TW201940272A - 雷射標記裝置 - Google Patents
雷射標記裝置 Download PDFInfo
- Publication number
- TW201940272A TW201940272A TW108104127A TW108104127A TW201940272A TW 201940272 A TW201940272 A TW 201940272A TW 108104127 A TW108104127 A TW 108104127A TW 108104127 A TW108104127 A TW 108104127A TW 201940272 A TW201940272 A TW 201940272A
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- laser
- temperature
- unit
- reference mark
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018018748A JP7073127B2 (ja) | 2018-02-06 | 2018-02-06 | レーザマーキング装置 |
JP2018-018748 | 2018-02-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201940272A true TW201940272A (zh) | 2019-10-16 |
Family
ID=67548933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108104127A TW201940272A (zh) | 2018-02-06 | 2019-02-01 | 雷射標記裝置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7073127B2 (ja) |
TW (1) | TW201940272A (ja) |
WO (1) | WO2019155954A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021220456A1 (ja) * | 2020-04-30 | 2021-11-04 | 株式会社ニコン | 加工システム |
CN112247368A (zh) * | 2020-09-10 | 2021-01-22 | 大族激光科技产业集团股份有限公司 | 水平调试方法及装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06277864A (ja) * | 1993-03-30 | 1994-10-04 | Nikon Corp | レーザ加工装置 |
JPH1058175A (ja) * | 1996-08-27 | 1998-03-03 | Nikon Corp | レーザ加工装置の光軸の較正方法 |
JPH1133763A (ja) * | 1997-07-18 | 1999-02-09 | Fuji Electric Co Ltd | レーザマーキング装置 |
JP2001334376A (ja) | 2000-05-26 | 2001-12-04 | Nec Toyama Ltd | レーザ加工装置及びレーザ光スポット位置補正方法 |
JP4091494B2 (ja) | 2003-07-24 | 2008-05-28 | 三菱電機株式会社 | レーザ加工装置およびその加工位置ずれ補正方法 |
-
2018
- 2018-02-06 JP JP2018018748A patent/JP7073127B2/ja active Active
-
2019
- 2019-01-30 WO PCT/JP2019/003154 patent/WO2019155954A1/ja active Application Filing
- 2019-02-01 TW TW108104127A patent/TW201940272A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7073127B2 (ja) | 2022-05-23 |
JP2019136705A (ja) | 2019-08-22 |
WO2019155954A1 (ja) | 2019-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20230028351A1 (en) | Laser patterning skew correction | |
TWI577483B (zh) | Laser processing machine, laser processing machine workpiece skew correction method | |
KR101103926B1 (ko) | 레이저 가공 장치 | |
TWI415703B (zh) | 雷射加工裝置及基板位置檢測方法 | |
EP2769800B1 (en) | Laser processing machine | |
TWI633279B (zh) | 基板測量裝置及雷射加工系統 | |
KR101344675B1 (ko) | 기판 가공 방법 | |
US20090059297A1 (en) | Calibration method for image rendering device and image rendering device | |
KR101362638B1 (ko) | 노광 장치 | |
TWI667090B (zh) | 雷射加工裝置 | |
TW201940272A (zh) | 雷射標記裝置 | |
TWI787595B (zh) | 雷射加工裝置、雷射加工方法及誤差調整方法 | |
TWI795563B (zh) | 檢查治具及檢查方法 | |
TWI638239B (zh) | 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置 | |
JP2007237199A (ja) | レーザ加工装置及びレーザ加工方法 | |
JP2007305696A (ja) | 位置決め装置の精度測定方法 | |
TWI794438B (zh) | 晶片位置測定裝置 | |
JP6706164B2 (ja) | アライメント装置、露光装置、およびアライメント方法 | |
JP2012133122A (ja) | 近接露光装置及びそのギャップ測定方法 | |
JP5017034B2 (ja) | 二次元座標測定機 | |
WO2021090613A1 (ja) | アライメント装置 | |
CN110062914B (zh) | 接近式曝光装置以及接近式曝光方法 | |
JP4487700B2 (ja) | 近接露光装置 | |
TW202414122A (zh) | 描繪位置資訊取得方法以及描繪方法 | |
KR20180083548A (ko) | 편평도 측정에 의한 실시간 초점 조절 구조의 레이저 마킹 장치 |