compound and the monofunctional N-vinyl compound. The content of the polymerization initiator is also appropriately set according to the type and content of the monofunctional acrylic compound and monofunctional N-vinyl compound and the type of polymerization initiator. As a non-limiting example, the content of the curing agent is preferably 0.1 to 20 parts by weight, more preferably 1 to 15 parts by weight, particularly preferably 2 to 12 parts by weight, relative to the total weight of the polymerizable composition.

重合開始剤の具体例として、ベンゾフェノン、ミヒラーズケトン、４，４'－ビス（ジエチルアミノ）ベンゾフェノン、キサントン、チオキサントン、イソプロピルキサントン、２，４－ジエチルチオキサントン、２－エチルアントラキノン、アセトフェノン、２－ヒドロキシ－２－メチルプロピオフェノン、２－ヒドロキシ－２－メチル－４'－イソプロピルプロピオフェノン、１－ヒドロキシシクロヘキシルフェニルケトン、イソプロピルベンゾインエーテル、イソブチルベンゾインエーテル、２，２－ジエトキシアセトフェノン、２，２－ジメトキシ－２－フェニルアセトフェノン、２，２－ジメトキシ－１，２－ジフェニルエタン－１－オン、カンファーキノン、ベンズアントロン、２－ヒロドキシ－１－［４－［４－（２－ヒドロキシ－２－メチル－プロピオニル）－ベンジル］フェニル］－２－メチル－プロパン－１－オン、１－［４－（２－ヒドロキシエトキシ）－フェニル］－２－ヒドロキシ－２－メチル－１－プロパン－１－オン、２－ヒドロキシ－２－メチル－１－フェニル－プロパン－１－オン、２－メチル－１－［４－（メチルチオ）フェニル］－２－モルフォリノ－１－プロパノン、２－ベンジル－２－ジメチルアミノ－１－（４－モルフォリノフェニル）－１－ブタノン、２－ジメチルアミノ－２－（４－メチルベンジル）－１－（４－モルフォリノフェニル）－１－ブタノン、オキシ－フェニル－アセチックアシッド２－（２－オキソ－２－フェニル－アセトキシ－エトキシ）－エチルエステル、オキシ－フェニル－アセチックアシッド２－（２－ヒドロキシ－エトキシ）－エチルエステル、オキシ－フェニル－アセチックアシッド２－（２－オキソ－２－フェニル－アセトキシ－エトキシ）－エチルエステルとオキシ－フェニル－アセチックアシッド２－（２－ヒドロキシ－エトキシ）－エチルエステルとの混合物、フェニルグリオキシリックアシッドメチルエステル、４－ジメチルアミノ安息香酸エチル、４－ジメチルアミノ安息香酸イソアミル、４，４'－ジ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、３，４，４'－トリ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、３，３'，４，４'－テトラ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、３，３'，４，４'－テトラ（ｔ－ヘキシルペルオキシカルボニル）ベンゾフェノン、３，３'－ジ（メトキシカルボニル）－４，４'－ジ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、３，４'－ジ（メトキシカルボニル）－４，３'－ジ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、４，４'－ジ（メトキシカルボニル）－３，３'－ジ（ｔ－ブチルペルオキシカルボニル）ベンゾフェノン、２－（４'－メトキシスチリル）－４，６－ビス（トリクロロメチル）－ｓ－トリアジン、２－（３'，４'－ジメトキシスチリル）－４，６－ビス（トリクロロメチル）－ｓ－トリアジン、２－（２'，４'－ジメトキシスチリル）－４，６－ビス（トリクロロメチル）－ｓ－トリアジン、２－（２'－メトキシスチリル）－４，６－ビス（トリクロロメチル）－ｓ－トリアジン、２－（４'－ペンチルオキシスチリル）－４，６－ビス（トリクロロメチル）－ｓ－トリアジン、４－［ｐ－Ｎ，Ｎ－ジ（エトキシカルボニルメチル）］－２，６－ジ（トリクロロメチル）－ｓ－トリアジン、１，３－ビス（トリクロロメチル）－５－（２'－クロロフェニル）－ｓ－トリアジン、１，３－ビス（トリクロロメチル）－５－（４'－メトキシフェニル）－ｓ－トリアジン、２－（ｐ－ジメチルアミノスチリル）ベンズオキサゾール、２－（ｐ－ジメチルアミノスチリル）ベンズチアゾール、２－メルカプトベンゾチアゾール、３，３'－カルボニルビス（７－ジエチルアミノクマリン）、２－（ｏ－クロロフェニル）－４，４'，５，５'－テトラフェニル－１，２'－ビイミダゾール、２，２'－ビス（２－クロロフェニル）－４，４'，５，５'－テトラキス（４－エトキシカルボニルフェニル）－１，２'－ビイミダゾール、２，２'－ビス（２，４－ジクロロフェニル）－４，４'，５，５'－テトラフェニル－１，２'－ビイミダゾール、２，２'－ビス（２，４－ジブロモフェニル）－４，４'，５，５'－テトラフェニル－１，２'－ビイミダゾール、２，２'－ビス（２，４，６－トリクロロフェニル）－４，４'，５，５'－テトラフェニル－１，２'－ビイミダゾール、３－（２－メチル－２－ジメチルアミノプロピオニル）カルバゾール、３，６－ビス（２－メチル－２－モルフォリノプロピオニル）－９－ｎ－ドデシルカルバゾール、１－ヒドロキシシクロヘキシルフェニルケトン、ビス（η ⁵ －２，４－シクロペンタジエン－１－イル）－ビス（２，６－ジフルオロ－３－（１Ｈ－ピロール－１－イル）－フェニル）チタニウム、ビス（２，４，６－トリメチルベンゾイル）フェニルフォスフィンオキサイドおよび２，４，６－トリメチルベンゾイルジフェニルフォスフィンオキサイドを挙げることができる。 These compounds may be used alone, and it is also effective to use two or more in combination. Among them, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinophenyl)-1-butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyl-di Phenyl-phosphine oxide has high sensitivity to UV-LED light sources and is preferred from the viewpoint of photocurability.

The polymerizable composition according to the present embodiment may contain substantially no volatile solvent from the viewpoint of simplifying the process of forming the ionizing radiation cured product, but may contain a volatile solvent from the viewpoint of adjusting the viscosity of the polymerizable composition. Volatile solvents may be mixed with other compositions to form a polymerizable composition during use. In the case where the polymerizable composition contains a volatile solvent, the polymerizable composition may start volatilizing in an uncured state, and preferably volatilizes at least at the stage where an ionizing radiation cured product is formed by appropriately heating before, during, and/or after irradiation with ionizing radiation. If an excessive amount of unvolatile solvent remains even after the polymerizable composition has been cured to some extent, the final cured product (ionizing radiation cured product) has a porous structure, and the surface properties (surface smoothness) required for a reversal matrix (negative pattern) for reversal transfer may deteriorate. Therefore, the content of the volatile solvent is preferably 30% by mass or less with respect to the entire polymerizable composition.

Specific examples of volatile solvents include methanol, ethanol, propanol, butanol, butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, and 3-ethoxypropionate. ethyl 2-oxypropionate, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, 2-eth Ethyl oxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, dioxane, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monophenyl ether, ethylene glycol monobutyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl Ether, diethylene glycol monophenyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monophenyl ether, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, benzyl alcohol, cyclohexanol, 1,4-butanediol, triethylene glycol, tripropylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether Acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, toluene, xylene, anisole, γ-butyrolactone, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and dimethylimida and zolidinone. These compounds may be used alone, and it is also effective to use two or more in combination.

The polymerizable composition according to the present embodiment may contain other additives than the above components. Specific examples of other additives include surfactants, polymerization inhibitors, plasticizers, antioxidants, ultraviolet absorbers, antistatic agents, flame retardants, flame retardant aids, fillers, pigments, dyes, and the like, but are not particularly limited as long as they can be uniformly mixed with other components within the scope of the present invention.

The polymerizable composition according to the present embodiment has a film-like shape or a predetermined pattern on the substrate by being supplied onto the substrate by coating, dropping, or the like when used. From the viewpoint of enhancing the ease of supplying the polymerizable composition onto such a substrate, it may be preferable that the viscosity at 25° C. of the polymerizable composition according to the present embodiment is 100 mPa·s or less. In particular, when the polymerizable composition is supplied onto the substrate by an inkjet printer, it is preferable to satisfy the above viscosity range. Furthermore, the inkjet ink made of the polymerizable composition according to the present embodiment preferably has a viscosity of 15 mPa·s or less, particularly preferably 10 mPa·s or less, at an ejection temperature (for example, 60° C.).

The polymerizable composition according to the present embodiment is cured by being irradiated with ionizing radiation to become an ionizing radiation cured product. Such an ionizing radiation cured product is soluble in an aqueous solution even after being heated at 150° C. for 2 hours in the air. As a specific example, the ionizing radiation cured product after the heat treatment (150° C. for 2 hours) is dissolved by immersion in an aqueous solution for 15 minutes or less, preferably 5 minutes or less.

The aqueous solution is a solution containing water, and may be composed of water, but is preferably a mixed solvent with a polar solvent, more preferably a mixed solution with a protic polar solvent such as alcohol. From the viewpoint of improving the uniformity of the mixed liquid, the alcohol preferably has high solubility in water, that is, has miscibility with water. The content of water in the aqueous solution is appropriately set according to the types of components other than water contained in the aqueous solution and the composition of the ionizing radiation cured product. When the aqueous solution consists of a water-alcohol mixture that is a mixture of water and alcohol, and the alcohol contained in the water-alcohol mixture consists of a substance having 4 or less carbon atoms such as ethanol or isopropanol, the alcohol content is preferably 25% by mass or more and 90% by mass or less, more preferably 50% by mass or more and 85% by mass or less, and particularly preferably 70% by mass or more and 80% by mass or less.

The aqueous solution may contain an organic solvent other than alcohol. Examples of such organic solvents include aprotic organic solvents such as N-methylpyrrolidone, acetone, acetonitrile and dimethylsulfoxide. From the viewpoint of reducing the environmental load, the content of the organic solvent other than alcohol in the aqueous solution is preferably 20% by mass or less based on the total amount of the aqueous solution.

It may be preferred that the aqueous solution is alkali-free, ie non-alkaline. If the aqueous solution contains an inorganic alkaline substance such as sodium hydroxide or an organic alkaline substance such as tetramethylammonium hydroxide in order to make the aqueous solution alkaline, the handleability of the aqueous solution may be reduced. Since a general alkaline solution has a pH of 9 or more, the term "alkali-free aqueous solution" as used herein means a pH of less than 9. The pH of the aqueous solution is preferably 8 or less, more preferably 7.5 or less, from the viewpoint of ensuring that it is alkali-free.

The ionizing radiation cured product according to the present embodiment does not easily change shape even when heated. As a specific example, when the ionizing radiation cured product according to the present embodiment has a film shape with a thickness of 13 to 18 μm formed on a glass substrate, even if it is heated at 150° C. for 2 hours in the atmosphere, the residual film rate defined by (thickness after heat treatment)/(thickness after heat treatment) is 80% or more, a preferable example is 85% or more, and a more preferable example is 90% or more. Therefore, even when a metal such as copper is directly formed on a pattern made of an ionizing radiation-cured product by a dry process such as vapor deposition or sputtering, the shape of the pattern is less likely to change.

Hereinafter, a method for manufacturing an electrode member in which a plurality of electrodes each have a recess and are exposed on one surface of an insulating substrate in which wiring is embedded, which can also be used as a redistribution line (RDL) used in a fan-out type WLP etc. will be described. The material forming the electrodes includes, for example, copper (Cu), and the material forming the insulating substrate includes, for example, polyimide.

FIG. 1 is a flowchart of the manufacturing method according to this embodiment. As shown in FIG. 1, this manufacturing method includes an arrangement step (step S101), a curing step (step S102), a conductive member arrangement step (step S104), a peeling step (step S105), and a dissolving step (step S106) as essential steps. Any of the present manufacturing methods may optionally include a patterning step (step S103) between the curing step (step S102) and the conductive member placement step (step S104), or may further include a heating step (step S107) between the curing step (step S102) and the start of the dissolving step (step S106).

FIG. 2 is a diagram for explaining the arranging step (step S101) to the curing step (step S102) included in an example of the manufacturing method according to this embodiment.

In the placement step (step S101), the polymerizable composition 10 is placed on one main surface of a plate-like or sheet-like substrate SB (FIG. 2(a)) that is finally peeled off, such as a glass substrate or a silicon substrate. The arrangement method of the polymerizable composition 10 is not limited. As shown in FIG. 2(b), FIG. 2 shows an example of forming a pattern 11 of a coating of a polymerizable composition on a substrate SB using various known placement means such as a screen printer PS (left), an offset printer PR using a transfer roll (center), and an inkjet printer PJ (right).

In the curing step, the pattern 11 of the coating of the polymerizable composition placed on the substrate SB is irradiated with the ionizing radiation LR (FIG. 2(c)), and the pattern 11 of the coating of the polymerizable composition is cured to obtain the pattern 20 of the cured ionizing radiation as a transfer matrix on the substrate SB (FIG. 2(d)). The type of ionizing radiation LR is not particularly limited, and examples include visible light, ultraviolet light, X-rays, γ-rays, electron beams, and ion beams. The irradiation device LS is appropriately set according to the type of ionizing radiation LR. Specific examples include LEDs, halogen lamps, radiation irradiation devices, electron beam irradiation devices, and ion beam sources. UV-LEDs and halogen lamps having an emission peak in the range of about 350 nm to about 400 nm are preferably used from the viewpoint of availability and ease of handling.

FIG. 3 is a diagram for explaining the placement step (step S101), the curing step (step S102), and the patterning step (step S103) included in another example of the manufacturing method according to this embodiment.

In the placement step (step S101), a layer 12 of the polymerizable composition is formed on one main surface (FIG. 3(a)) of the substrate SB as shown in FIG. 3(b). Examples of methods for forming the layer 12 of the polymerizable composition include spin coating, dipping, and spray coating. After that, the curing step (step S102) is performed to form a layer 21 of the ionizing radiation cured material on one main surface of the base material SB as shown in FIG. 3(c).

After that, a part of the layer 21 of the ionizing radiation cured material is irradiated with a high energy beam PE (specifically, a laser and an ion beam are exemplified) to remove the unnecessary ionizing radiation cured material 12d. In this manner, the patterning step (step S103) is performed to form a transfer matrix consisting of the pattern 20 of the ionizing radiation cured product on the substrate SB.

FIG. 4 is a diagram for explaining a conductive member placement step (step S104), a peeling step (step S105), and a dissolving step (step S106) included in an example of the manufacturing method according to this embodiment.

After the structure in which the pattern 20 of the cured ionizing radiation material is formed on the base material SB is obtained through the manufacturing process shown in FIG. 2 or FIG. FIG. 3A shows a specific example of the conductive member forming step (step S104), in which a conductive material is uniformly arranged on one main surface of the base material SB to form the film 30 of the conductive member in the form of a film.

The type of conductive material is not particularly limited, but it is preferable if the film 30 of the conductive member is impermeable to water and has the function of a protective layer for the pattern 20 of the ionizing radiation-cured material, since the degree of freedom in setting subsequent processes increases. From this point of view, conductive materials include metal-based materials such as copper (Cu) and aluminum (Al), inorganic oxide-based materials such as indium tin oxide (ITO) and zinc oxide (ZnO), and conductive nanowires dispersed in a resin. A method for manufacturing the film 30 of the conductive member is appropriately set according to the type of the conductive material. When the conductive material is made of a metallic material such as copper (Cu), specific examples include a method of forming the entire conductive member film 30 by a dry process such as vapor deposition or sputtering, and a method of forming a thin layer of a conductive material so as to cover the pattern 20 of the ionizing radiation cured product on the substrate SB by a dry process such as vapor deposition or sputtering, and then depositing the conductive material by a wet process such as plating to form the conductive member film 30 on the substrate SB.

When the conductive material is deposited by a dry process, the conductive material moving toward the substrate SB may have a high temperature or high kinetic energy. In this case, the substrate SB is heated, and as a result, the ionizing radiation cured pattern 20 on the substrate SB may also be at a high temperature. In such a case, the heating step (step S107) is substantially performed in the conductive member forming step (step S104). Even when the heating step (step S107) is substantially performed in this way, the pattern 20 of the ionizing radiation cured product can be appropriately dissolved in the aqueous solution in the dissolving step described later, and the shape change due to heat is small, as described above.

After the conductive member film 30 is thus formed on the base material SB, a part of the conductive member film 30 is removed by irradiating it with a high-energy beam such as a laser to obtain a conductive member pattern 31 formed so as to individually cover the pattern 20 of the ionizing radiation cured product (FIG. 4(b)). The high-energy rays irradiated in this process may heat the substrate SB and the conductive member pattern 31 . Even in such a case, the heating step (step S107) may be substantially performed in the conductive member forming step (step S104). As described above, even if the pattern 20 of the ionizing radiation cured product is heated in this way, the solubility in the aqueous solution can be properly maintained, and the shape change is unlikely to occur.

In FIGS. 4A and 4B, the conductive member pattern 31 is formed after forming the conductive member film 30 in the conductive member forming step (step S104), but the present invention is not limited to this. The conductive member pattern 31 may be formed directly, such as by using a suitable mask material.

Subsequently, in order to make it easier to further laminate members on the conductive member pattern 31 provided on the base material SB, as shown in FIG. 4C, an insulating material 40 such as polyimide is arranged around the conductive member pattern 31 on the base material SB. The specific method of this process is arbitrary. For example, the insulating material 40 may be applied by spin coating or the like and arranged by photolithography (including curing) in which heat treatment is performed. In this case, since the heat treatment is performed, the pattern 20 of the ionizing radiation cured material covered with the pattern 31 of the conductive member in contact with the insulating material 40 is also heated. Therefore, this heat treatment corresponds to the heating step (step S107) performed before the peeling step (step S105) described below is started. As described above, even if the ionizing radiation cured product according to the present embodiment is heated, the solubility in the aqueous solution is less likely to decrease, and the shape is less likely to change due to heating.

After appropriately arranging the insulating material 40 around the pattern 31 of the conductive member in this way, lamination and patterning of the conductive material (which may be lamination while being patterned) are further performed to form the wiring member 32 on the pattern 31 of the conductive member, and the insulating material 41 such as polyimide is arranged around the wiring member 32 (FIG. 4D). A plurality of layers composed of the wiring member 32 and the insulating material 41 may be provided. As described above, even if the process of forming the layer composed of the wiring member 32 and the insulating material 41 includes heat treatment, and the heating step (step S107) is substantially performed, the ionizing radiation-cured product maintains its solubility in the aqueous solution appropriately, and is less likely to change shape due to heating. In this way, the structure 200 including the pattern 20 of the cured ionizing radiation material constituting the transfer matrix, the pattern 31 of the conductive member constituting the electrode, the wiring member 32 constituting the wiring, and the insulating substrate 50 composed of the insulating portion 42 composed of the insulating materials 40 and 41 is arranged on the base material SB.

The structure 200 thus obtained is turned over to position the base material SB on the upper side of the structure 200 (FIG. 4(e)), and the base material SB is peeled off to expose the surface 20S of the pattern 20 of the ionizing radiation cured product in the structure 200 on the side of the base material SB (the surface facing the base material SB) (FIG. 4(f)). By bringing the pattern 20 of the ionizing radiation cured product including the exposed surface 20S into contact with the aqueous solution, the pattern 20 of the ionizing radiation cured product can be dissolved and removed. As a result, as shown in FIG. 4(g), a conductive member pattern 31 having a surface of concave portions 31R, which is the reverse shape of the pattern 20 of the ionizing radiation cured product, is exposed, and each of these conductive member patterns 31 becomes an electrode of the electrode member. In this way, an electrode member 100 is obtained in which a plurality of electrodes (conductive member patterns 31) are exposed with recesses 31R on one surface of the insulating substrate 50 in which the wiring (wiring member 32) is embedded.

When the exposed portion of the electrode has the concave portion 31R in this way, when the electrode member is used as a rewiring, the concave portion 31R functions as a receiving portion for the solder ball, thereby improving the stability of the placed solder ball. Therefore, the arrangement density of the electrodes in the rewiring can be increased, and the mounting density can be improved.

By the above-described manufacturing method, an electrode member can be manufactured in which the individual conductive members constituting the conductive member pattern 31 serve as electrodes, and the electrodes and the wiring electrically connected to the electrodes are embedded in the support member (consisting of the insulating material 40 and the insulating material 41).

Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above embodiments, and can be improved or changed within the scope of the purpose of improvement or the spirit of the present invention.

EXAMPLES The present invention will be described in more detail with reference to Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

(Example 1)
7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 3.55 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.27 parts by mass of IRGACURE 379EG (manufactured by BASF, hereinafter abbreviated as "IRG379") as a polymerization initiator, and BYK342 as a surfactant ( A polymerizable composition containing 0.0053 parts by mass of BYK-Chemie Japan) was prepared. In the polymerizable composition, the monofunctional acrylic compound and the monofunctional N-vinyl compound were equimolar (molar ratio 1:1). In the following other examples and comparative examples, the content of each compound in the polymerizable composition was set so that the two types of compounds having an ethylenically unsaturated bond contained in the polymerizable composition had the same number of ethylenically unsaturated bonds in each compound (so that the number of functional groups was equimolar). In the polymerizable composition, the amount of the polymerization initiator was equivalent to 12% of the total mass of the monofunctional acrylic compound and the monofunctional N-vinyl compound, and the amount of the surfactant was equivalent to 500 ppm of the total mass of the monofunctional acrylic compound and the monofunctional N-vinyl compound. In other examples and comparative examples below, the content of the polymerization initiator and the content of the surfactant were set so as to satisfy the above relationship of the total parts by mass. The resulting polymerizable composition had a viscosity of 10.4 mPa·s at 25°C and 8.8 mPa·s at 30°C. Therefore, the polymerizable composition according to Example 1 was particularly suitable as an inkjet ink at a temperature of 30° C. or higher.

(Example 2)
A polymerizable composition containing 7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 6.96 parts by mass of N-vinyl-ε-caprolactam (NVC) as a monofunctional N-vinyl compound, 1.68 parts by mass of IRG379 as a polymerization initiator, and 0.0070 parts by mass of BYK342 as a surfactant was prepared. The resulting polymerizable composition had a viscosity of 10.8 mPa·s at 25°C and 9.0 mPa·s at 30°C. Therefore, the polymerizable composition according to Example 2 was particularly suitable as an inkjet ink at a temperature of 30° C. or higher.

(Example 3)
A polymerizable composition containing 7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 4.26 parts by mass of N-vinylacetamide (NVAc) as a monofunctional N-vinyl compound, 1.36 parts by mass of IRG379 as a polymerization initiator, and 0.0057 parts by mass of BYK342 as a surfactant was prepared. The resulting polymerizable composition had a viscosity of 6.8 mPa·s at 25°C. Therefore, the polymerizable composition according to Example 3 was particularly suitable as an inkjet ink at a temperature of 25° C. or higher.

(Example 4)
A polymerizable composition containing 7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 4.71 parts by mass of N-vinylimidazole (NVIM) as a monofunctional N-vinyl compound, 1.41 parts by mass of IRG379 as a polymerization initiator, and 0.0059 parts by mass of BYK342 as a surfactant was prepared. The resulting polymerizable composition had a viscosity of 7.5 mPa·s at 25°C. Therefore, the polymerizable composition according to Example 4 was particularly suitable as an inkjet ink at a temperature of 25° C. or higher.

(Example 5)
A polymerizable composition containing 7.21 parts by mass of 4-hydroxybutyl acrylate (4HBA) as a monofunctional acrylic acid ester compound that is a type of monofunctional acrylic compound, 3.55 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.29 parts by mass of IRG379 as a polymerization initiator, and 0.0054 parts by mass of BYK342 as a surfactant was prepared. The resulting polymerizable composition had a viscosity of 9.0 mPa·s at 25°C. Therefore, the polymerizable composition according to Example 5 was particularly suitable as an inkjet ink at a temperature of 25° C. or higher.

(Example 6)
A polymerizable composition containing 6.36 parts by mass of diethylacrylamide (DEAA) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 3.55 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.19 parts by mass of IRG379 as a polymerization initiator, and 0.0050 parts by mass of BYK342 as a surfactant was prepared. The resulting polymerizable composition had a viscosity of 3.7 mPa·s at 25°C. Therefore, the polymerizable composition according to Example 6 was particularly suitable as an inkjet ink at a temperature of 25° C. or higher.

(Comparative example 1)
A polymerizable composition containing 7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 7.21 parts by mass of 4-hydroxybutyl acrylate (4HBA) as a monofunctional acrylic acid ester compound that is a type of monofunctional acrylic compound, 1.71 parts by mass of IRG379 as a polymerization initiator, and 0.0071 parts by mass of BYK342 as a surfactant. prepared. The resulting polymerizable composition had a viscosity of 12.8 mPa·s at 25°C and 7.9 mPa·s at 40°C. Therefore, the polymerizable composition according to Comparative Example 1 is particularly suitable as an inkjet ink at a temperature of 40° C. or higher.

(Comparative example 2)
A polymerizable composition containing 7.06 parts by mass of acryloylmorpholine (ACMO) as a monofunctional acrylamide compound that is a type of monofunctional acrylic compound, 6.53 parts by mass of polyethylene glycol #400 diacrylate (9EG-A) as a bifunctional acrylic compound, 1.21 parts by mass of IRG379 as a polymerization initiator, and 0.0071 parts by mass of BYK342 as a surfactant was prepared. The molar ratio of the monofunctional acrylic compound and the bifunctional acrylic compound in the polymerizable composition was set to 1:0.5 so that the numbers of functional groups were equal. The resulting polymerizable composition had a viscosity of 52.8 mPa·s at 25°C and 14.9 mPa·s at 60°C. Therefore, the polymerizable composition according to Comparative Example 2 is suitable as an inkjet ink if the temperature is 60° C. or higher.

(Comparative Example 3)
A polymerizable composition containing 6.53 parts by mass of polyethylene glycol #400 diacrylate (9EG-A) as a bifunctional acrylic compound, 1.78 parts by mass of N-vinylformamide (NVF) as a monofunctional N-vinyl compound, 1.00 parts by mass of IRG379 as a polymerization initiator, and 0.0042 parts by mass of BYK342 as a surfactant was prepared. The molar ratio of the bifunctional acrylic compound and the monofunctional N-vinyl compound in the polymerizable composition was set to 0.5:1 so that the numbers of functional groups are equal. The resulting polymerizable composition had a viscosity of 52.8 mPa·s at 25°C and 14.6 mPa·s at 60°C. Therefore, the polymerizable composition according to Comparative Example 3 is suitable as an inkjet ink if the temperature is 60° C. or higher.

(Evaluation Example 1) Evaluation of photocurability Each of the polymerizable compositions according to Examples 1 to 6 and Comparative Examples 1 to 3 was applied onto a glass substrate by spin coating for 10 seconds to obtain a coating film.
The resulting coating film of the polymerizable composition was cured under the following conditions to obtain an ionizing radiation cured product.
UV irradiation device: "ASM1503NM-UV-LED" manufactured by Asumi Giken Co., Ltd.
Lamp wavelength: 365nm
Exposure: 500 mJ/cm ² , 1000 mJ/cm ² , 1500 mJ/cm ² , 2000 mJ/cm ²
Illuminance: 700mW/ ^cm2
A UV monitor (“UV-Pad” manufactured by Opsytec) that measures UVA (315 to 400 nm) was used to measure UV light.
The polymerizable compositions according to Examples 1 to 6 and Comparative Examples 1 to 3 were applied and exposed to form films of ionizing radiation cured products on glass substrates. After that, the surface of the cured film was touched to examine the amount of light exposure at which a completely tackless state was achieved. Table 1 shows the results.

As shown in Table 1, in Examples 1 to 6 and Comparative Examples 2 and 3, the tackless exposure amount was 1500 mJ/cm ² or less, and among them, Examples 1, 3, 4 and 6 and Comparative Examples 2 and 3 were particularly good at 500 mJ/cm ² . On the other hand, in Comparative Example 1, a tackless state was not achieved even with an exposure amount of 2000 mJ/cm ² , and curing of the polymerizable composition was not completed.

(Evaluation Example 2) Evaluation of residual film ratio after heat treatment Each of the polymerizable compositions according to Examples 1 to 6 and Comparative Examples 2 and 3 was applied and cured under the same conditions as in Evaluation Example 1 to obtain films of ionizing radiation cured products. As a photocuring condition, exposure was performed at the tackless exposure amount confirmed in Evaluation Example 1. After that, the film of the obtained ionizing radiation cured product was further heat-treated under the following conditions. Comparative Example 1 did not reach a tackless state even at an exposure dose of 2000 mJ/cm ² , so it was excluded from evaluation and no additional heat treatment was performed.
Clean oven: "DT610" manufactured by Yamato Scientific Co., Ltd.
Temperature: 150°C
Heating time: 2 hours The film thickness (unit: μm) of the ionizing radiation cured product was measured before and after the heat treatment, and the residual film ratio (unit: %) defined by (thickness after heat treatment/thickness after heat treatment) was calculated. Table 2 shows the film thickness and residual film ratio before and after the heat treatment.

As shown in Table 2, in Examples 1 to 6 and Comparative Examples 2 and 3, the film retention rate was 80% or more. Among them, Examples 1 and 5 and Comparative Examples 2 and 3 had a film retention rate of 90% or more, which was particularly good.

(Evaluation Example 3) Evaluation of Solubility Each of the polymerizable compositions according to Examples 1 to 6 and Comparative Examples 2 and 3 was applied and cured under the same conditions as in Evaluation Example 2 to obtain ionizing radiation cured products. Moreover, after that, heat treatment was performed on the obtained ionizing radiation cured product under the same conditions as in Evaluation Example 2. Comparative Example 1 did not reach a tackless state even at an exposure dose of 2000 mJ/cm ² , so it was excluded from the evaluation and the solubility was not evaluated.
Subsequently, a mixture of water and ethanol (EtOH) (mixture ratio: water/EtOH=25/75) was prepared as a dissolution liquid, and the ionizing radiation-cured material after heat treatment was immersed in the dissolution liquid at 25° C., and the dissolution state of the ionizing radiation-cured material was observed. Evaluation criteria are as follows.
A: Dissolved within 5 minutes B: Dissolved within 15 minutes after 5 minutes C: Did not dissolve even after 15 minutes

The ionizing radiation cured products according to Examples 1 to 6 dissolved within 5 minutes after the heat treatment, which was good. In contrast, in the ionizing radiation cured products according to Comparative Examples 2 and 3, the ionizing radiation cured products after the heat treatment did not dissolve even after 15 minutes of immersion.

10: Polymerizable composition 11: Coating film pattern of polymerizable composition 12: Layer of polymerizable composition 12d: Unnecessary cured product of ionizing radiation 20: Pattern of cured product of ionizing radiation 20S: Exposed surface 21: Layer of cured product of ionizing radiation 30: Conductive member film 31: Conductive member pattern 31R: Concave portions 32: Wiring members 40, 41: Insulating material 42: Insulating portion 50: Insulating substrate 10 0: Electrode member 200: Structure LR: Ionizing radiation LS: Irradiation device PE: High energy beam PJ: Inkjet printer PR: Offset printer PS: Screen printer SB: Base material

Claims (17)

A polymerizable composition for forming a transcription matrix, comprising:
a monofunctional acrylic compound consisting of one or more compounds selected from the group consisting of monofunctional acrylate compounds and monofunctional acrylamide compounds;
a monofunctional N-vinyl compound;
a polymerization initiator that generates radicals upon exposure to ionizing radiation;
A polymerizable composition containing
A polymerizable composition, wherein the ionizing radiation-cured product of the polymerizable composition is soluble in an aqueous solution even after being heated at 150°C for 2 hours in the atmosphere. 2. The polymerizable composition according to claim 1, wherein when the ionizing radiation cured product has a film shape of 13 to 18 μm thick formed on a glass substrate, the ionizing radiation cured product has a residual film rate of 80% or more even after being heated at 150° C. for 2 hours in the atmosphere. 3. The polymerizable composition according to claim 1 , wherein the monofunctional N-vinyl compound is a monofunctional N-vinylamide compound. 4. The polymerizable composition according to claim 3 , wherein the monofunctional N-vinylamide compound comprises one or more compounds selected from N-vinylformamide, N-vinylacetamide and N-vinyl-ε-caprolactam. 5. The polymerizable composition according to any one of claims 1 to 4 , which has a viscosity at 60°C of 15 mPa·s or less. 6. The polymerizable composition according to any one of claims 1 to 5 , containing 30% by mass or less of volatile solvent relative to the entire polymerizable composition. An inkjet ink comprising the polymerizable composition according to any one of claims 1 to 6 . A transfer matrix comprising an ionizing radiation-cured product of the polymerizable composition according to any one of claims 1 to 6 . 9. The transfer matrix according to claim 8, wherein said ionizing radiation cured product is dissolved within 5 minutes of immersion in an aqueous solution even when heated at 150[deg.] C. for 2 hours in air. 10. The transfer matrix of claim 9, wherein said aqueous solution is a water-alcohol mixture. 11. The transcription matrix according to claim 9 or 10, wherein the aqueous solution has a pH of 8 or less. A method for manufacturing an electrode member in which a plurality of electrodes are exposed with recesses on one surface of an insulating substrate in which wiring is embedded,
An arrangement step of arranging the polymerizable composition according to any one of claims 1 to 6 on a substrate,
A curing step of irradiating the polymerizable composition placed on the base material with ionizing radiation to cure the polymerizable composition to obtain a transfer master made of an ionizing radiation cured product;
a conductive member forming step of forming a conductive member by arranging a conductive material so as to cover the transfer matrix;
A method of forming an electrode member, comprising: a peeling step of exposing a structure including the transfer matrix and the conductive member from the base material to expose the plurality of conductive members corresponding to the plurality of electrodes together with a surface of the transfer matrix attached to the conductive member facing the base material; 13. The method of forming an electrode member according to claim 12, further comprising a heating step of heating said transfer matrix on said substrate after said curing step and before said dissolving step starts. In the arranging step, the polymerizable composition is supplied to the substrate to arrange a pattern of the coating film of the polymerizable composition on the substrate,
In the curing step, the pattern of the coating film of the polymerizable composition on the substrate is cured to form the pattern of the ionizing radiation cured product on the substrate as the transfer matrix.
14. The method of forming an electrode member according to claim 12 or 13. 15. The method of forming an electrode member according to claim 14, wherein the polymerizable composition is an inkjet ink, and in the disposing step, an inkjet printer is used to dispose a pattern of the coating film of the polymerizable composition on the substrate. forming a layer of the polymerizable composition on the substrate in the arranging step;
In the curing step, a layer of the ionizing radiation cured material is formed from the layer of the polymerizable composition,
Before starting the conductive member forming step, a part of the layer of the ionizing radiation cured product is irradiated with high energy rays to remove the ionizing radiation cured product, and the pattern of the ionizing radiation cured product is formed as the transfer matrix on the base material.
14. The method of forming an electrode member according to claim 12 or 13. 17. The step of forming a conductive member includes forming a plurality of electrically independent patterns of the conductive member on the base material, further forming the wiring electrically connected to each of the patterns of the plurality of conductive members , and forming the insulating substrate on the base material by arranging an insulating material around the patterns of the plurality of conductive members and the wiring, and forming the insulating substrate on the base material in the peeling step, wherein the structure peeled off from the base material in the peeling step comprises the transfer matrix and the insulating substrate. The method for forming the electrode member according to 1.