TW201940272A - 雷射標記裝置 - Google Patents

雷射標記裝置 Download PDF

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Publication number
TW201940272A
TW201940272A TW108104127A TW108104127A TW201940272A TW 201940272 A TW201940272 A TW 201940272A TW 108104127 A TW108104127 A TW 108104127A TW 108104127 A TW108104127 A TW 108104127A TW 201940272 A TW201940272 A TW 201940272A
Authority
TW
Taiwan
Prior art keywords
workpiece
laser
temperature
unit
reference mark
Prior art date
Application number
TW108104127A
Other languages
English (en)
Chinese (zh)
Inventor
和田浩光
村尾幸一
Original Assignee
日商東麗工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗工程股份有限公司 filed Critical 日商東麗工程股份有限公司
Publication of TW201940272A publication Critical patent/TW201940272A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW108104127A 2018-02-06 2019-02-01 雷射標記裝置 TW201940272A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018018748A JP7073127B2 (ja) 2018-02-06 2018-02-06 レーザマーキング装置
JP2018-018748 2018-02-06

Publications (1)

Publication Number Publication Date
TW201940272A true TW201940272A (zh) 2019-10-16

Family

ID=67548933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108104127A TW201940272A (zh) 2018-02-06 2019-02-01 雷射標記裝置

Country Status (3)

Country Link
JP (1) JP7073127B2 (ja)
TW (1) TW201940272A (ja)
WO (1) WO2019155954A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021220456A1 (ja) * 2020-04-30 2021-11-04 株式会社ニコン 加工システム
CN112247368A (zh) * 2020-09-10 2021-01-22 大族激光科技产业集团股份有限公司 水平调试方法及装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06277864A (ja) * 1993-03-30 1994-10-04 Nikon Corp レーザ加工装置
JPH1058175A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置の光軸の較正方法
JPH1133763A (ja) * 1997-07-18 1999-02-09 Fuji Electric Co Ltd レーザマーキング装置
JP2001334376A (ja) 2000-05-26 2001-12-04 Nec Toyama Ltd レーザ加工装置及びレーザ光スポット位置補正方法
JP4091494B2 (ja) 2003-07-24 2008-05-28 三菱電機株式会社 レーザ加工装置およびその加工位置ずれ補正方法

Also Published As

Publication number Publication date
JP7073127B2 (ja) 2022-05-23
JP2019136705A (ja) 2019-08-22
WO2019155954A1 (ja) 2019-08-15

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